TW200520672A - Phase change thermal conductive plate and heat dissipating device having same - Google Patents
Phase change thermal conductive plate and heat dissipating device having sameInfo
- Publication number
- TW200520672A TW200520672A TW092135155A TW92135155A TW200520672A TW 200520672 A TW200520672 A TW 200520672A TW 092135155 A TW092135155 A TW 092135155A TW 92135155 A TW92135155 A TW 92135155A TW 200520672 A TW200520672 A TW 200520672A
- Authority
- TW
- Taiwan
- Prior art keywords
- phase change
- change thermal
- heat dissipating
- dissipating device
- same
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A phase change thermal interface plate includes a phase change thermal interface material having a polymer matrix and fillers dispersed therein. The fillers include carbon nanocapsules. A heat dissipating device having the same phase change thermal interface plate is provided accordingly.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92135155A TWI246878B (en) | 2003-12-12 | 2003-12-12 | Phase change thermal conductive plate and heat dissipating device having same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92135155A TWI246878B (en) | 2003-12-12 | 2003-12-12 | Phase change thermal conductive plate and heat dissipating device having same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200520672A true TW200520672A (en) | 2005-06-16 |
TWI246878B TWI246878B (en) | 2006-01-01 |
Family
ID=37193862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92135155A TWI246878B (en) | 2003-12-12 | 2003-12-12 | Phase change thermal conductive plate and heat dissipating device having same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI246878B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI383038B (en) * | 2009-06-02 | 2013-01-21 | Hon Hai Prec Ind Co Ltd | Thermal interface material, electronic device using the same and method for making the same |
TWI815540B (en) * | 2022-07-04 | 2023-09-11 | 馬思正 | Thermoelectric heat dissipation device and its derivative application products |
-
2003
- 2003-12-12 TW TW92135155A patent/TWI246878B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI383038B (en) * | 2009-06-02 | 2013-01-21 | Hon Hai Prec Ind Co Ltd | Thermal interface material, electronic device using the same and method for making the same |
TWI815540B (en) * | 2022-07-04 | 2023-09-11 | 馬思正 | Thermoelectric heat dissipation device and its derivative application products |
Also Published As
Publication number | Publication date |
---|---|
TWI246878B (en) | 2006-01-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |