TWI815540B - Thermoelectric heat dissipation device and its derivative application products - Google Patents

Abstract

A thermoelectric heat dissipation device and its derivative application products, characterized in that: the electronic product is provided with: a nanocrystal heat dissipation coating, coated on the surface of the housing or the heating element; a thin oscillating plate, installed in the housing to form An oscillating heat dissipation module uses the ion wind or ultrasonic waves released by the thin oscillator to generate resonance to improve the air convection effect of the nanocrystal heat dissipation coating, thereby improving the heat dissipation efficiency of the oscillating heat dissipation module; a phase change temperature regulation Micro-airbags use the phase change of phase change materials to absorb or release a large amount of latent heat. In this way, the oscillating heat dissipation module is used to improve the heat dissipation efficiency of electronic products, and the phase change temperature-adjusting micro-airbag is used to achieve the effect of intelligent temperature adjustment, thereby improving the practicality and reliability of electronic products. Furthermore, by combining a thermoelectric thermoelectric power generation chip with a furnace heat source body, electronic products can be derived into various derivative application products such as thermoelectric chargers/generators.

Description

Thermoelectric heat dissipation device and its derivative application products

The present invention relates to a thermoelectric heat dissipation device and its derivative application products, and particularly to a device for improving the heat dissipation efficiency of electronic products.

In recent years, semiconductor devices such as high-power central processing units (CPUs) and graphics processing units (GPUs) have developed rapidly. Electronic devices are becoming more and more thin and multi-tasking, and due to the increase in density and frequency of electronic components, local overheating will occur after long-term use. Usually, the chip of an electronic device is the main heat source during operation, and heat dissipation is not only for Lowering the temperature of the chip itself ensures that it can work normally within the required temperature range. At the same time, it is also necessary to ensure that the casing is not locally overheated during heat dissipation, resulting in a bad user experience for consumers. Currently, the heat dissipation method of electronic devices mainly uses simple Open holes, heat conduction, heat convection, etc., but these heat dissipation methods can no longer meet the heat energy generated by today's high-performance chips, so there will be overheating problems, and the heat energy cannot be evenly distributed, resulting in a reduction in the heat dissipation efficiency inside the electronic device, which in turn leads to The system command frequency is reduced or is too slow and crashes. It also happens from time to time.

Secondly, heat dissipation materials include: liquid metal, thermal conductive sheets, thermal conductive paste, thermal conductive tape, etc. They are designed to provide the best conditions for heat conduction and are usually placed between heating components and heat dissipation devices. space, used to fill the gap between the two, and reliably completely conduct the heat from the heating element to the heat sink. It can be applied to a variety of products, such as mobile phones, tablets, laptops, desktop computers, motherboards, memory modules and other electronic devices.

Among them, "liquid metal" is a low melting point alloy that is liquid at room temperature. Its main components are gallium indium tin alloy, indium bismuth tin alloy, or indium bismuth zinc alloy. It has stable properties and excellent thermal conductivity and Electrical conductivity, so many industries currently use "liquid metal" as thermal conductive material materials to solve the above problems. However, the use of liquid metal as a heat dissipation material is not without its shortcomings; compared with traditional commercial thermal interface materials, gallium-based liquid metal has extremely low thermal resistance and good fluidity. At present, researchers have developed an alloy with gallium, indium, bismuth, and tin as the main components, and its total thermal resistance is as low as 0.5K. mm2/W. However, the surface tension of gallium and gallium alloys is relatively large (0.5~0.72N/m), making the coating operation difficult, and has the disadvantage of poor wetting with the substrate; the good fluidity of liquid metal makes it easy to overflow from the interface, causing the problem of Risk of short circuit in electronic components.

In addition, when the current liquid metal reaches the phase change temperature, its fluidity greatly increases, and it is easy to overflow and contaminate electronic components. Therefore, it is necessary to design a sealing structure around the semiconductor coating, and add a middle frame and bedding sealing materials to prevent The leakage and absorption of liquid metal dosage tolerances increase the difficulty and limitations of heat dissipation module design. Liquid metal appears liquid under normal temperature conditions, which has certain restrictions on the coating process. Liquid metal can only be applied to the surface of semiconductor chips such as central processing units (CPUs) and graphics processing units (GPUs), but cannot be applied to heat dissipation modules. Flat and not flowing. Liquid metal has poor wettability with chip materials, and most of them appear in the shape of liquid beads during the construction process. The construction is more difficult than traditional thermal paste, and the amount of liquid metal needs to be strictly controlled to prevent leakage.

Also, the liquid metal sheets on the market will form a fluid with good fluidity after reaching the phase change temperature, which cannot effectively fill the gap between the chip and the heat dissipation module. It may even slowly drain over a long period of time, causing the module to The interface material between the chips is short of material, and the chip temperature gradually rises, thus triggering chip overheating and frequency reduction protection.

Inorganic nanoparticle-polymer composite heat dissipation materials are mainly composed of polymer materials and heat dissipation fillers (mainly composed of carbon materials, metals or ceramics, etc.). The particle size and volume fraction of the heat dissipation coating material affect the thermal conductivity of the body. The heat-dissipation fillers in heat-dissipation coating materials currently on the market are mainly graphite, carbon nanotubes, etc.; however, the compatibility of the above-mentioned heat-dissipation fillers with polymer materials is poor, and the nano-heat dissipation materials are easy to aggregate, which seriously affects their performance. Thermal conductivity and stability.

Therefore, in view of the above problems, the inventor of the present invention aims at liquid metal thermal conductive materials and The deficiencies caused by traditional thermal paste further propose solutions.

The main purpose of the present invention is to provide a thermoelectric heat dissipation device and its derivative application products, which can overcome the shortcomings caused by the above-mentioned traditional thermal conductive materials, thereby improving the heat dissipation efficiency and practicality of electronic products.

In order to achieve the above object, a first feasible embodiment of the present invention includes: an electronic product including a casing, a control circuit board, a plurality of electronic components provided on the control circuit board, a heating component, and a lithium battery; it is characterized in that : The electronic product is provided with: a nanocrystal heat dissipation coating, which is composed of: nanonatural crystal powder, quartz powder, graphite powder, silicon oxide, and UV photosensitive hardener mixed and coated on the On one surface of the casing or on the heating element; a thin oscillating piece, which can be a passive element composed of a tiny ultrasonic oscillator, a quartz oscillator, and a piezoelectric ceramic piece, is powered by the battery, and can generate 30MHZ when energized The above micro-vibrations are installed in the housing and close to the nanocrystal heat dissipation coating to form an oscillation heat dissipation module. The ion wind or ultrasonic waves released by the thin oscillation piece are used to generate resonance and improve the nanometer crystal heat dissipation coating. The air convection effect of the rice crystal heat dissipation coating improves the heat dissipation efficiency of the oscillation heat dissipation module; a phase change temperature-adjustable micro-airbag is made of a temperature-adjustable phase change material (PCM), which is made of polymer materials. The phase change material is coated inside the micron and/or nanoparticles to form a phase change temperature-adjusting micro-airbag with a core-shell structure, and the phase-change temperature-adjusting micro-airbag is injection molded on the CPU, GPU, and high-power chip of the circuit board. or filled in the shell, and utilizes the solid-liquid phase change of the phase change material to absorb or release a large amount of latent heat to maintain a constant temperature of the micro-airbag itself; thereby, the thin oscillation The oscillating heat dissipation module composed of the chip and the nanocrystal heat dissipation coating improves the heat dissipation efficiency of the electronic product, and then uses the phase change temperature-adjusting micro airbag to achieve the effect of intelligent temperature regulation, thereby improving the performance of the electronic product. Practicality and reliability.

According to the front-opening feature, the casing of the electronic product includes a front casing, a back casing, and a middle frame located between the front casing and the back casing, and the front casing is provided with an LCD screen.

According to the aforementioned characteristics, the electronic product may be a mobile phone.

According to the aforementioned characteristics, the electronic product may be a game console.

According to the characteristics disclosed above, the electronic product may be a translator or a translator.

According to the aforementioned features, the second possible embodiment of the present invention includes: an electronic product including a casing, a control circuit board, a plurality of electronic components, a heating element, and a lithium battery provided on the control circuit board; its characteristics The electronic product is equipped with: a nanocrystal heat dissipation coating, which is composed of: nanonatural crystal powder, quartz powder, graphite powder, silicon oxide, and UV photosensitive hardener, and is coated on On one surface of the casing or the heating element; a thin oscillation piece, which can be a passive element composed of a tiny ultrasonic oscillator, a quartz oscillator, and a piezoelectric ceramic piece, is powered by the battery, and can generate electricity when energized. Micro-vibrations above 30MHZ are installed in the housing and close to the nanocrystal heat dissipation coating to form an oscillating heat dissipation module. The ion wind or ultrasonic waves released by the oscillation piece are used to generate resonance and improve the nano-crystal heat dissipation coating. The air convection effect of the rice crystal heat dissipation coating improves the heat dissipation efficiency of the oscillation heat dissipation module; a heater heat source body is located in the housing, which has an ignition device and a fuel adding hole, and the fuel adding hole is exposed Outside the casing; at least one thermoelectric thermoelectric power generation chip has a hot surface and a cold surface. The hot surface is attached to the heat source body of the body furnace and generates electricity using the heat generated by the heat source body of the body furnace. The electronic product uses the power generated by the control circuit board to charge the lithium battery; a phase change temperature-adjustable micro-airbag is made of a temperature-adjustable phase change material (PCM) and polymer material. The quartz phase change material is coated inside micron and/or nanoparticles to form a phase change temperature-regulating micro-airbag with a core-shell structure, and the phase-change temperature-regulating micro-airbag is injection molded on the CPU, GPU, high-end components of the circuit board. on the power chip, or filled in the housing, using the phase state of the phase change material changes, causing the phase change material to absorb or release a large amount of latent heat to maintain a constant temperature of the micro-airbag itself; thereby, the oscillating heat dissipation module composed of the thin oscillating sheet and the nanocrystal heat dissipating coating improves the The heat dissipation efficiency of electronic products can be achieved by using the phase change temperature-adjusting micro-airbags to achieve the effect of intelligent temperature adjustment, thereby improving the practicality and reliability of the electronic products. Furthermore, the thermoelectric thermoelectric power generation chip is used with the heat source body of the heater. The electronic product becomes a thermoelectric charger/generator.

According to the characteristics disclosed above, the derivative applications of this electronic product include: a water-cooled thermoelectric charger/generator, an air-cooled thermoelectric charger/generator, an LED thermoelectric charger/generator, and a thermal-assisted electric bicycle set. Forced air cooling generator, and an ultrasonic cooling mobile phone case.

With the help of the above-mentioned technical features, the present invention uses the nanocrystal heat dissipation coating and the thin oscillation plate to form an oscillation heat dissipation module. The ion wind or ultrasonic waves released by the thin oscillation plate are used to generate resonance to improve the performance of the nanocrystal heat dissipation coating. The air convection effect of the layer is used to improve the heat dissipation efficiency of the oscillating heat dissipation module; and then the phase change temperature-adjusting micro-airbag uses the phase change of the phase change material to absorb or release a large amount of latent heat. In this way, the oscillating heat dissipation module is used to improve the heat dissipation efficiency of electronic products, and the phase change temperature-adjusting micro-airbag is used to achieve the effect of intelligent temperature adjustment, thereby improving the practicality and reliability of electronic products. Furthermore, by combining a thermoelectric thermoelectric power generation chip with a furnace heat source body, electronic products can be derived into various derivative application products such as thermoelectric chargers/generators.

10: Shell

10a:Front shell

10b: back shell

10c: middle frame

11: LCD screen

12:Fan

13: Magnet piece

14:Heat radiator tank

141: Cooling fins

15:Water cooling contact head

151:Copper sintered structure

16:Heat dissipation boss

17:Heat pipe

18:LED

101: Machine base

102: Combined seat

103: Ultrasonic cooling mobile phone case

20:Control circuit board

21:Electronic components

22: Heating element

30:Lithium battery

40: Oscillation cooling module

41:Nano crystal heat dissipation coating

42:Thin oscillating plate

421: Resonance

50: Phase change temperature regulating micro-airbag

50a: flake

50b: frame type

51: Phase change materials

52:Core shell

60: Huai stove heat source body

61:Ontology

62: Ignition device

63:Cover

64:Fuel adding hole

65: plug body

70: Thermoelectric thermoelectric power generation chip

71:Hot noodles

72:Cold noodles

73:Semiconductors

100A: Electronic products (mobile phones)

100B: Translator

100C: Mobile game console

100D:Game console

100E: Mother-to-child machine

200A: Thermoelectric charger/generator

200B: Water-cooled thermoelectric charger/generator

200C: Forced air-cooled generator/generator

200D: Air-cooled thermoelectric charger/generator

201:Connection port

Figure 1 is an exploded perspective view of the first feasible embodiment of the present invention.

Figure 2 is a partially exploded perspective view (1) of the first feasible embodiment of the present invention.

Figure 3 is a partially exploded perspective view (2) of the first feasible embodiment of the present invention.

Figure 4A is a rear perspective view of the first possible embodiment of the present invention.

Figure 4B is a front perspective view of the first possible embodiment of the present invention.

Figure 5A is a schematic diagram of the ultrasonic resonance of the oscillating heat dissipation module according to the first feasible embodiment of the present invention.

Figure 5B is a schematic diagram of a phase change temperature-regulated micro-airbag according to the first feasible embodiment of the present invention.

Figure 5C is a schematic diagram of the complete filling surface of the phase change temperature-regulated micro-airbag according to the first feasible embodiment of the present invention.

Figure 6A is a front perspective view of the first possible embodiment of the present invention, showing the electronic product in a horizontal direction.

FIG. 6B is a front perspective view of the first feasible embodiment of the present invention, showing the electronic product in the horizontal direction, which can be used as a translator or a game console.

Figure 6C is a front perspective view of the first feasible embodiment of the present invention, showing the electronic product in a horizontal orientation, which can be used as a game console.

FIG. 6D is a front perspective view of the first feasible embodiment of the present invention, showing the electronic product in a horizontal orientation and can be used as a motherboard.

Figure 7 is a reference diagram of the use state of the mobile phone for business travel according to the first feasible embodiment of the present invention.

FIG. 8A is an exploded perspective view of the heat source body of the heater according to the second possible embodiment of the present invention.

FIG. 8B is an assembled perspective view of the heat source body of the heater according to the second possible embodiment of the present invention.

Figure 9A is an exploded perspective view of the second possible embodiment of the present invention.

Figure 9B is a perspective view of a thermoelectric thermoelectric power generation chip according to the second feasible embodiment of the present invention.

Figure 9C is a schematic diagram of the thermoelectric thermoelectric power generation chip and the heat source body of the heater according to the second feasible embodiment of the present invention.

Figure 10A is a rear perspective view of the second possible embodiment of the present invention.

Figure 10B is a front perspective view of the second possible embodiment of the present invention.

Figure 11A is a reference diagram of the second possible embodiment of the present invention as a water-cooled thermoelectric charger/generator.

Figure 11B is a schematic diagram of the internal structure of the water-cooled contact head in Figure 11A.

Figure 12 is a structural diagram of a water-cooled thermoelectric charger/generator according to a second feasible embodiment of the present invention.

Figure 13 is a second feasible embodiment of the present invention as a forced air cooling device for a power-assisted electric heated bicycle set. Reference diagram of the charging/generator usage status.

Figure 14 is a rear perspective view of an air-cooled thermoelectric charger/generator according to a second possible embodiment of the present invention.

Figure 15 is a structural diagram of an air-cooled thermoelectric charger/generator according to a second possible embodiment of the present invention.

Figure 16 is a schematic diagram of the ultrasonic cooling mobile phone case derived from the present invention.

The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

First, please refer to Figures 1 to 7. The first feasible embodiment of a thermoelectric heat dissipation device and its derivative application products of the present invention includes: an electronic product 100A, including a housing 10, a control circuit board 20, and a device. A plurality of electronic components 21, a heating element 22, and a lithium battery 30 on the control circuit board 20 are characterized in that: the electronic product 100A is provided with: a nanocrystal heat dissipation coating 41, which consists of: nanometer Natural crystal powder, quartz powder, graphite powder, silicon oxide, and UV photosensitive hardener are mixed and coated on the surface of the housing 10 or the heating element 22; because natural crystal (ROCK Grystal) and quartz ( Quartz) self-oscillation lattice vibration rate is 32kHz/SEC2 or above, so the heat sink provided with the nanocrystal heat dissipation coating 41 can break up the air trapped on the surface and help the heat dissipation effect.

A thin oscillation piece 42 can be a passive component composed of a tiny ultrasonic oscillator, a quartz oscillator, and a piezoelectric ceramic piece. The battery 30 provides its power supply. When energized, it can generate micro-vibrations above 30 MHZ. Its installation An oscillating heat dissipation module 40 is formed in the housing 10 and close to the nanocrystal heat dissipation coating 41. As shown in FIG. 5A, the ion wind or ultrasonic waves released by the thin oscillation sheet 42 are used to generate resonance 421. , improve the air convection of the nanocrystal heat dissipation coating 41 Effect, thereby improving the heat dissipation efficiency of the oscillation heat dissipation module 40; therefore, the oscillation heat dissipation module 40 is a heat dissipation system composed of the nanocrystal heat dissipation coating 41 and the thin oscillation plate 42, which complement each other and multiply. efficiency.

A phase change temperature-adjustable micro-airbag 50, as shown in Figure 5B, is composed of a temperature-adjustable phase change material 51 (Phase Change Material, PCM) as the core, and a polymer material as the core shell 52. The phase change material 51 It is coated inside the micron and/or nanoparticles to form a phase change temperature-adjusting micro-airbag 50 with a core-shell structure, and the phase-change temperature-adjusting micro-airbag 50 is injection molded on the CPU, GPU, and high-power chip of the circuit board. , or filled in the shell 10, and the phase change of the temperature-adjustable phase change material 51 is utilized to allow the temperature-adjustable phase change material 51 to absorb or release a large amount of latent heat to maintain a constant temperature of the micro-airbag itself.

In this embodiment, the temperature-adjustable phase change material 51 includes: paraffin, but is not limited thereto. The phase change temperature-regulating micro airbag 50 has a particle size that can be adjusted between 0.1 and 50 μm, an enthalpy value that is greater than 180°C, a heat resistance that is greater than 200°C, and a phase change temperature of 0 to 70°C. As for the preparation method of the phase change temperature regulating micro-airbag 50, it is a prior art and is not the patent subject of the present invention, so it will not be described in detail. The present invention utilizes the characteristics of the phase change temperature-adjusting micro-airbag 50. As shown in Figure 5C, the phase-change temperature-adjusting micro-airbag 50 is in the form of a solid sheet at room temperature and softens when it reaches a specific temperature. Due to the good thermal melting of the material, Due to its fluidity, it can completely fill the uneven gaps on the surface, and utilize the latent heat that can be absorbed during phase changes to achieve a rapid cooling effect.

Following the above, in the phase change temperature regulating micro airbag 50, the phase change material 51 is covered by a core shell 52 containing polymer materials such as nano quartz to avoid leakage and volatilization problems during the phase change process, and to accelerate heat transfer. As the core phase change material 51, there are highly thermally conductive phase change microcapsules containing paraffin wax. The phase change temperature regulating micro-airbag 50 with this improved structure can accelerate the phase change material to release or absorb heat, so that it can effectively achieve the functions of heat conduction, heat dissipation, energy storage, etc.

In this embodiment, the housing 10 includes a front housing 10a, a rear housing 10b, and a There is a middle frame 10c between the front case 10a and the back case 10b, and the front case 10a is provided with a liquid crystal screen 11, so that the electronic product can become a mobile phone 100A as shown in Figure 4B. Or as shown in Figure 6B, after a translation software or APP is built-in, it becomes a translator 100B. Either as shown in FIG. 6C, it becomes a mobile game machine 100C, or it is combined with a base 101 to become a game machine 100D. Or as shown in FIG. 6D , a combination holder 102 is used to provide a mother-to-child machine 100E with a child screen and a mother screen. Figure 7 is a reference diagram of the use state of the mobile phone 100A and the translator 100B as a business travel mobile phone according to the present invention.

In addition, Figure 16 is a schematic diagram of the present invention applied to an ultrasonic cooling mobile phone case. In this embodiment, a mobile phone case 103 can be equipped with a circuit board and a high-capacity battery. What is important is that the mobile phone case 103 is provided with the The oscillation heat dissipation module 40 uses the ion wind or ultrasonic waves released by the thin oscillation piece 42 to generate resonance 421 to improve the air convection effect of the nanocrystal heat dissipation coating 41, thereby improving the heat dissipation efficiency of the mobile phone 100A.

Thereby, the oscillation heat dissipation module 40 composed of the thin oscillation sheet 42 and the nanocrystal heat dissipation coating 41 improves the heat dissipation efficiency of the electronic product, and then uses the phase change temperature regulating micro airbag 50 to achieve intelligent regulation. The effect of temperature is used to improve the practicality and reliability of the electronic product.

Please refer to Figures 8A to 15, which disclose a second feasible embodiment of the present invention. The structures that are the same as the previous embodiment are represented by the same figure numbers. The only difference is that: as shown in Figure 9A, in this embodiment, The electronic product may be a thermoelectric charger/generator 200A and further include: a heater heat source body 60 disposed in the housing 10, as shown in FIGS. 8A and 8B. The heater heat source body 60 has an ignition device 62. and a fuel adding hole 64, and the fuel adding hole 64 is exposed outside the housing 10; in this embodiment, the heater heat source body 60 further includes a body 61 and a cover 63, and the fuel adding hole 64 A plug body 65 is provided on it.

Furthermore, as shown in FIGS. 9B and 9C , this embodiment further includes at least one thermoelectric thermoelectric power generation chip 70 having a hot surface 71 and a cold surface 72 , and there are a plurality of wafers between the hot surface 71 and the cold surface 72 P-N semiconductor 73, however, the thermoelectric thermoelectric power generation chip 70 is a public technology, and its detailed structure will not be described in detail. The hot surface 71 is attached to the body warmer heat source body 60 and uses the heat generated by the body warmer heat source body 60 to generate heat. Generate electricity for use by the thermoelectric charger/generator 200A, and charge the lithium battery 30 with the generated power through the control circuit board 20 .

In addition, as shown in FIG. 9A , in this embodiment, the phase change temperature regulating micro-airbag 50 can be injection molded into a sheet 50 a to be attached to one side of the heat source body 60 of the warmer; it can also be adapted to the thermoelectric temperature difference. The shape of the power generation chip 70 can be injection molded into a frame 50b, so that as shown in Figure 9C, the thermoelectric thermoelectric power generation chip 70 is embedded in the frame 50b, but the hot surface 71 can still be attached to the body heater. The other side of the heat source body 60 can effectively achieve the functions of heat conduction, heat dissipation, energy storage, etc.

Thereby, the oscillation heat dissipation module 40 composed of the thin oscillation sheet 42 and the nanocrystal heat dissipation coating 41 improves the heat dissipation efficiency of the electronic product, and then uses the phase change temperature regulating micro airbag 50 to achieve intelligent regulation. The effect of temperature is used to improve the practicality and reliability of the electronic product. Furthermore, the thermoelectric thermoelectric power generation chip 70 is combined with the heater heat source body 60 to make the electronic product become a thermoelectric charger/generator 200A, as shown in Figures 10A and 10B. In addition, as shown in FIG. 9A , a magnet piece 13 can be provided inside the rear case 10b for adsorption function.

As shown in Figures 11A and 11B, in this embodiment, the thermoelectric charger/generator 200A can be attached to a heat dissipation tank 14. The heat dissipation tank can be a general water tank, or as shown in Figure 11, the heat dissipation tank 14 The water tank 14 has heat dissipation fins 141 and a water-cooling contact head 15 . And the inside of the water-cooling contact head 15, as shown in Figure 11B, has a copper sintered structure 151, and the internal structure of the heat dissipation fins 141 can be composed of a copper sintered structure, which is different from the general hollow interior with a heat dissipation tank. The surface of the sintered structure and the surface of the heat dissipation fins 141 will be coated with the nanocrystal heat dissipation coating 41. When heated, the surface lattice vibration will be generated, which will greatly increase the heat dissipation efficiency and allow the heat dissipation tank 14 to have more contact area. It can quickly absorb the temperature into the water and the heat dissipation fins 141 to remove the heat. In addition, nano-quartz powder and nano-gold thermal fluid can also increase the thermal conductivity of water, which can be used in water-cooling systems for power generation, refrigeration, CPU, GPU, etc. Therefore, in this embodiment, the thermoelectric charger/generator 200A becomes a water-cooled thermoelectric charger/generator 200B.

Figure 12 is a structural diagram of a water-cooled thermoelectric charger/generator according to a second feasible embodiment of the present invention. The main difference between this embodiment and the first embodiment is that, in addition to retaining the oscillation heat dissipation mode of the first embodiment, In addition to the set 40 and the phase-change temperature-adjusting micro-airbag 50, the thermoelectric thermoelectric power generation chip 70 is added to match the heater heat source body 60, so that the electronic product becomes a thermoelectric charger/generator 200A. This kind of small thermoelectric charger/generator 200A can use the heat generated by the heat source body 60 of the body furnace to generate electricity by using the heat generated by the heat source body 60 of the body furnace in an emergency and without power supply. The lithium battery 30 is charged and becomes a generator. When the lithium battery 30 is fully charged, power can be output from a connection port 201 and it becomes a charger. The most important technical feature of the present invention that can use "heat" to generate "electricity" in such a small volume is that it utilizes the oscillation composed of the thin oscillation plate 42 and the nanocrystal heat dissipation coating 41. The heat dissipation module 40 improves the heat dissipation efficiency of the electronic product, and then uses the phase change temperature-adjusting micro-airbag 50 to achieve the effect of intelligent temperature adjustment. Only in this way can the heat generated by the heater heat source body 60 make the thermoelectric thermoelectric power generation chip 70 generate electricity. Furthermore, the heat dissipation tank 14 is used to remove the heat generated by the thermoelectric charger/generator 200A to form a water-cooled thermoelectric charger/generator 200B.

Since the thermoelectric charger/generator 200A can achieve the expected charging and power generation functions, this embodiment can be applied to many products. For example: Figure 13 is a reference diagram of the use state of a forced air-cooled charger/generator 200C for a power-assisted electric heated bicycle set according to the second feasible embodiment of the present invention. The forced air-cooled charger/generator 200C It can be installed at an appropriate location on an electric bicycle and cooperates with the charging and discharging two-way disk motor of the electric bicycle to provide power in an emergency.

Figure 14 is a back perspective view of an air-cooled thermoelectric charger/generator 200B according to a second feasible embodiment of the present invention. In this embodiment, a plurality of heat dissipation protrusions 16 can be provided on the outside of the rear case 10b to help dissipate heat. Figure 15 is a This is a structural diagram of the air-cooled thermoelectric charger/generator 200D. Its composition is similar to the structural diagram of Figure 12. The only difference is that the position of the components is slightly different, and the water tank 14 is changed into a heat dissipation boss 16. The thin oscillator plate 42 and the nanocrystal heat dissipation coating 41 are provided inside the shell 10b. The oscillating heat dissipation module 40 and a heat pipe 17 complement each other and can help the closed water transfer system to eliminate fluid surface retention, affect heat dissipation exchange, and help heat dissipation. In addition, LED18 is provided on the front shell 10a.

Therefore, in addition to the derivative applications of the above-mentioned products, the present invention is not limited thereto and will not be described in detail one by one.

With the help of the above-mentioned technical features, the present invention uses the nanocrystal heat dissipation coating 41 and the thin oscillation plate 42 to form the oscillation heat dissipation module 40, which uses the ion wind or ultrasonic waves released by the thin oscillation plate 42 to generate resonance, thereby improving the efficiency of the heat dissipation. The air convection effect of the rice crystal heat dissipation coating 41 improves the heat dissipation efficiency of the oscillating heat dissipation module 40; and then the phase change temperature regulating micro airbag 50 uses the phase change of the phase change material 51 to absorb or release a large amount of latent heat. In this way, the oscillating heat dissipation module 40 is used to improve the heat dissipation efficiency of the electronic product, and then the phase change temperature-adjusting micro-airbag 50 is used to achieve the effect of intelligent temperature adjustment, thereby improving the practicality and reliability of the electronic product. Furthermore, by using a thermoelectric thermoelectric power generation chip 70 and a furnace heat source body 60, the electronic product can be derived into various derivative application products such as thermoelectric charger/generator.

In summary, the technical means disclosed in the present invention indeed meet the requirements for invention patents such as "novelty", "progressivity" and "available for industrial utilization". We pray that the Jun Bureau will grant patents to encourage inventions without any restrictions. Sense of morality.

However, the above disclosed drawings and descriptions are only preferred embodiments of the present invention. Modifications or equivalent changes made by those familiar with the art in accordance with the spirit and scope of this case should still be included in the patent application scope of this case.

10: Shell

10a:Front shell

10b: back shell

10c: middle frame

11: LCD screen

12:Fan

20:Control circuit board

21:Electronic components

22: Heating element

30:Lithium battery

40: Oscillation cooling module

41:Nano crystal heat dissipation coating

42:Thin oscillating plate

50: Phase change temperature regulating micro-airbag

100A: Electronic products (mobile phones)

Claims (7)

A thermoelectric heat dissipation device and its derivative application products, including: An electronic product includes a casing, a control circuit board, a plurality of electronic components on the control circuit board, a heating element, and a lithium battery; it is characterized in that: the electronic product is provided with: A nanocrystal heat dissipation coating, which consists of: nanonatural crystal powder, quartz powder, graphite powder, silicon oxide, and UV photosensitive hardener mixed together, and coated on a surface of the housing or the heating element superior; A thin oscillator, which can be a passive component composed of a tiny ultrasonic oscillator, a quartz oscillator, and a piezoelectric ceramic sheet. The battery provides its power. When powered, it can produce micro-vibrations above 30 MHZ. It is installed on An oscillating heat dissipation module is formed inside the housing and close to the nanocrystal heat dissipation coating. The ion wind or ultrasonic waves released by the thin oscillation piece are used to generate resonance to improve the air convection effect of the nanocrystal heat dissipation coating. , thereby improving the heat dissipation efficiency of the oscillation heat dissipation module; A phase change temperature-adjustable micro-airbag, which is composed of a temperature-adjustable phase change material (PCM) as the core, a polymer material as the core shell, and the phase change material is wrapped inside micron and/or nanoparticles , forming a phase change temperature-adjusting micro-airbag with a core-shell structure, and injection molding the phase-change temperature-adjusting micro-airbag on the CPU, GPU, and high-power chip of the circuit board, or filling it in the shell, using the phase change material The solid-liquid phase state change causes the phase change material to absorb or release a large amount of latent heat to maintain a constant temperature of the micro-airbag itself; In this way, the oscillating heat dissipation module composed of the thin oscillating plate and the nanocrystal heat dissipation coating improves the heat dissipation efficiency of the electronic product, and then uses the phase change temperature-adjusting micro-airbag to achieve the effect of intelligent temperature regulation. Thereby improving the practicality and reliability of the electronic product. For example, the thermoelectric heat dissipation device and its derivative application products described in item 1 of the patent application scope, wherein the housing of the electronic product includes a front housing, a rear housing, and a center located between the front housing and the rear housing. frame, and the front shell is provided with an LCD screen. For example, in the thermoelectric heat dissipation device and its derivative application products described in item 2 of the patent application scope, the electronic product can be a mobile phone. For example, the thermoelectric heat dissipation device and its derivative application products described in item 2 of the patent scope, wherein the electronic product can be a game console. For example, the thermoelectric heat dissipation device and its derivative application products described in item 2 of the patent application scope, wherein the electronic product can be a translator or its use form. A thermoelectric heat dissipation device and its derivative application products, including: An electronic product includes a casing, a control circuit board, a plurality of electronic components on the control circuit board, a heating element, and a lithium battery; it is characterized in that: the electronic product is provided with: A nanocrystal heat dissipation coating, which consists of: nanonatural crystal powder, quartz powder, graphite powder, silicon oxide, and UV photosensitive hardener mixed together, and coated on a surface of the housing or the heating element superior; A thin oscillator, which can be a passive component composed of a tiny ultrasonic oscillator, a quartz oscillator, and a piezoelectric ceramic sheet. The battery provides its power. When powered, it can produce micro-vibrations above 30 MHZ. It is installed on An oscillating heat dissipation module is formed inside the housing and close to the nanocrystal heat dissipation coating. The ion wind or ultrasonic waves released by the oscillation piece are used to generate resonance to improve the air convection effect of the nanocrystal heat dissipation coating. Thereby improving the heat dissipation efficiency of the oscillation heat dissipation module; A heater heat source body is located in the casing and has an ignition device and a fuel adding hole, and the fuel adding hole is exposed outside the casing; At least one thermoelectric thermoelectric power generation chip has a hot surface and a cold surface. The hot surface is attached to the heater heat source body and generates electricity using the heat generated by the heater heat source body for use in the electronic product. And charge the lithium battery with the generated power through the control circuit board; A phase change temperature-adjustable micro-airbag, which is composed of a temperature-adjustable phase change material (PCM) as the core, a polymer material as the core shell, and the phase change material is wrapped inside micron and/or nanoparticles , forming a phase change temperature-adjusting micro-airbag with a core-shell structure, and injection molding the phase-change temperature-adjusting micro-airbag on the CPU, GPU, and high-power chip of the circuit board, or filling it in the shell, using the phase change material The phase change of the phase change material causes the phase change material to absorb or release a large amount of latent heat to maintain a constant temperature of the micro-airbag itself; In this way, the oscillating heat dissipation module composed of the thin oscillating plate and the nanocrystal heat dissipation coating improves the heat dissipation efficiency of the electronic product, and then uses the phase change temperature-adjusting micro-airbag to achieve the effect of intelligent temperature regulation. In order to improve the practicality and reliability of the electronic product, the thermoelectric thermoelectric power generation chip is further matched with the heat source body of the furnace, so that the electronic product becomes a thermoelectric charger/generator. For example, the thermoelectric heat dissipation device and its derivative application products described in item 6 of the patent scope, among which, the derivative application products of this electronic product include: a water-cooled thermoelectric charger/generator, an air-cooled thermoelectric charger/generator, LED thermoelectric charger/generator, a forced air-cooled generator/generator for electric powered bicycle sets, and an ultrasonic cooling mobile phone case.

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