TW202103914A - Laminate and manufacturing method therefor - Google Patents

Abstract

A laminate (X) according to the present invention comprises an adherend (10) as a flexible adherend, and a film (20) as a reinforcing film. The film (20) includes a base material (21) and an adhesive layer (22) and attaches to the adherend (10) on the adhesive layer (22) side. The film (20) further includes film sections (20A, 20B) that are adjacent upon the adherend (10). The base material (21) of the film section (20A) has an end face (21a) which faces the film section (20B), and said end face (21a) is inclined so as to recede away from the adherend (10) in a direction toward the interior of the film section (20A). The base material (21) of the film section (20B) has an end face (21b) which faces the film section (20A), and said end face (21b) is inclined so as to recede away from the adherend (10) in a direction toward the interior of the film section (20B).

Description

Laminated body and its manufacturing method

The present invention relates to a laminate as a component of a flexible device and a method of manufacturing the same.

In the manufacturing process of various devices such as optical devices or electronic devices, there are situations as follows: from the viewpoint of protecting the surface of the component parts of the device or protecting it from impact, various steps are implemented after attaching a specific adhesive film to the part . There are cases where such a protective film is incorporated into a product device as a device structural material in a state of being attached to the component component in order to supplement the strength of the component component of the device to which it is attached. The related technology of such an adhesive film which has both a protection function and a reinforcement function is described in the following patent document 1, for example. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2017-132977

[The problem to be solved by the invention]

Regarding flexible device components such as flexible printed wiring boards (FPC), there are cases where the above-mentioned adhesive films are required to be attached to multiple locations on the same surface (that is, a reinforcing film that also undertakes the protective function during the manufacturing process) . In addition, there are cases where the flexible device constituent parts in which a plurality of reinforcing films are attached to the same surface side are assembled in a product device in a state where the reinforcing films are bent and folded back so that the reinforcing films are close to each other in the region between the reinforcing films.

In such a device constituent part (soft adhered body) with a plurality of reinforcing films, from the viewpoint of miniaturization or weight reduction of the device constituent part, it is preferable to be adjacent across the predetermined bending portion The separation distance between the two reinforcing membranes is relatively short. However, if the separation distance between two adjacent reinforcement films across the predetermined bending part is too short, there are cases where the reinforcement films abut each other when the flexible adherend is bent and deformed, and the soft adherend cannot Obtain the desired turnaround pattern.

The present invention provides a laminated body suitable for ensuring bending gaps for the bending of the inter-reinforcing film area in a soft adherend, and a manufacturing method thereof. The laminated body is provided with a soft adherend and a plurality of layers attached to the same side. A reinforcing film. [Technical means to solve the problem]

According to the first aspect of the present invention, a laminate is provided. This laminate has a soft adherend and a reinforcing film. The reinforcing film includes a base material and an adhesive layer thereon, and is attached to the soft adherend with the adhesive layer side. In the reinforcing film, the base material and the adhesive layer can be joined directly or through other layers. In addition, the reinforcing film includes a first reinforcing film portion and a second reinforcing film portion that are separated and adjacent to each other on the soft adherend. The base material of the first reinforcing film portion has a first inclined end surface facing the second reinforcing film portion. The first inclined end surface is inclined such that the farther away from the part of the soft adherend, the more it retracts toward the inner side of the first reinforcing film portion. The base material of the second reinforcing film portion has a second inclined end surface facing the first reinforcing film portion. The second inclined end surface is inclined such that the farther away from the part of the soft adherend, the more it retreats to the inside of the second reinforcing film portion.

In the laminated body of the first aspect of the present invention, as described above, the end face of the first reinforcing film portion on the soft adherend that faces the second reinforcing film portion is farther away from the soft adherend The more the part is slanted toward the inner side of the first reinforcing film part, and the end surface of the second reinforcing film part on the soft adherend that is opposite to the first reinforcing film part is the farther away from the soft adherend. The part is inclined in a way of retreating toward the inner side of the second reinforcing membrane part. Such a structure is suitable for ensuring a bending gap in the area between the first and second reinforcing film portions in the soft adherend (that is, suitable for suppressing the abutment of the reinforcing films). Such a laminated body is easy to obtain a proper folded back shape in which the bonding surface of the reinforcing film of the soft adherend faces the inside. In addition, with regard to the laminated body of the present invention, which can easily obtain an appropriate folded back shape in this way, it is easy to design the distance between the reinforcing films on the soft adherend to be short, and it is easy to achieve miniaturization or weight reduction.

In the laminate of the first aspect of the present invention, it is preferable that the adhesive layer of the first reinforcing film portion has a modified portion at the side edge of the second reinforcing film portion, and the adhesive layer of the second reinforcing film portion is The first reinforcing film part has a modified part at the side edge. This structure is suitable for suppressing the exudation of its constituent components in the adhesive layer of each reinforcing film part.

According to the second aspect of the present invention, there is provided a method of manufacturing a laminate. The manufacturing method includes: an attaching step, a cutting step, a peeling step, and an adhesive force increasing step.

In the attaching step, the reinforcing film including the substrate and the adhesive layer on the substrate is attached to the soft adherend with its adhesive layer side. In the reinforcing film, the base material and the adhesive layer can be joined directly or through other layers. The adhesive layer is composed of an adhesive composition that can be irradiated with active energy rays or external stimuli such as heating from a relatively low adhesive force state (low adhesive force state) to a relatively high adhesive force The state (high adhesion state) irreversibly changes.

In the cutting step, the reinforcing film on the soft adherend is processed to form a groove, and the reinforcing film is divided to form two separate first area portions and a second area portion between the first area portion. In this step, the notch that distinguishes each of the first area portion and the second area portion becomes wider as the distance away from the soft adherend is. That is, the cut end surface on the second area side in each first area portion is inclined so as to be retracted toward the inner side of the first area portion as it is farther away from the soft adherend. The cut end face (inclined) of the base material of the first region is included in the cut end face. In addition, the adhesive layers of the first and second regions generated by this step are in the above-mentioned low adhesive force state.

In the peeling step, the second area portion divided and formed between the first area portions is peeled from the soft adherend by the above method. The second region on the soft adherend is in a low adhesive force state as described above. Such a structure is preferable in that the second region portion is appropriately peeled from the soft adherend.

In the adhesive force increasing step, the adhesive force of the adhesive layer in the first region is increased. In this step, the adhesive layer of each first area on the soft adherend is changed to a high adhesive force state by external stimuli such as active energy ray irradiation or heating for the adhesive layer of the first area. Thereby, in the first region, the bonding state to the soft adherend becomes firm. Such a structure is suitable in terms of leaving the first region portion derived from the aforementioned reinforcing film as a structural material in the laminate. The first region portion where the adhesive layer is in a state of high adhesive force constitutes the reinforcing film portion (first reinforcing film portion, second reinforcing film portion) in the above-mentioned laminate of the first aspect of the present invention. In addition, the cut end surface (inclined) of the base material of the first region portion constitutes the inclined end surface of the base material of the first and second reinforcing film portions in the above-mentioned laminate of the first aspect.

According to the present laminated body manufacturing method including each step as described above, the above-mentioned laminated body of the first aspect of the present invention can be suitably manufactured. According to this manufacturing method of this kind, it is possible to enjoy the same effects as those described above with respect to the laminated body of the first aspect of the present invention in the laminated body to be produced. Moreover, in this manufacturing method, there is no need to individually attach a plurality of films as reinforcing materials to the flexible adherend. This manufacturing method contributes to the efficiency of the manufacturing of the laminated body or the device for assembling it.

In the above-mentioned cutting step, it is preferable that the adhesive layer of each first area portion is formed with a modified portion facing the cut groove between the second area portion. This structure is suitable for suppressing the exudation of its constituent components in the adhesive layer of each reinforcing film part.

In the above-mentioned cutting step, it is preferable that the notch system for dividing each of the first region portion and the second region portion is formed by half-cutting the reinforcing film from the base material side to the middle of the adhesive layer. Such a configuration is suitable in terms of suppressing so-called paste residue in the above-mentioned peeling step performed after the cutting step. When the reinforcing film on the adherend is cut along its entire thickness direction, depending on the cutting method or cutting conditions, it will be located at the interface between the adherend and the reinforcing film adhesive layer and its vicinity. The part of the adhesive layer constituting the material of the heating or pressing force causes a part of the adhesive layer facing the interface to be easily fixed to the adherend. In the cutting step, the structure in which an uncut adhesive part is left between the bottom end of the groove and the adherend by half-cutting as described above is suitable for avoiding the formation of the adhesive layer located at the interface and its vicinity The effect of local heating or pressing pressure in the material. In addition, there are cases in which an uncut adhesive part is left between the bottom end of the incision groove and the adherend by half-cutting as described above. There are cases in which the cohesive force of the remaining adhesive part is used to remove the adhesive part. The two-region part or its adhesive layer is preferably peeled from the surface of the adherend without adhesive residue (paste residue).

Fig. 1 and Fig. 2 show a laminate X according to an embodiment of the present invention. Fig. 1 is a three-dimensional view of the laminated body X. Fig. 2 is a partial enlarged cross-sectional view of the laminated body X. The laminated body X includes an adherend 10 and a film 20.

The adherend 10 is a soft adherend in one embodiment of the present invention, has flexibility, and has a first surface 11 and a second surface 12 facing each other. As the adherend 10, for example, a flexible optical device such as a flexible display panel, a flexible electronic device such as a flexible printed circuit board (FPC), and a flexible substrate as a component of these components. When the adherend 10 is a flexible optical device, the first surface 11 side of the adherend 10 is formed with, for example, a pixel area including a plurality of pixels in an array, and a circuit including various circuit elements such as a driving circuit. Areas, and wiring patterns for electrical connections. When the adherend 10 is a flexible electronic device, various circuit elements and wiring patterns are formed on the first surface 11 side of the adherend 10, for example. Such an adherend 10 can obtain various top-view shapes according to the design of the manufacturing target device.

As shown in detail in FIG. 2, the film 20 includes a substrate 21 and an adhesive layer 22, and is attached to the second surface 12 of the adherend 10 with the adhesive layer 22 side. In the film 20, the base material 21 and the adhesive layer 22 may be directly bonded, or may be bonded via other layers. This kind of film 20 is an example of the reinforcing film in the present invention. In addition to the protective function of the adherend 10, it is also used to supplement the reinforcing function. It is incorporated into the product device as a device structural material together with the adherend 10 Of the elements.

The film 20 includes a film portion 20A (first reinforcing film portion) and a film portion 20B (second reinforcing film portion) that are separated and adjacent to each other on the adherend 10 (the film portions 20A and 20B respectively include a base material 21 and an adhesive layer) twenty two). The film portions 20A and 20B are separated and adjacent to each other in a plane direction D2 orthogonal to the thickness direction D1 of the film 20.

The base 21 of the film portion 20A has an end surface 21a (first inclined end surface) facing the film portion 20B in the surface direction D2. This end surface 21a is inclined so that the farther away from the part of the adherend 10, the more it retreats to the inside of the film portion 20A. That is, the end surface 21a is inclined in such a manner that it moves away from the film portion 20B in the surface direction D2 as it advances in the direction from the adherend 10 to the film 20 in the thickness direction D1 of the film 20. The inclination angle α of the end face 21a with respect to the thickness direction D1 is, for example, 1° or more, preferably 2° or more, more preferably 3° or more, and still more preferably 5° or more, for example, 45° or less. Preferably, it is 30° or less. The adhesive layer 22 of the film portion 20A has a modified portion 22a at the edge of the film portion 20B side. The modified portion 22a is a portion where the exposed surface of the adhesive layer 22 in the film portion 20A is hardened by heating or the like.

The base 21 of the film portion 20B has an end surface 21b (a second inclined end surface) facing the film portion 20A in the surface direction D2. The end surface 21b is inclined so as to retract toward the inner side of the film portion 20B as it is farther away from the adherend 10. That is, the end surface 21b is inclined in such a manner that it moves away from the film portion 20B in the surface direction D2 as it advances in the direction from the adherend 10 to the film 20 in the thickness direction D1 of the film 20. The inclination angle α of the end surface 21b with respect to the thickness direction D1 is, for example, 1° or more, preferably 2° or more, more preferably 3° or more, and still more preferably 5° or more, for example, 45° or less. Preferably, it is 30° or less. The adhesive layer 22 of the film portion 20B has a modified portion 22b at the edge of the film portion 20A side. The modified portion 22b is a portion where the exposed surface of the adhesive layer 22 in the film portion 20B is hardened by heating or the like.

The base material 21 in the film 20 is a support for ensuring the mechanical strength of the film 20, and is a main element for the film 20 to exhibit its reinforcing function or protective function.

The substrate 21 includes a flexible plastic material. Examples of such plastic materials include (meth)acrylic resins (acrylic resins and/or methacrylic resins) such as polyester resins, polyolefin resins, and polymethacrylates, and polyimides. Resins, polycarbonate resins, polyether ether resins, polyarylate resins, melamine resins, polyamide resins, cellulose resins, and polystyrene resins. Examples of polyester resins include polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate. As polyolefin resin, polyethylene, polypropylene, and cycloolefin polymer (COP) are mentioned, for example. When the adhesive layer 22 is composed of an adhesive composition capable of being irradiated with active energy rays to achieve a high adhesive force state as described below, the base material 21 preferably has transparency with respect to the active energy rays. From the viewpoint of taking into account such transparency and mechanical strength, the plastic material used for forming the substrate 21 is preferably a polyester resin, and more preferably polyethylene terephthalate (PET).

The thickness of the substrate 21 is, for example, 4 μm or more, and from the viewpoint of reinforcing the adherend 10, it is preferably 20 μm or more, more preferably 30 μm or more, and still more preferably 45 μm or more. In addition, the thickness of the substrate 21 is, for example, 500 μm or less, and from the viewpoint of flexibility or handleability of the film 20, it is preferably 300 μm or less, more preferably 200 μm or less, and even more preferably 100 μm or less.

The adhesive layer 22 in the film 20 is an element for attaching the film 20 to the adherend 10, and is composed of an adhesive composition. The adhesive layer 22 in this embodiment is an adhesive that can irreversibly change from a state with relatively low adhesive force (a state of low adhesive force) to a state of relatively high adhesive force (a state with high adhesive force) by external stimuli. A layer formed by a sexual composition, and a high adhesion state is obtained in the laminated body X that has undergone the manufacturing process.

As an adhesive composition for forming the adhesive layer 22, for example, an adhesive composition capable of changing from a low adhesive force state to a high adhesive force state by irradiating active energy rays such as ultraviolet rays or electron beams (No. 1 Adhesive composition), and an adhesive composition capable of changing from a low-adhesive state to a high-adhesive state by heating (the second adhesive composition).

The first adhesive composition contains a base polymer, a photocuring agent, and a photopolymerization initiator.

As the base polymer, for example, acrylic polymer, natural rubber, styrene-isoprene-styrene block copolymer (SIS block copolymer), styrene-butadiene-styrene block copolymer, Segment copolymer (SBS block copolymer), styrene-ethylene-butylene-styrene block copolymer (SEBS block copolymer), styrene-butadiene rubber, polybutadiene, polyisoprene Ethylene, polyisobutylene, butyl rubber, chloroprene rubber, and silicone rubber. From the viewpoint of suppressing the adhesive force, the base polymer is preferably an acrylic polymer.

The glass transition temperature (Tg) of the base polymer is, for example, 0°C or less, preferably -100°C to -5°C, more preferably -80°C to -10°C, and still more preferably -40°C to -10°C. Such a configuration is suitable for ensuring the fluidity of the base polymer in the first adhesive composition, and therefore, for changing the first adhesive composition to a state of high adhesive force by active energy rays suitable.

The glass transition temperature is a value described in documents, catalogs, etc., or a value calculated based on the following formula (X) (Fox formula). The same is true for the glass transition temperature of other polymers described below.

1/Tg=W1/Tg1＋W2/Tg2＋…＋Wn/Tgn (X) [In formula (X), Tg represents the glass transition temperature (unit: K) of polymer (A), and Tgi (i=1, 2,...n) represents the glass transition temperature (unit: : K), Wi (i=1, 2,...n) represents the mass fraction of monomer i in all monomer components]

The acrylic polymer in the first adhesive composition is obtained by polymerization of a monomer component (first monomer component) containing an alkyl (meth)acrylate as a main component. The "(meth)acrylic acid" is assumed to mean acrylic acid and/or methacrylic acid.

The alkyl (meth)acrylate may, for example, be a linear or branched C1-20 alkyl (meth)acrylate. As such alkyl (meth)acrylate, for example, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, Butyl (meth)acrylate, isobutyl (meth)acrylate, second butyl (meth)acrylate, tertiary butyl (meth)acrylate, amyl (meth)acrylate, (meth)acrylic acid Isoamyl ester, neopentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, ( Isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecane (meth)acrylate Base ester, dodecyl (meth)acrylate, isotri(dodecyl) (meth)acrylate, tetradecyl (meth)acrylate, isotetradecyl (meth)acrylate Ester, pentadecyl (meth)acrylate, cetyl (meth)acrylate, heptadecyl (meth)acrylate, stearyl (meth)acrylate, isopropyl (meth)acrylate Stearyl ester, nonadecyl (meth)acrylate, and eicosyl (meth)acrylate. In terms of forming an acrylic polymer, one type of alkyl (meth)acrylate may be used, or two or more types of alkyl (meth)acrylate may be used.

From the viewpoint of adjusting the glass transition temperature of the acrylic polymer, the alkyl (meth)acrylate is preferably used in combination with methyl methacrylate and C4-12 alkyl acrylate. In the case of using these in combination, the compounding amount of methyl methacrylate is, for example, 5 parts by mass or more, for example, 20 parts by mass relative to 100 parts by mass of the total amount of methyl methacrylate and C4-12 alkyl acrylate Hereinafter, the compounding amount of C4-12 alkyl acrylate is, for example, 80 parts by mass or more, for example, 95 parts by mass or less.

The blending ratio of the alkyl (meth)acrylate in the first monomer component is, for example, 50% by mass or more, preferably 60% by mass or more, and, for example, 80% by mass or less.

The first monomer component preferably contains a functional group-containing vinyl monomer copolymerizable with the alkyl (meth)acrylate. Examples of functional group-containing vinyl monomers include: hydroxyl group-containing vinyl monomers, carboxyl group-containing vinyl monomers, nitrogen-containing vinyl monomers, (meth)acrylonitrile and other cyano group-containing monomers. Vinyl monomers, glycidyl (meth)acrylate and other glycidyl group-containing vinyl monomers, sulfo group-containing vinyl monomers, 2-hydroxyethyl acryloyl phosphate and other phosphoric acid group-containing vinyl Monomers, aromatic vinyl monomers, vinyl ester monomers, and vinyl ether monomers such as methyl vinyl ether.

Examples of hydroxyl-containing vinyl monomers include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, (meth) 6-Hydroxyhexyl acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, and 4-(hydroxyl (meth)acrylate) The methyl)cyclohexyl methyl ester is preferably 2-hydroxyethyl (meth)acrylate, and more preferably 2-hydroxyethyl acrylate.

Examples of carboxyl group-containing vinyl monomers include (meth)acrylic acid, 2-carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, and maleic acid. , Fumaric acid, and crotonic acid. Moreover, as a vinyl monomer containing a carboxyl group, the monomer containing an acid anhydride group, such as maleic anhydride or itaconic anhydride, can also be mentioned, for example.

Examples of nitrogen-containing vinyl monomers include: N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperidone, vinyl Pyridine, vinyl pyrrole, vinyl imidazole, vinyl azole, vinyl pyridine, N-acrylamide, N-vinyl carboxamides, and N-vinyl caprolactam.

Examples of the sulfo group-containing vinyl monomer include styrene sulfonic acid and allyl sulfonic acid.

Examples of the aromatic vinyl monomer include styrene, p-methylstyrene, o-methylstyrene, and α-methylstyrene.

As a vinyl ester monomer, vinyl acetate and vinyl propionate are mentioned, for example.

In terms of forming the acrylic polymer, one type of vinyl monomer containing functional groups may be used, or two or more types of vinyl monomer containing functional groups may be used. From the viewpoint of introducing a crosslinked structure into an acrylic polymer, as the functional group-containing vinyl monomer, it is preferable to use a hydroxyl group-containing vinyl monomer and/or a carboxyl group-containing vinyl monomer. From the viewpoint of ensuring sufficient cohesive force in the adhesive layer 22, as the functional group-containing vinyl monomer, it is preferable to use a nitrogen-containing vinyl monomer, preferably a nitrogen-containing vinyl monomer. A vinyl monomer containing a hydroxyl group and/or a vinyl monomer containing a carboxyl group are used together.

The blending ratio of the functional group-containing vinyl monomer in the first monomer component is, for example, 5% by mass or more, preferably 10% by mass or more, more preferably 15% by mass or more, and, for example, 30% by mass or less, Preferably it is 20 mass% or less.

The acrylic polymer can be formed by polymerizing the above-mentioned first monomer component containing an alkyl (meth)acrylate as a main component. As the polymerization method, for example, solution polymerization, bulk polymerization, and emulsion polymerization may be mentioned, and preferably, solution polymerization may be mentioned.

In the solution polymerization, for example, after preparing the reaction solution by preparing the first monomer component and the polymerization initiator in a solvent, the reaction solution is heated. Then, by the polymerization reaction of the first monomer component in the reaction solution, an acrylic polymer solution containing an acrylic polymer can be obtained.

The solid content concentration of the acrylic polymer solution obtained by solution polymerization is, for example, 20% by mass or more, for example, 80% by mass or less. The weight average molecular weight of the acrylic polymer is, for example, 100,000 or more, preferably 300,000 or more, more preferably 500,000 or more, for example, 5,000,000 or less, preferably 3,000,000 or less, more preferably 2,000,000 or less. The weight average molecular weight of the acrylic polymer is a value measured by gel permeation chromatography (GPC) and calculated by polystyrene conversion.

The blending ratio of the acrylic polymer in the first adhesive composition is, for example, 50% by mass or more, preferably 80% by mass or more, and, for example, 90% by mass or less. The ratio of the blending amount of the acrylic polymer in the first adhesive composition to the total amount of the acrylic polymer, the photohardener and the photopolymerization initiator is, for example, 70% by mass or more, and, for example, 95% by mass the following.

The photocuring agent in the first adhesive composition is, for example, a polyfunctional (meth)acrylate. From the viewpoint that the adhesive force of the adhesive layer 22 can be sufficiently increased by irradiating active energy rays, it is preferably Examples are bifunctional (meth)acrylate and trifunctional (meth)acrylate. Examples of bifunctional (meth)acrylates include polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, and polytetramethylene glycol di(meth)acrylic acid. Ester, bisphenol A ethylene oxide modified di(meth)acrylate, bisphenol A propylene oxide modified di(meth)acrylate, alkanediol di(meth)acrylate, tricyclodecane Dimethanol di(meth)acrylate, pentaerythritol di(meth)acrylate, neopentyl glycol di(meth)acrylate, and glycerol di(meth)acrylate. Examples of trifunctional (meth)acrylates include ethoxylated isocyanuric acid tri(meth)acrylate, pentaerythritol tri(meth)acrylate, and trimethylolpropane tri(meth)acrylate. Acrylate. Examples of light curing agents include other acrylic photoreactive oligomers, and photoreactive urethanes, polyethers, polyesters, polycarbonates, and polybutadienes. Oligomer. These light hardeners may be used alone, or two or more of them may be used in combination.

The functional group equivalent of the light hardener is, for example, 50 g/eq or more, for example, 500 g/eq or less. The viscosity of the light hardener at 25°C is, for example, 5 mPa·s or more, for example, 1000 mPa·s or less. From the viewpoint of compatibility in the first adhesive composition, the molecular weight of the light curing agent is, for example, 200 or less, for example, 1000 or more.

The compatibility of the light hardening agent with respect to the above-mentioned acrylic polymer is preferably low. The configuration in which the compatibility of the light hardener with the acrylic polymer is low is as follows. Regarding the adhesive force of the adhesive layer 22, it is possible to achieve a low adhesive force state that can be changed to a high adhesive force state afterwards. Better.

The blending ratio of the light hardener in the first adhesive composition is, for example, 10% by mass or more, and, for example, 50% by mass or less. The compounding amount of the light hardener in the first adhesive composition is, for example, 10 parts by mass or more, for example, 50 parts by mass or less, preferably 30 parts by mass or less with respect to 100 parts by mass of the acrylic polymer. The ratio of the blending amount of the light curing agent in the first adhesive composition to the total amount of the acrylic polymer, the light curing agent and the photopolymerization initiator is, for example, 5% by mass or more, and, for example, 30% by mass or less .

The photopolymerization initiator in the first adhesive composition is one that promotes the curing reaction of the photocuring agent, and is selected according to the type of the photocuring agent, etc. The photopolymerization initiator may, for example, be a photocation initiator (photoacid generator), a photoradical initiator, and a photoanion initiator (photobase generator). Examples of photoradical initiators include hydroxy ketones such as 1-hydroxycyclohexyl phenyl ketone, benzil dimethyl ketals, amino ketones, phosphine oxides, and benzophenones. Ketones, and three derivatives containing trichloromethyl. These photopolymerization initiators may be used alone, or two or more of them may be used in combination. In the case of using a polyfunctional (meth)acrylate as the photohardener, the photopolymerization initiator may preferably be a photoradical initiator, and more preferably may be hydroxyketones. The light absorption region of such a photopolymerization initiator is, for example, 300 nm or more, and for example, 450 nm or less.

The blending ratio of the photopolymerization initiator in the first adhesive composition is, for example, 0.01% by mass or more, and, for example, is 0.5% by mass or less, and preferably 0.1% by mass or less. The compounding amount of the photopolymerization initiator in the first adhesive composition is, for example, 0.01 parts by mass or more, for example, 1 part by mass or less, and preferably 0.5 parts by mass or less with respect to 100 parts by mass of the acrylic polymer. The ratio of the blending amount of the photopolymerization initiator in the first adhesive composition to the total amount of the acrylic polymer, the photohardener and the photopolymerization initiator is, for example, 0.01% by mass or more, or, for example, 1 mass % Or less, preferably 0.5% by mass or less.

When preparing the first adhesive composition, an acrylic polymer (in the case of preparing an acrylic polymer by solution polymerization, an acrylic polymer solution), a light hardener, and a photopolymerization initiator are used The above ratios are blended and mixed.

In the first adhesive composition, from the viewpoint of introducing a cross-linked structure to the acrylic polymer, it is preferable to formulate a cross-linking agent. When an acrylic polymer having a crosslinking point such as a hydroxyl group or a carboxyl group and a crosslinking agent are formulated in the first adhesive composition, the crosslinking point of the acrylic polymer can react with the crosslinking agent, and it can react to The acrylic polymer introduces a cross-linked structure. As the crosslinking agent used here, for example, isocyanate-based crosslinking agents, epoxy-based crosslinking agents, azoline-based crosslinking agents, aziridine-based crosslinking agents, and carbodiimide-based crosslinking agents may be mentioned. The linking agent and the metal chelate-based crosslinking agent preferably include an isocyanate-based crosslinking agent.

As the isocyanate-based crosslinking agent, for example, aliphatic diisocyanates such as butylene diisocyanate or hexamethylene diisocyanate, cyclopentyl diisocyanate or cyclohexyl diisocyanate, isophorone diisocyanate, etc. Aromatic diisocyanates such as cycloaliphatic diisocyanate, 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate. As the isocyanate-based crosslinking agent, derivatives of these isocyanates (for example, an isocyanurate modified body or a polyol modified body, etc.) may also be mentioned. Moreover, as an isocyanate-type crosslinking agent, you may use a commercial item. As the commercially available product, for example, Coronaate L (trimethylolpropane adduct of toluene diisocyanate, manufactured by Tosoh), Coronaate HL (trimethylolpropane adduct of hexamethylene diisocyanate, Tosoh (manufactured by Tosoh), Coronaate HX (isocyanurate body of hexamethylene diisocyanate, manufactured by Tosoh), and Takenate D110N (trimethylolpropane adduct of xylylene diisocyanate, manufactured by Mitsui Chemicals). These crosslinking agents may be used alone, or two or more of them may be used in combination.

The functional group equivalent of the crosslinking agent is, for example, 50 g/eq or more, and, for example, 500 g/eq or less.

The blending ratio of the crosslinking agent in the first adhesive composition relative to 100 parts by mass of the acrylic polymer is, for example, 0.1 parts by mass or more, preferably 1.0 parts by mass or more, more preferably 1.5 parts by mass or more, and more preferably It is 2.0 parts by mass or more, and, for example, 10 parts by mass or less, preferably 5 parts by mass or less, and more preferably 4 parts by mass or less.

When the above-mentioned cross-linking agent is blended in the first adhesive composition, a cross-linking catalyst for promoting the cross-linking reaction can also be blended in the first adhesive composition.

Examples of the crosslinking catalyst include metal crosslinking catalysts such as tetra-n-butyl titanate, tetraisopropyl titanate, iron triacetone acetone, butyl tin oxide, and dioctyl tin dilaurate. The cross-linking catalyst can be used alone, or two or more of them can be used in combination.

The blending ratio of the crosslinking catalyst in the first adhesive composition relative to 100 parts by mass of the acrylic polymer is, for example, 0.001 parts by mass or more, preferably 0.01 parts by mass or more, and, for example, 0.05 parts by mass or less.

In the first adhesive composition, other ingredients may be blended as needed. As other ingredients, for example, silane coupling agent, adhesiveness imparting agent, plasticizer, softener, anti-deterioration agent, filler, coloring agent, ultraviolet absorber (stabilization under fluorescent lamp or natural light) From the viewpoint of chemical conversion), antioxidants, surfactants, and antistatic agents.

The second adhesive composition described above includes a base polymer (first polymer) and an organosiloxane-containing polymer (second polymer).

As the base polymer, for example, acrylic polymer, natural rubber, styrene-isoprene-styrene block copolymer (SIS block copolymer), styrene-butadiene-styrene block copolymer, Segment copolymer (SBS block copolymer), styrene-ethylene-butylene-styrene block copolymer (SEBS block copolymer), styrene-butadiene rubber, polybutadiene, polyisoprene Ethylene, polyisobutylene, butyl rubber, chloroprene rubber, and silicone rubber. From the viewpoint of suppressing the adhesive force, the base polymer is preferably an acrylic polymer.

The glass transition temperature (Tg) of the base polymer is, for example, 0°C or lower, preferably -100°C to -5°C, more preferably -80°C to -10°C, and still more preferably -40°C to -10°C. Such a structure is suitable in terms of ensuring the fluidity of the base polymer in the second adhesive composition, and therefore, in terms of changing the second adhesive composition to a high adhesive force state by heating.

The acrylic polymer in the second adhesive composition is obtained by polymerization of a monomer component (second monomer component) containing alkyl (meth)acrylate as a main component.

As the alkyl (meth)acrylate in the second monomer component, for example, the same as the alkyl (meth)acrylate in the above-mentioned first monomer component can be used. The blending ratio of the alkyl (meth)acrylate in the second monomer component is, for example, 50% by mass or more, preferably 60% by mass or more, and, for example, 80% by mass or less.

The second monomer component preferably contains a functional group-containing vinyl monomer copolymerizable with the alkyl (meth)acrylate. As the functional group-containing vinyl monomer, for example, the same ones as the functional group-containing vinyl monomer in the above-mentioned first monomer component can be used. The blending ratio of the functional group-containing vinyl monomer in the second monomer component is, for example, 5 mass% or more, preferably 10 mass% or more, more preferably 15 mass% or more, and, for example, 30 mass% or less, Preferably it is 20 mass% or less.

The acrylic polymer in the second adhesive composition can be formed by polymerizing a second monomer component containing an alkyl (meth)acrylate as a main component. As the polymerization method, for example, solution polymerization, bulk polymerization, and emulsion polymerization may be mentioned, and preferably, solution polymerization may be mentioned.

The ratio of the blending amount of the acrylic polymer in the second adhesive composition to the total amount of the acrylic polymer and the organosiloxane-containing polymer is, for example, 70% by mass or more, and, for example, 99% by mass or less , Preferably it is 90% by mass or less.

As the polymer containing organosiloxane, for example, acrylic, urethane, polyether, polyester, polycarbonate, and polybutadiene having an organosiloxane skeleton can be mentioned. As for the polymer, from the viewpoint of controlling the adhesive force, an acrylic polymer having an organosiloxane skeleton is suitably used.

The acrylic polymer having an organosiloxane skeleton is obtained by polymerization of a monomer component (a third monomer component) containing an alkyl (meth)acrylate and a monomer having an organosiloxane skeleton. As the alkyl (meth)acrylate in the third monomer component, for example, the same ones as the alkyl (meth)acrylate in the above-mentioned first monomer component can be used. As a monomer containing an organosiloxane skeleton, for example, a compound represented by the following general formula (1) or a compound represented by the general formula (2) can be used. In the general formula (1)(2), R ₁ represents hydrogen or a methyl group, R ₂ represents a methyl group or a monovalent organic group, and m and n are integers of 0 or more.

[化1]

[化2]

As a monomer containing an organosiloxane skeleton, commercially available products may also be used. Specifically, examples include: X-22-174ASX, X-22-2426, X-22-2475, and KF-2012 (above It is a single-end reactive silicone manufactured by Shin-Etsu Chemical Industry Co., Ltd.).

The functional group equivalent of the monomer containing the organosiloxane skeleton is, for example, 700 g/mol or more, preferably 800 g/mol or more, more preferably 850 g/mol or more, and still more preferably 1500 g/mol or more, and , For example, less than 20000 g/mol, preferably less than 15000 g/mol, more preferably less than 10000 g/mol, still more preferably less than 6000 g/mol, particularly preferably less than 5000 g/mol .

The ratio of the blending amount of the organosiloxane skeleton-containing monomer in the third monomer component to the total amount of the alkyl (meth)acrylate and the organosiloxane skeleton-containing monomer is, for example, 10% by mass or more , Preferably 15% by mass or more, more preferably 20% by mass or more, and, for example, 60% by mass or less, preferably 50% by mass or less, more preferably 40% by mass or less, and more preferably 30% by mass or less .

The third monomer component may also contain a functional group-containing vinyl monomer. As the functional group-containing vinyl monomer, for example, the same ones as the functional group-containing vinyl monomer in the above-mentioned first monomer component can be used.

The organosiloxane-containing polymer in the second adhesive composition can be formed by containing an alkyl (meth)acrylate and a monomer containing an organosiloxane skeleton, and optionally a vinyl monomer containing a functional group. The third monomer component is formed by polymerization. As the polymerization method, for example, solution polymerization, bulk polymerization, and emulsion polymerization may be mentioned, and preferably, solution polymerization may be mentioned. In the solution polymerization, for example, after preparing a reaction solution by mixing the third monomer component and, for example, the above-mentioned polymerization initiator in a solvent, the reaction solution is heated. Then, by the polymerization reaction of the third monomer component in the reaction solution, a polymer solution containing a polymer containing organosiloxane can be obtained. In this polymerization reaction, a chain transfer agent may also be used in order to adjust the molecular weight of the formed polymer.

In the second adhesive composition, from the viewpoint of introducing a cross-linking structure into the acrylic polymer and/or the organosiloxane-containing polymer blended therein, it is preferable to formulate a cross-linking agent. As the crosslinking agent in the second adhesive composition, for example, the same as those described above as the crosslinking agent in the first adhesive composition can be used.

In the second adhesive composition, other ingredients may be blended as needed. As other ingredients, for example, silane coupling agent, adhesiveness imparting agent, plasticizer, softener, anti-deterioration agent, filler, coloring agent, ultraviolet absorber (stabilization under fluorescent lamp or natural light) From the viewpoint of chemical conversion), antioxidants, surfactants, and antistatic agents.

The mixing ratio of the organosiloxane-containing polymer in the second adhesive composition relative to 100 parts by mass of the acrylic polymer is, for example, 0.1 parts by mass or more, preferably 0.3 parts by mass or more, more preferably 0.4 parts by mass Above, more preferably 0.5 parts by mass or more, more preferably 1 part by mass or more, most preferably 2 parts by mass or more, and, for example, 75 parts by mass or less, preferably 50 parts by mass or less, more preferably 20 parts by mass Hereinafter, it is more preferably 10 parts by mass or less, particularly preferably 8 parts by mass or less, most preferably 5 parts by mass or less.

From the viewpoint of ensuring sufficient adhesion to the adherend 10, the thickness of the adhesive layer 22 is, for example, 5 μm or more, preferably 10 μm or more, more preferably 15 μm or more, and even more preferably 20 μm. Above, from the viewpoint of handling properties, it is, for example, 300 μm or less, preferably 100 μm or less, more preferably 50 μm or less, still more preferably 40 μm or less, and particularly preferably 30 μm or less.

In the laminate X, as described above with reference to FIG. 2, the end face 21a of the base 21 of the film portion 20A on the adherend 10 that faces the film portion 20B, the farther away from the adherend 10, the more toward The inner side of the film portion 20A is slanted, and the end face 21b of the base material 21 of the film portion 20B on the adherend 10 that faces the film portion 20A, the farther away from the adherend 10, the more toward the inner side of the film portion 20B. The way of retreat is inclined. This configuration is suitable for bending the laminated body X in the direction indicated by the arrow R in FIG. 2 in the region between the film portions 20A and 20B in the adherend 10 to ensure a bending clearance for the bending (That is, it is suitable for suppressing the abutment of the film portions 20A, 20B with each other). In terms of obtaining such technical effects, for example, the above-mentioned respective inclination angles α of the end faces 21a, 21b are appropriately set according to the distance between the film portions 20A, 20B.

Assuming that the end surface 21a is not inclined as described above but is perpendicular to the second surface 12 of the adherend 10, depending on the distance between the adjacent film portions 20A, 20B, the end surfaces 21a, 20B of the film portions 20A, 20B 21b interfere with each other, and the laminated body X cannot adopt a proper folded back shape.

On the other hand, in the laminated body X of one embodiment of the present invention, since the end surfaces 21a and 21b are inclined as described above, the bending of the adherend 10 in the region between the film portions 20A and 20B (toward the arrow R Bending in the direction shown) to ensure that there is a gap in the bending. Therefore, even when the film portion 20A or its end surface 21a is arranged close to the film portion 20B or its end surface 21b, it is easy to obtain an appropriate folded back form.

Such a laminated body X is easy to obtain an appropriate folded back shape in which the bonding surface of the film 20 of the adherend 10 faces the inside. In addition, with regard to the laminated body X that is easy to obtain an appropriate folded back shape in this way, it is easy to design the distance between the film portions 20A and 20B on the adherend 10 to be short, and therefore it is easy to achieve miniaturization or weight reduction.

In addition, in the laminate X, as described above, the adhesive layer 22 in the film portion 20A has a modified portion 22a on the side edge of the film portion 20B, and the adhesive layer 22 in the film portion 20B is on the side edge of the film portion 20A. The end has a modified portion 22b. Such a configuration is suitable for suppressing the exudation of the constituent components of the adhesive layer at the end faces 21a, 21b of the film portions 20A, 20B.

3A to 3D show a method of manufacturing the above-mentioned laminate X. The manufacturing method includes a preparation step, an attaching step, a cutting step, a peeling step, and an adhesive force increasing step.

First, in the preparation step, as shown in FIG. 3A, the above-mentioned adherend 10 and film 20' as soft adherends are prepared. The adherend 10 has the first surface 11 and the second surface 12 as described above. The film 20' includes the above-mentioned substrate 21 and the adhesive layer 22 in the above-mentioned low adhesion state.

The film 20' can be produced, for example, by applying an adhesive composition on the substrate 21 to form a coating film, and drying the solvent from the coating film to remove it as necessary. As the coating method of the adhesive composition, for example, roll coating, touch roll coating, gravure coating, reverse coating, roll brush coating, spray coating, dip roll coating, bar coating Coating, knife coating, air knife coating, curtain coating, die lip coating, and die nozzle coating. The drying temperature for removing the solvent is, for example, 50°C or higher, preferably 70°C or higher, more preferably 100°C or higher, and, for example, 200°C or lower, preferably 180°C or lower, more preferably 150°C or lower. The drying time is, for example, 5 seconds or more, preferably 10 seconds or more, and for example, 20 minutes or less, preferably 15 minutes or less, and more preferably 10 minutes or less. When the adhesive composition used contains a cross-linking agent, the cross-linking reaction involving the cross-linking agent in the adhesive composition proceeds by aging at the same time as the above-mentioned drying or afterwards. The aging conditions are appropriately set according to the type of crosslinking agent. The aging temperature is, for example, 20°C or higher, and, for example, is 160°C or lower, preferably 100°C or lower. The aging time is, for example, 1 minute or more, preferably 12 hours or more, more preferably 1 day or more, and, for example, 7 days or less. In addition, regarding the film 20' after manufacture, a release film may be laminated on the side of the adhesive layer 22 opposite to the base material 21 as needed. As such a release film, flexible plastic films, such as a polyethylene film, a polypropylene film, a polyethylene terephthalate film, and a polyester film, are mentioned, for example.

Next, in the attaching step, as shown in FIG. 3B, the film 20 ′ is attached to the adherend 10. The film 20' is attached to the second surface 12 side of the adherend 10 with the adhesive layer 22 side. The adhesive force of the adhesive layer 22 (in a low adhesive force state) of the film 20' is, for example, 4 N/25 mm or less, preferably 1 N/25 mm or less. The adhesive force of the film 20' with the adhesive layer 22 is set to the value measured by a peeling test, which is a test piece cut out from the film 20' as needed and attached to the polyamide at 25°C The surface of the amine film is then peeled off from the polyimide film. In this peeling test, the peeling temperature was set to 25°C, the peeling angle was set to 180°, and the peeling speed was set to 300 mm/min.

When the adhesive layer 22 of the film 20' is composed of the above-mentioned first adhesive composition (including acrylic polymer, light curing agent, and photopolymerization initiator), the light curing agent in the adhesive layer 22 In an uncured state, the adhesive layer 22 can obtain a low adhesive force state. When the adhesive layer 22 of the film 20' is composed of the above-mentioned second adhesive composition (containing an acrylic polymer and a polymer containing organosiloxane), the adhesive layer 22 contains organosilicon The polyorganosiloxane part of the side chain of the oxane polymer is relatively low-polarity in the adhesive layer 22 and tends to be segregated on the side surface of the adherend 10 of the adhesive layer 22 and its vicinity, so it adheres The agent layer 22 can obtain a low adhesive force state.

The configuration in which the adhesive layer 22 of the film 20' used in the attaching step is in a low adhesive force state is suitable in terms of ensuring the reworkability in this step. The film 20' requires light peelability for proper peeling from the adherend 10, so that poor adhesion occurs in this step (the position of the film 20' relative to the adherend 10 is shifted, or air bubbles are mixed into the adherend 10). In the case of between the adhesive body 10 and the film 20'), the replacement film 20' can be used for the attaching operation. The film 20' in which the adhesive layer 22 is in a low adhesive force state (the adhesive layer 22 can be changed to a high adhesive force state afterwards) is suitable for ensuring reworkability with respect to the attaching operation of the film 20' to the adherend 10, and in After proper attachment, a sufficient bonding state to the adherend 10 is ensured.

Then, in the cutting step, as shown in FIG. 3C, the film 20' on the adherend 10 is subjected to a cutting process to form a notch G (in FIG. 3C, the notch is represented by a thick solid line), The film 20' partitions and forms a second region portion S2 between the two separated first region portions S1 and the first region portion S1. The first region portion S1 is a region constituting the above-mentioned film 20 (film portions 20A, 20B) in the manufactured laminate X. The second area portion S2 is an area that is removed as described below. As the method of cutting in this step, for example, cutter cutting and laser cutting can be mentioned. As the tool for cutting the tool, for example, a rotary knife, a Thomson blade, and a Pinnacle blade can be mentioned. As the laser used for laser cutting, for example, CO ₂ laser or YAG laser can be cited.

In the cutting step, the notch G that distinguishes each of the first region portion S1 and the second region portion S2 is as shown in FIG. 4, and the wider the groove G is as it moves away from the adherend 10 toward the base material 21 side. The groove G is a V-shaped groove with a V-shaped cross section. That is, the cut end surface Ga on the second area portion S2 side in each first area portion S1 is inclined so as to be retracted toward the inner side of the first area portion S1 as the position farther away from the adherend 10 is moved. Regarding the inclination of the cutting end surface Ga of the groove G (for example, the angle equivalent to the above-mentioned inclination angle α), in the cutting of the tool, it can be adjusted by appropriately selecting the cutting edge angle of the cutting tool used. During the cutting, it can be adjusted by appropriately adjusting the irradiation conditions such as the irradiation energy, irradiation diameter, and irradiation position of the laser.

In the cutting step in this embodiment, the adhesive layer 22 of each first region portion S1 forms modified portions 22a, 22b facing the cut groove G between the second region portion S2. The modified portions 22a and 22b can be formed, for example, by locally increasing the temperature of the adhesive layer 22 when the groove is formed. As described above, the modified portions 22a and 22b are suitable for suppressing the exudation of the constituent components of the adhesive layer 22.

In the cutting step as described above, the notch G that distinguishes each of the first area portion S1 and the second area portion S2 can also be half-cut to the film 20' from the side of the base material 21 to the middle of the adhesive layer 22 To form. In the half-cutting, the base material 21 is cut along its entire thickness direction and cut to a position halfway in the thickness direction of the adhesive layer 22. The cutting depth of the adhesive layer 22 in the half-cut is, for example, 70% or more, preferably 80% or more, more preferably 90% or more, for example, less than 100% of the entire thickness (100%) of the adhesive layer 22 , Preferably it is 99% or less, more preferably 98% or less. Regarding the remaining thickness in the adhesive layer 22 after such half-cutting, it can be appropriately set according to the relationship with the viscoelasticity and other physical properties of the adhesive layer 22 and the peeling force.

Such half-cut processing is suitable for reducing the influence of heat generated by cutting processing such as laser cutting on the adherend 10, and therefore, is suitable for suppressing the heat history of the adherend 10 caused by the cutting step. For example, when the adherend 10 is an electronic device such as a flexible display panel or a flexible printed wiring board, the half-cutting process as described above can avoid or reduce the impact on various components or wiring on the first surface 11 side of the adherend 10 It is suitable in terms of thermal influence.

Then, in the peeling step, as shown in FIG. 3D, the second area portion S2 divided and formed between the first area portions S1 is peeled from the adherend 10. The adhesive layer 22 in the second area portion S2 on the adherend 10 is in a low adhesive force state as described above, and as a result, this configuration is in terms of properly peeling the second area portion S2 from the adherend 10 Better.

Moreover, in this peeling step, in terms of suppressing the so-called paste residue, it is suitable to perform half-cutting as described above in the cutting step before the peeling step. When the film 20' on the adherend 10 is cut along the entire thickness direction, depending on the cutting method and cutting conditions, the adhesive layer 22 located between the adherend 10 and the film 20' The part of the adhesive layer 22 facing the interface is easily fixed to the adherend 10 (local fixation of the adhesive) due to the local heating or pressing force in the composition material of the adhesive layer near the interface. For example, when the adhesive layer 22 is composed of the above-mentioned first adhesive composition, the light hardening agent such as polyfunctional (meth)acrylate in the composition is hardened to produce localized solidification of the adhesive. With. In the cutting step, the structure in which an uncut adhesive part is preliminarily left between the bottom end of the groove G and the adherend 10 by half-cutting as described above is suitable for avoiding adhesion at the interface and its vicinity. The agent layer constitutes the effect of local heating or pressing force in the material. In addition, there is a configuration in which an uncut adhesive portion is left between the bottom end of the groove G and the adherend 10 by the half-cut as described above, which is preferable in terms of the following aspects, that is, use The cohesive force of the remaining portion of the adhesive peels off the second region S2 or the adhesive layer 22 from the surface of the adherend 10 without adhesive residue (paste residue).

Then, in the adhesive force increasing step, the adhesive force of the adhesive layer 22 in the first region portion S1 is increased. When the adhesive layer 22 of the film 20' is composed of the above-mentioned first adhesive composition (containing an acrylic polymer, a light curing agent, and a photopolymerization initiator), in the peeling step, the adhesive layer 22 Irradiate active energy rays such as ultraviolet rays or electron beams. Thereby, through the polymerization or hardening of the light hardener in the adhesive layer 22, the adhesive layer 22 becomes a state of high adhesion. When the adhesive layer 22 of the film 20' is composed of the above-mentioned second adhesive composition (including an acrylic polymer and an organosiloxane-containing polymer), in the peeling step, the adhesive layer 22 is heating. The heating temperature is, for example, 40°C or higher, preferably 50°C or higher, more preferably 60°C or higher, and, for example, less than 150°C, preferably 120°C or lower, more preferably 100°C or lower, and more preferably 80°C. ℃ below. The heating time is, for example, 1 hour or less, preferably 30 minutes or less, more preferably 10 minutes or less, still more preferably 5 minutes or less, and, for example, 1 minute or more. By this heating, the compatibility between the acrylic polymer and the organosiloxane-containing polymer in the adhesive layer 22 becomes higher. The organosiloxane-containing polymer or the polyorganosiloxane as its side chain The part (in the low adhesive force state, there is a tendency to concentrate on the side surface of the adherend 10 of the adhesive layer 22 and its vicinity) thermally diffuse, and the acrylic layer on the side surface of the adherend 10 of the adhesive layer 22 and its vicinity The presence ratio of polymers has increased. Thereby, the adhesive layer 22 becomes a high adhesive force state. The adhesive force of the adhesive layer 22 in a state of high adhesive force is, for example, 5 N/25 mm or more, preferably 8 N/25 mm or more, more preferably 10 N/25 mm or more, and more preferably 12 N/25 mm above. In addition, with respect to the adhesive force of the adhesive layer 22 in a low adhesive force state, the adhesive force of the adhesive layer 22 in a high adhesive force state is, for example, 2 times or more, preferably 4 times or more, and more preferably 8 times or more. , And more preferably 10 times or more.

In this step, the adhesive layer 22 of the first area portion S1 is exposed to external stimuli such as active energy ray irradiation or heating as described above to make the adhesive layer of each first area portion S1 on the adherend 10 22 changes to a state of high adhesion. Thereby, in the 1st area|region part S1 derived from the film 20, the bonded state with respect to the to-be-adhered body 10 becomes firm. Such a structure is suitable in terms of leaving the first region S1 as a structural material in the layered body X. The first region S1 where the adhesive layer 22 is in a state of high adhesive force constitutes the film portions 20A and 20B in the laminate X.

According to the laminated body manufacturing method including each step as described above, the above-mentioned laminated body X can be suitably manufactured. Therefore, according to the present manufacturing method, the same effects as those described above with respect to the laminate X can be enjoyed in the manufactured laminate X. In addition, in this manufacturing method, it is not necessary to individually attach a plurality of film portions 20A and 20B as a reinforcing material to the adherend 10. Such a manufacturing method contributes to the efficiency of the manufacturing of the laminated body X or the device for assembling it. [Industrial availability]

The laminate of the present invention can be applied to, for example, a flexible device component in which a plurality of reinforcing films are attached to the same surface side.

10: Adhered body (soft adhered body) 11: Side 1 12: Side 2 20: Membrane (reinforcing membrane) 20': Membrane 20A: Membrane part (1st membrane part) 20B: Membrane part (Second membrane part) 21: Substrate 21a: End face (first inclined end face) 21b: End face (2nd inclined end face) 22: Adhesive layer 22a: Modified Department 22b: Modified Department D1: thickness direction D2: Face direction G: Grooving Ga: Cut off the end face R: Arrow S1: Division 1 S2: Area 2 X: layered body α: Tilt angle

Fig. 1 is a perspective view of a laminate in one embodiment of the present invention. Fig. 2 is a partial enlarged cross-sectional view of the laminated body shown in Fig. 1. Fig. 3A shows a part of the steps in the method of manufacturing the laminate shown in Figs. 1 and 2, Fig. 3B shows a step after the step shown in Fig. 3A, and Fig. 3C shows a step after the step shown in Fig. 3B, 3D represents the steps following the steps shown in FIG. 3C. Figure 4 is a partial enlarged view of Figure 3C.

10: Adhered body (soft adhered body)

11: First side 11

12: Second side 12

20: Membrane (reinforcing membrane)

20A: Membrane part (1st membrane part)

20B: Membrane part (Second membrane part)

21: Substrate

21a: End face (first inclined end face)

21b: End face (2nd inclined end face)

22: Adhesive layer

22a: Modified Department

22b: Modified Department

D1: thickness direction

D2: Face direction

R: Arrow

α: Tilt angle

Claims (5)

A laminated body characterized in that it has a soft adherend, and In the case of a reinforcing film, the reinforcing film includes a substrate and an adhesive layer on the substrate and is attached to the soft adherend with the adhesive layer side, and The reinforcing film includes a first reinforcing film portion and a second reinforcing film portion that are separated and adjacent to each other on the soft adherend, and The base material of the first reinforcing film portion has a first inclined end surface facing the second reinforcing film portion, and the first inclined end surface is located inwardly of the first reinforcing film portion as it is farther away from the soft adherend The way of retreat is inclined, The base material of the second reinforcing film portion has a second inclined end surface facing the first reinforcing film portion, and the second inclined end surface is moved toward the inside of the second reinforcing film portion as it is farther away from the soft adherend The way of retreat is inclined. The laminate of claim 1, wherein the adhesive layer of the first reinforcing film portion has a modified portion at the side edge of the second reinforcing film portion, and the adhesive layer of the second reinforcing film portion is on the first The side edge of the reinforcing film part has a modified part. A method for manufacturing a laminate, which is characterized in that it includes: A step of attaching a reinforcing film comprising a substrate and an adhesive layer on the substrate to the soft adherend with the adhesive layer side; The cutting step involves forming grooves on the reinforcing film on the soft adherend, and dividing the reinforcing film into two separate first area portions and a second area between the first area portion Part, and the notch that distinguishes each first area part from the second area part, the wider the softer the adherend is, the farther away from the above-mentioned soft adherend; The step of peeling the second region from the soft adherend; and The step of increasing the adhesive force is to increase the adhesive force of the adhesive layer in the first region. The method for manufacturing a laminate according to claim 3, wherein in the cutting step, a modified portion facing the cut groove between the second area portion and the adhesive layer of each first area portion is formed. The method of manufacturing a laminate according to claim 3 or 4, wherein in the cutting step, the notch system for distinguishing each of the first area portion and the second area portion provides the reinforcing film from the base material side to the adhesion The agent layer is formed by half-cutting halfway through.

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