TWI803606B - 黏著性組合物及黏著膠帶 - Google Patents
黏著性組合物及黏著膠帶 Download PDFInfo
- Publication number
- TWI803606B TWI803606B TW108110915A TW108110915A TWI803606B TW I803606 B TWI803606 B TW I803606B TW 108110915 A TW108110915 A TW 108110915A TW 108110915 A TW108110915 A TW 108110915A TW I803606 B TWI803606 B TW I803606B
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive
- zwitterion
- group
- mass
- tape
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-065869 | 2018-03-29 | ||
JP2018065869 | 2018-03-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202003765A TW202003765A (zh) | 2020-01-16 |
TWI803606B true TWI803606B (zh) | 2023-06-01 |
Family
ID=68061795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108110915A TWI803606B (zh) | 2018-03-29 | 2019-03-28 | 黏著性組合物及黏著膠帶 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7305617B2 (ja) |
TW (1) | TWI803606B (ja) |
WO (1) | WO2019189069A1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20230031940A (ko) * | 2020-07-22 | 2023-03-07 | 미쓰이 가가쿠 토세로 가부시키가이샤 | 백그라인드용 점착성 필름 및 전자 장치의 제조 방법 |
JPWO2022019160A1 (ja) * | 2020-07-22 | 2022-01-27 | ||
WO2022019166A1 (ja) * | 2020-07-22 | 2022-01-27 | 三井化学東セロ株式会社 | 電子装置の製造方法 |
CN117397004A (zh) * | 2021-05-28 | 2024-01-12 | 三井化学东赛璐株式会社 | 电子装置的制造方法 |
KR20240005907A (ko) * | 2021-05-28 | 2024-01-12 | 미쓰이 가가쿠 토세로 가부시키가이샤 | 백그라인드용 점착성 필름 및 전자 장치의 제조 방법 |
EP4350740A1 (en) * | 2021-05-28 | 2024-04-10 | Mitsui Chemicals Tohcello, Inc. | Method for producing electronic device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6106940A (en) * | 1998-03-17 | 2000-08-22 | 3M Innovative Properties Company | Adhesive compositions with zwitterionic tackifiers and plasticizers |
US6133391A (en) * | 1998-03-17 | 2000-10-17 | 3M Innovative Properties Company | Adhesive compositions and adhesive tapes comprising zwitterionic copolymers, and novel zwitterionic copolymers |
CN1395584A (zh) * | 2000-01-24 | 2003-02-05 | 阿托菲纳公司 | 基于阳离子单体的水溶性(共)聚合物盐水分散体,其制备方法及其应用 |
CN1523977A (zh) * | 2000-07-27 | 2004-08-25 | 莱雅公司 | 含有丙烯酸类化合物乳液的可重造型的头发定型组合物 |
WO2017112540A1 (en) * | 2015-12-22 | 2017-06-29 | Novozymes A/S | Processes for producing fermentation products |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3773358B2 (ja) * | 1998-07-01 | 2006-05-10 | 三井化学株式会社 | 半導体ウエハの裏面研削用粘着フィルム及びそれを用いる半導体ウエハの裏面研削方法 |
KR101216783B1 (ko) * | 2010-06-02 | 2012-12-28 | 미쓰이 가가쿠 토세로 가부시키가이샤 | 반도체 웨이퍼 표면 보호용 시트, 및 그것을 이용한 반도체 웨이퍼의 보호 방법과 반도체 장치의 제조 방법 |
WO2017112450A1 (en) * | 2015-12-22 | 2017-06-29 | 3M Innovative Properties Company | Internally incorporated phenolic resins in water-based (meth)acrylate adhesive compositions, pre-adhesive reaction mixtures, methods, and articles |
-
2019
- 2019-03-26 JP JP2020510850A patent/JP7305617B2/ja active Active
- 2019-03-26 WO PCT/JP2019/012675 patent/WO2019189069A1/ja active Application Filing
- 2019-03-28 TW TW108110915A patent/TWI803606B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6106940A (en) * | 1998-03-17 | 2000-08-22 | 3M Innovative Properties Company | Adhesive compositions with zwitterionic tackifiers and plasticizers |
US6133391A (en) * | 1998-03-17 | 2000-10-17 | 3M Innovative Properties Company | Adhesive compositions and adhesive tapes comprising zwitterionic copolymers, and novel zwitterionic copolymers |
CN1395584A (zh) * | 2000-01-24 | 2003-02-05 | 阿托菲纳公司 | 基于阳离子单体的水溶性(共)聚合物盐水分散体,其制备方法及其应用 |
CN1523977A (zh) * | 2000-07-27 | 2004-08-25 | 莱雅公司 | 含有丙烯酸类化合物乳液的可重造型的头发定型组合物 |
WO2017112540A1 (en) * | 2015-12-22 | 2017-06-29 | Novozymes A/S | Processes for producing fermentation products |
Also Published As
Publication number | Publication date |
---|---|
JPWO2019189069A1 (ja) | 2021-03-18 |
WO2019189069A1 (ja) | 2019-10-03 |
TW202003765A (zh) | 2020-01-16 |
JP7305617B2 (ja) | 2023-07-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI803606B (zh) | 黏著性組合物及黏著膠帶 | |
CN109743877B (zh) | 半导体加工用粘着胶带以及半导体装置的制造方法 | |
TWI823944B (zh) | 半導體加工用黏著帶及半導體裝置的製造方法 | |
TWI794450B (zh) | 黏著膠帶及半導體裝置的製造方法 | |
TW202020096A (zh) | 半導體加工用黏著帶及半導體裝置的製造方法 | |
WO2019181731A1 (ja) | 粘着テープおよび半導体装置の製造方法 | |
TWI803605B (zh) | 黏著性組合物及黏著膠帶 | |
TWI801527B (zh) | 半導體裝置的製造方法 | |
JP7326249B2 (ja) | 粘着テープおよび半導体装置の製造方法 | |
KR102642081B1 (ko) | 점착 테이프 및 반도체 장치의 제조 방법 | |
TW201918537A (zh) | 半導體加工用黏著帶以及半導體裝置的製造方法 | |
TWI801520B (zh) | 黏著膠帶的使用方法及半導體裝置的製造方法 | |
JP2013199565A (ja) | 電子部品加工用粘着シートおよび半導体装置の製造方法 | |
TW202237777A (zh) | 半導體加工用黏著膠帶及半導體裝置的製造方法 | |
CN117099185A (zh) | 半导体加工用粘着胶带及半导体装置的制造方法 | |
JP4309671B2 (ja) | 半導体ウェハ裏面研削用粘着フィルム及びそれを用いる半導体ウェハ裏面研削方法 | |
KR20220169929A (ko) | 반도체 웨이퍼 가공용 점착 시트 | |
CN115926633A (zh) | 用于半导体加工用压敏粘合带的压敏粘合剂组合物和使用该压敏粘合剂组合物的压敏粘合带 | |
TW202237771A (zh) | 半導體加工用黏著帶及半導體裝置的製造方法 | |
TW202237772A (zh) | 半導體加工用黏著帶及半導體裝置的製造方法 | |
TW202238700A (zh) | 半導體加工用黏著帶及半導體裝置的製造方法 | |
CN115141568A (zh) | 支撑片、树脂膜形成用复合片、套件、及带树脂膜的芯片的制造方法 |