TWI829829B - Block heater and block heater assembly - Google Patents
Block heater and block heater assembly Download PDFInfo
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- TWI829829B TWI829829B TW108145792A TW108145792A TWI829829B TW I829829 B TWI829829 B TW I829829B TW 108145792 A TW108145792 A TW 108145792A TW 108145792 A TW108145792 A TW 108145792A TW I829829 B TWI829829 B TW I829829B
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- 238000010438 heat treatment Methods 0.000 claims abstract description 64
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H3/00—Air heaters
- F24H3/02—Air heaters with forced circulation
- F24H3/06—Air heaters with forced circulation the air being kept separate from the heating medium, e.g. using forced circulation of air over radiators
- F24H3/08—Air heaters with forced circulation the air being kept separate from the heating medium, e.g. using forced circulation of air over radiators by tubes
- F24H3/081—Air heaters with forced circulation the air being kept separate from the heating medium, e.g. using forced circulation of air over radiators by tubes using electric energy supply
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H9/00—Details
- F24H9/18—Arrangement or mounting of grates or heating means
- F24H9/1854—Arrangement or mounting of grates or heating means for air heaters
- F24H9/1863—Arrangement or mounting of electric heating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H2250/00—Electrical heat generating means
- F24H2250/02—Resistances
Abstract
Description
本發明要求將2018年12月17日提交的韓國專利申請號10-2018-0163044和2019年12月6日提交的韓國專利申請號10-2019-0161569的優先權透過引用將其併入本文,如同在此完整闡述一樣。This application claims the priority of Korean Patent Application No. 10-2018-0163044 filed on December 17, 2018 and Korean Patent Application No. 10-2019-0161569 filed on December 6, 2019, which are incorporated herein by reference. As fully stated here.
本發明涉及一種塊型加熱器和一種塊型加熱器組件。The present invention relates to a block heater and a block heater assembly.
通常,化學氣相沉積(chemical vapor deposition,CVP)製程是將液相材料蒸發成蒸發氣體並將蒸發後的氣體以薄膜形式沉積在半導體裝置的表面上的製程。在化學氣相沉積製程中,如果熱量沒有均勻地傳遞到作為蒸發氣體流經的路徑的氣體管線,則液相材料會被不均勻地加熱,從而產生諸如顆粒等的缺陷。因此,在整個氣體管線上提供均勻溫度的程度直接與半導體製造效率有關。Generally, a chemical vapor deposition (CVP) process is a process in which a liquid phase material is evaporated into an evaporated gas and the evaporated gas is deposited in the form of a thin film on the surface of a semiconductor device. In the chemical vapor deposition process, if heat is not transferred evenly to the gas lines that serve as paths for the evaporated gas to flow, the liquid phase material will be heated unevenly, resulting in defects such as particles. Therefore, the degree to which uniform temperatures are provided throughout the gas line is directly related to semiconductor manufacturing efficiency.
為了解決上述問題,已經對作為將氣體管線加熱至均勻溫度的手段的塊型加熱器進行了穩定的研究。In order to solve the above-mentioned problems, steady research has been conducted on block heaters as a means of heating gas lines to a uniform temperature.
圖1是示意性地示出習知的塊型加熱器的構造的視圖。FIG. 1 is a view schematically showing the structure of a conventional block heater.
參照圖1,半導體製造設備1係用來:使得將用以加熱氣體管線30的塊型加熱器40設置在蒸發器10和腔室20之間,並且使得該塊型加熱器40包含多個分開的單元加熱模組41、43和45。然而習知的塊型加熱器具有以下問題。Referring to FIG. 1 , the semiconductor manufacturing equipment 1 is used to dispose a block heater 40 for heating a gas line 30 between an evaporator 10 and a chamber 20 , and to include a plurality of separate block heaters 40 . unit heating modules 41, 43 and 45. However, the conventional block heater has the following problems.
當仔細觀察圖1的區域A中所示的塊型加熱器40的連接結構時,由於氣體管線30和塊型加熱器40之間的熱膨脹係數不同,在相鄰且彼此接觸的單元加熱模組41、43和45之間形成預定的間隙,且氣體管線30的一部分透過各間隙向外暴露。When the connection structure of the block heater 40 shown in area A of FIG. 1 is carefully observed, due to the difference in thermal expansion coefficient between the gas pipeline 30 and the block heater 40, in the adjacent and contacting unit heating modules Predetermined gaps are formed between 41, 43 and 45, and a part of the gas pipeline 30 is exposed to the outside through each gap.
由於熱導率的降低,在氣體管線30的暴露部處形成冷點,並且蒸發的氣體再次被液化,從而氣體管線可能被堵塞並且產生缺陷顆粒。Due to the reduction in thermal conductivity, cold spots are formed at the exposed portions of the gas line 30, and the evaporated gas is liquefied again, so that the gas line may be clogged and defective particles may be generated.
因此,需要一種塊型加熱器的連接結構,其在氣體管線的預定區間內提供均勻的溫度,以確保蒸發氣體的穩定性。Therefore, there is a need for a connection structure of a block heater that provides uniform temperature within a predetermined interval of the gas pipeline to ensure the stability of the evaporated gas.
實施例提供一種塊型加熱器和一種塊型加熱器組件,其中,改變傳熱單元的形狀,使得相鄰的塊型加熱器彼此重疊的同時彼此連接,從而可以在氣體管線的預定區間內提供均勻的溫度。Embodiments provide a block heater and a block heater assembly, wherein the shape of the heat transfer unit is changed so that adjacent block heaters overlap each other while being connected to each other, thereby providing a predetermined section of the gas pipeline. Uniform temperature.
透過實施例可以實現的技術目的不限於上文已經具體描述的內容,且透過以下詳細描述,本領域通常知識者將更加清楚地理解本文中未描述的其他技術目的。The technical objectives that can be achieved through the embodiments are not limited to what has been specifically described above, and through the following detailed description, those of ordinary skill in the art will more clearly understand other technical objectives not described herein.
在一實施例中,塊型加熱器包含用以向氣體管線供應預定熱量的加熱元件以及設置在氣體管線和加熱元件之間以將熱量傳遞到氣體管線的傳熱單元,其中,傳熱單元包含在傳熱單元之至少一側上沿氣體管線的縱向方向形成的凸部或凹部。In one embodiment, the block heater includes a heating element for supplying predetermined heat to the gas line and a heat transfer unit disposed between the gas line and the heating element to transfer heat to the gas line, wherein the heat transfer unit includes A protrusion or recess formed on at least one side of the heat transfer unit along the longitudinal direction of the gas pipeline.
該傳熱單元可以是由具有優良導熱效率的鋁(Al)材料製成的。The heat transfer unit may be made of aluminum (Al) material with excellent thermal conductivity efficiency.
透過陽極氧化可以在該傳熱單元的一表面上形成氧化鋁(Al2 O3 )膜。An aluminum oxide (Al 2 O 3 ) film can be formed on one surface of the heat transfer unit through anodization.
該加熱元件可以為一平面加熱元件。The heating element may be a planar heating element.
塊型加熱器可以更包含設置與該傳熱單元相對的一蓋板,且該加熱元件設置在該蓋板和該傳熱單元之間,其中在該蓋板的一外表面與一殼體的一內表面之間可以形成一氣隙。The block heater may further include a cover plate disposed opposite to the heat transfer unit, and the heating element is disposed between the cover plate and the heat transfer unit, wherein an outer surface of the cover plate and a shell An air gap can be formed between an inner surface.
該傳熱單元可以包含具有對應於該氣體管線之形狀的形狀的一第一凹口;以及設置與該第一凹口相鄰的一第二凹口,該第二凹口具有對應於安裝到該氣體管線的一末端的一連接構件形狀的形狀。The heat transfer unit may include a first recess having a shape corresponding to the shape of the gas pipeline; and a second recess disposed adjacent to the first recess, the second recess having a shape corresponding to the shape of the gas pipeline. The shape of a connecting member at one end of the gas pipeline.
在另一個實施例中,一種塊型加熱器組件包含多個塊型加熱器,該些塊型加熱器各自包含一傳熱單元,其中多個凸部或多個凹部設置在該傳熱單元的相對末端,以及該些傳熱單元透過該些凸部各自和對應的該些凹部之其中一者之間的接合而彼此耦合。In another embodiment, a block heater assembly includes a plurality of block heaters, each of the block heaters includes a heat transfer unit, wherein a plurality of convex portions or a plurality of recessed portions are disposed on the heat transfer unit. The opposite ends and the heat transfer units are coupled to each other through an engagement between each of the convex portions and a corresponding one of the concave portions.
該些塊型加熱器各自包含至少一加熱元件,該加熱元件用以向一氣體管線提供預定的熱量。Each of the block heaters includes at least one heating element for providing predetermined heat to a gas pipeline.
該些凸部各自的一表面接觸該氣體管線的一表面,以及該些凹部各自的一表面接觸對應的該些凸部之其中一者的另一表面,同時該些凹部各自的該表面與該氣體管線隔開。A surface of each of the convex parts contacts a surface of the gas pipeline, and a surface of each of the concave parts contacts another surface of one of the corresponding convex parts, and at the same time, the surface of each of the concave parts is in contact with the surface of the gas pipeline. Gas lines are separated.
塊型加熱器組件可以更包含設置在該些傳熱單元之間的連接單元,其中,該連接單元可以由具有與該些傳熱單元相同的導熱率的一材料製成。The block heater assembly may further include a connection unit disposed between the heat transfer units, wherein the connection unit may be made of a material having the same thermal conductivity as the heat transfer units.
應當理解,本發明的以上概述和以下詳細描述都是示例性和說明性的,並且旨在提供對所要求保護的本發明的進一步解釋。It is to be understood that both the foregoing summary and the following detailed description of the invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
根據本發明的至少一個實施例,在氣體管線的預定區間內提供溫度均勻的熱量,從而抑制了在氣體管線中流動的處理氣體的狀態變化,缺陷顆粒的數量顯著減少,沉積膜的品質得到改善。According to at least one embodiment of the present invention, heat with uniform temperature is provided within a predetermined interval of the gas pipeline, thereby suppressing state changes of the processing gas flowing in the gas pipeline, the number of defective particles is significantly reduced, and the quality of the deposited film is improved. .
現在將詳細參考較佳實施例,其示例在圖式中示出。儘管實施例易於進行各種修改和替代形式,但是在圖式中以示例的方式示出了其特定實施例。Reference will now be made in detail to the preferred embodiments, examples of which are illustrated in the accompanying drawings. Although the embodiments are susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings.
可以理解的是,儘管本文可以使用術語“第一”、“第二”等來描述各種元件,但是這些元件不受這些術語的限制。另外,如“上/上部/之上”和“下/下部/之下”的關係術語僅用於區分一個主題或元件與另一主題或元件而不必要求或不涉及這些主題或元件之間的任何物理或邏輯關係或順序。It will be understood that, although the terms "first," "second," etc. may be used herein to describe various elements, these elements are not limited by these terms. In addition, relative terms such as "upper/upper/above" and "lower/lower/under" are only used to distinguish one subject or element from another subject or element and do not necessarily require or refer to a relationship between these subjects or elements. Any physical or logical relationship or sequence.
提供本說明書中使用的術語僅是為了解釋特定實施例,而無意於限制本發明。除非表示與上下文有絕對不同的含義,否則單數表示可以包含複數表示。The terminology used in this specification is provided for the purpose of explaining particular embodiments only and is not intended to limit the invention. A singular expression may include a plural expression unless the expression has an absolutely different meaning from the context.
在下文中,將參照圖式描述根據實施例的塊型加熱器和塊型加熱器組件。Hereinafter, a block type heater and a block type heater assembly according to embodiments will be described with reference to the drawings.
圖2是根據本發明之一實施例示意性示出具有塊型加熱器組件的半導體製造設備的構造的視圖。2 is a view schematically showing the configuration of a semiconductor manufacturing equipment having a block-type heater assembly according to one embodiment of the present invention.
參照圖2,半導體製造設備1000包含蒸發器100、處理腔室200、氣體管線300以及塊型加熱器組件400。蒸發器100用以蒸發液相處理材料,處理腔室200用以在內部噴射從蒸發器100供給的處理氣體以在基板S上沉積薄膜,氣體管線300設置在蒸發器100和處理腔室200之間以定義處理氣體的通道,以及塊型加熱器組件400用以均勻加熱整個氣體管線300。Referring to FIG. 2 , a semiconductor manufacturing equipment 1000 includes an
塊型加熱器組件400可以包含分別設置在多個分隔的加熱區z1、z2和z3中的多個塊型加熱器400a、400b和400c。The block heater assembly 400 may include a plurality of
各個塊型加熱器400a、400b和400c是構成塊型加熱器組件400的個別單元,且塊型加熱器組件400是其中塊型加熱器400a、400b和400c彼此耦合的組件。塊型加熱器組件400可以向整個氣體管線300提供具有均勻溫度的熱量。在圖2中,塊型加熱器組件被示為包含三個塊型加熱器,然而,這僅僅是示例性的。塊型加熱器的數量可以根據氣體管線的長度或工程師的設計而改變。Each of the
由於塊型加熱器組件400包含塊型加熱器400a、400b和400c,並且如上所述,塊型加熱器400a、400b和400c是個別單元,在維護過程中,個別單元很容易彼此分離和連接。Since the block heater assembly 400 includes the
塊型加熱器400a、400b和400c各可包含傳熱單元410、殼體420以及加熱元件(未示出)。傳熱單元410用以容納氣體管線300,殼體420用以成封閉傳熱單元410並定義塊型加熱器的外觀,且加熱元件用以提供預定熱量。
傳熱單元410可包含矩形塊體411和在傳熱單元410至少一側或另一側處沿氣體管線300的縱向方向形成的凸部413或凹部415。在此,傳熱單元410的凸部413和/或凹部415用作在相鄰的塊型加熱器之間進行耦合的連接部。同時,在各塊型加熱器400a和塊型加熱器400c的一側或另一側所形成的傳熱單元410的末端可能具有平坦的表面,塊型加熱器400a和塊型加熱器400c與蒸發器100和/或處理腔室200連通。The
凸部413可以包含在塊體411的外表面上以突出預定長度形成的耦合突起4131。The protrusion 413 may include a coupling protrusion 4131 formed on an outer surface of the block 411 to protrude a predetermined length.
凹部415可以包含耦合凹口4151和側壁4153。耦合凹口4151形成在塊體411的外表面上以被壓下預定長度,以及由於形成了耦合凹口4151,側壁4153在凹部415相對末端處設置。Recess 415 may include coupling notch 4151 and sidewall 4153. The coupling recess 4151 is formed on the outer surface of the block 411 to be depressed by a predetermined length, and due to the formation of the coupling recess 4151, side walls 4153 are provided at opposite ends of the recess 415.
現在,將描述圖2中所示的相鄰塊型加熱器之間的耦合結構。Now, the coupling structure between adjacent block heaters shown in FIG. 2 will be described.
形成在第二塊型加熱器400b的一側的凸部413的耦合突起4131插入並安置在於第一塊型加熱器400a的另一側所形成的凹部415的耦合凹口4151中,藉此第一塊型加熱器400a和第二塊型加熱器400b彼此耦合。The coupling protrusion 4131 of the convex portion 413 formed on one side of the
在第二塊型加熱器400b的另一側形成的凹部415的耦合凹口4151容納在第三塊型加熱器400c的一側上形成的凸部413的耦合突起4131,藉此第二塊型加熱器400b和第三塊型加熱器400c彼此耦合。The coupling recess 4151 of the recess 415 formed on the other side of the
如上所述,傳熱單元410的凸部413和凹部415在氣體管線300的縱向方向上彼此接合,從而相鄰的塊型加熱器透過嵌合而彼此牢固地緊固,並且,在相鄰的塊狀加熱器之間的耦合區B中,凸部413的耦合突起4131和凹部415的側壁4153在垂直於氣體管線300的縱向的方向上彼此重疊。另外,凸部413的一表面4131a與氣體管線300接觸,且凹部415的一表面4153a與凸部413的另一表面4131b接觸的同時與氣體管線300隔開。As described above, the convex portion 413 and the concave portion 415 of the
與圖1所示的習知塊型加熱器40不同,該實施例的塊型加熱器組件400被配置為使得相鄰的塊型加熱器的凸部413和凹部415形成為具有交錯的結構並且彼此耦合,從而可以在整個氣體管線300上保持溫度的均勻分佈。可替代地,塊型加熱器組件400可以在分開的加熱區z1、z2和z3中均勻地加熱氣體管線。Different from the conventional block heater 40 shown in FIG. 1 , the block heater assembly 400 of this embodiment is configured such that the convex portions 413 and the concave portions 415 of adjacent block heaters are formed to have a staggered structure and are coupled to each other so that a uniform distribution of temperature can be maintained throughout the
參照圖2所示的耦合區B的放大圖,由於氣體管線300和傳熱單元410之間的熱膨脹係數不同,即使在相鄰的第一塊型加熱器400a和第二塊型加熱器400b之間形成了預定的間隙區域a1,仍可沿彼此重疊的第一塊型加熱器400a的側壁4153和第二塊型加熱器400b的耦合突起4131之間的箭頭(直線)來定義出熱傳導路徑。沿著導熱路徑,從第一塊型加熱器400a提供的熱量被傳導到第二塊型加熱器400b,且從第二塊型加熱器400b提供的熱量被傳導到第一塊型加熱器400a,從而可以顯著減小在間隙區域a1產生的溫度偏差。Referring to the enlarged view of the coupling area B shown in FIG. 2, due to the difference in thermal expansion coefficient between the
另外,在預定的間隙a2中,定義出由第一塊型加熱器400a的耦合凹口4151和第二塊型加熱器400b的耦合突起4131所緊密地封閉的密閉空間,且在該密閉空間中,沿箭頭(同心圓)定義出熱對流路徑。由於從第一塊型加熱器400a和第二塊型加熱器400b供應的熱量沿著熱對流路徑傳遞到氣體管線300,可以防止在氣體管線300的一部分上形成冷點。In addition, in the predetermined gap a2, a sealed space tightly closed by the coupling recess 4151 of the
如上所述,根據實施例的塊型加熱器組件400用以具有以下結構:相鄰的塊型加熱器的傳熱單元410彼此交錯地重疊,從而可以減小塊型加熱器之間的溫度偏差,同時防止在氣體管線300的一部分上形成冷點。因此,在氣體管線300中流動的處理氣體不發生相變(例如從氣相變為液相),從而可以提升沉積膜的品質。此外,可以在組裝過程中輕鬆實現對齊,並且還可以透過表面之間的最大接觸來防止熱量散失到外部。在下文中,將描述根據實施例的塊型加熱器的組裝過程。As described above, the block heater assembly 400 according to the embodiment is used to have the following structure: the
圖3是圖2所示的塊型加熱器組件的分解立體圖。FIG. 3 is an exploded perspective view of the block heater assembly shown in FIG. 2 .
參照圖3(a),根據一個實施例的塊型加熱器組件400可以包含多個塊型加熱器(塊型加熱器400a和塊型加熱器400b),並且,塊型加熱器400a與塊型加熱器400b各自可以形成為對稱的結構,在該結構中,塊型加熱器可以分為上下部分或左右部分。Referring to Figure 3(a), a block heater assembly 400 according to one embodiment may include a plurality of block heaters (
氣體管線300包含圓管310、二通閥的本體320和安裝有螺栓的連接構件330。The
第一塊型加熱器400a的傳熱單元410具有與氣體管線300的形狀相對應的形狀,從而被緊密地裝配到氣體管線300上。傳熱單元410包含陷入凹口4171和陷入凹口4173以及階梯凹口4175。陷入凹口4171和陷入凹口4173在傳熱單元410對應於氣體管線300的圓管310和二通閥的本體320的部分中形成以便與氣體管線300表面接觸,階梯凹口4175在傳熱單元410與連接構件330相對應的部分中形成,其中氣體管線300的連接構件330具有安裝其上的螺栓以便與氣體管線300接觸而與螺栓的位置無關。如上所述,多個凹口417形成在傳熱單元410中,使得接觸面積在整個氣體管線300上增加。提供該構造以將預定的熱量從傳熱單元410均勻地傳導到氣體管線300。如果這種接觸狀態在特定部分處被釋放,該部分處的導熱效率則會顯著降低。The
參照圖3(b),第一塊型加熱器400a的第一單元塊型加熱器400a-1以對稱結構形成,第一塊型加熱器400a的第一單元塊型加熱器400a-1在垂直於氣體管線300的縱向的方向上組裝並因此均勻地與作為被加熱對象的氣體管線300緊密接觸。這裡,在第一單元塊型加熱器400a-1的上部和/或側部設置有如緊固件或抓夾的固定手段500。Referring to FIG. 3(b), the first
參照圖3(c),第一塊型加熱器400a的第二單元塊型加熱器400a-2以對稱結構形成,第一塊型加熱器400a的第二單元塊型加熱器400a-2均勻地與作為被加熱對象的氣體管線300緊密接觸,並同時透過設置在第一單元塊型加熱器400a-1上的固定手段500牢固地固定並耦合到第一單元塊型加熱器400a-1。Referring to FIG. 3(c), the second
同時,如前所述,構成第一塊型加熱器400a的第一單元塊型加熱器400a-1和第二單元塊型加熱器400a-2相對於氣體管線300的縱向方向對稱,且第一單元塊型加熱器400a-1和第二單元塊型加熱器400a-2包含相同的部件。Meanwhile, as mentioned above, the first
在下文中,將參考圖4所示的塊型加熱器的截面圖描述塊型加熱器的組件。Hereinafter, components of the block heater will be described with reference to a cross-sectional view of the block heater shown in FIG. 4 .
圖4是沿著圖2的1-1'線截取的塊型加熱器的截面圖。FIG. 4 is a cross-sectional view of the block heater taken along line 1-1' of FIG. 2 .
參照圖4,塊型加熱器400a可包含傳熱單元410、殼體420、加熱元件430以及蓋板440。傳熱單元410用以容納氣體管線300,殼體420用以包圍傳熱單元410並定義塊型加熱器的外觀,加熱元件430用以提供預定熱量,蓋板440用以覆蓋加熱元件430。Referring to FIG. 4 , the
傳熱單元410可以形成為對應於氣體管線300的形狀,並且可以與氣體管線300的表面接觸,使得將從加熱元件430供應的預定熱量傳導到氣體管線300。The
傳熱單元410可以由表現出高導熱率的材料製成。例如,傳熱單元410可以包含選自從鋁(Al)、銅(Cu)、銀(Ag)、鎢(W)及其組合組成的群組中的任意一種;然而,本發明不限於此。由具有高導熱率的材料製成的傳熱單元410可以平穩地將從加熱元件430供應的熱量傳導到氣體管線300。The
傳熱單元410的表面被陽極氧化,以表現出高的耐腐蝕性和耐磨性。可以透過陽極氧化在傳熱單元410的表面上形成氧化鋁(Al2
O3
)膜。The surface of the
至少一個凹口417(例如,陷入凹口4171、陷入凹口4173和階梯凹口4175)具有與氣體管線300的外周表面的形狀相對應的形狀,至少一個凹口417在傳熱單元410的一個末端中形成,並且可以在傳熱單元410的另一端中形成凹陷到預定深度以容納加熱元件430的容納凹口419。At least one recess 417 (for example, the recessed recess 4171 , the recessed recess 4173 and the stepped recess 4175 ) has a shape corresponding to the shape of the outer peripheral surface of the
加熱元件430可以將預定的熱量提供給傳熱單元410,使得在氣體管線300中流動的處理氣體被加熱至均勻的溫度。The
加熱元件430可以是配置成使得在加熱元件430的整個區域上均勻分佈加熱區域的平面加熱元件,以具有均勻的溫度分佈。
加熱元件430可以被安置於在傳熱單元410的另一末端中形成的容納凹口419中。此時,容納凹口419的深度或寬度可以對應於加熱元件430的厚度或寬度,使得在容納凹口419和加熱元件430之間既不形成單獨的空間也不形成氣穴。其原因在於,在容納凹口419與加熱元件430之間的接合表面處形成氣穴的態樣下,由於部分熱量的散發,可能無法為傳熱單元410提供均勻的溫度。The
蓋板設置與該傳熱單元相對的情況下,且該加熱元件設置在該蓋板和該傳熱單元之間。另外,蓋板440設置在傳熱單元410的另一末端上和加熱元件430上,以覆蓋安置在容納凹口419中的加熱元件430。The cover plate is arranged opposite to the heat transfer unit, and the heating element is arranged between the cover plate and the heat transfer unit. In addition, a
蓋板440可以設置為改善從加熱元件430發出的熱量的均勻性並固定加熱元件430的位置,並且蓋板440可以由例如為碳化矽(SiC)之材料製成。The
殼體420可以包圍傳熱單元410和/或蓋板440,並且殼體420可以定義塊型加熱器400a的外觀。The
殼體420可以由具有高耐熱性的絕緣材料製成,以防止從加熱元件430提供的熱量逸出塊型加熱器400a。聚醚醚酮(Poly ether ether ketone,PEEK)可以用作表現出高耐熱性的絕緣材料的示例。The
另外,可以將用以將從加熱元件430發出的熱量反射到傳熱單元410的塗層設置在殼體420的內表面上,以改善隔熱或散熱性能。In addition, a coating to reflect heat emitted from the
預定的氣隙450可以形成在殼體420的內表面和蓋板440的外表面之間。其原因在於,在殼體420中沒有形成氣隙450的態樣下,由加熱元件430產生的熱量可以透過蓋板440傳導到殼體420中,並且由於傳導的熱量,殼體420的絕熱性能可能顯著降低。A
因此,在根據該實施例的塊型加熱器400a中,在殼體420中形成單獨的氣隙450,從而可以控制加熱元件430和殼體420之間的熱流路徑,以確保殼體420的絕熱性能。Therefore, in the
此時,氣隙450的寬度d1可以等於或可以對應於加熱元件430的寬度d2。可替代地,氣隙450的面積可以等於或可以對應於加熱元件430的面積。At this time, the width d1 of the
同時,如前所述,加熱元件430被設計為被傳熱單元410的容納凹口419和蓋板440所覆蓋,以提供具有均勻溫度的熱量。此時,出於與設計相關的原因,加熱元件430未直接設置在傳熱單元410的一側和/或另一側。因此,為了防止在整個氣體管線300上出現局部溫度差,需要提高在與相鄰的塊型加熱器連接的傳熱單元410的一側和/或另一側的導熱效率。在下文中將參考圖5至圖7對此進行描述。Meanwhile, as mentioned above, the
圖5至圖7是沿圖2的2-2'線截取的傳熱單元的立體圖。5 to 7 are perspective views of the heat transfer unit taken along line 2-2' of FIG. 2 .
圖5是根據本發明之一實施例示出塊型加熱器組件的傳熱單元的立體圖。5 is a perspective view of a heat transfer unit of a block heater assembly according to an embodiment of the present invention.
參照圖5(a)所示的分解立體圖,第一傳熱單元410a和第二傳熱單元410b具有相同的形狀,其中各在第一傳熱單元410a和第二傳熱單元410b的一側和另一側形成有凹部(凹部415a或凹部415b)和凸部(凸部413a或凸部413b)。此時,第一傳熱單元410a和第二傳熱單元410b可以沿氣體管線300的縱向方向依序地設置。Referring to the exploded perspective view shown in FIG. 5(a) , the first heat transfer unit 410a and the second heat transfer unit 410b have the same shape, wherein each side of the first heat transfer unit 410a and the second heat transfer unit 410b and A concave portion (recessed portion 415a or concave portion 415b) and a convex portion (convex portion 413a or convex portion 413b) are formed on the other side. At this time, the first heat transfer unit 410a and the second heat transfer unit 410b may be sequentially disposed along the longitudinal direction of the
第一傳熱單元410a可以包含在第一傳熱單元410a一側形成的凹部415a和在第一傳熱單元410a另一側形成的凸部413a,且第二傳熱單元410b可包含在第二傳熱單元410b一側形成的凹部415b和在第二傳熱單元410b另一側形成的凸部413b。The first heat transfer unit 410a may include a recessed portion 415a formed on one side of the first heat transfer unit 410a and a convex portion 413a formed on the other side of the first heat transfer unit 410a, and the second heat transfer unit 410b may be included in the second heat transfer unit 410a. The recessed portion 415b formed on one side of the heat transfer unit 410b and the convex portion 413b formed on the other side of the second heat transfer unit 410b.
凸部413a包含形成在塊體411的外表面上以突出預定長度的耦合突起4131,且凹部415b包含耦合凹口4151和側壁4153,耦合凹口4151形成在塊體411的外表面上以被下壓預定長度,由於形成了耦合凹口4151,側壁4153在凹部415b相對的末端處設置。The convex portion 413a includes a coupling protrusion 4131 formed on the outer surface of the block 411 to protrude a predetermined length, and the recessed portion 415b includes a coupling recess 4151 formed on the outer surface of the block 411 to be lowered and a side wall 4153. Pressed to a predetermined length, side walls 4153 are provided at opposite ends of the recess 415b due to the formation of the coupling recess 4151.
參照圖5(a)和圖5(b)所示的組裝立體圖,在第一傳熱單元410a的另一側形成的凸部413a和在第二傳熱單元410b的一側設置的凹部415b彼此重疊,並透過嵌合牢固地緊固在一起。Referring to the assembly perspective views shown in FIGS. 5(a) and 5(b) , the convex portion 413a formed on the other side of the first heat transfer unit 410a and the recessed portion 415b provided on one side of the second heat transfer unit 410b are mutually exclusive. Overlapping and firmly fastened together by fitting.
凹部415b可以形成為具有使得凸部413a插入凹部415b中的尺寸,並且耦合突起4131的寬度可以等於耦合凹口4151的寬度從而使得耦合突起4131安置在耦合凹口4151內。在此,耦合突起4131的寬度可以是大約3mm至8mm;然而,本發明不限於此。The recess 415b may be formed to have a size such that the protrusion 413a is inserted into the recess 415b, and the width of the coupling protrusion 4131 may be equal to the width of the coupling recess 4151 so that the coupling protrusion 4131 is seated within the coupling recess 4151. Here, the width of the coupling protrusion 4131 may be about 3 mm to 8 mm; however, the present invention is not limited thereto.
同時,從第一加熱元件(未示出)提供的熱量可以通過在第二傳熱單元410b一側的凹部415b傳導到第二傳熱單元410b,第二傳熱單元410b一側的凹部415b與在第一傳熱單元410a的另一側的凸部413a重疊,並且可以將從第二加熱元件(未示出)提供的熱量通過第一傳熱單元410a另一側的凸部413a傳導至第一傳熱單元410a,第一傳熱單元410a另一側的凸部413a與在第二傳熱單元410b的一側的凹部415b重疊。At the same time, the heat provided from the first heating element (not shown) may be conducted to the second heat transfer unit 410b through the recess 415b on one side of the second heat transfer unit 410b, and the recess 415b on one side of the second heat transfer unit 410b is in contact with the second heat transfer unit 410b. The convex portion 413a on the other side of the first heat transfer unit 410a overlaps, and the heat provided from the second heating element (not shown) can be conducted to the third heat transfer unit 410a through the convex portion 413a on the other side of the first heat transfer unit 410a. In one heat transfer unit 410a, the convex portion 413a on the other side of the first heat transfer unit 410a overlaps with the recessed portion 415b on one side of the second heat transfer unit 410b.
如上所述,可以沿著在第一傳熱單元410a的另一側的耦合突起4131和在第二傳熱單元410b的一側的側壁4153之間的箭頭定義導熱路徑,耦合突起4131和側壁4153彼此重疊,從而可以在第一傳熱單元410a和第二傳熱單元410b彼此耦合的耦合區B中實現溫度補償。因此,可以在整個第一傳熱單元410a和第二傳熱單元410b上維持溫度的均勻分佈。可替代地,塊型加熱器組件400可以在分開的加熱區z1、z2和z3中均勻地加熱氣體管線300。As described above, the heat conduction path may be defined along the arrow between the coupling protrusion 4131 on the other side of the first heat transfer unit 410a and the side wall 4153 on one side of the second heat transfer unit 410b, the coupling protrusion 4131 and the side wall 4153 overlap each other, so that temperature compensation can be achieved in the coupling region B where the first heat transfer unit 410a and the second heat transfer unit 410b are coupled to each other. Therefore, uniform distribution of temperature can be maintained throughout the first heat transfer unit 410a and the second heat transfer unit 410b. Alternatively, block heater assembly 400 may heat
圖6是根據本發明的另一實施例示出塊型加熱器組件的傳熱單元的立體圖。6 is a perspective view illustrating a heat transfer unit of a block heater assembly according to another embodiment of the present invention.
參照圖6(a)所示的分解立體圖,第一傳熱單元410a和第二傳熱單元410b在各自的相對側設置有多個凹部415a或多個凸部413b,並且第一傳熱單元410a和第二傳熱單元410b具有不同的形狀。此時,第一傳熱單元410a和第二傳熱單元410b可以在氣體管線300的縱向方向上交替設置。Referring to the exploded perspective view shown in FIG. 6(a) , the first heat transfer unit 410a and the second heat transfer unit 410b are provided with a plurality of recessed portions 415a or a plurality of convex portions 413b on their respective opposite sides, and the first heat transfer unit 410a and the second heat transfer unit 410b have different shapes. At this time, the first heat transfer units 410a and the second heat transfer units 410b may be alternately arranged in the longitudinal direction of the
凸部413b可以形成在第二傳熱單元410b的相對側,且凹部415a和凹部415c可以形成在第一傳熱單元410a和第三傳熱單元410c的相對側,第一傳熱單元410a和第三傳熱單元410c設置在第二傳熱單元410b的一側和另一側。在第二傳熱單元410b設置在第一傳熱單元410a和第三傳熱單元410c之間的態樣下,分別在第一傳熱單元410a和第三傳熱單元410c的相對側形成凹部415a和凹部415c。如上所述,使用者可以在維護期間容易地將傳熱單元彼此分離。The convex portion 413b may be formed on opposite sides of the second heat transfer unit 410b, and the recessed portions 415a and 415c may be formed on opposite sides of the first and third heat transfer units 410a and 410c, the first and third heat transfer units 410a and 410c. The third heat transfer unit 410c is provided on one side and the other side of the second heat transfer unit 410b. In a state where the second heat transfer unit 410b is disposed between the first heat transfer unit 410a and the third heat transfer unit 410c, recesses 415a are formed on opposite sides of the first heat transfer unit 410a and the third heat transfer unit 410c respectively. and recess 415c. As mentioned above, the user can easily separate the heat transfer units from each other during maintenance.
參照圖6(a)和圖6(b)所示的組裝立體圖,形成在第一傳熱單元410a的另一側的凹部415a和設置在第二傳熱單元410b的一側的凸部413b彼此重疊,並且透過嵌合而彼此緊密地固定,且形成在第二傳熱單元410b的另一側的凸部413b和設置在第三傳熱單元410c的一側的凹部415c彼此重疊,並透過嵌合而緊密地固定。Referring to the assembly perspective views shown in FIGS. 6(a) and 6(b) , the recessed portion 415a formed on the other side of the first heat transfer unit 410a and the convex portion 413b provided on one side of the second heat transfer unit 410b are mutually exclusive. The convex portion 413b formed on the other side of the second heat transfer unit 410b and the recessed portion 415c provided on one side of the third heat transfer unit 410c overlap each other and are tightly fixed to each other through fitting. Fastened together and tightly.
如圖所示,相鄰的傳熱單元形成為在彼此重疊的狀態下具有交錯結構。結果,可以在第一傳熱單元410a和第二傳熱單元410b之間的耦合區B1中形成熱傳導路徑和/或在第二傳熱單元410b和第三傳熱單元410c之間的耦合區B2中形成熱傳導路徑,並且可以沿著形成的導熱路徑實現溫度補償,從而可以在整個第一傳熱單元410a、第二傳熱單元410b和第三傳熱單元410c上保持溫度的均勻分佈。可替代地,塊型加熱器組件400可以在分開的加熱區z1、z2和z3中均勻地加熱氣體管線300。As shown in the figure, adjacent heat transfer units are formed to have a staggered structure in a state of overlapping each other. As a result, a heat conduction path may be formed in the coupling area B1 between the first heat transfer unit 410a and the second heat transfer unit 410b and/or the coupling area B2 between the second heat transfer unit 410b and the third heat transfer unit 410c. A heat conduction path is formed in the heat conduction path, and temperature compensation can be achieved along the formed heat conduction path, so that a uniform distribution of temperature can be maintained throughout the first heat transfer unit 410a, the second heat transfer unit 410b, and the third heat transfer unit 410c. Alternatively, block heater assembly 400 may heat
圖7是根據本發明的另一實施例示出塊型加熱器組件的傳熱單元的立體圖。7 is a perspective view illustrating a heat transfer unit of a block heater assembly according to another embodiment of the present invention.
參照圖7(a)所示的分解立體圖,第一傳熱單元410a和第二傳熱單元410b在其相對兩側分別設置有凹部415a和凹部415b,並且第一傳熱單元410a和第二傳熱單元410b具有相同的形狀。此時,可以在第一傳熱單元410a和第二傳熱單元410b之間設置連接單元412。Referring to the exploded perspective view shown in FIG. 7(a) , the first heat transfer unit 410a and the second heat transfer unit 410b are respectively provided with recesses 415a and 415b on opposite sides thereof, and the first heat transfer unit 410a and the second heat transfer unit 410a are respectively provided with recesses 415a and recesses 415b. Thermal units 410b have the same shape. At this time, the connection unit 412 may be provided between the first heat transfer unit 410a and the second heat transfer unit 410b.
連接單元412可以形成為具有足夠的尺寸以插入第一傳熱單元410a的凹部415a和第二傳熱單元410b的凹部415b中,並且連接單元412的寬度d3可以等於第一傳熱單元410a的另一側的耦合凹口4151的第一寬度d4與第二傳熱單元410b的一側的耦合凹口4151的第二寬度d5之和。這裡,連接單元412的寬度d3可以是大約3mm至8mm;然而,本發明不限於此。The connection unit 412 may be formed with a sufficient size to be inserted into the recess 415a of the first heat transfer unit 410a and the recess 415b of the second heat transfer unit 410b, and the width d3 of the connection unit 412 may be equal to the other side of the first heat transfer unit 410a. The sum of the first width d4 of the coupling recess 4151 on one side and the second width d5 of the coupling recess 4151 on one side of the second heat transfer unit 410b. Here, the width d3 of the connection unit 412 may be approximately 3 mm to 8 mm; however, the present invention is not limited thereto.
連接單元412可以由具有高導熱率的材料製成。例如,連接單元412可以包含選自從鋁(Al)、銅(Cu)、銀(Ag)、鎢(W)及其組合組成的群組中的任何一種;然而,本發明不限於此。The connection unit 412 may be made of a material with high thermal conductivity. For example, the connection unit 412 may include any one selected from the group consisting of aluminum (Al), copper (Cu), silver (Ag), tungsten (W), and combinations thereof; however, the present invention is not limited thereto.
另外,連接單元412可以由具有與第一傳熱單元410a和第二傳熱單元410b相同的導熱率的材料製成。如果連接單元412的導熱率不同於第一傳熱單元410a和第二傳熱單元410b的導熱率,傳導到氣體管線300的各個區域的熱量可能彼此不同,從而可能無法在整個氣體管線300上保持溫度的均勻分佈。In addition, the connection unit 412 may be made of a material having the same thermal conductivity as the first heat transfer unit 410a and the second heat transfer unit 410b. If the thermal conductivity of the connection unit 412 is different from the thermal conductivity of the first heat transfer unit 410a and the second heat transfer unit 410b, the heat transferred to various areas of the
參照圖7(a)和圖7(b)所示的組裝立體圖,連接單元412與在第一傳熱單元410a的另一側形成的凹部415a以及在第二傳熱單元410b的一側形成的凹部415b重疊,並且連接單元412透過嵌合牢固地緊固至第一傳熱單元410a和第二傳熱單元410b。此時,連接單元412的一表面412a接觸氣體管線300的表面,且凹部415的一表面4153a接觸連接單元412的另一個表面412b,同時凹部415的一表面4153a與氣體管線300隔開。Referring to the assembly perspective views shown in FIGS. 7(a) and 7(b) , the connection unit 412 has a recess 415a formed on the other side of the first heat transfer unit 410a and a recess 415a formed on one side of the second heat transfer unit 410b. The recessed portions 415b overlap, and the connection unit 412 is firmly fastened to the first heat transfer unit 410a and the second heat transfer unit 410b through fitting. At this time, one surface 412a of the connection unit 412 contacts the surface of the
同時,從第一加熱元件(未示出)提供的熱量可以經由連接單元412傳導至第二傳熱單元410b,連接單元412與第一傳熱單元410a另一側的凹部415a重疊,並且連接單元412可以將第二加熱元件(未示出)提供的熱量通過連接單元412傳導到第一傳熱單元410a,連接單元412與在第二傳熱單元410b的一側的凹部415b重疊。也就是說,彼此相鄰的第一傳熱單元410a和第二傳熱單元410b透過設置連接單元412,可以在相互重疊的狀態下形成交錯結構,在第一傳熱單元410a和第二傳熱單元410b之間的耦合區B1中可以形成熱傳導路徑,並且可以沿著形成的導熱路徑實現溫度補償,從而可以在整個第一傳熱單元410a和第二傳熱單元410b上保持溫度的均勻分佈。可替代地,塊型加熱器組件400可以在分開的加熱區z1、z2和z3中均勻地加熱氣體管線300。At the same time, the heat provided from the first heating element (not shown) may be conducted to the second heat transfer unit 410b via the connection unit 412, which overlaps the recess 415a on the other side of the first heat transfer unit 410a, and the connection unit 412 may conduct the heat provided by the second heating element (not shown) to the first heat transfer unit 410a through the connection unit 412, which overlaps the recess 415b on one side of the second heat transfer unit 410b. That is to say, the first heat transfer unit 410a and the second heat transfer unit 410b that are adjacent to each other can form a staggered structure in an overlapping state by providing the connecting unit 412. A heat conduction path may be formed in the coupling area B1 between the units 410b, and temperature compensation may be achieved along the formed heat conduction path, so that uniform temperature distribution may be maintained throughout the first heat transfer unit 410a and the second heat transfer unit 410b. Alternatively, block heater assembly 400 may heat
在下文中,將參照圖8描述可應用於包含三通閥的氣體管線300的塊型加熱器的結構。Hereinafter, the structure of a block heater applicable to the
圖8是根據本發明之一實施例示出應用於包含三通閥的氣體管線的塊型加熱器的視圖。8 is a view illustrating a block heater applied to a gas pipeline including a three-way valve according to one embodiment of the present invention.
為了便於描述,將省略與圖2的描述重疊的描述,並且將基於差異進行描述。For convenience of description, description overlapping with that of FIG. 2 will be omitted, and description will be based on differences.
參照圖8,塊型加熱器組件可以包含設置在多個分隔的加熱區zl至z6中的多個塊型加熱器400a ~ 400f。Referring to FIG. 8 , the block heater assembly may include a plurality of
如圖8的區域C所示,在加熱區z1至z6中的第五加熱區z5中提供了氣體管線300,氣體管線300還可以包含三通閥,該三通閥用以選擇性地將從蒸發器100引入的處理氣體排放到處理腔室200a或EVAC 200b。As shown in area C of FIG. 8 , a
三通閥包含閥體340和球體,閥體340具有形成在閥體340中的入口341、第一出口342和第二出口343。球體(未示出)安裝在閥體340中,以打開和關閉處理氣體流路或改變處理氣體流路的方向。The three-way valve includes a
如先前參考圖3所述,設置成與具有二通閥的氣體管線300緊密接觸的傳熱單元410具有與氣體管線300的形狀相對應的形狀,以便嵌合在氣體管線300上。特別地,傳熱單元410設置有陷入凹口4173,該陷入凹口4173的形狀對應於二通閥的本體320的外周表面的形狀,從而與二通閥的本體320表面接觸。As previously described with reference to FIG. 3 , the
但是,如圖8所示,對於與具有三通閥的氣體管線300緊密接觸地設置的傳熱單元410,在三通閥的閥體340中形成的凹口4177可以具有不同的形狀。如果在傳熱單元410的表面中形成預定的凹口,以使凹口具有與閥體340的外周表面的形狀相對應的形狀,由於操作(work)原因,無法安裝閥頭(未顯示)。其原因是:對於與二通閥不同的三通閥來說,由於氣體管線的干擾,因此閥頭(未顯示)的安裝位置受到限制。However, as shown in FIG. 8 , for the
因此,根據實施例的塊型加熱器400e的傳熱單元410可以在傳熱單元410表面上設置有預定的凹口4177,該凹口4177用以容納三通閥。凹口4177可以形成為具有足夠的尺寸以容納三通閥的閥體340。此時,凹口4177的內徑可以形成為大於閥體340的外徑。Therefore, the
塊型加熱器400e還可包含設置在凹口4177和閥體340之間的空間中的填充部460,填充部460由具有與傳熱單元410相同的導熱率的材料製成。填充部460被提供以將預定的熱量從傳熱單元410均勻地傳導到氣體管線300,並且由於凹口4177的形成而提高了在接觸狀態被釋放的部分處的導熱效率。填充部460可以使與氣體管線300的表面接觸最大化,從而實現有效的熱傳遞。The
圖9是根據本發明的又一實施例示出塊型加熱器組件的立體圖。Figure 9 is a perspective view of a block heater assembly according to yet another embodiment of the present invention.
參照圖9(a)所示的分解立體圖,塊型加熱器組件400可以包含多個傳熱單元(第一傳熱單元410a和第二傳熱單元410b)以及設置在第一傳熱單元410a和第二傳熱單元410b之間的連接單元412,且第一傳熱單元410a和第二傳熱單元410b可以形成為具有相同的形狀。Referring to the exploded perspective view shown in FIG. 9(a) , the block heater assembly 400 may include a plurality of heat transfer units (a first heat transfer unit 410a and a second heat transfer unit 410b) and disposed between the first heat transfer unit 410a and the second heat transfer unit 410b. The connecting unit 412 between the second heat transfer unit 410b, and the first heat transfer unit 410a and the second heat transfer unit 410b may be formed to have the same shape.
第一傳熱單元410a和第二傳熱單元410b各包含塊體411和在塊體411的相對側表面一體形成的一對突起415’,且各突起415’具有“[”或“U”形的橫截面,並且突起415’形成在塊體411的外表面上突出預定的寬度d4。The first heat transfer unit 410a and the second heat transfer unit 410b each include a block 411 and a pair of protrusions 415' integrally formed on opposite side surfaces of the block 411, and each protrusion 415' has a "[" or "U" shape. cross section, and the protrusion 415' is formed on the outer surface of the block 411 to project a predetermined width d4.
突起415’包含第一段4151’、與第一段4151’相對的第二段4152’、設置在第一段4151’和第二段4152’之間的第三段4153’以及陷入凹口417。第三段4153’防止從加熱元件(未示出)提供的熱量散發到外部,陷入凹口417設置成與氣體管線300表面接觸且陷入凹口417可以由突起415’打開。第一傳熱單元410a和第二傳熱單元410b各可以在其一側和另一側設置有開口OP,該開口OP被塊體411的外表面和突起415’的內周表面所圍繞,並且連接單元412可以插入開口OP中。The protrusion 415' includes a first section 4151', a second section 4152' opposite the first section 4151', a third section 4153' disposed between the first section 4151' and the second section 4152', and a
連接單元412形成為具有足夠的尺寸和/或形狀,以緊密地插入到形成在第一傳熱單元410a和第二傳熱單元410b的一側和另一側的開口OP中。例如,連接單元412和開口OP的橫截面在面積和形狀上彼此相同,且連接單元412的寬度d3可以是突起415’的寬度d4的兩倍(d4 = d3 / 2)。The connection unit 412 is formed to have a sufficient size and/or shape to be tightly inserted into the openings OP formed on one side and the other side of the first and second heat transfer units 410a and 410b. For example, the cross sections of the connection unit 412 and the opening OP are the same as each other in area and shape, and the width d3 of the connection unit 412 may be twice the width d4 of the protrusion 415' (d4 = d3/2).
另外,連接單元412可以由表現出與第一傳熱單元410a和第二傳熱單元410b相同的導熱率的材料製成。例如,連接單元412可以包含選自鋁(Al)、銅(Cu)、銀(Ag)、鎢(W)及其組合的群組中的任意一種。In addition, the connection unit 412 may be made of a material exhibiting the same thermal conductivity as the first heat transfer unit 410a and the second heat transfer unit 410b. For example, the connection unit 412 may include any one selected from the group consisting of aluminum (Al), copper (Cu), silver (Ag), tungsten (W), and combinations thereof.
參照圖9(a)和圖9(b)所示的組裝立體圖,連接單元412與在第一傳熱單元410a和第二傳熱單元410b的一側和另一側上形成的開口OP重疊,並且透過嵌合而牢固地緊固至第一傳熱單元410a和第二傳熱單元410b。Referring to the assembled perspective views shown in FIGS. 9(a) and 9(b) , the connection unit 412 overlaps the opening OP formed on one side and the other side of the first heat transfer unit 410a and the second heat transfer unit 410b, And it is firmly fastened to the first heat transfer unit 410a and the second heat transfer unit 410b through fitting.
此時,連接單元412的前表面412a接觸氣體管線300的表面,與前表面412a相對的連接單元412的後表面412b直接接觸構成第一傳熱單元410a和第二傳熱單元410b的突起415’的第三段4153’。另外,連接單元412的上表面和下表面各直接接觸突起415’的第一段4151’和第二段4152’中相應的一個,且連接單元412的側表面直接接觸塊體411。At this time, the front surface 412a of the connection unit 412 contacts the surface of the
也就是說,連接單元412被第一傳熱單元410a和第二傳熱單元410b之間的耦合完全包圍,並且連接單元412不暴露於外。因此,從加熱元件(未顯示)提供的熱量在與連接單元412直接接觸的突起415’的內周表面中被獲取,且排放到外部的熱量的損失路徑被第三段4153’旁路或擴展,由此,可以提高塊型加熱器組件400的隔熱效率。That is, the connection unit 412 is completely surrounded by the coupling between the first heat transfer unit 410a and the second heat transfer unit 410b, and the connection unit 412 is not exposed to the outside. Therefore, the heat provided from the heating element (not shown) is captured in the inner peripheral surface of the protrusion 415' in direct contact with the connection unit 412, and the loss path of the heat discharged to the outside is bypassed or expanded by the third section 4153' , thus, the heat insulation efficiency of the block heater assembly 400 can be improved.
此外,由於第一傳熱單元410a和第二傳熱單元410b以交錯結構與連接單元412重疊,沿著相鄰的第一傳熱單元410a和第二傳熱單元410b之間的箭頭形成熱傳導路徑,並沿著熱傳導路徑實現溫度補償,從而可以保持溫度的均勻分佈。因此,塊型加熱器組件400可以在分開的加熱區z1、z2和z3中均勻地加熱氣體管線300。In addition, since the first heat transfer unit 410a and the second heat transfer unit 410b overlap the connection unit 412 in a staggered structure, a heat conduction path is formed along the arrows between the adjacent first heat transfer units 410a and the second heat transfer unit 410b. , and realize temperature compensation along the heat conduction path, so that the uniform distribution of temperature can be maintained. Therefore, the block heater assembly 400 can heat the
根據本發明的至少一個實施例,在氣體管線的預定區間內提供溫度均勻的熱量,從而抑制了在氣體管線中流動的處理氣體的狀態變化,缺陷顆粒的數量顯著減少,沉積膜的品質得到改善。According to at least one embodiment of the present invention, heat with uniform temperature is provided within a predetermined interval of the gas pipeline, thereby suppressing state changes of the processing gas flowing in the gas pipeline, the number of defective particles is significantly reduced, and the quality of the deposited film is improved. .
應當注意,本發明的效果不限於上述效果,根據本發明的以上描述,本領域通常知識者將清楚地理解本發明的其他方面和未提及的效果。It should be noted that the effects of the present invention are not limited to the above-mentioned effects, and those of ordinary skill in the art will clearly understand other aspects and unmentioned effects of the present invention based on the above description of the present invention.
儘管上面僅描述了幾個實施例,但是可以提供各種其他實施例。除非它們不兼容,否則可以以各種方式組合以上實施例,並且可以由此實現新的實施例。Although only a few embodiments are described above, various other embodiments may be provided. Unless they are incompatible, the above embodiments may be combined in various ways, and new embodiments may thereby be implemented.
對於本領域的通常知識者將顯而易見的是,在不脫離本發明的精神和實質特徵的態樣下,可以以不同於本文闡述的形式的特定形式來實施本發明。因此,以上詳細描述應在所有方面解釋為說明性而非限制性的。本發明的範圍應該由對所附申請專利範圍的合理解釋來確定,並且落入所附申請專利範圍的等效範圍內的所有改變都應包含在其中。It will be apparent to those of ordinary skill in the art that the present invention may be embodied in specific forms other than those set forth herein without departing from the spirit and essential characteristics of the invention. Accordingly, the above detailed description is to be construed in all respects as illustrative and not restrictive. The scope of the present invention should be determined by a reasonable interpretation of the appended patent scope, and all changes that fall within the equivalent range of the appended patent scope should be included therein.
1:半導體製造設備 10:蒸發器 20:腔室 30:氣體管線 40:塊型加熱器 41、43、45:單元加熱模組 1000:半導體製造設備 100:蒸發器 200、200a:處理腔室 200b:EVAC 300:氣體管線 310:圓管 320:本體 330:連接構件 340:閥體 341:入口 342:第一出口 343:第二出口 400:塊型加熱器組件 400a、400b、400c、400d、400e、400f:塊型加熱器 400a-1:第一單元塊型加熱器 400a-2:第二單元塊型加熱器 410:傳熱單元 410a:第一傳熱單元 410b:第二傳熱單元 410c:第三傳熱單元 411:塊體 412: 連接單元 412a、412b:表面 413、413a、413b:凸部 4131:耦合突起 4131a、4131b:表面 415、415a、415b、415c:凹部 4151:耦合凹口 4153:側壁 4153a:表面 415’:突起 4151’:第一段 4152’:第二段 4153’:第三段 417:凹口 4171、4173:陷入凹口 4175:階梯凹口 4177:凹口 419:容納凹口 420:殼體 430:加熱元件 440:蓋板 450:氣隙 460:填充部 500:固定手段 A、C:區域 S:基板 z1、z2、z3、z4、z5、z6:加熱區 B、B1、B2:耦合區 a1:間隙區域 a2:間隙 OP:開口 d1、d2、d3、d4、d5:寬度1:Semiconductor manufacturing equipment 10:Evaporator 20: Chamber 30:Gas pipeline 40:Block heater 41, 43, 45: unit heating module 1000:Semiconductor manufacturing equipment 100:Evaporator 200, 200a: Processing chamber 200b:EVAC 300:Gas pipeline 310: round tube 320:Ontology 330:Connection components 340: Valve body 341: Entrance 342:First exit 343:Second exit 400: Block heater assembly 400a, 400b, 400c, 400d, 400e, 400f: block heater 400a-1: First unit block heater 400a-2: Second unit block heater 410:Heat transfer unit 410a: First heat transfer unit 410b: Second heat transfer unit 410c: Third heat transfer unit 411:Block 412: Connection unit 412a, 412b: Surface 413, 413a, 413b: convex part 4131:Coupling protrusion 4131a, 4131b: Surface 415, 415a, 415b, 415c: concave part 4151:Coupling notch 4153:Side wall 4153a: Surface 415’:Protrusion 4151’: first paragraph 4152’:Second paragraph 4153’: The third paragraph 417: Notch 4171, 4173: Caught in a notch 4175:Step notch 4177:Notch 419: accommodation notch 420: Shell 430:Heating element 440:Cover 450: air gap 460: Filling Department 500: Fixed means A, C: area S:Substrate z1, z2, z3, z4, z5, z6: heating zone B, B1, B2: coupling area a1: gap area a2: gap OP: Open your mouth d1, d2, d3, d4, d5: width
圖式包含在本案內以提供對本發明的進一步理解,並結合在本案中並構成本案的一部分,圖式示出了本發明的實施例,並且與說明書一起用於解釋本發明的原理。在圖式中: 圖1是示意性示出習知的塊型加熱器的構造的視圖。 圖2是根據本發明之一實施例示意性示出具有塊型加熱器組件的半導體製造設備的構造的視圖。 圖3是圖2所示的塊型加熱器組件的分解立體圖。 圖4是沿著圖2的1-1'線截取的塊型加熱器的截面圖。 圖5是根據本發明之一實施例示出塊型加熱器組件的傳熱單元的立體圖。 圖6是根據本發明的另一實施例示出塊型加熱器組件的傳熱單元的立體圖。 圖7是根據本發明的另一實施例示出塊型加熱器組件的傳熱單元的立體圖。 圖8是根據本發明之一實施例示出應用於包含三通閥的氣體管線的塊型加熱器的視圖。 圖9是根據本發明的又一實施例示出塊型加熱器組件的立體圖。The drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this document, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. In the diagram: FIG. 1 is a view schematically showing the structure of a conventional block heater. 2 is a view schematically showing the configuration of a semiconductor manufacturing equipment having a block-type heater assembly according to one embodiment of the present invention. FIG. 3 is an exploded perspective view of the block heater assembly shown in FIG. 2 . FIG. 4 is a cross-sectional view of the block heater taken along line 1-1' of FIG. 2 . 5 is a perspective view of a heat transfer unit of a block heater assembly according to an embodiment of the present invention. 6 is a perspective view illustrating a heat transfer unit of a block heater assembly according to another embodiment of the present invention. 7 is a perspective view illustrating a heat transfer unit of a block heater assembly according to another embodiment of the present invention. 8 is a view illustrating a block heater applied to a gas pipeline including a three-way valve according to one embodiment of the present invention. Figure 9 is a perspective view of a block heater assembly according to yet another embodiment of the present invention.
1000:半導體製造設備 1000:Semiconductor manufacturing equipment
100:蒸發器 100:Evaporator
200:處理腔室 200: Processing Chamber
300:氣體管線 300:Gas pipeline
400:塊型加熱器組件 400: Block heater assembly
400a、400b、400c:塊型加熱器 400a, 400b, 400c: block heater
410:傳熱單元 410:Heat transfer unit
411:塊體 411:Block
413:凸部 413:convex part
4131:耦合突起 4131:Coupling protrusion
4131a、4131b:表面 4131a, 4131b: surface
415:凹部 415: concave part
4151:耦合凹口 4151:Coupling notch
4153:側壁 4153:Side wall
4153a:表面 4153a: Surface
420:殼體 420: Shell
S:基板 S:Substrate
z1、z2、z3:加熱區 z1, z2, z3: heating zone
B:耦合區 B: coupling area
a1:間隙區域 a1: gap area
a2:間隙 a2: gap
Claims (7)
Applications Claiming Priority (4)
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KR20180163044 | 2018-12-17 | ||
KR10-2018-0163044 | 2018-12-17 | ||
KR1020190161569A KR20200074870A (en) | 2018-12-17 | 2019-12-06 | Block heater and block heater assembly |
KR10-2019-0161569 | 2019-12-06 |
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TW202029429A TW202029429A (en) | 2020-08-01 |
TWI829829B true TWI829829B (en) | 2024-01-21 |
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TW108145792A TWI829829B (en) | 2018-12-17 | 2019-12-13 | Block heater and block heater assembly |
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KR (1) | KR20200074870A (en) |
CN (1) | CN113261087A (en) |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080003970U (en) * | 2007-03-14 | 2008-09-19 | 이철웅 | Block heaters in gas lines with safety covers |
KR200460771Y1 (en) * | 2010-09-06 | 2012-06-12 | 주식회사 디엔디 | A conduit heating device which is established in a semiconductor vacuum line |
KR101336828B1 (en) * | 2012-06-11 | 2013-12-04 | (주)포인트엔지니어링 | Heat sink for light emitting device array |
CN106122664A (en) * | 2016-08-29 | 2016-11-16 | 镇江市三维电加热器有限公司 | High-temperature pipe heating and thermal insulation module |
-
2019
- 2019-12-06 KR KR1020190161569A patent/KR20200074870A/en unknown
- 2019-12-11 CN CN201980083310.5A patent/CN113261087A/en active Pending
- 2019-12-13 TW TW108145792A patent/TWI829829B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080003970U (en) * | 2007-03-14 | 2008-09-19 | 이철웅 | Block heaters in gas lines with safety covers |
KR200460771Y1 (en) * | 2010-09-06 | 2012-06-12 | 주식회사 디엔디 | A conduit heating device which is established in a semiconductor vacuum line |
KR101336828B1 (en) * | 2012-06-11 | 2013-12-04 | (주)포인트엔지니어링 | Heat sink for light emitting device array |
CN106122664A (en) * | 2016-08-29 | 2016-11-16 | 镇江市三维电加热器有限公司 | High-temperature pipe heating and thermal insulation module |
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CN113261087A (en) | 2021-08-13 |
KR20200074870A (en) | 2020-06-25 |
TW202029429A (en) | 2020-08-01 |
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