TWI832646B - Package plate and method of making thereof - Google Patents

Abstract

A manufacturing method of a package plate is provided. The manufacturing method of a package plate including providing a substrate, and a composite material layer is provided on the surface of the substrate. In the scribing step, at least one groove is formed in the composite material layer by means of a laser. In the spraying step, the shielding material is sprayed directly toward the at least one groove, and the shielding material forms a deposition layer attached to the surface of the at least one groove. In the cutting step, a cutting path is preset on the outside of the groove, and another laser means is used to cut the substrate along the cutting path to obtain a package plate.

Description

Packaging plate and its manufacturing method

The present invention relates to a method for manufacturing a packaging panel, and in particular to a method for manufacturing a packaging panel with a shielding material layer.

With the evolution of technology, electronic components in electronic products often require mechanisms to shield magnetic fields due to user needs. For example, an antenna is provided with a shielding layer on its substrate.

The existing shielding layer setting technology is to spray electromagnetic shielding material on the entire substrate. However, for products that require shielding material only in specific areas (selective areas), the areas that do not need to be sprayed must be covered by a protective layer or mask, that is, Increased manufacturing steps and costs.

Therefore, how to improve the use of spray shielding materials, simplify the process and save manufacturing costs through the improvement of process technology to overcome the above-mentioned defects has become one of the important issues to be solved by this business.

The technical problem to be solved by the present invention is to provide a method for manufacturing a packaging panel and a packaging panel in view of the shortcomings of the existing technology.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a method for manufacturing a packaging panel, which includes: providing a substrate, and a composite material layer is provided on the surface of the substrate. In the scribing step, at least one groove is formed in the composite material layer using laser means. In the spraying step, a shielding material is sprayed outside the at least one trench directly toward the at least one trench, and the shielding material forms a deposition layer attached to the inner wall of the at least one trench. In the cutting step, a cutting path is preset outside the trench, and another laser means is used to cut the substrate along the cutting path to obtain a packaging plate.

In one possible embodiment, the barrier material includes a surfactant.

In a possible embodiment, the manufacturing method of the packaging board further includes a blowing step. After performing the spraying step, blowing off the surface of the substrate to blow off a portion of the remaining layer of shielding material deposited outside at least one trench.

In a possible embodiment, a blowing step is further included. After the cutting step is performed, the surface of the substrate is blown away to blow away the remaining layer of a portion of the shielding material deposited outside the at least one trench.

In a possible embodiment, the blowing step is performed using dry ice.

In a feasible embodiment, the depth of the trench is greater than or equal to 5 μm.

In a feasible embodiment, the thickness of the deposited layer is less than or equal to 5 μm.

In a feasible embodiment, the shielding material includes a plurality of copper powders, which account for more than 90% of the entire shielding material.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a packaging plate, which includes a substrate, a composite material layer and a deposition layer. The composite material layer is located on the substrate. The composite material layer is provided with at least one groove, and the depth of the groove in a longitudinal direction is greater than or equal to 5 μm. The deposition layer is located in the trench, the thickness of the deposition layer in the longitudinal direction is less than or equal to 5 μm, and the deposition layer is composed of a shielding material.

One of the beneficial effects of the present invention is that the manufacturing method of the packaging plate provided by the present invention can be achieved by "spraying shielding material directly toward at least one trench" and "shielding material forming a deposition layer attached to the inner wall surface of at least one trench" "On" technical solutions to reduce the process of system packaging (SiP: System in a Package) and save process costs.

In order to further understand the features and technical content of the present invention, please refer to the following Regarding the detailed description and drawings of the present invention, the drawings provided are only for reference and illustration and are not used to limit the present invention.

200:Packaging section

22:Substrate

24:Composite material layer

241:Trench

26:Sediment layer

261:Remaining layer

D: Depth

H:Thickness

P: clipping path

S100, S100’: Manufacturing method of packaging plate

S1-S4: Steps

S10: Steps

FIG. 1 is a flow chart of a method for manufacturing a packaging panel according to a first embodiment of the present invention.

FIG. 2 is a schematic diagram corresponding to step S1 of the embodiment shown in FIG. 1 .

FIG. 3 is a schematic diagram corresponding to step S2 of the embodiment shown in FIG. 1 .

FIG. 4 is a schematic diagram corresponding to step S3 of the embodiment shown in FIG. 1 .

FIG. 5 is a schematic diagram corresponding to step S4 of the embodiment shown in FIG. 1 .

FIG. 6 is a schematic diagram of the trench in the embodiment shown in FIG. 3 .

FIG. 7 is a schematic diagram of the appearance of a packaging module according to an embodiment of the present invention.

FIG. 8 is a schematic diagram taking VIII-VIII as a cross-section in the embodiment shown in FIG. 7 .

FIG. 9 is a flow chart of a method for manufacturing a packaging panel according to a second embodiment of the present invention.

FIG. 10 is a schematic diagram of the deposited layer after step S3 in the embodiment shown in FIG. 9 .

FIG. 11 is a schematic diagram of the deposited layer after step S10 in the embodiment shown in FIG. 9 .

The following is a specific embodiment to illustrate the implementation of the "packaging plate manufacturing method" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not Depiction of actual size, stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the scope of the present invention.

In addition, the term "or" used in this article shall include any one or combination of more of the associated listed items depending on the actual situation.

[First Embodiment]

Please refer to FIG. 1 , which is a step flow chart of a packaging module manufacturing method S100 according to the first embodiment of the present invention. Referring also to FIGS. 2 to 5 , FIG. 2 is a schematic diagram corresponding to step S1 of the embodiment shown in FIG. 1 . FIG. 3 is a schematic diagram corresponding to step S2 of the embodiment shown in FIG. 1 . FIG. 4 is a schematic diagram corresponding to step S3 of the embodiment shown in FIG. 1 . FIG. 5 is a schematic diagram corresponding to step S4 of the embodiment shown in FIG. 1 .

The manufacturing method S100 of the packaging panel includes the following steps: providing step S1: providing a substrate 22 with a composite material layer 24 provided on the surface of the substrate 22. Scoring step S2: Use laser means to form at least one groove 241 in the composite material layer 24. Spraying step S3: Spray the shielding material directly toward at least one trench 241. The shielding material forms a deposition layer 26 attached to the inner wall surface of at least one trench 241 (as shown in FIGS. 3 and 4, directly facing outside the trench 241). Groove 241 spraying). Cutting step S4: A cutting path P is preset outside the trench 241, and another laser means is used to cut the substrate 22 along the cutting path P to obtain the packaging panel 200.

The substrate 22 may be, but is not limited to, a bakelite board. According to some embodiments, the substrate 22 is a fiberglass board or a plastic board. There is a composite material layer 24 on the substrate 22, which may be but is not limited to a plastic layer, such as epoxy resin. In the scribing step, using laser means to create the trench 241 can increase the surface roughness of the inner wall of the trench 241 (including the bottom wall), so that the deposition layer 26 formed of the shielding material can easily adhere to the inner wall of the trench 241 superior.

Please refer to FIGS. 6 to 8 . FIG. 6 is a schematic diagram of the trench 241 in the embodiment shown in FIG. 3 . FIG. 7 is a schematic diagram of the appearance of the packaging module 200 according to an embodiment of the present invention. FIG. 8 is a schematic diagram of the embodiment shown in FIG. 7 , taking line 8-8 as a cross-section. The thickness H of the deposited layer 26 may be greater than, equal to, or less than the depth of the trench 241 Degree D. According to some embodiments, the depth D of the trench 241 is greater than or equal to 5 μm. According to some embodiments, the thickness H of the deposition layer 26 is less than 6 μm. Preferably, the thickness H of the deposition layer 26 is less than or equal to 5 μm.

According to some embodiments, the main component of the shielding material is copper powder (Cu), the copper component accounts for more than 95%, and the copper powder has better deposition performance (high density). In some embodiments, in addition to the shielding material mainly composed of copper powder, surfactant is added and sprayed into the trench 241 together. In this way, compared with the deposition layer 26 formed by the shielding material without adding surfactant, , which can improve the compactness of the deposited layer. In other words, adding surfactant to the shielding material can improve the agglomeration produced during the flow and forming of copper powder, so that the deposition layer 26 can be evenly distributed in the trench 241, as shown in FIG. 8 .

The distance between the sprayed shielding material and the trench 241 and the temperature of the shielding material will affect the density of the copper powder in the deposition layer 26. According to some embodiments, the aforementioned distance is 40 mm to 60 mm. According to some embodiments, the aforementioned temperature is 80 degrees C to 100 degrees C. However, the present invention is not limited and the distance and temperature settings can be changed depending on the user's needs. The aforementioned "spraying", according to some embodiments, refers to sputtering. According to some embodiments, it refers to spraying, which is not limited by the present invention.

According to an embodiment, after the deposition layer 26 is deposited, a high-temperature and high-humidity test is performed. Under the conditions of 300 hours, a temperature of 85 degrees, and a humidity of 85%, the impedance of the deposition layer 26 is maintained below 0.2 ohms (Ω), and the deposition layer 26 still has a good adhesion relationship with the groove 241. According to an embodiment, after the deposition layer 26 is deposited, a high temperature and high humidity test is performed. Under the conditions of 300 hours, a temperature of 85 degrees, and a humidity of 85%, the impedance of the deposition layer 26 is 0.19 ohms (Ω).

[Second Embodiment]

Please refer to FIG. 9 , which provides a step flow chart of a packaging module manufacturing method S100' according to the second embodiment of the present invention. Referring also to FIGS. 10 and 11 , FIG. 10 is a schematic diagram of the deposited layer after step S3 in the embodiment shown in FIG. 9 . Figure 11 corresponds to the embodiment shown in Figure 9. After step S10, Schematic diagram of sedimentary layers. According to this embodiment, the manufacturing method S100 of the packaging panel further includes: blowing step S10: after the spraying step S3, blowing off the surface of the substrate 22 to blow off the remaining layer of the shielding material deposited outside at least one trench 241. 261. As shown in FIG. 10 , when the shielding material is deposited in the trench 241 , a burr phenomenon will occur at the boundary of the trench 241 . The burr phenomenon is the remaining layer 261 . Through the blowing step, the remaining layer 261 can be removed. The remaining layer 261 is removed, so that there is no shielding material on the surface of the substrate 22 that does not require shielding material, thereby improving the burr phenomenon (see Figure 11). According to some embodiments, the blowing step S10 is performed after the cutting step S4, which has the same benefit of improving the burr phenomenon.

Preferably, the blowing step uses dry ice to blow off the surface of the substrate 22 to remove the remaining layer 261 .

Please refer to FIG. 7 again. The present invention also provides a packaging module 200 according to an embodiment. The packaging module 200 includes a substrate 22 , a composite material layer 24 and a deposition layer 26 . The composite material layer 24 is located on the substrate 22. The composite material layer 24 is provided with at least one groove 241, and the depth D (see Figure 6) of the groove 241 in a longitudinal direction is greater than or equal to 5 μm. The deposition layer 26 is located in the trench 241. The thickness H (see FIG. 8) of the deposition layer 26 in the longitudinal direction is less than or equal to 5 μm, and the deposition layer 26 is composed of a shielding material. Please refer to the above for descriptions of the substrate 22, the composite material layer 24 and the deposition layer 26.

[Beneficial effects of the embodiment]

One of the beneficial effects of the present invention is that the manufacturing method S100 of the packaging plate provided by the present invention can pass through the "spraying step of directly spraying a shielding material toward at least one trench 241" and "the shielding material forming deposition layer 26 is attached to The technical solution is "on the inner wall of at least one trench 241" to reduce the process of system packaging (SiP: System in a Package) and save process costs.

To further explain, there is no need to provide a protective layer or mask in the areas on the substrate 22 that do not need to be shielded. According to the user's needs, a groove 241 is carved by laser means, and then the shielding material is sprayed into the groove 241 by direct spraying. . According to the manufacturing method S100 of the packaging plate provided by the present invention, the sprayed The tolerance accuracy of the pattern size of the coating reaches ±10 μm, and the thickness H of the deposition layer 26 can be less than or equal to 5 μm. Compared with the existing technology, the thickness of the deposition layer is about 6 to 8 μm. The manufacturing method S100 of the packaging plate of the present invention has Outstanding technical performance.

The contents disclosed above are only preferred and feasible embodiments of the present invention, and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

S100: Manufacturing method of packaging plate

S1-S4: Steps

Claims (9)

A method for manufacturing a packaging panel, which includes: a step of providing a substrate with a composite material layer provided on the surface of the substrate; and a scribing step of using a laser to form at least one layer of composite material in the composite material layer. Trench; a spraying step of spraying a shielding material directly outside the at least one trench toward the at least one trench, and the shielding material forms a deposition layer attached to the inner wall of the at least one trench; and In a cutting step, a cutting path is preset outside the trench, and another laser means is used to cut the substrate along the cutting path to obtain the packaging plate. The manufacturing method of a packaging panel as claimed in claim 1, wherein in the spraying step, a surfactant is added to mix with the shielding material and sprayed on the at least one groove at the same time. The manufacturing method of the packaging board according to claim 1, further comprising a blowing step. After performing the spraying step, blowing off the surface of the substrate to blow off part of the shielding material in the at least one groove. A residual layer deposited outside the tank. The manufacturing method of the packaging board according to claim 1, further comprising a blowing step. After performing the cutting step, blowing off the surface of the substrate to blow off part of the shielding material in the at least one groove. A residual layer deposited outside the tank. The method for making a package plate as described in claim 3 or 4, wherein the blowing step is to use dry ice. The method for manufacturing a packaging plate as claimed in claim 1, wherein the depth of the trench is greater than or equal to 5 μm. The manufacturing method of a packaging plate according to claim 1, wherein the thickness of the deposition layer is less than or equal to 5 μm. The manufacturing method of a packaging panel as described in claim 1, wherein the shielding material includes a plurality of copper powders, which account for more than 90% of the entire shielding material. A packaging plate made by the method of making a packaging plate according to claim 1.

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