TWI802403B - Thermal pad bonding equipment - Google Patents

Abstract

The present invention provides a heat-dissipating rubber pad bonding equipment, which includes: a machine is provided with: a conveying flow path, a jig is arranged in the conveying flow path, and an object to be pasted can be displaced and conveyed in the conveying flow path or positioned above the jig; a transfer mechanism is provided with an operating seat that can be driven for displacement; a bonding device is located above the conveying flow path and is located on the operating seat of the transfer mechanism and can be driven for displacement. Displacement; the bonding device is provided with a link and a winding mechanism; wherein, the link is provided with a slide rail and a sliding seat; the winding mechanism is fixed on the sliding seat with a fixed seat, the fixed seat and its The winding mechanism on the top can be driven by the driving part, and move on the sliding rail relative to the linking part; thereby, it is more economical to attach the heat dissipation rubber pad to the object to be pasted.

Description

Thermal pad bonding equipment

The invention relates to a laminating equipment, in particular to a laminating equipment for a heat-dissipating rubber pad that is attached to an object to be pasted in an automated manner.

Press, in the general chip packaging process, glue is often coated on a substrate first, and then a chip is adhered to the substrate, and a layer of heat dissipation glue must be coated on the top of the chip, and then a heat sink is attached to the substrate. The heat dissipation glue covers and covers the chip and the substrate; recently, the heat dissipation glue has been gradually replaced by a heat dissipation pad with a heat dissipation function. The heat dissipation pad usually has double-sided adhesive tape on the upper and lower sides. In the state, the upper and lower surfaces of each heat dissipation rubber pad are coated with a layer of coating, the operator first tears off a layer of coating, and then sticks the surface of the heat dissipation rubber pad without coating on the upper surface of the die , and then tear off the envelope on the other side, and stick the heat sink on the heat dissipation pad.

The prior art replaces the heat dissipation glue with the heat dissipation pad, although it can reduce the heat dissipation The coating process of thermal glue, but artificially attaching each piece of the heat dissipation pad can not improve the efficiency of the process, and the quality of each piece of the heat dissipation pad is different, which is not economical in mass production; An automated method and equipment for first adhering thermal pads to the upper surface of the die on the substrate, and then covering the substrate with heat sinks, has been used, for example, the applicant applied for the announcement number No. 1716906 "Pad Thermal Pad Paste However, although this patent can solve the problem of automatic bonding of heat dissipation pads in the heat sink manufacturing process, there is still room for improvement under the requirements of economic benefits in semiconductor manufacturing technology!

The object of the present invention is to provide an economically beneficial cooling pad bonding equipment.

According to the purpose of the present invention, the heat dissipation rubber pad bonding equipment includes: a machine is provided with: a conveying flow path, a jig is arranged in the conveying flow path, and an object to be pasted can be displaced in the conveying flow path Transporting or positioning above the jig; a transport mechanism with an operating seat that can be driven for displacement; A laminating device is located above the conveying flow path and is located on the operating seat of the transfer mechanism, and can be driven for displacement; the laminating device is provided with a linkage and a belt winding mechanism; wherein the linkage is set There are slide rails and sliding seats; the winding mechanism is fixed on the sliding seat with a fixed seat, and the fixed seat and the winding mechanism on it can be driven by the driving part, and relatively on the sliding rail relative to the linking part For displacement.

In the heat dissipation rubber pad bonding equipment of the embodiment of the present invention, since the tape winding mechanism can be driven by the driving part, it can be displaced relative to the linking part, so that after the tape winding mechanism is installed with the material tape, the heat dissipation glue on the material tape The pad can be completely attached to the upper surface of the object under the simultaneous peeling and attaching process from one side of the tape to the other side, so it is not only suitable for heat dissipation of the die placed on the substrate The bonding of rubber pads can also be applied to closely adjacent crystal grains that have been cut into separate entities on the wafer but have not yet been placed on the substrate. Since each crystal grain is still on the same film layer, it can reduce two The transfer between the pasted objects A increases the bonding time. At the same time, because it is peeled off and pasted at the same time, there is no need to peel off the tape after pasting, which increases the pasting efficiency.

Please refer to Fig. 1, the object A of the first embodiment of the present invention is, for example, the crystal grain on the wafer A1 shown in the figure, the wafer A1 is located on a film layer A2, and the outer periphery of the film layer A2 is provided with a frame sheet frame A3, the stickers A are planned on the wafer A1 and have been cut into individual individuals, and the stickers A are arranged in a matrix on the wafer A1 in a plurality of co-joined and planar The ground is laid adjacent to each other; when carrying out the heat dissipation rubber pad bonding method of the present invention, a piece of heat dissipation rubber pad A4 will be respectively pasted above the object A as shown in Figure 2; The embodiment of the present invention is not limited to only attaching the thermal pad A4 to the crystal grains of the wafer A1 on the film layer A2 in FIG. The fitting of heat dissipation rubber pad A4 is the same as Liz, so I won’t go into details.

Please refer to Fig. 3, the heat dissipation rubber pad A4 is arranged on a strip-shaped strip A41, and is covered above the heat dissipation rubber pad A4 with a coating A42, the material strip A41 and the coating A42 jointly dissipate heat Covered by the rubber pad A4, a plurality of the heat dissipation rubber pads A4 are arranged continuously at equal intervals on the material tape. The inner layer of A42 is adhered, wherein, the two sides of the strip A41 each have a row of a plurality of pinholes A411 arranged continuously at equal intervals, and the two rows of pinholes A411 are separated by a distance, which is greater than the width of the heat dissipation rubber pad A4 and The heat dissipation rubber pad A4 is glued therein, and the material tape A41 can be rolled on the outer diameter of a sleeve A43 with a shaft hole A431 to form a ring shape.

Please refer to Fig. 4, the heat dissipation rubber pad bonding equipment of the first embodiment of the present invention can be implemented as shown in the figure, and it is installed on a machine B: A conveying flow path C, which is composed of a first rail frame C1; a fixture C11 is arranged in the first rail frame C1, and a plurality of circular groove-shaped adsorption parts arranged concentrically are arranged on the fixture C11 C111, each suction portion C111 provides negative pressure suction; the first rail frame C1 is provided with two spaced side frames C112 and two belts C113 that are respectively placed on the opposite inner sides of the two side frames C112 The track C114 formed on the top, the conveying flow path C is formed between the two tracks C114, and can be driven to make the object A composed of the wafer A1 with the frame A3 shown in Figure 1 be placed in the track C114 For X-axis linear displacement transport or positioning above the jig C11; the jig C11 can be lifted up and down so that the adsorption part C111 on the sticking object A is adsorbed for up or down operation; A transfer mechanism D is provided with two gantry rail frames D1 respectively spanning above the conveying flow path C at intervals, and each gantry rail frame D1 includes Z-axis vertical columns D11 respectively located on both sides of the conveying flow path C , and a crossbeam D12 horizontally arranged horizontally on the Y-axis above the two columns D11, each crossbeam D12 is respectively provided with a Y-axis drive member D13 such as a line code; on the two crossbeams D12 of the two gantry rail frames D1 A cantilever D2 that straddles the X-axis together, both ends of the cantilever D2 can be displaced in the Y-axis by the drive of the Y-axis driver D13, and an X-axis driver such as a wire code is provided on the cantilever D2 D21, an operating seat D3 is set on the cantilever D2, and can be driven by the X-axis driving member D21 to perform X-axis displacement; A bonding device E is arranged above the first rail frame C1 of the conveying flow path C, and is located on the operating seat D3 of the transfer mechanism D, and can be driven for X, Y, Z axial displacement.

Please refer to Figures 4 and 5, the jig C11 is provided with a heating element C12 that can indirectly heat each crystal grain on the object A in Figure 1 placed on the jig C11, and the jig C11 is supported by a base C13. The height of the spacer C131 is at an appropriate height, and the base C13 is supported by a plurality of pivot rods C141 on the next link C14 on the table B of the machine table. There are a plurality of pivot sleeves C151 for pivoting the pivot rod C141, and a fixed seat C16 is provided under the fixed member C15 with a plurality of support members C161, and a drive member C17 such as a motor is arranged below the fixed seat C16. C17 uses the driving force of rotation to drive the linkage C14 via a threaded shaft C171, so as to drive the base C13 to support the jig C11 to move up and down.

Please refer to Figures 6 and 7, the bonding device E is provided with a deflection mechanism E1 and a winding mechanism E2; wherein, The deflection mechanism E1 is provided with a seat E11 fixed behind the fixing part E13 through a first hollowed-out section E121 of a plate-shaped linkage part E12 and a second hollowed-out section E131 of a plate-shaped fixing part E13 On a Z-axis rail seat E14 on the side, the fitting device E is fixed on the operation seat D3 of the transfer mechanism D with the Z-axis rail seat E14 and is linked by it; the fixing part E13 is linked with the The fixing part E13 between the parts E12 is provided with a Z-axis slide rail E132 and a sliding seat E133, and the linkage part E12 is fixed on the sliding seat E133 for upward and downward displacement in the Z-axis; the deflection mechanism E1 is also A swing seat E15 extends through the first engraving section E121 of the link E12 and is fixed with the fixing part E13, so that the deflection mechanism E1 is driven by the carrier E11 and the rail seat E14 as the Z axis When moving in the direction of movement, the linkage E12 can be linked together for Z-axis synchronous displacement; the swing seat E15 includes an upper swing seat E151 and a lower swing seat E152 respectively located on and below the carrier E11; between the carrier E11 and The upper swing seat E151 and the lower swing seat E152 of the swing seat E15 are jointly provided with a pivot E153 in series in the Z-axis. Two convex pivoting parts E1511 and a driving part E154 composed of a motor are fixed on the front side of the carrier E11 by a fixing part E1541, and its output shaft E1542 is fixed in the center of a swing arm E1543, and the two sides of the swing arm E1543 are respectively Each of a connecting piece E155 and the two pivoting parts E1511 are pivotally arranged so that the swing arm E1543, the two connecting parts E155, and the two pivoting parts E1511 jointly form a four-bar linkage mechanism. When the driving part E154 drives the output shaft E1542 When rotating, the swing arm E1543 fixed to the output shaft E1542 will swing horizontally, so that the two connecting parts E155 pivoted on both sides form a forward and backward swing, so that the two pivoting parts E1511 can move the swing seat The upper swing seat E151 of E15 makes the link E12 fixedly installed with the upper swing seat E151 and the lower swing seat E152 take the pivot E153 as the axis to move the components on it to swing; The linkage part E12 extends horizontally to one side in the X-axis, and forms an upper linkage part E123 and a lower linkage part E124 separated by a hollow groove E122. The upper linkage part E123 has a longer length in the X-axis The first slide rail E1231, and the lower linkage part E124 are provided with a shorter second slide rail E1241, the first slide rail E1231 is provided with a first slide seat E1232, and the second slide rail E1241 is provided with a second Sliding seat E1242; the winding mechanism E2 is fixed on the first sliding seat E1232 and the second sliding seat E1242 with a plate-shaped fixing seat E21, and the inter-slot E122 of the linkage E12 is provided with a driving part E125, which A threaded shaft E1251 is screwed through a nut seat E211 on the rear side of the fixed seat E21 and then pivoted on a fixed pivot seat E1252 on the linkage E12, so that the fixed seat E21 and the winding mechanism E2 on it It can be driven by the driving part E125, and relative to the connecting part E12, it can make an X-axis displacement on the first sliding rail E1231 and the second sliding rail E1241; When each member is swayed, it will also be swayed by the interlocking fixed seat E21 and the winding mechanism E2 on it.

The winding mechanism E2 is provided with: A material pulley E22 is located on the right side of the fixed seat E21, and can be rotated by a drive member E221 on the rear side of the fixed seat E21 and a belt E222. the strip A41; A first reel E23 is located on the upper right side of the fixed seat E21, and is located above the material pulley E22. It is driven by the belt E232 driven by a driving part E231 on the rear side of the fixed seat E21 and can be rotated. , for rolling up the envelope A42; A second reel E24 is located on the left side of the upper side of the fixed seat E21, and is located above the material pulley E22. It is driven by the belt E242 driven by a driving part E241 on the rear side of the fixed seat E21 and can be rotated. , used to roll up the envelope A42 after the thermal pad A4 has been extracted. A drive mechanism E25 is located below the front side surface of the fixed base E21. The drive mechanism E25 is provided with two needle wheels E252 coaxially nested in a drive shaft E251 in the Y-axis at intervals. The drive shaft E251 is supported by the fixed Driven by a driver E253 on the front side of the seat E21, the strip A41 is pulled and driven by the two needle wheels E252; An abutting piece E26 is disposed near the front surface of the fixing base E21 and below the driving mechanism E25. The abutting piece E26 is arranged in the Y-axis direction, with one end set on the fixing base E21 and the other end suspended in the air.

Please refer to Figures 7 and 8, after the envelope A42 of the material tape A41 is first rolled and peeled off by the first reel E23, the material tape A41 with the heat dissipation rubber pad A4 attached thereon is hung on the drive mechanism The second pin wheel E252 of E25 is rolled by the second pin wheel E252; when the material tape A41 is wound under the abutting part E26, the material tape A41 leans against the abutting part E26, the heat dissipation rubber pad A4 faces downward and It is the other side of the material tape A41 opposite to the abutting part E26; the material tape A41 forms an input side A412 and an output side A413 with the abutting part E26 as a boundary, and the abutting part E26 includes a A slanted first side E261 on the input side A412 of the belt A41, and a second slanted side E262 on the output side A413, and the first side E261 and the second side E262 of the abutting member E26 face downward An abutment portion E263 with a sharp angle is formed at the intersection, and the abutment portion E263 has an acute angle α1 less than ninety degrees, and an arc-shaped bottom edge E264 is formed at the end of the abutment portion E263. The strip A41 The input side A412 and the output side A413 form an acute angle α2 less than ninety degrees, wherein the acute angle α2 is greater than the acute angle α1, and the input side A412 of the material tape A41 and the surface of the object A are input in an oblique manner, The angle of inclination is an acute angle α3 less than ninety degrees.

In the implementation of the first embodiment of the present invention, when the wafer A1 is still located on the film layer A2 after the wafer A1 is cut, the crystal grain A4 is pasted on the heat dissipation pad A4. When the object A is transported to the top of the jig C11 (as shown in FIG. 9 ) by the conveying channel formed by the first rail frame C1, the jig C11 is raised and the outer periphery is provided with the film of the frame A3 The layer A2 is adsorbed as the top, and the crystal grains on the film layer A2 as the object A are moved up to an appropriate height for positioning, and the heating element C12 indirectly heats the object placed on the jig C11 A; The transfer mechanism D uses the operating seat D3 to drive the Z-axis rail seat E14 (Figure 7) of the deflection mechanism E1 to make a large displacement, so that the deflection mechanism E1 and the tape winding mechanism E2 are included. The sticking device E is moved to the sticking part E26 just above the object A, and the sticking part E263 (Fig. 9) is correspondingly located above the close side of the sticking object A, the sticking device E After alignment inspection by means of an alignment inspection device (such as a CCD lens, not shown in the figure), the deflection mechanism E1 links the tape winding mechanism E2 to deflect the alignment, and then descends to attach the heat dissipation glue with the abutment part E26 Pad for homework on A4.

In the first embodiment of the present invention, when laminating, the tape A41 with the heat dissipation rubber pad A4 attached is turned from the input side A412 to the bottom edge E264 of the abutting part E263 of the abutting part E26 to the output side A413, the heat dissipation pad A4 is peeled off from the strip A41 of the output side A413; the stripped side of the heat dissipation pad A4 is touched by the bottom edge E264 to the upper surface of the object A in a line contact manner. Paste on the surface of the object A; then make the abutting member E26 move horizontally toward the input side of the material tape A41, so that the heat dissipation pad A4 is peeled off from the material tape A41 at the same time, and the process of pasting Going down to the other side, it is completely attached to the upper surface of the object A; after the entire heat dissipation pad A4 is completely attached to the upper surface of the object A, the abutting part E263 of the abutting part E26 The bottom edge E264 is moved away from the upper surface of the object A; the affixed part E26 is horizontally displaced toward the input side A412 of the material tape A41, so that the deflection mechanism E1 and the affixed part E26 are deflected. The tape-winding mechanism E2 of the abutting member E26 is set to perform a relative displacement. In this way, a plurality of objects A in the same row on the wafer A1 are all displaced by a small displacement, and a displacement of a large displacement is performed. The operating seat D3 of the transfer mechanism D can be kept in position without displacement, so as to make more efficient planning.

Please refer to Figures 10 and 11, the second embodiment of the present invention can use a semicircular cross-section abutting part F under the same mechanism and device as the first embodiment, the abutting part F includes a material belt A41 input side A412 a first side F1 of an inclined plane, and a second side F2 of an arc shape near the output side A413, and the first side F1 and the second side F2 of the abutting member F face An abutment portion F3 with an acute angle is formed at the lower intersection, and a horizontal bottom edge F31 is formed at the end of the abutment portion F3; wherein, the second side F2 of the abutment portion F3 has a diameter of 100 degree, the input side A412 and the output side A413 of the material strip A41 form an acute angle β1 less than ninety degrees, and the input side A412 of the material strip A41 and the surface of the object A are input in an inclined manner, The angle of inclination is an acute angle β2 less than ninety degrees; one side of the heat dissipation rubber pad A4 is pressed against the upper surface of the object A by the bottom edge F31, so that the abutting member F is moved to the other side of the heat dissipation rubber pad A4 One side (that is, toward the direction of the input side A412) is horizontally displaced, so that the heat dissipation rubber pad A4 is attached to the upper surface of the object A to be attached to the object A under the process of peeling off and attaching at the same time. surface; then make the sticking member F3 move horizontally toward the input side of the material tape A41, so that the heat dissipation pad A4 is completely pasted from the material tape A41 from one side to the other side under the process of simultaneous peeling and sticking Cover the upper surface of the object A.

In the laminating equipment for heat dissipation rubber pads according to the embodiment of the present invention, since the tape winding mechanism E2 can be driven by the driving part E125, and is displaced relative to the linkage part E12, after the tape winding mechanism E2 is set with the material tape A41, the material tape The thermal pad A4 on the A41 can be completely attached to the upper surface of the object A from the tape A41 from one side to the other side under the process of peeling off and attaching at the same time. The die placed on the substrate is used as the bonding of the heat dissipation pad A4, and it is also applicable to the dies that are closely adjacent to each other, for example, the dies that have been cut into individual entities on the wafer A1 but have not yet been placed on the substrate. It is also on the same film layer A2, so it can reduce the transmission between the two objects A and increase the bonding time. At the same time, because it is peeled off and applied at the same time, there is no need to peel off the material tape A41 after application, increasing the bonding time. efficiency.

But what is described above is only a preferred embodiment of the present invention, and should not be used in this way. The implementation scope of the present invention is limited, that is, all simple equivalent changes and modifications made according to the patent scope of the present invention and the description of the invention are still within the scope covered by the patent of the present invention.

A: Stickers A1: Wafer A2: film layer A3: border A4: Thermal pad A41: Tape A411: Pinhole A412: Input side A413: Output side A42: Envelope A43: Sleeve A431: shaft hole B: machine C: delivery flow path C1: The first rail frame C11: Jigs C111: adsorption part C112: side frame C113: belt C114: track C12: heating element C13: base C131: spacer C14: linkage C141: Pivot C15:Fixer C151: Pivot sleeve C16: Fixing seat C161: Supports C17: Driver C171: Shaft D: transfer mechanism D1: Gantry rail frame D11: column D12: Beam D13: Y-axis driving part D2: cantilever D21: X-axis driving part D3: Operating seat E: Fitting device E1: deflection mechanism E11: carrier E12: linkage E121: The first engraving interval E122: between slots E123: Upper linking part E1231: The first slide rail E1232: The first sliding seat E124: Lower linking part E1241: Second slide rail E1242: The second sliding seat E125: Driver E1251: shaft E13:Fixer E131: The second engraving interval E132: slide rail E133: sliding seat E14: Z-axis rail seat E15: Seat placement E151: Top swing seat E1511: Pivot E152: Hem seat E153: Pivot E154: Driver E1541: Fixing parts E1542: output shaft E1543: swing arm E155: Connector E2: Take-up mechanism E21: Fixing seat E22: material pulley E221: Driver E222: belt E23: First reel E231: Driver E232: belt E24: Second reel E241: Driver E242: belt E25: Drive Mechanism E251: Drive shaft E252: pin wheel E26: stickers E261: First side E262: Second side E263: Adhesive part E264: bottom edge F: stickers F1: first side F2: second side F3: Adhesive part α1: acute angle α2: acute angle α3: Acute angle β1: acute angle β2: acute angle

Fig. 1 is a schematic diagram of an object to be stuck on a film layer in the first embodiment of the present invention. Fig. 2 is an exploded schematic view of the sticker and the heat dissipation pad in the first embodiment of the present invention. FIG. 3 is a three-dimensional schematic diagram of a roll formed from a material tape provided with a heat dissipation rubber pad in the first embodiment of the present invention. Fig. 4 is a three-dimensional schematic diagram of the bonding equipment in the first embodiment of the present invention. Fig. 5 is a schematic diagram of the jig and the lower mechanism in the first embodiment of the present invention. Fig. 6 is a three-dimensional exploded schematic view of the bonding device according to the first embodiment of the present invention. Fig. 7 is a schematic perspective view of another side of the laminating device in the first embodiment of the present invention. Fig. 8 is a schematic diagram of the operation of attaching the heat dissipation rubber pad in the first embodiment of the present invention. Fig. 9 is a schematic diagram of the operation of the bonding equipment in the first embodiment of the present invention. Fig. 10 is a schematic perspective view of a bonding device according to a second embodiment of the present invention. Fig. 11 is a schematic diagram of the operation of attaching the heat dissipation rubber pad in the second embodiment of the present invention.

B: machine

C: delivery flow path

C1: The first rail frame

C11: Jigs

C111: adsorption part

C112: side frame

C113: belt

C114: track

D: transfer mechanism

D1: Gantry rail frame

D11: column

D12: Beam

D13: Y-axis driving part

D2: cantilever

D21: X-axis driving part

D3: Operating seat

E: Fitting device

Claims (10)

A cooling pad bonding equipment, comprising: On one machine there are: A conveying flow path, in which a jig is arranged, and an object to be pasted can be moved in the conveying flow path or positioned above the jig; A transfer mechanism, equipped with an operating seat that can be driven for displacement; A laminating device is located above the conveying flow path and is located on the operating seat of the transfer mechanism, and can be driven to be displaced; the laminating device is provided with a linkage and a tape winding mechanism; wherein, The linkage is provided with a slide rail and a sliding seat; the tape winding mechanism is fixed on the slide seat with a fixed seat, and the tape winding mechanism on the fixed seat and the tape can be driven by the driving member, and relatively to the linkage. Displacement on the slide rail. As described in claim 1, the heat dissipation rubber pad bonding equipment, wherein, the bonding device is provided with a deflection mechanism, and the deflection mechanism is provided with a carrier passing through a first engraved section of the linkage part and a second part of a fixed part. The section is hollowed out and fixed on a Z-axis rail seat on the rear side of the fixing member. According to claim 1, the heat dissipation rubber pad laminating equipment, wherein, the linking member can pivot with a pivot as the axis to link the components on it to swing, and link the fixed seat and the winding mechanism on it to swing. put. According to claim 1, the heat dissipation rubber pad bonding equipment, wherein, the winding mechanism is provided with a bonding part, and the bonding part is arranged in the Y-axis direction, and one end of the bonding part is set on the fixing seat, and the other end is suspended in the air. According to claim item 1, the heat dissipation rubber pad bonding equipment, wherein, the tape take-up mechanism is provided with a material belt wheel sleeved with a ring-shaped material tape, and is provided with a sticking part, and the material tape is wound under the sticking part and An input side and an output side are formed with the contact piece as a boundary, and the input side and the output side of the material tape form an acute angle less than 90 degrees. According to claim 5, when the tape winding mechanism is driven by the driving part to move on the slide rail relative to the linking part, the contacting part is moved toward the input side of the tape Horizontal displacement. According to claim item 5, the heat dissipation rubber pad bonding equipment, wherein the input side of the material tape is input in an oblique manner to the surface of the object to be attached, and the inclination angle is an acute angle less than ninety degrees. As described in claim item 5, the heat dissipation rubber pad bonding equipment, wherein, the bonding member includes a A slanted first side on the input side of the material strip, and a slanted second side on the output side, and an acute-angled abutment portion is formed at the downward intersection of the first side and the second side. , the abutting portion has an acute angle less than ninety degrees. As described in Claim 5, the heat dissipation rubber pad bonding equipment, wherein, the heat dissipation rubber pad is arranged on a long strip-shaped material belt, and the material belt is conveyed from the input side through a sticking part of the sticking part When one of the bottom edges turns to the output side, the thermal pad is peeled off from the material tape on the output side. As described in Claim 9, the heat dissipating rubber pad sticking equipment, wherein, the peeled side of the heat dissipating rubber pad is pressed against the upper surface of the object to be pasted by the bottom edge in a line contact manner, so as to be attached to the surface of the pasted object.

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