TWI809374B - Manufacturing method of resin molded product and resin molding apparatus - Google Patents

Abstract

The present invention provides a method of manufacturing a resin molded product and a resin molding apparatus capable of performing resin molding without discarding an object to be molded even if the discharge amount of liquid resin exceeds a target value. A method of manufacturing a resin molded article, comprising: a liquid resin ejection step of ejecting a liquid resin onto a release film; a metering step of measuring the weight of the liquid resin ejected onto the release film; and a weight judging step of judging whether the weight of the liquid resin is normal or abnormal, when the weight of the liquid resin is normal in the weight judging step, using the liquid The resin is subjected to resin molding, and when the weight of the liquid resin is abnormal in the weight judging step, the release film from which the liquid resin is ejected is discarded.

Description

Manufacturing method of resin molded product and resin molding apparatus

The present invention relates to a method of manufacturing a resin molded product and a resin molding device.

Patent Document 1 discloses a resin molding device. Before resin molding, as shown in FIG. The liquid resin is ejected from the tube nozzle 19a and supplied to the workpiece W through a syringe 19 .

[Prior art literature]

[Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2012-114285

In the resin molding apparatus described in Patent Document 1, since the liquid resin is directly discharged from the distribution unit to the workpiece, it is difficult to remove only the liquid resin from the workpiece when the discharge amount of the liquid resin exceeds an allowable range. Therefore, if the discharge amount of the liquid resin exceeds the allowable range, it must be discarded together with the workpiece. For example, when the wafer size is Φ300 and the semiconductor wafer size is 3mm×3mm, about 3600 semiconductor wafers are mounted on the wafer as the workpiece, and 3600 semiconductor wafers are lost if the workpiece is discarded.

Therefore, the main object of the present invention is to perform resin molding without discarding the object to be molded even if the discharge amount of the liquid resin exceeds a target value.

In order to solve the above-mentioned problems, the manufacturing method of the resin molded article of the present invention includes: a liquid resin ejection step of ejecting the liquid resin onto the release film; measuring the weight of the liquid resin ejected onto the release film a measuring step of measuring; and a weight judging step of judging whether the weight of the liquid resin is normal or abnormal, in the case of the normal weight of the liquid resin in the weight judging step, using The liquid resin of the film is resin-molded, and when the weight of the liquid resin is abnormal in the weight judging step, the release film from which the liquid resin is ejected is discarded.

In order to solve the above-mentioned problems, the resin molding device of the present invention includes: a molding die including an upper die and a lower die facing the upper die; a mold clamping mechanism for closing the molding die; A liquid resin ejection mechanism for liquid resin; and a control unit for judging the weight of the liquid resin, the control unit determines whether the weight of the liquid resin is normal or abnormal, and if the weight of the liquid resin is normal Next, control is performed so that resin molding is performed using the liquid resin ejected to the release film, and when the weight of the liquid resin is abnormal, the liquid resin ejected from the release film is discarded. The release film is controlled by the way.

According to the present invention, even if the discharge amount of liquid resin exceeds the target value, resin molding can be performed without discarding the object to be molded.

1: Resin molding device

5: Substrate before forming

6: Substrate after forming

10: Release film cutting module

11: roll release film

12: Release film

13: Membrane mounting table

14: Membrane holder

20: Resin supply module

21: Resin delivery mechanism

22: Membrane recovery mechanism

23: Resin ejection unit/liquid resin ejection mechanism

24: Membrane adsorption table

25:Meter

30: Resin molding module

31: Forming die

32: Lower mold

32a: side member

32b: bottom member

33: chamber

34: upper mold

35: Clamping mechanism

40: Conveyor module

41: Substrate loader

42: Adsorption hand moving mechanism

43: Adsorption hand

45: Substrate storage part before forming

46: Substrate storage part after molding

70: liquid resin

CTR: Control Department

X, Y, Z, θ: direction

S100, S110, S120, S130, S140, S150, S200, S210, S220, S230, S240, S250, S260, S270: steps

FIG. 1 is a schematic plan view showing the overall structure of a resin molding apparatus according to an embodiment of the present invention.

Fig. 2 is a sectional view of main parts showing a schematic configuration of a part of the resin supply module.

Fig. 3 is a sectional view of main parts showing a schematic structure of the resin molding die set.

FIG. 4 is a flow chart showing a resin molding operation according to an embodiment of the present invention.

FIG. 5 is a flow chart showing a resin molding operation according to an embodiment of the present invention.

Embodiments of the present invention will be described in detail with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same or corresponding part in a figure, and the description is not repeated. In addition, in this application document, the term "liquid" of a liquid resin means that it is liquid at normal temperature and has fluidity.

<Overall Structure of Resin Molding Apparatus 1>

The configuration of the resin molding apparatus 1 according to the present embodiment will be described with reference to FIGS. 1 to 3 . The resin molding apparatus 1 shown in FIG. 1 is a resin molding apparatus 1 that performs resin molding by a compression molding method.

As shown in FIG. 1 , the resin molding apparatus 1 of the embodiment includes a release film cutting module 10 , a resin supply module 20 , a resin molding module 30 , and a conveyance module 40 from the right side of the figure. Each module is independently separated, but can be attached to and detached from adjacent modules and can be increased or decreased. For example, it can be set as the resin supply module 20 and the delivery module 40 Two or three resin molding die sets 30 are arranged in between.

As shown in FIG. 1 , the release film cutting module 10 mainly includes a roll-shaped release film 11 , a film mounting table 13 , and a film holder 14 . A long release film is pulled out from the roll-shaped release film 11 by the film gripper 14 , and a part thereof is arranged on the cover film mounting table 13 . The release film 12 having a circular shape can be produced by cutting it circularly with a cutter. The film mounting table 13 is movable in the X direction, the Y direction, and the Z direction, and is movable between the release film cutting module 10 and the resin supply module 20 . In addition, the shape of the release film 12 is not specifically limited to a circular shape, For example, a rectangular shape may be sufficient.

As shown in FIG. 1 , the resin supply module 20 mainly includes: a resin conveying mechanism 21 , a film recovery mechanism 22 , a liquid resin ejection mechanism 23 , a film adsorption table 24 , and a control unit CTR. The resin transport mechanism 21 is integrally formed with the film recovery mechanism 22, and is movable between the release film cutting module 10 and the resin molding module 30 described later. The resin conveyance mechanism 21 can convey the release film 12 supplied with the liquid resin 70 to the molding die 31 which will be described later. The film recovery mechanism 22 can recover the used release film 12 from the molding die 31 . As shown in FIG. 2 , the liquid resin discharge mechanism 23 can supply the liquid resin onto the release film 12 from a nozzle (not shown). The film suction stage 24 can suction and hold the cut release film 12 . A meter 25 capable of measuring the weight of the liquid resin 70 ejected onto the release film 12 is included below the film adsorption table 24 . The control unit CTR can determine the weight of the liquid resin 70 , more specifically, can determine whether the weight of the liquid resin 70 supplied to the release film 12 is normal or abnormal. When the weight of the liquid resin 70 is normal, the control unit CTR can control the resin molding using the liquid resin 70 ejected to the release film 12, and can control it when the weight of the liquid resin 70 is abnormal. Control is performed to discard the release film 12 from which the liquid resin 70 has been ejected. In addition, the control unit CTR controls to perform multiple discharges by the liquid resin discharge mechanism 23 , and discharges the discharge amount calculated based on the difference between the previous discharge amount and the target value in the second and subsequent discharges.

As shown in FIGS. 1 and 3 , the resin molding die set 30 mainly includes a molding die 31 and a mold clamping mechanism 35 . The molding die 31 includes an upper die 34 and a lower die 32 facing the upper die 34 . The lower die 32 includes side members 32 a forming side surfaces of the cavity 33 and bottom surface members 32 b forming the bottom surface of the cavity 33 . A concave-shaped cavity 33 that accommodates the liquid resin 70 is formed by the side member 32a and the bottom member 32b. In addition, the side member 32a and the bottom surface member 32b include an adsorption groove (not shown) for adsorbing the release film 12 . The release film 12 supplied with the liquid resin 70 is transported from the resin supply module 20 to the molding die 31 by the resin transport mechanism 21 , and placed on the cavity 33 of the lower die 32 . In the resin molding die set 30, the molding die 31 is clamped by the mold clamping mechanism 35, so that the pre-molding substrate 5 on which the wafer as the molding object is mounted is resin-molded, and a post-molding substrate 5 in which the wafer is resin-sealed can be formed. Substrate6. Examples of the substrate include semiconductor substrates such as silicon wafers, lead frames, printed wiring boards, metal substrates, resin substrates, glass substrates, and ceramic substrates. In addition, the substrate may also be a carrier for Fan Out Wafer Level Packaging (FOWLP) and Fan Out Panel Level Packaging (FOPLP). Furthermore, it may be a substrate on which wiring has been applied or a substrate without wiring.

As shown in FIG. 1 , the conveying module 40 mainly includes a substrate loader 41, a suction hand 42, a suction hand moving mechanism 43, a pre-forming substrate storage unit 45, and a post-forming substrate storage unit. Incorporated Section 46. The substrate loader 41 can hold the substrate and move between the resin molding module 30 and the transfer module 40 . The suction hand 42 is equipped with a suction hand moving mechanism 43 which can move the suction hand 42 in the X direction, Y direction, and Z direction and rotate in the θ direction. Regarding the rotation, the suction hand 42 may be rotated in the horizontal direction, or the suction hand 42 may be rotated in the vertical direction and reversed. The suction hand 42 can suction hold the pre-molded substrate 5 stored in the pre-molded substrate storage portion 45 , and transport it to the substrate loader 41 by the suction hand moving mechanism 43 . In addition, the suction hand 42 can suction hold the molded substrate 6 held by the substrate loader 41 , and store it in the molded substrate storage unit 46 by the suction hand moving mechanism 43 .

<Manufacturing method of resin molded product using resin molding apparatus 1>

Next, an example of a method of manufacturing a resin molded article of this embodiment using the resin molding apparatus 1 of this embodiment will be described with reference to FIGS. 1 to 4 . FIG. 4 is a flowchart showing the resin molding operation of the present embodiment. In the present embodiment, a circular wafer is used as the substrate on which the wafer is mounted. However, the wafer is not particularly limited, and may be rectangular.

First, as shown in FIG. 1 , the suction hand 42 is inserted into the underside of the pre-molding substrate 5 on which the wafer stored in the pre-molding substrate storage portion 45 is mounted. 45 Take out the pre-molded substrate 5 . Here, the substrate is taken out from the pre-molding substrate storage portion 45 with the wafer mounting side being the upper side.

Next, the substrate sucked by the suction hand 42 is turned over so that the wafer mounting side of the substrate is the lower side. Then, the suction hand 42 is moved by the suction hand moving mechanism 43, with the wafer mounting surface of the substrate suctioned on the suction hand 42 as the lower side, and the The pre-molded substrate 5 is delivered to the substrate loader 41 .

At this time, the release film 12 is being cut in the release film cutting module 10 . The roll-shaped release film 11 is pulled out onto the film mounting table 13 by the film gripper 14, and the said release film 11 is cut|disconnected by the cutter (not shown), and the circular release film 12 is formed.

The film mounting table 13 holding the release film 12 by suction moves to the front of the resin transport mechanism 21 . The resin transport mechanism 21 moves above the film mounting table 13 , receives the release film 12 and transports it to the film adsorption table 24 of the resin supply module 20 . The resin transport mechanism 21 is in a state where the release film 12 is located above the film adsorption table 24 . The film suction table 24 absorbs and holds the release film 12 after receiving the release film 12 from the resin transfer mechanism 21 .

The subsequent operation after the liquid resin is discharged will be described in accordance with the flow chart of FIG. 4 . After the release film 12 is adsorbed and held on the film adsorption table 24, the liquid resin 70 is ejected from the liquid resin ejection mechanism 23 onto the release film 12 (liquid resin ejection step S100).

The weight of the liquid resin 70 discharged onto the mold release film 12 is measured by the meter 25 shown in FIG. 2 (measurement step S110).

After the weighing step S110, whether the weight of the liquid resin 70 is normal or abnormal is judged by the control part CTR (weight judging step S120). More specifically, control unit CTR determines whether or not the weight of liquid resin 70 is larger than a target value. As the target value, not only a single value of the discharge amount, but also a range of allowable discharge amount may be set in advance. The target value refers to the final amount of resin to be ejected.

When the weight of the liquid resin 70 is normal, that is, when the weight of the liquid resin 70 is not greater than the target value, as will be described later, use The liquid resin 70 is used for resin molding.

When the weight of the liquid resin 70 is abnormal, that is, when the weight of the liquid resin 70 is larger than the target value, the release film from which the liquid resin 70 is ejected is discarded (S150). In recent years, there has been an increase in products with extremely thin packages, for example, products requiring a package thickness of 0.38mm or 0.43mm. In this way, in a product with a thin package, the molding quality greatly changes depending on the supply amount of the liquid resin 70 . Therefore, when the discharge amount of the liquid resin 70 exceeds the target value, the liquid resin 70 is discarded together with the mold release film 12, and the discharge of the liquid resin 70 is performed again. Since the liquid resin 70 is ejected onto the release film 12, the liquid resin 70 can be discarded without discarding the pre-molded substrate 5 on which the wafer is mounted. In addition, by doing so, it is possible to manufacture a product with a target package thickness, thereby improving molding quality.

When the weight of the liquid resin 70 is normal, the release film 12 from which the liquid resin 70 is ejected is conveyed to the molding die 31 (transfer step S130). The release film 12 from which the liquid resin 70 has been ejected is conveyed between the upper mold 34 and the lower mold 32 of the resin molding die set 30 by the resin conveying mechanism 21 . Furthermore, before disposing the release film 12 on the molding die 31, the substrate loader 41 holding the pre-molded substrate 5 is moved between the upper die 34 and the lower die 32 so that the wafer mounting side becomes the lower side. The pre-molded substrate 5 is placed on the upper mold 34 .

As shown in FIG. 3 , the release film 12 conveyed between the upper mold 34 and the lower mold 32 by the resin conveying mechanism 21 is placed in the cavity 33 including the side member 32 a and the bottom surface member 32 b of the lower mold 32 . After the release film 12 is placed in the cavity 33, the release film 12 is sucked by the suction grooves (not shown) of the side member 32a and the bottom member 32b.

As shown in FIG. 3 , after the release film 12 is adsorbed and held by the cavity 33 , the mold 31 carrying the release film 12 is clamped to perform resin molding (resin molding step S140 ). Specifically, the lower mold 32 is raised by the mold clamping mechanism 35 . As a result, the upper mold 34 and the lower mold 32 approach each other to close the molds, and the wafer mounted on the lower surface of the substrate 5 before molding is immersed in the liquid resin 70 in the chamber 33 . In this state, the liquid resin 70 is heated and hardened, and the pre-molded substrate 5 can be resin-molded to manufacture a post-molded substrate 6 in which wafers are resin-sealed. After resin molding, the lower mold 32 is lowered by the clamping mechanism 35 . As a result, the upper mold 34 and the lower mold 32 are separated from each other to open the mold.

The molded substrate 6 is taken out from the upper mold 34 by the substrate loader 41 and held with the wafer mounting side as the lower side. Then, the substrate loader 41 moves from the resin molding module 30 to the transfer module 40 . Here, the release film 12 remaining in the chamber 33 is recovered by the film recovery mechanism 22, and discarded into a useless film cassette (not shown).

After the molded substrate 6 held by the substrate loader 41 is transported to the transfer module 40 , the wafer mounting side is set as the lower side by the suction hand 42 , and is sucked and held by the suction hand 42 . Thereafter, the molded substrate 6 adsorbed by the suction hand 42 is reversed so that the wafer mounting side of the substrate 6 is on the upper side, and the suction hand moving mechanism 43 is used to move the suction hand. Then, the suction hand 42 accommodates the molded substrate 6 in the molded substrate accommodating portion 46 with the wafer mounting side facing upward.

<Other Embodiments>

Next, another embodiment will be described according to the flow chart showing the resin molding operation in FIG. 5 . In the above-described embodiment, the ejection of the liquid resin 70 and the measurement of the weight of the liquid resin 70 ejected onto the release film 12 are performed once each, but as shown in FIG. As shown, it may also be repeated several times until the discharge amount of the liquid resin 70 approaches the target value.

Operations up to the measurement step S210 shown in FIG. 5 are the same as those in the above-mentioned embodiment, and thus description thereof will be omitted.

After the weighing step S210, whether the weight of the liquid resin 70 is normal or abnormal is judged by the control unit CTR (weight judging step S220). More specifically, control unit CTR determines whether the weight of liquid resin 70 is smaller than a target value.

When the weight of the liquid resin 70 is smaller than the target value, the control unit CTR calculates the discharge amount based on the difference between the discharge amount of the immediately preceding discharge step and the target value (calculation step S230).

After the calculation step S230, it returns to the resin discharge step S200, and the liquid resin 70 is discharged based on the calculated discharge amount. In this way, the resin ejection step S200 includes a plurality of ejection steps, and in the second and subsequent ejection steps, the ejection amount is calculated based on the difference between the ejection amount of the immediately preceding ejection step and the target value (calculation step S230 ). Thereby, the discharge amount of the liquid resin 70 can be brought closer to the target value, and the molding quality can be improved. In addition, as shown in FIG. 5, when the liquid resin 70 is ejected in multiple times, for example, the initial ejection amount may be set to be smaller than the target value, and after the second time, the ejection may be performed based on the immediately preceding one. The discharge amount calculated by the difference between the discharge amount of the discharge step and the target value. Thereby, the liquid resin 70 can be ejected so that it does not exceed a target value, and the waste of the liquid resin 70 can be suppressed.

When the weight of the liquid resin 70 is not less than the target value, it proceeds to the next weight determination step (S240). The operations after the weight determination step S240 are the same as those in the above-mentioned embodiment, and thus are omitted.

As described above, the manufacturing method of the resin molded article of this embodiment includes: the liquid resin ejection step of ejecting the liquid resin 70 onto the release film 12; A measuring step for measuring the weight of the resin 70; and a weight judging step for judging whether the weight of the liquid resin 70 is normal or abnormal, when the weight of the liquid resin 70 is normal in the weight judging step, use The liquid resin 70 ejected to the release film 12 is subjected to resin molding, and if the weight of the liquid resin 70 is abnormal in the weight judging step, the liquid resin 70 ejected is discarded. Describe the release film 12.

Thereby, even if the ejection amount of the liquid resin 70 exceeds the target value, resin molding can be performed without discarding the object to be molded. Since the liquid resin 70 is ejected onto the mold release film 12, only the liquid resin 70 can be discarded without discarding the pre-molding substrate 5 on which the wafer to be molded is mounted. In addition, since the resin molding is performed without using the liquid resin 70 exceeding the target value, it is possible to manufacture a product with a target package thickness, thereby improving molding quality.

In addition, the liquid resin ejection step includes a plurality of ejection steps, and the second and subsequent ejection steps include a calculation step of calculating the ejection amount based on the difference between the ejection amount of the immediately preceding ejection step and a target value.

Thereby, the discharge amount of the liquid resin 70 can be brought closer to the target value, and the molding quality can be improved. In addition, the liquid resin 70 can be discharged so as not to exceed the target value, so that the liquid resin 70 can be suppressed from being discarded.

In addition, when the weight of the liquid resin in the weight judging step is normal, the release film 12 from which the liquid resin 70 has been ejected is transported to Conveyance step of forming die 31 .

Thereby, only the release film 12 whose weight of the liquid resin 70 is normal can be sent to the molding die 31 .

In addition, after the conveying step, a resin molding step of closing the molding die 31 to perform resin molding is also included.

Thereby, a resin molded article can be manufactured with an appropriate amount of liquid resin 70 .

In addition, the resin molding apparatus of this embodiment includes: a molding die 31 including an upper die 34 and a lower die 32 facing the upper die 34; a mold clamping mechanism 35 for clamping the molding die 31; 12, a liquid resin ejection mechanism 23 that ejects liquid resin 70, and a control unit CTR that determines the weight of the liquid resin 70. The control unit CTR determines whether the weight of the liquid resin 70 is normal or abnormal. When the weight of the liquid resin 70 is normal, control is performed so that resin molding is performed using the liquid resin 70 ejected to the release film 12, and when the weight of the liquid resin 70 is abnormal, , control is performed so as to discard the release film 12 from which the liquid resin 70 has been ejected.

Thereby, even if the ejection amount of the liquid resin 70 exceeds the target value, resin molding can be performed without discarding the object to be molded. Since the liquid resin 70 is ejected onto the mold release film 12, only the liquid resin 70 can be discarded without discarding the pre-molding substrate 5 on which the wafer to be molded is mounted. In addition, since the resin molding is performed without using the liquid resin 70 exceeding the target value, it is possible to manufacture a product with a target package thickness, thereby improving molding quality.

In addition, the control unit CTR uses the above-mentioned liquid resin ejection mechanism 23 to perform Control is performed in a manner of carrying out multiple discharges, and in the second and subsequent discharges, the discharge amount calculated based on the difference between the previous discharge amount and the target value is discharged.

Thereby, the discharge amount of the liquid resin 70 can be brought closer to the target value, and the molding quality can be improved. In addition, the liquid resin 70 can be discharged so as not to exceed the target value, so that the liquid resin 70 can be suppressed from being discarded.

One embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment, and can be appropriately modified within the scope of the technical idea of the invention described in the claims.

In the present embodiment, the film mounting table 13 and the film adsorption table 24 are included, but the film mounting table 13 and the film adsorption table 24 may be shared to form only the film adsorption table 24 . In this case, the film suction table 24 is movable in the X direction, the Y direction, and the Z direction, and can move between the release film cutting module 10 and the resin supply module 20 . The film adsorption stage 24 on which the release film 12 is disposed is moved to the lower side of the resin discharge unit of the resin supply module 20 , and the liquid resin 70 is discharged onto the release film 12 in this state.

It should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is shown not by the description of the above-mentioned embodiment but by the scope of the claims, and it is intended that all changes within the meaning and range equivalent to the scope of the claims are included.

S100, S110, S120, S130, S140, S150: steps

Claims (5)

A method of manufacturing a resin molded article, comprising: a liquid resin ejection step of ejecting the liquid resin onto a release film; a metering step of measuring the weight of the liquid resin ejected onto the release film; and a weight A judging step of judging whether the weight of the liquid resin is greater than a target value to decide whether to discard the release film from which the liquid resin is ejected, and in the weight judging step, the weight of the liquid resin is not When it is normal than the target value, resin molding is performed using the liquid resin ejected to the release film, and the weight of the liquid resin in the weight judging step is greater than the target value Next, discarding the mold release film from which the liquid resin was ejected, the method for manufacturing a resin molded product further includes a conveying step based on the weight of the liquid resin determined in the weight judging step If the determination result is normal and not greater than the target value, the release film from which the liquid resin is ejected is transported to a molding die. The method of manufacturing a resin molded article according to claim 1, wherein the liquid resin ejection step includes a plurality of ejection steps, and the second and subsequent ejection steps include ejection based on the immediately preceding ejection step A calculation step of calculating the discharge amount from the difference between the discharge amount and the target value. The method of manufacturing a resin molded article according to claim 1 or claim 2, further comprising a resin molding step of closing a molding die to perform resin molding after the conveying step. A resin forming device, comprising: a forming mold, including an upper mold and a lower mold facing the upper mold; a mold clamping mechanism for clamping the forming mold; a liquid resin spraying mechanism for spraying liquid onto the release film and a control unit that determines the weight of the liquid resin, the control unit determines whether the weight of the liquid resin is greater than a target value, so as to determine whether to discard the release film that has ejected the liquid resin , and in the case where the weight of the liquid resin is not greater than the target value and is normal, control is performed in such a manner that resin molding is performed using the liquid resin ejected to the release film, and the liquid resin When the weight of the resin is greater than the target value, control is performed so as to discard the release film from which the liquid resin is ejected, and the resin molding apparatus further includes a conveying mechanism based on the control. When the weight of the liquid resin is judged to be normal by the department, and the weight of the liquid resin is not greater than the target value, the release film from which the liquid resin is ejected is sent to the molding die. The resin molding apparatus according to claim 4, wherein the control unit controls to perform a plurality of discharges by the liquid resin discharge mechanism, and in the second and subsequent discharges, the discharge is based on the previous discharge. The discharge amount calculated by the difference between the amount and the target value.

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