WO2022033409A1 - Manufacturing method for electromagnetic shielding structure - Google Patents

Abstract

Disclosed is a manufacturing method for an electromagnetic shielding structure, comprising the following steps: providing a circuit substrate, wherein the circuit substrate is provided with a plurality of circuit units; performing plastic encapsulation processing on the circuit substrate to form a non-conductive plastic layer on the circuit substrate, the non-conductive plastic layer separating the plurality of circuit units from each other; forming grooves between different circuit units, and cutting the circuit substrate to divide the circuit substrate into a plurality of independent substrates, each independent substrate comprising different circuit units; and performing chemical plating processing on each independent substrate to form a conductive coating on the walls of the groove and the surface of the independent substrate to shield different circuit units, thus forming an electromagnetic shielding structure.

Description

How to make an electromagnetic shielding structure

This application claims the priority of the Chinese patent application with application number 202010804150.3 filed on August 11, 2020, the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the technical field of packaging, and in particular, to a method for manufacturing an electromagnetic shielding structure.

Background technique

At present, in order to realize electromagnetic shielding of different circuit units on the circuit substrate, the cavity-splitting shielding (CPS) method or the common-type shielding (CFS) method is usually adopted. Grooves, filling with silver paste, and high-temperature curing processes require silver paste, dispensing equipment, and high-temperature curing equipment. Sputter technology is usually used for common shielding. However, the total cost of the process of split-cavity shielding and common-type shielding is expensive, usually accounting for more than 35% of the packaging cost. In addition, the thickness of the shielding layer on the side of the circuit substrate formed by the Sputter process is smaller than the thickness of the shielding layer on the front side, and the thickness of the shielding layer is uneven, which will reduce the shielding effect.

technical problem

The main purpose of the present application is to propose a method for fabricating an electromagnetic shielding structure, which aims to solve the expensive technical problem existing in the existing split-cavity shielding and common-type shielding.

technical solutions

In order to achieve the above purpose, the present application proposes a manufacturing method of an electromagnetic shielding structure, and the manufacturing method of the electromagnetic shielding structure includes the following steps:

A circuit substrate is provided, wherein the circuit substrate has a plurality of circuit units;

performing plastic encapsulation processing on the circuit substrate to form a non-conductive plastic layer on the circuit substrate, and the non-conductive plastic layer separates a plurality of the circuit units one by one;

A groove is formed between different circuit units, and the circuit substrate is cut, so as to separate the circuit substrates to form a plurality of independent substrates, and each of the independent substrates includes different circuit units;

Electroless plating is performed on each of the independent substrates to form conductive plating layers on the walls of the grooves and the surfaces of the independent substrates to shield different circuit units to form the electromagnetic shielding structure.

In one embodiment, grooves are formed between different circuit units, and the circuit substrate is cut, so as to separate the circuit substrates to form a plurality of independent substrates, and each of the independent substrates includes different Before the steps of the circuit unit, it also includes:

Laser irradiation is performed on the non-conductive plastic layer to form an activation layer on the surface of the non-conductive plastic layer.

In one embodiment, grooves are formed between different circuit units, and the circuit substrate is cut, so as to separate the circuit substrates to form a plurality of independent substrates, and each of the independent substrates includes different The steps of the circuit unit include:

Laser laser is performed on the non-conductive plastic layer to form the groove between different circuit units, and the activation layer is formed on the groove wall of the groove;

Laser cutting is performed on the circuit substrate to separate the circuit substrate to form a plurality of the independent substrates, and the activation layer is formed on the cut surface of each of the independent substrates.

In one embodiment, the non-conductive plastic layer is subjected to laser laser to form the grooves between different circuit units, and after the step of forming the activation layer on the walls of the grooves ,Also includes:

Dry ice blast the grooves.

In one embodiment, the laser cutting is performed on the circuit substrate to separate the circuit substrate to form a plurality of the independent substrates, and before the step of forming the activation layer on the cut surface of each of the independent substrates ,Also includes:

Laser marking is performed on the non-conductive plastic layer to form product marks on the non-conductive plastic layer.

In one embodiment, the electroless plating treatment is performed on each of the independent substrates to form a conductive plating layer on the walls of the grooves and the surface of the independent substrates, so as to shield the different circuit units and form a conductive plating layer. The steps of the electromagnetic shielding structure include:

Electroless plating is performed on each of the independent substrates, so as to form the conductive plating layer on the active layer, so as to shield the different circuit units to form the electromagnetic shielding structure.

In one embodiment, electroless plating is performed on each of the independent substrates to form a conductive plating layer on the groove wall and the surface of the independent substrate, so as to shield the different circuit units to form the Before the steps of the electromagnetic shielding structure, it also includes:

Affixing the front side of each of the independent substrates on a sticker film, and then sticking the backside of each of the independent substrates on another sticker film, so as to integrate the separate independent substrates on the sticker film;

The sticking films attached to the front surfaces of the independent substrates are removed, so that the front surfaces and the side surfaces of the independent substrates are exposed to the outside.

In one embodiment, electroless plating is performed on each of the independent substrates to form a conductive plating layer on the groove wall and the surface of the independent substrate, so as to shield the different circuit units to form the After the steps of the electromagnetic shielding structure, it also includes:

Electroplating is performed on each of the independent substrates to form a shielding plated layer outside the conductive plated layer, so that the conductive plated layer and the shielded plated layer jointly shield different circuit units.

In one embodiment, the conductive plating layer is a metal plating layer or a composite plating layer, and the thickness of the conductive plating layer is 0.1 μm˜50 μm.

In one embodiment, the non-conductive plastic layer is formed by plastic-encapsulated modified plastic of an organometallic compound.

beneficial effect

In the manufacturing method of the electromagnetic shielding structure of the present application, there is no need to fill with silver paste, and no glue dispensing equipment and high temperature curing equipment are required, the manufacturing equipment is omitted, the manufacturing process is simplified, the manufacturing cost is reduced, and the production efficiency is improved. In addition, in this embodiment, multiple independent substrates can be chemically plated at the same time to form multiple circuit shielding structures, that is, multiple products can be made at the same time, the process stability is good, and the productivity is higher than that of the silver paste filling process, which further reduces the production cost. cost. In addition, in the manufacturing method of the electromagnetic shielding structure of this embodiment, there is no need to use Sputter equipment and expensive targets used in the Sputter process, avoiding huge power and target consumption, low energy consumption, and only relatively low-cost electroless plating The formation of the conductive coating can be realized by the solution, which not only greatly reduces the production cost, but also is not limited by the target material.

Description of drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained according to the structures shown in these drawings without any creative effort.

1 is a schematic flowchart of a first embodiment of a method for manufacturing an electromagnetic shielding structure of the present application;

FIG. 2 is a schematic flowchart of a second embodiment of the manufacturing method of the electromagnetic shielding structure of the present application;

3 is a schematic flowchart of a third embodiment of a method for manufacturing an electromagnetic shielding structure of the present application;

FIG. 4 is a schematic flowchart of a fourth embodiment of a manufacturing method of an electromagnetic shielding structure of the present application;

FIG. 5 is a schematic flowchart of a fifth embodiment of the manufacturing method of the electromagnetic shielding structure of the present application;

6 is a schematic side view of a circuit substrate after plastic sealing according to an embodiment of the present application;

7 is a schematic side view of a circuit substrate after laser irradiation according to an embodiment of the present application;

8 is a schematic side view of a circuit substrate after laser grooving according to an embodiment of the present application;

9 is a schematic side view of a circuit substrate after laser cutting according to an embodiment of the present application;

FIG. 10 is a schematic side view of a circuit substrate after filming according to an embodiment of the present application.

Description of reference numbers:

label	name	label	name
100	circuit board	40	active layer
10	circuit unit	50	Independent substrate
20	Non-conductive plastic layer	60	film
30	groove

The realization, functional characteristics and advantages of the purpose of the present application will be further described with reference to the accompanying drawings in conjunction with the embodiments.

Embodiments of the present invention

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

It should be noted that if there are directional indications (such as up, down, left, right, front, back, etc.) involved in the embodiments of the present application, the directional indications are only used to explain a certain posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly.

In addition, if there are descriptions related to "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for the purpose of description, and should not be construed as indicating or implying Its relative importance or implicitly indicates the number of technical features indicated. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of such technical solutions does not exist. , is not within the scope of protection claimed in this application.

The present application provides a manufacturing method of an electromagnetic shielding structure.

Referring to FIG. 1 , it is a schematic flowchart of the first embodiment of the manufacturing method of the electromagnetic shielding structure of the present application. The method includes the following steps:

Step S100, providing a circuit substrate, wherein the circuit substrate has a plurality of circuit units;

Referring to FIG. 6 , it can be understood that there are multiple circuit units 10 on the circuit substrate 100 , and the circuit units 10 may be different or the same. Electromagnetic interference may exist between different circuit units 10 . In order to prevent electromagnetic interference, circuit shielding needs to be implemented between different circuit units 10 .

Step S200 , performing a plastic encapsulation process on the circuit substrate to form a non-conductive plastic layer on the circuit substrate, and the non-conductive plastic layer separates a plurality of the circuit units one by one;

The plastic encapsulation material in this embodiment does not use conventional plastic encapsulation materials such as overmolding materials, rubber, plastic or simple epoxy resin materials, but uses special plastic encapsulation materials, such as modified plastics of organometallic composites. It should be noted that the modified plastic of the organometallic composite has insulating properties, thermal conductivity, and injection molding properties. The non-conductive plastic layer 20 separates the plurality of circuit units 10 one by one to realize the packaging of the circuit units 10 .

Step S300, opening grooves between different circuit units, and cutting the circuit substrate, so as to separate the circuit substrates to form a plurality of independent substrates, and each of the independent substrates includes different circuit units;

Referring to FIGS. 8 and 9 , among the plurality of circuit units 10 on the circuit substrate 100 , groove processing is performed between different circuit units 10 , so that grooves 30 are formed between different circuit units 10 for subsequent electroless plating processing, Electromagnetic shielding between different circuit units 10 is achieved. After the grooves 30 are formed between different circuit units 10 , the circuit substrate 100 is cut, and the circuit substrate 100 after cutting is separated into a plurality of independent substrates 50 , and each independent substrate 50 includes different circuit units 10 . It should be noted that, compared with the cavity-division shielding method, the groove 30 in this embodiment is a common conical groove 30 as shown in FIG. 8 , that is, a conical concave that gradually narrows from top to bottom. The groove 30 only needs to be formed, and the shape of the groove 30 does not need to be formed into a complex shape such as a stepped shape in order to fill the silver paste, which is simple and convenient.

Step S400 , performing chemical plating on each of the independent substrates to form a conductive plating layer on the walls of the grooves and the surface of the independent substrate to shield different circuit units and form the electromagnetic shielding structure .

Each individual substrate 50 is placed into an electroless plating solution to perform an electroless plating process on each individual substrate 50 . Understandably, during the electroless plating process, the groove wall of the groove 30 and the surface of the independent substrate 50 are soaked in the electroless plating solution, so that a conductive plating layer is formed on both the groove wall of the groove 30 and the surface of the independent substrate 50 (not shown in the figure). . It can be understood that the surface of the independent substrate 50 is all the surfaces of the independent substrate 50 except for the connection with the non-conductive plastic layer 20 , including the front and side surfaces of the independent substrate 50 . A conductive plating layer is formed on the groove wall of the groove 30 and the surface of the independent substrate 50 , which can realize the electromagnetic shielding effect between different circuit units 10 and form an electromagnetic shielding structure. In addition, due to the use of chemical plating, the thickness of the conductive coating formed on the surface of the independent substrate 50 is uniform, the thickness of the conductive coating on the front side and the conductive coating on the side are the same, and there is no difference in thickness of the conductive coating, ensuring a good shielding effect of the electromagnetic shielding structure. . The non-conductive plastic layer 20 in this embodiment is formed by plastic-encapsulated modified plastic of an organic metal compound, which can provide structural support for the conductive plating layer, and has good thermal conductivity, can absorb the heat generated by the circuit unit 10 , and ensure the safety of the circuit unit 10 . normal operation.

In the manufacturing method of the electromagnetic shielding structure of the present embodiment, there is no need to fill silver paste, and neither glue dispensing equipment nor high temperature curing equipment is required, manufacturing equipment is omitted, manufacturing process is simplified, manufacturing cost is reduced, and production efficiency is improved. In addition, in this embodiment, multiple independent substrates 50 can be chemically plated at the same time to form multiple circuit shielding structures, that is, multiple products can be made at the same time, the process stability is good, and the productivity is higher than that of the silver paste filling process, which further reduces the cost of production. In addition, in the manufacturing method of the electromagnetic shielding structure of this embodiment, there is no need to use Sputter equipment and expensive targets used in the Sputter process, avoiding huge power and target consumption, low energy consumption, and only relatively low-cost electroless plating The formation of the conductive coating can be realized by the solution, which not only greatly reduces the production cost, but also is not limited by the target material.

Further, referring to FIG. 2 , it is a schematic flowchart of the second embodiment of the method for manufacturing an electromagnetic shielding structure of the present application. Based on the above-mentioned first embodiment, before the step S300 , the method further includes:

In step S201, laser irradiation is performed on the non-conductive plastic layer to form an activation layer on the surface of the non-conductive plastic layer.

Referring to FIG. 7 , the non-conductive plastic layer 20 is irradiated with laser light, and the organometallic compound after laser irradiation will release metal ions to form a metal core and a rough surface, so as to form an activation layer on the surface of the non-conductive plastic layer 20 40. It can be understood that the activation layer 40 is distributed on the surface of the non-conductive plastic layer 20 except for the connection with the circuit substrate 100. In this embodiment, the wavelength of laser irradiation is preferably 300 μm to 1200 μm.

Further, step S300 includes:

Step S301, performing laser laser on the non-conductive plastic layer to form the groove between different circuit units, and form the activation layer on the groove wall of the groove;

Referring to FIG. 8 , laser laser is performed on the non-conductive plastic layer 20 to form grooves 30 between different circuit units 10 . When the laser radiates the groove 30, due to the action of the laser irradiation, the metal ions will be released from the organometallic compound, forming a metal core and a rough surface on the groove wall of the groove 30, so as to form activation on the groove wall of the groove 30. layer 40 , and then an integrated activation layer 40 is formed on the groove wall of the groove 30 and the surface of the non-conductive plastic layer 20 .

Step S304, laser cutting the circuit substrate to separate the circuit substrate to form a plurality of the independent substrates, and to form the activation layer on the cut surface of each of the independent substrates.

Referring to FIG. 9 , laser cutting is performed on the circuit substrate 100 to cut the circuit substrate 100 into a plurality of separate individual substrates 50 . At the same time of laser cutting, due to the effect of laser irradiation, the organometallic compound on the cutting surface will release metal ions, forming a metal core and a rough surface on the cutting surface, so as to form the activation layer 40 on the cutting surface of the independent substrate 50, Furthermore, in each of the independent substrates 50 , the walls of the grooves 30 and the surfaces outside the connection between the non-conductive plastic layer 20 and the circuit substrate 100 form an integrated activation layer 40 . That is, after the processes of laser irradiation, laser laser groove formation and laser cutting, an integrated activation layer 40 is formed on the surface of each independent substrate 50, which facilitates subsequent electroless plating treatment on the integrated activation layer 40 to achieve electrical conductivity. One-shot molding of the coating.

Further, after step S301, it also includes:

Step S302, dry ice cleaning is performed on the groove.

In this embodiment, the use of dry ice cleaning to clean the groove 30 will not cause any damage to the surface of the groove 30, nor will it affect the smoothness of the surface of the groove 30, so as to remove impurities on the surface of the groove 30 and ensure the The grooves 30 are not affected, which facilitates subsequent electroless plating of the grooves 30 .

It should be noted that, before step S304, it also includes:

In step S303, laser marking is performed on the non-conductive plastic layer to form a product mark on the non-conductive plastic layer.

The product mark can be traceable product information such as product model, product production date, etc., so that the product has its own logo, which is convenient for subsequent production and after-sales processes.

Further, referring to FIG. 3 , which is a schematic flowchart of the third embodiment of the manufacturing method of the electromagnetic shielding structure of the present application, based on the above-mentioned second embodiment, the step S400 includes:

Step S401 , performing an electroless plating process on each of the independent substrates to form the conductive plating layer on the active layer to shield the different circuit units to form the electromagnetic shielding structure.

After the processes of laser irradiation, laser laser groove formation and laser cutting, the surfaces of the individual substrates 50 are activated to form an integrated activation layer 40 . condition. The individual substrates 50 are electrolessly plated with an electroless plating solution, and then a conductive plating layer is formed on the active layer 40. The conductive plating layer is distributed on the surface of the independent substrate 50, which can shield different circuit units 10 before, that is, the conductive plating layer plays a role in Electromagnetic shielding effect.

Further, referring to FIG. 4 , it is a schematic flowchart of the fourth embodiment of the method for manufacturing an electromagnetic shielding structure of the present application. Based on the above-mentioned first embodiment, before the step S400 , the method further includes:

Step S305, attaching the front side of each of the independent substrates to a film, and then attaching the back of each of the independent substrates to another film, so as to integrate the separate independent substrates on the film superior;

10, after laser cutting, the circuit substrate 100 is divided into a plurality of independent substrates 50, and the plurality of independent substrates 50 usually need to be fixed on the fixture, for example, the plurality of independent substrates 50 are adsorbed on the vacuum base, in order to avoid The process of electroless plating will affect the fixture and in order to realize the process of simultaneously performing electroless plating on a plurality of independent substrates 50 , in this embodiment, before the electroless plating, a film 60 is attached to the front surface of each independent substrate 50 first. Then stick the back of each independent substrate 50 on another sticker 60, that is, stick the fronts of multiple independent boards 50 on one sticker 60, and stick the back of the multiple independent boards 50 with another sticker 60. The sticking film 60 is used to integrate the separate independent substrates 50 on the sticking film 60 to form a whole.

Step S306 , removing the sticker film attached to the front surface of each of the independent substrates, so that the front and side surfaces of each of the independent substrates are exposed to the outside.

Tear off the film 60 attached to the front of each independent substrate 50, the film 60 on the bottom surface of each independent substrate 50 is retained, each independent substrate 50 maintains the overall state, and the bottom surface of each independent substrate 50 is protected by the film 60 to prevent subsequent The electroless plating process affects the pins on the bottom surface of the independent substrate 50, and at the same time avoids affecting the jig, so as to ensure the reusability of the jig. After tearing off the stickers 60 attached to the front surfaces of the independent substrates 50 , the front surfaces and side surfaces of the independent substrates 50 are exposed, so that the front and side surfaces of the independent substrates 50 can be subsequently electroless-plated, so that the front surfaces of the independent substrates 50 are exposed to the outside. As well as the conductive plating layer is formed on the side surface, it can be understood that the front surface of the independent substrate 50 includes the groove wall surface of the groove 30 .

The film 60 in this embodiment can use the UV film in the prior art, and the independent substrates 50 that are separated after being cut are integrated together through the film 60 , that is, chemical plating is performed on the plurality of independent substrates 50 at the same time to achieve electrical conductivity. The one-time forming of the plating layer can also protect the jig and the bottom pins of the independent substrate 50 from being affected.

Further, referring to FIG. 5 , which is a schematic flowchart of the fifth embodiment of the method for manufacturing an electromagnetic shielding structure of the present application, based on the above-mentioned first embodiment, after the step S400 , the method further includes:

Step S500, performing electroplating treatment on each of the independent substrates to form a shielding coating layer outside the conductive coating layer, so that the conductive coating layer and the shielding coating layer jointly shield different circuit units.

After the electroless plating treatment is performed on the individual substrates 50 , in order to improve the electromagnetic shielding effect of the electromagnetic shielding structure, the individual substrates 50 may also be subjected to electroplating treatment. In one embodiment, the conductive plating layer is a composite plating layer. Specifically, after the electroless plating treatment is performed on each independent substrate 50, the individual substrate 50 can also be subjected to an electroplating treatment of first copper plating and then nickel plating to form a composite plating layer on the conductive plating layer. coating. In another embodiment, after the electroless plating process is performed on each independent substrate 50 , an electroplating process such as gold plating, copper plating, or stainless steel plating may also be performed on the independent substrate 50 to form a metal plating layer on the conductive plating layer. In this way, by combining electroless plating and electroplating, conductive plating, composite plating or metal plating are successively formed on the front and side surfaces of the independent substrate 50 to improve the electromagnetic shielding effect of the electromagnetic shielding structure. In a preferred embodiment, the thickness of the conductive plating layer is 0.1 μm˜50 μm.

The above are only the preferred embodiments of the present application, and are not intended to limit the scope of the patent of the present application. Under the inventive concept of the present application, any equivalent structural transformations made by using the contents of the description and drawings of the present application, or directly/indirectly applied to other Relevant technical fields are included within the scope of patent protection of this application.

Claims (10)

1. A manufacturing method of an electromagnetic shielding structure, wherein the manufacturing method of the electromagnetic shielding structure comprises the following steps:

   A circuit substrate is provided, wherein the circuit substrate has a plurality of circuit units;

   performing plastic encapsulation processing on the circuit substrate to form a non-conductive plastic layer on the circuit substrate, and the non-conductive plastic layer separates a plurality of the circuit units one by one;

   A groove is formed between different circuit units, and the circuit substrate is cut, so as to separate the circuit substrates to form a plurality of independent substrates, and each of the independent substrates includes different circuit units;

   Electroless plating is performed on each of the independent substrates to form conductive plating layers on the walls of the grooves and the surfaces of the independent substrates, so as to shield the different circuit units to form the electromagnetic shielding structure.
2. The method for fabricating an electromagnetic shielding structure according to claim 1, wherein a groove is formed between different circuit units, and the circuit substrate is cut, so as to separate the circuit substrate to form a plurality of independent substrates , before the step of each of the independent substrates including different circuit units, further comprising:

   Laser irradiation is performed on the non-conductive plastic layer to form an activation layer on the surface of the non-conductive plastic layer.
3. The method for manufacturing an electromagnetic shielding structure according to claim 2, wherein a groove is formed between different circuit units, and the circuit substrate is cut, so as to separate the circuit substrate to form a plurality of independent substrates , the steps of each of the independent substrates including different circuit units include:

   Laser laser is performed on the non-conductive plastic layer to form the groove between different circuit units, and the activation layer is formed on the groove wall of the groove;

   Laser cutting is performed on the circuit substrate to separate the circuit substrate to form a plurality of the independent substrates, and the activation layer is formed on the cut surface of each of the independent substrates.
4. 3. The method for fabricating an electromagnetic shielding structure according to claim 3, wherein the non-conductive plastic layer is subjected to laser laser to form the groove between different circuit units, and the groove is formed in the groove. After the step of forming the activation layer on the groove wall, it also includes:

   Dry ice blast the grooves.
5. The method for fabricating an electromagnetic shielding structure according to claim 3, wherein the circuit substrate is laser-cut to separate the circuit substrates to form a plurality of the independent substrates, and each of the independent substrates is Before the step of forming the activation layer on the cut surface, it also includes:

   Laser marking is performed on the non-conductive plastic layer to form product marks on the non-conductive plastic layer.
6. The method of manufacturing an electromagnetic shielding structure according to claim 3, wherein the electroless plating is performed on each of the independent substrates to form conductive plating layers on the walls of the grooves and the surfaces of the independent substrates, so as to protect the different substrates. The circuit units are shielded, and the steps of forming the electromagnetic shielding structure include:

   Electroless plating is performed on each of the independent substrates, so as to form the conductive plating layer on the active layer, so as to shield the different circuit units to form the electromagnetic shielding structure.
7. The method for manufacturing an electromagnetic shielding structure according to any one of claims 1 to 6, wherein each of the independent substrates is subjected to electroless plating to form a conductive layer on the groove wall and the surface of the independent substrate. The plating layer is used to shield the different circuit units, and before the step of forming the electromagnetic shielding structure, the method further includes:

   Affixing the front side of each of the independent substrates on a sticker film, and then sticking the backside of each of the independent substrates on another sticker film, so as to integrate the separate independent substrates on the sticker film;

   The sticking films attached to the front surfaces of the independent substrates are removed, so that the front surfaces and side surfaces of the independent substrates are exposed to the outside.
8. The method for manufacturing an electromagnetic shielding structure according to any one of claims 1 to 6, wherein each of the independent substrates is subjected to electroless plating to form a conductive layer on the groove wall and the surface of the independent substrate. After the step of forming the electromagnetic shielding structure, the step of forming the electromagnetic shielding structure further includes:

   Electroplating is performed on each of the independent substrates to form a shielding plated layer outside the conductive plated layer, so that the conductive plated layer and the shielded plated layer jointly shield different circuit units.
9. The method for manufacturing an electromagnetic shielding structure according to any one of claims 1-6, wherein the conductive plating layer is a metal plating layer or a composite plating layer, and the thickness of the conductive plating layer is 0.1 μm˜50 μm.
10. The method for manufacturing an electromagnetic shielding structure according to any one of claims 1 to 6, wherein the non-conductive plastic layer is formed by plastic sealing of a modified plastic of an organic metal compound.