TW200927875A - Multilayer adhered sheet and method for producing electric member by using multilayer adhered sheet - Google Patents

Multilayer adhered sheet and method for producing electric member by using multilayer adhered sheet Download PDF

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Publication number
TW200927875A
TW200927875A TW097134069A TW97134069A TW200927875A TW 200927875 A TW200927875 A TW 200927875A TW 097134069 A TW097134069 A TW 097134069A TW 97134069 A TW97134069 A TW 97134069A TW 200927875 A TW200927875 A TW 200927875A
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Taiwan
Prior art keywords
acrylate
multilayer
meth
film
mass
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TW097134069A
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Chinese (zh)
Inventor
Takeshi Saito
Taro Inada
Tomomichi Takatsu
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Denki Kagaku Kogyo Kk
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Publication of TW200927875A publication Critical patent/TW200927875A/en

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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4833—Polyethers containing oxyethylene units
    • C08G18/4837—Polyethers containing oxyethylene units and other oxyalkylene units
    • C08G18/4845—Polyethers containing oxyethylene units and other oxyalkylene units containing oxypropylene or higher oxyalkylene end groups
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides a multilayer adhered sheet and a method for producing electric member by using multilayer adhered sheet. Provided is a multilayer adhered sheet, which comprises substrate film, adhering agent layer laminated on one surface of the said substrate film, die-attach film laminated on the adhering agent layer, wherein the said substrate film is made from acrylic copolymer; and also provided is a method for producing electric member by using the said multilayer adhered sheet. The multilayer adhered sheet of the present application has no dicing scrap form the dicing tape and die-attach tape in the case of dicing, has excellent chip stability in the case of dicing; furthermore provided is a method for producing electric member which is suitable to mount and adhere in the lead frame and the like, because of that the said multilayer adhered sheet has the effect of that hard to be removed out of the ring frame when dicing and ease to be peeled off when picking up treatment is carried out, therefore the said multilayer adhered sheet is picked up under the condition of the die-attach film layer adhered on the backside of chip after dicing.

Description

200927875 九、發明說明： 【發明所屬之技術領域】 本發明係關於多層黏著片及使用多層黏著片之電子構 件之製法。 【先前技術】 在電子構件之製法之一中，已知具有下述步驟之製 法：將晶圓或在絕緣基板上形成複數個電路圖案之電子構 件集合體貼附於黏著片之貼附步驟，將貼附之晶圓或電子 〇 構件集合體個個切斷並進行晶片化之切斷·分離步驟（切割 (dicing)步驟），將切斷之晶片從黏著片撿取（pick up)之撿 取步驟，在撿取之晶片底面塗布黏合劑後，藉由該黏合劑 將晶片固定於導線架（lead frame)等之固定步驟。 切斷步驟中，已知有將晶圓或電子構件集合體貼附於 黏著片，再將黏著片固定於環架（ring frame)後，切斷成一 個個晶片並分離（切割（dicing))之方法。 過去曾提出使用藉由在該製法所用之黏著片上積層附 Ο 模塊膠膜（die-attach film)，而兼具切割用之黏著片之機 能，及將晶片固定於導線架等之黏合劑之機能之黏著片（附 模塊膠膜一體成形片）之方法（參照專利文獻1、專利文獻 2)。藉由將附模塊膠膜一體成形片使用於電子構件之製 造，可省略切割後黏合劑之塗布步驟。 附模塊膠膜一體成形片，與使用黏合劑於晶片與導線 架之黏合之方法相較，在黏合劑部分之厚度控制及黏合劑 之擠出控制方面較優良。附模塊膠膜一體成形片可被利用 200927875 於晶片尺寸封裝（chip size package)、疊層封裝（stack package)、及系統級封裝（system-in-package)等之電子構件 等之製造。 [專利文獻1]日本特開2006-049509號公報 [專利文獻2]日本特開2007-246633號公報 【發明內容】 發明欲解決之課顆 然而’一般雖可使用聚乙烯系之樹脂組成物作爲附模 〇 塊膠膜一體成形片之基材，但在切割步驟中有發生來自基 材之切削屑及來自附模塊膠膜之切削屑之情形。 本發明爲鑑於上述情況，以提供可防止或減低切割步 驟時之切削屑的發生，高效率地進行可靠性高之切割步 驟，製造高品質之電子構件之技術爲目的。 解決課顆所用之丰段 依照本發明，提供一種多層黏著片，其具備基材膜、 積層在該基材膜之一表面之黏著劑層、及積層於該黏著劑 Ο 層之附模塊膠膜（die-attach film)，其中該基材膜爲由丙烯 系共聚物所形成的。 藉由將具上述構成之多層黏著片提供至切割步驟，可 抑制切割步驟時切削屑之發生，高效率地進行可靠性高之 切割處理，製造高品質之電子構件。再者’上述之多層黏 著片爲本發明之一態樣，使用本發明之多層黏著片之電子 構件之製法亦具有同樣之技術特徵，達到同樣之作用及效 果。 200927875 發明之效果 依照本發明，將上述構造之多層黏著片提供於切割步 驟，可抑制切割步驟時之切削屑之發生’高效率地進行可 靠性高之切割步驟，製造高品質之電子構件。其等之結果， 可試圖達到電子構件之可靠性提高’生產性之提高等。 【實施方式】 以下，對於本發明之多層黏著劑片，及使用多層黏著 片之電子構件之製法之實施形態詳細地說明。 0 〈術語之說明〉 本發明中，單體單元意指從單體而來之構造單元。本 說明書中之份及％，若無預先特別記載，係以質量爲基準。 本說明書中，（甲基）丙烯酸酯意指丙烯酸酯及甲基丙 烯酸酯之總稱。（甲基）丙烯酸等含有（甲基）之化合物等亦同 樣地爲名稱中具有「甲基」之化合物及不具有「甲基」之 化合物之總稱。 &lt;實施形態之槪要&gt; Φ 第1(1)圖爲說明本發明一實施形態之黏著片構造的斷 面之槪念圖。本實施形態之多層黏著片（附模塊膠膜一體成 形片）100,如第1(1)圖所示，具備基材膜106、在該基材膜 106上塗布下述黏著劑而成之黏著劑層103,及積層在該黏 著劑層1 03上之附模塊膠膜（die-attach film) 1 05。 其中，上述基材膜1 〇 6，與在該基材膜1 0 6上塗布下 述黏著劑而成之黏著劑層1 03合倂，稱爲黏著片1 1 0。亦 即，多層黏著片100具備黏著片110，以及積層在該黏著 200927875 片1 10之黏著劑層103側之附模塊膠膜105。 再者，上述基材膜106可由丙烯系共聚物形成。 &lt;基材膜&gt; 採用丙烯系共聚物做爲基材膜106之理由，係因 採用該丙烯系共聚物，可抑制切斷半導體晶圓時發生 削屑。該丙烯系共聚物，可列舉，例如，丙烯與其他 之無規共聚物，丙烯與其他成份之嵌段共聚物，丙烯 他成份之交互共聚物。其他成份可爲乙烯、1-丁烯、 ❹ 烯、：!-己烯、1-庚烯等α-烯烴，由至少2種以上α-烯 形成之共聚物，苯乙烯-二烯共聚物等。其中以1-丁烯 佳。藉此，特別能抑制將半導體晶圓切斷時所產生之 屑。 聚合丙烯系共聚物之方法，可列舉例如溶劑聚合 塊狀聚合法、氣相聚合法、逐次聚合方法等，然而以 階段製造丙烯單獨聚合物或丙烯與少量乙烯及/或α-之無規共聚物後，第二階段以下製造α-烯烴之單獨聚 ® 或丙烯與少量乙烯及/或（X-烯烴之無規共聚物之至少 段以上之逐次聚合方法爲較佳。 含有上述丙烯系共聚物之樹脂組成物中，除含有 丙烯系共聚物之外，在無損於本發明之目的之範圍內 可添加結晶核劑、陰離子性、陽離子性、非離子性或 子性之一般公知之抗靜電劑、紫外線吸收劑、滑劑、 防止劑、光安定劑、抗黏連劑（anti-blocking agent)、 活性劑、染料、顏料、難燃劑、充塡劑、石油樹脂等 藉由 之切 成份 與其 1-戊 烴所 爲較 切削 法、 第一 烯烴 合物 二階 上述 ，亦 兩離 氧化 界面 添加 200927875 劑。 對於基材膜106之成形方法並無特別限定’可爲例如 壓延（calendering)、T模頭押出、膨脹（inflation)及澆鑄 (casting)等 ° 爲使基材膜106之加工性提高，以在至少在基材膜106 之單面施行皴摺加工或壓紋加工形成凹凸爲較佳。就較佳 之面粗度而言，算術平均Ra値爲0.3μιη以上2.0μιη以下， 而以0.5μιη以上1·5μιη以下爲更佳。若面粗度爲0·3μιη以 © 上，則基材膜於製膜後基材容易回捲。又，若面粗度爲2.Ομπι 以下，由於無損視認性，可使切割時之加工精確度提高。 基材膜106之厚度並無特別限定，可爲50 μιη以上 250μιη以下，而以70μπι以上150μιη以下爲較佳。若基材 膜106之厚度爲50 μιη以上，延展時不易發生基材膜之斷 裂。又，若基材膜106之厚度爲250 μιη以下，切割處理半 導體晶圓時，有延展性優良之傾向。又，由於抑制重量增 力D，從成本性、作業性兩方面而言亦很實用。 Ο 多層黏著片100中，爲防止附模塊膠膜105剝離時之 帶電，亦可在基材膜106之單面或兩面塗布抗靜電劑，施 行抗靜電處理。 抗靜電劑，適合使用例如四級胺鹽單體。就四級胺鹽 單體而言，可列舉例如（甲基）丙烯酸二甲基胺基乙酯四級 氯化物、（甲基）丙烯酸二乙基胺基乙酯四級氯化物、（甲基） 丙烯酸甲基乙基胺基乙酯四級氯化物、對-二甲基胺基苯乙 烯四級氯化物、及對-二乙基胺基苯乙烯四級氯化物等，而 -10- 200927875 以甲基丙烯酸二甲基胺基乙酯四級氯化物爲較佳。 在基材膜106之表面，亦可塗布以防止黏連（blocking) 等爲目的之滑劑。滑劑以在基材膜中之上限爲3 0質量％之 方式摻入。對於滑劑並無特別限定，可爲例如聚矽氧樹脂 或（改質）聚矽氧油等聚矽氧化合物、氟樹脂、六方晶氮化 硼、碳黑及二硫化鉬等。電子構件之製造由於係在溫室中 進行，以使用聚矽氧化合物或氟樹脂做爲滑劑爲較佳。聚 矽氧化合物中，具有聚矽氧接枝及單體之共聚物由於與抗 〇 靜電層之相容性良好，所以特別適合使用。 對於將滑劑及抗靜電劑用於基材之方法並無特別限 定，例如可在一面塗布有黏著劑之基材膜之另一面積層， 亦可在製作構成基材之樹脂時添加。 (黏著劑層） 形成黏著劑層103之黏著劑，可使用先前切割用黏著 片中採用之黏著劑，例如除將丙烯酸、甲基丙烯酸及其等 之酯單體聚合之聚合物之外，亦可爲將此等單體與可共聚 Ο 合之不飽和單體（例如，醋酸乙酯、苯乙烯、丙烯腈）共聚 合之共聚物。做爲該黏著劑，在此等黏著劑中，以（甲基） 丙稀酸酯共聚物爲較佳。黏著劑層103中，亦可採用光硬 化型感壓性黏著劑，該光硬化型感壓性黏著劑係在藉由紫 外線或放射線之任一種照射而三次元網狀化之分子內，使 用至少具有2個以上分子內光聚合性碳-碳雙鍵之之低分子 量化合物，例如公知之丙烯酸酯化合物或胺基甲酸酯丙烯 酸酯寡聚物等。 -11- 200927875 ((甲基）丙烯酸酯共聚物） 對於本發明所使用之（甲基）丙烯酸酯共聚物無特別限 定，可爲將（甲基）丙烯酸酯之主單體與其他乙烯系化合物 單體共聚而成者。就乙烯系化合物單體而言，較佳使用具 有選自羥基、羧基、環氧基、醯胺基、胺基、羥甲基、磺 酸基、胺磺酸基、及（亞）磷酸酯基組成之官能基群之一種 以上的含官能基單體。 (甲基）丙烯酸酯之主單體，可列舉，例如，（甲基）丙烯 〇 酸丁酯、（甲基）丙烯酸2_丁酯、（甲基）丙烯酸第三丁酯、（甲 基）丙烯酸戊酯、（甲基）丙烯酸辛酯、（甲基）丙烯酸2-乙基 己酯、（甲基）丙烯酸壬酯、（甲基）丙烯酸癸酯、（甲基）丙烯 酸月桂酯、（甲基）丙烯酸甲酯、（甲基）丙烯酸乙酯、（甲基） 丙烯酸異丙酯、（甲基）丙烯酸十三烷酯、（甲基）丙烯酸肉萱 蔻酯、（甲基）丙烯酸鯨蠟酯、（甲基）丙烯酸硬脂酯、（甲基） 丙烯酸環己酯、（甲基）丙烯酸異冰片酯、（甲基）丙烯酸二環 戊酯、（甲基）丙烯酸苯甲酯、（甲基）丙烯酸甲氧基乙酯、（甲 G 基）丙烯酸乙氧基乙酯、（甲基）丙烯酸丁氧基甲酯、及（甲基） 丙烯酸乙氧基正丙酯等。 含有官能基之單體，可列舉如具有羥基、羧基、環氧 基、醯胺基、胺基、羥甲基、磺酸基、胺磺酸基、（亞）磷 酸酯基做爲官能基之乙烯系化合物。 具有羥基之單體，可列舉如（甲基）丙烯酸2 -羥基乙 酯、（甲基）丙烯酸2 -羥基丙酯及（甲基）丙烯酸2 -羥基丁醋 等。 -12- 200927875 具有羧基之單體，可列舉如（甲基）丙烯酸、丁烯酸、 馬來酸、馬來酸酐、衣康酸、富馬酸、丙烯醯胺基N-乙醇 酸及桂皮酸等。 具有環氧基之單體，可列舉如烯丙基縮水甘油基醚、 及（甲基）丙烯酸縮水甘油基醚等。 具有醯胺基之單體，可列舉如（甲基）丙烯醯胺等。 具有胺基之單體可列舉如（甲基）丙烯酸N，N-二甲基胺 基乙酯等。 ❹ 具有羥甲基之單體，可列舉如N-羥甲基丙烯醯胺等。 (甲基）丙烯酸酯共聚物之製法，可使用乳化聚合、溶 液聚合等公知之方法。爲了經由與附模塊膠膜之相互作 用，於放射線照射後黏著片容易從附模塊膠膜剝離，以可 藉由乳化聚合製造之丙烯酸系橡膠爲較佳。 (多官能異氰酸酯硬化劑） 多官能異氰酸酯硬化劑除具有2個以上異氰酸酯基之 點以外，並無特別限制，可爲例如芳香族聚異氰酸酯、脂 〇 肪族聚異氰酸酯、脂環族聚異氰酸酯等。 對於芳香族聚異氰酸酯並無特別限定，可爲例如1，3 -苯二異氰酸酯、4,4’-二苯基二異氰酸酯、1，4-苯二異氰酸 酯、4,4’-二苯基甲烷二異氰酸酯、2,4 -甲苯二異氰酸酯、 2,6-甲苯二異氰酸酯、4,4’-甲苯胺二異氰酸酯、2,4,6-三異 氰酸基甲苯、1，3,5-三異氰酸基苯、聯茴香胺二異氰酸酯、 4,4’-二苯基醚二異氰酸酯、4,4’，4”-三苯基甲烷三異氰酸 酯、（〇，ω’-二異氰酸基-1，3 -二甲基苯、ω,ω’-二異氰酸基- i，4- 200927875 二甲基苯、ω，ω’-二異氰酸基-1，4-二乙基苯、1，4-四甲基二 甲苯二異氰酸酯、及1，3-四甲基二甲苯二異氰酸酯等。 對於脂肪族聚異氰酸酯並無特別限定，可列舉如1 Ξ亞 甲基二異氰酸酯、四亞甲基二異氰酸酯、六亞甲基二異氰 酸酯、五亞甲基二異氰酸酯、1，2-伸丙基二異氰酸醋' 2,3· 伸丁基二異氰酸酯、1，3-伸丁基二異氰酸酯、十二亞甲基 二異氰酸酯、及2,4,4-三甲基六亞甲基二異氰酸酯等。 對於脂環族聚異氰酸酯並無特別限定’可列舉如3 -異 © 氰酸基甲基-3,5，5-三甲基環己基異氰酸酯、1,3-環戊院二異 氰酸酯、1,3-環己烷二異氰酸酯、1，4-環己烷二異氰酸醋、 甲基-2,4-環己烷二異氰酸酯、甲基-2,6-環己院二異氰酸 酯、4,4，-亞甲基雙（環己基異氰酸酯）、1，4_雙（異氰酸基甲 基）環己烷、及1，4_雙（異氰酸基甲基）環己烷等。 聚異氰酸酯中’以使用1，3 -苯二異氰酸酯、4,4二苯 基二異氰酸酯、丨，4·苯二異氰酸酯、4,4’-二苯基甲院二異 氨酸醋、2,4 -甲苯一·異氯酸醋、2,6 -甲苯_•異氨酸醋、4,4’-〇 甲苯胺二異氰酸酯、六亞甲基二異氰酸酯爲較佳。 多官能異氰酸酯硬化劑之摻混比，相對於（（甲基）丙烯 酸酯共聚物）ι〇〇質量份而言’較佳爲ο·1質量份以上20質 量份以下，其中以下限爲〇.5質量份以上’上限爲10質量 份以下爲更佳。若多官能異氰酸酯硬化劑爲0·1質量份以 上，由於黏著力不會過強’可抑制撿取（Pick up)不良之發 生。又，若多官能異氰酸酯硬化劑爲20質量份以下’由於 黏著力不會降低’可維持切割時黏著片與環架（ring frame) -14- 200927875 間之保持性’切割作業中黏著片與環架變得不易剝離。 (具有4個以上乙烯基之胺基甲酸酯丙烯酸酯寡聚物） 具有4個以上乙烯基之胺基甲酸酯丙烯酸酯寡聚物（以 下’簡稱爲「胺基甲酸酯丙烯酸酯寡聚物」）只要爲具有4 個以上乙烯基’分子內具有胺基甲酸酯鍵之（甲基）丙烯酸 酯寡聚物即可’並無特別限制。 對於胺基甲酸酯丙烯酸酯寡聚物之製法雖無特別限 定’可列舉如使含有羥基及複數個（甲基）丙烯酸酯基之（甲 〇 基）丙烯酸酯化合物與具有複數個異氰酸酯基之化合物（例 如二異氰酸酯化合物）反應，形成胺基甲酸酯丙烯酸酯寡聚 物之方法。亦可在具有複數個羥基末端之多元醇寡聚物 中，過剩地添加具有複數個異氰酸酯基之化合物（例如二異 氰酸酯化合物），使其反應，形成具有複數個異氰酸酯基末 端之寡聚物，再與含有羥基及複數個（甲基）丙烯酸酯基之 (甲基）丙烯酸酯化合物反應，形成胺基甲酸酯丙烯酸酯寡 聚物。 Φ 就含有羥基及複數個（甲基）丙烯酸酯基之（甲基）丙烯 酸酯化合物而言，可列舉如羥丙基化羥甲基丙烷三丙烯酸 酯、季戊四醇三丙烯酸酯、二季戊四醇-羥基-五丙烯酸酯、 雙（季戊四醇）-四丙嫌酸醋、四經甲基甲院-三丙嫌酸酯、縮 水甘油-二丙烯酸酯，或此等丙烯酸酯基之一部分或全部換 成甲基丙烯酸酯基之化合物等。 就具有複數個異氰酸酯基之異氰酸酯而言’可列舉如 芳香族異氰酸酯、脂環族異氰酸酯及脂肪族異氰酸醋等° 200927875 此等異氰酸酯中，以使用具有複數個異氰酸醋基之芳香族. 異氰酸酯或脂環族異氰酸酯爲較佳。異氰酸酯成分之形態 有單體、二聚物、三聚物，而以使用三聚物爲較佳。 就芳香族二異氰酸酯而言，可列舉如甲苯二異氰酸 酯、4,4，-二苯基甲烷二異氰酸酯、二甲苯二異氰酸酯等。 就脂環族二異氰酸酯而言，可列舉如異佛爾酮二異氰 酸酯、亞甲基雙（4-環己基異氰酸酯）等。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a multilayer adhesive sheet and an electronic component using the multilayer adhesive sheet. [Prior Art] In one of the methods for manufacturing an electronic component, a method of attaching a wafer or an electronic component assembly in which a plurality of circuit patterns are formed on an insulating substrate to an adhesive sheet is known, and The attached wafer or the electronic crucible member assembly is cut and separated, and the wafer is cut and separated (dicing step), and the cut wafer is picked up from the adhesive sheet. In the step of applying a binder to the bottom surface of the captured wafer, the wafer is fixed to a lead frame or the like by the adhesive. In the cutting step, it is known that a wafer or an electronic component assembly is attached to an adhesive sheet, and the adhesive sheet is fixed to a ring frame, and then cut into individual wafers and separated (dicing). method. In the past, it has been proposed to use a die-attach film laminated on an adhesive sheet used in the method, and to function as an adhesive for cutting, and to fix a wafer to a lead frame or the like. A method of attaching an adhesive sheet (with a module-molded film integrally formed sheet) (see Patent Document 1 and Patent Document 2). The coating step of the post-cutting adhesive can be omitted by using the module-molded film integrally formed sheet for the manufacture of the electronic member. The integral molded piece with the module film is superior to the method of bonding the wafer to the lead frame by using the adhesive, and the thickness control of the adhesive portion and the extrusion control of the adhesive. The module-integrated molded sheet can be manufactured using 200927875 in electronic components such as a chip size package, a stack package, and a system-in-package. [Patent Document 1] JP-A-2006-049509 (Patent Document 2) Japanese Laid-Open Patent Publication No. 2007-246633. SUMMARY OF THE INVENTION The invention is intended to solve the problem. However, generally, a polyethylene-based resin composition can be used. The base material of the molded piece is integrally molded, but in the cutting step, there are cases where chips from the substrate and chips from the module film are generated. In view of the above, the present invention has been made in an effort to prevent or reduce the occurrence of chips during the cutting step, and to efficiently perform a highly reliable cutting step and to manufacture a high-quality electronic component. In order to solve the problem, in accordance with the present invention, there is provided a multilayer adhesive sheet comprising a base film, an adhesive layer laminated on one surface of the base film, and a module adhesive film laminated on the adhesive layer (die-attach film), wherein the substrate film is formed of a propylene-based copolymer. By providing the multilayer adhesive sheet having the above-described configuration to the cutting step, it is possible to suppress the occurrence of chips during the cutting step, efficiently perform the cutting process with high reliability, and manufacture a high-quality electronic component. Further, the above-mentioned multilayer adhesive sheet is one aspect of the present invention, and the method of manufacturing the electronic member using the multilayer adhesive sheet of the present invention has the same technical features to achieve the same effect and effect. According to the present invention, the multilayer adhesive sheet having the above-described structure is provided in the cutting step, and the occurrence of chips during the cutting step can be suppressed, and the high-reliability cutting step can be efficiently performed to manufacture a high-quality electronic member. As a result of this, it is possible to achieve an improvement in the reliability of the electronic component, an increase in productivity, and the like. [Embodiment] Hereinafter, embodiments of a method for producing a multilayer adhesive sheet of the present invention and an electronic member using a multilayer adhesive sheet will be described in detail. 0 <Description of Terms> In the present invention, a monomer unit means a structural unit derived from a monomer. The parts and % in this manual are based on quality unless otherwise specified. In the present specification, (meth) acrylate means a general term for acrylate and methacrylate. The (meth)-containing compound such as (meth)acrylic acid is also a generic term for a compound having a "methyl group" in the name and a compound having no "methyl group". &lt;Maintenance of the embodiment&gt; Φ Fig. 1(1) is a view illustrating a cut surface of the adhesive sheet structure according to the embodiment of the present invention. As shown in Fig. 1 (1), the multilayer adhesive sheet (molded film integrally formed sheet) 100 of the present embodiment includes a base film 106, and the following adhesive is applied to the base film 106. The agent layer 103, and a die-attach film 105 laminated on the adhesive layer 103. The base film 1 〇 6 is bonded to the adhesive layer 10 formed by applying the above-mentioned adhesive to the base film 106, and is referred to as an adhesive sheet 1 10 . That is, the multilayer adhesive sheet 100 is provided with an adhesive sheet 110, and a module adhesive film 105 laminated on the side of the adhesive layer 103 of the adhesive sheet 200927875. Further, the base film 106 may be formed of a propylene-based copolymer. &lt;Substrate film&gt; The reason why the propylene-based copolymer is used as the base film 106 is that the propylene-based copolymer can be used to suppress chipping when the semiconductor wafer is cut. The propylene-based copolymer may, for example, be a copolymer of propylene and other random copolymers, a block copolymer of propylene with other components, and an alternating copolymer of propylene. The other component may be an α-olefin such as ethylene, 1-butene, decene, :-hexene or 1-heptene, a copolymer formed of at least two or more α-olefins, a styrene-diene copolymer, or the like. . Among them, 1-butene is preferred. Thereby, it is possible to particularly suppress the generation of chips generated when the semiconductor wafer is cut. Examples of the method for polymerizing the propylene-based copolymer include a solvent-polymerized bulk polymerization method, a gas phase polymerization method, a sequential polymerization method, and the like, but a propylene single polymer or a random copolymer of propylene and a small amount of ethylene and/or α- is produced in stages. Thereafter, a sequential polymerization method of at least a part or more of a single poly- or propylene and a small amount of ethylene and/or (a random copolymer of X-olefin) for producing an α-olefin in the second stage or less is preferred. The above-mentioned propylene-based copolymer is preferably contained. In the resin composition, in addition to the propylene-based copolymer, a crystal nucleating agent, an anionic, cationic, nonionic or sub-organic generally known antistatic agent may be added to the extent that the object of the present invention is not impaired. UV absorbers, slip agents, anti-blocking agents, light stabilizers, anti-blocking agents, active agents, dyes, pigments, flame retardants, sputum agents, petroleum resins, etc. The 1-pentane hydrocarbon is a second step of the first method and the second olefin compound. The 200927875 agent is also added to the oxidation interface. The method for forming the substrate film 106 is not particularly limited. For example, calendering, T-die extrusion, inflation, and casting may be performed to improve the processability of the base film 106 to perform at least one side of the base film 106. It is preferable that the unevenness is formed by embossing, and the arithmetic mean Ra 値 is 0.3 μm or more and 2.0 μm or less, and more preferably 0.5 μm or more and 1.5 μm or less, and the surface roughness is 0. - When 3μιη is applied to the substrate, the substrate is easily rewinded after film formation. If the surface roughness is 2. Ομπι or less, the processing accuracy during cutting can be improved due to non-destructive visibility. The thickness of 106 is not particularly limited, and may be 50 μm or more and 250 μm or less, and preferably 70 μm or more and 150 μm or less. When the thickness of the base film 106 is 50 μm or more, the base film is less likely to be broken during stretching. When the thickness of the base film 106 is 250 μm or less, the semiconductor wafer is diced, and the ductility is excellent. Further, since the weight gain D is suppressed, it is practical in terms of both cost and workability. Multi-layer adhesive sheet 10 In order to prevent electrification when the module film 105 is peeled off, an antistatic agent may be applied to one side or both sides of the base film 106 to perform an antistatic treatment. An antistatic agent is preferably used, for example, a quaternary amine salt monomer. Examples of the quaternary amine salt monomer include dimethylaminoethyl (meth) acrylate tetrachloride, diethylaminoethyl (meth) acrylate tetrachloride, (A) Base) methyl ethylaminoethyl acrylate tetrachloride, p-dimethylaminostyrene quaternary chloride, and p-diethylamino styrene quaternary chloride, etc., and -10- 200927875 Preferred is dimethylaminoethyl methacrylate tetrachloride. On the surface of the base film 106, a slip agent for the purpose of preventing blocking or the like may be applied. The lubricant was incorporated in such a manner that the upper limit in the substrate film was 30% by mass. The lubricant is not particularly limited, and examples thereof include polyoxyxides such as polyoxyxylene resins or (modified) polyoxygenated oils, fluororesins, hexagonal boron nitride, carbon black, and molybdenum disulfide. The manufacture of the electronic component is preferably carried out in a greenhouse, and it is preferred to use a polyoxygen compound or a fluororesin as a lubricant. Among the polyoxyxides, a copolymer having a polyfluorene graft and a monomer is particularly suitable for use because it has good compatibility with an antistatic antistatic layer. The method for applying the lubricant and the antistatic agent to the substrate is not particularly limited. For example, it may be applied to another area layer of the base film coated with the adhesive on one side, or may be added when the resin constituting the substrate is produced. (Adhesive layer) The adhesive for forming the adhesive layer 103 may be an adhesive used in the adhesive sheet for the prior cutting, for example, a polymer obtained by polymerizing an ester monomer such as acrylic acid, methacrylic acid or the like. It may be a copolymer of these monomers copolymerized with a copolymerizable unsaturated monomer (e.g., ethyl acetate, styrene, acrylonitrile). As the adhesive, a (meth) acrylate copolymer is preferred among these adhesives. In the adhesive layer 103, a photocurable pressure-sensitive adhesive which is three-dimensionally networked by irradiation of either ultraviolet rays or radiation may be used. A low molecular weight compound having two or more intramolecular photopolymerizable carbon-carbon double bonds, such as a known acrylate compound or urethane acrylate oligomer. -11-200927875 ((Meth) acrylate copolymer) The (meth) acrylate copolymer used in the present invention is not particularly limited, and may be a main monomer of (meth) acrylate and another vinyl compound. Monomer copolymerization. In the case of the vinyl compound monomer, it is preferred to use a group selected from the group consisting of a hydroxyl group, a carboxyl group, an epoxy group, a decylamino group, an amine group, a methylol group, a sulfonic acid group, an amine sulfonic acid group, and a (phosphite) group. One or more functional group-containing monomers having a functional group consisting of. The main monomer of the (meth) acrylate may, for example, be butyl (meth) acrylate, 2-butyl methacrylate, tert-butyl (meth) acrylate, or (meth) Amyl acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, decyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, (A) Methyl acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, tridecyl (meth) acrylate, decyl (meth) acrylate, cetyl (meth) acrylate Ester, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, benzyl (meth) acrylate, (A) Base) methoxyethyl acrylate, ethoxyethyl (meth) acrylate, butoxymethyl (meth) acrylate, and ethoxy propyl (meth) acrylate. The monomer having a functional group may, for example, have a hydroxyl group, a carboxyl group, an epoxy group, a decylamino group, an amine group, a methylol group, a sulfonic acid group, an amine sulfonic acid group or a (phosphoric acid ester group) as a functional group. A vinyl compound. Examples of the monomer having a hydroxyl group include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 2-hydroxybutyl methacrylate. -12- 200927875 A monomer having a carboxyl group, and examples thereof include (meth)acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide-based N-glycolic acid, and cinnamic acid. Wait. Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth)acrylic acid glycidyl ether. Examples of the monomer having a guanamine group include (meth) acrylamide and the like. The monomer having an amine group may, for example, be N,N-dimethylaminoethyl (meth)acrylate or the like.单体 A monomer having a methylol group may, for example, be N-methylol acrylamide or the like. As a method for producing the (meth) acrylate copolymer, a known method such as emulsion polymerization or solution polymerization can be used. In order to interact with the attached module film, the adhesive sheet is easily peeled off from the module adhesive film after radiation irradiation, and an acrylic rubber which can be produced by emulsion polymerization is preferable. (Polyfunctional isocyanate curing agent) The polyfunctional isocyanate curing agent is not particularly limited as long as it has two or more isocyanate groups, and may, for example, be an aromatic polyisocyanate, an aliphatic polyisocyanate or an alicyclic polyisocyanate. The aromatic polyisocyanate is not particularly limited and may be, for example, 1,3-benzene diisocyanate, 4,4'-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4'-diphenylmethane Isocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanatotoluene, 1,3,5-triisocyanide Acid benzene, dianisidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4',4"-triphenylmethane triisocyanate, (〇,ω'-diisocyanato-1 ,3-dimethylbenzene, ω,ω'-diisocyanato-i,4- 200927875 dimethylbenzene, ω,ω'-diisocyanato-1,4-diethylbenzene, 1 4-tetramethylxylene diisocyanate, 1,3-tetramethylxylene diisocyanate, etc. The aliphatic polyisocyanate is not particularly limited, and examples thereof include dimethylene diisocyanate and tetramethylene. Diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propyl diisocyanate vinegar 2,3·butylene diisocyanate, 1,3-butylene diisocyanate, ten Methylene diisocyanate, 2,4,4-trimethylhexamethylene diisocyanate, etc. The alicyclic polyisocyanate is not particularly limited, and examples thereof include 3-isocyanomethylmethyl-3. 5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentanyl diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl-2,4 -cyclohexane diisocyanate, methyl-2,6-cyclohexylene diisocyanate, 4,4,-methylenebis(cyclohexyl isocyanate), 1,4-di(isocyanatomethyl)cyclohexane Alkane, and 1,4_bis(isocyanatomethyl)cyclohexane, etc. In the polyisocyanate, '1,3-benzene diisocyanate, 4,4 diphenyl diisocyanate, hydrazine, 4·benzene Isocyanate, 4,4'-diphenyl-methyl diiso- acetoacetic acid, 2,4-toluene-isochloric acid vinegar, 2,6-toluene--isoleic acid vinegar, 4,4'-indoleamine Diisocyanate and hexamethylene diisocyanate are preferred. The blending ratio of the polyfunctional isocyanate hardener is preferably ο·1 by mass relative to the ((meth) acrylate copolymer) ι mass part. More than 20 parts by weight The lower limit is 〇. 5 parts by mass or more, and the upper limit is preferably 10 parts by mass or less. If the polyfunctional isocyanate hardener is 0.1 part by mass or more, since the adhesive force is not too strong, the pick-up can be suppressed (Pick up) In addition, if the polyfunctional isocyanate hardener is 20 parts by mass or less, 'the adhesion between the adhesive sheet and the ring frame -14-200927875 can be maintained as the adhesive force does not decrease'. The middle adhesive sheet and the ring frame become difficult to peel off. (The urethane acrylate oligomer having 4 or more vinyl groups) The urethane acrylate oligomer having 4 or more vinyl groups (hereinafter ' The abbreviated as "urethane acrylate oligomer" is not particularly limited as long as it is a (meth) acrylate oligomer having four or more vinyl groups having a urethane bond in the molecule. . The method for producing the urethane acrylate oligomer is not particularly limited, and examples thereof include a (meth) acrylate compound having a hydroxyl group and a plurality of (meth) acrylate groups and a plurality of isocyanate groups. A method of reacting a compound (e.g., a diisocyanate compound) to form a urethane acrylate oligomer. Further, in a polyol oligomer having a plurality of hydroxyl groups, a compound having a plurality of isocyanate groups (for example, a diisocyanate compound) may be excessively added and reacted to form an oligomer having a plurality of isocyanate group terminals, and then The urethane acrylate oligomer is formed by reacting with a (meth) acrylate compound containing a hydroxyl group and a plurality of (meth) acrylate groups. Φ For the (meth) acrylate compound having a hydroxyl group and a plurality of (meth) acrylate groups, for example, hydroxypropylated hydroxymethylpropane triacrylate, pentaerythritol triacrylate, dipentaerythritol-hydroxy- Pentaacrylate, bis(pentaerythritol)-tetrapropyl vinegar, tetramethylmethyl-tripropionate, glycidyl-diacrylate, or part or all of these acrylate groups are replaced by methacrylic acid a compound of an ester group or the like. Examples of the isocyanate having a plurality of isocyanate groups include, for example, an aromatic isocyanate, an alicyclic isocyanate, and an aliphatic isocyanuric acid. In the case of the isocyanate, an aromatic having a plurality of isocyanate groups is used. Isocyanate or alicyclic isocyanate is preferred. The form of the isocyanate component is preferably a monomer, a dimer or a trimer, and a trimer is preferably used. The aromatic diisocyanate may, for example, be toluene diisocyanate, 4,4,-diphenylmethane diisocyanate or xylene diisocyanate. Examples of the alicyclic diisocyanate include isophorone diisocyanate and methylene bis(4-cyclohexyl isocyanate).

就脂肪族二異氰酸酯而言，可列舉如六亞甲基二異氰 酸酯、三甲基六亞甲基二異氰酸酯等。 就多元醇成分而言，可列舉如聚（環氧丙烷）二醇、聚（環 氧丙烷）三醇、共聚（環氧乙烷-環氧丙烷）二醇 '聚（四亞甲 基氧化物）二醇、乙氧化雙酚A、乙氧化雙酚S螺二醇、經 己內酯改質之二醇、碳酸酯二醇等。 具有乙烯基之胺基甲酸酯丙烯酸酯寡聚物之乙烯基數 目若爲4個以上，由於放射線照射後黏著片容易從黏合劑 硬化層剝離，可使晶片之撿取性提高。 對於具：有4個以上乙烯基之胺基甲酸酯丙烯酸酯寡聚 物之慘混量並無特別限定，相對於（甲基）丙烯酸酯共聚物 100質量份而言’以20質量份以上200質量份以下爲較佳。 若具有4個以上乙烯基之胺基甲酸酯丙烯酸酯寡聚物之摻 混量爲20胃4份以±，放射線照射後黏著片從附模塊膠膜 剝離變得容易，可抑制晶片撿取性問題之發生。又，若具 .丫了 4 j&gt;r 卜- _基之胺基甲酸酯丙烯酸酯寡聚物之摻混量 爲2 0 〇質量份υ γ , 以下’切割時不易發生膠糊沾黏所造成之撿 -16- 200927875 取不良，同時由於可抑制來自反應殘餘物之微小膠糊殘屑 之產生，在將附模塊膠膜附著之晶片安裝（mounting)在導線 架上而加溫時可抑制黏合不良之發生。 (具有聚二甲基矽氧烷鍵之丙烯酸酯系聚合物） 就具有聚二甲基矽氧烷鍵之丙烯酸酯系聚合物而言， 可列舉（甲基）丙烯酸單體與在聚二甲基矽氧烷鍵之末端具 有乙烯基之單體（以下稱爲「聚矽氧系巨單體」）之聚合物， 其只要具有從聚二甲基矽氧烷鍵之末端具有乙烯基之單體 0 而來之單體單元之特點外’無特別限制，可爲例如聚矽氧 系巨單體之均聚物’或聚矽氧系巨單體與其他乙烯系化合 物聚合形成之乙烯系聚合物。聚矽氧系巨單體，以使用聚 二甲基矽氧烷鍵之末端成爲（甲基）丙烯醯基或苯乙烯基等 乙烯基之化合物爲較佳（參照例如日本特開2000_0 80 1 3 5號 公報）。 就（甲基）丙烯酸系單體而言’除（甲基）丙烯酸垸酯之 外，可列舉（甲基）丙烯酸羥烷酯、改質（甲基）丙稀酸羥_、 〇 及（甲基）丙烯酸等。 就（甲基）丙烯酸烷酯而言，可列舉如（甲基）丙嫌酸甲 酯、（甲基）丙烯酸乙酯、（甲基）丙烯酸正丙酯、（甲基）丙稀 酸正丁酯、（甲基）丙烯酸異丁酯、（甲基）丙烯酸第三丁酯、 (甲基）丙烯酸2 -乙基己酯、（甲基）丙烯酸月桂酯、（甲基） 丙烯酸硬脂酯、（甲基）丙烯酸異冰片酯、及（甲基）两嫌酸經 烷酯等。 就（甲基）丙燃酸羥烷酯’可列舉如（甲基）丙烯酸羥乙 200927875 酯、（甲基）丙烯酸羥丙酯、及（甲基）丙烯酸羥丁酯等。 就改質（甲基）丙烯酸羥酯而言，可列舉如經環氧乙烷 改質之（甲基）丙烯酸羥酯、及經內酯改質之（甲基）丙烯酸羥 酯等。 使用（甲基）丙烯酸酯時，合成具有聚二甲基矽氧烷鍵 之丙烯酸酯聚合物後，使用具有環氧基之（甲基）丙烯酸縮 水甘油酯等與丙烯酸反應，得到具有乙烯基之聚合物。 爲防止稱爲「粒子」之微小膠糊殘屑，及爲防止黏著 〇 片與附模塊膠膜積層時具有聚二甲基矽氧烷鍵之丙烯酸酯 系聚合物向附模塊膠膜移行（migration)，以使用具有反應 性之（甲基）丙烯酸羥烷酯、或改質（甲基）丙烯酸羥酯、及至 少具有一個乙烯基之具有聚二甲基矽氧烷鍵之丙烯酸酯聚 合物爲較佳。 對於具有聚二甲基矽氧烷鍵之丙烯酸酯聚合物之聚矽 氧系巨單體單元之比例無特別限定，而以具有聚二甲基矽 氧烷鍵之丙烯酸酯系聚合物100質量份中，聚矽氧系巨單 〇 體單元佔15質量份以上50質量份以下爲較佳。若聚矽氧 系巨單體單元之含量爲1 5質量份以上，放射線照射後黏著 片可從附模塊膠膜容易地剝離，可使晶片之撿取性提高。 又，若聚矽氧系巨單體單元之含量爲50質量份以下，由於 對黏著劑表面之滲透（bleed through)被抑制，所以將附模塊 膠膜附著之晶片安裝在導線架上而加溫時可抑制黏合不 良。 對於具有聚二甲基矽氧烷鍵之丙烯酸酯聚合物之摻混 -18- 200927875 量無特別限定，而以相對於（甲基）丙烯酸酯聚合物100質 量份而言，0.1質量份以上10質量份以下爲較佳。若具有 聚二甲基矽氧烷鍵之丙烯酸酯聚合物之摻混量爲0.1質量 份以上，放射線照射後黏著片可從附模塊膠膜容易地剝 離，可使晶片之撿取性提高。又，若具有聚二甲基矽氧烷 鍵之丙烯酸酯聚合物之摻混量爲1〇質量份以下，由於壓抑 初期黏著力之降低，可抑制切割時從環架之剝離。 在黏著劑層1 03中亦可添加例如聚合起始劑、軟化 〇 劑、老化防止劑、充塡劑、紫外線吸收劑、及光安定劑等 各種添加劑。 對於黏著劑層103之厚度並無特別限定，一般爲約5μιη 以上1 ΟΟμιη以下，而以約5μιη以上40μιη以下爲較佳。 對於在基材膜106上形成黏著劑層103而製成黏著片 之方法無特別限定，可列舉藉由例如凹輪塗布機、刮刀式 塗布機（comma coater)、塗布棒、刀塗布機或輥塗布機等塗 布機在基材上直接塗布黏著劑之方法。亦可藉由凸版印 e 刷、凹版印刷、平版印刷、柔版印刷（flexo printing)、膠 版印刷（offset printing)、或網版印刷等在基材膜上印刷黏 著劑層。 (附模塊膠膜） 附模塊膠膜1 0 5爲將黏著劑或黏合劑成形爲膜狀者。 附模塊膠膜105係以將黏合劑或黏著劑積層在PET(聚對苯 二甲酸乙二酯）樹脂等形成之剝離用膜等之狀態而市售 者，其可將黏合劑或黏著劑轉印至多層黏著片。 -19- 200927875 附模塊膠膜】〇5之材質’可爲—般使用之黏著劑或黏 合劑之成分。就黏著劑而言’可列舉如環氧系、聚醯胺系、 丙烯酸系、及聚醯亞胺系等。就黏合劑而言’可列舉如丙 烯酸系、醋酸乙烯酯系、乙烯-醋酸乙烯酯共聚物、乙烯· 丙烯酸酯共聚物、聚醯胺系、聚乙烯系、聚颯系、環氧系、 聚醯亞胺系、聚醯胺酸系、聚矽氧系、酚系、橡膠系聚合 物、氟橡膠系聚合物、及氟樹脂等。 附模塊膠膜105中亦可使用此等黏著劑或黏合劑之混 〇 合物、共聚物、及積層體等。附模塊膠膜中亦可視需要添 加光聚合起始劑、抗靜電劑、交聯促進劑等。 (黏著片） 將附模塊膠膜105貼合於黏著片110之黏著劑塗布 面，形成多層黏著片100。將多層黏著片100使用於電子 構件之製造時，必須調整附模塊膠膜1 0 5與黏著片1 1 0間 之黏著強度，由於若附模塊膠膜105與黏著片110間之黏 著強度大’則有發生撿取不良之情形，若黏著力小，則晶 ® 片保持性降低’同時有黏著片110與環架102容易剝離之 情形，因此以調整至0.05〜0.9N/20mm爲較佳。 (電子構件之製法） 對於使用多層黏著片1〇〇之電子構件之製法並無特別 限定，可列舉如第丨圖所示之下列順序。 (1) 將砂晶片101貼附於多層黏著片100而固定之貼附 步驟。 (2) 將多層黏著片100固定於環架1〇2之固定步驟。 -20- 200927875 (3) 用切割刀片104切割矽晶圓ι〇1之切割步驟。 (4) 將多層黏著片1〇〇擴大成放射狀，張開模塊晶片 (d i e c h i p) 1 0 8間隔後’用針等將模塊晶片i 〇 8突出之擴展 步驟。 (5) 用真空夾套（vacuum collet)或空氣針組（air pin set)等吸著晶片’於黏著劑層1 〇3與附模塊膠膜1 〇5之間剝 離’撿取附模塊膠膜105所附著之模塊晶片108之撿取步 驟。 〇 (6)將附模塊膠膜105所附著之模塊晶片108安裝 (mounting)在導線架1 1 1上之安裝步驟。 (7) 將附模塊膠膜105加熱，將晶片與導線架1 1 1加熱 黏合之加熱黏合步驟。 (8) 將安裝於導線環1 1 1或電路基板之模塊晶片1〇8藉 由樹脂（未圖示）成形之成形步驟。 該製法中，亦可使用形成電路圖案之電路基板等代替 導線架1 1 1。 © 〈作用效果〉 以下，關於本實施形態之多層黏著片100之作用效 果，參照第1圖並加以說明。 本實施形態之多層黏著片1 0 0，如第1 ( 1 )圖所示，具 備基材膜106,積層在該基材膜之一表面之黏著劑層103, 及再積層在該黏著劑層103之附模塊膠膜105，該基材膜 106係以丙烯系共聚物形成。 上述多層黏著片100可抑制切斷半導體晶圓時所產生 -21 - 200927875 之切屑。 又，本實施形態之多層黏著片100，基材膜106以含 有丙烯及1-丁烯做爲聚合成份爲較佳。 上述多層黏著片100由於柔軟性及彈性等優良，可更 進一步抑制切斷半導體晶圓時所產生之切屑。 又，本實施形態之多層黏著片100，黏著劑層103以 含有（甲基）丙烯酸酯1〇〇質量份，多官能異氰酸酯硬化劑 0_5質量份以上20質量份以下爲較佳。 φ 上述多層黏著片100由於黏著劑之黏著力及保持力優 良，可防止切割時電子構件之飛散。再者，由於黏著劑之 凝聚力優良，可防止膠糊沾上電子構件側面。 又，本實施形態之多層黏著片100，黏著劑層1 03較 佳含有100質量份之（甲基）丙烯酸酯，0.5質量份以上2〇 質量份以下之多官能異氰酸酯硬化劑，20質量份以上200 質量份以下之具有4個以上乙烯基之胺基甲酸酯丙烯酸 酯，及0.1質量份以上10質量份以下之具有聚二甲基矽氧 〇 烷鍵之丙烯酸酯共聚物。 上述多層黏著片100，由於黏著劑之黏著力及保持力 優良，可防止切割時電子構件之飛散。再者，由於黏著劑 之凝聚力優良，可防止膠糊沾上電子構件側面及稱爲粒子 之微小膠糊殘屑。 又，本實施形態之電子構件之製法，以使用上述多層 黏著片100爲較佳。 上述多層黏著片1 0 0，如以上所述，由於切割性等優 -22 - 200927875 良，可使生產步驟合理化’或電子構件之品質及生產性提 高。 【實施例】 以下，藉由實施例進一步對本發明加以說明，然而本 發明並不受此等之限定。 &lt;實驗材料之調製&gt; 實施例相關之黏著片、及多層黏著片係依照以下之順 序製造。 〇 (基材膜） 丙烯系共聚物A :使用以丙烯及乙烯·丙烯做爲聚合成 分，MFR(熔融流動率（melt flow rate)’以下相同）値0.9g/10 分鐘，密度〇.89g/cm3之市售品（Sunaroma公司製，Q3 0 0F)。 丙烯系共聚物B:使用含有丙烯及乙烯-丙烯做爲聚合 成分，MFR値 2.5g/10分鐘，密度 〇.88g/cm3之市售品 (Sunaroma 公司製，CA73 20XEP)。 丙烯系共聚物C:使用含有丙烯及1-丁烯做爲聚合成 〇 分，MFR値 7.5g/l 0分鐘，密度 〇.89g/cm3之市售品 (Sunaroma 公司製，X500F)。 乙烯系共聚物 A:使用乙烯與醋酸乙烯酯之無規共聚 物，MFR値 2.5g/l〇分鐘，醋酸乙烯酯含量 12%，密度 0.93g/cxn3之市售品（三井杜邦化學公司製）。 乙烯系共聚物B:使用乙烯與丙烯酸乙酯之無規共聚 物，MFR値5g/10分鐘，丙烯酸乙酯含量9%，密度〇.92g/cm3 之市售品（三井杜邦化學公司製）。 -23- 200927875 (黏著劑） (甲基）丙烯酸酯共聚物A:包含丙烯酸2_乙基己酯 95%、丙烯酸2 -羥基己酯5 %之共聚物’藉由溶液聚合而得 到者（本公司聚合品）。 (甲基）丙烯酸酯共聚物B:包含丙烯酸乙酯54 %、丙烯 酸丁酯19 %及丙烯酸甲氧基乙酯24 %之共聚物’藉由懸浮 聚合而得到者（本公司聚合品）。 多官能異氰酸酯硬化劑A:使用2,4 -甲苯二異氰酸酯 Q 之三羥甲基丙烷加成物之市售品（日本聚胺基甲酸酯公司 製，製品名 Colorate L-45E)。 胺基甲酸酯丙烯酸酯寡聚物A:係使聚（環氧丙烷）二醇 之末端與六亞甲基二異氰酸酯（脂肪族二異氰酸酯）之三聚 物反應形成之末端異氰酸酯寡聚物’再與二季戊四醇五丙 烯酸酯反應所形成之末端丙烯酸酯寡聚物，其爲數量平均 分子量（Μη)爲3, 700，丙烯酸酯官能基數15個之胺基甲酸 酯丙烯酸酯寡聚物（本公司聚合品）。 Ο 胺基甲酸酯丙烯酸酯寡聚物Β:係使聚（環氧丙烷）二醇 之末端與丙烯酸2-羥基乙酯反應形成末端異氰酸酯寡聚 物，再與丙烯酸2-羥基乙酯反應所形成之末端丙烯酸酯寡 聚物，其數量平均分子量（Μη)爲3,400，乙烯基數爲每一分 子2個之胺基甲酸酯丙烯酸酯寡聚物（本公司聚合品）。 具有聚二甲基矽氧烷鍵之丙烯酸酯共聚物Α:係將聚 矽氧分子鏈末端具有（甲基）丙烯醯基之聚矽氧系寡聚物、 .· 及甲基丙烯酸甲酯等所構成之丙烯酸乙烯系單元聚合而成 -24- 200927875 之聚矽氧系接枝共聚物之市售品（綜硏化學公司製，製品名 Actflow UTMM-LS2)。 光聚合起始劑：使用苯甲基二甲基縮酮所形成之市售 品（Ciba Japan 公司製，Irgacure 651)。 附模塊膠膜 A :使用以聚醯亞胺黏合劑做爲主體，厚 度30μηι之巾售品。 (黏著片） 基材膜爲將丙烯系共聚物Α從Τ模頭押出，形成100 μη1 © 薄膜者。黏著劑層爲摻混（甲基）丙烯酸酯共聚物A 100質 量份及異氰酸酯硬化劑A 3質量份者。黏著劑爲摻混（甲基） 丙烯酸酯共聚物A 100質量份及異氰酸酯硬化劑A 3質量 份者。 將黏著劑塗布於PET分離膜上，以乾燥後黏著劑層之 厚度成爲ΙΟμιη之方式塗布，並積層在ΙΟΟμηι之基材上， 得到黏著片。 (附模塊膠膜一體成形片） © 將30μπι厚度之附模塊膠膜Α裁切成6.2吋0之圓形， 積層在黏著片之黏著劑層上，形成多層黏著片。 (電子構件集合體） 電子構件之製造，使用形成仿真電路（dummy circuit) 圖案之直徑6吋χ厚度0.1mm之矽晶圓。將矽晶圓設置在 附模塊膠膜上。 黏者片之切入量爲30μιη。切割係以lOmmxlOmm之晶 片尺寸進行。切割裝置係使用DISCO公司製之DAD 341。 -25 - 200927875 切割刀片係使用DISCO公司製之NBC-ZH 205 0-27 HEEE。 切割刀片形狀：外徑 5 5.56mm，刀寬 3.5μιη，內徑 19.05mm。 切割刀片回轉數：40,000 rpm。 切割刀片運送速度：40mm/秒。 切削水溫：2 5 °C。 切削水量：1.0L /分鐘。 撿取爲藉由針器造成突起後，用真空夾套（vacuum collet)吸著晶片，使黏著片與附模塊膠膜之間剝離，得到 附模塊膠膜附著之晶片。撿取裝置係使用Canon Machinery 公司製 CAP-30011。再者，在黏著劑中使用光硬化型感壓 性黏著劑之實施例10至23之情況，以黑光（black light) 之紫外線1 5 OmJ照射後，進行撿取。 針器形狀：150μιη R。 針器突起高度：〇.5mm。 展開量：5 m m。 (黏著片之評價方法） 切割刀片之切削性：在上述條件下切割半導體晶圓 後，藉由光學顯微鏡（倍率200倍）從半導體晶圓上觀察切 割線。將結果示於表1及表2中。 ◎(優）：切削屑未附著於半導體晶圓上。 〇（良）：切削屑幾乎未附著於半導體晶圓上。 X (不佳）：附著於半導體晶圓上。 附模塊膠膜之切削性：於上述條件下切割半導體晶圓 -26 - 200927875 並撿取後，藉由光學顯微鏡（倍率1 0 0倍）觀察附模塊膠膜 附著之晶片截面。結果如表1及表2所示。 ◎(優）：附模塊膠膜之毛邊高度低於3μιη。 〇（良）：附模塊膠膜之毛邊筒度爲3μπι以上低於ΙΟμιη。 X (不佳）：附模塊膠膜之毛邊高度爲ΙΟμιη以上。 晶片保持性：於上述條件切割半導體晶圓時，評價晶 片保持在黏著片之數目。結果如表1及表2所示。 ◎(優）：晶片脫離低於5%。 φ ◦(良）：晶片脫離5%以上低於10%。 X (不佳）：晶片脫離10%以上。 撿取性：將半導體晶圓以上述條件切割後，評價在上 述條件下可撿取附模塊膠膜附著狀態之晶片之數目。結果 如表1及表2所示。 ◎(優）：9 5 %以上之晶片可撿取。 〇（良）：8 0 %以上低於9 5 %之晶片可撿取。 χ (不佳）：低於8 0 %之晶片可撿取。 e -27 - 200927875 [表1]The aliphatic diisocyanate may, for example, be hexamethylene diisocyanate or trimethylhexamethylene diisocyanate. Examples of the polyol component include poly(propylene oxide) glycol, poly(propylene oxide) triol, and copolymerized (ethylene oxide-propylene oxide) glycol 'poly(tetramethylene oxide). Diol, ethoxylated bisphenol A, ethoxylated bisphenol S spirodiol, diol modified with caprolactone, carbonate diol, and the like. When the number of vinyl groups having a vinyl urethane acrylate oligomer is four or more, the adhesive sheet is easily peeled off from the adhesive hardened layer after radiation irradiation, and the drawability of the wafer can be improved. The amount of the urethane acrylate oligomer having four or more vinyl groups is not particularly limited, and is 20 parts by mass or more based on 100 parts by mass of the (meth) acrylate copolymer. 200 parts by mass or less is preferred. If the blending amount of the urethane acrylate oligomer having 4 or more vinyl groups is 20 parts and 4 parts of the stomach, it is easy to peel off the adhesive sheet from the module film after the radiation irradiation, and the wafer picking can be suppressed. The occurrence of sexual problems. Further, if the blending amount of the urethane acrylate oligomer of 4 j&gt;r-b-based is 20 〇 mass parts υ γ, the following is not easy to cause adhesive sticking when cutting. Caused by the 捡-16- 200927875 bad, and because it can suppress the generation of tiny paste residue from the reaction residue, it can be suppressed when the wafer attached to the module film is mounted on the lead frame and heated. The occurrence of poor adhesion. (Acrylate-based polymer having a polydimethylsiloxane linkage) In the case of an acrylate-based polymer having a polydimethylsiloxane linkage, a (meth)acrylic monomer and a polydimethylene can be cited. a polymer having a vinyl group (hereinafter referred to as "polyoxygenated macromonomer") at the end of the oxyalkylene bond, as long as it has a vinyl group from the end of the polydimethyl siloxane bond The characteristics of the monomer unit derived from the body 0 are not particularly limited, and may be, for example, a homopolymer of a polyfluorene macromonomer or a polymerization of a polysiloxane-based macromonomer with other vinyl compounds. Things. It is preferable that a polyfluorene-based macromonomer is a compound having a vinyl group such as a (meth) acrylonitrile group or a styryl group at the end of the polydimethyl siloxane coupling (see, for example, Japanese Patent Laid-Open No. 2000_0 80 1 3). Bulletin No. 5). In the case of the (meth)acrylic monomer, 'except for the (meth)acrylic acid acrylate, hydroxyalkyl (meth) acrylate, modified (meth) acrylate hydroxy _, hydrazine and (A) Base) Acrylic, etc. Examples of the (meth)acrylic acid alkyl esters include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, and n-butyl (meth) acrylate. Ester, isobutyl (meth)acrylate, tert-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, Isobornyl (meth)acrylate, and (meth) two-acid acid by alkyl ester or the like. Examples of the (meth) propyl hydroxyalkyl acrylate include hydroxyethyl (meth) acrylate 200927875 ester, hydroxypropyl (meth) acrylate, and hydroxybutyl (meth) acrylate. Examples of the modified hydroxy (meth) acrylate include hydroxy (meth) acrylate modified with ethylene oxide and hydroxy (meth) acrylate modified with lactone. When (meth) acrylate is used, an acrylate polymer having a polydimethyl siloxane chain is synthesized, and then reacted with acrylic acid using a glycidyl (meth) acrylate having an epoxy group to obtain a vinyl group. polymer. In order to prevent the micro-adhesive residue called "particles", and to prevent the adhesive film and the module film from laminating, the acrylate polymer having a polydimethyl siloxane bond is transferred to the module film (migration) ), using a reactive hydroxyalkyl (meth) acrylate, or a modified hydroxy (meth) acrylate, and an acrylate polymer having at least one vinyl having a polydimethyl siloxane linkage Preferably. The ratio of the polyfluorene-based macromonomer unit having an acrylate polymer having a polydimethylsiloxane linkage is not particularly limited, and 100 parts by mass of the acrylate-based polymer having a polydimethylsiloxane linkage Among them, the polyfluorene-based macromonosteroid unit is preferably 15 parts by mass or more and 50 parts by mass or less. When the content of the polyoxygenated macromonomer unit is 15 parts by mass or more, the adhesive sheet can be easily peeled off from the attached module film after the radiation irradiation, and the pick-up property of the wafer can be improved. Further, if the content of the polyoxymethylene macromonomer unit is 50 parts by mass or less, since the bleed through of the surface of the adhesive is suppressed, the wafer to which the module film is attached is mounted on the lead frame and heated. It can inhibit poor adhesion. The amount of the blend of -18-200927875 of the acrylate polymer having a polydimethylsiloxane linkage is not particularly limited, and is 0.1 parts by mass or more with respect to 100 parts by mass of the (meth)acrylate polymer. The following parts are preferred. When the blending amount of the acrylate polymer having a polydimethylsiloxane linkage is 0.1 part by mass or more, the adhesive sheet can be easily peeled off from the module adhesive film after radiation irradiation, and the pick-up property of the wafer can be improved. Further, when the blending amount of the acrylate polymer having a polydimethyl siloxane chain bond is 1 part by mass or less, the peeling from the ring frame at the time of dicing can be suppressed due to the decrease in the initial adhesive force at the time of squeezing. Various additives such as a polymerization initiator, a softening agent, an aging preventive agent, a sputum-fixing agent, an ultraviolet absorber, and a light stabilizer may be added to the adhesive layer 103. The thickness of the pressure-sensitive adhesive layer 103 is not particularly limited, and is generally about 5 μm to 1 μm, and more preferably about 5 μm to 40 μm. The method of forming the adhesive sheet on the base film 106 to form the adhesive sheet is not particularly limited, and examples thereof include a concave coater, a comma coater, a coating bar, a knife coater, or a roll. A coating machine such as a coater directly applies an adhesive to a substrate. The adhesive layer may also be printed on the substrate film by letterpress printing, gravure printing, lithography, flexo printing, offset printing, or screen printing. (with module film) The module film 1 0 5 is used to form an adhesive or a film into a film. The module-attached film 105 is commercially available in a state in which a binder or an adhesive is laminated on a film for peeling formed of PET (polyethylene terephthalate) resin or the like, and the adhesive or adhesive can be transferred. Printed to multiple layers of adhesive. -19- 200927875 With the module film] 材质5 material 'can be used as a general-purpose adhesive or adhesive composition. Examples of the adhesive include epoxy, polyamine, acrylic, and polyimine. Examples of the binder include acrylic, vinyl acetate, ethylene-vinyl acetate copolymer, ethylene acrylate copolymer, polyamine, polyethylene, polyfluorene, epoxy, and poly. A quinone imine type, a polyaminic acid type, a polyoxyl type, a phenol type, a rubber type polymer, a fluororubber type polymer, and a fluororesin. Mixed adhesives, copolymers, laminates, and the like of these adhesives or adhesives can also be used in the module adhesive film 105. A photopolymerization initiator, an antistatic agent, a crosslinking accelerator, and the like may be added to the module film as needed. (Adhesive sheet) The module adhesive film 105 is attached to the adhesive application surface of the adhesive sheet 110 to form a multilayer adhesive sheet 100. When the multilayer adhesive sheet 100 is used for the manufacture of an electronic component, it is necessary to adjust the adhesion strength between the module adhesive film 105 and the adhesive sheet 110, since the adhesion strength between the adhesive film 105 and the adhesive sheet 110 is large. In the case where the extraction is poor, if the adhesion is small, the retention of the crystal sheet is lowered. At the same time, the adhesive sheet 110 and the ring frame 102 are easily peeled off, so that it is preferably adjusted to 0.05 to 0.9 N/20 mm. (Manufacturing Method of Electronic Member) The method for producing the electronic member using the multilayer adhesive sheet 1 is not particularly limited, and the following order as shown in the figure is given. (1) A step of attaching the sand wafer 101 to the multilayer adhesive sheet 100 and fixing it. (2) A fixing step of fixing the multilayer adhesive sheet 100 to the ring frame 1〇2. -20- 200927875 (3) The cutting step of cutting the 矽 wafer ι〇1 with the cutting blade 104. (4) The multilayer adhesive sheet 1〇〇 is expanded into a radial shape, and the module wafer (d i e c h i p) is opened after the interval of the module wafer i 〇 8 by the needle or the like. (5) Using a vacuum collet or an air pin set to suck the wafer 'between the adhesive layer 1 〇 3 and the attached module film 1 〇 5 'to take the module film The step of capturing 105 attached module wafers 108. 〇 (6) A mounting step of mounting the module wafer 108 attached to the module film 105 on the lead frame 111. (7) A heating bonding step of heating the attached module film 105 to heat-bond the wafer to the lead frame 111. (8) A molding step of molding a module wafer 1A8 attached to a wire loop 11 or a circuit board by a resin (not shown). In the manufacturing method, a circuit board or the like which forms a circuit pattern may be used instead of the lead frame 11 1 . © <Effects> The following describes the effect of the multilayer adhesive sheet 100 of the present embodiment with reference to Fig. 1 . The multilayer adhesive sheet 100 of the present embodiment includes a base film 106, an adhesive layer 103 laminated on one surface of the base film, and a layer of the adhesive layer deposited on the surface of the base film as shown in Fig. 1 (1). A module adhesive film 105 is attached to 103, and the base film 106 is formed of a propylene-based copolymer. The multilayer adhesive sheet 100 can suppress chips generated from -21 - 200927875 when the semiconductor wafer is cut. Further, in the multilayer adhesive sheet 100 of the present embodiment, the base film 106 preferably contains propylene and 1-butene as a polymerization component. The multilayer adhesive sheet 100 is excellent in flexibility and elasticity, and can further suppress chips generated when the semiconductor wafer is cut. Further, in the multilayer adhesive sheet 100 of the present embodiment, the adhesive layer 103 preferably contains 1 part by mass of (meth) acrylate and 0 to 5 parts by mass or more and 20 parts by mass or less of the polyfunctional isocyanate curing agent. φ The above-mentioned multilayer adhesive sheet 100 is excellent in adhesion and holding force of the adhesive, and can prevent scattering of electronic components during cutting. Further, since the adhesive has excellent cohesive force, the adhesive can be prevented from being stained on the side of the electronic component. Further, in the multilayer adhesive sheet 100 of the present embodiment, the adhesive layer 203 preferably contains 100 parts by mass of (meth) acrylate, 0.5 parts by mass or more and 2 parts by mass or less of the polyfunctional isocyanate curing agent, and 20 parts by mass or more. 200 parts by mass or less of urethane acrylate having 4 or more vinyl groups, and 0.1 parts by mass or more and 10 parts by mass or less of an acrylate copolymer having a polydimethyloxonium bond. The above-mentioned multilayer adhesive sheet 100 is excellent in adhesion and holding force of the adhesive, and can prevent scattering of the electronic member at the time of cutting. Further, since the cohesive force of the adhesive is excellent, the adhesive can be prevented from being stained on the side of the electronic member and the micro-paste residue called the particles. Further, in the method of manufacturing the electronic component of the present embodiment, it is preferable to use the above-mentioned multilayer adhesive sheet 100. The above-mentioned multilayer adhesive sheet 100, as described above, can be rationalized by the excellent cutting property, such as -22 - 200927875, or the quality and productivity of the electronic component can be improved. [Examples] Hereinafter, the present invention will be further illustrated by the examples, but the present invention is not limited thereto. &lt;Modulation of Experimental Material&gt; The adhesive sheet and the multilayer adhesive sheet according to the examples were produced in the following order. 〇 (base film) propylene-based copolymer A: propylene and ethylene/propylene are used as a polymerization component, MFR (melting flow rate is equal to or less) 値0.9 g/10 min, density 〇.89 g/ Commercial product of cm3 (manufactured by Sunaroma Co., Ltd., Q3 0 0F). Propylene-based copolymer B: A commercially available product (manufactured by Sunaroma Co., Ltd., CA73 20XEP) containing propylene and ethylene-propylene as a polymerization component, MFR 値 2.5 g/10 min, and density 〇.88 g/cm 3 was used. Propylene-based copolymer C: A commercially available product (manufactured by Sunaroma Co., Ltd., X500F) containing propylene and 1-butene as a polymerization product, MFR 7.5 7.5 g/l for 0 minutes, and density of 89.89 g/cm 3 was used. Vinyl copolymer A: a random copolymer of ethylene and vinyl acetate, a MFR of 2.5 g/l min, a vinyl acetate content of 12%, and a density of 0.93 g/cxn3 (manufactured by Mitsui DuPont Chemical Co., Ltd.) . The vinyl copolymer B: a random copolymer of ethylene and ethyl acrylate, a MFR of 5 g/10 min, an ethyl acrylate content of 9%, and a density of 9292 g/cm 3 (manufactured by Mitsui DuPont Chemical Co., Ltd.). -23- 200927875 (Adhesive) (Meth) acrylate copolymer A: a copolymer comprising 2-ethylhexyl acrylate 95%, 2-hydroxyhexyl acrylate 5% by solution polymerization (this) Company polymer). (Meth) acrylate copolymer B: a copolymer comprising 54% of ethyl acrylate, 19% of butyl acrylate and 24% of methoxyethyl acrylate obtained by suspension polymerization (polymerized product of the company). Polyfunctional isocyanate hardener A: A commercially available product of a trimethylolpropane adduct of 2,4-toluene diisocyanate Q (manufactured by Nippon Polyurethane Co., Ltd., product name Colorate L-45E). Urethane acrylate oligomer A: a terminal isocyanate oligomer formed by reacting a terminal of a poly(propylene oxide) diol with a trimer of hexamethylene diisocyanate (aliphatic diisocyanate) a terminal acrylate oligomer formed by reacting with dipentaerythritol pentaacrylate, which is a urethane acrylate oligomer having a number average molecular weight (??) of 3,700 and 15 acrylate functional groups. Company polymer). Ο urethane acrylate oligomer Β: reacts the end of poly(propylene oxide) diol with 2-hydroxyethyl acrylate to form a terminal isocyanate oligomer, and then reacts with 2-hydroxyethyl acrylate. The terminal acrylate oligomer formed had a number average molecular weight (?n) of 3,400 and a vinyl group acrylate oligomer of 2 molecules per molecule (polymerized product of the company). Acrylate copolymer having a polydimethylsiloxane linkage: a polyfluorene-based oligomer having a (meth)acryloyl group at the terminal of a polyoxymethylene molecular chain, . . . and methyl methacrylate A commercially available product of a polyfluorene-based graft copolymer of -24 to 200927875 (a product name: Actflow UTMM-LS2, manufactured by K.K.). Photopolymerization initiator: A commercially available product (Iggure 651, manufactured by Ciba Japan Co., Ltd.) formed using benzyldimethylketal. Attached module film A: A towel with a thickness of 30μηι is used as the main component of the polyimide. (Adhesive sheet) The base film is obtained by extruding a propylene-based copolymer crucible from a crucible die to form a 100 μη1 © film. The adhesive layer is a mixture of (meth) acrylate copolymer A 100 parts by mass and isocyanate hardener A 3 parts by mass. The adhesive is a blend of (meth) acrylate copolymer A 100 parts by mass and an isocyanate hardener A 3 by mass. The adhesive was applied onto a PET separation film, and the thickness of the adhesive layer was applied as a thickness after drying, and laminated on a substrate of ΙΟΟμηι to obtain an adhesive sheet. (With module film integrally formed piece) © Cut the module film of 30μπι thickness into a circular shape of 6.2吋0, and laminate it on the adhesive layer of the adhesive sheet to form a multi-layer adhesive sheet. (Electrical Member Aggregate) For the manufacture of an electronic component, a tantalum wafer having a diameter of 6 mm and a thickness of 0.1 mm which is a pattern of a dummy circuit is used. Place the germanium wafer on the attached module film. The cut amount of the adhesive sheet was 30 μm. The cutting was carried out at a wafer size of 10 mm x 10 mm. The cutting device was a DAD 341 manufactured by DISCO. -25 - 200927875 The cutting blade is made of NBC-ZH 205 0-27 HEEE manufactured by DISCO. Cutting blade shape: outer diameter 5 5.56mm, knife width 3.5μιη, inner diameter 19.05mm. Cutting blade revolutions: 40,000 rpm. Cutting blade transport speed: 40mm / sec. Cutting water temperature: 2 5 °C. Cutting water volume: 1.0 L / min. After the protrusion is caused by the needle, the wafer is sucked by a vacuum collet to peel off the adhesive sheet and the attached module film to obtain a wafer with the module film attached thereto. The picking device used was CAP-30011 manufactured by Canon Machinery. Further, in the case of Examples 10 to 23 in which a photocurable pressure-sensitive adhesive was used for the adhesive, the black light was irradiated with ultraviolet rays of 1 5 OmJ, and then the extraction was carried out. Needle shape: 150 μmη R. Needle protrusion height: 〇.5mm. Deployment amount: 5 m m. (Evaluation method of the adhesive sheet) Machinability of the dicing blade: After the semiconductor wafer was cut under the above conditions, the dicing line was observed from the semiconductor wafer by an optical microscope (magnification: 200 times). The results are shown in Tables 1 and 2. ◎ (Excellent): The chips are not attached to the semiconductor wafer. 〇 (good): The chips are hardly attached to the semiconductor wafer. X (poor): Attached to a semiconductor wafer. Machinability of the module film: After cutting the semiconductor wafer -26 - 200927875 under the above conditions and taking it, the wafer section attached to the module film is observed by an optical microscope (magnification of 100 times). The results are shown in Tables 1 and 2. ◎ (Excellent): The height of the burr of the attached module film is less than 3μιη. 〇(good): The edging degree of the module film is 3μπι or more and lower than ΙΟμιη. X (poor): The height of the burr of the module film is ΙΟμιη or more. Wafer retention: When the semiconductor wafer was cut under the above conditions, the number of the wafers held in the adhesive sheet was evaluated. The results are shown in Tables 1 and 2. ◎ (Excellent): The wafer is detached below 5%. φ ◦ (good): The wafer is separated from 5% or more and less than 10%. X (poor): The wafer is out of 10% or more. Skipability: After the semiconductor wafer was cut under the above conditions, the number of wafers in which the attached module film was attached under the above conditions was evaluated. The results are shown in Tables 1 and 2. ◎ (Excellent): More than 95% of the wafer can be taken. 〇 (good): More than 80% of the wafers below 95% can be taken. χ (poor): Less than 80% of the wafer can be taken. e -27 - 200927875 [Table 1]

實驗編號 1 2 3 4 5 6 7 8 9 10 11 基材膜 丙烯系共聚物 A 100 B 100 C 100 A 100 A 100 A 100 A 100 A 100 A 100 乙烯系共聚物 A 100 B 100 黏著劑 層 (甲基)丙烯酸酯共聚物 A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 B 100 B 100 多官能異氰酸酯硬化劑 A 3 A 3 A3 A3 A3 A 0.5 A 20 A 0.05 A 30 A3 A3 胺基甲酸酯丙烯酸酯寡 聚物 A 100 B 100 具有聚二甲基矽氧院鍵 之丙烯酸酯共聚物 A2 A2 評價 切割膠帶切削性 ◎ ◎ 〇 X X ◎ ◎ ◎ ◎ ◎ ◎ 附模塊膠膜切削性 ◎ ◎ 〇 X X ◎ ◎ ◎ ◎ ◎ ◎ 晶片保持性 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ 撿取性 ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇 ◎ ◎ 〇 綜合 ◎ ◎ ◎ X X ◎ ◎ 〇 〇 ◎ 〇 備註 實施例 實施例 實施例 比較例 比較例 實施例 實施例 實施例 實施例 實施例 實施例 [表2] 實驗編號 12 13 14 15 16 17 18 19 20 21 22 23 丙烯系共聚物 A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 基材膜 乙烯系共聚物 黏著劑 層 (甲基)丙烯酸酯共聚物 B 100 B 100 B 100 B 100 B 100 B 100 B 100 B 100 B 100 B 100 B 100 B 100 多官能異氰酸酯硬化劑 A 0.5 A 20 A 0.05 A 30 A3 A3 A3 A3 A3 A3 A3 A3 胺基甲酸酯丙烯酸酯寡 聚物 A 100 A 100 A 100 A 100 A 20 A 200 A 10 A 250 A 100 A 100 A 100 A 100 具有聚二甲基矽氧烷鍵 之丙烯酸酯共聚物 A2 A2 A2 A2 A 2 A 2 A2 A 2 A 0.1 A 10 A 0.05 A 15 評價 切割膠帶切削性 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 附模塊膠膜切削性 ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 晶片保持性 ◎ ◎ ◎ 〇 ◎ ◎ 〇 〇 ◎ ◎ ◎ 〇 撿取性 ◎ ◎ 〇 ◎ ◎ ◎ 〇 〇 ◎ ◎ 〇 ◎ 綜合 ◎ ◎ 〇 〇 ◎ ◎ 〇 〇 ◎ ◎ 〇 〇 備註 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 實施例 -28 - 200927875 &lt;實驗之考察&gt; 從表1及表2之實驗結果，可知使用本發明相關之基 材膜之多層黏著片，切削膠帶切削性、附模塊膠膜切削性 優良’同時撿取作業時附模塊膠膜與黏著劑層之剝離容易》 以上’係基於本發明之實施例加以說明。該實施例僅 只做爲例示’其可有各種變形例，又，從事此業者應能理 解此種變形例亦爲本發明之範圍。 【圖式簡單說明】 Θ [第1圖]爲表示說明本發明之一個實施形態相關之多 層黏著片之構造用之斷面之槪念圖。 【Ϊ要元件符號說明】 1 〇〇 多層黏著片 101 矽晶片 1 02 環架 1 03 黏著劑層 104 切割刀片 10 7 切入 105 附模塊膠膜 106 基材膜 10 8 模塊晶片 110 黏著片 111 導線架 -29 -Experiment No. 1 2 3 4 5 6 7 8 9 10 11 Substrate film propylene-based copolymer A 100 B 100 C 100 A 100 A 100 A 100 A 100 A 100 A 100 Ethylene-based copolymer A 100 B 100 Adhesive layer ( Methyl) acrylate copolymer A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 B 100 B 100 Polyfunctional isocyanate hardener A 3 A 3 A3 A3 A3 A 0.5 A 20 A 0.05 A 30 A3 A3 urethane acrylate oligomer A 100 B 100 Acrylate copolymer A2 A2 having polydimethyl oxime bond bond Evaluation of cutting tape machinability ◎ 〇 〇 XX ◎ ◎ ◎ ◎ ◎ ◎ With module film ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇Remarks Examples Embodiments Comparative Examples Comparative Examples Examples Examples Examples Examples Examples [Table 2] Experiment No. 12 13 14 15 16 17 18 19 20 21 22 23 Propylene Copolymer A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 A 100 Substrate film Vinyl copolymer Adhesive layer (Meth) acrylate copolymer B 100 B 100 B 100 B 100 B 100 B 100 B 100 B 100 B 100 B 100 B 100 B 100 Polyfunctional isocyanate hardener A 0.5 A 20 A 0.05 A 30 A3 A3 A3 A3 A3 A3 A3 A3 Amino acrylate acrylate A 100 A 100 A 100 A 100 A 20 A 200 A 10 A 250 A 100 A 100 A 100 A 100 Acrylate copolymer with polydimethylsiloxane linkage A2 A2 A2 A2 A 2 A 2 A2 A 2 A 0.1 A 10 A 0.05 A 15 Evaluation of cutting tape ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ ◎ 〇〇 〇〇 〇〇 实施 实施 实施 实施 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 〇〇 -28 - 200927875 &lt;Test of the experiment &gt; From the experimental results of Tables 1 and 2, it is understood that the multilayer adhesive sheet using the substrate film according to the present invention has excellent machinability for cutting tape and moldability of the module film, and the module film and adhesive are attached at the same time. The peeling of the agent layer is easy. The above is described based on the examples of the present invention. The embodiment is intended to be illustrative only, and various modifications may be made thereto, and those skilled in the art should understand that such modifications are also within the scope of the invention. [Brief Description of the Drawings] [Fig. 1] is a view showing a cross section for explaining the structure of a multi-layered adhesive sheet according to an embodiment of the present invention. [Description of the main components] 1 〇〇 Multi-layer adhesive sheet 101 矽 Wafer 1 02 Ring frame 10 03 Adhesive layer 104 Cutting blade 10 7 Cut-in 105 Attached film film 106 Substrate film 10 8 Module wafer 110 Adhesive sheet 111 Conductor Rack -29 -

Claims (1)

1 200927875 十、申請專利範圍： 1.—種多層黏著片，其係具備基材膜、積層在該基材膜之 一表面之黏著劑層、及積層在該黏著劑層之附模塊膠膜 (die-attach film);該基材膜係以丙烯系共聚物所形成的。 2·如申請專利範圍第1項之多層黏著片，其中該丙烯系共 聚物爲含有丙烯及1-丁烯作爲聚合成分者。 3.如申請專利範圍第1項之多層黏著片，其中該黏著劑層 係含有100質量份之（甲基）丙烯酸酯共聚物，與0.5質量 〇 份以上20質量份以下之多官能異氰酸酯硬化劑。 4 ·如申請專利範圍第1項之多層黏著片，其中該黏著劑層 係含有100質量份之（甲基）丙烯酸酯共聚物，〇·5質量份 以上20質量份以下之多官能異氰酸酯硬化劑，20質量份 以上2〇〇質量份以下之具有4個以上乙烯基之胺基甲酸 酯丙烯酸酯寡聚物，及0.1質量份以上1〇質量份以下之 具有聚二甲基矽氧烷鍵之丙烯酸酯共聚物。 5. —種使用如申請專利範圍第1項之多層黏著片之電子構 φ 件之製法。 -30-1 200927875 X. Patent application scope: 1. A multi-layer adhesive sheet comprising a substrate film, an adhesive layer laminated on one surface of the substrate film, and a module adhesive film laminated on the adhesive layer ( Die-attach film); the substrate film is formed of a propylene-based copolymer. 2. The multilayer adhesive sheet of claim 1, wherein the propylene-based copolymer is a polymerized component comprising propylene and 1-butene. 3. The multilayer adhesive sheet according to claim 1, wherein the adhesive layer contains 100 parts by mass of a (meth) acrylate copolymer, and 0.5 parts by mass or more and 20 parts by mass or less of a polyfunctional isocyanate hardener. . 4. The multilayer adhesive sheet according to claim 1, wherein the adhesive layer contains 100 parts by mass of a (meth) acrylate copolymer, and 5 parts by mass or more and 20 parts by mass or less of a polyfunctional isocyanate hardener. 20 parts by mass or more and 2 parts by mass or less of the urethane acrylate oligomer having 4 or more vinyl groups, and 0.1 part by mass or more and 1 part by mass or less of the polydimethyl siloxane chain bond Acrylate copolymer. 5. A method of using an electronic structure of a multilayer adhesive sheet as claimed in claim 1 of the patent application. -30-
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