WO2024034279A1

WO2024034279A1 - Heat dissipation device and electronic apparatus

Info

Publication number: WO2024034279A1
Application number: PCT/JP2023/023790
Authority: WO
Inventors: 利克大櫃
Original assignee: 株式会社村田製作所
Priority date: 2022-08-08
Filing date: 2023-06-27
Publication date: 2024-02-15

Abstract

This heat dissipation device 1A comprises: a casing 100 which has a first inner surface 10a and a second inner surface 10b opposite one another in a thickness direction T and is provided with an internal space; a working medium 20 which is enclosed in the internal space in the casing 10; a wick 30 which is provided in the internal space in the casing 10; and a support member 40 which is provided in the internal space in the casing 10 and is in contact with the first inner surface 10a of the casing 10 and the wick 30 in the thickness direction T. The first inner surface 10a of the casing 10 is provided with hollows 50 located around the support member 40. In a plan view from the thickness direction T, at least some of the hollows 50 adjoin a base 41 of the support member 40 on the side of the first inner surface 10a of the casing 10.

Description

Heat diffusion devices and electronic equipment

TECHNICAL FIELD The present invention relates to heat diffusion devices and electronic equipment.

In recent years, the amount of heat generated has increased due to higher integration and higher performance of elements. Furthermore, as products become smaller, heat generation density is increasing. This situation is particularly noticeable in the field of mobile terminals such as smartphones and tablets. Under these circumstances, it has become important to take measures for heat dissipation.

Graphite sheets and the like are often used as materials for heat dissipation, but their heat transport capacity is not sufficient, so the use of various heat diffusion devices that can diffuse heat is being considered. .

Patent Document 1 discloses a casing including an upper casing sheet and a lower casing sheet facing each other joined at outer edges and having an internal space, a hydraulic fluid sealed in the internal space, and the lower casing. A microchannel arranged in the inner space of the sheet and forming a flow path for the working fluid; a sheet-shaped wick arranged in the inner space of the casing and in contact with the microchannel; A vapor chamber is disclosed in which a contact area between the wick and the microchannel is 5% to 40% of the area of the internal space when viewed in plan.

International Publication No. 2021/229961

FIG. 1 of Patent Document 1 shows a structure in which a wick is sandwiched between a convex portion of a microchannel provided on a lower casing sheet and a support provided on an upper casing sheet. Furthermore, in Patent Document 1, the vaporized working fluid releases heat in the internal space of the casing and returns to liquid, and the working fluid that returns to liquid moves through the microchannel due to capillary force due to the holes in the wick. , it is described that it is again carried near a heat source.

On the other hand, the vapor chamber shown in FIG. 1 of Patent Document 1 has a structure in which the inner surface of the upper housing sheet is flat except for the pillars, so when the vaporized working fluid returns to liquid, the upper It becomes easier to disperse on the flat area of the inner surface of the housing sheet. In this way, in the vapor chamber shown in FIG. 1 of Patent Document 1, the working fluid to be collected by the wick is easily dispersed in the flat area of the inner surface of the upper housing sheet, so the working fluid is collected by the wick. It becomes difficult to do. Therefore, in the vapor chamber shown in FIG. 1 of Patent Document 1, the recovery efficiency of the working fluid by the wick is reduced, making it difficult for the working fluid to circulate, resulting in a problem that the soaking performance is reduced.

Note that the above problem is not limited to vapor chambers, but is a problem common to thermal diffusion devices that can diffuse heat with a configuration similar to that of vapor chambers.

The present invention has been made in order to solve the above problems, and aims to provide a heat diffusion device that can improve heat uniformity performance. Another object of the present invention is to provide an electronic device having the above heat diffusion device.

The heat diffusion device of the present invention includes a casing having a first inner surface and a second inner surface facing each other in the thickness direction and an internal space, and a working medium sealed in the internal space of the casing. , a wick provided in the internal space of the casing; a support provided in the internal space of the casing and in contact with the first inner surface of the casing and the wick in the thickness direction; The first inner surface of the housing is provided with a recess located around the support, and when viewed in plan from the thickness direction, at least a part of the recess is located on the first inner surface of the support. It is characterized in that it is in contact with the root of the first inner surface side of the body.

The electronic device of the present invention is characterized by comprising the heat diffusion device of the present invention.

According to the present invention, it is possible to provide a heat diffusion device that can improve heat soaking performance. Further, according to the present invention, it is possible to provide an electronic device having the above heat diffusion device.

FIG. 1 is a schematic perspective view showing an example of a heat diffusion device according to Embodiment 1 of the present invention. FIG. 2 is a schematic plan view showing an example of the internal structure of the heat diffusion device according to Embodiment 1 of the present invention. FIG. 3 is a schematic cross-sectional view showing an example of a cross section of the heat diffusion device shown in FIG. 2 along line segment a1-a2. FIG. 4 is a schematic cross-sectional view showing an enlarged view of the support and the depression shown in FIG. FIG. 5 is a schematic plan view showing an example of a state in which the support body and depression shown in FIG. 4 are viewed from the thickness direction. FIG. 6 is a schematic cross-sectional view showing an example in which the support body and the depression of the heat diffusion device according to Embodiment 1 of the present invention are different from those in FIG. 4 when viewed in cross-section from the plane direction. FIG. 7 is a schematic plan view showing an example in which the support body and the depression of the heat diffusion device according to Embodiment 1 of the present invention are different from FIG. 5 when viewed from the thickness direction. FIG. 8 is a schematic plan view showing an example in which the support and the depression of the heat diffusion device according to Embodiment 1 of the present invention are different from those in FIGS. 5 and 7 when viewed from the thickness direction. FIG. 9 is a schematic plan view showing an example in which the support and the depression of the heat diffusion device of Embodiment 1 of the present invention are different from those in FIGS. 5, 7, and 8 when viewed from the thickness direction. FIG. 10 is a schematic plan view showing an example in which the support body and the depression of the heat diffusion device according to Embodiment 1 of the present invention are different from those in FIGS. 5, 7, 8, and 9 when viewed from the thickness direction. It is. FIG. 11 shows an example in which the support and the depression of the heat diffusion device according to Embodiment 1 of the present invention are different from those in FIGS. 5, 7, 8, 9, and 10 when viewed from the thickness direction. FIG. FIG. 12 shows a plan view of the support and the depression of the heat diffusion device according to Embodiment 1 of the present invention, which is different from FIGS. 5, 7, 8, 9, 10, and 11 when viewed from the thickness direction. FIG. 3 is a schematic plan view showing an example. FIG. 13 is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Embodiment 2 of the present invention. FIG. 14 is a schematic cross-sectional view showing an example of a cross section of the heat diffusion device shown in FIG. 13 along line segment b1-b2. FIG. 15 is a schematic perspective view showing an example of the electronic device of the present invention.

Hereinafter, the heat diffusion device of the present invention and the electronic device of the present invention will be explained. Note that the present invention is not limited to the following configuration, and may be modified as appropriate without departing from the gist of the present invention. Furthermore, the present invention also includes a combination of a plurality of individual preferred configurations described below.

It goes without saying that each of the embodiments shown below is an example, and that parts of the configurations shown in different embodiments can be partially replaced or combined. In Embodiment 2 and subsequent embodiments, descriptions of matters common to Embodiment 1 will be omitted, and differences will be mainly explained. In particular, similar effects due to similar configurations will not be mentioned for each embodiment.

In the following description, unless the embodiments are particularly distinguished, they will simply be referred to as "the heat diffusion device of the present invention" and "the electronic device of the present invention."

In each embodiment below, a vapor chamber is shown as an example of the heat diffusion device of the present invention. The heat diffusion device of the present invention is also applicable to heat diffusion devices such as heat pipes.

The drawings shown below are schematic diagrams, and their dimensions, aspect ratios, etc. may differ from the actual product.

In this specification, terms indicating relationships between elements (for example, "parallel", "perpendicular", etc.) and terms indicating the shape of elements do not only mean literal strict aspects, but substantially It also means an equivalent range, for example, a range that includes a difference of several percent.

[Heat diffusion device]
The heat diffusion device of the present invention includes a casing having a first inner surface and a second inner surface facing each other in the thickness direction and an internal space, and a working medium sealed in the internal space of the casing. , a wick provided in the internal space of the casing; a support provided in the internal space of the casing and in contact with the first inner surface of the casing and the wick in the thickness direction; The first inner surface of the housing is provided with a recess located around the support, and when viewed in plan from the thickness direction, at least a part of the recess is located on the first inner surface of the support. It is characterized in that it is in contact with the root of the first inner surface side of the body.

<Embodiment 1>
An example of the heat diffusion device of the present invention will be described below as a heat diffusion device of Embodiment 1 of the present invention.

FIG. 1 is a schematic perspective view showing an example of a heat diffusion device according to Embodiment 1 of the present invention.

The vapor chamber (thermal diffusion device) 1A shown in FIG. 1 has a housing 10.

The housing 10 is hermetically sealed and has a hollow structure.

A heat source HS, which is a heat generating element, is provided on the outer surface of the housing 10.

Examples of the heat source HS include electronic components.

In this specification, the length direction, thickness direction, and width direction are defined by L, T, and W, respectively, as shown in FIG. 1 and the like. The length direction L, the thickness direction T, and the width direction W are orthogonal to each other. Further, a direction perpendicular to the thickness direction T and including the length direction L and the width direction W is defined as a surface direction.

It is preferable that the vapor chamber 1A has a planar shape as a whole. That is, it is preferable that the housing 10 has a planar shape as a whole.

In this specification, a planar shape includes a plate-like shape and a sheet-like shape, and the lengthwise dimension and the widthwise dimension are considerably larger than the thickness direction dimension, e.g. It means a shape in which the dimension in the direction and the dimension in the width direction are 10 times or more, preferably 100 times or more, the dimension in the thickness direction.

The size of the vapor chamber 1A is not particularly limited.

The dimension in the length direction L and the dimension in the width direction W of the vapor chamber 1A are preferably 5 mm or more and 500 mm or less, more preferably 20 mm or more and 300 mm or less, and still more preferably 50 mm or more and 200 mm or less.

The dimension in the length direction L and the dimension in the width direction W of the vapor chamber 1A may be the same or different.

The dimension of the vapor chamber 1A in the thickness direction T is preferably 50 μm or more and 500 μm or less.

The dimensions in the length direction L, the thickness direction T, and the width direction W of the vapor chamber 1A are determined as the maximum dimensions in the length direction L, thickness direction T, and width direction W, respectively.

The housing 10 is preferably composed of a first sheet 11 and a second sheet 12 whose outer edges are joined together. In this case, the first sheet 11 and the second sheet 12 may overlap so that their ends match, or may overlap with their ends shifted.

Examples of methods for joining the outer edges of the first sheet 11 and the second sheet 12 include laser welding, resistance welding, diffusion bonding, brazing welding, TIG welding (tungsten-inert gas welding), ultrasonic bonding, and resin sealing. Examples include stopping. Among these, laser welding, resistance welding, or brazing welding is preferred.

The constituent materials of the first sheet 11 and the second sheet 12 are not particularly limited as long as they have properties suitable for a vapor chamber, such as thermal conductivity, strength, flexibility, flexibility, etc. The constituent material of the first sheet 11 and the second sheet 12 is preferably a metal, such as copper, nickel, aluminum, magnesium, titanium, iron, or an alloy containing at least one of these metals as a main component. Preferably it is copper or aluminum.

The constituent materials of the first sheet 11 and the second sheet 12 may be the same or different.

When the constituent materials of the first sheet 11 and the second sheet 12 are different from each other, the first sheet 11 and the second sheet 12 can exhibit different functions. Such functions include, but are not particularly limited to, heat conduction functions, electromagnetic shielding functions, and the like.

The shapes of the first sheet 11 and the second sheet 12 are not particularly limited. For example, the first sheet 11 may have a flat plate shape with a constant dimension in the thickness direction T, and the second sheet 12 may have a shape in which the outer edge has a larger dimension in the thickness direction T than the portion other than the outer edge. . Alternatively, the first sheet 11 has a flat plate shape with a constant dimension in the thickness direction T, and the second sheet 12 has a constant dimension in the thickness direction T, and the portion other than the outer edge is on the outside. It may also have a convex shape. In this case, a recess will be provided at the outer edge of the housing 10. Such a recess on the outer edge of the housing 10 can be used when mounting the vapor chamber 1A. In addition, other components can be placed in the recess on the outer edge of the housing 10.

The dimensions of the first sheet 11 and the second sheet 12 in the thickness direction T are preferably 10 μm or more and 200 μm or less, more preferably 30 μm or more and 100 μm or less, and still more preferably 40 μm or more and 60 μm or less.

The dimensions of the first sheet 11 and the second sheet 12 in the thickness direction T may be the same or different.

The dimensions of the first sheet 11 and the second sheet 12 in the thickness direction T are each determined as the maximum dimension in the thickness direction T.

Examples of the planar shape of the casing 10 when viewed from the thickness direction T include polygons such as triangles and rectangles, circles, ellipses, and combinations thereof. Further, the planar shape of the casing 10 may be an L-shape, a C-shape (U-shape), a staircase shape, or the like. Further, the housing 10 may be provided with a through hole in the thickness direction T. The planar shape of the casing 10 may be a shape depending on the use of the vapor chamber 1A, a shape depending on the mounting location of the vapor chamber 1A, or a shape depending on other components existing nearby. It may also have a different shape.

The size of the housing 10 is not particularly limited.

The dimension in the length direction L and the dimension in the width direction W of the casing 10 are respectively preferably 5 mm or more and 500 mm or less, more preferably 20 mm or more and 300 mm or less, and still more preferably 50 mm or more and 200 mm or less.

The dimension in the length direction L and the dimension in the width direction W of the housing 10 may be the same or different from each other.

The dimension of the casing 10 in the thickness direction T is preferably 50 μm or more and 500 μm or less.

The dimension in the length direction L, the dimension in the thickness direction T, and the dimension in the width direction W of the casing 10 are determined as the maximum dimension in the length direction L, thickness direction T, and width direction W, respectively.

Although FIG. 1 illustrates an example in which the casing 10 is composed of two sheets, the first sheet 11 and the second sheet 12, the casing 10 may be composed of one sheet or three or more sheets. It may be composed of sheets.

FIG. 2 is a schematic plan view showing an example of the internal structure of the heat diffusion device of Embodiment 1 of the present invention. FIG. 3 is a schematic cross-sectional view showing an example of a cross section of the heat diffusion device shown in FIG. 2 along line segment a1-a2.

The vapor chamber 1A shown in FIGS. 2 and 3 includes a housing 10, a working medium 20, a wick 30, and a support 40.

As shown in FIG. 3, the housing 10 has a first inner surface 10a and a second inner surface 10b facing each other in the thickness direction T.

In the example shown in FIG. 3, the casing 10 is composed of a first sheet 11 and a second sheet 12, the inner surface of the first sheet 11 corresponds to the first inner surface 10a of the casing 10, and the inner surface of the second sheet 12 corresponds to the first inner surface 10a of the casing 10. The inner surface corresponds to the second inner surface 10b of the housing 10.

The housing 10 is provided with an internal space. More specifically, the housing 10 is provided with an internal space surrounded by a first inner surface 10a and a second inner surface 10b.

As shown in FIG. 2, it is preferable that the housing 10 has an evaporation part EP in the internal space.

The evaporation part EP is a part that evaporates a liquid-phase working medium 20, which will be described later, to change it into a gas-phase working medium 20. More specifically, the evaporation portion EP corresponds to a portion of the internal space of the housing 10 that is near the heat source HS shown in FIG. 1 and is heated by the heat source HS.

Depending on the number of heat sources HS, the number of evaporation parts EP may be one as shown in FIG. 2, or may be plural. In other words, only one heat source HS or a plurality of heat sources HS may be provided on the outer surface of the housing 10.

The heat source HS may be provided on the outer surface of the casing 10 opposite to the first inner surface 10a, here, the outer surface of the first sheet 11, or may be provided on the outer surface of the casing 10 opposite to the second inner surface 10b, Here, it may be provided on the outer surface of the second sheet 12.

As shown in FIGS. 2 and 3, the working medium 20 is sealed in the internal space of the housing 10.

The working medium 20 is not particularly limited as long as it can cause a gas-liquid phase change in the environment inside the casing 10. Examples of the working medium 20 include water, alcohols, and alternative fluorocarbons. The working medium 20 is preferably an aqueous compound, particularly preferably water.

As shown in FIGS. 2 and 3, the wick 30 is provided in the internal space of the housing 10.

The wick 30 has a capillary structure that can move the working medium 20 by capillary force.

The capillary structure of the wick 30 may be a known structure used in conventional heat diffusion devices (vapor chambers, etc.). Examples of such a capillary structure include a fine structure having irregularities such as pores, grooves, and protrusions, such as a porous structure, a fiber structure, a groove structure, and a network structure.

The wick 30 functions as a liquid transport section that sucks up and transports the liquid phase working medium 20 by capillary force.

It is preferable that the wick 30 is made of a porous material.

Examples of the porous body include a sintered body, a nonwoven fabric, a mesh, an etched perforated plate, and a fiber bundle.

Examples of the sintered body include porous metal sintered bodies, porous ceramic sintered bodies, and the like. Among these, metal porous sintered bodies are preferred, and copper or nickel porous sintered bodies are more preferred.

Examples of the nonwoven fabric include metal nonwoven fabric. When the wick 30 is made of nonwoven fabric, it can be manufactured at low cost.

Examples of the mesh include metal mesh, resin mesh, and surface-coated meshes of these. Among these, copper mesh, stainless steel (SUS) mesh, or polyester mesh is preferred. When the wick 30 is made of mesh, it can be manufactured at low cost.

The etched perforated plate is produced, for example, by etching a flat metal plate. When the wick 30 is composed of the etched perforated plate produced in this manner, it has excellent flatness.

A fiber bundle is produced, for example, by linearly bundling a plurality of fibers. The fiber bundle functions as a liquid holding section that sucks up and holds the working medium 20 in the liquid phase by capillary force, and also functions as a liquid transport section that transports the sucked up working medium 20 in the liquid phase.

When the wick 30 is composed of a fiber bundle, it is preferably composed of a braided fiber bundle. A braided fiber bundle in which a plurality of fibers are woven tends to have irregularities on its surface, so when the wick 30 is composed of a braided fiber bundle, the liquid phase working medium 20 is easily transported.

Examples of the fibers constituting the fiber bundle include metal wires such as copper, aluminum, and stainless steel wires, and non-metal wires such as carbon fibers and glass fibers. Among these, metal wire is preferred because of its high thermal conductivity. For example, a fiber bundle can be obtained by bundling about 200 copper wires with a diameter of about 0.03 mm.

The dimension of the wick 30 in the thickness direction T is preferably 2 μm or more and 200 μm or less, more preferably 5 μm or more and 100 μm or less, and still more preferably 10 μm or more and 40 μm or less.

The dimensions of the wick 30 in the thickness direction T may be the same throughout or may be different in some parts.

As shown in FIGS. 2 and 3, the internal space of the casing 10 includes a liquid flow path LP that mainly contains the working medium 20 in the liquid phase and a vapor flow path VP that mainly contains the working medium 20 in the gas phase. are doing.

In the example shown in FIG. 3, a liquid flow path LP that mainly contains the working medium 20 in the liquid phase exists between the second inner surface 10b of the housing 10 and the wick 30. Further, in the example shown in FIG. 3, a vapor flow path VP that mainly contains the working medium 20 in the vapor phase exists between the first inner surface 10a of the housing 10 and the wick 30.

The liquid flow path LP may contain the gas-phase working medium 20 as long as it is a region where the liquid-phase working medium 20 is mainly present. The vapor flow path VP may contain the liquid phase working medium 20 as long as it is a region where the gas phase working medium 20 is mainly present.

As shown in FIGS. 2 and 3, the support body 40 is provided in the internal space of the housing 10. More specifically, the support body 40 is provided in the vapor flow path VP in the internal space of the housing 10.

As shown in FIGS. 2 and 3, the support body 40 is in contact with the first inner surface 10a of the housing 10 and the wick 30 in the thickness direction T. Thereby, the wick 30 is supported by the support body 40.

In the example shown in FIGS. 2 and 3, a plurality of supports 40 are provided, and the plurality of supports 40 are in contact with the first inner surface 10a of the housing 10 and the wick 30 in the thickness direction T. It is sufficient that at least one of the plurality of supports 40 is in contact with the wick 30 in the thickness direction T, and all the supports 40 are in contact with the wick 30 in the thickness direction T as shown in FIG. Alternatively, a part of the support body 40 may be in contact with the wick 30 in the thickness direction T.

In the example shown in FIGS. 2 and 3, it is preferable that the plurality of supports 40 are provided evenly so that the center-to-center distance (pitch) of the supports 40 is constant. In this case, it is preferable that the plurality of supports 40 are provided evenly in some areas in the internal space of the housing 10, here, the steam flow path VP, and the plurality of supports 40 are preferably provided evenly over the entire area. It is more preferable to be present. In the region where the plurality of supports 40 are evenly provided, the strength of the vapor chamber 1A is ensured uniformly.

As shown in FIG. 3, the support body 40 is provided to protrude in the thickness direction T from the first inner surface 10a toward the second inner surface 10b in the internal space of the housing 10, here, in the steam flow path VP. You can leave it there. The direction in which the support body 40 protrudes from the first inner surface 10a of the housing 10 does not need to be strictly parallel to the thickness direction T.

The support body 40 may be integrated with the first inner surface 10a of the housing 10. In this case, the support body 40 is formed, for example, by etching the first inner surface 10a of the housing 10, here, the inner surface of the first sheet 11.

In this specification, two elements being integrated means a state in which there is no interface between the elements, for example, a state in which the boundary between the elements cannot be determined.

The support body 40 may be joined to the first inner surface 10a of the housing 10. In this case, the support body 40 is bonded to the first inner surface 10a of the housing 10, here, the inner surface of the first sheet 11, for example, by a bonding method such as diffusion bonding.

Examples of the constituent material of the support body 40 include resins, metals, ceramics, and mixtures or laminates of two or more of these.

The constituent material of the support body 40 is preferably the same as the constituent material of the housing 10, here, the constituent material of the first sheet 11, but may be different from the constituent material of the first sheet 11.

In the example shown in FIGS. 2 and 3, a plurality of supports 40 are provided, but the constituent materials of the plurality of supports 40 may be the same or different, or some of them may be made of the same or different materials. may be different.

The support body 40 may consist of a single layer or may consist of multiple layers.

The planar shape of the support body 40 when viewed from the thickness direction T is not limited to the circular shape shown in FIG. 3, as will be described later.

In the example shown in FIGS. 2 and 3, a plurality of supports 40 are provided, but the planar shapes of the plurality of supports 40 may be the same, different, or partially may be different.

Examples of the cross-sectional shape of the support body 40 when viewed in cross-section from the surface direction perpendicular to the thickness direction T include polygons such as rectangles. The cross-sectional shape of the support body 40 may be a tapered shape shown in FIG. 3, or may be a tapered shape different from that shown in FIG.

In the example shown in FIGS. 2 and 3, a plurality of supports 40 are provided, but the cross-sectional shapes of the plurality of supports 40 may be the same or different, or some of the supports 40 may have the same or different cross-sectional shapes. may be different.

The vapor chamber 1A operates as follows.

In the vapor chamber 1A, the working medium 20 in the liquid phase is evaporated by absorbing heat from the heat source HS in the wick 30 and the liquid flow path LP that are present in the region near the evaporation section EP, and the working medium 20 in the gas phase is evaporated by absorbing heat from the heat source HS. Changes to Then, the gas phase working medium 20 generated in the evaporation section EP passes through the vapor flow path VP to a region away from the evaporation section EP, for example, to a side opposite to the evaporation section EP in the longitudinal direction L of the vapor flow path VP. , where it is cooled and changed into a liquid phase working medium 20. Then, the liquid phase working medium 20 is recovered into the wick 30 and the liquid channel LP, and then transported to the evaporation section EP.

In the vapor chamber 1A, the above process is repeated, whereby the working medium 20 circulates while undergoing a gas-liquid phase change. At this time, the heat from the heat source HS is absorbed as latent heat of evaporation that changes the liquid-phase working medium 20 into the gas-phase working medium 20 in the evaporator section EP, and then is absorbed into the vapor-phase working medium 20 in a region away from the evaporator section EP. It is released as latent heat of condensation which transforms the medium 20 into the working medium 20 in the liquid phase. In this way, the vapor chamber 1A operates autonomously without requiring external power, and furthermore, by utilizing the latent heat of vaporization and latent heat of condensation of the working medium 20, the vapor chamber 1A can generate heat from the heat source HS in two dimensions. can spread rapidly.

As shown in FIG. 3, in the vapor chamber 1A, a recess 50 located around the support body 40 is provided on the first inner surface 10a of the housing 10, here, on the inner surface of the first sheet 11. More specifically, as shown in FIG. 3, the first inner surface 10a of the housing 10, here, the inner surface of the first sheet 11, in the region of the steam flow path VP that overlaps the wick 30 in the thickness direction T. A depression 50 is provided around the support body 40 in contact with the wick 30 in the thickness direction T.

FIG. 4 is a schematic cross-sectional view showing an enlarged view of the support and the depression shown in FIG. 3. FIG. 5 is a schematic plan view showing an example of a state in which the support body and depression shown in FIG. 4 are viewed from the thickness direction.

Note that FIG. 5 shows the support body and recess shown in FIG. 4 when viewed from above in the thickness direction from the second inner surface side to the first inner surface side of the casing. In addition, in FIG. 5, in order to clarify the position of the depression when viewed in plan from the thickness direction, the depression is marked with a pattern different from the first inner surface (first sheet) of the casing, more specifically, a white pattern. It shows. The same applies to subsequent drawings showing the support and the recesses when viewed in plan from the thickness direction.

When the support 40 and the depression 50 shown in FIG. 4 are viewed from the thickness direction T, at least a part of the depression 50 is located at the root of the support 40 on the first inner surface 10a side of the housing 10, as shown in FIG. 41.

In the vapor chamber 1A, the recess 50 is provided in the first inner surface 10a of the housing 10, so that the liquid phase working medium 20 changed from the gas phase working medium 20 accumulates in the recess 50 in the vapor flow path VP. It becomes easier. Furthermore, in the vapor chamber 1A, when viewed in plan from the thickness direction T, at least a portion of the depression 50 is in contact with the root 41 of the support 40, so that the liquid phase working medium 20 accumulated in the depression 50 is It becomes easier to move to the wick 30 along the side of the body 40. That is, in the vapor chamber 1A, the liquid phase working medium 20 is easily collected into the wick 30.

As described above, in the vapor chamber 1A, by utilizing the support body 40 and the depression 50, the recovery efficiency of the liquid phase working medium 20 by the wick 30 is improved. As a result, in the vapor chamber 1A, the working medium 20 is easily circulated, so that the heat soaking performance is improved.

Furthermore, in the vapor chamber 1A, since the recess 50 is provided in the first inner surface 10a of the housing 10, the dimensions in the thickness direction T of the housing 10 are the same and the recess 50 is not provided. In comparison, the internal space of the housing 10, here the steam flow path VP, is wider. In this manner, in the vapor chamber 1A, by ensuring a wide vapor flow path VP, a wide soaking area is ensured, and as a result, thermal conductivity is improved.

On the other hand, in the vapor chamber shown in FIG. 1 of Patent Document 1, if it is desired to widen the vapor flow path while maintaining the dimension in the thickness direction of the casing, the dimension in the thickness direction of the upper casing sheet constituting the casing is needs to be made smaller throughout. However, in the vapor chamber shown in FIG. 1 of Patent Document 1, if the dimension in the thickness direction of the upper housing sheet is reduced throughout, the rigidity of the upper housing sheet and, by extension, the rigidity of the housing will be insufficient, resulting in becomes easily deformed. Therefore, in the vapor chamber shown in FIG. 1 of Patent Document 1, it is possible to widen the internal space of the casing, particularly the vapor flow path corresponding to the area where the support is provided, while maintaining the dimension in the thickness direction of the casing. I can't.

On the other hand, in the vapor chamber 1A, the dimension in the thickness direction T of the first sheet 11 is not made small over the whole, but the depression 50 is provided around the support body 40 having relatively high rigidity, so that the casing The rigidity of the housing 10 will not be insufficient, and as a result, the housing 10 will not be deformed. Therefore, in the vapor chamber 1A, the vapor flow path VP can be expanded while maintaining the dimension of the housing 10 in the thickness direction T. In other words, in the vapor chamber 1A, a wide vapor flow path VP is secured while the dimension in the thickness direction T of the housing 10 is maintained, so a wide soaking area is secured, and as a result, thermal conductivity is improved. do.

The dimension of the depression 50 in the thickness direction T is preferably 10% or more and 50% or less of the dimension of the support 40 in the thickness direction T.

The dimension of the depression 50 in the thickness direction T is preferably 5% or more and 30% or less of the dimension of the housing 10 in the thickness direction T.

The dimension of the depression 50 in the thickness direction T is preferably 10% or more and 50% or less of the dimension of the first sheet 11 in the thickness direction T.

In the example shown in FIG. 3, a plurality of depressions 50 are provided, but the dimensions of the plurality of depressions 50 in the thickness direction T may be the same, different from each other, or partially different. You can leave it there.

The dimension of the depression 50 in the surface direction (for example, the length direction L or the width direction W) is preferably 5% or more and 30% or less of the center-to-center distance of the support body 40.

In the example shown in FIG. 3, a plurality of depressions 50 are provided, but the dimensions of the plurality of depressions 50 in the surface direction (for example, the length direction L or the width direction W) may be the same or each other. They may be different, or may be partially different.

The dimension of the depression 50 in the thickness direction T and the dimension in the surface direction (for example, the length direction L or the width direction W) are respectively the thickness direction T and the dimension in the surface direction (for example, the length direction L or the width direction W). ) is defined as the maximum dimension of

It is preferable that the cross-sectional shape of the recess 50 when viewed in cross section from a surface direction perpendicular to the thickness direction T is a shape in which the outer edge is formed of at least one of a straight line and a curve.

As shown in FIG. 4, the cross-sectional shape of the recess 50 when viewed in cross-section from the surface direction, here the length direction L, may be a shape in which the outer edge is a straight line.

FIG. 6 is a schematic cross-sectional view showing an example in which the support body and depressions of the heat diffusion device according to Embodiment 1 of the present invention are different from those in FIG. 4 when viewed in cross-section from the surface direction.

As shown in FIG. 6, the cross-sectional shape of the recess 50 when viewed in cross-section from the surface direction, here the length direction L, may be a shape in which the outer edge is formed by a curve. In this case, the radius of curvature of the outer edge of the depression 50 is not particularly limited.

The cross-sectional shape of the recess 50 when viewed in cross section from the surface direction, here, the length direction L, may be a shape in which the outer edge is formed of both straight lines and curves.

In the example shown in FIG. 3, a plurality of depressions 50 are provided, but the cross-sectional shapes of the plurality of depressions 50 may be the same, different, or partially different. good.

The planar shape of the support body 40 when viewed from the thickness direction T is not limited to the circular shape shown in FIG. 5.

FIG. 7 is a schematic plan view showing an example in which the support body and depressions of the heat diffusion device according to Embodiment 1 of the present invention are different from FIG. 5 when viewed from the thickness direction. FIG. 8 is a schematic plan view showing an example in which the support and the depression of the heat diffusion device according to Embodiment 1 of the present invention are different from those in FIGS. 5 and 7 when viewed from the thickness direction.

As shown in FIGS. 7 and 8, the planar shape of the support 40 may be a quadrilateral.

Note that the planar shape of the recess 50 is similar to that in FIG. 5 in the example shown in FIG. 7, but is different from that in FIG. 5 in the example shown in FIG.

FIG. 9 is a schematic plan view showing an example in which the support and the depression of the heat diffusion device according to Embodiment 1 of the present invention are different from those in FIGS. 5, 7, and 8 when viewed from the thickness direction. FIG. 10 is a schematic plan view showing an example in which the support body and the depression of the heat diffusion device according to Embodiment 1 of the present invention are different from those in FIGS. 5, 7, 8, and 9 when viewed from the thickness direction. It is.

As shown in FIGS. 9 and 10, the planar shape of the support body 40 when viewed from the thickness direction T may be such that a part of the outer edge is recessed inward. In this case, since the surface area of the side surface of the support body 40 increases, the number of paths through which the liquid phase working medium 20 accumulated in the depression 50 moves to the wick 30 along the side surface of the support body 40 increases. Therefore, the recovery efficiency of the liquid phase working medium 20 by the wick 30 is further improved, and as a result, the soaking performance is further improved.

The planar shape of the support body 40 when viewed in plan from the thickness direction T includes, for example, a triangular shape, an elliptical shape, etc. in addition to the above-mentioned circular, quadrangular, and shapes with a part of the outer edge concave inward. .

As shown in FIGS. 5, 8, 9, and 10, when viewed in plan from the thickness direction T, it is preferable that the entire depression 50 is in contact with the base 41 of the support 40. In this case, the liquid phase working medium 20 accumulated in the depression 50 has many paths to travel along the side surface of the support body 40 to the wick 30. Therefore, the recovery efficiency of the liquid phase working medium 20 by the wick 30 is further improved, and as a result, the soaking performance is further improved.

As shown in FIG. 7, when viewed in plan from the thickness direction T, the entire depression 50 does not need to be in contact with the root 41 of the support 40. That is, as shown in FIG. 7, when viewed from the thickness direction T, a part of the depression 50 is in contact with the base 41 of the support 40, and the remaining part of the depression 50 is not in contact with the base 41 of the support 40. It's okay. In the example shown in FIG. 7, the depression 50 contacts the base 41 of the support 40 at four locations, but the number and positions of the locations where a portion of the depression 50 contacts the base 41 of the support 40 are not particularly limited.

As shown in FIGS. 5, 8, 9, and 10, when viewed in plan from the thickness direction T, it is preferable that the depression 50 be in contact with the entire circumference of the root 41 of the support 40. In this case, the liquid phase working medium 20 accumulated in the depression 50 has many paths to travel along the side surface of the support body 40 to the wick 30. Therefore, the recovery efficiency of the liquid phase working medium 20 by the wick 30 is further improved, and as a result, the soaking performance is further improved.

FIG. 11 shows an example in which the support and the depression of the heat diffusion device according to Embodiment 1 of the present invention are different from those in FIGS. 5, 7, 8, 9, and 10 when viewed from the thickness direction. FIG.

As shown in FIG. 11, when viewed in plan from the thickness direction T, the depression 50 does not have to be in contact with the entire circumference of the root 41 of the support 40. In this case, as shown in FIG. 11, when viewed in plan from the thickness direction T, the depressions 50 may not be connected over the entire circumference of the base 41 of the support 40, but may have a partially interrupted shape. . In the example shown in FIG. 11, the recess 50 is interrupted at two points opposite to each other in the width direction W, but the number and positions of the points where the recess 50 is interrupted are not particularly limited.

Note that in the example shown in FIG. 7 as well, when viewed in plan from the thickness direction T, the recess 50 does not touch the entire circumference of the root 41 of the support 40.

As shown in FIGS. 5, 8, 9, 10, and 11, the inner edge of the recess 50 may be along the outer edge of the support 40 when viewed from the thickness direction T. That is, when viewed in plan from the thickness direction T, the inner edge of the depression 50 may be parallel to the outer edge of the support body 40.

As shown in FIG. 7, when viewed in plan from the thickness direction T, the inner edge of the depression 50 does not need to be along the outer edge of the support 40. That is, when viewed in plan from the thickness direction T, the inner edge of the depression 50 does not need to be parallel to the outer edge of the support body 40.

As shown in FIGS. 5, 8, 9, 10, and 11, the outer edge of the recess 50 may be along the outer edge of the support 40 when viewed from the thickness direction T. That is, when viewed in plan from the thickness direction T, the outer edge of the depression 50 may be parallel to the outer edge of the support body 40.

FIG. 12 shows a plan view of the support and the depression of the heat diffusion device according to Embodiment 1 of the present invention, which is different from FIGS. 5, 7, 8, 9, 10, and 11 when viewed from the thickness direction. FIG. 3 is a schematic plan view showing an example.

As shown in FIG. 12, when viewed in plan from the thickness direction T, the outer edge of the recess 50 does not need to be along the outer edge of the support 40. That is, when viewed in plan from the thickness direction T, the outer edge of the depression 50 does not need to be parallel to the outer edge of the support body 40. In this case, as shown in FIG. 12, when viewed in plan from the thickness direction T, the outer edge of the depression 50 does not have to be shaped to be equidistant from the center of the support body 40.

Note that in the example shown in FIG. 7 as well, when viewed in plan from the thickness direction T, the outer edge of the recess 50 does not follow the outer edge of the support body 40.

In the example shown in FIG. 3, a plurality of depressions 50 are provided, but the planar shapes of the plurality of depressions 50 may be the same, different from each other, or partially different. good.

The recess 50 is formed together with the support 40 by, for example, etching the first inner surface 10a of the housing 10, here, the inner surface of the first sheet 11, as described below.

For example, when etching is performed on the first inner surface 10a of the casing 10, here the inner surface of the first sheet 11, after providing a resist in the region where the support body 40 is to be formed, the inner surface of the first sheet 11 is etched. Among them, the etching rate in the region near the end of the resist is increased. As a result, a region of the inner surface of the first sheet 11 near the end of the resist is over-etched. As a result, a depression 50 as an over-etched region is formed so as to be in contact with the root 41 of the support 40. This method of forming the depressions 50 is useful when the constituent material of the first sheet 11 is aluminum.

Alternatively, for example, a resist is provided on the first inner surface 10a of the casing 10, here, the inner surface of the first sheet 11, in a region where the support 40 is to be formed, and then etching is performed. form 40. Thereafter, a resist is provided on the inner surface of the first sheet 11 in areas other than the area in contact with the base 41 of the support 40 (including the area where the support 40 is formed), and then etching is performed. As a result, a region of the inner surface of the first sheet 11 that is in contact with the base 41 of the support body 40 is etched, and a depression 50 is formed as the etched region. Such a method of forming the depressions 50 is useful when the constituent material of the first sheet 11 is copper.

As shown in FIG. 3, it is preferable that the vapor chamber 1A further includes a microchannel 60 that constitutes a liquid flow path LP. The microchannel 60 functions as a liquid transport section that transports the liquid phase working medium 20 together with the wick 30 .

As shown in FIG. 3, the microchannel 60 is configured as a region (flow path) between a plurality of protrusions 61 provided on the second inner surface 10b of the casing 10, here, the inner surface of the second sheet 12. There is.

As shown in FIG. 3, the plurality of protrusions 61 are in contact with the second inner surface 10b of the housing 10 and the wick 30 in the thickness direction T. Thereby, the wick 30 is supported by the plurality of protrusions 61.

It is preferable that the plurality of protrusions 61 are provided evenly so that the distance (pitch) between the centers of the protrusions 61 is constant. In this case, it is preferable that the plurality of protrusions 61 be provided evenly in a part of the internal space of the casing 10, here, in the liquid flow path LP, and preferably evenly provided over the entire region. It is more preferable. In the area where the plurality of protrusions 61 are evenly provided, the strength of the vapor chamber 1A is ensured uniformly.

The protrusion 61 may be integrated with the second inner surface 10b of the housing 10. In this case, the protrusion 61 is formed, for example, by etching the second inner surface 10b of the casing 10, here, the inner surface of the second sheet 12.

The protrusion 61 may be joined to the second inner surface 10b of the housing 10. In this case, the protrusion 61 is bonded to the second inner surface 10b of the housing 10, here, the inner surface of the second sheet 12, by a bonding method such as diffusion bonding, for example.

Examples of the constituent material of the protrusion 61 include resin, metal, ceramics, and mixtures or laminates of two or more of these.

The constituent material of the protrusion 61 is preferably the same as the constituent material of the casing 10, here the second sheet 12, but may be different from the constituent material of the second sheet 12.

The protrusion 61 may be made of a single layer or may be made of multiple layers.

Examples of the planar shape of the protrusion 61 when viewed from the thickness direction T include polygons such as triangles and rectangles, circles, ellipses, and combinations thereof.

The cross-sectional shape of the protrusion 61 when viewed in cross-section from the surface direction perpendicular to the thickness direction T includes, for example, a polygon such as a rectangle. The cross-sectional shape of the protrusion 61 may be tapered as shown in FIG. 3, or may be tapered different from that shown in FIG.

<Embodiment 2>
The heat diffusion device of the present invention may further include a partition wall provided on the first inner surface of the housing along at least a portion of the inner edge at a distance from the inner edge of the housing when viewed from the thickness direction. Often, a portion of the wick may be provided between the second inner surface of the housing and the partition wall, and may be provided along at least a portion of the partition wall. A heat diffusion device that is different from the heat diffusion device of Embodiment 1 of the present invention in this respect will be described below as a heat diffusion device of Embodiment 2 of the present invention.

FIG. 13 is a schematic plan view showing an example of the internal structure of a heat diffusion device according to Embodiment 2 of the present invention. FIG. 14 is a schematic cross-sectional view showing an example of a cross section of the heat diffusion device shown in FIG. 13 along line segment b1-b2.

The vapor chamber 1B shown in FIGS. 13 and 14 further includes a partition wall 70 in addition to the housing 10, the working medium 20, the wick 30, and the support body 40.

As shown in FIGS. 13 and 14, the partition wall 70 is provided on the first inner surface 10a of the casing 10 at a distance from the inner edge 15 of the casing 10 when viewed from the thickness direction T. It is located along.

In the example shown in FIGS. 13 and 14, the partition wall 70 is provided along the entire circumference of the inner edge 15 of the housing 10 when viewed from the thickness direction T.

The partition wall 70 does not have to be provided along the entire circumference of the inner edge 15 of the housing 10 when viewed from the thickness direction T.

As shown in FIG. 14, the partition wall 70 may be provided in the internal space of the housing 10 so as to protrude in the thickness direction T from the first inner surface 10a toward the second inner surface 10b. The direction in which the partition wall 70 projects from the first inner surface 10a of the housing 10 does not need to be strictly parallel to the thickness direction T.

As shown in FIG. 14, the partition wall 70 may be integrated with the first inner surface 10a of the housing 10. In this case, the partition wall 70 is formed, for example, by etching the first inner surface 10a of the casing 10, here, the inner surface of the first sheet 11.

The partition wall 70 may be joined to the first inner surface 10a of the housing 10. In this case, the partition wall 70 is bonded to the first inner surface 10a of the housing 10, here, the inner surface of the first sheet 11, by a bonding method such as diffusion bonding, for example.

Examples of the constituent material of the partition wall 70 include resins, metals, ceramics, and mixtures or laminates of two or more of these.

The constituent material of the partition wall 70 is preferably the same as the constituent material of the casing 10, here the first sheet 11, but may be different from the constituent material of the first sheet 11.

The partition wall 70 may be made of a single layer or may be made of multiple layers.

As shown in FIGS. 13 and 14, the wick 30 is partially provided between the second inner surface 10b of the housing 10 and the partition wall 70, and is provided along at least a portion of the partition wall 70. .

In the example shown in FIG. 13, the wick 30 is provided along the entire circumference of the partition wall 70 when viewed from the thickness direction T.

The wick 30 does not need to be provided along the entire circumference of the partition wall 70 when viewed from the thickness direction T.

In the example shown in FIG. 13, the wick 30 is provided along the entire circumference of the inner edge 15 of the housing 10 when viewed from the thickness direction T.

The wick 30 does not have to be provided along the entire circumference of the inner edge 15 of the housing 10 when viewed from the thickness direction T.

As shown in FIG. 14, the wick 30 is preferably in contact with the second inner surface 10b of the housing 10 in the thickness direction T.

As shown in FIG. 14, the wick 30 is preferably in contact with the partition wall 70 in the thickness direction T. In this case, the wick 30 is supported by the partition wall 70 in addition to the support body 40. Therefore, even if the wick 30 tries to deform due to external pressure, the liquid flow path LP, which will be described later, is less likely to collapse. As a result, the permeability of the liquid-phase working medium 20 through the liquid flow path LP is ensured.

As described above, it is preferable that the wick 30 be in contact with at least one of the second inner surface 10b of the housing 10 and the partition wall 70 in the thickness direction T. Among these, as shown in FIG. 14, it is particularly preferable that the wick 30 be in contact with both the second inner surface 10b of the housing 10 and the partition wall 70 in the thickness direction T.

The wick 30 is preferably fixed to the second inner surface 10b of the housing 10. For example, it is preferable that the wick 30 be joined to the second inner surface 10b of the housing 10. Examples of the method for joining the wick 30 and the second inner surface 10b of the housing 10 include diffusion bonding, ultrasonic bonding, spot welding, and the like.

The wick 30 is preferably fixed to the partition wall 70. For example, it is preferable that the wick 30 be joined to the partition wall 70. Examples of the method for joining the wick 30 and the partition wall 70 include diffusion bonding, ultrasonic bonding, spot welding, and the like.

As described above, the partition wall 70 is provided on the first inner surface 10a of the housing 10 along at least a portion of the inner edge 15 of the housing 10 at a distance from the inner edge 15. Further, the wick 30 is partially provided between the second inner surface 10b of the housing 10 and the partition wall 70, and is provided along at least a portion of the partition wall 70. Due to the arrangement of the partition wall 70 and the wick 30, the liquid flow path LP is formed in an area surrounded by a part of the case 10, a part of the partition wall 70, and a part of the wick 30 in the internal space of the case 10. and is provided along at least a portion of the inner edge 15 of the housing 10.

In the vapor chamber 1B, since the liquid flow path LP is provided as described above, the capillary force of the wick 30 acts on the liquid phase working medium 20 existing in the liquid flow path LP. Furthermore, in the vapor chamber 1B, the liquid flow path LP is configured as a cavity in which the wick 30 and the like are not provided, so that the liquid phase working medium 20 can move smoothly within the liquid flow path LP. As a result, in the vapor chamber 1B, the permeability of the liquid-phase working medium 20 is improved, and as a result, the liquid transport ability is improved.

In the vapor chamber 1B, the vapor flow path VP is provided in an area other than the liquid flow path LP in the internal space of the housing 10.

In the vapor chamber 1B, the liquid flow path LP is provided along at least a part of the inner edge 15 of the housing 10 as described above, so the vapor flow path VP is a liquid flow path in the internal space of the housing 10. It is provided in the plane direction with respect to the LP. Thereby, in the vapor chamber 1B, the vapor flow path VP is ensured widely in the surface direction in the internal space of the housing 10. As a result, in the vapor chamber 1B, a wide soaking area is ensured, and thermal conductivity is improved.

In the vapor chamber 1B, even if the internal space of the casing 10 is thin in the thickness direction T, the vapor flow path VP is ensured widely in the surface direction. For example, in the vapor chamber 1B, even if the dimension of the internal space of the housing 10 in the thickness direction T is as small as 100 μm or more and 200 μm or less, the vapor flow path VP is ensured widely in the surface direction. Note that the dimension of the internal space of the housing 10 in the thickness direction T is determined as the maximum dimension. In this way, in the vapor chamber 1B, even if the internal space of the casing 10 is thin in the thickness direction T, the vapor flow path VP is secured widely in the plane direction, so a wide soaking area is secured, and the thermal conductivity is improved. do.

As shown in FIG. 14, in the vapor chamber 1B, similarly to the vapor chamber 1A, the first inner surface 10a of the housing 10, here, the inner surface of the first sheet 11, has a depression 50 located around the support body 40. is provided. More specifically, as shown in FIG. 14, in the vapor chamber 1B, the first inner surface 10a of the housing 10, here, the first A depression 50 is provided around the support body 40 that is in contact with the inner surface of the sheet 11 and the wick 30 in the thickness direction T. Furthermore, when viewed in plan from the thickness direction T, at least a portion of the depression 50 is in contact with the root 41 of the support 40 .

Therefore, in the vapor chamber 1B, as in the vapor chamber 1A, the recovery efficiency of the liquid phase working medium 20 by the wick 30 is improved, and therefore the heat soaking performance is improved. Furthermore, in the vapor chamber 1B, as in the vapor chamber 1A, a wide vapor flow path VP is secured while the dimension in the thickness direction T of the casing 10 is maintained, so a wide soaking area is secured, and as a result, In addition, thermal conductivity is improved.

In the vapor chamber 1B, the first inner surface 10a of the casing 10 in the region of the vapor flow path VP that overlaps the wick 30 in the thickness direction T, here, the inner surface of the first sheet 11 and the wick 30 in the thickness direction T. It is sufficient if the depression 50 is provided around the support body 40 in contact with the support body 40 . As far as this is concerned, in the vapor chamber 1B, a depression may be provided around the support body 40 in a region of the vapor flow path VP that does not overlap with the wick 30 in the thickness direction T, or a depression may not be provided. It's okay.

As shown in FIG. 14, a plurality of supports 40 may be provided in both a region of the steam flow path VP that overlaps with the wick 30 in the thickness direction T and a region that does not overlap with the wick 30 in the thickness direction T. good.

As shown in FIG. 14, in a region of the steam flow path VP that does not overlap with the wick 30 in the thickness direction T, there is a support 40 in contact with the first inner surface 10a of the housing 10 in the thickness direction T, and a second inner surface 10b. It is preferable that a support body 40 that contacts in the thickness direction T is provided. As a result, the casing 10 is supported by the support body 40 from the steam flow path VP side, so that even if the casing 10 tries to deform due to external pressure, the steam flow path VP is less likely to collapse. As a result, the permeability of the gas phase working medium 20 through the vapor flow path VP is ensured.

In a region of the steam flow path VP that does not overlap the wick 30 in the thickness direction T, the support body 40 may be integrated with the second inner surface 10b of the casing 10. In this case, the support body 40 is formed, for example, by etching the second inner surface 10b of the housing 10, here, the inner surface of the second sheet 12.

The support body 40 may be joined to the second inner surface 10b of the housing 10 in a region of the steam flow path VP that does not overlap the wick 30 in the thickness direction T. In this case, the support body 40 is bonded to the second inner surface 10b of the housing 10, here, the inner surface of the second sheet 12, for example, by a bonding method such as diffusion bonding.

As shown in FIG. 14, in a region of the steam flow path VP that does not overlap the wick 30 in the thickness direction T, the two supports 40 are connected to each other in the thickness direction T to constitute one composite body. Furthermore, a plurality of such composite bodies may be provided.

The constituent material of the support body 40 may be the same or different between the region of the vapor flow path VP that overlaps with the wick 30 in the thickness direction T and the region that does not overlap with the wick 30 in the thickness direction T. You can leave it there.

The cross-sectional shape of the support body 40 may be the same or different between a region of the steam flow path VP that overlaps with the wick 30 in the thickness direction T and a region that does not overlap with the wick 30 in the thickness direction T. You can leave it there.

The planar shape of the support body 40 may be the same or different between a region of the vapor flow path VP that overlaps with the wick 30 in the thickness direction T and a region that does not overlap with the wick 30 in the thickness direction T. You can leave it there.

The dimensions of the plurality of supports 40 in the plane direction (for example, the length direction L or the width direction W) are the same as the region of the steam flow path VP that overlaps the wick 30 in the thickness direction T and the region that overlaps the wick 30 in the thickness direction T. They may be the same or different from the other areas.

The dimensions of the plurality of supports 40 in the thickness direction T are the same between a region of the steam flow path VP that overlaps with the wick 30 in the thickness direction T and a region that does not overlap with the wick 30 in the thickness direction T. It may be different or it may be different.

The plurality of supports 40 are arranged in the first inner surface 10a of the housing 10, in this case, the inner surface of the first sheet 11 and the wick 30 in the thickness direction, in a region overlapping with the wick 30 in the thickness direction T in the steam flow path VP. It suffices if the support body 40 that is in contact with T is included. As long as this is the case, the plurality of supports 40 may or may not be provided in a region of the steam flow path VP that does not overlap with the wick 30 in the thickness direction T.

In the example shown in FIG. 13, when viewed from the thickness direction T, the evaporation part EP overlaps the vapor flow path VP, but the evaporation part EP may overlap the liquid flow path LP. In this case, when viewed from the thickness direction T, the evaporation portion EP may overlap the inner edge 15 of the housing 10.

In the example shown in FIG. 13, the liquid flow path LP is provided in a region along the inner edge 15 of the housing 10; It may also be provided in a region that is not along the inner edge 15 of.

In the example shown in FIG. 13, when viewed from the thickness direction T, the liquid flow path LP is provided so as not to pass through the inside of the evaporation part EP; may be provided.

In the example shown in FIG. 13, when viewed from the thickness direction T, the liquid flow path LP is not provided along the outer periphery of the evaporation portion EP, but the liquid flow path LP is provided along the outer periphery of the evaporation portion EP. You can leave it there.

[Electronics]
The electronic device of the present invention is characterized by comprising the heat diffusion device of the present invention.

Below, as an example of the electronic device of the present invention, an electronic device having the heat diffusion device of Embodiment 1 of the present invention will be described. The same applies to electronic equipment having heat diffusion devices according to other embodiments of the present invention.

FIG. 15 is a schematic perspective view showing an example of the electronic device of the present invention.

The electronic device 100 shown in FIG. 15 has a vapor chamber 1A.

As shown in FIG. 15, it is preferable that the electronic device 100 further includes an electronic component 110.

As shown in FIG. 15, the electronic component 110 is preferably provided on the outer surface of the casing 10 of the vapor chamber 1A. In this case, the vapor chamber 1A can function as the heat source HS shown in FIG. 1 using the electronic component 110.

The electronic component 110 may be provided on the outer surface of the housing 10 of the vapor chamber 1A shown in FIG. However, it may be provided on the outer surface of the housing 10 opposite to the second inner surface 10b, here, on the outer surface of the second sheet 12.

The electronic component 110 may be provided directly on the outer surface of the housing 10, or may be provided via another member such as a highly thermally conductive adhesive, sheet, or tape.

When the electronic component 110 is provided on the outer surface of the casing 10 shown in FIG. 2, it is preferable that the electronic component 110 overlaps the evaporation part EP when viewed from the thickness direction T.

Examples of the electronic component 110 include a central processing unit (CPU), a light emitting diode (LED), and a heat generating element such as a power semiconductor.

As shown in FIG. 15, it is preferable that the electronic device 100 further includes a device housing 120.

In the example shown in FIG. 15, the vapor chamber 1A and the electronic component 110 are provided in the internal space of the device housing 120.

It is preferable that the housing 10 and the device housing 120 are joined via a joining member. More specifically, the outer surface of the casing 10 and the inner surface of the device casing 120 are preferably joined via a joining member. In this case, the adhesion between the housing 10 and the device housing 120 is improved.

The joining member that joins the housing 10 and the device housing 120 is preferably a thermally conductive member. In this case, heat from the heat source HS, here heat from the electronic component 110, is easily conducted from the casing 10 to the device casing 120. In other words, the heat from the heat source HS, in this case, the heat from the electronic component 110, is more likely to diffuse through the path from the casing 10 to the device casing 120.

Examples of the thermally conductive member include a thermally conductive tape, a thermally conductive adhesive, and the like.

As described above, the vapor chamber 1A operates autonomously without requiring external power, and further utilizes the latent heat of vaporization and latent heat of condensation of the working medium 20 to absorb heat from the heat source HS, here , heat from the electronic component 110 can be diffused two-dimensionally at high speed. Furthermore, in the vapor chamber 1A, as described above, the recovery efficiency of the liquid-phase working medium 20 by the wick 30 is improved, so that the heat soaking performance is improved. Furthermore, in the vapor chamber 1A, as described above, since the vapor flow path VP is wide while the dimension in the thickness direction T of the casing 10 is maintained, a wide soaking area is secured, and as a result, Improves thermal conductivity. From the above, the electronic device 100 having the vapor chamber 1A can effectively dissipate heat in a limited space inside the electronic device 100.

The following contents are disclosed in this specification.

<1>
a casing having a first inner surface and a second inner surface facing each other in the thickness direction and provided with an internal space;
a working medium sealed in the internal space of the housing;
a wick provided in the internal space of the housing;
a support provided in the internal space of the housing and in contact with the first inner surface of the housing and the wick in the thickness direction,
The first inner surface of the housing is provided with a recess located around the support,
When viewed in plan from the thickness direction, at least a portion of the depression is in contact with a root of the support on the first inner surface side of the casing.

<2>
The heat diffusion device according to <1>, wherein the planar shape of the support when viewed from the thickness direction is such that a part of the outer edge is recessed inward.

<3>
The heat diffusion device according to <1> or <2>, wherein the entire depression is in contact with the base of the support when viewed in plan from the thickness direction.

<4>
The heat diffusion device according to <3>, wherein the depression is in contact with the entire circumference of the root of the support when viewed in plan from the thickness direction.

<5>
The heat diffusion device according to any one of <1> to <4>, wherein the inner edge of the depression is along the outer edge of the support when viewed in plan from the thickness direction.

<6>
The heat diffusion device according to any one of <1> to <5>, wherein the outer edge of the depression is along the outer edge of the support when viewed in plan from the thickness direction.

<7>
According to any one of <1> to <6>, the cross-sectional shape of the recess when viewed in cross section from a surface direction perpendicular to the thickness direction is a shape in which an outer edge is configured of at least one of a straight line and a curved line. Heat spreading device.

<8>
An electronic device comprising the heat diffusion device according to any one of <1> to <7>.

The heat diffusion device of the present invention can be used for a wide range of applications in the field of mobile information terminals and the like. The heat diffusion device of the present invention can be used, for example, to lower the temperature of a heat source such as a central processing unit and extend the usage time of electronic devices, and can be used in smartphones, tablet terminals, notebook computers, game devices, wearable devices, etc. Available for use.

1A, 1B Vapor chamber (thermal diffusion device)
10 Housing 10a First inner surface 10b Second inner surface 11 First sheet 12 Second sheet 15 Inner edge 20 Working medium 30 Wick 40 Support 41 Root of support 50 Hollow 60 Microchannel 61 Protrusion 70 Partition 100 Electronic device 110 Electronic component 120 Equipment housing EP Evaporation section HS Heat source L Length direction LP Liquid flow path T Thickness direction VP Vapor flow path W Width direction

Claims

A casing having a first inner surface and a second inner surface facing each other in the thickness direction and provided with an internal space;
a working medium sealed in the internal space of the housing;
a wick provided in the internal space of the housing;
a support provided in the internal space of the housing and in contact with the first inner surface of the housing and the wick in the thickness direction,
The first inner surface of the housing is provided with a recess located around the support body,
When viewed in plan from the thickness direction, at least a portion of the depression is in contact with a root of the support on the first inner surface side of the casing.
The heat diffusion device according to claim 1, wherein the planar shape of the support when viewed from the thickness direction is such that a part of the outer edge is recessed inward.
The heat diffusion device according to claim 1 or 2, wherein the entire depression is in contact with the root of the support when viewed in plan from the thickness direction.
The heat diffusion device according to claim 3, wherein the depression is in contact with the entire circumference of the base of the support when viewed in plan from the thickness direction.
The heat diffusion device according to any one of claims 1 to 4, wherein an inner edge of the depression is along an outer edge of the support when viewed in plan from the thickness direction.
The heat diffusion device according to any one of claims 1 to 5, wherein an outer edge of the depression is along an outer edge of the support when viewed in plan from the thickness direction.
The thermal diffusion according to any one of claims 1 to 6, wherein the cross-sectional shape of the depression when viewed in cross section from a plane direction perpendicular to the thickness direction is a shape in which an outer edge is configured of at least one of a straight line and a curved line. device.
An electronic device comprising the heat diffusion device according to any one of claims 1 to 7.