TWI836648B - 胺化醯亞胺化合物、胺化醯亞胺組合物、硬化劑、環氧樹脂組合物、胺化醯亞胺化合物之製造方法、密封材、及接著劑 - Google Patents

胺化醯亞胺化合物、胺化醯亞胺組合物、硬化劑、環氧樹脂組合物、胺化醯亞胺化合物之製造方法、密封材、及接著劑 Download PDF

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Publication number
TWI836648B
TWI836648B TW111137640A TW111137640A TWI836648B TW I836648 B TWI836648 B TW I836648B TW 111137640 A TW111137640 A TW 111137640A TW 111137640 A TW111137640 A TW 111137640A TW I836648 B TWI836648 B TW I836648B
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Taiwan
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aminated
compound
epoxy resin
imine
group
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TW111137640A
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Chinese (zh)
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TW202302547A (zh
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上村直弥
山田輝久
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日商旭化成股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
    • C07D295/22—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with hetero atoms directly attached to ring nitrogen atoms
    • C07D295/28—Nitrogen atoms
    • C07D295/32—Nitrogen atoms acylated with carboxylic or carbonic acids, or their nitrogen or sulfur analogues
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/506—Amines heterocyclic containing only nitrogen as a heteroatom having one nitrogen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09J161/30—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic and acyclic or carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Indole Compounds (AREA)
  • Plural Heterocyclic Compounds (AREA)
TW111137640A 2020-07-15 2021-07-15 胺化醯亞胺化合物、胺化醯亞胺組合物、硬化劑、環氧樹脂組合物、胺化醯亞胺化合物之製造方法、密封材、及接著劑 TWI836648B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020121122 2020-07-15
JP2020-121122 2020-07-15

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TW202302547A TW202302547A (zh) 2023-01-16
TWI836648B true TWI836648B (zh) 2024-03-21

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TW111137640A TWI836648B (zh) 2020-07-15 2021-07-15 胺化醯亞胺化合物、胺化醯亞胺組合物、硬化劑、環氧樹脂組合物、胺化醯亞胺化合物之製造方法、密封材、及接著劑
TW110126030A TWI787910B (zh) 2020-07-15 2021-07-15 胺化醯亞胺化合物、胺化醯亞胺組合物、硬化劑、環氧樹脂組合物、胺化醯亞胺化合物之製造方法、密封材、及接著劑

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Country Status (6)

Country Link
US (1) US20230212132A1 (https=)
JP (2) JP7606802B2 (https=)
KR (2) KR20250164337A (https=)
CN (2) CN120698950A (https=)
TW (2) TWI836648B (https=)
WO (1) WO2022014646A1 (https=)

Families Citing this family (5)

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Publication number Priority date Publication date Assignee Title
KR20240044519A (ko) * 2021-12-28 2024-04-04 아사히 가세이 가부시키가이샤 에폭시 수지 조성물, 경화물, 밀봉재 및 접착제
JP2024074518A (ja) * 2022-11-21 2024-05-31 旭化成株式会社 エポキシ樹脂組成物
WO2025028598A1 (ja) * 2023-08-01 2025-02-06 旭化成株式会社 エポキシ樹脂用硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤
WO2025028605A1 (ja) * 2023-08-01 2025-02-06 旭化成株式会社 硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤
WO2025028611A1 (ja) * 2023-08-01 2025-02-06 旭化成株式会社 エポキシ樹脂用硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤

Citations (5)

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US3888827A (en) * 1972-11-20 1975-06-10 Permachem Asia Co Ltd 1,2-epoxy resin compositions containing aminimide compounds
JPS5076199A (https=) * 1973-11-12 1975-06-21
JPS61231020A (ja) * 1985-04-04 1986-10-15 Shigeo Tatsuki 低摩擦低摩耗性複合材料
JP2000229927A (ja) * 1999-02-09 2000-08-22 Three Bond Co Ltd アミンイミド化合物およびそれを用いたエポキシ樹脂組成物
JP2003096061A (ja) * 2001-09-25 2003-04-03 Otsuka Chem Co Ltd アミンイミド化合物及びそれを含有するエポキシ樹脂用硬化剤

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JPS4843089B1 (https=) * 1969-12-20 1973-12-17
GB1465905A (en) * 1973-11-30 1977-03-02 Ici Ltd Ammonioamidates
US4005055A (en) * 1975-05-22 1977-01-25 Skeist Laboratories, Incorporated Anaerobic aminimide curing compositions
JP2597137B2 (ja) * 1988-03-18 1997-04-02 三洋化成工業株式会社 反応性乳化剤及び水分散型樹脂組成物
JPH01304033A (ja) * 1988-05-30 1989-12-07 Lion Corp 二疎水鎖二親水基型界面活性剤
JP2594341B2 (ja) * 1988-11-28 1997-03-26 ユニチカ株式会社 ホツトメルト接着剤組成物
JP2003055638A (ja) * 2001-08-21 2003-02-26 Three Bond Co Ltd フィルム状接着剤
JP2004284955A (ja) * 2003-03-19 2004-10-14 Arakawa Chem Ind Co Ltd アミンイミド化合物及びその製造方法
JP5057016B2 (ja) 2006-06-26 2012-10-24 株式会社スリーボンド 活性エネルギー線の照射により活性化するアミンイミド化合物、それを用いた組成物およびその硬化方法
JP4973868B2 (ja) 2007-11-13 2012-07-11 株式会社スリーボンド 硬化性樹脂組成物および硬化方法
JP5486927B2 (ja) * 2007-12-28 2014-05-07 三井化学株式会社 潜在性硬化剤、それを含むエポキシ樹脂組成物、シール剤および有機ｅｌディスプレイ
JP6282515B2 (ja) 2014-04-07 2018-02-21 旭化成株式会社 エポキシ樹脂及びその製造方法、エポキシ樹脂組成物及びその硬化物
JP2015231020A (ja) * 2014-06-06 2015-12-21 株式会社ニューフレアテクノロジー 露光システム及び露光方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3888827A (en) * 1972-11-20 1975-06-10 Permachem Asia Co Ltd 1,2-epoxy resin compositions containing aminimide compounds
JPS5076199A (https=) * 1973-11-12 1975-06-21
JPS61231020A (ja) * 1985-04-04 1986-10-15 Shigeo Tatsuki 低摩擦低摩耗性複合材料
JP2000229927A (ja) * 1999-02-09 2000-08-22 Three Bond Co Ltd アミンイミド化合物およびそれを用いたエポキシ樹脂組成物
JP2003096061A (ja) * 2001-09-25 2003-04-03 Otsuka Chem Co Ltd アミンイミド化合物及びそれを含有するエポキシ樹脂用硬化剤

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Publication number Publication date
JP7606802B2 (ja) 2024-12-26
CN120698950A (zh) 2025-09-26
US20230212132A1 (en) 2023-07-06
TW202206416A (zh) 2022-02-16
WO2022014646A1 (ja) 2022-01-20
JP2025041699A (ja) 2025-03-26
CN115803323B (zh) 2025-05-16
JPWO2022014646A1 (https=) 2022-01-20
KR20230024366A (ko) 2023-02-20
CN115803323A (zh) 2023-03-14
KR102886585B1 (ko) 2025-11-14
TWI787910B (zh) 2022-12-21
KR20250164337A (ko) 2025-11-24
TW202302547A (zh) 2023-01-16

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