TWI373833B - Heatsink and semiconductor device with heatsink - Google Patents
Heatsink and semiconductor device with heatsink Download PDFInfo
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- TWI373833B TWI373833B TW97130232A TW97130232A TWI373833B TW I373833 B TWI373833 B TW I373833B TW 97130232 A TW97130232 A TW 97130232A TW 97130232 A TW97130232 A TW 97130232A TW I373833 B TWI373833 B TW I373833B
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- heat sink
- header
- discharge
- sink body
- cooling fluid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
1373833 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種散熱器，該散熱器藉由一用於冷卻 _目的之"IL體的使用以冷卻一加熱元件，以及有關於一種具 有一散熱器之半導體裝置，一用於該半導體裝置之加熱元 件係一半導體元件。 瓤 【先前技術】 φ'迄今已使用一冷卻器（radiator)及一散熱器（heatsink) 來冷卻一加熱器（例如，一半導體元件）。特別地，因為一 功率半導體發熱功率係大的，所以已出一種用以使一冷卻 目的之流體在一散熱器中循環之配置（見例如， JP-A-2006-19676)。 JP-A-2006-19676描述一單位模組光源，其中以螺釘將 一 WL有一做為一加熱元件之發光二極體的散熱器固定至 一固定夾具（fixing jig)。亦描述有關在該散熱器與該固 •定夾具間使用一樹脂或金屬構件，該樹脂或金屬構件耦接 .一用以引入一冷卻目的之流體至散熱器中之供應通口及 一用以從散熱器排放該流體之排放通口至該固定夾具之 一供應通口及一排放通口，而沒有漏水之牽連。 再者’為了配置複數個單元模組光源，jp_A_2〇〇6_19676 描述一用以耦接該等單元模組光源之供應通口及排放通 口在一起而沒有漏水之牽連之構件的使用。簡言之，描述 該等固定夾具之不漏水輕接。 JP-A-2006-19676中所述之技術陳述在以一對一關係耦 97130232 6 1373833 接該散熱II至該固定夹具時使用該樹脂或金屬構件。在這 :羡的結構中，可藉由耦接多個固定夾具來整合多個散熱 器。然而’具有下面問題：因為必須以水密式輕接多個位 置，所α漏水發生之機率變得相對高。再纟，沒有据述一 種用以防止從該等供應通口或該等排放通口漏水之發生 的特定結構，以及認為可藉由將該樹脂或金屬構件夾在平 面間以達成漏水之預防。 【發明内容】 已根據該情況構想出本發明及本發明旨在提供一種散 熱器，該散熱器藉由整合多個散熱器至一管集箱(he*。 來減少必須以水密式賴接之位置的數目，以抑制流體茂漏 之發生，以及提供-種具有這樣的散熱器之半導體裝置。 走本發明之一第一態樣係有關於一種適合耦接至一管集 箱之一安裝面的散熱器，在該管集箱中形成用以使一冷卻 流體通過之-供應路徑及―排放路徑，該散熱器包括： 一散熱器本禮’支撐一加熱元件及在該散熱器本體中形 成-用於該冷卻流體之流動通道，該散熱器本體輛接至該 管集箱，以便使該散熱器本體之一接觸面與該管集箱之安 裝面接觸， 其中在該散熱器本體之接觸面上形成一第一循環孔口 及-第二循環孔口’從該供應路徑經由該第—循環孔口引 入該冷卻流體及經由該第二循環孔σ排放該冷卻流體至 該排放路徑， 在该ΐ集箱之安裝面上形成複數個供應通口及複數個 97130232 7 1373833 排放通π ’藉由與該供應路徑相通以經由該複數個供應通 口供應該冷卻流體至該第—孔口及藉由與該排放路徑相 通以經由該複數個排放通口排放該冷卻流體， - 使複數個該散熱器本體耦接至該管集箱，以及 •使該第一循環孔口以水密式輕接至該等供應通口中之 -及使該第二循環孔口以水密絲接至該等排放通口中 之一 ° ·*本發明之-第二態樣的特徵在於：在該散熱器本體與該 e集相間插人-片狀密封構件，以便以水密式純於該散 熱器本體與該管集箱之間，以及 在該密封構件中形成一使該第一循環孔口與該供應通 口彼此相通之供應孔及一使該第二循環孔口與該排放通 口彼此相通之排放孔，以便朝該密封構件之厚度方向穿 過。 本發明之一第二態樣的特徵在於：在該管集箱中形成一 _第-接收管及-第二接收管，該第一接收管之一端與該供 應路徑相通及另一端對該供應通口開口，該第二接收管之 一端與該排放路徑相通及另一端對該排放通口開口， 該散熱II本體包括-對插管，該對插管係提供於該接觸 '面上，以便從該接觸面突出及以便插入在該管集箱中之第 '一與第二接收管， 該等插管中之-穿過-第一循環孔口，以及該等插管中 之另一插管穿過一第二循環孔口， 在該第一及第二接收管内部提供密封構件及使該等密 97130232 13738331373833 IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink which is cooled by a use of a cooling body for cooling a heating element, and A semiconductor device having a heat sink, and a heating element for the semiconductor device is a semiconductor component.瓤 [Prior Art] φ' has heretofore used a radiator and a heatsink to cool a heater (for example, a semiconductor element). In particular, since a power semiconductor has a large heating power, a configuration for circulating a fluid for cooling purposes in a heat sink has been proposed (see, for example, JP-A-2006-19676). JP-A-2006-19676 describes a unit module light source in which a heat sink of a light-emitting diode having a WL as a heating element is fixed by screws to a fixing jig. Also described is the use of a resin or metal member between the heat sink and the solid fixture, the resin or metal member coupled to a supply port for introducing a cooling purpose fluid into the heat sink and a The discharge port of the fluid is discharged from the radiator to one of the supply port and the discharge port of the fixing jig without any impediment of water leakage. Furthermore, in order to configure a plurality of unit module light sources, jp_A_2〇〇6_19676 describes the use of a member for coupling the supply ports of the unit module light sources and the discharge ports together without leakage. In short, the watertight connections of the fixtures are described. The technique described in JP-A-2006-19676 states that the resin or metal member is used when the heat dissipation II is coupled to the fixing jig in a one-to-one relationship 97130232 6 1373833. In this structure, a plurality of heat sinks can be integrated by coupling a plurality of fixed fixtures. However, there is the following problem: since it is necessary to lightly connect a plurality of locations in a watertight manner, the probability of occurrence of alpha leakage becomes relatively high. Further, there is no specific structure for preventing the occurrence of water leakage from the supply ports or the discharge ports, and it is considered that the prevention of water leakage can be achieved by sandwiching the resin or the metal member between the flat surfaces. SUMMARY OF THE INVENTION The present invention has been conceived in view of the circumstances and the present invention is directed to providing a heat sink that reduces water-tight connection by integrating a plurality of heat sinks into a header (he*) The number of positions to suppress the occurrence of fluid leakage, and to provide a semiconductor device having such a heat sink. One of the first aspects of the present invention relates to a mounting surface suitable for coupling to a tube header a heat sink in which a supply path and a "discharge path" for passing a cooling fluid are formed, the heat sink comprising: a heat sink that supports a heating element and is formed in the heat sink body a flow passage for the cooling fluid, the heat sink body being coupled to the header, such that a contact surface of the heat sink body is in contact with a mounting surface of the header, wherein the contact of the heat sink body Forming a first circulation orifice and a second circulation orifice 'from the supply path, introducing the cooling fluid through the first circulation orifice and discharging the cooling fluid to the discharge path via the second circulation orifice σ Forming a plurality of supply ports on the mounting surface of the stacking box and a plurality of 97130232 7 1373833 discharge passages π' by communicating with the supply path to supply the cooling fluid to the first orifice through the plurality of supply ports And communicating with the discharge path to discharge the cooling fluid via the plurality of discharge ports, - coupling a plurality of the heat sink bodies to the header, and: making the first circulation orifice water-tight Connecting to the supply ports - and causing the second circulation orifice to be connected to the discharge ports by a watertight wire. - The second aspect of the present invention is characterized in that the heat sink body is The e-set intervenes between the sheet-like sealing members so as to be watertightly pure between the heat sink body and the header, and a first circulation orifice and the supply port are formed in the sealing member a supply hole communicating with each other and a discharge hole communicating the second circulation port and the discharge port to each other so as to pass through the thickness direction of the sealing member. A second aspect of the present invention is characterized in that Forming a tube in the header a receiving tube and a second receiving tube, one end of the first receiving tube is in communication with the supply path and the other end is open to the supply port, one end of the second receiving tube is in communication with the discharge path and the other end is discharged a port opening, the heat sink II body includes a pair of cannula, the pair of cannula being provided on the contact 'face for protruding from the contact surface and for inserting the first and second receiving in the tube header a tube, the through-first circulation orifice in the cannula, and another cannula of the cannula passing through a second circulation orifice to provide a seal inside the first and second receiving tubes Member and make the same secret 97130232 1373833
封構件與該等插管之外圍面接觸’以便以水密式密封該第 一及第二接收管之内周面與該等插管之外周面。 X 本發明之-第四態樣的特徵在於：至少在該散熱器本體 之接觸面中的循環孔口周圍或在該管集箱之安裝面令的 供應通口及排放通口周圍形成凹部， 、 在該等凹部令配置環狀密封構件，該等環狀密封構件呈 現橡膠彈性，以及The sealing member is in contact with the peripheral surface of the cannula to seal the inner circumferential surface of the first and second receiving tubes and the outer circumferential surface of the canisters in a watertight manner. The fourth aspect of the present invention is characterized in that a recess is formed at least around the circulation orifice in the contact surface of the heat sink body or around the supply port and the discharge port of the mounting face of the pipe header. Having an annular sealing member disposed in the recesses, the annular sealing members exhibit rubber elasticity, and
使該散熱器本體連結至該管集箱，以便在該散熱器本體 與該管集箱間壓緊該等密封構件。 本發明之一第五態樣的特徵在於：該加熱元件係一發光 二極體。 x 本發明之一第六態樣的特徵在於：該管集箱係以一絕緣 合成樹脂材料所形成。 本發明之一第七態樣係有關於一種半導體裝置該半導 體裝置包括：一上述散熱器，其中該加熱元件係一半導體 φ 元件’該散熱器本體具有一堆疊本體，該堆疊本體包括一 . 設有一金屬板及熱耦合至該半導體元件及電性連接該半 導體元件之一電極的底部基板，以及一設有一金屬板及電 性連接該半導體元件之另一電極的覆蓋基板及一在該底 ' 部基板與該覆蓋基板間做絕緣之絕緣材料層。 ' 在本發明之第一態樣中，在該管集箱之安裝面上形成該 複數個供應通口及該複數個排放通口，其中藉由與該供應 路徑相通以經由該複數個供應通口供應該冷卻流體至該 第一孔口及藉由與該排放路徑相通以經由該複數個排放 97130232 9 1373833 通口排放該冷卻流體，而且複數個散熱本體係耦接於該管 集箱。於是，藉由以水密式耦接在該等散熱器本體中所形 成之第一循環孔口至在該管集箱上之供應通口及以水密 • 式耦接在該等散熱器本體中所形成之第二循環孔口至在 . 該管集箱上之排放通口 ’可整合該多個散熱器本體，以便 不發生流體之洩漏。再者，當構成一整合該等散熱器本體 之裝置時，只在兩倍於散熱器本體之數目的位置上提供不 φ 漏水耦接。可使必須以水密式耦接之位置的數目幾乎是在 以水密式亦耦接該等夾具之傳統結構中的位置之數目的 一半。因此，基於位置之減少可降低流體洩漏之發生的可 能性。 再者’因為使該多個散熱器本體耦接至一管集箱，所以 藉^以该管集箱分類該冷卻流體至該複數個散熱器主體 的流動路徑，可集體管理該冷卻流體至該複數個散熱器主 體，供應及排放。再者，因為一管集箱可用於該複數個散 熱器主體，户斤以基本需求係要在使該等散#器主體連結至 該=集箱的位置上管理該冷卻流體之A漏，以及可減少所 要管理之項目的數目。此有助於在維修及檢查期間所 之操作性。 ^田以水岔式耦接在該散熱器本體中所形成之第一 第二循環孔口與在該管集箱上之供應通口及排放通口 ，車社I在定位後輕5地使這些構件彼此難。因此，用以 助=等散熱器主體至該管集箱之工作變得容易，以及有 ;用以更換該等散熱器主體之工作。 97130232 1373833 在本發明之第二態樣中’因為在該散熱器本體與該管集 箱間插入該片狀密封構件，所以甚至在對每體 分別提供該密封構件之情況中該第-及第二孔 片該抵、封構件。可以相對少數目之密封構件(亦即，只 同：：等散熱器本體之數目的密封構件)維持不漏水 :接。再者，亦可對多個散熱器本體提供一片該密封構 。於疋’可提供有較少數目之零件。此外，在以-絕緣 材料形成該密封構件之情況中，該散熱器本體可兼做該電 極，以及甚至在該管集箱係由金屬所製成之情況中，該密 封構件可兼做在該散熱H本體與該管集箱間所配置之絕 緣材料。結果，可減少該等零件之數目。 在本發明之第三態樣中，在該管集箱中所提供之接收管 中插入在該散熱器本體上所突出之插管，以及藉由在該等 接收管内部所提供之㈣構件在該等插管與該等接收管 間實施不漏水密封。於是，可藉由在該等密封位置上使密 封距離變長’以提供不漏水性能。再者，藉由在該管集箱 之接收管中插入該等插管，可將該散熱器本體定位及暫時 固疋在該官集箱上。因此’可輕易地實施該散熱器本體至 該管集箱之安裝程序。 在本發月之第四癌樣中，至少在該散熱器本體之接觸面 中的循環孔口周圍或在該管集箱之安裝面中的供應通口 及排放通口周圍形成凹部，在該等凹部中配置呈現橡膠彈 之環狀密封構件，以及使該散熱器本體連結至該管集 相以便在該散熱器本體與該管集箱間壓緊該等密封構 97130232 11 丄： ^因此，使該等密封構件與該散熱器本體及該管隼箱幾 箱mm，Λΐ 料錢^體及該管集 m觸而無關於該散熱器本體及該管集箱之平坦 散熱器本體與該等密封構件間及在該管集 牛間沒有形成間隙，以及即使施加高壓， 4子不發生該冷卻流體之洩漏。 在本發明之第五4樣中，藉由冷卻該發光二極體，可使 光二極體以獲得—高輪出光源。通常，當提升該發 -木體之溫度時，會降低該發光效率。The heat sink body is coupled to the header to compress the sealing members between the heat sink body and the header. A fifth aspect of the invention is characterized in that the heating element is a light-emitting diode. x A sixth aspect of the invention is characterized in that the tube header is formed of an insulating synthetic resin material. A seventh aspect of the present invention relates to a semiconductor device including: the above heat sink, wherein the heating element is a semiconductor φ element. The heat sink body has a stacked body, and the stacked body includes a set. a metal plate and a bottom substrate thermally coupled to the semiconductor element and electrically connected to one of the electrodes of the semiconductor element, and a cover substrate provided with a metal plate and another electrode electrically connected to the semiconductor element and a bottom portion An insulating material layer that is insulated between the substrate and the cover substrate. In a first aspect of the present invention, the plurality of supply ports and the plurality of discharge ports are formed on a mounting surface of the header, wherein the plurality of supply ports are communicated through the plurality of supply ports The cooling fluid is supplied to the first orifice and communicated with the discharge passage to discharge the cooling fluid through the plurality of discharges 97130232 9 1373833, and a plurality of heat dissipation systems are coupled to the header. Thus, the first circulating orifice formed in the heat sink body by watertight coupling to the supply port on the header and the watertight coupling in the heat sink body The second circulation orifice formed to the discharge port on the header can integrate the plurality of radiator bodies so that no fluid leakage occurs. Furthermore, when a device incorporating the heat sink bodies is constructed, a water leakage coupling is provided only at a position twice the number of heat sink bodies. The number of locations that can be coupled in a watertight manner is almost half the number of locations in a conventional structure that is watertight and also coupled to the fixtures. Therefore, the reduction in position can reduce the likelihood of fluid leakage. Furthermore, because the plurality of heat sink bodies are coupled to a tube header, the flow path of the cooling fluid to the plurality of radiator bodies is classified by the tube header, and the cooling fluid can be collectively managed to the A plurality of radiator bodies are supplied and discharged. Furthermore, since a tube header can be used for the plurality of radiator bodies, the basic requirement is to manage the A leakage of the cooling fluid at a position where the bulk body is coupled to the = header, and It can reduce the number of items to be managed. This contributes to the operability during maintenance and inspection. The field is coupled to the first and second circulation orifices formed in the radiator body by the water raft and the supply port and the discharge port on the pipe collecting box. These components are difficult for each other. Therefore, it is easy to work with the radiator main body to the pipe collecting box, and to replace the heat sink main body. 97130232 1373833 In the second aspect of the present invention, 'because the sheet-like sealing member is interposed between the heat sink body and the header, the first and the third in the case where the sealing member is separately provided for each body The two-hole piece is used to abut and seal the member. A relatively small number of sealing members (i.e., only the sealing members of the number of radiator bodies, etc.) can be maintained without water leakage: Furthermore, a plurality of the heat sink bodies may be provided with a piece of the sealing structure. Yu Yu' can provide a smaller number of parts. Further, in the case where the sealing member is formed of an insulating material, the heat sink body can double as the electrode, and even in the case where the tube header is made of metal, the sealing member can double An insulating material disposed between the heat dissipation H body and the tube header. As a result, the number of such parts can be reduced. In a third aspect of the invention, the cannula protruding from the heat sink body is inserted into the receiving tube provided in the tube header, and the (four) members provided inside the receiving tube are The cannula and the receiving tubes are sealed with a watertight seal. Thus, the sealing distance can be made longer by the sealing position at the sealing positions to provide watertightness. Furthermore, by inserting the cannulas into the receiving tube of the header, the heat sink body can be positioned and temporarily fixed to the official header. Therefore, the installation procedure of the radiator body to the header can be easily implemented. In the fourth cancer sample of the present month, a recess is formed at least around the circulation orifice in the contact surface of the heat sink body or around the supply port and the discharge port in the mounting surface of the tube header. An annular sealing member that presents a rubber bomb is disposed in the concave portion, and the heat sink body is coupled to the tube collecting phase to press the sealing structure between the heat sink body and the tube header 97130232 11 ^: ^ Having the sealing members and the heat sink body and the tube box a few boxes of mm, the body of the tube and the tube set m are contactless with respect to the heat sink body and the flat heat sink body of the tube box and the like No gap is formed between the sealing members and between the tube collecting cows, and even if a high pressure is applied, the leakage of the cooling fluid does not occur. In the fifth aspect of the invention, by cooling the light-emitting diode, the light diode can be made to obtain a high-round light source. Generally, when the temperature of the hair-wood body is raised, the luminous efficiency is lowered.
由使該冷料職環以料冷卻㈣光二㈣，可甚至I 2大電流時㈣該溫度上升’以及可以高輸出使該光源 …、7C而維持该發光效率。 在本發明之第六態樣中m絕緣合成樹脂材料形 成㈣集箱，所以甚至在該散熱器本體兼做-電極之情況 中’可安裝該散熱器本體在該管集箱上’以便直接彼此接 觸。因而’不需要在該散熱器本體與該管集箱間插入一絕 緣材料’因為該管集箱係由金屬所製成。因此，可減少裳 件之數目。 β 在本發明之第七態樣中，藉由在該底部基板及該覆蓋基 板之兩個金屬板間插人該絕緣材料層，以提供該散熱器本 體。使在該覆蓋基板上所安裝之半導體裝置的兩個電極與 4底部基板及該覆蓋基板分別連接。因此，相較於使用尾 銷（terminal pins)及引線（lead wires)於電連接之情 況，可增加電極面積以增加大電流容量。此外，因為該散 97130232 12 χ373833 熱器本體兼做電連接部，所以相較於分別提供像尾銷及引 線之電連接部的情況，可減少來自該散熱器本體之突出零 件。因此，可使該散熱器本體輕易地附著至該管集箱或其 • 它構件及可緊密地容納該散熱器本體。 , 【實施方式】 .(第一具體例） 藉由採用一下面所要描述之散熱器包括一當做一加熱 鲁元件之紫外線發光二極體的情況做為一實施例來說明該 散熱器。附帶地，在本發明中，不僅該紫外線波長範圍之 紫外線發光二極體，而且一不同於該紫外線發光二極體之 發光二極體（例如，一可見光波長範圍之發射光源）可適合 做為該加熱元件。再者，其它功率半導體元件亦可適合做 為該加熱元件。 如圖1至圖3所示，使一散熱器本體丨構成做為一藉由 雄豐一由一上面安裝有一相當於裸晶片之紫外線發光二 魯^體2的金屬板所製成之底部基板^、一由一包圍該底 •。卩基板11之安裝有該紫外線發光二極體2之區域的金屬 板所製成之覆蓋基板12及一在該底部基板η與該覆蓋基 .板12間所插入且使該底部基板11與該覆蓋基板12所絕 緣之絕緣材料層13所產生之多層產品。使用一銅元素或 ' —銅基合金於該底部基板11及該覆蓋基底12。 如圖1所示，藉由晶粒接合使該紫外線發光二極體2之 一電極（陽極）直接連接至該底部基板11。藉由打線接合 使該紫外線發光二極體2之另一電極（陰極）連接至該覆 97130232 13 1373833 蓋基板12。總之’使該紫外線發光二極體2之一電極電 性連接至該底部基板1 i，以及使該紫外線發光二極體2 之另一電極電性連接至該覆蓋基板12。 • 在該覆蓋基板12中開出一個暴露孔14，以便未覆蓋在 該底部基板11上所安裝之紫外線發光二極體2。使該暴 • 露孔14之内周面成錐形，以致於該暴露孔14之内徑隨著 離該底部基板11之距離的增加而變大。在該暴露孔14中 鲁安裝一具有一凸曲（例如’球形）外表面之泛光透鏡15。 結果，該紫外線發光二極體2被容納在一由該底部基板 11、該覆蓋基板12及該泛光透鏡15所包圍之密閉空間中 及被保護不受環境（例如，濕氣）之影響。藉由調整該泛光 透鏡15之位置及特性或該暴露孔之内周面的傾斜或反 射之角度，可控制從該紫外線發光二極體2所照射之光的 發光強度分佈。 在該底部基板1 1之背面（相對於該底部基板1 1之安裝 _有该覆蓋基板12的表面之表面）中形成一對循環孔口 • 16，每一循環孔口 16係圓形開口。在該底部基板丨丨中形 成用以在該等循環孔口 16間建立互通之流動通道17。形 成每一流動通道17，以便通過該底部基板u之安裝有該 •紫外線發光二極體2的鄰近地區’藉以提高一流經該流動 -通道Η之冷卻目的之流體與該紫外線發光二極體2間之 熱耦合的程度。該冷卻目的之流體可使用水，但是，亦可 使用一不同於水之物質，只要該物質在室溫下處於液態中 及呈現接近1之比熱容量。 97130232 14 1373833 如圖3所示，在本具體例中，當從該泛光透鏡15之正 面觀看時，該底部基板U及該覆蓋基板丨2兩者係形成為 矩形，狀及具有實質相同寬度。然而，該底部基板u及 .該覆盍基板12具有彼此不同之長度，以及該底部基板u 係形成比該覆蓋基板12長。此外，該底部基板11之長度 中“的位置不同於該覆蓋基板12之長度中心的位置；或 者換勺話說，使该覆蓋基板12在縱向上之一端沿著它的 •縱向延伸至該底部基板11之一側。使該泛光透鏡15之中 〜對齊至該底部基板丨丨之長度中心。形成該兩個循環孔 16同時使它們沿著該底部基板11之縱向彼此隔離。 在該底部基板11之每一縱端上形成一安裝孔18。再 者，在該底部基板11及該覆蓋基板12中分別開出一連接 及連接孔2 2，母一連接孔係一螺絲孔。該等個別 ^接孔21及22係定位在該底部基板u之長度中心與該 專個別女裝孔18之間。在該底部基板11之長度中心與該 眷等個別連接孔21及22間存在有等距離。該等連接孔21 •及22係提供用於該紫外線發光二極體2之電性連接。 泣附帶地，在該等個別循環孔口 16周圍形成圓形開口凹 。卩23及24。換句話說，在該等凹部23及24之内部底面 中開出該等個別循環孔口 16，以及在該等個別凹部23及 ‘ 24上集中形成該等個別循環孔口 16。 如圖1、4及5所示，在該等散熱器主體1之使用時， $該散熱器主體耦接至該管集箱3，以允許該冷卻目的之 流體之循環。藉由以一耦接螺釘3c固定一由金屬材料所 97130232 15 1373833 製成之支撐台3a與一由絕緣材料所製成之間隔物扑來構 成該管集箱3。藉由穿過該支撐台3a將耦接螺釘3c旋入 該間隔物3b。該管集箱3並非侷限於上述形狀。只要一 .連接該等散熱器本體1之安裝面31成為一平坦面，對該 管集箱3之剖面輪廓並沒有強加特定限制。在該管集箱3 中形成使該冷卻目的之流體所循環之一供應路徑32及一 排放路徑33。在該管集箱3之安裝面31的適當位置上開 #出保持與該供應路徑32相通之供應通口 34及保持與該排 放路徑33相通之排放通口 35。為了表示之簡化，從圖5 省略該間隔物3b。 分別以圓形開出該等供應通口 34及該等排放通口 35。 該等通口之開口直徑實質上等於該等循環孔口 16之開口 直徑。使該供應通口 34與該排放通口 35間之距離等於在 該政熱器本體1中所形成之循環孔口 16間之距離。在該 管集箱3中形成由該供應通口 34及排放通口 35所構成之 _數組通口（例如，1 〇組）。 為了連結該散熱器本體1至該管集箱3’使該底部基板 U之開出有該對循環孔口 16之接觸面25與該管集箱3 之安裝面31接觸，以及經由該等安裝孔丨8將安裝螺釘 19旋入該管集箱3。此時’使在該管集箱3之安裝面31 •中所開出且屬於一組之該供應通口 34的軸線及該排放通 口 35的軸線對齊至一散熱器本體1之循環孔口 16的個別 軸線。將呈現橡膠彈性之環狀密封構件4安裝至該等個別 凹部23及24中，以及使該散熱器本體1連結至該管集箱 97130232 16By allowing the cold material to cool (4) light two (four), even if I 2 large current (4) the temperature rises ' and the high output can make the light source ..., 7C maintain the luminous efficiency. In the sixth aspect of the present invention, the m-insulating synthetic resin material forms a (four) header, so that even in the case where the heat sink body doubles as an electrode, the heat sink body can be mounted on the header to directly directly contact each other. contact. Thus, it is not necessary to insert an insulating material between the heat sink body and the header because the tube header is made of metal. Therefore, the number of dresses can be reduced. In the seventh aspect of the present invention, the heat sink body is provided by interposing the insulating material layer between the base substrate and the two metal plates of the cover substrate. The two electrodes of the semiconductor device mounted on the cover substrate are connected to the bottom substrate and the cover substrate, respectively. Therefore, the electrode area can be increased to increase the large current capacity as compared with the case where the terminal pins and lead wires are used for electrical connection. In addition, since the heat sink body of the 97130232 12 χ 373833 also serves as an electrical connection portion, the protruding member from the heat sink body can be reduced as compared with the case where the electrical connection portions such as the tail pin and the lead wire are respectively provided. Therefore, the heat sink body can be easily attached to the header or its member and the heat sink body can be closely accommodated. [Embodiment] (First Specific Example) The heat sink will be described as an embodiment by using a heat sink to be described below including an ultraviolet light-emitting diode as a heating element. Incidentally, in the present invention, not only the ultraviolet light-emitting diode of the ultraviolet wavelength range but also a light-emitting diode different from the ultraviolet light-emitting diode (for example, an emission light source of a visible light wavelength range) can be suitably used as The heating element. Furthermore, other power semiconductor components can also be suitable as the heating element. As shown in FIG. 1 to FIG. 3, a heat sink body is formed as a bottom substrate made of a metal plate on which an ultraviolet light-emitting diode 2 corresponding to a bare wafer is mounted. One by one surrounded by the bottom. a cover substrate 12 made of a metal plate in the region of the ultraviolet light-emitting diode 2 on which the substrate 11 is mounted, and a substrate between the base substrate η and the cover substrate 12 is inserted and the base substrate 11 is inserted A multilayer product produced by covering the insulating material layer 13 insulated by the substrate 12. A copper element or a copper-based alloy is used for the base substrate 11 and the cover substrate 12. As shown in Fig. 1, an electrode (anode) of the ultraviolet light-emitting diode 2 is directly connected to the base substrate 11 by die bonding. The other electrode (cathode) of the ultraviolet light-emitting diode 2 is connected to the cover substrate 12 by the wire bonding by the wire bonding 130130232 13 1373833. In short, one of the electrodes of the ultraviolet light-emitting diode 2 is electrically connected to the base substrate 1 i, and the other electrode of the ultraviolet light-emitting diode 2 is electrically connected to the cover substrate 12. • An exposure hole 14 is formed in the cover substrate 12 so as not to cover the ultraviolet light-emitting diode 2 mounted on the base substrate 11. The inner circumference of the blast hole 14 is tapered such that the inner diameter of the exposure hole 14 becomes larger as the distance from the base substrate 11 increases. A flood lens 15 having a convex curved (e.g., 'spherical) outer surface is mounted in the exposure hole 14. As a result, the ultraviolet light-emitting diode 2 is housed in a sealed space surrounded by the base substrate 11, the cover substrate 12, and the flood lens 15, and is protected from the environment (e.g., moisture). The light emission intensity distribution of the light irradiated from the ultraviolet light emitting diode 2 can be controlled by adjusting the position and characteristics of the flood lens 15 or the angle of inclination or reflection of the inner peripheral surface of the exposure hole. A pair of circulating orifices are formed in the back surface of the base substrate 11 (with respect to the surface of the base substrate 11 to be mounted with the surface of the covering substrate 12). 16. Each of the circulating orifices 16 has a circular opening. A flow passage 17 for establishing an intercommunication between the circulating orifices 16 is formed in the bottom substrate. Forming each of the flow channels 17 so as to pass through the vicinity of the bottom substrate u on which the ultraviolet light-emitting diode 2 is mounted, thereby improving the fluid flow of the first-stage cooling through the flow-channel enthalpy and the ultraviolet light-emitting diode 2 The degree of thermal coupling between. The fluid for cooling purposes may use water, but a substance other than water may be used as long as the substance is in a liquid state at room temperature and exhibits a specific heat capacity close to 1. 97130232 14 1373833 As shown in FIG. 3, in this embodiment, when viewed from the front of the flood lens 15, the base substrate U and the cover substrate 2 are formed in a rectangular shape and have substantially the same width. . However, the base substrate u and the cover substrate 12 have different lengths from each other, and the base substrate u is formed longer than the cover substrate 12. Further, the position of the length of the base substrate 11 is different from the position of the center of the length of the cover substrate 12; or alternatively, the cover substrate 12 is extended longitudinally at one end thereof to the bottom substrate along its longitudinal direction. One side of the lens 45 is aligned to the center of the length of the bottom substrate 。. The two circulation holes 16 are formed while being separated from each other along the longitudinal direction of the base substrate 11. A mounting hole 18 is formed in each of the longitudinal ends of the elliptical substrate 11. Further, a connecting and connecting hole 22 is formed in the bottom substrate 11 and the covering substrate 12, and the female connecting hole is a screw hole. The holes 21 and 22 are positioned between the center of the length of the base substrate u and the individual female hole 18. The center of the length of the base substrate 11 is equidistant from the individual connecting holes 21 and 22 such as the cymbal. The connection holes 21 and 22 provide an electrical connection for the ultraviolet light-emitting diode 2. Incidentally, a circular opening recess is formed around the individual circulation orifices 16. 卩23 and 24. In other words, in the recesses 23 and 24 The individual circulation orifices 16 are opened in the bottom surface of the portion, and the individual circulation orifices 16 are collectively formed on the individual recesses 23 and '24. As shown in Figures 1, 4 and 5, the heat sink bodies are When in use, the heat sink body is coupled to the header 3 to allow circulation of the fluid for cooling purposes. A support made of metal material 97130232 15 1373833 is fixed by a coupling screw 3c. The table 3a and a spacer made of an insulating material are rushed to form the header 3. The coupling screw 3c is screwed into the spacer 3b through the support table 3a. The header 3 is not limited In the above shape, as long as the mounting surface 31 connecting the heat sink bodies 1 becomes a flat surface, no specific limitation is imposed on the cross-sectional profile of the header box 3. The purpose of the cooling is formed in the header box 3. One of the fluid supply path 32 and a discharge path 33. At a suitable position of the mounting surface 31 of the header 3, a supply port 34 that maintains communication with the supply path 32 is maintained and maintained with the discharge path 33. The discharge port 35 is connected. For the sake of simplicity, from 5 omitting the spacers 3b. The supply ports 34 and the discharge ports 35 are respectively opened in a circular shape. The opening diameters of the ports are substantially equal to the opening diameters of the circulating orifices 16. The distance between the port 34 and the discharge port 35 is equal to the distance between the circulation orifices 16 formed in the kelamatic body 1. The supply port 34 and the discharge port are formed in the header 3 35-shaped array port (for example, 1 〇 group). In order to connect the heat sink body 1 to the tube header 3', the bottom substrate U is opened with the contact surface 25 of the pair of circulating apertures 16 The mounting surface 31 of the header 3 is in contact with each other, and the mounting screw 19 is screwed into the header 3 via the mounting holes 8. At this time, the axis of the supply port 34 which is opened in the mounting surface 31 of the header 3 and belongs to a group and the axis of the discharge port 35 are aligned to the circulation orifice of a radiator body 1. The individual axes of 16. A rubber-elastic annular sealing member 4 is mounted in the individual recesses 23 and 24, and the heat sink body 1 is coupled to the header 98130232 16
丄J/JOJJ 3，以便在該等凹部23及24 4 安裝面31間壓緊該等密封：部底面與該管集箱3之 及該排放通口 35連結至該等德二,使T供應通口 34 隙。該等密封構件4可使W型^^孔口 16，而沒有間 該密封構件4採用一圓形判 該散熱器本體丨與該管集箱；具有-環狀。當在丄J/JOJJ 3, in order to press the seals between the recesses 23 and 24 4 of the mounting surface 31: the bottom surface of the portion and the header 3 and the discharge port 35 are connected to the two, so that the T supply Port 34 gap. The sealing members 4 can have a W-shaped opening 16 without a gap between the sealing member 4 and the heat sink body 丨 and the tube header; When in
觸之狀態分別接觸該散熱器本截二隼 ㈣形成。“，該線接觸不是根= 坦程度。該供應通口 34jSa集相之安裝面31的平 孔口 1 ^排放通口 35與該等對應循環 ^ 16互通’以致於在該密封構件4之橡膠彈性的有效 乍=之範圍内不會造成該冷卻目的之流體之茂漏。 如述配置沒有使用瞢Jfl ( n; η Λ (ρ pe Or tube)。因此，容易使 I;笪ί熱f主體1附著至該管集箱3。結果，有助於連結The state of contact is respectively formed by contacting the heat sink with the second section (four). "The line contact is not the root = the degree of the flat. The flat port 1 of the mounting port 31 of the supply port 34jSa is flushed with the corresponding loops 16 so that the rubber in the sealing member 4 The effective 乍= of the range of elasticity does not cause leakage of the fluid for the purpose of cooling. As described, 瞢Jfl (n; η Λ (ρ pe Or tube) is not used. Therefore, it is easy to make I; 1 attached to the header box 3. As a result, it helps to link
=散熱器主體1與該管集箱3之操作，以及亦有助於該 政熱器主體1之更換的操作。換句話說維修操作（例 如，該等散熱器主體1之故障等）變得容易。 此外，使複數散熱器主體1連結至該管集箱3，以及因 此做到基纟需求以致於不會造成該冷卻目的《流體從該 2散熱器主體1與該管集箱3連結在一起之位置處洩漏。 虽相較於對每一散熱器本體1提供該管集箱3之情況，排 除使该等管集箱3彼此連接之必要性，以及可減少所要處 理之該冷卻目的之流體的洩漏之位置的數目。 在該管集箱3之支撐台3a與間隔物3b間亦使用用以連 97130232 17 1373833 結該等散熱器主體1之循環孔口 16至該管集箱3之供應 通口 34及排放通口 35的結構。特別地’該供應路徑32 及該排放路徑33必須建立在該支撐台3a與該間隔物3b 間之互通。因此，如圖1所示’在該支撐台3a中之在該 支撐台3a及該間隔物3b上要連結該供應路徑32及該排 放路徑33的位置處形成凹部36，以及在該支撐台3a與 該間隔物3b間夾入一位於該等個別凹部36中之環狀密封 構件37(0型環），因而壓緊該環狀密封構件 在上述具體例中，將在該散熱器本體丨中該底部基板 11之相對於該覆蓋基板12的表面當做一接觸面25。然 而，亦可將該底部基板Π之相鄰於提供有該覆蓋基板12 之表面的表面當做該接觸面25。例如，亦可以將該底部 基板11之一縱端面當做該接觸面25，以及在該接觸面中 f可以提供該等循環孔口 16。此外，在該底部基板 =別縱端面上亦可以提供該等循環孔σ i6，以取代在一 ^面f所提供之兩個並列循環孔u 16,以及亦可以提供 j管集箱3,以便對應於該等個別循環孔口 16。此外， :述具體例中，在該散熱器本體1中提供該等凹部23 24,或：而亦：可以W集箱3中提供該等凹部23及 提:…w在錄熱本體1及該管集箱3兩者中 扣供该4凹部23及24。 (弟一具體例） 在該第一具體例中，提 .構件4之使 /、〜、·々構，以便藉由該環狀密封 7费式耦接該散熱器本體1及該管集箱 97130232 I37J833 3片狀vzim體财，提供該結構，錢使用一 -具體例令，為=該職密封構件4。再者，在該第 1中提、該等密封構件4,在該散熱器本體 該等凹部心24係不需要：方面’在本具體例中’ 部=Π5具有這樣相同於構成該散熱器本體1之底= operation of the radiator body 1 and the header 3, and also the operation of replacing the heater body 1. In other words, the maintenance operation (e.g., the failure of the radiator main body 1 or the like) becomes easy. In addition, the plurality of heat sink bodies 1 are coupled to the headers 3, and thus the base needs are such that the purpose of the cooling is not caused by the fluid from the 2 heat sink body 1 and the header 3 being joined together. Leak at the location. Although the necessity of connecting the headers 3 to each of the heat sink bodies 1 is eliminated, the necessity of connecting the headers 3 to each other and the position of leakage of the fluid to be treated for the cooling purpose are eliminated. number. A supply port 34 and a discharge port for connecting the circulation orifice 16 of the radiator body 1 to the pipe header 3 of the radiator body 1 are also connected between the support table 3a of the pipe header 3 and the spacer 3b. The structure of 35. In particular, the supply path 32 and the discharge path 33 must establish an intercommunication between the support table 3a and the spacer 3b. Therefore, as shown in FIG. 1, a recess 36 is formed in the support table 3a at a position where the supply path 32 and the discharge path 33 are to be joined to the support table 3a and the spacer 3b, and at the support table 3a. An annular sealing member 37 (0-ring) located in the individual recesses 36 is interposed between the spacers 3b, thereby pressing the annular sealing member in the above specific example, and will be in the heat sink body The surface of the base substrate 11 with respect to the cover substrate 12 serves as a contact surface 25. However, the surface of the base substrate adjacent to the surface on which the cover substrate 12 is provided may be regarded as the contact surface 25. For example, one of the longitudinal end faces of the bottom substrate 11 can also be regarded as the contact face 25, and the circulating orifices 16 can be provided in the contact faces. In addition, the circulation holes σ i6 may be provided on the bottom substrate=the other longitudinal end faces instead of the two parallel circulation holes u 16 provided in the surface f and the j-tube header 3 may also be provided. Corresponding to the individual circulation orifices 16. In addition, in the specific example, the concave portion 23 24 is provided in the heat sink body 1 or: and the concave portion 23 can be provided in the header 3 and the heat recording body 1 and the The four recesses 23 and 24 are buckled in both of the headers 3. (Department of a specific example) In the first specific example, the structure of the member 4 is made, and is configured to be coupled to the heat sink body 1 and the header box by the annular seal 7 97130232 I37J833 3 piece of vzim body wealth, provide the structure, the money uses a - specific order, = the job seal member 4. Further, in the first aspect, the sealing members 4 are not required in the heat sink main body 24: in the present embodiment, the portion = Π5 has the same configuration as that of the heat sink body. 1 bottom
寸:二=於該管集箱3的表面之全部面積的尺 膠彈性夕从』， 該在封構件5係由-種呈現橡 膠彈故之材料所製成。在該密封構 供應通口 34及哕蚶淤1 rr Μ & 耠供用以使該 16之一供旌 35連接至該等個別循環孔口 本體1中、=及—排放孔42,以便在對應於該散熱器 在”封二Γ哀孔口 16的位置上穿過該密封構件5。亦 封構件5中之對應於該散熱器本體 18的位置上提供通孔43。 女裝孔 散：：太!!该散熱器本體1固定至該管集箱3，以便在該 散熱器本體1與該管集箱3間插人該密封構件5。因此， 屋緊該密封構件5，以便以水密式使該供應通口 ％及該 排放通口 35耦接至該等循環孔口 16。 在本具體例中，不需要在該散熱器本體丨中提供該等凹 部23及24及對一個散熱器本體i只提供一個密封構件5 之基座。因此，可輕易地實施該散熱器本體丨至該管集箱 3之安裝程序。再者，因為使該密封構件5之尺寸大於在 該第一具體例中所使用之密封構件4的尺寸，所以可更容 易處理該密封構件5。於是，改善該散熱器本體i至該^ 97130232 19 1373833 集箱3之安裝程序的可加工性。再者，甚至當該 5係由二屬：製成時，藉由以一絕緣材料提供該密封：件 如二 熱器本體1與該管集箱3間之絕緣。因此， =吏用以-絕緣材料所形成之安裝螺·ΐ9，則該二 構=可以是不需要的（圖7顯示一省略該間隔物扑之結 本具體例中對該等散熱器本體i之每 供一片上述密封構件5,但是如圖8所示 相二广本體1提供-片密封構件6。在此結構中， =於對母-散熱器本體1分別提供密封構件5之 可減少該密封構件6之數目。因此，上月/ 件之數目。在其它方面n — 乂減少該等零 同於該第一具體例。U例之結構及操作係相 (第三具體例） 在本具體例中，如圖9及10所示，提供— 27，以便從該散熱器本體丨之底 ' B 6及 將該等插管…插入該管在 箱3上安裝該散熱器本體； =’在該官集 等循環孔口 16。 乂料插官26及27形成該 及在：管集箱3令，如圖10所示，形成1 一接收管38 及-第二接收管39,其中 “ 38 ::收管39之一端與該排放路徑33相通及另二=第 放…5開口。在每一接收管38及39内部形成：對 97130232 20 1373833 固定槽(retaining grooves)38a 及 _， 1’以便在該等接收管38…之預定位置上固定= 密封構件7。 u疋通寻 -It管38及39具有一直徑及—高度，以便該等插 s 26及27可插入其中。使該等密 26及27之外周面緊密接觸，以及在該等插管;6及= ;=Γ及咖之底面間歸該等密封構件7:結 果，在該⑽收管38及39之内周面與該等插管Μ” 之外周面間提供不漏水密封。 =是’藉由㈣散熱器本體1之插管26及27插入該管 集相3之接收管38及39,以及藉由以該等安裝螺釘19 器本體1至該管集箱3,使該管集箱3及該散 …盗本體1以水密式彼此耦接。 附帶地，在該管集箱3係由金屬所製成之情況中，使嗜 ，本體i之底部基板u與該管集箱3電性連接， 吏該等散熱器本體】串接時，為了該第一具體例所 料期望提供該間隔⑯或者以-像合成樹脂 本體成該管集箱3。另一方面，當使該等散熱器 本體1並接時，可以藉由以一金屬材料形 使該等底部基板u與該f集箱3直接連接。S八相 依據本具體例之結構，其中藉由在等接收管⑽及 之密封構件7的使用，以水密式密封該等插管π 及=及㈣接收管38及39，可藉由使密封距離變長， 提向該不漏水特性（將該密封距離界定為在該接收管中之 97130232 21 ^73833 指=密封構件的距離）(）再者’因為將該散熱器本體1之 被Ij6及27插入該管集箱3之接收管38及39,所以在 总π =女裝刖，該散熱器本體1可暫時被固定及定位在該 二，相3上。因此，可輕易地實施該散熱器本體丨在該管 票箱3上之安裝程序。 在/、匕方面，該第二具體例之結構及操作相同於該第一 辦體例及該第二具體例。附帶地，同樣在該第—及第二具 :例中’可藉由以-合成樹脂形成該管集箱3來省略該間 5物3b，以及使用以一金屬材料所形成之安裝螺釘19。 再f ’在該第—具體例中’當使該等散熱器本體1並接而 不是串接時’可使用-種結構，丨中使該底部基板u與 =屬所製成之管集箱3直接接觸。另—方面，在該第二具 ，中，為了獲得這樣的結構，需要以—導電材料來提供 該密封構件6 (例如，使用一金屬材料）。 【圖式簡單說明】Inch: two = the rubber elastic state of the entire area of the surface of the tube header 3, which is made of a material which exhibits a rubber bullet. The seal supply port 34 and the sluice 1 rr amp &; are provided for connecting the one of the 16 supply ports 35 to the individual circulation orifice bodies 1 and the discharge holes 42 so as to correspond The heat sink passes through the sealing member 5 at the position of the sealing hole 16. The through hole 43 is also provided at a position corresponding to the heat sink body 18 in the sealing member 5. Too!! The radiator body 1 is fixed to the header 3 so as to insert the sealing member 5 between the radiator body 1 and the header 3. Therefore, the sealing member 5 is tightened to be watertight. The supply port % and the discharge port 35 are coupled to the circulating orifices 16. In this embodiment, the recesses 23 and 24 and the pair of heat sink bodies need not be provided in the heat sink body i only provides a base of the sealing member 5. Therefore, the mounting procedure of the heat sink body to the header 3 can be easily implemented. Furthermore, since the size of the sealing member 5 is made larger than in the first specific example The size of the sealing member 4 used in the sealing member 4 can be handled more easily. , improving the processability of the installation procedure of the heat sink body i to the ^ 97130232 19 1373833 header 3. Further, even when the 5 series is made of two genera: the seal is provided by an insulating material: The member is insulated between the two heat exchanger body 1 and the pipe header 3. Therefore, if the mounting screw/ΐ9 formed by the insulating material is used, the two structures may be unnecessary (Fig. 7 shows an omitted In the specific example, each of the heat sink bodies i is provided with one piece of the above-mentioned sealing member 5, but as shown in Fig. 8, the body 2 is provided with a sheet sealing member 6. In this structure, Providing the sealing member 5 to the female-heatsink body 1 respectively reduces the number of the sealing members 6. Therefore, the number of last month/pieces. In other respects n - 乂 reduction of the zeros is the same as the first specific example. Structure and Operating Phase of U Example (Third Specific Example) In this specific example, as shown in Figures 9 and 10, - 27 is provided to the bottom of the heat sink body 'B 6 and the cannula ...insert the tube to mount the heat sink body on the box 3; = 'in the loop hole 16 of the official set. The inserts 26 and 27 form the same as: the tube header 3, as shown in Fig. 10, forming a receiving tube 38 and a second receiving tube 39, wherein "38: one end of the receiving tube 39 and the discharge path 33 communication and the other two = first opening 5 openings are formed inside each of the receiving tubes 38 and 39: a pair of 97130232 20 1373833 retaining grooves 38a and _, 1' so as to be at predetermined positions of the receiving tubes 38... Upper fixing = sealing member 7. The U-Through-It tubes 38 and 39 have a diameter and a height so that the plugs 26 and 27 can be inserted therein. The outer peripheral surfaces of the dense portions 26 and 27 are brought into close contact, and the sealing members 7 are returned between the cannulas; 6 and === the bottom surface of the coffee beans: as a result, within the (10) receiving tubes 38 and 39 A watertight seal is provided between the circumferential surface and the outer circumferential surface of the cannula 。" = is by (four) the insertion tubes 26 and 27 of the heat sink body 1 are inserted into the receiving tubes 38 and 39 of the tube collecting phase 3, and by The tube body 1 is attached to the tube header 3 by the mounting screws 19, and the tube header 3 and the bulk body 1 are coupled to each other in a watertight manner. Incidentally, the tube header 3 is made of metal. In the case where the bottom substrate u of the body i is electrically connected to the header box 3, and when the heat sink bodies are connected in series, it is desirable to provide the interval 16 for the first specific example or - forming the tube header 3 like a synthetic resin body. On the other hand, when the heat sink bodies 1 are connected in parallel, the bottom substrate u can be directly connected to the f header 3 by a metal material. The S-phase is according to the structure of the specific example, wherein the cannula π and = are sealed by watertight sealing by using the receiving tube (10) and the sealing member 7 The receiving tubes 38 and 39 can be raised to the watertight property by making the sealing distance longer (the sealing distance is defined as 97130232 21 ^73833 in the receiving tube = the distance of the sealing member) () again Since the heat sink body 1 is inserted into the receiving tubes 38 and 39 of the header 3 by the Ij6 and 27, the heat sink body 1 can be temporarily fixed and positioned in the second phase. 3. Therefore, the installation procedure of the heat sink body on the ticket box 3 can be easily implemented. In terms of /, the second embodiment is identical in structure and operation to the first office example and the first In addition, in the first and second articles, the same can be omitted by forming the header 3 by a synthetic resin, and using the metal material. Mounting screws 19. In the first embodiment, 'when the heat sink bodies 1 are joined together instead of being connected in series' can be used in a structure in which the bottom substrate u and the genus are made. The tube header 3 is in direct contact. On the other hand, in the second item, in order to obtain such a structure, To - the electrically conductive material to provide a sealing member 6 (e.g., using a metal material)] [Brief Description of the drawings
圖1係顯示一第一具體例之一 的剖面圖； 散熱器本體的實例使用 圖2A係該散熱器本體之前侧的立體圖； 圖2B係該散熱器本體之後侧的立體圖； 圖3A係該散熱器本體之前視圖； 圖3B係該散熱器本體之後視圖； 圖3C係該散熱器本體之侧視圖； 圖4係顯示該散&器本體之實例使用㈣視圖； 圖5係顯示該散熱器本體之實例使用的分解立體圖 97130232 22 圖 β / 係顯示一第二具體例之一散熱器本體的實例使用 之分解立體圖； 圖 7 λ%, Rk.— 你顯示該第二具體例之散熱器本體的實例使用之 剖面圖； 圖 8 λ%. Har — ^ 〜員示在該第二具體例之另一實例使用中所使用 选、封構件的立體圖； 圖 9 佐加- 係顯不一弟三具體例之一散熱器本體的 之刀解立_ ;収 剖L10係顯示該第三具體例之散熱器本體的實例使用之 【主要元件符號說明】 1 散熱器本體 2 〇 紫外線發光二極體 3 管集箱 3a 支撐台 • 3b 間隔物 • 3c 耦接螺釘 4 環狀密封構件 5 片狀密封構件 ' 6 密封構件 -7 密封構件 11 底部基板 12 覆蓋基板 13 絕緣材料層 97130232 23 暴露孔 泛光透鏡 循環孔口 流動通道 安裝孔 安裝螺釘 連接孔 連接孔 凹部 凹部 接觸面 插管 插管 安裝面 供應路徑 排放路徑 供應通口 排放通口 凹部 環狀密封構件 第一接收管 固定槽 第二接收管 固定槽 24 1373833 41 供應孔 42 排放孔 43 通孔 97130232 251 is a cross-sectional view showing a first embodiment of the heat sink body; FIG. 2B is a perspective view of the front side of the heat sink body; FIG. 2B is a perspective view of the rear side of the heat sink body; Figure 3B is a rear view of the heat sink body; Figure 3C is a side view of the heat sink body; Figure 4 is a view showing the use of the diffuser &body; (Figure 4) shows the heat sink body Exploded perspective view used in the example 97130232 22 Figure β / shows an exploded perspective view of an example of a heat sink body of a second specific example; Figure 7 λ%, Rk. - You show the heat sink body of the second specific example Sectional view of the example used; Figure 8 λ%. Har — ^ ~ The member shows a perspective view of the selected and sealed members used in another example of the second specific example; Figure 9 Zoga - shows the difference between the three For example, the blade of the heat sink body is disassembled _; the section L10 shows the example of the heat sink body of the third specific example. [Main component symbol description] 1 heat sink body 2 〇 ultraviolet light emitting diode 3 tube Box 3a Support table • 3b spacer • 3c coupling screw 4 annular sealing member 5 sheet sealing member ' 6 sealing member -7 sealing member 11 bottom substrate 12 covering substrate 13 insulating material layer 97130232 23 exposure hole flood lens circulation hole Port flow channel mounting hole mounting screw connection hole connection hole recessed portion recess contact surface intubation cannula mounting surface supply path discharge path supply port discharge port recessed portion annular sealing member first receiving tube fixing groove second receiving tube fixing groove 24 1373833 41 Supply hole 42 Discharge hole 43 Through hole 97130232 25
Claims (1)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2007210065 | 2007-08-10 | ||
| JP2008185350A JP4407764B2 (en) | 2007-08-10 | 2008-07-16 | Heat sink and semiconductor device provided with heat sink |
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| TW200908253A TW200908253A (en) | 2009-02-16 |
| TWI373833B true TWI373833B (en) | 2012-10-01 |
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| JP (1) | JP4407764B2 (en) |
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| GB0809650D0 (en) * | 2008-05-29 | 2008-07-02 | Integration Technology Ltd | LED Device and arrangement |
| KR101010866B1 (en) * | 2010-02-26 | 2011-01-25 | 유버 주식회사 | Uv led module cooling device |
| KR101272801B1 (en) * | 2011-09-30 | 2013-06-10 | 원철희 | Vacuum Chamber V-LED Curing Machine |
| CN103579898A (en) * | 2012-07-25 | 2014-02-12 | 苏州长光华芯光电技术有限公司 | Highly-self-adaptive active refrigerating type two-dimensional semiconductor laser array |
| BR112015027296A2 (en) * | 2013-05-02 | 2017-07-25 | Koninklijke Philips Nv | cooling device for cooling a laser array, laser system, and method of manufacturing a cooling device for cooling a laser array |
| JP6558222B2 (en) * | 2015-11-16 | 2019-08-14 | ウシオ電機株式会社 | Light-emitting element light source module |
| JP6915652B2 (en) * | 2015-11-16 | 2021-08-04 | ウシオ電機株式会社 | Light emitting element light source module |
| JP2018006418A (en) * | 2016-06-28 | 2018-01-11 | 富士ゼロックス株式会社 | Laser element unit, irradiation device and image formation device |
| CN113976062B (en) | 2016-09-09 | 2024-05-03 | 株式会社日本光电科技 | Ultraviolet irradiation device and method |
| JP6765395B2 (en) * | 2018-06-14 | 2020-10-07 | 株式会社フジクラ | Optical module unit and laser device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5166863A (en) * | 1991-07-15 | 1992-11-24 | Amdahl Corporation | Liquid-cooled assembly of heat-generating devices and method for assembling and disassembling |
| JP4934954B2 (en) * | 2003-10-15 | 2012-05-23 | 日亜化学工業株式会社 | Heat sink and semiconductor device provided with heat sink |
| JP4598422B2 (en) * | 2004-03-19 | 2010-12-15 | 浜松ホトニクス株式会社 | Laser array module and cooling manifold |
| CN102056467A (en) * | 2006-01-24 | 2011-05-11 | 日本电气株式会社 | Liquid-cooled heat radiator |
| CN2919359Y (en) * | 2006-05-26 | 2007-07-04 | 佛山市顺德区汉达精密电子科技有限公司 | Water-cooled computer heat radiating device |
-
2008
- 2008-07-16 JP JP2008185350A patent/JP4407764B2/en not_active Expired - Fee Related
- 2008-08-08 TW TW97130232A patent/TWI373833B/en not_active IP Right Cessation
- 2008-08-11 CN CN200810145701.9A patent/CN101365328B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101365328B (en) | 2014-06-25 |
| CN101365328A (en) | 2009-02-11 |
| JP2009065128A (en) | 2009-03-26 |
| TW200908253A (en) | 2009-02-16 |
| JP4407764B2 (en) | 2010-02-03 |
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