CN115954279A - Package plate and manufacturing method thereof - Google Patents
Package plate and manufacturing method thereof Download PDFInfo
- Publication number
- CN115954279A CN115954279A CN202211623457.9A CN202211623457A CN115954279A CN 115954279 A CN115954279 A CN 115954279A CN 202211623457 A CN202211623457 A CN 202211623457A CN 115954279 A CN115954279 A CN 115954279A
- Authority
- CN
- China
- Prior art keywords
- shielding material
- layer
- substrate
- groove
- trench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Dicing (AREA)
- Laser Beam Processing (AREA)
Abstract
A manufacturing method of a packaging plate comprises the steps of providing a substrate, and arranging a composite material layer on the surface of the substrate. And a scribing step, wherein at least one groove is formed in the composite material layer by a laser means. And a spraying step of directly spraying a shielding material towards the at least one groove, wherein the shielding material forms a deposition layer to be attached to the inner wall surface of the at least one groove. And a cutting step, wherein a cutting path is preset at the outer side of the groove, and the substrate is cut along the cutting path by another laser means to obtain a packaging plate.
Description
Technical Field
The present invention relates to a method for manufacturing a package board, and more particularly, to a method for manufacturing a package board having a shielding material layer.
Background
With the development of technology, electronic components in electronic products often need a mechanism for shielding magnetic fields according to the needs of users. For example, the antenna is provided with a shielding layer on its substrate.
The conventional shielding layer disposing technique is to spray electromagnetic shielding material on the whole substrate, however, for the product requiring shielding material only in a specific area (selective area), the area not to be sprayed must be shielded by a protective layer or a mask, which increases the process and cost.
Therefore, how to improve the use of the spray shielding material, simplify the process and save the manufacturing cost by improving the process technology has become one of the important issues to be solved by the industry.
Disclosure of Invention
The present invention provides a method for manufacturing a package board and a package board, which are directed to overcome the disadvantages of the prior art.
In order to solve the above technical problem, one of the technical solutions adopted by the present invention is to provide a method for manufacturing a package board, including: providing a substrate, wherein a composite material layer is arranged on the surface of the substrate. And a scribing step, wherein at least one groove is formed in the composite material layer by a laser means. And a spraying step, namely directly spraying a shielding material towards the at least one groove, wherein the shielding material forms a deposition layer to be attached to the inner wall surface of the at least one groove. And a cutting step, wherein a cutting path is preset at the outer side of the groove, and the substrate is cut along the cutting path by another laser means to obtain a packaging plate.
In one possible embodiment, the shielding material includes a surfactant.
In a possible embodiment, the method for manufacturing a package plate further comprises a blowing step, after the spraying step is performed, of blowing off the surface of the substrate to blow off a portion of the remaining layer of the shielding material deposited outside the at least one trench.
In a possible embodiment, the method further comprises a step of blowing off the surface of the substrate after the step of cutting is performed, so as to blow off part of the remaining layer of the shielding material deposited outside the at least one trench.
In a possible embodiment, the blowing step is performed with dry ice.
In a possible embodiment, the depth of the trench is greater than or equal to 5 μm.
In a possible embodiment, the thickness of the deposited layer is less than or equal to 5 μm.
In one possible embodiment, the shielding material includes a plurality of copper powders that are greater than 90% of the total shielding material.
In order to solve the above technical problems, one of the technical solutions of the present invention is to provide a package board, which includes a substrate, a composite material layer, and a deposition layer. The composite material layer is arranged on the substrate and is provided with at least one groove, and the depth of the groove in a longitudinal direction is more than or equal to 5 mu m. The deposition layer is located in the trench, the deposition layer has a thickness of 5 μm or less in the longitudinal direction, and the deposition layer is made of a shielding material.
One of the advantages of the present invention is that the method for manufacturing the Package board provided by the present invention can reduce the process of System in a Package (SiP) and save the process cost by the technical solutions of "directly spraying the shielding material toward the at least one trench" and "forming the deposition layer by the shielding material to be attached to the inner wall surface of the at least one trench".
For a better understanding of the features and technical content of the present invention, reference is made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.
Drawings
Fig. 1 is a flowchart illustrating a method for fabricating a package board according to a first embodiment of the present invention.
Fig. 2 is a schematic diagram of step S1 corresponding to the embodiment shown in fig. 1.
Fig. 3 is a schematic diagram of step S2 corresponding to the embodiment shown in fig. 1.
Fig. 4 is a schematic diagram of step S3 corresponding to the embodiment shown in fig. 1.
Fig. 5 is a schematic diagram of step S4 corresponding to the embodiment shown in fig. 1.
Fig. 6 is a schematic view of a trench in the embodiment of fig. 3.
Fig. 7 is an external view of a package board according to an embodiment of the invention.
FIG. 8 is a schematic sectional view taken along line VIII-VIII in the embodiment shown in FIG. 7.
Fig. 9 is a flowchart illustrating a method for fabricating a package board according to a second embodiment of the present invention.
Fig. 10 is a schematic diagram corresponding to the embodiment shown in fig. 9, illustrating the deposition layer after step S3.
Fig. 11 is a schematic diagram corresponding to the embodiment shown in fig. 9, after step S10, of depositing a layer.
Detailed Description
The following description will be made of specific embodiments of the "method for manufacturing a package board" and the "package board" of the present invention, and those skilled in the art will understand the advantages and effects of the present invention from the disclosure of the present specification. The invention is capable of other and different embodiments and its several details are capable of modifications and various changes in detail without departing from the spirit and scope of the present invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
[ first embodiment ]
Referring to fig. 1, a flowchart of a method S100 for manufacturing a package board according to a first embodiment of the invention is shown. Referring to fig. 2 to 5, fig. 2 is a schematic view of step S1 corresponding to the embodiment shown in fig. 1. Fig. 3 is a schematic diagram of step S2 corresponding to the embodiment shown in fig. 1. Fig. 4 is a schematic diagram of step S3 corresponding to the embodiment shown in fig. 1. Fig. 5 is a schematic diagram of step S4 corresponding to the embodiment shown in fig. 1.
The method S100 for manufacturing a package board includes the following steps: providing step S1: a substrate 22 is provided with a composite layer 24 on a surface of the substrate 22. A scribing step S2: at least one trench 241 is formed in the composite layer 24 by laser means. A spraying step S3: the shielding material is directly sprayed toward the at least one trench 241, and the shielding material forms the deposition layer 26 attached to the inner wall surface of the at least one trench 241. A cutting step S4: a cutting path P is preset outside the groove 241, and another laser means is used to cut the substrate 22 along the cutting path P to obtain the package plate 200.
Referring to fig. 6 to 8, fig. 6 is a schematic view of a trench 241 in the embodiment shown in fig. 3. Fig. 7 is an external view of a package board 200 according to an embodiment of the invention. FIG. 8 is a cross-sectional view of the embodiment shown in FIG. 9, taken along line 8-8. The thickness H of the deposited layer 26 may be higher than, equal to, or less than the depth D of the trench 241. According to some embodiments, the depth D of the trench 241 is equal to or greater than 5 μm. According to some embodiments, the thickness H of the deposition layer 26 is less than 6 μm, preferably, the thickness H of the deposition layer 26 is less than or equal to 5 μm.
According to some embodiments, the shielding material has copper powder (Cu) as a major component, the percentage of the Cu component being greater than 95.0%, and the Cu powder has better deposition performance (higher degree of densification). In some embodiments, in addition to the shielding material based on copper powder, a surfactant is added and sprayed into the trenches 241, thereby improving the compactness of the deposited layer compared to the deposited layer 26 formed by the shielding material without the added surfactant. In other words, by adding the surfactant to the shielding material, the agglomeration (aggregation) generated during the flowing and forming of the copper powder can be improved, and the deposited layer 26 can be uniformly distributed in the trench 241, as shown in fig. 8.
The distance between the sprayed shielding material and the trench 241 and the temperature of the shielding material, which may affect the densification of the copper powder in the deposited layer 26, may be 40mm to 60mm according to some embodiments, and may be 80C to 100C according to some embodiments. However, the present invention is not limited thereto, and the setting of the distance and the temperature may be changed according to the user's needs. The foregoing "spraying" is referred to as sputtering (sputtering) according to some embodiments. According to some embodiments, the present invention is not limited to spray coating (spray).
According to an embodiment, after the deposition of the deposition layer 26, a high temperature and high humidity test is performed, under the conditions of 300 hours, 85 degrees of temperature and 85% of humidity, the resistance of the deposition layer 26 is maintained below 0.2 ohm (Ω), and the deposition layer 26 and the trench 241 still have a good adhesion relationship. According to an embodiment, after the deposition of the deposition layer 26, a high temperature and high humidity test is performed, and the resistance of the deposition layer 26 is 0.19 ohm (Ω) under the conditions of 300 hours, 85 degrees of temperature and 85% of humidity.
[ second embodiment ]
Referring to fig. 9, a flowchart of a method S100' for fabricating a package board according to a second embodiment of the invention is provided. Referring to fig. 10 and 11, fig. 10 is a schematic diagram of the deposition layer after step S3 in the embodiment shown in fig. 9. Fig. 11 is a schematic diagram corresponding to the embodiment shown in fig. 9, after step S10, of depositing a layer. According to this embodiment, the method S100 for fabricating a package board further includes: a blowing step S10: after the spraying step S3, the surface of the substrate 22 is blown to blow away a part of the remaining layer 261 of the shielding material deposited outside the at least one trench 241. As shown in fig. 10, when the shielding material is deposited in the trench 241, a burr phenomenon (burr) may be generated at the boundary of the trench 241, and the burr phenomenon is the remaining layer 261, and the remaining layer 261 may be removed by a blowing step, so that the surface of the substrate 22 where the shielding material is not needed does not have the shielding material, and the burr phenomenon is improved (see fig. 11). According to some embodiments, the blowing step S10 is performed after the cutting step S4, which also improves the burr phenomenon.
Preferably, the blowing step is to blow off the surface of the substrate 22 by dry ice (dry ice) to remove the residual layer 261.
Referring to fig. 7, the present invention further provides a package plate 200 according to an embodiment, where the package plate 200 includes a substrate 22, a composite layer 24 and a deposition layer 26. The composite layer 24 is disposed on the substrate 22, the composite layer 24 has at least one groove 241, and a depth D (see fig. 6) of the groove 241 in a longitudinal direction is greater than or equal to 5 μm. The deposition layer 26 is located in the trench 241, the thickness H (see fig. 8) of the deposition layer 26 in the longitudinal direction is 5 μm or less, and the deposition layer 26 is composed of a shield material. For a description of substrate 22, composite layer 24, and deposited layer 26, reference is made to the above.
[ advantageous effects of the embodiments ]
One of the advantages of the present invention is that the method S100 for manufacturing the Package board provided by the present invention can directly spray a shielding material toward the at least one trench 241 through the spraying step and the technical solution of forming the deposition layer 26 on the inner wall surface of the at least one trench 241 by the shielding material, so as to reduce the process of System in a Package (SiP) and save the process cost.
Further, a protective layer or a mask is not required to be disposed on the substrate 22 in the region where the shielding is not required, and a groove 241 is scribed by a laser method according to the user's requirement, and then the shielding material is directly sprayed in the groove 241. According to the manufacturing method S100 of the package plate provided by the present invention, the tolerance precision of the size of the sprayed pattern reaches ± 10 μm, and the thickness H of the deposition layer 26 may be less than or equal to 5 μm, compared to the prior art in which the thickness of the deposition layer is about 6 to 8 μm, the manufacturing method S100 of the package plate of the present invention has a significant technical effect.
The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.
Claims (9)
1. A method of fabricating a package board, the method comprising:
a providing step, providing a substrate, wherein a composite material layer is arranged on the surface of the substrate;
a scribing step, forming at least one groove in the composite material layer by a laser means;
a spraying step of directly spraying a shielding material towards the at least one groove, wherein the shielding material forms a deposition layer attached to the inner wall surface of the at least one groove; and
and a cutting step, wherein a cutting path is preset at the outer side of the groove, and the substrate is cut along the cutting path by another laser means to obtain the packaging plate.
2. The method as claimed in claim 1, wherein a surfactant is further added to mix with the shielding material and to co-coat the at least one trench during the spraying step.
3. The method as claimed in claim 1, further comprising a step of blowing off the surface of the substrate after the step of spraying to blow off a remaining layer of the shielding material deposited outside the at least one trench.
4. The method of claim 1, further comprising a step of blowing off a surface of the substrate after the step of cutting to blow off a remaining layer of the shielding material deposited outside the at least one trench.
5. A method for manufacturing a package board as claimed in claim 3 or 4, wherein the blowing step is performed by dry ice.
6. The method of claim 1, wherein the trench has a depth of 5 μm or more.
7. The method of claim 1, wherein the thickness of the deposited layer is less than or equal to 5 μm.
8. The method of claim 1, wherein the shielding material comprises a plurality of copper powders, wherein the percentage of the shielding material is greater than 90% of the total shielding material.
9. A package board, comprising:
a substrate;
the composite material layer is positioned on the substrate and provided with at least one groove, and the depth of the groove in the longitudinal direction is more than or equal to 5 mu m; and
and the deposition layer is positioned in the groove, the thickness of the shielding deposition layer in the longitudinal direction is less than or equal to 5 mu m, and the deposition layer is made of a shielding material.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211623457.9A CN115954279A (en) | 2022-12-16 | 2022-12-16 | Package plate and manufacturing method thereof |
| TW111150808A TWI832646B (en) | 2022-12-16 | 2022-12-30 | Package plate and method of making thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211623457.9A CN115954279A (en) | 2022-12-16 | 2022-12-16 | Package plate and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115954279A true CN115954279A (en) | 2023-04-11 |
Family
ID=87288880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211623457.9A Pending CN115954279A (en) | 2022-12-16 | 2022-12-16 | Package plate and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115954279A (en) |
| TW (1) | TWI832646B (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI563626B (en) * | 2014-04-28 | 2016-12-21 | Universal Scient Ind Shanghai | Manufacturing method of electronic packaging device |
| EP3817043A1 (en) * | 2019-10-31 | 2021-05-05 | Heraeus Deutschland GmbH & Co KG | Electromagnetic interference shielding in recesses of electronic modules |
| TWI819278B (en) * | 2020-06-10 | 2023-10-21 | 日商拓自達電線股份有限公司 | Method for manufacturing electromagnetic wave shielding package using conductive composition |
| CN115226303A (en) * | 2021-04-16 | 2022-10-21 | 庆鼎精密电子（淮安）有限公司 | Manufacturing method of packaging structure with electromagnetic shielding effect |
-
2022
- 2022-12-16 CN CN202211623457.9A patent/CN115954279A/en active Pending
- 2022-12-30 TW TW111150808A patent/TWI832646B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI832646B (en) | 2024-02-11 |
| TW202428087A (en) | 2024-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6380615B2 (en) | Composite magnetic sealing material and electronic circuit package using the same as molding material | |
| KR102298791B1 (en) | Electromagnetic shielding film, circuit board and manufacturing method of electromagnetic shielding film | |
| US8440917B2 (en) | Method and apparatus to reduce impedance discontinuity in packages | |
| WO2016092692A1 (en) | Moulded circuit module, and production method therefor | |
| WO2016092695A1 (en) | Moulded circuit module, and production method therefor | |
| US20020125566A1 (en) | High frequency circuit chip and method of producing the same | |
| CN109119380B (en) | Electronic circuit package using composite magnetic encapsulant | |
| WO2016092691A1 (en) | Moulded circuit module, and production method therefor | |
| TW201616632A (en) | Semiconductor device packages | |
| JP2017188647A (en) | Electronic circuit package arranged by using composite magnetic sealing material | |
| US20130037923A1 (en) | Semiconductor package and method of manufacturing the same | |
| KR20200010462A (en) | Method of manufacturing electromagnetic shielding film, circuit board and electromagnetic shielding film | |
| EP2106895A1 (en) | Case of electronic device and method for manufacturing the same | |
| US20230094686A1 (en) | Glass substrates having partially embedded conductive layers for power delivery in semiconductor packages and related methods | |
| KR100736633B1 (en) | Reinforcement substrate and manufacturing method | |
| CN115954279A (en) | Package plate and manufacturing method thereof | |
| Brown | RF/microwave hybrids: basics, materials and processes | |
| US20110123930A1 (en) | Ceramic substrate preparation process | |
| JP5292033B2 (en) | Printed wiring board | |
| JP2012094605A (en) | Three-dimensional substrate and method of manufacturing the same | |
| JP4368737B2 (en) | Electromagnetic wave noise suppressor and method for manufacturing the same | |
| US20130193566A1 (en) | Integrated Circuit Shielding Film and Manufacturing Method Thereof | |
| US9320143B2 (en) | Touch member and method of manufacturing the same | |
| US10645800B1 (en) | High-frequency circuit board and method for manufacturing the same | |
| US8053352B2 (en) | Method and mesh reference structures for implementing Z-axis cross-talk reduction through copper sputtering onto mesh reference planes |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |