TWI821293B - Substrate storage container management system, loading port, substrate storage container management method - Google Patents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67282—Marking devices
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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Abstract
本發明提供基板收納容器管理系統、裝載埠、基板收納容器管理方法。能預測伴隨使用的劣化等引起的FOUP等基板收納容器的更換時期的基板收納容器管理系統不是應用設置感測器等設備類的基板收納容器、而是應用現在通用的基板收納容器來實現。通過能進行使基板（W）相對於包括搬出搬入口（41）的基板收納容器即FOUP（4）出入的處理的裝載埠（2），讀取附加於FOUP的個體識別用ID（4x），將個體識別用ID和設於裝載埠的感測器（2c）的感測器值發送至上位元系統（C），在上位系統將個體識別用ID和感測器值相互關聯，儲存並儲備在資料庫（Cd），解析資料庫內的資料並輸出每個個體識別用ID的FOUP的狀態。The present invention provides a substrate storage container management system, a loading port, and a substrate storage container management method. A substrate storage container management system that can predict the replacement timing of a substrate storage container such as a FOUP due to deterioration due to use is realized not by using a substrate storage container equipped with a device such as a sensor, but by using a currently used substrate storage container. The individual identification ID (4x) attached to the FOUP is read through the loading port (2) that can carry out the process of loading and unloading the substrate (W) into and out of the FOUP (4), which is a substrate storage container including the transfer port (41), The individual identification ID and the sensor value of the sensor (2c) installed in the loading port are sent to the upper-level system (C). The upper-level system associates the individual identification ID and the sensor value with each other, stores and reserves them. In the database (Cd), analyze the data in the database and output the FOUP status of each individual identification ID.
Description
本發明涉及對能夠收納晶片的容器（基板收納容器）的劣化資訊進行管理的基板收納容器管理系統、以及能夠應用於基板收納容器管理系統的裝載埠、以及基板收納容器管理方法。The present invention relates to a substrate container management system that manages deterioration information of a container capable of storing wafers (substrate container), a loading port applicable to the substrate container management system, and a substrate container management method.
在半導體的製造工序中，為了提高成品率、品質，在潔淨室內進行晶片的處理。近年來，採用僅對晶片的周圍的局所的空間進一步提高清潔度的“小型圍繞方式”，並採用晶片的搬運及其它處理的措施。在小型圍繞方式中，在箱體的內部構成大致封閉的晶片搬運室（以下“搬運室”）的壁面的一部分，並且載置在高清潔的內部空間收納有晶片的容器即FOUP（Front-Opening Unified Pod），在搬運室相鄰地設有裝載埠（Load Port），該裝載埠具有在貼緊於FOUP的門（以下“FOUP門”）的狀態下使該FOUP門開閉的功能。In the semiconductor manufacturing process, wafers are processed in a clean room in order to improve yield and quality. In recent years, the "small surrounding method" has been adopted to further improve the cleanliness of only the local space around the wafer, and measures for transporting and other processing of the wafer have been adopted. In the small enclosure method, a part of the wall surface of a substantially closed wafer transfer chamber (hereinafter "transfer room") is formed inside the box, and a container storing wafers, called a FOUP (Front-Opening Unit), is placed in a highly clean internal space. Unified Pod), a load port (Load Port) is provided adjacent to the transport room, and the load port has a function of opening and closing the FOUP door (hereinafter "FOUP door") in a state of close contact with the FOUP door.
裝載埠是用於在與搬運室之間進行晶片的出入的裝置，作為搬運室與FOUP之間的介面部發揮功能。並且，構成為，若能夠與FOUP門卡合來使FOUP門開閉的裝載埠的門（以下為“裝載埠門”）敞開，則通過配置在搬運室內的搬運機器人（晶片搬運裝置），能夠向搬運室內取出FOUP內的晶片、或者將晶片從搬運室內收納到FOUP內。The load port is a device for loading and unloading wafers into and out of the transfer chamber, and functions as an interface between the transfer chamber and the FOUP. Furthermore, when the door of the loading port (hereinafter referred to as the "loading port door") that can engage with the FOUP door to open and close the FOUP door is opened, the transfer robot (wafer transfer device) disposed in the transfer chamber can move the wafer to the FOUP door. The wafers in the FOUP are taken out from the transfer chamber, or the wafers are stored in the FOUP from the transfer chamber.
並且，在半導體的製造工序中，為了適當地維持晶片周邊的氣氛，使用上述的稱為FOUP的儲存筒，在FOUP的內部容納晶片來進行管理。尤其是近年來，促進了元件的高集成化、電路的細微化，要求將晶片周邊維持為高清潔度，以免產生顆粒、水分向晶片表面的附著。因此，為了不使晶片表面氧化等表面的性狀發生變化，在FOUP的內部填充氮氣，使晶片周邊處於作為惰性氣體的氮氣氣氛、或者還進行成為真空狀態的處理（清洗處理）。In addition, in the semiconductor manufacturing process, in order to appropriately maintain the atmosphere around the wafer, the above-mentioned storage tube called FOUP is used, and the wafer is accommodated and managed inside the FOUP. In particular, in recent years, high integration of components and miniaturization of circuits have been promoted, requiring high cleanliness around the wafer to prevent particles and moisture from adhering to the wafer surface. Therefore, in order to prevent the surface properties of the wafer from changing, such as oxidation, the inside of the FOUP is filled with nitrogen, and the periphery of the wafer is placed in a nitrogen atmosphere as an inert gas, or a process (cleaning process) is performed to create a vacuum state.
但是，FOUP由於在內部滯留有塵埃或者在處理工序中使用的雜質，因此定期地進行熱水清洗而被再利用。由於反復進行該熱水清洗，樹脂制的FOUP逐漸變形。氣密性因這樣的FOUP的變形而降低，氣體相對於FOUP的流入、漏出（洩漏）成為問題。例如，在FOUP主體中的能夠由FOUP門開閉的搬出搬入口產生了歪斜的情況下，FOUP門的氣密性降低。其結果，在實施了將FOUP內的氣體置換為氮氣的清洗處理之後，在利用OHT等進行的搬運中，出現FOUP內的氮氣向FOUP外漏出、或者周圍的大氣容易流入到FOUP內的狀況，產生FOUP內的氧氣濃度上升之類的問題。However, since dust or impurities used in the treatment process remain inside the FOUP, it is regularly cleaned with hot water and reused. As this hot water cleaning is repeated, the resin FOUP gradually deforms. The air tightness decreases due to such deformation of the FOUP, and the inflow and leakage (leakage) of gas into the FOUP becomes a problem. For example, when the carry-out port in the FOUP body that can be opened and closed by the FOUP door is skewed, the airtightness of the FOUP door is reduced. As a result, after performing the cleaning process to replace the gas in the FOUP with nitrogen, during transportation by OHT or the like, the nitrogen in the FOUP leaks out of the FOUP, or the surrounding atmosphere tends to flow into the FOUP. This causes problems such as the oxygen concentration in the FOUP rising.
為了應對這樣的問題，考慮了通過對每個FOUP測定FOUP的形狀來判定FOUP的劣化的程度的方法（以下為“前者的方法”）、一律更換超過了預先設定的預定的使用次數、使用期間的FOUP的方法（以下為“後者的方法”）。In order to cope with such problems, a method of determining the degree of deterioration of FOUPs by measuring the shape of the FOUPs for each FOUP (hereinafter referred to as the "former method") has been considered, and the method of uniformly replacing the FOUPs after exceeding a preset scheduled number of uses and usage periods has been considered. FOUP method (hereinafter referred to as "the latter method").
然而，前者的方法需要逐個測定FOUP的形狀，因此需要在半導體的製造工序中、或者在半導體的製造工序的前後的適當時機確保實施這樣的形狀測定的時間，因此花費時間，效率低。另外，如果是後者的方法，則會產生更換沒有劣化到需要更換的程度的FOUP的事態，新購買FOUP所需要的成本多得超過所需，通過持續使用在達到預定的使用次數、使用期間之前變形的程度變大的FOUP直到達到預定的使用次數、使用期間，有時會產生氣體相對於FOUP的流入、漏出（洩漏）。However, the former method requires measuring the shape of the FOUP one by one. Therefore, it is necessary to secure time to perform such shape measurement during the semiconductor manufacturing process or at an appropriate time before and after the semiconductor manufacturing process. Therefore, it is time-consuming and inefficient. In addition, if the latter method is used, there will be a situation where the FOUP has not deteriorated to the extent that it needs to be replaced. The cost of purchasing a new FOUP will be more than necessary. By continuing to use it, it will not reach the predetermined number of uses and period of use. When a FOUP that is greatly deformed reaches a predetermined number of uses or during use, gas may flow in or out of the FOUP (leakage).
原來FOUP的變形一點一點地進行，難以對每個FOUP準確地把握劣化導致的更換時期，如果是後者的方法那樣的忽視FOUP的個體差的更換方法，則效率低，產生不需要的更換費用、或者認為能夠提前防止氣流相對於FOUP流入、漏出（洩漏）的事態的概率不高。Originally, the deformation of FOUP proceeds little by little, and it is difficult to accurately grasp the replacement time due to deterioration for each FOUP. If the replacement method ignores individual differences in FOUPs like the latter method, it will be inefficient and unnecessary replacement will occur. Cost, or the possibility that airflow can be prevented from flowing in or leaking out (leakage) of the FOUP in advance is not high.
因此，提出了如下管理系統，其包含：設於基板收納容器來檢測其使用狀態的檢測機構；設於基板收納容器來判斷其檢查檢驗時期的小型的無線通訊機構；對檢查檢驗時期的基板收納容器進行檢查檢驗的檢查檢驗裝置；以及報告與無線通訊機構進行的基板收納容器的檢查檢驗時期的判斷結果和檢查檢驗裝置進行的基板收納容器的檢查檢驗結果的任一結果相應的內容的報告機構，無線通訊機構利用運算處理部至少對檢測機構的檢測值和與基板收納容器相關的檢查檢驗值進行比較，根據該比較結果，來判斷基板收納容器的檢查檢驗時期（參照專利文獻1：日本特開2017－212322號公報）。Therefore, the following management system is proposed, which includes: a detection mechanism provided in the substrate storage container to detect its use status; a small wireless communication mechanism provided in the substrate storage container to determine the inspection and inspection period; and a detection mechanism for detecting the inspection and inspection period of the substrate storage container. An inspection and inspection device that performs inspection and inspection on the container; and a reporting mechanism that reports content corresponding to either the result of the inspection and inspection period of the substrate storage container by the wireless communication mechanism or the result of the inspection and inspection of the substrate storage container by the inspection and inspection device. The wireless communication mechanism uses the arithmetic processing unit to compare at least the detection value of the detection mechanism with the inspection and inspection value related to the substrate storage container, and determines the inspection and inspection time of the substrate storage container based on the comparison result (refer to Patent Document 1: Japanese Patent Open Gazette No. 2017-212322).
在上述專利文獻1中記載了如下技術：根據這樣的管理系統，由設於基板收納容器的檢測機構檢測該基板收納容器的使用狀態，在作為檢測值的輸出目的地的無線通訊機構中，對檢測值和與基板收納容器相關的閾值進行比較，其結果，在檢測值小於閾值、或者未接近閾值的情況下，判斷為能夠仍然繼續使用基板收納容器，另一方面，在檢測值接近閾值、或者超過了閾值的情況下，判斷為基板收納容器的性能或品質下降，接近基板收納容器的使用限度，能夠選定基板收納容器的更換品。Patent Document 1 described above describes a management system in which a detection mechanism provided in a substrate storage container detects the use state of the substrate storage container, and a wireless communication mechanism serving as an output destination of the detection value detects the state of use of the substrate storage container. The detection value is compared with a threshold value related to the substrate storage container. As a result, when the detection value is less than the threshold value or not close to the threshold value, it is determined that the substrate storage container can still be used. On the other hand, when the detection value is close to the threshold value, Or when the value exceeds the threshold, it is determined that the performance or quality of the substrate storage container has deteriorated and is approaching the usage limit of the substrate storage container, and a replacement substrate storage container can be selected.
然而，如果是專利文獻1記載的管理系統，則必須在作為基板收納容器的FOUP設置感測器以及通信機構（以下為“感測器等設備類”），因此除了需要在FOUP安裝感測器等設備類的作業以外，還要求在每個FOUP安裝感測器用的電源。因此，為了實現專利文獻1所記載的系統，不能使用現在使用的一般的FOUP作為基板收納容器，需要全部更換為新的FOUP。在半導體製造生產線中，大量的FOUP已被廣泛使用，更換其全部數量而採用該文獻的管理系統對於使用者來說負擔較大，認為難以導入製造現場。However, in the management system described in Patent Document 1, it is necessary to install sensors and communication mechanisms (hereinafter referred to as "sensors and other equipment") in the FOUP as a substrate storage container. Therefore, in addition to the need to install sensors in the FOUP In addition to equipment work, it is also required to install a power supply for sensors in each FOUP. Therefore, in order to realize the system described in Patent Document 1, the currently used general FOUP cannot be used as the substrate storage container, and all the FOUPs need to be replaced with new FOUPs. A large number of FOUPs are widely used in semiconductor manufacturing production lines. Replacing all the FOUPs and adopting a management system using this document is a heavy burden on users and is considered difficult to introduce into manufacturing sites.
並且，對分別賦予大量的FOUP的感測器等設備類進行個別維修的作業需要龐大的勞動力，還需要留意對FOUP進行熱水清洗時的熱、浸水引起的感測器等設備類的故障，難以萬無一失地進行用於在正常的狀態下使用感測器等設備類的事前準備或維修。並且，如果感測器等設備類的事前準備或維修不充分，則無法利用感測器進行準確的檢測處理，或者陷入不穩定的無線通訊狀態，不能適當地選定成為更換對象的FOUP，通過使用本來成為更換對象的FOUP，也會產生氣體相對於FOUP的流入、漏出（洩漏），FOUP內的晶片的表面被氧化之類的問題。這樣的問題在FOUP以外的基板收納容器中也同樣會產生。In addition, the work of individually repairing the sensors and other equipment that are provided with a large number of FOUPs requires a huge amount of labor. It is also necessary to pay attention to the failure of the sensors and other equipment caused by heat and water immersion when washing the FOUP with hot water. It is difficult to prepare or repair equipment such as sensors for use in normal conditions without fail. In addition, if the advance preparation or maintenance of equipment such as sensors is insufficient, accurate detection processing using the sensors will not be possible, or the wireless communication state will be unstable, and the FOUP to be replaced cannot be appropriately selected. By using The FOUP, which is originally intended for replacement, may have problems such as the inflow and leakage (leakage) of gas from the FOUP, and the surface of the wafer in the FOUP may be oxidized. Such problems also occur in substrate storage containers other than FOUP.
本發明是著眼於這樣的課題而提出的方案，主要的目的在於，為了抑制容納在FOUP等基板收納容器內的晶片的表面被氧化，能夠預測伴隨使用的劣化等引起的基板收納容器的更換時期的基板收納容器管理系統不是應用設置了感測器等設備類的FOUP、而是應用現在通用的FOUP來實現。此外，本發明是即使在FOUP以外的基板收納容器中也能夠對應的技術。The present invention was proposed with an eye on such a problem, and its main purpose is to be able to predict the replacement timing of the substrate storage container due to deterioration due to use, etc., in order to prevent the surface of the wafer contained in a substrate storage container such as a FOUP from being oxidized. The board storage container management system is not implemented by using a FOUP in which devices such as sensors are installed, but by using a commonly used FOUP today. In addition, the present invention is a technology that can be applied to substrate storage containers other than FOUP.
根據本發明的基板收納容器管理系統，其包含：裝載埠，其相對於基板收納容器能夠進行基板的出入處理，包括能夠讀取附加於上述基板收納容器的個體識別用ID的ID讀取機構和直接或者間接地檢測上述基板收納容器的狀態的感測器；關聯機構，其將由上述ID讀取機構讀取出的上述個體識別用ID與由上述感測器檢測出的感測器值相互關聯起來；資料庫，其儲備由上述關聯機構關聯的資料；以及資料處理部，其解析上述資料庫內的上述資料，並輸出每個上述個體識別用ID的上述基板收納容器的狀態。A substrate storage container management system according to the present invention includes a loading port capable of loading and unloading substrates from the substrate storage container, an ID reading mechanism capable of reading an individual identification ID attached to the substrate storage container, and A sensor that directly or indirectly detects the state of the substrate storage container; a correlation mechanism that correlates the individual identification ID read by the ID reading mechanism with the sensor value detected by the sensor. a database that stores data associated with the above-mentioned related organizations; and a data processing unit that analyzes the above-mentioned data in the above-mentioned database and outputs the status of the above-mentioned substrate storage container for each of the above-mentioned individual identification IDs.
在此，個體識別用ID用於識別各個基板收納容器，關於設於裝載埠的感測器的檢測值，判斷是從哪個基板收納容器取得的。此外，在個體識別用ID中不寫入與基板收納容器的經年劣化等相關的資料。“直接或者間接地檢測基板收納容器的狀態的感測器”只要是能夠檢測表示基板收納容器的劣化（變形）的資訊的感測器即可，例如能夠列舉在將基板收納容器內置換為氮氣等適當的氣體的清洗處理時檢測通過基板收納容器的埠從基板收納容器內向基板收納容器外排出的氣體（廢氣）的壓力的感測器、檢測基板收納容器內的晶片位置的映射感測器等。能夠根據這樣的廢氣的壓力感測器值、映射感測器的檢測值來把握基板收納容器的變形。也就是，在廢氣的壓力感測器值比以前下降的情況下，能夠認為基板收納容器變形，清洗處理時基板收納容器內的氣體通過基板收納容器的變形部分向外部漏出。另外，在映射感測器的檢測值與以前的檢測值不同（產生晶片的位置偏移）的情況下，能夠認為基板收納容器變形，晶片的位置發生了變化。也就是，容納在基板收納容器內的晶片載置於設置在基板收納容器內的多級狀的擱板上，若基板收納容器的變形進展，則高度方向上的晶片彼此的間隙變化，因此通過檢測這樣的變化，能夠判斷基板收納容器是否變形，或者通過檢測一枚晶片是否傾斜，能夠判斷基板收納容器是否變形。Here, the individual identification ID is used to identify each substrate storage container, and it is determined from which substrate storage container the detection value of the sensor installed in the loading port was obtained. In addition, no data related to aging deterioration of the substrate storage container or the like is written in the individual identification ID. The "sensor that directly or indirectly detects the state of the substrate storage container" only needs to be a sensor that can detect information indicating the deterioration (deformation) of the substrate storage container. For example, the sensor can be used to replace the substrate storage container with nitrogen gas. A sensor that detects the pressure of the gas (exhaust gas) discharged from the substrate storage container to the outside of the substrate storage container through the port of the substrate storage container during the cleaning process with appropriate gas, and a mapping sensor that detects the position of the wafer in the substrate storage container. wait. The deformation of the substrate storage container can be grasped based on the pressure sensor value of such exhaust gas and the detection value of the mapping sensor. That is, when the pressure sensor value of the exhaust gas is lower than before, it is considered that the substrate storage container is deformed, and the gas in the substrate storage container leaks to the outside through the deformed portion of the substrate storage container during the cleaning process. In addition, when the detection value of the mapping sensor is different from the previous detection value (the position of the wafer is shifted), it can be considered that the substrate storage container is deformed and the position of the wafer is changed. That is, the wafers accommodated in the substrate storage container are placed on a multi-stage shelf provided in the substrate storage container. If the deformation of the substrate storage container progresses, the gap between the wafers in the height direction changes. Therefore, by By detecting such changes, it is possible to determine whether the substrate storage container is deformed, or by detecting whether one wafer is tilted, it is possible to determine whether the substrate storage container is deformed.
如果是這樣的本發明的基板收納容器管理系統，則不需要將感測器用的電源安裝於各基板收納容器，對全部基板收納容器賦予個體識別用ID的作業比在全部基板收納容器設置感測器等設備類的作業更容易，並且，相對於裝載埠的ID讀取機構以及感測器的電源供給利用裝載埠所包括的電氣系統能夠比較容易地進行。此外，本發明的基板收納容器管理系統通過將感測器的設置物件設定為裝載埠，從而與在作為現有技術敘述的每個基板收納容器設置感測器等設備類的方式相比，成為維修的對象的絕對數量變少，可減輕維修的負擔，並且在不需要留意基板收納容器的熱水清洗時的熱、浸水引起的感測器等設備類的故障這一點也有利。According to the substrate storage container management system of the present invention, there is no need to install a power supply for the sensor in each substrate storage container, and the task of assigning individual identification IDs to all the substrate storage containers is much faster than installing sensors on all the substrate storage containers. It is easier to work with equipment such as a load port, and the power supply to the ID reading mechanism and sensors of the loading port can be relatively easily performed using the electrical system included in the loading port. In addition, the substrate storage container management system of the present invention sets the installation object of the sensor as a loading port. Therefore, compared with the method of installing equipment such as sensors in each substrate storage container described as a conventional technology, it becomes a maintenance tool. The absolute number of objects is reduced, which reduces the burden of maintenance. It is also advantageous in that there is no need to pay attention to equipment failures such as sensors caused by heat and water immersion during hot water cleaning of the substrate storage container.
並且，根據本發明的基板收納容器管理系統，通過將賦予在較多的製造現場已使用的基板收納容器的個體識別用ID、與設於裝載埠的感測器檢測出的檢測值相關聯並資料庫化，在資料處理部解析資料庫內的資料並輸出每個個體識別用ID的基板收納容器的狀態，從而使用者能夠取得或把握基板收納容器的劣化資訊。通過靈活利用這樣的本發明的基板收納容器管理系統，能夠基於劣化資訊來確定基板收納容器各自的更換時期，通過將應更換的基板收納容器更換為新的基板收納容器，能夠防止或抑制基板收納容器的變形引起的基板收納容器內的晶片表面的氧化之類的事態，降低錯誤產生頻度，從而半導體製造裝置的停止時間變短，提高生產性。Furthermore, according to the substrate storage container management system of the present invention, the individual identification ID given to the substrate storage container used at many manufacturing sites is associated with the detection value detected by the sensor installed in the loading port. In the database formation, the data processing unit analyzes the data in the database and outputs the status of the substrate storage container for each individual identification ID, so that the user can obtain or grasp the degradation information of the substrate storage container. By making full use of the substrate storage container management system of the present invention, it is possible to determine the replacement time of each substrate storage container based on the deterioration information, and to prevent or suppress substrate storage by replacing the substrate storage container that should be replaced with a new substrate storage container. Events such as oxidation of the wafer surface in the substrate storage container caused by deformation of the container reduce the frequency of errors, thereby shortening the downtime of the semiconductor manufacturing equipment and improving productivity.
在本發明中，較佳上述資料處理部包含：電腦構，其根據由特定的上述感測器檢測出的感測器值計算統計資料；比較機構，其對與特定的上述個體識別用ID相關聯的感測器值和由上述電腦構計算出的計算結果進行比較；以及狀態輸出機構，其基於由上述比較機構比較出的結果來輸出上述基板收納容器的狀態。In the present invention, it is preferable that the data processing unit includes: a computer unit that calculates statistical data based on sensor values detected by the specific sensor; and a comparison unit that compares data associated with the specific individual identification ID. The connected sensor value is compared with the calculation result calculated by the above-mentioned computer mechanism; and a status output mechanism outputs the status of the above-mentioned substrate storage container based on the comparison result by the above-mentioned comparison mechanism.
通過在資料處理部設置這樣的電腦構以及比較機構，從而能夠使在資料處理部的資料處理具有通用性。By providing such a computer mechanism and a comparison mechanism in the data processing unit, the data processing in the data processing unit can be made versatile.
在本發明中，較佳上述裝載埠包括多種上述感測器，上述關聯機構能夠將上述個體識別用ID與由上述多種感測器檢測出的多種上述感測器值相互關聯起來。In the present invention, it is preferable that the loading port includes a plurality of types of sensors, and the correlation mechanism is capable of correlating the individual identification ID with a plurality of types of sensor values detected by the plurality of sensors.
根據這樣的結構，能夠使用多種感測器值來判斷基板收納容器的狀態，因此能夠提高判斷的精度。According to such a structure, a variety of sensor values can be used to determine the state of the substrate storage container, so the accuracy of the determination can be improved.
在本發明中，較佳還包含動作調整部，該動作調整部基於上述資料處理部輸出的每個上述個體識別用ID的上述基板收納容器的狀態，對上述裝載埠的與上述基板收納容器的處理相關的控制值進行調整。The present invention preferably further includes an operation adjustment unit that adjusts the relationship between the loading port and the substrate storage container based on the state of the substrate storage container for each of the individual identification IDs output by the data processing unit. Process related control values to be adjusted.
通過設置這樣的動作調整部，能夠根據基板收納容器的狀態來調整裝載埠的對基板收納容器的處理，因此能抑制在裝載埠產生錯誤，能夠進行順暢的處理。By providing such an operation adjustment unit, the processing of the substrate storage container at the loading port can be adjusted according to the state of the substrate storage container. Therefore, errors at the loading port can be suppressed and smooth processing can be performed.
在本發明中，較佳上述關聯機構能夠將上述個體識別用ID、與在上述基板收納容器的處理時產生的錯誤相關的資訊、以及與對儲存在上述基板收納容器中的上述基板進行的處理相關的資訊中的至少任一方資訊相互關聯，還包含動作調整部，該動作調整部基於儲備在上述資料庫中的每個上述個體識別用ID的上述至少任一方的資訊，來調整上述裝載埠的與上述基板收納容器的處理相關的控制值。In the present invention, it is preferable that the correlation mechanism is capable of transmitting the individual identification ID, information on an error occurring during processing of the substrate storage container, and processing of the substrate stored in the substrate storage container. At least any one of the relevant information is related to each other, and further includes an action adjustment unit that adjusts the loading port based on at least one of the information for each of the individual identification IDs stored in the database. The control value related to the processing of the above-mentioned substrate storage container.
通過設置這樣的動作調整部，能夠根據事前產生的錯誤、對基板進行的處理來調整裝載埠的對基板收納容器的處理，因此能抑制在裝載埠產生錯誤，能夠進行順暢的處理。By providing such an operation adjustment unit, it is possible to adjust the processing of the substrate storage container at the loading port based on errors that have occurred in advance and the processing of the substrate. Therefore, errors at the loading port can be suppressed and smooth processing can be performed.
在本發明中，較佳還包含能夠與上述裝載埠通信的上位系統，在上述上位系統至少設有上述關聯機構、上述資料庫以及上述資料處理部。The present invention preferably further includes a higher-level system capable of communicating with the load port, and the higher-level system is provided with at least the above-mentioned related mechanism, the above-mentioned database, and the above-mentioned data processing unit.
通過將這樣的上位系統與裝載埠分開設置，從而能夠在上位系統中處理在多個裝載埠取得的資料。By arranging such a higher-level system and the load ports separately, data acquired from a plurality of load ports can be processed in the upper-level system.
在本發明中，較佳上述資料處理部包括學習機構，該學習機構根據上述裝載埠的上述感測器的感測器值來學習上述基板收納容器的狀態。In the present invention, it is preferable that the data processing unit includes a learning mechanism that learns the state of the substrate storage container based on the sensor value of the sensor of the loading port.
通過設置這樣的學習機構，能夠精度良好地推定基板收納容器的狀態。By providing such a learning mechanism, the state of the substrate storage container can be estimated with high accuracy.
本發明的裝載埠是上述的基板收納容器管理系統所包含的裝載埠，其包含：上述ID讀取機構，其能夠讀取附加於上述基板收納容器的上述個體識別用ID；以及上述感測器，其直接或者間接地檢測上述基板收納容器的狀態。The loading port of the present invention is a loading port included in the above-described substrate storage container management system, and includes: the above-mentioned ID reading mechanism capable of reading the above-mentioned individual identification ID attached to the above-mentioned substrate storage container; and the above-mentioned sensor. , which directly or indirectly detects the state of the substrate storage container.
根據這樣的裝載埠，如上所述，能夠取得與基板收納容器的管理相關的感測器值，能夠進行適當的基板收納容器的管理。According to such a loading port, as described above, the sensor value related to the management of the substrate storage container can be acquired, and appropriate management of the substrate storage container can be performed.
根據本發明的基板收納容器管理方法，其包含以下步驟：ID讀取步驟，通過相對於基板收納容器能夠進行基板的出入處理的裝載埠，讀取附加於上述基板收納容器的個體識別用ID；檢測步驟，利用設置在上述裝載埠的感測器，直接或者間接地檢測上述基板收納容器的狀態；關聯步驟，將在上述ID讀取步驟中讀取出的上述個體識別用ID與在上述檢測步驟中檢測出的感測器值相互關聯起來；資料庫化步驟，將在上述關聯步驟中關聯的資料儲備在資料庫中；以及資料處理步驟，解析上述資料庫內的上述資料，並輸出每個上述個體識別用ID的上述基板收納容器的狀態。The substrate storage container management method according to the present invention includes the following steps: an ID reading step of reading the individual identification ID attached to the substrate storage container through a loading port capable of loading and unloading the substrate with respect to the substrate storage container; The detection step is to directly or indirectly detect the state of the substrate storage container using a sensor installed in the loading port; the correlation step is to combine the individual identification ID read in the ID reading step with the one in the detection step. The sensor values detected in the step are correlated with each other; the database step is to store the data associated in the above correlation step in the database; and the data processing step is to analyze the above data in the above database and output each The state of the substrate storage container of each of the individual identification IDs.
如果是這樣的本發明的基板收納容器管理方法，則不伴有對在較多的製造現場已經使用的基板收納容器進行大幅度的式樣變更，而是照樣利用，並能夠輸出各基板收納容器的狀態。並且，能夠基於與基板收納容器的狀態相關的輸出資訊來進行各基板收納容器的更換時期的預測。According to the substrate storage container management method of the present invention, the substrate storage containers already used in many manufacturing sites can be used as they are without significant changes in styles, and the contents of each substrate storage container can be output. condition. Furthermore, the replacement timing of each substrate storage container can be predicted based on the output information related to the state of the substrate storage container.
在本發明中，較佳還包含動作調整步驟，該步驟中，基於在上述資料處理步驟中輸出的每個上述個體識別用ID的上述基板收納容器的狀態，對上述裝載埠的與上述基板收納容器的處理相關的控制值進行調整。In the present invention, it is preferable to further include an operation adjustment step in which, based on the state of the substrate storage container for each of the individual identification IDs output in the data processing step, the loading port and the substrate storage are adjusted. Container handling related control values are adjusted.
通過設置這樣的動作調整步驟，能夠根據基板收納容器的狀態來調整裝載埠的對基板收納容器的處理，因此能抑制在裝載埠產生錯誤，能夠進行順暢的處理。By providing such an operation adjustment step, the processing of the substrate storage container at the loading port can be adjusted according to the state of the substrate storage container. Therefore, errors at the loading port can be suppressed and smooth processing can be performed.
在本發明中，較佳在上述關聯步驟中，將上述個體識別用ID、與上述基板收納容器的處理時產生的錯誤相關的資訊、以及與對儲存在上述基板收納容器中的上述基板進行的處理相關的資訊中的任一方的資訊相互關聯，In the present invention, it is preferable that in the above-mentioned correlation step, the individual identification ID, information on errors occurring during processing of the substrate storage container, and information on the substrates stored in the substrate storage container are processing related information in which any party's information is related to each other,
還包含動作調整步驟，該步驟中，基於儲備在上述資料庫中的每個上述個體識別用ID的上述至少任一方的資訊，來調整上述裝載埠的與上述基板收納容器的處理相關的控制值。It also includes an operation adjustment step, in which the control value of the loading port related to the processing of the substrate storage container is adjusted based on at least one of the information of each of the individual identification IDs stored in the database. .
通過設置這樣的動作調整步驟，能夠根據事前產生的錯誤、對基板進行的處理來調整裝載埠的對基板收納容器的處理，因此抑制在裝載埠產生錯誤，能夠進行順暢的處理。By providing such an operation adjustment step, it is possible to adjust the processing of the substrate storage container at the loading port based on errors that have occurred in advance and the processing of the substrate. Therefore, errors at the loading port are suppressed and smooth processing can be performed.
本發明的效果如下。The effects of the present invention are as follows.
根據本發明，通過對FOUP等基板收納容器賦予個體識別用ID，並且IoT（Internet of Things），從而將設置在裝載埠的感測器的感測器值與個體識別用ID相關聯並資料庫化，基於資料庫的資料判斷伴隨基板收納容器的使用的劣化狀態，且能夠預測基板收納容器的更換時期的基板收納容器管理系統不是應用設置了感測器等設備類的專用的基板收納容器、而是應用現在通用的基板收納容器來實現。並且，根據這樣的本發明，基板收納容器的形狀測定不花費時間，便能夠取得與基板收納容器的變形相關的資訊，確定應更換的基板收納容器，如果將該確定的基板收納容器更換為新的基板收納容器，就能夠抑制收納在基板收納容器內的晶片的表面被氧化。According to the present invention, by assigning an individual identification ID to a substrate storage container such as a FOUP, and IoT (Internet of Things), the sensor values of the sensors installed in the loading port are associated with the individual identification ID and stored in the database. ization, a substrate storage container management system that can determine the deterioration state accompanying the use of the substrate storage container based on the data in the database and predict the replacement time of the substrate storage container does not apply to a dedicated substrate storage container equipped with equipment such as sensors. Instead, it is achieved by using a commonly used substrate storage container. Furthermore, according to the present invention, it is possible to obtain information about the deformation of the substrate storage container without taking time to measure the shape of the substrate storage container, and to identify the substrate storage container that should be replaced. If the determined substrate storage container is replaced with a new one, The substrate storage container can prevent the surface of the wafer stored in the substrate storage container from being oxidized.
以下，參照圖式對本發明的第一實施方式進行說明。Hereinafter, the first embodiment of the present invention will be described with reference to the drawings.
例如，如圖1所示，本實施方式的基板收納容器管理系統1利用在半導體的製造工序中使用的作為基板收納容器的FOUP4、裝載埠2、上位系統C而構成，具體而言，是如下系統：從裝載埠2的通信機構2y向上位系統C發送FOUP4所附帶的個體識別用ID4x、和由設於裝載埠2的感測器2c檢測出的與FOUP4相關的感測器值，在上位系統C中將這些個體識別用ID4x以及感測器值相關聯並資料庫化，基於資料庫Cd的資料能夠輸出FOUP4的狀態。For example, as shown in FIG. 1 , the substrate storage container management system 1 of this embodiment is configured using a FOUP 4 as a substrate storage container used in a semiconductor manufacturing process, a loading port 2 , and a higher-level system C. Specifically, it is as follows System: The communication mechanism 2y of the load port 2 sends the individual identification ID 4x attached to the FOUP 4 and the sensor value related to the FOUP 4 detected by the sensor 2c provided in the load port 2 to the upper system C. In system C, these individual identification ID4x and sensor values are associated and databased, and the status of FOUP4 can be output based on the data in database Cd.
如图2所示，在半导体的制造工序中，FOUP4與配置於洁净室的装载端口2以及包含搬运室3的EFEM（Equipment Front End Module）一起使用。在圖2中示意性地示出EFEM及其周邊裝置的相對位置關係。As shown in FIG. 2 , in the semiconductor manufacturing process, the FOUP 4 is used together with the load port 2 arranged in the clean room and the EFEM (Equipment Front End Module) including the transfer chamber 3 . The relative positional relationship between the EFEM and its peripheral devices is schematically shown in FIG. 2 .
在搬運室3的內部空間3S，設置能夠在FOUP4與處理裝置M之間搬運作為基板的晶片W的搬運機器人31。通過驅動設於搬運室3內的風扇篩檢程式單元32，在搬運室3的內部空間3S產生下降氣流，能夠使清潔度高的氣體（環境氣體）在搬運空間3S迴圈。在搬運室3中與配置有裝載埠2的前壁面3A對置的後壁面3B，相鄰地設有例如處理裝置M（半導體處理裝置）。在潔淨室，處理裝置M的內部空間MS、搬運室3的內部空間3S以及載置於裝載埠2上的FOUP4的內部空間4S維持為高清潔度。另一方面，配置裝載埠2的空間、換言之處理裝置M外、EFEM外為比較低的清潔度。In the internal space 3S of the transfer chamber 3, a transfer robot 31 capable of transferring the wafer W as a substrate between the FOUP 4 and the processing apparatus M is provided. By driving the fan screening program unit 32 installed in the transfer room 3, a downward airflow is generated in the internal space 3S of the transfer room 3, and gas with high cleanliness (ambient gas) can be circulated in the transfer space 3S. In the transfer chamber 3 , for example, a processing device M (semiconductor processing device) is provided adjacent to the rear wall surface 3B facing the front wall surface 3A on which the loading port 2 is arranged. In the clean room, the internal space MS of the processing device M, the internal space 3S of the transfer chamber 3 and the internal space 4S of the FOUP 4 placed on the loading port 2 are maintained at high cleanliness. On the other hand, the cleanliness of the space where the loading port 2 is arranged, in other words, the outside of the processing device M and the outside of the EFEM is relatively low.
在本實施方式中，如圖2所示，在EFEM的前後方向D使裝載埠2、搬運室3、處理裝置M依次相互緊密接觸地配置。此外，EFEM的動作由裝載埠2的控制器（圖4所示的控制部2C）、EFEM整體的控制器（圖2所示的控制部3C）控制，處理裝置M的工作由處理裝置M的控制器（圖2所示的控制部MC）控制。在此，作為處理裝置M整體的控制器的控制部MC、作為EFEM整體的控制器的控制部3C是裝載埠2的控制部2C的上位控制器。此外，構成基板收納容器管理系統1的上位系統C由伺服器構成，能夠與設置在半導體製造工序的多個裝載埠2連接。這些各控制部2C、MC、3C由包含CPU、記憶體以及介面的通常的微處理器等構成，在記憶體預先儲存處理所需要的程式，CPU逐次取出必要的程式並執行，與周邊硬體協作來實現所希望的功能。In this embodiment, as shown in FIG. 2 , the loading port 2 , the transfer chamber 3 , and the processing device M are arranged in order to be in close contact with each other in the front-rear direction D of the EFEM. In addition, the operation of the EFEM is controlled by the controller of the loading port 2 (control unit 2C shown in FIG. 4) and the controller of the entire EFEM (control unit 3C shown in FIG. 2). The operation of the processing device M is controlled by the controller of the processing device M. The controller (control unit MC shown in Fig. 2) controls. Here, the control unit MC as a controller of the entire processing apparatus M and the control unit 3C as a controller of the entire EFEM are upper-level controllers of the control unit 2C of the load port 2 . In addition, the upper-level system C constituting the substrate container management system 1 is composed of a server and can be connected to a plurality of loading ports 2 provided in the semiconductor manufacturing process. Each of these control units 2C, MC, and 3C is composed of a general microprocessor including a CPU, a memory, and an interface. Programs required for processing are stored in the memory in advance. The CPU sequentially retrieves and executes the necessary programs, and communicates with the peripheral hardware. Collaborate to achieve the desired functionality.
如圖2以及圖3所示，FOUP4是習知的結構，構成為，包含通過作為開口部的搬出搬入口41而能夠將內部空間4S敞開的FOUP主體42、以及能夠開閉搬出搬入口41的FOUP門43，在內部沿上下方向H呈多級狀地容納多枚晶片W，經由搬出搬入口41能夠使這些晶片W出入。As shown in FIGS. 2 and 3 , the FOUP 4 has a conventional structure and is configured to include a FOUP main body 42 that can open the internal space 4S through a carry-out port 41 as an opening, and a FOUP that can open and close the carry-out port 41 . The door 43 accommodates a plurality of wafers W in a multi-stage manner along the up-down direction H inside, and allows the wafers W to be put in and out through the unloading/unloading port 41 .
FOUP主體42在內部空間4S包含能夠以多級預定間距載置晶片W的擱板部（晶片載置擱板）。如圖3等所示，在FOUP主體42的底壁，在預定部位設有埠40。埠40例如以嵌入形成於FOUP主體42的底壁的埠安裝用貫通孔的中空筒狀的索環密封件為主體，通過檢驗閥能夠開閉地構成。在FOUP主體42的上壁的朝上的面的中央部，設置被容器搬運裝置（例如OHT：Over Head Transport）等把持的凸緣部。The FOUP main body 42 includes a shelf portion (wafer placing shelf) capable of placing wafers W at predetermined pitches in multiple steps in the internal space 4S. As shown in FIG. 3 and others, a port 40 is provided at a predetermined location on the bottom wall of the FOUP main body 42 . The port 40 is composed, for example, of a hollow cylindrical grommet seal fitted into a port installation through hole formed in the bottom wall of the FOUP main body 42 as a main body, and can be opened and closed by a check valve. A flange portion gripped by a container transport device (for example, OHT: Over Head Transport) or the like is provided at the center of the upward surface of the upper wall of the FOUP main body 42 .
FOUP門43在載置於裝載埠2的後述的載置台23上的狀態下與裝載埠2的裝載埠門22對置，且構成為大致板狀。在FOUP門43設置能將該FOUP門43鎖定於FOUP主體42的閂鎖鑰匙（省略圖示）。在由FOUP門43封閉了FOUP門43中的搬出搬入口41的狀態下與FOUP主體42接觸或者接近的預定的部分設置墊圈（省略圖示），並構成為通過使墊圈與FOUP主體42接觸而彈性變形，從而能夠密閉FOUP4的內部空間4S。The FOUP door 43 faces the loading port door 22 of the loading port 2 in a state of being placed on a mounting table 23 of the loading port 2 described below, and is configured in a substantially plate shape. The FOUP door 43 is provided with a latch key (not shown) that can lock the FOUP door 43 to the FOUP body 42 . A gasket (not shown) is provided at a predetermined portion that comes into contact with or is close to the FOUP body 42 in a state where the carry-in/out port 41 of the FOUP door 43 is closed by the FOUP door 43, and is configured so that the gasket comes into contact with the FOUP body 42. Elastically deforms to seal the internal space 4S of FOUP4.
如圖1所示，本實施方式的FOUP4在適當的部位安裝個體識別用ID4x。此外，在圖1中，示意性地示出個體識別用ID4x。作為個體識別用ID4x的一個例子，能夠列舉RFID（Radio Frequency Identifier），但並不限定於此，能夠使用適當的ID。FOUP4所附帶的個體識別用ID4x可以是無源標籤（被動標籤）、有源標籤（能動標籤）、組合雙方而成的半有源標籤（起動型能動標籤）的任一個，通信方式也沒有特別限定。並且，作為FOUP4所附帶的個體識別用ID4x，也能夠使用一維條碼、QR條碼（注冊商標）那樣的二維條碼等。As shown in FIG. 1 , the FOUP 4 of this embodiment is equipped with ID 4x for individual identification at an appropriate location. In addition, in FIG. 1 , ID4x for individual identification is schematically shown. An example of the ID4x for individual identification is RFID (Radio Frequency Identifier), but it is not limited to this, and an appropriate ID can be used. The ID4x for individual identification included with FOUP4 can be any of a passive tag (passive tag), an active tag (active tag), or a semi-active tag (activated active tag) that combines both, and the communication method is not particularly limited. Furthermore, as the individual identification ID4x included with FOUP4, a one-dimensional barcode, a two-dimensional barcode such as a QR barcode (registered trademark), etc. can also be used.
如圖3至圖6等所示，本實施方式的裝載埠2包含：基座21，其呈板狀，構成搬運室3的前壁面3A的一部分，而且形成有用於敞開搬運室3的內部空間3S的開口部21a；裝載埠門22，其開閉基座21的開口部21a；以及載置台23，以大致水準姿勢設置在基座21。As shown in FIGS. 3 to 6 , etc., the loading port 2 of this embodiment includes a base 21 , which is plate-shaped, constitutes a part of the front wall surface 3A of the transfer chamber 3 , and forms an internal space for opening the transfer chamber 3 . The opening 21a of 3S, the loading port door 22 which opens and closes the opening 21a of the base 21, and the mounting table 23 are installed on the base 21 in a substantially horizontal attitude.
在基座21的下端，設置包括小腳輪以及設置腳的腳部24，在與FOUP門43對置的位置設置窗單元214（參照圖7）。設於該窗單元214的開口部215是允許晶片W通過的開口部。At the lower end of the base 21, a leg portion 24 including casters and a set foot is provided, and a window unit 214 is provided at a position facing the FOUP door 43 (see FIG. 7). The opening 215 provided in the window unit 214 is an opening that allows the wafer W to pass.
載置台23設置在水準基台25（支撐台）的上部，該水準基台25（支撐台）以大致水準姿勢配置在基座21中比高度方向中央稍微靠上方的位置。該載置台23能夠以使FOUP門43與裝載埠門22對置的朝向載置FOUP4，該FOUP門43能夠開閉FOUP主體42的內部空間4S。另外，載置台23構成為，能夠在FOUP門43與基座21的開口部21a接近的預定的對接位置（參照圖8）、和使FOUP門43相比對接位置從基座21離開預定距離的位置（參照圖3）之間相對於基座21進退移動。如圖4所示，載置台23包括向上突出的多個突起（銷）231，通過使這些突起231與形成於FOUP4的底面的孔（省略圖示）卡合，從而實現載置台23上的FOUP4的定位。另外，設置用於相對於載置台23固定FOUP4的鎖定爪232。通過將該鎖定爪232牽拉到設於FOUP4的底面的被鎖定部（省略圖示）而處於固定的鎖定狀態，從而能夠與定位用的突起231協作地將FOUP4引導至載置台23上的適當的位置並且固定。另外，通過解除鎖定爪232相對於設置在FOUP4的底面的被鎖定部的鎖定狀態，從而能夠使FOUP4處於能夠從載置台23離開的狀態。The mounting base 23 is provided on an upper portion of a horizontal base 25 (support base) that is arranged in a substantially horizontal posture at a position slightly above the center in the height direction of the base 21 . The placement table 23 can place the FOUP 4 in an orientation such that the FOUP door 43 can open and close the internal space 4S of the FOUP main body 42 and face the loading port door 22 . In addition, the mounting table 23 is configured to be able to move the FOUP door 43 to a predetermined docking position (see FIG. 8 ) in which the FOUP door 43 is close to the opening 21 a of the base 21 , and to move the FOUP door 43 away from the base 21 by a predetermined distance from the docking position. It moves forward and backward relative to the base 21 between positions (see FIG. 3 ). As shown in FIG. 4 , the mounting base 23 includes a plurality of protrusions (pins) 231 protruding upward. By engaging these protrusions 231 with holes (not shown) formed in the bottom surface of the FOUP 4 , the FOUP 4 on the mounting base 23 is realized. positioning. In addition, a lock claw 232 for fixing the FOUP 4 to the mounting base 23 is provided. By pulling the lock claw 232 to a locked portion (not shown) provided on the bottom surface of the FOUP 4 to maintain a fixed locked state, the FOUP 4 can be guided to an appropriate position on the mounting base 23 in cooperation with the positioning protrusion 231 . position and fixed. In addition, by releasing the locked state of the locking pawl 232 with respect to the locked portion provided on the bottom surface of the FOUP 4, the FOUP 4 can be placed in a state where it can be separated from the mounting base 23.
裝載埠門22包含連結機構221，該連結機構221能夠在蓋連結狀態與蓋連結解除狀態之間進行切換，該蓋連結狀態是連結FOUP門43並能夠將FOUP門43從FOUP主體42拆下的狀態，該蓋連結解除狀態是解除相對於FOUP門43的連結狀態，而且將FOUP門43安裝於FOUP主體42的狀態（參照圖6），裝載埠門22在通過連結機構221以一體化的狀態保持FOUP門43的狀態下能夠沿預定的移動路徑移動。本實施方式的裝載埠2構成為能夠使裝載埠門22至少在全閉位置C與敞開位置O之間移動，該全閉位置C是圖8所示的位置、也就是由該裝載埠門22所保持的FOUP門43密閉FOUP主體42的內部空間4S的位置，該敞開位置O是圖9所示的位置、也就是使該裝載埠門22所保持的FOUP門43從FOUP主體42離開而使該FOUP主體42的內部空間4S朝向搬運室3內敞開的位置。本實施方式的裝載埠2構成為，能夠在維持定位於全閉位置C的裝載埠門22的起立姿勢的狀態下移動至圖9所示的敞開位置O，並且，能夠從圖9所示的敞開位置O至未圖示的全開位置維持起立姿勢的狀態下向下方向移動。這樣的裝載埠門22是移動由設置在裝載埠2的門移動機構27來實現。另外，本實施方式的裝載埠2包含移動限制部L，該移動限制部L限制定位於對接位置的載置台23上的FOUP4向離開基座21的方向移動。在本實施方式中，將移動限制部L作為窗單元214而單元化（參照圖7）。The loading port door 22 includes a connection mechanism 221 that can switch between a lid-connected state in which the FOUP door 43 is connected and the FOUP door 43 can be detached from the FOUP body 42, and a lid-unconnected state. state, the lid unlinked state is a state in which the FOUP door 43 is unlinked and the FOUP door 43 is installed on the FOUP main body 42 (see FIG. 6 ). The loading port door 22 is in an integrated state by the linking mechanism 221 The FOUP door 43 can move along a predetermined movement path while maintaining the state. The load port 2 of this embodiment is configured to move the load port door 22 at least between the fully closed position C and the open position O. The fully closed position C is the position shown in FIG. 8 , that is, the load port door 22 The held FOUP door 43 seals the internal space 4S of the FOUP body 42. The open position O is the position shown in FIG. 9, that is, the FOUP door 43 held by the loading port door 22 is separated from the FOUP body 42. The internal space 4S of the FOUP main body 42 is open toward the inside of the transfer chamber 3 . The load port 2 of this embodiment is configured to be movable to the open position O shown in FIG. 9 while maintaining the upright posture of the load port door 22 positioned at the fully closed position C, and to be moved from the open position O shown in FIG. 9 Move from the open position O to the fully open position (not shown) in the downward direction while maintaining the standing posture. Such movement of the loading port door 22 is realized by the door moving mechanism 27 provided in the loading port 2 . In addition, the loading port 2 of this embodiment includes a movement restriction part L that restricts the movement of the FOUP 4 positioned on the mounting table 23 at the docking position in a direction away from the base 21 . In this embodiment, the movement restriction part L is unitized as a window unit 214 (see FIG. 7 ).
本實施方式的裝載埠2包含清洗裝置P，該清洗裝置P向FOUP4的內部空間4S注入清洗用氣體（也稱為清洗用氣體，主要使用氮氣、乾燥空氣），能夠將FOUP4的內部空間4S的氣體氣氛置換為清洗用氣體（參照圖4）。清洗裝置P包含以上端部能夠露出的狀態配置在載置台23上的預定部位的多個清洗噴嘴9（氣體供排裝置）。這些多個清洗噴嘴9與設置在FOUP4的底面的埠40的位置相應地安裝在載置台23上的適當位置，能夠以與埠40接觸的狀態連接。使用了這樣的清洗裝置P的底部清洗處理是如下處理：使設置在FOUP4的底部的多個埠40中的預定個數（除全部以外）的埠作為“供給埠”發揮功能，利用與供給埠連接的清洗噴嘴9向該FOUP4內注入氮氣、惰性氣體或者乾燥空氣等適當選擇的清洗用氣體，並且使剩餘的埠40作為“排氣埠”發揮功能，通過與排氣埠連接的清洗噴嘴9排出FOUP4內的氣體氣氛，由此向FOUP4內充滿清洗用氣體。裝載埠2包含壓力感測器（省略圖示），該壓力感測器對底部清洗處理時與作為排氣埠發揮功能的埠40連接的清洗噴嘴9的氣體壓（排氣壓）進行檢測。The loading port 2 of this embodiment includes a cleaning device P that injects cleaning gas (also called cleaning gas, which mainly uses nitrogen and dry air) into the internal space 4S of the FOUP 4 to clean the internal space 4S of the FOUP 4 . The gas atmosphere is replaced with cleaning gas (see Figure 4). The cleaning device P includes a plurality of cleaning nozzles 9 (gas supply and discharge devices) arranged at predetermined positions on the mounting table 23 in a state in which the upper end portions can be exposed. These plurality of cleaning nozzles 9 are installed at appropriate positions on the mounting table 23 in accordance with the positions of the ports 40 provided on the bottom surface of the FOUP 4 , and can be connected in a state of contact with the ports 40 . The bottom cleaning process using such a cleaning device P is a process in which a predetermined number (except all) of the plurality of ports 40 provided at the bottom of the FOUP 4 function as "supply ports" and utilize the supply ports. The connected cleaning nozzle 9 injects an appropriately selected cleaning gas such as nitrogen, inert gas or dry air into the FOUP 4, and causes the remaining port 40 to function as an "exhaust port". The gas atmosphere in FOUP 4 is discharged, thereby filling FOUP 4 with cleaning gas. The loading port 2 includes a pressure sensor (not shown) that detects the gas pressure (exhaust pressure) of the cleaning nozzle 9 connected to the port 40 that functions as an exhaust port during the bottom cleaning process.
如圖10所示，本實施方式的裝載埠2包含能夠檢測FOUP4內的晶片W的有無和收納姿勢的映射部m。映射部m包括：能夠檢測沿高度方向H以多級狀收納在FOUP4內的晶片W的有無的映射感測器（發送器m1、接收器m2）；以及支撐映射感測器m1、m2的感測器框架m3。映射部m能夠在如下姿勢間轉換：其整體配置於搬運室內的搬運空間的映射退避姿勢；以及至少映射感測器m1、m2通過基座21的開口21a而定位於FOUP4內的映射姿勢。映射部m構成為在維持映射退避姿勢或映射姿勢的狀態下能夠沿高度方向H移動。如圖10所示，通過將感測器框架m3的一部分安裝於門移動機構27的一部分，從而映射部m的升降移動與裝載埠門22的升降移動一體地進行。此外，圖10以外的各圖中省略了映射部m。As shown in FIG. 10 , the load port 2 of this embodiment includes a mapping unit m capable of detecting the presence and storage posture of the wafer W in the FOUP 4 . The mapping unit m includes: mapping sensors (transmitter m1, receiver m2) capable of detecting the presence or absence of the wafer W stored in the FOUP 4 in a multi-stage manner along the height direction H; and sensors supporting the mapping sensors m1, m2. Detector frame m3. The mapping unit m can switch between a mapping retraction posture in which the entire unit is disposed in the transportation space inside the transportation room, and a mapping posture in which at least the mapping sensors m1 and m2 are positioned in the FOUP 4 through the opening 21 a of the base 21 . The mapping unit m is configured to be movable in the height direction H while maintaining the mapping retraction posture or the mapping posture. As shown in FIG. 10 , by attaching a part of the sensor frame m3 to a part of the door moving mechanism 27 , the upward and downward movement of the mapping part m and the upward and downward movement of the loading port door 22 are performed integrally. In addition, the mapping part m is omitted in each figure except FIG. 10 .
映射感測器由發出作為信號的光束（光芒）的發送器m1（發光感測器）、和接收從發送器m1發出的信號的接收器m2（受光感測器）構成。此外，映射感測器也可以由發送器、和朝向發送器反射從發送器發出的光芒的反射部構成。該情況下，發送機也有作為接收器的功能。The mapping sensor is composed of a transmitter m1 (light-emitting sensor) that emits a light beam (light) as a signal, and a receiver m2 (light-receiving sensor) that receives a signal transmitted from the transmitter m1. In addition, the mapping sensor may be composed of a transmitter and a reflecting portion that reflects light emitted from the transmitter toward the transmitter. In this case, the transmitter also functions as a receiver.
並且，如圖1所示，本實施方式的裝載埠2包含：能夠讀取附加於FOUP4的個體識別用ID4x的ID讀取機構2x；以及能夠相對於上位系統C發送直接或者間接地檢測由ID讀取機構2x讀取出的個體識別用ID4x以及FOUP4的狀態的感測器2c（在本實施方式中，壓力感測器、映射感測器這兩種感測器）的檢測值（感測器值）的裝載埠側通信機構2y。ID讀取機構2x、壓力感測器、映射感測器、裝載埠側通信機構2y分別由通用產品構成，設置在裝載埠2的預定部位。Furthermore, as shown in FIG. 1 , the load port 2 of the present embodiment includes an ID reading mechanism 2 x that can read the individual identification ID 4 x attached to the FOUP 4 , and an ID reading mechanism 2 x that can directly or indirectly detect the ID by sending it to the upper-level system C. The detection value (sensing value) of the sensor 2c (in this embodiment, two types of sensors, a pressure sensor and a mapping sensor) of the individual identification ID 4x and the status of the FOUP 4 read by the reading mechanism 2x The load port side communication mechanism 2y of the device value). The ID reading mechanism 2x, the pressure sensor, the mapping sensor, and the loading port side communication mechanism 2y are each composed of general-purpose products and are installed at predetermined positions of the loading port 2.
如圖1所示，上位系統C包含上位系統側通信機構Cx、關聯機構Cy、資料庫Cd、以及資料處理部Cz。上位系統側通信機構Cx能夠接收從裝載埠側通信機構2y發送的個體識別用ID4x以及感測器值。關聯機構Cy將由上位系統側通信機構Cx接收到的個體識別用ID4x與感測器值相互關聯起來。資料庫Cd儲存並儲備由關聯機構Cy關聯後的資料，資料處理部Cz解析資料庫Cd內的資料並輸出每個個體識別用ID4x的狀態（在本實施方式中為FOUP4的更換時期的預測結果）。上位系統側通信機構Cx、關聯機構Cy、資料庫Cd能夠分別使用通用產品來構成。資料處理部Cz中的具體的處理內容將於後文敘述。As shown in FIG. 1 , the upper-level system C includes a higher-level system side communication mechanism Cx, a related organization Cy, a database Cd, and a data processing unit Cz. The higher-level system side communication unit Cx can receive the individual identification ID 4x and the sensor value transmitted from the loading port side communication unit 2y. The correlation mechanism Cy correlates the individual identification ID 4x received by the higher-level system side communication mechanism Cx with the sensor value. The database Cd stores and reserves data associated with the related organization Cy. The data processing unit Cz analyzes the data in the database Cd and outputs the status of each individual identification ID 4x (in this embodiment, the predicted result of the replacement period of FOUP4 ). The upper system side communication mechanism Cx, the related mechanism Cy, and the database Cd can each be configured using general-purpose products. The specific processing content in the data processing section Cz will be described later.
以下，與EFEM的動作流程一起，來說明本實施方式的基板收納容器管理系統1的動作流程。Hereinafter, the operation flow of the substrate storage container management system 1 of this embodiment will be described together with the operation flow of EFEM.
首先，利用OHT等容器搬運裝置將FOUP4搬運至裝載埠2的上方，並載置於載置台23上。此時，例如設於載置台23的定位用突起231與FOUP4的定位用凹部嵌合，使載置台23上的鎖定爪232處於鎖定狀態（鎖定處理）。在本實施方式中，能夠在沿搬運室3的寬度方向排列三台配置的裝載埠2的載置台23上分別載置FOUP4。另外，也能夠構成為，利用檢測FOUP4是否載置於載置台23上的預定位置的落座感測器（省略圖示）來檢測FOUP4載置於載置台23上的正規位置的情況。First, the FOUP 4 is transported above the loading port 2 using a container transport device such as an OHT, and placed on the mounting table 23 . At this time, for example, the positioning protrusion 231 provided on the mounting base 23 is fitted into the positioning recessed portion of the FOUP 4 so that the lock claw 232 on the mounting base 23 is in a locked state (locking process). In the present embodiment, the FOUPs 4 can be placed on the mounting bases 23 of the loading ports 2 arranged in three rows in the width direction of the transfer chamber 3 . Alternatively, a seating sensor (not shown) that detects whether the FOUP 4 is placed at a predetermined position on the placement base 23 may be used to detect whether the FOUP 4 is placed in a regular position on the placement base 23 .
在本實施方式的裝載埠2中，在FOUP4載置於載置台23上的正規位置的時刻，檢測FOUP4中的底面部按壓了設置在載置台23上的例如加壓感測器的被按壓部的情況。以此為契機，設置在載置台23上的清洗噴嘴9（全部的清洗噴嘴9）比載置台23的上表面更向上方進出而與FOUP4的各埠40連結，各埠40從封閉狀態被切換為敞開狀態。並且，本實施方式的裝載埠2利用清洗裝置P向FOUP4的內部空間4S供給氮氣，進行將FOUP4的內部空間4S置換為氮氣的處理（底部清洗處理）。在底部清洗處理時，FOUP4內的氣體氣氛從與作為排氣埠發揮功能的埠40連接的清洗噴嘴9向FOUP4外排出。通過這樣的底部清洗處理，使FOUP4內的水分濃度以及氧氣濃度分別降低至預定值以下，從而使FOUP4內的晶片W的周圍環境成為低濕度環境以及低氧環境。In the loading port 2 of this embodiment, when the FOUP 4 is placed in a regular position on the mounting base 23, it is detected that the bottom portion of the FOUP 4 presses a pressed portion of, for example, a pressure sensor provided on the mounting base 23. situation. Taking this as an opportunity, the cleaning nozzles 9 (all cleaning nozzles 9 ) provided on the mounting table 23 move in and out upward from the upper surface of the mounting table 23 and are connected to each port 40 of the FOUP 4 , and each port 40 is switched from the closed state. is in an open state. Furthermore, the loading port 2 of this embodiment uses the cleaning device P to supply nitrogen gas to the internal space 4S of the FOUP 4 and performs a process (bottom cleaning process) of replacing the internal space 4S of the FOUP 4 with nitrogen gas. During the bottom cleaning process, the gas atmosphere in the FOUP 4 is discharged to the outside of the FOUP 4 from the cleaning nozzle 9 connected to the port 40 functioning as an exhaust port. Through such bottom cleaning processing, the moisture concentration and oxygen concentration in FOUP 4 are reduced to below predetermined values respectively, thereby making the surrounding environment of wafer W in FOUP 4 a low-humidity environment and a low-oxygen environment.
本實施方式的裝載埠2在鎖定處理後，使處於圖2所示的位置的載置台23移動至圖8所示的對接位置（對接處理），使用移動限制部L進行保持並固定FOUP4的至少兩側的處理（夾緊處理），將連結機構221切換為蓋連結狀態（蓋連結處理），使FOUP門43與裝載埠門22一起移動，敞開基座21的開口部21a以及FOUP4的搬出搬入口41，執行解除FOUP4內的密閉狀態的處理（密閉解除處理）。本實施方式的裝載埠2在使裝載埠門22從敞開位置O移動至全開位置的處理中，實施利用了映射部m的映射處理。映射處理是如下處理：將在執行密閉解除處理之前處於映射退避姿勢的映射部m在使裝載埠門22從全閉位置C移動至敞開位置O之後切換為映射姿勢，通過使裝載埠門22朝向全開位置向下方移動，映射部m也在維持映射姿勢的狀態下向下方移動，使用映射感測器m1、m2，檢測收納在FOUP4內的晶片W的有無和收納姿勢。即、通過從發送器m1朝向接收器m2發出信號而形成於發送器m1與接收器m2之間的信號路徑在存在晶片W的部位被遮擋，在不存在晶片W的部位未被遮擋而到達接收器m2。由此，能夠依次檢測在FOUP4內沿高度方向H排列收納的晶片W的有無和收納姿勢。In the loading port 2 of this embodiment, after the locking process, the mounting table 23 in the position shown in FIG. 2 is moved to the docking position shown in FIG. 8 (docking process), and at least the FOUP 4 is held and fixed using the movement restriction part L. In the processing on both sides (clamping processing), the coupling mechanism 221 is switched to the lid coupling state (lid coupling processing), the FOUP door 43 is moved together with the loading port door 22 , the opening 21 a of the base 21 is opened, and the FOUP 4 is carried in and out. Port 41 executes the process of releasing the sealed state in FOUP4 (sealed release process). The load port 2 of this embodiment performs mapping processing using the mapping unit m in the process of moving the load port door 22 from the open position O to the fully open position. The mapping process is a process of switching the mapping unit m that was in the mapping retraction posture before executing the sealing release process to the mapping posture after moving the load port door 22 from the fully closed position C to the open position O, and moving the load port door 22 toward The fully open position moves downward, and the mapping part m also moves downward while maintaining the mapping posture. The mapping sensors m1 and m2 are used to detect the presence and storage posture of the wafer W stored in the FOUP 4 . That is, the signal path formed between the transmitter m1 and the receiver m2 by transmitting a signal from the transmitter m1 to the receiver m2 is blocked at the location where the wafer W is present, and reaches the reception without being blocked at the location where the wafer W is not present. Device m2. This makes it possible to sequentially detect the presence and storage posture of the wafers W arranged and stored in the height direction H in the FOUP 4 .
通過執行密閉解除處理，成為FOUP主體42的內部空間4S與搬運室3的內部空間3S連通的狀態，基於由映射處理檢測出的資訊（晶片位置），設置在搬運室3的內部空間3S的搬運機器人31從特定的晶片載置擱板取出晶片W，或者實施將晶片W收納到特定的晶片載置擱板的處理（搬運處理）。By executing the sealing release process, the internal space 4S of the FOUP main body 42 and the internal space 3S of the transfer chamber 3 are in a state of communication. Based on the information (wafer position) detected by the mapping process, the transfer of the internal space 3S of the transfer chamber 3 is performed. The robot 31 takes out the wafer W from a specific wafer mounting shelf or performs a process (transport process) of storing the wafer W on a specific wafer mounting shelf.
若FOUP4內的晶片W全部結束了處理裝置M的處理工序，則本實施方式的裝載埠2利用門移動機構27使裝載埠門22移動至全閉位置C，封閉基座21的開口部21a以及FOUP4的搬出搬入口41，進行密閉FOUP4的內部空間4S的處理（密閉處理），接著，執行將連結機構221從蓋連結狀態切換為蓋連結解除狀態的處理（蓋連結解除處理）。通過該處理，能夠將FOUP門43安裝於FOUP主體42，基座21的開口部21a以及FOUP4的搬出搬入口41分別由裝載埠門22、FOUP門43封閉，FOUP4的內部空間4S成為密閉狀態。When all the wafers W in the FOUP 4 have completed the processing steps of the processing device M, the load port 2 in this embodiment uses the door moving mechanism 27 to move the load port door 22 to the fully closed position C to close the opening 21 a of the base 21 and The carry-out port 41 of the FOUP 4 performs a process of sealing the internal space 4S of the FOUP 4 (sealing process), and then performs a process of switching the coupling mechanism 221 from the cover connection state to the cover release state (cover release process). Through this process, the FOUP door 43 can be attached to the FOUP main body 42, the opening 21a of the base 21 and the unloading/unloading port 41 of the FOUP 4 are respectively closed by the loading port door 22 and the FOUP door 43, and the internal space 4S of the FOUP 4 is in a sealed state.
接下來，本實施方式的裝載埠2進行解除移動限制部L對FOUP4的固定狀態（夾緊狀態）的夾緊解除處理，接著，在執行了使載置台23向離開基座21的方向移動的處理（對接解除處理）之後，解除由載置台23上的鎖定爪232鎖定FOUP4的狀態（鎖定解除處理）。由此，儲存了結束了預定的處理的晶片W的FOUP4從各裝載埠2的載置台23上被交接到容器搬運裝置，向下一工序搬出。Next, the load port 2 of this embodiment performs a clamp release process to release the fixed state (clamped state) of the FOUP 4 by the movement restricting portion L, and then executes the movement of the mounting table 23 in a direction away from the base 21 After the process (the docking release process), the locked state of the FOUP 4 by the lock claw 232 on the mounting table 23 is released (the lock release process). Thereby, the FOUP 4 storing the wafers W that have completed the scheduled processing is transferred from the mounting table 23 of each load port 2 to the container transport device, and is carried out to the next process.
在進行以上的處理的過程中，本實施方式的基板收納容器管理系統1輸出載置於裝載埠2的載置台23上的FOUP4的狀態（具體而言，預測FOUP4的更換時期）。即，本實施方式的基板收納容器管理系統1在FOUP4放置於裝載埠2的載置台23上的時刻，由裝載埠2的ID讀取機構2x讀取FOUP4的個體識別用ID4x，利用裝載埠側通信機構2y將讀取到的個體識別用ID4x發送至上位元系統C的關聯機構Cy。並且，在進行對FOUP4內進行清洗的處理（底部清洗處理）時，本實施方式的基板收納容器管理系統1利用與裝載埠2的排氣用清洗噴嘴9相關聯地設置的壓力感測器來檢測廢氣的壓力，並將檢測值（壓力值）發送至上位元系統C的關聯機構Cy。While performing the above processing, the substrate storage container management system 1 of this embodiment outputs the status of the FOUP 4 placed on the mounting table 23 of the loading port 2 (specifically, predicting the replacement timing of the FOUP 4). That is, the substrate storage container management system 1 of the present embodiment reads the individual identification ID 4x of the FOUP 4 by the ID reading mechanism 2x of the load port 2 when the FOUP 4 is placed on the mounting table 23 of the load port 2, and uses the load port side The communication mechanism 2y sends the read individual identification ID 4x to the associated mechanism Cy of the higher-level system C. Furthermore, when performing the cleaning process (bottom cleaning process) within the FOUP 4 , the substrate storage container management system 1 of this embodiment uses the pressure sensor provided in association with the exhaust cleaning nozzle 9 of the loading port 2 . The pressure of the exhaust gas is detected and the detection value (pressure value) is sent to the related organization Cy of the upper element system C.
上位系統C利用上位系統側通信機構Cx接收個體識別用ID4x以及壓力值，並利用關聯機構Cy將個體識別用ID4x以及壓力值相互關聯起來，保存（儲存、儲備）於資料庫Cd。另外，本實施方式的基板收納容器管理系統1在進行利用了映射部m的映射處理時，利用裝載埠側通信機構2y將作為映射感測器的檢測值的晶片位置發送至上位元系統C的關聯機構Cy。上位系統C利用上位系統側通信機構Cx接收晶片位置，利用關聯機構Cy將個體識別用ID4x與晶片位置關聯起來，並保存（儲存、儲備）於資料庫Cd。The upper-level system C uses the upper-level system side communication mechanism Cx to receive the individual identification ID4x and the pressure value, and uses the correlation mechanism Cy to associate the individual identification ID4x and the pressure value with each other, and save (store, reserve) them in the database Cd. In addition, when performing mapping processing using the mapping unit m, the substrate container management system 1 of the present embodiment transmits the wafer position as the detection value of the mapping sensor to the upper-level system C using the load port side communication mechanism 2y. Affiliated institutions Cy. The upper-level system C receives the chip position using the upper-level system-side communication mechanism Cx, associates the individual identification ID 4x with the chip position using the association mechanism Cy, and stores (stores, reserves) the chip position in the database Cd.
由此，在上位系統C中，將設置在裝載埠2的各種感測器的檢測值（在本實施方式中為壓力感測器的壓力值、映射感測器的晶片位置）與賦予FOUP4的個體識別用ID4x相關聯而資料庫化。此外，在本實施方式中，如圖13的表格那樣，與每個FOUP4的個體識別用ID4x、壓力感測器的壓力值（圖13的排氣噴嘴壓力值）、映射感測器的晶片位置（圖13的FOUP晶片位置）一起保存計測日期和時間。並且，在上位系統C的資料處理部Cz，解析收集到的資料，進行FOUP4的更換時期的預測。此外，基於由與裝載埠2的排氣用清洗噴嘴9相關聯地設置的壓力感測器檢測出的廢氣的壓力值的變化，能夠判斷FOUP4的搬出搬入口41與FOUP門43之間的間隙擴大。即，如果知道從排氣用清洗噴嘴9排出的氣體的壓力變低，則可知通過FOUP4的搬出搬入口41與FOUP門43之間的間隙的排氣量變多，能夠判斷為FOUP4的搬出搬入口41與FOUP門43之間的間隙擴大，從而能夠確定FOUP4的變形。另外，如上所述，在映射感測器的檢測值與以前的檢測值不同的（產生了晶片W的位置偏移）情況下，FOUP4變形，可以認為晶片W的位置發生了變化。也就是，若FOUP4的變形繼續進行，則以多級狀容納在FOUP4內的晶片W彼此的間隙發生變化，因此通過檢測這樣的變化來確定FOUP4的變形，通過檢測晶片W以傾斜的姿勢被容納的情況，能夠確定FOUP4的變形。Therefore, in the host system C, the detection values of various sensors installed in the load port 2 (in this embodiment, the pressure value of the pressure sensor and the chip position of the mapping sensor) are combined with the values assigned to the FOUP 4 Individual identification is linked and databased using ID4x. In addition, in this embodiment, as shown in the table of FIG. 13 , the ID 4x for individual identification of each FOUP 4, the pressure value of the pressure sensor (the exhaust nozzle pressure value of FIG. 13), and the wafer position of the mapping sensor are (FOUP chip position in Figure 13) Save the measurement date and time together. Furthermore, the data processing unit Cz of the upper-level system C analyzes the collected data and predicts the replacement time of FOUP4. In addition, based on the change in the pressure value of the exhaust gas detected by the pressure sensor provided in association with the exhaust cleaning nozzle 9 of the loading port 2, it is possible to determine the gap between the carry-out port 41 of the FOUP 4 and the FOUP door 43. expand. That is, if it is known that the pressure of the gas discharged from the exhaust cleaning nozzle 9 becomes low, it is known that the amount of exhaust gas passing through the gap between the carry-out port 41 of the FOUP 4 and the FOUP door 43 increases, and it can be determined that the carry-out port of the FOUP 4 The gap between FOUP door 41 and FOUP door 43 is enlarged, so that the deformation of FOUP 4 can be determined. In addition, as described above, when the detection value of the mapping sensor is different from the previous detection value (the position of the wafer W is shifted), the FOUP 4 deforms, and it can be considered that the position of the wafer W has changed. That is, if the deformation of FOUP 4 continues, the gap between the wafers W accommodated in the FOUP 4 in a multi-stage manner changes. Therefore, by detecting such a change, the deformation of the FOUP 4 is determined, and the wafer W is accommodated in an inclined posture by detecting situation, the deformation of FOUP4 can be determined.
如圖11（a）所示，本實施方式中的資料處理部Cz包含：電腦構Cz1，其根據由特定的感測器2c（在本實施方式中為壓力感測器、映射感測器）檢測出的感測器值（壓力值、晶片位置）來計算統計資料；比較機構Cz2，其對與特定的個體識別用ID4x相關聯的感測器值和由電腦構Cz1計算出的計算結果進行比較；以及預測結果輸出機構Cz3，其基於由比較機構Cz2比較出的結果來計算FOUP4的更換時期並輸出預測結果。即，本實施方式中的資料處理部Cz基於將儲存、儲備於資料庫Cd的資料在每個各種感測器中平均化的數值來預測FOUP4的更換時期。在此，“預測結果輸出機構Cz3”相當於本發明的基於由“比較機構比較出的結果來輸出基板收納容器的狀態的狀態輸出機構”，是“狀態輸出機構”的一個例子。As shown in FIG. 11(a) , the data processing unit Cz in this embodiment includes a computer mechanism Cz1, which is configured based on a specific sensor 2c (in this embodiment, a pressure sensor or a mapping sensor). The detected sensor values (pressure value, chip position) are used to calculate statistics; the comparison mechanism Cz2 compares the sensor values associated with the specific individual identification ID4x and the calculation results calculated by the computer mechanism Cz1 comparison; and a prediction result output unit Cz3 that calculates the replacement period of FOUP 4 based on the comparison result by the comparison unit Cz2 and outputs the prediction result. That is, the data processing unit Cz in this embodiment predicts the replacement time of the FOUP 4 based on the average value of the data stored and reserved in the database Cd for each of the various sensors. Here, the "prediction result output mechanism Cz3" corresponds to the "status output mechanism that outputs the status of the substrate storage container based on the comparison result by the comparison mechanism" in the present invention, and is an example of the "status output mechanism".
具體而言，如圖11（b）的流程圖所示，資料處理部Cz的電腦構Cz1進行如下處理：從資料庫Cd對FOUP4的每個個體識別用ID4x取得資料，對每個個體識別用ID4x將各種感測器值曲線化的處理；按照感測器的種類將各個體識別用ID4x的曲線化後的感測器值（感測器值曲線）平均化的處理、也就是按照感測器2c的每個種類製成感測器值平均曲線的處理（計算統計資料的處理）。圖12（a）中示出了與個體識別用ID“A”相關聯的“第一感測器的感測器值”（例如壓力感測器的壓力值）相關的“感測器值曲線”的一個例子，該圖（b）中示出了與個體識別用ID“A”相關聯的“第二感測器的感測器值”（例如映射感測器的晶片位置）相關的“感測器值曲線”的一個例子。另外，該圖（c）中示出了與個體識別用ID“A”相關聯的第一感測器的感測器值相關的“感測器值曲線”、與個體識別用ID“B”相關聯的第一感測器的感測器值相關的“感測器值曲線”、以及基於這些多個“感測器值曲線”製成的“與第一感測器相關的感測器值平均曲線”的一個例子。Specifically, as shown in the flowchart of FIG. 11(b), the computer structure Cz1 of the data processing unit Cz performs the following processing: acquires data for each individual identification ID4x of FOUP4 from the database Cd, and obtains data for each individual identification ID4x of the FOUP4. ID4x is a process that curves various sensor values; a process that averages the curved sensor values (sensor value curve) of each individual identification ID4x according to the type of sensor, that is, according to the sensor type. A process of creating an average curve of sensor values for each type of device 2c (process of calculating statistical data). FIG. 12(a) shows a "sensor value curve" related to the "sensor value of the first sensor" (for example, the pressure value of the pressure sensor) associated with the individual identification ID "A". "An example of this, Figure (b) shows "the sensor value of the second sensor" (for example, the chip position of the mapping sensor) associated with the individual identification ID "A" An example of a "sensor value curve". In addition, FIG. (c) shows a "sensor value curve" related to the sensor value of the first sensor associated with the individual identification ID "A", and the individual identification ID "B". The “sensor value curve” related to the sensor value of the associated first sensor, and the “sensor value curve” related to the first sensor made based on these multiple “sensor value curves” An example of a value averaging curve.
在製成感測器值平均曲線的處理之後，資料處理部Cz的比較機構Cz2對感測器值平均曲線和針對每個個體識別用ID4x製成的感測器值曲線進行解析（比較、研究）。作為該情況的解析，例如能夠包含與感測器值平均曲線相比較的感測器值的偏離度、對向設定的閾值的接近程度（或者是否超過閾值）等的運算、判斷處理。圖12（c）同時示出了第一感測器的感測器值平均曲線、和與個體識別用ID“A”相關聯的第一感測器的感測器值相關的感測器值曲線。After the process of creating the sensor value average curve, the comparison mechanism Cz2 of the data processing unit Cz analyzes (compares, studies) the sensor value average curve and the sensor value curve created for each individual identification ID4x. ). Analysis of this situation may include, for example, computation and judgment processing such as the degree of deviation of the sensor value compared with the sensor value average curve, the degree of proximity to the set threshold (or whether it exceeds the threshold), and the like. FIG. 12(c) simultaneously shows the sensor value average curve of the first sensor and the sensor value related to the sensor value of the first sensor associated with the individual identification ID "A". curve.
並且，資料處理部Cz的預測結果輸出機構Cz3基於相同個體識別用ID4x的各種感測器的檢測值來對更換時期預測結果進行解析（比較、研究），來預測每個個體識別用ID4x（每個FOUP4）的更換時期，並輸出其預測結果。該情況下，能夠對每個感測器的種類設定優先順位（加權），或者進行運算平均值等的處理。即，能夠設定為，在預測更換時期按每個感測器的種類而不同的情況（例如基於第一感測器的檢測值的更換時期為4月23日，基於第二感測器的檢測值的更換時期為4月25日的情況）下，輸出最早的預測更換時期（4月23日）作為FOUP的預測更換時期，或者輸出各感測器的預測更換時期的平均或者中間值（4月24日）作為FOUP的預測更換時期，或者輸出最晚的預測更換時期（4月25日）作為FOUP的預測更換時期。另外，也可以不進行上述的加權、平均值的運算等，而是任意地設定感測器值的閾值、FOUP4的使用次數等，在處於設定的閾值、使用次數等的範圍以外時，作為FOUP4的更換時期來輸出。Furthermore, the prediction result output unit Cz3 of the data processing unit Cz analyzes (compares and studies) the replacement time prediction results based on the detection values of various sensors of the same individual identification ID4x, and predicts each individual identification ID4x (each individual identification ID4x). FOUP4) replacement period, and output its prediction results. In this case, it is possible to set a priority (weighting) for each sensor type, or to perform processing such as calculating an average value. That is, it can be set so that when the estimated replacement time is different for each type of sensor (for example, the replacement time based on the detection value of the first sensor is April 23, and the replacement time based on the detection value of the second sensor If the replacement time of the value is April 25), output the earliest predicted replacement time (April 23) as the predicted replacement time of FOUP, or output the average or median value of the predicted replacement time of each sensor (4 April 24th) as the predicted replacement period of FOUP, or output the latest predicted replacement period (April 25th) as the predicted replacement period of FOUP. In addition, it is also possible to arbitrarily set the threshold value of the sensor value, the number of uses of FOUP4, etc., without performing the above-mentioned weighting, average calculation, etc., and when it is outside the range of the set threshold value, number of uses, etc., as FOUP4 The replacement period is output.
資料處理部Cz輸出的每個個體識別用ID4x（每個FOUP4）的更換時期預測結果例如顯示在使用者能夠目視確認的顯示器上，或者設定為從適當的揚聲器等作為生髮出來進行報告，由此用戶能夠把握FOUP4的更換時期預測結果。The replacement time prediction result for each individual identification ID 4x (for each FOUP 4) output by the data processing unit Cz is displayed on a display that the user can visually confirm, or is set to be reported from an appropriate speaker or the like. Users can grasp the replacement time prediction results of FOUP4.
根據這樣的本實施方式的基板收納容器管理系統1以及基板收納容器管理方法，利用上位系統C將賦予在較多的製造現場已經使用的FOUP4的個體識別用ID4x、與設置在裝載埠2的感測器2c的檢測值相關聯並資料庫化，利用上位系統C的資料處理部Cz來解析資料庫Cd內的資料並輸出每個個體識別用ID4x的FOUP4的狀態（具體而言，更換時期的預測結果），從而能夠取得FOUP4的劣化資訊。通過靈活使用這樣的本發明的基板收納容器管理系統1，使用者能夠把握基於設置在裝載埠2的感測器2c的檢測值預測的每個FOUP4的更換時期。並且，通過將更換時期較近的FOUP4、到達更換時期的FOUP4更換成新的FOUP4，能夠防止或抑制FOUP4的變形或歪斜引起的不良狀況，即FOUP4的搬出搬入口41與FOUP門43的間隙變大、氣體通過該間隙流入或漏出到FOUP4內之類的不良狀況，防止將FOUP4內的氣體置換為氮氣的清洗處理後，氮氣從FOUP4內向FOUP4外流出、或者大氣（氧氣）向FOUP4內流入的事態，從而能夠將預定的期間FOUP4內部維持為低氧氣濃度，能夠防止或抑制容納在FOUP4內的晶片的表面被氧化的事態。其結果，能夠降低FOUP4的變形引起的錯誤產生頻度，半導體製造裝置的停止時間變短，提高生產性。According to the substrate storage container management system 1 and the substrate storage container management method of the present embodiment, the upper-level system C is used to assign the individual identification ID 4x to the FOUP 4 that has been used at many manufacturing sites, and the ID 4x installed in the loading port 2 The detection values of the detector 2c are associated and databased, and the data processing unit Cz of the upper-level system C is used to analyze the data in the database Cd and output the status of FOUP4 of each individual identification ID4x (specifically, the replacement time Prediction results), so that the degradation information of FOUP4 can be obtained. By utilizing the substrate storage container management system 1 of the present invention, the user can grasp the replacement time of each FOUP 4 predicted based on the detection value of the sensor 2 c installed in the loading port 2 . In addition, by replacing the FOUP 4 with a recent replacement time or the FOUP 4 that has reached the replacement time with a new FOUP 4, it is possible to prevent or suppress a malfunction caused by deformation or distortion of the FOUP 4, that is, a change in the gap between the carry-out entrance 41 of the FOUP 4 and the FOUP door 43. Large, undesirable conditions such as gas flowing in or leaking into FOUP4 through this gap, preventing nitrogen from flowing out of FOUP4 or atmospheric air (oxygen) flowing into FOUP4 after the cleaning process of replacing the gas in FOUP4 with nitrogen. Thus, the oxygen concentration inside the FOUP 4 can be maintained at a low level for a predetermined period, and the surface of the wafer accommodated in the FOUP 4 can be prevented or suppressed from being oxidized. As a result, the frequency of errors caused by deformation of the FOUP 4 can be reduced, the downtime of the semiconductor manufacturing apparatus can be shortened, and productivity can be improved.
尤其是，如果考慮在全部FOUP4上設置感測器等設備類的作業規模大且複雜，則本實施方式的基板收納容器管理系統1以及基板收納容器管理方法僅對現行的FOUP4賦予個體識別用ID4x即可，與作為現有技術敘述的在每個FOUP4設置感測器的方式相比較，在不需要在各FOUP4上安裝感測器用的電源這一上也有利，不需要重新準備能夠適用於基板收納容器管理系統1以及基板收納容器管理方法的專用的基板收納容器，容易導入製造現場（製造生產線）。In particular, considering the large-scale and complicated operation of installing devices such as sensors on all FOUPs 4, the substrate container management system 1 and the substrate container management method of this embodiment only assign the individual identification ID 4x to the current FOUP4. That is, compared with the conventional method of installing a sensor in each FOUP 4, it is also advantageous in that it is not necessary to install a power supply for the sensor in each FOUP 4, and it is suitable for board storage without the need for new preparation. The dedicated substrate storage container of the container management system 1 and the substrate storage container management method can be easily introduced into a manufacturing site (manufacturing production line).
此外，本實施方式的基板收納容器管理系統1以及基板收納容器管理方法通過將感測器的設置物件設定為裝載埠2，從而與作為現有技術敘述的在每個FOUP4上設置感測器的方式相比，作為維修物件的感測器的絕對數量較少，可減輕維修的負擔，並且在不需要留意FOUP4的熱水清洗時的熱或浸水引起的感測器等設備類的故障這一點上也有利。並且，相對於裝載埠2的ID讀取機構2x、感測器2c、以及裝載埠側通信機構2y的電源供給能夠利用裝載埠2所包括的電氣系統比較地容易進行。In addition, the substrate container management system 1 and the substrate container management method of the present embodiment set the installation object of the sensor to the loading port 2, thereby being different from the method of installing sensors in each FOUP 4 described as a conventional technology. Compared with the FOUP4, the absolute number of sensors that need to be repaired is small, which can reduce the burden of maintenance, and there is no need to pay attention to equipment failures such as sensors caused by heat or water immersion during hot water cleaning of FOUP4. Also beneficial. In addition, power supply to the ID reading mechanism 2x, the sensor 2c, and the loading port side communication mechanism 2y of the loading port 2 can be relatively easily performed using the electrical system included in the loading port 2.
另外，根據本實施方式的基板收納容器管理系統1以及基板收納容器管理方法，還能夠進行基板收納容器需要的預測。即，根據作為基板收納容器的FOUP4的更換時期預測的結果，能夠將預測為同時期更換（廢棄）的FOUP4的數量作為新的FOUP4的導入數來進行需要預測。並且，根據本實施方式的基板收納容器管理系統1以及基板收納容器管理方法，將資料庫Cd中收集的資料作為大資料來靈活利用，認為也可以通過資料採擷來尋求基板收納容器劣化原因。In addition, according to the substrate storage container management system 1 and the substrate storage container management method of this embodiment, it is also possible to predict the need for substrate storage containers. That is, based on the prediction result of the replacement time of FOUP4 as the substrate storage container, the need can be predicted by using the number of FOUP4 predicted to be replaced (discarded) at the same time as the number of introduction of new FOUP4. Furthermore, according to the substrate container management system 1 and the substrate container management method of this embodiment, the data collected in the database Cd are utilized as large data, and it is considered that the cause of the degradation of the substrate container can be found through data collection.
另外，也可以如以下的第二實施方式那樣，在保存於資料庫Cd中的資料的解析中使用機械學習。In addition, as in the second embodiment below, machine learning may be used to analyze the data stored in the database Cd.
在第一實施方式中，上位系統C的資料處理部Cz是圖11（a）所示的那樣的結構，但在第二實施方式中使用圖14所示的資料處理部Ce。此外，資料處理部Ce以外的結構與第一實施方式相同，因此省略詳細的說明。In the first embodiment, the data processing unit Cz of the host system C has the structure shown in FIG. 11(a) . However, in the second embodiment, the data processing unit Ce shown in FIG. 14 is used. In addition, the structure other than the data processing unit Ce is the same as that of the first embodiment, so detailed description is omitted.
在本實施方式中，與第一實施方式（圖1）相同，在FOUP4利用裝載埠2開閉FOUP門43的過程中，使用單個或者多個感測器2c而直接或者間接地檢測FOUP4的狀態。另外，將由感測器2c檢測出的感測器值保存（儲存、儲備）在上位系統C的資料庫Cd中。此外，如圖13所示的表格那樣，保存在資料庫Cd中的資料利用關聯機構Cy將個體識別用ID4x與由感測器2c檢測出的感測器值相關聯起來，並作為賦予了計測日期和時間的記錄來儲存。此外，保存在資料庫Cd中的資料由圖14所示的資料處理部Ce處理、解析，靈活用於FOUP4的狀態或者更換時期預測等預測維護。In this embodiment, like the first embodiment ( FIG. 1 ), when the FOUP 4 opens and closes the FOUP door 43 using the loading port 2 , a single or multiple sensors 2 c are used to directly or indirectly detect the state of the FOUP 4 . In addition, the sensor value detected by the sensor 2c is saved (stored, reserved) in the database Cd of the host system C. In addition, as shown in the table shown in FIG. 13, the data stored in the database Cd uses the association mechanism Cy to associate the individual identification ID 4x with the sensor value detected by the sensor 2c, and assigns the measurement as a result. Date and time records are stored. In addition, the data stored in the database Cd is processed and analyzed by the data processing unit Ce shown in Fig. 14, and is flexibly used for predictive maintenance such as the status of the FOUP4 or prediction of replacement time.
以下對資料處理部Ce的具體的結構進行敘述。如圖14所示的方塊圖那樣，資料處理部Ce包括學習機構Ce1和預測結果輸出機構Ce2。學習機構Ce1例如由神經網路構成。The specific structure of the data processing unit is described below. As shown in the block diagram of FIG. 14 , the data processing unit Ce includes a learning unit Ce1 and a prediction result output unit Ce2. The learning mechanism Ce1 is composed of a neural network, for example.
以下，對本實施方式的資料處理部Ce所包括的學習機構Ce1的已學習模型的構建順序進行敘述。首先，從資料庫Cd提取每個FOUP4的感測器2c的感測器值的時間序列資料、和FOUP4實際劣化、變形、不能使用的日期和時間或者更換的日期和時間，輸入至學習機構Ce1的神經網路。於是，在神經網路中，各種參數被輸入的資料更新，進行學習。通過重複該操作，構建已學習模式型。Hereinafter, the procedure for constructing the learned model of the learning mechanism Ce1 included in the data processing unit Ce of this embodiment will be described. First, the time series data of the sensor value of the sensor 2c of each FOUP4 and the date and time of actual degradation, deformation, unusability or replacement of the FOUP4 are extracted from the database Cd, and input to the learning institution Ce1 neural network. Therefore, in the neural network, various parameters are updated by the input data and learn. By repeating this operation, the learned pattern is constructed.
若在按以上的順序構建的已學習模型中輸入保存在資料庫Cd中的每個FOUP4的資料，則能夠輸出FOUP4的狀態的推定、更換時期的預測結果。因此，使用預測結果輸出機構Ce2輸出從已學習模型輸出的FOUP4的狀態、更換時期預測。If the data of each FOUP4 stored in the database Cd is input to the learned model constructed in the above procedure, the estimation of the state of the FOUP4 and the prediction result of the replacement time can be output. Therefore, the prediction result output unit Ce2 is used to output the status of FOUP 4 and the replacement time prediction output from the learned model.
在本實施方式中，使用神經網路構建學習模型，但也可以使用其以外的方法。另外，在本實施方式中使用了有指導學習，但也可以使用無指導學習，也可以使用隨時更新學習模型那樣的阿拉伯數字。並且，在本實施方式中，從資料庫Cd提取FOUP4不能使用的日期和時間來構建已學習模型，但也可以使用FOUP4能夠正常利用時的資料來構建已學習模型，並進行預測維護。In this embodiment, a neural network is used to construct a learning model, but other methods may also be used. In addition, in this embodiment, guided learning is used, but unguided learning may also be used, or Arabic numerals such that the learning model is updated at any time may be used. Furthermore, in this embodiment, the date and time when FOUP4 cannot be used is extracted from the database Cd to construct a learned model. However, the learned model may also be constructed using data when FOUP4 is normally available, and predictive maintenance may be performed.
並且，也可以如以下的第三實施方式那樣，使用資料處理部Cz輸出的每個個體識別用ID4x的FOUP4的狀態、保存在資料庫Cd中的其它資料，對每個FOUP4調整裝載埠2的動作。Furthermore, as in the third embodiment below, the status of the FOUP 4 for each individual identification ID 4x output by the data processing unit Cz and other data stored in the database Cd may be used to adjust the load port 2 for each FOUP 4. action.
第一實施方式的上位系統C是圖1所示的那樣的結構，但在第三實施方式中使用圖15所示的上位系統C。此外，裝載埠2的結構與第一實施方式相同，因此省略詳細的說明。The higher-level system C of the first embodiment has the structure shown in FIG. 1 , but in the third embodiment, the higher-level system C shown in FIG. 15 is used. In addition, the structure of the load port 2 is the same as that of the first embodiment, so detailed description is omitted.
如圖15所示，本實施方式的上位系統C包含上位系統側通信機構Cx、關聯機構Cy、資料庫Cd、資料處理部Cz、以及動作調整部Ca。上位系統側通信機構Cx能夠在與裝載埠側通信機構2y之間雙方向地發送或接收資料信號，接收由裝載埠2的ID讀取機構2x讀取的個體識別用ID4x和由感測器2c檢測出的感測器值。接收的感測器值可以是一種也可以是多種。關聯機構Cy將個體識別用ID4x與感測器值相互關聯起來。資料庫Cd儲存並儲備由關聯機構Cy關聯後的資料。與第一實施方式相同（參照圖13），在資料庫Cd中儲備有對個體識別用ID4x與感測器值關聯後的資料賦予了計測日期和時間的資料。資料處理部Cz解析資料庫Cd內的資料並輸出每個個體識別用ID4x的狀態。在本實施方式中，對於資料處理部Cz輸出的FOUP4的狀態也與個體識別用ID4x相關聯並保存在資料庫Cd中。As shown in FIG. 15 , the higher-level system C of this embodiment includes the upper-level system side communication mechanism Cx, the related mechanism Cy, the database Cd, the data processing unit Cz, and the operation adjustment unit Ca. The upper system side communication mechanism Cx can send or receive data signals in both directions with the loading port side communication mechanism 2y, and receives the individual identification ID 4x read by the ID reading mechanism 2x of the loading port 2 and the sensor 2c Detected sensor value. The received sensor value can be one or multiple. The association Cy associates the ID4x for individual identification with the sensor value. The database Cd stores and reserves the data associated with the related organization Cy. Similar to the first embodiment (see FIG. 13 ), the database Cd stores data in which the individual identification ID 4x is associated with the sensor value and the measurement date and time are assigned thereto. The data processing unit Cz analyzes the data in the database Cd and outputs the status of each individual identification ID4x. In the present embodiment, the status of FOUP4 output to the data processing unit Cz is also associated with the individual identification ID4x and stored in the database Cd.
對本實施方式的裝載埠2以及上位系統C的FOUP4的處理順序進行說明。首先，若在裝載埠2的載置台23載置有FOUP4，則由裝載埠2的ID讀取機構2x讀取FOUP4的個體識別用ID4x。接著，裝載埠側通信機構2y將FOUP4的個體識別用ID4x發送至上位元系統側通信機構Cx。在上位系統C中，在資料庫Cd查詢接收到的個體識別用ID4x的FOUP4的狀態資料，將其結果獲得的狀態資料登錄至動作調整部Ca。在動作調整部Ca中，與FOUP4的狀態一致地調整裝載埠2處理FOUP4時的動作。The processing procedures of the load port 2 and the FOUP 4 of the upper-level system C in this embodiment will be described. First, when FOUP4 is placed on the mounting table 23 of the loading port 2, the ID reading mechanism 2x of the loading port 2 reads the individual identification ID 4x of the FOUP4. Next, the loading port side communication unit 2y transmits the individual identification ID 4x of the FOUP 4 to the higher-level system side communication unit Cx. In the host system C, the status data of FOUP4 of the received individual identification ID 4x is searched in the database Cd, and the status data obtained as a result is registered in the operation adjustment unit Ca. The operation adjustment unit Ca adjusts the operation of the load port 2 when processing the FOUP4 in accordance with the state of the FOUP4.
例如，如果是變形還沒有進展的FOUP4，則經由上位系統側通信機構Cx向裝載埠2發送指示，以便如通常那樣進行處理，如果是變形或劣化已有進展的FOUP4，則在裝載埠2的處理時產生錯誤的可能性較高，因此例如經由上位系統側通信機構Cx向裝載埠2發送指示，以便將錯誤產生時的重試次數設定得較多。這樣，通過根據FOUP4的狀態來設定重試次數（相當於本發明的“與基板收納容器的處理相關的控制值”），從而即使在變形或劣化已經進展的FOUP4中，也不會在裝載埠2頻發錯誤，能夠順暢地進行處理。For example, if the deformation of FOUP4 has not progressed yet, an instruction is sent to the load port 2 via the upper-level system side communication mechanism Cx to perform processing as usual. Since an error is likely to occur during processing, for example, an instruction is sent to the load port 2 via the upper-level system side communication mechanism Cx to set a larger number of retries when an error occurs. In this way, by setting the number of retries according to the state of the FOUP 4 (corresponding to the "control value related to the processing of the substrate storage container" in the present invention), even if the deformation or deterioration of the FOUP 4 has progressed, the loading port will not be damaged. 2 Frequent errors can be handled smoothly.
另外，動作調整部Ca調整控制值時使用的資料不僅可以參照FOUP4的狀態，也可以參照其它資料。例如，也可以預先將與在裝載埠2的FOUP4的處理時產生的錯誤相關的資訊與個體識別用ID相關聯並保存在資料庫Cd中，動作調整部Ca基於保存在資料庫Cd中的與錯誤相關的資訊，來對每個FOUP4調整裝載埠2的動作。具體而言，動作調整部Ca計算每個FOUP4容易產生的錯誤，對每個FOUP4調整裝載埠2的動作即可。作為該情況的一個例子，可列舉如下情況：如果是在裝載埠門22與FOUP4的對接處理時容易產生錯誤的FOUP4，則以使裝載埠2與FOUP4的對接處理時的壓力（相當於本發明的“與基板收納容器的處理相關的控制值”）比通常的對接處理的壓力更強的方式，調整裝載埠2的動作。這樣，通過預先把握容易產生的錯誤，並預先對每個FOUP4調整預先裝載埠2的動作，能夠提前防止錯誤的產生。此外，每個FOUP4的容易產生的錯誤的計算能夠使用統計方法、資料採擷、機械學習等各種各樣的方法。另外，每個FOUP4容易產生的錯誤的計算也可以在動作調整部Ca以外進行。例如，也可以通過由資料處理部Cd計算每個FOUP4容易產生的錯誤，並向動作調整部Ca輸入計算結果，從而動作調整部Ca調整裝載埠2的動作。In addition, the data used when the operation adjustment unit Ca adjusts the control value can refer to not only the status of FOUP4 but also other data. For example, the information related to the error occurring during the processing of FOUP 4 of the load port 2 may be associated with the individual identification ID in advance and stored in the database Cd, and the operation adjustment unit Ca may be based on the AND stored in the database Cd. Error related information to adjust the behavior of load port 2 for each FOUP4. Specifically, the operation adjustment unit Ca calculates errors that are likely to occur for each FOUP 4 and adjusts the operation of the load port 2 for each FOUP 4 . As an example of this case, the following case can be cited: if the FOUP 4 is prone to errors during the docking process of the load port 22 and FOUP 4, the pressure during the docking process of the load port 2 and FOUP 4 (equivalent to the present invention "Control value related to the processing of the substrate storage container") adjusts the operation of the loading port 2 so that the pressure is stronger than that of the normal docking process. In this way, by grasping errors that are likely to occur in advance and adjusting the operation of the preload port 2 for each FOUP 4 in advance, the occurrence of errors can be prevented in advance. In addition, various methods such as statistical methods, data collection, and machine learning can be used to calculate the errors that are prone to occur in each FOUP4. In addition, calculation of errors that are likely to occur for each FOUP 4 may be performed outside the operation adjustment unit Ca. For example, the data processing unit Cd may calculate errors that are likely to occur in each FOUP 4 and input the calculation results to the operation adjustment unit Ca, so that the operation adjustment unit Ca adjusts the operation of the load port 2 .
此外，也可以預先將儲存在FOUP4中的與對晶片W進行處理相關的資訊與個體識別用ID相關聯地保存在資料庫Cd中，動作調整部Ca基於與對晶片W進行處理相關的資訊，來對每個FOUP4調整裝載埠2的動作。例如，在下一工序的裝載埠2處理儲存有熱處理後的晶片W的FOUP4的情況下，在下一工序的向裝載埠2的搬運中，FOUP4內的氣氛被冷卻，FOUP4內的氣壓變動。該情況下，有時FOUP門43難以開閉，因此只要使重試次數（相當於本發明的“與基板收納容器的處理相關的控制值”）比通常多即可。這樣，在裝載埠2上載置有FOUP4時，使用個體識別用ID4x並參照與前一工序的晶片W的處理相關的資訊，來進行裝載埠2的動作調整，由此不會在裝載埠2頻發錯誤，能夠順暢地進行處理。In addition, the information related to the processing of the wafer W stored in the FOUP 4 may be stored in the database Cd in advance in association with the individual identification ID, and the operation adjustment unit Ca may be based on the information related to the processing of the wafer W. To adjust the behavior of load port 2 for each FOUP4. For example, when the FOUP 4 storing the heat-processed wafer W is processed in the load port 2 of the next step, the atmosphere in the FOUP 4 is cooled during transportation to the load port 2 in the next step, and the air pressure in the FOUP 4 fluctuates. In this case, it may be difficult to open and close the FOUP door 43 , so the number of retries (corresponding to the “control value related to the processing of the substrate storage container” in the present invention) may be increased than usual. In this way, when the FOUP 4 is loaded on the load port 2, the operation of the load port 2 is adjusted by using the individual identification ID 4x and referring to the information related to the processing of the wafer W in the previous process, so that the load port 2 frequency is not changed. Errors can be handled smoothly.
此外，在本實施方式中，動作調整部Ca利用FOUP4的狀態、與FOUP4的處理時產生的錯誤相關的資訊、以及儲存在FOUP4中的與對晶片W進行的處理相關的資訊中任一個，來進行裝載埠2的動作調整。但是，也可以基於其以外的資訊來進行裝載埠2的動作調整，也可以組合多個資訊來進行裝載埠2的動作調整。In addition, in the present embodiment, the operation adjustment unit Ca uses any one of the status of the FOUP 4, information about errors that occur during processing of the FOUP 4, and information about the processing of the wafer W stored in the FOUP 4. Adjust the operation of load port 2. However, the operation of the load port 2 may be adjusted based on other information, or a plurality of pieces of information may be combined to adjust the operation of the load port 2.
以上，對本發明的實施方式進行了說明，但本發明並不限於上述實施方式的結構。例如，在上述的實施方式中，關聯機構Cy、資料庫Cd、資料處理部Cz以及動作調整部Ca設置在與裝載埠2不同的上位系統C。但是，這些各功能部並非必須設置在上位系統C。例如，也可以將關聯機構Cy設置在裝載埠2，從裝載埠2向上位系統C發送預先在裝載埠2關聯的個體識別用ID4x和感測器值。對於資料庫Cd、資料處理部Cz以及動作調整部Ca，同樣也可以設置在裝載埠2。The embodiments of the present invention have been described above. However, the present invention is not limited to the structures of the above-mentioned embodiments. For example, in the above-described embodiment, the correlation mechanism Cy, the database Cd, the data processing unit Cz, and the operation adjustment unit Ca are provided in the upper-level system C that is different from the load port 2. However, these functional units do not necessarily need to be provided in the upper-level system C. For example, the correlation mechanism Cy may be installed in the load port 2, and the individual identification ID 4x and the sensor value that have been previously associated in the load port 2 may be sent from the load port 2 to the upper system C. The database Cd, the data processing unit Cz, and the operation adjustment unit Ca can also be provided in the load port 2.
另外，在上述的實施方式中，例示了從裝載埠向上位系統發送的感測器值為兩種感測器的感測器值的方式，但從裝載埠向上位系統發送的感測器值也可以是一種感測器的感測器值的方式、也可以是三種以上感測器的感測器值的方式。另外，上位系統的設置場所無論在進行半導體製造的工廠內還是工廠外，都可以用一個上位系統統一管理或處理多個半導體製造工廠、多個半導體製造工序的資料。並且，也可以將上位系統的功能分散到多個電腦、伺服器。對於保存在資料庫中的資料的形式，也可以以實施方式那樣的表格以外的形式來保存。另外，在上述實施方式中，通過對保存在資料庫中的資料添加計測日期和時間，來表示資料的時間序列，但也可以置換為能夠把握時間序列的其它資料。In addition, in the above embodiment, the sensor value transmitted from the load port to the upper system is exemplified as the sensor value of two sensors. However, the sensor value transmitted from the load port to the upper system is It may be in the form of sensor values of one sensor, or it may be in the form of sensor values of three or more sensors. In addition, whether the upper-level system is installed in a factory where semiconductor manufacturing is performed or outside the factory, one upper-level system can be used to centrally manage or process data of multiple semiconductor manufacturing factories and multiple semiconductor manufacturing processes. In addition, the functions of the upper-level system can also be distributed to multiple computers and servers. The data stored in the database may be stored in a format other than a table as in the embodiment. In addition, in the above embodiment, the time series of the data is expressed by adding the measurement date and time to the data stored in the database, but it may be replaced with other data that can grasp the time series.
作為本發明中的“直接或者間接地檢測FOUP的狀態的感測器”，除了上述的“排氣噴嘴的壓力感測器”、“映射感測器”以外，還能夠列舉“可直接或者間接地檢測從容器門（FOUP門）的全閉位置至敞開位置的移動所花的時間的感測器”、測定“容器門（FOUP門）的閂鎖鑰匙的旋轉轉矩的轉矩感測器”。通過將“從容器門（FOUP門）的全閉位置至敞開位置的移動時間”作為資料來取得，能夠把握容器門（FOUP門）是否變得難以打開，根據容器門（FOUP門）從全閉位置至敞開位置的移動時間變長的感測器值（資料），能夠判斷為有容器門（FOUP門）難以打開的現象、也就是有基板收納容器變形的可能性。另外，也可以安裝能夠計測在FOUP的對接處理時、容器門（FOUP門）與裝載埠門對接所需要的轉矩、壓力的感測器。As the "sensor that directly or indirectly detects the state of the FOUP" in the present invention, in addition to the above-mentioned "pressure sensor of the exhaust nozzle" and "mapping sensor", there can also be listed "sensor that directly or indirectly detects the state of the FOUP". "A sensor that accurately detects the time it takes for the container door (FOUP door) to move from the fully closed position to the open position" and a "torque sensor that measures the rotational torque of the latch key of the container door (FOUP door)" ". By acquiring the "movement time from the fully closed position of the container door (FOUP door) to the open position" as data, it is possible to grasp whether the container door (FOUP door) becomes difficult to open, and according to the change of the container door (FOUP door) from the fully closed position, it is possible to grasp If the sensor value (data) shows that the movement time from the position to the open position becomes longer, it can be determined that the container door (FOUP door) is difficult to open, that is, there is a possibility that the substrate storage container is deformed. In addition, a sensor capable of measuring the torque and pressure required for the docking of the container door (FOUP door) and the loading port door during the docking process of the FOUP may be installed.
另外，通過將“容器門（FOUP門）的閂鎖鑰匙的旋轉轉矩值”作為資料來取得，能夠把握閂鎖鑰匙是否變得難以旋轉，根據旋轉轉矩值為較大的資料，能夠判斷為有閂鎖鑰匙變得難以旋轉的現象、也就是有基板收納容器變形的可能性。In addition, by obtaining the "rotation torque value of the latch key of the container door (FOUP door)" as data, it is possible to grasp whether the latch key has become difficult to rotate, and based on the data with a large rotation torque value, it is possible to determine This is because the latch key may become difficult to rotate, which means that the substrate storage container may be deformed.
另外，關於為了將容器門（FOUP門）連結於裝載埠門而設置在裝載埠門的連結機構，也可以在裝載埠設置能夠檢測該連結機構的適當的連結狀態的感測器，根據該感測器的檢測值的變化來推測或判斷基板收納容器的變形引起的連結不良。此外，通過根據從排氣噴嘴排出的廢氣的氧氣濃度計取得感測器值，能夠推定或判斷基板收納容器的變形引起的外部空氣的流入對基板收納容器內的晶片有多大程度的影響。另外，通過檢測設置在裝載埠的載置臺上的鎖定爪的鎖定錯誤，能夠推定設置在基板收納容器的底面的被鎖定部（與鎖定爪卡合的部分）的刮削。並且，也可以計測鎖定爪的鎖定錯誤次數。In addition, regarding the connection mechanism provided in the load port door in order to connect the container door (FOUP door) to the load port door, a sensor capable of detecting the appropriate connection state of the connection mechanism may be provided in the load port. Based on the sensor, The change in the detection value of the detector is used to estimate or judge the connection failure caused by the deformation of the substrate storage container. In addition, by obtaining a sensor value based on an oxygen concentration meter of the exhaust gas discharged from the exhaust nozzle, it is possible to estimate or determine the extent to which the inflow of outside air due to deformation of the substrate container affects the wafers in the substrate container. In addition, by detecting a locking error of the locking pawl provided on the mounting table of the loading port, it is possible to estimate scraping of the locked portion (the portion engaged with the locking pawl) provided on the bottom surface of the substrate storage container. Furthermore, the number of locking errors of the locking pawl can also be measured.
另外，上位系統的資料處理部也可以通過利用資料採擷的方法來輸出基板收納容器的狀態（例如預測基板收納容器的更換時期）。In addition, the data processing unit of the upper-level system can also output the status of the substrate storage container (for example, predicting the replacement time of the substrate storage container) by using a data acquisition method.
在檢測（計測）間隔時間，相對於標準間隔時間花費了時間的情況下，如果僅是特定的裝載埠花費時間的傾向，則能夠判定為產生了由裝載埠引起的時間損失，報告催促裝載埠的調整的資訊，如果是特定的基板收納容器載置在哪個裝載埠上也花費時間的傾向，則能夠判定為產生了由基板收納容器引起的時間損失，也可以報告以基板收納容器為檢查物件的資訊或者催促更換的資訊。另外，相對於容器門（FOUP門）難以打開的基板收納容器，在動作調整機構將底部清洗處理時的氣體供給量設定得較多以提高基板收納容器的內壓，並以使容器門（FOUP門）容易打開的方式進行了處理的情況下，基板收納容器內的氣氛容易洩漏到外部。這樣，在進行了有裝載埠周邊的氧氣濃度降低的可能性的處理的情況下，也可以向作業者報告。When the detection (measurement) interval takes time compared to the standard interval, if there is only a tendency for a specific load port to take the time, it can be determined that time loss due to the load port has occurred, and a report is made to urge the load port. If the adjustment information shows that a specific substrate storage container tends to take time regardless of which loading port it is placed on, it can be determined that time loss due to the substrate storage container has occurred, and a report can be made that the substrate storage container is an inspection object. information or information urging replacement. In addition, compared with the substrate storage container whose container door (FOUP door) is difficult to open, the operation adjustment mechanism sets the gas supply amount during the bottom cleaning process to be larger to increase the internal pressure of the substrate storage container and open the container door (FOUP door). When handling is performed in such a way that the door) can be easily opened, the atmosphere in the substrate storage container is likely to leak to the outside. In this way, when a process that may reduce the oxygen concentration around the loading port is performed, a report can be made to the operator.
在上述的實施方式中，作為基板收納容器，採用了晶片搬運所使用的FOUP。但是在本發明中也能夠使用FOUP以外的基板收納容器、例如MAC（Multi Applicati on Carrier）、H－MAC（Horizontal-MAC）、FOSB（Front Open Shipping Box）等。In the above-described embodiment, a FOUP used for wafer transportation is used as the substrate storage container. However, in the present invention, substrate storage containers other than FOUP, such as MAC (Multi Application on Carrier), H-MAC (Horizontal-MAC), FOSB (Front Open Shipping Box), etc., can also be used.
在上述的實施方式中，作為底部清洗處理等所使用的環境氣體列舉了氮氣，但並不限定於此，能夠使用乾燥氣體、氬氣等所希望的氣體（惰性氣體）。In the above-described embodiment, nitrogen gas is used as the ambient gas used for bottom cleaning processing, etc., but the invention is not limited thereto, and any desired gas (inert gas) such as dry gas or argon gas can be used.
另外，容器門（FOUP門）也可以在從全閉位置向全開位置移動的過程中暫時成為傾斜姿勢（伴隨描繪部分圓弧狀的軌跡的動作）。In addition, the container door (FOUP door) may temporarily assume a tilted posture (accompanying the movement of drawing a partially arc-shaped trajectory) while moving from the fully closed position to the fully open position.
對於其它各部的具體的結構也不限於上述實施方式，在不脫離本發明的主旨的範圍能夠進行各種變形。The specific structures of other components are not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention.
1‧‧‧基板收納容器管理系統2‧‧‧裝載埠2c‧‧‧感測器2x‧‧‧ID讀取機構2y‧‧‧裝載埠側通信機構21‧‧‧開閉機構21a‧‧‧開口部22‧‧‧裝載埠門23‧‧‧載置台24‧‧‧腳部25‧‧‧水準機台27‧‧‧門移動機構214‧‧‧窗單元215‧‧‧開口部221‧‧‧連結機構231‧‧‧突起232‧‧‧鎖定爪3‧‧‧搬運室31‧‧‧搬運機器人32‧‧‧風扇篩檢程式單元3A‧‧‧前壁面3B‧‧‧後壁面3C‧‧‧控制部3S‧‧‧內部空間4‧‧‧FOUP40‧‧‧埠41‧‧‧搬出搬入口42‧‧‧FOUP主體43‧‧‧FOUP門4S‧‧‧內部空間4x‧‧‧個體識別用ID9‧‧‧清洗噴嘴C‧‧‧上位系統Ca‧‧‧動作調整部Cd‧‧‧資料庫Ce‧‧‧資料處理部Ce1‧‧‧學習機構Ce2‧‧‧預測結果輸出機構Cx‧‧‧上位系統側通信機構Cy‧‧‧關聯機構Cz‧‧‧資料處理部Cz1‧‧‧電腦構Cz2‧‧‧比較機構Cz3‧‧‧預測結果輸出機構D‧‧‧前後方向H‧‧‧上下方向L‧‧‧移動限制部m‧‧‧映射部m1‧‧‧發送器m2‧‧‧接收器m3‧‧‧感測器框架M‧‧‧處理裝置MC‧‧‧控制部MS‧‧‧內部空間P‧‧‧清洗裝置W‧‧‧基板1‧‧‧Substrate storage container management system 2‧‧‧Loading port 2c‧‧‧Sensor 2x‧‧‧ID reading mechanism 2y‧‧‧Loading port side communication mechanism 21‧‧‧Opening and closing mechanism 21a‧‧‧Opening Part 22‧‧‧Loading port door 23‧‧‧Placement table 24‧‧‧Foot 25‧‧‧Leveling machine platform 27‧‧‧Door moving mechanism 214‧‧‧Window unit 215‧‧‧Opening part 221‧‧‧ Linking mechanism 231‧‧‧Protrusion 232‧‧‧Lock claw 3‧‧‧Transportation room 31‧‧‧Transportation robot 32‧‧‧Fan screening program unit 3A‧‧‧Front wall surface 3B‧‧‧Rear wall surface 3C‧‧‧ Control part 3S‧‧‧Inner space 4‧‧‧FOUP40‧‧‧Port 41‧‧‧Moving in and out 42‧‧‧FOUP main body 43‧‧‧FOUP door 4S‧‧‧Inner space 4x‧‧‧ID9 for individual identification ‧‧‧Cleaning nozzle C‧‧‧Superior system Ca‧‧‧Action adjustment department Cd‧‧‧Database Ce‧‧‧Data processing department Ce1‧‧‧Learning institution Ce2‧‧‧Prediction result output mechanism Cx‧‧‧Superior System side communication mechanism Cy‧‧‧Associated institution Cz‧‧‧Data processing department Cz1‧‧‧Computer mechanism Cz2‧‧‧Comparison mechanism Cz3‧‧‧Prediction result output mechanism D‧‧‧Front and rear direction H‧‧‧Up and down direction L ‧‧‧Movement restriction part m‧‧‧Mapping part m1‧‧‧Transmitter m2‧‧‧Receiver m3‧‧‧Sensor frame M‧‧‧Processing device MC‧‧‧Control part MS‧‧‧Internal space P‧‧‧Cleaning device W‧‧‧Substrate
圖1是本發明的第一實施方式的基板收納容器管理系統的方塊線圖。FIG. 1 is a block diagram of a substrate storage container management system according to the first embodiment of the present invention.
圖2是示意性地表示該實施方式的EFEM及其周邊裝置的相對位置關係的側視圖。FIG. 2 is a side view schematically showing the relative positional relationship between the EFEM and its peripheral devices according to the embodiment.
圖3是示意性地表示FOUP從基座離開而且裝載埠門處於全閉位置的狀態的該實施方式的裝載埠的側剖面的圖。3 is a schematic side cross-sectional view of the loading port of the embodiment in a state where the FOUP is separated from the base and the loading port door is in a fully closed position.
圖4是省略一部分地示出該實施方式的裝載埠的立體圖。FIG. 4 is a partially omitted perspective view of the loading port of the embodiment.
圖5是圖4的x方向向視圖。FIG. 5 is a view in the x direction of FIG. 4 .
圖6是圖4的y方向向視圖。FIG. 6 is a y-direction view of FIG. 4 .
圖7是該實施方式中的窗單元的整體立體圖。FIG. 7 is an overall perspective view of the window unit in this embodiment.
圖8是與圖3對應地表示FOUP接近基座而且裝載埠門處於全閉位置的狀態的圖。FIG. 8 is a diagram corresponding to FIG. 3 showing a state in which the FOUP is close to the base and the loading port door is in a fully closed position.
圖9是與圖3對應地表示裝載埠門處於敞開位置的狀態的圖。FIG. 9 is a diagram corresponding to FIG. 3 showing a state in which the loading port door is in an open position.
圖10是表示該實施方式中的映射部的圖。FIG. 10 is a diagram showing a mapping unit in this embodiment.
圖11是該實施方式中的資料處理部的功能方塊圖以及流程圖。FIG. 11 is a functional block diagram and flow chart of the data processing unit in this embodiment.
圖12是示意性地表示該實施方式中的資料處理部的處理內容的圖。FIG. 12 is a diagram schematically showing the processing contents of the data processing unit in this embodiment.
圖13是表示該實施方式中的資料處理部的資料庫（表格）的圖。FIG. 13 is a diagram showing a database (table) of the data processing unit in the embodiment.
圖14是本發明的第二實施方式中的資料處理部的功能方塊圖。FIG. 14 is a functional block diagram of the data processing unit in the second embodiment of the present invention.
圖15是本發明的第三實施方式的基板收納容器管理系統的方塊線圖。FIG. 15 is a block diagram of the substrate storage container management system according to the third embodiment of the present invention.
圖中：1—基板收納容器管理系統，2—裝載埠，23—載置台，2c—感測器，2x—ID讀取機構，2y—裝載埠側通信機構，4—基板收納容器（FOUP），41—搬出搬入口，4x—個體識別用ID，C—上位系統，Ca—動作調整部，Cd—資料庫，Cx—上位系統側通信機構，Cy—關聯機構，Cz—資料處理部，W—基板（晶片）。In the picture: 1—Substrate storage container management system, 2—Loading port, 23—Loading table, 2c—Sensor, 2x—ID reading mechanism, 2y—Loading port side communication mechanism, 4—Substrate storage container (FOUP) , 41—Moving in and out, 4x—ID for individual identification, C—upper system, Ca—action adjustment department, Cd—database, Cx—upper system side communication mechanism, Cy—related organization, Cz—data processing department, W —Substrate (wafer).
1‧‧‧基板收納容器管理系統 1‧‧‧Substrate storage container management system
2‧‧‧裝載埠 2‧‧‧Loading port
2c‧‧‧感測器 2c‧‧‧Sensor
2x‧‧‧ID讀取機構 2x‧‧‧ID reading mechanism
2y‧‧‧裝載埠側通信機構 2y‧‧‧Loading port side communication mechanism
21‧‧‧開閉機構 21‧‧‧Opening and closing mechanism
23‧‧‧載置台 23‧‧‧Placement table
25‧‧‧水準機台 25‧‧‧level machine
4‧‧‧FOUP 4‧‧‧FOUP
40‧‧‧埠 40‧‧‧Port
41‧‧‧搬出搬入口 41‧‧‧Move-out entrance
43‧‧‧FOUP門 43‧‧‧FOUP DOOR
4S‧‧‧內部空間 4S‧‧‧Internal space
4x‧‧‧個體識別用ID 4x‧‧‧ID for individual identification
9‧‧‧清洗噴嘴 9‧‧‧Clean the nozzle
C‧‧‧上位系統 C‧‧‧upper system
Cd‧‧‧資料庫 Cd‧‧‧Database
Cx‧‧‧上位系統側通信機構 Cx‧‧‧upper system side communication mechanism
Cy‧‧‧關聯機構 Cy‧‧‧Affiliated institutions
Cz‧‧‧資料處理部 Cz‧‧‧Data Processing Department
W‧‧‧基板 W‧‧‧Substrate
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| JP2019031789A JP7295384B2 (en) | 2018-05-24 | 2019-02-25 | Substrate storage container management system, load port, substrate storage container management method |
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| KR102389879B1 (en) * | 2020-06-29 | 2022-04-22 | 송춘기 | Efem system equipped with n2 leak prevention |
| CN114548708B (en) * | 2022-01-30 | 2022-08-26 | 弥费实业(上海)有限公司 | Empty wafer box management method and device, computer equipment and storage medium |
| CN116525508B (en) * | 2023-05-23 | 2024-03-26 | 乐孜芯创半导体设备(上海)有限公司 | Closed wafer box loading port and gas replacement method thereof |
| CN117672928B (en) * | 2023-10-19 | 2024-06-25 | 重庆鹰谷光电股份有限公司 | Box opening method |
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| TW202003353A (en) | 2020-01-16 |
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| KR20190134523A (en) | 2019-12-04 |
| JP7256358B2 (en) | 2023-04-12 |
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