TW202003353A - Management system for substrate storage container, load port, and management method for substrate storage container can predict a replacement timing of a substrate storage container - Google Patents

Management system for substrate storage container, load port, and management method for substrate storage container can predict a replacement timing of a substrate storage container Download PDF

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TW202003353A
TW202003353A TW108117924A TW108117924A TW202003353A TW 202003353 A TW202003353 A TW 202003353A TW 108117924 A TW108117924 A TW 108117924A TW 108117924 A TW108117924 A TW 108117924A TW 202003353 A TW202003353 A TW 202003353A
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storage container
substrate storage
foup
loading port
sensor
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TWI821293B (en
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伊藤泉
水谷友哉
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日商昕芙旎雅股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67282—Marking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Abstract

The present invention provides a management system for substrate storage container, a load port and a management method for substrate storage container. The management system for substrate storage container is capable of predicting a replacement timing of a substrate storage container such as FOUP due to the deterioration or the like that are caused by using. The management system is not implemented by applying a substrate storage container equipped with a device such as a sensor, but by using a substrate storage container that is commonly used now. The method comprises the steps of : reading an entity identification ID (4x) attached to the FOUP through the load port which can process the in-and-out of a substrate (W) relative to the substrate storage container (that is, FOUP) having a loading/unloading port (41); sending the entity identification ID and a sensor value of a sensor (2c) disposed on the load port to a host system (C); associating the entity identification ID with the sensor value in the host system and storing and reserving it in a database (Cd); analyzing the data in the database and outputting a FOUP status of each entity identification ID.

Description

基板收納容器管理系統、裝載埠、基板收納容器管理方法Substrate storage container management system, loading port, and substrate storage container management method

本發明涉及對能夠收納晶片的容器（基板收納容器）的劣化資訊進行管理的基板收納容器管理系統、以及能夠應用於基板收納容器管理系統的裝載埠、以及基板收納容器管理方法。The present invention relates to a substrate storage container management system that manages the deterioration information of a container (substrate storage container) capable of storing wafers, a loading port applicable to the substrate storage container management system, and a substrate storage container management method.

在半導體的製造工序中，為了提高成品率、品質，在潔淨室內進行晶片的處理。近年來，採用僅對晶片的周圍的局所的空間進一步提高清潔度的“小型圍繞方式”，並採用晶片的搬運及其它處理的措施。在小型圍繞方式中，在箱體的內部構成大致封閉的晶片搬運室（以下“搬運室”）的壁面的一部分，並且載置在高清潔的內部空間收納有晶片的容器即FOUP（Front-Opening Unified Pod），在搬運室相鄰地設有裝載埠（Load Port），該裝載埠具有在貼緊於FOUP的門（以下“FOUP門”）的狀態下使該FOUP門開閉的功能。In the semiconductor manufacturing process, in order to improve yield and quality, wafer processing is performed in a clean room. In recent years, the "small surrounding method" that further improves the cleanliness of only the space around the wafers has been adopted, and wafer handling and other processing measures have been adopted. In the small surrounding method, a part of the wall surface of a substantially closed wafer transfer chamber (hereinafter referred to as a "transfer chamber") is formed inside the box, and FOUP (Front-Opening), which is a container that houses wafers in a high-clean internal space Unified Pod), a loading port (Load Port) is provided adjacent to the transfer room, and the loading port has a function of opening and closing the FOUP door in a state of being in close contact with the FOUP door (hereinafter referred to as "FOUP door").

裝載埠是用於在與搬運室之間進行晶片的出入的裝置，作為搬運室與FOUP之間的介面部發揮功能。並且，構成為，若能夠與FOUP門卡合來使FOUP門開閉的裝載埠的門（以下為“裝載埠門”）敞開，則通過配置在搬運室內的搬運機器人（晶片搬運裝置），能夠向搬運室內取出FOUP內的晶片、或者將晶片從搬運室內收納到FOUP內。The loading port is a device for transferring wafers into and out of the transfer chamber, and functions as an interface between the transfer chamber and the FOUP. In addition, if the door of the loading port (hereinafter referred to as "loading port door") that can be engaged with the FOUP door to open and close the FOUP door is opened, the transport robot (wafer transport device) disposed in the transport room can The wafer in the FOUP is taken out from the transfer chamber, or the wafer is stored in the FOUP from the transfer chamber.

並且，在半導體的製造工序中，為了適當地維持晶片周邊的氣氛，使用上述的稱為FOUP的儲存筒，在FOUP的內部容納晶片來進行管理。尤其是近年來，促進了元件的高集成化、電路的細微化，要求將晶片周邊維持為高清潔度，以免產生顆粒、水分向晶片表面的附著。因此，為了不使晶片表面氧化等表面的性狀發生變化，在FOUP的內部填充氮氣，使晶片周邊處於作為惰性氣體的氮氣氣氛、或者還進行成為真空狀態的處理（清洗處理）。In addition, in the semiconductor manufacturing process, in order to appropriately maintain the atmosphere around the wafer, the above-mentioned storage tube called FOUP is used, and the wafer is accommodated and managed inside the FOUP. Especially in recent years, the high integration of components and the miniaturization of circuits have been promoted, and it is required to maintain a high degree of cleanliness in the periphery of the wafer to avoid the adhesion of particles and moisture to the wafer surface. Therefore, in order not to change the surface properties such as oxidation of the wafer surface, the inside of the FOUP is filled with nitrogen gas, and the periphery of the wafer is subjected to a nitrogen atmosphere as an inert gas, or a treatment (cleaning treatment) is performed in a vacuum state.

但是，FOUP由於在內部滯留有塵埃或者在處理工序中使用的雜質，因此定期地進行熱水清洗而被再利用。由於反復進行該熱水清洗，樹脂制的FOUP逐漸變形。氣密性因這樣的FOUP的變形而降低，氣體相對於FOUP的流入、漏出（洩漏）成為問題。例如，在FOUP主體中的能夠由FOUP門開閉的搬出搬入口產生了歪斜的情況下，FOUP門的氣密性降低。其結果，在實施了將FOUP內的氣體置換為氮氣的清洗處理之後，在利用OHT等進行的搬運中，出現FOUP內的氮氣向FOUP外漏出、或者周圍的大氣容易流入到FOUP內的狀況，產生FOUP內的氧氣濃度上升之類的問題。However, FOUP contains dust or impurities used in the treatment process, so it is periodically washed with hot water and reused. By repeating this hot water washing, the resin-made FOUP gradually deforms. The airtightness is reduced by such deformation of the FOUP, and the inflow and leakage (leakage) of gas with respect to the FOUP become a problem. For example, when the FOUP main body can be opened and closed by the FOUP door opening and closing of the loading and unloading door skew, the airtightness of the FOUP door is reduced. As a result, after performing the cleaning process of replacing the gas in the FOUP with nitrogen, during transportation by OHT or the like, the nitrogen in the FOUP leaks out of the FOUP, or the surrounding atmosphere easily flows into the FOUP, There is a problem such as an increase in the oxygen concentration in the FOUP.

為了應對這樣的問題，考慮了通過對每個FOUP測定FOUP的形狀來判定FOUP的劣化的程度的方法（以下為“前者的方法”）、一律更換超過了預先設定的預定的使用次數、使用期間的FOUP的方法（以下為“後者的方法”）。In order to cope with such a problem, a method of determining the degree of deterioration of FOUP by measuring the shape of FOUP for each FOUP (hereinafter referred to as "the former method"), all replacements exceeding a predetermined number of use times and use periods that have been set in advance The FOUP method (the following is "the latter method").

然而，前者的方法需要逐個測定FOUP的形狀，因此需要在半導體的製造工序中、或者在半導體的製造工序的前後的適當時機確保實施這樣的形狀測定的時間，因此花費時間，效率低。另外，如果是後者的方法，則會產生更換沒有劣化到需要更換的程度的FOUP的事態，新購買FOUP所需要的成本多得超過所需，通過持續使用在達到預定的使用次數、使用期間之前變形的程度變大的FOUP直到達到預定的使用次數、使用期間，有時會產生氣體相對於FOUP的流入、漏出（洩漏）。However, the former method needs to measure the shape of the FOUP one by one. Therefore, it is necessary to ensure the time for performing such shape measurement at an appropriate timing in the semiconductor manufacturing process or before and after the semiconductor manufacturing process, which takes time and is inefficient. In addition, if it is the latter method, there will be a situation in which the FOUP that has not deteriorated to the point where it needs to be replaced will be generated. The cost of purchasing a new FOUP is much more than necessary. By continuing to use it until the predetermined number of uses and the period of use The FOUP whose degree of deformation becomes larger until the predetermined number of uses and the period of use may cause inflow and leakage (leakage) of gas relative to the FOUP.

原來FOUP的變形一點一點地進行，難以對每個FOUP準確地把握劣化導致的更換時期，如果是後者的方法那樣的忽視FOUP的個體差的更換方法，則效率低，產生不需要的更換費用、或者認為能夠提前防止氣流相對於FOUP流入、漏出（洩漏）的事態的概率不高。The original FOUP is deformed little by little, and it is difficult to accurately grasp the replacement time due to deterioration for each FOUP. If the latter method ignores the individual poor replacement method of FOUP, the efficiency is low and unnecessary replacement occurs. The cost, or the possibility that it is possible to prevent the inflow and outflow (leakage) of the airflow relative to the FOUP in advance is not high.

因此，提出了如下管理系統，其包含：設於基板收納容器來檢測其使用狀態的檢測機構；設於基板收納容器來判斷其檢查檢驗時期的小型的無線通訊機構；對檢查檢驗時期的基板收納容器進行檢查檢驗的檢查檢驗裝置；以及報告與無線通訊機構進行的基板收納容器的檢查檢驗時期的判斷結果和檢查檢驗裝置進行的基板收納容器的檢查檢驗結果的任一結果相應的內容的報告機構，無線通訊機構利用運算處理部至少對檢測機構的檢測值和與基板收納容器相關的檢查檢驗值進行比較，根據該比較結果，來判斷基板收納容器的檢查檢驗時期（參照專利文獻1：日本特開2017－212322號公報）。Therefore, a management system has been proposed, which includes: a detection mechanism provided in the substrate storage container to detect its use state; a small wireless communication mechanism provided in the substrate storage container to determine the inspection inspection period; and a substrate storage for the inspection inspection period Inspection and inspection device for inspecting and inspecting containers; and reporting mechanism for reporting content corresponding to any result of the inspection result of the inspection and inspection of the substrate storage container with the wireless communication mechanism and any result of inspection and inspection of the substrate storage container by the inspection and inspection device , The wireless communication mechanism compares at least the detection value of the detection mechanism with the inspection and inspection value related to the substrate storage container by the arithmetic processing unit, and determines the inspection and inspection time of the substrate storage container based on the comparison result (refer to Patent Document 1: Japanese Special Open 2017-212322 Bulletin).

在上述專利文獻1中記載了如下技術：根據這樣的管理系統，由設於基板收納容器的檢測機構檢測該基板收納容器的使用狀態，在作為檢測值的輸出目的地的無線通訊機構中，對檢測值和與基板收納容器相關的閾值進行比較，其結果，在檢測值小於閾值、或者未接近閾值的情況下，判斷為能夠仍然繼續使用基板收納容器，另一方面，在檢測值接近閾值、或者超過了閾值的情況下，判斷為基板收納容器的性能或品質下降，接近基板收納容器的使用限度，能夠選定基板收納容器的更換品。The above Patent Document 1 describes a technique in which, according to such a management system, a detection mechanism provided in a substrate storage container detects the use state of the substrate storage container, and in a wireless communication mechanism as an output destination of the detection value, The detection value is compared with the threshold value related to the substrate storage container. As a result, when the detection value is less than the threshold value or is not close to the threshold value, it is determined that the substrate storage container can still be used. On the other hand, when the detection value is close to the threshold value, Or, when the threshold value is exceeded, it is determined that the performance or quality of the substrate storage container is degraded, approaching the limit of use of the substrate storage container, and the replacement product of the substrate storage container can be selected.

然而，如果是專利文獻1記載的管理系統，則必須在作為基板收納容器的FOUP設置感測器以及通信機構（以下為“感測器等設備類”），因此除了需要在FOUP安裝感測器等設備類的作業以外，還要求在每個FOUP安裝感測器用的電源。因此，為了實現專利文獻1所記載的系統，不能使用現在使用的一般的FOUP作為基板收納容器，需要全部更換為新的FOUP。在半導體製造生產線中，大量的FOUP已被廣泛使用，更換其全部數量而採用該文獻的管理系統對於使用者來說負擔較大，認為難以導入製造現場。However, if it is the management system described in Patent Document 1, a sensor and a communication mechanism must be installed in the FOUP that is the substrate storage container (hereinafter referred to as "sensors and other devices"), so in addition to the need to install a sensor in the FOUP In addition to other equipment operations, it is also necessary to install a power supply for the sensor in each FOUP. Therefore, in order to realize the system described in Patent Document 1, the general FOUP currently used cannot be used as a substrate storage container, and all need to be replaced with a new FOUP. In the semiconductor manufacturing production line, a large number of FOUPs have been widely used, and replacing the entire number of them to adopt the management system of this document is a heavy burden for users, and it is considered difficult to introduce it to the manufacturing site.

並且，對分別賦予大量的FOUP的感測器等設備類進行個別維修的作業需要龐大的勞動力，還需要留意對FOUP進行熱水清洗時的熱、浸水引起的感測器等設備類的故障，難以萬無一失地進行用於在正常的狀態下使用感測器等設備類的事前準備或維修。並且，如果感測器等設備類的事前準備或維修不充分，則無法利用感測器進行準確的檢測處理，或者陷入不穩定的無線通訊狀態，不能適當地選定成為更換對象的FOUP，通過使用本來成為更換對象的FOUP，也會產生氣體相對於FOUP的流入、漏出（洩漏），FOUP內的晶片的表面被氧化之類的問題。這樣的問題在FOUP以外的基板收納容器中也同樣會產生。In addition, the maintenance work for individual devices such as sensors with a large number of FOUPs requires a large amount of labor, and it is also necessary to pay attention to the failure of sensors and other devices caused by heat and water immersion when FOUP is washed in hot water. It is difficult to perform pre-preparation or maintenance for using sensors and other equipment in a normal state without fail. In addition, if equipment such as sensors is not prepared or repaired in advance, the sensor cannot be used for accurate detection processing, or it may fall into an unstable wireless communication state, and the FOUP to be replaced cannot be properly selected. The FOUP that was originally intended to be replaced also causes gas inflow and leakage (leakage) to the FOUP, and the surface of the wafer in the FOUP is oxidized. Such problems also occur in substrate storage containers other than FOUP.

本發明是著眼於這樣的課題而提出的方案，主要的目的在於，為了抑制容納在FOUP等基板收納容器內的晶片的表面被氧化，能夠預測伴隨使用的劣化等引起的基板收納容器的更換時期的基板收納容器管理系統不是應用設置了感測器等設備類的FOUP、而是應用現在通用的FOUP來實現。此外，本發明是即使在FOUP以外的基板收納容器中也能夠對應的技術。The present invention is a solution proposed in view of such a problem, and its main purpose is to prevent the surface of a wafer contained in a substrate storage container such as FOUP from being oxidized, and to predict the replacement time of the substrate storage container due to deterioration or the like used The substrate storage container management system is not implemented by applying FOUPs such as sensors and other devices, but by applying FOUPs that are now commonly used. In addition, the present invention is a technology that can be handled even in a substrate storage container other than FOUP.

根據本發明的基板收納容器管理系統，其包含：裝載埠，其相對於基板收納容器能夠進行基板的出入處理，包括能夠讀取附加於上述基板收納容器的個體識別用ID的ID讀取機構和直接或者間接地檢測上述基板收納容器的狀態的感測器；關聯機構，其將由上述ID讀取機構讀取出的上述個體識別用ID與由上述感測器檢測出的感測器值相互關聯起來；資料庫，其儲備由上述關聯機構關聯的資料；以及資料處理部，其解析上述資料庫內的上述資料，並輸出每個上述個體識別用ID的上述基板收納容器的狀態。The substrate storage container management system according to the present invention includes: a loading port capable of carrying in and out of the substrate with respect to the substrate storage container, and includes an ID reading mechanism capable of reading an individual identification ID attached to the substrate storage container and A sensor that directly or indirectly detects the state of the substrate storage container; an association mechanism that correlates the ID for individual identification read by the ID reading mechanism and the sensor value detected by the sensor A database, which stores data related to the related agencies; and a data processing unit, which analyzes the data in the database and outputs the status of the substrate storage container for each of the individual identification IDs.

在此，個體識別用ID用於識別各個基板收納容器，關於設於裝載埠的感測器的檢測值，判斷是從哪個基板收納容器取得的。此外，在個體識別用ID中不寫入與基板收納容器的經年劣化等相關的資料。“直接或者間接地檢測基板收納容器的狀態的感測器”只要是能夠檢測表示基板收納容器的劣化（變形）的資訊的感測器即可，例如能夠列舉在將基板收納容器內置換為氮氣等適當的氣體的清洗處理時檢測通過基板收納容器的埠從基板收納容器內向基板收納容器外排出的氣體（廢氣）的壓力的感測器、檢測基板收納容器內的晶片位置的映射感測器等。能夠根據這樣的廢氣的壓力感測器值、映射感測器的檢測值來把握基板收納容器的變形。也就是，在廢氣的壓力感測器值比以前下降的情況下，能夠認為基板收納容器變形，清洗處理時基板收納容器內的氣體通過基板收納容器的變形部分向外部漏出。另外，在映射感測器的檢測值與以前的檢測值不同（產生晶片的位置偏移）的情況下，能夠認為基板收納容器變形，晶片的位置發生了變化。也就是，容納在基板收納容器內的晶片載置於設置在基板收納容器內的多級狀的擱板上，若基板收納容器的變形進展，則高度方向上的晶片彼此的間隙變化，因此通過檢測這樣的變化，能夠判斷基板收納容器是否變形，或者通過檢測一枚晶片是否傾斜，能夠判斷基板收納容器是否變形。Here, the individual identification ID is used to identify each substrate storage container, and it is determined from which substrate storage container the detection value of the sensor provided in the loading port is obtained. In addition, the ID for individual identification does not write data related to the deterioration of the substrate storage container over time. The “sensor that directly or indirectly detects the state of the substrate storage container” may be any sensor that can detect information indicating the deterioration (deformation) of the substrate storage container. For example, the sensor may be replaced with nitrogen in the substrate storage container. Sensors that detect the pressure of gas (exhaust gas) discharged from the substrate storage container to the outside of the substrate storage container through the port of the substrate storage container during the cleaning process of an appropriate gas, etc., and a mapping sensor that detects the position of the wafer in the substrate storage container Wait. The deformation of the substrate storage container can be grasped based on the pressure sensor value of such exhaust gas and the detection value of the mapping sensor. That is, when the pressure sensor value of the exhaust gas is lower than before, it can be considered that the substrate storage container is deformed, and the gas in the substrate storage container leaks to the outside through the deformed portion of the substrate storage container during the cleaning process. In addition, when the detection value of the mapping sensor is different from the previous detection value (the position of the wafer is shifted), it can be considered that the substrate storage container is deformed and the position of the wafer has changed. That is, the wafers accommodated in the substrate storage container are placed on a multi-level shelf provided in the substrate storage container. If the deformation of the substrate storage container progresses, the gap between the wafers in the height direction changes, so By detecting such a change, it is possible to determine whether the substrate storage container is deformed, or by detecting whether one wafer is tilted, it is possible to determine whether the substrate storage container is deformed.

如果是這樣的本發明的基板收納容器管理系統，則不需要將感測器用的電源安裝於各基板收納容器，對全部基板收納容器賦予個體識別用ID的作業比在全部基板收納容器設置感測器等設備類的作業更容易，並且，相對於裝載埠的ID讀取機構以及感測器的電源供給利用裝載埠所包括的電氣系統能夠比較容易地進行。此外，本發明的基板收納容器管理系統通過將感測器的設置物件設定為裝載埠，從而與在作為現有技術敘述的每個基板收納容器設置感測器等設備類的方式相比，成為維修的對象的絕對數量變少，可減輕維修的負擔，並且在不需要留意基板收納容器的熱水清洗時的熱、浸水引起的感測器等設備類的故障這一點也有利。In such a substrate storage container management system of the present invention, it is not necessary to install a power supply for the sensor in each substrate storage container, and the task of assigning individual identification IDs to all substrate storage containers is better than providing sensing in all substrate storage containers The operation of devices such as devices is easier, and the power supply to the ID reading mechanism of the loading port and the sensor can be performed relatively easily by the electrical system included in the loading port. In addition, the substrate storage container management system of the present invention is a maintenance by setting the sensor installation object as the loading port, compared with the method of installing sensors and the like in each substrate storage container described in the prior art. The absolute number of objects is reduced, which can reduce the burden of maintenance, and it is also advantageous in that there is no need to pay attention to the failure of sensors and other equipment caused by heat or water immersion during the hot water washing of the substrate storage container.

並且，根據本發明的基板收納容器管理系統，通過將賦予在較多的製造現場已使用的基板收納容器的個體識別用ID、與設於裝載埠的感測器檢測出的檢測值相關聯並資料庫化，在資料處理部解析資料庫內的資料並輸出每個個體識別用ID的基板收納容器的狀態，從而使用者能夠取得或把握基板收納容器的劣化資訊。通過靈活利用這樣的本發明的基板收納容器管理系統，能夠基於劣化資訊來確定基板收納容器各自的更換時期，通過將應更換的基板收納容器更換為新的基板收納容器，能夠防止或抑制基板收納容器的變形引起的基板收納容器內的晶片表面的氧化之類的事態，降低錯誤產生頻度，從而半導體製造裝置的停止時間變短，提高生產性。Furthermore, according to the substrate storage container management system of the present invention, the individual identification ID given to the substrate storage container used in many manufacturing sites is correlated with the detection value detected by the sensor provided in the loading port. Databaseization. The data processing unit analyzes the data in the database and outputs the status of the substrate storage container for each individual identification ID, so that the user can obtain or grasp the degradation information of the substrate storage container. By utilizing such a substrate storage container management system of the present invention, it is possible to determine the replacement timing of each substrate storage container based on the deterioration information, and by replacing the substrate storage container to be replaced with a new substrate storage container, it is possible to prevent or suppress substrate storage Incidents such as oxidation of the wafer surface in the substrate storage container due to the deformation of the container reduce the frequency of occurrence of errors, thereby shortening the stop time of the semiconductor manufacturing apparatus and improving productivity.

在本發明中，較佳上述資料處理部包含：電腦構，其根據由特定的上述感測器檢測出的感測器值計算統計資料；比較機構，其對與特定的上述個體識別用ID相關聯的感測器值和由上述電腦構計算出的計算結果進行比較；以及狀態輸出機構，其基於由上述比較機構比較出的結果來輸出上述基板收納容器的狀態。In the present invention, it is preferable that the data processing unit includes: a computer mechanism that calculates statistical data based on the sensor value detected by the specific sensor; and a comparison mechanism that correlates with the specific ID for individual identification The connected sensor value is compared with the calculation result calculated by the computer mechanism; and a state output mechanism that outputs the state of the substrate storage container based on the result compared by the comparison mechanism.

通過在資料處理部設置這樣的電腦構以及比較機構，從而能夠使在資料處理部的資料處理具有通用性。By providing such a computer structure and a comparison mechanism in the data processing section, it is possible to make the data processing in the data processing section versatile.

在本發明中，較佳上述裝載埠包括多種上述感測器，上述關聯機構能夠將上述個體識別用ID與由上述多種感測器檢測出的多種上述感測器值相互關聯起來。In the present invention, it is preferable that the loading port includes a plurality of the sensors, and the association mechanism can correlate the ID for individual identification with a plurality of the sensor values detected by the plurality of sensors.

根據這樣的結構，能夠使用多種感測器值來判斷基板收納容器的狀態，因此能夠提高判斷的精度。According to such a configuration, the state of the substrate storage container can be determined using various sensor values, and thus the accuracy of the determination can be improved.

在本發明中，較佳還包含動作調整部，該動作調整部基於上述資料處理部輸出的每個上述個體識別用ID的上述基板收納容器的狀態，對上述裝載埠的與上述基板收納容器的處理相關的控制值進行調整。In the present invention, it is preferable to further include an operation adjustment unit that compares the state of the substrate storage container of each of the individual identification IDs output by the data processing unit with respect to the loading port and the substrate storage container. Adjust the process-related control values.

通過設置這樣的動作調整部，能夠根據基板收納容器的狀態來調整裝載埠的對基板收納容器的處理，因此能抑制在裝載埠產生錯誤，能夠進行順暢的處理。By providing such an operation adjustment part, it is possible to adjust the processing of the substrate storage container by the loading port according to the state of the substrate storage container, so that it is possible to suppress an error at the loading port and perform smooth processing.

在本發明中，較佳上述關聯機構能夠將上述個體識別用ID、與在上述基板收納容器的處理時產生的錯誤相關的資訊、以及與對儲存在上述基板收納容器中的上述基板進行的處理相關的資訊中的至少任一方資訊相互關聯，還包含動作調整部，該動作調整部基於儲備在上述資料庫中的每個上述個體識別用ID的上述至少任一方的資訊，來調整上述裝載埠的與上述基板收納容器的處理相關的控制值。In the present invention, it is preferable that the related mechanism is capable of associating the ID for individual identification, information related to an error generated during processing of the substrate storage container, and processing performed on the substrate stored in the substrate storage container At least one of the related information is related to each other, and further includes an action adjustment unit that adjusts the loading port based on the information of the at least one of each of the individual identification IDs stored in the database Control value related to the processing of the above substrate storage container.

通過設置這樣的動作調整部，能夠根據事前產生的錯誤、對基板進行的處理來調整裝載埠的對基板收納容器的處理，因此能抑制在裝載埠產生錯誤，能夠進行順暢的處理。By providing such an operation adjustment unit, it is possible to adjust the processing of the substrate storage container of the loading port according to the error generated beforehand and the processing of the substrate. Therefore, it is possible to suppress the occurrence of an error at the loading port and perform smooth processing.

在本發明中，較佳還包含能夠與上述裝載埠通信的上位系統，在上述上位系統至少設有上述關聯機構、上述資料庫以及上述資料處理部。In the present invention, it is preferable to further include an upper-level system capable of communicating with the loading port, and the upper-level system is provided with at least the associated mechanism, the database, and the data processing unit.

通過將這樣的上位系統與裝載埠分開設置，從而能夠在上位系統中處理在多個裝載埠取得的資料。By disposing such a higher-level system separately from the loading port, data acquired at multiple loading ports can be processed in the higher-level system.

在本發明中，較佳上述資料處理部包括學習機構，該學習機構根據上述裝載埠的上述感測器的感測器值來學習上述基板收納容器的狀態。In the present invention, it is preferable that the data processing unit includes a learning mechanism that learns the state of the substrate storage container based on the sensor value of the sensor of the loading port.

通過設置這樣的學習機構，能夠精度良好地推定基板收納容器的狀態。By providing such a learning mechanism, the state of the substrate storage container can be accurately estimated.

本發明的裝載埠是上述的基板收納容器管理系統所包含的裝載埠，其包含：上述ID讀取機構，其能夠讀取附加於上述基板收納容器的上述個體識別用ID；以及上述感測器，其直接或者間接地檢測上述基板收納容器的狀態。The loading port of the present invention is a loading port included in the above-mentioned substrate storage container management system, and includes: the ID reading mechanism capable of reading the ID for individual identification attached to the substrate storage container; and the sensor , Which directly or indirectly detects the state of the substrate storage container.

根據這樣的裝載埠，如上所述，能夠取得與基板收納容器的管理相關的感測器值，能夠進行適當的基板收納容器的管理。According to such a loading port, as described above, the sensor value related to the management of the substrate storage container can be acquired, and the appropriate management of the substrate storage container can be performed.

根據本發明的基板收納容器管理方法，其包含以下步驟：ID讀取步驟，通過相對於基板收納容器能夠進行基板的出入處理的裝載埠，讀取附加於上述基板收納容器的個體識別用ID；檢測步驟，利用設置在上述裝載埠的感測器，直接或者間接地檢測上述基板收納容器的狀態；關聯步驟，將在上述ID讀取步驟中讀取出的上述個體識別用ID與在上述檢測步驟中檢測出的感測器值相互關聯起來；資料庫化步驟，將在上述關聯步驟中關聯的資料儲備在資料庫中；以及資料處理步驟，解析上述資料庫內的上述資料，並輸出每個上述個體識別用ID的上述基板收納容器的狀態。The substrate storage container management method according to the present invention includes the following steps: an ID reading step, which reads an ID for individual identification attached to the substrate storage container through a loading port capable of performing a substrate access process with respect to the substrate storage container; In the detection step, the sensor provided in the loading port is used to directly or indirectly detect the state of the substrate storage container; in the correlation step, the ID for individual identification read in the ID reading step and the detection The sensor values detected in the step are correlated with each other; the databaseization step stores the data associated in the above-mentioned correlation step in the database; and the data processing step analyzes the above-mentioned data in the above-mentioned database and outputs each The state of the substrate storage container of the ID for individual identification.

如果是這樣的本發明的基板收納容器管理方法，則不伴有對在較多的製造現場已經使用的基板收納容器進行大幅度的式樣變更，而是照樣利用，並能夠輸出各基板收納容器的狀態。並且，能夠基於與基板收納容器的狀態相關的輸出資訊來進行各基板收納容器的更換時期的預測。If it is such a method for managing a substrate storage container of the present invention, the substrate storage container already used in many manufacturing sites is not accompanied by a large-scale design change, but is used as it is, and the output of each substrate storage container can be output. status. Furthermore, it is possible to predict the replacement time of each substrate storage container based on the output information related to the state of the substrate storage container.

在本發明中，較佳還包含動作調整步驟，該步驟中，基於在上述資料處理步驟中輸出的每個上述個體識別用ID的上述基板收納容器的狀態，對上述裝載埠的與上述基板收納容器的處理相關的控制值進行調整。In the present invention, it is preferable to further include an operation adjustment step in which the loading port and the substrate are stored based on the state of the substrate storage container for each of the individual identification IDs output in the data processing step The control value related to the processing of the container is adjusted.

通過設置這樣的動作調整步驟，能夠根據基板收納容器的狀態來調整裝載埠的對基板收納容器的處理，因此能抑制在裝載埠產生錯誤，能夠進行順暢的處理。By providing such an operation adjustment step, it is possible to adjust the processing of the substrate storage container by the loading port according to the state of the substrate storage container. Therefore, it is possible to suppress an error at the loading port and perform smooth processing.

在本發明中，較佳在上述關聯步驟中，將上述個體識別用ID、與上述基板收納容器的處理時產生的錯誤相關的資訊、以及與對儲存在上述基板收納容器中的上述基板進行的處理相關的資訊中的任一方的資訊相互關聯，In the present invention, it is preferable that in the correlation step, the ID for individual identification, the information related to the error generated during the processing of the substrate storage container, and the processing performed on the substrate stored in the substrate storage container The information of any party in the processing of related information is related to each other,

還包含動作調整步驟，該步驟中，基於儲備在上述資料庫中的每個上述個體識別用ID的上述至少任一方的資訊，來調整上述裝載埠的與上述基板收納容器的處理相關的控制值。It also includes an action adjustment step in which the control value related to the processing of the substrate storage container of the loading port is adjusted based on the information of at least one of each of the individual identification IDs stored in the database .

通過設置這樣的動作調整步驟，能夠根據事前產生的錯誤、對基板進行的處理來調整裝載埠的對基板收納容器的處理，因此抑制在裝載埠產生錯誤，能夠進行順暢的處理。By providing such an operation adjustment step, it is possible to adjust the processing of the substrate storage container of the loading port according to the error generated beforehand and the processing of the substrate. Therefore, it is possible to suppress the occurrence of an error at the loading port and perform smooth processing.

本發明的效果如下。The effects of the present invention are as follows.

根據本發明，通過對FOUP等基板收納容器賦予個體識別用ID，並且IoT（Internet of Things），從而將設置在裝載埠的感測器的感測器值與個體識別用ID相關聯並資料庫化，基於資料庫的資料判斷伴隨基板收納容器的使用的劣化狀態，且能夠預測基板收納容器的更換時期的基板收納容器管理系統不是應用設置了感測器等設備類的專用的基板收納容器、而是應用現在通用的基板收納容器來實現。並且，根據這樣的本發明，基板收納容器的形狀測定不花費時間，便能夠取得與基板收納容器的變形相關的資訊，確定應更換的基板收納容器，如果將該確定的基板收納容器更換為新的基板收納容器，就能夠抑制收納在基板收納容器內的晶片的表面被氧化。According to the present invention, by assigning an ID for individual identification to a substrate storage container such as FOUP and IoT (Internet of Things), the sensor value of the sensor installed in the loading port is associated with the ID for individual identification and the database The substrate storage container management system that can determine the deterioration state accompanying the use of the substrate storage container based on the data in the database and can predict the replacement time of the substrate storage container is not a dedicated substrate storage container equipped with sensors and other equipment. Instead, it is realized by applying a general-purpose substrate storage container. In addition, according to the present invention, the shape measurement of the substrate storage container takes no time, and it is possible to obtain information related to the deformation of the substrate storage container, to determine the substrate storage container to be replaced, and to replace the determined substrate storage container with a new one The substrate storage container can suppress the oxidation of the surface of the wafer stored in the substrate storage container.

以下，參照圖式對本發明的第一實施方式進行說明。Hereinafter, the first embodiment of the present invention will be described with reference to the drawings.

例如，如圖1所示，本實施方式的基板收納容器管理系統1利用在半導體的製造工序中使用的作為基板收納容器的FOUP4、裝載埠2、上位系統C而構成，具體而言，是如下系統：從裝載埠2的通信機構2y向上位系統C發送FOUP4所附帶的個體識別用ID4x、和由設於裝載埠2的感測器2c檢測出的與FOUP4相關的感測器值，在上位系統C中將這些個體識別用ID4x以及感測器值相關聯並資料庫化，基於資料庫Cd的資料能夠輸出FOUP4的狀態。For example, as shown in FIG. 1, the substrate storage container management system 1 of the present embodiment is configured using a FOUP 4 as a substrate storage container used in a semiconductor manufacturing process, a loading port 2, and a higher-level system C. Specifically, it is as follows System: The ID4x for individual identification attached to FOUP4 and the sensor value related to FOUP4 detected by the sensor 2c provided in the loading port 2 are sent from the communication mechanism 2y of the loading port 2 to the upper-level system C. In the system C, these individual identification ID4x and sensor values are correlated and databased, and the state of FOUP4 can be output based on the data of the database Cd.

如图2所示，在半导体的制造工序中，FOUP4與配置於洁净室的装载端口2以及包含搬运室3的EFEM（Equipment Front End Module）一起使用。在圖2中示意性地示出EFEM及其周邊裝置的相對位置關係。As shown in FIG. 2, in the semiconductor manufacturing process, the FOUP 4 is used together with the load port 2 disposed in the clean room and the EFEM (Equipment Front End Module) including the transfer room 3. FIG. 2 schematically shows the relative positional relationship between EFEM and its peripheral devices.

在搬運室3的內部空間3S，設置能夠在FOUP4與處理裝置M之間搬運作為基板的晶片W的搬運機器人31。通過驅動設於搬運室3內的風扇篩檢程式單元32，在搬運室3的內部空間3S產生下降氣流，能夠使清潔度高的氣體（環境氣體）在搬運空間3S迴圈。在搬運室3中與配置有裝載埠2的前壁面3A對置的後壁面3B，相鄰地設有例如處理裝置M（半導體處理裝置）。在潔淨室，處理裝置M的內部空間MS、搬運室3的內部空間3S以及載置於裝載埠2上的FOUP4的內部空間4S維持為高清潔度。另一方面，配置裝載埠2的空間、換言之處理裝置M外、EFEM外為比較低的清潔度。In the internal space 3S of the transfer chamber 3, a transfer robot 31 capable of transferring a wafer W as a substrate between the FOUP 4 and the processing device M is provided. By driving the fan screening program unit 32 provided in the transfer room 3, a downward air flow is generated in the internal space 3S of the transfer room 3, and gas (environmental gas) with high cleanliness can be circulated in the transfer space 3S. In the transfer chamber 3, for example, a processing device M (semiconductor processing device) is provided adjacent to the rear wall surface 3B facing the front wall surface 3A where the loading port 2 is arranged. In the clean room, the internal space MS of the processing device M, the internal space 3S of the transfer room 3, and the internal space 4S of the FOUP 4 placed on the loading port 2 are maintained at a high degree of cleanliness. On the other hand, the space where the loading port 2 is arranged, in other words, outside the processing device M and outside the EFEM is relatively clean.

在本實施方式中，如圖2所示，在EFEM的前後方向D使裝載埠2、搬運室3、處理裝置M依次相互緊密接觸地配置。此外，EFEM的動作由裝載埠2的控制器（圖4所示的控制部2C）、EFEM整體的控制器（圖2所示的控制部3C）控制，處理裝置M的工作由處理裝置M的控制器（圖2所示的控制部MC）控制。在此，作為處理裝置M整體的控制器的控制部MC、作為EFEM整體的控制器的控制部3C是裝載埠2的控制部2C的上位控制器。此外，構成基板收納容器管理系統1的上位系統C由伺服器構成，能夠與設置在半導體製造工序的多個裝載埠2連接。這些各控制部2C、MC、3C由包含CPU、記憶體以及介面的通常的微處理器等構成，在記憶體預先儲存處理所需要的程式，CPU逐次取出必要的程式並執行，與周邊硬體協作來實現所希望的功能。In this embodiment, as shown in FIG. 2, the loading port 2, the transfer chamber 3, and the processing device M are arranged in close contact with each other in order in the front-rear direction D of the EFEM. In addition, the operation of EFEM is controlled by the controller of the loading port 2 (control unit 2C shown in FIG. 4) and the controller of the entire EFEM (control unit 3C shown in FIG. 2), and the operation of the processing device M is controlled by the processing device M The controller (control unit MC shown in FIG. 2) controls. Here, the control unit MC as the controller of the entire processing device M and the control unit 3C of the controller as the entire EFEM are the upper controllers of the control unit 2C of the loading port 2. In addition, the higher-level system C constituting the substrate storage container management system 1 is constituted by a server, and can be connected to a plurality of loading ports 2 provided in a semiconductor manufacturing process. Each of these control units 2C, MC, and 3C is composed of a general microprocessor including a CPU, a memory, and an interface. Programs required for processing are stored in the memory in advance, and the CPU takes out necessary programs one by one and executes them. Collaborate to achieve the desired function.

如圖2以及圖3所示，FOUP4是習知的結構，構成為，包含通過作為開口部的搬出搬入口41而能夠將內部空間4S敞開的FOUP主體42、以及能夠開閉搬出搬入口41的FOUP門43，在內部沿上下方向H呈多級狀地容納多枚晶片W，經由搬出搬入口41能夠使這些晶片W出入。As shown in FIGS. 2 and 3, the FOUP 4 is a conventional structure, and is configured to include a FOUP body 42 capable of opening the internal space 4S through the carry-out port 41 as an opening, and a FOUP capable of opening and closing the carry-out port 41 The door 43 internally accommodates a plurality of wafers W in multiple stages in the up-down direction H, and these wafers W can be accessed through the loading/unloading port 41.

FOUP主體42在內部空間4S包含能夠以多級預定間距載置晶片W的擱板部（晶片載置擱板）。如圖3等所示，在FOUP主體42的底壁，在預定部位設有埠40。埠40例如以嵌入形成於FOUP主體42的底壁的埠安裝用貫通孔的中空筒狀的索環密封件為主體，通過檢驗閥能夠開閉地構成。在FOUP主體42的上壁的朝上的面的中央部，設置被容器搬運裝置（例如OHT：Over Head Transport）等把持的凸緣部。The FOUP body 42 includes a shelf portion (wafer placement shelf) capable of placing the wafer W at a predetermined pitch in multiple stages in the internal space 4S. As shown in FIG. 3 and the like, the bottom wall of the FOUP body 42 is provided with ports 40 at predetermined locations. The port 40 is mainly composed of, for example, a hollow cylindrical grommet seal inserted into a port mounting through hole formed in the bottom wall of the FOUP body 42, and is configured to be openable and closable by a check valve. A flange portion held by a container transport device (for example, OHT: Over Head Transport) or the like is provided at the center of the upward-facing surface of the upper wall of the FOUP body 42.

FOUP門43在載置於裝載埠2的後述的載置台23上的狀態下與裝載埠2的裝載埠門22對置，且構成為大致板狀。在FOUP門43設置能將該FOUP門43鎖定於FOUP主體42的閂鎖鑰匙（省略圖示）。在由FOUP門43封閉了FOUP門43中的搬出搬入口41的狀態下與FOUP主體42接觸或者接近的預定的部分設置墊圈（省略圖示），並構成為通過使墊圈與FOUP主體42接觸而彈性變形，從而能夠密閉FOUP4的內部空間4S。The FOUP door 43 is opposed to the loading port door 22 of the loading port 2 in a state of being placed on a loading table 23 to be described later of the loading port 2, and is configured in a substantially plate shape. The FOUP door 43 is provided with a latch key (not shown) that can lock the FOUP door 43 to the FOUP body 42. A gasket (not shown) is provided in a predetermined portion that is in contact with or close to the FOUP body 42 in a state where the loading/unloading entrance 41 in the FOUP door 43 is closed by the FOUP door 43, and is configured such that the gasket contacts the FOUP body 42 By elastically deforming, the internal space 4S of the FOUP 4 can be sealed.

如圖1所示，本實施方式的FOUP4在適當的部位安裝個體識別用ID4x。此外，在圖1中，示意性地示出個體識別用ID4x。作為個體識別用ID4x的一個例子，能夠列舉RFID（Radio Frequency Identifier），但並不限定於此，能夠使用適當的ID。FOUP4所附帶的個體識別用ID4x可以是無源標籤（被動標籤）、有源標籤（能動標籤）、組合雙方而成的半有源標籤（起動型能動標籤）的任一個，通信方式也沒有特別限定。並且，作為FOUP4所附帶的個體識別用ID4x，也能夠使用一維條碼、QR條碼（注冊商標）那樣的二維條碼等。As shown in FIG. 1, the FOUP 4 of this embodiment is equipped with an ID 4x for individual identification at an appropriate location. In addition, in FIG. 1, ID4x for individual identification is schematically shown. As an example of ID4x for individual identification, RFID (Radio Frequency Identifier) can be cited, but it is not limited to this, and an appropriate ID can be used. The ID4x for individual identification attached to FOUP4 can be any of passive tags (passive tags), active tags (active tags), and semi-active tags (start-up active tags) that combine the two, and the communication method is not particularly special. limited. In addition, as the ID4x for individual identification attached to FOUP4, a two-dimensional barcode such as a one-dimensional barcode or a QR barcode (registered trademark) can also be used.

如圖3至圖6等所示，本實施方式的裝載埠2包含：基座21，其呈板狀，構成搬運室3的前壁面3A的一部分，而且形成有用於敞開搬運室3的內部空間3S的開口部21a；裝載埠門22，其開閉基座21的開口部21a；以及載置台23，以大致水準姿勢設置在基座21。As shown in FIGS. 3 to 6 and the like, the loading port 2 of the present embodiment includes a base 21 that is plate-shaped and constitutes a part of the front wall surface 3A of the transfer chamber 3 and that an internal space for opening the transfer chamber 3 is formed The opening 21a of 3S; the loading port door 22 which opens and closes the opening 21a of the base 21; and the mounting table 23 are provided on the base 21 in a substantially horizontal posture.

在基座21的下端，設置包括小腳輪以及設置腳的腳部24，在與FOUP門43對置的位置設置窗單元214（參照圖7）。設於該窗單元214的開口部215是允許晶片W通過的開口部。At the lower end of the base 21, a caster and a leg portion 24 are provided, and a window unit 214 is provided at a position facing the FOUP door 43 (see FIG. 7). The opening 215 provided in the window unit 214 is an opening that allows the wafer W to pass through.

載置台23設置在水準基台25（支撐台）的上部，該水準基台25（支撐台）以大致水準姿勢配置在基座21中比高度方向中央稍微靠上方的位置。該載置台23能夠以使FOUP門43與裝載埠門22對置的朝向載置FOUP4，該FOUP門43能夠開閉FOUP主體42的內部空間4S。另外，載置台23構成為，能夠在FOUP門43與基座21的開口部21a接近的預定的對接位置（參照圖8）、和使FOUP門43相比對接位置從基座21離開預定距離的位置（參照圖3）之間相對於基座21進退移動。如圖4所示，載置台23包括向上突出的多個突起（銷）231，通過使這些突起231與形成於FOUP4的底面的孔（省略圖示）卡合，從而實現載置台23上的FOUP4的定位。另外，設置用於相對於載置台23固定FOUP4的鎖定爪232。通過將該鎖定爪232牽拉到設於FOUP4的底面的被鎖定部（省略圖示）而處於固定的鎖定狀態，從而能夠與定位用的突起231協作地將FOUP4引導至載置台23上的適當的位置並且固定。另外，通過解除鎖定爪232相對於設置在FOUP4的底面的被鎖定部的鎖定狀態，從而能夠使FOUP4處於能夠從載置台23離開的狀態。The mounting table 23 is provided above the leveling base 25 (supporting table), and the leveling base 25 (supporting table) is arranged on the base 21 in a substantially horizontal posture slightly above the center in the height direction. The mounting table 23 can mount the FOUP 4 in such a direction that the FOUP door 43 and the loading port door 22 face each other. The FOUP door 43 can open and close the internal space 4S of the FOUP body 42. In addition, the mounting table 23 is configured such that the FOUP door 43 and the opening 21a of the base 21 can be approached at a predetermined docking position (see FIG. 8), and the docking position of the FOUP door 43 is separated from the base 21 by a predetermined distance. The position (refer to FIG. 3) moves forward and backward relative to the base 21. As shown in FIG. 4, the mounting table 23 includes a plurality of protrusions (pins) 231 protruding upward. By engaging these projections 231 with holes (not shown) formed on the bottom surface of the FOUP 4, the FOUP 4 on the mounting table 23 is realized Positioning. In addition, a locking claw 232 for fixing the FOUP 4 with respect to the mounting table 23 is provided. By pulling the locking claw 232 to the locked portion (not shown) provided on the bottom surface of the FOUP 4 to be in a fixed locked state, it is possible to guide the FOUP 4 to the mounting table 23 in cooperation with the positioning protrusion 231 And fixed. In addition, by releasing the locked state of the locking claw 232 with respect to the locked portion provided on the bottom surface of the FOUP 4, the FOUP 4 can be brought away from the mounting table 23.

裝載埠門22包含連結機構221，該連結機構221能夠在蓋連結狀態與蓋連結解除狀態之間進行切換，該蓋連結狀態是連結FOUP門43並能夠將FOUP門43從FOUP主體42拆下的狀態，該蓋連結解除狀態是解除相對於FOUP門43的連結狀態，而且將FOUP門43安裝於FOUP主體42的狀態（參照圖6），裝載埠門22在通過連結機構221以一體化的狀態保持FOUP門43的狀態下能夠沿預定的移動路徑移動。本實施方式的裝載埠2構成為能夠使裝載埠門22至少在全閉位置C與敞開位置O之間移動，該全閉位置C是圖8所示的位置、也就是由該裝載埠門22所保持的FOUP門43密閉FOUP主體42的內部空間4S的位置，該敞開位置O是圖9所示的位置、也就是使該裝載埠門22所保持的FOUP門43從FOUP主體42離開而使該FOUP主體42的內部空間4S朝向搬運室3內敞開的位置。本實施方式的裝載埠2構成為，能夠在維持定位於全閉位置C的裝載埠門22的起立姿勢的狀態下移動至圖9所示的敞開位置O，並且，能夠從圖9所示的敞開位置O至未圖示的全開位置維持起立姿勢的狀態下向下方向移動。這樣的裝載埠門22是移動由設置在裝載埠2的門移動機構27來實現。另外，本實施方式的裝載埠2包含移動限制部L，該移動限制部L限制定位於對接位置的載置台23上的FOUP4向離開基座21的方向移動。在本實施方式中，將移動限制部L作為窗單元214而單元化（參照圖7）。The loading port door 22 includes a coupling mechanism 221 that can switch between a lid coupling state and a lid coupling release state in which the FOUP door 43 is coupled and the FOUP door 43 can be detached from the FOUP body 42 In this state, the lid connection release state is a state where the connection state with respect to the FOUP door 43 is released, and the FOUP door 43 is mounted on the FOUP body 42 (see FIG. 6 ), and the loading port door 22 is integrated with the connection mechanism 221 The FOUP door 43 can be moved along a predetermined movement path while being held. The loading port 2 of the present embodiment is configured to be able to move the loading port door 22 at least between the fully closed position C and the open position O, which is the position shown in FIG. 8, that is, the loading port door 22 The held FOUP door 43 closes the position of the internal space 4S of the FOUP body 42, and the open position O is the position shown in FIG. 9, that is, the FOUP door 43 held by the loading port door 22 is separated from the FOUP body 42 to make The internal space 4S of the FOUP body 42 faces a position opened in the transfer chamber 3. The loading port 2 of the present embodiment is configured to be able to move to the open position O shown in FIG. 9 while maintaining the standing posture of the loading port door 22 positioned at the fully closed position C, and can be moved from The open position O is moved downward in a state where the standing posture is maintained to the fully open position (not shown). Such a loading port door 22 is moved by a door moving mechanism 27 provided in the loading port 2. In addition, the loading port 2 of the present embodiment includes a movement restricting portion L that restricts the movement of the FOUP 4 positioned on the mounting table 23 at the docking position away from the base 21. In this embodiment, the movement restriction unit L is unitized as the window unit 214 (see FIG. 7 ).

本實施方式的裝載埠2包含清洗裝置P，該清洗裝置P向FOUP4的內部空間4S注入清洗用氣體（也稱為清洗用氣體，主要使用氮氣、乾燥空氣），能夠將FOUP4的內部空間4S的氣體氣氛置換為清洗用氣體（參照圖4）。清洗裝置P包含以上端部能夠露出的狀態配置在載置台23上的預定部位的多個清洗噴嘴9（氣體供排裝置）。這些多個清洗噴嘴9與設置在FOUP4的底面的埠40的位置相應地安裝在載置台23上的適當位置，能夠以與埠40接觸的狀態連接。使用了這樣的清洗裝置P的底部清洗處理是如下處理：使設置在FOUP4的底部的多個埠40中的預定個數（除全部以外）的埠作為“供給埠”發揮功能，利用與供給埠連接的清洗噴嘴9向該FOUP4內注入氮氣、惰性氣體或者乾燥空氣等適當選擇的清洗用氣體，並且使剩餘的埠40作為“排氣埠”發揮功能，通過與排氣埠連接的清洗噴嘴9排出FOUP4內的氣體氣氛，由此向FOUP4內充滿清洗用氣體。裝載埠2包含壓力感測器（省略圖示），該壓力感測器對底部清洗處理時與作為排氣埠發揮功能的埠40連接的清洗噴嘴9的氣體壓（排氣壓）進行檢測。The loading port 2 of the present embodiment includes a cleaning device P which injects a cleaning gas (also referred to as a cleaning gas, mainly using nitrogen gas and dry air) into the internal space 4S of the FOUP4, which enables the internal space 4S of the FOUP4 to The gas atmosphere is replaced with cleaning gas (see FIG. 4). The cleaning device P includes a plurality of cleaning nozzles 9 (gas supply and discharge devices) arranged at predetermined positions on the mounting table 23 in a state where the upper end can be exposed. The plurality of cleaning nozzles 9 are installed at appropriate positions on the mounting table 23 according to the positions of the ports 40 provided on the bottom surface of the FOUP 4, and can be connected in contact with the ports 40. The bottom cleaning process using such a cleaning device P is a process of making a predetermined number (except all) of the plurality of ports 40 provided at the bottom of the FOUP 4 function as a “supply port” and use the supply port The connected cleaning nozzle 9 injects appropriately selected cleaning gas such as nitrogen, inert gas, or dry air into the FOUP 4 and makes the remaining port 40 function as an "exhaust port" through the cleaning nozzle 9 connected to the exhaust port The gas atmosphere in the FOUP 4 is discharged, thereby filling the FOUP 4 with cleaning gas. The loading port 2 includes a pressure sensor (not shown) that detects the gas pressure (exhaust pressure) of the cleaning nozzle 9 connected to the port 40 functioning as an exhaust port during the bottom cleaning process.

如圖10所示，本實施方式的裝載埠2包含能夠檢測FOUP4內的晶片W的有無和收納姿勢的映射部m。映射部m包括：能夠檢測沿高度方向H以多級狀收納在FOUP4內的晶片W的有無的映射感測器（發送器m1、接收器m2）；以及支撐映射感測器m1、m2的感測器框架m3。映射部m能夠在如下姿勢間轉換：其整體配置於搬運室內的搬運空間的映射退避姿勢；以及至少映射感測器m1、m2通過基座21的開口21a而定位於FOUP4內的映射姿勢。映射部m構成為在維持映射退避姿勢或映射姿勢的狀態下能夠沿高度方向H移動。如圖10所示，通過將感測器框架m3的一部分安裝於門移動機構27的一部分，從而映射部m的升降移動與裝載埠門22的升降移動一體地進行。此外，圖10以外的各圖中省略了映射部m。As shown in FIG. 10, the loading port 2 of this embodiment includes a mapping section m that can detect the presence or absence of the wafer W in the FOUP 4 and the storage posture. The mapping section m includes: a mapping sensor (transmitter m1, receiver m2) capable of detecting the presence or absence of the wafer W stored in the FOUP 4 in multiple stages in the height direction H; and a sensor supporting the mapping sensors m1, m2 Detector frame m3. The mapping unit m can switch between postures: a mapping retreat posture whose entirety is arranged in the transport space in the transport room; and at least a mapping posture of the mapping sensors m1 and m2 positioned in the FOUP 4 through the opening 21 a of the base 21. The mapping unit m is configured to be movable in the height direction H while maintaining the mapping retreat posture or the mapping posture. As shown in FIG. 10, by attaching a part of the sensor frame m3 to a part of the door moving mechanism 27, the up-and-down movement of the mapping section m and the up-and-down movement of the loading port door 22 are performed integrally. In addition, in each figure other than FIG. 10, the mapping section m is omitted.

映射感測器由發出作為信號的光束（光芒）的發送器m1（發光感測器）、和接收從發送器m1發出的信號的接收器m2（受光感測器）構成。此外，映射感測器也可以由發送器、和朝向發送器反射從發送器發出的光芒的反射部構成。該情況下，發送機也有作為接收器的功能。The mapping sensor is composed of a transmitter m1 (luminescence sensor) that emits a light beam (ray) as a signal, and a receiver m2 (light-receiving sensor) that receives a signal emitted from the transmitter m1. In addition, the mapping sensor may be composed of a transmitter and a reflecting portion that reflects the light emitted from the transmitter toward the transmitter. In this case, the transmitter also functions as a receiver.

並且，如圖1所示，本實施方式的裝載埠2包含：能夠讀取附加於FOUP4的個體識別用ID4x的ID讀取機構2x；以及能夠相對於上位系統C發送直接或者間接地檢測由ID讀取機構2x讀取出的個體識別用ID4x以及FOUP4的狀態的感測器2c（在本實施方式中，壓力感測器、映射感測器這兩種感測器）的檢測值（感測器值）的裝載埠側通信機構2y。ID讀取機構2x、壓力感測器、映射感測器、裝載埠側通信機構2y分別由通用產品構成，設置在裝載埠2的預定部位。Further, as shown in FIG. 1, the loading port 2 of the present embodiment includes: an ID reading mechanism 2x capable of reading the ID 4x for individual identification attached to the FOUP 4; and capable of directly or indirectly detecting the ID by sending it to the host system C The detection value (sensing of the sensor 2c (in this embodiment, the two sensors of the pressure sensor and the mapping sensor) of the state of the ID4x and FOUP4 for individual identification read by the reading mechanism 2x Device) 2y. The ID reading mechanism 2x, the pressure sensor, the mapping sensor, and the load port side communication mechanism 2y are each constituted by a general-purpose product, and are provided at predetermined positions of the load port 2.

如圖1所示，上位系統C包含上位系統側通信機構Cx、關聯機構Cy、資料庫Cd、以及資料處理部Cz。上位系統側通信機構Cx能夠接收從裝載埠側通信機構2y發送的個體識別用ID4x以及感測器值。關聯機構Cy將由上位系統側通信機構Cx接收到的個體識別用ID4x與感測器值相互關聯起來。資料庫Cd儲存並儲備由關聯機構Cy關聯後的資料，資料處理部Cz解析資料庫Cd內的資料並輸出每個個體識別用ID4x的狀態（在本實施方式中為FOUP4的更換時期的預測結果）。上位系統側通信機構Cx、關聯機構Cy、資料庫Cd能夠分別使用通用產品來構成。資料處理部Cz中的具體的處理內容將於後文敘述。As shown in FIG. 1, the higher-level system C includes an upper-level system-side communication mechanism Cx, an affiliate Cy, a database Cd, and a data processing unit Cz. The higher-level system-side communication mechanism Cx can receive the ID4x for individual identification and the sensor value transmitted from the load port-side communication mechanism 2y. The associated mechanism Cy correlates the ID4x for individual identification received by the higher-level system-side communication mechanism Cx with the sensor value. The database Cd stores and stores the data associated with the affiliate Cy, and the data processing unit Cz analyzes the data in the database Cd and outputs the status of each individual identification ID4x (in this embodiment, the prediction result of the replacement period of FOUP4 ). The higher-level system-side communication mechanism Cx, the affiliated mechanism Cy, and the database Cd can each be constructed using general-purpose products. The specific processing contents in the data processing unit Cz will be described later.

以下，與EFEM的動作流程一起，來說明本實施方式的基板收納容器管理系統1的動作流程。Hereinafter, the operation flow of the substrate storage container management system 1 of the present embodiment will be described together with the operation flow of EFEM.

首先，利用OHT等容器搬運裝置將FOUP4搬運至裝載埠2的上方，並載置於載置台23上。此時，例如設於載置台23的定位用突起231與FOUP4的定位用凹部嵌合，使載置台23上的鎖定爪232處於鎖定狀態（鎖定處理）。在本實施方式中，能夠在沿搬運室3的寬度方向排列三台配置的裝載埠2的載置台23上分別載置FOUP4。另外，也能夠構成為，利用檢測FOUP4是否載置於載置台23上的預定位置的落座感測器（省略圖示）來檢測FOUP4載置於載置台23上的正規位置的情況。First, the FOUP 4 is transported above the loading port 2 using a container transport device such as OHT, and placed on the mounting table 23. At this time, for example, the positioning protrusions 231 provided on the mounting table 23 are fitted into the positioning recesses of the FOUP 4 to put the locking claws 232 on the mounting table 23 in a locked state (locking process). In the present embodiment, the FOUPs 4 can be placed on the mounting tables 23 of the three loading ports 2 arranged in the width direction of the transfer chamber 3. In addition, it may be configured to detect that the FOUP 4 is placed at a normal position on the mounting table 23 using a seating sensor (not shown) that detects whether the FOUP 4 is placed at a predetermined position on the mounting table 23.

在本實施方式的裝載埠2中，在FOUP4載置於載置台23上的正規位置的時刻，檢測FOUP4中的底面部按壓了設置在載置台23上的例如加壓感測器的被按壓部的情況。以此為契機，設置在載置台23上的清洗噴嘴9（全部的清洗噴嘴9）比載置台23的上表面更向上方進出而與FOUP4的各埠40連結，各埠40從封閉狀態被切換為敞開狀態。並且，本實施方式的裝載埠2利用清洗裝置P向FOUP4的內部空間4S供給氮氣，進行將FOUP4的內部空間4S置換為氮氣的處理（底部清洗處理）。在底部清洗處理時，FOUP4內的氣體氣氛從與作為排氣埠發揮功能的埠40連接的清洗噴嘴9向FOUP4外排出。通過這樣的底部清洗處理，使FOUP4內的水分濃度以及氧氣濃度分別降低至預定值以下，從而使FOUP4內的晶片W的周圍環境成為低濕度環境以及低氧環境。In the loading port 2 of the present embodiment, when the FOUP 4 is placed at a normal position on the mounting table 23, it is detected that the bottom portion of the FOUP 4 presses the pressed portion of the pressure sensor, such as a pressure sensor, provided on the mounting table 23 Case. Taking this as an opportunity, the cleaning nozzles 9 (all cleaning nozzles 9) provided on the mounting table 23 enter and exit upward from the upper surface of the mounting table 23, and are connected to the ports 40 of the FOUP 4, and the ports 40 are switched from the closed state. Is open. In addition, the loading port 2 of the present embodiment supplies nitrogen gas to the internal space 4S of the FOUP 4 using the cleaning device P, and performs a process of replacing the internal space 4S of the FOUP 4 with nitrogen gas (bottom cleaning process). During the bottom cleaning process, the gas atmosphere in the FOUP 4 is discharged out of the FOUP 4 from the cleaning nozzle 9 connected to the port 40 functioning as an exhaust port. By such a bottom cleaning process, the moisture concentration and the oxygen concentration in the FOUP 4 are respectively reduced to below a predetermined value, so that the surrounding environment of the wafer W in the FOUP 4 becomes a low humidity environment and a low oxygen environment.

本實施方式的裝載埠2在鎖定處理後，使處於圖2所示的位置的載置台23移動至圖8所示的對接位置（對接處理），使用移動限制部L進行保持並固定FOUP4的至少兩側的處理（夾緊處理），將連結機構221切換為蓋連結狀態（蓋連結處理），使FOUP門43與裝載埠門22一起移動，敞開基座21的開口部21a以及FOUP4的搬出搬入口41，執行解除FOUP4內的密閉狀態的處理（密閉解除處理）。本實施方式的裝載埠2在使裝載埠門22從敞開位置O移動至全開位置的處理中，實施利用了映射部m的映射處理。映射處理是如下處理：將在執行密閉解除處理之前處於映射退避姿勢的映射部m在使裝載埠門22從全閉位置C移動至敞開位置O之後切換為映射姿勢，通過使裝載埠門22朝向全開位置向下方移動，映射部m也在維持映射姿勢的狀態下向下方移動，使用映射感測器m1、m2，檢測收納在FOUP4內的晶片W的有無和收納姿勢。即、通過從發送器m1朝向接收器m2發出信號而形成於發送器m1與接收器m2之間的信號路徑在存在晶片W的部位被遮擋，在不存在晶片W的部位未被遮擋而到達接收器m2。由此，能夠依次檢測在FOUP4內沿高度方向H排列收納的晶片W的有無和收納姿勢。The loading port 2 of the present embodiment moves the mounting table 23 at the position shown in FIG. 2 to the docking position shown in FIG. 8 (dock processing) after the locking process, and holds and fixes at least FOUP4 using the movement restricting portion L The processing on both sides (clamping processing) switches the coupling mechanism 221 to the lid coupling state (lid coupling processing), moves the FOUP door 43 together with the loading port door 22, and opens the opening 21a of the base 21 and unloads the FOUP4 The port 41 executes a process of releasing the sealed state in the FOUP 4 (sealing release process). The loading port 2 of the present embodiment performs the mapping process using the mapping section m in the process of moving the loading port door 22 from the open position O to the fully opened position. The mapping process is a process of switching the mapping section m in the mapping retreat posture before performing the sealing release process to the mapping posture after moving the loading port door 22 from the fully closed position C to the open position O, by orienting the loading port door 22 The fully-open position moves downward, and the mapping section m also moves downward while maintaining the mapping posture, and uses the mapping sensors m1 and m2 to detect the presence and storage posture of the wafer W stored in the FOUP4. That is, the signal path formed between the transmitter m1 and the receiver m2 by sending a signal from the transmitter m1 toward the receiver m2 is blocked at the location where the wafer W exists, and is not blocked at the location where the wafer W does not exist, and reaches the reception器m2. This makes it possible to sequentially detect the presence and the posture of the wafers W arranged and stored in the height direction H in the FOUP 4.

通過執行密閉解除處理，成為FOUP主體42的內部空間4S與搬運室3的內部空間3S連通的狀態，基於由映射處理檢測出的資訊（晶片位置），設置在搬運室3的內部空間3S的搬運機器人31從特定的晶片載置擱板取出晶片W，或者實施將晶片W收納到特定的晶片載置擱板的處理（搬運處理）。By performing the seal release process, the internal space 4S of the FOUP body 42 communicates with the internal space 3S of the transfer chamber 3, and based on the information (wafer position) detected by the mapping process, the transfer is provided in the internal space 3S of the transfer chamber 3 The robot 31 takes out the wafer W from the specific wafer mounting shelf, or performs a process (conveying process) of storing the wafer W on the specific wafer mounting shelf.

若FOUP4內的晶片W全部結束了處理裝置M的處理工序，則本實施方式的裝載埠2利用門移動機構27使裝載埠門22移動至全閉位置C，封閉基座21的開口部21a以及FOUP4的搬出搬入口41，進行密閉FOUP4的內部空間4S的處理（密閉處理），接著，執行將連結機構221從蓋連結狀態切換為蓋連結解除狀態的處理（蓋連結解除處理）。通過該處理，能夠將FOUP門43安裝於FOUP主體42，基座21的開口部21a以及FOUP4的搬出搬入口41分別由裝載埠門22、FOUP門43封閉，FOUP4的內部空間4S成為密閉狀態。When all the wafers W in the FOUP 4 have completed the processing steps of the processing device M, the loading port 2 of the present embodiment uses the door moving mechanism 27 to move the loading port door 22 to the fully closed position C, closing the opening 21a of the base 21 and The loading/unloading port 41 of the FOUP 4 performs a process of sealing the internal space 4S of the FOUP 4 (sealing process), and then executes a process of switching the connection mechanism 221 from the lid connection state to the lid connection release state (cover connection release process). Through this process, the FOUP door 43 can be attached to the FOUP body 42, the opening 21 a of the base 21 and the loading/unloading entrance 41 of the FOUP 4 are closed by the loading port door 22 and the FOUP door 43, respectively, and the internal space 4S of the FOUP 4 is in a closed state.

接下來，本實施方式的裝載埠2進行解除移動限制部L對FOUP4的固定狀態（夾緊狀態）的夾緊解除處理，接著，在執行了使載置台23向離開基座21的方向移動的處理（對接解除處理）之後，解除由載置台23上的鎖定爪232鎖定FOUP4的狀態（鎖定解除處理）。由此，儲存了結束了預定的處理的晶片W的FOUP4從各裝載埠2的載置台23上被交接到容器搬運裝置，向下一工序搬出。Next, the loading port 2 of the present embodiment performs a clamp release process for releasing the fixed state (clamped state) of the FOUP 4 by the movement restricting portion L, and then, after the movement of the mounting table 23 in a direction away from the base 21 is performed After the processing (docking release processing), the state in which the FOUP 4 is locked by the locking claw 232 on the mounting table 23 is released (lock release processing). As a result, the FOUP 4 storing the wafer W that has completed the predetermined processing is transferred from the mounting table 23 of each loading port 2 to the container conveying device, and is carried out to the next step.

在進行以上的處理的過程中，本實施方式的基板收納容器管理系統1輸出載置於裝載埠2的載置台23上的FOUP4的狀態（具體而言，預測FOUP4的更換時期）。即，本實施方式的基板收納容器管理系統1在FOUP4放置於裝載埠2的載置台23上的時刻，由裝載埠2的ID讀取機構2x讀取FOUP4的個體識別用ID4x，利用裝載埠側通信機構2y將讀取到的個體識別用ID4x發送至上位元系統C的關聯機構Cy。並且，在進行對FOUP4內進行清洗的處理（底部清洗處理）時，本實施方式的基板收納容器管理系統1利用與裝載埠2的排氣用清洗噴嘴9相關聯地設置的壓力感測器來檢測廢氣的壓力，並將檢測值（壓力值）發送至上位元系統C的關聯機構Cy。In the course of performing the above processing, the substrate storage container management system 1 of the present embodiment outputs the state of FOUP4 mounted on the mounting table 23 of the loading port 2 (specifically, the replacement time of FOUP4 is predicted). That is, when the FOUP4 is placed on the mounting table 23 of the loading port 2, the substrate storage container management system 1 of the present embodiment reads the ID4x for individual identification of FOUP4 by the ID reading mechanism 2x of the loading port 2 and uses the loading port side The communication mechanism 2y transmits the read ID4x for individual identification to the associated mechanism Cy of the higher-level system C. In addition, when performing the process of cleaning the inside of the FOUP 4 (bottom cleaning process), the substrate storage container management system 1 of the present embodiment uses a pressure sensor provided in association with the exhaust cleaning nozzle 9 of the loading port 2. The pressure of the exhaust gas is detected, and the detected value (pressure value) is sent to the associated mechanism Cy of the higher-level system C.

上位系統C利用上位系統側通信機構Cx接收個體識別用ID4x以及壓力值，並利用關聯機構Cy將個體識別用ID4x以及壓力值相互關聯起來，保存（儲存、儲備）於資料庫Cd。另外，本實施方式的基板收納容器管理系統1在進行利用了映射部m的映射處理時，利用裝載埠側通信機構2y將作為映射感測器的檢測值的晶片位置發送至上位元系統C的關聯機構Cy。上位系統C利用上位系統側通信機構Cx接收晶片位置，利用關聯機構Cy將個體識別用ID4x與晶片位置關聯起來，並保存（儲存、儲備）於資料庫Cd。The upper-level system C receives the ID4x for individual identification and the pressure value using the upper-system-side communication mechanism Cx, and uses the associated mechanism Cy to correlate the ID4x for individual identification and the pressure value with each other, and stores (stores and reserves) the database Cd. In addition, the substrate storage container management system 1 of the present embodiment transmits the wafer position as the detection value of the mapping sensor to the higher-level system C using the load port side communication mechanism 2y when performing the mapping process using the mapping unit m Affiliated organization Cy. The upper-level system C uses the upper-level system-side communication mechanism Cx to receive the wafer position, and the associated mechanism Cy associates the individual identification ID4x with the wafer position, and stores (stores and reserves) the database Cd.

由此，在上位系統C中，將設置在裝載埠2的各種感測器的檢測值（在本實施方式中為壓力感測器的壓力值、映射感測器的晶片位置）與賦予FOUP4的個體識別用ID4x相關聯而資料庫化。此外，在本實施方式中，如圖13的表格那樣，與每個FOUP4的個體識別用ID4x、壓力感測器的壓力值（圖13的排氣噴嘴壓力值）、映射感測器的晶片位置（圖13的FOUP晶片位置）一起保存計測日期和時間。並且，在上位系統C的資料處理部Cz，解析收集到的資料，進行FOUP4的更換時期的預測。此外，基於由與裝載埠2的排氣用清洗噴嘴9相關聯地設置的壓力感測器檢測出的廢氣的壓力值的變化，能夠判斷FOUP4的搬出搬入口41與FOUP門43之間的間隙擴大。即，如果知道從排氣用清洗噴嘴9排出的氣體的壓力變低，則可知通過FOUP4的搬出搬入口41與FOUP門43之間的間隙的排氣量變多，能夠判斷為FOUP4的搬出搬入口41與FOUP門43之間的間隙擴大，從而能夠確定FOUP4的變形。另外，如上所述，在映射感測器的檢測值與以前的檢測值不同的（產生了晶片W的位置偏移）情況下，FOUP4變形，可以認為晶片W的位置發生了變化。也就是，若FOUP4的變形繼續進行，則以多級狀容納在FOUP4內的晶片W彼此的間隙發生變化，因此通過檢測這樣的變化來確定FOUP4的變形，通過檢測晶片W以傾斜的姿勢被容納的情況，能夠確定FOUP4的變形。Thus, in the upper-level system C, the detection values of various sensors provided in the load port 2 (in this embodiment, the pressure value of the pressure sensor and the wafer position of the mapping sensor) and the FOUP4 Individual identification is linked with ID4x and databaseized. In addition, in this embodiment, as shown in the table of FIG. 13, the ID4x for individual identification of each FOUP 4, the pressure value of the pressure sensor (the exhaust nozzle pressure value in FIG. 13 ), and the wafer position of the mapping sensor (FOUP wafer position in Fig. 13) Save the measurement date and time together. In addition, the data processing unit Cz of the higher-level system C analyzes the collected data to predict the replacement time of FOUP4. Further, based on the change in the pressure value of the exhaust gas detected by the pressure sensor provided in association with the exhaust cleaning nozzle 9 of the loading port 2, it is possible to determine the gap between the loading/unloading inlet 41 of the FOUP 4 and the FOUP door 43 expand. That is, if it is known that the pressure of the gas discharged from the exhaust cleaning nozzle 9 becomes lower, it can be known that the amount of exhaust gas passing through the gap between the FOUP 4 carrying-out port 41 and the FOUP door 43 increases, and it can be determined that the FOUP 4 carrying-out port The gap between 41 and the FOUP door 43 is enlarged, so that the deformation of the FOUP 4 can be determined. In addition, as described above, when the detection value of the mapping sensor is different from the previous detection value (a position shift of the wafer W has occurred), the FOUP 4 is deformed, and it can be considered that the position of the wafer W has changed. That is, if the deformation of the FOUP4 continues, the gap between the wafers W accommodated in the FOUP4 in multiple stages changes, so the deformation of the FOUP4 is determined by detecting such changes, and the wafer W is accommodated in an inclined posture by detecting the change Situation, the deformation of FOUP4 can be determined.

如圖11（a）所示，本實施方式中的資料處理部Cz包含：電腦構Cz1，其根據由特定的感測器2c（在本實施方式中為壓力感測器、映射感測器）檢測出的感測器值（壓力值、晶片位置）來計算統計資料；比較機構Cz2，其對與特定的個體識別用ID4x相關聯的感測器值和由電腦構Cz1計算出的計算結果進行比較；以及預測結果輸出機構Cz3，其基於由比較機構Cz2比較出的結果來計算FOUP4的更換時期並輸出預測結果。即，本實施方式中的資料處理部Cz基於將儲存、儲備於資料庫Cd的資料在每個各種感測器中平均化的數值來預測FOUP4的更換時期。在此，“預測結果輸出機構Cz3”相當於本發明的基於由“比較機構比較出的結果來輸出基板收納容器的狀態的狀態輸出機構”，是“狀態輸出機構”的一個例子。As shown in FIG. 11(a), the data processing unit Cz in this embodiment includes a computer structure Cz1 based on a specific sensor 2c (in this embodiment, a pressure sensor and a mapping sensor) The detected sensor values (pressure value, wafer position) are used to calculate statistical data; the comparison mechanism Cz2 performs the calculation of the sensor value associated with the specific individual identification ID4x and the calculation result calculated by the computer structure Cz1 Comparison; and the prediction result output mechanism Cz3, which calculates the replacement period of FOUP4 based on the result compared by the comparison mechanism Cz2 and outputs the prediction result. That is, the data processing unit Cz in the present embodiment predicts the replacement time of the FOUP 4 based on the numerical value obtained by averaging the data stored and stored in the database Cd for each of various sensors. Here, the “prediction result output mechanism Cz3” corresponds to the state output mechanism of the present invention that outputs the state of the substrate storage container based on the result of the comparison by the comparison mechanism, and is an example of the “state output mechanism”.

具體而言，如圖11（b）的流程圖所示，資料處理部Cz的電腦構Cz1進行如下處理：從資料庫Cd對FOUP4的每個個體識別用ID4x取得資料，對每個個體識別用ID4x將各種感測器值曲線化的處理；按照感測器的種類將各個體識別用ID4x的曲線化後的感測器值（感測器值曲線）平均化的處理、也就是按照感測器2c的每個種類製成感測器值平均曲線的處理（計算統計資料的處理）。圖12（a）中示出了與個體識別用ID“A”相關聯的“第一感測器的感測器值”（例如壓力感測器的壓力值）相關的“感測器值曲線”的一個例子，該圖（b）中示出了與個體識別用ID“A”相關聯的“第二感測器的感測器值”（例如映射感測器的晶片位置）相關的“感測器值曲線”的一個例子。另外，該圖（c）中示出了與個體識別用ID“A”相關聯的第一感測器的感測器值相關的“感測器值曲線”、與個體識別用ID“B”相關聯的第一感測器的感測器值相關的“感測器值曲線”、以及基於這些多個“感測器值曲線”製成的“與第一感測器相關的感測器值平均曲線”的一個例子。Specifically, as shown in the flowchart of FIG. 11(b), the computer structure Cz1 of the data processing unit Cz performs the following processing: acquiring data from the database Cd for each individual identification ID4x of FOUP4, and identifying each individual ID4x curve processing of various sensor values; the processing of averaging the sensor values (sensor value curve) of each body identification ID4x curve according to the type of sensor, that is, according to the sensor Each type of the device 2c makes a process of averaging a curve of sensor values (process of calculating statistical data). FIG. 12(a) shows the “sensor value curve” related to the “sensor value of the first sensor” (for example, the pressure value of the pressure sensor) associated with the ID “A” for individual identification An example of ", the figure (b) shows the "sensor value of the second sensor" associated with the individual identification ID "A" (for example, mapping the wafer position of the sensor) An example of "sensor value curve". In addition, the figure (c) shows the "sensor value curve" related to the sensor value of the first sensor associated with the individual identification ID "A" and the individual identification ID "B" The “sensor value curve” related to the sensor value of the associated first sensor, and the “sensor related to the first sensor” made based on these multiple “sensor value curves” An example of value average curve".

在製成感測器值平均曲線的處理之後，資料處理部Cz的比較機構Cz2對感測器值平均曲線和針對每個個體識別用ID4x製成的感測器值曲線進行解析（比較、研究）。作為該情況的解析，例如能夠包含與感測器值平均曲線相比較的感測器值的偏離度、對向設定的閾值的接近程度（或者是否超過閾值）等的運算、判斷處理。圖12（c）同時示出了第一感測器的感測器值平均曲線、和與個體識別用ID“A”相關聯的第一感測器的感測器值相關的感測器值曲線。After the process of making the average sensor value curve, the comparison mechanism Cz2 of the data processing section Cz analyzes the average sensor value curve and the sensor value curve made with ID4x for each individual identification (comparison, research ). The analysis of this case may include, for example, calculation and determination processing such as the degree of deviation of the sensor value compared with the average curve of the sensor value, and the proximity of the threshold set in the opposite direction (or whether the threshold is exceeded). FIG. 12(c) also shows an average curve of sensor values of the first sensor and sensor values related to the sensor value of the first sensor associated with the ID “A” for individual identification curve.

並且，資料處理部Cz的預測結果輸出機構Cz3基於相同個體識別用ID4x的各種感測器的檢測值來對更換時期預測結果進行解析（比較、研究），來預測每個個體識別用ID4x（每個FOUP4）的更換時期，並輸出其預測結果。該情況下，能夠對每個感測器的種類設定優先順位（加權），或者進行運算平均值等的處理。即，能夠設定為，在預測更換時期按每個感測器的種類而不同的情況（例如基於第一感測器的檢測值的更換時期為4月23日，基於第二感測器的檢測值的更換時期為4月25日的情況）下，輸出最早的預測更換時期（4月23日）作為FOUP的預測更換時期，或者輸出各感測器的預測更換時期的平均或者中間值（4月24日）作為FOUP的預測更換時期，或者輸出最晚的預測更換時期（4月25日）作為FOUP的預測更換時期。另外，也可以不進行上述的加權、平均值的運算等，而是任意地設定感測器值的閾值、FOUP4的使用次數等，在處於設定的閾值、使用次數等的範圍以外時，作為FOUP4的更換時期來輸出。Furthermore, the prediction result output mechanism Cz3 of the data processing unit Cz analyzes the prediction results of the replacement period based on the detection values of various sensors of the same ID4x for individual identification (comparison, research) to predict the ID4x for each individual identification (each FOUP4) replacement period, and output its prediction results. In this case, it is possible to set a priority order (weighting) for each type of sensor, or perform processing such as calculating an average value. That is, it can be set that the predicted replacement time differs for each sensor type (for example, the replacement time based on the detection value of the first sensor is April 23, and the detection based on the second sensor When the value replacement period is April 25), output the earliest predicted replacement period (April 23) as the predicted replacement period of FOUP, or output the average or intermediate value of the predicted replacement period of each sensor (4 Month 24) as the predicted replacement period of FOUP, or the latest predicted replacement period (April 25) is output as the predicted replacement period of FOUP. In addition, the above-mentioned weighting, average calculation, etc. may not be performed, but the threshold value of the sensor value, the number of times of use of FOUP4, etc. may be arbitrarily set. Output period.

資料處理部Cz輸出的每個個體識別用ID4x（每個FOUP4）的更換時期預測結果例如顯示在使用者能夠目視確認的顯示器上，或者設定為從適當的揚聲器等作為生髮出來進行報告，由此用戶能夠把握FOUP4的更換時期預測結果。The replacement time prediction result for each individual identification ID4x (each FOUP4) output by the data processing unit Cz is displayed, for example, on a display that can be visually confirmed by the user, or set to report from an appropriate speaker or the like as a report, thereby The user can grasp the prediction result of the replacement period of FOUP4.

根據這樣的本實施方式的基板收納容器管理系統1以及基板收納容器管理方法，利用上位系統C將賦予在較多的製造現場已經使用的FOUP4的個體識別用ID4x、與設置在裝載埠2的感測器2c的檢測值相關聯並資料庫化，利用上位系統C的資料處理部Cz來解析資料庫Cd內的資料並輸出每個個體識別用ID4x的FOUP4的狀態（具體而言，更換時期的預測結果），從而能夠取得FOUP4的劣化資訊。通過靈活使用這樣的本發明的基板收納容器管理系統1，使用者能夠把握基於設置在裝載埠2的感測器2c的檢測值預測的每個FOUP4的更換時期。並且，通過將更換時期較近的FOUP4、到達更換時期的FOUP4更換成新的FOUP4，能夠防止或抑制FOUP4的變形或歪斜引起的不良狀況，即FOUP4的搬出搬入口41與FOUP門43的間隙變大、氣體通過該間隙流入或漏出到FOUP4內之類的不良狀況，防止將FOUP4內的氣體置換為氮氣的清洗處理後，氮氣從FOUP4內向FOUP4外流出、或者大氣（氧氣）向FOUP4內流入的事態，從而能夠將預定的期間FOUP4內部維持為低氧氣濃度，能夠防止或抑制容納在FOUP4內的晶片的表面被氧化的事態。其結果，能夠降低FOUP4的變形引起的錯誤產生頻度，半導體製造裝置的停止時間變短，提高生產性。According to the substrate storage container management system 1 and the substrate storage container management method of the present embodiment as described above, the higher-level system C gives the ID4x for individual identification of the FOUP 4 that has been used in many manufacturing sites and the feeling of being installed in the loading port 2 The detection values of the detector 2c are correlated and databaseized, and the data processing unit Cz of the host system C is used to analyze the data in the database Cd and output the status of FOUP4 for each individual identification ID4x (specifically, the replacement period Prediction results), so that the degradation information of FOUP4 can be obtained. By flexibly using such a substrate storage container management system 1 of the present invention, the user can grasp the replacement time of each FOUP 4 predicted based on the detection value of the sensor 2c provided in the loading port 2. In addition, by replacing the FOUP4 with a relatively recent replacement time and the FOUP4 with the replacement time replaced with a new FOUP4, it is possible to prevent or suppress the malfunction caused by the deformation or deflection of the FOUP4, that is, the clearance between the FOUP4 carrying-out port 41 and the FOUP door 43 becomes Large, gas flows into or out of the FOUP4 through this gap, and prevents bad conditions such as replacing the gas in the FOUP4 with nitrogen. After the nitrogen gas flows out of the FOUP4 to the outside of the FOUP4 or the atmosphere (oxygen) flows into the FOUP4 In this state, it is possible to maintain the inside of the FOUP 4 at a low oxygen concentration for a predetermined period, and it is possible to prevent or suppress the state in which the surface of the wafer accommodated in the FOUP 4 is oxidized. As a result, the frequency of errors due to deformation of FOUP 4 can be reduced, the stop time of the semiconductor manufacturing apparatus can be shortened, and productivity can be improved.

尤其是，如果考慮在全部FOUP4上設置感測器等設備類的作業規模大且複雜，則本實施方式的基板收納容器管理系統1以及基板收納容器管理方法僅對現行的FOUP4賦予個體識別用ID4x即可，與作為現有技術敘述的在每個FOUP4設置感測器的方式相比較，在不需要在各FOUP4上安裝感測器用的電源這一上也有利，不需要重新準備能夠適用於基板收納容器管理系統1以及基板收納容器管理方法的專用的基板收納容器，容易導入製造現場（製造生產線）。In particular, if it is considered that the operation scale of installing devices such as sensors on all FOUPs 4 is large and complicated, the substrate storage container management system 1 and the substrate storage container management method of the present embodiment only assign ID4x for individual identification to the current FOUP 4 That is, compared with the method of providing a sensor for each FOUP4 described as the prior art, it is also advantageous in that it is not necessary to install a power supply for the sensor on each FOUP4, and it is suitable for substrate storage without re-preparation The dedicated substrate storage container of the container management system 1 and the substrate storage container management method can be easily introduced into a manufacturing site (manufacturing production line).

此外，本實施方式的基板收納容器管理系統1以及基板收納容器管理方法通過將感測器的設置物件設定為裝載埠2，從而與作為現有技術敘述的在每個FOUP4上設置感測器的方式相比，作為維修物件的感測器的絕對數量較少，可減輕維修的負擔，並且在不需要留意FOUP4的熱水清洗時的熱或浸水引起的感測器等設備類的故障這一點上也有利。並且，相對於裝載埠2的ID讀取機構2x、感測器2c、以及裝載埠側通信機構2y的電源供給能夠利用裝載埠2所包括的電氣系統比較地容易進行。In addition, the substrate storage container management system 1 and the substrate storage container management method of the present embodiment set the sensor installation object to the loading port 2, which is different from the method of installing the sensor on each FOUP 4 described in the prior art. In contrast, the absolute number of sensors as maintenance items is less, which can reduce the burden of maintenance, and there is no need to pay attention to the failure of sensors and other equipment caused by heat or water immersion during FOUP4 hot water washing Also beneficial. In addition, the power supply to the ID reading mechanism 2x, the sensor 2c, and the load port side communication mechanism 2y of the loading port 2 can be relatively easily performed by the electrical system included in the loading port 2.

另外，根據本實施方式的基板收納容器管理系統1以及基板收納容器管理方法，還能夠進行基板收納容器需要的預測。即，根據作為基板收納容器的FOUP4的更換時期預測的結果，能夠將預測為同時期更換（廢棄）的FOUP4的數量作為新的FOUP4的導入數來進行需要預測。並且，根據本實施方式的基板收納容器管理系統1以及基板收納容器管理方法，將資料庫Cd中收集的資料作為大資料來靈活利用，認為也可以通過資料採擷來尋求基板收納容器劣化原因。In addition, according to the substrate storage container management system 1 and the substrate storage container management method of the present embodiment, it is also possible to predict the need for the substrate storage container. That is, based on the result of the prediction of the replacement time of the FOUP4 that is the substrate storage container, the number of FOUP4 that is predicted to be replaced (discarded) at the same time can be used as the number of new FOUP4 introductions to make a need prediction. In addition, according to the substrate storage container management system 1 and the substrate storage container management method of the present embodiment, the data collected in the database Cd is flexibly utilized as large data, and it is considered that the cause of the deterioration of the substrate storage container can also be sought through data mining.

另外，也可以如以下的第二實施方式那樣，在保存於資料庫Cd中的資料的解析中使用機械學習。In addition, as in the following second embodiment, machine learning may be used in the analysis of the document stored in the document library Cd.

在第一實施方式中，上位系統C的資料處理部Cz是圖11（a）所示的那樣的結構，但在第二實施方式中使用圖14所示的資料處理部Ce。此外，資料處理部Ce以外的結構與第一實施方式相同，因此省略詳細的說明。In the first embodiment, the data processing unit Cz of the higher-level system C is configured as shown in FIG. 11( a ), but in the second embodiment, the data processing unit Ce shown in FIG. 14 is used. In addition, the configuration other than the data processing unit Ce is the same as that of the first embodiment, and therefore detailed description is omitted.

在本實施方式中，與第一實施方式（圖1）相同，在FOUP4利用裝載埠2開閉FOUP門43的過程中，使用單個或者多個感測器2c而直接或者間接地檢測FOUP4的狀態。另外，將由感測器2c檢測出的感測器值保存（儲存、儲備）在上位系統C的資料庫Cd中。此外，如圖13所示的表格那樣，保存在資料庫Cd中的資料利用關聯機構Cy將個體識別用ID4x與由感測器2c檢測出的感測器值相關聯起來，並作為賦予了計測日期和時間的記錄來儲存。此外，保存在資料庫Cd中的資料由圖14所示的資料處理部Ce處理、解析，靈活用於FOUP4的狀態或者更換時期預測等預測維護。In this embodiment, similar to the first embodiment (FIG. 1 ), during the FOUP 4 opening and closing the FOUP door 43 using the loading port 2, a single or multiple sensors 2 c are used to directly or indirectly detect the state of the FOUP 4. In addition, the sensor value detected by the sensor 2c is stored (stored and stored) in the database Cd of the higher-level system C. In addition, as shown in the table shown in FIG. 13, the data stored in the database Cd associates the individual identification ID 4x with the sensor value detected by the sensor 2c using the related mechanism Cy, and gives the measurement as Date and time records are stored. In addition, the materials stored in the database Cd are processed and analyzed by the data processing unit Ce shown in FIG. 14, and are flexibly used for predictive maintenance such as the state of FOUP4 or replacement period prediction.

以下對資料處理部Ce的具體的結構進行敘述。如圖14所示的方塊圖那樣，資料處理部Ce包括學習機構Ce1和預測結果輸出機構Ce2。學習機構Ce1例如由神經網路構成。The specific configuration of the data processing unit Ce will be described below. As shown in the block diagram shown in FIG. 14, the data processing unit Ce includes a learning mechanism Ce1 and a prediction result output mechanism Ce2. The learning institution Ce1 is composed of, for example, a neural network.

以下，對本實施方式的資料處理部Ce所包括的學習機構Ce1的已學習模型的構建順序進行敘述。首先，從資料庫Cd提取每個FOUP4的感測器2c的感測器值的時間序列資料、和FOUP4實際劣化、變形、不能使用的日期和時間或者更換的日期和時間，輸入至學習機構Ce1的神經網路。於是，在神經網路中，各種參數被輸入的資料更新，進行學習。通過重複該操作，構建已學習模式型。Hereinafter, the procedure for constructing the learned model of the learning mechanism Ce1 included in the data processing unit Ce of the present embodiment will be described. First, the time series data of the sensor value of the sensor 2c of each FOUP4 and the date and time of actual deterioration, deformation, unavailability or replacement of the FOUP4 and the date and time of the FOUP4 are extracted from the database Cd and input to the learning institution Ce1 Neural network. Therefore, in the neural network, various parameters are updated by the input data for learning. By repeating this operation, a learned pattern is constructed.

若在按以上的順序構建的已學習模型中輸入保存在資料庫Cd中的每個FOUP4的資料，則能夠輸出FOUP4的狀態的推定、更換時期的預測結果。因此，使用預測結果輸出機構Ce2輸出從已學習模型輸出的FOUP4的狀態、更換時期預測。If the data of each FOUP4 stored in the database Cd is input to the learned model constructed in the above order, the estimation of the state of FOUP4 and the prediction result of the replacement time can be output. Therefore, the prediction result output mechanism Ce2 is used to output the state of FOUP4 output from the learned model and the replacement timing prediction.

在本實施方式中，使用神經網路構建學習模型，但也可以使用其以外的方法。另外，在本實施方式中使用了有指導學習，但也可以使用無指導學習，也可以使用隨時更新學習模型那樣的阿拉伯數字。並且，在本實施方式中，從資料庫Cd提取FOUP4不能使用的日期和時間來構建已學習模型，但也可以使用FOUP4能夠正常利用時的資料來構建已學習模型，並進行預測維護。In this embodiment, a neural network is used to build a learning model, but other methods may be used. In addition, in this embodiment, guided learning is used, but unsupervised learning may be used, or Arabic numerals such as a learning model may be updated at any time. Furthermore, in this embodiment, the date and time when FOUP4 cannot be used is extracted from the database Cd to construct the learned model. However, it is also possible to construct the learned model using data when FOUP4 can be used normally and perform predictive maintenance.

並且，也可以如以下的第三實施方式那樣，使用資料處理部Cz輸出的每個個體識別用ID4x的FOUP4的狀態、保存在資料庫Cd中的其它資料，對每個FOUP4調整裝載埠2的動作。Furthermore, as in the following third embodiment, the status of FOUP4 for each individual identification ID4x output by the data processing unit Cz and other data stored in the database Cd may be used to adjust the loading port 2 for each FOUP4. action.

第一實施方式的上位系統C是圖1所示的那樣的結構，但在第三實施方式中使用圖15所示的上位系統C。此外，裝載埠2的結構與第一實施方式相同，因此省略詳細的說明。The higher-level system C of the first embodiment has the configuration shown in FIG. 1, but the upper-level system C shown in FIG. 15 is used in the third embodiment. In addition, the structure of the loading port 2 is the same as that of the first embodiment, so a detailed description is omitted.

如圖15所示，本實施方式的上位系統C包含上位系統側通信機構Cx、關聯機構Cy、資料庫Cd、資料處理部Cz、以及動作調整部Ca。上位系統側通信機構Cx能夠在與裝載埠側通信機構2y之間雙方向地發送或接收資料信號，接收由裝載埠2的ID讀取機構2x讀取的個體識別用ID4x和由感測器2c檢測出的感測器值。接收的感測器值可以是一種也可以是多種。關聯機構Cy將個體識別用ID4x與感測器值相互關聯起來。資料庫Cd儲存並儲備由關聯機構Cy關聯後的資料。與第一實施方式相同（參照圖13），在資料庫Cd中儲備有對個體識別用ID4x與感測器值關聯後的資料賦予了計測日期和時間的資料。資料處理部Cz解析資料庫Cd內的資料並輸出每個個體識別用ID4x的狀態。在本實施方式中，對於資料處理部Cz輸出的FOUP4的狀態也與個體識別用ID4x相關聯並保存在資料庫Cd中。As shown in FIG. 15, the higher-level system C of the present embodiment includes a higher-level system-side communication mechanism Cx, a related mechanism Cy, a database Cd, a data processing unit Cz, and an operation adjustment unit Ca. The higher-level system-side communication mechanism Cx can send or receive data signals in both directions with the load port-side communication mechanism 2y, and receive the ID 4x for individual identification read by the ID reading mechanism 2x of the load port 2 and the sensor 2c The detected sensor value. The received sensor value may be one kind or multiple kinds. The association mechanism Cy correlates the ID4x for individual identification and the sensor value. The database Cd stores and stores the data associated with the affiliate Cy. As in the first embodiment (see FIG. 13 ), the database Cd stores data obtained by assigning the measurement date and time to the data associated with the ID4x for individual identification and the sensor value. The data processing unit Cz analyzes the data in the database Cd and outputs the status of each individual identification ID4x. In this embodiment, the state of FOUP4 output by the document processing unit Cz is also associated with the individual identification ID4x and stored in the document database Cd.

對本實施方式的裝載埠2以及上位系統C的FOUP4的處理順序進行說明。首先，若在裝載埠2的載置台23載置有FOUP4，則由裝載埠2的ID讀取機構2x讀取FOUP4的個體識別用ID4x。接著，裝載埠側通信機構2y將FOUP4的個體識別用ID4x發送至上位元系統側通信機構Cx。在上位系統C中，在資料庫Cd查詢接收到的個體識別用ID4x的FOUP4的狀態資料，將其結果獲得的狀態資料登錄至動作調整部Ca。在動作調整部Ca中，與FOUP4的狀態一致地調整裝載埠2處理FOUP4時的動作。The processing procedure of the loading port 2 and the FOUP 4 of the higher-level system C of the present embodiment will be described. First, if FOUP4 is placed on the mounting table 23 of the loading port 2, the ID reading mechanism 2x of the loading port 2 reads the ID4x for individual identification of FOUP4. Next, the loading port side communication mechanism 2y transmits the ID4x for individual identification of FOUP4 to the higher-level system side communication mechanism Cx. In the higher-level system C, the database Cd queries the received status data of the FOUP4 of the ID4x for individual identification, and registers the status data obtained as a result in the motion adjustment unit Ca. In the operation adjustment unit Ca, the operation when the loading port 2 processes the FOUP4 is adjusted in accordance with the state of the FOUP4.

例如，如果是變形還沒有進展的FOUP4，則經由上位系統側通信機構Cx向裝載埠2發送指示，以便如通常那樣進行處理，如果是變形或劣化已有進展的FOUP4，則在裝載埠2的處理時產生錯誤的可能性較高，因此例如經由上位系統側通信機構Cx向裝載埠2發送指示，以便將錯誤產生時的重試次數設定得較多。這樣，通過根據FOUP4的狀態來設定重試次數（相當於本發明的“與基板收納容器的處理相關的控制值”），從而即使在變形或劣化已經進展的FOUP4中，也不會在裝載埠2頻發錯誤，能夠順暢地進行處理。For example, if it is a FOUP4 whose deformation has not yet progressed, it will send an instruction to the loading port 2 via the higher-level system-side communication mechanism Cx so that it can be processed as usual. If it is a deformed or degraded FOUP4 that has progressed, There is a high possibility that an error occurs during processing. Therefore, for example, an instruction is sent to the loading port 2 via the higher-level system-side communication mechanism Cx, so that the number of retry times when an error occurs is set to be large. In this way, by setting the number of retries according to the state of FOUP4 (equivalent to the "control value related to the processing of the substrate storage container" of the present invention), even in FOUP4 where deformation or deterioration has progressed, it will not be in the loading port 2 Frequent errors, which can be handled smoothly.

另外，動作調整部Ca調整控制值時使用的資料不僅可以參照FOUP4的狀態，也可以參照其它資料。例如，也可以預先將與在裝載埠2的FOUP4的處理時產生的錯誤相關的資訊與個體識別用ID相關聯並保存在資料庫Cd中，動作調整部Ca基於保存在資料庫Cd中的與錯誤相關的資訊，來對每個FOUP4調整裝載埠2的動作。具體而言，動作調整部Ca計算每個FOUP4容易產生的錯誤，對每個FOUP4調整裝載埠2的動作即可。作為該情況的一個例子，可列舉如下情況：如果是在裝載埠門22與FOUP4的對接處理時容易產生錯誤的FOUP4，則以使裝載埠2與FOUP4的對接處理時的壓力（相當於本發明的“與基板收納容器的處理相關的控制值”）比通常的對接處理的壓力更強的方式，調整裝載埠2的動作。這樣，通過預先把握容易產生的錯誤，並預先對每個FOUP4調整預先裝載埠2的動作，能夠提前防止錯誤的產生。此外，每個FOUP4的容易產生的錯誤的計算能夠使用統計方法、資料採擷、機械學習等各種各樣的方法。另外，每個FOUP4容易產生的錯誤的計算也可以在動作調整部Ca以外進行。例如，也可以通過由資料處理部Cd計算每個FOUP4容易產生的錯誤，並向動作調整部Ca輸入計算結果，從而動作調整部Ca調整裝載埠2的動作。In addition, the data used when the operation adjustment unit Ca adjusts the control value can refer to not only the state of FOUP4 but also other data. For example, the information related to the error generated during the processing of the FOUP 4 of the loading port 2 may be associated with the ID for individual identification and stored in the database Cd in advance, and the operation adjustment unit Ca may be based on the data stored in the database Cd. Error-related information, to adjust the operation of loading port 2 for each FOUP4. Specifically, the operation adjustment unit Ca may calculate errors that are likely to occur for each FOUP4, and adjust the operation of the loading port 2 for each FOUP4. As an example of this situation, the following may be mentioned: If FOUP4 is prone to generate errors during the docking process of the loading port door 22 and FOUP4, the pressure during the docking process of the loading port 2 and FOUP4 (equivalent to the present invention) "Control value related to the processing of the substrate storage container") adjusts the operation of the loading port 2 in a manner that is more pressure-intensive than usual docking processing. In this way, by grasping the errors that are likely to occur in advance and adjusting the operation of the preloading port 2 for each FOUP 4 in advance, the occurrence of errors can be prevented in advance. In addition, each FOUP4 error-prone calculation can use various methods such as statistical methods, data extraction, and machine learning. In addition, calculation of errors that are likely to occur for each FOUP 4 may be performed outside the operation adjustment unit Ca. For example, the data processing unit Cd may calculate an error that is likely to occur for each FOUP 4 and input the calculation result to the operation adjustment unit Ca, so that the operation adjustment unit Ca may adjust the operation of the loading port 2.

此外，也可以預先將儲存在FOUP4中的與對晶片W進行處理相關的資訊與個體識別用ID相關聯地保存在資料庫Cd中，動作調整部Ca基於與對晶片W進行處理相關的資訊，來對每個FOUP4調整裝載埠2的動作。例如，在下一工序的裝載埠2處理儲存有熱處理後的晶片W的FOUP4的情況下，在下一工序的向裝載埠2的搬運中，FOUP4內的氣氛被冷卻，FOUP4內的氣壓變動。該情況下，有時FOUP門43難以開閉，因此只要使重試次數（相當於本發明的“與基板收納容器的處理相關的控制值”）比通常多即可。這樣，在裝載埠2上載置有FOUP4時，使用個體識別用ID4x並參照與前一工序的晶片W的處理相關的資訊，來進行裝載埠2的動作調整，由此不會在裝載埠2頻發錯誤，能夠順暢地進行處理。In addition, the information related to the processing of the wafer W stored in the FOUP 4 may be stored in the database Cd in association with the ID for individual identification, and the operation adjustment unit Ca may be based on the information related to the processing of the wafer W. To adjust the action of loading port 2 for each FOUP4. For example, when the loading port 2 of the next step processes the FOUP 4 storing the heat-treated wafer W, during the next step of transport to the loading port 2, the atmosphere in the FOUP 4 is cooled, and the air pressure in the FOUP 4 fluctuates. In this case, the FOUP door 43 may be difficult to open and close. Therefore, the number of retries (corresponding to the “control value related to the processing of the substrate storage container” of the present invention) may be greater than usual. In this way, when the FOUP4 is placed on the loading port 2, the ID4x for individual identification is used to refer to the information related to the processing of the wafer W in the previous process to adjust the operation of the loading port 2, so that it will not be Errors can be processed smoothly.

此外，在本實施方式中，動作調整部Ca利用FOUP4的狀態、與FOUP4的處理時產生的錯誤相關的資訊、以及儲存在FOUP4中的與對晶片W進行的處理相關的資訊中任一個，來進行裝載埠2的動作調整。但是，也可以基於其以外的資訊來進行裝載埠2的動作調整，也可以組合多個資訊來進行裝載埠2的動作調整。In addition, in the present embodiment, the operation adjustment unit Ca uses any one of the state of FOUP4, the information related to the error generated during the processing of FOUP4, and the information related to the processing performed on the wafer W stored in FOUP4. Adjust the operation of loading port 2. However, the movement adjustment of the loading port 2 may be performed based on other information, or a plurality of pieces of information may be combined to adjust the movement of the loading port 2.

以上，對本發明的實施方式進行了說明，但本發明並不限於上述實施方式的結構。例如，在上述的實施方式中，關聯機構Cy、資料庫Cd、資料處理部Cz以及動作調整部Ca設置在與裝載埠2不同的上位系統C。但是，這些各功能部並非必須設置在上位系統C。例如，也可以將關聯機構Cy設置在裝載埠2，從裝載埠2向上位系統C發送預先在裝載埠2關聯的個體識別用ID4x和感測器值。對於資料庫Cd、資料處理部Cz以及動作調整部Ca，同樣也可以設置在裝載埠2。The embodiment of the present invention has been described above, but the present invention is not limited to the structure of the above-described embodiment. For example, in the above-described embodiment, the related agency Cy, the database Cd, the data processing unit Cz, and the operation adjustment unit Ca are provided in a higher-level system C different from the loading port 2. However, these functional units are not necessarily installed in the upper-level system C. For example, the associated mechanism Cy may be installed in the loading port 2 and the ID4x for individual identification and the sensor value previously associated with the loading port 2 may be sent from the loading port 2 to the upper-level system C. The database Cd, the data processing unit Cz, and the operation adjustment unit Ca may also be installed in the loading port 2.

另外，在上述的實施方式中，例示了從裝載埠向上位系統發送的感測器值為兩種感測器的感測器值的方式，但從裝載埠向上位系統發送的感測器值也可以是一種感測器的感測器值的方式、也可以是三種以上感測器的感測器值的方式。另外，上位系統的設置場所無論在進行半導體製造的工廠內還是工廠外，都可以用一個上位系統統一管理或處理多個半導體製造工廠、多個半導體製造工序的資料。並且，也可以將上位系統的功能分散到多個電腦、伺服器。對於保存在資料庫中的資料的形式，也可以以實施方式那樣的表格以外的形式來保存。另外，在上述實施方式中，通過對保存在資料庫中的資料添加計測日期和時間，來表示資料的時間序列，但也可以置換為能夠把握時間序列的其它資料。In addition, in the above-mentioned embodiment, the method of sending the sensor values from the loading port to the upper system is exemplified, but the sensor values sent from the loading port to the upper system It may also be a method of sensor values of a sensor, or a method of sensor values of three or more sensors. In addition, regardless of whether the installation location of the higher-level system is in a semiconductor manufacturing plant or outside the factory, a single higher-level system can be used to collectively manage or process data of multiple semiconductor manufacturing plants and multiple semiconductor manufacturing processes. In addition, the functions of the higher-level system can be distributed to multiple computers and servers. The format of the material stored in the database may be stored in a format other than the table as in the embodiment. In addition, in the above-mentioned embodiment, the time series of the data is expressed by adding the measurement date and time to the data stored in the database, but it may be replaced with other materials that can grasp the time series.

作為本發明中的“直接或者間接地檢測FOUP的狀態的感測器”，除了上述的“排氣噴嘴的壓力感測器”、“映射感測器”以外，還能夠列舉“可直接或者間接地檢測從容器門（FOUP門）的全閉位置至敞開位置的移動所花的時間的感測器”、測定“容器門（FOUP門）的閂鎖鑰匙的旋轉轉矩的轉矩感測器”。通過將“從容器門（FOUP門）的全閉位置至敞開位置的移動時間”作為資料來取得，能夠把握容器門（FOUP門）是否變得難以打開，根據容器門（FOUP門）從全閉位置至敞開位置的移動時間變長的感測器值（資料），能夠判斷為有容器門（FOUP門）難以打開的現象、也就是有基板收納容器變形的可能性。另外，也可以安裝能夠計測在FOUP的對接處理時、容器門（FOUP門）與裝載埠門對接所需要的轉矩、壓力的感測器。As the "sensor that directly or indirectly detects the state of the FOUP" in the present invention, in addition to the above-mentioned "pressure sensor of the exhaust nozzle" and "mapping sensor", "directly or indirectly" can be cited. Sensor to detect the time taken for the movement from the fully closed position to the open position of the container door (FOUP door)" and a torque sensor to measure the rotational torque of the latch key of the container door (FOUP door) ". By obtaining the "movement time from the fully closed position of the container door (FOUP door) to the open position" as a document, it is possible to grasp whether the container door (FOUP door) becomes difficult to open, and from the fully closed position of the container door (FOUP door) The sensor value (data) in which the movement time from the position to the open position becomes longer can be judged as a phenomenon that the container door (FOUP door) is difficult to open, that is, the substrate storage container may be deformed. In addition, a sensor capable of measuring the torque and pressure required for the docking of the container door (FOUP door) and the loading port door during the docking process of the FOUP may also be installed.

另外，通過將“容器門（FOUP門）的閂鎖鑰匙的旋轉轉矩值”作為資料來取得，能夠把握閂鎖鑰匙是否變得難以旋轉，根據旋轉轉矩值為較大的資料，能夠判斷為有閂鎖鑰匙變得難以旋轉的現象、也就是有基板收納容器變形的可能性。In addition, by obtaining the "rotation torque value of the latch key of the container door (FOUP door)" as data, it is possible to grasp whether the latch key becomes difficult to rotate, and it is possible to determine from the data that the rotation torque value is large There is a possibility that the latch key becomes difficult to rotate, that is, the substrate storage container may be deformed.

另外，關於為了將容器門（FOUP門）連結於裝載埠門而設置在裝載埠門的連結機構，也可以在裝載埠設置能夠檢測該連結機構的適當的連結狀態的感測器，根據該感測器的檢測值的變化來推測或判斷基板收納容器的變形引起的連結不良。此外，通過根據從排氣噴嘴排出的廢氣的氧氣濃度計取得感測器值，能夠推定或判斷基板收納容器的變形引起的外部空氣的流入對基板收納容器內的晶片有多大程度的影響。另外，通過檢測設置在裝載埠的載置臺上的鎖定爪的鎖定錯誤，能夠推定設置在基板收納容器的底面的被鎖定部（與鎖定爪卡合的部分）的刮削。並且，也可以計測鎖定爪的鎖定錯誤次數。In addition, regarding the connection mechanism provided at the loading port door for connecting the container door (FOUP door) to the loading port door, a sensor capable of detecting an appropriate connection state of the connection mechanism may be provided at the loading port. The detection value of the detector changes to estimate or judge the connection failure caused by the deformation of the substrate storage container. In addition, by acquiring the sensor value from the oxygen concentration meter of the exhaust gas discharged from the exhaust nozzle, it is possible to estimate or judge how much the inflow of outside air due to the deformation of the substrate storage container affects the wafers in the substrate storage container. In addition, by detecting a locking error of the locking claw provided on the mounting table of the loading port, it is possible to estimate the scraping of the locked portion (the portion that engages with the locking claw) provided on the bottom surface of the substrate storage container. In addition, the number of locking errors of the locking claw can also be measured.

另外，上位系統的資料處理部也可以通過利用資料採擷的方法來輸出基板收納容器的狀態（例如預測基板收納容器的更換時期）。In addition, the data processing unit of the higher-level system may output the state of the substrate storage container (for example, predict the replacement time of the substrate storage container) by using the method of data extraction.

在檢測（計測）間隔時間，相對於標準間隔時間花費了時間的情況下，如果僅是特定的裝載埠花費時間的傾向，則能夠判定為產生了由裝載埠引起的時間損失，報告催促裝載埠的調整的資訊，如果是特定的基板收納容器載置在哪個裝載埠上也花費時間的傾向，則能夠判定為產生了由基板收納容器引起的時間損失，也可以報告以基板收納容器為檢查物件的資訊或者催促更換的資訊。另外，相對於容器門（FOUP門）難以打開的基板收納容器，在動作調整機構將底部清洗處理時的氣體供給量設定得較多以提高基板收納容器的內壓，並以使容器門（FOUP門）容易打開的方式進行了處理的情況下，基板收納容器內的氣氛容易洩漏到外部。這樣，在進行了有裝載埠周邊的氧氣濃度降低的可能性的處理的情況下，也可以向作業者報告。In the case where the interval time is detected (measured) and it takes time relative to the standard interval time, if only a specific loading port tends to spend time, it can be determined that there is a time loss caused by the loading port, and the report urges the loading port If the information of the adjustment of the specific substrate storage container tends to take time on which loading port, it can be determined that there is a time loss caused by the substrate storage container, and the substrate storage container can also be reported as the inspection object Information or information urging replacement. In addition, with respect to the substrate storage container that is difficult to open with the container door (FOUP door), the operation adjustment mechanism sets the gas supply amount during the bottom cleaning process to be large to increase the internal pressure of the substrate storage container, and the container door (FOUP (Door) When the treatment is performed in a way that is easy to open, the atmosphere in the substrate storage container is likely to leak to the outside. In this way, when a process that may reduce the oxygen concentration around the loading port is performed, it may be reported to the operator.

在上述的實施方式中，作為基板收納容器，採用了晶片搬運所使用的FOUP。但是在本發明中也能夠使用FOUP以外的基板收納容器、例如MAC（Multi Applicati on Carrier）、H－MAC（Horizontal-MAC）、FOSB（Front Open Shipping Box）等。In the above-described embodiment, as the substrate storage container, the FOUP used for wafer transfer is used. However, in the present invention, substrate storage containers other than FOUP, such as MAC (Multi Applicati on Carrier), H-MAC (Horizontal-MAC), FOSB (Front Open Shipping Box), etc., can also be used.

在上述的實施方式中，作為底部清洗處理等所使用的環境氣體列舉了氮氣，但並不限定於此，能夠使用乾燥氣體、氬氣等所希望的氣體（惰性氣體）。In the above-described embodiment, nitrogen gas is used as the environmental gas used for the bottom cleaning process, but it is not limited thereto, and a desired gas (inert gas) such as dry gas or argon gas can be used.

另外，容器門（FOUP門）也可以在從全閉位置向全開位置移動的過程中暫時成為傾斜姿勢（伴隨描繪部分圓弧狀的軌跡的動作）。In addition, the container door (FOUP door) may temporarily be in a tilted posture (with an action of drawing a partial arc-shaped trajectory) while moving from the fully closed position to the fully open position.

對於其它各部的具體的結構也不限於上述實施方式，在不脫離本發明的主旨的範圍能夠進行各種變形。The specific structure of the other parts is not limited to the above-mentioned embodiment, and various modifications can be made without departing from the gist of the present invention.

1‧‧‧基板收納容器管理系統2‧‧‧裝載埠2c‧‧‧感測器2x‧‧‧ID讀取機構2y‧‧‧裝載埠側通信機構21‧‧‧開閉機構21a‧‧‧開口部22‧‧‧裝載埠門23‧‧‧載置台24‧‧‧腳部25‧‧‧水準機台27‧‧‧門移動機構214‧‧‧窗單元215‧‧‧開口部221‧‧‧連結機構231‧‧‧突起232‧‧‧鎖定爪3‧‧‧搬運室31‧‧‧搬運機器人32‧‧‧風扇篩檢程式單元3A‧‧‧前壁面3B‧‧‧後壁面3C‧‧‧控制部3S‧‧‧內部空間4‧‧‧FOUP40‧‧‧埠41‧‧‧搬出搬入口42‧‧‧FOUP主體43‧‧‧FOUP門4S‧‧‧內部空間4x‧‧‧個體識別用ID9‧‧‧清洗噴嘴C‧‧‧上位系統Ca‧‧‧動作調整部Cd‧‧‧資料庫Ce‧‧‧資料處理部Ce1‧‧‧學習機構Ce2‧‧‧預測結果輸出機構Cx‧‧‧上位系統側通信機構Cy‧‧‧關聯機構Cz‧‧‧資料處理部Cz1‧‧‧電腦構Cz2‧‧‧比較機構Cz3‧‧‧預測結果輸出機構D‧‧‧前後方向H‧‧‧上下方向L‧‧‧移動限制部m‧‧‧映射部m1‧‧‧發送器m2‧‧‧接收器m3‧‧‧感測器框架M‧‧‧處理裝置MC‧‧‧控制部MS‧‧‧內部空間P‧‧‧清洗裝置W‧‧‧基板1‧‧‧Substrate storage container management system 2‧‧‧ Loading port 2c‧‧‧ Sensor 2x‧‧‧ID reading mechanism 2y‧‧‧ Loading port side communication mechanism 21‧‧‧Opening and closing mechanism 21a‧‧‧ opening Part 22 ‧‧‧ Loading port door 23 ‧ ‧ ‧ Mounting table 24 ‧ ‧ ‧ Foot 25 ‧ ‧ ‧ Leveling machine 27 ‧ ‧ ‧ door movement mechanism 214 ‧ ‧ ‧ window unit 215 ‧ ‧ ‧ opening 221 ‧ ‧ Linking mechanism 231‧‧‧Protrusion 232‧‧‧Lock claw 3‧‧‧Transport room 31‧‧‧Transport robot 32‧‧‧Fan screening program unit 3A‧‧‧Front wall 3B‧‧‧‧Back wall 3C‧‧‧ Control unit 3S‧‧‧Internal space 4‧‧‧FOUP40‧‧‧Port 41‧‧‧Move-out/entry entrance 42‧‧‧FOUP body 43‧‧‧FOUP door 4S‧‧‧Inner space 4x‧‧‧ID9 for individual identification ‧‧‧Cleaning nozzle C‧‧‧High-level system Ca‧‧‧Motion adjustment section Cd‧‧‧Data base Ce‧‧‧‧Data processing section Ce1‧‧‧Learning institution Ce2‧‧‧Prediction result output mechanism Cx‧‧‧High System side communication mechanism Cy‧‧‧Affiliated organization Cz‧‧‧Data processing department Cz1‧‧‧Computer structure Cz2‧‧‧Comparative organization Cz3‧‧‧Predicted result output mechanism D‧‧‧Front and back direction H‧‧‧Up and down direction L ‧‧‧Motion restriction part m‧‧‧ Mapping part m1‧‧‧Transmitter m2‧‧‧Receiver m3‧‧‧Sensor frame M‧‧‧Processing device MC‧‧‧Control part MS‧‧‧Internal space P‧‧‧cleaning device W‧‧‧substrate

圖1是本發明的第一實施方式的基板收納容器管理系統的方塊線圖。FIG. 1 is a block diagram of a substrate storage container management system according to a first embodiment of the present invention.

圖2是示意性地表示該實施方式的EFEM及其周邊裝置的相對位置關係的側視圖。FIG. 2 is a side view schematically showing the relative positional relationship between the EFEM and its peripheral devices according to this embodiment.

圖3是示意性地表示FOUP從基座離開而且裝載埠門處於全閉位置的狀態的該實施方式的裝載埠的側剖面的圖。3 is a side cross-sectional view schematically showing the loading port of this embodiment in a state where the FOUP is away from the base and the loading port door is in the fully closed position.

圖4是省略一部分地示出該實施方式的裝載埠的立體圖。FIG. 4 is a perspective view partially showing the loading port of the embodiment.

圖5是圖4的x方向向視圖。FIG. 5 is a view in the x direction of FIG. 4.

圖6是圖4的y方向向視圖。FIG. 6 is a y-direction view of FIG. 4.

圖7是該實施方式中的窗單元的整體立體圖。7 is an overall perspective view of the window unit in the embodiment.

圖8是與圖3對應地表示FOUP接近基座而且裝載埠門處於全閉位置的狀態的圖。8 is a view corresponding to FIG. 3 showing a state where the FOUP is close to the base and the loading port door is in the fully closed position.

圖9是與圖3對應地表示裝載埠門處於敞開位置的狀態的圖。9 is a view corresponding to FIG. 3 showing a state where the loading port door is in an open position.

圖10是表示該實施方式中的映射部的圖。FIG. 10 is a diagram showing a mapping unit in the embodiment.

圖11是該實施方式中的資料處理部的功能方塊圖以及流程圖。11 is a functional block diagram and flowchart of the data processing unit in the embodiment.

圖12是示意性地表示該實施方式中的資料處理部的處理內容的圖。FIG. 12 is a diagram schematically showing the processing contents of the data processing unit in the embodiment.

圖13是表示該實施方式中的資料處理部的資料庫（表格）的圖。13 is a diagram showing a database (table) of the data processing unit in the embodiment.

圖14是本發明的第二實施方式中的資料處理部的功能方塊圖。14 is a functional block diagram of a data processing unit in a second embodiment of the present invention.

圖15是本發明的第三實施方式的基板收納容器管理系統的方塊線圖。15 is a block diagram of a substrate storage container management system according to a third embodiment of the present invention.

圖中：1—基板收納容器管理系統，2—裝載埠，23—載置台，2c—感測器，2x—ID讀取機構，2y—裝載埠側通信機構，4—基板收納容器（FOUP），41—搬出搬入口，4x—個體識別用ID，C—上位系統，Ca—動作調整部，Cd—資料庫，Cx—上位系統側通信機構，Cy—關聯機構，Cz—資料處理部，W—基板（晶片）。In the picture: 1-substrate storage container management system, 2-loading port, 23-placement table, 2c-sensor, 2x-ID reading mechanism, 2y-loading port side communication mechanism, 4-substrate storage container (FOUP) , 41—moving in and out, 4x—individual identification ID, C—superordinate system, Ca—operation adjustment department, Cd—database, Cx—superior system side communication mechanism, Cy—affiliated organization, Cz—data processing department, W — Substrate (wafer).

1‧‧‧基板收納容器管理系統 1‧‧‧Substrate storage container management system

2‧‧‧裝載埠 2‧‧‧ Loading port

2c‧‧‧感測器 2c‧‧‧Sensor

2x‧‧‧ID讀取機構 2x‧‧‧ID reading mechanism

2y‧‧‧裝載埠側通信機構 2y‧‧‧Port-side communication mechanism

21‧‧‧開閉機構 21‧‧‧Opening and closing mechanism

23‧‧‧載置台 23‧‧‧Stage

25‧‧‧水準機台 25‧‧‧leveling machine

4‧‧‧FOUP 4‧‧‧FOUP

40‧‧‧埠 40‧‧‧ port

41‧‧‧搬出搬入口 41‧‧‧Move out and move in

43‧‧‧FOUP門 43‧‧‧FOUP door

4S‧‧‧內部空間 4S‧‧‧Internal space

4x‧‧‧個體識別用ID 4x‧‧‧ ID for individual identification

9‧‧‧清洗噴嘴 9‧‧‧cleaning nozzle

C‧‧‧上位系統 C‧‧‧ Host system

Cd‧‧‧資料庫 Cd‧‧‧Database

Cx‧‧‧上位系統側通信機構 Cx‧‧‧Higher system side communication agency

Cy‧‧‧關聯機構 Cy‧‧‧Affiliated Organization

Cz‧‧‧資料處理部 Cz‧‧‧Data Processing Department

W‧‧‧基板 W‧‧‧Substrate

Claims (11)

一種基板收納容器管理系統，其特徵在於，包含： 裝載埠，其相對於基板收納容器能夠進行基板的出入處理，包括能夠讀取附加於上述基板收納容器的個體識別用ID的ID讀取機構和直接或者間接地檢測上述基板收納容器的狀態的感測器； 關聯機構，其將由上述ID讀取機構讀取出的上述個體識別用ID與由上述感測器檢測出的感測器值相互關聯起來； 資料庫，其儲備由上述關聯機構關聯了的資料；以及 資料處理部，其解析上述資料庫內的上述資料，並輸出每個上述個體識別用ID的上述基板收納容器的狀態。A substrate storage container management system, comprising: a loading port capable of carrying in and out of a substrate with respect to the substrate storage container; and an ID reading mechanism capable of reading an individual identification ID attached to the substrate storage container and A sensor that directly or indirectly detects the state of the substrate storage container; an association mechanism that correlates the ID for individual identification read by the ID reading mechanism and the sensor value detected by the sensor A database, which stores data related to the related organizations; and a data processing unit, which analyzes the data in the database and outputs the status of the substrate storage container for each of the individual identification IDs. 根據請求項1所述的基板收納容器管理系統，其特徵在於， 上述資料處理部包含： 電腦構，其根據由特定的上述感測器檢測出的感測器值計算統計資料； 比較機構，其對與特定的上述個體識別用ID相關聯的感測器值和由上述電腦構計算出的計算結果進行比較；以及 狀態輸出機構，其基於由上述比較機構比較出的結果來輸出上述基板收納容器的狀態。The substrate storage container management system according to claim 1, wherein the data processing unit includes: a computer mechanism that calculates statistical data based on sensor values detected by the specific sensor; a comparison mechanism, which Comparing the sensor value associated with the specific ID for individual identification and the calculation result calculated by the computer mechanism; and a status output mechanism that outputs the substrate storage container based on the result compared by the comparison mechanism status. 根據請求項1或2所述的基板收納容器管理系統，其特徵在於， 上述裝載埠包括多種上述感測器， 上述關聯機構能夠將上述個體識別用ID與由多種上述感測器檢測出的多種上述感測器值相互關聯起來。The substrate storage container management system according to claim 1 or 2, wherein the loading port includes a plurality of the sensors, and the related mechanism is capable of comparing the individual identification ID and the plurality of types detected by the plurality of sensors The above sensor values are correlated with each other. 根據請求項1~3任一項中所述的基板收納容器管理系統，其特徵在於， 還包含動作調整部，該動作調整部基於上述資料處理部輸出的每個上述個體識別用ID的上述基板收納容器的狀態，對上述裝載埠的與上述基板收納容器的處理相關的控制值進行調整。The substrate storage container management system according to any one of claims 1 to 3, further comprising an operation adjustment unit based on the substrate for each of the individual identification IDs output by the data processing unit The state of the storage container is adjusted for the control value of the loading port related to the processing of the substrate storage container. 根據請求項1~3任一項中所述的基板收納容器管理系統，其特徵在於， 上述關聯機構能夠將上述個體識別用ID、與在上述基板收納容器的處理時產生的錯誤相關的資訊以及與對儲存在上述基板收納容器中的上述基板進行的處理相關的資訊中的至少任一方的資訊相互關聯起來， 還包含動作調整部，該動作調整部基於儲備在上述資料庫中的每個上述個體識別用ID的上述至少任一方的資訊，來調整上述裝載埠的與上述基板收納容器的處理相關的控制值。The substrate storage container management system according to any one of claims 1 to 3, wherein the related mechanism is capable of associating the ID for individual identification, information related to errors generated during processing of the substrate storage container, and At least any one of the information related to the processing performed on the substrate stored in the substrate storage container is related to each other, and further includes an operation adjustment unit based on each of the above stored in the database The information of at least any one of the above IDs for individual identification adjusts the control value related to the processing of the substrate storage container of the loading port. 根據請求項1~5任一項中所述的基板收納容器管理系統，其特徵在於， 還包含能夠與上述裝載埠通信的上位系統， 在上述上位系統至少設有上述關聯機構、上述資料庫以及上述資料處理部。The substrate storage container management system according to any one of claims 1 to 5, further comprising an upper-level system capable of communicating with the loading port, and the upper-level system is provided with at least the associated mechanism, the database, and The above data processing department. 根據請求項1~6任一項中所述的基板收納容器管理系統，其特徵在於， 上述資料處理部包括學習機構，該學習機構根據上述裝載埠的上述感測器的感測器值來學習上述基板收納容器的狀態。The substrate storage container management system according to any one of claims 1 to 6, wherein the data processing unit includes a learning mechanism that learns based on a sensor value of the sensor of the loading port The state of the board storage container. 一種裝載埠，是請求項1~7任一項中所述的基板收納容器管理系統所包含的裝載埠，其特徵在於，包含： 上述ID讀取機構，其能夠讀取附加於上述基板收納容器的上述個體識別用ID；以及 上述感測器，其直接或者間接地檢測上述基板收納容器的狀態。A loading port is a loading port included in the substrate storage container management system described in any one of claims 1 to 7, characterized by comprising: the ID reading mechanism capable of reading the substrate storage container The ID for individual identification of the; and the sensor, which directly or indirectly detect the state of the substrate storage container. 一種基板收納容器管理方法，其特徵在於，包含以下步驟： ID讀取步驟，通過相對於基板收納容器能夠進行基板的出入處理的裝載埠，讀取附加於上述基板收納容器的個體識別用ID； 檢測步驟，利用設置在上述裝載埠的感測器，直接或者間接地檢測上述基板收納容器的狀態； 關聯步驟，將在上述ID讀取步驟中讀取出的上述個體識別用ID與在上述檢測步驟中檢測出的感測器值相互關聯起來； 資料庫化步驟，將在上述關聯步驟中關聯起來的資料儲備在資料庫中；以及 資料處理步驟，解析上述資料庫內的上述資料，並輸出每個上述個體識別用ID的上述基板收納容器的狀態。A method for managing a substrate storage container, comprising the following steps: an ID reading step, which reads an ID for individual identification added to the substrate storage container through a loading port capable of performing a substrate access process with respect to the substrate storage container; In the detection step, a sensor provided in the loading port is used to directly or indirectly detect the state of the substrate storage container; in the correlation step, the ID for individual identification read in the ID reading step and the detection The sensor values detected in the step are correlated with each other; the databaseization step stores the data correlated in the correlation step in the database; and the data processing step analyzes the above data in the database and outputs The state of the substrate storage container for each of the individual identification IDs. 根據請求項9所述的基板收納容器管理方法，其特徵在於， 還包含動作調整步驟，該步驟中，基於在上述資料處理步驟中輸出的每個上述個體識別用ID的上述基板收納容器的狀態，對上述裝載埠的與上述基板收納容器的處理相關的控制值進行調整。The substrate storage container management method according to claim 9, further comprising an operation adjustment step in which the state of the substrate storage container based on each of the individual identification IDs output in the data processing step , Adjust the control value of the loading port related to the processing of the substrate storage container. 根據請求項9所述的基板收納容器管理方法，其特徵在於， 在上述關聯步驟中，將上述個體識別用ID、與在上述基板收納容器的處理時產生的錯誤相關的資訊以及與對儲存在上述基板收納容器中的上述基板進行的處理相關的資訊中的至少任一方的資訊相互關聯起來， 還包含動作調整步驟，該步驟中，基於儲備在上述資料庫中的每個上述個體識別用ID的上述至少任一方的資訊，來調整上述裝載埠的與上述基板收納容器的處理相關的控制值。The substrate storage container management method according to claim 9, wherein in the association step, the ID for individual identification, information related to errors generated during the processing of the substrate storage container, and the At least any one of the information related to the processing performed by the substrate in the substrate storage container is related to each other, and further includes an action adjustment step in which each individual identification ID stored in the database is based on Information of at least one of the above to adjust the control value of the loading port related to the processing of the substrate storage container.
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