TWI828058B - 擴展裝置 - Google Patents
擴展裝置 Download PDFInfo
- Publication number
- TWI828058B TWI828058B TW111104878A TW111104878A TWI828058B TW I828058 B TWI828058 B TW I828058B TW 111104878 A TW111104878 A TW 111104878A TW 111104878 A TW111104878 A TW 111104878A TW I828058 B TWI828058 B TW I828058B
- Authority
- TW
- Taiwan
- Prior art keywords
- cold air
- wafer
- air supply
- sheet
- cooling
- Prior art date
Links
- 238000001816 cooling Methods 0.000 claims description 109
- 238000009529 body temperature measurement Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 138
- 238000000034 method Methods 0.000 description 22
- 238000012545 processing Methods 0.000 description 12
- 230000001681 protective effect Effects 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 10
- 238000004378 air conditioning Methods 0.000 description 7
- 238000013459 approach Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/033749 WO2023042263A1 (ja) | 2021-09-14 | 2021-09-14 | エキスパンド装置 |
| WOPCT/JP2021/033749 | 2021-09-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202312315A TW202312315A (zh) | 2023-03-16 |
| TWI828058B true TWI828058B (zh) | 2024-01-01 |
Family
ID=85601994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111104878A TWI828058B (zh) | 2021-09-14 | 2022-02-10 | 擴展裝置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023042263A1 (de) |
| KR (1) | KR20240021309A (de) |
| CN (1) | CN117981053A (de) |
| TW (1) | TWI828058B (de) |
| WO (1) | WO2023042263A1 (de) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201604943A (zh) * | 2014-06-13 | 2016-02-01 | Disco Corp | 膠帶擴張裝置 |
| TWI553721B (zh) * | 2012-12-26 | 2016-10-11 | 日立化成股份有限公司 | 擴展方法、以及半導體裝置的製造方法 |
| TW201929060A (zh) * | 2017-10-02 | 2019-07-16 | 日商迪思科股份有限公司 | 膠帶擴張裝置及膠帶擴張方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5243101Y2 (de) | 1972-11-02 | 1977-09-30 | ||
| JP3657190B2 (ja) * | 2000-11-13 | 2005-06-08 | Ｎｅｃセミコンパッケージ・ソリューションズ株式会社 | エキスパンド装置 |
| JP5243101B2 (ja) * | 2008-05-14 | 2013-07-24 | 株式会社ディスコ | 破断装置 |
| JP6298635B2 (ja) * | 2014-01-10 | 2018-03-20 | 株式会社ディスコ | 分割装置及び被加工物の分割方法 |
| JP2019029363A (ja) * | 2017-07-25 | 2019-02-21 | 株式会社ディスコ | 接着フィルムの破断方法 |
| JP7030006B2 (ja) * | 2018-04-12 | 2022-03-04 | 株式会社ディスコ | 拡張方法及び拡張装置 |
| JP7242130B2 (ja) * | 2019-02-06 | 2023-03-20 | 株式会社ディスコ | エキスパンド装置 |
-
2021
- 2021-09-14 KR KR1020247001850A patent/KR20240021309A/ko unknown
- 2021-09-14 CN CN202180102154.XA patent/CN117981053A/zh active Pending
- 2021-09-14 JP JP2023547970A patent/JPWO2023042263A1/ja active Pending
- 2021-09-14 WO PCT/JP2021/033749 patent/WO2023042263A1/ja active Application Filing
-
2022
- 2022-02-10 TW TW111104878A patent/TWI828058B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI553721B (zh) * | 2012-12-26 | 2016-10-11 | 日立化成股份有限公司 | 擴展方法、以及半導體裝置的製造方法 |
| TW201604943A (zh) * | 2014-06-13 | 2016-02-01 | Disco Corp | 膠帶擴張裝置 |
| TW201929060A (zh) * | 2017-10-02 | 2019-07-16 | 日商迪思科股份有限公司 | 膠帶擴張裝置及膠帶擴張方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202312315A (zh) | 2023-03-16 |
| KR20240021309A (ko) | 2024-02-16 |
| CN117981053A (zh) | 2024-05-03 |
| WO2023042263A1 (ja) | 2023-03-23 |
| JPWO2023042263A1 (de) | 2023-03-23 |
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