TWI806280B - Optical sensing device - Google Patents

Abstract

An optical sensing device includes a substrate, a sensing element layer, a first planarization layer and a second planarization layer. The sensing element layer is disposed on the substrate and includes a plurality of sensing elements. The first planarization layer is disposed on the sensing element layer and has a first slit. The second planarization layer is disposed on the first planarization layer and has a second slit, wherein an orthogonal projection of the first slit on the substrate is not overlapped with an orthogonal projection of the second slit, which extends in the same direction as the first slit, on the substrate, and the orthogonal projection of the second slit on the substrate presents a curved pattern.

Description

Optical Sensing Device

The present invention relates to a sensing device, and in particular to an optical sensing device.

In order to construct a smart living environment, sensing technology has been widely used in various electronic devices. For example, devices such as mobile phones and electronic locks use fingerprint sensors to protect personal data security and access control. In terms of practical application requirements, the fingerprint sensor needs to be designed with light collimation, for example, use a light-shielding layer to limit the light-receiving angle of the sensing element, and use organic materials to stack enough thickness to facilitate micro-lens focusing and The purpose of collimating the light is to obtain a clearer fingerprint image.

Since the organic thick film is prone to warping due to temperature changes during the manufacturing process, the design of breaking the film is currently used to release the stress in the organic thick film to solve the problem of warping. However, the design of this film break will cause gas to rush into the film break due to the pressure change of breaking the vacuum during the subsequent process, causing the frame glue to puncture or break, resulting in poor production yield.

The invention provides an optical sensing device with improved production yield.

An embodiment of the present invention proposes an optical sensing device, which has a sensing area and a non-sensing area surrounding the sensing area, and includes: a substrate; a sensing element layer located on the substrate, and including multiple sensors located in the sensing area a sensing element; a first planar layer, located on the sensing element layer, and having a first slit; and a second planar layer, located on the first planar layer, and having a second slit, wherein, extending in the same direction Orthographic projections of the first slit and the second slit on the substrate do not overlap, and the orthographic projection of the part of the second slit located in the non-sensing area on the substrate presents a curved pattern.

In an embodiment of the present invention, the orthographic projection of the portion of the second slit located in the sensing region on the substrate presents a straight line pattern.

In an embodiment of the present invention, the above-mentioned first flat layer further has a first groove located in the non-sensing area, the second flat layer further has a second groove located in the non-sensing area, and the first groove The orthographic projection of the second trench on the substrate is superimposed on the orthographic projection of the substrate.

In an embodiment of the present invention, the above-mentioned first slit extends through the first flat layer along the first direction and the second direction, and the first direction and the second direction are perpendicular to each other.

In an embodiment of the present invention, the above-mentioned second slit extends through the second flat layer along the first direction and the second direction, and the first direction and the second direction are perpendicular to each other.

In an embodiment of the present invention, the above-mentioned curved pattern is an S-shaped curved pattern or a zigzag pattern.

In an embodiment of the present invention, the total area of the above-mentioned first slit and the second slit accounts for 0.05% to 6% of the total area of the optical sensing device.

In an embodiment of the present invention, the above-mentioned optical sensing device further includes a first light-shielding layer located on the sensing element layer and having a plurality of first openings, wherein the orthographic projection of each first opening on the substrate overlaps each The orthographic projection of the sensing element on the substrate.

In an embodiment of the present invention, the above-mentioned optical sensing device further includes a second light-shielding layer, which is located on the first flat layer and has a plurality of second openings, wherein the orthographic projection of each second opening on the substrate overlaps each The orthographic projection of the sensing element on the substrate.

In an embodiment of the present invention, the above-mentioned optical sensing device further includes a plurality of microlens structures located on the second flat layer, and the orthographic projections of each microlens structure on the substrate overlap the orthographic projections of each sensing element on the substrate .

Another embodiment of the present invention provides an optical sensing device, which has a sensing area and a non-sensing area surrounding the sensing area, and includes: a first substrate; a sensing element layer located on the first substrate, and including A plurality of sensing elements in the sensing area; a first planar layer, located on the sensing element layer, and having a first slit located in the sensing area and a first groove located in the non-sensing area; and a second planar layer , located on the first flat layer, and has a second slit located in the sensing area and a second groove located in the non-sensing area, wherein the first slit and the second slit extending in the same direction are located in the first The orthographic projections of the substrates do not overlap, and the orthographic projections of the first trench on the first substrate overlap the orthographic projections of the second trench on the first substrate.

In an embodiment of the present invention, the above-mentioned first slit further extends to the non-sensing area and connects to the first trench.

In an embodiment of the present invention, the above-mentioned second slit also extends to the non-sensing area and connects to the second groove.

In an embodiment of the present invention, the orthographic projection of the above-mentioned first groove and the second groove on the first substrate presents a ring pattern.

In an embodiment of the present invention, the above-mentioned optical sensing device further includes a third flat layer located between the sensing element layer and the first flat layer, and the third flat layer has a third slit located in the sensing region and the third groove located in the non-sensing area, wherein the orthographic projections of the first slit, the second slit and the third slit extending in the same direction on the first substrate do not overlap, and the third groove is located in the first substrate The orthographic projection of a substrate overlaps the orthographic projections of the first groove and the second groove on the first substrate.

In an embodiment of the present invention, the above-mentioned optical sensing device further includes a second substrate opposite to the first substrate, and the sensing element layer, the first flat layer and the second flat layer are located between the second substrate and the first substrate. between.

In an embodiment of the present invention, the above-mentioned optical sensing device further includes a color-resist pattern located between the second substrate and the second flat layer.

In an embodiment of the present invention, the above-mentioned optical sensing device further includes a spacer located between the second substrate and the second planar layer.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or Intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to physical and/or electrical connection. Furthermore, "electrically connected" or "coupled" may mean that other elements exist between two elements.

It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and and/or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first "element," "component," "region," "layer" or "section" discussed below could be termed a second element, component, region, layer or section without departing from the teachings herein.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include plural forms including "at least one" or meaning "and/or" unless the content clearly dictates otherwise. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It should also be understood that when used in this specification, the terms "comprising" and/or "comprising" designate the existence of said features, regions, integers, steps, operations, elements and/or components, but do not exclude one or more Existence or addition of other features, regions, integers, steps, operations, elements, parts and/or combinations thereof.

Additionally, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe one element's relationship to another element as shown in the figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "below" can encompass both an orientation of "below" and "upper," depending on the particular orientation of the drawing. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "beneath" can encompass both an orientation of above and below.

The terms "about," "approximately," or "substantially" as used herein include stated values and those within ordinary skill in the art, taking into account the measurements in question and the specific amount of error associated with the measurements (i.e., limitations of the measurement system). The average value within an acceptable range of deviation from a specified value as determined by a human being. For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, "about", "approximately", or "substantially" used herein may select a more acceptable range of deviation or standard deviation based on optical properties, etching properties or other properties, and may not use one standard deviation to apply to all nature.

Exemplary embodiments are described herein with reference to cross section illustrations that are schematic illustrations of idealized embodiments. Accordingly, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances are to be expected. Thus, embodiments described herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, a region shown or described as flat, may, typically, have rough and/or non-linear features. Additionally, acute corners shown may be rounded. Thus, the regions shown in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.

FIG. 1A is a schematic top view of an optical sensing device 10 according to an embodiment of the invention. FIG. 1B is an enlarged schematic view of a region I of the optical sensing device 10 of FIG. 1A . Fig. 1C is a schematic cross-sectional view taken along the section line A-A' of Fig. 1B. Fig. 1D is a schematic cross-sectional view taken along the section line B-B' of Fig. 1A. Fig. 1E is a schematic cross-sectional view taken along the section line C-C' of Fig. 1A. In order to make the drawing more concise, FIG. 1A schematically shows the substrate SB1 , the frame glue FG, the slits ST1 , ST2 and the scribe line CL of the optical sensing device 10 , and omits other components.

First, please refer to FIGS. 1A to 1C at the same time. The optical sensing device 10 includes: a substrate SB1; a sensing element layer SE located on the substrate SB1 and including a plurality of sensing elements SC; a flat layer PL1 located on the sensing element layer on the SE, and has a slit ST1; and a flat layer PL2, located on the flat layer PL1, and has a slit ST2, wherein the orthographic projections of the slit ST1 and the slit ST2 extending in the same direction on the substrate SB1 do not overlap, and The orthographic projection of the slit ST2 on the substrate SB1 presents a curved pattern.

In the optical sensing device 10 according to an embodiment of the present invention, by making the slit ST2 in the flat layer PL2 present a curved pattern, it is possible to prevent the gas from rushing into the slit ST2, so as to prevent the frame glue from being pierced by the gas impact. or disconnection problems, thereby improving the production yield of the optical sensing device 10 .

Hereinafter, with reference to FIG. 1A to FIG. 1E , the implementation of each element of the optical sensing device 10 will be continuously described, but the present invention is not limited thereto.

Referring to FIG. 1A , in this embodiment, the optical sensing device 10 can be obtained by cutting along the cutting line CL, and the cutting line CL can be located between two adjacent optical sensing devices 10 . In general, the optical sensing device 10 may have a sensing area SA and a non-sensing area NA, and the non-sensing area NA may surround the sensing area SA. In addition, the optical sensing device 10 can also be coated with a frame glue FG, and the frame glue FG can surround the sensing area SA, and the frame glue FG and its outside can be regarded as the non-sensing area NA. In some embodiments, the non-sensing area NA may further include a bonding area BA, and the bonding area BA may be located on one side of the optical sensing device 10, for example, the bonding area BA may be located on the lower side of the optical sensing device 10, As shown in Figure 1A, but not limited thereto.

The substrate SB1 of the optical sensing device 10 can be a flexible substrate or a rigid substrate, and its material can be ceramic substrate, quartz substrate, glass substrate, polymer substrate or other suitable materials, but not limited thereto.

Please refer to FIG. 1C , in some embodiments, the optical sensing device 10 may further include an insulating layer IL, and the insulating layer IL may be disposed between the substrate SB1 and the sensing element layer SE. The material of the insulating layer IL can be silicon oxide, silicon nitride, or a stacked layer of at least two of the above materials, but is not limited thereto.

In this embodiment, the sensing element SC in the sensing element layer SE may be located in the sensing area SA, and the sensing element SC may include a first electrode SC1 , a photosensitive layer SC2 and a second electrode SC3 . The first electrode SC1 , the photosensitive layer SC2 and the second electrode SC3 are sequentially stacked on the substrate SB1 in this order, for example. In some embodiments, the area of the second electrode SC3 is larger than the area of the photosensitive layer SC2, and the contours of the first electrode SC1 and the second electrode SC3 may partially overlap. In some embodiments, the first electrode SC1 and the second electrode SC3 may include a light-transmitting conductive material or a light-impermeable conductive material, which depends on the application of the sensing device 100 . For example, the optical sensing device 10 can be used as an under-screen fingerprint sensor. Therefore, light from the outside (such as light reflected by a fingerprint) will pass through the second electrode SC3 and enter the photosensitive layer SC2. Based on this , the second electrode SC3 is made of light-transmitting conductive material. The photosensitive layer SC2 has the characteristic of converting light energy into electrical energy, so as to realize the function of optical sensing. In some embodiments, the material of the photosensitive layer SC2 may include a silicon-rich material, which may be silicon-rich oxide, silicon-rich nitride, silicon-rich oxynitride, silicon-rich carbide, silicon-rich oxycarbide, hydrogenated silicon-rich Oxide, hydrogenated silicon-rich nitride, hydrogenated silicon-rich carbide, or other suitable materials or combinations thereof.

In some embodiments, the sensing element layer SE may further include a planarization layer PLs. The flat layer PLs is, for example, located between the first electrode SC1 and the second electrode SC3 of the sensing element SC. In some embodiments, the flat layer PLs has an opening OP exposing the first electrode SC1 of the sensing element SC, wherein the photosensitive layer SC2 is located in the opening OP and contacts the first electrode SC1, and the second electrode SC3 can be disposed on the photosensitive layer. SC2 and the flat layer PLs and in contact with the photosensitive layer SC2.

Please refer to FIG. 1A to FIG. 1C at the same time, each slit ST1 of the flat layer PL1 can completely penetrate the flat layer PL1 , and the flat layer PL2 can be filled into the slit ST1 . In other words, the slit ST1 may extend from the non-sensing area NA on one side of the optical sensing device 10 through the sensing area SA, and then extend to the non-sensing area NA on the opposite side, so as to divide the flat layer PL1 into two separate parts. A block, in this way, can help with stress relief. For example, in this embodiment, the slit ST1 of the flat layer PL1 may include two slits ST1h extending along the first direction D1 and one slit ST1v extending along the second direction D2, and the first direction D1 and The second directions D2 may be perpendicular to each other, so that the flat layer PL1 may be divided into six separate blocks. However, the extending direction and number of the slits ST1 are not particularly limited. In some embodiments, the number of slits ST1 may be equal to or greater than one. In some embodiments, the extending direction of the slit ST1 may be different from the first direction D1 and the second direction D2. In some embodiments, the width W1 of the slit ST1 may be between 5 μm and 10 μm.

Similarly, each slit ST2 of the flat layer PL2 can completely pass through the flat layer PL2 to divide the flat layer PL2 into two separate parts, so as to facilitate stress release. For example, in this embodiment, the slit ST2 of the flat layer PL2 may include two slits ST2h extending along the first direction D1 and one slit ST2v extending along the second direction D2, and the first direction D1 and The second directions D2 may be perpendicular to each other, so that the flat layer PL2 may be divided into six separate blocks. However, the extending direction and number of the slits ST2 are not particularly limited. In some embodiments, the number of slits ST2 may be equal to or greater than one. In some embodiments, the extending direction of the slit ST2 may be different from the first direction D1 and the second direction D2. In some embodiments, the width W2 of the slit ST2 may be between 5 μm and 10 μm. In some embodiments, the total area of the slits ST1 , ST2 may account for about 0.05% to 6% of the total area of the optical sensing device 10 .

In this embodiment, the orthographic projections of the slits ST1v and ST2v extending along the second direction D2 on the substrate SB1 do not overlap. Likewise, in this embodiment, the orthographic projections of the slits ST1h and ST2h extending along the first direction D1 on the substrate SB1 do not overlap. In this way, it is possible to avoid affecting the overall flatness of the flat layers PL1, PL2.

In some embodiments, the optical sensing device 10 may further include a planar layer PL3 and a light-shielding layer BM1, and the planar layer PL3 may be located between the planar layer PL1 and the sensing element layer SE, and the light-shielding layer BM1 may be located in the planar layer PL1, for example. and the flat layer PL3. In detail, the light-shielding layer BM1 may have a plurality of openings O1, and the orthographic projection of each opening O1 on the substrate SB1 may overlap the orthographic projection of each sensing element SC on the substrate SB1. The material of the light-shielding layer BM1 can include light-shielding and/or reflective materials, which can be metals, alloys, nitrides of the aforementioned materials, oxides of the aforementioned materials, nitrogen oxides of the aforementioned materials, or other suitable light-shielding and/or reflective materials. Material. In some embodiments, the material of the light shielding layer BM1 may be molybdenum, molybdenum oxide or stacked layers thereof. The arrangement of the light-shielding layer BM1 can effectively prevent stray light from entering the sensing element SC, thereby improving the sensing resolution. In this embodiment, the opening O1 is provided correspondingly to the sensing element SC, so that the sensing element SC can convert the external light passing through the opening O1 into a corresponding electrical signal. In addition, in some embodiments, the area provided with the light-shielding layer BM1 can be used to shield, for example, the switching element, so as to avoid the leakage of the switching element.

In some embodiments, the optical sensing device 10 may further include a light shielding layer BM2, and the light shielding layer BM2 may be located between the planar layer PL1 and the planar layer PL2. In detail, the light shielding layer BM2 may have a plurality of openings O2, and the orthographic projection of each opening O2 on the substrate SB1 may overlap the orthographic projection of each sensing element SC on the substrate SB1. In this embodiment, the opening O2 is provided correspondingly to the sensing element SC, so that the sensing element SC can convert the external light passing through the opening O2 into a corresponding electrical signal. The material of the light-shielding layer BM2 can include light-shielding and/or reflective materials, which can be metals, alloys, nitrides of the aforementioned materials, oxides of the aforementioned materials, nitrogen oxides of the aforementioned materials, or other suitable light-shielding and/or reflective materials. Material. In some embodiments, the material of the light shielding layer BM2 may be molybdenum, molybdenum oxide or stacked layers thereof. In addition, the light-shielding layer BM2 can also be disposed in the slit ST1 , which can shield light from a large angle (such as oblique light) from the outside and avoid light leakage. For example, when the optical sensing device 10 is used as an under-screen fingerprint sensor, stray light interference caused by oblique light to the sensing element SC can be avoided, thereby improving the signal-to-noise ratio of the light to obtain a clearer image. fingerprint image. In addition, it can also avoid the sensed image distortion.

In some embodiments, the optical sensing device 10 may further include a flat layer PL4, the flat layer PL4 may be located on the flat layer PL2, and the flat layer PL4 may be filled in the slit ST2 of the flat layer PL2. In some embodiments, the planar layers PLs, PL1, PL2, PL3, PL4 may include, for example, stacked layers of organic material layers and inorganic material layers, wherein the organic material layers may include, for example, polyimide, polyester, benzocyclo Butene (benzocyclobutene, BCB), polymethylmethacrylate (polymethylmethacrylate, PMMA), polyvinyl phenol (poly(4-vinylphenol), PVP), polyvinyl alcohol (polyvinyl alcohol, PVA), polytetrafluoroethylene (polytetrafluoroethylene) , PTFE), hexamethyldisiloxane (hexamethyldisiloxane, HMDSO) or a stacked layer of at least two of the above materials, but not limited thereto, the inorganic material layer may include, for example, silicon oxide, silicon nitride, silicon oxynitride, Or a stacked layer of at least two of the above materials, but not limited thereto.

In some embodiments, the optical sensing device 10 may further include a light shielding layer BM3, the light shielding layer BM3 may be located on the planar layer PL4, and the light shielding layer BM3 may have an opening O3. The material of the light-shielding layer BM3 can include light-shielding and/or reflective materials, which can be metals, alloys, nitrides of the aforementioned materials, oxides of the aforementioned materials, oxynitrides of the aforementioned materials, or other suitable light-shielding and/or reflective materials. Material. In some embodiments, the material of the light shielding layer BM3 may be molybdenum, molybdenum oxide or stacked layers thereof.

In some embodiments, the optical sensing device 10 may further include a plurality of microlens structures ML, and the microlens structures ML may be located in the opening O3 of the light shielding layer BM3 and arranged correspondingly to the sensing elements SC. For example, a plurality of microlens structures ML can be arranged in an array. In some embodiments, the central axis of each microlens structure ML may overlap with the central axes of the corresponding openings O1 and O2 to further improve the effect of light collimation. In some embodiments, the microlens structure ML may be a symmetrical lenticular lens, an asymmetrical lenticular lens, a plano-convex lens or a concave-convex lens, but not limited thereto.

In some embodiments, the optical sensing device 10 may further include a plurality of counter objects CP, which may belong to the same film layer as the microlens structure ML, but the counter objects CP may not overlap the sensing element SC. In addition, the counter object CP may have various shapes or sizes, such as a semicircle as shown in FIG. 1C or a regular trapezoid as shown in FIG. 1D , but is not limited thereto.

In some embodiments, the optical sensing device 10 may further include a substrate SB2, and a color-resist pattern CR may be disposed on the substrate SB2, and the color-resist pattern CR may be disposed corresponding to a part of the sensing element SC to provide an anti-counterfeit function. For example, the color-resist pattern CR may include a red color-resist pattern Rr, a green color-resist pattern Rg, and a blue color-resist pattern Rb, and the red color-resist pattern Rr, the green color-resist pattern Rg, and the blue color-resist pattern Rb may respectively correspond to different The sensing element SC is set. In this way, the sensing elements SC corresponding to different color resist patterns CR can measure light sensing signals of different wavelength bands to distinguish the authenticity of the sensing object.

In addition, the substrates SB1 and SB2 can be grouped under high vacuum, and after the grouping is completed, the substrate SB2 is opposite to the substrate SB1, so that the sensing element layer SE, the flat layers PL1, PL2 and the color-resist pattern CR can be located on the substrate SB1, Between SB2, the microlens structure ML may be located between the substrate SB2 and the flat layer PL2, and the color resist pattern CR may be located between the microlens structure ML and the substrate SB2. In some embodiments, a spacer SP can also be provided on the substrate SB2, the spacer SP does not overlap the sensing element SC, and the spacer SP can be aligned with the counter object CP on the substrate SB1, so that the substrates SB1 and SB2 After the grouping is completed, a stable distance is maintained, and at the same time, crushing of the microlens structure ML is avoided, thereby improving the sensing resolution of the optical sensing device 10 . In addition, the spacer SP may have various shapes or sizes, such as inverted trapezoids with different sizes as shown in FIG. 1D , but is not limited thereto.

Referring to FIG. 1B , in this embodiment, the orthographic projection of the portion of the slit ST2 located in the non-sensing area NA (for example, at least the portion less than the overlapping frame FG) on the substrate SB1 may present an S-shaped curve pattern. In this way, when the vacuum of the substrates SB1 and SB2 is broken after the assembly is completed, resistance can be formed to the gas rushing into the slit ST2, thereby preventing the sealant from being punctured or disconnected due to the gas shock. In this embodiment, the orthographic projection of the portion of the slit ST2 located in the sensing area SA on the substrate SB1 may present a straight line pattern, but is not limited thereto. In some embodiments, the portion of the slit ST2 located in the sensing area SA may also present an S-shaped curve pattern.

Please refer to FIG. 1A and FIG. 1D at the same time. In this embodiment, the planar layer PL1 may also have a trench T1 located in the non-sensing area NA, and the orthographic projection of the trench T1 on the substrate SB1 may present a circular pattern. In other words, the trench T1 may surround the optical sensing device 10 . In addition, the flat layer PL2 can also have a trench T2 located in the non-sensing area NA, the orthographic projection of the trench T2 on the substrate SB1 can present a ring pattern, and the orthographic projection of the trench T1 on the substrate SB1 can completely overlap the trench Orthographic projection of T2 onto substrate SB1. That is to say, the trench T2 can also surround the optical sensing device 10 . In addition, the slit ST1 may connect the trench T1, and the slit ST2 may connect the trench T2.

In other embodiments, the flat layers PLs, PL3, and PL4 may also have trenches Ts, T3, and T4 respectively, and the orthographic projection of the trench T3 on the substrate SB1 completely overlaps the orthographic projection of the trench T1 on the substrate SB1, and the trench Ts The orthographic projection of the trench T3 on the substrate SB1 completely overlaps the orthographic projection of the trench T3 on the substrate SB1, and the orthographic projection of the trench T2 on the substrate SB1 completely overlaps the orthographic projection of the trench T4 on the substrate SB1, so that the trenches Ts, T1, T2, T3, T4 may form the scribe lines CL shown in FIG. 1A . In this way, when cutting the scribe line CL, the flat layers PLs, PL1, PL2, PL3, and PL4 on both sides of the trenches Ts, T1, T2, T3, and T4 can be aligned with the corresponding spacers SP and countertops CP. It constitutes a well-supported and stable structure that is conducive to cutting, so as to improve cutting quality.

In some embodiments, the planar layers PLs, PL1, PL2, PL3, PL4 can also have trenches Tsa, T1a, T2a, T3a, T4a located in the non-sensing area NA, respectively, wherein the trenches Tsa, T1a, T2a, T3a The orthographic projections of , T4a on the substrate SB1 can be respectively located between the orthographic projections of the grooves Ts, T1, T2, T3, T4 on the substrate SB1 and the orthographic projection of the frame glue FG on the substrate SB1, and the grooves Tsa, T1a, T2a, Orthographic projections of T3a and T4a on the substrate SB1 can overlap each other, so that the flat layers PLs, PL1, PL2, PL3, and PL4 on both sides of the scribe line CL can be aligned with the flat layers PLs, PL1, PL2, PL3, and PL4 located in the sensing area SA. In this way, it is possible to avoid affecting the film layer of the sensing area SA when the cutting line CL cuts.

In some embodiments, as shown in FIG. 1D , multiple sets (for example, three sets in the figure) of spacers SP and countertops CP can be provided at the place where the sealant FG is coated, so as to ensure that the spacer SP and the countertop CP can be formed between the substrate SB1 and the substrate SB2. Stable adhesive structure.

Please refer to FIG. 1E , in this embodiment, the bonding area BA of the optical sensing device 10 can be provided with a plurality of pads PD, and the pads PD can be electrically connected to, for example, an external driving element to transmit the driving signal to the sensing device. Element SC. In addition, a counter object CP can be provided on both sides of the scribe line CL and on the substrate SB1, and stacked black color-resist patterns Rk and red color-resist patterns can be respectively provided on the substrate SB2 corresponding to the pads PD and the counter object CP. Rr, the green color-resist pattern Rg, the blue color-resist pattern Rb and the spacer SP are used to provide auxiliary support when the scribe line CL performs cutting.

In the following, other embodiments of the present invention are continued to be described using FIGS. 2A to 2D , and the element numbers and related contents of the embodiment in FIGS. 1A to 1E are used, wherein the same or similar elements are represented by the same numbers, and Descriptions of the same technical contents are omitted. For the description of the omitted parts, reference may be made to the embodiment shown in FIG. 1A to FIG. 1E , which will not be repeated in the following description.

FIG. 2A is a schematic top view of an optical sensing device 20 according to an embodiment of the invention. FIG. 2B is an enlarged schematic view of the area II of the optical sensing device 20 in FIG. 2A . Fig. 2C is a schematic cross-sectional view taken along the section line D-D' of Fig. 2B. Fig. 2D is a schematic cross-sectional view taken along the section line E-E' of Fig. 2A. In order to make the drawing more concise, FIG. 2A schematically shows the substrate SB1 , the frame glue FG, the slits ST1 , ST2 , ST3 and the scribe lines CL of the optical sensing device 20 , and omits other components.

Please refer to FIG. 2A to FIG. 2D at the same time. The optical sensing device 20 has a sensing area SA and a non-sensing area NA surrounding the sensing area SA, and includes: a substrate SB1; a sensing element layer SE located on the substrate SB1, and including a plurality of sensing elements SC located in the sensing area SA; a flat layer PL1 located on the sensing element layer SE, and having a slit ST1 located in the sensing area SA and a trench T1 located in the non-sensing area NA; and The flat layer PL2 is located on the flat layer PL1 and has a slit ST2 located in the sensing area SA and a trench T2 located in the non-sensing area NA, wherein the slit ST1 and the slit ST2 extending in the same direction are on the substrate SB1 The orthographic projections of do not overlap, and the orthographic projection of the trench T1 on the substrate SB1 overlaps the orthographic projection of the trench T2 on the substrate SB1. In addition, the optical sensing device 20 may further include planar layers PLs, PL3, PL4, light shielding layers BM1, BM2, BM3, an insulating layer IL, a microlens structure ML, a color resist pattern CR and a substrate SB2.

Compared with the optical sensing device 10 shown in FIGS. 1A to 1E , the optical sensing device 20 shown in FIGS. 2A to 2D is different in that: the flat layer PL3 of the optical sensing device 20 also has a slit ST3, and a portion of the slit ST2 of the flat layer PL2 located in the non-sensing area NA may exhibit a zigzag pattern.

In this embodiment, each slit ST3 of the flat layer PL3 can completely penetrate the flat layer PL3 to facilitate stress release. In other words, the slit ST3 may extend from the non-sensing area NA on one side of the optical sensing device 20 through the sensing area SA, and then extend to the non-sensing area NA on the opposite side, so as to divide the flat layer PL3 into two separate parts. blocks, and the light-shielding layer BM1 and the flat layer PL1 can be filled in the slit ST3. For example, in this embodiment, the slit ST3 of the flat layer PL3 may include two slits ST3h extending along the first direction D1 and one slit ST3v extending along the second direction D2, and the first direction D1 and The second directions D2 may be perpendicular to each other, so that the flat layer PL3 may be divided into six separate blocks. However, the extending direction and number of the slits ST3 are not particularly limited. In some embodiments, the number of slits ST3 may be equal to or greater than one. In some embodiments, the extending direction of the slit ST3 may be different from the first direction D1 and the second direction D2.

In addition, in this embodiment, at least the portion of the slit ST2 that is less than the overlapping sealant FG presents a zigzag pattern. In this way, when the vacuum of the substrates SB1 and SB2 is broken after the assembly is completed, resistance can be formed to the gas rushing into the slit ST2, thereby preventing the sealant from being punctured or disconnected due to the gas shock. In some embodiments, the portion of the slit ST2 located in the sensing area SA may also exhibit a zigzag pattern.

Please refer to FIG. 2A and FIG. 2D at the same time. In this embodiment, the flat layer PL3 can also have a trench T3 located in the non-sensing area NA, and the orthographic projection of the trench T3 on the substrate SB1 can overlap the trench T1 and the trench. Orthographic projection of T2 onto substrate SB1. In other words, the trench T3 can surround the optical sensing device 10 , and the orthographic projection of the trench T3 on the substrate SB1 can present a circular pattern. In addition, the slit ST3 may connect the trench T3.

In this embodiment, the planar layers PLs and PL4 are not disposed on both sides of the scribe line CL, and the trenches T1 , T2 , T3 can constitute the scribe line CL shown in FIG. 2A . In some embodiments, the flat layers PL1, PL2, and PL3 can also have trenches T1a, T2a, and T3a respectively located in the non-sensing area NA, wherein the orthographic projections of the trenches, T1a, T2a, and T3a on the substrate SB1 can be located at Between the orthographic projections of the grooves T1, T2, and T3 on the substrate SB1 and the orthographic projection of the sealant FG on the substrate SB1, and the orthographic projections of the grooves T1a, T2a, and T3a on the substrate SB1 can overlap each other, so that both sides of the scribe line CL The planar layers PL1 , PL2 , PL3 in the sensing area SA can be disconnected from the planar layers PL1 , PL2 , PL3 in the sensing area SA, so as to avoid affecting the film layer of the sensing area SA when the scribe line CL performs cutting. In addition, countertops CP can be provided on the flat layer PL2 on both sides of the trench T2, and stacked black color-resist patterns Rk, red color-resist patterns Rr, and green color-resist patterns can be respectively provided on the substrate SB2 corresponding to the countertops CP. The resist pattern Rg, the blue color resist pattern Rb and the spacer SP. In this way, when cutting the scribe line CL, the flat layers PL1, PL2, PL3 and the counter object CP on both sides of the scribe line CL can be matched with the corresponding black color-resist pattern Rk, red color-resist pattern Rr, green color-resist pattern The stacked layers of the pattern Rg, the blue color resist pattern Rb and the spacer SP form a structure with good support and stability, which is favorable for cutting, so as to improve cutting quality.

To sum up, the optical sensing device of the present invention can prevent frame glue puncture or disconnection caused by air shock by making the slits in the flat layer present a curved pattern, thereby improving the production yield of the optical sensing device . In addition, the optical sensing device of the present invention forms cutting lines by overlapping the grooves of the flat layer, which can provide a cutting structure with good support, thereby improving cutting quality.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.

10, 20: Optical sensing device A-A', B-B', C-C', D-D', E-E': hatching BA: junction area BM1, BM2, BM3: shading layer CL: cutting lane CP: Counterpoint CR: color resist pattern D1: the first direction D2: Second direction FG: frame glue I, II: area IL: insulating layer ML: microlens structure NA: non-sensing area O1, O2, O3, OP: opening PD: Pad PLs, PL1, PL2, PL3, PL4: Flat layers Rb: blue color resist pattern Rg: green color resistance pattern Rk: black color resistance pattern Rr: red color resistance pattern SA: sensing area SB1, SB2: Substrate SC: Sensing element SC1: first electrode SC2: photosensitive layer SC3: Second electrode SE: Sensing element layer SP: spacer ST1, ST1h, ST1v: Slits ST2, ST2h, ST2v: Slits ST3, ST3h, ST3v: Slits Ts, T1, T2, T3, T4: Groove Tsa, T1a, T2a, T3a, T4a: Trenches W1, W2: seam width

FIG. 1A is a schematic top view of an optical sensing device 10 according to an embodiment of the invention. FIG. 1B is an enlarged schematic view of a region I of the optical sensing device 10 of FIG. 1A . Fig. 1C is a schematic cross-sectional view taken along the section line A-A' of Fig. 1B. Fig. 1D is a schematic cross-sectional view taken along the section line B-B' of Fig. 1A. Fig. 1E is a schematic cross-sectional view taken along the section line C-C' of Fig. 1A. FIG. 2A is a schematic top view of an optical sensing device 20 according to an embodiment of the invention. FIG. 2B is an enlarged schematic view of the area II of the optical sensing device 20 in FIG. 2A . Fig. 2C is a schematic cross-sectional view taken along the section line D-D' of Fig. 2B. Fig. 2D is a schematic cross-sectional view taken along the section line E-E' of Fig. 2A.

A-A': hatching

CL: cutting lane

FG: frame glue

NA: non-sensing area

SA: sensing area

ST1v, ST2v: slit

W1, W2: seam width

Claims (10)

An optical sensing device having a sensing area and a non-sensing area surrounding the sensing area, and comprising: a substrate; a sensing element layer located on the substrate, and comprising a plurality of sensing elements located in the sensing area a sensing element; a first planar layer, located on the sensing element layer, and having a first slit; and a second planar layer, located on the first planar layer, and having a second slit, wherein, along The first slit extending in the same direction does not overlap with the orthographic projection of the second slit on the substrate, and the part of the second slit located in the non-sensing area is on the orthographic projection of the substrate The projection presents a curved pattern. The optical sensing device according to claim 1, wherein the orthographic projection of the portion of the second slit located in the sensing region on the substrate presents a straight line pattern. The optical sensing device according to claim 1, wherein the first planar layer also has a first groove located in the non-sensing area, and the second planar layer also has a groove located in the non-sensing area. a second groove, and the orthographic projection of the first groove on the substrate overlaps the orthographic projection of the second groove on the substrate. The optical sensing device according to claim 1, wherein the first slit extends through the first flat layer along a first direction and a second direction, and the first direction and the second direction are perpendicular to each other . The optical sensing device according to claim 1, wherein the second slit extends through the second flat layer along a first direction and a second direction, and the first direction and the second direction are perpendicular to each other . The optical sensing device according to claim 1, wherein the curved pattern is an S-shaped curved pattern or a zigzag pattern. The optical sensing device according to claim 1, wherein the total area of the first slit and the second slit accounts for 0.05% to 6% of the total area of the optical sensing device. The optical sensing device according to claim 1, further comprising a first light-shielding layer located on the sensing element layer and having a plurality of first openings, wherein each of the first openings is located on the front side of the substrate The projection overlaps the orthographic projection of each of the sensing elements on the substrate. The optical sensing device according to claim 1, further comprising a second light-shielding layer located on the first flat layer and having a plurality of second openings, wherein each of the second openings is located on the front side of the substrate The projection overlaps the orthographic projection of each of the sensing elements on the substrate. The optical sensing device according to claim 1, further comprising a plurality of microlens structures located on the second flat layer, and each of the microlens structures overlaps each of the sensing elements in the orthographic projection of the substrate Orthographic projection onto the substrate.

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