TWI839075B - Polishing pad conditioning device - Google Patents

Abstract

The present invention provides a polishing pad conditioning device, comprising: a substrate; and a plurality of first cleaning units and a plurality of second cleaning units, which are arranged above the substrate; wherein each of the first cleaning unit comprises a plurality of first brushes arranged in parallel, and the plurality of first brushes are arranged perpendicular to the substrate or formed a first angle with the substrate; wherein each of the second cleaning units comprises a plurality of second brushes arranged in parallel, and the plurality of second brushes are arranged perpendicular to the substrate or formed a second angle with the substrate. According to the present invention, the polishing pad conditioning device can clean the polishing pads with different hardness, and can effectively remove residual debris in the grooves of the polishing pad, thereby achieving better cleaning ability.

Description

Grinding pad dressing device

The present invention relates to a dressing device, and in particular to a polishing pad dressing device; however, the present invention is not limited thereto.

In the process of grinding or polishing semiconductor wafers, in order to make the wafer surface flat, the chemical mechanical polishing (CMP) method is generally used to process the wafer. However, grinding debris will be generated during the chemical mechanical polishing process, and the abrasive slurry used will also accumulate in the holes of the polishing pad. Over time, it will not only cause the polishing pad to wear out, but also reduce the polishing effect. Therefore, a polishing pad dresser must be used to dress the polishing pad to extend the life of the polishing pad.

Prior art, such as U.S. Patent Publication No. US7815495B2, discloses a CMP polishing pad conditioner, which includes a plastic abrasive having a first hardness and a brush having a second hardness less than the first hardness, wherein the plastic abrasive includes a substrate and a plurality of plastic nodules formed on the surface of the substrate, each plastic nodule having a flat surface for contacting the polishing pad; the brush is disposed adjacent to the plastic abrasive and has a plurality of brush elements for contacting the polishing pad. The previous proposal utilizes a design with two hardnesses, wherein the plastic abrasive is used to maintain the removal rate of the polishing pad, and the brush is used to remove the slurry byproducts accumulated in the grooves of the polishing pad, thereby preventing the polishing pad from being damaged, especially the soft polishing pad, and also removing the slurry byproducts accumulated in the grooves of the polishing pad that cannot be removed by diamond abrasive particles.

Taiwan Invention Patent Publication No. TW202212058A discloses a polishing pad dresser, which includes a driving device, a mounting substrate, a diamond dressing head, a brush, an elastic connector and a controller. In this case, the brush is set on the surface of the elastic connector, and the driving device is connected to the controller and the mounting substrate. The controller is used to apply pressure to the mounting substrate to cause the elastic connector to expand and contract, thereby changing the height of the brush relative to the diamond dressing head to achieve different dressing purposes.

Although there are dressers for cleaning polishing pads in the prior art, such as those disclosed in the previous patents, these previous patents only brush the surface of the polishing pad in the longitudinal direction, and polishing pad debris is still very likely to remain in the holes or grooves of the polishing pad. In addition, although the above-mentioned U.S. Patent Publication No. US7815495B2 discloses that two kinds of hardness abrasives and brushes can be used alternately to achieve the effect of cleaning the grooves of the polishing pad without damaging the polishing pad, it still requires the use of two different cleaning tools to be used alternately to achieve the desired effect.

In view of this, the present invention enables the polishing pad dressing device to clean polishing pads of different hardness by adjusting the setting angle of the bristles, the arrangement density of the bristles, the arrangement of the cleaning units and the change of the bristle height, and can effectively remove the residues in the dead corners of the polishing pad groove, thereby having a better cleaning ability.

On one hand, the present invention provides a polishing pad dressing device, comprising: a substrate having an upper surface; and a plurality of first cleaning units and a plurality of second cleaning units, which are arranged above the substrate; wherein each of the first cleaning units includes a plurality of first bristles arranged in parallel, and the plurality of first bristles are arranged perpendicular to the upper surface or form a first angle with the upper surface; wherein each of the second cleaning units includes a plurality of second bristles arranged in parallel, and the plurality of second bristles are arranged perpendicular to the upper surface or form a second angle with the upper surface.

According to an embodiment of the present invention, the first angle and the second angle are both less than 90 degrees.

According to an embodiment of the present invention, the first angle and the second angle are both 45 to 75 degrees.

According to an embodiment of the present invention, the plurality of first bristles are disposed perpendicular to the upper surface, and the plurality of second bristles form the second angle with the upper surface, and the second angle is less than 90 degrees.

According to an embodiment of the present invention, the plurality of first cleaning units and the plurality of second cleaning units are arranged in a staggered manner.

According to an embodiment of the present invention, two adjacent first cleaning units form a first cleaning group, and two adjacent second cleaning units form a second cleaning group, and the first cleaning groups and the second cleaning groups are arranged in a staggered manner.

According to one embodiment of the present invention, the plurality of first cleaning units include a plurality of high-density first cleaning units and a plurality of low-density first cleaning units, and each of the high-density first cleaning units has a higher bristle arrangement density than each of the low-density first cleaning units.

According to an embodiment of the present invention, the plurality of high-density first cleaning units and the plurality of low-density first cleaning units are arranged in a staggered manner.

According to one embodiment of the present invention, the plurality of second cleaning units include a plurality of high-density second cleaning units and a plurality of low-density second cleaning units, and each of the high-density second cleaning units has a higher bristle arrangement density than each of the low-density second cleaning units.

According to an embodiment of the present invention, the plurality of high-density second cleaning units and the plurality of low-density second cleaning units are arranged in a staggered manner.

According to an embodiment of the present invention, the material of the substrate is selected from the group consisting of metal, ceramic and polymer resin.

According to one embodiment of the present invention, the material of the plurality of first bristles is polypropylene, nylon or polyvinylidene fluoride, and the material of the plurality of second bristles is polypropylene, nylon or polyvinylidene fluoride.

According to one embodiment of the present invention, the plurality of first bristles have a first hardness, and the plurality of second bristles have a second hardness.

According to one embodiment of the present invention, the first hardness is greater than the second hardness.

According to one embodiment of the present invention, the plurality of first bristles have the same height, different heights or a combination thereof, and the plurality of second bristles also have the same height, different heights or a combination thereof.

According to one embodiment of the present invention, the plurality of first bristles have the same height, while the plurality of second bristles have different heights, and the tops of the plurality of second bristles form a working surface, and the working surface is a curved surface or an inclined surface.

The advantages of the polishing pad dressing device provided by the present invention are: by adjusting the setting angle of the bristles, the arrangement density of the bristles, the arrangement of the cleaning units, and the change of the height of the bristles, the polishing pad dressing device can clean polishing pads of different hardness and can effectively remove the residues in the dead corners of the polishing pad groove, thereby having a better cleaning ability. In addition, the structure of the present invention is simple, and it can have a better cleaning ability without adding other devices.

According to conventional operation methods, various features and components in the figure are not drawn according to the actual scale, and the drawing method is to present the specific features and components related to the present invention in the best way. In addition, between different figures, the same or similar element symbols are used to refer to similar elements and components.

The following embodiments should not be considered to unduly limit the present invention. A person having ordinary knowledge in the art to which the present invention belongs may modify and change the embodiments discussed herein without departing from the spirit or scope of the present invention, and still fall within the scope of the present invention.

In this document, unless the context otherwise states, the terms "comprising", "including", "having" or "containing" are inclusive or open, and do not exclude other unspecified elements or method steps; the terms "a" and "the" can be interpreted as singular or plural; the term "one or more" means "at least one", and thus can include a single feature or a mixture/combination. In addition, in this specification and the scope of the attached patent application, unless otherwise stated, "disposed on something" can be regarded as directly or indirectly contacting the surface of something by attachment or other forms, and the definition of the surface should be determined based on the context/paragraph meaning of the specification content and the common knowledge in the field to which this specification belongs.

As used herein, "staggered arrangement" refers to a cross-combination arrangement of multiple units with different characteristics, and the cross-combination arrangement can be different units arranged adjacent to each other, or more than one identical unit as a group, and then arranged adjacent to each other in groups; the number of identical units in the group can be 2, 3, 4 or 5, but the case is not limited to this. In the present invention, the unit can be a cleaning unit, and the characteristics can be the bristle setting angle, bristle arrangement density, bristle height decreasing direction, etc. in the cleaning unit.

FIG1 (A) and (B) show a partial structure of a polishing pad conditioning device of an embodiment of the present invention, please refer to FIG1 (A) first. The present invention provides a polishing pad conditioning device 100A, comprising: a substrate 110 having an upper surface; and a plurality of first cleaning units 121 and a plurality of second cleaning units 122, which are disposed above the substrate 110; wherein each of the first cleaning units 121 comprises a plurality of first bristles 131 arranged in parallel, and a first angle α is formed between the plurality of first bristles 131 and the upper surface; according to the present embodiment, the plurality of first bristles 131 are disposed perpendicular to the upper surface (i.e., the first angle α is 90 degrees). In addition, each of the second cleaning units 122 includes a plurality of second bristles 132 arranged in parallel, and a second angle β is formed between the plurality of second bristles 132 and the upper surface.

The first angle α and the second angle β are equal to or less than 90 degrees, such as but not limited to: 10 degrees, 15 degrees, 20 degrees, 25 degrees, 30 degrees, 35 degrees, 40 degrees, 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 85 degrees or 90 degrees. In a preferred embodiment, the first angle α and the second angle β are both less than 90 degrees, such as but not limited to: 10 degrees, 15 degrees, 20 degrees, 25 degrees, 30 degrees, 35 degrees, 40 degrees, 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees or 85 degrees; or, the first angle α is 90 degrees and the second angle β is less than 90 degrees. In another preferred embodiment, the first angle α and the second angle β are both 45 to 75 degrees, for example but not limited to: 45 degrees, 47 degrees, 49 degrees, 50 degrees, 52 degrees, 55 degrees, 58 degrees, 60 degrees, 62 degrees, 65 degrees, 68 degrees, 70 degrees, 71 degrees, 72 degrees, 73 degrees, 74 degrees or 75 degrees; or, the first angle α is 90 degrees and the second angle β is 45 to 75 degrees.

Specifically, the plurality of first cleaning units 121 and the plurality of second cleaning units 122 are arranged in a staggered manner. According to an embodiment of the present invention, the plurality of first cleaning units 121 and the plurality of second cleaning units 122 may be arranged in a ring or in a straight line on the substrate 110, but the present invention is not limited thereto.

Specifically, the substrate 110 is used to carry a plurality of first cleaning units 121 and a plurality of second cleaning units 122. The plurality of first bristles 131 and a plurality of second bristles 132 can be attached to the substrate 110, or, preferably, extend upward from the substrate 110; more preferably, the substrate 110 includes a plurality of grooves to accommodate the plurality of first bristles 131 and a plurality of second bristles 132. According to an embodiment of the present invention, the shape of the substrate 110 is preferably a disc, and the material of the substrate 110 includes but is not limited to the group consisting of free metal, ceramic and polymer resin.

Please refer to (B) of FIG1 for further details. Here, the polishing pad dressing device 100B includes a plurality of high-density first cleaning units 121a and a plurality of low-density first cleaning units 121b, and each of the high-density first cleaning units 121a has a higher bristle arrangement density than each of the low-density first cleaning units 121b, wherein the plurality of high-density first cleaning units 121a and the plurality of low-density first cleaning units 121b are arranged in a staggered manner. In addition, the polishing pad dressing device 100 further includes a plurality of high-density second cleaning units 122a and a plurality of low-density second cleaning units 122b, and each of the high-density second cleaning units 122a has a higher bristle arrangement density relative to each of the low-density second cleaning units 122b, wherein the plurality of high-density second cleaning units 122a and the plurality of low-density second cleaning units 122b are arranged in a staggered manner.

Specifically, the plurality of high-density first cleaning units 121a, the plurality of low-density first cleaning units 121b, the plurality of high-density second cleaning units 122a and the plurality of low-density second cleaning units 122b are arranged in a staggered manner. According to a preferred embodiment of the present invention, the high-density second cleaning unit 122a, the low-density first cleaning unit 121b, the low-density second cleaning unit 122b and the high-density first cleaning unit 121a are arranged in sequence.

As used herein, the term "bristle arrangement density" refers to the number of bristles contained in each square unit area; in other words, the high-density cleaning unit has more bristles per square unit area than the low-density cleaning unit.

FIG. 2 (A) and (B) show a partial structure of another embodiment of the polishing pad conditioning device of the present invention. Please refer to FIG. 2 (A) and (B) together. In the polishing pad conditioning device 100C, the plurality of first cleaning units 121 are formed into a first cleaning group 141 with two adjacent units, and the plurality of second cleaning units 122 are formed into a second cleaning group 142 with two adjacent units, and the first cleaning group 141 and the second cleaning group 142 are arranged in a staggered manner; In the polishing pad conditioning device 100D, the first cleaning group 141 is composed of the high-density first cleaning unit 121a and the low-density first cleaning unit 121b, and the second cleaning group 142 is composed of the high-density second cleaning unit 122a and the low-density second cleaning unit 122b (as shown in (B) of FIG. 2).

According to an embodiment of the present invention, the materials of the plurality of first bristles 131 and the plurality of second bristles 132 are soft bristles or hard bristles, respectively. The material of the soft bristles can be polypropylene, nylon or polyvinylidene fluoride; and the material of the hard bristles can be polypropylene, nylon or polyvinylidene fluoride. Under the same material, the hard bristles have a thicker wire diameter than the soft bristles, and the hard bristles and the soft bristles can be arranged alternately. In a preferred embodiment, the plurality of first bristles 131 are hard bristles with a first hardness, and the plurality of second bristles 132 are soft bristles with a second hardness; in a more preferred embodiment, the first hardness is greater than the second hardness.

Generally speaking, the abrasive of a grinding pad dresser is diamond particles, which are more likely to damage the grinding pad and shorten the life of the grinding pad, especially soft grinding pads. Without being limited by a specific theory, the inventors have found that the grinding pad dressing devices 100A and 100B provided by the present invention are more suitable for a relatively soft grinding pad. When a soft polishing pad is to be trimmed, the plurality of first bristles 131 are hard bristles, which are arranged perpendicular to the upper surface of the substrate, and the plurality of second bristles 132 are soft bristles, and the second angle β is set to 45 to 75 degrees, for example: 45 degrees, 47 degrees, 49 degrees, 50 degrees, 52 degrees, 55 degrees, 58 degrees, 60 degrees, 62 degrees, 65 degrees, 68 degrees, 70 degrees, 71 degrees, 72 degrees, 73 degrees, 74 degrees or 75 degrees.

According to some embodiments of the present invention, the plurality of first bristles have the same height, different heights or a combination thereof, and the plurality of second bristles also have the same height, different heights or a combination thereof. Specifically, the connecting lines of the bristle tops of the plurality of first bristles or the plurality of second bristles respectively form a working surface, and the working surface is a plane, a curved surface, an inclined surface or an irregular surface. In a preferred embodiment, the plurality of first bristles have the same height, and the plurality of second bristles have different heights, and the tops of the plurality of second bristles form a working surface, and the working surface is a curved surface or an inclined surface, and more preferably, the working surface is a curved surface.

The "bristle height" mentioned in this article refers to the height of the bristles from the upper surface of the substrate to the top of the bristles; and the "working surface" mentioned refers to a surface formed by the connecting lines of the tops of the multiple bristles, and the surface can be a plane, a curved surface, a slope or an irregular surface depending on the height of the bristles.

FIG3 (A) and (B) show a partial structure of a polishing pad conditioning device of an embodiment of the present invention. Please refer to FIG3 (A) first. The present invention provides a polishing pad conditioning device 200A, which includes: a substrate 210, and a plurality of first cleaning units 221 and a plurality of second cleaning units 222. Each of the first cleaning units 221 includes a plurality of first bristles 231 arranged in parallel, and the plurality of first bristles 231 have the same height; and each of the second cleaning units 222 includes a plurality of second bristles 232 arranged in parallel, and the plurality of second bristles 232 have different heights, wherein the height of the plurality of second bristles 232 decreases along a direction, and the top of each of the plurality of second bristles 232 forms a working surface S, and the working surface S is a curved surface. Specifically, the direction includes a direction D1 and a direction D2, the direction D1 is toward the center C of the substrate, and the direction D2 is away from the center C of the substrate.

The "bristle height decreases along one direction" mentioned herein means that there is an angle between the line connecting the tops of the bristles and the horizontal line, and the angle decreases along the direction toward or away from the center of the substrate, and the bristle height decreases as the decreasing angle increases.

According to one embodiment of the present invention, there is a decreasing angle (not shown in the figure) between the top connection line of the plurality of second bristles 232 and the horizontal line, and the decreasing angle is less than 90 degrees, for example: 20 degrees, 25 degrees, 30 degrees, 35 degrees, 40 degrees, 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees or 85 degrees; preferably, the decreasing angle is 60 to 75 degrees, for example: 60 degrees, 65 degrees, 70 degrees or 75 degrees.

Please refer to (A) and (B) of FIG. 3 , the plurality of second cleaning units 222 include a plurality of inward second cleaning units 222a and a plurality of outward second cleaning units 222b, the bristle height of each of the inward second cleaning units 222a decreasing direction is the direction D1, and the bristle height of each of the outward second cleaning units 222b decreasing direction is the direction D2. More specifically, the plurality of inward second cleaning units 222a and the plurality of outward second cleaning units 222b are arranged in a staggered manner. According to a preferred embodiment of the present invention, a first cleaning unit 221 is disposed at the center C of the substrate, and the first cleaning unit 221 is alternately arranged with a plurality of inward-facing second cleaning units 222a and a plurality of outward-facing second cleaning units 222b on both sides thereof.

Referring again to FIG. 3(B) , in the polishing pad conditioning device 200B, the plurality of inward second cleaning units 222a may be high-density second cleaning units or low-density second cleaning units arranged alternately, and the plurality of outward second cleaning units 222b may be high-density second cleaning units or low-density second cleaning units arranged alternately.

In one embodiment of the present invention, the first plurality of bristles 231 and the second plurality of bristles 232 are made of soft bristles or hard bristles, respectively. The soft bristles can be made of polypropylene, nylon or polyvinylidene fluoride; and the hard bristles can be made of polypropylene, nylon or polyvinylidene fluoride. Under the same material, the hard bristles have a thicker wire diameter than the soft bristles, and the hard bristles and the soft bristles can be arranged alternately. In a preferred embodiment, the first plurality of bristles 231 are hard bristles having a first hardness, and the second plurality of bristles 232 are soft bristles having a second hardness; in a more preferred embodiment, the first hardness is greater than the second hardness.

Without being bound by a particular theory, the inventors have found that the polishing pad dressing devices 200A and 200B provided by the present invention are more suitable for a relatively hard polishing pad. When a hard polishing pad is to be dressed, the height difference and the slope of the bristles in the polishing pad dressing devices 200A and 200B can penetrate deep into the grooves of the hard polishing pad to facilitate cleaning of the polishing debris accumulated therein.

Embodiment 1

This embodiment compares the surface cleaning effects of the polishing pad conditioning device of the present invention and a conventional conditioning device. Specifically, the polishing pad conditioning device 100A is used as an embodiment, and a conventional conditioning device (the bristles are arranged at the same angle and at the same height) is used as a comparison example. Both devices clean a soft polishing pad at the same time, and photograph its surface after cleaning.

Figure 4 (A) and (B) show the polishing pad surface after cleaning by the embodiment and the comparative example, respectively. Please refer to Figure 4 (A) and (B) together. From the result of Figure 4 (A), it can be seen that the color of the polishing pad surface is lighter, indicating that the surface cleaning ability of the embodiment is better; and from Figure 4 (B), it can be seen that after the polishing pad is cleaned by the dressing device of the comparative example, the color is darker than that of Figure 4 (A), indicating that its surface cleaning ability is poor.

Embodiment 2

This embodiment also compares the surface cleaning effects of the polishing pad conditioning device of the present invention and a conventional conditioning device. Specifically, the polishing pad conditioning device 100A is used as an embodiment, and a conventional conditioning device (the bristles are arranged at the same angle and the bristles are at the same height) is used as a comparison example. Both devices clean a soft polishing pad at the same time, and after cleaning, the pore state of the polishing pad surface is observed using an electron microscope.

FIG5 (A) shows the surface of the polishing pad after cleaning in the embodiment, while FIG5 (B) shows the surface of the polishing pad after cleaning in the comparative example. Please refer to FIG5 (A) and (B) together. It can be seen from FIG5 (A) that there is no debris accumulation in the holes on the surface of the polishing pad; while it can be seen from FIG5 (B) that there is debris accumulation in the holes of the polishing pad.

Embodiment 3

This embodiment compares the cleaning effects of the polishing pad conditioning device of the present invention and a conventional conditioning device; in detail, the above-mentioned polishing pad conditioning device 200A is used as an embodiment, and a conventional conditioning device (the bristles are arranged at the same angle and the bristles are at the same height) is used as a comparative example, and both are used to clean a hard polishing pad at the same time, and the surface is photographed after cleaning. FIG6 (A) shows the surface of the polishing pad after cleaning by the embodiment, and FIG6 (B) shows the surface of the polishing pad after cleaning by the comparative example. Please refer to (A) and (B) of FIG. 6 . As can be seen from (A) of FIG. 6 , there is no debris accumulation in the grooves on the surface of the polishing pad; while as can be seen from (B) of FIG. 6 , there is debris accumulation in the grooves of the polishing pad.

It can be seen from Examples 1 to 3 that the polishing pad conditioning device of the present invention can be effectively applied to the cleaning of soft polishing pads or hard polishing pads, and shows better cleaning ability than conventional conditioning devices. In addition, the polishing pad conditioning device of the present invention can also effectively remove the debris in the holes or grooves of the polishing pad that are difficult to clean.

In summary, the advantages of the polishing pad dressing device provided by the present invention are: by adjusting the setting angle of the bristles, the arrangement density of the bristles, the arrangement of the cleaning units, and the change of the height of the bristles, the polishing pad dressing device can clean polishing pads of different hardness and can effectively remove the residues in the dead corners of the polishing pad groove, thereby having a better cleaning ability. In addition, the structure of the present invention is simple, and it can have a better cleaning ability without adding other devices.

Herein, all ranges provided are intended to include each specific range within the given range and the combination of sub-ranges between the given ranges. In addition, unless otherwise specified, all ranges provided herein include the endpoints of the ranges. Thus, the range 1-5 specifically includes 1, 2, 3, 4 and 5, as well as sub-ranges such as 2-5, 3-5, 2-3, 2-4, 1-4, etc.

All publications and patent applications cited in this specification are incorporated herein by reference, and each individual publication or patent application is specifically and individually indicated as incorporated herein by reference for any and all purposes. In the event of any inconsistency between this document and any publication or patent application incorporated by reference, this document controls.

The present invention has been described in detail above. However, what has been described above is only the preferred embodiment of the present invention and should not be used to limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made according to the scope of the patent application of the present invention should still fall within the scope of the patent of the present invention.

100A~100D, 200A~200B: polishing pad dressing device 110, 210: substrate 121, 221: first cleaning unit 121a: high-density first cleaning unit 121b: low-density first cleaning unit 122, 222: second cleaning unit 122a: high-density second cleaning unit 122b: low-density second cleaning unit 131, 231: first brush 132, 232: second brush 141: first cleaning group 142: second cleaning group 222a: inward second cleaning unit 222b: outward second cleaning unit C: center of substrate D1: toward the center of the substrate D2: Far from the center of the substrate S: Working surface α: First angle β: Second angle

.

The implementation of the present invention is now described by way of example only with reference to the accompanying drawings, in which:

FIG. 1 is a schematic diagram of a polishing pad conditioning device according to an embodiment of the present invention.

FIG. 2 is a schematic diagram of a polishing pad conditioning device according to an embodiment of the present invention.

FIG. 3 is a schematic diagram of a polishing pad conditioning device according to an embodiment of the present invention.

FIG. 4 is a schematic diagram showing the cleaning effect of a polishing pad conditioning device according to an embodiment of the present invention.

FIG. 5 is a schematic diagram showing the cleaning effect of a polishing pad conditioning device according to an embodiment of the present invention.

FIG. 6 is a schematic diagram showing the cleaning effect of a polishing pad conditioning device according to an embodiment of the present invention.

It should be understood that aspects of the present invention are not limited to the configurations, means and characteristics shown in the accompanying drawings.

without

100A, 100B: Grinding pad dressing device

110: Substrate

121: First cleaning unit

121a: High-density first cleaning unit

121b: Low-density first cleaning unit

122: Second cleaning unit

122a: High-density second cleaning unit

122b: Low-density second cleaning unit

131: First Brush

132: Second bristle

α: First angle

β: Second angle

Claims (13)

A polishing pad dressing device comprises: a substrate having an upper surface; and a plurality of first cleaning units and a plurality of second cleaning units disposed above the substrate; wherein each of the first cleaning units comprises a plurality of first bristles arranged in parallel, and the plurality of first bristles are disposed perpendicular to the upper surface; wherein each of the second cleaning units comprises a plurality of second bristles arranged in parallel, and the plurality of second bristles form a second angle with the upper surface, and the second angle is less than 90 degrees. The polishing pad dressing device as described in claim 1, wherein the plurality of first cleaning units and the plurality of second cleaning units are arranged in a staggered manner. A polishing pad conditioning device as described in claim 1, wherein the plurality of first cleaning units are composed of two adjacent first cleaning units, and the plurality of second cleaning units are composed of two adjacent second cleaning units, and the first cleaning units and the second cleaning units are arranged in a staggered manner. A polishing pad dressing device as described in claim 1, wherein the plurality of first cleaning units include a plurality of high-density first cleaning units and a plurality of low-density first cleaning units, and each of the high-density first cleaning units has a higher bristle arrangement density than each of the low-density first cleaning units. The polishing pad dressing device as described in claim 4, wherein the plurality of high-density first cleaning units and the plurality of low-density first cleaning units are arranged in a staggered manner. A polishing pad dressing device as described in claim 1, wherein the plurality of second cleaning units include a plurality of high-density second cleaning units and a plurality of low-density second cleaning units, and each of the high-density second cleaning units has a higher bristle arrangement density than each of the low-density second cleaning units. The polishing pad dressing device as described in claim 6, wherein the plurality of high-density second cleaning units and the plurality of low-density second cleaning units are arranged in a staggered manner. A polishing pad conditioning device as described in claim 1, wherein the material of the substrate is selected from the group consisting of metal, ceramic and polymer resin. The polishing pad dressing device as described in claim 1, wherein the material of the plurality of first bristles is polypropylene, nylon or polyvinylidene fluoride, and the material of the plurality of second bristles is polypropylene, nylon or polyvinylidene fluoride. A polishing pad conditioning device as described in claim 1, wherein the plurality of first bristles have a first hardness, and the plurality of second bristles have a second hardness. A polishing pad conditioning device as described in claim 10, wherein the first hardness is greater than the second hardness. A polishing pad dressing device as described in claim 1, wherein the plurality of first bristles have the same height, different heights or a combination thereof, and the plurality of second bristles also have the same height, different heights or a combination thereof. A polishing pad dressing device as described in claim 12, wherein the plurality of first bristles have the same height, and the plurality of second bristles have different heights, and the tops of the plurality of second bristles form a working surface, and the working surface is a curved surface or an inclined surface.