TWI839508B - 第三積層體之製造方法、第四積層體之製造方法以及附內面保護膜之半導體裝置之製造方法、以及第三積層體 - Google Patents
第三積層體之製造方法、第四積層體之製造方法以及附內面保護膜之半導體裝置之製造方法、以及第三積層體 Download PDFInfo
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Images
Classifications
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-086298 | 2019-04-26 | ||
| JP2019086298 | 2019-04-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202103969A TW202103969A (zh) | 2021-02-01 |
| TWI839508B true TWI839508B (zh) | 2024-04-21 |
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| TW109113745A TWI839508B (zh) | 2019-04-26 | 2020-04-24 | 第三積層體之製造方法、第四積層體之製造方法以及附內面保護膜之半導體裝置之製造方法、以及第三積層體 |
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| KR (1) | KR20220004964A (ja) |
| CN (2) | CN118231319A (ja) |
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| TW (1) | TWI839508B (ja) |
| WO (1) | WO2020218519A1 (ja) |
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| JP7534944B2 (ja) | 2020-12-10 | 2024-08-15 | リンテック株式会社 | 保護膜付きワークの製造方法及び保護膜形成フィルム付きワークの製造方法 |
| JP2022152297A (ja) | 2021-03-29 | 2022-10-12 | リンテック株式会社 | 支持シート、樹脂膜形成用複合シート、キット、及び、樹脂膜付きチップの製造方法 |
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| CN107001876A (zh) * | 2015-03-30 | 2017-08-01 | 琳得科株式会社 | 树脂膜形成用片及树脂膜形成用复合片 |
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| JPH04271597A (ja) | 1991-02-27 | 1992-09-28 | Nec Eng Ltd | ２ベアラサービス同期方式 |
| JP4689075B2 (ja) * | 2001-05-21 | 2011-05-25 | 日東電工株式会社 | 半導体ウエハ加工用保護シート |
| JP4271597B2 (ja) * | 2004-02-27 | 2009-06-03 | リンテック株式会社 | チップ用保護膜形成用シート |
| JP5367656B2 (ja) * | 2010-07-29 | 2013-12-11 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム及びその用途 |
| JP5432853B2 (ja) * | 2010-07-30 | 2014-03-05 | 日東電工株式会社 | ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法 |
| US9786541B2 (en) | 2011-09-30 | 2017-10-10 | Lintec Corporation | Dicing sheet with protective film forming layer and chip fabrication method |
| JP6091954B2 (ja) * | 2013-03-26 | 2017-03-08 | リンテック株式会社 | 粘着シート、保護膜形成用フィルム、保護膜形成用複合シート、およびマーキング方法 |
| JP6334197B2 (ja) * | 2014-02-25 | 2018-05-30 | リンテック株式会社 | 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法 |
| JPWO2016027888A1 (ja) * | 2014-08-22 | 2017-06-01 | リンテック株式会社 | 保護膜形成用シートおよび保護膜付き半導体チップの製造方法 |
| JP6078578B2 (ja) * | 2015-04-22 | 2017-02-08 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム及びその用途 |
| CN108966671B (zh) * | 2016-03-24 | 2023-09-26 | 琳得科株式会社 | 支撑片及保护膜形成用复合片 |
| WO2017188202A1 (ja) * | 2016-04-28 | 2017-11-02 | リンテック株式会社 | 保護膜形成用フィルム及び保護膜形成用複合シート |
| TWI721158B (zh) * | 2016-04-28 | 2021-03-11 | 日商琳得科股份有限公司 | 保護膜形成用膜及保護膜形成用複合片 |
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2020
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107001876A (zh) * | 2015-03-30 | 2017-08-01 | 琳得科株式会社 | 树脂膜形成用片及树脂膜形成用复合片 |
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| Publication number | Publication date |
|---|---|
| JPWO2020218519A1 (ja) | 2021-05-06 |
| WO2020218519A1 (ja) | 2020-10-29 |
| JP6854983B1 (ja) | 2021-04-07 |
| CN113692352A (zh) | 2021-11-23 |
| CN118231319A (zh) | 2024-06-21 |
| SG11202110169VA (en) | 2021-10-28 |
| TW202103969A (zh) | 2021-02-01 |
| KR20220004964A (ko) | 2022-01-12 |
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