TWI827863B - 晶圓外觀檢查裝置及方法 - Google Patents

晶圓外觀檢查裝置及方法 Download PDF

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Publication number
TWI827863B
TWI827863B TW109123702A TW109123702A TWI827863B TW I827863 B TWI827863 B TW I827863B TW 109123702 A TW109123702 A TW 109123702A TW 109123702 A TW109123702 A TW 109123702A TW I827863 B TWI827863 B TW I827863B
Authority
TW
Taiwan
Prior art keywords
inspection
image
wafer
macro
reference image
Prior art date
Application number
TW109123702A
Other languages
English (en)
Chinese (zh)
Other versions
TW202109027A (zh
Inventor
仲田朋宏
Original Assignee
日商東麗工程股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東麗工程股份有限公司 filed Critical 日商東麗工程股份有限公司
Publication of TW202109027A publication Critical patent/TW202109027A/zh
Application granted granted Critical
Publication of TWI827863B publication Critical patent/TWI827863B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/01—Arrangements or apparatus for facilitating the optical investigation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/104—Mechano-optical scan, i.e. object and beam moving

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Quality & Reliability (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW109123702A 2019-08-20 2020-07-14 晶圓外觀檢查裝置及方法 TWI827863B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-150100 2019-08-20
JP2019150100A JP7368141B2 (ja) 2019-08-20 2019-08-20 ウエーハ外観検査装置および方法

Publications (2)

Publication Number Publication Date
TW202109027A TW202109027A (zh) 2021-03-01
TWI827863B true TWI827863B (zh) 2024-01-01

Family

ID=74661135

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109123702A TWI827863B (zh) 2019-08-20 2020-07-14 晶圓外觀檢查裝置及方法

Country Status (5)

Country Link
JP (1) JP7368141B2 (ja)
KR (1) KR20220044741A (ja)
CN (1) CN114222909A (ja)
TW (1) TWI827863B (ja)
WO (1) WO2021033396A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023122677A (ja) * 2022-02-24 2023-09-05 東レエンジニアリング株式会社 ウエーハ検査装置
CN117352415B (zh) * 2023-12-05 2024-02-23 南京阿吉必信息科技有限公司 一种红光led倒装芯片结构的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007155610A (ja) * 2005-12-07 2007-06-21 Seiko Epson Corp 外観検査装置および外観検査方法
JP2007331491A (ja) * 2006-06-13 2007-12-27 Toyoda Gosei Co Ltd ガス発生器およびその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3565672B2 (ja) * 1996-11-12 2004-09-15 宮崎沖電気株式会社 ウエハのマクロ検査方法および自動ウエハマクロ検査装置
JP2915864B2 (ja) 1997-01-10 1999-07-05 オリンパス光学工業株式会社 ウエハ検査装置
JPH11274254A (ja) * 1998-03-19 1999-10-08 Sharp Corp 外観検査装置および外観検査方法
JP2001099788A (ja) * 1999-09-28 2001-04-13 Sharp Corp 自動マクロ外観検査装置
JP2002014057A (ja) * 2000-06-30 2002-01-18 Nidek Co Ltd 欠陥検査装置
JP2002267615A (ja) * 2001-03-12 2002-09-18 Olympus Optical Co Ltd 欠陥検出方法及びその装置
JP4649051B2 (ja) * 2001-03-21 2011-03-09 オリンパス株式会社 検査画面の表示方法及び基板検査システム
DE102004056698B3 (de) * 2004-11-24 2006-08-17 Stratus Vision Gmbh Inspektionsvorrichtung für ein Substrat, das mindestens eine aufgedruckte Schicht aufweist
JP2005214980A (ja) * 2005-01-31 2005-08-11 Miyazaki Oki Electric Co Ltd ウエハのマクロ検査方法および自動ウエハマクロ検査装置
JP2007107945A (ja) * 2005-10-12 2007-04-26 Olympus Corp 基板検査装置
JP2007333491A (ja) * 2006-06-13 2007-12-27 Sumitomo Electric Ind Ltd 板状部材の外観検査装置
US8501503B2 (en) * 2011-04-28 2013-08-06 Nanda Technologies Gmbh Methods of inspecting and manufacturing semiconductor wafers
US9196031B2 (en) * 2012-01-17 2015-11-24 SCREEN Holdings Co., Ltd. Appearance inspection apparatus and method
JP2015148447A (ja) * 2014-02-04 2015-08-20 東レエンジニアリング株式会社 自動外観検査装置
CN106770362B (zh) * 2016-12-27 2019-12-31 武汉精测电子集团股份有限公司 基于aoi的宏观缺陷检测装置及方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007155610A (ja) * 2005-12-07 2007-06-21 Seiko Epson Corp 外観検査装置および外観検査方法
JP2007331491A (ja) * 2006-06-13 2007-12-27 Toyoda Gosei Co Ltd ガス発生器およびその製造方法

Also Published As

Publication number Publication date
JP7368141B2 (ja) 2023-10-24
KR20220044741A (ko) 2022-04-11
CN114222909A (zh) 2022-03-22
WO2021033396A1 (ja) 2021-02-25
JP2021032598A (ja) 2021-03-01
TW202109027A (zh) 2021-03-01

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