TWI825962B - The invention relates to a design layout defect repair method, storage medium and equipment - Google Patents

Abstract

The invention relates to the technical field of graphic repair, a design layout defect repair method, storage medium and equipment, including the following steps: providing the design layout, and obtaining the mask map through the design layout; Obtaining defect information on the design layout; Repair the mask drawing according to the defect information and the preset repair rules to obtain the repaired mask drawing. The invention provides a design layout defect repair method, storage medium and equipment to solve the problem that the existing design layout repair technology consumes more time.

Description

Design layout defect repair method, storage medium and equipment

The present invention relates to the technical field of graphics repair technology, and in particular to a design layout defect repair method, storage medium and equipment.

The existing graphics repair methods for design layouts rely heavily on the experience of engineers in the correction process. The automation process is not high and the repair operations are repeated too many times, resulting in a long and time-consuming repair cycle for the design layout.

In order to solve the problem of time-consuming design layout repair, the present invention provides a design layout defect repair method, storage medium and equipment.

In order to solve the above technical problems, the present invention provides the following technical solution: a design layout defect repair method. The method includes the following steps: providing a design layout, and obtaining a mask layout through the design layout; and obtaining defect information on the design layout. ;according to the stated The defect information and preset repair rules are used to repair the mask layout to obtain a repaired mask layout.

Preferably, obtaining defect information on the design layout specifically includes the following steps: simulating the mask layout to obtain an initial exposure profile; detecting the defects with the exposure profile and the design layout through photolithography rules. information.

Preferably, the defect information includes defect type information and defect location information, and the preset repair rules are defect modification methods corresponding to the defect type and defect location.

Preferably, repairing the design layout includes the following steps: repairing the mask layout includes the following steps: obtaining the defective edge of the mask layout corresponding to the defect according to the defect information; The rules and the defect type information are used to move the defective edge to obtain the repaired mask layout.

Preferably, obtaining the defective edge of the mask pattern corresponding to the defect according to the defect information includes the following steps: defining a mark area according to the defect position information; and the mask pattern at least partially falls within the mark area. The edge is the defective edge.

Preferably, the defining the marking area includes the following steps: obtaining the center point of the defect according to the defect location information; using the center point as a reference position, defining the marking area according to a preset size.

Preferably, moving the defective edge according to the repair rule to obtain the repaired mask layout includes the following steps: determining the movement direction and movement distance of the defective edge according to the defect type information and the repair rule; The moving direction and the moving distance move the defective edge.

Preferably, after repairing the defect, the method further includes the following steps: simulating the repaired mask pattern again to generate an exposure profile and performing defect detection on the exposure profile; if the defect repair does not reach a preset condition, then The repaired mask pattern is repaired again.

Preferably, the mask pattern is a mask pattern that has undergone optical proximity correction (Optical Proximity Correction, OPC), or a mask pattern that has not undergone OPC.

In order to solve the above technical problems, the present invention provides another technical solution as follows: a computer-readable storage medium on which computer program instructions are stored. When the computer program instructions are executed by the processor, the design layout defect repair method as described above is implemented. .

In order to solve the above technical problems, the present invention provides another technical solution as follows: a design layout defect repair device. The device includes a device body and a device operating program. When the device body executes the device operating program, the design as described above is realized. Layout defect repair methods.

Compared with the existing technology, the design layout defect repair method, storage medium and equipment provided by the present invention have the following beneficial effects:

1. A method for repairing design layout defects provided by the present invention. The method includes the following steps: providing a design layout, and obtaining a mask layout through the design layout; obtaining defect information on the design layout; and repairing defects according to the defect information and preset repair rules. The mask pattern is repaired to obtain a repaired mask pattern. This method classifies the defects in the design layout and confirms the information, and can determine the type of defect. The repair rules are preset based on the type of defect. Taking the actual defect location as the actual location, repairing according to the preset rules can quickly complete the repair of the defect. Overall, the defects of the design layout can be accurately judged and the mask layout can be repaired quickly, which greatly reduces the time required to repair the defects of the design layout.

2. A design layout defect repair method provided by the present invention obtains defect information on the design layout, specifically including the following steps: simulating the mask layout to obtain the initial exposure profile; detecting the exposure profile and the design layout through photolithography rules to obtain Defect information. Simulate the mask layout to obtain the initial exposure profile, and conduct photolithography rule detection on the exposure profile and design layout to obtain defect information. Defect information can be quickly obtained to facilitate subsequent classification and positioning of defects based on the defect information, so as to reduce subsequent The time it takes to fix the defect.

3. A design layout defect repair method provided by the present invention, the defect information includes defect type information and defect location information, and the preset repair rules are defect modification methods corresponding to the defect type and defect location. By identifying the defect information on the design layout, subsequent steps can be facilitated based on the type and location of the defect. Identifying the types of design layout defects can ensure that the subsequent repair method is the corresponding method. Determining the location of the design layout defects and the mask layout attributes corresponding to the defects can facilitate the subsequent judgment of the defective edges corresponding to the defects. Marking and moving improve the efficiency of design layout repair and reduce the time required.

4. A design layout defect repair method provided by the present invention. Repairing the mask layout includes the following steps: obtaining the defective edges of the mask layout corresponding to the defects according to the defect information; moving the defective edges according to the repair rules and defect type information to obtain the defective edges. Repair mask layout. For different defects, the defect information can be directly repaired according to the preset repair rules. The recessed edge is moved according to the defect to repair the defect, which speeds up the defect repair process and reduces the time spent on defect repair.

5. A method for repairing design layout defects provided by the present invention. Obtaining the defective edge of the mask layout corresponding to the defect based on the defect information includes the following steps: defining the marking area according to the defect location information; at least part of the edge of the mask layout falling within the marking area. is the defective edge. Calibrating the position information of the defect based on the defect information can facilitate the subsequent determination of the defect edge. Through the defined area, some edges of the mask layout fall into the defined area and are marked as defective edges. Determining defective edges through regions facilitates subsequent repair of defects and reduces the time spent on repairing defects in design layouts.

6. In a design layout defect repair method provided by the present invention, defining the calibration area includes the following steps: obtaining the center point of the defect based on the defect location information; using the center point as the reference position, defining the marking area according to the preset size. Based on the type and location of the defect and the relationship between the marked edges, and at the same time determining the moving direction of the edge through specific rules, defects in the design layout can be repaired faster, thereby reducing time consumption.

7. A design layout defect repair method provided by the present invention. Moving the defective edge according to the repair rules to obtain the repaired mask layout includes the following steps: determining the movement direction and movement distance of the defective edge according to the defect type information and repair rules; and moving distance to move the defective edge. Based on the type information and location information of the defect, the moving direction and distance of the defective edge can be determined, so that the defect can be repaired more quickly and stably.

8. A design layout defect repair method provided by the present invention also includes the following steps after repairing the defects: simulating the repaired mask layout again to generate an exposure profile and performing defect detection on the exposure profile. If the defect repair does not reach the predetermined level, Assuming the situation, then for The repaired mask layout is repaired again. Defects are detected again on the simulated exposure profile generated by the repaired mask layout to prevent the repair of defects from not reaching the preset condition. The repaired mask layout that has not reached the preset condition will continue to be repaired, resulting in multiple defects. The operation is repeated until the final output of the repaired mask pattern reaches the preset condition for repairing defects.

9. A method for repairing design layout defects provided by the present invention. The mask layout is a mask layout that has undergone optical proximity correction (Optical Proximity Correction, OPC), or a mask layout that has not undergone OPC. Using a design layout that has been corrected by the optical proximity effect can reduce design layout defects, thereby reducing the time required to repair design layout defects.

10. A computer-readable storage medium provided by the present invention has computer program instructions on it. When the computer program instructions are executed by the processor, the above-mentioned design layout defect repair method is implemented. The computer-readable storage medium has the same beneficial effects as the above-mentioned method for repairing design layout defects, which will not be described in detail here.

11. The invention provides a design layout defect repairing device, which includes a device body and a device operating program. When the device body executes the device operating program, the above-mentioned design layout defect repairing method is implemented. This device has the same beneficial effects as the above-mentioned design layout defect repair method, which will not be described in detail here.

100: Computer readable storage media

200: Design layout defect repair equipment

110: Computer program instructions

210:Equipment body

220:Device running program

In order to explain the technical solutions in the embodiments of the present invention more clearly, the drawings that need to be used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the following description The drawings in are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without exerting any creative effort.

FIG. 1 is a flow chart of a method for repairing design layout defects provided by the first embodiment of the present invention.

FIG. 2 is a flow chart of step S100 of a design layout defect repair method provided by the first embodiment of the present invention.

FIG. 3 is a flow chart of step S2 of a method for repairing design layout defects provided by the first embodiment of the present invention.

FIG. 4 is a flow chart of step S3 of a design layout defect repair method provided by the first embodiment of the present invention.

FIG. 5 is a flow chart of step S31 of a method for repairing design layout defects provided by the first embodiment of the present invention.

FIG. 6 is a flow chart of step S311 of a method for repairing design layout defects provided by the first embodiment of the present invention.

FIG. 7 is a flowchart of steps S313 and S314 included in step S32 of a design layout defect repair method provided by the first embodiment of the present invention.

FIG. 8 is a flow chart of step S4 of a method for repairing design layout defects provided by the first embodiment of the present invention.

FIG. 9 is a mask layout of an exemplary process of a design layout defect repair method provided by the first embodiment of the present invention.

Figure 10 is a mask layout with marked defective edges for an exemplary process of a design layout defect repair method provided by the first embodiment of the present invention.

FIG. 11 is a mask layout after the 2nd to 5th iteration of an exemplary flow of a design layout defect repair method provided by the first embodiment of the present invention.

Figure 12 is a schematic structural diagram of a computer-readable storage medium provided by the second embodiment of the present invention.

Figure 13 is a schematic structural diagram of a design layout defect repair device provided by the third embodiment of the present invention.

In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the present invention and are not intended to limit the present invention.

As an explanation, the defects in the present invention, that is, the defects in the design layout, exist on the design layout. The defects in the mask layout obtained through the design layout originate from the defects in the design layout, not in the process of obtaining the mask layout. Defects caused by the process.

Please refer to Figure 1. The first embodiment of the present invention provides a design layout defect repair method, which includes the following steps: S1: Provide the design layout, and obtain the mask layout through the design layout; S2: Obtain defect information on the design layout; S3: The mask layout is repaired according to the defect information and the preset repair rules to obtain a repaired mask layout.

It can be understood that the first embodiment of the present invention provides a design layout defect repair method, which classifies the design layout defects and confirms the information, and can determine Based on the type of defect, the preset repair rules are based on the type of defect. Taking the defect location as the actual location, repairing according to the preset rules can quickly complete the repair of the defect. Overall, the defects of the design layout can be accurately judged and masked. Quick repair of drawings greatly reduces the time required to repair design layout defects.

Please refer to Figure 2. The first embodiment of the present invention provides a method for repairing design layout defects. After step S1, it also includes: S100: performing optical proximity effect correction on the provided mask layout.

It can be understood that the first embodiment of the present invention provides a method for repairing design layout defects. The mask layout is a mask layout that has undergone optical proximity correction (Optical Proximity Correction, OPC) or a mask layout that has not undergone OPC. Using a design layout that has been corrected by the optical proximity effect can reduce design layout defects, thereby reducing the time required to repair design layout defects.

It can be understood that the first embodiment of the present invention provides a method for repairing design layout defects. There is no limit on whether the mask layout obtained by providing the design layout has been repaired through OPC. As a preference, the mask layout in this embodiment has been through the steps. S0 is the mask layout that has been repaired by OPC.

Please refer to Figure 3. The first embodiment of the present invention provides a design layout defect repair method. In step S2, defect information on the design layout is obtained, which specifically includes the following steps: S21: Simulate the mask layout to obtain the initial exposure profile; S22 : The exposure profile and design layout are detected by photolithography rules to obtain defect information.

It can be understood that the first embodiment of the present invention provides a design layout defect repair method, which simulates the mask layout to obtain the initial exposure profile, and performs photolithography rule detection on the exposure profile and the design layout to obtain defect information, which can quickly obtain defect information. , to facilitate subsequent classification and location of defects based on defect information, so as to reduce the time required to subsequently repair defects.

Specifically, the defect information includes defect type information and defect location information. Defect types can be divided into EPE (Edge placement error, edge placement error), PINCH (circuit break) and BRIDGE (short circuit), etc. The defect position is the corresponding position of the defect in the design layout in its mask layout.

It can be understood that the first embodiment of the present invention provides a method for repairing design layout defects. By identifying defect information on the design layout, the type and location of the defects can be used to better facilitate subsequent steps. Identifying the type of design layout defects can ensure that the subsequent repair method is the corresponding method. Determining the position on the mask layout corresponding to the design layout defects can facilitate the subsequent judgment, marking and movement of the defective edges corresponding to the defects. , which improves the efficiency of design layout repair and reduces the time required.

Please refer to Figure 4. The first embodiment of the present invention provides a design layout defect repair method. Repairing the design layout in step S3 includes the following steps: S31: Obtain the defective edge of the mask layout corresponding to the defect according to the defect information; S32: According to Repair rules and defect type information move the defect edges to obtain the repaired mask layout.

It can be understood that the first embodiment of the present invention provides a design layout defect repair method. For different defects, the defect edge is directly moved according to the preset repair rules according to the defect information to repair the defect. It speeds up the defect repair process and reduces the time spent on defect repair.

Specifically, the preset repair rules are defect modification methods corresponding to defect types and defect locations.

It can be understood that the first embodiment of the present invention provides a design layout defect repair method. Defects can be divided into EPE, PINCH, BRIDGE, etc., and the modification methods adopted are different according to the type of defect and the location of the defect.

Please refer to Figure 5. The first embodiment of the present invention provides a design layout defect repair method. Step S31 includes the following steps: S311: Define a mark area according to the defect location information; S312: At least part of the mask layout falls within the mark area. The edge is a defective edge.

It can be understood that the first embodiment of the present invention provides a method for repairing design layout defects. A defined area is formed through defect location information. Calibrating the location information of the defect based on the defect information can facilitate subsequent determination of the defect edge. Through the defined The area causes part of the edge of the mask pattern to fall into the defined area and is marked as a defective edge. Determining defective edges through regions facilitates subsequent repair of defects and reduces the time spent on repairing defects in design layouts.

Please refer to Figure 6. The first embodiment of the present invention provides a design layout defect repair method. Defining the calibration area in step S311 includes the following steps: S311a: Obtain the center point of the defect according to the defect location information; S311b: Using the center point as the reference position, define the marking area according to the preset size.

It can be understood that the first embodiment of the present invention provides a method for repairing design layout defects. The mark area is defined according to the preset size with the location of the defect as the center point, that is, a rectangular frame with the defect as the center point is formed, and the area contained in the rectangular frame is To define the area, if the rectangular frame and the edge of the mask pattern where the defect is located are included in the rectangular frame, or the edge of the mask pattern where the defect is located coincides with or intersects the boundary of the rectangular frame, then the mask within the rectangular frame The edges of the template pattern or the edges of the mask pattern that intersect or overlap with the rectangular frame are judged as defective edges.

Please refer to Figure 7. The first embodiment of the present invention provides a design layout defect repair method. Step S32 also includes the following steps: S313: Determine the movement direction and movement distance of the defective edge according to the defect type information and repair rules; S314: Determine the movement direction according to the movement direction. and moving distance to move the defective edge.

It can be understood that the first embodiment of the present invention provides a method for repairing design layout defects. By moving the corresponding edge of the mask layout corresponding to the defect, that is, the defective edge, so that the defect reaches a preset condition, the repair of the design layout defect can be completed. Repair. Based on the type information and location information of the defect, the moving direction and distance of the defective edge can be determined, so that the defect can be repaired more quickly and stably.

For example, in step S311, a marking area is defined according to the defect type. According to this marking area, the marked edge can be moved with specific rules. For example, if the EPE is a positive defect, that is, the edge placement error is greater than 0, the marked edge should go inside the marked area direction to move; on the contrary, the edge marked by a negative value EPE, that is, a defect with an edge placement error less than 0, should move in the direction outside the marked area. The edge marked by the PINCH defect should move toward the outside of the marked area, while the edge marked by the BRIDGE defect needs to move toward the inside of the marked area.

Please refer to Figure 8. The first embodiment of the present invention provides a design layout defect repair method. After step S3, it also includes: S4: simulate the repaired mask layout again to generate an exposure profile and perform defect detection on the exposure profile. If the defect If the repair does not reach the preset condition, the repaired mask pattern will be repaired again.

It can be understood that the first embodiment of the present invention provides a design layout defect repair method, which detects defects again on the repaired design layout to prevent the defect repair from not reaching the preset situation, and to prevent the defect repair from not reaching the preset situation. The repaired mask pattern continues to be repaired, resulting in multiple iterative operations until the final output of the repaired mask pattern reaches the preset condition for repairing defects.

For example, a mask layout as shown in Figure 9 is provided, and manual OPC correction is performed on the mask layout, that is, simulation is performed to obtain the first version of the exposure profile, and defect detection is performed on the first version of the exposure profile to detect the presence of EPE defects, as shown in Figure As shown in Figure 10, the defective edge of the EPE defect is marked, and the mask layout is repaired through multiple repeated operations, so that the EPE defect at this position is repaired.

Specifically, the steps are as follows: S201: Simulate the mask layout that has undergone the first OPC correction to obtain the exposure profile; S202: Perform defect detection on the exposure profile, and conclude that the simulated exposure profile contains an EPE defect; S203: Obtain the location information of the EPE defect; S204: Use the location information of the EPE defect to form a defined area centered on the EPE defect; S205: Pass Define the area to determine the defective edge of the mask layout where the EPE defect is located; S206: Move the defective edge based on the position information of the EPE defect and the defective edge to repair the EPE defect of the mask layout; S207: Repair the completed EPE defect Defects are detected on the mask layout. If the defects are not repaired to the preset condition, repeat the above steps.

Specifically, FIG. 11 shows the mask layout after the second to fifth iterative operations are completed. In this embodiment, after five iterative operations, the mask layout is repaired.

In summary, the first embodiment of the present invention provides a design layout correction method, which provides a design layout and obtains a mask layout of the design layout, simulates the mask layout to obtain the initial exposure profile, and performs photolithography rule detection on the exposure profile and the design layout. , obtain the defect information on the design layout, and define a marking area centered on the defect based on the position information on the mask layout corresponding to the defect information on the design layout, through the relationship between the marking area and the edge of the mask layout where the defect is located Determine the defective edge, move the defective edge according to the defect information and the positional relationship between the defect and the defective edge, so that the defect reaches the preset state, complete the defect repair of the design layout, and simulate the simulation generated by the repaired mask layout Exposure profile for another defect inspection Check, if the defect does not reach the preset state, it will be repaired again, forming an iterative operation, and repeated operations will be performed multiple times until the mask layout with the defect completely repaired is output.

Referring to FIG. 12 , a second embodiment of the present invention provides a computer-readable storage medium 100 having computer program instructions 110 thereon. When the computer program instructions 110 are executed by a processor, the above-mentioned mask layout correction method is implemented.

It can be understood that computer program instructions 110 are stored in the computer-readable storage medium 100 in the second embodiment of the present invention. The computer program instructions 110 can be called by the processor to perform a design layout defect repair described in the first embodiment. method. The computer-readable storage medium 100 has the same beneficial effects as the above-mentioned design layout defect repair method, which will not be described in detail here.

Specifically, the computer-readable storage medium 100 may be an electronic memory such as flash memory, EEPROM (Electrically Erasable Programmable Read Only Memory), EPROM, hard disk or ROM.

Optionally, the computer-readable storage medium 100 includes non-volatile computer-readable media.

Specifically, the computer-readable storage medium 100 has storage space for computer program instructions 110 that execute any method steps in the above methods. These program instructions can be read from or written to one or more computer program products. Optionally, the computer program instructions 110 can be compressed in an appropriate form.

Referring to Figure 13, a third embodiment of the present invention provides a design layout defect repairing device 200, which includes a device body 210 and a device running program 220. When the device body 210 executes the device running program 220, it implements the above design layout defect repairing method.

It can be understood that when the design layout defect repair device 200 in the third embodiment of the present invention is running and the device body 210 executes the device running program 220, the method described in the first embodiment can be implemented. The equipment has the same beneficial effects as the above-mentioned design layout defect repair method, which will not be described in detail here.

In the embodiments provided by the present invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A. B can also be determined based on A and/or other information.

It will be understood that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic associated with the embodiment is included in at least one embodiment of the invention. Thus, the appearances of "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily referring to the same embodiment. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also know that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily necessary for the present invention.

In various embodiments of the present invention, it should be understood that the size of the sequence numbers of the above-mentioned processes does not necessarily mean the order of execution. The execution order of each process should be determined by its functions and internal logic, and should not be used in the embodiments of the present invention. The implementation process constitutes any limitation.

The flowcharts and block diagrams in the accompanying drawings of the present application illustrate the architecture, functions and operations of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flowchart or block diagram may represent a module, segment, or portion of code that contains one or more components for implementing the provisions Executable instructions for logical functions. It should also be noted that in some implementations as replacement In the scheme, the functions marked in the boxes may also occur in an order different from that marked in the drawings. For example, two blocks shown one after another may actually execute substantially in parallel, or they may sometimes execute in the reverse order, depending upon the functionality involved. It is noted that each block in the block diagram and/or flowchart illustration, and combinations of blocks in the block diagram and/or flowchart illustration, can be configured with dedicated hardware-based hardware that performs the specified functions or operations. system, or can be implemented using a combination of dedicated hardware and computer instructions.

Compared with the existing technology, the design layout defect repair method provided by the present invention has the following beneficial effects:

1. A method for repairing design layout defects provided by the present invention. The method includes the following steps: providing a design layout, and obtaining a mask layout through the design layout; obtaining defect information on the design layout; and repairing defects according to the defect information and preset repair rules. The mask pattern is repaired to obtain a repaired mask pattern. This method classifies the defects in the design layout and confirms the information, and can determine the type of defect. The repair rules are preset based on the type of defect. Taking the actual defect location as the actual location, repairing according to the preset rules can quickly complete the repair of the defect. Overall, the defects of the design layout can be accurately judged and the mask layout can be repaired quickly, which greatly reduces the time required to repair the defects of the design layout.

2. A design layout defect repair method provided by the present invention obtains defect information on the design layout, specifically including the following steps: simulating the mask layout to obtain the initial exposure profile; detecting the exposure profile and the design layout through photolithography rules to obtain Defect information. Simulate the mask layout to obtain the initial exposure profile, and conduct photolithography rule detection on the exposure profile and design layout to obtain defect information. This can quickly obtain defect information to facilitate subsequent basis. Defect information classifies and locates defects to reduce the time required to subsequently repair defects.

3. A design layout defect repair method provided by the present invention, the defect information includes defect type information and defect location information, and the preset repair rules are defect modification methods corresponding to the defect type and defect location. By identifying the defect information on the design layout, subsequent steps can be facilitated based on the type and location of the defect. Identifying the types of design layout defects can ensure that the subsequent repair method is the corresponding method. Determining the location of the design layout defects and the mask layout attributes corresponding to the defects can facilitate the subsequent judgment of the defective edges corresponding to the defects. Marking and moving improve the efficiency of design layout repair and reduce the time required.

4. A design layout defect repair method provided by the present invention. Repairing the mask layout includes the following steps: obtaining the defective edges of the mask layout corresponding to the defects according to the defect information; moving the defective edges according to the repair rules and defect type information to obtain the defective edges. Repair mask layout. For different defects, based on the defect information, the defect edge is directly moved according to the preset repair rules to repair the defect, which speeds up the defect repair process and reduces the time spent on defect repair.

5. A method for repairing design layout defects provided by the present invention. Obtaining the defective edge of the mask layout corresponding to the defect based on the defect information includes the following steps: defining the marking area according to the defect location information; at least part of the edge of the mask layout falling within the marking area. is the defective edge. Calibrating the position information of the defect based on the defect information can facilitate the subsequent determination of the defect edge. Through the defined area, some edges of the mask layout fall into the defined area, and Marked as defective edge. Determining defective edges through regions facilitates subsequent repair of defects and reduces the time spent on repairing defects in design layouts.

6. In a design layout defect repair method provided by the present invention, defining the calibration area includes the following steps: obtaining the center point of the defect based on the defect location information; using the center point as the reference position, defining the marking area according to the preset size. Based on the type and location of the defect and the relationship between the marked edges, and at the same time determining the moving direction of the edge through specific rules, defects in the design layout can be repaired faster, thereby reducing time consumption.

7. A design layout defect repair method provided by the present invention. Moving the defective edge according to the repair rules to obtain the repaired mask layout includes the following steps: determining the movement direction and movement distance of the defective edge according to the defect type information and repair rules; and moving distance to move the defective edge. Based on the type information and location information of the defect, the moving direction and distance of the defective edge can be determined, so that the defect can be repaired more quickly and stably.

8. A design layout defect repair method provided by the present invention also includes the following steps after repairing the defects: simulating the repaired mask layout again to generate an exposure profile and performing defect detection on the exposure profile. If the defect repair does not reach the predetermined level, If so, the repaired mask pattern will be repaired again. Defects are detected again on the simulated exposure profile generated by the repaired mask layout to prevent the repair of defects from not reaching the preset condition. The repaired mask layout that has not reached the preset condition will continue to be repaired, resulting in multiple defects. The operation is repeated until the final output of the repaired mask pattern reaches the preset condition for repairing defects.

9. A design layout defect repair method provided by the present invention, the mask layout has undergone optical proximity correction (Optical Proximity Correction, OPC) The mask layout may be a mask layout that has not gone through OPC. Using a design layout that has been corrected by the optical proximity effect can reduce design layout defects, thereby reducing the time required to repair design layout defects.

10. A computer-readable storage medium provided by the present invention has computer program instructions on it. When the computer program instructions are executed by the processor, the above-mentioned design layout defect repair method is implemented. The computer-readable storage medium has the same beneficial effects as the above-mentioned method for repairing design layout defects, which will not be described in detail here.

11. The invention provides a design layout defect repairing device, which includes a device body and a device operating program. When the device body executes the device operating program, the above-mentioned design layout defect repairing method is implemented. This device has the same beneficial effects as the above-mentioned design layout defect repair method, which will not be described in detail here.

The design layout defect repair method, storage medium and equipment disclosed in the embodiments of the present invention have been introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation modes of the present invention. The description of the above embodiments is only for It helps to understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the field, there will be changes in the specific implementation and application scope according to the idea of the present invention. In summary, the content of this specification It should not be understood as a limitation of the present invention. Any modifications, equivalent substitutions and improvements made within the principles of the present invention shall be included in the protection scope of the present invention.

Claims (9)

A design layout defect repair method includes the following steps: providing a design layout, and obtaining a mask layout through the design layout; obtaining defect information on the design layout, including the following steps: simulating the mask layout to obtain The initial exposure profile; and detecting the initial exposure profile and the design layout through photolithography rules to obtain the defect information. The defect information only comes from the design layout itself, and the defect information includes defect types and defects. position information; and repair the mask layout according to the defect information and preset repair rules to obtain a repaired mask layout. The preset repair rules are based on the defect type and the defect The defect modification method corresponding to the position. The method for repairing design layout defects according to claim 1, wherein repairing the mask layout includes the following steps: obtaining the defective edge of the mask layout corresponding to the defect according to the defect information; and The defective edges are moved using the repair rules and the defect type information to obtain the repaired mask layout. The method for repairing design layout defects according to claim 2, wherein obtaining the defective edge of the mask layout corresponding to the defect according to the defect information includes the following steps: defining a mark area according to the defect location information; and The edge defining the mask pattern that at least partially falls within the mark area is the defective edge. The method for repairing design layout defects as described in claim 3, wherein defining the marked area includes the following steps: Obtain the center point of the defect according to the defect location information; and use the center point as a reference position to define the marking area according to a preset size. The design layout defect repair method as described in claim 2, wherein moving the defective edge according to the repair rule to obtain the repaired mask layout includes the following steps: according to the defect type information and the preset The repair rule determines the moving direction and moving distance of the defective edge; and moves the defective edge according to the moving direction and the moving distance. The method for repairing design layout defects as described in claim 1 further includes the following steps: simulating the repaired mask layout again, generating a re-exposure profile and performing defect detection on the re-exposure profile. When the design layout When the defect repair fails to reach the preset condition, the repaired mask pattern is repaired again. The design layout defect repair method as described in claim 1, wherein the mask layout is a mask layout that has undergone optical proximity correction (Optical Proximity Correction, OPC), or a mask layout that has not undergone OPC. A computer-readable storage medium on which computer program instructions are stored, characterized in that: when the computer program instructions are executed by a processor, the design layout defect repair method described in any one of claims 1 to 7 is implemented. A design layout defect repairing device, including: a device body and a device running program, characterized in that: when the device body executes the device running program, the design layout defect repairing method as described in any one of claims 1 to 7 is implemented .