TWI800820B - 樹脂模塑裝置 - Google Patents

樹脂模塑裝置 Download PDF

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Publication number
TWI800820B
TWI800820B TW110114828A TW110114828A TWI800820B TW I800820 B TWI800820 B TW I800820B TW 110114828 A TW110114828 A TW 110114828A TW 110114828 A TW110114828 A TW 110114828A TW I800820 B TWI800820 B TW I800820B
Authority
TW
Taiwan
Prior art keywords
resin molding
molding device
resin
molding
Prior art date
Application number
TW110114828A
Other languages
English (en)
Other versions
TW202144157A (zh
Inventor
藤沢雅彦
斎藤裕史
Original Assignee
日商山田尖端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商山田尖端科技股份有限公司 filed Critical 日商山田尖端科技股份有限公司
Publication of TW202144157A publication Critical patent/TW202144157A/zh
Application granted granted Critical
Publication of TWI800820B publication Critical patent/TWI800820B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B29C2043/189—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles the parts being joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW110114828A 2020-05-22 2021-04-26 樹脂模塑裝置 TWI800820B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020089939A JP7323937B2 (ja) 2020-05-22 2020-05-22 樹脂モールド装置
JP2020-089939 2020-05-22

Publications (2)

Publication Number Publication Date
TW202144157A TW202144157A (zh) 2021-12-01
TWI800820B true TWI800820B (zh) 2023-05-01

Family

ID=78607752

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110114828A TWI800820B (zh) 2020-05-22 2021-04-26 樹脂模塑裝置

Country Status (4)

Country Link
US (1) US20210362379A1 (zh)
JP (1) JP7323937B2 (zh)
CN (1) CN113707562A (zh)
TW (1) TWI800820B (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008132730A (ja) * 2006-11-29 2008-06-12 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
TW201739015A (zh) * 2016-04-05 2017-11-01 Towa Corp 樹脂封裝裝置及樹脂封裝方法
JP6525805B2 (ja) * 2015-08-10 2019-06-05 アピックヤマダ株式会社 モールド金型及びモールド装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3282988B2 (ja) * 1997-05-01 2002-05-20 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP5605971B2 (ja) * 2001-09-07 2014-10-15 マイクロン テクノロジー， インク． 電子装置及びその製造方法
US7713841B2 (en) * 2003-09-19 2010-05-11 Micron Technology, Inc. Methods for thinning semiconductor substrates that employ support structures formed on the substrates
CN101006554A (zh) 2004-10-29 2007-07-25 株式会社尼康 标线保护构件、标线运送装置、曝光装置及标线运送方法
JP2007081070A (ja) * 2005-09-14 2007-03-29 Canon Inc 加工装置及び方法
JP4737638B2 (ja) * 2007-01-19 2011-08-03 東京エレクトロン株式会社 現像処理装置
JP2012020446A (ja) * 2010-07-13 2012-02-02 Apic Yamada Corp 樹脂モールド装置
TWI523164B (zh) * 2010-11-25 2016-02-21 山田尖端科技股份有限公司 樹脂模塑裝置
JP5787691B2 (ja) * 2011-09-21 2015-09-30 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP2013168461A (ja) 2012-02-15 2013-08-29 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2014138127A (ja) * 2013-01-17 2014-07-28 Sumitomo Heavy Ind Ltd 樹脂封止装置
JP2015119040A (ja) 2013-12-18 2015-06-25 日東電工株式会社 封止シート貼付け方法
JP6320448B2 (ja) * 2016-04-28 2018-05-09 Ｔｏｗａ株式会社 樹脂封止装置および樹脂封止方法
JP7312421B2 (ja) * 2018-04-13 2023-07-21 アピックヤマダ株式会社 モールド金型、樹脂モールド装置及び樹脂モールド方法並びに搬送具

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008132730A (ja) * 2006-11-29 2008-06-12 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP6525805B2 (ja) * 2015-08-10 2019-06-05 アピックヤマダ株式会社 モールド金型及びモールド装置
TW201739015A (zh) * 2016-04-05 2017-11-01 Towa Corp 樹脂封裝裝置及樹脂封裝方法

Also Published As

Publication number Publication date
US20210362379A1 (en) 2021-11-25
JP7323937B2 (ja) 2023-08-09
CN113707562A (zh) 2021-11-26
TW202144157A (zh) 2021-12-01
JP2021184442A (ja) 2021-12-02

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