TWI802063B - Cutting device, and method of manufacturing cut product - Google Patents

Abstract

The problem to be solved by the present invention is to provide a cutting device or the like capable of suppressing variations in the depth of grooves formed in an object to be cut by half-cutting. In order to solve this problem, the cutting device of the present invention includes a cutting mechanism. The cutting mechanism has a blade for cutting an object to be cut. A blade has a first side and a second side. The cutting device further includes a first pressing mechanism and a second pressing mechanism. The first pushing mechanism is arranged at a position opposite to the first side. The second pushing mechanism is arranged at a position opposite to the second side. Each of the first pressing mechanism and the second pressing mechanism is configured to press the object to be cut from above to below. When half-cutting is applied, the relative positional relationship between the first pressing mechanism and the second pressing mechanism and the object to be cut changes in the same manner as the relative positional relationship between the cutting mechanism and the object to be cut.

Description

Cutting device, and method of manufacturing cut product

The present invention relates to a cutting device and a method for manufacturing a cut product.

Japanese Patent Application Publication No. 2008-112961 (Patent Document 1) discloses a method for manufacturing a semiconductor device. In this manufacturing method, a half cut is applied by a dicing saw, whereby a groove is formed on the lead frame. Thereafter, a plating layer is formed on the groove, and the lead frame is cut along the groove by a narrow dicing saw. Thereby, a semiconductor device cut into individual sheets can be obtained (see Patent Document 1).

[Prior Art Literature] (patent documents) Patent Document 1: Japanese Patent Laid-Open No. 2008-112961

[Problem to be solved by the invention] Objects to be cut such as lead frames may warp. If half-cutting is applied to the object to be cut in a state along the object to be cut, the depth of the groove formed on the object to be cut will vary. In the above-mentioned Patent Document 1, a solution to such a problem is not disclosed.

The present invention was made to solve such problems, and an object of the present invention is to provide a cutting device and a method of manufacturing a cut product capable of reducing variations in the depth of grooves formed on an object to be cut by half-cutting.

[Technical means to solve the problem] A cutting device according to an aspect of the present invention is configured to give a half-cut through the object to be cut in the thickness direction of the object to be cut which is formed of resin. This cutting device includes a cutting mechanism. The cutting mechanism has a blade for cutting an object to be cut. A blade has a first side and a second side. The cutting device further includes a first pressing mechanism and a second pressing mechanism. The first pushing mechanism is arranged at a position opposite to the first side. The second pushing mechanism is arranged at a position opposite to the second side. Each of the first pressing mechanism and the second pressing mechanism is configured to press the object to be cut from above to below. When half-cutting is applied, the relative positional relationship between the first pressing mechanism and the second pressing mechanism and the object to be cut changes in the same manner as the relative positional relationship between the cutting mechanism and the object to be cut.

A method of manufacturing a cut product according to another aspect of the present invention is a method of manufacturing a cut product using the above-mentioned cutting device. The method of manufacturing the cut-off product includes the steps of: preparing a cutting device equipped with a blade of a first thickness; applying a half-cut through to an object to be cut; replacing the blade with a blade of a second thickness, the second thickness being smaller than the first thickness 1. The thickness is thinner; and, the object to be cut is cut along the position where the half-cut is applied.

[Effect of the invention] According to the present invention, it is possible to provide a cutting device and a method of manufacturing a cut product capable of reducing variations in the depth of grooves formed in an object to be cut by half-cutting.

Hereinafter, an embodiment (hereinafter also referred to as "the present embodiment") related to one aspect of the present invention will be described in detail with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same or a corresponding part in a figure, and the description is not repeated. In addition, for easy understanding, appropriate objects are omitted or exaggerated and schematically drawn in each drawing. In addition, the directions indicated by the arrows in the drawings are common to the drawings.

[1. Embodiment 1] ＜1-1. Overview＞ Fig. 1 is a diagram schematically showing a part of a plane of a cutting device 10 according to the first embodiment. As shown in FIG. 1 , the cutting device 10 includes a cutting table 30 and a cutting mechanism 40 .

The cutting table 30 holds the package substrate 20 to be cut. The cutting table 30 includes a holding member 31 , a rotating mechanism 32 , and a moving mechanism 33 . The holding member 31 sucks the package substrate 20 from below, thereby holding the package substrate 20 . The rotation mechanism 32 can rotate the holding member 31 in the θ direction in the figure. The moving mechanism 33 moves the holding member 31 along the Y-axis in the figure. In addition, in the package substrate 20, a substrate or a lead frame to which a semiconductor chip is connected is encapsulated by resin. In addition, the package substrate 20 used for the manufacture of the semiconductor package 50 demonstrated with reference to FIG. 2 mentioned later is the package substrate using the lead frame as an example.

The cutting mechanism 40 includes a blade 41 . The cutting mechanism 40 cuts the package substrate 20 by the blade 41 , thereby cutting the package substrate 20 into a plurality of semiconductor packages of individual sheets. The cutting mechanism 40 is movable along the X-axis and the Z-axis in the figure. In addition, the cutting device 10 may be constituted by a double-spindle having two cutting mechanisms 40 , or may be constituted by a single-spindle having one cutting mechanism 40 .

Furthermore, the cutting mechanism 40 may be configured to form a groove in the package substrate 20 by removing a part of the package substrate 20 with the blade 41 . That is, the cutting mechanism 40 may give a half-cut through the package substrate 20 in the thickness direction of the package substrate 20 . The concept of the term "cutting" included in the name of the cutting device 10 (cutting device) includes separating the cutting object into plural pieces and removing a part of the cutting object.

The cutting device 10 is, for example, capable of manufacturing a wettable flank QFN (Quad Flat No-leaded) such as a semiconductor package 50 as an example of a cut product, and has a function for The package substrate 20 performs a half-cut-through function. Next, the semiconductor package 50 and a method of manufacturing the semiconductor package 50 will be described.

FIG. 2 is a perspective view schematically showing a semiconductor package 50 . As shown in FIG. 2 , in the semiconductor package 50 , a step portion 51 is formed at the boundary portion between the top surface (the surface on which the terminals 52 are formed) and the side surface in the drawing. When surface mounting is performed on the semiconductor package 50 , solder will enter the step portion 51 . Thereby, a three-dimensional solder connection structure can be realized with respect to the semiconductor package 50 . In addition, since the solder enters the step portion 51 , the solder seam can be easily observed from the side of the semiconductor package 50 in the visual inspection after assembly.

FIG. 3 is a diagram for explaining a method of forming the step portion 51 . Referring to FIG. 3 , in order to form the step portion 51 , first, a groove G1 is formed on the package substrate 20 by the blade 41 having a first thickness. Thereafter, the package substrate 20 is cut at the position P1 by the blade 41 having a second thickness (thinner than the first thickness), thereby cutting the package substrate 20 into individual sheets. Thereby, the some semiconductor package 50 in which the step part 51 was formed is manufactured.

As described above, various advantages exist in the semiconductor package 50 . Forming the level difference portion 51 in the semiconductor package 50 can be realized by applying a half-cut through. The cutting device 10 has a function of half-cutting through the package substrate 20 in order to manufacture the semiconductor package 50 , for example.

When applying the half-cut through to the package substrate 20, it is important to form grooves with a uniform depth on the package substrate 20 as much as possible. In the cutting device 10 , an ingenuity is applied to suppress variation in the depth of the groove formed by half-cutting. Hereinafter, the configuration and the like of the cutting device 10 will be described in detail.

<1-2. Configuration of cutting device> Fig. 4 is a schematic diagram showing a part of the cutting device 10 from the side. As shown in FIG. 4 , the cutting device 10 includes a cutting table 30 , a cutting mechanism 40 , a pressing mechanism 60 , and a discharge mechanism 70 .

The pressing mechanism 60 and the discharge mechanism 70 are respectively attached to the cutting mechanism 40 . The pressing mechanism 60 is attached to the rear of the cutting mechanism 40 , and the discharge mechanism 70 is attached to the front of the cutting mechanism 40 . In addition, the "front" of the cutting mechanism 40 is the direction in which the cutting table 30 enters when the cutting table 30 moves to a position below the blade 41 . The blade 41 is clamped in the Y-axis direction by the pressing mechanism 60 and the discharge mechanism 70 . The pressing mechanism 60 is provided at a position opposite to the discharge mechanism 70 with respect to the blade 41 . Thereby, both the pressing mechanism 60 and the discharge mechanism 70 can be attached to the cutting mechanism 40 .

The pressing mechanism 60 is configured to be able to press the package substrate 20 placed on the cutting table 30 from above to below. The configuration of the pressing mechanism 60 and the reason for providing the pressing mechanism 60 will be described in detail later.

The discharge mechanism 70 includes three nozzles (for example, a first nozzle, a second nozzle, and a third nozzle) configured to discharge the machining fluid individually. The first nozzle discharges the machining fluid toward the blade 41 . The second nozzle discharges the machining fluid toward the contact portion (cut portion) between the blade 41 and the package substrate 20 . The third nozzle discharges the machining liquid toward unnecessary scrap generated when the package substrate 20 is cut. In addition, the discharge mechanism 70 does not necessarily have to include three nozzles. For example, the discharge mechanism 70 may be composed of one or two nozzles, or may be composed of four or more nozzles. The discharge mechanism 70 discharges the machining fluid supplied from a water storage tank or a water pipe, for example. When the machining fluid is sprayed onto the rotating blade 41 by the ejection mechanism 70, a large amount of machining fluid contacts the blade 41, and the blade 41 can be cooled more effectively. In addition, when the machining fluid is sprayed onto the cutting portion, a large amount of machining fluid is supplied to the machining point, heat generated during cutting can be suppressed, and the package substrate 20 can be properly cut. In addition, by spraying the machining liquid onto the sap material, it is possible to remove the sap material remaining on the cutting table 30 .

FIG. 5 is a schematic view showing the relationship between the pressing mechanism 60 and the blade 41 from the side. FIG. 6 is a plan view schematically showing the pressing mechanism 60 . Fig. 7 is a schematic view showing the relationship between the pressing mechanism 60 and the blade 41 from the front.

Referring to FIG. 5 , FIG. 6 and FIG. 7 , the pushing mechanism 60 includes a first pushing mechanism 61 and a second pushing mechanism 62 . The first pressing mechanism 61 is provided at a position close to one side surface of the blade 41 , and the second pressing mechanism 62 is provided at a position close to the other side surface of the blade 41 . When the package substrate 20 is cut by the blade 41 , the blade 41 is located in a region sandwiched between the first pressing mechanism 61 and the second pressing mechanism 62 . That is, when cutting the package substrate 20 by the blade 41, in a side view, a part of the first pressing mechanism 61 faces one side of the blade, and a part of the second pressing mechanism 62 faces the other side of the blade. One side faces.

The first pressing mechanism 61 and the second pressing mechanism 62 are each configured to press the package substrate 20 from above to below (see FIG. 1 ). The first pressing mechanism 61 and the second pressing mechanism 62 each include a leaf spring 610 , a pressing unit 620 , base members 630 , 640 , and screws 624 , 625 , 631 , 633 , 634 .

The base members 630, 640, 650 are each made of metal, for example. The base member 650 is a plate-shaped member extending in the height direction, and is attached to the rear end of the cutting mechanism 40 . Holes H1 and H2 are respectively formed on both side surfaces of the base member 650 . Each of the holes H1 and H2 is a long hole in the vertical direction. The base member 650 is fixed to the cutting mechanism 40 by using screws to pass through the holes H1, H2. In the holes H1 , H2 , the position in the height direction of the pressing mechanism 60 can be changed by changing the position in the height direction of the screw locking, respectively.

The base member 640 is a member extending forward from the lower end of the base member 650 and is attached to the base member 650 . The base member 630 is a rod-shaped member attached to the top surface of the base member 640 and extends forward from the base member 640 . Screw holes are respectively formed in the base members 630 , 640 , and the base members 630 , 640 are integrally locked with screws 633 , 634 . The hole H3 formed in each of the base members 630, 640 has a long shape in the front-back direction, and the position of the roller 622 in the front-back direction can be adjusted by adjusting the screw-locked position.

A leaf spring 610 extending obliquely downward is attached to the bottom surface of the base member 630 . The leaf spring 610 is made of metal, for example. Screw holes are formed in the leaf spring 610 so that the base member 630 and the leaf spring 610 are integrally locked together with screws 632 . The screw 631 passes through the screw hole of the base member 630 and presses the leaf spring 610 from above. The position pushed by the screw 631 in the plate spring 610 is located in front of the position screwed by the screw 632 . Adjust the position of the screw 631 in the height direction, thereby adjusting the bending degree of the leaf spring 610 . Thereby, the elastic force of the leaf spring 610 is adjusted.

At the front end portion of the leaf spring 610, a pressing unit 620 is attached. The pressing unit 620 includes a base member 621 , a roller 622 , a rotating shaft 623 , and screws 624 and 625 . The base member 621 is made of metal or resin, for example. Screw holes are formed in the base member 621 , and the base member 621 and the leaf spring 610 are integrally locked with screws 624 and 625 . A concave portion is formed at the front end portion of the base member 621 in plan view, and the roller 622 is located in the concave portion. The roller 622 is attached to the base member 621 via a rotation shaft 623 and is rotatable relative to the base member 621 . The rotation shaft 623 extends in the X-axis direction (thickness direction of the blade 41). The roller 622 is made of rubber or resin, for example. The roller 622 is an example of the "pressing member" of the present invention. By using the rubber or resin-like elastic roller 622 , it is possible to reduce markings on the package substrate 20 caused by the pressing of the roller 622 . Also, it is possible to reduce burrs that are generated when half-cutting through to be crushed.

In a state where the package substrate 20 is not present under the roller 622 , the lower end of the roller 622 is located below the imaginary plane Z1 representing the position of the lower end of the blade 41 . Therefore, when the package substrate 20 is cut, the lower end of the roller 622 comes to a higher position than the lower end of the blade 41 , so the roller 622 presses the package substrate 20 down by the elastic force of the leaf spring 610 .

FIG. 8 is a schematic diagram for explaining the positional relationship between the blade 41 and the roller 622 when a half-cut is applied to the package substrate 20 . As shown in FIG. 8 , when a half cut is applied to the package substrate 20 , the blade 41 cuts off a part of the package substrate 20 . Therefore, the blade 41 enters below the top surface of the package substrate 20 in the height direction. On the other hand, the roller 622 presses down the top surface of the packaging substrate 20 during the half-cut-through formation. Therefore, the lower end of the roller 622 comes to a higher position than the lower end of the blade 41 .

Also, the position of the rotation center of the roller 622 in the Y-axis direction (position P6 ) is located in front of the position of the rotation center of the blade 41 in the Y-axis direction (position P5 ). This is because the cutting start position (position P7 ) of the blade 41 into the package substrate 20 is located in front of the position (position P5 ) of the rotation center of the blade 41 in the Y-axis direction. According to the cutting device 10 , the position of the rotation center of the roller 622 is located in front of the position of the rotation center of the blade 41 , so the package substrate 20 can be pressed by the roller 622 at a position closer to the cutting start position. Next, the reason why the pressing device 60 is provided in the cutting device 10 will be described.

<1-3. The reason for installing the pressing device> Fig. 9 is a schematic diagram showing a part of the cutting device 10X, which is the object of comparison, from the side. As shown in Fig. 9, the cutting device 10X does not have a pressing device. For example, the package substrate 20 may warp. If a half-cut is applied to the package substrate 20 in a state where the package substrate 20 is warped, there will be a problem that the depth of the groove varies depending on the position. For example, the groove formed at the position P3 is deeper than the groove formed at the position P2, and the groove formed at the position P4 is deeper than the groove formed at the position P3. In order to solve such a problem, the cutting device 10 according to the first embodiment is provided with a pressing device 60 .

Fig. 10 is a diagram for explaining the effectiveness of the pressing mechanism 60 in the cutting device 10 according to the first embodiment. As shown in FIG. 10 , in the cutting device 10 , when a half-cut is applied to the package substrate 20 , the position adjacent to the start of cutting of the package substrate 20 is pressed down by the roller 622 . The half-cut through is applied to the package substrate 20 in a state of being pressed back and forth by the rollers 622 , thereby suppressing warpage of the package substrate 20 . Therefore, according to the cutting device 10 , the half-cut through the package substrate 20 is performed while the warp of the package substrate 20 is suppressed, so that the variation in the depth of the groove formed by the half-cut through can be suppressed.

FIG. 11 is a schematic view showing the relationship between the pressing mechanism 60 and the blade 41 in a state in which the diameter of the blade 41 is reduced from the side. As shown in FIG. 11, even if the diameter of the blade 41 becomes smaller, the roller 622 is energized downward by the elastic force of the plate spring 610, so that the object to be cut can be pressed from above to below.

FIG. 12 is a schematic diagram for explaining the operation of the pressing mechanism 60 . As shown in FIG. 12, a rotating shaft J1 is provided on a part of the cutting mechanism 40 to which the pressing mechanism 60 is attached, and this part of the cutting mechanism 40 is configured to be rotatable. That is, a part of the cutting mechanism 40 is rotatable, whereby the pressing mechanism 60 can be avoided from the position overlapping the blade 41 in a side view. As a result, the blade 41 can be easily exchanged. In this way, it can be said that the cutting device 10 according to the first embodiment includes an avoiding mechanism, and the rotating shaft J1 included in the avoiding mechanism is configured so that the pressing mechanism 60 can be avoided so that it cannot be seen from the side view. The position overlapping with the blade 41.

<1-4. Operation of cutting device> For example, the semiconductor package 50 is manufactured by the following method (see FIG. 2 ). A cutting edge 41 having a first thickness is attached to the cutting device 10 .

Thereafter, in the cutting device 10 , the cutting table 30 enters below the blade 41 from the front of the cutting mechanism 40 . With the entry of the cutting table 30 , the pressing mechanism 60 pushes the package substrate 20 on the cutting table 30 from above to below, and starts half-cutting through the package substrate 20 by the blade 41 . The cutting mechanism 40 is equipped with a pushing mechanism 60, so when half-cutting is applied, the relative positional relationship between the pushing mechanism 60 and the packaging substrate 20 is the same as the relative positional relationship between the cutting mechanism 40 and the packaging substrate 20. Ways change.

When the half-cutting of the package substrate 20 is completed, the blade 41 is replaced in the cutting device 10 . The replaced blade 41 has a second thickness (thinner than the first thickness).

Thereafter, in the cutting device 10 , the cutting table 30 enters below the blade 41 from the front of the cutting mechanism 40 . As the cutting table 30 enters, the pressing mechanism 60 pushes the package substrate 20 on the cutting table 30 from above to below, and starts cutting the package substrate 20 by the blade 41 . The package substrate 20 is cut along the grooves formed by the half-cut, thereby completing a plurality of semiconductor packages 50 .

＜1-5. Characteristics＞ As described above, according to the cutting device 10 of the first embodiment, the pressing mechanism 60 is provided. The relative positional relationship changes in the same manner as the relative positional relationship between the cutting mechanism 40 and the package substrate 20 . In the cutting device 10 , when the half cut is applied to the package substrate 20 , the package substrate 20 is pressed down by the roller 622 . The half-cut through is applied to the package substrate 20 in a state of being pressed down by the roller 622 thereby suppressing warpage of the package substrate 20 . Therefore, according to the cutting device 10 , the half-cut through the package substrate 20 is performed while the warp of the package substrate 20 is suppressed, so that the variation in the depth of the groove formed by the half-cut through can be suppressed.

[2. Embodiment 2] The cutting device 10 according to the first embodiment includes the pressing mechanism 60 . The cutting device 80 according to the second embodiment differs from the cutting device 10 according to the first embodiment mainly in the structure of the pressing mechanism. Hereinafter, the description will focus on differences from the first embodiment described above.

<2-1. Configuration of cutting device> Fig. 13 is a schematic diagram showing part of the cutting device 80 according to the second embodiment from the side. As shown in FIG. 13 , the cutting device 80 includes a cutting table 30 , a cutting mechanism 40 , a pressing mechanism 90 , and a discharge mechanism 70 .

The pressing mechanism 90 and the discharge mechanism 70 are respectively attached to the cutting mechanism 40 . The pressing mechanism 90 is attached to the rear of the cutting mechanism 40 , and the discharge mechanism 70 is attached to the front of the cutting mechanism 40 . The blade 41 is clamped in the Y-axis direction by the pressing mechanism 90 and the discharge mechanism 70 . The pressing mechanism 90 is provided at a position opposite to the discharge mechanism 70 with respect to the blade 41 . Thereby, both the pressing mechanism 90 and the discharge mechanism 70 can be attached to the cutting mechanism 40 . The pressing mechanism 90 is configured to be able to press the package substrate 20 placed on the cutting table 30 from above to below.

FIG. 14 is a schematic view showing the relationship between the pressing mechanism 90 and the blade 41 from the side. FIG. 15 is a plan view schematically showing the pressing mechanism 90 . Fig. 16 is a schematic view showing the relationship between the pressing mechanism 90 and the blade 41 from the front.

Referring to FIG. 14 , FIG. 15 and FIG. 16 , the pushing mechanism 90 includes a first pushing mechanism 91 and a second pushing mechanism 92 . The first pressing mechanism 91 is provided at a position close to one side surface of the blade 41 , and the second pressing mechanism 92 is provided at a position close to the other side surface of the blade 41 . When the package substrate 20 is cut by the blade 41 , the blade 41 is located in a region sandwiched between the first pressing mechanism 91 and the second pressing mechanism 92 . That is, when cutting the package substrate 20 by the blade 41, in a side view, a part of the first pressing mechanism 91 faces one side of the blade, and a part of the second pressing mechanism 92 faces the other side of the blade. One side faces.

The first pressing mechanism 91 and the second pressing mechanism 92 are each configured to press the package substrate 20 from above to below. The first pushing mechanism 91 includes a base member 940 and pushing units 950 and 960 . The second pushing mechanism 92 includes a base member 910 and pushing units 920 and 930 .

The base members 910, 940, 970 are each made of metal, for example. The members constituted by the base members 910 , 940 , and 970 are substantially L-shaped members, and are attached to the rear end of the cutting mechanism 40 . Holes H4 and H5 are respectively formed on both side surfaces of this member. Each of the holes H4 and H5 is a long hole in the vertical direction. This member is fixed to the cutting mechanism 40 by passing through the holes H4 and H5 with screws. In each of the holes H4, H5, the position in the height direction of the pressing mechanism 90 can be changed by changing the position in the height direction of screw locking. Further, support shafts 926 extending in the X-axis direction (thickness direction of the blade 41 ) are formed on the base members 910 and 940 , respectively.

The pressing units 920 , 930 , 950 , and 960 each include a rotating member 921 , a roller 922 , rotating shafts 923 , 925 , and a torsion spring 924 . The rotation shafts 923 and 925 each extend along the X-axis direction. The rotating member 921 is, for example, a metal plate-shaped member, and is rotatably attached to the base member 910 or the base member 940 . The base member 910 or the base member 940 and the rotation member 921 are installed together via the rotation shaft 925 . Around the rotation shaft 925, a torsion spring 924 is attached.

At the front end portion of the rotating member 921, a roller 922 is rotatably attached. The roller 922 is made of, for example, rubber or resin. The rotating member 921 and the roller 922 are connected through a rotating shaft 923 . One end of the torsion spring 924 pushes the rotating shaft 923 downward, and the other end of the torsion spring 924 pushes the supporting shaft 926 downward. Thereby, the roller 922 is energized in the direction of rotation. In addition, the roller 922 is attached to the inner side of the rotating member 921 in the thickness direction of the blade 41 . That is, the length between the roller 922 and the blade 41 is shorter than the length between the rotating member 921 and the blade 41 . Thereby, when the half-cut is applied to the package substrate 20 , the roller 922 can be pushed closer to the half-cut position. The rotating member 921 including the pressing units 930 and 960 is an example of the "first rotating member" of the present invention. The roller 922 attached to the rotating member 921 including the pressing units 930 and 960 is provided on the front side of the rotation center of the blade 41 and is an example of the "first pressing member" of the present invention. Also, the rotating member 921 including the pressing units 920 and 950 is an example of the "second rotating member" of the present invention. The roller 922 attached to the rotating member 921 including the pressing units 920 and 950 is provided on the rear side of the rotation center of the blade 41 and is an example of the "second pressing member" of the present invention.

In a state where the package substrate 20 is not present under the roller 922 , the lower end of the roller 922 is located below the imaginary plane Z2 representing the position of the lower end of the blade 41 . Therefore, when the packaging substrate 20 is cut, the lower end of the roller 922 comes to a position higher than the lower end of the blade 41 , so the roller 922 presses the packaging substrate 20 downward by the elastic force of the torsion spring 924 .

FIG. 17 is a diagram schematically showing the relationship between the pressing mechanism 90 and the blade 41 in a state in which the diameter of the blade 41 is reduced from the side. As shown in FIG. 17, even if the diameter of the blade 41 becomes smaller, the roller 922 is energized downward by the elastic force of the torsion spring 924, so the object to be cut can be pushed downward from above.

In addition, the cutting device 80 according to the second embodiment is also provided with an avoiding mechanism as shown in FIG. 12 .

＜2-2. Characteristics＞ As described above, according to the cutting device 80 of the second embodiment, the pressing mechanism 90 is provided. The relative positional relationship changes in the same manner as the relative positional relationship between the cutting mechanism 40 and the package substrate 20 . In the cutting device 80 , when a half-cut is applied to the package substrate 20 , the package substrate 20 is pressed down by the roller 922 . The half-cut through is applied to the package substrate 20 in a state of being pressed down by the roller 922 thereby suppressing warpage of the package substrate 20 . Therefore, according to the cutting device 80 , the package substrate 20 is half-cut through while suppressing the warping of the package substrate 20 , so the variation in the depth of the groove formed by the half-cut through can be reduced.

[3. Other embodiments] The concept of the first and second embodiments described above is not limited to the first and second embodiments described above. Hereinafter, an example of another embodiment to which the concept of the first and second embodiments described above can be applied will be described.

In Embodiments 1 and 2 described above, the top surface of the holding member 31 is flat. However, the top surface of the holding member 31 does not have to be completely flat. For example, the top surface of the holding member 31 may be warped in accordance with warping of the package substrate 20 . At this time, half-cutting is applied to the package substrate 20 while adjusting the height of the blade 41 . Even in this case, when the package substrate 20 is more warped than the top surface of the holding member 31 , the pressing mechanism functions effectively.

In Embodiments 1 and 2, the cutting of the package substrate 20 is performed by moving the cutting table 30 in the Y-axis direction. However, the cutting method is not limited to this. Cutting of the package substrate 20 may be performed by setting the only possible movement of the cutting table 30 to a rotational movement and moving the cutting mechanism 40 in the Y-axis direction. That is, it is only necessary to relatively move the cutting table 30 and the cutting mechanism 40 to cut the package substrate 20 .

In addition, in the first embodiment described above, for example, the base members 630, 640, and 650 may be integrally formed.

In addition, in the above-mentioned second embodiment, for example, the base members 910, 940, and 970 may be integrally formed.

As mentioned above, the embodiment of this invention was demonstrated as an example. That is, the detailed description and drawings are disclosed for illustrative purposes. Therefore, among the constituent elements described in the detailed description and the drawings, constituent elements that are not necessary for solving problems may be included. Therefore, even if these unnecessary constituent elements are described in the detailed description and drawings, these unnecessary constituent elements should not be recognized as essential immediately.

In addition, the above embodiments are merely illustrations of the present invention in various points. Various modifications and changes can be made to the above-described embodiments within the scope of the present invention. That is, for implementation of the present invention, appropriate specific configurations can be adopted in accordance with the embodiments.

10,10X,80: cut-off device 20: Package substrate 30: cutting table 31: Hold member 32: Rotary mechanism 33: Mobile Mechanism 40: Cutting mechanism 41: blade 50: Semiconductor packaging 51: Segment difference department 52: terminal 60,90: Push mechanism 61,91: The first pushing mechanism 62,92: The second pushing mechanism 70: spit mechanism 610: leaf spring 620,920,930,950,960: pushing unit 621, 630, 640, 650, 910, 940, 970: base components 622,922: rollers 623,923,925,J1: Rotary axis 624,625,631,632,633,634: Screws 921: Rotating components 924: torsion spring 926: Support axis G1: groove H1, H2, H3, H4, H5: holes P1,P2,P3,P4,P5,P6,P7: position Z1, Z2: imaginary surface

Fig. 1 is a diagram schematically showing a part of a plane of a cutting device according to Embodiment 1. Fig. 2 is a perspective view schematically showing a semiconductor package. Fig. 3 is a diagram for explaining a method of forming a step portion. Fig. 4 is a schematic diagram showing a part of the cutting device from the side. Fig. 5 is a schematic diagram showing the relationship between the pressing mechanism and the blade from the side. Fig. 6 is a plan view schematically showing the pressing mechanism. Fig. 7 is a schematic view showing the relationship between the pressing mechanism and the blade from the front. FIG. 8 is a schematic diagram for explaining the positional relationship between the blade and the roller when a half-cut is applied to the package substrate. Fig. 9 is a schematic diagram showing a part of the cutting device, which is the object of comparison, from the side. Fig. 10 is a diagram for explaining the effectiveness of the pressing mechanism in the cutting device. Fig. 11 is a schematic view showing the relationship between the pressing mechanism and the blade when the diameter of the blade is reduced from the side. Fig. 12 is a schematic diagram for explaining the action of the pushing mechanism. Fig. 13 is a schematic diagram showing part of a cutting device according to Embodiment 2 from the side. Fig. 14 is a schematic view showing the relationship between the pressing mechanism and the blade in the second embodiment from the side. Fig. 15 is a plan view schematically showing a pressing mechanism in Embodiment 2. Fig. 16 is a schematic view showing the relationship between the pressing mechanism and the blade in Embodiment 2 from the front. Fig. 17 is a diagram schematically showing the relationship between the pressing mechanism and the blade in a state in which the diameter of the blade in Embodiment 2 is reduced from the side.

Domestic deposit information (please note in order of depositor, date, and number) none

Overseas storage information (please note in order of storage country, organization, date, and number) none

10: Cut-off device

20: Package substrate

30: cutting table

31: Hold member

32: Rotary mechanism

33: Mobile Mechanism

40: Cutting mechanism

41: blade

Claims (6)

A cutting device configured to apply a half-cut in the thickness direction of the object to be cut formed by resin; the cutting device is provided with a cutting mechanism having a The blade for cutting off the object; the aforementioned blade has a first side and a second side; the cutting device further has a first pushing mechanism and a second pushing mechanism, and the first pushing mechanism is arranged on the opposite side At the position of the aforementioned first side, the second pushing mechanism is arranged at a position opposite to the aforementioned second side; the aforementioned first pushing mechanism and the aforementioned second pushing mechanism each have a pushing force formed by a roller. member; the aforementioned roller, when cutting the aforementioned object to be cut, at least a part of it faces the side surface of the aforementioned blade, the rotation center of the aforementioned roller is located at a position more forward than the rotation center of the aforementioned blade, and the aforementioned cutting The object to be cut is pushed from above to the bottom; It changes in the same manner as the above-mentioned relative positional relationship of the object to be cut. The cutting device as described in claim 1, wherein, further The first step is to include a discharge mechanism that discharges the machining fluid from the front of the blade, and each of the first pressing mechanism and the second pressing mechanism further includes an elastic mounting member that rotates from the rear side of the blade toward the rotation of the blade. The central side extends, and the aforementioned roller is attached to the front end portion of the elastic mounting member. A cutting device configured to apply a half-cut in the thickness direction of the object to be cut formed by resin; the cutting device is provided with a cutting mechanism having a The blade for cutting off the object; the aforementioned blade has a first side and a second side; the cutting device further has a first pushing mechanism and a second pushing mechanism, and the first pushing mechanism is arranged on the opposite side At the position of the aforementioned first side, the second pushing mechanism is arranged at a position opposite to the aforementioned second side; the aforementioned first pushing mechanism and the aforementioned second pushing mechanism are each configured to push the aforementioned cutting object Pushing from above toward the bottom; when the aforementioned half-cutting is applied, the respective relative positional relationship between the aforementioned first pushing mechanism and the aforementioned second pushing mechanism and the aforementioned cutting object should be consistent with the relationship between the aforementioned cutting mechanism and the aforementioned cutting The relative positional relationship of the object to be judged changes in the same manner; the aforementioned first pushing mechanism and the aforementioned second pushing mechanism each have A first pressing member and a second pressing member, the first pressing member is provided at a position further forward than the rear of the blade, and the second pressing member is disposed at a position rearward than the front of the blade , the aforementioned first pushing member and the aforementioned second pushing member are each configured to push the aforementioned cutting object from above to below; the aforementioned first pushing mechanism and the aforementioned second pushing mechanism each further include a second A rotating member and a second rotating member, the first rotating member is configured to make a force act on the direction of rotation, and the aforementioned first pressing member is installed, the second rotating member is configured to make a force act on the direction of rotation, and is equipped with The aforementioned second pushing member; the length between the aforementioned first pushing mechanism and the aforementioned blade is shorter than the length between the aforementioned first rotating member and the aforementioned blade; the length between the aforementioned second pushing mechanism and the aforementioned blade , which is shorter than the length between the aforementioned second rotating member and the aforementioned blade. The cutting device according to claim 3, wherein each of the first pressing member and the second pressing member is formed of a roller. The cutting device according to any one of claims 1 to 4, further comprising an avoidance mechanism configured to make the first pressing mechanism and the second pushing mechanism Press mechanism avoids to the position that can not overlap with aforementioned blade respectively. A method of manufacturing a cut-off product, which is a method of manufacturing a cut-off product using the cutting device described in any one of Claims 1 to 5; the method of manufacturing the cut-off product includes the following steps: preparing and installing the first The aforementioned cutting device of the aforementioned blade of one thickness; apply a half cut through to the aforementioned cutting object; replace the aforementioned blade with a blade of a second thickness, the second thickness is thinner than the aforementioned first thickness; and, along the applied The aforementioned half-cut position is used to cut off the aforementioned object.

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