TW527099U - Heat dissipation plate having gained heat dissipation efficiency - Google Patents

Heat dissipation plate having gained heat dissipation efficiency

Info

Publication number
TW527099U
TW527099U TW091211096U TW91211096U TW527099U TW 527099 U TW527099 U TW 527099U TW 091211096 U TW091211096 U TW 091211096U TW 91211096 U TW91211096 U TW 91211096U TW 527099 U TW527099 U TW 527099U
Authority
TW
Taiwan
Prior art keywords
heat dissipation
gained
efficiency
plate
dissipation plate
Prior art date
Application number
TW091211096U
Other languages
Chinese (zh)
Inventor
Hai-Ching Lin
Original Assignee
Hai-Ching Lin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hai-Ching Lin filed Critical Hai-Ching Lin
Priority to TW091211096U priority Critical patent/TW527099U/en
Publication of TW527099U publication Critical patent/TW527099U/en
Priority to US10/619,593 priority patent/US20040031589A1/en
Priority to JP2003270136U priority patent/JP3099275U/en
Priority to DE20311052U priority patent/DE20311052U1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW091211096U 2002-07-19 2002-07-19 Heat dissipation plate having gained heat dissipation efficiency TW527099U (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW091211096U TW527099U (en) 2002-07-19 2002-07-19 Heat dissipation plate having gained heat dissipation efficiency
US10/619,593 US20040031589A1 (en) 2002-07-19 2003-07-16 Air guide apparatus of heat sink
JP2003270136U JP3099275U (en) 2002-07-19 2003-07-16 Baffle device for heat sink
DE20311052U DE20311052U1 (en) 2002-07-19 2003-07-17 Air duct for a heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091211096U TW527099U (en) 2002-07-19 2002-07-19 Heat dissipation plate having gained heat dissipation efficiency

Publications (1)

Publication Number Publication Date
TW527099U true TW527099U (en) 2003-04-01

Family

ID=28451985

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091211096U TW527099U (en) 2002-07-19 2002-07-19 Heat dissipation plate having gained heat dissipation efficiency

Country Status (4)

Country Link
US (1) US20040031589A1 (en)
JP (1) JP3099275U (en)
DE (1) DE20311052U1 (en)
TW (1) TW527099U (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM248226U (en) * 2003-10-17 2004-10-21 Hon Hai Prec Ind Co Ltd Heat dissipating device
US7159649B2 (en) * 2004-03-11 2007-01-09 Thermal Corp. Air-to-air heat exchanger
US7038911B2 (en) * 2004-06-30 2006-05-02 International Business Machines Corporation Push-pull dual fan fansink
CN2752958Y (en) * 2004-09-03 2006-01-18 东莞莫仕连接器有限公司 Heat radiator with flow guide structure
US20060102319A1 (en) * 2004-11-16 2006-05-18 Asia Vital Component Co., Ltd. Heat dissipation enhancing device
TWI264271B (en) * 2005-05-13 2006-10-11 Delta Electronics Inc Heat sink
TWI289648B (en) * 2005-07-07 2007-11-11 Ama Precision Inc Heat sink structure
TWI308050B (en) * 2006-02-14 2009-03-21 Asustek Comp Inc Heat-sink with slant fins
TWM336475U (en) * 2008-03-03 2008-07-11 Tai Sol Electronics Co Ltd Heat dissipater with internal flow guiding function
TWM380512U (en) * 2009-10-29 2010-05-11 Wistron Corp Heat sink and heat-dissipation fins thereof
CN104602469B (en) * 2015-01-15 2017-09-26 华为技术有限公司 Rack
EP4113049B1 (en) * 2021-06-29 2024-09-04 ABB Schweiz AG Heat exchanger, cooled device assembly comprising the heat exchanger, and method for manufacturing the heat exchanger

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062314Y2 (en) * 1989-08-30 1994-01-19 ナカミチ株式会社 Heat dissipation device
US5158136A (en) * 1991-11-12 1992-10-27 At&T Laboratories Pin fin heat sink including flow enhancement
US5375655A (en) * 1993-03-31 1994-12-27 Lee; Yong N. Heat sink apparatus
TW307837B (en) * 1995-05-30 1997-06-11 Fujikura Kk
US5734552A (en) * 1996-06-21 1998-03-31 Sun Microsystems, Inc. Airfoil deflector for cooling components
US5957194A (en) * 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
US6110306A (en) * 1999-11-18 2000-08-29 The United States Of America As Represented By The Secretary Of The Navy Complexed liquid fuel compositions
US20020109970A1 (en) * 2000-12-18 2002-08-15 Samsung Electro-Mechanics Co., Ltd. Heat sink for cooling electronic chip
JP2002368468A (en) * 2001-06-07 2002-12-20 Matsushita Electric Ind Co Ltd Heat sink, its manufacturing method and cooler using the same
TW529737U (en) * 2001-06-20 2003-04-21 Foxconn Prec Components Co Ltd Heat sink apparatus
US6637502B1 (en) * 2002-04-16 2003-10-28 Thermal Corp. Heat sink with converging device

Also Published As

Publication number Publication date
JP3099275U (en) 2004-04-02
US20040031589A1 (en) 2004-02-19
DE20311052U1 (en) 2003-12-04

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees