TWI833015B - Laminated body and manufacturing method thereof - Google Patents

Abstract

The present invention provides a laminated body suitable for ensuring bending clearance in the bending of the reinforcing inter-membrane area in a soft adherend, and a manufacturing method thereof. The laminated body has a soft adherend and a plurality of layers attached to the same side thereof. Reinforcement membrane. The laminated body X of the present invention includes an adherend 10 (soft adherend) and a film 20 (reinforcement film). The film 20 includes a base material 21 and an adhesive layer 22 and is attached to the adherend 10 with the adhesive layer 22 side, and includes adjacent film portions 20A and 20B on the adherend 10 . The base material 21 of the film portion 20A has an end surface 21 a facing the film portion 20B, and the end surface 21 a is inclined in such a manner that the portion farther away from the adherend 10 retreats toward the inside of the film portion 20A. The base material 21 of the film portion 20B has an end surface 21b facing the film portion 20A, and the end surface 21b is inclined in such a manner that the portion farther away from the adherend 10 recedes toward the inside of the film portion 20B.

Description

Laminated body and manufacturing method thereof

The present invention relates to a laminated body that is a component component of a soft device, for example, and a manufacturing method thereof.

In the manufacturing process of various devices such as optical devices and electronic devices, there are cases where various steps are performed after attaching a specific adhesive film to the parts from the viewpoint of protecting the surface of the component parts of the device or protecting them from impact. . Such a protective film may be incorporated into a product device as a device structural material in a state of being attached to the component parts in order to supplement the strength of the component parts of the device to which it is attached. Technology related to such an adhesive film having both a protective function and a reinforcing function is described in the following Patent Document 1, for example. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2017-132977

[Problem to be solved by the invention]

Regarding flexible device components such as flexible printed circuit boards (FPC), there are cases where the above-mentioned adhesive films (that is, reinforcing films that also serve as protective functions during the manufacturing process) are required to be bonded to multiple locations on the same surface. . In addition, a soft device component with a plurality of reinforcing films attached to the same surface side may be assembled into the product device in a state where the reinforcing films are bent and folded so that the reinforcing films come close to each other in the region between the reinforcing films.

In such a device component (soft adherend) having a plurality of reinforcing films, from the viewpoint of miniaturization or weight reduction of the device component, it is preferable that they span the planned bending portion and be adjacent to each other. The separation distance between the two reinforcing membranes is short. However, if the separation distance between two adjacent reinforcing films across the planned bending position is too short, there may be a situation where the reinforcing films contact each other when the soft adherend is bent and deformed, and the soft adherend cannot Get the desired reversal shape.

The present invention provides a laminated body suitable for ensuring bending clearance in the bending of the reinforcing inter-membrane region in a soft adherend, and a manufacturing method thereof. A reinforcing film. [Technical means to solve problems]

According to a first aspect of the present invention, a laminated body is provided. The laminated body has a soft adherend and a reinforcing film. The reinforcing film includes a base material and an adhesive layer on it, and is attached to the soft adherend with the adhesive layer side. In the reinforced film, the base material and the adhesive layer can be directly connected or connected through other layers. Furthermore, the reinforcing film includes a first reinforcing film part and a second reinforcing film part that are separated and adjacent to each other on the soft adherend. The base material of the first reinforcing film part has a first inclined end face facing the second reinforcing film part. The first inclined end surface is inclined in such a manner that the portion further away from the soft adherend is retreated toward the inside of the first reinforcing film portion. The base material of the second reinforcing film part has a second inclined end face facing the first reinforcing film part. The second inclined end surface is inclined in such a manner that the portion further away from the soft adherend is retreated toward the inside of the second reinforcing film portion.

In the laminate of the first aspect of the present invention, as described above, the end surface of the base material of the first reinforcing film portion on the soft adherend that faces the second reinforcing film portion is farther away from the soft adherend. The part is inclined toward the inside of the first reinforcing film part, and the end surface of the base material of the second reinforcing film part on the soft adherend that is opposite to the first reinforcing film part is further away from the soft adherend. The part is tilted in such a way that it recedes toward the inside of the second reinforcing membrane part. This configuration is suitable for ensuring a bending clearance for bending in the region between the first and second reinforcing film portions in the soft adherend (that is, suitable for suppressing contact between the reinforcing films). This kind of laminate can easily obtain an appropriate folded shape such that the reinforcing film bonding surface of the soft adherend faces inward. In addition, for the laminate of the present invention that can easily obtain an appropriate folded shape in this way, it is easy to design the distance between the reinforcing films on the soft adherend to be shorter, so that it is easy to achieve miniaturization or weight reduction.

In the laminated body of the first aspect of the present invention, it is preferable that the adhesive layer of the first reinforcing film part has a modified portion at the side edge end of the second reinforcing film part, and the adhesive layer of the second reinforcing film part preferably The side edge end of the first reinforcing membrane portion has a modified portion. This structure is suitable for suppressing the leakage of the constituent components in the adhesive layer of each reinforcing film part.

According to a second aspect of the present invention, a method for manufacturing a laminated body is provided. The manufacturing method includes: an attaching step, a cutting step, a peeling step, and an adhesion increasing step.

In the attaching step, the reinforcing film including the base material and the adhesive layer on the base material is attached to the soft adherend with its adhesive layer side. In the reinforced film, the base material and the adhesive layer can be directly connected or connected through other layers. The adhesive layer is composed of an adhesive composition that can move from a state with relatively low adhesive force (low adhesive force state) to a relatively high adhesive force by external stimulation such as active energy ray irradiation or heating. The state (high adhesion state) changes irreversibly.

In the cutting step, the reinforcing film on the soft adherend is processed to form cutting grooves, and two separated first regions and a second region between the first regions are divided and formed in the reinforcing film. In this step, the cutting grooves that distinguish each of the first and second regions become wider as they are farther away from the soft adherend. That is, the cut end surface on the second region side of each first region is inclined in such a manner that the portion further away from the soft adherend recedes toward the inside of the first region. The cut end face includes the cut end face (inclined) of the base material in the first region. In addition, each adhesive layer in the first and second regions produced through this step is in the above-mentioned low adhesive force state.

In the peeling step, the second region portions divided and formed between the first region portions are peeled off from the soft adherend in the above manner. The second area on the soft adherend is in a low adhesion state as described above. This configuration is preferable in terms of appropriately peeling the second region portion from the soft adherend.

In the step of increasing the adhesive force, the adhesive force of the adhesive layer in the first region is increased. In this step, external stimulation such as active energy ray irradiation or heating to the adhesive layer in the first region causes the adhesive layer in each first region on the soft adherend to change to a high-adhesion state. Thereby, the bonding state with respect to the soft adherend becomes firm in the 1st area|region part. This structure is suitable in that the first region derived from the reinforcing film remains in the laminate as a structural material. The first region portion in which the adhesive layer is in a high adhesive force state constitutes the reinforcing film portion (the first reinforcing film portion and the second reinforcing film portion) in the above-mentioned laminated body according to the first aspect of the present invention. Furthermore, the cut end surface (inclined) of the base material in the first region constitutes the inclined end surface of the base material of the first and second reinforcing film parts in the above-mentioned laminated body of the first aspect.

According to the present laminated body manufacturing method including each of the above-mentioned steps, the above-mentioned laminated body according to the first aspect of the present invention can be appropriately manufactured. According to this manufacturing method, the manufactured laminated body can enjoy the same effect as mentioned above with respect to the laminated body of the 1st aspect of this invention. Furthermore, in this manufacturing method, there is no need to individually attach a plurality of films as reinforcing materials to the soft adherend. This manufacturing method contributes to the efficiency of manufacturing the laminated body or the device to which it is assembled.

In the above-mentioned cutting step, it is preferable to form a modified portion facing the cutting groove between the second area portion and the adhesive layer of each first area portion. This structure is suitable for suppressing the leakage of the constituent components in the adhesive layer of each reinforcing film part.

In the above-mentioned cutting step, it is preferable that the cutting grooves that distinguish each first region part and the second region part are formed by half-cutting the reinforcing film from the base material side to the middle of the adhesive layer. This structure is suitable in order to suppress so-called paste residue in the peeling step performed after the cutting step. When the reinforcing film on the adherend is cut along its entire thickness direction, depending on the cutting method or cutting conditions, the interface between the adherend and the adhesive layer of the reinforcing film and its vicinity may The part of the adhesive layer facing the interface is easily fixed to the adherend due to the local heating or pressing force in the material constituting the adhesive layer. In the cutting step, the structure of leaving an uncut adhesive portion between the bottom end of the cutting groove and the adherend by half-cutting as described above is suitable to avoid the formation of an adhesive layer located at the above-mentioned interface and its vicinity. The effect of local heating or pressing force in the material. Furthermore, in this configuration in which an uncut adhesive portion remains between the bottom end of the cut groove and the adherend by half-cutting as described above, there is a case where the cohesive force of the remaining portion of the adhesive is used to remove the adhesive. 2. It is preferable that the area part or its adhesive layer is peeled off from the surface of the adherend without adhesive residue (paste residue).

1 and 2 show a laminated body X according to an embodiment of the present invention. Figure 1 is a perspective view of the laminated body X. FIG. 2 is a partially enlarged sectional view of the laminated body X. The laminated body X includes an adherend 10 and a film 20 .

The adherend 10 is a soft adherend in one embodiment of the present invention. It is flexible and has a first surface 11 and a second surface 12 facing each other. Examples of the adherend 10 include flexible optical devices such as a flexible display panel, flexible electronic devices such as a flexible printed wiring board (FPC), and soft base materials that are components thereof. When the adherend 10 is a flexible optical device, for example, a pixel area including a plurality of pixels in an array and a circuit including various circuit elements such as a drive circuit are formed on the first surface 11 side of the adherend 10 . areas, and the wiring patterns that electrically connect them. When the adherend 10 is a flexible electronic device, for example, various circuit elements and wiring patterns are formed on the first surface 11 side of the adherend 10 . This adherend 10 can obtain various top-view shapes according to the design of the manufacturing target device.

As shown in detail in FIG. 2 , the film 20 includes a base material 21 and an adhesive layer 22 , and is bonded to the second surface 12 of the adherend 10 with the adhesive layer 22 side. In the film 20, the base material 21 and the adhesive layer 22 can be directly connected or connected through other layers. This kind of film 20 is an example of the reinforcing film in the present invention. In addition to having a protective function for the adherend 10, it is also used to supplement the reinforcing function. It is incorporated into the product device together with the adherend 10 as a device structural material. of elements.

The film 20 includes a film portion 20A (a first reinforcing film portion) and a film portion 20B (a second reinforcing film portion) that are separated and adjacent to the adherend 10 (the film portions 20A and 20B respectively include the base material 21 and the adhesive layer twenty two). The film portions 20A and 20B are spaced apart and adjacent to each other in the plane direction D2 orthogonal to the thickness direction D1 of the film 20 .

The base material 21 of the film portion 20A has an end surface 21a (first inclined end surface) facing the film portion 20B in the surface direction D2. The end surface 21a is inclined in such a manner that the portion farther away from the adherend 10 recedes toward the inside of the film portion 20A. That is, the end surface 21 a is inclined in a direction away from the film portion 20B in the surface direction D2 as it advances from the adherend 10 toward the film 20 in the thickness direction D1 of the film 20 . The inclination angle α of the end surface 21a relative to the thickness direction D1 is, for example, 1° or more, preferably 2° or more, more preferably 3° or more, further preferably 5° or more, for example, 45° or less, preferably The best temperature is below 30°. The adhesive layer 22 of the film portion 20A has a modified portion 22a at an edge on the film portion 20B side. The modified part 22a is a part where the exposed surface of the adhesive layer 22 in the film part 20A is hardened by heating or the like.

The base material 21 of the film portion 20B has an end surface 21b (second inclined end surface) facing the film portion 20A in the surface direction D2. The end surface 21b is inclined in such a manner that the portion farther away from the adherend 10 recedes toward the inside of the film portion 20B. That is, the end surface 21 b is inclined in a direction away from the film portion 20B in the surface direction D2 as it advances from the adherend 10 toward the film 20 in the thickness direction D1 of the film 20 . The inclination angle α of the end surface 21b with respect to the thickness direction D1 is, for example, 1° or more, preferably 2° or more, more preferably 3° or more, further preferably 5° or more, for example, 45° or less, preferably The best temperature is below 30°. The adhesive layer 22 of the film portion 20B has a modified portion 22b at an edge on the film portion 20A side. The modified part 22b is a part where the exposed surface of the adhesive layer 22 in the film part 20B is hardened by heating or the like.

The base material 21 in the film 20 is a support used to ensure the mechanical strength of the film 20 and is the main element used in the film 20 to express its reinforcing function or protective function.

The base material 21 includes flexible plastic material. Examples of such plastic materials include polyester resin, polyolefin resin, (meth)acrylic resin such as polymethacrylate (acrylic resin and/or methacrylic resin), polyimide Resin, polycarbonate resin, polyether resin, polyarylate resin, melamine resin, polyamide resin, cellulose resin, and polystyrene resin. Examples of the polyester resin include polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate. Examples of the polyolefin resin include polyethylene, polypropylene, and cycloolefin polymer (COP). When the adhesive layer 22 is composed of an adhesive composition that can be transformed into a high adhesive state by irradiation with active energy rays as described below, the base material 21 is preferably transparent to the active energy rays. From the viewpoint of balancing transparency and mechanical strength, the plastic material used to constitute the base material 21 is preferably polyester resin, and more preferably polyethylene terephthalate (PET).

The thickness of the base material 21 is, for example, 4 μm or more. From the viewpoint of reinforcing the adherend 10, it is preferably 20 μm or more, more preferably 30 μm or more, and further preferably 45 μm or more. Moreover, the thickness of the base material 21 is, for example, 500 μm or less. From the viewpoint of flexibility or handleability of the film 20, it is preferably 300 μm or less, more preferably 200 μm or less, and still more preferably 100 μm or less.

The adhesive layer 22 in the film 20 is an element used to attach the film 20 to the adherend 10 and is composed of an adhesive composition. The adhesive layer 22 in this embodiment is an adhesive that can irreversibly change from a state of relatively low adhesion (low adhesion state) to a state of relatively high adhesion (high adhesion state) through external stimulation. A layer formed of a sexual composition, and a high adhesion state is obtained in the laminate X after the manufacturing process.

Examples of the adhesive composition used to form the adhesive layer 22 include an adhesive composition capable of changing from a low-adhesion state to a high-adhesion state by irradiating active energy rays such as ultraviolet rays or electron beams (Part 2). 1 adhesive composition), and an adhesive composition capable of changing from a low adhesive force state to a high adhesive force state by heating (second adhesive composition).

The first adhesive composition includes a base polymer, a photohardener, and a photopolymerization initiator.

Examples of the base polymer include acrylic polymers, natural rubber, styrene-isoprene-styrene block copolymers (SIS block copolymers), styrene-butadiene-styrene block copolymers, and Segment copolymer (SBS block copolymer), styrene-ethylene-butylene-styrene block copolymer (SEBS block copolymer), styrene-butadiene rubber, polybutadiene, polyisoprene vinyl, polyisobutylene, butyl rubber, chloroprene rubber, and silicone rubber. From the viewpoint of suppressing adhesion, an acrylic polymer is preferred as the base polymer.

The glass transition temperature (Tg) of the base polymer is, for example, 0°C or lower, preferably -100°C to -5°C, more preferably -80°C to -10°C, further preferably -40°C to -10°C. This structure is suitable for ensuring the fluidity of the base polymer in the first adhesive composition and, therefore, for changing the first adhesive composition into a high adhesive state by active energy rays. Appropriate.

The glass transition temperature is a value described in literature, catalogs, etc., or a value calculated based on the following formula (X) (Fox formula). The same is true for the glass transition temperatures of other polymers described below.

1/Tg＝W1/Tg1+W2/Tg2+…+Wn/Tgn (X) [In formula (X), Tg represents the glass transition temperature (unit: K) of polymer (A), and Tgi (i=1, 2,...n) represents the glass transition temperature (unit: K) when monomer i forms a homopolymer. : K), Wi (i=1, 2,...n) represents the mass fraction of monomer i among all monomer components]

The acrylic polymer in the first adhesive composition is obtained by polymerization of a monomer component (first monomer component) containing alkyl (meth)acrylate as a main component. "(Meth)acrylic acid" means acrylic acid and/or methacrylic acid.

Examples of the alkyl (meth)acrylate include linear or branched C1-20 alkyl (meth)acrylate. Examples of such (meth)acrylic acid alkyl esters include: (meth)acrylic acid methyl ester, (meth)acrylic acid ethyl ester, (meth)acrylic acid propyl ester, (meth)acrylic acid isopropyl ester, Butyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, third butyl (meth)acrylate, amyl (meth)acrylate, (meth)acrylic acid Isoamyl ester, neopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, ( Isooctyl methacrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecane (meth)acrylate ester, dodecyl (meth)acrylate, isotri(dodecyl)(meth)acrylate, myristyl (meth)acrylate, isotetradecyl (meth)acrylate Ester, pentadecyl (meth)acrylate, cetyl (meth)acrylate, heptadecyl (meth)acrylate, stearyl (meth)acrylate, iso(meth)acrylate Octadecyl ester, nonadecyl (meth)acrylate, and eicosanyl (meth)acrylate. In terms of forming an acrylic polymer, one type of (meth)acrylic acid alkyl ester may be used, or two or more types of (meth)acrylic acid alkyl esters may be used.

From the viewpoint of adjusting the glass transition temperature of the acrylic polymer, it is preferable to use a combination of methyl methacrylate and C4-12 alkyl acrylate as the (meth)acrylic acid alkyl ester. When these are used together, the compounding amount of methyl methacrylate is, for example, 5 parts by mass or more, for example, 20 parts by mass, relative to 100 parts by mass of the total amount of methyl methacrylate and C4-12 alkyl acrylate. Hereinafter, the compounding amount of C4-12 alkyl acrylate is, for example, 80 parts by mass or more, for example, 95 parts by mass or less.

The blending ratio of the alkyl (meth)acrylate in the first monomer component is, for example, 50 mass% or more, preferably 60 mass% or more, and, for example, 80 mass% or less.

The first monomer component preferably contains a functional group-containing vinyl monomer capable of being copolymerized with alkyl (meth)acrylate. Examples of the functional group-containing vinyl monomer include hydroxyl group-containing vinyl monomer, carboxyl group-containing vinyl monomer, nitrogen-containing vinyl monomer, (meth)acrylonitrile and other cyano group-containing vinyl monomers. Vinyl monomers, glycidyl group-containing vinyl monomers such as glycidyl (meth)acrylate, sulfo group-containing vinyl monomers, phosphate group-containing vinyl monomers such as 2-hydroxyethylacrylyl phosphate Monomers, aromatic vinyl monomers, vinyl ester monomers, and vinyl ether monomers such as methyl vinyl ether.

Examples of the hydroxyl-containing vinyl monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and (meth)acrylate. 6-hydroxyhexyl acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, and 4-(hydroxymeth)acrylate Methyl)cyclohexylmethyl ester, preferably 2-hydroxyethyl (meth)acrylate, more preferably 2-hydroxyethyl acrylate.

Examples of the carboxyl group-containing vinyl monomer include: (meth)acrylic acid, 2-carboxyethyl (meth)acrylate, carboxypentylcarboxypentyl(meth)acrylate, itaconic acid, and maleic acid. , fumaric acid, and crotonic acid. Examples of the carboxyl group-containing vinyl monomer include acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride.

Examples of the nitrogen-containing vinyl monomer include: N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpyrrolidone, ethylene vinylpyrrole, vinylpyrrole, vinylimidazole, vinylethazole, vinylpyridine, N-acrylamide, N-vinylcarboxamides, and N-vinylcaprolactamide.

Examples of the sulfo group-containing vinyl monomer include styrenesulfonic acid and allylsulfonic acid.

Examples of the aromatic vinyl monomer include styrene, p-methylstyrene, o-methylstyrene, and α-methylstyrene.

Examples of the vinyl ester monomer include vinyl acetate and vinyl propionate.

In terms of forming an acrylic polymer, one type of vinyl monomer containing functional groups may be used, or two or more types of vinyl monomers containing functional groups may be used. From the viewpoint of introducing a crosslinked structure into the acrylic polymer, it is preferable to use a hydroxyl group-containing vinyl monomer and/or a carboxyl group-containing vinyl monomer as the functional group-containing vinyl monomer. From the viewpoint of ensuring sufficient cohesive force in the adhesive layer 22, as the functional group-containing vinyl monomer, it is preferred to use a nitrogen-containing vinyl monomer, and it is preferred to use a nitrogen-containing vinyl monomer. A hydroxyl group-containing vinyl monomer and/or a carboxyl group-containing vinyl monomer are used together.

The blending ratio of the functional group-containing vinyl monomer in the first monomer component is, for example, 5 mass% or more, preferably 10 mass% or more, more preferably 15 mass% or more, and, for example, 30 mass% or less. Preferably it is 20 mass % or less.

The acrylic polymer can be formed by polymerizing the above-described first monomer component containing alkyl (meth)acrylate as a main component. Examples of the polymerization method include solution polymerization, block polymerization, and emulsion polymerization. Preferably, solution polymerization is used.

In solution polymerization, for example, after mixing the first monomer component and the polymerization initiator in a solvent to prepare a reaction solution, the reaction solution is heated. Then, by polymerizing the first monomer component in the reaction solution, an acrylic polymer solution containing an acrylic polymer can be obtained.

The solid content concentration of the acrylic polymer solution obtained by solution polymerization is, for example, 20 mass% or more, for example, 80 mass% or less. The weight average molecular weight of the acrylic polymer is, for example, 100,000 or more, preferably 300,000 or more, more preferably 500,000 or more, for example, 5,000,000 or less, preferably 3,000,000 or less, more preferably 2,000,000 or less. The weight average molecular weight of the acrylic polymer is measured by gel permeation chromatography (GPC) and calculated in terms of polystyrene.

The compounding ratio of the acrylic polymer in the first adhesive composition is, for example, 50 mass% or more, preferably 80 mass% or more, and, for example, 90 mass% or less. The ratio of the compounding amount of the acrylic polymer in the first adhesive composition to the total amount of the acrylic polymer, photohardener, and photopolymerization initiator is, for example, 70 mass % or more, and, for example, 95 mass %. the following.

The photocuring agent in the first adhesive composition is, for example, polyfunctional (meth)acrylate. From the viewpoint that the adhesive force of the adhesive layer 22 can be sufficiently increased by irradiating active energy rays, it is preferably Examples include bifunctional (meth)acrylate and trifunctional (meth)acrylate. Examples of bifunctional (meth)acrylates include polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, and polytetramethylene glycol di(meth)acrylate. Ester, bisphenol A ethylene oxide modified di(meth)acrylate, bisphenol A propylene oxide modified di(meth)acrylate, alkylene glycol di(meth)acrylate, tricyclodecane Dimethanol di(meth)acrylate, pentaerythritol di(meth)acrylate, neopentyl glycol di(meth)acrylate, and glycerol di(meth)acrylate. Examples of the trifunctional (meth)acrylate include ethoxyisocyanuric acid tri(meth)acrylate, pentaerythritol tri(meth)acrylate, and trimethylolpropane tri(meth)acrylate. Acrylate. Examples of the photohardening agent include other acrylic photoreactive oligomers, and photoreactive oligomers such as urethane series, polyether series, polyester series, polycarbonate series, and polybutadiene series. Oligomer. These photohardeners may be used alone, or two or more types may be used in combination.

The functional group equivalent of the photohardener is, for example, 50 g/eq or more, for example, 500 g/eq or less. The viscosity of the photohardener at 25°C is, for example, 5 mPa·s or more, for example, 1000 mPa·s or less. The molecular weight of the photocuring agent is, for example, 200 or less, for example, 1,000 or more, from the viewpoint of compatibility in the first adhesive composition.

The compatibility of the photohardener with respect to the above-mentioned acrylic polymer is preferably low. The low compatibility of the photohardener with the acrylic polymer is as follows. Regarding the adhesive force of the adhesive layer 22, it is possible to realize a low adhesive force state that can be subsequently changed to a high adhesive force state. Better.

The compounding ratio of the photocuring agent in the first adhesive composition is, for example, 10% by mass or more, and, for example, 50% by mass or less. The compounding amount of the photohardener in the first adhesive composition is, for example, 10 parts by mass or more, for example, 50 parts by mass or less, and preferably 30 parts by mass or less based on 100 parts by mass of the acrylic polymer. The ratio of the compounding amount of the photocuring agent in the first adhesive composition to the total amount of the acrylic polymer, photocuring agent, and photopolymerization initiator is, for example, 5 mass % or more, and, for example, 30 mass % or less. .

The photopolymerization initiator in the first adhesive composition is one that accelerates the curing reaction of the photocuring agent, and is selected according to the type of the photocuring agent and the like. Examples of the photopolymerization initiator include a photocation initiator (photoacid generator), a photoradical initiator, and a photoanion initiator (photobase generator). Examples of the photoradical initiator include hydroxyketones such as 1-hydroxycyclohexylphenyl ketone, benzyldimethyl ketals, aminoketones, acylphosphine oxides, benzyl Ketones, and trichloromethyl-containing triclosan derivatives. These photopolymerization initiators may be used alone, or two or more types may be used in combination. When a polyfunctional (meth)acrylate is used as the photohardener, the photopolymerization initiator preferably includes a photoradical initiator, and more preferably includes hydroxyketones. The light absorption region of such a photopolymerization initiator is, for example, 300 nm or more, and, for example, 450 nm or less.

The compounding ratio of the photopolymerization initiator in the first adhesive composition is, for example, 0.01 mass% or more, and, for example, it is 0.5 mass% or less, preferably 0.1 mass% or less. The compounding amount of the photopolymerization initiator in the first adhesive composition is, for example, 0.01 part by mass or more, and, for example, 1 part by mass or less, preferably 0.5 part by mass or less based on 100 parts by mass of the acrylic polymer. The ratio of the compounding amount of the photopolymerization initiator in the first adhesive composition to the total amount of the acrylic polymer, the photohardening agent, and the photopolymerization initiator is, for example, 0.01 mass % or more, and, for example, 1 mass %. % or less, preferably 0.5 mass% or less.

When preparing the first adhesive composition, an acrylic polymer (when the acrylic polymer is prepared by solution polymerization, an acrylic polymer solution), a photohardener, and a photopolymerization initiator are mixed with Prepare and mix in the above ratios.

In the first adhesive composition, from the viewpoint of introducing a cross-linked structure into the acrylic polymer, it is preferable to mix a cross-linking agent. When an acrylic polymer having cross-linking points such as hydroxyl groups or carboxyl groups and a cross-linking agent are blended into the first adhesive composition, the cross-linking points of the acrylic polymer and the cross-linking agent can react, thereby enabling the The acrylic polymer introduces a cross-linked structure. Examples of cross-linking agents used for this include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, and carbodiimide-based cross-linking agents. The cross-linking agent and the metal chelate cross-linking agent are preferably an isocyanate-based cross-linking agent.

Examples of the isocyanate-based crosslinking agent include aliphatic diisocyanates such as butyl diisocyanate and hexamethylene diisocyanate, cyclopentyl diisocyanate or cyclohexyl diisocyanate, isophorone diisocyanate, and the like. Aromatic diisocyanates such as alicyclic diisocyanate, 2,4-toluene diisocyanate or 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate. Examples of the isocyanate-based crosslinking agent include derivatives of these isocyanates (for example, isocyanurate modified products or polyol modified products, etc.). In addition, as the isocyanate-based cross-linking agent, commercially available products can also be used. Examples of such commercially available products include Coronate L (trimethylolpropane adduct of toluene diisocyanate, manufactured by Tosoh), Coronate HL (trimethylolpropane adduct of hexamethylene diisocyanate, Manufactured by Tosoh), Coronate HX (isocyanurate body of hexamethylene diisocyanate, manufactured by Tosoh), and Takenate D110N (trimethylolpropane adduct of xylylene diisocyanate, manufactured by Mitsui Chemicals). These cross-linking agents may be used alone, or two or more types may be used in combination.

The functional group equivalent of the cross-linking agent is, for example, 50 g/eq or more, or, for example, 500 g/eq or less.

The blending ratio of the cross-linking agent in the first adhesive composition is, for example, 0.1 parts by mass or more, preferably 1.0 parts by mass or more, more preferably 1.5 parts by mass or more, still more preferably, based on 100 parts by mass of the acrylic polymer. It is 2.0 parts by mass or more, and for example, it is 10 parts by mass or less, preferably 5 parts by mass or less, and more preferably 4 parts by mass or less.

When the above-described cross-linking agent is blended in the first adhesive composition, a cross-linking catalyst for accelerating the cross-linking reaction may also be blended in the first adhesive composition.

Examples of the cross-linking catalyst include metal-based cross-linking catalysts such as tetra-n-butyl titanate, tetraisopropyl titanate, iron triacetyl acetonate, butyl tin oxide, and dioctyl tin dilaurate. The cross-linking catalyst can be used alone, or two or more types can be used in combination.

The compounding ratio of the crosslinking catalyst in the first adhesive composition is, for example, 0.001 parts by mass or more, preferably 0.01 parts by mass or more, and, for example, 0.05 parts by mass or less based on 100 parts by mass of the acrylic polymer.

In the first adhesive composition, other ingredients may also be blended as necessary. Examples of other ingredients include: silane coupling agents, adhesion-imparting agents, plasticizers, softeners, anti-deterioration agents, fillers, colorants, and ultraviolet absorbers (for stability under fluorescent lamps or natural light). From a chemical perspective), antioxidants, surfactants, and antistatic agents.

The second adhesive composition includes a base polymer (first polymer) and an organosiloxane-containing polymer (second polymer).

Examples of the base polymer include acrylic polymers, natural rubber, styrene-isoprene-styrene block copolymers (SIS block copolymers), styrene-butadiene-styrene block copolymers, and Segment copolymer (SBS block copolymer), styrene-ethylene-butylene-styrene block copolymer (SEBS block copolymer), styrene-butadiene rubber, polybutadiene, polyisoprene vinyl, polyisobutylene, butyl rubber, chloroprene rubber, and silicone rubber. From the viewpoint of suppressing adhesion, an acrylic polymer is preferred as the base polymer.

The glass transition temperature (Tg) of the base polymer is, for example, 0°C or lower, preferably -100°C to -5°C, more preferably -80°C to -10°C, further preferably -40°C to -10°C. This structure is suitable for ensuring the fluidity of the base polymer in the second adhesive composition, and therefore is suitable for changing the second adhesive composition to a high adhesive state by heating.

The acrylic polymer in the second adhesive composition is obtained by polymerization of a monomer component (second monomer component) containing alkyl (meth)acrylate as a main component.

As the (meth)acrylic acid alkyl ester in the second monomer component, for example, the same thing as the (meth)acrylic acid alkyl ester in the above-mentioned first monomer component can be used. The blending ratio of the alkyl (meth)acrylate in the second monomer component is, for example, 50 mass% or more, preferably 60 mass% or more, and, for example, 80 mass% or less.

The second monomer component preferably contains a functional group-containing vinyl monomer capable of being copolymerized with alkyl (meth)acrylate. As the functional group-containing vinyl monomer, for example, the same functional group-containing vinyl monomer as the above-mentioned first monomer component can be used. The blending ratio of the functional group-containing vinyl monomer in the second monomer component is, for example, 5% by mass or more, preferably 10% by mass or more, more preferably 15% by mass or more, and, for example, 30% by mass or less. Preferably it is 20 mass % or less.

The acrylic polymer in the second adhesive composition can be formed by polymerizing a second monomer component containing alkyl (meth)acrylate as a main component. Examples of the polymerization method include solution polymerization, block polymerization, and emulsion polymerization. Preferably, solution polymerization is used.

The ratio of the blending amount of the acrylic polymer in the second adhesive composition to the total amount of the acrylic polymer and the organosiloxane-containing polymer is, for example, 70 mass % or more, and, for example, 99 mass % or less. , preferably 90% by mass or less.

Examples of polymers containing organosiloxane include acrylic, urethane, polyether, polyester, polycarbonate, and polybutadiene based polymers having an organosiloxane skeleton. From the viewpoint of controlling the adhesive force, an acrylic polymer having an organosiloxane skeleton is suitably used as the polymer.

An acrylic polymer having an organosiloxane skeleton is obtained by polymerization of a monomer component (third monomer component) containing an alkyl (meth)acrylate and a monomer having an organosiloxane skeleton. As the (meth)acrylic acid alkyl ester in the third monomer component, for example, the same thing as the (meth)acrylic acid alkyl ester in the above-mentioned first monomer component can be used. As the monomer containing an organosiloxane skeleton, for example, a compound represented by the following general formula (1) or a compound represented by the general formula (2) can be used. In the general formula (1) (2), R ₁ represents hydrogen or a methyl group, R ₂ represents a methyl group or a monovalent organic group, and m and n are integers above 0.

[Chemical 1]

[Chemicalization 2]

As the monomer containing the organosiloxane skeleton, commercially available products can also be used. Specifically, X-22-174ASX, X-22-2426, X-22-2475, and KF-2012 (above) It is a single-end reactive silicone manufactured by Shin-Etsu Chemical Industry Co., Ltd.).

The functional group equivalent of the monomer containing the organosiloxane skeleton is, for example, 700 g/mol or more, preferably 800 g/mol or more, more preferably 850 g/mol or more, and further preferably 1500 g/mol or more, and , for example, less than 20000 g/mol, preferably less than 15000 g/mol, more preferably less than 10000 g/mol, further preferably less than 6000 g/mol, particularly preferably less than 5000 g/mol .

The ratio of the compounding amount of the organosiloxane skeleton-containing monomer in the third monomer component to the total amount of the alkyl (meth)acrylate and the organosiloxane skeleton-containing monomer is, for example, 10 mass % or more , preferably 15 mass% or more, more preferably 20 mass% or more, and, for example, 60 mass% or less, preferably 50 mass% or less, more preferably 40 mass% or less, and still more preferably 30 mass% or less. .

The third monomer component may also contain a vinyl monomer containing a functional group. As the functional group-containing vinyl monomer, for example, the same functional group-containing vinyl monomer as the above-mentioned first monomer component can be used.

The organosiloxane-containing polymer in the second adhesive composition can be formed by containing an alkyl (meth)acrylate and a monomer containing an organosiloxane skeleton and, if necessary, a vinyl monomer containing a functional group. The third monomer component is polymerized to form. Examples of the polymerization method include solution polymerization, block polymerization, and emulsion polymerization. Preferably, solution polymerization is used. In solution polymerization, for example, after preparing a reaction solution by blending the third monomer component and, for example, the above-mentioned polymerization initiator in a solvent, the reaction solution is heated. Then, by polymerizing the third monomer component in the reaction solution, a polymer solution including an organosiloxane-containing polymer can be obtained. In this polymerization reaction, a chain transfer agent may also be used in order to adjust the molecular weight of the polymer formed.

In the second adhesive composition, from the viewpoint of introducing a cross-linked structure into the acrylic polymer and/or the polymer containing organosiloxane prepared therein, a cross-linking agent is preferably prepared. As the cross-linking agent in the second adhesive composition, for example, the same ones as those described above as the cross-linking agent in the first adhesive composition can be used.

In the second adhesive composition, other ingredients may also be blended as necessary. Examples of other ingredients include: silane coupling agents, adhesion-imparting agents, plasticizers, softeners, anti-deterioration agents, fillers, colorants, and ultraviolet absorbers (for stability under fluorescent lamps or natural light). From a chemical perspective), antioxidants, surfactants, and antistatic agents.

The compounding ratio of the organosiloxane-containing polymer in the second adhesive composition is, for example, 0.1 parts by mass or more, preferably 0.3 parts by mass or more, and more preferably 0.4 parts by mass, based on 100 parts by mass of the acrylic polymer. More than 0.5 parts by mass, more preferably 0.5 parts by mass or more, particularly preferably 1 part by mass or more, most preferably 2 parts by mass or more, and, for example, 75 parts by mass or less, preferably 50 parts by mass or less, more preferably 20 parts by mass or less, more preferably 10 parts by mass or less, particularly preferably 8 parts by mass or less, most preferably 5 parts by mass or less.

From the viewpoint of ensuring sufficient adhesion to the adherend 10 , the thickness of the adhesive layer 22 is, for example, 5 μm or more, preferably 10 μm or more, more preferably 15 μm or more, and still more preferably 20 μm. As mentioned above, from the viewpoint of handleability, it is, for example, 300 μm or less, preferably 100 μm or less, more preferably 50 μm or less, further preferably 40 μm or less, particularly preferably 30 μm or less.

In the laminated body The inner side of the film portion 20A is inclined in such a way that the base material 21 of the film portion 20B on the adherend 10 is opposite to the film portion 20A. The way to retreat is tilted. This structure is suitable for ensuring a bending clearance when bending the area between the film portions 20A and 20B in the adherend 10 in the direction indicated by the arrow R in FIG. 2 and folding back the laminated body X. (That is, it is suitable for suppressing the contact of the film parts 20A and 20B with each other). In order to obtain such technical effects, for example, the above-described inclination angles α of the end surfaces 21a and 21b are appropriately set according to the distance between the membrane portions 20A and 20B.

Assuming that the end surface 21a is not inclined as described above but is perpendicular to the second surface 12 of the adherend 10, depending on the distance between the adjacent film parts 20A and 20B, the end surfaces 21a of the film parts 20A and 20B will be 21b interfere with each other, and the laminated body X cannot adopt an appropriate folded form.

On the other hand, in the laminated body X according to one embodiment of the present invention, since the end surfaces 21a and 21b are inclined as described above, it is possible to respond to the bending of the adherend 10 in the area between the film portions 20A and 20B (in the direction of the arrow R bend in the direction shown) to ensure bending clearance. Therefore, even when the membrane part 20A or its end surface 21a and the membrane part 20B or its end surface 21b are arranged close to each other, it is easy to obtain an appropriate folded shape.

Such a laminated body X can easily obtain an appropriate folded shape such that the film 20 bonding surface of the adherend 10 faces inward. In addition, for the laminated body X that is easy to obtain an appropriate folded shape in this way, it is easy to design the distance between the film portions 20A and 20B on the adherend 10 to be short, so it is easy to achieve miniaturization or weight reduction.

In addition, in the laminated body The end has a modified portion 22b. This structure is suitable for suppressing the leakage of the constituent components of the adhesive layer on the end surfaces 21a and 21b of the film portions 20A and 20B.

3A to 3D illustrate the manufacturing method of the above-mentioned laminated body X. The manufacturing method includes: a preparation step, an attaching step, a cutting step, a peeling step, and an adhesion increasing step.

First, in the preparation step, as shown in FIG. 3A , the above-mentioned adherend 10 and the film 20' as the soft adherend are prepared. The adherend 10 has the first surface 11 and the second surface 12 as described above. The film 20' includes the above-mentioned base material 21 and the adhesive layer 22 in the above-mentioned low adhesion state.

The film 20' can be produced, for example, by applying an adhesive composition on the base material 21 to form a coating film, and if necessary, drying and removing the solvent from the coating film. Examples of coating methods for the adhesive composition include roll coating, contact roll coating, gravure coating, reverse coating, roller brush coating, spray coating, dip roll coating, and rod coating. Coating, knife coating, air knife coating, curtain coating, die lip coating, and die nozzle coating. The drying temperature for removing the solvent is, for example, 50°C or higher, preferably 70°C or higher, more preferably 100°C or higher, and, for example, 200°C or lower, preferably 180°C or lower, and more preferably 150°C or lower. The drying time is, for example, 5 seconds or more, preferably 10 seconds or more, and, for example, 20 minutes or less, preferably 15 minutes or less, more preferably 10 minutes or less. When the adhesive composition used contains a cross-linking agent, the cross-linking reaction involving the cross-linking agent in the adhesive composition proceeds by aging simultaneously with or after the above-mentioned drying. Aging conditions are appropriately set according to the type of cross-linking agent. The aging temperature is, for example, 20°C or higher, and may be, for example, 160°C or lower, preferably 100°C or lower. The aging time is, for example, 1 minute or more, preferably 12 hours or more, more preferably 1 day or more, and, for example, 7 days or less. Furthermore, regarding the manufactured film 20', a release film may be laminated on the side of the adhesive layer 22 opposite to the base material 21 if necessary. Examples of such release films include flexible plastic films such as polyethylene films, polypropylene films, polyethylene terephthalate films, and polyester films.

Next, in the attachment step, as shown in FIG. 3B , the film 20' is attached to the adherend 10. The film 20' is attached to the second surface 12 side of the adherend 10 with its adhesive layer 22 side. The adhesive force of the adhesive layer 22 (in a low adhesive force state) of the film 20' is, for example, 4 N/25 mm or less, preferably 1 N/25 mm or less. The adhesive force of the film 20' with the adhesive layer 22 is a value measured by a peeling test in which a test piece cut out from the film 20' is bonded to polyethylene at 25°C. The surface of the amine film is then peeled off from the polyimide film. In this peeling test, the peeling temperature was set to 25°C, the peeling angle was set to 180°, and the peeling speed was set to 300 mm/min.

When the adhesive layer 22 of the film 20' is composed of the above-mentioned first adhesive composition (including an acrylic polymer, a photohardening agent and a photopolymerization initiator), due to the photohardening agent in the adhesive layer 22 In an unhardened state, the adhesive layer 22 can obtain a low adhesion state. When the adhesive layer 22 of the film 20' is composed of the above-described second adhesive composition (including an acrylic polymer and a polymer containing organosiloxane), the adhesive layer 22 contains organosiloxane. The polyorganosiloxane part of the side chain of the oxane polymer is relatively low-polar in the adhesive layer 22 and tends to be concentrated on the surface of the adherend 10 side of the adhesive layer 22 and its vicinity, so it adheres The agent layer 22 can achieve a low adhesion state.

The configuration in which the adhesive layer 22 of the film 20' used in the attaching step is in a low adhesive force state is suitable in terms of ensuring reworkability in this step. The film 20' is required to have light releasability for proper peeling from the adherend 10, so that poor adhesion occurs in this step (the position of the film 20' relative to the adherend 10 is shifted, or air bubbles are mixed into the adherend). (between the adhesive body 10 and the film 20'), an alternative film 20' can be used to perform the adhesion operation. The film 20' in which the adhesive layer 22 is in a low adhesion state (the adhesive layer 22 of which can be later changed to a high adhesion state) is suitable for ensuring reworkability with respect to the attachment operation of the film 20' to the adherend 10, and in After proper attachment, a sufficient bonding state to the adherend 10 is ensured.

Then, in the cutting step, as shown in FIG. 3C , the film 20 ′ on the adherend 10 is subjected to a cutting process to form the cutting groove G (in FIG. 3C , the cutting groove is schematically represented by a thick solid line). The film 20' is divided and formed with a second area portion S2 between the two separated first area portions S1 and the first area portion S1. The first region portion S1 is a region constituting the above-mentioned film 20 (film portions 20A, 20B) in the manufactured laminated body X. The second area portion S2 is an area removed as follows. Examples of the cutting processing method in this step include knife cutting and laser cutting. Examples of the cutter used for cutter cutting include a rotary cutter, a Thomson blade, and a Pinnacle blade. Examples of the laser used for laser cutting include CO ₂ laser and YAG laser.

In the cutting step, as shown in FIG. 4 , the cutting groove G that separates the first region portion S1 and the second region portion S2 becomes wider as it moves away from the adherend 10 toward the base material 21 side. The cut groove G is a V-shaped groove having a V-shaped cross section. That is, the cut end surface Ga on the second area portion S2 side of each first area portion S1 is inclined in such a manner that the portion farther away from the adherend 10 retreats toward the inside of the first area portion S1. The degree of inclination of the cutting end surface Ga of the cutting groove G (for example, the angle corresponding to the above-mentioned inclination angle α) can be adjusted by appropriately selecting the edge angle of the tool tip during cutting. During laser cutting, adjustments can be made by appropriately adjusting the irradiation energy, irradiation diameter, irradiation position and other irradiation conditions of the laser.

In addition, in the cutting step in this embodiment, the modified portions 22a and 22b facing the cut groove G between the first region portion S1 and the second region portion S2 are formed in the adhesive layer 22. The modified portions 22a and 22b can be formed, for example, by local heating of the adhesive layer 22 during groove formation. As described above, the modified portions 22a and 22b are suitable for suppressing the bleeding of the constituent components of the adhesive layer 22.

In the above-mentioned cutting step, the cutting groove G that distinguishes each first area part S1 and the second area part S2 may also be cut in half from the base material 21 side to the middle of the adhesive layer 22 of the film 20 ′. to form. In the half-cutting, the entire base material 21 is cut along the thickness direction and is cut to a position halfway along the thickness direction of the adhesive layer 22 . The cutting depth of the adhesive layer 22 in the half-cut is, for example, 70% or more, preferably 80% or more, more preferably 90% or more, for example, less than 100% of the entire thickness of the adhesive layer 22 (100%). , preferably less than 99%, more preferably less than 98%. The remaining thickness of the adhesive layer 22 after such half-cutting can be appropriately set based on the relationship with the physical properties such as viscoelasticity of the adhesive layer 22 and the peeling force.

This half-cut processing is suitable for reducing the impact of heat generated by cutting processes such as laser cutting on the adherend 10, and therefore is suitable for suppressing the thermal history of the adherend 10 caused by the cutting step. For example, when the adherend 10 is an electronic device such as a flexible display panel or a flexible printed wiring board, the half-cut processing as described above can avoid and reduce the damage to various components or wiring provided on the first surface 11 side of the adherend 10 It is suitable in terms of thermal influence.

Next, in the peeling step, as shown in FIG. 3D , the second region portion S2 divided and formed between the first region portions S1 is peeled off from the adherend 10 . The adhesive layer 22 in the second region S2 on the adherend 10 is in a low adhesion state as described above. As a result, this configuration can properly peel the second region S2 from the adherend 10 . Better.

Moreover, in this peeling step, from the viewpoint of suppressing so-called paste residue, it is suitable to perform half-cutting as described above in the cutting step before the peeling step. When the entire film 20' on the adherend 10 is cut along its thickness direction, depending on the cutting method and cutting conditions, the adhesive layer 22 located on the adherend 10 and the film 20' may Due to the local heating or pressing force in the interface and the adjacent adhesive layer material, a part of the adhesive layer 22 facing the interface is easily fixed to the adherend 10 (local fixation of the adhesive). For example, when the adhesive layer 22 is composed of the above-mentioned first adhesive composition, local solidification of the adhesive may occur due to curing of photohardeners such as polyfunctional (meth)acrylates in the composition. write. In the cutting step, the structure in which an uncut adhesive portion remains between the bottom end of the cutting groove G and the adherend 10 through half-cutting as described above is suitable for avoiding adhesion at the above-mentioned interface and its vicinity. The effect of local heating or pressing force in the material forming the agent layer. Furthermore, there is a case in which the uncut adhesive portion remains between the bottom end of the cut groove G and the adherend 10 by half-cutting as described above, which is preferable from the following point of view. That is, using The cohesive force of the remaining adhesive portion peels off the second area portion S2 or its adhesive layer 22 from the surface of the adherend 10 without adhesive residue (paste residue).

Next, in the adhesive force increasing step, the adhesive force of the adhesive layer 22 in the first region S1 is increased. When the adhesive layer 22 of the film 20' is composed of the above-mentioned first adhesive composition (including an acrylic polymer, a photohardener and a photopolymerization initiator), in the peeling step, the adhesive layer 22 is Irradiate active energy rays such as ultraviolet rays or electron beams. Thereby, the adhesive layer 22 becomes a high adhesive state through polymerization or hardening of the photohardener in the adhesive layer 22 . When the adhesive layer 22 of the film 20' is composed of the above-mentioned second adhesive composition (including an acrylic polymer and a polymer containing an organosiloxane), in the peeling step, the adhesive layer 22 is Heat. The heating temperature is, for example, 40°C or higher, preferably 50°C or higher, more preferably 60°C or higher, and, for example, less than 150°C, preferably 120°C or less, more preferably 100°C or less, and still more preferably 80°C. below ℃. The heating time is, for example, 1 hour or less, preferably 30 minutes or less, more preferably 10 minutes or less, further preferably 5 minutes or less, and, for example, 1 minute or more. By such heating, the compatibility between the acrylic polymer in the adhesive layer 22 and the polymer containing organosiloxane becomes higher. The polymer containing organosiloxane or the polyorganosiloxane as its side chain becomes higher. (In a low adhesion state, there is a tendency to be concentrated on the adherend 10 side surface of the adhesive layer 22 and its vicinity) for thermal diffusion, and the acrylic system on the adherend 10 side surface of the adhesive layer 22 and its vicinity The presence ratio of polymer increases. Thereby, the adhesive layer 22 becomes a high adhesive force state. The adhesive force of the adhesive layer 22 in a high adhesive state is, for example, 5 N/25 mm or more, preferably 8 N/25 mm or more, more preferably 10 N/25 mm or more, and further preferably 12 N/25 mm or more. In addition, the adhesive force of the adhesive layer 22 in the high adhesive force state is, for example, 2 times or more, preferably 4 times or more, and more preferably 8 times or more, compared to the adhesive force of the adhesive layer 22 in the low adhesive force state. , and more preferably 10 times or more.

In this step, by applying external stimulation such as active energy ray irradiation or heating to the adhesive layer 22 of the first region S1 as described above, the adhesive layer of each first region S1 on the adherend 10 is 22 changes to a high adhesion state. Thereby, in the first region portion S1 originating from the film 20, the bonding state to the adherend 10 becomes firm. This configuration is suitable in that the first region portion S1 remains in the laminated body X as a structural material. The first region portion S1 in which the adhesive layer 22 is in a high adhesive force state constitutes the film portions 20A and 20B in the laminated body X.

The above-mentioned laminated body X can be produced appropriately according to the laminated body manufacturing method including each step as described above. Therefore, according to this manufacturing method, the same effect as described above with respect to the laminated body X can be enjoyed in the manufactured laminated body X. In addition, in this manufacturing method, it is not necessary to individually attach the plurality of film portions 20A and 20B as reinforcing materials to the adherend 10 . This manufacturing method contributes to the efficiency of manufacturing the laminated body X or the device to which it is assembled. [Industrial availability]

The laminate of the present invention can be used, for example, in a flexible device component in which a plurality of reinforcing films are bonded to the same surface.

10: Adhered body (soft adhered body) 11:Side 1 12:Side 2 20: Membrane (reinforcement membrane) 20':membrane 20A: Membrane part (1st membrane part) 20B: Membrane part (2nd membrane part) 21:Substrate 21a: End face (1st inclined end face) 21b: End face (2nd inclined end face) 22: Adhesive layer 22a: Modification Department 22b: Modification Department D1:Thickness direction D2: Face direction G: cut groove Ga: cut end face R: arrow S1: Region 1 S2: 2nd Regional Department X: Laminated body α:tilt angle

FIG. 1 is a perspective view of a laminated body according to an embodiment of the present invention. FIG. 2 is a partially enlarged sectional view of the laminated body shown in FIG. 1 . 3A shows some steps in the manufacturing method of the laminated body shown in FIGS. 1 and 2 , FIG. 3B shows the steps following the step shown in FIG. 3A , and FIG. 3C shows the steps following the step shown in FIG. 3B . 3D represents the steps following those shown in Figure 3C. Figure 4 is a partial enlarged view of Figure 3C.

10: Adhered body (soft adhered body)

11: Side 1 11

12: Side 2 12

20: Membrane (reinforcement membrane)

20A: Membrane part (1st membrane part)

20B: Membrane part (2nd membrane part)

21:Substrate

21a: End face (1st inclined end face)

21b: End face (2nd inclined end face)

22:Adhesive layer

22a: Modification Department

22b: Modification Department

D1:Thickness direction

D2: Face direction

R: arrow

α:tilt angle

Claims (3)

A laminated body having a soft adherend and a reinforcing film. The reinforcing film includes a base material and an adhesive layer on the base material and is bonded to the soft adherend with the adhesive layer side, and the above-mentioned The reinforcing film includes a first reinforcing film part and a second reinforcing film part that are separated and adjacent to the soft adherend. The base material of the first reinforcing film part has a first reinforcing film part opposite to the second reinforcing film part. Inclined end surface, the first inclined end surface is inclined in such a manner that the farther away from the soft adherend is, the more it retreats toward the inside of the first reinforcing film part. The base material of the second reinforcing film part has the same structure as the first reinforcing film part. The opposing second inclined end surface is inclined in such a manner that the farther away from the soft adherend is, the more it recedes toward the inside of the second reinforcing film part. The adhesive layer of the first reinforcing film part is on the above-mentioned The second reinforcing film portion has a modified portion at a side edge thereof, and the adhesive layer of the second reinforcing film portion has a modified portion at a side edge of the first reinforcing film portion. A method for manufacturing a laminated body, which includes: a step of attaching a reinforcing film including a base material and an adhesive layer on the base material to a soft adherend with the adhesive layer side; and a cutting step, which is to cut the soft adherend. The above-mentioned reinforcing film on the adherend is processed to form grooves, and the reinforcing film is divided into two separate first area parts and a second area part between the above-mentioned first area parts, and each first area is distinguished. The further away from the groove between the above-mentioned second area and the above-mentioned The wider the soft adherend is; the step of peeling off the above-mentioned second region from the above-mentioned soft adherend; and the step of increasing the adhesion of the adhesive layer in the above-mentioned first region, wherein In the cutting step, a modified portion facing the cutting groove between the second area portion is formed in the adhesive layer of each first area portion. The method for manufacturing a laminated body according to claim 2, wherein in the cutting step, the cutting grooves that distinguish each first region and the second region are formed by extending from the base material side of the reinforcing film to the adhesive layer. It is formed by cutting in half the middle.