TWI800756B - 帶溫度維持裝置的隔離環及電漿處理裝置 - Google Patents

帶溫度維持裝置的隔離環及電漿處理裝置 Download PDF

Info

Publication number
TWI800756B
TWI800756B TW109134407A TW109134407A TWI800756B TW I800756 B TWI800756 B TW I800756B TW 109134407 A TW109134407 A TW 109134407A TW 109134407 A TW109134407 A TW 109134407A TW I800756 B TWI800756 B TW I800756B
Authority
TW
Taiwan
Prior art keywords
plasma treatment
temperature maintenance
isolation ring
treatment device
maintenance device
Prior art date
Application number
TW109134407A
Other languages
English (en)
Other versions
TW202119466A (zh
Inventor
周豔
廉曉芳
徐朝陽
狄 吳
Original Assignee
大陸商中微半導體設備（上海）股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大陸商中微半導體設備（上海）股份有限公司 filed Critical 大陸商中微半導體設備（上海）股份有限公司
Publication of TW202119466A publication Critical patent/TW202119466A/zh
Application granted granted Critical
Publication of TWI800756B publication Critical patent/TWI800756B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching
    • H01J2237/3341—Reactive etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
TW109134407A 2019-11-13 2020-10-05 帶溫度維持裝置的隔離環及電漿處理裝置 TWI800756B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911106901.8A CN112802729B (zh) 2019-11-13 2019-11-13 带温度维持装置的隔离环
CN201911106901.8 2019-11-13

Publications (2)

Publication Number Publication Date
TW202119466A TW202119466A (zh) 2021-05-16
TWI800756B true TWI800756B (zh) 2023-05-01

Family

ID=75803148

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109134407A TWI800756B (zh) 2019-11-13 2020-10-05 帶溫度維持裝置的隔離環及電漿處理裝置

Country Status (2)

Country Link
CN (1) CN112802729B (zh)
TW (1) TWI800756B (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW460972B (en) * 1998-09-25 2001-10-21 Lam Res Corp Plasma processing chamber and method of processing a semiconductor wafer in the plasma processing chamber
WO2002054444A1 (en) * 2000-12-29 2002-07-11 Lam Research Corporation Electrode for plasma processes and method for manufacture and use thereof
US20090081878A1 (en) * 2007-09-25 2009-03-26 Lam Research Corporation Temperature control modules for showerhead electrode assemblies for plasma processing apparatuses
TW201513213A (zh) * 2013-07-17 2015-04-01 Advanced Micro Fabrication Equipment Shanghai Co Ltd 等離子體處理裝置
TW201937579A (zh) * 2017-11-30 2019-09-16 日商東京威力科創股份有限公司 基板處理裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060005560A (ko) * 2004-07-13 2006-01-18 삼성전자주식회사 플라즈마를 이용하는 반도체 소자 제조 장비
US7430986B2 (en) * 2005-03-18 2008-10-07 Lam Research Corporation Plasma confinement ring assemblies having reduced polymer deposition characteristics
US7713379B2 (en) * 2005-06-20 2010-05-11 Lam Research Corporation Plasma confinement rings including RF absorbing material for reducing polymer deposition
KR101625516B1 (ko) * 2008-02-08 2016-05-30 램 리써치 코포레이션 플라즈마 프로세싱 장치 및 플라즈마 프로세싱 장치에서 반도체 기판을 처리하는 방법
JP2009224420A (ja) * 2008-03-14 2009-10-01 Sumitomo Precision Prod Co Ltd プラズマ処理装置
CN104051210B (zh) * 2013-03-12 2016-05-11 中微半导体设备(上海)有限公司 一种减少门效应的等离子体处理装置
CN106898534B (zh) * 2015-12-21 2019-08-06 中微半导体设备(上海)股份有限公司 等离子体约束环、等离子体处理装置与基片处理方法
CN109961999B (zh) * 2017-12-22 2021-03-23 中微半导体设备(上海)股份有限公司 一种气体喷淋头及防止聚合物积聚的方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW460972B (en) * 1998-09-25 2001-10-21 Lam Res Corp Plasma processing chamber and method of processing a semiconductor wafer in the plasma processing chamber
WO2002054444A1 (en) * 2000-12-29 2002-07-11 Lam Research Corporation Electrode for plasma processes and method for manufacture and use thereof
US20090081878A1 (en) * 2007-09-25 2009-03-26 Lam Research Corporation Temperature control modules for showerhead electrode assemblies for plasma processing apparatuses
TW201513213A (zh) * 2013-07-17 2015-04-01 Advanced Micro Fabrication Equipment Shanghai Co Ltd 等離子體處理裝置
TW201937579A (zh) * 2017-11-30 2019-09-16 日商東京威力科創股份有限公司 基板處理裝置

Also Published As

Publication number Publication date
CN112802729B (zh) 2024-05-10
TW202119466A (zh) 2021-05-16
CN112802729A (zh) 2021-05-14

Similar Documents

Publication Publication Date Title
TWI799406B (zh) 真空處理裝置及維護裝置
DK3117310T3 (da) Håndtering af behandling associeret med valgte arkitektoniske indretninger
DK3615057T3 (da) Doseringsskema til behandling af kognitive svækkelser med blodplasmaprodukter
DK3504210T3 (da) 7-substituerede sulfonimidoylpurinonforbindelser til behandling og forebyggelse af virusinfektion
DK3234098T3 (da) Anordning og fremgangsmåde til påvisning af plantepatogener
DK3341001T3 (da) Sammensætning og fremgangsmåde til behandling og profylakse af tarminfektion og -inflammation
DK3152291T3 (da) Fremgangsmåder og indretninger til kapillar-understøttet vitrificering
DK3484535T3 (da) Hygiejniske medicinske indretninger med hydrofil belægning og fremgangsmåder til dannelse deraf
TWI800533B (zh) Ｅｆｅｍ系統及ｅｆｅｍ系統之氣體供給方法
DK3191103T3 (da) Sammensætninger og fremgangsmåder til behandling af præcancerøse hudlæsioner
DK3532143T3 (da) Kateteranordninger med ventiler og tilhørende fremgangsmåder
ITUA20162248A1 (it) Dispositivo di trasferimento nonché procedimento di funzionamento di questo dispositivo di trasferimento e linea di trasferimento con l`utilizzo del dispositivo di trasferimento
DK3469076T3 (da) Mutant lipase og anvendelse deraf
GB201404824D0 (en) An annular combustion chamber upstream wall and heat shield arrangement
DK3282584T3 (da) Effektfordelingssystem og fremgangsmåde
EP3375301A4 (en) Ring with fixing and self-retaining means
DK3163983T3 (da) Apparat til plasmabehandling med indirekte atmosfærisk tryk
DK3697405T3 (da) Ny mek-inhibitor til behandlingen af virale og bakterielle infektioner
DK3250522T3 (da) Nedsænket forbrændingssmelter og fremgangsmåde
DE112020004657A5 (de) Behandlungsanlage und Behandlungsverfahren
DE112019003184A5 (de) Trennvorrichtung und Behandlungsanlage
TWI799602B (zh) 電漿處理裝置及電漿蝕刻方法
DE102018221635B8 (de) Kontaktierungsverfahren und System
TWI800756B (zh) 帶溫度維持裝置的隔離環及電漿處理裝置
IT201700070472A1 (it) Dispositivo e metodo per il trattamento del mosto