CN112040632A - Method for manufacturing electromagnetic shielding structure - Google Patents
Method for manufacturing electromagnetic shielding structure Download PDFInfo
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- CN112040632A CN112040632A CN202010804150.3A CN202010804150A CN112040632A CN 112040632 A CN112040632 A CN 112040632A CN 202010804150 A CN202010804150 A CN 202010804150A CN 112040632 A CN112040632 A CN 112040632A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0227—Split or nearly split shielding or ground planes
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- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a manufacturing method of an electromagnetic shielding structure, which comprises the following steps: providing a circuit substrate, wherein the circuit substrate is provided with a plurality of circuit units; carrying out plastic packaging treatment on the circuit substrate to form a non-conductive plastic layer on the circuit substrate, wherein the non-conductive plastic layer separates the circuit units one by one; forming grooves among different circuit units, and cutting the circuit substrate to separate the circuit substrate into a plurality of independent substrates, wherein each independent substrate comprises different circuit units; and carrying out chemical plating treatment on each independent substrate to form conductive plating layers on the wall of the groove and the surfaces of the independent substrates so as to shield different circuit units and form the electromagnetic shielding structure. The invention omits the manufacturing equipment and simplifies the manufacturing process, has low manufacturing cost and high production efficiency, has no difference in the thickness of the conductive coating and ensures the good shielding effect of the electromagnetic shielding structure.
Description
Technical Field
The invention relates to the technical field of packaging, in particular to a manufacturing method of an electromagnetic shielding structure.
Background
At present, in order to achieve electromagnetic shielding of different circuit units on a circuit substrate, a cavity-divided shielding (CPS) mode or a common-mode shielding (CFS) mode is generally adopted, wherein the cavity-divided shielding needs to be subjected to processes of encapsulating incoming materials, laser grooving, groove cleaning, silver paste filling, high-temperature curing and the like, the process needs equipment such as silver paste, dispensing equipment and high-temperature curing, and the common-mode shielding generally adopts a Sputter process. However, the total cost of the fabrication of the cavity shield and the conformal shield is expensive, and usually accounts for more than 35% of the packaging cost. Moreover, the thickness of the shielding layer on the side surface of the circuit substrate formed by the Sputter process is smaller than that of the shielding layer on the front surface, and the shielding effect is reduced due to uneven thickness of the shielding layer.
Disclosure of Invention
The invention mainly aims to provide a manufacturing method of an electromagnetic shielding structure, and aims to solve the technical problem that the existing cavity-dividing shielding and common-mode shielding modes are expensive.
In order to achieve the above object, the present invention provides a method for manufacturing an electromagnetic shielding structure, wherein the method for manufacturing the electromagnetic shielding structure comprises the following steps:
providing a circuit substrate, wherein the circuit substrate is provided with a plurality of circuit units;
carrying out plastic packaging treatment on the circuit substrate to form a non-conductive plastic layer on the circuit substrate, wherein the non-conductive plastic layer separates the circuit units one by one;
forming grooves among different circuit units, and cutting the circuit substrate to separate the circuit substrate into a plurality of independent substrates, wherein each independent substrate comprises different circuit units;
and carrying out chemical plating treatment on each independent substrate to form conductive plating layers on the wall of the groove and the surfaces of the independent substrates so as to shield different circuit units and form the electromagnetic shielding structure.
Preferably, before the step of forming the grooves between different circuit units and cutting the circuit substrate to separate the circuit substrate into a plurality of independent substrates, each of the independent substrates includes different circuit units, the method further includes:
and carrying out laser irradiation on the non-conductive plastic layer to form an activation layer on the surface of the non-conductive plastic layer.
Preferably, the step of forming a groove between different circuit units and cutting the circuit substrate to separate the circuit substrate into a plurality of independent substrates, each of the independent substrates including different circuit units includes:
performing laser on the non-conductive plastic layer to form the grooves among different circuit units, and forming the activated layer on the groove wall of each groove;
and carrying out laser cutting on the circuit substrate to separate the circuit substrate into a plurality of independent substrates, and forming the activation layer on the cutting surface of each independent substrate.
Preferably, the step of performing laser on the non-conductive plastic layer to form the grooves between different circuit units and forming the activation layer on the groove walls further includes:
and carrying out dry ice cleaning on the groove.
Preferably, the step of laser cutting the circuit substrate to separate the circuit substrate into a plurality of independent substrates and form the activation layer on the cut surface of each independent substrate further includes:
and carrying out laser marking on the non-conductive plastic layer to form a product mark on the non-conductive plastic layer.
Preferably, the step of performing an electroless plating process on each of the independent substrates to form conductive plating layers on the walls of the grooves and the surfaces of the independent substrates to shield different circuit units from each other, and the step of forming the electromagnetic shielding structure includes:
and carrying out chemical plating treatment on each independent substrate to form the conductive plating layer on the activation layer so as to shield different circuit units and form the electromagnetic shielding structure.
Preferably, before the step of performing an electroless plating process on each of the independent substrates to form conductive plating layers on the walls of the grooves and the surfaces of the independent substrates to shield different circuit units, the step of forming the electromagnetic shielding structure further includes:
attaching the front surface of each independent substrate to one adhesive film, and attaching the back surface of each independent substrate to the other adhesive film so as to integrate each independent substrate which is separately arranged on the adhesive film;
and removing the adhesive film adhered to the front surface of each independent substrate so as to expose the front surface and the side surface of each independent substrate.
Preferably, after the step of performing an electroless plating process on each of the independent substrates to form conductive plating layers on the walls of the grooves and the surfaces of the independent substrates to shield different circuit units, the step of forming the electromagnetic shielding structure further includes:
and electroplating each independent substrate to form a shielding coating outside the conductive coating, so that the conductive coating and the shielding coating jointly shield different circuit units.
Preferably, the conductive coating is a metal coating or a composite coating, and the thickness of the conductive coating is 0.1-50 um.
Preferably, the non-conductive plastic layer is formed by plastic package of modified plastic of organic metal compound.
According to the manufacturing method of the electromagnetic shielding structure, silver paste does not need to be filled, and dispensing equipment and high-temperature curing equipment are not needed, so that manufacturing equipment is omitted, manufacturing procedures are simplified, manufacturing cost is reduced, and production efficiency is improved. Moreover, the present embodiment can simultaneously perform chemical plating treatment on a plurality of independent substrates to form a plurality of circuit shielding structures, i.e., a plurality of products are simultaneously manufactured, the manufacturing process stability is good, the productivity is higher than that of a silver paste filling process, and further the manufacturing cost is reduced. In addition, in the manufacturing method of the electromagnetic shielding structure of the embodiment, the use of a Sputter device and an expensive target material used in the Sputter process is not needed, huge power and target material consumption are avoided, energy consumption is low, the formation of the conductive coating can be realized only by a relatively low-price chemical plating solution, the manufacturing cost is greatly reduced, the limitation of a target material is avoided, the material types of the conductive coating are more extensive, the thickness of the conductive coating is not different, and the good shielding effect of the electromagnetic shielding structure is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing an electromagnetic shielding structure according to a first embodiment of the present invention;
fig. 2 is a schematic flow chart illustrating a method for manufacturing an electromagnetic shielding structure according to a second embodiment of the present invention;
fig. 3 is a schematic flow chart of a method for manufacturing an electromagnetic shielding structure according to a third embodiment of the present invention;
fig. 4 is a schematic flow chart illustrating a fourth embodiment of a method for manufacturing an electromagnetic shielding structure according to the present invention;
fig. 5 is a schematic flow chart of a fifth embodiment of the method for manufacturing an electromagnetic shielding structure according to the present invention;
FIG. 6 is a schematic side view of a circuit substrate after plastic encapsulation according to an embodiment of the invention;
FIG. 7 is a schematic side view of a circuit substrate after laser irradiation according to one embodiment of the present invention;
FIG. 8 is a schematic side view of a circuit substrate after laser grooving according to an embodiment of the invention;
FIG. 9 is a schematic side view of a circuit substrate after laser cutting according to one embodiment of the present invention;
FIG. 10 is a schematic side view of a circuit substrate after being pasted with a film according to an embodiment of the invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
40 | |
| 10 | |
50 | |
| 20 | Non-conductive |
60 | |
| 30 | Groove |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a manufacturing method of an electromagnetic shielding structure.
Referring to fig. 1, a schematic flow chart of a first embodiment of a method for manufacturing an electromagnetic shielding structure of the present invention is shown, the method including the following steps:
step S100, providing a circuit substrate, wherein the circuit substrate is provided with a plurality of circuit units;
referring to fig. 6, it is understood that the circuit substrate 100 has a plurality of circuit units 10 thereon, and the circuit units 10 may be different or the same. An electromagnetic interference phenomenon may occur between different circuit units 10, and in order to prevent the electromagnetic interference, circuit shielding needs to be implemented between different circuit units 10.
Step S200, carrying out plastic package treatment on the circuit substrate to form a non-conductive plastic layer on the circuit substrate, wherein the non-conductive plastic layer separates a plurality of circuit units one by one;
the plastic packaging material of this embodiment is not selected from conventional plastic packaging materials such as coating molding materials, rubber, plastics, or simple epoxy resin materials, but is a special plastic packaging material, such as modified plastics of organic metal compounds. The modified plastic of the organic metal compound has insulation properties, thermal conductivity, injection moldability, and the like. The non-conductive plastic layer 20 separates the circuit units 10 one by one, and the circuit units 10 are packaged.
Step S300, forming grooves among different circuit units, and cutting the circuit substrate to separate the circuit substrate into a plurality of independent substrates, wherein each independent substrate comprises different circuit units;
referring to fig. 8 and 9, among the plurality of circuit units 10 on the circuit substrate 100, a groove opening process is performed between different circuit units 10, so that a groove 30 is formed between different circuit units 10, and then an electroless plating process is performed to achieve electromagnetic shielding between different circuit units 10. After the grooves 30 are formed between different circuit units 10, the circuit substrate 100 is cut, the cut circuit substrate 100 is separated into a plurality of independent substrates 50, and each independent substrate 50 includes different circuit units 10. It should be noted that, compared to the cavity-separated shielding manner, the groove 30 of the present embodiment is formed as a common tapered groove 30 as shown in fig. 8, that is, the tapered groove 30 gradually narrows from top to bottom, and it is not necessary to form the shape of the groove 30 into a complex shape such as a step shape for filling silver paste, which is simple and convenient.
Step S400, performing chemical plating on each of the independent substrates to form conductive plating layers on the walls of the grooves and the surfaces of the independent substrates, so as to shield different circuit units and form the electromagnetic shielding structure.
Each individual substrate 50 is placed in an electroless plating solution, thereby subjecting each individual substrate 50 to an electroless plating process. It is understood that, during the electroless plating process, the walls of the grooves 30 and the surfaces of the individual substrates 50 are immersed in the electroless plating solution, so that conductive plating layers (not shown) are formed on the walls of the grooves 30 and the surfaces of the individual substrates 50. It is understood that the surface of the separate substrate 50 is all surfaces of the separate substrate 50 except the connection with the non-conductive plastic layer 20, including the front surface and the side surface of the separate substrate 50. The conductive coating is formed on the walls of the grooves 30 and the surface of the independent substrate 50, so that the electromagnetic shielding effect among different circuit units 10 can be realized, and an electromagnetic shielding structure is formed. Moreover, due to the chemical plating, the thickness of the conductive plating layer formed on the surface of the independent substrate 50 is uniform, the thickness of the conductive plating layer on the front surface is consistent with that of the conductive plating layer on the side surface, and the thickness difference of the conductive plating layers is avoided, so that the good shielding effect of the electromagnetic shielding structure is ensured. The non-conductive plastic layer 20 of the embodiment is formed by plastic packaging of modified plastic of organic metal compound, can provide structural support for the conductive coating, has good thermal conductivity, can absorb heat generated by the circuit unit 10, and ensures normal operation of the circuit unit 10.
In the manufacturing method of the electromagnetic shielding structure, silver paste does not need to be filled, and dispensing equipment and high-temperature curing equipment are not needed, so that manufacturing equipment is omitted, manufacturing procedures are simplified, manufacturing cost is reduced, and production efficiency is improved. Moreover, the present embodiment can simultaneously perform the chemical plating process on the plurality of independent substrates 50 to form a plurality of circuit shielding structures, i.e., a plurality of products are simultaneously manufactured, the manufacturing process stability is good, the productivity is higher than that of the silver paste filling process, and further the manufacturing cost is reduced. In addition, in the manufacturing method of the electromagnetic shielding structure of the embodiment, the use of a Sputter device and an expensive target material used in the Sputter process is not needed, huge power and target material consumption are avoided, energy consumption is low, the formation of the conductive coating can be realized only by a relatively low-price chemical plating solution, the manufacturing cost is greatly reduced, the limitation of a target material is avoided, the material types of the conductive coating are more extensive, the thickness of the conductive coating is not different, and the good shielding effect of the electromagnetic shielding structure is ensured.
Further, referring to fig. 2, a schematic flow chart of a second embodiment of the method for manufacturing an electromagnetic shielding structure according to the present invention is shown, based on the first embodiment, before the step S300, the method further includes:
step S201, performing laser irradiation on the non-conductive plastic layer to form an activation layer on the surface of the non-conductive plastic layer.
Referring to fig. 7, the non-conductive plastic layer 20 is irradiated with laser, and the organic metal compound after the laser irradiation releases metal ions to form a metal core and a rough surface, so as to form the activation layer 40 on the surface of the non-conductive plastic layer 20, it can be understood that the activation layer 40 is distributed on the surface of the non-conductive plastic layer 20 except for the connection with the circuit substrate 100. In this embodiment, the wavelength of the laser irradiation is preferably 300 to 1200 um.
Further, step S300 includes:
step S301, performing laser on the non-conductive plastic layer to form grooves among different circuit units, and forming the activated layer on groove walls of the grooves;
referring to fig. 8, the non-conductive plastic layer 20 is laser-irradiated to laser-eject grooves 30 between different circuit units 10. While the grooves 30 are laser-irradiated, the organic metal compound releases metal ions due to the laser irradiation, so that metal nuclei and rough surfaces are formed on the groove walls of the grooves 30, an activation layer 40 is formed on the groove walls of the grooves 30, and an integrated activation layer 40 is formed on the groove walls of the grooves 30 and the surfaces of the non-conductive plastic layers 20.
Step S304, performing laser cutting on the circuit substrate to separate the circuit substrate into a plurality of independent substrates, and forming the active layer on the cutting surface of each independent substrate.
Referring to fig. 9, the circuit substrate 100 is laser-cut, and the circuit substrate 100 is cut into a plurality of separated individual substrates 50. During laser cutting, the organic metal compound on the cutting surface releases metal ions due to the action of laser irradiation, so as to form metal nuclei and rough surface on the cutting surface, so as to form the activation layer 40 on the cutting surface of the independent substrate 50, and further, in each independent substrate 50, the groove wall of the groove 30 and the surface except the connection part of the non-conductive plastic layer 20 and the circuit substrate 100 form an integrated activation layer 40. That is, after the processes of laser irradiation, laser grooving and laser cutting, the integrated active layer 40 is formed on the surface of each independent substrate 50, so that the chemical plating treatment can be simultaneously performed on the integrated active layer 40 in a subsequent step, and the one-step forming of the conductive plating layer can be realized.
Further, after step S301, the method further includes:
and step S302, carrying out dry ice cleaning on the groove.
In this embodiment, adopt dry ice cleaning mode to clear up recess 30, can not cause any injury to recess 30 surface, can not influence the smooth finish on recess 30 surface yet, and then guarantee recess 30 not influenced when getting rid of recess 30 surface impurity, make things convenient for the follow-up chemical plating to handle recess 30.
Before step S304, the method further includes:
step S303, carrying out laser marking on the non-conductive plastic layer so as to form a product mark on the non-conductive plastic layer.
The product mark can be traceable product information such as product model, product production date and the like, so that the product is provided with an identifier, and the subsequent production, after-sale and other processes are facilitated.
Further, referring to fig. 3, a schematic flow chart of a third embodiment of the method for manufacturing an electromagnetic shielding structure according to the present invention is shown, based on the second embodiment, in the step S400, the method includes:
step S401, performing chemical plating on each of the independent substrates to form the conductive plating layer on the active layer, so as to shield different circuit units, thereby forming the electromagnetic shielding structure.
After the processes of laser irradiation, laser grooving and laser cutting, the surface of each independent substrate 50 is activated to form an integrated activation layer 40, and the activation layer 40 enables the independent substrate 50 to form a rough surface to achieve the condition of chemical plating. The independent substrates 50 are chemically plated with a chemical plating solution to form a conductive plating layer on the active layer 40, wherein the conductive plating layer is distributed on the surfaces of the independent substrates 50, so that the different circuit units 10 can be shielded, i.e., the conductive plating layer can play a role in electromagnetic shielding.
Further, referring to fig. 4, a schematic flow chart of a fourth embodiment of the method for manufacturing an electromagnetic shielding structure according to the present invention is shown, based on the first embodiment, before the step S400, the method further includes:
step S305, attaching the front surface of each of the independent substrates to a film, and attaching the back surface of each of the independent substrates to another film, so as to integrate the separately disposed independent substrates to the film;
referring to fig. 10, after the laser cutting, the circuit substrate 100 is divided into a plurality of independent substrates 50, and the plurality of independent substrates 50 are usually fixed on a jig, for example, the plurality of independent substrates 50 are adsorbed on a vacuum base, so as to avoid the influence of the chemical plating process on the jig and to realize the process of simultaneously performing chemical plating on the plurality of independent substrates 50, in this embodiment, before the chemical plating, the front surface of each independent substrate 50 is first attached to one film 60, and then the back surface of each independent substrate 50 is attached to another film 60, that is, the front surfaces of the plurality of independent substrates 50 are attached to one film 60, and the back surfaces of the plurality of independent substrates 50 are attached to another film 60, so as to integrate the separated independent substrates 50 on the film 60 to form a whole.
Step S306, removing the adhesive film attached to the front surface of each of the independent substrates, so as to expose the front surface and the side surface of each of the independent substrates.
The sticking film 60 stuck to the front surface of each independent substrate 50 is torn off, the sticking film 60 on the bottom surface of each independent substrate 50 is reserved, each independent substrate 50 is kept in an integral state, and the bottom surface of each independent substrate 50 is protected by the sticking film 60, so that the influence of the subsequent chemical plating process on the bottom surface pins of the independent substrates 50 is prevented, meanwhile, the influence on the jig is avoided, and the reusability of the jig is ensured. After the adhesive film 60 attached to the front surface of each individual substrate 50 is peeled off, the front surface and the side surface of each individual substrate 50 are exposed to the outside, so that the front surface and the side surface of each individual substrate 50 are subjected to the chemical plating process, thereby forming the conductive plating layer on the front surface and the side surface of the individual substrate 50, and it can be understood that the front surface of the individual substrate 50 includes the groove wall surface of the groove 30.
The pad pasting 60 of this embodiment can adopt the UV membrane among the prior art, will be each independent base plate 50 that the separation set up after the cutting through the pad pasting 60 integration together, carry out the chemical plating simultaneously to a plurality of independent base plates 50 promptly and handle, realize the one shot forming of conductive coating, can protect again that the bottom surface pin of tool and independent base plate 50 is not influenced.
Further, referring to fig. 5, a schematic flow chart of a fifth embodiment of the method for manufacturing an electromagnetic shielding structure according to the present invention is shown, based on the first embodiment, after the step S400, the method further includes:
step S500, performing electroplating treatment on each of the independent substrates to form a shielding plating layer outside the conductive plating layer, so that the conductive plating layer and the shielding plating layer jointly shield different circuit units.
After the individual substrates 50 are subjected to the electroless plating treatment, the individual substrates 50 may be subjected to the electroplating treatment in order to improve the electromagnetic shielding effect of the electromagnetic shielding structure. In one embodiment, the conductive coating is a composite coating, and specifically, after the chemical plating process is performed on each of the independent substrates 50, the independent substrates 50 may be further subjected to an electroplating process of plating copper and then plating nickel, so as to form the composite coating on the conductive coating. In another embodiment, after the electroless plating process is performed on each of the individual substrates 50, the individual substrates 50 may be subjected to an electroplating process such as gold plating, copper plating, or stainless steel plating to form a metal plating layer on the conductive plating layer. Therefore, by combining the chemical plating and the electroplating, the conductive plating layer and the composite plating layer or the metal plating layer are sequentially formed on the front surface and the side surface of the independent substrate 50, so that the electromagnetic shielding effect of the electromagnetic shielding structure is improved. In a preferred embodiment, the thickness of the conductive plating layer is 0.1-50 um.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The manufacturing method of the electromagnetic shielding structure is characterized by comprising the following steps of:
providing a circuit substrate, wherein the circuit substrate is provided with a plurality of circuit units;
carrying out plastic packaging treatment on the circuit substrate to form a non-conductive plastic layer on the circuit substrate, wherein the non-conductive plastic layer separates the circuit units one by one;
forming grooves among different circuit units, and cutting the circuit substrate to separate the circuit substrate into a plurality of independent substrates, wherein each independent substrate comprises different circuit units;
and carrying out chemical plating treatment on each independent substrate to form conductive plating layers on the wall of the groove and the surfaces of the independent substrates so as to shield different circuit units and form the electromagnetic shielding structure.
2. The method for manufacturing an electromagnetic shielding structure according to claim 1, wherein the step of forming the recess between different circuit units and cutting the circuit substrate to separate the circuit substrate into a plurality of independent substrates, each of the independent substrates including different circuit units further comprises:
and carrying out laser irradiation on the non-conductive plastic layer to form an activation layer on the surface of the non-conductive plastic layer.
3. The method of claim 2, wherein the step of forming the recesses between different circuit units and cutting the circuit substrate to separate the circuit substrate into a plurality of individual substrates, each of the individual substrates including different circuit units comprises:
performing laser on the non-conductive plastic layer to form the grooves among different circuit units, and forming the activated layer on the groove wall of each groove;
and carrying out laser cutting on the circuit substrate to separate the circuit substrate into a plurality of independent substrates, and forming the activation layer on the cutting surface of each independent substrate.
4. The method of claim 3, wherein said step of laser-irradiating said non-conductive plastic layer to form said grooves between different ones of said circuit units and forming said active layer on walls of said grooves further comprises:
and carrying out dry ice cleaning on the groove.
5. The method for manufacturing an electromagnetic shielding structure according to claim 3, wherein the step of laser cutting the circuit substrate to separate the circuit substrate into a plurality of individual substrates and forming the activation layer on the cut surface of each individual substrate further comprises:
and carrying out laser marking on the non-conductive plastic layer to form a product mark on the non-conductive plastic layer.
6. The method of claim 3, wherein the step of performing an electroless plating process on each of the independent substrates to form conductive plating layers on the walls of the grooves and the surfaces of the independent substrates to shield different circuit units from each other comprises:
and carrying out chemical plating treatment on each independent substrate to form the conductive plating layer on the activation layer so as to shield different circuit units and form the electromagnetic shielding structure.
7. The method for manufacturing an electromagnetic shielding structure according to any one of claims 1 to 6, further comprising, before the step of performing an electroless plating process on each of the individual substrates to form conductive plating layers on the walls of the grooves and on the surfaces of the individual substrates to shield different circuit units from each other to form the electromagnetic shielding structure:
attaching the front surface of each independent substrate to one adhesive film, and attaching the back surface of each independent substrate to the other adhesive film so as to integrate each independent substrate which is separately arranged on the adhesive film;
and removing the adhesive film adhered to the front surface of each independent substrate so as to expose the front surface and the side surface of each independent substrate.
8. The method for manufacturing an electromagnetic shielding structure according to any one of claims 1 to 6, further comprising, after the step of performing an electroless plating process on each of the individual substrates to form conductive plating layers on the walls of the grooves and on the surfaces of the individual substrates to shield different circuit units from each other to form the electromagnetic shielding structure:
and electroplating each independent substrate to form a shielding coating outside the conductive coating, so that the conductive coating and the shielding coating jointly shield different circuit units.
9. The method for manufacturing an electromagnetic shielding structure of any one of claims 1 to 6, wherein the conductive coating is a metal coating or a composite coating, and the thickness of the conductive coating is 0.1 to 50 um.
10. The method for manufacturing an electromagnetic shielding structure according to any one of claims 1 to 6, wherein the non-conductive plastic layer is formed by plastic molding of a modified plastic of an organic metal compound.
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| CN202010804150.3A CN112040632B (en) | 2020-08-11 | 2020-08-11 | Method for manufacturing electromagnetic shielding structure |
| PCT/CN2021/111404 WO2022033409A1 (en) | 2020-08-11 | 2021-08-09 | Manufacturing method for electromagnetic shielding structure |
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| WO2022033409A1 (en) * | 2020-08-11 | 2022-02-17 | 青岛歌尔微电子研究院有限公司 | Manufacturing method for electromagnetic shielding structure |
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| CN102479767A (en) * | 2010-11-24 | 2012-05-30 | 宇芯（毛里求斯）控股有限公司 | Semiconductor device package with electromagnetic shielding |
| CN105428325A (en) * | 2015-12-22 | 2016-03-23 | 苏州日月新半导体有限公司 | Preparation process of single-layer ultrathin substrate packaging structure with metal shielding layer and product thereof |
| CN109300793A (en) * | 2018-10-10 | 2019-02-01 | 环维电子(上海)有限公司 | The production method and device of Sip mould group with electromagnetic armouring structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022033409A1 (en) * | 2020-08-11 | 2022-02-17 | 青岛歌尔微电子研究院有限公司 | Manufacturing method for electromagnetic shielding structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112040632B (en) | 2022-10-18 |
| WO2022033409A1 (en) | 2022-02-17 |
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