KR20100137819A - Pellicle frame and pellicle assembly for mask - Google Patents

Pellicle frame and pellicle assembly for mask Download PDF

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Publication number
KR20100137819A
KR20100137819A KR1020090056043A KR20090056043A KR20100137819A KR 20100137819 A KR20100137819 A KR 20100137819A KR 1020090056043 A KR1020090056043 A KR 1020090056043A KR 20090056043 A KR20090056043 A KR 20090056043A KR 20100137819 A KR20100137819 A KR 20100137819A
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KR
South Korea
Prior art keywords
pellicle
mask
frame
pellicle frame
pattern
Prior art date
Application number
KR1020090056043A
Other languages
Korean (ko)
Inventor
안일신
오혜근
Original Assignee
한양대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한양대학교 산학협력단 filed Critical 한양대학교 산학협력단
Priority to KR1020090056043A priority Critical patent/KR20100137819A/en
Publication of KR20100137819A publication Critical patent/KR20100137819A/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

The present invention relates to a pellicle assembly for a frame and mask for a pellicle, the structure of which is improved to prevent or suppress the occurrence of haze, thereby improving the quality and productivity of the produced product. The pellicle frame according to the present invention is for preventing foreign matter from adhering to the surface of the mask on which the pattern is formed during the exposure process. In the frame, a plurality of nano-scale holes are formed in the inner surface of the pellicle frame.

Description

Pellicle frame and pellicle assembly for mask

The present invention relates to a pellicle assembly for a pellicle frame and a mask, and more particularly, to a pellicle frame and a pellicle assembly for a mask for preventing foreign matter from adhering to the surface of the mask during an exposure process.

Semiconductor lithography is a process of transmitting light to a pattern formed on a transparent substrate called a photomask or mask and transferring the image onto a photoresist-coated wafer through a lens. At this time, if foreign matter such as dust adheres to the surface on which the pattern of the mask is formed, the image is transferred to the wafer as it is.

In order to prevent the above problem, the pattern of the mask is protected by a thin protective film called pellicle in the conventional case. That is, as shown in FIG. 1, the pellicle 2 is attached to the pellicle frame 1 formed in an annular shape, and the pellicle frame 1 is attached to the mask m using the adhesive 3. This prevented foreign substances from adhering to the mask m.

However, recently, in order to increase the degree of integration of the device, as the size of the pattern p is reduced and ultraviolet rays having a short wavelength are irradiated to the mask, foreign matter in the space between the pellicle 2 and the mask m, that is, various kinds of air Molecules that break away from organics, vapors, pellicles, and adhesives react with ultraviolet light to create a fouling layer called haze. The generated haze adheres to the pellicle 2 and the mask m to hinder the transmission of ultraviolet rays, and as a result, the exposure process is poor, resulting in a deterioration of the quality of the produced wafer w.

In addition, in the case where haze is generated as described above, the pellicle frame 1 and the pellicle 2 are separated from the mask m while the exposure process is stopped, and then the mask is cleaned, and a new pellicle frame and pellicle are attached to the mask. After bonding, the exposure process must be restarted, resulting in a decrease in productivity due to the interruption of the exposure process.

The present invention has been made to solve the above problems, an object of the present invention is to prevent or suppress the generation of haze, the frame and mask for the pellicle having an improved structure to improve the quality and productivity of the product produced It is to provide a pellicle assembly for.

In order to achieve the above object, the pellicle frame according to the present invention is for preventing foreign matter from adhering to the surface of the mask on which the pattern is formed during the exposure process, the pellicle is formed in an annular shape and attached to one surface of the pellicle; In the frame for pellicles coupled to the mask so as to face each other, the inner surface of the pellicle frame is characterized in that a plurality of nano-scale holes are formed.

And, the pellicle assembly for a mask according to the present invention is formed in an annular shape, the pellicle frame coupled to the mask to surround the pattern, the pellicle attached to the pellicle frame to face the pattern, the mask, the pellicle It is disposed in the space surrounded by the frame and the pellicle, characterized in that it comprises a suction member formed with a plurality of holes of the nano-scale.

According to the present invention, it is preferable that a plurality of nano-scale holes are formed on the inner surface of the pellicle frame.

In addition, according to the present invention, the adsorption member is preferably made of porous silica.

According to the present invention having the above-described configuration, the phenomenon in which haze occurs during the exposure step is prevented or suppressed. Therefore, the quality of the product produced by the exposure process and the productivity of the exposure process are improved.

Figure 2 is an exploded perspective view of the pellicle frame and pellicle coupled thereto according to an embodiment of the present invention.

Referring to FIG. 2, the pellicle frame 10 is attached to the mask m together with the pellicle 20 coupled to one surface, and the foreign matter is attached to the surface of the mask on which the pattern p is formed during the exposure process. It is to prevent that.

In the present embodiment, the pellicle frame 10 is formed in a square annular shape, and a plurality of holes having nano-scales are formed on the inner surface of the pellicle frame. The plurality of holes of the nano-scale are for adsorbing various foreign substances in the air, as described below, and mechanically polishing the inner surface of the pellicle frame 10 made of metal, or using the electrolyte for the pellicle frame. It is formed by etching. As shown in FIG. 2, the pellicle frame 10 is attached to the mask m by an adhesive or the like and surrounds the pattern p formed on the mask. The pellicle frame 20 is coupled to the pellicle frame so as to face the mask m, so that the pattern p is closed by the mask m, the pellicle frame 10 and the pellicle 20. It is arranged in the space 30.

As described above, when the pellicle frame 10 having the nano-scale holes formed on the inner surface thereof is coupled to the mask m, the foreign matter contained in the space 30 surrounding the pattern p, that is, various kinds of air. Organic molecules, vapors, pellicles and various molecules that are separated from the adhesive are adsorbed to the nano-scale holes formed in the pellicle frame 10. Therefore, during the exposure process, the foreign materials react with the ultraviolet rays to prevent or at least reduce the haze, and as a result, the quality of the wafer is prevented from being lowered and the productivity is improved.

3 is a perspective view of a pellicle assembly for a mask according to an embodiment of the present invention.

Referring to FIG. 3, the mask pellicle assembly 140 according to the present embodiment includes a pellicle frame 110, a pellicle 120, and an adsorption member 130.

The pellicle frame 110 is formed in a square annular shape, and a plurality of holes having nano-scales are formed on the inner surface of the pellicle frame. As described above, the nano-scale holes may be formed by mechanical polishing or etching using an electrolyte. As shown in FIG. 3, the pellicle frame 110 is attached to the mask m by an adhesive or the like and surrounds the pattern p formed on the mask.

The pellicle 120 is attached to one surface of the pellicle frame 110 so as to face the mask m, whereby the pattern p formed on the mask is enclosed by the pellicle, the pellicle frame and the mask 150. ) Will be placed within.

The adsorption member 130 is for adsorbing various foreign matters contained in the enclosed space 150, that is, various organic substances in the air, vapors, pellicles, and various molecules released from the adhesive. The adsorption member 130 is made of a material in which a plurality of nano-scale holes are formed. In this embodiment, the adsorption member is made of porous silica. Porous silica is a material in which a plurality of pores having nano-scales are formed, which is already known in Korean Patent No. 10-0396457, etc., and thus detailed description thereof will be omitted. The adsorption member 130 is coupled to the pellicle frame 110 is disposed in the sealed space 150, and adsorbs the foreign matter contained in the space 150.

When the mask pellicle assembly 140 configured as described above is coupled to the mask m, the foreign substance is included in the space 150 surrounding the pattern p, and foreign matter is transferred to the pellicle frame 110 and the adsorption member 130. Will be adsorbed. Thus, the foreign matter reacts with the ultraviolet light during the exposure process to prevent or at least reduce the haze, thereby preventing the wafer quality and productivity from being lowered and improving the productivity.

Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the specific preferred embodiments described above, and the present invention belongs to the present invention without departing from the gist of the present invention as claimed in the claims. Various modifications can be made by those skilled in the art, and such changes are within the scope of the claims.

For example, in the case of the pellicle assembly for the mask described above, the nano-scale hole is formed in the pellicle frame, but the invention may be configured so that no hole is formed in the pellicle frame.

In addition, in the above-described embodiment, the adsorption member is made of porous silica, but may be made of another material having pores of nano-scale.

1 is a view for explaining a conventional exposure process.

Figure 2 is an exploded perspective view of the pellicle frame and pellicle coupled thereto according to an embodiment of the present invention.

3 is a perspective view of a pellicle assembly for a mask according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10 ... frame for pellicle 140 ... pellicle assembly for mask

110 Frame for pellicle 120 ...

130 ... adsorption member m ... mask

Claims (4)

In the pellicle frame to prevent the foreign matter is attached to the surface of the mask pattern is formed during the exposure process, the pellicle is formed in an annular shape is coupled to the mask so as to face the pattern, A pellicle frame having a plurality of nano-scale holes formed on an inner surface of the pellicle frame. A pellicle frame formed in an annular shape and coupled to the mask to surround the pattern; A pellicle attached to the pellicle frame so as to face the pattern; And And a suction member disposed in a space surrounded by the mask, the pellicle frame, and the pellicle, wherein a plurality of nano-scale holes are formed. The method of claim 2, A pellicle assembly for a mask in which a plurality of nano-scale holes are formed on an inner surface of the pellicle frame. The method of claim 2, The adsorption member is a mask pellicle assembly made of porous silica.
KR1020090056043A 2009-06-23 2009-06-23 Pellicle frame and pellicle assembly for mask KR20100137819A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090056043A KR20100137819A (en) 2009-06-23 2009-06-23 Pellicle frame and pellicle assembly for mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090056043A KR20100137819A (en) 2009-06-23 2009-06-23 Pellicle frame and pellicle assembly for mask

Publications (1)

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KR20100137819A true KR20100137819A (en) 2010-12-31

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220086040A (en) * 2020-12-16 2022-06-23 주식회사 에프에스티 Porous Pellicle Frame for EUV(extreme ultraviolet) Lithography
KR20220112519A (en) * 2021-02-04 2022-08-11 주식회사 에프에스티 Pellicle Frame for EUV(extreme ultraviolet) Lithography

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220086040A (en) * 2020-12-16 2022-06-23 주식회사 에프에스티 Porous Pellicle Frame for EUV(extreme ultraviolet) Lithography
KR20220112519A (en) * 2021-02-04 2022-08-11 주식회사 에프에스티 Pellicle Frame for EUV(extreme ultraviolet) Lithography

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