WO2022107455A1 - Cutting device, and method for manufacturing cut product - Google Patents

Cutting device, and method for manufacturing cut product Download PDF

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Publication number
WO2022107455A1
WO2022107455A1 PCT/JP2021/035844 JP2021035844W WO2022107455A1 WO 2022107455 A1 WO2022107455 A1 WO 2022107455A1 JP 2021035844 W JP2021035844 W JP 2021035844W WO 2022107455 A1 WO2022107455 A1 WO 2022107455A1
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WO
WIPO (PCT)
Prior art keywords
blade
cutting
cut
cutting device
pressing
Prior art date
Application number
PCT/JP2021/035844
Other languages
French (fr)
Japanese (ja)
Inventor
創 渡辺
善夏 黄
幹司 石橋
和宏 高橋
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020237019978A priority Critical patent/KR20230098900A/en
Priority to CN202180052234.9A priority patent/CN115989112A/en
Publication of WO2022107455A1 publication Critical patent/WO2022107455A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Definitions

  • the present invention relates to a cutting device and a method for manufacturing a cut product.
  • Patent Document 1 discloses a method for manufacturing a semiconductor device.
  • a groove is formed in the lead frame by performing a half cut with a dicing saw. After that, a plating layer is formed on the groove, and the lead frame is cut along the groove by a narrow dicing saw. As a result, an individualized semiconductor device can be obtained (see Patent Document 1).
  • the object to be cut such as the lead frame may be warped.
  • a half cut is applied to the object to be cut while the object to be cut is aligned, the depth of the groove formed in the object to be cut varies.
  • Patent Document 1 does not disclose a means for solving such a problem.
  • the present invention has been made to solve such a problem, and an object thereof is a cutting device capable of reducing variation in the depth of a groove formed on an object to be cut by half-cutting, and a cutting device. It is to provide a method of manufacturing a cut product.
  • the cutting device is configured to perform a half cut in a resin-molded cutting object in the thickness direction of the cutting object.
  • This cutting device includes a cutting mechanism.
  • the cutting mechanism has a blade that cuts the object to be cut.
  • the blade has a first side surface and a second side surface.
  • the cutting device further includes first and second pressing mechanisms.
  • the first pressing mechanism is provided at a position facing the first side surface.
  • the second pressing mechanism is provided at a position facing the second side surface.
  • Each of the first and second pressing mechanisms is configured to press the object to be cut from above to below.
  • the method for manufacturing a cut product according to another aspect of the present invention is a method for manufacturing a cut product using the above-mentioned cutting device.
  • the method for manufacturing this cut product is a step of preparing a cutting device to which a blade of the first thickness is attached, a step of making a half cut on the object to be cut, and a blade having a second thickness thinner than the first thickness. It includes a step of replacement and a step of cutting the object to be cut along the position where the half cut was made.
  • the present invention it is possible to provide a cutting device capable of reducing variations in the depth of grooves formed on an object to be cut by half-cutting, and a method for manufacturing a cut product.
  • FIG. 2 is a plan view schematically showing a pressing mechanism in the second embodiment.
  • the second embodiment it is a schematic diagram which shows the relationship between a holding mechanism and a blade from the front.
  • it is a figure schematically showing the relationship between the holding mechanism and a blade from the side in a state where the diameter of the blade is reduced.
  • FIG. 1 is a diagram schematically showing a part of a plane of a cutting device 10 according to the first embodiment.
  • the cutting device 10 includes a cutting table 30 and a cutting mechanism 40.
  • the cutting table 30 holds the package substrate 20 to be cut.
  • the cutting table 30 includes a holding member 31, a rotating mechanism 32, and a moving mechanism 33.
  • the holding member 31 holds the package substrate 20 by sucking the package substrate 20 from below.
  • the rotation mechanism 32 can rotate the holding member 31 in the ⁇ direction in the figure.
  • the moving mechanism 33 can move the holding member 31 along the Y axis in the figure.
  • the substrate or lead frame to which the semiconductor chip is connected is resin-sealed.
  • the package substrate 20 used for manufacturing the semiconductor package 50 described with reference to FIG. 2 described later uses a lead frame shown as an example.
  • the cutting mechanism 40 includes a blade 41.
  • the cutting mechanism 40 cuts the package substrate 20 with the blade 41 to separate the package substrate 20 into a plurality of semiconductor packages.
  • the cutting mechanism 40 is movable along the X-axis and the Z-axis in the figure.
  • the cutting device 10 may have a twin spindle configuration having two cutting mechanisms 40 or a single spindle configuration having one cutting mechanism 40.
  • the cutting mechanism 40 is configured to form a groove in the package substrate 20 by removing a part of the package substrate 20 by the blade 41. That is, the cutting mechanism 40 can make a half cut in the package substrate 20 in the thickness direction of the package substrate 20.
  • the concept of the term "cutting" included in the name of the cutting device 10 (cutting device) includes separating the cutting target into a plurality of pieces and removing a part of the cutting target.
  • the cutting device 10 has a function of half-cutting the package substrate 20 in order to enable the production of a wettable QFN (Quad Flat No-leaded) such as a semiconductor package 50 which is an example of a cut product. There is.
  • a wettable QFN Quad Flat No-leaded
  • semiconductor package 50 The semiconductor package 50 and the method for manufacturing the semiconductor package 50 will be described below.
  • FIG. 2 is a perspective view schematically showing the semiconductor package 50.
  • a step portion 51 is formed at a boundary portion between the upper surface (the surface on which the terminal 52 is formed) and the side surface in the drawing.
  • the solder enters the stepped portion 51.
  • a three-dimensional solder connection structure can be realized for the semiconductor package 50.
  • the solder fillet can be easily observed from the side surface of the semiconductor package 50 in the visual inspection after mounting.
  • FIG. 3 is a diagram for explaining a method of forming the stepped portion 51.
  • the groove G1 is formed on the package substrate 20 by the blade 41 having the first thickness.
  • the package substrate 20 is separated by cutting the package substrate 20 at the position P1 by the blade 41 having the second thickness (thinner than the first thickness). As a result, a plurality of semiconductor packages 50 in which the stepped portion 51 is formed are manufactured.
  • the semiconductor package 50 has various advantages. By performing the half cut, the stepped portion 51 formed in the semiconductor package 50 can be realized.
  • the cutting device 10 has, for example, a function of half-cutting the package substrate 20 in order to manufacture the semiconductor package 50.
  • the cutting device 10 is devised to suppress variations in the depth of the grooves formed by the half cut.
  • the configuration of the cutting device 10 and the like will be described in detail.
  • FIG. 4 is a schematic view showing a part of the cutting device 10 from the side.
  • the cutting device 10 includes a cutting table 30, a cutting mechanism 40, a pressing mechanism 60, and a discharging mechanism 70.
  • Each of the pressing mechanism 60 and the discharging mechanism 70 is attached to the cutting mechanism 40.
  • the pressing mechanism 60 is attached to the rear of the cutting mechanism 40, and the discharge mechanism 70 is attached to the front of the cutting mechanism 40.
  • the "front" of the cutting mechanism 40 is the direction in which the cutting table 30 enters when the cutting table 30 moves to a position below the blade 41.
  • the blade 41 is sandwiched by the pressing mechanism 60 and the discharging mechanism 70 in the Y-axis direction.
  • the pressing mechanism 60 is provided at a position opposite to the ejection mechanism 70 with respect to the blade 41. As a result, both the pressing mechanism 60 and the discharging mechanism 70 can be attached to the cutting mechanism 40.
  • the pressing mechanism 60 is configured to press the package substrate 20 arranged on the cutting table 30 from above to below.
  • the configuration of the pressing mechanism 60 and the reason why the pressing mechanism 60 is provided will be described in detail later.
  • the discharge mechanism 70 includes three nozzles (for example, first, second and third nozzles) each of which is configured to discharge the machining fluid.
  • the first nozzle discharges the processing liquid toward the blade 41.
  • the second nozzle discharges the processing liquid toward the contact point (cut portion) between the blade 41 and the package substrate 20.
  • the third nozzle discharges the processing liquid toward the unnecessary scrap portion generated when the package substrate 20 is cut.
  • the discharge mechanism 70 does not necessarily have to include three nozzles.
  • the discharge mechanism 70 may be composed of one or two nozzles, or may be composed of four or more nozzles.
  • the discharge mechanism 70 discharges the processing liquid supplied from, for example, a water storage tank or water supply.
  • machining fluid When the machining fluid is sprayed onto the rotating blade 41 by the discharge mechanism 70, a large amount of machining fluid comes into contact with the blade 41, and the blade 41 is cooled more effectively. Further, when the processing liquid is sprayed onto the cutting portion, a large amount of processing liquid is supplied to the processing point, heat generated during cutting can be suppressed, and the package substrate 20 can be appropriately cut. Further, by injecting the processing liquid onto the scrap portion, the scrap portion remaining on the cutting table 30 can be removed.
  • FIG. 5 is a schematic view showing the relationship between the pressing mechanism 60 and the blade 41 from the side.
  • FIG. 6 is a plan view schematically showing the pressing mechanism 60.
  • FIG. 7 is a schematic view showing the relationship between the pressing mechanism 60 and the blade 41 from the front.
  • the pressing mechanism 60 includes a first pressing mechanism 61 and a second pressing mechanism 62.
  • the first pressing mechanism 61 is provided at a position close to one side surface of the blade 41
  • the second pressing mechanism 62 is provided at a position close to the other side surface of the blade 41.
  • the blade 41 is located in the region sandwiched by the first pressing mechanism 61 and the second pressing mechanism 62. That is, when the package substrate 20 is cut by the blade 41, a part of the first pressing mechanism 61 faces one side surface of the blade 41 and a part of the second pressing mechanism 62 faces the other side surface of the blade 41 in a side view. do.
  • Each of the first pressing mechanism 61 and the second pressing mechanism 62 is configured to press the package substrate 20 (FIG. 1) from above to below.
  • Each of the first pressing mechanism 61 and the second pressing mechanism 62 includes a leaf spring 610, a pressing unit 620, base members 630, 640, and screws 624,625,631,633,634.
  • Each of the base members 630, 640, and 650 is made of, for example, metal.
  • the base member 650 is a plate-shaped member extending in the height direction, and is attached to the rear end portion of the cutting mechanism 40. Holes H1 and H2 are formed on both side surfaces of the base member 650. Each of the holes H1 and H2 is a vertically long hole. By passing a screw through the holes H1 and H2, the base member 650 is fixed to the cutting mechanism 40. By changing the position in the height direction of screwing in each of the holes H1 and H2, the position of the pressing mechanism 60 in the height direction can be changed.
  • the base member 640 is a member that extends forward from the lower end of the base member 650 and is attached to the base member 650.
  • the base member 630 is a rod-shaped member attached to the upper surface of the base member 640 and extends forward from the base member 640.
  • Screw holes are formed in each of the base members 630 and 640, and the base members 630 and 640 are screwed to each other by screws 633 and 634.
  • the holes H3 formed in each of the base members 630 and 640 have a long shape in the front-rear direction, and the position of the roller 622 in the front-rear direction can be adjusted by adjusting the screwing position.
  • a leaf spring 610 extending diagonally downward is attached to the lower surface of the base member 630.
  • the leaf spring 610 is made of metal, for example.
  • a screw hole is formed in the leaf spring 610, and the base member 630 and the leaf spring 610 are screwed to each other by a screw 632.
  • the screw 631 penetrates the screw hole of the base member 630 and presses the leaf spring 610 from above.
  • the position pressed by the screw 631 is ahead of the position screwed to the base member 630 by the screw 632.
  • a pressing unit 620 is attached to the tip of the leaf spring 610.
  • the holding unit 620 includes a base member 621, a roller 622, a rotating shaft 623, and screws 624,625.
  • the base member 621 is made of, for example, metal or resin.
  • a screw hole is formed in the base member 621, and the base member 621 and the leaf spring 610 are screwed to each other by screws 624 and 625.
  • a recess is formed at the tip of the base member 621, and the roller 622 is located in the recess.
  • the roller 622 is attached to the base member 621 via a rotation shaft 623 and is rotatable with respect to the base member 621.
  • the rotation shaft 623 extends in the X-axis direction (thickness direction of the blade 41).
  • the roller 622 is made of, for example, rubber or resin.
  • the roller 622 is an example of the "holding member" of the present invention.
  • the lower end of the roller 622 In a state where the package substrate 20 does not exist below the roller 622, the lower end of the roller 622 is located below the virtual surface Z1 indicating the lower end position of the blade 41. Therefore, when the package substrate 20 is cut, the lower end of the roller 622 comes to a position higher than the lower end of the blade 41, so that the roller 622 pushes the package substrate 20 by the elastic force of the leaf spring 610.
  • FIG. 8 is a schematic diagram for explaining the positional relationship between the blade 41 and the roller 622 when the package substrate 20 is half-cut.
  • the blade 41 scrapes off a part of the package substrate 20. Therefore, the blade 41 enters below the upper surface of the package substrate 20 in the height direction.
  • the roller 622 presses the upper surface of the package substrate 20. Therefore, the lower end of the roller 622 is higher than the lower end of the blade 41.
  • the position of the rotation center of the roller 622 in the Y-axis direction is located ahead of the position of the rotation center of the blade 41 in the Y-axis direction (position P5). This is because the cutting start position (position P7) of the package substrate 20 by the blade 41 is located ahead of the position (position P5) of the rotation center of the blade 41 in the Y-axis direction.
  • the cutting device 10 since the position of the rotation center of the roller 622 is located in front of the position of the rotation center of the blade 41, the package substrate 20 can be pressed by the roller 622 at a position closer to the cutting start position. .. Next, the reason why the pressing mechanism 60 is provided in the cutting device 10 will be described.
  • FIG. 9 is a schematic view showing a part of the cutting device 10X to be compared from the side.
  • the cutting device 10X does not have a pressing mechanism.
  • the package substrate 20 may be warped. If the package substrate 20 is half-cut while the package substrate 20 is warped, there arises a problem that the depth of the groove varies depending on the position. For example, the depth of the groove formed at position P3 is deeper than the depth of the groove formed at position P2, and the depth of the groove formed at position P4 is greater than the depth of the groove formed at position P3. It happens that it is deeper.
  • a pressing mechanism 60 is provided in order to solve such a problem.
  • FIG. 10 is a diagram for explaining the effectiveness of the pressing mechanism 60 in the cutting device 10 according to the first embodiment.
  • the cutting device 10 when the package substrate 20 is half-cut, the position adjacent to the cutting start portion of the package substrate 20 is pressed by the roller 622.
  • the package substrate 20 is half-cut while the warpage of the package substrate 20 is suppressed by being pressed by the roller 622. Therefore, according to the cutting device 10, since the package substrate 20 is half-cut while the warp of the package substrate 20 is suppressed, it is possible to suppress variations in the depth of the grooves formed by the half-cut.
  • FIG. 11 is a schematic view showing the relationship between the pressing mechanism 60 and the blade 41 from the side when the diameter of the blade 41 is reduced. As shown in FIG. 11, even if the diameter of the blade 41 is reduced, the roller 622 is urged downward by the elastic force of the leaf spring 610, so that the object to be cut is pressed downward from above. Can be done.
  • FIG. 12 is a schematic diagram for explaining the operation of the pressing mechanism 60.
  • a rotation shaft J1 is provided in a part of the cutting mechanism 40 to which the pressing mechanism 60 is attached, and a part of the cutting mechanism 40 is configured to rotate. That is, by rotating a part of the cutting mechanism 40, the pressing mechanism 60 retracts from the position where it overlaps with the blade 41 in the side view. As a result, the blade 41 can be easily replaced.
  • the cutting device 10 according to the first embodiment includes a retracting mechanism including the rotation shaft J1 configured to retract the pressing mechanism 60 to a position where it does not overlap with the blade 41 in the side view. ..
  • the semiconductor package 50 (FIG. 2) is manufactured by the following method.
  • a blade 41 having a first thickness is attached.
  • the cutting table 30 enters below the blade 41 from the front of the cutting mechanism 40.
  • the pressing mechanism 60 presses the package substrate 20 on the cutting table 30 from above to downward, and the blade 41 starts half-cutting the package substrate 20. Since the pressing mechanism 60 is attached to the cutting mechanism 40, when half-cutting is performed, the relative positional relationship between the pressing mechanism 60 and the package substrate 20 is the relative positional relationship between the cutting mechanism 40 and the package substrate 20. It changes in the same way as the positional relationship.
  • the blade 41 is replaced in the cutting device 10.
  • the replaced blade 41 has a second thickness (thinner than the first thickness).
  • the cutting table 30 enters below the blade 41 from the front of the cutting mechanism 40.
  • the pressing mechanism 60 presses the package substrate 20 on the cutting table 30 from above to downward, and the blade 41 starts cutting the package substrate 20.
  • a plurality of semiconductor packages 50 are completed by cutting the package substrate 20 along the grooves formed by the half cut.
  • the cutting device 10 includes the pressing mechanism 60, and when the package substrate 20 is half-cut, each of the first pressing mechanism 61 and the second pressing mechanism 62 is provided.
  • the relative positional relationship between and the package substrate 20 changes in the same manner as the relative positional relationship between the cutting mechanism 40 and the package substrate 20.
  • the cutting device 10 when the package substrate 20 is half-cut, the package substrate 20 is pressed by the roller 622.
  • the package substrate 20 is half-cut while the warpage of the package substrate 20 is suppressed by being pressed by the roller 622. Therefore, according to the cutting device 10, since the package substrate 20 is half-cut while the warp of the package substrate 20 is suppressed, it is possible to suppress variations in the depth of the grooves formed by the half-cut.
  • the cutting device 10 according to the first embodiment includes a pressing mechanism 60.
  • the structure of the pressing mechanism is mainly different between the cutting device 80 according to the second embodiment and the cutting device 10 according to the first embodiment.
  • the parts different from those of the first embodiment will be mainly described.
  • FIG. 13 is a schematic view showing a part of the cutting device 80 according to the second embodiment from the side.
  • the cutting device 80 includes a cutting table 30, a cutting mechanism 40, a pressing mechanism 90, and a discharging mechanism 70.
  • the pressing mechanism 90 and the discharging mechanism 70 is attached to the cutting mechanism 40.
  • the pressing mechanism 90 is attached to the rear of the cutting mechanism 40, and the discharge mechanism 70 is attached to the front of the cutting mechanism 40.
  • the blade 41 is sandwiched by the pressing mechanism 90 and the discharging mechanism 70 in the Y-axis direction.
  • the pressing mechanism 90 is provided at a position opposite to the ejection mechanism 70 with respect to the blade 41. As a result, both the pressing mechanism 90 and the discharging mechanism 70 can be attached to the cutting mechanism 40.
  • the pressing mechanism 90 is configured to press the package substrate 20 arranged on the cutting table 30 from above to below.
  • FIG. 14 is a schematic view showing the relationship between the pressing mechanism 90 and the blade 41 from the side.
  • FIG. 15 is a plan view schematically showing the pressing mechanism 90.
  • FIG. 16 is a schematic view showing the relationship between the pressing mechanism 90 and the blade 41 from the front.
  • the pressing mechanism 90 includes a first pressing mechanism 91 and a second pressing mechanism 92.
  • the first pressing mechanism 91 is provided at a position close to one side surface of the blade 41
  • the second pressing mechanism 92 is provided at a position close to the other side surface of the blade 41.
  • the blade 41 is located in the region sandwiched by the first pressing mechanism 91 and the second pressing mechanism 92. That is, when the package substrate 20 is cut by the blade 41, a part of the first pressing mechanism 91 faces one side surface of the blade 41 and a part of the second pressing mechanism 92 faces the other side surface of the blade 41 in a side view. do.
  • Each of the first pressing mechanism 91 and the second pressing mechanism 92 is configured to press the package substrate 20 from above to below.
  • the first pressing mechanism 91 includes a base member 940 and pressing units 950 and 960.
  • the second pressing mechanism 92 includes a base member 910 and pressing units 920 and 930.
  • Each of the base members 910, 940, and 970 is made of, for example, metal.
  • the member composed of the base members 910, 940, and 970 is a substantially L-shaped member, and is attached to the rear end portion of the cutting mechanism 40. Holes H4 and H5 are formed on each of both side surfaces of the member. Each of the holes H4 and H5 is a vertically long hole.
  • the member is fixed to the cutting mechanism 40 by passing a screw through the holes H4 and H5. By changing the position in the height direction of screwing in each of the holes H4 and H5, the position of the pressing mechanism 90 in the height direction can be changed.
  • each of the base members 910 and 940 is formed with a support shaft 926 extending in the X-axis direction (thickness direction of the blade 41).
  • Each of the holding units 920, 930, 950, and 960 includes a rotating member 921, a roller 922, a rotating shaft 923, 925, and a torsion spring 924.
  • Each of the rotating shafts 923 and 925 extends in the X-axis direction.
  • the rotating member 921 is, for example, a metal plate-shaped member, and is rotatably attached to the base member 910 or the base member 940.
  • the base member 910 or the base member 940 and the rotating member 921 are attached via a rotating shaft 925.
  • a torsion spring 924 is attached around the rotating shaft 925.
  • a roller 922 is rotatably attached to the tip of the rotating member 921.
  • the roller 922 is made of, for example, rubber or resin.
  • the rotating member 921 and the roller 922 are connected via a rotating shaft 923.
  • One end of the torsion spring 924 presses the rotary shaft 923 downward, and the other end of the torsion spring 924 presses the support shaft 926 downward.
  • the roller 922 is urged in the rotational direction.
  • the roller 922 is attached to the inside of the rotating member 921 in the thickness direction of the blade 41. That is, the length between the roller 922 and the blade 41 is shorter than the length between the rotating member 921 and the blade 41.
  • the rotating member 921 included in the pressing units 930 and 960 is an example of the "first rotating member” of the present invention
  • the roller 922 attached to the rotating member 921 is the “first pressing member” of the present invention.
  • the rotating member 921 included in the holding units 920 and 950 is an example of the "second rotating member” of the present invention
  • the roller 922 attached to the rotating member 921 is the “second rotating member” of the present invention. This is an example of a "holding member”.
  • the lower end of the roller 922 In a state where the package substrate 20 does not exist below the roller 922, the lower end of the roller 922 is located below the virtual surface Z2 indicating the lower end position of the blade 41. Therefore, when the package substrate 20 is cut, the lower end of the roller 922 comes to a position higher than the lower end of the blade 41, so that the roller 922 pushes the package substrate 20 by the elastic force of the torsion spring 924.
  • FIG. 17 is a diagram schematically showing the relationship between the pressing mechanism 90 and the blade 41 from the side when the diameter of the blade 41 is reduced. As shown in FIG. 17, even if the diameter of the blade 41 is reduced, the roller 922 is urged downward by the elastic force of the torsion spring 924, so that the object to be cut is pressed downward from above. be able to.
  • the cutting device 80 according to the second embodiment is also provided with a retracting mechanism as shown by FIG.
  • the cutting device 80 includes the pressing mechanism 90, and when the package substrate 20 is half-cut, each of the first pressing mechanism 91 and the second pressing mechanism 92 is provided.
  • the relative positional relationship between and the package substrate 20 changes in the same manner as the relative positional relationship between the cutting mechanism 40 and the package substrate 20.
  • the cutting device 80 when the package substrate 20 is half-cut, the package substrate 20 is pressed by the roller 922.
  • the package substrate 20 is half-cut while the warpage of the package substrate 20 is suppressed by being pressed by the rollers 922. Therefore, according to the cutting device 80, since the package substrate 20 is half-cut while the warp of the package substrate 20 is suppressed, it is possible to reduce the variation in the depth of the groove formed by the half-cut.
  • the upper surface of the holding member 31 was flat.
  • the upper surface of the holding member 31 does not necessarily have to be completely flat.
  • the upper surface of the holding member 31 may be warped according to the warp of the package substrate 20.
  • the package substrate 20 is half-cut while adjusting the height position of the blade 41. Even in this case, the pressing mechanism functions effectively when the package substrate 20 is further warped from the upper surface of the holding member 31.
  • the package substrate 20 is cut by moving the cutting table 30 in the Y-axis direction.
  • the cutting method is not limited to this.
  • the operation that the cutting table 30 can perform is only the rotation operation, and the package substrate 20 may be cut by moving the cutting mechanism 40 in the Y-axis direction. That is, the package substrate 20 may be cut by relatively moving the cutting table 30 and the cutting mechanism 40.
  • the base members 630, 640, and 650 may be integrally formed.
  • the base members 910, 940, and 970 may be integrally formed.
  • the above-described embodiment is merely an example of the present invention in all respects.
  • the above-described embodiment can be variously improved or modified within the scope of the present invention. That is, in carrying out the present invention, a specific configuration can be appropriately adopted according to the embodiment.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Shearing Machines (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)

Abstract

This cutting device comprises a cutting mechanism. The cutting mechanism has a blade for cutting an object to be cut. The blade has a first side surface, and a second side surface. The cutting device further comprises first and second pressing mechanisms. The first pressing mechanism is provided at a position facing the first side surface. The second pressing mechanism is provided at a position facing the second side surface. Each of the first and second pressing mechanisms is configured to press, downward from above, the object to be cut. When half cutting is executed, the relative positional relationship between each of the first and second pressing mechanisms and the object to be cut changes in the same manner as the relative positional relationship between the cutting mechanism and the object to be cut.

Description

切断装置、及び、切断品の製造方法Cutting device and manufacturing method of cut products
　本発明は、切断装置、及び、切断品の製造方法に関する。 The present invention relates to a cutting device and a method for manufacturing a cut product.
　特開２００８－１１２９６１号公報（特許文献１）は、半導体装置の製造方法を開示する。この製造方法においては、ダイシングソーによるハーフカットが施されることによって、リードフレームに溝が形成される。その後、溝上にめっき層が形成され、幅の狭いダイシングソーによって溝に沿ってリードフレームが切断される。これにより、個片化された半導体装置が得られる（特許文献１参照）。 Japanese Unexamined Patent Publication No. 2008-112961 (Patent Document 1) discloses a method for manufacturing a semiconductor device. In this manufacturing method, a groove is formed in the lead frame by performing a half cut with a dicing saw. After that, a plating layer is formed on the groove, and the lead frame is cut along the groove by a narrow dicing saw. As a result, an individualized semiconductor device can be obtained (see Patent Document 1).
特開２００８－１１２９６１号公報Japanese Unexamined Patent Publication No. 2008-112961
　リードフレーム等の切断対象物が反っている場合がある。切断対象物が沿った状態で、切断対象物にハーフカットを施すと、切断対象物に形成される溝の深さがばらつく。上記特許文献１においては、このような問題の解決手段が開示されていない。 The object to be cut such as the lead frame may be warped. When a half cut is applied to the object to be cut while the object to be cut is aligned, the depth of the groove formed in the object to be cut varies. The above-mentioned Patent Document 1 does not disclose a means for solving such a problem.
　本発明は、このような問題を解決するためになされたものであって、その目的は、ハーフカットによって切断対象物上に形成される溝の深さのばらつきを低減可能な切断装置、及び、切断品の製造方法を提供することである。 The present invention has been made to solve such a problem, and an object thereof is a cutting device capable of reducing variation in the depth of a groove formed on an object to be cut by half-cutting, and a cutting device. It is to provide a method of manufacturing a cut product.
　本発明のある局面に従う切断装置は、樹脂成形された切断対象物において、切断対象物の厚さ方向にハーフカットを施すように構成されている。この切断装置は、切断機構を備える。切断機構は、切断対象物を切断するブレードを有する。ブレードは、第１側面と、第２側面とを有する。切断装置は、第１及び第２押さえ機構をさらに備える。第１押さえ機構は、第１側面に対向する位置に設けられている。第２押さえ機構は、第２側面に対向する位置に設けられている。第１及び第２押さえ機構の各々は、切断対象物を上方から下方に向けて押さえるように構成されている。ハーフカットが施される場合に、第１及び第２押さえ機構の各々と切断対象物との相対的な位置関係は、切断機構と切断対象物との相対的な位置関係と同じように変化する。 The cutting device according to a certain aspect of the present invention is configured to perform a half cut in a resin-molded cutting object in the thickness direction of the cutting object. This cutting device includes a cutting mechanism. The cutting mechanism has a blade that cuts the object to be cut. The blade has a first side surface and a second side surface. The cutting device further includes first and second pressing mechanisms. The first pressing mechanism is provided at a position facing the first side surface. The second pressing mechanism is provided at a position facing the second side surface. Each of the first and second pressing mechanisms is configured to press the object to be cut from above to below. When a half cut is applied, the relative positional relationship between each of the first and second pressing mechanisms and the object to be cut changes in the same manner as the relative positional relationship between the cutting mechanism and the object to be cut. ..
　本発明の他の局面に従う切断品の製造方法は、上記切断装置を用いた切断品の製造方法である。この切断品の製造方法は、第１厚みのブレードが取り付けられた切断装置を準備するステップと、切断対象物にハーフカットを施すステップと、ブレードを第１厚みよりも薄い第２厚みのブレードに取り替えるステップと、ハーフカットが施された位置に沿って、切断対象物を切断するステップとを含む。 The method for manufacturing a cut product according to another aspect of the present invention is a method for manufacturing a cut product using the above-mentioned cutting device. The method for manufacturing this cut product is a step of preparing a cutting device to which a blade of the first thickness is attached, a step of making a half cut on the object to be cut, and a blade having a second thickness thinner than the first thickness. It includes a step of replacement and a step of cutting the object to be cut along the position where the half cut was made.
　本発明によれば、ハーフカットによって切断対象物上に形成される溝の深さのばらつきを低減可能な切断装置、及び、切断品の製造方法を提供することができる。 According to the present invention, it is possible to provide a cutting device capable of reducing variations in the depth of grooves formed on an object to be cut by half-cutting, and a method for manufacturing a cut product.
実施の形態１に従う切断装置の平面の一部を模式的に示す図である。It is a figure which shows a part of the plane of the cutting apparatus according to Embodiment 1. 半導体パッケージを模式的に示す斜視図である。It is a perspective view which shows the semiconductor package schematically. 段差部の形成方法について説明するための図である。It is a figure for demonstrating the method of forming a step portion. 切断装置の一部を側方から示す模式図である。It is a schematic diagram which shows a part of a cutting device from the side. 押さえ機構とブレードとの関係を側方から示す模式図である。It is a schematic diagram which shows the relationship between a holding mechanism and a blade from the side. 押さえ機構を模式的に示す平面図である。It is a top view which shows the holding mechanism schematically. 押さえ機構とブレードとの関係を正面から示す模式図である。It is a schematic diagram which shows the relationship between a holding mechanism and a blade from the front. パッケージ基板にハーフカットを施す場合における、ブレードとローラとの位置関係を説明するための模式図である。It is a schematic diagram for demonstrating the positional relationship between a blade and a roller when half-cut is applied to a package substrate. 比較対象である切断装置の一部を側方から示す模式図である。It is a schematic diagram which shows a part of the cutting device which is a comparison target from the side. 切断装置における押さえ機構６０の有効性を説明するための図である。It is a figure for demonstrating the effectiveness of the holding mechanism 60 in a cutting device. ブレードの径が小さくなった状態における、押さえ機構とブレードとの関係を側方から示す模式図である。It is a schematic diagram which shows the relationship between a holding mechanism and a blade from the side in a state where the diameter of a blade becomes small. 押さえ機構の動作を説明するための模式図である。It is a schematic diagram for demonstrating the operation of a holding mechanism. 実施の形態２に従う切断装置の一部を側方から示す模式図である。It is a schematic diagram which shows a part of the cutting apparatus according to Embodiment 2 from the side. 実施の形態２において、押さえ機構とブレードとの関係を側方から示す模式図である。In the second embodiment, it is a schematic diagram which shows the relationship between a holding mechanism and a blade from the side. 実施の形態２において、押さえ機構を模式的に示す平面図である。FIG. 2 is a plan view schematically showing a pressing mechanism in the second embodiment. 実施の形態２において、押さえ機構とブレードとの関係を正面から示す模式図である。In the second embodiment, it is a schematic diagram which shows the relationship between a holding mechanism and a blade from the front. 実施の形態２において、ブレードの径が小さくなった状態における、押さえ機構とブレードとの関係を側方から模式的に示す図である。In the second embodiment, it is a figure schematically showing the relationship between the holding mechanism and a blade from the side in a state where the diameter of the blade is reduced.
　以下、本発明の一側面に係る実施の形態（以下、「本実施の形態」とも称する。）について、図面を用いて詳細に説明する。なお、図中同一又は相当部分には同一符号を付してその説明は繰り返さない。また、各図面は、理解の容易のために、適宜対象を省略又は誇張して模式的に描かれている。また、各図面において各矢印が示す方向は、各図面において共通である。 Hereinafter, an embodiment according to one aspect of the present invention (hereinafter, also referred to as “the present embodiment”) will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are designated by the same reference numerals and the description thereof will not be repeated. In addition, each drawing is schematically drawn by omitting or exaggerating the object as appropriate for easy understanding. Further, the direction indicated by each arrow in each drawing is common to each drawing.
　［１．実施の形態１］
　＜１－１．概要＞
　図１は、本実施の形態１に従う切断装置１０の平面の一部を模式的に示す図である。図１に示されるように、切断装置１０は、切断テーブル３０と、切断機構４０とを含んでいる。 [1. Embodiment 1]
<1-1. Overview>
FIG. 1 is a diagram schematically showing a part of a plane of a cutting device 10 according to the first embodiment. As shown in FIG. 1, the cutting device 10 includes a cutting table 30 and a cutting mechanism 40.
　切断テーブル３０は、切断されるパッケージ基板２０を保持する。切断テーブル３０は、保持部材３１と、回転機構３２と、移動機構３３とを含んでいる。保持部材３１は、パッケージ基板２０を下方から吸着することによって、パッケージ基板２０を保持する。回転機構３２は、保持部材３１を図のθ方向に回転させることが可能である。移動機構３３は、保持部材３１を図のＹ軸に沿って移動させることが可能である。なお、パッケージ基板２０においては、半導体チップが接続された基板又はリードフレームが樹脂封止されている。なお、後述する図２を参照して説明する半導体パッケージ５０の製造に用いるパッケージ基板２０は、一例として示すリードフレームを用いたものである。 The cutting table 30 holds the package substrate 20 to be cut. The cutting table 30 includes a holding member 31, a rotating mechanism 32, and a moving mechanism 33. The holding member 31 holds the package substrate 20 by sucking the package substrate 20 from below. The rotation mechanism 32 can rotate the holding member 31 in the θ direction in the figure. The moving mechanism 33 can move the holding member 31 along the Y axis in the figure. In the package substrate 20, the substrate or lead frame to which the semiconductor chip is connected is resin-sealed. The package substrate 20 used for manufacturing the semiconductor package 50 described with reference to FIG. 2 described later uses a lead frame shown as an example.
　切断機構４０は、ブレード４１を含んでいる。切断機構４０は、ブレード４１によりパッケージ基板２０を切断することによって、パッケージ基板２０を複数の半導体パッケージに個片化する。切断機構４０は、図のＸ軸及びＺ軸に沿って移動可能である。なお、切断装置１０は、２つの切断機構４０を有するツインスピンドル構成であってもよいし、１つの切断機構４０を有するシングルスピンドル構成であってもよい。 The cutting mechanism 40 includes a blade 41. The cutting mechanism 40 cuts the package substrate 20 with the blade 41 to separate the package substrate 20 into a plurality of semiconductor packages. The cutting mechanism 40 is movable along the X-axis and the Z-axis in the figure. The cutting device 10 may have a twin spindle configuration having two cutting mechanisms 40 or a single spindle configuration having one cutting mechanism 40.
　また、切断機構４０は、ブレード４１によりパッケージ基板２０の一部を除去することによって、パッケージ基板２０に溝を形成するように構成されている。すなわち、切断機構４０は、パッケージ基板２０において、パッケージ基板２０の厚さ方向にハーフカットを施すことが可能である。切断装置１０の名称（切断装置）に含まれる「切断」という用語の概念は、切断対象を複数に分離すること、及び、切断対象の一部を除去することを含む。 Further, the cutting mechanism 40 is configured to form a groove in the package substrate 20 by removing a part of the package substrate 20 by the blade 41. That is, the cutting mechanism 40 can make a half cut in the package substrate 20 in the thickness direction of the package substrate 20. The concept of the term "cutting" included in the name of the cutting device 10 (cutting device) includes separating the cutting target into a plurality of pieces and removing a part of the cutting target.
　切断装置１０は、例えば、切断品の一例である半導体パッケージ５０のようなウェッタブルＱＦＮ（Quad Flat No-leaded）の製造を可能とするために、パッケージ基板２０にハーフカットを施す機能を有している。半導体パッケージ５０、及び、半導体パッケージ５０の製造方法について次に説明する。 The cutting device 10 has a function of half-cutting the package substrate 20 in order to enable the production of a wettable QFN (Quad Flat No-leaded) such as a semiconductor package 50 which is an example of a cut product. There is. The semiconductor package 50 and the method for manufacturing the semiconductor package 50 will be described below.
　図２は、半導体パッケージ５０を模式的に示す斜視図である。図２に示されるように、半導体パッケージ５０においては、図中の上面（端子５２が形成されている面）と側面との境界部分に段差部５１が形成されている。半導体パッケージ５０が面実装された場合には、半田が段差部５１に入り込む。これにより、半導体パッケージ５０に関して、立体的な半田接続構造を実現することができる。また、半田が段差部５１に入り込んでいるため、実装後の外観検査において、半導体パッケージ５０の側面から半田フィレットを容易に観察することができる。 FIG. 2 is a perspective view schematically showing the semiconductor package 50. As shown in FIG. 2, in the semiconductor package 50, a step portion 51 is formed at a boundary portion between the upper surface (the surface on which the terminal 52 is formed) and the side surface in the drawing. When the semiconductor package 50 is surface-mounted, the solder enters the stepped portion 51. As a result, a three-dimensional solder connection structure can be realized for the semiconductor package 50. Further, since the solder has entered the stepped portion 51, the solder fillet can be easily observed from the side surface of the semiconductor package 50 in the visual inspection after mounting.
　図３は、段差部５１の形成方法について説明するための図である。図３を参照して、段差部５１を形成するために、まず、第１の厚みを有するブレード４１によってパッケージ基板２０上に溝Ｇ１が形成される。その後、第２の厚み（第１の厚みよりも薄い）を有するブレード４１により位置Ｐ１においてパッケージ基板２０を切断することによって、パッケージ基板２０が個片化される。これにより、段差部５１が形成された複数の半導体パッケージ５０が製造される。 FIG. 3 is a diagram for explaining a method of forming the stepped portion 51. With reference to FIG. 3, in order to form the stepped portion 51, first, the groove G1 is formed on the package substrate 20 by the blade 41 having the first thickness. Then, the package substrate 20 is separated by cutting the package substrate 20 at the position P1 by the blade 41 having the second thickness (thinner than the first thickness). As a result, a plurality of semiconductor packages 50 in which the stepped portion 51 is formed are manufactured.
　上述のように、半導体パッケージ５０には、様々な利点が存在する。ハーフカットを行なうことによって、半導体パッケージ５０に形成されている段差部５１を実現することができる。切断装置１０は、例えば、半導体パッケージ５０を製造するために、パッケージ基板２０にハーフカットを施す機能を有している。 As mentioned above, the semiconductor package 50 has various advantages. By performing the half cut, the stepped portion 51 formed in the semiconductor package 50 can be realized. The cutting device 10 has, for example, a function of half-cutting the package substrate 20 in order to manufacture the semiconductor package 50.
　パッケージ基板２０にハーフカットが施された場合に、なるべく均一な深さの溝がパッケージ基板２０上に形成されることが重要である。切断装置１０においては、ハーフカットによって形成される溝の深さのばらつきを抑制するための工夫が施されている。以下、切断装置１０の構成等について詳細に説明する。 When the package substrate 20 is half-cut, it is important that grooves having as uniform a depth as possible are formed on the package substrate 20. The cutting device 10 is devised to suppress variations in the depth of the grooves formed by the half cut. Hereinafter, the configuration of the cutting device 10 and the like will be described in detail.
　＜１－２．切断装置の構成＞
　図４は、切断装置１０の一部を側方から示す模式図である。図４に示されるように、切断装置１０は、切断テーブル３０と、切断機構４０と、押さえ機構６０と、吐出機構７０とを含んでいる。 <1-2. Configuration of cutting device>
FIG. 4 is a schematic view showing a part of the cutting device 10 from the side. As shown in FIG. 4, the cutting device 10 includes a cutting table 30, a cutting mechanism 40, a pressing mechanism 60, and a discharging mechanism 70.
　押さえ機構６０及び吐出機構７０の各々は、切断機構４０に取り付けられている。押さえ機構６０は切断機構４０の後方に取り付けられており、吐出機構７０は切断機構４０の前方に取り付けられている。なお、切断機構４０の「前方」は、ブレード４１の下方の位置に切断テーブル３０が移動してくる場合に、切断テーブル３０が進入してくる方向である。ブレード４１は、Ｙ軸方向において、押さえ機構６０及び吐出機構７０によって挟まれている。押さえ機構６０は、ブレード４１に対して、吐出機構７０と反対側の位置に設けられている。これにより、押さえ機構６０と吐出機構７０との両方が、切断機構４０に取り付け可能となっている。 Each of the pressing mechanism 60 and the discharging mechanism 70 is attached to the cutting mechanism 40. The pressing mechanism 60 is attached to the rear of the cutting mechanism 40, and the discharge mechanism 70 is attached to the front of the cutting mechanism 40. The "front" of the cutting mechanism 40 is the direction in which the cutting table 30 enters when the cutting table 30 moves to a position below the blade 41. The blade 41 is sandwiched by the pressing mechanism 60 and the discharging mechanism 70 in the Y-axis direction. The pressing mechanism 60 is provided at a position opposite to the ejection mechanism 70 with respect to the blade 41. As a result, both the pressing mechanism 60 and the discharging mechanism 70 can be attached to the cutting mechanism 40.
　押さえ機構６０は、切断テーブル３０上に配置されるパッケージ基板２０を上方から下方に向けて押さえるように構成されている。押さえ機構６０の構成、及び、押さえ機構６０が設けられている理由については後程詳しく説明する。 The pressing mechanism 60 is configured to press the package substrate 20 arranged on the cutting table 30 from above to below. The configuration of the pressing mechanism 60 and the reason why the pressing mechanism 60 is provided will be described in detail later.
　吐出機構７０は、各々が加工液を吐出するように構成された３つのノズル（例えば、第１、第２及び第３ノズル）を含む。第１ノズルは、ブレード４１に向けて加工液を吐出する。第２ノズルは、ブレード４１とパッケージ基板２０との接触箇所（切断部分）に向けて加工液を吐出する。第３ノズルは、パッケージ基板２０の切断時に発生する不要な端剤部分に向けて加工液を吐出する。なお、吐出機構７０は、必ずしも３つのノズルを含む必要はない。例えば、吐出機構７０は、１つ又は２つのノズルによって構成されてもよいし、４つ以上のノズルによって構成されてもよい。吐出機構７０は、たとえば貯水タンク又は水道から供給される加工液を吐出する。吐出機構７０によって加工液が回転中のブレード４１に噴射されると、ブレード４１に多くの加工液が接触し、ブレード４１がより効果的に冷却される。また、加工液が切断部分に噴射されると、加工点に多くの加工液が供給され、切断時に発生する熱を抑制することができ、パッケージ基板２０を適切に切断することができる。また、加工液が端材部分に噴射されることで、切断テーブル３０上に残存する端材部分を除去することができる。 The discharge mechanism 70 includes three nozzles (for example, first, second and third nozzles) each of which is configured to discharge the machining fluid. The first nozzle discharges the processing liquid toward the blade 41. The second nozzle discharges the processing liquid toward the contact point (cut portion) between the blade 41 and the package substrate 20. The third nozzle discharges the processing liquid toward the unnecessary scrap portion generated when the package substrate 20 is cut. The discharge mechanism 70 does not necessarily have to include three nozzles. For example, the discharge mechanism 70 may be composed of one or two nozzles, or may be composed of four or more nozzles. The discharge mechanism 70 discharges the processing liquid supplied from, for example, a water storage tank or water supply. When the machining fluid is sprayed onto the rotating blade 41 by the discharge mechanism 70, a large amount of machining fluid comes into contact with the blade 41, and the blade 41 is cooled more effectively. Further, when the processing liquid is sprayed onto the cutting portion, a large amount of processing liquid is supplied to the processing point, heat generated during cutting can be suppressed, and the package substrate 20 can be appropriately cut. Further, by injecting the processing liquid onto the scrap portion, the scrap portion remaining on the cutting table 30 can be removed.
　図５は、押さえ機構６０とブレード４１との関係を側方から示す模式図である。図６は、押さえ機構６０を模式的に示す平面図である。図７は、押さえ機構６０とブレード４１との関係を正面から示す模式図である。 FIG. 5 is a schematic view showing the relationship between the pressing mechanism 60 and the blade 41 from the side. FIG. 6 is a plan view schematically showing the pressing mechanism 60. FIG. 7 is a schematic view showing the relationship between the pressing mechanism 60 and the blade 41 from the front.
　図５、図６及び図７を参照して、押さえ機構６０は、第１押さえ機構６１と、第２押さえ機構６２とを含んでいる。第１押さえ機構６１はブレード４１の一方の側面に近い位置に設けられており、第２押さえ機構６２はブレード４１の他方の側面に近い位置に設けられている。ブレード４１によるパッケージ基板２０の切断時に、ブレード４１は、第１押さえ機構６１及び第２押さえ機構６２によって挟まれた領域に位置している。すなわち、ブレード４１によるパッケージ基板２０の切断時に、側面視において、第１押さえ機構６１の一部分はブレード４１の一方の側面と対向し、第２押さえ機構６２の一部分はブレード４１の他方の側面と対向する。 With reference to FIGS. 5, 6 and 7, the pressing mechanism 60 includes a first pressing mechanism 61 and a second pressing mechanism 62. The first pressing mechanism 61 is provided at a position close to one side surface of the blade 41, and the second pressing mechanism 62 is provided at a position close to the other side surface of the blade 41. When the package substrate 20 is cut by the blade 41, the blade 41 is located in the region sandwiched by the first pressing mechanism 61 and the second pressing mechanism 62. That is, when the package substrate 20 is cut by the blade 41, a part of the first pressing mechanism 61 faces one side surface of the blade 41 and a part of the second pressing mechanism 62 faces the other side surface of the blade 41 in a side view. do.
　第１押さえ機構６１及び第２押さえ機構６２の各々は、パッケージ基板２０（図１）を上方から下方に向けて押さえるように構成されている。第１押さえ機構６１及び第２押さえ機構６２の各々は、板バネ６１０と、押さえユニット６２０と、ベース部材６３０，６４０と、ネジ６２４，６２５，６３１，６３３，６３４とを含んでいる。 Each of the first pressing mechanism 61 and the second pressing mechanism 62 is configured to press the package substrate 20 (FIG. 1) from above to below. Each of the first pressing mechanism 61 and the second pressing mechanism 62 includes a leaf spring 610, a pressing unit 620, base members 630, 640, and screws 624,625,631,633,634.
　ベース部材６３０，６４０，６５０の各々は、例えば、金属で構成されている。ベース部材６５０は、高さ方向に延びる板状の部材であり、切断機構４０の後端部に取り付けられている。ベース部材６５０の両側面の各々には、孔Ｈ１，Ｈ２が形成されている。孔Ｈ１，Ｈ２の各々は、縦長の孔である。孔Ｈ１，Ｈ２にネジを通すことで、ベース部材６５０が切断機構４０に固定される。孔Ｈ１，Ｈ２の各々において、ネジ留めする高さ方向の位置を変更することによって、押さえ機構６０の高さ方向における位置を変更することができる。 Each of the base members 630, 640, and 650 is made of, for example, metal. The base member 650 is a plate-shaped member extending in the height direction, and is attached to the rear end portion of the cutting mechanism 40. Holes H1 and H2 are formed on both side surfaces of the base member 650. Each of the holes H1 and H2 is a vertically long hole. By passing a screw through the holes H1 and H2, the base member 650 is fixed to the cutting mechanism 40. By changing the position in the height direction of screwing in each of the holes H1 and H2, the position of the pressing mechanism 60 in the height direction can be changed.
　ベース部材６４０は、ベース部材６５０の下端部から前方に延びる部材であり、ベース部材６５０に取り付けられている。ベース部材６３０は、ベース部材６４０の上面に取り付けられている棒状の部材であり、ベース部材６４０から前方に延びている。ベース部材６３０，６４０の各々にはネジ穴が形成されており、ベース部材６３０，６４０はネジ６３３，６３４によって互いにネジ留めされている。ベース部材６３０，６４０の各々に形成されている孔Ｈ３は、前後方向に長い形状を有し、ネジ留め位置を調整することによって、ローラ６２２の前後方向における位置を調整することができる。 The base member 640 is a member that extends forward from the lower end of the base member 650 and is attached to the base member 650. The base member 630 is a rod-shaped member attached to the upper surface of the base member 640 and extends forward from the base member 640. Screw holes are formed in each of the base members 630 and 640, and the base members 630 and 640 are screwed to each other by screws 633 and 634. The holes H3 formed in each of the base members 630 and 640 have a long shape in the front-rear direction, and the position of the roller 622 in the front-rear direction can be adjusted by adjusting the screwing position.
　ベース部材６３０の下面には、斜め下方に延びる板バネ６１０が取り付けられている。板バネ６１０は、例えば、金属製である。板バネ６１０にはネジ穴が形成されており、ベース部材６３０と板バネ６１０とはネジ６３２によって互いにネジ留めされている。ネジ６３１は、ベース部材６３０のネジ穴を貫通しており、板バネ６１０を上方から押さえる。板バネ６１０において、ネジ６３１によって押さえられる位置は、ネジ６３２によってベース部材６３０にネジ留めされる位置よりも前方である。ネジ６３１の高さ方向の位置を調整することによって、板バネ６１０の曲がり具合が調整される。これにより、板バネ６１０の弾性力が調整される。 A leaf spring 610 extending diagonally downward is attached to the lower surface of the base member 630. The leaf spring 610 is made of metal, for example. A screw hole is formed in the leaf spring 610, and the base member 630 and the leaf spring 610 are screwed to each other by a screw 632. The screw 631 penetrates the screw hole of the base member 630 and presses the leaf spring 610 from above. In the leaf spring 610, the position pressed by the screw 631 is ahead of the position screwed to the base member 630 by the screw 632. By adjusting the position of the screw 631 in the height direction, the bending degree of the leaf spring 610 is adjusted. As a result, the elastic force of the leaf spring 610 is adjusted.
　板バネ６１０の先端部には、押さえユニット６２０が取り付けられている。
押さえユニット６２０は、ベース部材６２１と、ローラ６２２と、回転軸６２３と、ネジ６２４，６２５とを含んでいる。ベース部材６２１は、例えば、金属又は樹脂で構成されている。ベース部材６２１にはネジ穴が形成されており、ベース部材６２１と板バネ６１０とはネジ６２４，６２５によって互いにネジ留めされている。平面視においてベース部材６２１の先端部には凹部が形成されており、該凹部にローラ６２２が位置している。ローラ６２２は、回転軸６２３を介してベース部材６２１に取り付けられており、ベース部材６２１に対して回転可能である。回転軸６２３は、Ｘ軸方向（ブレード４１の厚み方向）に延びている。ローラ６２２は、例えば、ゴム又は樹脂で構成されている。ローラ６２２は、本発明の「押さえ部材」の一例である。ゴム又は樹脂のような弾性のあるローラ６２２を用いることで、ローラ６２２で押さえた痕がパッケージ基板２０に付くことを低減することができる。また、ハーフカット時に発生するバリの押し潰しを低減することができる。 A pressing unit 620 is attached to the tip of the leaf spring 610.
The holding unit 620 includes a base member 621, a roller 622, a rotating shaft 623, and screws 624,625. The base member 621 is made of, for example, metal or resin. A screw hole is formed in the base member 621, and the base member 621 and the leaf spring 610 are screwed to each other by screws 624 and 625. In a plan view, a recess is formed at the tip of the base member 621, and the roller 622 is located in the recess. The roller 622 is attached to the base member 621 via a rotation shaft 623 and is rotatable with respect to the base member 621. The rotation shaft 623 extends in the X-axis direction (thickness direction of the blade 41). The roller 622 is made of, for example, rubber or resin. The roller 622 is an example of the "holding member" of the present invention. By using an elastic roller 622 such as rubber or resin, it is possible to reduce the marks pressed by the roller 622 from being attached to the package substrate 20. In addition, it is possible to reduce the crushing of burrs that occur during half-cutting.
　ローラ６２２の下方にパッケージ基板２０が存在しない状態で、ローラ６２２の下端は、ブレード４１の下端位置を示す仮想面Ｚ１よりも下方に位置する。したがって、パッケージ基板２０の切断時にはローラ６２２の下端がブレード４１の下端よりも高い位置にくるため、板バネ６１０の弾性力によってローラ６２２がパッケージ基板２０を押下する。 In a state where the package substrate 20 does not exist below the roller 622, the lower end of the roller 622 is located below the virtual surface Z1 indicating the lower end position of the blade 41. Therefore, when the package substrate 20 is cut, the lower end of the roller 622 comes to a position higher than the lower end of the blade 41, so that the roller 622 pushes the package substrate 20 by the elastic force of the leaf spring 610.
　図８は、パッケージ基板２０にハーフカットを施す場合における、ブレード４１とローラ６２２との位置関係を説明するための模式図である。図８に示されるように、パッケージ基板２０にハーフカットを施す場合に、ブレード４１はパッケージ基板２０の一部を削り取る。そのため、ブレード４１は、高さ方向において、パッケージ基板２０の上面よりも下方に進入する。一方、ハーフカットの形成時、ローラ６２２は、パッケージ基板２０の上面を押下する。したがって、ローラ６２２の下端は、ブレード４１の下端よりも高い位置にくる。 FIG. 8 is a schematic diagram for explaining the positional relationship between the blade 41 and the roller 622 when the package substrate 20 is half-cut. As shown in FIG. 8, when the package substrate 20 is half-cut, the blade 41 scrapes off a part of the package substrate 20. Therefore, the blade 41 enters below the upper surface of the package substrate 20 in the height direction. On the other hand, when forming the half cut, the roller 622 presses the upper surface of the package substrate 20. Therefore, the lower end of the roller 622 is higher than the lower end of the blade 41.
　また、Ｙ軸方向におけるローラ６２２の回転中心の位置（位置Ｐ６）は、Ｙ軸方向におけるブレード４１の回転中心の位置（位置Ｐ５）よりも前方に位置している。これは、ブレード４１によるパッケージ基板２０の切込み開始位置（位置Ｐ７）が、Ｙ軸方向におけるブレード４１の回転中心の位置（位置Ｐ５）よりも前方に位置しているためである。切断装置１０によれば、ローラ６２２の回転中心の位置がブレード４１の回転中心の位置よりも前方に位置しているため、切込み開始位置により近い位置においてパッケージ基板２０をローラ６２２によって押さえることができる。次に、切断装置１０において押さえ機構６０が設けられている理由について説明する。 Further, the position of the rotation center of the roller 622 in the Y-axis direction (position P6) is located ahead of the position of the rotation center of the blade 41 in the Y-axis direction (position P5). This is because the cutting start position (position P7) of the package substrate 20 by the blade 41 is located ahead of the position (position P5) of the rotation center of the blade 41 in the Y-axis direction. According to the cutting device 10, since the position of the rotation center of the roller 622 is located in front of the position of the rotation center of the blade 41, the package substrate 20 can be pressed by the roller 622 at a position closer to the cutting start position. .. Next, the reason why the pressing mechanism 60 is provided in the cutting device 10 will be described.
　＜１－３．押さえ機構が設けられている理由＞
　図９は、比較対象である切断装置１０Ｘの一部を側方から示す模式図である。図９に示されるように、切断装置１０Ｘは、押さえ機構を有していない。例えば、パッケージ基板２０が反っている場合がある。パッケージ基板２０が反った状態で、パッケージ基板２０にハーフカットを施すと、位置によって溝の深さがばらつくという問題が生じる。例えば、位置Ｐ２において形成される溝の深さよりも位置Ｐ３において形成される溝の深さの方が深く、位置Ｐ３において形成される溝の深さよりも位置Ｐ４において形成される溝の深さの方が深いということが生じる。本実施の形態１に従う切断装置１０においては、このような問題を解消するために、押さえ機構６０が設けられている。 <1-3. Reason for the holding mechanism>
FIG. 9 is a schematic view showing a part of the cutting device 10X to be compared from the side. As shown in FIG. 9, the cutting device 10X does not have a pressing mechanism. For example, the package substrate 20 may be warped. If the package substrate 20 is half-cut while the package substrate 20 is warped, there arises a problem that the depth of the groove varies depending on the position. For example, the depth of the groove formed at position P3 is deeper than the depth of the groove formed at position P2, and the depth of the groove formed at position P4 is greater than the depth of the groove formed at position P3. It happens that it is deeper. In the cutting device 10 according to the first embodiment, a pressing mechanism 60 is provided in order to solve such a problem.
　図１０は、本実施の形態１に従う切断装置１０における押さえ機構６０の有効性を説明するための図である。図１０に示されるように、切断装置１０においては、パッケージ基板２０にハーフカットを施す場合に、パッケージ基板２０の切断開始箇所に隣接する位置がローラ６２２によって押下される。ローラ６２２によって押下されることによってパッケージ基板２０の反りが抑制された状態で、パッケージ基板２０にハーフカットが施される。したがって、切断装置１０によれば、パッケージ基板２０の反りが抑制された状態でパッケージ基板２０のハーフカットが行なわれるため、ハーフカットによって形成される溝の深さのばらつきを抑制することができる。 FIG. 10 is a diagram for explaining the effectiveness of the pressing mechanism 60 in the cutting device 10 according to the first embodiment. As shown in FIG. 10, in the cutting device 10, when the package substrate 20 is half-cut, the position adjacent to the cutting start portion of the package substrate 20 is pressed by the roller 622. The package substrate 20 is half-cut while the warpage of the package substrate 20 is suppressed by being pressed by the roller 622. Therefore, according to the cutting device 10, since the package substrate 20 is half-cut while the warp of the package substrate 20 is suppressed, it is possible to suppress variations in the depth of the grooves formed by the half-cut.
　図１１は、ブレード４１の径が小さくなった状態における、押さえ機構６０とブレード４１との関係を側方から示す模式図である。図１１に示されるように、ブレード４１の径が小さくなったとしても、ローラ６２２は、板バネ６１０の弾性力によって下方に付勢されるため、切断対象物を上方から下方に向けて押さえつけることができる。 FIG. 11 is a schematic view showing the relationship between the pressing mechanism 60 and the blade 41 from the side when the diameter of the blade 41 is reduced. As shown in FIG. 11, even if the diameter of the blade 41 is reduced, the roller 622 is urged downward by the elastic force of the leaf spring 610, so that the object to be cut is pressed downward from above. Can be done.
　図１２は、押さえ機構６０の動作を説明するための模式図である。図１２に示されるように、押さえ機構６０が取り付けられた切断機構４０の一部には回転軸Ｊ１が設けられており、該切断機構４０の一部は回転するように構成されている。すなわち、該切断機構４０の一部が回転することによって、押さえ機構６０が、側面視においてブレード４１と重なる位置から退避する。その結果、ブレード４１の交換を容易に行なうことができる。このように、本実施の形態１に従う切断装置１０は、側面視においてブレード４１と重ならない位置まで押さえ機構６０を退避させるように構成された、回転軸Ｊ１を含む退避機構を含んでいるといえる。 FIG. 12 is a schematic diagram for explaining the operation of the pressing mechanism 60. As shown in FIG. 12, a rotation shaft J1 is provided in a part of the cutting mechanism 40 to which the pressing mechanism 60 is attached, and a part of the cutting mechanism 40 is configured to rotate. That is, by rotating a part of the cutting mechanism 40, the pressing mechanism 60 retracts from the position where it overlaps with the blade 41 in the side view. As a result, the blade 41 can be easily replaced. As described above, it can be said that the cutting device 10 according to the first embodiment includes a retracting mechanism including the rotation shaft J1 configured to retract the pressing mechanism 60 to a position where it does not overlap with the blade 41 in the side view. ..
　＜１－４．切断装置の動作＞
　例えば、以下の方法により、半導体パッケージ５０（図２）が製造される。切断装置１０において、第１の厚みのブレード４１が取り付けられる。 <1-4. Operation of cutting device>
For example, the semiconductor package 50 (FIG. 2) is manufactured by the following method. In the cutting device 10, a blade 41 having a first thickness is attached.
　その後、切断装置１０においては、切断機構４０の前方から、切断テーブル３０がブレード４１の下方に進入する。切断テーブル３０の進入に伴なって、押さえ機構６０が切断テーブル３０上のパッケージ基板２０を上方から下方に向けて押さえると共に、ブレード４１によるパッケージ基板２０のハーフカットが始まる。押さえ機構６０は切断機構４０に取り付けられているため、ハーフカットが施される場合に、押さえ機構６０とパッケージ基板２０との相対的な位置関係は、切断機構４０とパッケージ基板２０との相対的な位置関係と同じように変化する。 After that, in the cutting device 10, the cutting table 30 enters below the blade 41 from the front of the cutting mechanism 40. With the entry of the cutting table 30, the pressing mechanism 60 presses the package substrate 20 on the cutting table 30 from above to downward, and the blade 41 starts half-cutting the package substrate 20. Since the pressing mechanism 60 is attached to the cutting mechanism 40, when half-cutting is performed, the relative positional relationship between the pressing mechanism 60 and the package substrate 20 is the relative positional relationship between the cutting mechanism 40 and the package substrate 20. It changes in the same way as the positional relationship.
　パッケージ基板２０のハーフカットが完了すると、切断装置１０において、ブレード４１が取り替えられる。取り替え後のブレード４１は、第２の厚み（第１の厚みよりも薄い）を有する。 When the half-cut of the package substrate 20 is completed, the blade 41 is replaced in the cutting device 10. The replaced blade 41 has a second thickness (thinner than the first thickness).
　その後、切断装置１０においては、切断機構４０の前方から、切断テーブル３０がブレード４１の下方に進入する。切断テーブル３０の進入に伴なって、押さえ機構６０が切断テーブル３０上のパッケージ基板２０を上方から下方に向けて押さえると共に、ブレード４１によるパッケージ基板２０の切断が始まる。ハーフカットによって形成された溝に沿って、パッケージ基板２０の切断が行なわれることによって、複数の半導体パッケージ５０が完成する。 After that, in the cutting device 10, the cutting table 30 enters below the blade 41 from the front of the cutting mechanism 40. With the entry of the cutting table 30, the pressing mechanism 60 presses the package substrate 20 on the cutting table 30 from above to downward, and the blade 41 starts cutting the package substrate 20. A plurality of semiconductor packages 50 are completed by cutting the package substrate 20 along the grooves formed by the half cut.
　＜１－５．特徴＞
　以上のように、本実施の形態１に従う切断装置１０は、押さえ機構６０を備えており、パッケージ基板２０にハーフカットが施される場合に、第１押さえ機構６１及び第２押さえ機構６２の各々とパッケージ基板２０との相対的な位置関係は、切断機構４０とパッケージ基板２０との相対的な位置関係と同じように変化する。切断装置１０においては、パッケージ基板２０にハーフカットを施す場合に、パッケージ基板２０がローラ６２２によって押下される。ローラ６２２によって押下されることによってパッケージ基板２０の反りが抑制された状態で、パッケージ基板２０にハーフカットが施される。したがって、切断装置１０によれば、パッケージ基板２０の反りが抑制された状態でパッケージ基板２０のハーフカットが行なわれるため、ハーフカットによって形成される溝の深さのばらつきを抑制することができる。 <1-5. Features>
As described above, the cutting device 10 according to the first embodiment includes the pressing mechanism 60, and when the package substrate 20 is half-cut, each of the first pressing mechanism 61 and the second pressing mechanism 62 is provided. The relative positional relationship between and the package substrate 20 changes in the same manner as the relative positional relationship between the cutting mechanism 40 and the package substrate 20. In the cutting device 10, when the package substrate 20 is half-cut, the package substrate 20 is pressed by the roller 622. The package substrate 20 is half-cut while the warpage of the package substrate 20 is suppressed by being pressed by the roller 622. Therefore, according to the cutting device 10, since the package substrate 20 is half-cut while the warp of the package substrate 20 is suppressed, it is possible to suppress variations in the depth of the grooves formed by the half-cut.
　［２．実施の形態２］
　上記実施の形態１に従う切断装置１０は、押さえ機構６０を含んでいた。本実施の形態２に従う切断装置８０と、上記実施の形態１に従う切断装置１０とは、主に押さえ機構の構造が異なる。以下では、上記実施の形態１と異なる部分を中心に説明する。 [2. Embodiment 2]
The cutting device 10 according to the first embodiment includes a pressing mechanism 60. The structure of the pressing mechanism is mainly different between the cutting device 80 according to the second embodiment and the cutting device 10 according to the first embodiment. Hereinafter, the parts different from those of the first embodiment will be mainly described.
　＜２－１．切断装置の構成＞
　図１３は、本実施の形態２に従う切断装置８０の一部を側方から示す模式図である。図１３に示されるように、切断装置８０は、切断テーブル３０と、切断機構４０と、押さえ機構９０と、吐出機構７０とを含んでいる。 <2-1. Configuration of cutting device>
FIG. 13 is a schematic view showing a part of the cutting device 80 according to the second embodiment from the side. As shown in FIG. 13, the cutting device 80 includes a cutting table 30, a cutting mechanism 40, a pressing mechanism 90, and a discharging mechanism 70.
　押さえ機構９０及び吐出機構７０の各々は、切断機構４０に取り付けられている。押さえ機構９０は切断機構４０の後方に取り付けられており、吐出機構７０は切断機構４０の前方に取り付けられている。ブレード４１は、Ｙ軸方向において、押さえ機構９０及び吐出機構７０によって挟まれている。押さえ機構９０は、ブレード４１に対して、吐出機構７０と反対側の位置に設けられている。これにより、押さえ機構９０と吐出機構７０との両方が、切断機構４０に取り付け可能となっている。押さえ機構９０は、切断テーブル３０上に配置されるパッケージ基板２０を上方から下方に向けて押さえるように構成されている。 Each of the pressing mechanism 90 and the discharging mechanism 70 is attached to the cutting mechanism 40. The pressing mechanism 90 is attached to the rear of the cutting mechanism 40, and the discharge mechanism 70 is attached to the front of the cutting mechanism 40. The blade 41 is sandwiched by the pressing mechanism 90 and the discharging mechanism 70 in the Y-axis direction. The pressing mechanism 90 is provided at a position opposite to the ejection mechanism 70 with respect to the blade 41. As a result, both the pressing mechanism 90 and the discharging mechanism 70 can be attached to the cutting mechanism 40. The pressing mechanism 90 is configured to press the package substrate 20 arranged on the cutting table 30 from above to below.
　図１４は、押さえ機構９０とブレード４１との関係を側方から示す模式図である。図１５は、押さえ機構９０を模式的に示す平面図である。図１６は、押さえ機構９０とブレード４１との関係を正面から示す模式図である。 FIG. 14 is a schematic view showing the relationship between the pressing mechanism 90 and the blade 41 from the side. FIG. 15 is a plan view schematically showing the pressing mechanism 90. FIG. 16 is a schematic view showing the relationship between the pressing mechanism 90 and the blade 41 from the front.
　図１４、図１５及び図１６を参照して、押さえ機構９０は、第１押さえ機構９１と、第２押さえ機構９２とを含んでいる。第１押さえ機構９１はブレード４１の一方の側面に近い位置に設けられており、第２押さえ機構９２はブレード４１の他方の側面に近い位置に設けられている。ブレード４１によるパッケージ基板２０の切断時に、ブレード４１は、第１押さえ機構９１及び第２押さえ機構９２によって挟まれた領域に位置している。すなわち、ブレード４１によるパッケージ基板２０の切断時に、側面視において、第１押さえ機構９１の一部分はブレード４１の一方の側面と対向し、第２押さえ機構９２の一部分はブレード４１の他方の側面と対向する。 With reference to FIGS. 14, 15 and 16, the pressing mechanism 90 includes a first pressing mechanism 91 and a second pressing mechanism 92. The first pressing mechanism 91 is provided at a position close to one side surface of the blade 41, and the second pressing mechanism 92 is provided at a position close to the other side surface of the blade 41. When the package substrate 20 is cut by the blade 41, the blade 41 is located in the region sandwiched by the first pressing mechanism 91 and the second pressing mechanism 92. That is, when the package substrate 20 is cut by the blade 41, a part of the first pressing mechanism 91 faces one side surface of the blade 41 and a part of the second pressing mechanism 92 faces the other side surface of the blade 41 in a side view. do.
　第１押さえ機構９１及び第２押さえ機構９２の各々は、パッケージ基板２０を上方から下方に向けて押さえるように構成されている。第１押さえ機構９１は、ベース部材９４０と、押さえユニット９５０，９６０とを含んでいる。第２押さえ機構９２は、ベース部材９１０と、押さえユニット９２０，９３０とを含んでいる。 Each of the first pressing mechanism 91 and the second pressing mechanism 92 is configured to press the package substrate 20 from above to below. The first pressing mechanism 91 includes a base member 940 and pressing units 950 and 960. The second pressing mechanism 92 includes a base member 910 and pressing units 920 and 930.
　ベース部材９１０，９４０，９７０の各々は、例えば、金属で構成されている。ベース部材９１０，９４０，９７０によって構成される部材は、略Ｌ字状の部材であり、切断機構４０の後端部に取り付けられている。該部材の両側面の各々には、孔Ｈ４，Ｈ５が形成されている。孔Ｈ４，Ｈ５の各々は、縦長の孔である。孔Ｈ４，Ｈ５にネジを通すことで、該部材が切断機構４０に固定されている。孔Ｈ４，Ｈ５の各々において、ネジ留めする高さ方向の位置を変更することによって、押さえ機構９０の高さ方向における位置を変更することができる。また、ベース部材９１０，９４０の各々には、Ｘ軸方向（ブレード４１の厚み方向）に延びる支え軸９２６が形成されている。 Each of the base members 910, 940, and 970 is made of, for example, metal. The member composed of the base members 910, 940, and 970 is a substantially L-shaped member, and is attached to the rear end portion of the cutting mechanism 40. Holes H4 and H5 are formed on each of both side surfaces of the member. Each of the holes H4 and H5 is a vertically long hole. The member is fixed to the cutting mechanism 40 by passing a screw through the holes H4 and H5. By changing the position in the height direction of screwing in each of the holes H4 and H5, the position of the pressing mechanism 90 in the height direction can be changed. Further, each of the base members 910 and 940 is formed with a support shaft 926 extending in the X-axis direction (thickness direction of the blade 41).
　押さえユニット９２０，９３０，９５０，９６０の各々は、回転部材９２１と、ローラ９２２と、回転軸９２３，９２５と、ねじりバネ９２４とを含んでいる。回転軸９２３，９２５の各々は、Ｘ軸方向に延びている。回転部材９２１は、例えば、金属製の板状部材であり、ベース部材９１０又はベース部材９４０に回転可能に取り付けられている。ベース部材９１０又はベース部材９４０と、回転部材９２１とは、回転軸９２５を介して取り付けられている。回転軸９２５の周囲には、ねじりバネ９２４が取り付けられている。 Each of the holding units 920, 930, 950, and 960 includes a rotating member 921, a roller 922, a rotating shaft 923, 925, and a torsion spring 924. Each of the rotating shafts 923 and 925 extends in the X-axis direction. The rotating member 921 is, for example, a metal plate-shaped member, and is rotatably attached to the base member 910 or the base member 940. The base member 910 or the base member 940 and the rotating member 921 are attached via a rotating shaft 925. A torsion spring 924 is attached around the rotating shaft 925.
　回転部材９２１の先端部には、ローラ９２２が回転可能に取り付けられている。ローラ９２２は、例えば、ゴム又は樹脂で構成されている。回転部材９２１とローラ９２２とは、回転軸９２３を介して接続されている。ねじりバネ９２４の一端は回転軸９２３を下方に押さえ、ねじりバネ９２４の他端は支え軸９２６を下方に押さえる。これにより、ローラ９２２は、回転方向に付勢される。なお、ブレード４１の厚み方向において、ローラ９２２は、回転部材９２１の内側に取り付けられている。すなわち、ローラ９２２とブレード４１との間の長さは、回転部材９２１とブレード４１との間の長さよりも短い。これにより、パッケージ基板２０にハーフカットを施す場合に、ハーフカット位置により近い位置をローラ９２２によって押さえることができる。押さえユニット９３０，９６０に含まれている回転部材９２１は、本発明の「第１回転部材」の一例であり、該回転部材９２１に取り付けられているローラ９２２は、本発明の「第１押さえ部材」の一例である。また、押さえユニット９２０，９５０に含まれている回転部材９２１は、本発明の「第２回転部材」の一例であり、該回転部材９２１に取り付けられているローラ９２２は、本発明の「第２押さえ部材」の一例である。 A roller 922 is rotatably attached to the tip of the rotating member 921. The roller 922 is made of, for example, rubber or resin. The rotating member 921 and the roller 922 are connected via a rotating shaft 923. One end of the torsion spring 924 presses the rotary shaft 923 downward, and the other end of the torsion spring 924 presses the support shaft 926 downward. As a result, the roller 922 is urged in the rotational direction. The roller 922 is attached to the inside of the rotating member 921 in the thickness direction of the blade 41. That is, the length between the roller 922 and the blade 41 is shorter than the length between the rotating member 921 and the blade 41. As a result, when the package substrate 20 is half-cut, a position closer to the half-cut position can be pressed by the roller 922. The rotating member 921 included in the pressing units 930 and 960 is an example of the "first rotating member" of the present invention, and the roller 922 attached to the rotating member 921 is the "first pressing member" of the present invention. Is an example. Further, the rotating member 921 included in the holding units 920 and 950 is an example of the "second rotating member" of the present invention, and the roller 922 attached to the rotating member 921 is the "second rotating member" of the present invention. This is an example of a "holding member".
　ローラ９２２の下方にパッケージ基板２０が存在しない状態で、ローラ９２２の下端は、ブレード４１の下端位置を示す仮想面Ｚ２よりも下方に位置する。したがって、パッケージ基板２０の切断時にはローラ９２２の下端がブレード４１の下端よりも高い位置にくるため、ねじりバネ９２４の弾性力によってローラ９２２がパッケージ基板２０を押下する。 In a state where the package substrate 20 does not exist below the roller 922, the lower end of the roller 922 is located below the virtual surface Z2 indicating the lower end position of the blade 41. Therefore, when the package substrate 20 is cut, the lower end of the roller 922 comes to a position higher than the lower end of the blade 41, so that the roller 922 pushes the package substrate 20 by the elastic force of the torsion spring 924.
　図１７は、ブレード４１の径が小さくなった状態における、押さえ機構９０とブレード４１との関係を側方から模式的に示す図である。図１７に示されるように、ブレード４１の径が小さくなったとしても、ローラ９２２は、ねじりバネ９２４の弾性力によって下方に付勢されているため、切断対象物を上方から下方に向けて押さえつけることができる。 FIG. 17 is a diagram schematically showing the relationship between the pressing mechanism 90 and the blade 41 from the side when the diameter of the blade 41 is reduced. As shown in FIG. 17, even if the diameter of the blade 41 is reduced, the roller 922 is urged downward by the elastic force of the torsion spring 924, so that the object to be cut is pressed downward from above. be able to.
　なお、本実施の形態２に従う切断装置８０においても、図１２によって示されたような退避機構が設けられている。 The cutting device 80 according to the second embodiment is also provided with a retracting mechanism as shown by FIG.
　＜２－２．特徴＞
　以上のように、本実施の形態２に従う切断装置８０は、押さえ機構９０を備えており、パッケージ基板２０にハーフカットが施される場合に、第１押さえ機構９１及び第２押さえ機構９２の各々とパッケージ基板２０との相対的な位置関係は、切断機構４０とパッケージ基板２０との相対的な位置関係と同じように変化する。切断装置８０においては、パッケージ基板２０にハーフカットを施す場合に、パッケージ基板２０がローラ９２２によって押下される。ローラ９２２によって押下されることによってパッケージ基板２０の反りが抑制された状態で、パッケージ基板２０にハーフカットが施される。したがって、切断装置８０によれば、パッケージ基板２０の反りが抑制された状態でパッケージ基板２０のハーフカットが行なわれるため、ハーフカットによって形成される溝の深さのばらつきを低減することができる。 <2-2. Features>
As described above, the cutting device 80 according to the second embodiment includes the pressing mechanism 90, and when the package substrate 20 is half-cut, each of the first pressing mechanism 91 and the second pressing mechanism 92 is provided. The relative positional relationship between and the package substrate 20 changes in the same manner as the relative positional relationship between the cutting mechanism 40 and the package substrate 20. In the cutting device 80, when the package substrate 20 is half-cut, the package substrate 20 is pressed by the roller 922. The package substrate 20 is half-cut while the warpage of the package substrate 20 is suppressed by being pressed by the rollers 922. Therefore, according to the cutting device 80, since the package substrate 20 is half-cut while the warp of the package substrate 20 is suppressed, it is possible to reduce the variation in the depth of the groove formed by the half-cut.
　［３．他の実施の形態］
　上記実施の形態１，２の思想は、以上で説明された実施の形態１，２に限定されない。以下、上記実施の形態１，２の思想を適用できる他の実施の形態の一例について説明する。 [3. Other embodiments]
The ideas of the first and second embodiments are not limited to the first and second embodiments described above. Hereinafter, an example of another embodiment to which the ideas of the first and second embodiments can be applied will be described.
　上記実施の形態１，２においては、保持部材３１の上面が平らであった。しかしながら、保持部材３１の上面は、必ずしも完全に平らである必要はない。例えば、パッケージ基板２０の反りに合わせて、保持部材３１の上面が反っていてもよい。この場合には、ブレード４１の高さ位置を調整しながら、パッケージ基板２０にハーフカットが施される。この場合であっても、保持部材３１の上面よりもパッケージ基板２０がさらに反っている場合に、押さえ機構が有効に機能する。 In the first and second embodiments, the upper surface of the holding member 31 was flat. However, the upper surface of the holding member 31 does not necessarily have to be completely flat. For example, the upper surface of the holding member 31 may be warped according to the warp of the package substrate 20. In this case, the package substrate 20 is half-cut while adjusting the height position of the blade 41. Even in this case, the pressing mechanism functions effectively when the package substrate 20 is further warped from the upper surface of the holding member 31.
　また、上記実施の形態１，２においては、切断テーブル３０がＹ軸方向に移動することによって、パッケージ基板２０の切断が行なわれた。しかしながら、切断方法はこれに限定されない。切断テーブル３０が可能な動作は回転動作のみとし、切断機構４０をＹ軸方向に移動させることによって、パッケージ基板２０の切断が行なわれてもよい。すなわち、切断テーブル３０と切断機構４０とを相対的に移動させてパッケージ基板２０の切断が行なわれればよい。 Further, in the above-described first and second embodiments, the package substrate 20 is cut by moving the cutting table 30 in the Y-axis direction. However, the cutting method is not limited to this. The operation that the cutting table 30 can perform is only the rotation operation, and the package substrate 20 may be cut by moving the cutting mechanism 40 in the Y-axis direction. That is, the package substrate 20 may be cut by relatively moving the cutting table 30 and the cutting mechanism 40.
　また、上記実施の形態１において、例えば、ベース部材６３０，６４０，６５０は、一体的に形成されてもよい。 Further, in the first embodiment, for example, the base members 630, 640, and 650 may be integrally formed.
　また、上記実施の形態２において、ベース部材９１０，９４０，９７０は、一体的に形成されてもよい。 Further, in the second embodiment, the base members 910, 940, and 970 may be integrally formed.
　以上、本発明の実施の形態について例示的に説明した。すなわち、例示的な説明のために、詳細な説明及び添付の図面が開示された。よって、詳細な説明及び添付の図面に記載された構成要素の中には、課題解決のために必須でない構成要素が含まれることがある。したがって、それらの必須でない構成要素が詳細な説明及び添付の図面に記載されているからといって、それらの必須でない構成要素が必須であると直ちに認定されるべきではない。 The embodiments of the present invention have been exemplified above. That is, for illustrative purposes, detailed description and accompanying drawings have been disclosed. Therefore, some of the components described in the detailed description and the attached drawings may include components that are not essential for solving the problem. Therefore, just because those non-essential components are described in detail and in the accompanying drawings should not be immediately determined to be essential.
　また、上記実施の形態は、あらゆる点において本発明の例示にすぎない。上記実施の形態は、本発明の範囲内において、種々の改良や変更が可能である。すなわち、本発明の実施にあたっては、実施の形態に応じて具体的構成を適宜採用することができる。 Moreover, the above-described embodiment is merely an example of the present invention in all respects. The above-described embodiment can be variously improved or modified within the scope of the present invention. That is, in carrying out the present invention, a specific configuration can be appropriately adopted according to the embodiment.
　１０，１０Ｘ，８０　切断装置、２０　パッケージ基板、３０　切断テーブル、３１　保持部材、３２　回転機構、３３　　移動機構、４０　切断機構、４１　ブレード、５０　半導体パッケージ、５１　段差部、５２　端子、６０，９０　押さえ機構、６１，９１　第１押さえ機構、６２，９２　第２押さえ機構、７０　吐出機構、６１０　板バネ、６２０，９２０，９３０，９５０，９６０　押さえユニット、６２１，６３０，６４０，６５０，９１０，９４０，９７０　ベース部材、６２２，９２２　ローラ、６２３，９２３，９２５，Ｊ１　回転軸、６２４，６２５，６３１，６３２，６３３，６３４　ネジ、９２１　回転部材、９２４　ねじりバネ、９２６　支え軸、Ｇ１　溝、Ｈ１，Ｈ２，Ｈ３，Ｈ４，Ｈ５　孔、Ｐ１，Ｐ２，Ｐ３，Ｐ４，Ｐ５，Ｐ６，Ｐ７　位置、Ｚ１，Ｚ２　仮想面。 10, 10X, 80 cutting device, 20 package board, 30 cutting table, 31 holding member, 32 rotation mechanism, 33 moving mechanism, 40 cutting mechanism, 41 blade, 50 semiconductor package, 51 stepped part, 52 terminal, 60, 90 presser Mechanism, 61, 91 1st presser mechanism, 62,92 2nd presser mechanism, 70 discharge mechanism, 610 leaf spring, 620,920,930,950,960 presser unit, 621,630,640,650,910,940, 970 base member, 622,922 roller, 623, 923,925, J1 rotary shaft, 624,625,631,632,633,634 screw, 921 rotary member, 924 torsion spring, 926 support shaft, G1 groove, H1, H2 , H3, H4, H5 hole, P1, P2, P3, P4, P5, P6, P7 position, Z1, Z2 virtual surface.

Claims (9)

  1. 　樹脂成形された切断対象物において、前記切断対象物の厚さ方向にハーフカットを施すように構成された切断装置であって、
    　前記切断対象物を切断するブレードを有する切断機構を備え、
    　前記ブレードは、第１側面と、第２側面とを有し、
    　前記切断装置は、
    　前記第１側面に対向する位置に設けられた第１押さえ機構と、
    　前記第２側面に対向する位置に設けられた第２押さえ機構とをさらに備え、
    　前記第１及び第２押さえ機構の各々は、前記切断対象物を上方から下方に向けて押さえるように構成されており、
    　前記ハーフカットが施される場合に、前記第１及び第２押さえ機構の各々と前記切断対象物との相対的な位置関係は、前記切断機構と前記切断対象物との相対的な位置関係と同じように変化する、切断装置。     A cutting device configured to perform a half cut in a resin-molded cutting object in the thickness direction of the cutting object.
    A cutting mechanism having a blade for cutting the object to be cut is provided.
    The blade has a first side surface and a second side surface.
    The cutting device is
    A first pressing mechanism provided at a position facing the first side surface,
    Further provided with a second pressing mechanism provided at a position facing the second side surface.
    Each of the first and second pressing mechanisms is configured to press the object to be cut from above to below.
    When the half cut is applied, the relative positional relationship between each of the first and second pressing mechanisms and the cutting object is the relative positional relationship between the cutting mechanism and the cutting object. A cutting device that changes in the same way.
  2. 　前記第１及び第２押さえ機構の各々は、
    　前記ブレードの後方よりも前方に近い位置に設けられた第１押さえ部材と、
    　前記ブレードの前方よりも後方に近い位置に設けられた第２押さえ部材とを備え、
    　前記第１及び第２押さえ部材の各々は、前記切断対象物を上方から下方に向けて押さえるように構成されている、請求項１に記載の切断装置。     Each of the first and second pressing mechanisms
    The first holding member provided at a position closer to the front than the rear of the blade, and
    A second holding member provided at a position closer to the rear than the front of the blade is provided.
    The cutting device according to claim 1, wherein each of the first and second pressing members is configured to press the object to be cut from above to below.
  3. 　前記第１及び第２押さえ機構の各々は、
    　回転方向に力が働くように構成され、前記第１押さえ部材が取り付けられている第１回転部材と、
    　回転方向に力が働くように構成され、前記第２押さえ部材が取り付けられている第２回転部材とをさらに備え、
    　前記第１押さえ部材と前記ブレードとの間の長さは、前記第１回転部材と前記ブレードとの間の長さよりも短く、
    　前記第２押さえ部材と前記ブレードとの間の長さは、前記第２回転部材と前記ブレードとの間の長さよりも短い、請求項２に記載の切断装置。     Each of the first and second pressing mechanisms
    A first rotating member configured to exert a force in the rotational direction and to which the first holding member is attached, and a first rotating member.
    It is further provided with a second rotating member which is configured to exert a force in the rotational direction and to which the second holding member is attached.
    The length between the first holding member and the blade is shorter than the length between the first rotating member and the blade.
    The cutting device according to claim 2, wherein the length between the second pressing member and the blade is shorter than the length between the second rotating member and the blade.
  4. 　前記第１及び第２押さえ機構の各々は押さえ部材を備え、
    　前記押さえ部材は、前記ブレードの回転中心よりも前方の位置において、前記切断対象物を上方から下方に向けて押さえるように構成されている、請求項１に記載の切断装置。     Each of the first and second pressing mechanisms includes a pressing member.
    The cutting device according to claim 1, wherein the holding member is configured to hold the cutting object from above to below at a position in front of the rotation center of the blade.
  5. 　側面視において、前記ブレードと重ならない位置まで、前記第１及び第２押さえ機構の各々を退避させるように構成された退避機構をさらに備える、請求項１から請求項４のいずれか１項に記載の切断装置。 The aspect according to any one of claims 1 to 4, further comprising a retracting mechanism configured to retract each of the first and second pressing mechanisms to a position where they do not overlap the blade in a side view. Cutting device.
  6. 　前記ブレードの前方から加工液を吐出する吐出機構をさらに備え、
    　前記退避機構は、前記ブレードに対して前記吐出機構と反対側の位置に設けられている、請求項５に記載の切断装置。     Further equipped with a discharge mechanism for discharging the machining fluid from the front of the blade,
    The cutting device according to claim 5, wherein the retracting mechanism is provided at a position opposite to the discharging mechanism with respect to the blade.
  7. 　前記第１及び第２押さえ部材の各々は、ローラによって構成されている、請求項２又は請求項３に記載の切断装置。 The cutting device according to claim 2 or 3, wherein each of the first and second pressing members is composed of a roller.
  8. 　前記押さえ部材は、ローラによって構成されている、請求項４に記載の切断装置。 The cutting device according to claim 4, wherein the holding member is composed of a roller.
  9. 　請求項１から請求項８のいずれか１項に記載の切断装置を用いた切断品の製造方法であって、
    　第１厚みの前記ブレードが取り付けられた前記切断装置を準備するステップと、
    　前記切断対象物にハーフカットを施すステップと、
    　前記ブレードを前記第１厚みよりも薄い第２厚みのブレードに取り替えるステップと、
    　前記ハーフカットが施された位置に沿って、前記切断対象物を切断するステップとを含む、切断品の製造方法。     A method for manufacturing a cut product using the cutting device according to any one of claims 1 to 8.
    The step of preparing the cutting device to which the blade of the first thickness is attached, and
    The step of half-cutting the object to be cut and
    The step of replacing the blade with a blade having a second thickness thinner than the first thickness,
    A method for manufacturing a cut product, which comprises a step of cutting the object to be cut along the position where the half cut is applied.
PCT/JP2021/035844 2020-11-17 2021-09-29 Cutting device, and method for manufacturing cut product WO2022107455A1 (en)

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JP2008103648A (en) * 2006-10-23 2008-05-01 Matsushita Electric Ind Co Ltd Apparatus for manufacturing semiconductor device, and method for manufacturing the semiconductor device
JP2009101617A (en) * 2007-10-24 2009-05-14 Seiko Epson Corp Auto cutter-fitted printer
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