TW202013063A - Photomask protection component structure by which the quantity of residual adhesives is reduced, the exposed thickness of the adhesive is reduced, and the generated haze is also reduced - Google Patents
Photomask protection component structure by which the quantity of residual adhesives is reduced, the exposed thickness of the adhesive is reduced, and the generated haze is also reduced Download PDFInfo
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Abstract
Description
本發明是有關一種光罩保護組件結構,係一用於結合在半導體製程的光罩組件上,用於隔離外部汙染物的保護框。The invention relates to a structure of a photomask protection component, which is a protective frame used for being combined with a photomask component of a semiconductor manufacturing process and used for isolating external contaminants.
目前的半導體元件製造技術,半導體元件的電路圖案是透過微影(lithography)製程將電路圖案轉印至矽晶圓的表面,具體而言是利用特定波長的光源投射通過光罩(photomask)的方式,將光罩上的電路圖案轉印至矽晶圓的表面。In the current semiconductor device manufacturing technology, the circuit pattern of the semiconductor device is transferred to the surface of the silicon wafer through a lithography process, specifically, a light source of a specific wavelength is projected through a photomask To transfer the circuit pattern on the photomask to the surface of the silicon wafer.
一般光罩組件會在表面的電路圖案外設置一保護組件,而通常該保護組件會在底面透過一高度介於0.2mm~1mm的黏著劑而黏合在光罩組件上,而該保護組件的頂面則覆蓋有一層保護薄膜,以作為該光罩組件表面電路圖案之保護,避免微塵落入光罩表面,造成電路曝光失敗。Generally, a photomask component is provided with a protective component outside the circuit pattern on the surface, and usually the protective component is adhered to the photomask component on the bottom surface through an adhesive with a height of 0.2 mm to 1 mm, and the top surface of the protective component It is covered with a layer of protective film to protect the circuit pattern on the surface of the photomask assembly, so as to prevent fine dust from falling into the surface of the photomask and causing circuit exposure failure.
然而,目前該黏著劑通常是釋放污染物的來源,因此,使用一段時間後,必然會污染光罩組件表面的電路圖案,造成該光罩組件必須清洗,而清洗光罩組件的前提,是將該保護組件由該光罩組件表面移除,然而由於光罩組件表面與該保護組件之間具有黏著劑,故當分離後,於光罩組件表面上會有很多黏著劑的殘膠存留,因此業者往往必須透過溶劑重複進行清洗,才有可能將該光罩組件表面上的殘膠成分清除,而若是殘膠難以清除,則必須先使用藥水或棉花棒在殘膠區域塗佈,並於溶解後再進行清洗,故若是殘膠量越多更提升困難度。However, at present, the adhesive is usually a source of released contaminants. Therefore, after being used for a period of time, the circuit pattern on the surface of the reticle assembly must be contaminated, causing the reticle assembly to be cleaned. The premise of cleaning the reticle assembly is to The protective component is removed from the surface of the photomask component. However, since there is an adhesive between the surface of the photomask component and the protective component, after separation, a lot of adhesive residue will remain on the surface of the photomask component, so Manufacturers often have to repeatedly clean through the solvent before it is possible to remove the residual glue components on the surface of the reticle assembly. If the residual glue is difficult to remove, you must first use a potion or cotton swab to coat the residual glue area and dissolve it. After cleaning, the more the amount of residual glue, the greater the difficulty.
再者,該黏著劑的高度通常為0.2mm~1mm,這樣的高度通常膠壁是完全暴露於框架外,該高度即代表該黏著劑3釋放污染物(例如: 薄霧(haze))的區間,使污染物大量的被釋放,造成光罩表面的污染。In addition, the height of the adhesive is usually 0.2 mm to 1 mm. Such a height is usually completely exposed to the outside of the frame. This height represents the interval where the adhesive 3 releases contaminants (for example: haze) , So that a large amount of pollutants are released, causing pollution on the surface of the photomask.
因此,若能夠增加保護組件底部與黏著劑之黏接強度,則能當要將光罩與框架分離時,將更容易使該保護組件由該光罩組件表面分開,且光罩表面上的殘膠量也會大幅減少,以及降低整體污染物的生成,如此為本發明之解決方案。Therefore, if the adhesion strength between the bottom of the protective component and the adhesive can be increased, it is easier to separate the protective component from the surface of the photomask component when the photomask is separated from the frame, and the residual on the surface of the photomask component The amount of glue will also be greatly reduced, as well as the formation of overall pollutants, which is the solution of the invention.
本發明之光罩保護組件結構,包括有一框架與一保護薄膜,該框架係為環框狀,在該框架的底面內凹有二道隨著該框架環繞的溝槽,在二道該溝槽之間並形成有一凹凸壁面,在該凹凸壁面上則形成有大量連續排列的凹部與凸部,而該保護薄膜係貼合於該框架之頂面上,且具透光性,藉之,各該溝槽與各該凹部用於填入一黏著劑,並透過該黏著劑得以將該框架黏合於一光罩組件之表面上,令該框架內於該保護薄膜與該光罩組件之間形成一腔室。The structure of the photomask protection assembly of the present invention includes a frame and a protective film. The frame is in the shape of a ring frame. Two grooves surrounding the frame are recessed in the bottom surface of the frame. A concave and convex wall surface is formed between them, and a large number of continuously arranged concave and convex portions are formed on the concave and convex wall surface, and the protective film is attached to the top surface of the frame and is transparent, so that each The groove and each of the recesses are used to fill in an adhesive, and through the adhesive, the frame can be adhered to the surface of a reticle assembly, so that the frame is formed between the protective film and the reticle assembly One chamber.
藉由二道溝槽配合大量凹部與凸部之配置,讓框架底面形成大量的凹凸造型,因此,大幅的提升了該黏著劑與該框架的黏著接觸面積,使該黏著劑在該溝槽內的黏接強度會大於光罩表面,因此,更容易將該框架由該光罩組件的表面分開,同時,讓該光罩表面上的殘膠量也會大幅減少,另外,由於大部分的黏著劑係填入各該溝槽內,因此該黏著劑外露於該溝槽外的厚度降低至0.1mm以下,係相當於習知的2~10倍以下,進而可減少因黏著劑外露所釋放出的汙染物質產生。Through the arrangement of two grooves and a large number of concave and convex portions, a large number of concave and convex shapes are formed on the bottom surface of the frame, therefore, the adhesive contact area of the adhesive and the frame is greatly improved, so that the adhesive is in the groove The bonding strength will be greater than the surface of the reticle. Therefore, it is easier to separate the frame from the surface of the reticle assembly. At the same time, the amount of residual glue on the surface of the reticle will be greatly reduced. In addition, due to most of the adhesion The adhesive is filled into each of the grooves, so the thickness of the adhesive exposed outside the groove is reduced to less than 0.1mm, which is equivalent to 2 to 10 times less than conventionally known, which can reduce the release of the adhesive Produced pollutants.
更具體的說,該黏著劑係為壓克力膠或矽膠。More specifically, the adhesive is acrylic or silicone.
更具體的說,該黏著劑的總厚度範圍為0.3~1mm。More specifically, the total thickness of the adhesive ranges from 0.3 to 1 mm.
更具體的說,各該溝槽的深度範圍為0.2mm~0.9mm。More specifically, the depth of each groove ranges from 0.2 mm to 0.9 mm.
更具體的說,該黏著劑外露於該溝槽外的厚度為0.1mm以下。More specifically, the thickness of the adhesive exposed outside the groove is 0.1 mm or less.
更具體的說,該溝槽的形狀係設計為U形、V形或是多邊形。More specifically, the shape of the groove is designed to be U-shaped, V-shaped or polygonal.
更具體的說,該凸部末端是與該框架的底面齊平。More specifically, the end of the convex portion is flush with the bottom surface of the frame.
更具體的說,該凸部末端是內縮至該溝槽內。More specifically, the end of the convex portion is retracted into the groove.
更具體的說,該凸部末端是外凸至該框架的底面More specifically, the end of the convex portion is convex to the bottom surface of the frame
有關於本發明其他技術內容、特點與功效,在以下配合參考圖式之較佳實施例的詳細說明中,將可清楚的呈現。Regarding other technical contents, features and effects of the present invention, it will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings.
請參閱第1~3、4A圖,分別為本發明之光罩保護組件結構的立體示意圖以及內部結構剖面示意圖,如圖中所示,至少包含一框架1與一保護薄膜2;Please refer to Figures 1~3 and 4A, which are respectively a three-dimensional schematic diagram and a cross-sectional schematic diagram of the internal structure of the mask protection component structure of the present invention. As shown in the figure, at least a
其中,該框架1係為環框狀,且可使用鋁材製作,在該框架1的底面內凹有二道隨著該框架1環繞的溝槽11,在二道該溝槽11之間並形成有一凹凸壁面12,在該凹凸壁面12上則形成有大量連續排列的凹部121與凸部122,而該保護薄膜2係貼合於該框架1之頂面上;Wherein, the
請參閱第5、6圖,各該溝槽11與各該凹部121用於填入一黏著劑3,並透過該黏著劑3得以將該框架1黏合於一光罩組件4之表面41上,令該框架1內於該保護薄膜2與該光罩組件4之間形成一腔室13,該光罩組件4上並設有圖案42,該黏著劑3係為壓克力膠或矽膠,而該黏著劑3的總厚度H1範圍(相當於該溝槽11最深處至該黏著劑3外露的最外處)為0.3~1mm,其可包含0.3mm、0.4mm、0.5mm、0.6mm、0.7mm、0.8mm、0.9mm或1mm,而各該溝槽11的槽深度H2範圍為0.2mm~0.9mm,其可包含0.2mm 、0.3mm、0.4mm、0.5mm、0.6mm、0.7mm、0.8mm或0.9mm,該黏著劑3外露於該溝槽11外的外露厚度H3的範圍為0.1mm以下,其可包含0.01mm、0.02mm、0.03mm、0.04mm、0.05mm、0.06mm、0.07mm、0.08mm、0.09mm或0.1mm。Please refer to FIGS. 5 and 6, each of the
本發明之光罩保護組件結構,請參閱第7圖,在該框架1與該光罩組件4黏合後,透過特定波長的光線經由腔室13將該圖案42轉印至矽晶圓的表面。For the structure of the photomask protection component of the present invention, please refer to FIG. 7. After the
本發明之光罩保護組件結構,請參閱第8圖,在經多次轉印使用後的該光罩組件4,該黏著劑3會釋放污染物至腔室13,因此,使用一段時間後便需要進行清洗,故需將該框架1拆離該光罩組件4,拆除該框架1時,因該黏著劑3在該溝槽11內的厚度大於外露的厚度,而且該溝槽11設有兩道,再配合大量的各該凹部121與各該凸部122,大幅的提升了該黏著劑3與該框架1的接觸面積,使在該溝槽11內的該黏著劑3的黏接強度會大於該溝槽11外的該黏著劑3的黏接強度,故可更輕易的將該框架1由該光罩組件4的表面41拆離,而且該黏著劑3可更完整的保留於該框架1上,進而使該光罩組件4的表面41的殘膠量變少,甚至沒有殘膠。For the structure of the reticle protection assembly of the present invention, please refer to FIG. 8. After the
本發明之光罩保護組件結構,請參閱第4A圖,該溝槽11係設計為U形,請一併參閱第4B、4C圖,該溝槽11的形狀亦可設計為V形或是多邊形。For the structure of the photomask protection component of the present invention, please refer to FIG. 4A. The
本發明之光罩保護組件結構,請參閱第4A圖,各該凸部122末端是與該框架1的底面齊平,請一併參閱第4D圖,各該凸部122末端是亦可內縮至該溝槽11內,請一併參閱第4E圖,各該凸部122末端是亦可外凸至該框架1的底面,而凸出之高度為0.1mm以下,其係配合該黏著劑3外露於該溝槽11外的厚度,因此可包含0.01mm、0.02mm、0.03mm、0.04mm、0.05mm、0.06mm、0.07mm、0.08mm、0.09mm或0.1mm。For the structure of the photomask protection component of the present invention, please refer to FIG. 4A, the end of each
本發明所提供之光罩保護組件結構,與其他習用技術相互比較時,其優點如下: 1. 藉由二道溝槽配合大量凹部與凸部之配置,大幅的提升了該黏著劑與該框架的黏著接觸面積,使該黏著劑在該溝槽內的黏接強度會大於光罩表面,因此,更容易將該框架由該光罩組件的表面分開,同時,讓該光罩表面上的殘膠量也會大幅減少。 2. 因為該黏著劑外露於該溝槽外的厚度降低至0.1mm以下,而習知露出0.2mm~1mm的厚度的黏著劑,因此由外露處釋放出的汙染物質可降低2~10倍。The structure of the photomask protection component provided by the present invention has the following advantages when compared with other conventional technologies: 1. By combining two grooves with a large number of concave and convex portions, the adhesive and the frame are greatly improved The adhesive contact area makes the adhesion strength of the adhesive in the groove greater than the surface of the reticle. Therefore, it is easier to separate the frame from the surface of the reticle assembly, and at the same time, let the residual on the surface of the reticle The amount of glue will also be greatly reduced. 2. Because the thickness of the adhesive exposed outside the groove is reduced to less than 0.1 mm, and conventionally exposed adhesive with a thickness of 0.2 mm to 1 mm, the pollutants released from the exposed area can be reduced by 2 to 10 times.
上述之實施例揭露,僅是本發明部分較佳的實施例選擇,然其並非用以限定本發明,任何熟悉此一技術領域具有通常知識者,在瞭解本發明前述的技術特徵及實施例,並在不脫離本發明之精神和範圍內所做的均等變化或潤飾,仍屬本發明涵蓋之範圍,而本發明之專利保護範圍須視本說明書所附之請求項所界定者為準。The above-mentioned embodiments are disclosed, which are only some of the preferred embodiments of the present invention. However, they are not intended to limit the present invention. Anyone who is familiar with this technical field and has ordinary knowledge will understand the aforementioned technical features and embodiments of the present invention. The equivalent changes or modifications made without departing from the spirit and scope of the present invention still fall within the scope of the present invention, and the patent protection scope of the present invention shall be subject to the definition of the claims attached to this specification.
1:框架11:溝槽12:凹凸壁面121:凹部122:凸部13:腔室2:保護薄膜3:黏著劑4:光罩組件41:表面42:圖案H1:總厚度H2:槽深度H3:外露厚度1: Frame 11: Groove 12: Concave and convex wall 121: Concave part 122: Convex part 13: Chamber 2: Protective film 3: Adhesive 4: Photomask assembly 41: Surface 42: Pattern H1: Total thickness H2: Groove depth H3 : Exposed thickness
[第1圖]係本發明光罩保護組件結構之框架立體示意圖。 [第2圖]係本發明光罩保護組件結構之框架結構平面示意圖。 [第3圖]係本發明光罩保護組件結構之框架結構剖面示意圖。 [第4A圖] 係本發明光罩保護組件結構之溝槽設為U形之局部剖面示意圖。 [第4B圖] 係本發明光罩保護組件結構之溝槽設為V形之局部剖面示意圖。 [第4C圖] 係本發明光罩保護組件結構之溝槽設為多邊形之局部剖面示意圖。 [第4D圖] 係本發明光罩保護組件結構之凸部末端內凹之局部剖面示意圖。 [第4E圖] 係本發明光罩保護組件結構之凸部末端凸出之局部剖面示意圖。 [第5圖] 係本發明光罩保護組件結構之框架結合光罩組件立體剖面示意圖。 [第6圖] 係本發明光罩保護組件結構之框架結合光罩組件剖面示意圖。 [第7圖] 係本發明光罩保護組件結構之實施轉印立體剖面示意圖。 [第8圖] 係本發明光罩保護組件結構之實施拆離框架立體剖面示意圖。[Figure 1] It is a schematic perspective view of the frame of the mask protection assembly structure of the present invention. [Figure 2] is a schematic plan view of the frame structure of the photomask protection component structure of the present invention. [Figure 3] is a schematic cross-sectional view of the frame structure of the photomask protection component structure of the present invention. [FIG. 4A] It is a partial cross-sectional schematic view of the U-shaped groove of the mask protection component structure of the present invention. [Fig. 4B] This is a partial cross-sectional view of the V-shaped groove of the mask protection device structure of the present invention. [Fig. 4C] It is a partial cross-sectional schematic view of the polygonal groove of the mask protection device structure of the present invention. [Fig. 4D] It is a partial cross-sectional schematic diagram of the concave end of the convex portion of the mask protection component structure of the present invention. [Fig. 4E] It is a partial cross-sectional schematic view of the end of the convex part of the structure of the mask protection component of the present invention. [Figure 5] This is a perspective cross-sectional schematic view of a frame combined with a mask assembly of the mask protection assembly structure of the present invention. [Figure 6] This is a schematic cross-sectional view of a frame combined with a reticle assembly of the reticle protection assembly structure of the present invention. [Figure 7] It is a schematic cross-sectional schematic view of the implementation of the transfer structure of the photomask protection component of the present invention. [Figure 8] This is a three-dimensional schematic cross-sectional view of the implementation of the detachment frame of the mask protection assembly structure of the present invention.
1:框架 1: framework
11:溝槽 11: Groove
12:凹凸壁面 12: uneven wall
121:凹部 121: recess
122:凸部 122: convex
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WO1998002783A1 (en) * | 1996-07-17 | 1998-01-22 | Mitsui Chemicals, Inc. | Mask protecting device |
KR100505283B1 (en) * | 2001-10-31 | 2005-08-03 | 미쓰이 가가쿠 가부시키가이샤 | Pellicle and method of manufacturing mask with pellicle |
TWI454839B (en) * | 2007-03-01 | 2014-10-01 | 尼康股份有限公司 | A film frame apparatus, a mask, an exposure method, and an exposure apparatus, and a method of manufacturing the element |
US8349525B2 (en) * | 2009-06-18 | 2013-01-08 | Nikon Corporation | Protective apparatus, mask, mask fabricating method and conveying apparatus, and exposure apparatus |
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