CN114564908A - Design layout defect repairing method, storage medium and device - Google Patents
Design layout defect repairing method, storage medium and device Download PDFInfo
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- 238000004590 computer program Methods 0.000 claims description 16
- 238000001514 detection method Methods 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 9
- 238000001259 photo etching Methods 0.000 claims description 7
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Abstract
The invention relates to the technical field of graph repair, in particular to a method, a storage medium and equipment for repairing the defects of a design layout, which comprise the following steps of providing the design layout and obtaining a mask layout through the design layout; acquiring defect information on the design layout; and repairing the mask layout according to the defect information and a preset repairing rule to obtain a repaired mask layout. The invention provides a method, a storage medium and a device for repairing the defects of a design layout, which solve the problem that the existing design layout repairing technology consumes much time.
Description
[ technical field ] A
The invention relates to the technical field of graph repair, in particular to a design layout defect repair method, a storage medium and a device.
[ background of the invention ]
In the existing graph repairing method for the design layout, the correcting process is very dependent on the experience of an engineer, the automation process is not high, the repairing iteration times are too many, and the long period and the long time consumption for repairing the design layout are caused.
[ summary of the invention ]
In order to solve the problem that the time consumption for repairing the design layout is long, the invention provides a method, a storage medium and a device for repairing the defects of the design layout.
In order to solve the technical problems, the invention provides the following technical scheme: a design layout defect repairing method comprises the following steps: providing a design layout, and acquiring a mask layout through the design layout; acquiring defect information on the design layout; and repairing the mask layout according to the defect information and a preset repairing rule to obtain a repaired mask layout.
Preferably, the acquiring the defect information on the design layout specifically includes the following steps: performing analog simulation on the mask layout to obtain a primary exposure outline; and detecting the exposure outline and the design layout by a photoetching rule to obtain the defect information.
Preferably, the defect information includes defect type information and defect position information, and the preset repair rule is a defect modification mode corresponding to the defect type and the defect position.
Preferably, the repairing the design layout comprises the following steps: repairing the mask layout comprises the following steps: acquiring a defect edge of the mask layout corresponding to the defect according to the defect information; and moving the defect edge according to the repair rule and the defect type information to obtain the repaired mask layout.
Preferably, the step of obtaining the defect edge of the mask layout corresponding to the defect according to the defect information includes the following steps: defining a marking area according to the defect position information; and the edge of the mask layout at least partially falling into the marking area is the defect edge.
Preferably, said delimiting the marking area comprises the steps of: obtaining the central point of the defect according to the defect position information; and defining the marking area according to a preset size by taking the central point as a reference position.
Preferably, the step of moving the defect edge according to the repair rule to obtain the repaired mask layout comprises the following steps: judging the moving direction and the moving distance of the defect edge according to the defect type information and the repair rule; and moving the defect edge according to the moving direction and the moving distance.
Preferably, the method further comprises the following steps after repairing the defect: and performing simulation on the repaired mask layout again to generate an exposure outline and performing defect detection on the exposure outline, and repairing the repaired mask layout again if the defect repair does not reach the preset condition.
Preferably, the mask layout is a mask layout that has been subjected to Optical Proximity Correction (OPC), or a mask layout that has not been subjected to OPC.
In order to solve the above technical problems, the present invention provides another technical solution as follows: a computer readable storage medium having stored thereon computer program instructions which, when executed by a processor, implement a method of design layout defect repair as described above.
In order to solve the above technical problems, the present invention provides another technical solution as follows: a device for repairing the defects of the design layout comprises a device body and a device running program, wherein the device body executes the device running program to realize the method for repairing the defects of the design layout.
Compared with the prior art, the design layout defect repairing method, the storage medium and the device provided by the invention have the following beneficial effects:
1. the invention provides a method for repairing the defects of a design layout, which comprises the following steps of providing the design layout and obtaining a mask layout through the design layout; acquiring defect information on a design layout; and repairing the mask layout according to the defect information and a preset repairing rule to obtain a repaired mask layout. The method classifies the defects of the design layout and confirms the information, can judge the types of the defects, can quickly finish the repair of the defects by using the repair rule preset by the type of the defects and using the positions of the defects as the reality according to the preset rule, can accurately judge the defects of the design layout and quickly repair the mask layout, and greatly reduces the time spent on repairing the defects of the design layout.
2. The invention provides a method for repairing the defects of a design layout, which obtains the defect information of the design layout and specifically comprises the following steps: performing analog simulation on the mask layout to obtain a primary exposure outline; and detecting the exposure outline and the design layout by a photoetching rule to obtain defect information. The mask layout is subjected to simulation to obtain a primary exposure contour, the exposure contour and the design layout are subjected to photoetching rule detection to obtain defect information, the defect information can be rapidly obtained, and the defects can be conveniently classified and positioned according to the defect information in the follow-up process, so that the time spent on repairing the defects in the follow-up process is reduced.
3. According to the design layout defect repairing method provided by the invention, the defect information comprises defect type information and defect position information, and the preset repairing rule is a defect modifying mode corresponding to the defect type and the defect position. By identifying the defect information on the design layout, the subsequent steps can be conveniently carried out according to the information such as the type, the position and the like of the defect. The type of the defect of the design layout is identified, so that the subsequent repairing mode of the defect is a corresponding mode, the position of the defect of the design layout and the attribute of the mask layout corresponding to the defect are judged, the defect edge corresponding to the defect can be conveniently judged, marked and moved, the repairing efficiency of the design layout is improved, and the time consumed is reduced.
4. The invention provides a method for repairing the defects of a design layout, which comprises the following steps of: acquiring a defect edge of a mask layout corresponding to the defect according to the defect information; and moving the defect edge according to the repair rule and the defect type information to obtain a repaired mask layout. Aiming at different defects, the defect edge is directly moved according to the preset repair rule according to the information of the defects so as to repair the defects, thereby quickening the process of defect repair and reducing the time spent on defect repair.
5. The method for repairing the defects of the design layout, provided by the invention, comprises the following steps of obtaining the defect edges of the mask layout corresponding to the defects according to the defect information: defining a mark region according to the defect position information; the edge of the mask layout at least partially falling into the mark area is a defect edge. The position information of the defect is calibrated according to the defect information, so that the defect edge can be conveniently judged subsequently, and part of the edge of the mask layout falls into the defined region through the defined region and is marked as the defect edge. The defect edge is judged through the region, so that the subsequent repair of the defect is facilitated, and the time spent on the defect repair of the design layout is reduced.
6. The invention provides a design layout defect repairing method, which defines a calibration area and comprises the following steps: obtaining the central point of the defect according to the defect position information; and defining a marking area according to a preset size by taking the central point as a reference position. According to the type and the position of the defect and the relationship of the marked edge, the moving direction of the edge is judged through a specific rule, the defect of the design layout can be repaired more quickly, and the time consumption is further reduced.
7. The invention provides a design layout defect repairing method, which obtains a repaired mask layout by moving a defect edge according to a repairing rule and comprises the following steps: judging the moving direction and the moving distance of the defect edge according to the defect type information and the repair rule; and moving the defect edge according to the moving direction and the moving distance. The moving direction and the distance of the defect edge are judged according to the type information and the position information of the defect, so that the defect can be repaired more quickly and stably.
8. The design layout defect repairing method provided by the invention further comprises the following steps after the defects are repaired: and performing simulation on the repaired mask layout again to generate an exposure outline and performing defect detection on the exposure outline, and repairing the repaired mask layout again if the defect repair does not reach the preset condition. And detecting the defects again by the simulation exposure outline generated by the repaired mask layout so as to prevent the defects from being repaired without reaching the preset condition, and continuously repairing the repaired mask layout with the defects repaired without reaching the preset condition to form multiple iterations until the finally output repaired mask layout repairs the defects to reach the preset condition.
9. According to the design layout defect repairing method provided by the invention, the mask layout is a mask layout which is subjected to Optical Proximity Correction (OPC) or a mask layout which is not subjected to OPC. The defects of the design layout can be reduced by adopting the design layout corrected by the optical proximity effect, so that the time spent on repairing the defects of the design layout is reduced.
10. The invention provides a computer readable storage medium, which is provided with computer program instructions, and the computer program instructions are executed by a processor to realize the design layout defect repairing method. The computer-readable storage medium has the same beneficial effects as the above-mentioned design layout defect repairing method, and is not described herein again.
11. The design layout defect repair equipment provided by the invention comprises an equipment body and an equipment operation program, and the design layout defect repair method is realized when the equipment body executes the equipment operation program. The device has the same beneficial effects as the design layout defect repairing method, and the details are not repeated herein.
[ description of the drawings ]
Fig. 1 is a flowchart of a method for repairing a defect in a design layout according to a first embodiment of the present invention.
Fig. 2 is a flowchart of step S0 of the method for repairing a design layout defect according to the first embodiment of the present invention.
Fig. 3 is a flowchart of step S2 of the method for repairing a design layout defect according to the first embodiment of the present invention.
Fig. 4 is a flowchart of step S3 of the method for repairing a design layout defect according to the first embodiment of the present invention.
Fig. 5 is a flowchart of step S31 of the method for repairing a design layout defect according to the first embodiment of the present invention.
Fig. 6 is a flowchart of step S311 of a method for repairing a design layout defect according to a first embodiment of the present invention.
Fig. 7 is a flowchart after step S312 of a method for repairing a design layout defect according to a first embodiment of the present invention.
Fig. 8 is a flowchart of step S4 of the method for repairing a design layout defect according to the first embodiment of the present invention.
Fig. 9 is a mask layout of an exemplary flow of a design layout defect repairing method according to a first embodiment of the present invention.
Fig. 10 is a mask layout marked with defect edges of an exemplary flow of a design layout defect repair method according to a first embodiment of the present invention.
Fig. 11 is a mask layout after 2-5 iterations of an exemplary process of a design layout defect repair method according to a first embodiment of the present invention.
Fig. 12 is a schematic structural diagram of a computer-readable storage medium according to a second embodiment of the present invention.
Fig. 13 is a schematic structural diagram of a design layout defect repairing apparatus according to a third embodiment of the present invention.
The attached drawings indicate the following:
100. a computer-readable storage medium; 200. designing layout defect repair equipment;
110. computer program instructions; 210. an apparatus body; 220. the device runs the program.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As an illustration, the defect in the present invention, that is, the defect of the design layout, is present on the design layout, and the defect of the mask layout obtained by the design layout is derived from the defect on the design layout, rather than the defect caused by the process flow in the process of obtaining the mask layout.
Referring to fig. 1, a first embodiment of the present invention provides a method for repairing a defect in a design layout, which includes the following steps:
s1: providing a design layout, and acquiring a mask layout through the design layout;
s2: acquiring defect information on a design layout;
s3: and repairing the mask layout according to the defect information and a preset repairing rule to obtain a repaired mask layout.
It can be understood that the first embodiment of the present invention provides a method for repairing defects of a design layout, which classifies the defects of the design layout and confirms the information, so as to determine the types of the defects, and repair the defects according to the predetermined rule by using the repair rule preset for the types of the defects and the actual defect positions, so as to complete the repair of the defects quickly, and thus, the defects of the design layout can be accurately determined and the mask layout can be repaired quickly, and the time required for repairing the defects of the design layout can be greatly reduced.
Referring to fig. 2, a method for repairing a defect in a design layout according to a first embodiment of the present invention further includes after step S1,
s100: and carrying out optical proximity effect correction on the provided mask layout.
It is to be understood that the first embodiment of the present invention provides a design layout defect repairing method, and the mask layout is a mask layout which has undergone Optical Proximity Correction (OPC) or a mask layout which has not undergone OPC. The defects of the design layout can be reduced by adopting the design layout corrected by the optical proximity effect, so that the time spent on repairing the defects of the design layout is reduced.
It can be understood that, in the method for repairing a defect in a design layout provided in the first embodiment of the present invention, whether the mask layout obtained by providing the design layout is subjected to OPC repair is not limited, and as a preferable example, the mask layout in this embodiment is the mask layout subjected to OPC repair in step S0.
Referring to fig. 3, a first embodiment of the present invention provides a method for repairing a defect in a design layout, where the method for obtaining defect information on the design layout in step S2 specifically includes the following steps:
s21: performing analog simulation on the mask layout to obtain a primary exposure outline;
s22: and detecting the exposure outline and the design layout by a photoetching rule to obtain defect information.
It can be understood that the first embodiment of the present invention provides a method for repairing a defect in a design layout, where a mask layout is simulated to obtain a first exposure profile, and the exposure profile and the design layout are subjected to lithography rule detection to obtain defect information, so that the defect information can be obtained quickly, and it is convenient to classify and position the defect according to the defect information, so as to reduce the time required for repairing the defect subsequently.
Specifically, the defect information includes defect type information and defect location information. The defect types can be classified into EPE (Edge placement error), pinph (circuit open), and BRIDGE (short), etc. The defect position is the position corresponding to the defect of the design layout in the mask layout.
It can be understood that, the first embodiment of the present invention provides a method for repairing a defect in a design layout, and the method can better facilitate the subsequent steps according to the information such as the type and the position of the defect by identifying the defect information in the design layout. The type of the defect of the design layout is identified, so that the subsequent repairing mode of the defect is a corresponding mode, the position on the mask layout corresponding to the defect of the design layout is judged, the defect edge corresponding to the defect of the design layout can be conveniently judged, marked and moved, the repairing efficiency of the design layout is improved, and the time consumed is reduced.
Referring to fig. 4, a first embodiment of the present invention provides a method for repairing a defect in a design layout, where the step S3 of repairing the design layout includes the following steps:
s31: acquiring a defect edge of a mask layout corresponding to the defect according to the defect information;
s32: and moving the defect edge according to the repair rule and the defect type information to obtain a repaired mask layout.
It can be understood that, the first embodiment of the present invention provides a method for repairing a defect in a design layout, which directly moves a defect edge according to a preset repair rule according to information about the defect, so as to repair the defect, thereby accelerating a process of repairing the defect and reducing time spent on repairing the defect.
Specifically, the preset repair rule is a defect modification mode corresponding to the defect type and the defect position.
It can be understood that the first embodiment of the present invention provides a method for repairing a design layout defect, where the defect can be classified into EPE, cancel, BRIDGE, and the like, and the modification manner adopted according to the type of the defect and the position of the defect is different.
Referring to fig. 5, a first embodiment of the present invention provides a method for repairing a design layout defect, where step S31 includes the following steps:
s311: defining a marking area according to the defect position information;
s312: the edge of the mask layout at least partially falling into the mark area is a defect edge.
It can be understood that, the first embodiment of the present invention provides a method for repairing a defect in a design layout, where a defined region is formed according to defect location information, the location information of the defect is calibrated according to the defect information, so as to facilitate subsequent determination of a defective edge, and a part of an edge of a mask layout falls into the defined region through the defined region and is marked as a defective edge. The defect edge is judged through the region, so that the subsequent repair of the defect is facilitated, and the time spent on the defect repair of the design layout is reduced.
Referring to fig. 6, a first embodiment of the present invention provides a method for repairing a defect in a design layout, wherein the step S311 of defining a calibration area includes the following steps:
s311 a: obtaining the central point of the defect according to the defect position information;
s311 b: and defining a marking area according to a preset size by taking the central point as a reference position.
It can be understood that, the first embodiment of the present invention provides a method for repairing a defect in a design layout, where a position where the defect is located is used as a central point to define a mark region according to a preset size, that is, a rectangular frame with the defect as the central point is formed, a region included in the rectangular frame is a defined region, edges of the rectangular frame and a mask layout where the defect is located are included in the rectangular frame, or edges of the mask layout where the defect is located are overlapped or intersected with boundaries of the rectangular frame, and then edges of the mask layout located in the rectangular frame or edges of the mask layout which are overlapped or intersected with the rectangular frame are both determined as defect edges.
Referring to fig. 7, a first embodiment of the present invention provides a method for repairing a design layout defect, and step S312 further includes the following steps:
s313: judging the moving direction and the moving distance of the defect edge according to the defect type information and the repair rule;
s314: and moving the defect edge according to the moving direction and the moving distance.
It can be understood that the first embodiment of the present invention provides a method for repairing a defect in a design layout, in which a corresponding edge of a mask layout corresponding to the defect, that is, a defect edge, is moved so that the defect reaches a preset condition, and the repair of the defect in the design layout can be completed. The moving direction and the distance of the defect edge are judged according to the type information and the position information of the defect, so that the defect can be repaired more quickly and stably.
For example, in step S311, a mark region is defined according to the defect type, and according to the mark region, the edge of the mark can be moved with a specific rule, for example, if the edge placement error is greater than 0 for a defect with an EPE of positive value, the edge of the mark should be moved toward the inside of the mark region; conversely, an edge marked by a negative value EPE, i.e., a defect with an edge placement error less than 0, should be moved in a direction outside the marked area. The edge marked by the PINCH defect should be moved in the direction outside the marked region, while the edge marked by the BRIDGE defect should be moved in the direction inside the marked region.
Referring to fig. 8, a method for repairing a defect in a design layout according to a first embodiment of the present invention further includes after step S3,
s4: and performing simulation on the repaired mask layout again to generate an exposure outline and performing defect detection on the exposure outline, and repairing the repaired mask layout again if the defect repair does not reach the preset condition.
It can be understood that the first embodiment of the present invention provides a method for repairing a defect in a design layout, where the repaired design layout is subjected to defect detection again to prevent the defect from being repaired without reaching the preset condition, and the repaired mask layout whose defect repair has not reached the preset condition is continuously repaired to form multiple iterations until the finally output repaired mask layout achieves the preset condition for repairing the defect.
Illustratively, a mask layout as shown in fig. 9 is provided, manual OPC correction is performed on the mask layout, that is, simulation is performed to obtain an initial exposure profile, defect detection is performed on the initial exposure profile, an EPE defect is detected, a defect edge is marked on the EPE defect as shown in fig. 10, and the mask layout is iteratively repaired for multiple times, so that the EPE defect at the position is repaired.
Specifically, the method comprises the following steps:
s201: carrying out analog simulation on the mask layout subjected to the first OPC correction to obtain an exposure profile;
s202: detecting defects of the exposure profile to obtain that EPE defects exist in the simulation exposure profile;
s203: acquiring the position information of the EPE defect;
s204: forming a defined area by taking the EPE defect as a center through the position information of the EPE defect;
s205: judging the defect edge of the mask layout where the EPE defect is located through the defined region;
s206: moving the defect edge according to the position information of the EPE defect and the defect edge so as to repair the EPE defect of the mask layout;
s207: and detecting the defects of the repaired mask layout, and if the defect repair does not reach the preset condition, repeating the steps.
Specifically, fig. 11 is a mask layout after 2 nd to 5 th iterations, and in this embodiment, the repair of the mask layout is completed through five iterations.
To sum up, the first embodiment of the present invention provides a method for correcting a design layout, which comprises providing a design layout, obtaining a mask layout of the design layout, performing simulation on the mask layout to obtain a first exposure profile, performing lithography rule detection on the exposure profile and the design layout to obtain defect information on the design layout, defining a mark region with a defect as a center according to position information on the mask layout corresponding to the defect information on the design layout, determining a defect edge according to a relationship between the mark region and the edge of the mask layout where the defect is located, performing defect edge movement according to the defect information and the position relationship between the defect edge and the defect edge to enable the defect to reach a preset state, completing defect repair of the design layout, performing another defect inspection on a simulation exposure profile generated by simulation on the mask layout after repair, and performing another repair if the defect does not reach the preset state, and forming an iteration, and performing multiple iterations until the mask layout with the completely repaired defects is output.
Referring to fig. 12, a second embodiment of the invention provides a computer-readable storage medium 100 having computer program instructions 110 thereon, wherein the computer program instructions 110, when executed by a processor, implement a reticle map correction method as described above.
It is understood that the computer-readable storage medium 100 in the second embodiment of the present invention stores therein a computer program 110, and the computer program 110 can be invoked by a processor to execute a design layout defect repairing method described in the first embodiment. The computer-readable storage medium 100 has the same beneficial effects as the above-mentioned design layout defect repairing method, which are not described herein again.
In particular, the computer-readable storage medium 100 may be an electronic memory such as a flash memory, an EEPROM (electrically erasable programmable read only memory), an EPROM, a hard disk, or a ROM.
Optionally, the computer-readable storage medium 100 includes a non-volatile computer-readable medium.
In particular, the computer-readable storage medium 100 has storage space for computer program instructions 110 for performing any of the method steps of the above-described method. The program instructions may be read from or written to one or more computer program products. Alternatively, the computer program instructions 110 may be compressed in a suitable form.
Referring to fig. 13, a third embodiment of the present invention provides a design layout defect repairing apparatus 200, which includes an apparatus body 210 and an apparatus operating program 220, and when the apparatus body 210 executes the apparatus operating program 220, the above-mentioned design layout defect repairing method is implemented.
It is to be understood that, when the design layout defect repair apparatus 200 in the third embodiment of the present invention is run, the method described in the first embodiment can be implemented when the apparatus body 210 executes the apparatus running program 220. The device has the same beneficial effects as the above-mentioned design layout defect repairing method, which are not described herein again.
In the embodiments provided herein, it should be understood that "B corresponding to a" means that B is associated with a from which B can be determined. It should also be understood that determining B from a does not mean determining B from a alone, but may also be determined from a and/or other information.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also appreciate that the embodiments described in this specification are exemplary and alternative embodiments, and that the acts and modules illustrated are not required in order to practice the invention.
In various embodiments of the present invention, it should be understood that the sequence numbers of the above-mentioned processes do not imply a necessary order of execution, and the order of execution of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
The flowchart and block diagrams in the figures of the present application illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will be understood that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Compared with the prior art, the design layout defect repairing method provided by the invention has the following beneficial effects:
1. the invention provides a method for repairing the defects of a design layout, which comprises the following steps of providing the design layout and obtaining a mask layout through the design layout; acquiring defect information on a design layout; and repairing the mask layout according to the defect information and a preset repairing rule to obtain a repaired mask layout. The method classifies the defects of the design layout and confirms the information, can judge the types of the defects, can quickly finish the repair of the defects by using the repair rule preset by the type of the defects and using the positions of the defects as the reality according to the preset rule, can accurately judge the defects of the design layout and quickly repair the mask layout, and greatly reduces the time spent on repairing the defects of the design layout.
2. The invention provides a method for repairing the defects of a design layout, which obtains the defect information of the design layout and specifically comprises the following steps: carrying out analog simulation on the mask layout to obtain a primary exposure outline; and detecting the exposure outline and the design layout by a photoetching rule to obtain defect information. The mask layout is subjected to simulation to obtain a primary exposure contour, the exposure contour and the design layout are subjected to photoetching rule detection to obtain defect information, the defect information can be rapidly obtained, and the defects can be conveniently classified and positioned according to the defect information in the follow-up process, so that the time spent on repairing the defects in the follow-up process is reduced.
3. According to the design layout defect repairing method provided by the invention, the defect information comprises defect type information and defect position information, and the preset repairing rule is a defect modifying mode corresponding to the defect type and the defect position. By identifying the defect information on the design layout, the subsequent steps can be conveniently carried out according to the information such as the type, the position and the like of the defect. The type of the defect of the design layout is identified, so that the subsequent repairing mode of the defect is a corresponding mode, the position of the defect of the design layout and the attribute of the mask layout corresponding to the defect are judged, the defect edge corresponding to the defect can be conveniently judged, marked and moved, the repairing efficiency of the design layout is improved, and the time consumed is reduced.
4. The invention provides a method for repairing the defects of a design layout, which comprises the following steps of: acquiring a defect edge of a mask layout corresponding to the defect according to the defect information; and moving the defect edge according to the repair rule and the defect type information to obtain a repaired mask layout. Aiming at different defects, the defect edge is directly moved according to the preset repair rule according to the information of the defects so as to repair the defects, thereby quickening the process of defect repair and reducing the time spent on defect repair.
5. The method for repairing the defects of the design layout, provided by the invention, comprises the following steps of obtaining the defect edge of the mask layout corresponding to the defect according to the defect information: defining a mark region according to the defect position information; the edge of the mask layout at least partially falling into the mark area is a defect edge. The position information of the defect is calibrated according to the defect information, so that the defect edge can be conveniently judged subsequently, and part of the edge of the mask layout falls into the defined region through the defined region and is marked as the defect edge. The defect edge is judged through the region, so that the subsequent repair of the defect is facilitated, and the time spent on the defect repair of the design layout is reduced.
6. The invention provides a method for repairing the defects of a design layout, which defines a calibration area and comprises the following steps: obtaining the central point of the defect according to the defect position information; and defining a marking area according to a preset size by taking the central point as a reference position. According to the type and the position of the defect and the relation of the marked edge, the moving direction of the edge is judged through a specific rule, the defect of the design layout can be repaired more quickly, and the time consumption is further reduced.
7. The invention provides a design layout defect repairing method, which obtains a repaired mask layout by moving a defect edge according to a repairing rule and comprises the following steps: judging the moving direction and the moving distance of the defect edge according to the defect type information and the repair rule; and moving the defect edge according to the moving direction and the moving distance. The moving direction and the distance of the defect edge are judged according to the type information and the position information of the defect, so that the defect can be repaired more quickly and stably.
8. The design layout defect repairing method provided by the invention further comprises the following steps after the defects are repaired: and performing simulation on the repaired mask layout again to generate an exposure outline and performing defect detection on the exposure outline, and repairing the repaired mask layout again if the defect repair does not reach the preset condition. And detecting the defects again by the simulation exposure outline generated by the repaired mask layout so as to prevent the defects from being repaired without reaching the preset condition, and continuously repairing the repaired mask layout with the defects repaired without reaching the preset condition to form multiple iterations until the finally output repaired mask layout repairs the defects to reach the preset condition.
9. According to the design layout defect repairing method provided by the invention, the mask layout is a mask layout which is subjected to Optical Proximity Correction (OPC) or a mask layout which is not subjected to OPC. The defects of the design layout can be reduced by adopting the design layout corrected by the optical proximity effect, so that the time spent on repairing the defects of the design layout is reduced.
10. The invention provides a computer readable storage medium, which is provided with computer program instructions, and the computer program instructions are executed by a processor to realize the design layout defect repairing method. The computer-readable storage medium has the same beneficial effects as the above-mentioned design layout defect repairing method, and is not described herein again.
11. The design layout defect repair equipment provided by the invention comprises an equipment body and an equipment operation program, and the design layout defect repair method is realized when the equipment body executes the equipment operation program. The device has the same beneficial effects as the design layout defect repairing method, and the details are not repeated herein.
The design layout defect repairing method, the storage medium and the device disclosed by the embodiment of the invention are described in detail, a specific embodiment is applied in the text to explain the principle and the implementation mode of the invention, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for the persons skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present description should not be construed as a limitation to the present invention, and any modification, equivalent replacement, and improvement made within the principle of the present invention should be included in the protection scope of the present invention.
Claims (11)
1. A design layout defect repairing method is characterized in that: the method comprises the following steps:
providing a design layout, and acquiring a mask layout through the design layout;
acquiring defect information on the design layout;
and repairing the mask layout according to the defect information and a preset repairing rule to obtain a repaired mask layout.
2. The design layout defect repairing method according to claim 1, wherein: acquiring defect information on the design layout, specifically comprising the following steps:
performing analog simulation on the mask layout to obtain a primary exposure outline;
and detecting the exposure outline and the design layout by a photoetching rule to obtain the defect information.
3. The design layout defect repairing method according to claim 1, wherein: the defect information comprises defect type information and defect position information, and the preset repair rule is a defect modification mode corresponding to the defect type and the defect position.
4. A design layout defect repairing method according to claim 3, characterized in that: repairing the mask layout comprises the following steps:
acquiring a defect edge of the mask layout corresponding to the defect according to the defect information;
and moving the defect edge according to the repair rule and the defect type information to obtain the repaired mask layout.
5. The design layout defect repairing method according to claim 4, wherein: acquiring the defect edge of the mask layout corresponding to the defect according to the defect information comprises the following steps:
defining a marking area according to the defect position information;
and the edge of the mask layout at least partially falling into the marking area is the defect edge.
6. The design layout defect repairing method according to claim 5, wherein: the defining a marking region comprises the steps of:
obtaining the central point of the defect according to the defect position information;
and defining the marking area according to a preset size by taking the central point as a reference position.
7. The design layout defect repairing method according to claim 5, wherein: moving the defect edge according to the repair rule to obtain the repaired mask layout comprises the following steps:
judging the moving direction and the moving distance of the defect edge according to the defect type information and the repair rule;
and moving the defect edge according to the moving direction and the moving distance.
8. The design layout defect repairing method according to claim 4, wherein: after repairing the defect, the method further comprises the following steps:
and performing simulation on the repaired mask layout again to generate an exposure outline and performing defect detection on the exposure outline, and repairing the repaired mask layout again if the defect repair does not reach the preset condition.
9. The design layout defect repairing method according to claim 1, wherein: the mask layout is a mask layout that has been subjected to Optical Proximity Correction (OPC), or a mask layout that has not been subjected to OPC.
10. A computer-readable storage medium having computer program instructions stored thereon, characterized in that: the computer program instructions, when executed by a processor, implement the method of any one of claims 1-9.
11. A design layout defect repair device is characterized in that: the device comprises a device body and a device running program, wherein the device body executes the device running program to realize the method of any one of claims 1-9.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210090007.1A CN114564908A (en) | 2022-01-25 | 2022-01-25 | Design layout defect repairing method, storage medium and device |
| PCT/CN2022/103100 WO2023142384A1 (en) | 2022-01-25 | 2022-06-30 | Design layout defect repair method, storage medium and device |
| TW111132767A TWI825962B (en) | 2022-01-25 | 2022-08-30 | The invention relates to a design layout defect repair method, storage medium and equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210090007.1A CN114564908A (en) | 2022-01-25 | 2022-01-25 | Design layout defect repairing method, storage medium and device |
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| CN114564908A true CN114564908A (en) | 2022-05-31 |
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| CN202210090007.1A Pending CN114564908A (en) | 2022-01-25 | 2022-01-25 | Design layout defect repairing method, storage medium and device |
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| Country | Link |
|---|---|
| CN (1) | CN114564908A (en) |
| TW (1) | TWI825962B (en) |
| WO (1) | WO2023142384A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114818604A (en) * | 2022-06-29 | 2022-07-29 | 飞腾信息技术有限公司 | Method and device for correcting short-circuit defect on digital layout |
| WO2023142384A1 (en) * | 2022-01-25 | 2023-08-03 | 深圳晶源信息技术有限公司 | Design layout defect repair method, storage medium and device |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI229894B (en) * | 2002-09-05 | 2005-03-21 | Toshiba Corp | Mask defect inspecting method, semiconductor device manufacturing method, mask defect inspecting apparatus, generating method of defect influence map, and computer program product |
| JP4297693B2 (en) * | 2003-01-31 | 2009-07-15 | 株式会社ルネサステクノロジ | Photomask, photomask manufacturing method, and photomask manufacturing apparatus |
| CN101192007B (en) * | 2006-11-28 | 2011-07-06 | 中芯国际集成电路制造(上海)有限公司 | Mask plate, mask plate layout design method and defect repairing method |
| CN102193302A (en) * | 2010-03-03 | 2011-09-21 | 中芯国际集成电路制造(上海)有限公司 | Mask image defection detection method and detection system thereof |
| CN104317159A (en) * | 2010-03-03 | 2015-01-28 | 中芯国际集成电路制造(上海)有限公司 | Mask graphic defect detection method and mask graphic defect detection system for |
| US9274417B2 (en) * | 2013-09-18 | 2016-03-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for lithography patterning |
| CN107703715B (en) * | 2016-08-08 | 2020-09-25 | 中芯国际集成电路制造(上海)有限公司 | Method for repairing mask pattern defects |
| US11016035B2 (en) * | 2017-09-18 | 2021-05-25 | Elite Semiconductor Inc. | Smart defect calibration system and the method thereof |
| TWI671838B (en) * | 2018-07-17 | 2019-09-11 | 敖翔科技股份有限公司 | Semiconductor fab's defect operating system and apparatus |
| JP7437959B2 (en) * | 2019-03-07 | 2024-02-26 | Hoya株式会社 | Modified photomask and display device manufacturing method |
| CN114564908A (en) * | 2022-01-25 | 2022-05-31 | 深圳晶源信息技术有限公司 | Design layout defect repairing method, storage medium and device |
-
2022
- 2022-01-25 CN CN202210090007.1A patent/CN114564908A/en active Pending
- 2022-06-30 WO PCT/CN2022/103100 patent/WO2023142384A1/en unknown
- 2022-08-30 TW TW111132767A patent/TWI825962B/en active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023142384A1 (en) * | 2022-01-25 | 2023-08-03 | 深圳晶源信息技术有限公司 | Design layout defect repair method, storage medium and device |
| CN114818604A (en) * | 2022-06-29 | 2022-07-29 | 飞腾信息技术有限公司 | Method and device for correcting short-circuit defect on digital layout |
| CN114818604B (en) * | 2022-06-29 | 2022-10-11 | 飞腾信息技术有限公司 | Method and device for correcting short-circuit defects on digital layout |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI825962B (en) | 2023-12-11 |
| TW202331579A (en) | 2023-08-01 |
| WO2023142384A1 (en) | 2023-08-03 |
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