KR100841830B1 - Uniform heating apparatus - Google Patents

Abstract

A plurality of hollow pipes 3 are arranged at equal intervals therein, and heat-treating plates 2 provided so that both ends of each hollow pipe 3 are exposed to the outside and end portions of two adjacent hollow pipes 3. Meandering path forming means for connecting the U-shaped pipes 4a and 4b to form a meandering conduit, and an inlet portion 5 disposed below the plate 2 and serving as one end of the meandering conduit. 7) The evaporation vessel which the upper part connects and the lower part of the container 7 is connected to the exit part 6 used as the other end of the said meandering pipeline, and forms a single communication circuit between meandering pipelines ( 7) and a cracker which provides a heater 8 for heating a predetermined amount of hydraulic oil 9 sealed and filled in the evaporation vessel 7, and heats the heat treatment object 1 while maintaining a uniform temperature distribution. .

Description

Cracking Device {UNIFORM HEATING APPARATUS}

BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows Embodiment 1 of the cracking apparatus which concerns on this invention, The same figure (a) is a top view, The same figure (b) is a side view,

Fig. 2 is a configuration diagram showing Embodiment 2 of the cracking apparatus according to the present invention, in which figure (a) is a plan view, and (b) is a side view,

Fig. 3 is a configuration diagram showing Embodiment 3 of a cracking device according to the present invention, in which figure (a) is a plan view, and (b) is a side view,

Fig. 4 is a configuration diagram showing Embodiment 4 of the cracking device according to the present invention, in which (a) is a plan view, and (b) is a side view;

Fig. 5 is a configuration diagram showing Embodiment 5 of the cracking apparatus according to the present invention, in which figure (a) is a plan view, and (b) is a side view,

FIG. 6 is a configuration diagram illustrating a conventional first heat treatment apparatus, the drawing (a) is a plan view, the drawing (b) is a side view,

7 is a plan view illustrating a conventional second heat treatment apparatus;

Fig. 8 is a configuration diagram illustrating a conventional third heat treatment apparatus, in which Figs. (A) and (b) are plan views of planar heaters respectively, and (c) are drawings (a) and (Fig. Side view of the heat processing apparatus containing the planar heater shown to b).

※ Explanation of reference number indicating main part of drawing ※

1: substrate 2: plate

3: hollow pipe 4a, 4b: U-shaped pipe

5: inlet pipe 6: outlet pipe

7: evaporation vessel 8: heater

9: working fluid 10: steam

11: condensate

This invention relates to the cracking apparatus which heat-processes heat processing objects, such as a semiconductor wafer and a liquid crystal glass substrate.

In manufacturing processes, such as a semiconductor device or a liquid crystal display device, there exist various heat processing processes, such as a 1st drying stroke, a 2nd drying stroke, a heating stroke, and a drying stroke. The 1st drying process is a process for removing the moisture of a semiconductor wafer or a liquid crystal glass substrate. The second drying step is a step of drying the photoresist film after applying the photoresist. The heating stroke is a stroke that is heated after the exposure treatment is performed on the photoresist film. A drying process is a process of drying after developing. In each of these heat treatment steps, a heat treatment apparatus is used to maintain a wafer, a substrate, or the like at a predetermined temperature.

In the conventional heat treatment apparatus, what consists of several different structures is proposed.

The first heat treatment apparatus is described in Japanese Unexamined Patent Publication (Japanese Patent Laid-Open No. 1999-283909). This heat treatment apparatus is configured to use a heat treatment plate as shown in FIG. 6. 6A is a plan view of the heat treatment plate, and FIG. 6B is a sectional view taken along the line A-A shown in FIG. 6A. The structure of this heat treatment plate consists of the main part 54 laminated | stacked in the order of the surface heater 52 and the heat treatment plate 53 on the rectangular base plate 51. As shown in FIG. The subplate 55 which consists of the division plates 55A and 55B is arrange | positioned on the upper surface of the main part 54 so that attachment and detachment are possible. On the surfaces of each of the dividing plates 55A and 55B, a plurality of proximity balls 56,... Serving as spacers are arranged. Semiconductor wafers, substrates, and the like 57, which are heat treatment targets, are placed on the plurality of proximity balls 56,...

The second heat treatment apparatus is described in Japanese Unexamined Patent Publication (Japanese Patent Laid-Open No. 1999-283909) as described above. This heat treatment apparatus is configured to use a heat treatment plate as shown in FIG. 6. In particular, another part is in the structure of the main part 54, as shown in FIG. The main portion 54 is composed of a rectangular central dividing portion 54A and "co" shaped peripheral dividing portions 54B and 54C arranged to surround the central dividing portion 54A. Although the structure of each division part 54A-54C is abbreviate | omitted, it laminate | stacks in order of a base plate, a planar heater, and a heat processing plate from the downward direction as shown in FIG.

The third heat treatment apparatus is described in JP-A-2004-288601. This heat treatment apparatus is a structure using a heat treatment plate similarly to the above. The heat treatment plate is configured as shown in FIG. 8. That is, the heat treatment plate is laminated as shown in Fig. 8 (c) with the peripheral heater 61 (see Fig. 8 (a)) and the global heater 62 (see Fig. 8 (b)). . The heat insulating material 63 and the support plate 64 are laminated in the order of the lower surface side of the global-surface heater 62 which comprises a laminated body. The heating plate 65 is arranged on the upper surface side of the upper peripheral surface heater 61 constituting the laminate. Therefore, the laminated body which consists of the peripheral surface heater 61 and the global surface heater 62 has a structure interposed between the support plate 64 and the heating plate 65 via the heat insulating material 63.

That is, the heat treatment plate in the third heat treatment apparatus has a feature in that at least two surface heaters are stacked. In the figure, "66" and "67" are planar bodies formed by press-molding synthetic mica powder, "68" and "69" are meandering foil heaters, and "70," 71 "are lead outs. It is wealth.

By the way, in the heat processing process of the board | substrate etc. which require microprocessing, it is required for the heat processing target of the semiconductor wafer, the board | substrate etc. to be heat-treated at uniform temperature in a plate surface. However, the amount of heat radiation from the plate end surface corresponding to the outer peripheral portion of the heat treatment plate is large. Therefore, since the heat treatment plate often shows a tendency for the temperature to decrease due to the influence of heat radiation, a countermeasure against temperature decrease of the plate end face portion is important.

Accordingly, in the heat treatment plate described in the above-mentioned Unexamined Patent Publication (Japanese Patent Laid-Open No. 1999-283909), the following measures for reducing the temperature are provided. That is, as shown in FIG. 7, two "co" shaped peripheral dividing portions 54B and 54C are arranged so as to surround the substantially rectangular central dividing portion 54A. Then, the temperature of each divided portion 54A, 54B, 54C is detected, the calorific value of the planar heater (corresponding to reference numeral 52 in Fig. 6) stacked inside each plate is controlled to crack the surface of the heat-treated plate. Countermeasures are prepared.

However, in the case of the partition plates 54A to 54C described above, steps and gaps are likely to occur at the joining portions by protruding engagement of the partition plates 54A to 54C. When a step | step or a gap arises, the heat conduction efficiency of a heat processing plate will worsen. As a result, there is a problem in that the cracking of the temperature is adversely affected and the practicality is deteriorated in terms of cost and reliability.

Moreover, in the heat processing plate described in the said Unexamined-Japanese-Patent No. 2004-288601, the following measures of the temperature fall are provided. This heat treatment plate is configured to laminate a global surface heater 62 for uniformly heating the entire surface of the plate, and a peripheral surface heater 61 for adjusting the temperature around the plate to adjust the temperature.

In the heat treatment plate of such a structure, it is necessary to consider the arrangement pattern of the heaters 68 and 69 so that plate surface may become an equal temperature. In order to obtain an array pattern having an even temperature, there is a problem that an optimum array pattern must be generated while repeating experimental production of various array patterns and measurement of temperature distribution for a specific substrate size.

In addition, in the heat treatment plate using a planar heater, it is usually adjusted so as to have cracking properties in accordance with a specific substrate size. As a result, when the size of the board | substrate used as a heat processing target object is changed, there exists a problem that it becomes impossible to heat a changed board | substrate uniformly.

In the heat treatment plate using the planar heater, the planar heaters 61 and 62 are sandwiched between the plate (heat plate 65) serving as the heat treatment portion and the plate serving as the base portion (support plate 64). It is necessary to fix it tightly. As a result, the thickness of the whole plate becomes large, and the heating plate 65 becomes large accordingly. Therefore, the amount of heat input of the planar heater for raising the temperature to a predetermined temperature within a predetermined time becomes large, and there is a problem of dissipating power uselessly.

An object of the present invention is to provide a cracking device that enables heating while maintaining a uniform temperature distribution with respect to a heat treatment object.

Another object of the present invention is to provide a cracking device in which the thermal responsiveness is increased by thinning the plate and the cracking property is not changed by the size of the heat treatment target.

(1) The cracking apparatus according to the present invention is configured to heat-treat a heat-treatment object provided such that a plurality of parallel holes or a plurality of hollow pipes are arranged at substantially equal intervals inside, and both parallel holes or both ends of each hollow pipe are exposed to the outside. A coupling means for connecting a U-shaped tube to an end of the plate and two adjacent parallel holes or two hollow pipes to form a meandering conduit, and an end of the meandering conduit, The evaporating vessel and the evaporating vessel which are connected to the upper part of the inlet part, and the lower part of the container is connected to the outlet part which becomes the other end of the said meandering line, and forms a single communication circuit with the said meandering line. Heating means for heating the predetermined amount of working liquid sealed and filled in the inside is provided.

In addition, another structure of the cracking apparatus described in the above (1) is not the outside of the plate but also accommodates the end of each parallel hole or each hollow pipe in the inside of the plate, and at the same time the two adjacent parallel holes or The U-shaped hole or the U-shaped pipe may be connected to the ends of the two hollow pipes, and the configuration may be similarly accommodated inside the plate.

(2) In addition, the cracking apparatus according to the present invention heat-treats the heat-treatment object provided such that a plurality of parallel holes or a plurality of hollow pipes are arranged at substantially equidistant intervals, and both parallel holes or both ends of each hollow pipe are exposed to the outside. A U-shaped tube is connected to a parallel hole of each pair exposed to the outside of the plate using two adjacent parallel holes or two hollow pipes adjacent to each other or to one end of the hollow pipe. The upper part of the container is connected to a coupling means for forming a conduit and an inlet portion which is disposed below and outside the plate, and becomes an end of the U-shaped conduit of each set, and becomes the other end of the U-shaped conduit of the set. The evaporating vessel which connects the lower part of a container to an outlet part, respectively, and forms a communication circuit between the U-shaped pipe | channels of each group, And a heating means for heating the hydraulic fluid sealing of the filled amount in the container.

Moreover, the other structure of the cracking apparatus described in said (2) is not the exterior of a plate but accommodates the edge part of the two parallel holes or two hollow pipes which consist of said each tank in the inside of a plate, and the edge of each tank A U-shaped hole or a U-shaped tube may be connected to each other, and the configuration may be similarly accommodated in the plate.

(3) Moreover, the said evaporation container described in said (1) or (2) may be comprised as follows. The evaporation vessel is placed underneath this plate so as to fit within the substantially projected area of the plate. An upper portion of the evaporation vessel is connected to an inlet portion which becomes one end of the meandering conduit or the U-shaped conduits of each set, and the evaporation vessel of the evaporation vessel is the other end of the meandering conduit or the U-shaped conduits of each set. The structure which connects a lower part may be sufficient.

Therefore, according to the structure of said (1) or (3), the heat processing object can be heated, maintaining a uniform temperature distribution. In addition, the thinning of the plate can be realized, whereby the thermal responsiveness of the plate can be improved, and a cracking device can be provided that can secure the cracking property without being affected by the size of the heat treatment target.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings.

(Embodiment 1)

BRIEF DESCRIPTION OF THE DRAWINGS It is a block diagram which shows Embodiment 1 of the cracking apparatus which concerns on this invention. The figure (a) is a top view, and the figure (b) is a side view.

In FIG. 1, "1" is a substrate (for example, a semiconductor wafer, a liquid crystal glass substrate, etc.) as a heat treatment object. "2" is a heat treatment plate formed of a material having good thermal conductivity, for example, an aluminum material, a copper material, or the like. The substrate 1 is placed on the upper portion of the plate 2 via a suitable gap. In addition, the spacer for securing a gap is abbreviate | omitted in FIG.

Inside the plate 2, the plurality of hollow pipes 3,... Are arranged in the same direction at substantially equal intervals. Both ends of each hollow pipe 3 are exposed to appropriate lengths from both sides of the plate 2. The plate 2 has a thickness that sufficiently surrounds the outer circumferential portion of the hollow pipe 3, and is formed in a planar flat plate body in appearance.

The U-shaped tube 4a is connected to one end of the two hollow pipes 3 adjacent to each other exposed from the right-side cross section of the plate 2. The two hollow pipes 3 adjacent to each other by being delayed by one hollow pipe from the other end of the hollow pipe 3 exposed from the left end surface of the plate 2 by one hollow pipe. The U-shaped tube 4b is connected to the other end of the U-shaped tube 4b.

Therefore, the plurality of hollow pipes 3,... Are arranged in meandering conduits via the U-shaped pipes 4a... And the U-shaped pipes 4b. Then, both ends of the meandering conduit continuously connected are derived from, for example, the left side cross section, which is the same side surface of the plate 2.

The inlet pipe 5 is connected to one end of the meandering conduit consisting of these hollow pipes 3,... And the U-shaped pipes 4a and 4b, and the outlet pipe 6 is connected to the other end of the meandering conduit. do. These inlet pipes 5 and outlet pipes 6 are connected to an evaporation vessel 7 arranged outside the plate 2. The inlet pipe 5 derived from one end of the meandering pipe line is bent downward and connected directly to one end side of the evaporation vessel 7. In addition, the outlet pipe 6 drawn out from the other end of the meandering pipeline is similarly curved downward and connected to the lower side of the surface facing the meandering pipeline of the evaporation vessel 7. The evaporation vessel 7 and the meandering conduit line form a single communication circuit.

In other words, the cracking device according to the present invention includes one end portion of the evaporation vessel 7-the inlet pipe 5-the hollow pipe 3-the U-shaped tube 4a-the hollow pipe 3-the U-shaped tube 4b. … A single communication circuit is formed which consists of the hollow pipe 3, the outlet pipe 6, the other end of the evaporation vessel 7 and the body of the evaporation vessel 7.

The evaporation vessel 7 has a predetermined length, for example, a length corresponding to the distance of one side of the plate 2, and is formed into a cylindrical body. The evaporation vessel 7 is arranged outside the plate 2 in parallel with the plate 2 in a somewhat lower position at the lower surface of the plate 2.

Both ends of the evaporation vessel 7 are hermetically sealed, and a heater 8 as a heating means is built in the evaporation vessel 7 along the longitudinal direction. The evaporation vessel 7 is filled with a predetermined amount of the working liquid 9 after vacuum evacuation. In this embodiment, the heater 8 is in the state immersed in the working liquid 9.

Next, the operation | movement of the cracking apparatus comprised as mentioned above is demonstrated.

When the heater 8 inside the evaporation vessel 7 generates heat, the working liquid 9 evaporates due to the heat generated by the heater 8. The vapor 10 which has evaporated flows into the hollow pipe 3 provided in the plate 2 via the inlet pipe 5 connected to the upper part of the evaporation vessel 7 as shown by the broken arrow. . At this time, the temperature of the plate 2 is lower than the temperature of the evaporation vessel 7. As a result, the steam 10 in the hollow pipe 3 condenses on the inner surface of the hollow pipe 3, but since the hollow pipe 3 is formed in a single communication circuit, the pressure of the steam 10 is increased in the communication circuit. Almost the same throughout. Therefore, each inner surface portion of the hollow pipe 3 is isothermal, and the latent heat of condensation is released from the plate 2 to heat the entire surface of the plate 2 in the same manner.

That is, the steam 10 moves while decreasing the flow rate sequentially in the direction of the broken line arrows 10a to 10g while condensing sequentially inside the hollow pipe 3. As a result, the condensate 11 moves in the communication circuit while gradually increasing the flow rate as shown by the solid arrows 11a to 11d inside the hollow pipe 3.

At this time, the substrate 1, which is a heat treatment object, is placed on the upper portion of the plate 2 via a spacer for securing a gap. In this case, the spacer for securing the gap is omitted. In addition, in the figure, the arrow from the plate 2 to the board | substrate 1 has shown the heat flow from the plate 2 to the board | substrate 1. As shown in FIG.

Therefore, the condensate 11 moving in the hollow pipe 3 naturally flows back into the evaporation vessel 7 from the lower part of the evaporation vessel 7 via the outlet pipe 6 while increasing the flow rate.

Therefore, according to the above embodiment, the meandering pipe line which consists of the hollow pipes 3, ... and U-shaped pipe | tubes 4a and 4b inside the plate 2 and the evaporation container 7 form a single communication circuit. At the same time, the condensate 11 moving in the meandering conduit circulates through the communication circuit while increasing the flow rate. As a result, the condensate 11 spreads out to the whole surface of the plate 2 equally, and the surface of the plate 2 is uniformly heated, and the board | substrate 1 on the plate 2 is heated uniformly.

In addition, according to this cracking device, since the vapor 10 and the condensate 11 evaporated from the working fluid 9 flow in the same direction, the condensate even if the meandering conduit in the plate 2 is arranged in a horizontal state. (11) is gently refluxed to the evaporation vessel (7). Usually, in the heat pipe of a short pipe | tube shape, vapor 10 and the condensate 11 flow, and liquid return is inhibited by steam flow. In this regard, with the cracking device according to the present invention, the condensate 11 is refluxed to the evaporation vessel 7, and the liquid return phenomenon due to the vapor flow disappears. This eliminates the need to incline the hollow pipe 3. Thereby, the thickness of the plate 2 does not need to be thickened by the inclination equivalent of the hollow pipe 3, and it is realized thin. Therefore, as the plate 2 is thinned, the plate 2 can realize good thermal conductivity and can realize a cracking device with good thermal response.

Moreover, with the thinning of the plate 2, the heat capacity of the plate 2 can be reduced, and the heating energy at the time of temperature rising can be minimized. In addition, the electric power used as a heating source can be saved and energy saving can be aimed at.

Moreover, even if the size of the board | substrate 1 mounted on the plate 2 changes, since the steam 10 which moves in a meandering conduit | pipe is condensed and radiated according to the load state of the board | substrate 1, the board | substrate of a different size ( Also with respect to 1), the substrate 1 can be heated to be cracked.

(Embodiment 2)

It is a block diagram which shows Embodiment 2 of the cracking apparatus which concerns on this invention. The figure (a) is a top view, and the figure (b) is a side view. In addition, in the structure shown in FIG. 2, the same code | symbol is attached | subjected to the same part as FIG. 1, and the description is abbreviate | omitted.

Hereinafter, the component part different from FIG. 1 is demonstrated. The said Embodiment 1 exposes the both ends of each hollow pipe 3 accommodated in the plate 2 to the exterior of the plate 2, and alternately positions to the exposed part of the edge part of two adjacent hollow pipes 3, and is located. The U-shaped pipes 4a and 4b are connected to each other to form a meandering pipe line.

In this Embodiment 2, although the point which connects U-shaped pipe | tube 4a, 4b to the edge part of two adjacent hollow pipes 3 is the same as Embodiment 1, each hollow pipe 3 is not the outside of the plate 2. All of the curved portions of the meandering conduits, including the end portions and the U-shaped tubes 4a and 4b, are housed inside the plate 2. And only the both ends of a meandering pipeline are picked up by the same side part of the plate 2. As shown in FIG.

With such a configuration, a meandering pipeline consisting of the hollow pipe 3 and the U-shaped pipes 4a and 4b can be easily formed inside the plate 1 by using a conventionally known method such as an injection method or a friction cross joining method. It is possible to bury.

In addition, the point where both ends of the meandering pipe line drawn out from the same side part of the plate 2 is connected with the evaporation container 7 via the inlet pipe 5 and the outlet pipe 6, and the structure of the evaporation container 7 itself are Since it is the same as Embodiment 1, the description is abbreviate | omitted here.

Therefore, according to embodiment above, the same effect as Embodiment 1 is exhibited. In addition, by providing the U-shaped pipes 4a and 4b of the meandering conduits inside the plate 2, useless heat dissipation to the outside of the plate 2 is eliminated, and the cracking property of the plate 2 is increased, The board | substrate 1 can be heated effectively, and energy saving can be aimed at.

In addition, by providing the U-shaped tubes 4a and 4b of the meandering conduits in the plate 2, the portions protruding from the plate 2 to the outside are eliminated, and the apparatus can be miniaturized.

In addition, in the said Embodiment 1, 2, although the U-shaped pipe | tube 4a, 4b was connected to the edge part of the adjacent hollow pipe 3, each edge part of the adjacent hollow pipe 3 was bent each other, and formed in U shape. It is also possible to configure a meandering pipe by integrating the same.

(Embodiment 3)

It is a block diagram which shows Embodiment 3 of the cracking apparatus which concerns on this invention. The figure (a) is a top view, and the figure (b) is a side view. In addition, in FIG. 3, the same code | symbol is attached | subjected to the same part as FIG. 1, the detailed description is abbreviate | omitted, and a different part is demonstrated especially below.

In Embodiments 1 and 2, the pre-hollow pipes 3,... Arranged inside the plate 2 are formed to be a single meandering conduit. In the third embodiment, two hollow pipes 3a-3a, 3b-3b, 3c-3c, and 3d-3d which are adjacent to each other among the hollow pipes 3, ... arranged at equal intervals inside the plate 2. Group them together. Then, one end of the hollow pipes 3a-3a, 3b-3b, 3c-3c, and 3d-3d constituting each group is exposed to the outside from the right end surface of the plate 2. The U-shaped pipe 4a is connected to the ends of the hollow pipes 3a-3a, 3b-3b, 3c-3c, and 3d-3d of each set exposed to the outside, thereby forming a U-shaped pipe line. That is, the hollow pipe 3a-3a and the U-shaped tube 4a, the hollow pipe 3b-3b and the U-shaped tube 4a, the hollow pipe 3c-3c and the U-shaped tube 4a, and the hollow pipe 3d-3d. ) And U-shaped pipe 4a form a U-shaped pipe.

In addition, the other end of each group of U-shaped pipes is exposed to the outside from the left end surface of the plate 2. An inlet pipe 5 is connected to one end of each of the U-shaped pipes in each of the pairs, and an outlet pipe 6 is respectively connected to the other end of the U-shaped pipe. Connected. The inlet pipe 5 is bent downward like the first embodiment and connected directly to the evaporation vessel 7. The outlet pipe 6 is bent downward as in Embodiment 1 and connected to the lower side surface portion of the surface facing the U-shaped pipe line of the evaporation vessel 7. Therefore, a communication circuit is formed between each U-shaped pipe line of each tank and the evaporation vessel 7, respectively. Thus, a plurality of sets of communication circuits are formed between the evaporation vessel 7 and the hollow pipes 3,... In the plate 2.

Therefore, according to the above embodiment, in addition to the same effect as Embodiment 1, the following effects are shown.

In Embodiment 1, the steam 10 generated by the heater 8 inside the evaporation vessel 7 enters into the plate 2 from the inlet pipe 5 connected to one end of the meandering pipe. At this time, when the heating amount of the heater 8 becomes large, the steam flow rate in the inlet pipe 5 is increased, thereby increasing the vapor pressure loss. As a result, it is possible to consider that the liquid level inside the evaporation vessel 7 is lower than that of the heater 8 and, in extreme cases, the heater 8 is overheated.

In view of this, in the third embodiment, the steam 10 generated by the heater 8 inside the evaporation vessel 7 is uniformly dispersed from the inlet pipes 5,. Since it enters inside the plate 2, the steam flow rate into each inlet pipe 5, ... can be reduced. As a result, even if the heating amount of the heater 8 increases, the increase in the vapor pressure loss can be suppressed, and the liquid level of the working liquid 9 filled in the evaporation vessel 7 can be kept stable. Therefore, it becomes possible to increase the amount of heat input of the heater 8, and can raise the temperature increase rate of the plate 2 to a predetermined temperature.

(Embodiment 4)

4 is a configuration diagram showing Embodiment 4 of the cracking apparatus according to the present invention. The figure (a) is a top view, and the figure (b) is a side view. In addition, in FIG. 4, the same code | symbol is attached | subjected to the same part as FIG. 1, FIG. 3, the detailed description is abbreviate | omitted, and a different part is demonstrated especially below.

In the third embodiment, the hollow pipes 3a-3a, 3b-3b, ... of each tank are embedded in the plate 1, and one of the hollow pipes 3a-3a, 3b-3b, ... of each tank is embedded. The edge part is exposed to the outer side of the plate 2, respectively, and it is the structure which connected to the edge part used as this exposure part by the U-shaped pipe 4a, and formed the U-shaped pipe line of each set.

In the fourth embodiment, similarly to the second embodiment, the U-shaped tube 4a is connected to one end of each set of hollow pipes 3a-3a, 3b-3b, ... and the corresponding one end inside the plate 2. To prepare. And only the other end of the hollow pipe 3a-3a, 3b-3b, ... of each tank may be taken out to the exterior of the plate 2, and it may be set as the structure which connects to the evaporation container 7. As shown in FIG.

By such a configuration, since one end of each set of hollow pipes is not exposed to the outside of the plate 2, useless heat radiation to the outside of the plate 2 is eliminated. As a result, the cracking property of the plate 2 can be improved, and the board | substrate 1 can be heated effectively, and energy saving can be aimed at. In addition, the space occupied by the device is reduced, which contributes to the miniaturization of the device.

In addition, the steam 10 generated by the heat generation of the heater 8 is uniformly dispersed from the inlet pipes 5, ... of the rolling U-shaped pipe line, enters the plate 2, and circulates. Therefore, while suppressing the increase in the vapor pressure loss, the liquid level of the working liquid 9 filled in the evaporation vessel 7 can be stabilized, and the amount of heat input to the heater 8 can be increased, and the plate ( The temperature increase rate of 2) can be raised.

In addition, in Embodiment 3, 4, although the edge part of the adjacent hollow pipe 3 was connected using the U-shaped pipe 4a, each edge part of the adjacent hollow pipe 3 was bent each other, and it connected in U shape. Integrating may form a U-shaped pipe line.

(Embodiment 5)

5 is a configuration diagram showing Embodiment 5 of the cracking device according to the present invention. The figure (a) is a top view, and the figure (b) is a side view. 5, the same code | symbol is attached | subjected to the same part as FIGS. 1-4, and the detailed description is abbreviate | omitted.

In Embodiments 1 to 4, although the evaporation vessel 7 is disposed outside the projected area of the plate 2, for example, almost all of the evaporation vessel 7 is plate 2 as shown in Fig. 5B. May be arranged in the lower portion of the plate 2 as the projected area of the plate.

Also in this configuration, two hollow pipes (3a-3a, 3b-3b, ...) and U-shaped pipes serving as both ends or adjacent jaws of meandering conduits consisting of a plurality of hollow pipes 3 and U-shaped pipes 4a and 4b. Both ends of the U-shaped conduit made of (4a) are bent and taken out so as to be exposed to the lower surface near the left end of the plate 2, for example. One end of the meandering pipe or the U-shaped pipe is directly connected to the evaporation vessel 7 directly or via the inlet pipe 5, and an outlet pipe ( It connects to the lower part of the evaporation vessel 7 via 6).

According to embodiment of such a structure, in addition to exhibiting the same effect as any one of embodiment 1-4, the protrusion of the pipe from the plate 2 to the outside can be reduced, and also the installation space of an apparatus is shown. Can be reduced.

In addition, the protruding length from the plate 2 of the inlet pipe 5 and the outlet pipe 6 connected to both ends of the meandering pipe line or the U-shaped pipe line is reduced. Thereby, the heat radiation to the outside from the inlet pipe 5 and the outlet pipe 6 can be suppressed, and the plate 2 can be heated efficiently.

In addition, this invention is not limited to the said embodiment, It can variously deform and implement in the range which does not deviate from the summary.

In each said embodiment, although eight hollow pipes 3 (including 3a, 3b, 3c, 3d) were contained in the inside of the plate 2, the number of these pipes should just be an even number, and is limited to eight. no.

In addition, in Embodiment 1 and 3, although the hollow pipe 3 (including 3a, 3b, 3c, 3d) was embedded in the inside of the plate 2, for example, the hollow pipe in the inside of the plate 2 is carried out. Hollow holes such as parallel holes corresponding to (3) are formed. And connection relay metal fittings may be embedded in the end of a hollow hole, and U-shaped pipe | tube 4a, 4b, the inlet pipe 5, the outlet pipe 6, etc. may be connected to each connection relay metal fitting.

In addition, in the said embodiment, the inlet pipe 5 connected to one end of a meandering pipe line or one end of each group of U-shaped pipe lines just above the evaporation container 7 is connected, and also the evaporation container 7 is carried out. The other end of the meandering conduit or the other end of the U-shaped conduit of each set is connected to the lower surface of the meandering conduit or U-shaped conduit which faces each other.

However, the inlet pipe 5 should just be the upper part of the evaporation container 7, and the outlet pipe 6 should just be the lower part of the evaporation container 7, and it does not specifically limit a connection position.

In the above embodiment, the meandering conduit or the U-shaped conduit is contained in the inside of the plate 2. For example, the meandering conduit or the U-shaped conduit is directly welded or row attached to the lower surface of the plate 2. May be a constitution. Further, a meandering groove or a U-shaped groove having a semicircle depth is formed on the lower surface of the plate 2, and a meandering or U-shaped pipeline is embedded in the meandering groove or the U-shaped groove having a semicircular depth. In addition, a single communication circuit may be formed.

In addition, in the said embodiment, although the heating means, such as the heater 8, was arrange | positioned inside the evaporation container 7, and the working liquid 9 was made to heat directly, For example, heating means, such as the heater 8, was used. The working liquid 9 may be heated by contacting the outside of the evaporation vessel 7. In addition, as an example of a heating means, any of heat transfer type, hot water heating type, and steam heating type may be sufficient.

Moreover, in the said embodiment, although it comprised with the single communication circuit comprised by the meandering pipeline, As a plate size becomes large, it is also good as a cracking apparatus comprised with the several communication circuit comprised by meandering pipeline in one plate. .

The present invention can provide a cracking device that can be heated while maintaining a uniform temperature distribution with respect to the heat treatment object, improves the thermal responsiveness by thinning the plate, and does not change the cracking characteristic by the size of the heat treatment object. .

Claims (9)

A plurality of parallel holes or a plurality of hollow pipes 3 arranged at equal intervals therein, and a plate 2 for heat-treating a heat treatment object provided such that both parallel holes or both ends of each hollow pipe 3 are exposed to the outside; Meandering means for forming meandering conduits by connecting U-shaped pipes 4a and 4b to end portions of two adjacent parallel holes or two hollow pipes 3; The upper part of the container 7 is connected to the inlet part 5 which is arrange | positioned at the outer bottom of the said plate 2 and becomes one end of the meandering conduit, and the outlet part 6 which becomes the other end of the meandering conduit. A lower portion of the vessel 7 is connected to the evaporation vessel 7 to form a single communication circuit with the meandering conduit; Characterized in that it comprises heating means (8) for heating a predetermined amount of the working liquid (9) sealed and filled in the evaporation vessel (7). Crack device. A plate 2 for heat-treating a heat-treatment object in which a plurality of parallel holes or hollow pipes 3 are arranged at equal intervals therein; A U-shaped hole or U-shaped pipes 4a and 4b are connected to the ends of two adjacent parallel holes or two hollow pipes 3 to form a meandering pipe line. Forming means in a meander shape, The upper part of the container 7 is connected to the inlet part 5 which is arrange | positioned at the outer bottom of the said plate 2 and becomes one end of the meandering conduit, and the outlet part 6 which becomes the other end of the meandering conduit. A lower portion of the vessel 7 is connected to the evaporation vessel 7 to form a single communication circuit with the meandering conduit; And heating means (8) for heating a predetermined amount of the working liquid (9) sealed and filled in the evaporation vessel (7). Crack device. A plurality of parallel holes or hollow pipes [(3a, 3a), (3b, 3b), (3c, 3c), (3d, 3d)] are arranged inside each other at equal intervals, and each parallel hole or each hollow pipe [( 3a, 3a), (3b, 3b), (3c, 3c), (2d, 3d)] plate (2) for heat-treating the heat treatment object provided so that both ends are exposed to the outside; Two adjacent parallel holes or the hollow pipes (3a-3a, 3b-3b, 3c-3c, 3d-3d) are exposed to the outside of the plate. One end of each of the pair of parallel holes or the hollow pipes ((3a-3a), (3b-3b), (3c-3c), and (3d-3d)] of the pairs is connected to the U-shaped tube 4a, respectively. Forming means in a U-shape to form a magnetic pipe; A container at an inlet portion 5 disposed below the plate and serving as one end of each of the baths (3a-3a, 3b-3b, 3c-3c, 3d-3d); (7) The upper part is connected, and the lower part of the container 7 is respectively connected to the exit part 6 used as the other end of the said U-shaped pipe | channel of each said group, and the communication circuit is connected between the U-shaped pipelines of each group | piece. An evaporation vessel 7 to form, Characterized in that it comprises heating means (8) for heating a predetermined amount of the working liquid (9) sealed and filled in the evaporation vessel (7). Crack device. A plate (2) for heat-treating a heat-treatment object in which a plurality of parallel holes or hollow pipes [(3a, 3a), (3b, 3b), (3c, 3c), (3d, 3d)] are arranged at equal intervals therein; , Two adjacent parallel holes or the hollow pipes [(3a-3a), (3b-3b), (3c-3c), and (3d-3d)] are adjacent to each other, and the parallel holes or the hollow pipes of the respective pairs [ One end of each of (3a-3a), (3b-3b), (3c-3c) and (3d-3d) is connected to the U-shaped hole or U-shaped tube 4a in the inside of the plate 2, respectively. And U-shaped forming means for forming a U-shaped pipe line, A container at an inlet portion 5 disposed below the plate and serving as one end of each of the baths (3a-3a, 3b-3b, 3c-3c, 3d-3d); (7) The upper part is connected, and the lower part of the container 7 is respectively connected to the exit part 6 used as the other end of the said U-shaped pipe | channel of each said group, and the communication circuit is connected between the U-shaped pipelines of each group | piece. An evaporation vessel 7 to form, Characterized in that it comprises heating means (8) for heating a predetermined amount of the working liquid (9) sealed and filled in the evaporation vessel (7). Crack device. The method according to claim 1 or 2, The inlet portion 5 serving as one end of the meandering conduit and the outlet portion 6 serving as the other end are provided on the same surface portion side of the plate 2. Crack device. The method according to claim 1 or 2, The evaporation vessel is disposed below the plate so as to fall within the projected area of the plate, and an upper portion of the evaporation vessel is connected to an inlet portion that becomes one end of the meandering conduit, and the other end of the meandering conduit is A lower portion of the evaporation vessel is connected to an outlet portion Crack device. The method according to claim 1 or 2, End portions of two adjacent hollow pipes 3 are formed to be bent and joined to each other instead of the U-shaped pipes 4a and 4b, and joined. Crack device. The method according to claim 3 or 4, The evaporation vessel is disposed below the plate so as to fall within the projected area of the plate, and an upper portion of the evaporation vessel is connected to an inlet portion that becomes one end of the U-shaped conduit of each set. A lower portion of the evaporation vessel is connected to an outlet portion serving as the other end of the pipeline. Crack device. The method according to claim 3 or 4, One end of each of the hollow pipes ((3a-3a), (3b-3b), (3c-3c), and (3d-3d) to be a pair is bent with each other instead of the U-shaped pipes 4a and 4b. Forming and joining to form a U-shaped portion, characterized in that Crack device.

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