TWI801483B - Package structure of simple circuit board and chip - Google Patents

Abstract

A simple package structure of circuit board and chip, comprising a first chip, at least one first chip contact is arranged under the first chip; a circuit board is positioned under the first chip, wherein there is a position above the circuit board The circuit board contacts corresponding to the first chip contacts of the first chip; the first chip contacts are bonded to the corresponding circuit board contacts of the circuit board during packaging, so that the first chip is combined with the circuit board ; Wherein the first chip contact is combined with the circuit board contact by ACF rubber ball bonding or convex joint bonding; wherein the ACF rubber ball bonding system is the combination of using ACF rubber balls as solder joints and the pads of the other party way, to combine the chip with the circuit board; and wherein the bump joint is the application of bumps of the same material and other flat contacts or bumps, which are respectively placed in the circuit board and the chip, and applied Physical or chemical methods combine the bumps with other flat contacts or bumps, so that the circuit board is combined with the chip. The above bonding method can also be used to bond wafers with multiple chips and circuit board groups.

Description

Package structure of simple circuit board and chip

The present invention relates to, in particular, a package structure of a simple circuit board and a chip.

In the conventional semiconductor multi-layer chip packaging structure, pads are manufactured on the circuit board and the chip, and then the connection between the pads is used to achieve signal communication. Finally, an encapsulation layer is formed to achieve the purpose of overall encapsulation. In order to adapt to the positions of solder joints between different boards in the structure of the prior art, the connecting wires must be wound and arranged in different positions of the entire circuit structure. Winding will lead to difficulties in operation and increased man-hours. In addition, epoxy resin must be encapsulated on different surfaces during packaging, so the thickness of the overall structure increases. On the one hand, it increases costs and man-hours, and also reduces the heat dissipation effect .

In order to improve the shortcomings of the conventional packaging structure, the inventor conceived of forming an opening on the upper circuit board, so that the signal connection line is connected to the lower chip and the upper circuit board through the opening, such as the U.S. Patent No. US9299626B2, which is applied The wafer-level packaging structure is formed by the wire bonding process, which is applicable to the packaging structure of large chips, so that the overall structure can be simplified and the packaging cost can be saved. The inventor is engaged in this industry, and after many considerations, he found that many circuit structures are actually much more complex than the circuit structure described in the patent, so the inventor wants to use this circuit structure to solve the problem of more complex chip packaging structures. .

Therefore this case hopes to propose a kind of brand-new packaging structure of simple type circuit board and chip, to solve above-mentioned defective in prior art.

Therefore, the purpose of the present invention is to solve the above-mentioned problems in the prior art. In the present invention, a simple packaging structure of circuit board and chip is proposed, which can make the contacts and wires all be hidden inside and not exposed. Therefore The packaging structure can be reduced, so the entire man-hours and operating procedures during packaging can be reduced, so the entire manufacturing cost will also be reduced accordingly.

In order to achieve the above object, the present invention proposes a simple circuit board and chip packaging structure, including a first chip, at least one first chip contact is arranged below the first chip; a circuit board is positioned under the first chip , wherein there is a circuit board contact corresponding to the first chip contact of the first chip above the circuit board; the first chip contact is combined with the corresponding circuit board contact of the circuit board during packaging, so that The first chip is bonded to the circuit board; wherein the first chip contact is bonded to the circuit board contact by ACF rubber ball bonding or convex joint bonding; wherein the ACF rubber ball bonding system is the use of ACF rubber balls as solder joints The method of bonding with the gasket of the other party to bond the chip to the circuit board; and wherein the bump bonding is the application of bumps of the same material and other flat or bumps, which are respectively placed on the In the circuit board and the chip, and use physical or chemical methods to combine the bumps with other flat contacts or bumps, so that the circuit board and the chip are combined.

This case also proposes a simple circuit board and wafer packaging structure, including a first wafer, the first wafer includes a plurality of first chips, each of which has at least one first chip contact under the first chip; The circuit board group is located under the first wafer, and the circuit board group includes a plurality of circuit boards whose number corresponds to the plurality of first chips, wherein each circuit board has a position corresponding to the first wafer above each circuit board. The circuit board contact of the first chip contact of the first chip; the first chip contact is combined with the corresponding circuit board contact of the circuit board group during packaging, so that the first wafer is combined with the circuit board group ; Wherein the mode of combining the first chip contact with the circuit board contact is ACF rubber ball combination or convex contact Combination; wherein the ACF rubber ball combination is the combination of using ACF rubber balls as the welding joint and the pad of the other party, so as to combine the wafer and the circuit board group; wherein the convex joint combination is the application of the same material The convex contact and the flat contact are placed in the circuit board group and the wafer respectively, and the convex contact and the flat contact are combined by physical or chemical methods, so that the circuit board group is combined with the wafer.

The features and advantages of the present invention can be further understood from the following description, please refer to the accompanying drawings when reading.

10’‧‧‧first wafer

10‧‧‧The first chip

11‧‧‧The first chip contact

20’‧‧‧circuit board set

20‧‧‧circuit board

21‧‧‧circuit board contacts

23‧‧‧The first groove

25‧‧‧wire

27‧‧‧The second groove

29‧‧‧Contact

30‧‧‧Second chip

31‧‧‧Second chip contacts

40‧‧‧The third chip

41‧‧‧wire

42‧‧‧Contact

50‧‧‧The third groove

60‧‧‧The fourth groove

70‧‧‧film

111‧‧‧flat contact

112’‧‧‧Convex contact

112‧‧‧Convex contact

150’‧‧‧lead wire

152’‧‧‧lead substrate

201‧‧‧colloid

202‧‧‧Metal conductor

211‧‧‧ACF rubber ball

212’‧‧‧Convex contact

212‧‧‧flat contact

231‧‧‧groove contact

500‧‧‧circuit components

FIG. 1 shows a schematic cross-sectional view of a first application example of the first embodiment of the present application.

Fig. 2 shows another schematic cross-sectional view of the first application example of the first embodiment of the present application.

Fig. 3 shows a schematic cross-sectional view of the ACF rubber ball of the first embodiment of the present case.

FIG. 4 shows a schematic cross-sectional view of the ACF rubber ball of the first embodiment shown in FIG. 3 after pressing.

FIG. 5 shows a schematic cross-sectional view of a second application example of the first embodiment of the present invention.

FIG. 6 shows another schematic cross-sectional view of the second application example of the first embodiment of the present application.

FIG. 7 shows a schematic cross-sectional view of a third application example of the first embodiment of the present invention.

FIG. 8 shows another schematic cross-sectional view of the third application example of the first embodiment of the present application.

FIG. 9 shows a schematic cross-sectional view of a fourth application example of the first embodiment of the present application.

FIG. 10 shows another schematic cross-sectional view of the fourth application example of the first embodiment of the present application.

FIG. 11 shows a partial plan view of the third groove disposed on the circuit board of the present case.

Fig. 12 shows a schematic cross-sectional view of the first application example of the second embodiment of the present application.

Fig. 13 shows another schematic cross-sectional view of the first application example of the second embodiment of the present application.

FIG. 14 shows a schematic cross-sectional view of a second application example of the second embodiment of the present application.

FIG. 15 shows another schematic cross-sectional view of the second application example of the second embodiment of the present application.

FIG. 16 shows a schematic cross-sectional view of a third application example of the second embodiment of the present application.

Fig. 17 shows another schematic cross-sectional view of the third application example of the second embodiment of the present application.

FIG. 18 shows a schematic cross-sectional view of the circuit board assembly cut first and pasted on the adhesive film in the second embodiment of the present case.

FIG. 19 shows a schematic cross-sectional view of cutting individual first chips and their corresponding circuit boards into single units in the second embodiment of the present application.

FIG. 20 shows a schematic cross-sectional view of another implementation of the second application example of the first embodiment of the present application.

FIG. 21 shows a schematic view of the wires in FIG. 20 installed on a wire substrate.

Fig. 22 shows a schematic cross-sectional view of yet another implementation of the second application example of the first embodiment of the present application.

FIG. 23 shows a schematic view of the wires in FIG. 22 installed on a wire substrate.

Hereby, with regard to the structural composition of this case, and the effects and advantages that can be produced, in conjunction with the drawings, one of the preferred embodiments of this case is described in detail as follows.

Please refer to Fig. 1 to shown in Fig. 11, show the first embodiment of the package structure of simple type circuit board and chip of the present invention, comprise following element: a first chip 10, there is at least one first chip 10 below Wafer contact 11.

A circuit board 20 is located below the first chip 10 , wherein above the circuit board 20 there are circuit board contacts 21 corresponding in position to the first chip contacts 11 of the first chip 10 .

During packaging, the first chip contact 11 is bonded to the corresponding circuit board contact 21 of the circuit board 20 , as shown in FIG. 2 , so that the first chip 10 is bonded to the circuit board 20 . where the first wafer The contact 11 can be combined with the contact 21 of the circuit board by ACF rubber ball bonding or convex contact bonding.

In the first application example of this embodiment, it is ACF rubber ball bonding, which uses ACF rubber balls as the bonding method of the welding joint and the pad of the other party, so as to bond the chip and the circuit board.

In this ACF rubber ball combination, as shown in FIG. 1, the first chip contact 11 is a flat contact (gasket, pad) 111, and the circuit board contact 21 is an ACF rubber ball 211, as shown in FIG. 3 As shown, the ACF rubber ball 211 is a soft colloid formed by distributing many metal (such as gold) conductors 202 inside the colloid 201 . During packaging, the ACF rubber ball 211 is deformed after being pressed and attached to the first chip contact 11 of the corresponding first chip 10, as shown in FIG. 2, so that the first chip 10 is bonded to the circuit board 20. Please refer to Figure 3 and Figure 4, where Figure 3 shows that the ACF rubber ball 211 is a soft colloid formed by spreading many metal (such as gold) conductors 202 inside the colloid 201, and the metal conductors 202 will contact each other after pressing And making the whole ACF rubber ball 211 a conductor can conduct current (as shown in FIG. 4 ).

Other circuit components 500 can be installed under the circuit board 20 and connected to the ACF rubber ball 211 via the wire 25 passing through the circuit board 20 .

In the second application example of this embodiment, it is the combination of bumps, which is the use of bumps of the same material and other flat contacts or bumps. These contacts are respectively placed in the circuit board and the chip, and applied physical or Chemically combine the bumps with other flat contacts or bumps to make the circuit board bonded to the chip.

In this bump connection, the first chip contact 11 is a bump 112 (such as a metal contact or a solder ball) protruding from the lower surface of the first chip 10, and the circuit board contact 21 is a flat The contact 212 (pad), the material of the flat contact 212 is the same as the material of the convex contact 112 . During packaging, the protruding joints 112 of the first chip 10 are bonded to the corresponding flat joints 212 , as shown in FIG. 5 . The first wafer 10 is thus bonded to the circuit board 20 , as shown in FIG. 6 . When the material of the bump 112 is metal, it can Combined with ultrasonic method. When the bumps 112 are made of solder balls, they can be combined by soldering.

Figure 20 shows another embodiment of this example, the first chip contact 11 is a protruding contact 112' (such as a metal contact or a solder ball) protruding from the side end below the first chip 10, the circuit board The contact 21 is a protruding contact 212' (pad). During packaging, the bump 112' of the first chip 10 is bonded to the corresponding circuit board contact 21 through a wire 150'. When there are several first chip contacts 11 and circuit board contacts 21, the wire 150' connected is installed on a lead substrate 152' (as shown in Figure 21), and the lead substrate 152' is connected across the lead substrate 152'. Several first chip contacts 11 and circuit board contacts 21, and the packaging operation is completed at one time.

As shown in FIG. 22, it is the same as the wire connection method shown in FIG. 20, but in FIG. 22 the first chip 10 has the lower surface of the first chip contact 11 turned upwards and positioned above the entire assembly structure, Then package again in the same way. Wherein the first chip contact 11 is a protruding contact 212' protruding from the lower surface of the first chip, and then the first chip has the lower surface of the first chip contact 11 turned upwards and positioned in the entire assembly structure The top of the circuit board contact 21 is a protruding contact 212'; the protruding contact 212' of the first chip 10 is combined on the corresponding circuit board contact 21 through a wire 150' during packaging; when there are several During a first chip contact 11 and a circuit board contact 21, the wire 150' connected is installed on a wire substrate 152' (as shown in Figure 23), and the wire substrate 152' is connected across the several wire substrates. The first chip contact 11 and the circuit board contact 21 . In the third application example of this embodiment, a second chip 30 is connected to the lower surface of the first chip 10 . There is at least one second chip contact 31 under the second chip 30 .

The upper surface of the circuit board 20 forms a first groove 23, wherein the upper surface of the groove bottom of the first groove 23 has a groove contact 231 corresponding to the second chip contact 31 of the second chip 30. .

Therefore, when packaging, the second chip 30 is located inside the first groove 23, and the groove contacts 231 are bonded to the corresponding second chip contacts 31 of the second chip 30 during packaging, as shown in Figure 7 As shown, thus making the second wafer 30 combined with the circuit board 20, as shown in FIG. 8 . The method of combining the groove contacts 231 with the second chip contacts 31 may be the above-mentioned ACF rubber ball bonding or the above-mentioned convex contact bonding. FIG. 7 and FIG. 8 show that the bonding method of the groove contact 231 and the second chip contact 31 is ACF rubber ball bonding.

In the fourth application example of this embodiment, it includes the first wafer 10 as described above.

A second groove 27 is formed on the lower surface of the circuit board 20 , wherein a third chip 40 is installed on the bottom surface of the second groove 27 .

Wherein the combination method of the first chip 10 and the circuit board 20 can be combined with the ACF rubber ball combination of the first application example or the bump joint combination of the second application example, as shown in Figure 9 or Figure 10, so the details No longer. 9 and 10 show that the bonding method of the first chip 10 and the circuit board 20 is ACF glue ball bonding.

The combination of the third chip 40 and the circuit board 20 is the same as that in the prior art. As shown in FIG. 9 or FIG. 10 , the lower surface of the third chip 40 and the lower surface of the circuit board 20 are connected by wires 41 and contacts 29 , 42 .

In the above-listed embodiment, since the expansion coefficient of the circuit board 20 is different from that of the first wafer 10 and the second wafer 30 during processing, the expansion coefficient of the circuit board 20 will be greater than that of the first wafer 10, The coefficient of expansion of the second wafer 30 has high temperature treatment in the above-mentioned bonding process, so that the circuit board 20 is separated from the first wafer 10 and the second wafer 30, resulting in bonding failure. Therefore, in this case, For each of the above application examples, a third groove 50 is formed on the side of the circuit board 20 (comprising ACF glue ball 211, flat contact 212 (gasket)) closer to the edge of the circuit board 20 (as shown in FIG. 11), the third groove 50 can be a single-sided arc or ㄇ-shaped groove, so as to provide expansion margin for the joint during thermal expansion, so as to avoid contact between the circuit board 20 and the first wafer 10, The second wafer 30 is detached.

The second embodiment of the present case is described below, wherein the same elements as those of the above-mentioned first embodiment are denoted by the same symbols, and the details thereof will not be further described.

A first wafer 10', the first wafer 10' comprises a plurality of first wafers 10 (two wafers are used as an illustration example in the figure), each of which has at least one first wafer contact 11 below the first wafer 10 .

A circuit board group 20' is located below the first wafer 10', and the circuit board group 20' includes a plurality of circuit boards 20 corresponding to the number of the plurality of first chips 10, wherein each of the circuit boards 20 has a position above The circuit board contact 21 corresponding to the first chip contact 11 of each of the first chips 10 of the first wafer 10 ′.

During packaging, the first chip contact 11 is bonded to the corresponding circuit board contact 21 of the circuit board group 20', as shown in Figure 13, so that the first wafer 10' is bonded to the circuit board group 20'. The first wafer contact 11 can be bonded to the circuit board contact 21 by ACF rubber ball bonding or bump bonding.

In the first application example of this embodiment, it is the combination of ACF rubber balls, which uses ACF rubber balls as the bonding method of the solder joints and the pads of the other party to combine the wafer and the circuit board assembly.

In this ACF rubber ball combination, as shown in FIG. 12 , the first chip contact 11 is a flat contact (gasket, pad) 111 , and the circuit board contact 21 is an ACF rubber ball 211 . During packaging, the ACF rubber ball 211 is deformed after being pressed and attached to the first chip contact 11 of the corresponding first wafer 10', as shown in FIG. 13, so that the first wafer 10' Glue the circuit board assembly 20'.

Other circuit components 500 can be installed under the circuit board assembly 20', and are connected to the ACF rubber ball 211 via the wire 25 passing through the circuit board assembly 20'.

In the second application example of this embodiment, it is the combination of convex contacts, which is the application of convex contacts of the same material and The flat contacts are respectively placed in the circuit board group and the wafer, and the convex contacts and the flat contacts are combined by physical or chemical methods, so that the circuit board group and the wafer are combined.

In this bump connection, the first chip contact 11 is a bump 112 (such as a metal contact or a solder ball) protruding from the lower surface of the first wafer 10 ′, and the circuit board contact 21 It is a flat contact 212 (pad), and the material of the flat contact 212 is the same as that of the convex contact 112 . During packaging, the bumps 112 of the first wafer 10' are bonded to the corresponding flat contacts 212, as shown in FIG. 14 . Therefore, the first wafer 10' is combined with the circuit board group 20', as shown in FIG. 15 . When the material of the bumps 112 is metal, ultrasonic bonding can be used. When the bumps 112 are made of solder balls, they can be combined by soldering.

In the third application example of this embodiment, a second chip 30 is connected to the lower surface of the first chip 10 . There is at least one second chip contact 31 under the second chip 30 .

The upper surface of each of the circuit boards 20 forms a first groove 23, wherein the upper surface of the groove bottom of the first groove 23 has a groove contact corresponding to the second chip contact 31 of each of the second chip 30 in position. Point 231.

Therefore, when packaging, the second chip 30 is located inside the first groove 23, and the groove contacts 231 are bonded to the corresponding second chip contacts 31 of the second chip 30 during packaging, as shown in Figure 16 As shown, thus making the second wafer 30 combined with the circuit board 20, as shown in FIG. 17 . The method of combining the groove contacts 231 with the second chip contacts 31 may be the above-mentioned ACF rubber ball bonding or the above-mentioned convex contact bonding. FIG. 16 and FIG. 17 show that the bonding method of the groove contact 231 and the second chip contact 31 is ACF rubber ball bonding.

In the above-listed embodiment, since the expansion coefficient of the circuit board assembly 20' is different from that of the first wafer 10 and the second wafer 30 during processing, the expansion coefficient of the circuit board assembly 20' will be greater than that of the first wafer 30. The expansion coefficients of a wafer 10 and the second wafer 30 all have high-temperature treatment in the above-mentioned bonding process. The situation causes the circuit board assembly 20' to separate from the first wafer 10', resulting in bonding failure.

Therefore, in this case, for each of the above-mentioned application examples, some contacts (including ACF rubber ball 211, flat contact 212 (pad)) on the circuit board set 20' are closer to the edge of the circuit board set 20'. The fourth groove 60 (as shown in Figure 12 to Figure 17) is formed on the side, and the fourth groove 60 can be a single-sided arc or ㄇ-shaped groove, so as to provide expansion margin for these joints during thermal expansion , thus preventing the circuit board assembly 20' from detaching from the first wafer 10'.

Another way to absorb expansion is to cut the circuit board group 20' first, and then paste it on a lower adhesive film 70 for packaging (as shown in Figure 18). The adhesive film 70 is elastic and can provide The expansion margin is to absorb the expansion of the circuit board set 20' when heated.

As shown in FIG. 19, in this embodiment, after the combination of the first wafer 10' and the circuit board group 20' is completed, individual first wafers 10 and their corresponding circuit boards 20 can be cut into single units. .

The advantage of this case is that the contacts and wires are all hidden inside without being exposed, so the packaging structure can be reduced, so the entire man-hours and operating procedures during packaging can be reduced, so the entire manufacturing cost will also be reduced.

To sum up, the humanized and thoughtful design of this case is quite in line with actual needs. Its specific improvement has existing deficiencies, and compared with the prior art, it has the advantage of breakthrough progress, and indeed has the enhancement of efficacy, and it is not easy to achieve. This case has not been published or disclosed in domestic and foreign literature and market, which is in compliance with the provisions of the patent law.

The above detailed description is a specific description of a feasible embodiment of the present invention, but this embodiment is not used to limit the patent scope of the present invention, and any equivalent implementation or change that does not depart from the technical spirit of the present invention shall be included in In the patent scope of this case.

10‧‧‧The first chip

11‧‧‧The first chip contact

20‧‧‧circuit board

21‧‧‧circuit board contacts

25‧‧‧wire

111‧‧‧flat contact

211‧‧‧ACF rubber ball

Claims (15)

A simple circuit board and chip packaging structure, comprising: a first chip, at least one first chip contact is located below the first chip; a circuit board is located below the first chip, wherein the circuit board is above the The position corresponds to the circuit board contact of the first chip contact of the first chip; the first chip contact is bonded to the corresponding circuit board contact of the circuit board during packaging, so that the first chip is combined with the circuit board; wherein the first chip contact is combined with the contact of the circuit board by ACF rubber ball bonding or convex joint bonding; wherein the ACF rubber ball bonding is the use of ACF rubber balls as solder joints and pads of the other party Combining means to combine the chip with the circuit board; and wherein the bump joint is the application of bumps of the same material and other flat contacts or bumps, these contacts are respectively placed in the circuit board and the chip, and Combining the convex contact with other flat contacts or convex contacts by physical or chemical methods, so that the circuit board is combined with the chip; wherein in the ACF glue ball bonding, the first chip contact is a flat contact, The circuit board contact is an ACF rubber ball, wherein the ACF rubber ball is a soft colloid formed by spreading many metal conductors inside the colloid, and after pressing, the metal conductors will contact each other so that the entire ACF rubber ball is a conductor. Current can be conducted; during packaging, the ACF rubber ball is deformed after being pressed and attached to the first chip contact of the corresponding first chip, so that the first chip is bonded to the circuit board; wherein the first chip is under the The surface is connected to a second chip; there is at least one second chip contact under the second chip; a first groove is formed on the upper surface of the circuit board, wherein the upper surface of the bottom of the first groove has positions corresponding to groove contacts of the second chip contacts of the second chip; During packaging, the second chip is located inside the first groove, and the groove contacts are combined with the corresponding second chip contacts of the second chip during packaging, so that the second chip is combined with the circuit board; Wherein the groove contact is combined with the second chip contact by the above-mentioned ACF rubber ball combination. A simple circuit board and chip packaging structure, comprising: a first chip, at least one first chip contact is located below the first chip; a circuit board is located below the first chip, wherein the circuit board is above the The position corresponds to the circuit board contact of the first chip contact of the first chip; the first chip contact is bonded to the corresponding circuit board contact of the circuit board during packaging, so that the first chip is combined with the circuit board; wherein the first chip contact is combined with the contact of the circuit board by ACF rubber ball bonding or convex joint bonding; wherein the ACF rubber ball bonding is the use of ACF rubber balls as solder joints and pads of the other party Combining means to combine the chip with the circuit board; and wherein the bump joint is the application of bumps of the same material and other flat contacts or bumps, these contacts are respectively placed in the circuit board and the chip, and Combining the bumps with other flat contacts or bumps by physical or chemical methods to combine the circuit board with the chip; wherein in the bump combination, the first chip contact is a protruding The convex contact on the lower surface of the first chip, the circuit board contact is a flat contact, the material of the flat contact is the same as the material of the convex contact; the convex contact of the first chip is combined in the corresponding on the flat contact; make the first chip combined with the circuit board; wherein the lower surface of the first chip is connected to a second chip; there is at least one second chip contact under the second chip; the upper surface of the circuit board forming a first groove, wherein the upper surface of the bottom of the first groove has The position corresponds to the groove contact of the second chip contact of the second chip; when packaging, the second chip is located inside the first groove, and the groove contact is bonded to the corresponding first groove during packaging. The contacts of the second chip of the two chips are connected so that the second chip is bonded to the circuit board; wherein the way of bonding the groove contacts to the contacts of the second chip is the above-mentioned convex contact bonding. The packaging structure of simple circuit board and chip as described in item 2 of the scope of the patent application, wherein when the material of the bumps is metal, it is bonded by means of ultrasonic waves. The package structure of simple circuit board and chip as described in item 2 of the scope of the patent application, wherein when the material of the bumps is solder balls, it is combined by soldering. A simple circuit board and chip packaging structure, comprising: a first chip, at least one first chip contact is located below the first chip; a circuit board is located below the first chip, wherein the circuit board is above the The position corresponds to the circuit board contact of the first chip contact of the first chip; the first chip contact is bonded to the corresponding circuit board contact of the circuit board during packaging, so that the first chip is combined with the circuit board; wherein the first chip contact is combined with the contact of the circuit board by ACF rubber ball bonding or convex joint bonding; wherein the ACF rubber ball bonding is the use of ACF rubber balls as solder joints and pads of the other party Combining means to combine the chip with the circuit board; and wherein the bump joint is the application of bumps of the same material and other flat contacts or bumps, these contacts are respectively placed in the circuit board and the chip, and Combining the convex contact with other flat contacts or convex contacts by physical or chemical methods, so that the circuit board is combined with the chip; wherein in the ACF glue ball bonding, the first chip contact is a flat contact, The circuit board contact is an ACF rubber ball, wherein the ACF rubber ball is formed by spreading many metal conductors inside the colloid Soft colloid, and after pressing, the metal conductors will contact each other so that the entire ACF rubber ball is a conductor and can conduct current; when packaging, the ACF rubber ball is deformed after being pressed and attached to the corresponding first chip of the first chip A chip contact point, so that the first chip is bonded to the circuit board; wherein a second groove is formed on the lower surface of the circuit board, and a third chip is installed on the bottom surface of the second groove. The package structure of a simple circuit board and a chip as described in item 5 of the scope of the patent application, wherein the lower surface of the third chip and the lower surface of the circuit board are connected by wires and contacts. The packaging structure of a simple circuit board and a chip as described in item 1 of the patent scope of the application, wherein the contact on the circuit board forms a third groove on the side closer to the edge of the circuit board, and the third groove is a single The arc-shaped or ㄇ-shaped groove is used to provide an expansion margin for the joint during thermal expansion, so as to prevent the circuit board from detaching from the first wafer and the second wafer. A simple circuit board and chip packaging structure, comprising: a first chip, at least one first chip contact is located below the first chip; a circuit board is located below the first chip, wherein the circuit board is above the The position corresponds to the circuit board contact of the first chip contact of the first chip; the first chip contact is bonded to the corresponding circuit board contact of the circuit board during packaging, so that the first chip is combined with the circuit board; wherein the first chip contact is combined with the contact of the circuit board by ACF rubber ball bonding or convex joint bonding; wherein the ACF rubber ball bonding is the use of ACF rubber balls as solder joints and pads of the other party Combining means to combine the chip with the circuit board; and wherein the bump joint is the application of bumps of the same material and other flat contacts or bumps, these contacts are respectively placed in the circuit board and the chip, and Apply physical or chemical methods to bond the bump and other flat contacts or convex contacts, so that the circuit board and the chip are combined; wherein the first chip contact is a convex contact protruding from the side end below the first chip, and the circuit board contact It is a protruding joint; when packaging, the protruding joint of the first chip is combined on the corresponding circuit board contact through a wire; when there are several first chip contacts and circuit board contacts, the connecting wire is It is installed on a lead substrate, and the lead substrate is bridged between the first chip contacts and the circuit board contacts. A simple circuit board and chip packaging structure, comprising: a first chip, at least one first chip contact is located below the first chip; a circuit board is located below the first chip, wherein the circuit board is above the The position corresponds to the circuit board contact of the first chip contact of the first chip; the first chip contact is bonded to the corresponding circuit board contact of the circuit board during packaging, so that the first chip is combined with the circuit board; wherein the first chip contact is combined with the contact of the circuit board by ACF rubber ball bonding or convex joint bonding; wherein the ACF rubber ball bonding is the use of ACF rubber balls as solder joints and pads of the other party Combining means to combine the chip with the circuit board; and wherein the bump joint is the application of bumps of the same material and other flat contacts or bumps, these contacts are respectively placed in the circuit board and the chip, and Combining the raised contact with other flat contacts or raised contacts by physical or chemical methods, so that the circuit board is combined with the chip; wherein the first chip contact is a protrusion protruding from the lower surface of the first chip Protruding joint, then the lower surface of the first chip with the first chip contact is turned upwards and positioned above the entire assembly structure; the circuit board contact is a protruding joint; the protruding joint of the first chip is packaged The contact is combined on the corresponding circuit board contact through a wire; when there are several first chip contacts and circuit board contacts, The connected wires are installed on a wire substrate, and the wire substrate is bridged between the first chip contacts and the circuit board contacts. A simple circuit board and chip packaging structure, comprising: a first wafer, the first wafer includes a plurality of first chips, each of the first chips has at least one first chip contact; a circuit board group Positioned below the first wafer, the circuit board group includes a plurality of circuit boards corresponding in number to the plurality of first chips, wherein each of the circuit boards has a position corresponding to each of the first wafers above the first wafer. The circuit board contact of the first chip contact of the chip; during packaging, the first chip contact is combined with the corresponding circuit board contact of the circuit board group, so that the first wafer is combined with the circuit board group; wherein the The way that the first chip contact is combined with the circuit board contact is ACF rubber ball bonding or convex contact bonding; wherein the ACF rubber ball bonding system is the combination of using ACF rubber balls as the welding joint and the gasket of the other party, with Combining the wafer with the circuit board group; wherein the bump joint is used to place the bump contact and the flat contact of the same material in the circuit board group and the wafer respectively, and use physical or chemical methods to combine the bump contact and the flat contact, so that the circuit board group is combined with the wafer; wherein in the combination of the ACF rubber ball, the first wafer contact is a flat contact, and the circuit board contact is an ACF rubber ball; when packaging The ACF rubber ball is deformed after being pressed and attached to the corresponding first wafer contact of the first wafer, so that the first wafer is bonded to the circuit board group; wherein the lower surface of the first wafer is connected to a The second chip; there is at least one second chip contact under the second chip; a first groove is formed on the upper surface of each circuit board, wherein the upper surface of the groove bottom of the first groove There are groove contacts corresponding to the second chip contacts of each of the second chips in position; when packaging, the second chip is located inside the first groove, and the groove contacts are bonded to the corresponding On the second chip contacts of the second chip, the second chip is bonded to the circuit board; wherein the groove contacts are bonded to the second chip contacts by the above-mentioned ACF rubber ball bonding. A simple circuit board and chip packaging structure, comprising: a first wafer, the first wafer includes a plurality of first chips, each of the first chips has at least one first chip contact; a circuit board group Positioned below the first wafer, the circuit board group includes a plurality of circuit boards corresponding in number to the plurality of first chips, wherein each of the circuit boards has a position corresponding to each of the first wafers above the first wafer. The circuit board contact of the first chip contact of the chip; during packaging, the first chip contact is combined with the corresponding circuit board contact of the circuit board group, so that the first wafer is combined with the circuit board group; wherein the The way that the first chip contact is combined with the circuit board contact is ACF rubber ball bonding or convex contact bonding; wherein the ACF rubber ball bonding system is the combination of using ACF rubber balls as the welding joint and the gasket of the other party, with Combining the wafer with the circuit board group; wherein the bump joint is used to place the bump contact and the flat contact of the same material in the circuit board group and the wafer respectively, and use physical or chemical methods to combine the bump contact and flat contacts, so that the circuit board group is combined with the wafer; wherein in the combination of the bumps, the first wafer contact is a bump protruding from the lower surface of the first wafer, the The circuit board contact is a flat contact, and the material of the flat contact is the same as that of the convex contact; the convex contact of the first wafer is combined on the corresponding flat contact during packaging, so that the first The wafer is bonded to the circuit board set; Wherein the lower surface of the first chip is connected to a second chip; there is at least one second chip contact under the second chip; a first groove is formed on the upper surface of each of the circuit boards, wherein the groove bottom of the first groove The upper surface has groove contacts corresponding to the second chip contacts of each of the second chips in position; when packaging, the second chip is located inside the first groove, and the groove contacts are bonded to the first groove during packaging. Corresponding to the second chip contact of the second chip, the second chip is combined with the circuit board; wherein the groove contact is combined with the second chip contact by the above-mentioned convex contact combination. The package structure of the simple circuit board and the chip as described in item 11 of the scope of the patent application, wherein when the material of the bumps is metal, it is bonded by means of ultrasonic waves. The package structure of a simple circuit board and a chip as described in item 11 of the scope of the patent application, wherein when the material of the bump is a solder ball, it is combined by soldering. The packaging structure of a simple circuit board and chip as described in item 10 of the scope of the patent application, wherein the contacts on the circuit board group form a fourth groove on the side closer to the edge of the circuit board group, and the fourth groove The single-side arc-shaped or ㄇ-shaped groove is used to provide expansion margin for the joint during thermal expansion, so as to prevent the circuit board group from detaching from the first wafer. The simple circuit board and chip packaging structure described in item 10 of the scope of the patent application, wherein the circuit board assembly is cut first, and then pasted on a lower adhesive film for packaging, and the adhesive film is elastic , to provide expansion margin to absorb the expansion of the circuit board group when heated.

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