TWI839928B - Heat dissipation device and electronic device - Google Patents

Abstract

The purpose of the present invention is to provide a heat diffusion device that can be easily manufactured and can improve the maximum heat transfer amount. The heat diffusion device 1a has: a housing 10, which has a first inner wall surface 10a and a second inner wall surface 10b opposite to each other in the thickness direction T; an actuating medium 20, which is sealed in the inner space of the housing 10; a linear core 30, which is arranged in the inner space of the housing 10 in a manner connected to the first inner wall surface 10a; and a guide rail-shaped member 40, which includes a pair of wall portions 41 and 42 arranged in the inner space of the housing 10 in a manner protruding from the second inner wall surface 10b in the thickness direction T; and the linear core 30 and a pair of wall portions 41 and 42 of the guide rail-shaped member 40 are connected in the thickness direction T, and constitute a liquid flow path 50 of the actuating medium 20.

Description

Heat dissipation device and electronic device

The present invention relates to a heat diffusion device and an electronic machine.

In recent years, the amount of heat generated has increased due to the high integration and performance of components. In addition, the heat density has increased due to the miniaturization of products. This situation is particularly prominent in the field of mobile terminals such as smartphones and tablets. In view of this situation, it has become important to seek countermeasures for heat dissipation.

As heat dissipation components, graphite sheets are mostly used, but since their heat transfer capacity is insufficient, various heat dissipation components are being studied. Among them, research on the use of planar heat pipes, i.e., vapor chambers, as heat dissipation devices that can dissipate heat very effectively continues to advance.

Patent document 1 discloses a heat pipe comprising: a container enclosing an operating fluid; and a core body disposed inside the container with a gap in the left-right direction between the inner wall of the container and in contact with the upper wall and the lower wall of the container; and the core body has a first core part and a second core part disposed with a gap in the left-right direction when viewed in cross section, the first core part and the second core part are respectively connected to the upper wall and the lower wall, and the liquid accumulation part formed by the upper wall, the lower wall, the first core part and the second core part is filled with the liquid phase operating fluid. [Prior technical document] [Patent document]

[Patent Document 1] Japanese Patent No. 6827362

[The problem the invention is trying to solve]

In the heat pipe described in Patent Document 1, as shown in FIG. 4 of Patent Document 1, a core body is provided in such a manner that a first core part and a second core part are spaced apart in the left-right direction and connected to each other by a connecting core part. In the heat pipe described in Patent Document 1, the core body is provided in such a manner that a liquid accumulation part filled with a liquid phase operating fluid is formed between the first core part and the second core part.

However, in a heat diffusion device such as the heat pipe described in Patent Document 1, it is not easy to set a core as shown in FIG. 4 of Patent Document 1. For example, in a heat diffusion device, when the core is composed of a porous body such as a non-woven fabric or a mesh, it is considered to be bent and set as shown in FIG. 4 of Patent Document 1, but it is not easy to make the core self-supporting as shown in FIG. 4 of Patent Document 1. In order to make the core self-supporting, it is considered to be better to increase the thickness of the core (in FIG. 4 of Patent Document 1, the thickness in the left and right directions), but a core with a large thickness is not easy to bend as shown in FIG. 4 of Patent Document 1. Furthermore, if the thickness of the core in the heat diffusion device increases, the vapor flow path becomes smaller accordingly, so the maximum heat transfer amount decreases.

The present invention is completed to solve the above-mentioned problems, and its purpose is to provide a heat diffusion device that can be easily manufactured and can increase the maximum heat transfer. In addition, the purpose of the present invention is to provide an electronic device having the above-mentioned heat diffusion device. [Technical means for solving the problem]

The heat diffusion device of the present invention comprises: a shell having a first inner wall surface and a second inner wall surface facing each other in the thickness direction; an actuating medium sealed in the inner space of the shell; a linear core arranged in the inner space of the shell in contact with the first inner wall surface; and a rail-shaped component including a pair of wall portions arranged in the inner space of the shell in a manner protruding from the second inner wall surface toward the thickness direction; and the linear core is in contact with the pair of wall portions of the rail-shaped component in the thickness direction and constitutes a liquid flow path of the actuating medium.

The electronic device of the present invention is characterized by comprising: the heat dissipation device of the present invention; and electronic components mounted on the outer wall surface of the casing of the heat dissipation device. [Effect of the invention]

According to the present invention, a heat dissipation device which can be easily manufactured and can improve the maximum heat transfer capacity can be provided. In addition, according to the present invention, an electronic device having the above heat dissipation device can be provided.

The heat dissipation device and the electronic device of the present invention are described below. In addition, the present invention is not limited to the following configurations, and can be appropriately modified within the scope of the present invention. In addition, the present invention also includes a combination of multiple preferred configurations described below.

The embodiments shown below are examples, and the structures shown in different embodiments may be partially replaced or combined. After embodiment 2, the description of the matters common to embodiment 1 is omitted, and the differences are mainly described. In particular, the same effects of the same structure are not mentioned one by one in each embodiment.

In the following embodiments, a vapor chamber is shown as an example of the heat diffusion device of the present invention. The heat diffusion device of the present invention can also be applied to heat diffusion devices such as heat pipes.

In the following description, when there is no particular distinction between the various embodiments, they are simply referred to as "the heat diffusion device of the present invention" and "the electronic device of the present invention".

The following diagrams are schematic diagrams and may differ from the actual product in terms of size, aspect ratio, etc.

[Heat diffusion device] The heat diffusion device of the present invention is described below.

<Implementation Form 1> The heat diffusion device of the present invention comprises: a housing having a first inner wall surface and a second inner wall surface facing each other in the thickness direction; an actuating medium sealed in the inner space of the housing; a linear core disposed in the inner space of the housing in contact with the first inner wall surface; and a rail-shaped member, a pair of wall portions disposed in a manner that is contained in the inner space of the housing and protrudes from the second inner wall surface in the thickness direction.

FIG. 1 is a three-dimensional schematic diagram showing an example of a heat diffusion device according to the first embodiment of the present invention.

The vapor chamber (heat diffusion device) 1a shown in FIG. 1 has a housing 10 .

The housing 10 is sealed in an airtight state and has a hollow structure.

A heating element, namely a heat source HS, is installed on the outer wall of the housing 10 .

As the heat source HS, electronic parts etc. are exemplified.

In this specification, the length direction, thickness direction, and width direction are respectively defined as directions L, T, and W as shown in FIG. 1 and the like. The length direction L, the thickness direction T, and the width direction W are orthogonal to each other. In addition, the direction orthogonal to the thickness direction T, that is, the direction including the length direction L and the width direction W is defined as the plane direction.

The steam chamber 1a is preferably in a planar shape as a whole. That is, the housing 10 is preferably in a planar shape as a whole.

In this specification, the surface shape refers to a shape including a plate shape and a sheet shape, that is, a shape whose dimensions in the length direction and the width direction are much larger than the dimensions in the thickness direction, for example, a shape whose dimensions in the thickness direction and the width direction are more than 10 times the dimensions in the thickness direction, preferably more than 100 times.

The size of the steam chamber 1a, that is, the size of the housing 10 is not particularly limited.

The length L and width W dimensions of the steam chamber 1a, that is, the length L and width W dimensions of the housing 10 are preferably 5 mm to 500 mm, more preferably 20 mm to 300 mm, and even more preferably 50 mm to 200 mm.

The size of the steam chamber 1a in the length direction L and the size of the width direction W, that is, the size of the housing 10 in the length direction L and the size of the width direction W may be the same as or different from each other.

The dimension of the steam chamber 1a in the thickness direction T, that is, the dimension of the housing 10 in the thickness direction T, is preferably not less than 50 μm and not more than 500 μm.

The dimensions of the steam chamber 1a in the length direction L, the thickness direction T and the width direction W, that is, the dimensions of the shell 10 in the length direction L, the thickness direction T and the width direction W are respectively specified as the maximum dimensions of the length direction L, the thickness direction T and the width direction W.

The housing 10 is preferably formed of a first sheet 11 and a second sheet 12 joined at their outer edges. In this case, the first sheet 11 and the second sheet 12 may be overlapped with their ends aligned with each other, or may be overlapped with their ends offset from each other.

Examples of methods for joining the outer edges of the first sheet 11 and the second sheet 12 include laser welding, resistance welding, diffusion welding, brazing, TIG welding (tungsten-inert gas welding), ultrasonic welding, and resin sealing. Among them, laser welding, resistance welding, or brazing is preferred.

The materials of the first sheet 11 and the second sheet 12 are not particularly limited as long as they have properties suitable for the steam chamber, such as thermal conductivity, strength, softness, flexibility, etc. The materials of the first sheet 11 and the second sheet 12 are preferably metals, such as copper, nickel, aluminum, magnesium, titanium, iron, alloys with at least one of these metals as the main component, etc., and copper is particularly preferred.

The constituent materials of the first sheet 11 and the second sheet 12 may be the same or different from each other.

When the first sheet 11 and the second sheet 12 are made of different materials, the first sheet 11 and the second sheet 12 can exert different functions. Such functions are not particularly limited, and examples thereof include heat conduction function and electromagnetic wave shielding function.

The dimensions of the first sheet 11 and the second sheet 12 in the thickness direction T are each preferably 10 μm to 200 μm, more preferably 30 μm to 100 μm, and further preferably 40 μm to 60 μm.

The dimensions of the first sheet 11 and the second sheet 12 in the thickness direction T may be the same as or different from each other.

The dimensions of the first sheet 11 and the second sheet 12 in the thickness direction T may be the same throughout the entirety, or may be partially different.

The shapes of the first sheet 11 and the second sheet 12 are not particularly limited. For example, the first sheet 11 may be a flat plate with a specific dimension in the thickness direction T, and the second sheet 12 may be a shape in which the dimension in the thickness direction T of the outer edge is larger than the portion outside the outer edge. Alternatively, the first sheet 11 may be a flat plate with a specific dimension in the thickness direction T, and the second sheet 12 may be a shape in which the dimension in the thickness direction T is specific, and the portion outside the outer edge is convex outward relative to the outer edge. In this case, a depression is provided on the outer edge of the shell 10. Such a depression on the outer edge of the shell 10 can be used when the steam chamber 1a is mounted. In addition, other parts may be arranged on the depression on the outer edge of the shell 10.

In FIG. 1 , the case 10 is shown as being composed of two sheets, namely a first sheet 11 and a second sheet 12 . However, the case 10 may be composed of one sheet or three or more sheets.

As the plane shape of the steam chamber 1a viewed from the thickness direction T, that is, the plane shape of the housing 10, for example, a triangle, a rectangle or other polygon, a circle, an ellipse, a combination of these shapes, etc., can be listed. In addition, the plane shape of the steam chamber 1a, that is, the plane shape of the housing 10, can also be an L-shape, a C-shape (U-shape), a step shape, etc. In addition, a through hole can be provided in the thickness direction T of the housing 10. The plane shape of the steam chamber 1a, that is, the plane shape of the housing 10, can be a shape corresponding to the purpose of the steam chamber 1a, can also be a shape corresponding to the mounting position of the steam chamber 1a, and can also be a shape corresponding to other parts existing nearby.

Fig. 2 is a schematic top view showing the internal structure of an example of a heat diffusion device according to the first embodiment of the present invention. Fig. 3 is a schematic cross-sectional view showing a cross section along the line A1-A2 of the heat diffusion device shown in Fig. 2.

The steam chamber 1a shown in FIG. 2 and FIG. 3 comprises a housing 10, an actuating medium 20, a linear core 30 and a guide rail-shaped member 40.

As shown in FIG3 , the housing 10 has a first inner wall surface 10 a and a second inner wall surface 10 b that are opposite to each other in the thickness direction T. In the example shown in FIG3 , the housing 10 is composed of a first sheet material 11 and a second sheet material 12 , the inner surface of the first sheet material 11 corresponds to the first inner wall surface 10 a of the housing 10 , and the inner surface of the second sheet material 12 corresponds to the second inner wall surface 10 b of the housing 10 .

An inner space is provided in the housing 10. More specifically, an inner space surrounded by a first inner wall surface 10a and a second inner wall surface 10b is provided in the housing 10.

As shown in FIG. 2 , the housing 10 preferably has an evaporation portion EP in the internal space.

The evaporation portion EP is a portion where the liquid phase of the activating medium 20 described later evaporates and changes into the gas phase of the activating medium 20. More specifically, the evaporation portion EP is equivalent to the portion near the heat source HS shown in FIG. 1 in the inner space of the housing 10, that is, the portion heated by the heat source HS.

The evaporation portion EP may be disposed at an end portion of the housing 10 or at a central portion of the housing 10 .

The number of evaporation parts EP depends on the number of heat sources HS, as shown in FIG. 2 , and may be only one or more.

In addition, the heat source HS can be installed on the outer wall surface opposite to the first inner wall surface 10a of the housing 10, which is the outer surface of the first sheet 11, or can be installed on the outer wall surface opposite to the second inner wall surface 10b of the housing 10, which is the outer surface of the second sheet 12.

As shown in FIG. 2 and FIG. 3 , the actuating medium 20 is sealed in the inner space of the housing 10 .

The actuating medium 20 is not particularly limited as long as it can produce a gas-liquid phase change in the environment in the housing 10. Examples of the actuating medium 20 include water, ethanol, and hydrochlorofluorocarbons. The actuating medium 20 is preferably an aqueous compound, and water is particularly preferred.

As shown in FIG. 3 , the linear core 30 is disposed in the inner space of the housing 10 in contact with the first inner wall surface 10 a.

In this specification, the core means a capillary structure that can move the actuating medium by capillary force. The capillary structure may be a well-known structure used in the previous vapor chamber, such as fine holes, protrusions, grooves and other micro structures with concave and convex shapes.

In this specification, linear means a shape whose dimension in the extension direction (length direction L in Figure 2) is much larger than the dimension in the direction perpendicular to the extension (width direction W in Figure 2), for example, a shape whose dimension in the extension direction is more than 5 times the dimension in the direction perpendicular to the extension direction.

The linear core 30 functions as a liquid transporting portion that sucks up and transports the liquid-phase activating medium 20 by capillary force.

As shown in FIG. 3 , the linear core 30 has, for example, a first surface 30 a , a second surface 30 b , a third surface 30 c , and a fourth surface 30 d .

The first surface 30 a and the second surface 30 b of the linear core 30 are opposed to each other in the surface direction (the width direction W in FIG. 3 ).

The first surface 30a of the linear core 30 is in contact with the third surface 30c and the fourth surface 30d.

The second surface 30b of the linear core 30 is in contact with the third surface 30c and the fourth surface 30d.

The third surface 30 c and the fourth surface 30 d of the linear core 30 are opposed to each other in the thickness direction T.

The third surface 30c of the linear core 30 is located closer to the first inner wall surface 10a of the housing 10 than the fourth surface 30d. That is, the third surface 30c of the linear core 30 is in contact with the first inner wall surface 10a of the housing 10.

The fourth surface 30d of the linear core 30 is located closer to the second inner wall surface 10b of the housing 10 than the third surface 30c.

The linear core 30 is preferably fixed to the first inner wall surface 10a of the housing 10. For example, the linear core 30 is preferably bonded to the first inner wall surface 10a of the housing 10. Examples of the bonding method of the linear core 30 include diffusion bonding, ultrasonic bonding, and spot welding.

As shown in FIG3 , the linear core 30 is preferably not in contact with the second inner wall surface 10b of the housing 10. For example, if the linear core 30 is bent so as to be in contact with the second inner wall surface 10b of the housing 10, the bent portion is likely to become a starting point for physical damage. Furthermore, if the linear core 30 is bent so as to be in contact with the second inner wall surface 10b of the housing 10, the bent portion of the linear core 30 becomes useless from the viewpoint of widely securing the vapor flow path 60 of the working medium 20 described later.

The linear core 30 is preferably made of a porous body.

Examples of the porous body include a sintered body, a nonwoven fabric, a mesh, an etched porous plate, and a fiber bundle.

Examples of the sintered body include a porous metal sintered body, a porous ceramic sintered body, etc. Among them, a porous metal sintered body is preferred, and a porous sintered body of copper or nickel is more preferred.

Examples of the nonwoven fabric include metal nonwoven fabrics, etc. When the linear core 30 is made of nonwoven fabric, it can be manufactured at a low cost.

As the mesh, for example, metal mesh, resin mesh, surface coating mesh, etc. are listed. Among them, copper mesh, stainless steel (SUS) mesh, or polyester mesh is preferred. When the linear core 30 is composed of a mesh, it can be manufactured at a low price.

The etched porous plate is produced by, for example, etching a flat metal plate. When the linear core 30 is formed of the etched porous plate produced in this way, the flatness is excellent.

The fiber bundle is produced by, for example, bundling a plurality of fibers in a linear shape. The fiber bundle functions as a liquid holding portion that sucks up and holds the liquid-phase operating medium 20 by capillary force, and functions as a liquid transport portion that transports the sucked-up liquid-phase operating medium 20.

When the linear core 30 is formed of a fiber bundle, it is preferably formed of a woven fiber bundle. Since a woven fiber bundle having a plurality of fibers woven therein is likely to have unevenness on the surface, when the linear core 30 is formed of a woven fiber bundle, it is easy to transport the liquid phase of the operating medium 20.

Examples of fibers constituting a fiber bundle include metal wires such as copper, aluminum, and stainless steel, and non-metal wires such as carbon fiber and glass fiber. Among them, metal wires are preferred due to their high thermal conductivity. For example, a fiber bundle can be formed by bundling about 200 copper wires with a diameter of about 0.03 mm.

The rail-shaped component 40 includes a pair of wall portions 41 and a wall portion 42 .

The wall portions 41 and 42 are provided in the inner space of the housing 10 so as to protrude from the second inner wall surface 10b toward the thickness direction T. More specifically, the wall portions 41 and 42 are provided in the inner space of the housing 10 so as to protrude from the second inner wall surface 10b toward the first inner wall surface 10a. The direction in which the wall portions 41 and 42 protrude from the second inner wall surface 10b of the housing 10 does not need to be strictly parallel to the thickness direction T.

The wall portion 41 and the wall portion 42 extend in parallel with each other at a distance. In the example shown in Fig. 2 and Fig. 3, the wall portion 41 and the wall portion 42 extend in the length direction L at a distance from each other at a distance from each other at a distance.

As shown in FIG. 3 , the wall portion 41 has, for example, a first surface 41 a , a second surface 41 b , and a third surface 41 c .

The first surface 41 a and the second surface 41 b of the wall portion 41 are opposed to each other in a surface direction (a width direction W in FIG. 3 ).

The first surface 41 a of the wall portion 41 is located on the opposite side of the wall portion 42 relative to the second surface 41 b and is in contact with the third surface 41 c.

The second surface 41b of the wall portion 41 is located closer to the wall portion 42 than the first surface 41a and is in contact with the third surface 41c.

The third surface 41 c of the wall portion 41 faces the first inner wall surface 10 a of the housing 10 in the thickness direction T, and further faces the fourth surface 30 d of the linear core 30 .

As shown in FIG. 3 , the wall portion 42 has, for example, a first surface 42 a , a second surface 42 b , and a third surface 42 c .

The first surface 42 a and the second surface 42 b of the wall portion 42 are opposed to each other in a surface direction (a width direction W in FIG. 3 ).

The first surface 42a of the wall portion 42 is located on the opposite side of the wall portion 41 relative to the second surface 42b and is in contact with the third surface 42c.

The second surface 42b of the wall portion 42 is located closer to the wall portion 41 than the first surface 42a and is in contact with the third surface 42c.

The third surface 42 c of the wall portion 42 faces the first inner wall surface 10 a of the housing 10 in the thickness direction T, and further faces the fourth surface 30 d of the linear core 30 .

The constituent material of the rail-shaped member 40 is used as the constituent material of the wall portion 41 and the wall portion 42 here, and examples thereof include resin, metal, ceramic, a mixture or laminate of a plurality of these materials.

The wall portion 41 and the wall portion 42 may be made of the same material or different materials.

The dimensions of the wall portion 41 and the wall portion 42 in a direction (a width direction W in FIGS. 2 and 3 ) perpendicular to the thickness direction T and the extension direction of the liquid flow path 50 (a length direction L in FIGS. 2 and 3 ) may be the same as or different from each other.

The dimensions of the wall portion 41 and the wall portion 42 in the thickness direction T may be the same as or different from each other.

In the heat diffusion device of the present invention, the rail-shaped member may be integrated with the second inner wall surface of the casing.

As shown in FIG3 , the rail-shaped member 40 may be integrated with the second inner wall surface 10b of the housing 10. That is, the wall portion 41 and the wall portion 42 may be integrated with the second inner wall surface 10b of the housing 10. In this case, the wall portion 41 and the wall portion 42 constituting the rail-shaped member 40 are formed by, for example, etching the second inner wall surface 10b of the housing 10, which is the inner surface of the second sheet 12 in this case.

In the heat diffusion device of the present invention, the linear core and a pair of wall portions of the rail-shaped member are connected in the thickness direction and form a liquid flow path for the actuating medium.

As shown in FIG3 , the linear core 30 is connected to the rail-shaped member 40 in the thickness direction T. More specifically, the linear core 30 is connected to the wall portion 41 in the thickness direction T, and the linear core 30 is connected to the wall portion 42 in the thickness direction T. In the example shown in FIG3 , the fourth surface 30d of the linear core 30 is connected to the third surface 41c of the wall portion 41, and the fourth surface 30d of the linear core 30 is connected to the third surface 42c of the wall portion 42. In this way, the liquid flow path 50 of the actuating medium 20 is formed by the linear core 30 being connected to the wall portion 41 and the wall portion 42 in the thickness direction T, and more specifically, the liquid flow path 50 of the actuating medium 20 in the liquid phase is formed.

The liquid-phase actuating medium 20 existing in the liquid flow path 50 thus constructed exerts a capillary force on the linear core 30 in the thickness direction T.

The linear core 30 is preferably fixed to at least one of the wall portion 41 and the wall portion 42, and more preferably fixed to both of the wall portion 41 and the wall portion 42. For example, the linear core 30 is preferably bonded to at least one of the wall portion 41 and the wall portion 42, and more preferably bonded to both of the wall portion 41 and the wall portion 42. Examples of the bonding method of the linear core 30 include diffusion bonding, ultrasonic bonding, and spot welding.

As shown in FIG. 3 , the liquid flow path 50 has, for example, a first surface 50 a , a second surface 50 b , a third surface 50 c , and a fourth surface 50 d .

The first surface 50a and the second surface 50b of the liquid flow channel 50 are opposed to each other in the surface direction (the width direction W in FIG. 3 ).

The first surface 50a of the liquid flow path 50 is in contact with the third surface 50c and the fourth surface 50d.

The second surface 50b of the liquid flow path 50 is in contact with the third surface 50c and the fourth surface 50d.

The third surface 50c and the fourth surface 50d of the liquid flow path 50 are opposed to each other in the thickness direction T.

The third surface 50c of the liquid flow path 50 is located closer to the first inner wall surface 10a of the housing 10 than the fourth surface 50d.

The fourth surface 50d of the liquid flow path 50 is located closer to the second inner wall surface 10b of the housing 10 than the third surface 50c.

In the example shown in FIG. 3 , the first surface 50a of the liquid flow path 50 is in contact with the second surface 41b of the wall portion 41. The second surface 50b of the liquid flow path 50 is in contact with the second surface 42b of the wall portion 42. The third surface 50c of the liquid flow path 50 is in contact with the fourth surface 30d of the linear core 30. The fourth surface 50d of the liquid flow path 50 is in contact with the second inner wall surface 10b of the housing 10. Thus, in the example shown in FIG. 3 , the liquid flow path 50 is provided in an area surrounded by the second surface 41b of the wall portion 41, the second surface 42b of the wall portion 42, the fourth surface 30d of the linear core 30, and the second inner wall surface 10b of the housing 10.

As described above, in the vapor chamber 1a, the linear core 30 does not need to be bent or processed, and the linear core 30 is arranged in contact with the wall portion 41 and the wall portion 42 in the thickness direction T, thereby easily forming the liquid flow path 50. Therefore, the vapor chamber 1a can be easily manufactured compared to the heat pipe described in FIG. 4 of Patent Document 1, for example.

Furthermore, in the vapor chamber 1a, since the liquid flow path 50 is formed as a cavity without the linear core 30 or the like, the liquid phase actuating medium 20 can move smoothly in the liquid flow path 50. As a result, the permeability of the liquid phase actuating medium 20 in the vapor chamber 1a is improved, and as a result, the liquid transport capacity is improved.

On the other hand, as shown in FIG. 2 and FIG. 3 , in the internal space of the housing 10, in the area outside the linear core 30 and the liquid flow path 50, a vapor flow path 60 of the actuating medium 20, more specifically, a vapor flow path 60 of the actuating medium 20 in the gas phase is provided. That is, in the internal space of the housing 10, the vapor flow path 60 is provided in the surface direction relative to the linear core 30 and the liquid flow path 50. Thus, in the vapor chamber 1a, even if the internal space of the housing 10 is reduced in the thickness direction T, the vapor flow path 60 can be widely ensured in the surface direction. For example, in the vapor chamber 1a, the size of the internal space of the housing 10 in the thickness direction T can be reduced to 100 μm or more and 200 μm or less, and the vapor flow path 60 can be widely ensured in the surface direction. In addition, when the size of the inner space of the housing 10 in the thickness direction T varies in the plane direction, it is specified as the maximum size among these. In this way, in the steam chamber 1a, even if the inner space of the housing 10 is reduced in the thickness direction T, the steam flow path 60 can be widely ensured, thereby easily improving the heat diffusion capacity and further improving the heat distribution performance.

Here, as a comparison example of the steam chamber 1a, the following heat diffusion device is assumed: the linear core 30 is not connected to the first inner wall surface 10a of the shell 10, more specifically, the third surface 30c of the linear core 30 is not connected to the first inner wall surface 10a of the shell 10, and the space between the third surface 30c of the linear core 30 and the first inner wall surface 10a of the shell 10 is used as a steam flow path. In the heat diffusion device of the comparative example, the liquid phase actuating medium 20 sucked up from the liquid flow path 50 by the linear core 30 by capillary force absorbs heat from the heat source, evaporates from the third surface 30c of the linear core 30, and changes into the gas phase actuating medium 20, which moves to the vapor flow path between the third surface 30c of the linear core 30 and the first inner wall surface 10a of the shell 10. However, in the heat diffusion device of the comparative example, if the vapor flow path between the third surface 30c of the linear core 30 and the first inner wall surface 10a of the shell 10 is thinned in the thickness direction T in order to thin the inner space of the shell 10 in the thickness direction T, the vapor pressure of the gas phase actuating medium 20 on the vapor flow path will become much higher than the capillary force of the linear core 30. Therefore, in the heat diffusion device of the comparative example, if the inner space of the shell 10 is thinned in the thickness direction T, the liquid phase actuating medium 20 is not easy to evaporate from the third surface 30c of the linear core 30, and as a result, the maximum heat transfer amount is likely to be reduced.

In contrast, in the vapor chamber 1a, as shown in FIG3 , the third surface 30c of the linear wick 30 is in contact with the first inner wall surface 10a of the housing 10. As a result, in the vapor chamber 1a, as shown by the arrow in FIG3 , the liquid phase actuating medium 20 sucked up by the linear wick 30 from the liquid flow path 50 by the capillary force evaporates from the first surface 30a and the second surface 30b of the linear wick 30 by absorbing heat from a heat source (not shown in FIG3 ), rather than evaporating from the third surface 30c of the linear wick 30, and changes into the gas phase actuating medium 20, and moves to the vapor flow path 60. In this way, in the vapor chamber 1a, the liquid phase actuating medium 20 contained in the linear wick 30 evaporates from the first surface 30a and the second surface 30b of the linear wick 30 toward the widely secured vapor flow path 60. Therefore, in the vapor chamber 1a, unlike the heat diffusion device of the above-mentioned comparative example, the vapor pressure of the gas phase actuating medium 20 in the vapor flow path 60 is not much higher than the capillary force of the linear wick 30. Thus, in the vapor chamber 1a, even if the inner space of the housing 10 is thinned in the thickness direction T, the capillary force of the linear wick 30 is not easily hindered by the vapor pressure of the gas phase actuating medium 20 in the vapor flow path 60, so the liquid phase actuating medium 20 is easily evaporated from the linear wick 30, and as a result, the maximum heat transfer amount is improved.

As described above, according to the vapor chamber 1a, a heat diffusion device that can be easily manufactured and can improve the maximum heat transfer can be realized. In particular, when the vapor chamber 1a is thinned, more specifically, when the inner space of the housing 10 is thinned in the thickness direction T, the maximum heat transfer of the vapor chamber 1a is significantly improved.

In the heat diffusion device of the present invention, the dimension of the liquid flow path in a direction perpendicular to the thickness direction and the extension direction of the liquid flow path is preferably larger than the dimension of the liquid flow path in the thickness direction.

As shown in FIG3 , the dimension F50 of the liquid flow path 50 in the direction (the width direction W in FIG3 ) perpendicular to the thickness direction T and the extension direction of the liquid flow path 50 (the length direction L in FIG3 ) is preferably larger than the dimension G50 of the liquid flow path 50 in the thickness direction T. In this case, the inner space of the housing 10 can be thinned in the thickness direction T, and the vapor cavity 1a can be thinned in the thickness direction T, while the liquid flow path 50 that helps to increase the permeability of the liquid phase actuating medium 20 is expanded.

In addition, in the vapor chamber 1a, as described above, the capillary force of the linear wick 30 acts on the liquid phase actuating medium 20 existing in the liquid flow path 50 in the thickness direction T. Therefore, if the dimension F50 of the liquid flow path 50 is larger than the dimension G50 of the liquid flow path 50, that is, the dimension G50 of the liquid flow path 50 is smaller than the dimension F50 of the liquid flow path 50, the capillary force of the linear wick 30 is likely to affect the entire liquid flow path 50. As a result, the maximum heat transfer amount of the vapor chamber 1a is likely to be increased.

If it is assumed that, unlike the vapor chamber 1a, a wick (e.g., a porous body) is provided on the first surface 50a and the second surface 50b of the liquid flow path 50 instead of the third surface 50c of the liquid flow path 50, so that the capillary force of the wick acts in a direction (the width direction W in FIG. 3 ) orthogonal to the thickness direction T and the extension direction of the liquid flow path 50 (the length direction L in FIG. 3 ), then the capillary force of the wick is not easy to affect the entire liquid flow path 50 because the dimension F50 of the liquid flow path 50 is larger than the dimension G50 of the liquid flow path 50. As a result, the liquid phase of the operating medium 20 existing only near the first surface 50a and the second surface 50b of the liquid flow path 50 is easily absorbed by the wick and evaporates, so it is not easy to increase the maximum heat transfer amount.

Based on the above viewpoints, when the dimension F50 of the liquid flow path 50 is larger than the dimension G50 of the liquid flow path 50, as shown in the vapor chamber 1a, it is more effective to provide the wall portion 41 and the wall portion 42 instead of the core on the first surface 50a and the second surface 50b of the liquid flow path 50, and to provide the core on the third surface 50c of the liquid flow path 50.

The dimension F50 of the liquid flow path 50 is not particularly limited, and is, for example, 500 μm or more and 2000 μm or less. In addition, when the dimension F50 of the liquid flow path 50 varies in the thickness direction T, it is defined as the largest dimension among the dimensions.

The dimension G50 of the liquid flow path 50 is not particularly limited, and is, for example, 50 μm or more and 100 μm or less. In addition, when the dimension G50 of the liquid flow path 50 changes in the plane direction, it is defined as the largest dimension among these dimensions.

The dimension F50 of the liquid flow path 50 is preferably not less than 5 times and not more than 50 times the dimension G50 of the liquid flow path 50 .

In the heat diffusion device of the present invention, the dimension of the linear core in the thickness direction is preferably larger than 1/3 of the dimension of the vapor flow path of the actuating medium in the thickness direction.

As shown in FIG3 , the dimension G30 of the linear core 30 in the thickness direction T is preferably greater than 1/3 of the dimension G60 of the vapor flow path 60 in the thickness direction T. In this case, since the areas of the first surface 30a and the second surface 30b of the linear core 30 can be enlarged, the effective evaporation area (the dotted line portion in FIG3 ) of the liquid phase actuating medium 20 when evaporating from the first surface 30a and the second surface 30b of the linear core 30 can be enlarged. As a result, the maximum heat transfer amount of the vapor chamber 1a can be easily increased.

The size G30 of the linear core 30 is not particularly limited, and is, for example, 50 μm or more and 100 μm or less. In addition, when the size G30 of the linear core 30 varies in the plane direction, it is defined as the largest size among the sizes.

The dimension G60 of the vapor flow path 60 is not particularly limited, and is, for example, not less than 100 μm and not more than 200 μm. In addition, when the dimension G60 of the vapor flow path 60 changes in the plane direction, it is defined as the largest dimension among these dimensions.

From the viewpoint of widely ensuring the liquid flow path 50 which helps to improve the permeability of the liquid-phase operating medium 20 , the size G30 of the linear core 30 is preferably less than 2/3 of the size G60 of the vapor flow path 60 .

In the heat diffusion device of the present invention, both ends of the linear core may be aligned with both ends of the rail-shaped member in a direction perpendicular to the thickness direction and the extending direction of the liquid flow path.

As shown in Figures 2 and 3, in a direction (width direction W in Figures 2 and 3) orthogonal to the thickness direction T and the extension direction of the liquid flow path 50 (length direction L in Figures 2 and 3), the two ends of the linear core 30 can also be respectively consistent with the two ends of the guide rail-like component 40.

In this specification, the end of the linear core and the end of the guide-shaped member are consistent in the direction perpendicular to the thickness direction and the extension direction of the liquid flow path, which means that the end of the linear core and the end of the guide-shaped member exist on the same plane along the thickness direction and the extension direction of the liquid flow path.

In the examples shown in FIGS. 2 and 3 , both ends of the linear core 30 in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50 correspond to the first surface 30a and the second surface 30b. In addition, in the examples shown in FIGS. 2 and 3 , both ends of the rail-shaped member 40 in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50 correspond to the first surface 41a of the wall portion 41 and the first surface 42a of the wall portion 42. Thus, in the examples shown in FIGS. 2 and 3 , in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50, the first surface 30a of the linear core 30 coincides with the first surface 41a of the wall portion 41, and the second surface 30b of the linear core 30 coincides with the first surface 42a of the wall portion 42.

As shown in Fig. 2, it is preferred that the evaporation portion EP overlaps with the linear core 30 and the liquid flow path 50 when viewed from the thickness direction T. In this case, as described later, the liquid-phase operating medium 20 is transported to the evaporation portion EP via the linear core 30 and the liquid flow path 50.

For the linear core 30, the rail-shaped member 40 and the liquid flow path 50 of the vapor chamber 1a shown in FIG2, FIG3 shows the cross-sectional structure of the region overlapping with the evaporation portion EP, but it is preferred that the cross-sectional structure of the region not overlapping with the evaporation portion EP is also the same as FIG3.

The steam chamber 1a shown in Figs. 2 and 3 operates as follows.

The liquid-phase actuating medium 20 is evaporated by absorbing heat from the heat source HS in the linear core 30 and the liquid flow path 50 existing in the evaporation section EP, and is changed into the gas-phase actuating medium 20. Furthermore, the gas-phase actuating medium 20 generated in the evaporation section EP moves to a place separated from the evaporation section EP, such as the end periphery of the linear core 30 and the liquid flow path 50 on the opposite side of the evaporation section EP, through the vapor flow path 60, and is cooled there, and is changed into the liquid-phase actuating medium 20. Furthermore, the liquid-phase actuating medium 20 is recovered from the linear core 30 and the liquid flow path 50 and transported to the evaporation section EP.

In the steam chamber 1a, by repeating the above process, the actuating medium 20 circulates while generating a gas-liquid phase change. At this time, the heat from the heat source HS is absorbed in the evaporation part EP as the evaporation latent heat of the actuating medium 20 in the liquid phase to the actuating medium 20 in the gas phase, and then released as the condensation latent heat of the actuating medium 20 in the gas phase to the actuating medium 20 in the liquid phase at a place separated from the evaporation part EP. In this way, the steam chamber 1a is self-actuated without external power, and further, the evaporation latent heat and condensation latent heat of the actuating medium 20 are utilized to diffuse the heat from the heat source HS in two dimensions at a high speed. Furthermore, in the steam chamber 1a, as described above, the steam flow path 60 is widely ensured, and the actuating medium 20 in the liquid phase is easily evaporated from the linear core 30, thereby increasing the maximum heat transfer amount.

<Implementation Form 2> In the heat diffusion device of the present invention, at least one end of the linear core may be located outside the guide rail-shaped member in a direction perpendicular to the thickness direction and the extension direction of the liquid flow path. In this case, in the heat diffusion device of the present invention, at least one end of the linear core may be located outside the guide rail-shaped member in a direction perpendicular to the thickness direction and the extension direction of the liquid flow path. Regarding this point, a heat diffusion device different from the heat diffusion device of Implementation Form 1 of the present invention will be described below as a heat diffusion device of Implementation Form 2 of the present invention.

Fig. 4 is a schematic top view showing the internal structure of an example of a heat diffusion device according to Embodiment 2 of the present invention. Fig. 5 is a schematic cross-sectional view showing a cross section along line B1-B2 of the heat diffusion device shown in Fig. 4 .

In the vapor chamber 1b shown in FIG. 4 and FIG. 5 , one end of the linear core 30 is located outside the rail-shaped member 40 in a direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50 (the length direction L in FIG. 4 and FIG. 5 ). More specifically, in a direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50, the second surface 30b of the linear core 30 is located outside the first surface 42a of the wall portion 42. That is, in a direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50, a portion of the second surface 30b side of the fourth surface 30d of the linear core 30 is exposed outside the rail-shaped member 40. Thus, in the thickness direction T, a portion of the second surface 30 b side of the fourth surface 30 d of the linear core 30 faces the second inner wall surface 10 b of the housing 10 where the liquid flow path 50 is not provided.

On the other hand, in the vapor chamber 1 b shown in FIGS. 4 and 5 , the first surface 30 a of the linear core 30 coincides with the first surface 41 a of the wall portion 41 in a direction perpendicular to the thickness direction T and the extending direction of the liquid flow path 50 .

In the vapor chamber 1b, unlike the examples shown in Figures 4 and 5, in a direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50, the first surface 30a of the linear core 30 is located further outside than the first surface 41a of the wall portion 41, and the second surface 30b of the linear core 30 is consistent with the first surface 42a of the wall portion 42.

In the vapor chamber 1b, in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50, because one end of the linear core 30 is located outside the guide-shaped member 40, the effective evaporation area of the linear core 30 (the dotted line portion in FIG. 5 ) is only the portion of the linear core 30 exposed outside the guide-shaped member 40 at one end side, and in the example shown in FIG. 5 , only the portion of the fourth surface 30d of the linear core 30 exposed outside the guide-shaped member 40 is further expanded. Therefore, in the vapor chamber 1b, the liquid-phase operating medium 20 is easily evaporated from the linear core 30 compared to the vapor chamber 1a, and as a result, the maximum heat transfer amount is easily increased.

For the linear core 30, the rail-shaped member 40 and the liquid flow path 50 of the vapor chamber 1b shown in FIG4, FIG5 shows the cross-sectional structure of the region overlapping with the evaporation portion EP, but it is preferred that the cross-sectional structure of the region not overlapping with the evaporation portion EP is the same as FIG5. In this case, if the gas phase actuating medium 20 generated in the evaporation portion EP passes through the vapor flow path 60 and is cooled outside the rail-shaped member 40 in the region not overlapping with the evaporation portion EP to change into the liquid phase actuating medium 20, the liquid phase actuating medium 20 can be recovered through the linear core 30 exposed outside the rail-shaped member 40. In this way, when the steam chamber 1b has the same cross-sectional structure as that of FIG. 5 in the area not overlapping with the evaporation portion EP, the liquid phase actuating medium 20 existing on the outer side of the guide-shaped member 40 can be effectively recovered by the linear core 30 exposed on the outer side of the guide-shaped member 40, and as a result, the maximum heat transfer capacity of the steam chamber 1b can be easily increased.

As described above, the linear core 30 exposed on the outer side of the rail-shaped component 40 helps to improve the evaporation efficiency of the liquid-phase actuating medium 20 in the evaporation part EP where the liquid-phase actuating medium 20 evaporates, and helps to improve the recovery efficiency of the liquid-phase actuating medium 20 in the liquid recovery part where the liquid-phase actuating medium 20 is recovered.

The dimension K1 of a portion of the side of one end of the linear core 30 exposed outside the rail-shaped member 40 in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50 may be the same or different in the evaporation portion EP and the liquid recovery portion. For example, from the viewpoint of the evaporation efficiency of the liquid-phase actuating medium 20, the dimension K1 in the evaporation portion EP may be larger than the dimension K1 in the liquid recovery portion, and from the viewpoint of the recovery efficiency of the liquid-phase actuating medium 20, the dimension K1 in the liquid recovery portion may be larger than the dimension K1 in the evaporation portion EP.

In the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50, a portion of the dimension K1 on the side of an end portion of the linear core 30 exposed on the outer side of the guide-shaped member 40 can also be said to represent a portion of the dimension on the side of the second surface 30b on the fourth surface 30d of the linear core 30 exposed on the outer side of the guide-shaped member 40 in the example shown in Figure 5, or represents the distance between the second surface 30b of the linear core 30 and the first surface 42a of the wall portion 42.

<Implementation Form 3> In the heat diffusion device of the present invention, at least one end of the linear core may be located outside the guide rail-shaped member in a direction perpendicular to the thickness direction and the extension direction of the liquid flow path. In this case, in the heat diffusion device of the present invention, both ends of the linear core may be located outside the guide rail-shaped member in a direction perpendicular to the thickness direction and the extension direction of the liquid flow path. Regarding this point, a heat diffusion device different from the heat diffusion device of Implementation Form 1 of the present invention will be described below as a heat diffusion device of Implementation Form 3 of the present invention.

Fig. 6 is a schematic top view showing the internal structure of an example of a heat diffusion device according to Embodiment 3 of the present invention. Fig. 7 is a schematic cross-sectional view showing a cross section along line C1-C2 of the heat diffusion device shown in Fig. 6 .

In the vapor chamber 1c shown in FIG6 and FIG7, in the direction (in FIG6 and FIG7, the width direction W) perpendicular to the thickness direction T and the extension direction of the liquid flow path 50 (in FIG6 and FIG7, the length direction L), both ends of the linear core 30 are located outside the rail-shaped member 40. More specifically, in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50, the first surface 30a of the linear core 30 is located outside the first surface 41a of the wall portion 41, and the second surface 30b of the linear core 30 is located outside the first surface 42a of the wall portion 42. That is, in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50, a portion of the first surface 30a side on the fourth surface 30d of the linear core 30 and a portion of the second surface 30b side on the fourth surface 30d of the linear core 30 are exposed outside the rail-shaped member 40. Thus, in the thickness direction T, a portion of the first surface 30a side on the fourth surface 30d of the linear core 30 and a portion of the second surface 30b side on the fourth surface 30d of the linear core 30 face the second inner wall surface 10b of the housing 10 where the liquid flow path 50 is not provided.

In the vapor chamber 1c, in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50, the two ends of the linear core 30 are located outside the guide-shaped member 40, and the evaporation effective area of the linear core 30 (the dotted line portion in FIG. 7 ) is further expanded compared with the vapor chamber 1a, only the portion of the linear core 30 exposed on the two end sides and outside the guide-shaped member 40, in the example of FIG. 7 , only the portion of the fourth surface 30d of the linear core 30 exposed outside the guide-shaped member 40. Therefore, in the vapor chamber 1c, the liquid-phase operating medium 20 is easily evaporated from the linear core 30, compared with the vapor chamber 1a, and as a result, the maximum heat transfer amount is easily increased.

Compared with the steam chamber 1b, the effective evaporation area of the steam chamber 1c is further expanded. Therefore, compared with the steam chamber 1b, the liquid phase of the working medium 20 in the steam chamber 1c is easier to evaporate from the linear wick 30, and as a result, the maximum heat transfer amount is easier to increase.

For the linear core 30, the guide rail-shaped member 40 and the liquid flow path 50 of the vapor chamber 1c shown in Fig. 6, Fig. 7 shows the cross-sectional structure of the region overlapping with the evaporation portion EP, but it is preferred that the cross-sectional structure of the region not overlapping with the evaporation portion EP is also the same as Fig. 7. In this way, when the vapor chamber 1c has the same cross-sectional structure as Fig. 7 in the region not overlapping with the evaporation portion EP, the liquid-phase actuating medium 20 existing on the outer side of the guide rail-shaped member 40 can be effectively recovered by the linear core 30 exposed on the outer side of the guide rail-shaped member 40, and as a result, the maximum heat transfer amount of the vapor chamber 1c can be easily increased.

The vapor chamber 1c has the same cross-sectional structure as that of FIG. 7 in the area not overlapping with the evaporation portion EP. Compared with the vapor chamber 1b having the same cross-sectional structure as that of FIG. 5 in the area not overlapping with the evaporation portion EP, the linear core 30 is exposed to the outside of the guide-shaped component 40 at both end sides, so it is easy to improve the recovery efficiency of the liquid phase actuating medium 20.

The dimension K1 of a portion of the side of one end of the linear core 30 exposed outside the rail-shaped member 40 in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50 may be the same or different in the evaporation portion EP and the liquid recovery portion. For example, from the viewpoint of the evaporation efficiency of the liquid-phase actuating medium 20, the dimension K1 in the evaporation portion EP may be larger than the dimension K1 in the liquid recovery portion, and from the viewpoint of the recovery efficiency of the liquid-phase actuating medium 20, the dimension K1 in the liquid recovery portion may be larger than the dimension K1 in the evaporation portion EP.

In the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50, a portion of the dimension K1 of the side of one end of the linear core 30 exposed on the outer side of the guide-shaped component 40 can also be said to represent a portion of the dimension of the side of the second surface 30b on the fourth surface 30d of the linear core 30 exposed on the outer side of the guide-shaped component 40, or represent the distance between the second surface 30b of the linear core 30 and the first surface 42a of the wall portion 42 in the example shown in Figure 7.

The dimension K2 of a portion of the other end side of the linear core 30 exposed outside the rail-shaped member 40 in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50 may be the same or different in the evaporation portion EP and the liquid recovery portion. For example, from the viewpoint of the evaporation efficiency of the liquid-phase actuating medium 20, the dimension K2 in the evaporation portion EP may be larger than the dimension K2 in the liquid recovery portion, and from the viewpoint of the recovery efficiency of the liquid-phase actuating medium 20, the dimension K2 in the liquid recovery portion may be larger than the dimension K2 in the evaporation portion EP.

In the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50, a portion of the dimension K2 of the other end side of the linear core 30 exposed on the outer side of the guide-shaped component 40 can also be said to represent a portion of the dimension of the first surface 30a side on the fourth surface 30d of the linear core 30 exposed on the outer side of the guide-shaped component 40 in the example shown in Figure 7, or represent the distance between the first surface 30a of the linear core 30 and the first surface 41a of the wall portion 41.

The size K1 and the size K2 may be the same or different in the evaporation part EP. Also, the size K1 and the size K2 may be the same or different in the liquid recovery part.

<Implementation Form 4> The heat diffusion device of the present invention preferably further has a plurality of pillars, which are arranged inside the liquid flow path with intervals between them along the extension direction of the liquid flow path, and support the linear core. In this regard, a heat diffusion device that is different from the heat diffusion device of Implementation Form 1 of the present invention will be described below as a heat diffusion device of Implementation Form 4 of the present invention.

Fig. 8 is a schematic top view showing the internal structure of an example of a heat diffusion device according to Embodiment 4 of the present invention. Fig. 9 is a schematic cross-sectional view showing a cross section along line D1-D2 of the heat diffusion device shown in Fig. 8 .

The steam chamber 1d shown in FIGS. 8 and 9 further has a plurality of pillars 70 .

As shown in FIG8 , a plurality of pillars 70 are disposed inside the liquid flow path 50 at intervals along the extension direction (the length direction L in FIG8 ) of the liquid flow path 50 . That is, the plurality of pillars 70 are disposed between the wall portion 41 and the wall portion 42 .

As shown in FIG8 , the plurality of pillars 70 are preferably evenly arranged in the liquid flow path 50 so that the distance between the pillars 70 is constant. In this case, the plurality of pillars 70 are preferably evenly arranged in a part of the liquid flow path 50, and more preferably evenly arranged over the entire area. In the area where the plurality of pillars 70 are evenly arranged, the strength of the vapor chamber 1d is ensured to be uniform.

The plurality of pillars 70 support the linear core 30. In the example shown in FIG. 9, the plurality of pillars 70 are in contact with the linear core 30, here, with the fourth surface 30d of the linear core 30, and with the second inner wall surface 10d of the housing 10, inside the liquid flow path 50, and support the linear core 30 from the liquid flow path 50 side. By supporting the linear core 30 with the plurality of pillars 70, even if the linear core 30 is to be deformed by the pressure from the outside, the liquid flow path 50 is not easily crushed. As a result, the permeability of the liquid phase of the operating medium 20 in the liquid flow path 50 is ensured.

As shown in Fig. 9, the plurality of pillars 70 may be integrated with the second inner wall surface 10b of the housing 10. In this case, the plurality of pillars 70 are formed by, for example, etching the second inner wall surface 10b of the housing 10, here, the inner surface of the second sheet 12.

The plurality of pillars 70 may be joined to the second inner wall surface 10b of the housing 10. In this case, the plurality of pillars 70 are joined to the second inner wall surface 10b of the housing 10, and here to the inner surface of the second sheet 12, by a joining method such as diffusion joining.

The plurality of pillars 70 may be arranged in one row along the extending direction of the liquid flow path 50 as shown in FIG. 8 , or may be arranged in a plurality of rows.

The constituent materials of the plurality of pillars 70 include, for example, resin, metal, ceramic, a mixture or laminate of the above plurality of materials, etc.

The materials constituting the plurality of pillars 70 may be the same as or different from each other.

The plurality of pillars 70 may be independent and may include a single layer or multiple layers.

The dimensions of the plurality of pillars 70 in the extension direction of the liquid flow path 50 are each converted into the approximate diameter of the cross section along the surface direction of the end of the thickness direction T of the pillar 70, for example, 100 μm to 2000 μm, preferably 300 μm to 1000 μm. When the dimensions of the pillars 70 in the extension direction of the liquid flow path 50 increase, the linear core 30 is further suppressed from changing due to external pressure. When the dimensions of the pillars 70 in the extension direction of the liquid flow path 50 decrease, the liquid flow path 50 is more widely secured.

The dimensions of the plurality of pillars 70 in the extending direction of the liquid flow path 50 may be the same as each other, may be different from each other, or may be partially different.

The dimensions of the plurality of pillars 70 in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50 (the width direction W in FIG. 8 and FIG. 9 ) are each converted into the approximate diameter of the circle of the cross section along the surface direction of the end of the thickness direction T of the pillar 70, for example, 100 μm to 2000 μm, preferably 300 μm to 1000 μm. When the dimensions of the pillars 70 in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50 increase, the linear core 30 is further suppressed from changing due to external pressure. When the dimensions of the pillars 70 in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50 decrease, the liquid flow path 50 is more widely secured.

The dimensions of the plurality of pillars 70 in the direction perpendicular to the thickness direction T and the extending direction of the liquid flow path 50 may be the same as each other, different from each other, or partially different from each other.

In the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50, the dimensions of the plurality of pillars 70 may be independent and the same as or different from the dimensions of the wall portion 41. In addition, in the direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50, the dimensions of the plurality of pillars 70 may be independent and the same as or different from the dimensions of the wall portion 42.

The dimensions of the plurality of pillars 70 in the thickness direction T may be the same as each other, may be different from each other, or may be partially different.

In the thickness direction T, the dimensions of the plurality of pillars 70 may be independent and the same as or different from the dimensions of the wall portion 41. In addition, in the thickness direction T, the dimensions of the plurality of pillars 70 may be independent and the same as or different from the dimensions of the wall portion 42.

Examples of the planar shapes of the plurality of pillars 70 when viewed from above in the thickness direction T include triangles, polygons such as a rectangle as shown in FIG. 8 , circles, ellipses, and shapes combining these.

The planar shapes of the plurality of pillars 70 may be the same as each other, may be different from each other, or may be partially different.

As the cross-sectional shape of the plurality of pillars 70 when viewed in the plane direction, each of them may be a polygon such as a rectangle as shown in FIG. 9 .

The cross-sectional shapes of the plurality of pillars 70 may be the same as each other, may be different from each other, or may be partially different.

The size, shape, number, and arrangement of the plurality of pillars 70 in an actual product may also be different from the examples shown in FIGS. 8 and 9 .

A plurality of pillars 70 may be connected to each other to form a support. That is, a row of supports extending in the extension direction of the liquid flow path 50 may be provided in the vapor chamber 1d. In addition, a plurality of rows of supports extending in the extension direction of the liquid flow path 50 may be provided in the vapor chamber 1d in a manner that they are spaced apart from each other in a direction perpendicular to the thickness direction T and the extension direction of the liquid flow path 50.

The heat diffusion device of the fourth embodiment of the present invention shows an example of providing a plurality of pillars to the heat diffusion device of the first embodiment of the present invention. The heat diffusion devices of other embodiments of the present invention may also be provided with a plurality of pillars.

<Implementation Form 5> In the heat diffusion device of the present invention, the rail-shaped member can also be joined to the second inner wall surface of the housing. Regarding this point, a heat diffusion device that is different from the heat diffusion device of Implementation Form 1 of the present invention will be described below as a heat diffusion device of Implementation Form 5 of the present invention.

Fig. 10 is a schematic top view showing the internal structure of an example of a heat diffusion device according to Embodiment 5 of the present invention. Fig. 11 is a schematic cross-sectional view showing a cross section along line E1-E2 of the heat diffusion device shown in Fig. 10 .

In the steam chamber 1e shown in Figures 10 and 11, the rail-shaped member 40' is joined to the second inner wall surface 10b of the housing 10. The rail-shaped member 40' is joined to the second inner wall surface 10b of the housing 10, and here to the inner surface of the second sheet 12, by a joining method such as diffusion joining.

The rail-shaped member 40 ′ includes a connecting portion 43 in addition to the wall portion 41 and the wall portion 42 .

The connecting portion 43 connects the wall portion 41 and the wall portion 42 at the second inner wall surface 10 b side of the housing 10 .

In the example shown in FIG. 11 , as a rail-shaped member, a rail-shaped member 40 ′ having a structure in which a wall portion 41 and a wall portion 42 are connected by a connecting portion 43 is shown, but a rail-shaped member having a structure in which the wall portion 41 and the wall portion 42 are not connected may also be used.

In the heat diffusion device of embodiment 5 of the present invention, an example of a state in which the rail-shaped member is joined to the second inner wall surface of the casing in the heat diffusion device of embodiment 1 of the present invention is shown, but in the heat diffusion devices of other embodiments of the present invention, the rail-shaped member may also be joined to the second inner wall surface of the casing.

<Implementation Form 6> In the heat diffusion device of the present invention, the linear core can also be arranged along the outer periphery of the internal space of the shell. Regarding this point, a heat diffusion device that is different from the heat diffusion device of Implementation Form 1 of the present invention will be described below as a heat diffusion device of Implementation Form 6 of the present invention.

FIG. 12 is a schematic top view showing the internal structure of an example of a heat diffusion device according to the sixth embodiment of the present invention.

In the steam chamber 1f shown in Fig. 12, the linear core 30 is arranged along the outer periphery of the inner space of the housing 10. In the example shown in Fig. 12, the linear core 30 is arranged only on the outer periphery of the inner space of the housing 10.

As shown in FIG. 12 , both ends of the linear core 30 are preferably arranged so as to be concentrated on the evaporation portion EP.

As shown in FIG. 12 , in the area surrounded by the linear core 30, a vapor flow path 60 of the actuating medium 20 is preferably provided. More specifically, a vapor flow path 60 of the actuating medium 20 in a gas phase is provided.

<Implementation Form 7> In each of the above implementation forms, the heat diffusion device of the present invention has been exemplified as having one linear core, but the heat diffusion device of the present invention may also have a plurality of linear cores. When the heat diffusion device of the present invention has a plurality of linear cores, when viewed from the thickness direction, the plurality of linear cores preferably extend in parallel with each other with spaces therebetween. In this regard, a heat diffusion device having a different form from the heat diffusion device of Implementation Form 1 of the present invention will be described below as a heat diffusion device of Implementation Form 7 of the present invention.

FIG. 13 is a schematic top view showing the internal structure of an example of a heat diffusion device according to Embodiment 7 of the present invention.

The steam chamber 1g shown in Fig. 13 has a plurality of linear cores 30. In the example shown in Fig. 13, the number of the linear cores 30 is 4, but the number of the linear cores 30 is not particularly limited as long as it is 2 or more.

The constituent materials of the plurality of linear cores 30 may be the same as each other, different from each other, or partially different from each other.

The dimensions of the plurality of linear cores 30 in the thickness direction T may be the same as each other, may be different from each other, or may be partially different.

As shown in FIG. 13 , when viewed from the thickness direction T, the plurality of linear cores 30 extend in parallel with each other at intervals.

As shown in Fig. 13, the plurality of linear cores 30 are preferably arranged in a manner concentrated on the evaporation portion EP. In this case, the operating medium 20 can circulate at a shorter distance.

As shown in FIG13 , the first vapor flow path 61 is preferably provided between adjacent linear cores 30. In this case, the second vapor flow path 62 having a dimension in the width direction W larger than the first vapor flow path 61 is preferably provided between the outermost linear core 30 (the leftmost linear core 30 in FIG13 ) among the plurality of linear cores 30 and the housing 10. Furthermore, the third vapor flow path 63 having a dimension in the width direction W larger than the first vapor flow path 61 is preferably provided between the outermost linear core 30 (the rightmost linear core 30 in FIG13 ) among the plurality of linear cores 30 and the housing 10.

In the steam chamber, if the plurality of linear cores 30 are biased to be located in a part of the inner space of the housing 10, the gas phase activating medium 20 is not easy to pass through the area, so the heat uniformity performance is easily reduced. In contrast, in the steam chamber 1g, since the plurality of linear cores 30 are extended in parallel with each other at intervals, and the gaps between the plurality of linear cores 30 are used as steam flow paths, the heat uniformity performance is easily improved.

Based on the above, in the steam chamber 1g, the liquid phase actuating medium 20 and the gas phase actuating medium 20 are easy to circulate, and the liquid transport capacity and the heat uniformity performance are easy to improve.

In the heat diffusion device of the seventh embodiment of the present invention, an example of a heat diffusion device of the first embodiment of the present invention having a plurality of linear cores is shown, but a plurality of linear cores may also be provided in the heat diffusion device of other embodiments of the present invention.

<Implementation Form 8> In each of the above implementation forms, the heat diffusion device of the present invention has been exemplified in which the shell has one evaporation part, that is, one heat source is installed on the outer wall of the shell, but the shell of the heat diffusion device of the present invention may also have multiple evaporation parts, that is, multiple heat sources may also be installed on the outer wall of the shell. In this regard, a heat diffusion device that is different from the heat diffusion device of the implementation form 1 of the present invention and the heat diffusion device of the implementation form 7 of the present invention will be described below as the heat diffusion device of the implementation form 8 of the present invention.

Fig. 14 is a schematic top view showing the internal structure of one example of a heat diffusion device according to the eighth embodiment of the present invention. Fig. 15 is a schematic top view showing the internal structure of another example of a heat diffusion device according to the eighth embodiment of the present invention.

In the evaporation chamber 1h shown in Fig. 14 and the evaporation chamber 1h' shown in Fig. 15, the housing 10 has a plurality of evaporation parts EP. The number of evaporation parts EP is 2 in the example of Fig. 14 and 3 in the example of Fig. 15, but is not particularly limited as long as it is 2 or more.

The vapor chamber 1h shown in Fig. 14 has two linear cores 30. In the example shown in Fig. 14, the two linear cores 30 overlap with different evaporation parts EP.

The vapor chamber 1h' shown in Fig. 15 has three linear cores 30. In the example shown in Fig. 15, the three linear cores 30 are overlapped with different evaporation parts EP.

As shown in FIG. 14 and FIG. 15 , the plurality of linear cores 30 preferably overlap with different evaporation portions EP.

As shown in FIG. 14 and FIG. 15 , when the housing 10 has a plurality of evaporation parts EP, the plurality of evaporation parts EP may be independently disposed at the ends of the housing 10 or at the center of the housing 10 .

The heat diffusion device of the eighth embodiment of the present invention shows an example of a heat diffusion device of the first embodiment of the present invention having a plurality of evaporation parts, but a plurality of evaporation parts may also be provided in the heat diffusion device of other embodiments of the present invention.

[Electronic device] The electronic device of the present invention is described below.

The electronic device of the present invention comprises the heat diffusion device of the present invention and electronic parts mounted on the outer wall surface of the casing of the heat diffusion device.

FIG. 16 is a three-dimensional schematic diagram showing an example of the electronic device of the present invention.

Hereinafter, as an example of the electronic device of the present invention, an electronic device having the heat diffusion device of the first embodiment of the present invention will be described. The same applies to electronic devices having the heat diffusion devices of other embodiments of the present invention.

The electronic device 100 shown in FIG. 16 has a vapor chamber 1 a and electronic components 110 .

The electronic component 110 is equivalent to the heat source HS shown in FIG. 1 .

The electronic component 110 is mounted on the outer wall surface of the shell 10 of the steam chamber 1a. More specifically, the electronic component 110 can be mounted on the outer wall surface on the opposite side of the first inner wall surface 10a of the shell 10, which is the outer surface of the first sheet 11, relative to the shell 10 shown in FIG. 3, or can be mounted on the outer wall surface on the opposite side of the second inner wall surface 10b of the shell 10, which is the outer surface of the second sheet 12.

The electronic component 110 can be directly mounted on the outer wall of the housing 10, or can be mounted via other components such as adhesives, sheets, tapes, etc. with high thermal conductivity.

When the electronic component 110 is mounted on the outer wall of the housing 10 shown in FIG. 2 , it overlaps with the evaporation portion EP of the housing 10 when viewed from the thickness direction T.

Examples of the electronic component 110 include heat generating elements such as a central processing unit (CPU), a light emitting diode (LED), and a power semiconductor.

Examples of the electronic device 100 include a smartphone, a tablet terminal, a laptop computer, a game console, and a wearable device.

As shown in FIG16 , it is preferred that the electronic device 100 further comprises a device housing 120 . In the example shown in FIG16 , the steam chamber 1 a and the electronic component 110 are disposed in the inner space of the device housing 120 .

The housing 10 and the machine housing 120 are preferably joined via a joining member. More specifically, the outer wall surface of the housing 10 and the inner wall surface of the machine housing 120 are preferably joined via a joining member. In this case, the close contact between the housing 10 and the machine housing 120 is improved.

The bonding member that bonds the housing 10 to the machine housing 120 is preferably a heat conductive member. In this case, the heat from the heat source HS, here the heat from the electronic component 110, is easily transferred from the housing 10 to the machine housing 120. That is, even if the path from the housing 10 to the machine housing 120 is used, the heat from the heat source HS, here the heat from the electronic component 110, is easily diffused.

Examples of thermally conductive members include thermally conductive tapes and thermally conductive adhesives.

As described above, the steam chamber 1a is self-actuated without external power, and further, the evaporation latent heat and condensation latent heat of the actuating medium 20 are utilized to diffuse the heat from the heat source HS, here, the heat from the electronic component 110, in two dimensions at high speed. Furthermore, in the steam chamber 1a, as described above, the steam flow path 60 is widely ensured, and the liquid actuating medium 20 is easy to evaporate from the linear core 30, so the maximum heat transfer amount is improved. Based on the above, by using the electronic device 100 having the steam chamber 1a, heat dissipation can be effectively achieved in the limited space inside the electronic device 100. [Industrial Applicability]

The heat dissipation device of the present invention can be widely used in the field of portable information terminals, etc. The heat dissipation device of the present invention can be used, for example, to reduce the temperature of the heat source of the central processing unit, etc., to extend the use time of electronic equipment, and can be used in smart phones, tablet terminals, laptops, game consoles, wearable devices, etc.

1a: Vapor chamber (heat diffusion device) 1b: Vapor chamber (heat diffusion device) 1c: Vapor chamber (heat diffusion device) 1d: Vapor chamber (heat diffusion device) 1e: Vapor chamber (heat diffusion device) 1f: Vapor chamber (heat diffusion device) 1g: Vapor chamber (heat diffusion device) 1h: Vapor chamber (heat diffusion device) 1h': Vapor chamber (heat diffusion device) 10: Shell 10a: 1st inner wall surface 10b: 2nd inner wall surface 11: 1st sheet 12: 2nd sheet 20: Actuating medium 30: Linear core 30a: 1st surface of linear core 30b: 2nd surface of linear core 30c: 3rd surface of linear core 30d: 4th surface of linear core 40: Guide rail-shaped member 40': Guide rail-shaped member 41: Wall 41a: 1st surface of wall 41b: 2nd surface of wall 41c: 3rd surface of wall 42: Wall 42a: 1st surface of wall 42b: 2nd surface of wall 42c: 3rd surface of wall 43: Connecting part 50: Liquid flow path 50a: 1st surface of liquid flow path 50b: 2nd surface of liquid flow path 50c: 3rd surface of liquid flow path 50d: 4th surface of liquid flow path 60: Vapor flow path 61: 1st vapor flow path 62: 2nd vapor flow path 63: 3rd vapor flow path 70: Support 100: Electronic equipment 110: Electronic parts 120: Machine housing EP: Evaporation section F50: Dimensions of the liquid flow path in the direction perpendicular to the thickness direction and the extension direction of the liquid flow path G30: Dimensions of the linear core in the thickness direction G50: Dimensions of the liquid flow path in the thickness direction G60: Dimensions of the vapor flow path in the thickness direction HS: Heat source K1: Dimensions of a portion of the linear core on one end side exposed outside the guide rail-shaped member K2: Dimensions of a portion of the linear core on the other end side exposed outside the guide rail-shaped member L: Length direction T: Thickness direction W: Width direction

FIG. 1 is a three-dimensional schematic diagram showing an example of a heat diffusion device of embodiment 1 of the present invention. FIG. 2 is a top view schematic diagram showing the internal structure of an example of a heat diffusion device of embodiment 1 of the present invention. FIG. 3 is a cross-sectional schematic diagram showing a cross section along the line segment A1-A2 of the heat diffusion device shown in FIG. 2. FIG. 4 is a top view schematic diagram showing the internal structure of an example of a heat diffusion device of embodiment 2 of the present invention. FIG. 5 is a cross-sectional schematic diagram showing a cross section along the line segment B1-B2 of the heat diffusion device shown in FIG. 4. FIG. 6 is a top view schematic diagram showing the internal structure of an example of a heat diffusion device of embodiment 3 of the present invention. FIG. 7 is a cross-sectional schematic diagram showing a cross section along the line segment C1-C2 of the heat diffusion device shown in FIG. 6. FIG8 is a schematic diagram showing a top view of the internal structure of an example of a heat diffusion device of the fourth embodiment of the present invention. FIG9 is a schematic diagram showing a cross-sectional view of a cross section along the line segment D1-D2 of the heat diffusion device shown in FIG8. FIG10 is a schematic diagram showing a top view of the internal structure of an example of a heat diffusion device of the fifth embodiment of the present invention. FIG11 is a schematic diagram showing a cross-sectional view of a cross section along the line segment E1-E2 of the heat diffusion device shown in FIG10. FIG12 is a schematic diagram showing a top view of the internal structure of an example of a heat diffusion device of the sixth embodiment of the present invention. FIG13 is a schematic diagram showing a top view of the internal structure of an example of a heat diffusion device of the seventh embodiment of the present invention. FIG. 14 is a schematic diagram showing a top view of the internal structure of an example of a heat diffusion device of the eighth embodiment of the present invention. FIG. 15 is a schematic diagram showing a top view of the internal structure of another example of a heat diffusion device of the eighth embodiment of the present invention. FIG. 16 is a three-dimensional schematic diagram showing an example of an electronic device of the present invention.

1a: Vapor chamber (heat diffusion device)

10: Shell

10a: 1st inner wall surface

10b: Second inner wall surface

11: Sheet 1

12: Second sheet

20: Action Media

30: Linear core

30a: Surface 1 of the linear core

30b: Second side of linear core

30c: The third side of the linear core

30d: Surface 4 of the linear core

40: Rail-shaped component

41: Wall

41a: Surface 1 of the wall

41b: The second side of the wall

41c: The third side of the wall

42: Wall

42a: Surface 1 of the wall

42b: The second side of the wall

42c: The third side of the wall

50: Liquid flow path

50a: The first surface of the liquid flow path

50b: Second side of liquid flow path

50c: The third side of the liquid flow path

50d: Surface 4 of the liquid flow path

60: Steam flow path

F50: The dimension of the liquid flow path in the direction perpendicular to the thickness direction and the extension direction of the liquid flow path

G30: Dimensions of linear core in thickness direction

G50: Dimensions of the liquid flow path in the thickness direction

G60: Dimensions of the steam flow path in the thickness direction

L: Length direction

T: thickness direction

W: width direction

Claims (8)

A heat diffusion device is characterized by comprising: a housing having a first inner wall surface and a second inner wall surface facing each other in the thickness direction; an actuating medium sealed in the inner space of the housing; a linear core disposed in the inner space of the housing in contact with the first inner wall surface; and a rail-shaped member including a pair of wall portions disposed in the inner space of the housing in a manner protruding from the second inner wall surface toward the thickness direction; the linear core and the pair of wall portions of the rail-shaped member are in contact with each other in the thickness direction and constitute a liquid flow path of the actuating medium; and the dimension of the liquid flow path in a direction orthogonal to the thickness direction and the extension direction of the liquid flow path is greater than the dimension of the liquid flow path in the thickness direction. A heat diffusion device as claimed in claim 1, wherein the dimension of the linear core in the thickness direction is greater than 1/3 of the dimension of the vapor flow path of the actuating medium in the thickness direction. As in claim 1, the heat diffusion device, wherein in a direction orthogonal to the thickness direction and the extension direction of the liquid flow path, the two ends of the linear core are respectively consistent with the two ends of the guide rail-shaped component. As in claim 1, the heat diffusion device, wherein at least one end of the linear core is located outside the guide rail-shaped member in a direction orthogonal to the thickness direction and the extension direction of the liquid flow path. The heat diffusion device of claim 1 further comprises a plurality of pillars, which are arranged inside the liquid flow path at intervals along the extension direction of the liquid flow path and support the linear core. A heat diffusion device as claimed in claim 1, wherein the rail-shaped component is integrated with the second inner wall surface of the housing. A heat diffusion device as claimed in claim 1, wherein the rail-shaped component is joined to the second inner wall surface of the housing. An electronic device characterized by comprising: a heat dissipation device as in any one of claims 1 to 7; and electronic components mounted on the outer wall surface of the casing of the heat dissipation device.