TWI808827B - Photomask protection component structure - Google Patents

Abstract

A photomask protection component structure includes a frame, an organic adhesive layer and a light-transmitting film. The inner frame of the frame has a wall, and the surface of the wall has a concave-convex surface. The organic adhesive layer is coated on the concave-convex surface to absorb particles or dust, so as to avoid polluting the photomask surface.

Description

Photomask protection component structure

The invention relates to a photomask protection component structure, in particular to a photomask protection component structure that absorbs particles or dust through the adhesive layer and the concave-convex surface structure to avoid polluting the photomask surface.

According to the current semiconductor device manufacturing technology, the circuit pattern of the semiconductor device is transferred to the surface of the silicon wafer through a lithography process. Specifically, the circuit pattern is transferred to the surface of the silicon wafer by projecting a light source with a specific wavelength through a photomask. In order to double the number of semiconductor elements such as transistors per unit area and reduce the line width of semiconductor circuits as the main technical solution, deep ultraviolet light (DUV) with a wavelength of 193 nanometers is currently used as the exposure light source of the lithography process, which can make the minimum line width of semiconductor circuits reach 7~10 nanometers (nm).

Due to the miniaturization of semiconductor components, during the manufacturing process of semiconductor components, defects in the photomask will cause distortion or deformation of the circuit pattern on the surface of the silicon wafer. Even a defect with a nanometer size such as 20nm~200nm will cause damage to the semiconductor circuit pattern. It is known that one of the causes of photomask defects is that the surface of the photomask is polluted by contamination particles; in order to maintain the quality of the photomask during use, a conventional method is to arrange a photomask protection film (pellicle) on the surface of the photomask to prevent contamination from falling on the surface of the photomask and form contamination particles.

However, even with the above-mentioned photomask protective film, it is still impossible to completely avoid the contamination of the photomask surface by the pollutants in practice. The sources or causes of the photomask pollution substances include the pollution substances produced in the environment and the inner cavity. The aforementioned environments include clean rooms, storage environments for photomasks, and equipment and chemicals in the lithography process.

Some dust enters the space between the mask protective film (pellicle) and the photomask during the manufacturing process or during use. Since it is too small to be found, it is easy to fall into the pattern area of the photomask due to movement during the handling process, thereby affecting the yield of exposure copying;

For the inner ring of the aluminum frame, glue is generally used to capture dust and fix the dust on the aluminum frame. However, in general, the photomask frame 1, as shown in Figures 1A and 1B, the top surface of the photomask frame 1 is bonded to a light-transmitting film 2 through the adhesive 41, and the bottom surface of the photomask frame 1 is bonded to the surface of a photomask 3 through the adhesive 42. The inner frame wall of the photomask frame 1 has a layer of adhesive layer 43. However, the inner frame The wall surface is a smooth surface, although the adhesive layer 43 can Adhering to the dust 5 , however, if the dust 5 is too large (1-20 μ), it may still fall on the surface of the mask 3 on a smooth surface, thereby causing distortion or deformation of the circuit pattern.

Therefore, in this case, through the concave-convex surface structure and the structure coated with the adhesive layer on the concave-convex surface structure, when the dust or particles fall into the frame, they can be absorbed by the adhesive layer, and when the dust or particles are too large, they may break away from the adhesive layer. However, because of the design of the concave-convex surface structure in this case, the dust or particles can be adhered by the adhesive layer on the next continuously extending concave-convex surface structure, so as to prevent the dust or particles from falling into the photomask pattern area on the surface of the mask. Therefore, the present invention should be a best solution.

The photomask protection component structure of the present invention is combined on the surface of a photomask, and includes: a frame with a top surface and a bottom surface, the inner frame of the frame has a wall surface, and the surface of the wall surface It is a concave-convex surface; an organic adhesive layer, the organic adhesive layer is a self-adhesive, and the organic adhesive layer is arranged on the concave-convex surface; and a light-transmitting film is attached to the top surface of the frame to seal the top surface of the frame.

More specifically, the organic adhesive layer is an acrylic pressure-sensitive adhesive or a pressure-sensitive adhesive.

More specifically, the concave-convex surface is a serrated surface.

More specifically, the concave-convex surface is a wave surface.

More specifically, the concave-convex surface is an irregular undulating surface.

1: Frame for photomask

2: Transparent film

3: mask

41: Adhesive

42: Adhesive

43: Adhesive layer

44: Organic adhesive layer

5: Dust

6: frame

61: top surface

62: Bottom

63: Bump surface

[Fig. 1A] is a three-dimensional schematic diagram of a conventional photomask protection component structure.

[Fig. 1B] is a schematic cross-sectional view of A-A of a conventional photomask protection component structure.

[Fig. 2A] is a schematic diagram of the structural implementation of the photomask protection component structure of the present invention.

[Fig. 2B] is a schematic diagram of the structural implementation of the photomask protection component structure of the present invention.

[Fig. 3] is a schematic diagram of the implementation of dust adsorption of the photomask protection component structure of the present invention.

Other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings.

Please refer to Figures 2A and 2B, which are schematic diagrams of the structural implementation of the photomask protection component structure of the present invention. As shown in the figure, the photomask protection component structure includes a frame 6. The frame 6 has a top surface 61 and a bottom surface 62. The inner frame of the frame 6 has a wall surface, and the surface of the wall surface is a concave-convex surface. 63. As shown in FIG. 2A, the concave-convex surface 63 is a serrated surface.

As shown in FIG. 2B, the concave-convex surface 63 can also be a wave surface, and in addition to the sawtooth surface and the wave surface, each high point and low point of the concave-convex surface 63 can also be changed to design an irregular undulating surface.

The concave-convex surface 63 is combined with an organic adhesive layer 44. The organic adhesive layer 44 is a self-adhesive (such as acrylic pressure-sensitive adhesive or pressure-sensitive adhesive). Since the organic adhesive layer 44 is self-adhesive, it can be used to absorb dust particles.

The top surface 61 of the frame 6 is attached to the light-transmitting film 2 through an adhesive 41 (Acrylic or Epoxy) to seal the top surface 61 of the frame 6 , and the bottom surface 62 of the frame 6 is attached to the surface of the photomask 3 through an adhesive 42 (Acrylic or Silicone Pressure Sensitive Adhesives).

The dust adsorption in this case is shown in FIG. 3 , the dust 5 inside the frame 6 will be adsorbed on the organic adhesive layer 44 , and due to the design of the concave-convex surface 63 , if the dust 5 on the top falls down because the particles are too large, it will fall on the other surface of the concave-convex surface 63 to prevent the dust 5 from floating downward and falling on the surface of the photomask 3 .

Compared with other conventional technologies, the photomask protection component structure provided by the present invention has the following advantages:

(1) The present invention utilizes the concave-convex surface structure and the structure coated with the adhesive layer on the concave-convex surface structure, so that when particles or foreign dust particles fall into the frame, they can be absorbed by the adhesive layer.

(2) Due to the design of the concave-convex surface structure of the present invention, if the dust or particles are too large and cause the dust or particles to separate from the adhesive layer, the dust or particles will fall and stick to the next continuously extending concave-convex surface structure, so as to prevent the dust or particles from falling into the pattern area of the mask surface.

The present invention has been disclosed through the above-mentioned embodiments, but it is not intended to limit the present invention It is clear that any person who is familiar with this technical field and has common knowledge can make some changes and modifications after understanding the above-mentioned technical features and embodiments of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention must be defined by the appended claims of this specification.

2: Transparent film

3: mask

41: Adhesive

42: Adhesive

44: Organic adhesive layer

6: frame

61: top surface

62: Bottom

63: Bump surface

Claims (4)

A photomask protection component structure is combined on the surface of a photomask. It includes: a frame with a top surface and a bottom surface. The inner frame of the frame has a wall surface. The surface of the wall surface is a concave-convex surface. The photomask protection component structure according to claim 1, wherein the organic adhesive layer is an acrylic pressure-sensitive adhesive or a pressure-sensitive adhesive. The photomask protection component structure as claimed in claim 1, wherein the sawtooth surface can be replaced by a wave surface. The photomask protection component structure according to claim 1 or 3, wherein the concave-convex surface is further an irregular undulating surface.

Images