JP2007329469A - Laser diode cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser diode cooling device capable of holding and cooling a laser diode while easily exchanging the laser diode that is held. <P>SOLUTION: The laser diode cooling device 10 comprises a plurality of cooling modules 12 having the same structure in which the modules are arrayed in a line by a fixing means. The cooling module 12 comprises a module body 14 of synthetic resin. In the module body 14, a housing part 16, a cooling part 18, a flow-in side channel 20, and a flow-out side channel 22 are formed. In the module body 14, a wear preventing piece 24 of stainless steel, an O-ring 26 of rubber, and a cathode terminal 28 and anode terminal 30 consisting of metal plate are also formed. A lid 38 is detachably provided to the module body 14. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a laser diode cooling device, and in particular, a high-power laser diode used for solid-state laser excitation of a processing machine or a bio-measuring device that processes the surface and inner surface of various materials such as metal, synthetic resin, and glass. The present invention relates to a laser diode cooling device for cooling.

FIG. 19 is an exploded perspective view showing a conventional cooled laser diode array assembly as the background of the present invention. The cooling laser diode array assembly 1 shown in FIG. 19 has a plurality of modules 2, 2,. Each module 2 includes each laser diode array 2a. Each laser diode array 2a is soldered to each metal base 2b serving as an anode. Each base 2b is formed with a first through hole 3a for allowing the coolant to flow and a second through hole 3b for passing the fixing screw 6 therethrough. Each cathode 2c is provided so as to correspond to each base 2b, and an insulator 2d is sandwiched between the base 2b and the cathode 2c.
These modules 2, 2,... Are arranged in a line, and each base 2b is formed in a planar shape having two holes corresponding to the first through hole 3a and the second through hole 3b. And sandwiched between joints 4 and 4 for electrical insulation.
Further, on both sides of the modules 2, 2,... And the joints 4, 4, .. arranged in a line, the inlets leading to the first through holes 3a and the through holes corresponding to the second through holes 3b are provided. One flange 5a having a hole and the other flange 5b having a through-hole corresponding to the outlet portion and the second through-hole 3b communicating with the first through-hole 3a are arranged, and these are the second through-hole 3b. It is fixed with a fixing screw 6 or the like passed through.
In addition, one insulating plate 7 is provided on the back of these modules 2, 2,..., And electrical connection is performed by metal screws 8a and 8b penetrating the insulating plate 7 in the base 2b portion and the cathode 2c portion. Is called.
In this cooling laser diode array assembly 1, if the coolant flows from the inlet of one flange 5a to the outlet of the other flange 5b via the first through hole 3a of each base 2b, The laser diode arrays 2a, 2a,... Soldered to the bases 2b, 2b,... Can be cooled (see, for example, Patent Document 1 and Patent Document 2).

US Pat. No. 6,091,746 Special table 2000-500291

  However, in the cooled laser diode array assembly 1 shown in FIG. 19, when one of the laser diode arrays 2a is worn out or fails and the laser diode array 2a is replaced, the laser diode array 2a to be replaced is soldered. The fixed base 2b is removed from the fixing screw 6, and the fixing screw 6 is inserted into the second through hole 3b of the base 2b to which the new laser diode array 2a that has not been worn out or failed is soldered. There must be. Therefore, it takes a lot of time to replace the laser diode array 2a, which is complicated. In this case, depending on the position of the laser diode array 2a to be replaced, the base 2b of the other laser diode array 2a not to be replaced must be removed from the fixing screw 6 or passed through the fixing screw 6. Therefore, the replacement work becomes more complicated.

  SUMMARY OF THE INVENTION Therefore, a main object of the present invention is to provide a laser diode cooling apparatus that can hold and cool a laser diode and can easily replace the held laser diode.

A laser diode cooling device according to the present invention is a laser diode cooling device for holding and cooling a laser diode, comprising a cooling module and a fixing means for fixing the cooling module. A main body, a terminal formed on the module main body for supplying power to the laser diode, and a lid body that can be opened and closed with respect to the module main body, and the module main body is a storage for storing the laser diode A cooling section for cooling the laser diode housed in the housing section with a cooling medium, an inflow side passage for allowing the cooling medium to flow into the cooling section from the outside, and the cooling medium flowing out from the cooling section to the outside And a module main body with the laser diode housed in the housing part of the module body. The laser diode cooling device is configured such that the laser diode is pressed and held on the storage unit side by the lid and held on the terminal side and electrically connected to the terminal by closing the lid with respect to .
In the laser diode cooling device according to the present invention, the inflow side passages in the plurality of cooling modules are formed so as to communicate with each other when the plurality of cooling modules are arranged, and the outflow side passages in the plurality of cooling modules are in the plurality of cooling modules. Preferably, the fixing means is formed so as to be fixed in a state where an arbitrary number of cooling modules are arranged.
In the laser diode cooling device according to the present invention, the module main body is formed of a synthetic resin, and a wear prevention piece made of metal for preventing wear by the cooling medium is provided in the vicinity of the cooling portion of the module main body. It is preferable.
Furthermore, in the laser diode cooling device according to the present invention, it is preferable that the module main body is formed by joining a plurality of portions made of synthetic resin with, for example, ultrasonic welding or an adhesive. In this case, it is preferable that the inflow side passage and the outflow side passage are each formed in a shape such that the resistance to the cooling medium is reduced in the module body. In this case, the terminal is preferably partially embedded in the module body.
In the laser diode cooling device according to the present invention, the fixing means includes, for example, fixing blocks arranged on both sides of the arranged cooling modules, and a connecting member penetrating the cooling module and the fixing blocks.
Furthermore, the laser diode cooling device according to the present invention preferably includes positioning means for positioning a plurality of cooling modules in an arrayed state. In this case, the positioning means includes, for example, rails that fit into the plurality of cooling modules in a state where the plurality of cooling modules are arranged.
Further, in the laser diode cooling device according to the present invention, in the cooling module, the corner on the side where the laser light is output by the laser diode housed in the housing portion is an angle obtained by dividing 360 degrees by an integer of 4 or more. Preferably it is formed.
Furthermore, in the laser diode cooling device according to the present invention, it is preferable that a contact portion facing the laser diode is formed in a shape having a non-planar shape in the terminal.
The laser diode cooling device according to the present invention preferably includes a heat absorbing member provided so as to be in contact with the terminal.

In the laser diode cooling device according to the present invention, the laser diode can be held and stored in the cooling module if the laser diode is housed in the housing portion of the module body and the lid is closed with respect to the module body. The diode can be electrically connected to a terminal for supplying power.
In the laser diode cooling device according to the present invention, if the cooling medium flows into the cooling section through the inflow side passage and flows out from the cooling section through the outflow side passage in the cooling module, the cooling medium is stored and held in the storage section. The laser diode can be cooled by a cooling medium.
Furthermore, in the laser diode cooling device according to the present invention, in the cooling module, if the lid is opened with respect to the module main body, the laser diode housed in the housing portion can be easily replaced, and thus is retained. The laser diode can be easily replaced.

In the laser diode cooling device according to the present invention, as described above, when a plurality of cooling modules are arranged, the inflow side passages in the plurality of cooling modules communicate with each other and the outflow side passages in the plurality of cooling modules communicate with each other. In the case where the fixing means is configured to fix an arbitrary number of cooling modules in an arrayed state, the number of cooling modules to be fixed in an arrayed state can be changed to an arbitrary number. Therefore, the number of laser diodes to be held can be changed to an arbitrary number, and it is possible to cope with changing the number of laser diodes to be used.
In this case, if a plurality of cooling modules are arranged and fixed, a plurality of inflow passages communicate with each other and a plurality of outflow passages communicate with each other. Thus, it can flow into a plurality of cooling sections and flow out through a plurality of outflow passages communicating with the plurality of cooling sections. Thereby, the held plurality of laser diodes can be cooled with the cooling medium.
When cooling a plurality of laser diodes in this way, the cooling medium for cooling the individual laser diodes flows into the individual cooling units via the individual inflow side passages and is separated from the individual cooling units to the individual outflow sides. The cooling medium that flows out of the passage and cools one laser diode is not used to cool the other laser diode. Therefore, the plurality of laser diodes are equally cooled by the cooling medium and are cooled by the cooling medium having the same temperature, so that the wavelength shift due to the temperature change of the laser diode can be minimized. Therefore, the efficiency of solid-state laser excitation by these laser diodes is improved.

  In the laser diode cooling device according to the present invention, as described above, when the module main body is formed of synthetic resin and the wear prevention piece is provided in the vicinity of the cooling section of the module main body, Wear caused by the cooling medium in the vicinity can be prevented by the wear preventing piece.

Furthermore, in the laser diode cooling device according to the present invention, as described above, when the module main body is formed by joining a plurality of portions made of synthetic resin, the module main body even if the module main body has a complicated shape. Can be formed by resin molding. For example, the inflow-side passage and the outflow-side passage can be formed in the module body in such a shape that the resistance to the cooling medium is reduced, or the terminals can be partially embedded in the module body. If the inflow side passage and the outflow side passage are formed in the module body in such a shape that the resistance to the cooling medium is reduced, the resistance of the inflow side passage and the outflow side passage to the cooling medium is reduced. Therefore, it is possible to reduce the size of the pump and chiller. When the terminals are partially embedded in the module main body, the terminals can be three-dimensionally formed on the module main body, so that the cooling module can be downsized and the laser diode cooling device can be downsized.
In addition, when a plurality of parts made of synthetic resin are joined by ultrasonic welding or an adhesive as described above, the plurality of parts can be firmly joined, and water leakage from the parts is prevented. Can do.

  In the laser diode cooling device according to the present invention, as described above, the fixing means includes the fixing blocks arranged on both sides of the arranged cooling modules, and the connection members penetrating the cooling modules and the fixing blocks. If included, the number of cooling modules to be fixed in the arrayed state can be changed by changing the number of cooling modules through which the connecting member passes between the fixing blocks.

Furthermore, in the laser diode cooling device according to the present invention, as described above, when the positioning means for positioning the plurality of cooling modules in the arrayed state is provided, the plurality of cooling modules are positioned in the arrayed state. And deformation such as twisting can be prevented in the arrangement of the plurality of cooling modules.
In this case, as described above, when the positioning unit includes rails that fit into the plurality of cooling modules in a state in which the plurality of cooling modules are arranged, the plurality of cooling modules and rails fit together, thereby the plurality of cooling modules. Can be positioned in an arrayed state.

  In the laser diode cooling device according to the present invention, as described above, in the cooling module, the corner portion on the side where the laser light is output by the laser diode housed in the housing portion is an integer greater than or equal to 360 degrees. Cooling modules arranged in that set of integers can be arranged radially around a laser medium, such as a rod-shaped YAG crystal, from the laser diodes in that set of integers. The laser medium can be irradiated with laser light.

  Furthermore, in the laser diode cooling device according to the present invention, as described above, when the contact portion facing the laser diode is formed in a shape having a non-planar shape in the terminal, the variation in the dimensions of each part or the laser diode is reduced. Even if there is a variation in the pressing force on the terminal side, good results can be obtained for these variations.

  Further, in the laser diode cooling device according to the present invention, as described above, when the heat absorbing member is provided so as to be in contact with the terminal, heat generation of the terminal can be suppressed by the heat absorbing member. Heat generation can be suppressed.

  According to the present invention, it is possible to obtain a laser diode cooling device that can hold and cool a laser diode and can easily replace the held laser diode.

  The above-mentioned object, other objects, features, and advantages of the present invention will become more apparent from the following description of the best mode for carrying out the invention with reference to the drawings.

FIG. 1 is a perspective view showing an example of a laser diode cooling device according to the present invention. FIG. 2 is a perspective view showing a state where three cooling modules are removed from the laser diode cooling device. FIG. 3 is a perspective view showing a state in which the module main body is disassembled from the state shown in FIG. FIG. 4 is a perspective view of the state shown in FIG. 3 viewed from the opposite side. FIG. 5 is a cross-sectional view of the cooling module used in the laser diode cooling device, cut at the center in the width direction. FIG. 6 is a perspective view showing a state where the lid of the cooling module is removed. FIG. 7 is a perspective view showing a state in which the module main body is disassembled from the state shown in FIG. FIG. 8 is a perspective view of the state shown in FIG. 7 viewed from the opposite side. FIG. 9 is an illustrative view showing a relationship between a lid body and a module body in the cooling module.
Since the laser diode cooling apparatus 10 shown in FIG. 1 can hold and cool a plurality of laser diodes, an example of the laser diode will be described first.

18A is a perspective view of an example of a laser diode that is held and cooled by the laser diode cooling device 10 shown in FIG. 1 as viewed from above, and FIG. 18B shows the laser diode on the lower side. It is the perspective view seen from.
A laser diode 100 shown in FIG. 18 is a high-power laser diode in which a laser diode chip is contained in a TO263 package, which is a standard for packages such as FETs, and has a merit that the package is small and can be manufactured at low cost. The laser diode 100 includes a package 102 made of a rectangular parallelepiped resin mold in which a laser diode chip is provided on one end side inside. A rectangular plate-like window 104 made of glass, for example, is provided on the one end side of the package 102. The window 104 is a part that outputs laser light output from the laser diode chip in the package 102 to the outside. Three pin-shaped electrodes 106 a, 106 b and 106 c are provided on the other end side opposite to the window 104 in the package 102. The electrodes 106a and 106c on both sides are connected to the N side portion of the PN junction of the laser diode chip in the package 102, and the center electrode 106b is connected to the P side portion of the PN junction of the laser diode chip in the package 102. . The central electrode 106b is connected to the positive electrode of the power supply, the electrodes 106a and 106c on both sides are connected to the negative electrode of the power supply, and the voltage of the power supply is controlled so that a current of about 35 A flows, so that A laser beam of about 30 W is output in the vertical direction. In this case, one end side portion of the package 102 is particularly heated by the internal laser diode chip. A square plate-like cooling fin 108 made of a metal such as Cu is provided as a heat sink on the lower surface of the one end side portion of the package 102. When the laser fin 100 is cooled, the cooling fin 108 is such that a cooling medium such as pure water flows on the lower surface thereof and from the window 104 side toward the electrodes 106a, 106b, and 106c. A number of grooves 108a, 108a,... For improving the flow of the cooling medium are formed on the lower surface of the cooling fin 108 so as to extend from the window 104 side of the package 102 to the electrodes 106a, 106b, 106c.

  The wavelength of the laser light output from the laser diode 100 shown in FIG. 18 varies depending on the temperature of the laser diode chip in the package 102. In this case, the amount of change in wavelength with respect to temperature is, for example, about 0.28 nm / ° C. Therefore, when a plurality of laser diodes 100 are used for solid-state laser excitation, the package 102 is cooled in these laser diodes 100, the temperature of the laser diode chip in the package 102 is made constant, and the output laser light is output. It is desirable to set the wavelength to a predetermined wavelength.

  The laser diode cooling device 10 shown in FIG. 1 that holds and cools the laser diode 100 shown in FIG. 18 includes, for example, four cooling modules 12, 12,.

  The cooling module 12 includes a thick plate-like module body 14 made of, for example, PEEK (registered trademark) resin. As shown in FIGS. 2, 3, and 4, the module main body 14 is ultrasonically welded or bonded to the two divided portions of the one side portion 14a and the other side portion 14b formed of PEEK (registered trademark) resin. It is formed by joining with an agent. As shown in FIGS. 7 and 8, the one side portion 14a and the other side portion 14b are positioned in order to increase their bonding strength and prevent water leakage between them. The protrusions and dents are formed so as to fit appropriately. Further, the first side portion 14a and the second side portion 14b are formed with predetermined means that cannot be formed after bonding before bonding them, and further, predetermined components that cannot be assembled after bonding are incorporated. The module body 14 may be formed of a synthetic resin other than the PEEK (registered trademark) resin, for example, a synthetic resin such as a PPS resin, ceramic, glass, or other insulators. It may be formed by bonding with an adhesive. Alternatively, the module main body 14 may be formed of a material obtained by subjecting the metal surface to insulation processing, such as a functionally gradient material specially processed on the metal surface. If the module main body 14 is formed of such a material, the module main body 14 has very high thermal conductivity, and has much higher heat resistance than that made of synthetic resin.

  As shown in FIG. 6, a housing portion 16 for housing the laser diode 100 is formed on the upper portion of the module body 14. The storage unit 16 includes a rectangular recess 16a corresponding to the package 102 of the laser diode 100, and three grooves 16b, 16b, 16b corresponding to the three electrodes 106a, 106b, 106c of the laser diode 100. The recess 16a is formed on one end side in the longitudinal direction in the upper part of the module body 14. Further, the groove portions 16b, 16b, and 16b are formed at the center in the longitudinal direction in the upper portion of the module main body 14, respectively.

  Furthermore, as shown in FIG. 6, the module body 14 is formed with a cooling unit 18 for cooling the laser diode 100 stored in the storage unit 16 with a cooling medium such as pure water. The cooling part 18 is a space part formed from one end side opposite to the groove part 16 b to the center at the bottom part of the concave part 16 a of the storage part 16. The cooling unit 18 is formed in a portion including a portion corresponding to the groove 108 a of the cooling fin 108 of the laser diode 100 stored in the recess 16 a of the storage unit 16 at the bottom of the recess 16 a of the storage unit 16.

  Further, as shown in FIGS. 5 and 7, the module main body 14 is formed with an inflow side passage 20 for allowing the cooling medium to flow into the cooling unit 18 from the outside. The inflow side passage 20 includes a cylindrical passage portion 20a having a relatively large flow passage area passing through one end side portion in the longitudinal direction of the module body 14 in the thickness direction, and one end side of the cooling portion 18 from the center of the passage portion 20a. And a connecting J-shaped passage portion 20b. Therefore, when the plurality of module main bodies 14 are arranged in a row in the thickness direction, the passage portions 20a communicate with each other. Further, the passage portion 20b is formed in a streamlined shape in order to reduce the resistance to the cooling medium flowing from the passage portion 20a having a relatively large passage area to the cooling portion 18 having the smallest passage area. In this case, the end portion 20 c of the passage portion 20 b connected to the cooling portion 18 is formed to be thin in the longitudinal direction of the module main body 14 and to be long in the width direction of the module main body 14. Further, the end portion 20c of the passage portion 20b is formed so as to correspond to one end portion on the window 104 side in the groove 108a of the cooling fin 108 of the laser diode 100 housed in the recess 16a. As described above, the inflow side passage 20 includes the columnar passage portion 20a and the streamlined passage portion 20b having a relatively large flow passage area, and is formed in a shape that reduces resistance to the cooling medium.

  Further, the module main body 14 is formed with an outflow side passage 22 through which the cooling medium flows out from the cooling unit 18. The outflow side passage 22 includes a cylindrical passage portion 22a having a relatively large flow passage area that penetrates the other end portion in the longitudinal direction of the module body 14 in the thickness direction, and the other end of the cooling portion 18 from the center of the passage portion 22a. And a long passage portion 22b connected to the side. Therefore, when the plurality of module main bodies 14 are arranged in a line in the thickness direction, the passage portions 22a also communicate with each other. Further, the passage portion 22b has a streamlined shape partially bent at an obtuse angle in order to reduce the resistance to the cooling medium flowing from the cooling portion 18 having the smallest passage area to the passage portion 22a having a relatively large passage area. It is formed in a substantially streamlined shape. In this case, the end portion 22c of the passage portion 22b connected to the cooling portion 18 is also formed to be thin in the longitudinal direction of the module main body 14 and to be long in the width direction of the module main body 14 similarly to the end portion 20c. Is done. Further, the end portion 22c of the passage portion 22b is formed so as to correspond to the other end portion on the electrode 106a, 106b, 106c side in the groove 108a of the cooling fin 108 of the laser diode 100 housed in the recess 16a. Thus, the outflow side passage 22 has a cylindrical passage portion 22a and a substantially streamlined passage portion 22b having a relatively large flow passage area, and is formed in a shape such that resistance to the cooling medium is reduced. .

  As shown in FIGS. 5 and 6, the module main body 14 is provided with a wear prevention piece 24 made of a metal that is difficult to ionize, such as stainless steel, in the vicinity of the cooling unit 18. In this case, the wear preventing piece 24 is provided between the end portion 20 c of the inflow side passage 20 and the end portion 22 c of the outflow side passage 22 in the vicinity of the cooling portion 18 where the flow velocity of the cooling medium is the fastest. The wear prevention piece 24 is for preventing wear due to the cooling medium in the vicinity of the cooling portion 18 of the module main body 14 where the flow velocity of the cooling medium is the fastest.

  The module body 14 is provided with an O-ring 26 having a sealing property made of rubber or the like around the cooling unit 18 at the bottom of the recess 16a of the storage unit 16. The O-ring 26 is for preventing water leakage from the cooling unit 18.

  As shown in FIGS. 4, 5, and 7, the module body 14 is formed with a cathode terminal 28 made of a metal plate and an anode terminal 30 made of a metal plate as terminals for supplying power to the laser diode 100. .

  The cathode terminal 28 is electrically connected to the electrodes 106 a and 106 c on both sides of the laser diode 100. The cathode terminal 28 is formed over the upper surface of the back surface of the module main body 14 from the bottom surface of the groove portions 16b and 16b on both sides of the storage portion 16 in the module main body 14 through the other end side in the longitudinal direction of the upper surface of the module main body 14. The In this case, the cathode terminal 28 is embedded in the module body 14 in two portions close to the recess 16 a of the storage portion 16 and one portion close to the central groove portion 16 b. The cathode terminal 28 is fixed to the back surface of the module body 14 by screws 32 a and nuts 32 b embedded in the module body 14.

The anode terminal 30 is electrically connected to the central electrode 106 b of the laser diode 100. The anode terminal 30 is partly embedded in the module main body 14 from the bottom surface of the central groove 16 b in the module main body 14 and formed below the back surface of the module main body 14. In this case, the anode terminal 30 is also embedded in the module main body 14 at a portion close to the recess 16 a of the storage portion 16. The anode terminal 30 is fixed to the back surface of the module main body 14 by screws 34 a and nuts 34 b embedded in the module main body 14.
In addition, the anode terminal 30, the screw 34a, and the nut 34b are electrically insulated from each other by forming a planar or three-dimensional space with respect to the cathode terminal 28, the screw 32a, and the nut 32b.

  As shown in FIGS. 4, 7, and 9, lid slide grooves 36 and 36 are formed on both sides of the module body 14 in the width direction. These lid slide grooves 36 and 36 are used for opening and closing a lid 38 to be described later with respect to the module main body 14 by sliding.

  As shown in FIGS. 1 to 5 and 9, the lid 38 includes an elastic cover member 40 made of metal, for example. The cover member 40 is formed so as to have a substantially C-shaped cross section, and both end portions 40a, 40a are formed so as to fit into the lid slide grooves 36, 36, respectively. In this case, the cover member 40 is formed to be slidable in the longitudinal direction of the module main body 14 with respect to the module main body 14 by fitting both end portions 40a, 40a into the lid slide grooves 36, 36. The cover member 40 is formed with an attachment hole 40b for attaching an operation member 42 having elasticity made of synthetic resin.

As shown in FIG. 5, the operation member 42 includes a thin plate-shaped package pressing portion 42 a that is mostly disposed in the cover member 40. Together with the package retainer 42a, three rows of electrode retainers 42b, 42b, 42b (see FIGS. 4 and 9) projecting downward, a mounting projecting portion 42c projecting upward, and a hook 42d having a recess are integrated. Formed.
The package pressing portion 42 a is for pressing the package 102 of the laser diode 100 toward the concave portion 16 a and the cooling portion 18 side of the storage portion 16 using the elasticity of the cover member 40 and the operation member 42. The electrode pressing portions 42b, 42b, 42b are for pressing the electrodes 106a, 106b, 106c of the laser diode 100 toward the cathode terminal 28 and the anode terminal 30 by using the elasticity of the cover member 40 and the operation member 42. In order to prevent the ends of the package pressing portion 42a and the electrode pressing portions 42b, 42b, 42b from being caught by the package 102 and the electrodes 106a, 106b, 106c when the lid 38 is closed, the package pressing portion 42a and As shown in FIG. 5, the electrode holding portions 42b, 42b, 42b are formed such that their lower end portions are rounded, and gradually, on their lower surfaces, as they approach the lower end portions. An inclined surface is formed so as to be positioned at the upper side.
The operation member 42 is attached to the cover member 40 by inserting the attachment portion 42 c into the attachment hole 40 b of the cover member 40. In this case, most of the operation member 42 excluding the tip end portion 42e protruding above the package pressing portion 42a and most of the electrode pressing portion 42b are covered with the cover member 40, and the tip end portion 42e of the package pressing portion 42a is covered with the cover member. 40 is hooked to the tip surface.

The lid 38 can be opened and closed by sliding the module body 14 with the cover member 40 sandwiched between the fingers from both sides or by placing a finger on the concave portion of the hook portion 42d of the operation member 42. In this case, if the cover member 40 is slid in the direction in which the lid 38 is closed (the direction from the back side to the front side of the module main body 14), the tip end portion 42e of the package pressing portion 42a that is caught on the tip end surface of the cover member 40. The operating member 42 having the same slides in the same direction, and the lid 38 is closed. On the contrary, if the operating member 42 is slid in the direction in which the lid 38 is opened (direction from the front side to the back side of the module main body 14), the mounting hole 40b into which the mounting portion 42c of the operating member 42 is inserted is formed. The cover member 40 is also slid in the same direction, and the lid pair 38 is opened.
Thus, the lid 38 is provided so as to be openable and closable with respect to the module main body 14.

  In addition to the metal, the cover member 40 of the lid 38 is elastic, such as a synthetic resin such as POM resin or polycarbonate (PC) resin, ceramic, a material obtained by insulating the metal surface, or rubber. In addition to the synthetic resin such as POM resin or polycarbonate (PC) resin, for example, the operation member 42 of the lid 38 is subjected to insulation processing on the surface of ceramic or metal. It may be formed of other insulators having elasticity, such as a material, rubber or the like. As described above, when the POM resin is used as the material of the lid 38, the lid 38 has a relatively high heat-resistant temperature and good sliding characteristics. Further, if polycarbonate (PC) resin is used as the material of the lid 38, the deformation temperature of the lid 38 is further increased. For example, the deformation temperature of the POM resin exceeds the deformation temperature due to the maximum load current when five laser diodes 100 are connected. Even if there is a possibility that the lid body 38 may be deformed, the deformation of the lid 38 can be prevented even in such a high load state.

  In the cooling module 12, the lid 102 is closed with respect to the module body 14 in a state where the laser diode 100 is housed in the housing part 16 of the module body 14, whereby the package 102 is held by the package holding part 42 a and the cooling part 16. The electrodes 106a, 106b, and 106c are pressed against the cathode terminal 28 and the anode terminal 30 by the electrode holding portions 42b, 42b, and 42b, and desired for the cathode terminal 28 and the anode terminal 30. It is formed so that it may be electrically connected to the thing.

  Further, as shown in FIGS. 2 and 3, the module main body 14 of the cooling module 12 is fixed to the lower portion on one end side in the longitudinal direction and the upper portion on the other end side through two portions penetrating those portions in the thickness direction. Use holes 44a and 44b are formed. These fixing holes 44a and 44b are used when a plurality of cooling modules 12 are fixed.

  Further, the laser diode cooling device 10 includes a fixing means for fixing an arbitrary number of cooling modules 12 in a state of being arranged in a line. As shown in FIG. 1, the fixing means includes two fixing blocks 46, 46 arranged on both sides of the cooling modules 12 arranged in a row, and two passing through the cooling module 12 and the fixing blocks 46. And connecting members such as screws 48a and 48b. In this case, the two screws 48a and 48b are respectively passed through the fixing holes 44a and 44b formed in the cooling module 12 and the fixing holes 50a and 50b formed in the fixing block 46 corresponding thereto. . In this laser diode cooling device 10, since the two screws 48a and 48b are passed through the plurality of cooling modules 12, the arrangement of the plurality of cooling modules 12 is compared to the conventional one shown in FIG. It is difficult to bend and a plurality of laser beams are aligned, and the sealing performance between the cooling modules 12 is improved.

The fixing blocks 46 and 46 are respectively formed with a passage 52 leading to the passage portion 20a and a passage 54 leading to the passage portion 22a. An input pipe joint 56 and an output pipe joint 58 are connected to the passages 52 and 54 of one fixing block 46, respectively. The passages 52 and 54 of the other fixing block 46 may be closed with a sealing plug or the like, or may not be formed. However, another output fitting may be connected to the passage 54 of the other fixing block 46, and another input fitting may be connected to the passage 52 of the other fixing block 46. Good.
In one fixing block 46 to which the input pipe joint 56 and the output pipe joint 58 are connected, the surface facing the cooling module 12 has an O seal having a sealing property made of, for example, rubber around the passage portions 54 and 56. Each ring (not shown) is provided. Further, in the cooling module 12 adjacent to one fixing block 46, the passage portions 20 a and 22 b are provided on the surface opposite to the surface facing the one fixing block 46, that is, on the surface facing the other cooling module 12. A similar O-ring (not shown) is provided around each. Similarly, all the other cooling modules 12 are each provided with an O-ring.

  Further, the laser diode cooling apparatus 10 includes positioning means for positioning the plurality of cooling modules 12 in a state of being arranged in a line. The positioning means includes a rail 60 that fits the plurality of cooling modules 12 and the fixing blocks 46 in a state where the plurality of cooling modules 12 and the fixing blocks 46 are arranged in a line. The rail 60 is formed in a polygonal cross section. Further, positioning concave portions 62 having a shape corresponding to the shape of the upper portion of the rail 60 are formed in the lower portion of the module body 14 of the cooling module 12 and the lower portion of the fixing block 46, respectively. In this case, the positioning recess 62 is formed to fit over the rail 60 in a state where the cooling modules 12 and the fixing blocks 46 are arranged in a line. The shape of the upper portion of the rail 60 and the positioning recess 62 may be other shapes such as a trapezoidal cross section or a semicircular cross section. Further, in order for the cooling module 12 and the like to be connected to the rail 60, any of the cooling module 12 and the fixing block 46 may be connected to the rail 60 with a connecting member such as a screw.

  Further, in this laser diode cooling device 10, in the cooling module 12, the corner 64 on the side where the laser light is output by the laser diode 100 housed in the housing 16 is 72 degrees when viewed in the thickness direction. Formed at an angle.

In the laser diode cooling device 10, the plurality of laser diodes 100 are held only by housing the laser diode 100 in the housing portion 16 of the module body 14 in the plurality of cooling modules 12 and closing the lid 38 with respect to the module body 14. And a plurality of laser diodes 100 can be electrically connected to desired terminals of the cathode terminal 28 and the anode terminal 30, that is, the laser diode 100 and a terminal for supplying power to the laser diode 100 are connected. In this case, wiring is not necessary and they can be easily connected.
In this case, since the package 102 of the laser diode 100 is pressed against the O-ring 26 around the cooling unit 18 by the package pressing unit 42a of the lid 38, water leakage from the cooling unit 18 can be prevented. it can.
Further, in this case, since the electrode of the laser diode 100 is pressed against a desired terminal by the electrode pressing portion 42b of the lid 38, their contact resistance is reduced, and heat generation due to electrical resistance can be suppressed.
Further, in the laser diode cooling device 10, if the cooling medium flows into the cooling unit 18 through the inflow side passage 20 and flows out from the cooling unit 18 through the outflow side passage 22 in the plurality of cooling modules 12, the storage unit 16. The plurality of laser diodes 100 housed and held in the can be cooled by the cooling medium. In this case, the cooling medium flows from the window 104 side to the electrodes 106a 106b and 106c side in the multiple grooves 108a of the cooling fin 108.
Furthermore, in this laser diode cooling device 10, in each cooling module 12, the laser diode 100 housed in the housing portion 16 can be easily replaced by opening the lid 38 with respect to the module body 14. The held laser diodes 100 can be easily replaced individually.

Further, in this laser diode cooling device 10, the fixing means is formed so as to fix an arbitrary number of cooling modules 12 arranged in a row, so that the number of cooling modules 12 to be fixed in a row arranged. Can be changed to an arbitrary number, and the number of laser diodes 100 to be held can also be changed to an arbitrary number. Therefore, it is possible to cope with changing the number of laser diodes 100 to be used. For example, the degree of freedom in designing a laser oscillator or the like can be increased, and the speed of trial production can be increased.
Further, in this case, if the plurality of cooling modules 12 are fixed in a row, the plurality of inflow side passages 20 and the plurality of outflow side passages 22 communicate with each other. Can flow into the plurality of cooling portions 18 through the plurality of inflow side passages 20 communicating with each other, and can flow out from the output fitting 58 through the plurality of outflow side passages 22 communicating with the plurality of cooling portions 18. Thereby, the plurality of laser diodes 100 held can be cooled with the cooling medium.
When cooling the plurality of laser diodes 100 in this way, the cooling medium for cooling the individual laser diodes 100 is introduced into the individual cooling units 18 via the individual inflow passages 20 and the individual cooling units 18. The cooling medium that has flowed out from each of the flow paths 22 and cooled one laser diode 100 is not used to cool the other laser diode 100. Therefore, the plurality of laser diodes 100 are equally cooled by the cooling medium and are cooled by the cooling medium having the same temperature, so that the wavelength shift due to the temperature change of the laser diode 100 can be minimized. Therefore, the efficiency of solid-state laser excitation by those laser diodes 100 is improved.

  Further, in this laser diode cooling device 10, the module main body 14 is formed of synthetic resin, and the wear prevention piece 24 is provided in the vicinity of the cooling portion 18 of the module main body 14, so that the vicinity of the cooling portion 18 of the module main body 14 is provided. In this case, wear due to the cooling medium can be prevented by the wear prevention piece 24, and deterioration due to wear over time can be prevented.

Further, in this laser diode cooling device 10, the module main body 14 is formed by joining two parts of the one side portion 14a and the other side portion 14b made of synthetic resin, so that the module main body 14 has a complicated shape. Nevertheless, the one side portion 14a and the other side portion 14b of the module body 14 can be formed by resin molding. That is, the inflow side passage 20 and the outflow side passage 22 can be formed in the module main body 14 in free-form flow paths including a streamline type and a substantially streamline type, respectively. Further, the cathode terminal 28 and the anode terminal 30 are provided in the module main body 14. Can be embedded in a partially free arrangement.
Since the inflow side passage 20 and the outflow side passage 22 are formed in the module main body 14 in such a shape that the resistance to the cooling medium including the streamline type and the substantially streamline type is reduced, the inflow side passage 20 and the outflow side passage 22 with respect to the cooling medium. For example, minimizing the system by reducing the size of the pump or chiller for sending the cooling medium, or increasing the number of cooling modules that can be connected using the same capacity pump or chiller be able to. In addition, examples of the shape that reduces the resistance to the cooling medium include a shape that cannot be bent at an acute angle other than a shape including a streamline shape or a substantially streamline shape.
Further, since the cathode terminal 28 and the anode terminal 30 are partially embedded in the module main body 12, the cathode terminal 28 and the anode terminal 30 can be three-dimensionally formed in the module main body 14, and the width direction of the cooling module 12 Therefore, the laser diode cooling device 10 can be downsized. If the laser diode cooling device 10 is miniaturized in this way, when the laser medium (crystal) is excited with laser light, the overall efficiency can be increased by increasing the output density of the laser light.
Furthermore, since the one side portion 14a and the other side portion 14b made of synthetic resin are joined by ultrasonic welding or an adhesive, the one side portion 14a and the other side portion 14b can be firmly joined. Water leakage from between 14a and the other side part 14b can be prevented.

  Further, in this laser diode cooling device 10, the number of cooling modules 12 fixed in a row is changed by changing the number of cooling modules 12 through which the screws 48 a and 48 b of the connecting members pass between the fixing blocks 46. Can be changed.

  Further, since the laser diode cooling device 10 includes the positioning means, the plurality of cooling modules 12 can be positioned in a state of being arranged in a row with high accuracy, and the arrangement of the plurality of cooling modules 12 can be twisted. Deformation can be prevented. In this case, the plurality of cooling modules 12 can be positioned in a row by fitting the positioning recesses 62 of the plurality of cooling modules 12 with the upper portions of the rails 60 of the positioning means. In order to position the cooling module 12 in this way, instead of forming the positioning recess 62 in the cooling module 12, a groove extending in the longitudinal direction is formed in the upper portion of the rail 60, and the lower portion of the cooling module 12 is formed. A positioning convex portion corresponding to the groove may be formed.

  Moreover, in this laser diode cooling device 10, since the corner 64 of the cooling module 12 is formed at an angle of 72 degrees, the cooling modules 12 arranged in five sets are made of a laser medium such as a rod-shaped YAG crystal. The laser medium can be arranged radially, and the laser medium can be irradiated with laser light from five sets of laser diodes 100.

FIG. 10 is a perspective view showing another example of the laser diode cooling device according to the present invention. FIG. 11 is a perspective view showing a state where one fixing block is removed from the laser diode cooling apparatus shown in FIG. 12A is a front view showing one fixing block used in the laser diode cooling device shown in FIG. 10, and FIG. 12B is a cross-sectional view taken along line BB in FIG. 12A. It is.
A laser diode cooling device 10 shown in FIG. 10 is obtained by fixing and positioning the three cooling modules 12 in the laser diode cooling device 10 shown in FIG. 5 sets. The five sets are arranged in a star shape (radially) around a laser medium 200 such as a columnar YAG crystal disposed at the center of the cylindrical glass tube 202. Thereby, a pumping module having a number of cooling modules 12 is constructed. In this case, since the corner | angular part 64 of the cooling module 12 is formed at 72 degree | times, five sets of things can be arranged radially. Further, disk-like fixing blocks 46 and 46 are arranged on both sides of the five sets and fixed with screws. One fixing block 46 includes five sets of inflow side passages 20, one input fitting 56, and a passage 52 communicating with one end of the glass tube 202, and a through hole 66 for passing one end of the laser medium 200. Have. The other fixing block 46 includes five sets of the outflow side passages 22, one output pipe joint 58, a passage leading to the other end of the glass tube 202, and a through hole for passing the other end of the laser medium 200. And have. Further, outside the both ends of the laser medium 200, respective mirrors (not shown) for reflecting and reciprocating the laser light are arranged.

The laser diode cooling device 10 shown in FIG. 10 has the same effect as the laser diode cooling device 10 shown in FIG.
In the laser diode cooling apparatus 10 shown in FIG. 10, the laser beam is irradiated from 15 laser diodes 100 to the laser medium 200.
Furthermore, in the laser diode cooling apparatus 10 shown in FIG. 10, the laser medium 200 is cooled by the cooling medium passing through the glass tube 202.

FIG. 13 is a perspective view of still another example of the laser diode cooling device according to the present invention as viewed from above. FIG. 14 is a perspective view of the laser diode cooling device shown in FIG. 13 viewed from below. FIG. 15 is a perspective view showing a cooling module used in the laser diode cooling apparatus shown in FIG. FIG. 16 is a perspective view showing a state where the lid is opened with respect to the module body in the cooling module shown in FIG. 15. FIG. 17 is a perspective view showing a state in which the laser diode is removed from the housing portion of the module body from the state shown in FIG.
Compared with the laser diode cooling device 10 shown in FIG. 1, the laser diode cooling device 10 shown in FIG. 13, in particular, in the cathode terminal 28 and the anode terminal 30 of the cooling module 12, as shown in FIGS. 16 and 17. Contact portions 28a and 30a facing the electrodes 106a, 106b, 106c of the laser diode 100 in the three grooves 16b of the housing portion 16 of the main body 14 are each in a shape having a non-planar shape that is not a planar shape such as a wave shape, for example. It is formed. In this case, in each groove part 16b of the accommodating part 16 of the module main body 14, for example, the contact portion 28a of the cathode terminal 28 is formed in a shape having three wave shapes, and the contact portion 30a of the anode terminal 30 is set in four wave shapes. It is formed in the shape which has.

  Further, in the laser diode cooling device 10 shown in FIG. 13, the cathode terminal 28 has a short central portion in the width direction, as shown in FIG. 15, and near the other end side in the longitudinal direction of the upper surface of the module body 14. Embedded in the module body 14. Further, as shown in FIGS. 14 and 15 to 17, the anode terminal 30 is not in contact with the cathode terminal 28, and the longitudinal direction of the upper surface of the module body 14 from the bottom surface of the central groove 16 b in the module body 14. In the vicinity of the other end of the module main body 14, it is long and is embedded in the module main body 14 from the lower side of the back surface of the module main body 14 to the lower surface of the module main body 14.

  Further, in the laser diode cooling apparatus 10 shown in FIG. 13, the lid 38 is composed of, for example, a front central portion that contacts the package 102 of the laser diode 100 and an inner portion that contacts the electrodes 106a, 106b, and 106c of the laser diode 100. It is made of a material having a certain hardness made of an insulator such as a resin, and the other part is made of a material having a certain elasticity made of, for example, a metal. Further, the lid 38 does not cover the cathode terminal 28 and the anode terminal 30 at the other end portion in the longitudinal direction of the upper surface of the module body 14 as shown in FIG. Therefore, the module main body 14 is formed to be short in the longitudinal direction of the upper surface.

Further, in the laser diode cooling device 10 shown in FIG. 13, as shown in FIG. 13, an upper heat absorbing member 68a is fixed to the upper side of the fixing blocks 46, 46 on both sides with a screw or the like behind the lid 38. Is done. The upper endothermic member 68a includes a plate-like endothermic portion made of a material having high thermal conductivity such as Al or Cu, for example. On one main surface of the endothermic portion, an emergency sheet such as a rubber sheet or rubber tape having thermal conductivity is provided. A heat conductive sheet that conducts heat well is bonded with an adhesive. The upper heat absorbing member 68a is provided such that the heat conductive sheet is in contact with the cathode terminal 28 and the anode terminal 30 and the heat absorbing portion is in contact with the rear portion of the lid 38 that is closed.
Similarly, as shown in FIG. 14, a lower heat absorbing member 68b having the same structure as the upper heat absorbing member 68a is fixed to the lower side of the fixing blocks 46 on both sides with screws or the like. The lower heat absorbing member 68 b is provided so that the heat conductive sheet contacts the anode terminal 30.

  In the laser diode cooling device 10 shown in FIG. 13, the input pipe joint 56 is connected to the passage 52 of one fixing block 46, and the output pipe joint 58 is connected to the passage 54 of the other fixing block 46. .

The laser diode cooling device 10 shown in FIG. 13 has the same effects as the laser diode cooling device 10 shown in FIG. 1, but also has the following effects.
That is, in the laser diode cooling device 10 shown in FIG. 13, the contact portions 28a and 30a are formed in a shape having a non-planar shape such as a wave shape at the cathode terminal 28 and the anode terminal 30 of the cooling module 12, for example, mass production. Even if there are variations in the dimensions of each part of the laser diode cooling device 10 and the like, and variations in the force pressing the electrodes 106a, 106b, 106c of the laser diode 100 against the contact portions 28a and 30a of the cathode terminal 28 and the anode terminal 30, Good electrical connection can be obtained, good results can be obtained even for these variations, and it is possible to prepare for unexpected situations during mass production. In addition, as a shape which has a non-planar shape, the shape which has an uneven | corrugated | grooved part other than the shape which has a wave shape etc. may be sufficient, for example.
Furthermore, although the anode terminal 30 generates more heat than the cathode terminal 28, the contact portion 30a of the anode terminal 30 is formed in a shape having more wave shapes than the one contact portion 28a of the cathode terminal 28. Therefore, the contact resistance of the anode terminal 30 can be reduced, and heat generation due to electrical resistance can be suppressed.

  Further, in the laser diode cooling device 10 shown in FIG. 13, since the portion of the lid 38 that contacts the laser diode 100 is formed of an insulator, unnecessary short-circuiting by the lid 38 can be prevented, and the quality can be improved. Variations can be avoided.

Further, in the laser diode cooling apparatus 10 shown in FIG. 13, the upper heat absorbing member 68a is provided so as to contact the cathode terminal 28 and the anode terminal 30, and the lower heat absorbing member 68b is provided so as to contact the anode terminal 30, Heat generation of the cathode terminal 28 and the anode terminal 30 can be suppressed by the heat absorption member 68a and the lower heat absorption member 68b, and therefore, heat generation of the laser diode 100 can be suppressed. The heat energy absorbed by the upper heat absorbing member 68a and the lower heat absorbing member 68b is radiated to the fixing blocks 46, 46 on both sides cooled by a cooling medium such as pure water. However, this thermal energy may be radiated to portions other than the fixing block 46 and the air by changing the structure of the heat absorbing members such as the upper heat absorbing member 68a and the lower heat absorbing member 68b. In addition, the heat absorbing members such as the upper heat absorbing member 68a and the lower heat absorbing member 68b have a small amount of heat generated as well as a case where the amount of heat generated is large, for example, when four or more laser diodes 100 are connected and used. Also in some cases, it is preferably used.
Further, when the amount of heat generated from the laser diode 100 is large, other passages that lead to the passages 52 and 54 of the fixing block 46 are formed in the fixing block 46, the upper heat absorbing member 68a, and the lower heat absorbing member 68b. The cooling may be further performed by circulating a cooling medium such as pure water through the other passage.
In the laser diode cooling device 10 shown in FIG. 13, the upper heat absorbing member 68a particularly has a function as a stopper that prevents the lid body 38 from being opened carelessly because it contacts the rear part of the closed lid body 38. Have both.
Furthermore, the positions and shapes of the cathode terminal 28 and the anode terminal 30 may be arbitrarily changed. For example, the anode terminal 30 may not be formed on the lower surface of the module body 14. Further, the number of heat absorbing members and the positions and shapes to be formed may be arbitrarily changed according to the positions and shapes of the kassort terminal 28 and the anode terminal 30. For example, only one heat absorbing member may be formed so as to contact at least one of the cathode terminal 28 and the anode terminal 30.

Further, in the laser diode cooling apparatus 10 shown in FIG. 13, since the input pipe joint 56 and the output pipe joint 58 are provided in the fixing blocks 46, 46 on both sides, the inlet / outlet of a cooling medium such as pure water is provided on both sides. As a result, wavelength shift between the laser diodes 100 can be suppressed.
That is, if the input pipe joint 56 and the output pipe joint 58 are provided in the fixing block 46 on one side, the inlet / outlet of a cooling medium such as pure water is concentrated on the fixing block 46 on one side, for each laser diode. The flow rate of the cooling medium varies depending on the location due to the pressure loss due to the difference in the path length of the cooling medium, and a slight wavelength shift occurs when, for example, five laser diodes are connected. Such a wavelength shift becomes more remarkable as the number of cooling modules (laser diodes) is increased.
On the other hand, in the laser diode cooling apparatus 10 shown in FIG. 13, since the input pipe joint 56 and the output pipe joint 58 are provided in the fixing blocks 46, 46 on both sides, for example, an inlet / outlet of a cooling medium such as pure water is provided. Dispersed in the fixing blocks 46 on both sides, the difference in the path length of the cooling medium for each laser diode and the pressure loss due to the difference are reduced, the flow rate difference of the cooling medium depending on the place is almost eliminated, and between the laser diodes Wavelength shift can be suppressed. Further, in the laser diode cooling device 10 shown in FIG. 13, even if the number of the cooling modules 12 (laser diodes 100) between the fixing blocks 46 and 46 is increased, similarly, the path length of the cooling medium for each laser diode is increased. And the pressure loss due to the difference are reduced, there is almost no difference in the flow rate of the cooling medium depending on the location, and the wavelength shift between the laser diodes can be suppressed.

  In each of the laser diode cooling devices 10 described above, a cooling medium made of pure water is used. However, as the cooling medium, other liquids or gases may be used in addition to pure water.

  Further, in each of the laser diode cooling devices 10 described above, the lid body 38 is formed so as to slide open and close with respect to the module body 14, but the lid body may be formed so as to rotate and open and close. .

  In each of the laser diode cooling devices 10 described above, the laser diodes 10 are held so that the upper surfaces or lower surfaces (surfaces on the cooling fin 108 side) of the plurality of laser diodes 100 are aligned on one plane. In the laser diode cooling apparatus according to the present invention, the laser diodes 100 are held so that the side surfaces (surfaces on which neither the window 104 nor the electrodes 106a, 106b, 106c are formed) of the plurality of laser diodes 100 are aligned on one plane. May be configured.

  Further, in each laser diode cooling device 10 described above, since the angle of the corner portion 64 of the cooling module 12 is 72 degrees, five cooling modules 12 can be arranged radially, but in the present invention, The angle 64 may be 60 degrees or 90 degrees so that six or four cooling modules 12 can be arranged radially.

  Each of the laser diode cooling devices 10 described above is formed corresponding to the laser diode 100 having a special shape. However, the laser diode cooling device according to the present invention is formed corresponding to the laser diode having another shape. May be.

  The laser diode cooling device according to the present invention cools a high-power laser diode used for solid-state laser excitation, such as a processing machine or a bio-measuring device that processes the surface and inner surface of various materials such as metal, synthetic resin, and glass. Applicable to usage.

It is a perspective view which shows an example of the laser diode cooling device concerning this invention. It is a perspective view which shows the state which removed three cooling modules in the laser-diode cooling device shown in FIG. It is a perspective view which shows the state which decomposed | disassembled the module main body from the state shown in FIG. It is the perspective view which looked at the state shown in FIG. 3 from the opposite side. It is sectional drawing which cut | disconnected the cooling module used for the laser-diode cooling device shown in FIG. 1 in the center in the width direction. It is a perspective view which shows the state which removed the cover body of the cooling module used for the laser-diode cooling device shown in FIG. It is a perspective view which shows the state which decomposed | disassembled the module main body from the state shown in FIG. It is the perspective view which looked at the state shown in FIG. 7 from the opposite side. It is an illustration figure which shows the relationship between the cover body and module main body etc. in the cooling module used for the laser-diode cooling device shown in FIG. It is a perspective view which shows the other example of the laser-diode cooling device concerning this invention. It is a perspective view which shows the state which removed the one block for fixation in the laser-diode cooling device shown in FIG. (A) is a front view which shows one block for fixation used for the laser-diode cooling device shown in FIG. 10, (B) is sectional drawing in the BB line of (A). It is the perspective view which looked at the further another example of the laser-diode cooling device concerning this invention from the upper side. It is the perspective view which looked at the laser-diode cooling device shown in FIG. 13 from the lower side. It is a perspective view which shows the cooling module used for the laser-diode cooling device shown in FIG. It is a perspective view which shows the state which opened the cover body with respect to the module main body in the cooling module shown in FIG. It is a perspective view which shows the state which removed the laser diode from the accommodating part of the module main body from the state shown in FIG. (A) is the perspective view which looked at an example of the laser diode hold | maintained and cooled by the laser diode cooling device shown in FIG. 1, from the upper side, (B) is the perspective view which looked at the laser diode from the lower side. . It is a disassembled perspective view which shows the conventional cooling laser diode array assembly used as the background of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Laser diode cooling device 12 Cooling module 14 Module main body 14a One side part 14b The other side part 16 Storage part 16a Concave part 16b Groove part 18 Cooling part 20 Inflow side channel | path 20a, 20b Path part 20c End part 22 Outflow side channel | path 22a, 22b Path part 22c End 24 Wear prevention piece 26 O-ring 28 Cathode terminal 30 Anode terminal 32a, 34a Screw 32b, 34b Nut 36 Groove for lid slide 38 Lid 40 Cover member 40a Both ends 40b Mounting hole 42 Operation member 42a Package holding part 42b Electrode holding part 42c Mounting part 42d Hooking part 42e Tip part 44a, 44b Fixing hole 46 Fixing block 48a, 48b Screw 50a, 50b Fixing hole 52, 54 Passage 56 Input pipe joint 58 Output pipe joint 60 Rail 62 position Decided recess 64 corner portion 66 through hole 68a upper heat absorbing member 68b lower heat absorbing member 100 laser diode 102 package 104 windows 106a, 106b, 106c electrode 108 cooling fin 108a groove 200 laser medium 202 glass tubes

Claims (12)

A laser diode cooling device for holding and cooling a laser diode,
A cooling module, and a fixing means for fixing the cooling module,
The cooling module is
Module body,
A terminal formed on the module body for supplying power to the laser diode; and a lid provided to be openable and closable with respect to the module body.
The module body is
A storage part for storing the laser diode,
A cooling unit for cooling the laser diode stored in the storage unit with a cooling medium;
An inflow side passage for flowing the cooling medium from the outside into the cooling unit; and an outflow side passage for flowing the cooling medium from the cooling unit to the outside,
The laser diode is pressed against and held by the lid by the lid body by closing the lid body with respect to the module body with the laser diode housed in the housing portion of the module body. A laser diode cooling device that is pressed against the terminal side and electrically connected to the terminal. The inflow side passages in the plurality of cooling modules are formed to communicate when a plurality of the cooling modules are arranged,
The outflow side passages in the plurality of cooling modules are formed to communicate when a plurality of the cooling modules are arranged,
2. The laser diode cooling device according to claim 1, wherein the fixing unit is configured to fix an arbitrary number of the cooling modules in an arrayed state. The module body is made of synthetic resin,
3. The laser diode cooling device according to claim 1, wherein a wear prevention piece made of a metal for preventing wear by the cooling medium is provided in the vicinity of the cooling portion of the module main body.   The laser diode cooling device according to any one of claims 1 to 3, wherein the module body is formed by joining a plurality of portions made of a synthetic resin.   5. The laser diode cooling device according to claim 4, wherein each of the inflow side passage and the outflow side passage is formed in a shape such that resistance to the cooling medium is reduced in the module body.   The laser diode cooling device according to claim 4 or 5, wherein the terminal is partially embedded in the module body. The fixing means includes
The laser diode cooling device according to claim 1, comprising: fixing blocks arranged on both sides of the arranged cooling modules; and connection members penetrating the cooling modules and the fixing blocks. .   The laser diode cooling device according to any one of claims 1 to 7, further comprising positioning means for positioning the plurality of cooling modules in an arrayed state.   The laser diode cooling device according to claim 8, wherein the positioning unit includes rails that fit into the plurality of cooling modules in a state where the plurality of cooling modules are arranged.   2. The cooling module according to claim 1, wherein a corner portion on a side where laser light is output by the laser diode housed in the housing portion is formed at an angle obtained by dividing 360 degrees by an integer of 4 or more. Item 10. The laser diode cooling device according to Item 9.   11. The laser diode cooling device according to claim 1, wherein a contact portion facing the laser diode is formed in a shape having a non-planar shape in the terminal.   The laser diode cooling device according to any one of claims 1 to 11, further comprising a heat absorbing member provided so as to be in contact with the terminal.

Images