DK3163983T3 - Apparat til plasmabehandling med indirekte atmosfærisk tryk - Google Patents
Apparat til plasmabehandling med indirekte atmosfærisk tryk Download PDFInfo
- Publication number
- DK3163983T3 DK3163983T3 DK15191844.8T DK15191844T DK3163983T3 DK 3163983 T3 DK3163983 T3 DK 3163983T3 DK 15191844 T DK15191844 T DK 15191844T DK 3163983 T3 DK3163983 T3 DK 3163983T3
- Authority
- DK
- Denmark
- Prior art keywords
- atmospheric pressure
- plasma treatment
- treatment appliance
- indirect
- indirect atmospheric
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2431—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes using cylindrical electrodes, e.g. rotary drums
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2443—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
- H05H1/246—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube the plasma being activated using external electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2443—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
- H05H1/245—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube the plasma being activated using internal electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2240/00—Testing
- H05H2240/10—Testing at atmospheric pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2245/00—Applications of plasma devices
- H05H2245/40—Surface treatments
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP15191844.8A EP3163983B1 (en) | 2015-10-28 | 2015-10-28 | Apparatus for indirect atmospheric pressure plasma processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK3163983T3 true DK3163983T3 (da) | 2020-08-24 |
Family
ID=54365046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK15191844.8T DK3163983T3 (da) | 2015-10-28 | 2015-10-28 | Apparat til plasmabehandling med indirekte atmosfærisk tryk |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US20170125221A1 (da) |
| EP (1) | EP3163983B1 (da) |
| DK (1) | DK3163983T3 (da) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014226039A1 (de) * | 2014-12-16 | 2016-06-16 | Carl Zeiss Smt Gmbh | Ionisierungseinrichtung und Massenspektrometer damit |
| JP2019029333A (ja) * | 2017-07-26 | 2019-02-21 | 東芝メモリ株式会社 | プラズマ処理装置および半導体装置の製造方法 |
| EP3784148A4 (en) | 2018-04-24 | 2022-01-19 | Paragon 28, Inc. | IMPLANTS, USE AND ASSEMBLY PROCEDURES |
| CN110234194A (zh) * | 2019-07-23 | 2019-09-13 | 烟台龙源电力技术股份有限公司 | 等离子体发生器 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4544446A (en) * | 1984-07-24 | 1985-10-01 | J. T. Baker Chemical Co. | VLSI chemical reactor |
| US5863337A (en) * | 1993-02-16 | 1999-01-26 | Ppg Industries, Inc. | Apparatus for coating a moving glass substrate |
| JP3349953B2 (ja) * | 1998-05-25 | 2002-11-25 | シャープ株式会社 | 基板処理装置 |
| US6923890B2 (en) | 1999-12-15 | 2005-08-02 | Plasmasol Corporation | Chemical processing using non-thermal discharge plasma |
| TW200308187A (en) * | 2002-04-10 | 2003-12-16 | Dow Corning Ireland Ltd | An atmospheric pressure plasma assembly |
| KR101098085B1 (ko) * | 2004-03-09 | 2011-12-26 | 다이니폰 인사츠 가부시키가이샤 | 전자선 조사 장치 |
| JP4202292B2 (ja) * | 2004-03-22 | 2008-12-24 | シャープ株式会社 | プラズマ処理装置 |
| US8227051B1 (en) | 2004-06-24 | 2012-07-24 | UT-Battle, LLC | Apparatus and method for carbon fiber surface treatment |
| EP1689216A1 (en) * | 2005-02-04 | 2006-08-09 | Vlaamse Instelling Voor Technologisch Onderzoek (Vito) | Atmospheric-pressure plasma jet |
| TW200816880A (en) * | 2006-05-30 | 2008-04-01 | Matsushita Electric Ind Co Ltd | Atmospheric pressure plasma generating method, plasma processing method and component mounting method using same, and device using these methods |
| US20090183675A1 (en) * | 2006-10-13 | 2009-07-23 | Mustafa Pinarbasi | Reactor to form solar cell absorbers |
| US8142608B2 (en) * | 2007-09-11 | 2012-03-27 | Atomic Energy Council—Institute of Nuclear Energy Research | Atmospheric pressure plasma reactor |
| JP4582140B2 (ja) * | 2007-11-22 | 2010-11-17 | セイコーエプソン株式会社 | 基板の表面処理方法 |
| WO2009080662A1 (en) | 2007-12-20 | 2009-07-02 | Eidgenössische Technische Hochschule Zürich | Remote non-thermal atmospheric plasma treatment of temperature sensitive particulate materials and apparatus therefore |
| US20110143019A1 (en) * | 2009-12-14 | 2011-06-16 | Amprius, Inc. | Apparatus for Deposition on Two Sides of the Web |
| US20140326182A1 (en) * | 2013-05-03 | 2014-11-06 | Areesys Corporation | Continuous Substrate Processing Apparatus |
| WO2014191012A1 (de) * | 2013-05-27 | 2014-12-04 | Plasmatreat Gmbh | Vorrichtung und verfahren zur behandlung eines drahts aus leitfähigem material |
| US9177824B2 (en) * | 2013-06-12 | 2015-11-03 | Applied Materials, Inc. | Photoresist treatment method by low bombardment plasma |
| US20160329192A1 (en) * | 2015-05-05 | 2016-11-10 | Eastman Kodak Company | Radial-flow plasma treatment system |
-
2015
- 2015-10-28 EP EP15191844.8A patent/EP3163983B1/en active Active
- 2015-10-28 DK DK15191844.8T patent/DK3163983T3/da active
-
2016
- 2016-10-27 US US15/335,992 patent/US20170125221A1/en not_active Abandoned
-
2022
- 2022-04-05 US US17/713,666 patent/US20220230854A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP3163983A1 (en) | 2017-05-03 |
| US20170125221A1 (en) | 2017-05-04 |
| US20220230854A1 (en) | 2022-07-21 |
| EP3163983B1 (en) | 2020-08-05 |
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