JP2011044444A - Multilayered pressure-sensitive adhesive sheet, and manufacturing method for electronic component with multilayered pressure-sensitive adhesive sheet - Google Patents

Multilayered pressure-sensitive adhesive sheet, and manufacturing method for electronic component with multilayered pressure-sensitive adhesive sheet Download PDF

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Publication number
JP2011044444A
JP2011044444A JP2007327283A JP2007327283A JP2011044444A JP 2011044444 A JP2011044444 A JP 2011044444A JP 2007327283 A JP2007327283 A JP 2007327283A JP 2007327283 A JP2007327283 A JP 2007327283A JP 2011044444 A JP2011044444 A JP 2011044444A
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Prior art keywords
sensitive adhesive
adhesive sheet
pressure
meth
acrylate
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JP2007327283A
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Japanese (ja)
Inventor
Takeshi Saito
岳史 齊藤
Taro Inada
太郎 稲田
Tomomichi Takatsu
知道 高津
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Denka Co Ltd
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Denki Kagaku Kogyo KK
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Priority to JP2007327283A priority Critical patent/JP2011044444A/en
Priority to PCT/JP2008/065557 priority patent/WO2009078203A1/en
Priority to TW097134069A priority patent/TW200927875A/en
Publication of JP2011044444A publication Critical patent/JP2011044444A/en
Pending legal-status Critical Current

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    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4833—Polyethers containing oxyethylene units
    • C08G18/4837—Polyethers containing oxyethylene units and other oxyalkylene units
    • C08G18/4845—Polyethers containing oxyethylene units and other oxyalkylene units containing oxypropylene or higher oxyalkylene end groups
    • C—CHEMISTRY; METALLURGY
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
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    • C08G18/61—Polysiloxanes
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216—Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/622—Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
    • C08G18/6225—Polymers of esters of acrylic or methacrylic acid
    • C08G18/6229—Polymers of hydroxy groups containing esters of acrylic or methacrylic acid with aliphatic polyalcohols
    • C—CHEMISTRY; METALLURGY
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C08G18/673—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen containing two or more acrylate or alkylacrylate ester groups
    • C—CHEMISTRY; METALLURGY
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
    • C—CHEMISTRY; METALLURGY
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    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
    • C08G18/7621—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring being toluene diisocyanate including isomer mixtures
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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
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    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
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    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
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    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
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    • C09J2423/00—Presence of polyolefin
    • C09J2423/006—Presence of polyolefin in the substrate
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    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01088—Radium [Ra]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayered pressure-sensitive adhesive sheet of a die attachment integrated type, provided compatibly with a function of a pressure-sensitive adhesive sheet for fixing a wafer to a ring frame at dicing, and an adhesion function for fixing a chip to a lead frame, or the like, and which is capable of preventing a cut waste from being generated in a dicing process, or reducing it therein. <P>SOLUTION: The multilayered pressure-sensitive adhesive sheet includes a base material film 106; a pressure-sensitive adhesive layer 103 formed on one side face of the base material film; and further a die attachment film 105 laminated onto the pressure-sensitive adhesive layer, and the base material film is formed of a propylene copolymer, in the multilayered pressure-sensitive adhesive sheet. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、多層粘着シート及び多層粘着シートを用いた電子部品の製造方法に関する。   The present invention relates to a multilayer pressure-sensitive adhesive sheet and an electronic component manufacturing method using the multilayer pressure-sensitive adhesive sheet.

電子部品の製造方法の一つに、ウエハや絶縁基板上に複数の回路パターンが形成された電子部品集合体を粘着シートに貼り付ける貼付工程と、貼り付けられたウエハや電子部品集合体を個々に切断してチップ化する切断・分離工程（ダイシング工程）と、切断されたチップを粘着シートからピックアップするピックアップ工程と、ピックアップしたチップの底面に接着剤を塗布した後にこの接着剤でチップをリードフレーム等に固定する固定工程を有する製造方法が知られている。   One method of manufacturing electronic components includes an attaching step of attaching an electronic component assembly in which a plurality of circuit patterns are formed on a wafer or an insulating substrate to an adhesive sheet, and the attached wafer or electronic component assembly individually. A cutting / separation process (dicing process) for cutting into chips, a pick-up process for picking up the cut chips from the pressure-sensitive adhesive sheet, and applying an adhesive to the bottom surface of the picked-up chip, and then leading the chip with this adhesive A manufacturing method having a fixing step of fixing to a frame or the like is known.

切断工程にあっては、ウエハや電子部品集合体を粘着シートに貼り付け、更に粘着シートをリングフレームに固定してから個々のチップに切断し分離（ダイシング）する方法が知られている。   In the cutting process, a method is known in which a wafer or an electronic component assembly is attached to an adhesive sheet, and the adhesive sheet is further fixed to a ring frame, and then cut into individual chips and separated (diced).

この製造方法で用いられる粘着シートにダイアタッチフィルムを積層することにより、ダイシング用の粘着シートの機能と、チップをリードフレーム等に固定する接着剤の機能を兼ね備えた粘着シート（ダイアタッチフィルム一体型シート）を用いる方法が提案されている（特許文献１、特許文献２参照）。ダイアタッチフィルム一体型シートを電子部品の製造に用いることにより、ダイシング後の接着剤の塗布工程を省略できる。   By laminating a die attach film on the pressure sensitive adhesive sheet used in this manufacturing method, the pressure sensitive adhesive sheet having the function of an adhesive sheet for dicing and the function of an adhesive for fixing a chip to a lead frame or the like (die attach film integrated type) A method using a sheet has been proposed (see Patent Document 1 and Patent Document 2). By using the die attach film integrated sheet for the production of electronic components, the step of applying the adhesive after dicing can be omitted.

ダイアタッチフィルム一体型シートは、チップとリードフレームの接着に接着剤を用いる方法に比べ、接着剤部分の厚み制御や接着剤のはみ出し抑制に優れている。ダイアタッチフィルム一体型シートは、チップサイズパッケージ、スタックパッケージ、及びシステムインパッケージ等の電子部品の製造に利用されている。   The die attach film-integrated sheet is excellent in controlling the thickness of the adhesive portion and suppressing the protrusion of the adhesive as compared with a method using an adhesive for bonding the chip and the lead frame. The die attach film integrated sheet is used for manufacturing electronic components such as a chip size package, a stack package, and a system in package.

特開２００６−０４９５０９号公報JP 2006-049509 A 特開２００７−２４６６３３号公報JP 2007-246633 A

しかしながら、ダイアタッチフィルム一体型シートの基材としては、一般的にポリエチレン系の樹脂組成物が使用されているが、ダイシング工程に基材由来の切削屑、及びダイアタッチフィルム由来の切削屑が発生する場合があった。   However, as a base material for the die attach film integrated sheet, a polyethylene resin composition is generally used. However, cutting waste derived from the base material and die attach film are generated in the dicing process. There was a case.

本発明は、上記事情を鑑みてなされたものであり、ダイシング工程時における切削屑の発生を防止又は低減し、高効率に信頼性の高いダイシング工程を行い、高品質な電子部品を製造できる技術を提供することを目的とする。   The present invention has been made in view of the above circumstances, and can prevent or reduce the generation of cutting chips during the dicing process, perform a highly efficient and reliable dicing process, and manufacture a high-quality electronic component. The purpose is to provide.

本発明によれば、基材フィルムと、該基材フィルムの一方の面に積層してなる粘着剤層と、さらに該粘着剤層に積層されたダイアタッチフィルムと、を備え、該基材フィルムがプロピレン系共重合体で形成されている多層粘着シートが提供される。   According to the present invention, a base film, a pressure-sensitive adhesive layer laminated on one surface of the base film, and a die attach film laminated on the pressure-sensitive adhesive layer are provided, and the base film Is provided with a propylene-based copolymer.

上記構成からなる多層粘着シートをダイシング工程に供することにより、ダイシング工程時における切削屑の発生を抑制でき、高効率に信頼性の高いダイシング処理を行い、高品質な電子部品を製造できる。なお、上記の多層粘着シートは本発明の一態様であり、本発明の多層粘着シートを用いた電子部品の製造方法も、同様の技術的特徴を有し、同様の作用効果を奏する。   By using the multilayer pressure-sensitive adhesive sheet having the above-described configuration in the dicing process, generation of cutting waste during the dicing process can be suppressed, a highly efficient and highly reliable dicing process can be performed, and a high-quality electronic component can be manufactured. In addition, said multilayer adhesive sheet is 1 aspect of this invention, The manufacturing method of the electronic component using the multilayer adhesive sheet of this invention also has the same technical feature, and there exists the same effect.

本発明によれば、上記構成の多層粘着シートをダイシング工程に供することにより、ダイシング工程時における切削屑の発生を抑制でき、高効率に信頼性の高いダイシング工程を行い、高品質な電子部品を製造できる。これらの結果、電子部品の信頼性の向上、生産性の向上等を図ることができる。   According to the present invention, by providing the multilayer adhesive sheet having the above configuration to the dicing process, generation of cutting waste during the dicing process can be suppressed, a highly efficient and reliable dicing process is performed, and a high-quality electronic component is obtained. Can be manufactured. As a result, it is possible to improve the reliability and productivity of electronic components.

以下、本発明に係る多層粘着剤シート及び多層粘着シートを用いた電子部品の製造方法の実施形態について詳細に説明する。   Hereinafter, embodiments of a multilayer pressure-sensitive adhesive sheet and an electronic component manufacturing method using the multilayer pressure-sensitive adhesive sheet according to the present invention will be described in detail.

＜用語の説明＞
本明細書において、単量体単位とは単量体に由来する構造単位を意味する。本明細書の部及び％は、特に記載がない限り質量基準とする。
本明細書において、（メタ）アクリレートとはアクリレート及びメタアクリレートの総称である。（メタ）アクリル酸等の（メタ）を含む化合物等も同様に、名称中に「メタ」を有する化合物と「メタ」を有さない化合物の総称である。 <Explanation of terms>
In the present specification, the monomer unit means a structural unit derived from a monomer. Unless otherwise indicated, parts and% in this specification are based on mass.
In this specification, (meth) acrylate is a general term for acrylate and methacrylate. Similarly, a compound containing (meth) such as (meth) acrylic acid is a general term for a compound having “meta” in the name and a compound not having “meta”.

＜実施形態の概要＞
図１（１）は、本発明の一実施形態の粘着シート構成を説明する断面の概念図である。本実施形態の多層粘着シート（ダイアタッチフィルム一体型シート）１００は、図１（１）に示すように、基材フィルム１０６と、その基材フィルム１０６に後述する粘着剤を塗布してなる粘着剤層１０３と、その粘着剤層１０３上に積層されてなるダイアタッチフィルム１０５と、を備える。 <Outline of Embodiment>
Drawing 1 (1) is a key map of a section explaining the adhesive sheet composition of one embodiment of the present invention. A multilayer pressure-sensitive adhesive sheet (die attach film integrated sheet) 100 of this embodiment is a pressure-sensitive adhesive formed by applying a base film 106 and a pressure-sensitive adhesive described later to the base film 106 as shown in FIG. The adhesive layer 103 and the die attach film 105 laminated | stacked on the adhesive layer 103 are provided.

ここで、上記の基材フィルム１０６と、基材フィルム１０６に後述する粘着剤を塗布してなる粘着剤層１０３と、を併せて、粘着シート１１０と呼ぶことにする。すなわち、多層粘着シート１００は、粘着シート１１０と、その粘着シート１１０の粘着剤層１０３側に積層されてなるダイアタッチフィルム１０５と、を備える。   Here, the base film 106 and the pressure-sensitive adhesive layer 103 formed by applying a pressure-sensitive adhesive described later to the base film 106 are collectively referred to as a pressure-sensitive adhesive sheet 110. That is, the multilayer adhesive sheet 100 includes an adhesive sheet 110 and a die attach film 105 laminated on the adhesive layer 103 side of the adhesive sheet 110.

そして、上記基材フィルム１０６はプロピレン系共重合体で形成されている。   The base film 106 is made of a propylene-based copolymer.

（基材フィルム）
基材フィルム１０６としてプロピレン系共重合体を採用した理由は、このプロピレン系共重合体を採用することにより、半導体ウエハを切断する際に発生する切り屑を抑制することができるためである。このプロピレン系共重合体としては、例えばプロピレンと他成分とのランダム共重合体、プロピレンと他成分とのブロック共重合体、プロピレンと他成分の交互共重合体がある。他成分としては、エチレン、１−ブテン、１−ペンテン、１−ヘキセン、１−ヘプテン等のα−オレフィン、少なくとも２種以上のα−オレフィンからなる共重合体、スチレン−ジエン共重合体等が挙げられる。これらの中でも１−ブテンが好ましい。これにより、半導体ウエハを切断する際に発生する切り屑を特に抑制することができる。 (Base film)
The reason why the propylene-based copolymer is adopted as the base film 106 is that, by adopting this propylene-based copolymer, chips generated when the semiconductor wafer is cut can be suppressed. Examples of the propylene copolymer include a random copolymer of propylene and other components, a block copolymer of propylene and other components, and an alternating copolymer of propylene and other components. Examples of other components include α-olefins such as ethylene, 1-butene, 1-pentene, 1-hexene and 1-heptene, copolymers composed of at least two kinds of α-olefins, and styrene-diene copolymers. Can be mentioned. Among these, 1-butene is preferable. Thereby, it is possible to particularly suppress chips generated when the semiconductor wafer is cut.

プロピレン系共重合体を重合する方法としては、例えば溶媒重合法、バルク重合法、気相重合法、逐次重合方法等が挙げられるが、一段目でプロピレン単独重合体またはプロピレンと少量のエチレンおよび／またはα−オレフィンとのランダム共重合体を製造後、二段目以降でα−オレフィンの単独重合体またはプロピレンと少量のエチレンおよび／またはα−オレフィンとのランダム共重合体を製造する、少なくとも二段以上の逐次重合方法が好ましい。   Examples of the method for polymerizing the propylene-based copolymer include a solvent polymerization method, a bulk polymerization method, a gas phase polymerization method, a sequential polymerization method, and the like. In the first stage, the propylene homopolymer or propylene and a small amount of ethylene and / or Alternatively, after the production of a random copolymer with an α-olefin, an α-olefin homopolymer or a random copolymer of propylene with a small amount of ethylene and / or α-olefin is produced in the second and subsequent stages. A stepwise sequential polymerization process is preferred.

上記プロピレン系共重合体を含む樹脂組成物には、上述したプロピレン系共重合体以外に本発明の目的を損なわない範囲で結晶核剤、アニオン性、カチオン性、非イオン性または両イオン性の一般に公知である帯電防止剤、紫外線吸収剤、滑剤、酸化防止剤、光安定剤、アンチブロッキング剤、界面活性剤、染料、顔料、難燃剤、充填剤、石油樹脂等の添加剤を添加しても良い。   The resin composition containing the propylene-based copolymer includes a crystal nucleating agent, anionic, cationic, nonionic or amphoteric as long as the object of the present invention is not impaired other than the propylene-based copolymer described above. Add generally known additives such as antistatic agents, ultraviolet absorbers, lubricants, antioxidants, light stabilizers, antiblocking agents, surfactants, dyes, pigments, flame retardants, fillers, petroleum resins, etc. Also good.

基材フィルム１０６の成型方法は特に限定されず、例えばカレンダー、Ｔダイ押出し、インフレーション、及びキャスティング等が挙げられる。   The molding method of the base film 106 is not particularly limited, and examples thereof include calendar, T-die extrusion, inflation, and casting.

基材フィルム１０６の加工性を向上させるために、少なくとも基材フィルム１０６の片面にシボ加工やエンボス加工を施して凹凸を形成することが好ましい。好ましい面粗度は算術平均Ｒａ値が０．３μｍ以上２．０μｍ以下であり、０．５μｍ以上１．５μｍ以下とすることがより好ましい。面粗度が０．３μｍ以上であれば、基材フィルム製膜後に基材の巻き戻しが容易ある。また、面粗度が２．０μｍ以下であれば、視認性が損なわれないため、ダイシング時の加工精度を向上させることができる。   In order to improve the workability of the base film 106, it is preferable that at least one surface of the base film 106 is subjected to embossing or embossing to form irregularities. A preferable surface roughness is an arithmetic average Ra value of 0.3 μm or more and 2.0 μm or less, and more preferably 0.5 μm or more and 1.5 μm or less. If the surface roughness is 0.3 μm or more, the substrate can be easily rewound after the substrate film is formed. Moreover, if surface roughness is 2.0 micrometers or less, since visibility is not impaired, the processing precision at the time of dicing can be improved.

基材フィルム１０６の厚みは特に限定されないが、５０μｍ以上２５０μｍ以下が良い。好ましくは７０μｍ以上、１５０μｍ以下がよい。基材フィルム１０６の厚みが５０μｍ以上であれば、エキスパンド時に基材フィルムの切断が生じにくくなる。また、基材フィルム１０６の厚みが２５０μｍ以下であれば、半導体ウエハをダイシング処理する場合にエキスパンド性に優れる傾向にある。また、重量が増大を抑えられるので、コスト性、作業性の両面からも実用的である。   The thickness of the base film 106 is not particularly limited, but is preferably 50 μm or more and 250 μm or less. Preferably it is 70 μm or more and 150 μm or less. If the thickness of the base film 106 is 50 μm or more, the base film is hardly cut during expansion. Moreover, if the thickness of the base film 106 is 250 μm or less, the expandability tends to be excellent when the semiconductor wafer is subjected to a dicing process. Moreover, since an increase in weight can be suppressed, it is practical from the viewpoints of both cost and workability.

多層粘着シート１００には、ダイアタッチフィルム１０５剥離時における帯電を防止するために、基材フィルム１０６の片面又は両面に帯電防止剤を塗布して帯電防止処理を施してもよい。   In order to prevent the multilayer adhesive sheet 100 from being charged when the die attach film 105 is peeled off, an antistatic agent may be applied to one surface or both surfaces of the base film 106 to perform an antistatic treatment.

帯電防止剤としては、例えば四級アミン塩単量体が好適に用いられる。四級アミン塩単量体としては、例えばジメチルアミノエチル（メタ）アクリレート四級塩化物、ジエチルアミノエチル（メタ）アクリレート四級塩化物、メチルエチルアミノエチル（メタ）アクリレート四級塩化物、ｐ−ジメチルアミノスチレン四級塩化物、及びｐ−ジエチルアミノスチレン四級塩化物等が挙げられ、ジメチルアミノエチルメタクリレート四級塩化物が好適に用いられる。   As the antistatic agent, for example, a quaternary amine salt monomer is preferably used. Examples of the quaternary amine salt monomer include dimethylaminoethyl (meth) acrylate quaternary chloride, diethylaminoethyl (meth) acrylate quaternary chloride, methylethylaminoethyl (meth) acrylate quaternary chloride, p-dimethyl. Examples thereof include aminostyrene quaternary chloride and p-diethylaminostyrene quaternary chloride, and dimethylaminoethyl methacrylate quaternary chloride is preferably used.

基材フィルム１０６の表面には、ブロッキング防止等の目的で滑剤を塗布してよい。滑剤は基材フィルム中に３０質量％を上限として練り込んでもよい。滑剤としては、特に限定されないが、例えばシリコーン樹脂や（変性）シリコーン油等のシリコーン化合物、フッ素樹脂、六方晶ボロンナイトライド、カーボンブラック、及び二硫化モリブデン等が挙げられる。電子部品の製造はクリーンルームで行なわれるため、滑剤としてシリコーン化合物又はフッ素樹脂を用いることが好ましい。シリコーン化合物の中でも特にシリコーングラフと単量体を有する共重合体は帯電防止層との相溶性が良いため、好適に用いられる。   A lubricant may be applied to the surface of the base film 106 for the purpose of preventing blocking or the like. The lubricant may be kneaded in the base film up to 30% by mass. The lubricant is not particularly limited, and examples thereof include silicone compounds such as silicone resins and (modified) silicone oils, fluororesins, hexagonal boron nitride, carbon black, and molybdenum disulfide. Since electronic parts are manufactured in a clean room, it is preferable to use a silicone compound or a fluororesin as a lubricant. Among silicone compounds, a copolymer having a silicone graph and a monomer is preferably used because of its good compatibility with the antistatic layer.

滑剤及び帯電防止剤の基材への用い方は特に限定されないが、例えば一方の面に粘着剤が塗布された基材フィルムの他方の面に積層してもよく、基材を構成する樹脂を作製する際に添加しても良い。   The method of using the lubricant and the antistatic agent on the base material is not particularly limited. For example, the lubricant may be laminated on the other surface of the base film coated with an adhesive on one surface, and the resin constituting the base material may be used. You may add when producing.

（粘着剤層）
粘着剤層１０３を形成する粘着剤としては、従来のダイシング用粘着シートに採用される粘着剤、例えば、アクリル酸、メタクリル酸及びそれらのエステルモノマーを重合させたポリマーの他、これらモノマーと共重合可能な不飽和単量体（例えば、酢酸ビニル、スチレン、アクリロニトリル）とを共重合させたコポリマーが用いられる。この粘着剤としては、これら粘着剤のうち、（メタ）アクリル酸エステル共重合体が好ましい。粘着剤層１０３には、紫外線又は放射線のいずれか又は照射によって三次元網状化しうる分子内に光重合性炭素−炭素二重結合を分子内に少なくとも２個以上有する低分子量化合物、たとえば公知のアクリレート化合物又はウレタンアクリレートオリゴマ等を用いた光硬化型感圧性粘着剤も採用できる。 (Adhesive layer)
As the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer 103, a pressure-sensitive adhesive employed in a conventional pressure-sensitive adhesive sheet for dicing, for example, a polymer obtained by polymerizing acrylic acid, methacrylic acid and ester monomers thereof, and copolymerization with these monomers Copolymers copolymerized with possible unsaturated monomers (eg, vinyl acetate, styrene, acrylonitrile) are used. Of these pressure-sensitive adhesives, (meth) acrylic acid ester copolymers are preferred as the pressure-sensitive adhesive. The pressure-sensitive adhesive layer 103 includes a low molecular weight compound having at least two photopolymerizable carbon-carbon double bonds in a molecule that can be formed into a three-dimensional network by irradiation with ultraviolet rays or radiation, such as a known acrylate. A photocurable pressure-sensitive adhesive using a compound, urethane acrylate oligomer or the like can also be employed.

（（メタ）アクリル酸エステル共重合体）
本発明で使用する（メタ）アクリル酸エステル共重合体は、特に限定されないが、（メタ）アクリル酸エステルの主単量体と、その他のビニル化合物単量体を共重合したものである。ビニル化合物単量体は、ヒドロキシル基、カルボキシル基、エポキシ基、アミド基、アミノ基、メチロール基、スルホン酸基、スルファミン酸基、及び（亜）リン酸エステル基からなる官能基群の１種以上を有する官能基含有単量体を用いることが好ましい。 ((Meth) acrylic acid ester copolymer)
The (meth) acrylic acid ester copolymer used in the present invention is not particularly limited, but is a copolymer of a main monomer of (meth) acrylic acid ester and another vinyl compound monomer. The vinyl compound monomer is one or more of a functional group consisting of a hydroxyl group, a carboxyl group, an epoxy group, an amide group, an amino group, a methylol group, a sulfonic acid group, a sulfamic acid group, and a (phosphite) ester group. It is preferable to use a functional group-containing monomer having

（メタ）アクリル酸エステルの主単量体としては、例えばブチル（メタ）アクリレート、２−ブチル（メタ）アクリレート、ｔ−ブチル（メタ）アクリレート、ペンチル（メタ）アクリレート、オクチル（メタ）アクリレート、２−エチルヘキシル（メタ）アクリレート、ノニル（メタ）アクリレート、デシル（メタ）アクリレート、ラウリル（メタ）アクリレート、メチル（メタ）アクリレート、エチル（メタ）アクリレート、イソプロピル（メタ）アクリレート、トリデシル（メタ）アクリレート、ミリスチル（メタ）アクリレート、セチル（メタ）アクリレート、ステアリル（メタ）アクリレート、シクロヘキシル（メタ）アクリレート、イソボロニル（メタ）アクリレート、ジシクロペンタニル（メタ）アクリレート、ベンジル（メタ）アクリレート、メトキシエチル（メタ）アクリレート、エトキシエチル（メタ）アクリレート、ブトキシメチル（メタ）アクリレート、及びエトキシ−ｎ−プロピル（メタ）アクリレート等が挙げられる。   As the main monomer of (meth) acrylic acid ester, for example, butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, octyl (meth) acrylate, 2 -Ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, tridecyl (meth) acrylate, myristyl (Meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, benzyl (meth) ) Acrylate, methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, butoxymethyl (meth) acrylate, and ethoxy -n- propyl (meth) acrylate.

官能基含有単量体としては、例えば官能基としてヒドロキシル基、カルボキシル基、エポキシ基、アミド基、アミノ基、メチロール基、スルホン酸基、スルファミン酸基、（亜）リン酸エステル基を有するビニル化合物が挙げられる。   As a functional group-containing monomer, for example, a vinyl compound having a hydroxyl group, a carboxyl group, an epoxy group, an amide group, an amino group, a methylol group, a sulfonic acid group, a sulfamic acid group, or a (sub) phosphate group as a functional group Is mentioned.

ヒドロキシル基を有する単量体としては、例えば２−ヒドロキシエチル（メタ）アクリレート、２−ヒドロキシプロピル（メタ）アクリレート、及び２−ヒドロキシブチル（メタ）アクリレート等が挙げられる。   Examples of the monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate.

カルボキシル基を有する単量体としては、例えば（メタ）アクリル酸、クロトン酸、マレイン酸、無水マレイン酸、イタコン酸、フマール酸、アクリルアミドＮ−グリコール酸、及びケイ皮酸等が挙げられる。   Examples of the monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid.

エポキシ基を有する単量体としては、例えばアリルグリシジルエーテル、及び（メタ）アクリル酸グリシジルエーテル等が挙げられる。   Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth) acrylic acid glycidyl ether.

アミド基を有する単量体としては、例えば（メタ）アクリルアミド等が挙げられる。   Examples of the monomer having an amide group include (meth) acrylamide.

アミノ基を有する単量体としては、例えばＮ，Ｎ−ジメチルアミノエチル（メタ）アクリレート等が挙げられる。   Examples of the monomer having an amino group include N, N-dimethylaminoethyl (meth) acrylate.

メチロール基を有する単量体としては、例えばＮ−メチロールアクリルアミド等が挙げられる。   Examples of the monomer having a methylol group include N-methylolacrylamide.

（メタ）アクリル酸エステル共重合体の製造方法は、乳化重合、溶液重合等の公知の方法が使用できる。ダイアタッチフィルムとの相互作用により放射線照射後に粘着シートがダイアタッチフィルムと容易に剥離できるように、乳化重合により製造できるアクリルゴムが好ましい。   As a method for producing the (meth) acrylic acid ester copolymer, known methods such as emulsion polymerization and solution polymerization can be used. Acrylic rubber that can be produced by emulsion polymerization is preferred so that the pressure-sensitive adhesive sheet can be easily peeled off from the die attach film after irradiation by irradiation with the die attach film.

（多官能イソシアネート硬化剤）
多官能イソシアネート硬化剤はイソシアネート基を２個以上有する点以外に特に限定されず、例えば芳香族ポリイソシアネート、脂肪族ポリイソシアネート、脂環族ポリイソシアネート等が挙げられる。 (Multifunctional isocyanate curing agent)
The polyfunctional isocyanate curing agent is not particularly limited except that it has two or more isocyanate groups, and examples thereof include aromatic polyisocyanates, aliphatic polyisocyanates, and alicyclic polyisocyanates.

芳香族ポリイソシアネートは特に限定されず、例えば１，３−フェニレンジイソシアネート、４，４’−ジフェニルジイソシアネート、１，４−フェニレンジイソシアネート、４，４’−ジフェニルメタンジイソシアネート、２，４−トリレンジイソシアネート、２，６−トリレンジイソシアネート、４，４’−トルイジンジイソシアネート、２，４，６−トリイソシアネートトルエン、１，３，５−トリイソシアネートベンゼン、ジアニシジンジイソシアネート、４，４’−ジフェニルエーテルジイソシアネート、４，４’，４”−トリフェニルメタントリイソシアネート、ω，ω’−ジイソシアネート−１，３−ジメチルベンゼン、ω，ω’−ジイソシアネート−１，４−ジメチルベンゼン、ω，ω’−ジイソシアネート−１，４−ジエチルベンゼン、１，４−テトラメチルキシリレンジイソシアネート、及び１，３−テトラメチルキシリレンジイソシアネート等が挙げられる。   The aromatic polyisocyanate is not particularly limited, and for example, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2 , 6-tolylene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4 ', 4 "-triphenylmethane triisocyanate, ω, ω'-diisocyanate-1,3-dimethylbenzene, ω, ω'-diisocyanate-1,4-dimethylbenzene, ω, ω'-diisocyanate-1,4- Diethyl Benzene, 1,4-tetramethylxylylene diisocyanate, and 1,3-tetramethylxylylene diisocyanate and the like.

脂肪族ポリイソシアネートは特に限定されず、例えばトリメチレンジイソシアネート、テトラメチレンジイソシアネート、ヘキサメチレンジイソシアネート、ペンタメチレンジイソシアネート、１，２−プロピレンジイソシアネート、２，３−ブチレンジイソシアネート、１，３−ブチレンジイソシアネート、ドデカメチレンジイソシアネート、及び２，４，４−トリメチルヘキサメチレンジイソシアネート等が挙げられる。   The aliphatic polyisocyanate is not particularly limited. For example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene. Examples thereof include diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate.

脂環族ポリイソシアネートは特に限定されず、例えば３−イソシアネートメチル−３，５，５−トリメチルシクロヘキシルイソシアネート、１，３−シクロペンタンジイソシアネート、１，３−シクロヘキサンジイソシアネート、１，４−シクロヘキサンジイソシアネート、メチル−２，４−シクロヘキサンジイソシアネート、メチル−２，６−シクロヘキサンジイソシアネート、４，４’−メチレンビス（シクロヘキシルイソシアネート）、１，４−ビス（イソシアネートメチル）シクロヘキサン、及び１，４−ビス（イソシアネートメチル）シクロヘキサン等が挙げられる。   The alicyclic polyisocyanate is not particularly limited. For example, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl -2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylenebis (cyclohexyl isocyanate), 1,4-bis (isocyanatomethyl) cyclohexane, and 1,4-bis (isocyanatomethyl) cyclohexane Etc.

ポリイソシアネートのうち、１，３−フェニレンジイソシアネート、４，４’−ジフェニルジイソシアネート、１，４−フェニレンジイソシアネート、４，４’−ジフェニルメタンジイソシアネート、２，４−トリレンジイソシアネート、２，６−トリレンジイソシアネート、４，４’−トルイジンジイソシアネート、ヘキサメチレンジイソシアネートが好適に用いられる。   Among polyisocyanates, 1,3-phenylene diisocyanate, 4,4'-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate 4,4'-toluidine diisocyanate and hexamethylene diisocyanate are preferably used.

多官能イソシアネート硬化剤の配合比は（（メタ）アクリル酸エステル共重合体）１００質量部に対して０．１質量部以上２０質量部以下が好ましく、下限としては０．５質量部以上、上限としては１０質量部以下がより好ましい。多官能イソシアネート硬化剤が０．１質量部以上であれば、粘着力が強すぎないので、ピックアップ不良の発生を抑制することができる。また、多官能イソシアネート硬化剤が２０質量部以下であれば、粘着力が低下せず、ダイシング時に粘着シートとリングフレームの間の保持性が維持されるので、ダイシング作業中に粘着シートとリングフレームが剥離しにくくなる。   The blending ratio of the polyfunctional isocyanate curing agent is preferably 0.1 parts by mass or more and 20 parts by mass or less with respect to 100 parts by mass ((meth) acrylic acid ester copolymer), and the lower limit is 0.5 parts by mass or more and the upper limit. Is more preferably 10 parts by mass or less. If the polyfunctional isocyanate curing agent is 0.1 part by mass or more, the adhesive force is not too strong, and hence the occurrence of pickup failure can be suppressed. Also, if the polyfunctional isocyanate curing agent is 20 parts by mass or less, the adhesive strength does not decrease and the retainability between the adhesive sheet and the ring frame is maintained during dicing, so the adhesive sheet and ring frame during dicing work Becomes difficult to peel.

（ビニル基を４個以上有するウレタンアクリレートオリゴマ）
ビニル基を４個以上有するウレタンアクリレートオリゴマ（以下、単に「ウレタンアクリレートオリゴマ」という。）とは、ビニル基を４個以上有し、分子内にウレタン結合を有する（メタ）アクリレートオリゴマであれば特に限定されない。 (Urethane acrylate oligomers with 4 or more vinyl groups)
A urethane acrylate oligomer having 4 or more vinyl groups (hereinafter simply referred to as “urethane acrylate oligomer”) is a (meth) acrylate oligomer having 4 or more vinyl groups and having a urethane bond in the molecule. It is not limited.

ウレタンアクリレートオリゴマの製造方法は特に限定されないが、例えば水酸基と複数の（メタ）アクリレート基を含有する（メタ）アクリレート化合物と、複数のイソシアネート基を有する化合物（例えばジイソシアネート化合物）を反応させてウレタンアクリレートオリゴマとする方法が挙げられる。複数の水酸基末端を有するポリオールオリゴマに、複数のイソシアネート基を有する化合物（例えばジイソシアネート化合物）を過剰に添加して反応させて複数のイソシアネート末端を有するオリゴマとし、更に水酸基と複数の（メタ）アクリレート基を含有する（メタ）アクリレート化合物と反応させてウレタンアクリレートオリゴマとしてもよい。   The method for producing the urethane acrylate oligomer is not particularly limited. For example, a urethane acrylate is prepared by reacting a (meth) acrylate compound containing a hydroxyl group and a plurality of (meth) acrylate groups with a compound having a plurality of isocyanate groups (for example, a diisocyanate compound). An example is an oligomer method. A compound having a plurality of isocyanate groups (for example, a diisocyanate compound) is added to and reacted with a polyol oligomer having a plurality of hydroxyl ends to form an oligomer having a plurality of isocyanate ends, and further a hydroxyl group and a plurality of (meth) acrylate groups. It is good also as a urethane acrylate oligomer by making it react with the (meth) acrylate compound containing this.

水酸基と複数の（メタ）アクリレート基を含有する（メタ）アクリレート化合物としては、例えば、ヒドロキシプロピル化トリメチロールプロパントリアクリレート、ペンタエリスリトールトリアクリレート、ジペンタエリスリトール−ヒドロキシ−ペンタアクリレート、ビス（ペンタエリスリトール）−テトラアクリレート、テトラメチロールメタン−トリアクリレート、グリシドール−ジアクリレートや、これらのアクリレート基の一部又は全部をメタアクリレート基とした化合物等が挙げられる。   Examples of the (meth) acrylate compound containing a hydroxyl group and a plurality of (meth) acrylate groups include hydroxypropylated trimethylolpropane triacrylate, pentaerythritol triacrylate, dipentaerythritol-hydroxy-pentaacrylate, and bis (pentaerythritol). -Tetraacrylate, tetramethylolmethane-triacrylate, glycidol-diacrylate, and compounds having a methacrylate group as a part or all of these acrylate groups.

複数のイソシアネート基を有するイソシアネートとしては、例えば、芳香族イソシアネート、脂環族イソシアネート、及び脂肪族イソシアネート等が挙げられる。これらのイソシアネートのうち、複数のイソシアネート基を有する、芳香族イソシアネート又は脂環族イソシアネートが好適に用いられる。イソシアネート成分の形態としては単量体、二量体、三量体があり、三量体が好適に用いられる。   Examples of the isocyanate having a plurality of isocyanate groups include aromatic isocyanate, alicyclic isocyanate, and aliphatic isocyanate. Of these isocyanates, aromatic isocyanates or alicyclic isocyanates having a plurality of isocyanate groups are preferably used. As the form of the isocyanate component, there are a monomer, a dimer, and a trimer, and a trimer is preferably used.

芳香族ジイソシアネートとしては、例えば、トリレンジイソシアネート、４，４−ジフェニルメタンジイソシアネート、キシリレンジイソシアネートなどがある。   Examples of the aromatic diisocyanate include tolylene diisocyanate, 4,4-diphenylmethane diisocyanate, and xylylene diisocyanate.

脂環族ジイソシアネートとしては、例えば、イソホロンジイソシアネート、メチレンビス（４−シクロヘキシルイソシアネート）などが挙げられる。   Examples of the alicyclic diisocyanate include isophorone diisocyanate and methylene bis (4-cyclohexyl isocyanate).

脂肪ジイソシアネートとしては、例えば、ヘキサメチレンジイソシアネート、トリメチルヘキサメチレンジイソシアネート等が挙げられる。   Examples of the fatty diisocyanate include hexamethylene diisocyanate and trimethylhexamethylene diisocyanate.

ポリオール成分としては、例えば、ポリ（プロピレンオキサイド）ジオール、ポリ（プロピレンオキサイド）トリオール、コポリ（エチレンオキサイド−プロピレンオキサイド）ジオール、ポリ（テトラメチレンオキサイド）ジオール、エトキシ化ビスフェノールＡ、エトキシ化ビスフェノールＳスピログリコール、カプロラクトン変性ジオール、カーボネートジオール等が挙げられる。   Examples of the polyol component include poly (propylene oxide) diol, poly (propylene oxide) triol, copoly (ethylene oxide-propylene oxide) diol, poly (tetramethylene oxide) diol, ethoxylated bisphenol A, and ethoxylated bisphenol S spiroglycol. , Caprolactone-modified diol, carbonate diol and the like.

ビニル基を有するウレタンアクリレートオリゴマのビニル基の数が４個以上であれば、放射線照射後の粘着シートの接着剤硬化層からの剥離が容易なので、チップのピックアップ性を向上させることができる。   If the number of vinyl groups of the urethane acrylate oligomer having a vinyl group is 4 or more, it is easy to peel off the adhesive sheet after irradiation of the adhesive sheet from the adhesive-cured layer, so that the chip pickup property can be improved.

ビニル基を４個以上有するウレタンアクリレートオリゴマの配合量は特に限定されないが、（メタ）アクリル酸エステル共重合体１００質量部に対して２０質量部以上２００質量部以下とすることが好ましい。ビニル基を４個以上有するウレタンアクリレートオリゴマの配合量が２０質量部以上であれば、放射線照射後の粘着シートのダイアタッチフィルムからの剥離が容易となり、チップのピックアップ性の問題の発生を抑制することができる。また、ビニル基を４個以上有するウレタンアクリレートオリゴマの配合量が２００質量部以下であれば、ダイシング時に糊の掻き上げによりピックアップ不良が生じにくくなるとともに、反応残渣による微小な糊残りの発生を抑制できるため、ダイアタッチフィルムが付着したチップをリードフレーム上に搭載した際の加温時の接着不良の発生を抑制することができる。   Although the compounding quantity of the urethane acrylate oligomer which has 4 or more vinyl groups is not specifically limited, It is preferable to set it as 20 to 200 mass parts with respect to 100 mass parts of (meth) acrylic acid ester copolymers. If the compounding amount of the urethane acrylate oligomer having 4 or more vinyl groups is 20 parts by mass or more, the pressure-sensitive adhesive sheet after irradiation is easily peeled off from the die attach film, and the problem of chip pick-up property is suppressed. be able to. Also, if the blending amount of urethane acrylate oligomer having 4 or more vinyl groups is 200 parts by mass or less, pick-up is less likely to occur due to glue scraping during dicing, and the occurrence of minute glue residue due to reaction residues is suppressed. Therefore, it is possible to suppress the occurrence of adhesion failure during heating when the chip to which the die attach film is attached is mounted on the lead frame.

（ポリジメチルシロキサン結合を有するアクリル酸エステル系重合体）
ポリジメチルシロキサン結合を有するアクリル酸エステル系重合体は、（メタ）アクリル単量体とポリジメチルシロキサン結合の末端にビニル基を有する単量体（以下、「シリコーン系マクロモノマ」という）の重合物であり、ポリジメチルシロキサン結合の末端にビニル基を有する単量体に由来する単量体単位を有する点以外は特に限定されず、例えばシリコーン系マクロモノマのホモポリマーや、シリコーン系マクロモノマと他のビニル化合物を重合してなるビニル重合体が挙げられる。シリコーン系マクロモノマは、ポリジメチルシロキサン結合の末端が（メタ）アクリロイル基またはスチリル基等のビニル基となっている化合物が好適に用いられる（例えば、特開２０００−０８０１３５号公報等参照）。 (Acrylic acid ester polymer having polydimethylsiloxane bond)
The acrylic ester polymer having a polydimethylsiloxane bond is a polymer of a (meth) acrylic monomer and a monomer having a vinyl group at the end of the polydimethylsiloxane bond (hereinafter referred to as “silicone macromonomer”). Yes, with the exception of having a monomer unit derived from a monomer having a vinyl group at the end of a polydimethylsiloxane bond, such as a homopolymer of a silicone-based macromonomer or a silicone-based macromonomer and other vinyl compounds And vinyl polymers obtained by polymerizing. As the silicone-based macromonomer, a compound in which the terminal of the polydimethylsiloxane bond is a vinyl group such as a (meth) acryloyl group or a styryl group is preferably used (see, for example, JP-A-2000-080135).

（メタ）アクリル単量体としては、アルキル（メタ）アクリレートの他に、ヒドロキシアルキル（メタ）アクリレート、変性ヒドロキシ（メタ）アクリレート、及び（メタ）アクリル酸等が挙げられる。   Examples of the (meth) acrylic monomer include hydroxyalkyl (meth) acrylate, modified hydroxy (meth) acrylate, and (meth) acrylic acid in addition to alkyl (meth) acrylate.

アルキル（メタ）アクリレートとしては、例えばメチル（メタ）アクリレート、エチル（メタ）アクリレート、ｎ−プロピル（メタ）アクリレート、ｎ−ブチル（メタ）アクリレート、イソブチル（メタ）アクリレート、ｔ−ブチル（メタ）アクリレート、２−エチルヘキシル（メタ）アクリレート、ラウリル（メタ）アクリレート、ステアリル（メタ）アクリレート、及びイソボルニル（メタ）アクリレート、及びヒドロキシアルキル（メタ）アクリレート等が挙げられる。   Examples of the alkyl (meth) acrylate include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, and t-butyl (meth) acrylate. , 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, isobornyl (meth) acrylate, and hydroxyalkyl (meth) acrylate.

ヒドロキシアルキル（メタ）アクリレートとしては、例えばヒドロキシエチル（メタ）アクリレート、ヒドロキシプロピル（メタ）アクリレート、及びヒドロキシブチル（メタ）アクリレート等が挙げられる。   Examples of the hydroxyalkyl (meth) acrylate include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate.

変性ヒドロキシ（メタ）アクリレートとしては、例えばエチレンオキシド変性ヒドロキシ（メタ）アクリレート、及びラクトン変性ヒドロキシ（メタ）アクリレート等が挙げられる。   Examples of the modified hydroxy (meth) acrylate include ethylene oxide-modified hydroxy (meth) acrylate and lactone-modified hydroxy (meth) acrylate.

（メタ）アクリル酸を用いた場合、ポリジメチルシロキサン結合を有するアクリル酸エステル重合体を合成した後、エポキシ基を有するグリシジル（メタ）アクリレート等を用いアクリル酸と反応させ、ビニル基を有する重合物を得る。   When (meth) acrylic acid is used, an acrylic acid ester polymer having a polydimethylsiloxane bond is synthesized, and then reacted with acrylic acid using glycidyl (meth) acrylate having an epoxy group, and a polymer having a vinyl group Get.

パーティクルと呼ばれる微小な糊残りを防止するため、及び粘着シートとダイアタッチフィルムを積層した際にポリジメチルシロキサン結合を有するアクリル酸エステル系重合体のダイアタッチフィルムへのマイグレーションを防止するためには、反応性を有するヒドロキシアルキル（メタ）アクリレート、又は変性ヒドロキシ（メタ）アクリレート、及びビニル基を少なくとも一つ有するポリジメチルシロキサン結合を有するアクリル酸エステル重合体が好適に用いられる。   In order to prevent minute adhesive residue called particles and to prevent migration of acrylic acid ester polymer having polydimethylsiloxane bond to the die attach film when the adhesive sheet and the die attach film are laminated, A reactive hydroxyalkyl (meth) acrylate or modified hydroxy (meth) acrylate, and an acrylate polymer having a polydimethylsiloxane bond having at least one vinyl group are preferably used.

ポリジメチルシロキサン結合を有するアクリル酸エステル重合体のシリコーン系マクロモノマ単位の割合は特に限定されないが、ポリジメチルシロキサン結合を有するアクリル酸エステル系重合体１００質量部中、シリコーン系マクロモノマ単位を１５質量部以上５０質量部以下とすることが好ましい。シリコーン系マクロモノマ単位の含有量が１５質量部以上であれば、放射線照射後の粘着シートをダイアタッチフィルムから容易に剥離でき、チップのピックアップ性を向上させることができる。また、シリコーン系マクロモノマ単位の含有量が５０質量部以下であれば、粘着剤表面へのブリードアウトが抑制されるため、ダイアタッチフィルムが付着したチップをリードフレーム上に搭載した際の加温時に接着不良を抑制することができる。   The proportion of the silicone macromonomer unit in the acrylic ester polymer having a polydimethylsiloxane bond is not particularly limited, but in 100 parts by mass of the acrylic ester polymer having a polydimethylsiloxane bond, the silicone macromonomer unit is 15 parts by mass or more. The amount is preferably 50 parts by mass or less. When the content of the silicone-based macromonomer unit is 15 parts by mass or more, the pressure-sensitive adhesive sheet after irradiation can be easily peeled off from the die attach film, and the chip pickup property can be improved. Also, if the content of the silicone-based macromonomer unit is 50 parts by mass or less, bleeding out to the surface of the adhesive is suppressed, so during heating when the chip to which the die attach film is attached is mounted on the lead frame Adhesion failure can be suppressed.

ポリジメチルシロキサン結合を有するアクリル酸エステル重合体の配合量は特に限定されないが、（メタ）アクリル酸エステル重合体１００質量部に対して０．１質量部以上１０質量部以下とすることが好ましい。ポリジメチルシロキサン結合を有するアクリル酸エステル重合体の配合量が０．１質量部以上であれば、放射線照射後に粘着シートをダイアタッチフィルムから容易に剥離でき、チップのピックアップ性を向上させることができる。また、ポリジメチルシロキサン結合を有するアクリル酸エステル重合体の配合量が１０質量部以下であれば、初期の粘着力の低下が抑えられるため、ダイシング時にリングフレームからの剥離を抑制することができる。   Although the compounding quantity of the acrylate polymer which has a polydimethylsiloxane bond is not specifically limited, It is preferable to set it as 0.1 to 10 mass parts with respect to 100 mass parts of (meth) acrylic acid ester polymers. When the blending amount of the acrylate polymer having a polydimethylsiloxane bond is 0.1 parts by mass or more, the pressure-sensitive adhesive sheet can be easily peeled off from the die attach film after irradiation and the pickup property of the chip can be improved. . Moreover, since the fall of an initial stage adhesive force will be suppressed if the compounding quantity of the acrylic ester polymer which has a polydimethylsiloxane bond is 10 mass parts or less, peeling from a ring frame can be suppressed at the time of dicing.

粘着剤層１０３には、例えば、重合開始剤、軟化剤、老化防止剤、充填剤、紫外線吸収剤、及び光安定剤等の各種添加剤を添加してもよい。   For example, various additives such as a polymerization initiator, a softening agent, an antiaging agent, a filler, an ultraviolet absorber, and a light stabilizer may be added to the pressure-sensitive adhesive layer 103.

粘着剤層１０３の厚みは特に限定されるものではないが、一般に５μｍ以上１００μｍ以下程度であり、５μｍ以上４０μｍ以下程度であるのが好ましい。   The thickness of the pressure-sensitive adhesive layer 103 is not particularly limited, but is generally about 5 μm to 100 μm, preferably about 5 μm to 40 μm.

基材フィルム１０６上に粘着剤層１０３を形成して粘着シートとする方法は特に限定されず、例えばグラビアコーター、コンマコーター、バーコーター、ナイフコーター、又はロールコーター等のコーターで基材上に粘着剤を直接塗布する方法が挙げられる。凸版印刷、凹版印刷、平版印刷、フレキソ印刷、オフセット印刷、又はスクリーン印刷等で基材フィルム上に粘着剤層を印刷してもよい。   The method of forming the pressure-sensitive adhesive layer 103 on the base film 106 to form a pressure-sensitive adhesive sheet is not particularly limited. For example, the pressure-sensitive adhesive is adhered onto the base with a coater such as a gravure coater, comma coater, bar coater, knife coater, or roll coater. The method of apply | coating an agent directly is mentioned. The pressure-sensitive adhesive layer may be printed on the substrate film by letterpress printing, intaglio printing, planographic printing, flexographic printing, offset printing, screen printing, or the like.

（ダイアタッチフィルム）
ダイアタッチフィルム１０５は、粘着剤や接着剤をフィルム状に成形したものである。ダイアタッチフィルム１０５は、ＰＥＴ（ポリエチレンテレフタレート）樹脂等からなる剥離用フィルム等に接着剤や粘着剤を積層した状態で市販されており、接着剤や粘着剤を多層粘着シートに転写することができる。 (Die attach film)
The die attach film 105 is formed by forming a pressure-sensitive adhesive or an adhesive into a film shape. The die attach film 105 is commercially available in a state in which an adhesive or pressure-sensitive adhesive is laminated on a peeling film made of PET (polyethylene terephthalate) resin or the like, and can transfer the adhesive or pressure-sensitive adhesive to a multilayer pressure-sensitive adhesive sheet. .

ダイアタッチフィルム１０５の材質は、一般的に使用される粘着剤や接着剤の成分が用いられる。粘着剤としては、例えばエポキシ系、ポリアミド系、アクリル系、及びポリイミド系等が挙げられる。接着剤としては、例えばアクリル系、酢酸ビニル系、エチレン・酢酸ビニル共重合体系、エチレン・アクリル酸エステル共重合体系、ポリアミド系、ポリエチレン系、ポリスルホン系、エポキシ系、ポリイミド系、ポリアミド酸系、シリコーン系、フェノール系、ゴム系ポリマー、フッ素ゴム系ポリマー、及びフッ素樹脂等が挙げられる。   As the material of the die attach film 105, generally used adhesive or adhesive components are used. Examples of the adhesive include epoxy, polyamide, acrylic, and polyimide. Examples of adhesives include acrylic, vinyl acetate, ethylene / vinyl acetate copolymer, ethylene / acrylate ester copolymer, polyamide, polyethylene, polysulfone, epoxy, polyimide, polyamic acid, and silicone. , Phenolic, rubber-based polymer, fluororubber-based polymer, and fluororesin.

ダイアタッチフィルム１０５にはこれらの粘着剤や接着剤を混合物、共重合体、及び積層体等も使用することができる。ダイアタッチフィルムには、必要に応じて光重合開始剤、帯電防止剤、架橋促進剤等を添加してもよい。   For the die attach film 105, a mixture, a copolymer, a laminate, and the like of these pressure-sensitive adhesives and adhesives can also be used. You may add a photoinitiator, an antistatic agent, a crosslinking accelerator etc. to a die attach film as needed.

（粘着シート）
粘着シート１１０の粘着剤塗布面にダイアタッチフィルム１０５を貼り付け、多層粘着シート１００とする。多層粘着シート１００を電子部品の製造に使用する場合には、ダイアタッチフィルム１０５と粘着シート１１０の間の粘着強度を調整する必要があり、ダイアタッチフィルム１０５と粘着シート１１０の間の粘着強度が大きいとピックアップ不良が発生する場合があり、粘着力が小さいとチップ保持が低下すると同時に、粘着シート１１０とリングフレーム１０２が剥離しやすくなる場合があるため、０．０５〜０．９Ｎ／２０ｍｍに調整することが好ましい。 (Adhesive sheet)
A die attach film 105 is attached to the adhesive-coated surface of the adhesive sheet 110 to obtain a multilayer adhesive sheet 100. When the multilayer adhesive sheet 100 is used for manufacturing an electronic component, it is necessary to adjust the adhesive strength between the die attach film 105 and the adhesive sheet 110, and the adhesive strength between the die attach film 105 and the adhesive sheet 110 is adjusted. If it is large, pick-up failure may occur. If the adhesive force is small, the chip holding will be reduced and at the same time the adhesive sheet 110 and the ring frame 102 may be easily peeled, so 0.05 to 0.9 N / 20 mm. It is preferable to adjust.

（電子部品の製造方法）
多層粘着シート１００を使用した電子部品の製造方法は特に限定されないが、例えば、図１に示す次の手順が挙げられる。
（１）シリコンウエハ１０１を多層粘着シート１００に貼り付けて固定する貼付工程。
（２）多層粘着シート１００をリングフレーム１０２に固定する固定工程。
（３）ダイシングブレード１０４でシリコンウエハ１０１をダイシングするダイシング工程。
（４）多層粘着シート１００を放射状に拡大してダイチップ１０８間隔を広げた後、ダイチップ１０８をニードル等で突き上るエキスパンド工程。
（５）真空コレツト又はエアピンセット等でチップを吸着し、粘着剤層１０３とダイアタッチフィルム１０５との間で剥離し、ダイアタッチフィルム１０５が付着したダイチップ１０８をピックアップするピックアップ工程。
（６）ダイアタッチフィルム１０５が付着したダイチップ１０８をリードフレーム１１１上に搭載（マウント）する搭載工程。
（７）ダイアタッチフィルム１０５を加熱し、チップとリードフレーム１１１を加熱接着する加熱接着工程。
（８）リードフレーム１１１又は回路基板に搭載したダイチップ１０８を樹脂（不図示）でモールドするモールド工程。 (Method for manufacturing electronic parts)
Although the manufacturing method of the electronic component which uses the multilayer adhesive sheet 100 is not specifically limited, For example, the following procedure shown in FIG. 1 is mentioned.
(1) A sticking process in which the silicon wafer 101 is stuck to the multilayer adhesive sheet 100 and fixed.
(2) A fixing step of fixing the multilayer adhesive sheet 100 to the ring frame 102.
(3) A dicing step of dicing the silicon wafer 101 with the dicing blade 104.
(4) An expanding process in which the multilayer adhesive sheet 100 is radially expanded to widen the space between the die chips 108, and then the die chips 108 are pushed up with a needle or the like.
(5) A pick-up step of picking up the die chip 108 to which the die attach film 105 is adhered by adsorbing the chip with a vacuum collector or air tweezers, peeling between the adhesive layer 103 and the die attach film 105.
(6) A mounting step in which the die chip 108 to which the die attach film 105 is attached is mounted on the lead frame 111.
(7) A heat bonding process in which the die attach film 105 is heated and the chip and the lead frame 111 are heat bonded.
(8) A molding step of molding the die chip 108 mounted on the lead frame 111 or the circuit board with a resin (not shown).

この製造方法では、リードフレーム１１１の代わりに回路パターンを形成した回路基板等を用いてもよい。   In this manufacturing method, a circuit board or the like on which a circuit pattern is formed may be used instead of the lead frame 111.

＜作用効果＞
以下、本実施形態の多層粘着シート１００の作用効果について図１を参照しながら説明する。 <Effect>
Hereinafter, the effect of the multilayer adhesive sheet 100 of this embodiment is demonstrated, referring FIG.

本実施形態の多層粘着シート１００は、図１（１）に示すように、基材フィルム１０６と、該基材フィルムの一方の面に積層してなる粘着剤層１０３と、さらに該粘着剤層１０３に積層されたダイアタッチフィルム１０５と、を備え、該基材フィルム１０６がプロピレン系共重合体で形成されている。   As shown in FIG. 1 (1), the multilayer pressure-sensitive adhesive sheet 100 of this embodiment includes a base film 106, a pressure-sensitive adhesive layer 103 formed on one surface of the base film, and the pressure-sensitive adhesive layer. A die attach film 105 laminated on the substrate 103, and the base film 106 is formed of a propylene-based copolymer.

上記多層粘着シート１００は、半導体ウエハを切断する際に発生する切り屑を抑制することができるからである。   This is because the multilayer adhesive sheet 100 can suppress chips generated when the semiconductor wafer is cut.

また、本実施形態の多層粘着シート１００は、基材フィルム１０６がプロピレンと１−ブテンを重合成分として含有したものであることが好ましい。   Moreover, it is preferable that the multilayer adhesive sheet 100 of this embodiment is what the base film 106 contains a propylene and 1-butene as a polymerization component.

上記多層粘着シート１００は、柔軟性や弾力性等に優れるため、半導体ウエハを切断する際に発生する切り屑をさらに抑制することができるからである。   This is because the multilayer adhesive sheet 100 is excellent in flexibility, elasticity, and the like, and therefore can further suppress chips generated when the semiconductor wafer is cut.

また、本実施形態の多層粘着シート１００は、粘着剤層１０３が、（メタ）アクリル酸エステル１００質量部と、多官能イソシアネート硬化剤０．５質量部以上２０質量部以下とを含有するものであることが好ましい。   Moreover, as for the multilayer adhesive sheet 100 of this embodiment, the adhesive layer 103 contains 100 mass parts of (meth) acrylic acid ester, and 0.5 mass part or more and 20 mass parts or less of polyfunctional isocyanate hardening | curing agents. Preferably there is.

上記多層粘着シート１００は、粘着剤の粘着力や保持力に優れるため、ダイシング時の電子部品の飛散を防止することができる。さらに、粘着剤の凝集力に優れるため、電子部品側面への糊の掻き上げを防止することができる。   Since the multilayer pressure-sensitive adhesive sheet 100 is excellent in the pressure-sensitive adhesive strength and holding power of the pressure-sensitive adhesive, it is possible to prevent scattering of electronic components during dicing. Furthermore, since the cohesive force of the adhesive is excellent, it is possible to prevent the glue from being scraped up to the side surface of the electronic component.

また、本実施形態の多層粘着シート１００は、粘着剤層１０３が、（メタ）アクリル酸エステル共重合体１００質量部、多官能イソシアネート硬化剤０．５質量部以上２０質量部以下、ビニル基を４個以上有するウレタンアクリレートオリゴマ２０質量部以上２００質量部以下、及びポリジメチルシロキサン結合を有するアクリル酸エステル共重合体０．１質量部以上１０質量部以下、を含有するものであることが好ましい。   Further, in the multilayer pressure-sensitive adhesive sheet 100 of this embodiment, the pressure-sensitive adhesive layer 103 has a (meth) acrylic acid ester copolymer of 100 parts by mass, a polyfunctional isocyanate curing agent of 0.5 parts by mass to 20 parts by mass, and a vinyl group. It is preferable to contain 20 to 200 parts by mass of urethane acrylate oligomer having 4 or more and 0.1 to 10 parts by mass of acrylate copolymer having a polydimethylsiloxane bond.

上記多層粘着シート１００は、粘着剤の粘着力や保持力に優れるため、ダイシング時の電子部品の飛散を防止することができる。さらに、粘着剤の凝集力に優れるため、電子部品側面への糊の掻き上げやパーティクルと呼ばれるような微小な糊残りを防止することができる。   Since the multilayer pressure-sensitive adhesive sheet 100 is excellent in the pressure-sensitive adhesive strength and holding power of the pressure-sensitive adhesive, it is possible to prevent scattering of electronic components during dicing. Furthermore, since the pressure-sensitive adhesive has an excellent cohesive force, it is possible to prevent the adhesive from being scraped up to the side surface of the electronic component and the minute adhesive residue called particles.

また、本実施形態の電子部品の製造方法は、上記多層粘着シート１００を用いることが好ましい。   Moreover, it is preferable to use the said multilayer adhesive sheet 100 for the manufacturing method of the electronic component of this embodiment.

上記多層粘着シート１００は、上述した通り、ダイシング性等に優れるため、生産工程の合理化、又は電子部品の品質や生産性の向上を図ることができるからである。   This is because the multilayer pressure-sensitive adhesive sheet 100 is excellent in dicing properties and the like as described above, so that the production process can be rationalized or the quality and productivity of electronic components can be improved.

以下、本発明を実施例によりさらに説明するが、本発明はこれらに限定されるものではない。   EXAMPLES Hereinafter, although an Example demonstrates this invention further, this invention is not limited to these.

＜実験材料の調製＞
実施例に係る粘着シート、及び多層粘着シートは次の手順で製造した。
（基材フィルム）
プロピレン系共重合体Ａ：プロピレンとエチレン−プロピレンを重合成分として含有、ＭＦＲ（メルトフローレート、以下同じ）値０．９ｇ／１０分、密度０．８９ｇ／ｃｍ３、の市販品（サンアロマー社製、Ｑ３００Ｆ）を用いた。
プロピレン系共重合体Ｂ：プロピレンとエチレン−プロピレンを重合成分として含有、ＭＦＲ値２．５ｇ／１０分、密度０．８８ｇ／ｃｍ３、の市販品（サンアロマー社製、ＣＡ７３２０ＸＥＰ）を用いた。
プロピレン系共重合体Ｃ：プロピレンと１−ブテンを重合成分として含有、ＭＦＲ値７．５ｇ／１０分、密度０．８９ｇ／ｃｍ３、の市販品（サンアロマー社製、Ｘ５００Ｆ）を用いた。
エチレン系共重合体Ａ：エチレンと酢酸ビニルのランダム共重合体、ＭＦＲ値２．５ｇ／１０分、酢酸ビニル含有量１２％、密度０．９３ｇ／ｃｍ３、の市販品（三井デュポンポリケミカル社製）を用いた。
エチレン系共重合体Ｂ：エチレンとエチルアクリレートのランダム共重合体、ＭＦＲ値５ｇ／１０分、エチルアクリレート含有量９％、密度０．９２ｇ／ｃｍ３、の市販品（三井デュポンポリケミカル社製）を用いた。 <Preparation of experimental materials>
The pressure-sensitive adhesive sheet according to the example and the multilayer pressure-sensitive adhesive sheet were produced by the following procedure.
(Base film)
Propylene-based copolymer A: Commercially available product (manufactured by Sun Allomer Co., Ltd.) containing propylene and ethylene-propylene as polymerization components, MFR (melt flow rate, hereinafter the same) value 0.9 g / 10 min, density 0.89 g / cm 3 Q300F) was used.
Propylene-based copolymer B: A commercially available product (manufactured by Sun Allomer, CA7320XEP) containing propylene and ethylene-propylene as polymerization components, having an MFR value of 2.5 g / 10 min and a density of 0.88 g / cm 3 was used.
Propylene-based copolymer C: A commercially available product (X500F, manufactured by Sun Allomer Co., Ltd.) containing propylene and 1-butene as polymerization components and having an MFR value of 7.5 g / 10 min and a density of 0.89 g / cm 3 was used.
Ethylene copolymer A: Random copolymer of ethylene and vinyl acetate, MFR value 2.5 g / 10 min, vinyl acetate content 12%, density 0.93 g / cm 3 (Mitsui DuPont Polychemical Co., Ltd.) Made).
Ethylene copolymer B: Random copolymer of ethylene and ethyl acrylate, MFR value 5 g / 10 min, ethyl acrylate content 9%, density 0.92 g / cm 3 (commercially available from Mitsui DuPont Polychemical Co., Ltd.) Was used.

（粘着剤）
（メタ）アクリル酸エステル共重合体Ａ：２−エチルヘキシルアクリレート９５％、２−ヒドロキシエチルアクリレート５％の共重合体からなり、溶液重合により得られたもの（当社重合品）。
（メタ）アクリル酸エステル共重合体Ｂ：エチルアクリレート５４％、ブチルアクリレート１９％、メトキシエチルアクリレート２４％の共重合体からなり、懸濁重合により得られたもの（当社重合品）。
多官能イソシアネート硬化剤Ａ：２，４−トリレンジイソシアネートのトリメチロールプロパンアダクト体の市販品（日本ポリウレタン社製、製品名コロネートＬ−４５Ｅを用いた。
ウレタンアクリレートオリゴマＡ：ポリ（プロピレンオキサイド）ジオールの末端にヘキサメチレンジイソシアネート（脂肪族ジイソシアネート）の三量体を反応させてなる末端イソシアネートオリゴマに、更にジペタエリスリトールペンタアクリレートを反応させてなる末端アクリレートオリゴマであって、数平均分子量（Ｍｎ）が３，７００でアクリレート官能基数１５個のウレタンアクリレートオリゴマ（当社重合品）。
ウレタンアクリレートオリゴマＢ：ポリ（プロピレンオキサイド）ジオールの末端に２−ヒドロキシエチルアクリレートを反応させてなる末端イソシアネートオリゴマに、更に２−ヒドロキシエチルアクリレートを反応させてなる末端アクリレートオリゴマであって、数平均分子量（Ｍｎ）が３，４００、ビニル基数は１分子あたり２個のウレタンアクリレートオリゴマ（当社重合品）。
シリコーン変性アクリル樹脂Ａ：シリコーン分子鎖の末端に（メタ）アクリロイル基を有するシリコーン系オリゴマ、及びメチルメタアクリレート等からなるアクリルビニル単位を重合してなるシリコーン系グラフト共重合体の市販品（綜研化学社製、製品名アクトフローＵＴＭＭ−ＬＳ２）。 (Adhesive)
(Meth) acrylic acid ester copolymer A: a copolymer of 95% 2-ethylhexyl acrylate and 5% 2-hydroxyethyl acrylate, obtained by solution polymerization (our polymer).
(Meth) acrylic acid ester copolymer B: a copolymer of 54% ethyl acrylate, 19% butyl acrylate and 24% methoxyethyl acrylate, obtained by suspension polymerization (our polymer).
Multifunctional isocyanate curing agent A: Commercially available product of trimethylolpropane adduct of 2,4-tolylene diisocyanate (manufactured by Nippon Polyurethane Co., Ltd., product name Coronate L-45E was used.
Urethane acrylate oligomer A: terminal acrylate oligomer obtained by further reacting dipetaerythritol pentaacrylate with a terminal isocyanate oligomer obtained by reacting hexamethylene diisocyanate (aliphatic diisocyanate) trimer with poly (propylene oxide) diol. A urethane acrylate oligomer having a number average molecular weight (Mn) of 3,700 and 15 acrylate functional groups (our polymerized product).
Urethane acrylate oligomer B: a terminal acrylate oligomer obtained by further reacting 2-hydroxyethyl acrylate with a terminal isocyanate oligomer obtained by reacting 2-hydroxyethyl acrylate with the terminal of poly (propylene oxide) diol, and having a number average molecular weight (Mn) is 3,400 and the number of vinyl groups is 2 urethane acrylate oligomers per molecule (our polymerized product).
Silicone-modified acrylic resin A: Commercially available silicone graft copolymer obtained by polymerizing a silicone oligomer having a (meth) acryloyl group at the end of a silicone molecular chain and an acrylic vinyl unit composed of methyl methacrylate (Soken Chemical) Product name Act Flow UTMM-LS2).

光重合開始剤：ベンジルジメチルケタールからなる市販品（チバ・ジャパン社製、イルガキュア６５１）を用いた。
ダイアタッチフィルムＡ：ポリイミド接着剤を主体とし、厚さ３０μｍからなる市販品を用いた。 Photopolymerization initiator: A commercially available product (Irgacure 651, manufactured by Ciba Japan Co., Ltd.) consisting of benzyl dimethyl ketal was used.
Die attach film A: A commercially available product composed mainly of polyimide adhesive and having a thickness of 30 μm was used.

（粘着シート）
基材フィルムは、プロピレン系共重合体ＡをＴダイ押出しにより、１００μｍに成膜したものである。粘着剤層は、（メタ）アクリル酸エステル共重合体Ａ１００質量部、イソシアネート硬化剤Ａ３質量部を配合したものである。粘着剤は、（メタ）アクリル酸エステル共重合体Ａ１００質量部、イソシアネート硬化剤Ａ３質量部を配合したものである。 (Adhesive sheet)
The base film is formed by forming a propylene copolymer A into a film of 100 μm by T-die extrusion. The pressure-sensitive adhesive layer is a blend of 100 parts by mass of (meth) acrylic acid ester copolymer A and 3 parts by mass of isocyanate curing agent A. The pressure-sensitive adhesive is a blend of 100 parts by weight of (meth) acrylic acid ester copolymer A and 3 parts by weight of isocyanate curing agent A.

粘着剤をＰＥＴセパレーターフィルム上に塗布し、乾燥後の粘着剤層の厚みが１０μｍとなるように塗工し、１００μｍの基材に積層し粘着シートを得た。   The pressure-sensitive adhesive was applied onto a PET separator film, applied so that the thickness of the pressure-sensitive adhesive layer after drying was 10 μm, and laminated on a 100 μm substrate to obtain a pressure-sensitive adhesive sheet.

（ダイアタッチフィルム一体型シート）
３０μｍ厚さのダイアタッチフィルムＡを６．２インチφの円形に切断し、粘着シートの粘着剤層上にラミネートして多層粘着シートとした。 (Die attach film integrated sheet)
A die attach film A having a thickness of 30 μm was cut into a 6.2-inch diameter circle and laminated on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet to obtain a multilayer pressure-sensitive adhesive sheet.

（電子部品集合体）
電子部品の製造には、ダミーの回路パターンを形成した直径６インチ×厚さ０．１ｍｍのシリコンウエハを用いた。シリコンウエハをダイアタッチフィルム上に設置した。 (Electronic component assembly)
For manufacturing electronic components, a silicon wafer having a diameter of 6 inches and a thickness of 0.1 mm formed with a dummy circuit pattern was used. A silicon wafer was placed on the die attach film.

粘着シートへの切り込み量は３０μｍとした。ダイシングは１０ｍｍ×１０ｍｍのチップサイズで行った。ダイシング装置はＤＩＳＣＯ社製 ＤＡＤ３４１を用いた。ダイシングブレードはＤＩＳＣＯ社製ＮＢＣ−ＺＨ２０５Ｏ−２７ＨＥＥＥを用いた。
ダイシングブレード形状 ：外径５５．５６ｍｍ、刃幅３５μｍ、内径１９．０５ｍｍ。
ダイシングブレード回転数 ：４０，０００ｒｐｍ。
ダイシングブレード送り速度：４０ｍｍ／秒。
切削水温度：２５℃。
切削水量 ：１．０Ｌ／分。 The amount of cut into the adhesive sheet was 30 μm. Dicing was performed with a chip size of 10 mm × 10 mm. A DAD341 manufactured by DISCO was used as the dicing apparatus. The dicing blade used was NBC-ZH205O-27HEEE manufactured by DISCO.
Dicing blade shape: outer diameter 55.56 mm, blade width 35 μm, inner diameter 19.05 mm.
Dicing blade rotation speed: 40,000 rpm.
Dicing blade feed rate: 40 mm / sec.
Cutting water temperature: 25 ° C.
Cutting water amount: 1.0 L / min.

ピックアップはニードルピンで突き上げた後、真空コレツトでチップを吸着し、粘着シートとダイアタッチフィルムとの間で剥離し、ダイアタッチフィルムが付着したチップを得た。ピックアップ装置はキャノンマシナリー社製 ＣＡＰ−３００IIを用いた。尚、粘着剤に光硬化型感圧性粘着剤を使用した実施例１０乃至２３の場合、ブラックライトで紫外線を１５０ｍＪ照射後、ピックアップを行なった。
ニードルピン形状 ：１５０μｍＲ。
ニードルピン突き上げ高さ：０．５ｍｍ。
エキスパンド量 ：５ｍｍ。 After picking up the pick-up with a needle pin, the chip was adsorbed with a vacuum collector and peeled off between the adhesive sheet and the die attach film to obtain a chip with the die attach film attached. As the pickup device, CAP-300II manufactured by Canon Machinery Co., Ltd. was used. In Examples 10 to 23, in which a photocurable pressure-sensitive adhesive was used as the adhesive, pick-up was performed after irradiating 150 mJ of ultraviolet light with a black light.
Needle pin shape: 150 μmR.
Needle pin push-up height: 0.5 mm.
Expand amount: 5 mm.

（粘着シートの評価方法）
ダイシングテープの切削性：半導体ウエハを前記条件にてダイシングした後に、半導体ウエハ上からダイシングラインを光学顕微鏡（倍率２００倍）で観察した。結果を表１及び表２に示す。
◎（優）：半導体ウエハ上に切削屑が付着していない。
○（良）：半導体ウエハ上に切削屑が殆ど付着していない。
×（不可）：半導体ウエハ上に付着していた。 (Evaluation method of adhesive sheet)
Cutting property of dicing tape: After the semiconductor wafer was diced under the above conditions, a dicing line was observed from above the semiconductor wafer with an optical microscope (magnification 200 times). The results are shown in Tables 1 and 2.
◎ (excellent): no cutting waste adheres to the semiconductor wafer.
○ (Good): Almost no cutting waste adheres to the semiconductor wafer.
X (impossible): It adhered on the semiconductor wafer.

ダイアタッチフィルムの切削性：半導体ウエハを前記条件にてダイシング、ピックアップした後に、ダイアタッチフィルム付きのチップ断面を光学顕微鏡（倍率１００倍）で観察した。結果を表１及び表２に示す。
◎（優）：ダイアタッチフィルムのバリの高さが３μｍ未満。
○（良）：ダイアタッチフィルムのバリの高さが３μｍ以上１０μｍ未満。
×（不可）：ダイアタッチフィルムのバリの高さが１０μｍ以上。 Cutting ability of die attach film: After the semiconductor wafer was diced and picked up under the above conditions, the cross section of the chip with the die attach film was observed with an optical microscope (magnification 100 times). The results are shown in Tables 1 and 2.
A (excellent): The height of the burr of the die attach film is less than 3 μm.
○ (Good): The height of the burr of the die attach film is 3 μm or more and less than 10 μm.
X (impossible): The height of the burr of the die attach film is 10 μm or more.

チップ保持：半導体ウエハを前記条件にてダイシングした際に、チップが粘着シートに保持されている数を評価した。結果を表１及び表２示す。
◎（優）：チップ飛びが５％未満。
○（良）：チップ飛びが５％以上１０％未満。
×（不可）：チップ飛びが１０％以上。 Chip holding: When the semiconductor wafer was diced under the above conditions, the number of chips held on the adhesive sheet was evaluated. Tables 1 and 2 show the results.
◎ (Excellent): Chip skipping is less than 5%.
○ (Good): Chip skipping is 5% or more and less than 10%.
X (impossible): Chip jump is 10% or more.

ピックアップ：半導体ウエハを前記条件にてダイシングした後、前記条件にてダイアタッチフィルムが付着した状態のチップをピックアップできた数を評価した。結果を表１及び表２に示す。
◎（優）：９５％以上のチップがピックアップできた。
○（良）：８０％以上９５％未満のチップがピックアップできた。
×（不可）：８０％未満のチップがピックアップできた。 Pickup: After the semiconductor wafer was diced under the above conditions, the number of chips with the die attach film attached under the above conditions was evaluated. The results are shown in Tables 1 and 2.
◎ (Excellent): More than 95% of chips could be picked up.
○ (good): 80% or more and less than 95% of chips could be picked up.
X (impossible): Less than 80% of chips could be picked up.

Figure 2011044444
Figure 2011044444

Figure 2011044444
Figure 2011044444

＜実験の考察＞
表１および表２に示した実験結果からわかるように、本発明に係る基材フィルムを用いた多層粘着シートは、ダイシングテープ切削性、ダイアタッチフィルム切削性に優れるとともに、ピックアップ作業時にダイアタッチフィルムと粘着剤層との剥離が容易である。 <Experimental considerations>
As can be seen from the experimental results shown in Table 1 and Table 2, the multilayer adhesive sheet using the base film according to the present invention is excellent in dicing tape machinability and die attach film machinability. And the pressure-sensitive adhesive layer can be easily peeled off.

以上、本発明の実施例に基づいて説明した。この実施例はあくまで例示であり、種々の変形例が可能なこと、またそうした変形例も本発明の範囲にあることは当業者に理解されるところである。   In the above, it demonstrated based on the Example of this invention. It is to be understood by those skilled in the art that this embodiment is merely an example, and that various modifications are possible and that such modifications are within the scope of the present invention.

本発明の多層粘着シートは、ダイシング時のダイシングテープ、及びダイアタッチフィルム由来の切削屑がなく、ダイシング時のチップ保持に優れ、更にダイシング時にリングフレームから外れにくく、ピックアップ作業時にチップの剥離が容易という効果を奏するため、粘着シートは、ダイシング後にチップ裏面にダイアタッチフィルム層を付けた状態でピックアップし、リードフレーム等にマウントして接着させる電子部品の製造方法に好適に用いられる。   The multilayer pressure-sensitive adhesive sheet of the present invention is free from cutting chips derived from a dicing tape and die attach film during dicing, has excellent chip retention during dicing, is not easily detached from the ring frame during dicing, and is easy to peel off during pick-up work In order to achieve the above effect, the pressure-sensitive adhesive sheet is suitably used for a method of manufacturing an electronic component that is picked up with a die attach film layer attached to the back surface of the chip after dicing, and mounted and bonded to a lead frame or the like.

本発明の一実施形態に係る多層粘着シートの構成を説明するための断面を示す概念図である。It is a conceptual diagram which shows the cross section for demonstrating the structure of the multilayer adhesive sheet which concerns on one Embodiment of this invention.

符号の説明Explanation of symbols

１００ 多層粘着シート
１０１ シリコンウエハ
１０２ リングフレーム
１０３ 粘着剤層
１０４ ダイシングブレード
１０７ 切り込み
１０５ ダイアタッチフィルム
１０６ 基材フィルム
１０８ ダイチップ
１１０ 粘着シート
１１１ リードフレーム DESCRIPTION OF SYMBOLS 100 Multilayer adhesive sheet 101 Silicon wafer 102 Ring frame 103 Adhesive layer 104 Dicing blade 107 Cut 105 Die attach film 106 Base film 108 Die chip 110 Adhesive sheet 111 Lead frame

Claims (5)

基材フィルムと、前記基材フィルムの一方の面に積層してなる粘着剤層と、さらに前記粘着剤層に積層されたダイアタッチフィルムと、を備え、前記基材フィルムがプロピレン系共重合体で形成されている多層粘着シート。   A base film, a pressure-sensitive adhesive layer laminated on one surface of the base film, and a die attach film laminated on the pressure-sensitive adhesive layer, wherein the base film is a propylene-based copolymer A multilayer adhesive sheet formed of 前記プロピレン系共重合体が、プロピレンと１−ブテンを重合成分として含有したものである請求項１に記載の多層粘着シート。   The multilayer pressure-sensitive adhesive sheet according to claim 1, wherein the propylene-based copolymer contains propylene and 1-butene as polymerization components. 前記粘着剤層が、（メタ）アクリル酸エステル共重合体１００質量部と、多官能イソシアネート硬化剤０．５質量部以上２０質量部以下と、を含有することを特徴とする請求項１又は２のいずれかに記載の多層粘着シート。   The pressure-sensitive adhesive layer contains 100 parts by weight of a (meth) acrylic acid ester copolymer and 0.5 parts by weight or more and 20 parts by weight or less of a polyfunctional isocyanate curing agent. A multilayer pressure-sensitive adhesive sheet according to any one of the above. 前記粘着剤層が、（メタ）アクリル酸エステル共重合体１００質量部、多官能イソシアネート硬化剤０．５質量部以上２０質量部以下、ビニル基を４個以上有するウレタンアクリレートオリゴマ２０質量部以上２００質量部以下、及びポリジメチルシロキサン結合を有するアクリル酸エステル共重合体０．１質量部以上１０質量部以下、を含有することを特徴とする請求項１又は２のいずれかに記載の多層粘着シート。   The pressure-sensitive adhesive layer is 100 parts by mass of a (meth) acrylic acid ester copolymer, 0.5 parts by mass or more and 20 parts by mass or less of a polyfunctional isocyanate curing agent, and 20 parts by mass or more of urethane acrylate oligomer having 4 or more vinyl groups. The multilayer pressure-sensitive adhesive sheet according to claim 1, comprising 0.1 part by mass or more and 10 parts by mass or less of an acrylic acid ester copolymer having a polydimethylsiloxane bond. . 請求項１乃至４のいずれか一項に記載の多層粘着シートを用いた電子部品の製造方法。   The manufacturing method of the electronic component using the multilayer adhesive sheet as described in any one of Claims 1 thru | or 4.
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