JP4129206B2 - Heat treatment equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat treatment apparatus for performing heat treatment of a semiconductor substrate, a glass substrate for a liquid crystal display device, a glass substrate for a photomask, a substrate for an optical disk, etc. (hereinafter referred to as “substrate”).
[0002]
[Prior art]
Conventionally, as this type of heat treatment apparatus, there is one provided with a heater and a water cooling type cooling mechanism on the lower side of the substrate mounting plate.
[0003]
Such a heat treatment apparatus is disclosed in Patent Document 1, for example.
[0004]
[Patent Document 1]
JP-A-11-283896
[0005]
[Problems to be solved by the invention]
However, in the water-cooled cooling mechanism as described above, for example, when the cooling operation is not performed for a long time for temperature adjustment control under a condition where the set temperature is equal to or higher than the boiling point of the cooling liquid, the cooling mechanism There was a problem that the liquid remaining in the piping and the like would boil.
[0006]
Therefore, an object of the present invention is to provide a heat treatment apparatus that can prevent boiling of the cooling liquid.
[0007]
[Means for Solving the Problems]
  In order to solve the above-mentioned problem, the invention according to claim 1 is a heat treatment apparatus for performing heat treatment on a substrate, wherein a mounting table on which the substrate can be mounted, a heating means for heating the mounting table, and a cooling liquid are provided. A cooling unit that has a liquid flow mechanism that can flow and that cools the mounting table with the cooling liquid that flows through the liquid flow mechanism, and a heating period for the mounting table by the heating unit And the table aboveBoiling point of the cooling liquidDuring the standby period including at least one of the above periods, the cooling liquid is caused to flow through the liquid flow mechanism.Further, the mounting table has an internal space in which a working liquid is enclosed, and the heating means is a means for heating the mounting table by heating and evaporating the working liquid in the internal space, The liquid flow mechanism is disposed in the internal space and cools the vapor of the working liquid.
[0010]
  Also,Invention of Claim 2 is the heat processing apparatus which heat-processes to a board | substrate, Comprising: The mounting base which can mount a board | substrate, the heating means which heats the said mounting base, and the liquid flow which can flow the cooling liquid And a cooling means for cooling the mounting table by the cooling liquid flowing through the liquid flow mechanism, the heating period to the mounting table by the heating means and the mounting table being the cooling In the waiting period including at least one of the periods when the boiling point of the working liquid is equal to or higher than the boiling point, the cooling liquid is caused to flow through the liquid flow mechanism.The mounting table has an internal space filled with a working liquid, and the heating means is a means for heating the mounting liquid by heating and evaporating the working liquid in the internal space, and the internal space A protruding cooling part having a cooling space communicating with the pipe extends outward from the mounting table.In addition, the vapor of the working liquid is led out of the internal space.The liquid flow mechanism cools the protruding cooling part to cool the vapor of the working liquid.To do.
[0011]
  And claims3The described inventionA heat treatment apparatus for performing heat treatment on a substrate, comprising: a mounting table on which the substrate can be mounted; a heating unit that heats the mounting table; and a liquid flow mechanism that allows a cooling liquid to flow therethrough. Cooling means for cooling the mounting table by the cooling liquid flowing through the flow mechanism, and the heating period to the mounting table by the heating unit and the mounting table is equal to or higher than the boiling point of the cooling liquid. During the standby period including at least one of the periods, the cooling liquid is caused to flow through the liquid flow mechanism, the mounting table includes an internal space in which a working liquid is enclosed, and the heating unit includes The projecting cooling unit having a cooling space communicating with the internal space extends outward from the mounting table, by heating and evaporating the working liquid in the inner space to evaporate the working table. Formed to put out Said liquid through flow mechanism, by cooling the projecting cooling unit, which cools the vapor of the working liquid,The liquid flow mechanism has a plurality of cooling pipes, and in the standby period, the cooling liquid is caused to flow through some of the cooling pipes to cool the mounting table. In the period, the cooling liquid is also passed through the other cooling pipes.It is something to be made.
[0012]
  In this case, the claim4As described, in the standby period, the cooling liquid may be passed through one or a plurality of cooling pipes arranged at positions close to the protruding cooling unit.
[0013]
In these cases, as described in claim 5, during the standby period, the flow rate of the cooling liquid flowing through the liquid flow mechanism is greater than the flow rate of the cooling liquid during the period for cooling the mounting table. May be reduced.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
<1. First Embodiment>
<1.1. Schematic configuration of substrate processing apparatus>
FIG. 1 is a plan view showing an overall configuration of a substrate processing apparatus 1 according to a first embodiment of the present invention. 1 and the subsequent drawings are attached with an XYZ orthogonal coordinate system in which the Z-axis direction is the vertical direction and the XY plane is the horizontal plane, as necessary, in order to clarify the directional relationship.
[0015]
The substrate processing apparatus 1 is an apparatus that performs resist coating processing and development processing on a substrate, and includes an indexer ID that loads and unloads the substrate, a first processing unit group PG1 that includes a plurality of processing units that perform processing on the substrate, and It includes an interface IF for transferring the substrate to and from the second processing unit group PG2, an exposure apparatus (not shown), and a transfer robot TR.
[0016]
The indexer ID has a carrier (not shown) on which a plurality of substrates can be stored and a mobile robot. The mobile robot pays out the unprocessed substrate from the carrier to the transport robot TR and receives the processed substrate from the transport robot TR and stores it in the carrier.
[0017]
Although not shown, the interface IF includes a robot that delivers a substrate to and from the transfer robot TR, and a buffer cassette on which the substrate is placed. The interface IF has a function of receiving a resist-coated substrate from the transport robot TR and passing it to an exposure apparatus (not shown), and receiving an exposed substrate and passing it to the transport robot TR. The interface IF has a buffer function for temporarily stocking the substrate before and after exposure in order to adjust the delivery timing with the exposure apparatus.
[0018]
The substrate processing apparatus 1 includes a plurality of processing units (processing units) for processing a substrate, some of which constitute the first processing unit group PG1, and the remaining part of the second processing unit group PG2. Constitute. FIG. 2 is a diagram illustrating configurations of the first processing unit group PG1 and the second processing unit group PG2.
[0019]
The first processing unit group PG1 is configured by arranging a plurality of heat treatment units above the coating processing units SC1 and SC2 (resist coating processing units) which are liquid processing units. In FIG. 2, the processing units are arranged in a plane for convenience of illustration, but are actually stacked in the height direction (Z-axis direction).
[0020]
The coating processing units SC1 and SC2 are so-called spin coaters that apply a uniform resist by supplying a photoresist to the main surface of the substrate and rotating the substrate. Three rows of heat treatment units stacked in three stages are provided above the coating processing units SC1 and SC2. That is, in order from the bottom, the cooling unit CP1, the adhesion strengthening unit AH (adhesion strengthening processing unit), the row in which the heating unit HP1 is laminated, the row in which the cooling unit CP2, the heating unit HP2, and the heating unit HP3 are laminated, and the cooling unit. CP3, a heating unit HP4, and a row in which the heating units HP5 are stacked are provided.
[0021]
Similarly, the second processing unit group PG2 is configured by arranging a plurality of heat treatment units above the development processing units SD1 and SD2 which are liquid processing units. The development processing units SD1 and SD2 are so-called spin developers that perform development processing by supplying a developer onto the exposed substrate. Three rows of heat treatment units stacked in three stages are provided above the development processing units SD1 and SD2. That is, the cooling unit CP4, the post-exposure bake unit PEB, and the heating unit HP6 are stacked in order from the bottom, the cooling unit CP5, the heating unit HP7, and the heating unit HP8 are stacked, the cooling unit CP6, and the heating unit HP9. And a row in which the heating units HP10 are stacked.
[0022]
The heating units HP1 to HP10 are so-called hot plates that heat a substrate and raise the temperature to a predetermined temperature. Further, the adhesion strengthening unit AH and the post-exposure bake unit PEB are heating units that heat the substrate before and immediately after the resist coating process, respectively. The cooling units CP1 to CP6 are so-called cool plates that cool the substrate to a predetermined temperature and maintain the substrate at the predetermined temperature.
[0023]
In the present specification, units (heating unit and cooling unit) for adjusting the temperature of these substrates are referred to as heat treatment units. A processing unit that supplies a processing liquid to a substrate such as the coating processing units SC1 and SC2 and the development processing units SD1 and SD2 and performs a predetermined processing is referred to as a liquid processing unit. The liquid processing unit and the heat treatment unit are collectively referred to as a processing unit.
[0024]
A filter fan unit FFU that forms a downflow of clean air whose temperature and humidity are controlled is provided immediately above the liquid processing unit. Although not shown, a filter fan unit that forms a downflow of clean air toward the transfer space is also provided at an upper position where the transfer robot TR is disposed.
[0025]
In the first embodiment, in particular, the heating units HP1 to HP10, which are constituent elements of the first processing unit group PG1 and the second processing unit group PG2, employ a configuration according to the features of the present invention. In the following, one heating unit HP1 will be described, but the same applies to the other heating units HP2 to HP10.
[0026]
<1.2. Configuration of heating unit>
3 is a cross-sectional view of the heating unit HP1, and FIG. 4 is a plan view of the mounting table 11 of FIG.
[0027]
The mounting table 11 employs a heat pipe structure HS to increase the in-plane uniformity of the temperature distribution while extremely reducing the heat capacity, and includes a housing main body 1h and a hydraulic fluid chamber forming unit 14. Yes. Here, the heat pipe structure HS includes a thermosiphon type that uses gravity for reflux of the working liquid.
[0028]
The housing main body 1h is formed as a flat metal housing, and the substrate W is placed on the placement surface 11a corresponding to the upper surface thereof. A plurality of ceramic spheres (not shown) are dispersed and fitted on the mounting surface 11a, and the substrate W is supported in a point contact state to prevent heat treatment unevenness. The small sphere may be omitted and the substrate W may be supported in a surface contact state.
[0029]
A hollow working chamber 12 is formed inside the housing main body 1h. The working chamber 12 is depressurized due to the heat pipe structure HS, and a plurality of columns 13 are erected so as to supplement the strength in the vertical direction.
[0030]
The hydraulic fluid chamber forming portion 14 is formed to project from the lower portion of the housing main body portion 1h. A hydraulic fluid chamber 14a is formed in the hydraulic fluid chamber forming portion 14, and a heater 15 is incorporated as a heating means in the hydraulic fluid chamber 14a and the hydraulic fluid 16 is stored. In the first embodiment, water is used as the working liquid 16.
[0031]
The working fluid chamber 14a and the working chamber 12 of the housing main body 1h communicate with each other, and the working fluid chamber 14a and the working chamber 12 form an airtight internal space in which the working fluid in the heat pipe structure HS is sealed. It is formed. And the vapor | steam of the working liquid 16 which arises by heating the heater 15 makes the temperature distribution of the mounting surface 11a uniform by moving the inside of this effect | action area | region using the effect | action chamber 12 and giving / receiving latent heat of evaporation. The holding surface 11a can be rapidly heated while being held. In this way, the placement surface 11a is heated, so that the substrate W placed thereon is heated. That is, the mounting table 11 functions as a heat medium means for heating the substrate W.
[0032]
The cooling mechanism as a cooling means in this apparatus includes a cooling pipe 21 as a liquid flow mechanism, a cooling liquid supply source 25, and a supply valve 26 interposed between the cooling pipe 21 and the cooling liquid supply source 25. And.
[0033]
The cooling pipe 21 is formed in a pipe shape through which a cooling liquid can flow with a heat conductive material (for example, metal or alloy), penetrates the outer wall of the housing main body 1h, and in the working chamber 12, It is arranged so as to pass almost the entire area of the mounting surface 11a (see FIG. 4).
[0034]
One end of the cooling pipe 21 is connected to a cooling liquid supply source 25 via a supply valve 26 and a supply pipe 22, and the other end of the cooling pipe 21 is not shown via a discharge pipe 23. Connected to the drain. Then, the cooling liquid supplied from the cooling liquid supply source 25 is supplied to the cooling pipe 21 through the supply pipe 22 by opening the supply valve 26, and the cooling pipe 21 acts on the mounting table 11. After exchanging heat with the steam in the chamber 12 to cool the mounting table 11, it is discharged to a drain (not shown) via the discharge pipe 23. That is, the surface of the cooling pipe 21 comes into contact with the vapor of the working liquid in the working chamber 12, and causes a cooling action to the mounting surface 11 a through the vapor of the working liquid. In other words, the working liquid of the heat pipe structure HS is heated by the heater 15, and the vapor of the working liquid is cooled by the cooling pipe 21.
[0035]
The supply valve 26 is configured to be switchable between a valve opening state and a valve closing state. In the valve open state, the cooling liquid is allowed to flow from the cooling liquid supply source 25 toward the cooling pipe 21 at a first flow rate V1 sufficient to cool the mounting table 11, while in the valve closed state. The cooling liquid is allowed to flow at a second flow rate V0 that is smaller than the first flow rate V1. This second flow rate V0 is set to a minimum so as not to greatly hinder the heating by the heater 15 within a range where the cooling liquid in the cooling pipe 21 does not boil due to the vapor of the working liquid due to the heating of the heater 15. Flow rate. Such an optimum value of the flow rate V0 is calculated theoretically, experimentally, or empirically, for example. As such a supply valve 26, for example, a slow leak bubble that can flow a predetermined amount of liquid in a closed state can be used.
[0036]
In the present embodiment, the supply valve 26 is opened continuously or stepwise so as to gradually decrease or increase the flow rate from the first flow rate V1 to the second flow rate V0 or vice versa. What can switch a valve state and a valve closing state is used.
[0037]
As shown in FIG. 4, the cooling pipe 21 is arranged in a meandering manner so that the working chamber 12 of the mounting table 11 is folded back multiple times in order to increase its surface area. Therefore, heat exchange between the cooling pipe 21 and the steam in the working chamber 12 can be performed efficiently.
[0038]
Further, the cooling pipe 21 is supported through the side wall of the housing main body 1 h of the mounting table 11 via the mounting table 11 and a ring-shaped (donut-shaped) heat insulating member 24. Therefore, since the cooling pipe 21 and the mounting table 11 are thermally insulated by the heat insulating member 24, the heat pipe does not directly transfer from the cooling pipe 21 to the mounting table 11. Examples of the heat insulating member 24 include ceramics and heat resistant resin.
[0039]
Moreover, the temperature sensor 27 is embedded in the mounting table 11 so that the temperature of the mounting surface 11a can be measured. The temperature of the substrate W placed on the placement surface 11 a is detected based on the output of the temperature sensor 27.
[0040]
The control unit 3 is connected to a control target unit by a signal line 34, and includes a memory 31 that stores a program, a variable, and the like, and a CPU 32 that executes control according to the program stored in the memory 31. . The CPU 32 performs predetermined heating control by the heater 15 and cooling control by the cooling liquid supply source 25 and the supply valve 26 based on the temperature detected through the temperature sensor 27 in accordance with a program stored in the memory 31, for example. This is executed at the timing, and temperature adjustment control of the mounting surface 11a described below is performed.
[0041]
A cooling plate 221 as a cooling member is further provided on the lower surface of the housing main body 1h in the heating unit. The cooling plate 221 is a member in which two metal plates having high heat conductivity are bonded together, and is disposed between two hydraulic fluid chambers 14 disposed at the lower part of the housing 1h so as to contact the lower surface side of the housing 1h. Has been.
[0042]
A predetermined meandering flow path is formed on the bonding surface of the cooling plate 221. One end of this flow path is connected to a cooling medium supply source and a compressed air supply source (not shown) via a pipe. Further, the other end of the flow path is communicated with a drain (not shown) via a pipe. And the cooling medium is supplied to this flow path by sending in the above-mentioned compressed air.
[0043]
The cooling plate 221 mainly cools the mounting table 11 when the substrate W is not processed, for example, when the set temperature of the mounting table 11 is lowered or when the mounting table 11 is returned to the origin temperature after the heat treatment of the substrate W. Used to do. For example, when the set temperature is changed, the temperature is adjusted by using both the cooling plate 221 and the cooling mechanism described above.
[0044]
<1.3. Temperature adjustment control>
Next, temperature adjustment control of the mounting surface 11a by the heating unit HP1 will be described. FIG. 5 shows the relationship between the timing indicating the control of the heater 15 and the cooling liquid supply source 25 and the temperature of the mounting surface 11a. 5A to 5C correspond to the time t, the vertical axis in FIG. 5A is the output W of the heater 15, and the vertical axis in FIG. 5B is the cooling liquid supply source 25. The vertical axis of FIG. 5C corresponds to the flow rate V of the cooling liquid supplied to the cooling pipe 21 from the temperature T and the temperature T of the mounting surface 11 a monitored by the temperature sensor 27.
[0045]
Before the time t1, the output of the heater 15 is held at a constant output W0, and the supply valve 26 is closed, so that the cooling pipe 21 is relatively small from the cooling liquid supply source 25. The cooling liquid is supplied at the second flow rate V0. Here, the cooling capacity of the cooling pipe 21 due to the flow of the cooling liquid at the second flow rate V0 is lower than the heating capacity of the heater 15, and therefore the placement surface 11a is held at the set temperature T0.
[0046]
At time t1, when the substrate W is transferred from the transfer robot TR onto the placement surface 11a, heat transfer occurs between the placement surface 11a and the substrate W. Therefore, the temperature T of the placement surface 11a is changed from T0. descend. When this temperature drop is detected through the temperature sensor 27, the control unit 3 gradually increases the output value of the heater 15 from W0 toward W1, which is the maximum output.
[0047]
When the output value of the heater 15 reaches the maximum output W1 during the period from the time t1 to the time t2, since the supply of heat to the placement surface 11a increases, a decrease in heat escaping from the placement surface 11a to the substrate W is compensated. As a result, the rate of decrease in the temperature of the mounting surface 11a is reduced, and the temperature gradient of the temperature curve shown in FIG. At time t2, when the heat escaping from the placement surface 11a to the substrate W and the heat transmitted from the heater 15 to the placement surface 11a are substantially balanced, the temperature becomes the minimum value T1, and the temperature gradient value is changed from negative to positive. Changes to.
[0048]
When a minimum point at which the temperature gradient of the mounting surface 11a changes from negative to positive is detected through the temperature sensor 27 at time t2, as shown in FIG. 5A, the output value of the heater 15 is gradually increased from W1. While decreasing, the supply valve 26 is opened, and the flow rate of the cooling liquid from the cooling liquid supply source 25 to the cooling pipe 21 is gradually increased.
[0049]
Subsequently, at time t3 when it is detected that the temperature of the mounting surface 11a is lower than the set temperature T0 by a predetermined value through the temperature sensor 27, the output of the heater 15 is stopped, and the cooling liquid supply source The flow rate of the cooling liquid from 25 to the cooling pipe 21 is a first flow rate V1 that is the maximum value.
[0050]
In the period from time t3 to t4, the cooling liquid is supplied from the cooling liquid supply source 25 to the cooling pipe 21 at the first flow rate V1, whereby the placement surface 11a continues to be further cooled, as shown in FIG. The temperature gradient of the temperature curve shown further decreases (cooling step).
[0051]
As described above, the flow rate of the cooling liquid from the cooling liquid supply source 25 to the cooling pipe 21 is gradually (smoothly) while gradually decreasing (smoothly) the output value from the heater 15 as time elapses. ) Further, the flow rate of the cooling liquid is maintained at the maximum flow rate V1 for a predetermined time. The temperature of the mounting surface 11a becomes higher than the set temperature T0 even when the heater 15 is stopped. This is for preventing the occurrence of a chute and shortening the time required to reach the set temperature T0.
[0052]
When it is detected at time t4 that the temperature T of the mounting surface 11a has reached the temperature T0 "through the temperature sensor 27, the flow rate of the cooling liquid from the cooling liquid supply source 25 to the cooling pipe 21 is changed from time t4 to t5. The supply valve 26 is closed so as to gradually decrease toward the second flow rate V0, and the output value of the heater 15 is gradually increased from zero toward the constant output W0, and after time t5. The output of the heater 15 is held at a constant output W0, and the supply valve 26 is closed to cool the cooling pipe 21 from the cooling liquid supply source 25 at a relatively small second flow rate V0. The working liquid is supplied, and the temperature of the placement surface 11a and the substrate W is maintained at the set temperature T0.
[0053]
Controllability of the cooling process in such temperature adjustment depends on the selection of the heat capacity of the cooling liquid to be used and the temperature adjustment amount (temperature range to be increased or decreased by cooling).
[0054]
For example, when the cooling process is performed with the cooling liquid having a large heat capacity even though the temperature adjustment amount is small, the flow rate is decreased from the first flow rate V1 to the second flow rate V0, and the cooling process is stopped. Nevertheless, undershoot occurs that is lower than the set temperature T0. On the other hand, when the cooling process is performed with a cooling liquid having a small heat capacity despite the large amount of temperature adjustment, the processing time required for cooling increases.
[0055]
Therefore, it is preferable to select the cooling liquid used in the cooling process in consideration of the compatibility between the heat capacity of the cooling liquid and the temperature adjustment amount.
[0056]
<1.4. Advantages of Heating Unit of First Embodiment>
In the above embodiment, the heating unit HP1 having the heat pipe structure HS allows the cooling liquid to flow through the cooling pipe 21 during the standby period including the heating period (heating process) by the heater 15. For this reason, in the cooling pipe 21, it is prevented that the cooling liquid which received the heat | fever of the vapor | steam rises in temperature more than a boiling point, and the boiling of this cooling liquid can be prevented. The heating period by the heater 15 is not only a period during which the temperature of the mounting surface 11a is increased by the heating of the heater 15 (time t1 to t3 in FIG. 5), but the mounting surface 11a is brought to a constant temperature by the heating of the heater 15. This includes a holding period (until time t1 in FIG. 5 and after time t4).
[0057]
  In the present embodiment, the period during which the mounting table 11 is heated by the heater 15 is set as a standby period, and the cooling liquid is allowed to flow through the cooling pipe 21 during the standby period. Is equal to or higher than a predetermined temperature (for example,Above boiling point)The standby state is set as the standby period, and the cooling liquid may be allowed to flow through the cooling pipe 21 at the flow rate V0 during the standby period, or the mounting table 11 is heated by the heater 15 and mounted. A state in which the placement surface 11a is equal to or higher than a predetermined temperature set in advance may be set as a standby period, and the cooling liquid 21 may be allowed to flow through the cooling pipe 21 during the standby period. In these cases, there is no fear of boiling except during the cooling period and the standby period, and therefore the flow of the cooling liquid may be blocked. In addition, the cooling liquid may be continuously supplied regardless of the period.
[0058]
In the present embodiment, the cooling liquid flow rate V0 during the standby period is smaller than the cooling liquid flow rate V1 during the cooling period, so that cooling and heating can be performed efficiently. However, the cooling liquid may be continuously supplied at a constant flow rate without increasing the flow rate during the cooling period.
[0059]
Furthermore, the mounting table 11 has an internal space in which the working liquid is enclosed, and the heater 15 heats the working liquid in the internal space to evaporate it, and the cooling pipe 21 The working liquid 12 is disposed in the working chamber 12 in the internal space to cool the vapor of the working liquid. For this reason, the heating action by the heater 15 and the cooling action by the cooling pipe 21 act on the mounting surface 11a (and hence the substrate W) via the working liquid of the heat pipe structure HS and its vapor. For this reason, it is possible to rapidly heat and cool while maintaining the uniformity of the temperature distribution of the mounting surface 11a and the temperature distribution of the substrate W mounted on the mounting surface 11a, and it is formed on the substrate during the heat treatment. The film thickness and line width uniformity of the formed wiring layer can be kept good.
[0060]
<2. Second Embodiment>
Next, a second embodiment will be described. FIG. 6 is a cross-sectional view showing the heating unit 200 according to the second embodiment, and FIG. 7 is a plan view showing the heating unit 200. In the description of the present embodiment, the same components as those described in the first embodiment are denoted by the same reference numerals and the description thereof is omitted, and the heating unit HP1 described in the first embodiment is omitted. The difference will be mainly described.
[0061]
Note that the heating unit 200 of the present embodiment can be used as the heating units HP1 to HP10 that are components of the first processing unit group PG1 and the second processing unit group PG2 described in the first embodiment. Therefore, even if each of the heating units HP1 to HP10 is replaced with the heating unit 200, a substrate processing apparatus similar to the apparatus 1 can be configured.
[0062]
<2.1. Configuration of heating unit>
In this heating unit 200, instead of cooling the working liquid by the cooling pipe 21 disposed in the working chamber 12 which is the internal space of the mounting table 11 like the heating unit HP1, the lead-out pipe 220 outside the mounting table 11 is used. By cooling the working liquid vapor.
[0063]
That is, in the heating unit 200, the cooling pipe 21 in the heating unit HP1 is omitted, and instead, a lead-out pipe 220 as a projecting cooling section for leading the vapor of the working liquid out of the internal space, and the lead-out pipe 220. And an external cooling pipe 230 as a liquid flow mechanism for cooling the vapor of the working liquid by cooling.
[0064]
The outlet tube 220 is a component having a cooling space that is formed to extend outward from the mounting table 11 and communicates with the internal space. More specifically, the outlet tube 220 is formed in a long tubular shape, and one end portion thereof is connected to the side wall portion of the housing main body portion 1h so as to communicate with the working chamber 12, and the other end portion is operated. It is connected to the side wall portion of the liquid chamber forming portion 14 so as to communicate with the hydraulic fluid chamber 14a. Further, the intermediate portion in the longitudinal direction of the outlet tube 220 is routed so as to pass the outside side of the mounting table 11, and a part of the intermediate portion is connected to the cooling medium member 240 formed of a heat conductive member such as copper. Insertion is supported. The position where a part of the outlet pipe is inserted and supported by the cooling medium member 240 is higher than the working liquid water level in the hydraulic fluid chamber 14a, and therefore, the outlet pipe 220 is inserted and supported by the cooling medium member 240. The portion (hereinafter simply referred to as the insertion support portion) is filled with the vapor of the cooling liquid. Moreover, it sets so that the liquid level of a working liquid may be located in the other end part side below the said insertion support part.
[0065]
The external cooling pipe 230 is formed in a long tubular shape, and one end thereof is connected to the cooling liquid supply source 25 via the supply valve 26 and the other end is connected to a drain not shown. Yes. Further, a part of the intermediate portion in the longitudinal direction of the external cooling pipe 230 is inserted and supported by the cooling medium member 240. The lead-out pipe 220 and the external cooling pipe 230 are arranged in the cooling medium member 240 so as to be in a parallel state with a predetermined interval. Thus, by allowing the cooling liquid to flow through the external cooling pipe 230, heat exchange is performed between the outlet pipe 220 and the outer cooling pipe 230 via the cooling medium member 240, and the outlet pipe 220 is cooled. It has become so.
[0066]
<2.2. Explanation of cooling action>
The heating in the heating unit 200 is performed according to the same principle as that of the heating unit HP1. On the other hand, cooling is performed according to the following principle. That is, when the cooling liquid is caused to flow through the external cooling pipe 230, the insertion support portion of the outlet pipe 220 is cooled by the cooling medium member 240, and the vapor of the working liquid filling the insertion support portion is cooled and condensed. . The condensed working liquid is returned to the working fluid chamber 14a from the other end side of the outlet pipe 220 by gravity. In accordance with this, the vapor of the working liquid filling the working chamber 12 flows into the outlet pipe 220 from one end side of the outlet pipe 220 and is cooled and condensed when it reaches the cooling medium member 240 to become a liquid.
[0067]
By repeating such a cycle, the temperature of the steam in the working chamber 12 is lowered, and the mounting table 11 is cooled.
[0068]
In the heating unit 200, the mounting table 11 is cooled by allowing the cooling liquid to flow through the external cooling pipe 230. Therefore, the cooling liquid flow rate control of the cooling pipe 21 in the first embodiment is performed using the external cooling pipe 230. By applying to the flow control of the cooling liquid in the cooling pipe 230, the temperature adjustment control for the placement surface 11a can be performed.
[0069]
In the cooling liquid flow rate control for the external cooling pipe 230, the cooling liquid is caused to flow through the external cooling pipe 230 at the second flow rate V0 that is smaller than the first flow rate V1 during the cooling period during the standby period. As a result, the temperature of the cooling liquid is prevented from rising above the boiling point due to the heat of the vapor in the external cooling pipe 230, and the boiling of the cooling liquid can be prevented.
[0070]
<2.3. Advantages of Heating Unit of Second Embodiment>
According to the heating unit 200 according to the second embodiment, the cooling liquid is allowed to flow through the external cooling pipe 230 during the standby period, as in the first embodiment. For this reason, in the external cooling pipe 230, the temperature of the cooling liquid that has received the heat of the vapor is prevented from rising above the boiling point, and the boiling of the cooling liquid can be prevented.
[0071]
Further, since the cooling liquid flow rate V0 during the standby period is smaller than the cooling liquid flow rate V1 during the cooling period, cooling and heating can be performed efficiently.
[0072]
Furthermore, in the first embodiment, since the cooling pipe 21 is introduced into the mounting table 11, a slight heat transfer is likely to occur at the portion where the cooling pipe 21 is introduced into the mounting table 11, and the temperature distribution is reduced. It may be a factor causing non-uniformity. However, in the present embodiment, the external cooling pipe 230 cools the discharge pipe 220 protruding to the outside of the mounting table 11 to cool the vapor of the working liquid. Therefore, the external cooling pipe 230 and the mounting table 11 Therefore, the temperature distribution is more uniform.
[0073]
In the present embodiment, one end portion of the outlet tube 220 is communicated with the working chamber 12 and the other end portion is communicated with the working fluid chamber 14a. However, for example, in a substantially horizontal posture outside the mounting table 11. In addition to forming a protruding tube that protrudes and forming a cooling space communicating with the inside of the working chamber 12 in the protruding tube, the external cooling tube 230 may be disposed around the protruding tube. In this case, by cooling the protruding tube, the vapor is cooled and condensed, and the working liquid is refluxed.
[0074]
<2.4. Modification Example According to Second Embodiment>
FIG. 8 is a view showing a modified example of the external cooling pipe 230 and the cooling mediating member 240 according to the second embodiment.
[0075]
As shown in the figure, in this modification, a plurality of external cooling pipes 330, 331, and 332 are provided as a liquid flow mechanism instead of the external cooling pipe 230. Further, the cooling medium member 340 inserts and supports the longitudinal intermediate part of the outlet pipe 220 in the same manner as the cooling medium member 240 and also inserts and supports the longitudinal intermediate parts of the external cooling pipes 330, 331, and 332. ing. In the cooling medium member 240, the external cooling pipes 330, 331, and 332 are arranged in a parallel state with a predetermined feeling in a substantially parallel posture with respect to the outlet pipe 220.
[0076]
One end of the external cooling pipe 330 closest to the outlet pipe 220 among the external cooling pipes 330, 331, and 332 is directly connected to the cooling liquid supply source 25 (not shown in FIG. 8, see FIG. 6). The other end is connected to a drain (not shown). The cooling liquid always flows through the external cooling pipe 330 not only in the cooling period but also in the standby period including the heating period. Note that the flow rate of the cooling liquid flowing through the external cooling pipe 330 is set to the same flow rate as the flow rate V0 so that the heating by the heater 15 is not significantly hindered.
[0077]
In addition, one end portion of the other external cooling pipes 331 and 332 is connected to a common connection pipe 334, and is connected to the cooling liquid supply source 25 via the valve 326 from the connection pipe 334, and the other end portion is It is connected to a drain (not shown). The valve 326 used here is a valve capable of switching between a valve open state and a valve closed state. The difference from the valve 26 is that the valve is completely closed so that the cooling liquid is not allowed to flow in the closed state.
[0078]
In this modification, the valve 326 is controlled to open and close at the same timing as when the valve 26 in the first embodiment is opened and closed.
[0079]
For example, when the mounting table 11 is cooled, the valve 326 is opened. As a result, the cooling liquid flows through all the external cooling pipes 330, 331, and 332, and the mounting table 11 is rapidly cooled.
[0080]
For example, when the mounting table 11 is heated by the heater 15 or kept at a constant temperature, the valve 326 is closed. As a result, the cooling liquid flows only in the external cooling pipe 330 closest to the outlet pipe 220. In this state, since the cooling liquid flows only in the external cooling pipe 330, the heating by the heater 15 is not greatly hindered. Moreover, since the cooling liquid always flows through the external cooling pipe 330, the cooling liquid is prevented from boiling inside. Furthermore, since the other external cooling pipes 331 and 332 are located farther from the lead-out pipe 220 than the external cooling pipe 330, the heat from the lead-out pipe 220 is relatively difficult to transfer, and the external cooling pipe Since the cooling effect by 330 can be expected, boiling of the cooling liquid in the external cooling pipes 331 and 332 is prevented.
[0081]
In this modification, since the plurality of external cooling pipes 330, 333, and 332 are provided, the surface area of the cooling member is large, and efficient heat exchange is performed, so that more rapid cooling can be performed. Further, in the standby period, it is only necessary to allow the cooling liquid to flow through some of the external cooling pipes 330.
[0082]
In particular, during the standby period, since the cooling liquid is allowed to flow through the external cooling pipe 330 disposed at the position closest to the outlet pipe 220, each external cooling pipe can be used with a relatively small flow rate of the cooling liquid. The boiling of the cooling liquid in 330, 331, and 332 can be effectively prevented.
[0083]
The invention according to this modification can be applied to a configuration including two or more external cooling pipes 330, 331, 332. Further, during the standby period, the cooling liquid may be passed through two or more of the external cooling pipes 330, 331, and 332.
[0084]
<3. Modification>
In each of the embodiments, the configuration in which the cooling pipe 21 is disposed in the mounting table 11 and the configuration in which the external cooling pipe 230 cools the lead-out pipe 220 extended to the mounting table 11 have been described. It is not necessarily limited to these aspects. For example, a configuration in which a cooling pipe is disposed on the lower surface of the mounting table 11 and the cooling pipe directly cools the mounting table 11 can be applied.
[0085]
In each of the embodiments, the configuration in which heating and cooling are performed using the heat pipe structure has been described. However, the present invention can also be applied to a configuration in which the heat pipe structure is not used. In short, the present invention can be applied to all configurations for cooling the mounting table 11 by flowing a cooling liquid.
[0086]
【The invention's effect】
  As described above, according to the heat treatment apparatus of the first aspect of the present invention, since the cooling liquid flows through the liquid flow mechanism during the standby period, the cooling liquid is boiled in the liquid flow mechanism. Can be prevented.
Further, the mounting table is heated by the working liquid vapor, and the working liquid vapor is cooled by the liquid flow mechanism disposed in the internal space of the mounting table, so that the temperature distribution of the mounting table is uniform. It can be heated and cooled while being held.
[0089]
According to the second aspect of the present invention, since the cooling liquid flows through the liquid flow mechanism during the standby period, boiling of the cooling liquid in the liquid flow mechanism can be prevented. Also,A protruding cooling part having a cooling space communicating with the internal space extends outward from the mounting table.In addition, the vapor of the working liquid is led out of the internal space.The liquid flow mechanism cools the projecting cooling unit to cool the vapor of the working liquid, so that there is no direct heat transfer between the liquid flow mechanism and the mounting table. Thus, the uniformity of the temperature distribution on the mounting table can be further improved.
[0090]
According to the third aspect of the present invention, since the cooling liquid flows through the liquid flow mechanism during the standby period, the boiling of the cooling liquid in the liquid flow mechanism can be prevented. Further, the protruding cooling part having a cooling space communicating with the internal space is formed to extend outward from the mounting table, and the liquid flow mechanism cools the protruding cooling part, Since the vapor of the working liquid is cooled, direct heat transfer between the liquid flow mechanism and the mounting table is prevented, and the uniformity of temperature distribution in the mounting table can be further improved. Also,More rapid cooling can be achieved with multiple cooling pipes. In the standby period, it is only necessary to allow the cooling liquid to flow through some of the cooling pipes.
[0091]
  Claim4According to the described invention, the cooling liquid is caused to flow through one or a plurality of cooling pipes disposed at positions close to the projecting cooling section, so that each cooling liquid can be flowed at a relatively small cooling liquid flow rate. Boiling can be effectively prevented.
[0092]
In these cases, cooling and heating can be efficiently performed by reducing the flow rate of the cooling liquid during the standby period as compared with the flow rate of the cooling liquid during the period for cooling the mounting table.
[Brief description of the drawings]
FIG. 1 is a plan view showing an overall configuration of a substrate processing apparatus.
FIG. 2 is a diagram showing a configuration of a first processing unit group and a second processing unit group of the same substrate processing apparatus.
FIG. 3 is a sectional view showing a heating unit according to the first embodiment of the present invention.
FIG. 4 is a plan view of a mounting table of the heating unit.
FIG. 5 is a diagram showing the heating and cooling control timing and the placement surface temperature when adjusting the set temperature in the heating unit.
FIG. 6 is a sectional view showing a heating unit according to a second embodiment of the present invention.
FIG. 7 is a plan view showing the same heating unit.
FIG. 8 is a view showing a modification of the heating unit.
[Explanation of symbols]
3 Control unit
11 Mounting table
12 Working chamber
14a Hydraulic fluid chamber
15 Heater
16 Working liquid
21 Cooling pipe
25 Cooling liquid supply source
26 Supply valve
200 heating unit
220 Outlet tube
230 External cooling pipe
326 valve
330, 331, 332 External cooling pipe
HP1 heating unit
V0 second flow rate
V1 first flow rate
W substrate

Claims (5)

A heat treatment apparatus for performing heat treatment on a substrate,
A mounting table on which a substrate can be mounted;
Heating means for heating the mounting table,
A cooling unit that has a liquid flow mechanism through which the cooling liquid can flow, and cools the mounting table with the cooling liquid that flows through the liquid flow mechanism;
During the standby period including at least one of the heating period to the mounting table by the heating means and the period in which the mounting table has become equal to or higher than the boiling point of the cooling liquid, the cooling liquid is passed through the liquid flow mechanism. It is a thing
The mounting table has an internal space filled with a working liquid,
The heating means is means for heating the mounting table by heating and evaporating the working liquid in the internal space,
The liquid flow mechanism is a heat treatment apparatus that is disposed in the internal space and cools the vapor of the working liquid . A heat treatment apparatus for performing heat treatment on a substrate,
A mounting table on which a substrate can be mounted;
Heating means for heating the mounting table,
A cooling unit that has a liquid flow mechanism through which the cooling liquid can flow, and cools the mounting table with the cooling liquid that flows through the liquid flow mechanism;
During the standby period including at least one of the heating period to the mounting table by the heating means and the period in which the mounting table has become equal to or higher than the boiling point of the cooling liquid, the cooling liquid is passed through the liquid flow mechanism. It is a thing
The mounting table has an internal space filled with a working liquid,
The heating means is means for heating the mounting table by heating and evaporating the working liquid in the internal space,
A protruding cooling part having a cooling space communicating with the internal space extends outward from the mounting table, and is formed so as to guide the vapor of the working liquid out of the internal space.
The liquid flow mechanism is a heat treatment apparatus that cools the vapor of the working liquid by cooling the protrusion cooling unit . A heat treatment apparatus for performing heat treatment on a substrate,
A mounting table on which a substrate can be mounted;
Heating means for heating the mounting table,
A cooling unit that has a liquid flow mechanism through which the cooling liquid can flow, and cools the mounting table with the cooling liquid that flows through the liquid flow mechanism;
During the standby period including at least one of the heating period to the mounting table by the heating means and the period in which the mounting table has become equal to or higher than the boiling point of the cooling liquid, the cooling liquid is passed through the liquid flow mechanism. It is a thing
The mounting table has an internal space filled with a working liquid,
The heating means is means for heating the mounting table by heating and evaporating the working liquid in the internal space,
The protruding cooling part having a cooling space communicating with the internal space is formed to extend outward from the mounting table,
The liquid flow mechanism cools the protrusion cooling part to cool the vapor of the working liquid,
The liquid flow mechanism has a plurality of cooling pipes,
In the waiting period, the cooling liquid is allowed to flow through some of the cooling pipes among the cooling pipes,
In the period for cooling the mounting table, the heat treatment apparatus for allowing the cooling liquid to flow through the other cooling pipes . The heat treatment apparatus according to claim 3,
A heat treatment apparatus that causes a cooling liquid to flow through one or a plurality of cooling pipes disposed at positions close to the protruding cooling unit during the standby period . It is the heat processing apparatus in any one of Claims 1-4,
The heat treatment apparatus , wherein the flow rate of the cooling liquid flowing through the liquid flow mechanism during the standby period is smaller than the flow rate of the cooling liquid during the period for cooling the mounting table .

Images