TWI800688B - 封裝組成物 - Google Patents

封裝組成物 Download PDF

Info

Publication number
TWI800688B
TWI800688B TW108135496A TW108135496A TWI800688B TW I800688 B TWI800688 B TW I800688B TW 108135496 A TW108135496 A TW 108135496A TW 108135496 A TW108135496 A TW 108135496A TW I800688 B TWI800688 B TW I800688B
Authority
TW
Taiwan
Prior art keywords
encapsulating composition
encapsulating
composition
Prior art date
Application number
TW108135496A
Other languages
English (en)
Other versions
TW202042316A (zh
Inventor
俞美林
金俊衡
郭芝媛
崔國鉉
李榮鐘
Original Assignee
南韓商Ｌｇ化學股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商Ｌｇ化學股份有限公司 filed Critical 南韓商Ｌｇ化學股份有限公司
Publication of TW202042316A publication Critical patent/TW202042316A/zh
Application granted granted Critical
Publication of TWI800688B publication Critical patent/TWI800688B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/223—Di-epoxy compounds together with monoepoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D171/00—Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D171/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/45—Anti-settling agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Sealing Material Composition (AREA)
  • Epoxy Resins (AREA)
  • Photovoltaic Devices (AREA)
TW108135496A 2018-09-28 2019-10-01 封裝組成物 TWI800688B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2018-0115968 2018-09-28
KR1020180115968A KR102253501B1 (ko) 2018-09-28 2018-09-28 밀봉재 조성물

Publications (2)

Publication Number Publication Date
TW202042316A TW202042316A (zh) 2020-11-16
TWI800688B true TWI800688B (zh) 2023-05-01

Family

ID=69953222

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108135496A TWI800688B (zh) 2018-09-28 2019-10-01 封裝組成物

Country Status (6)

Country Link
US (1) US20220017693A1 (zh)
JP (1) JP7180837B2 (zh)
KR (1) KR102253501B1 (zh)
CN (1) CN113166374B (zh)
TW (1) TWI800688B (zh)
WO (1) WO2020067827A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114902804A (zh) * 2019-12-27 2022-08-12 三井化学株式会社 固化性组合物及有机el显示装置
JPWO2022239674A1 (zh) * 2021-05-11 2022-11-17

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201602227A (zh) * 2014-03-25 2016-01-16 富士軟片股份有限公司 組成物、底部塡充用積層體、積層體、半導體裝置之製造方法、及半導體裝置
TW201708437A (zh) * 2015-03-20 2017-03-01 藍色立方體有限責任公司 可固化組成物
TW201734078A (zh) * 2015-11-05 2017-10-01 日產化學工業有限公司 多官能環氧化合物及含有其之硬化性組合物
WO2018106090A1 (ko) * 2016-12-09 2018-06-14 주식회사 엘지화학 밀봉재 조성물
TW201834547A (zh) * 2016-12-09 2018-09-16 南韓商Ｌｇ化學股份有限公司 有機電子裝置之製法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007091923A (ja) * 2005-09-29 2007-04-12 Fujifilm Corp インク組成物、並びに、これを用いた画像形成方法および記録物
KR101552526B1 (ko) * 2007-11-29 2015-09-14 닛산 가가쿠 고교 가부시키가이샤 3차원 패턴 형성 재료
JP5916220B2 (ja) * 2012-07-19 2016-05-11 日本化薬株式会社 エネルギー線硬化型樹脂組成物及びその硬化物
JP6274639B2 (ja) * 2013-05-23 2018-02-07 日本化薬株式会社 エネルギー線硬化型樹脂組成物及びその硬化物
JP6400005B2 (ja) * 2013-07-09 2018-10-03 株式会社Adeka カチオン重合性組成物
JP2015110762A (ja) * 2013-10-31 2015-06-18 三洋化成工業株式会社 活性光線硬化型接着剤組成物
WO2017077846A1 (ja) * 2015-11-05 2017-05-11 日産化学工業株式会社 エポキシ系反応性希釈剤及びそれを含むエポキシ樹脂組成物
TWI687448B (zh) * 2016-12-09 2020-03-11 南韓商Ｌｇ化學股份有限公司 封裝組成物
KR102034455B1 (ko) * 2016-12-09 2019-10-21 주식회사 엘지화학 밀봉재 조성물
JP6719674B2 (ja) * 2016-12-09 2020-07-08 エルジー・ケム・リミテッド シール材組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201602227A (zh) * 2014-03-25 2016-01-16 富士軟片股份有限公司 組成物、底部塡充用積層體、積層體、半導體裝置之製造方法、及半導體裝置
TW201708437A (zh) * 2015-03-20 2017-03-01 藍色立方體有限責任公司 可固化組成物
TW201734078A (zh) * 2015-11-05 2017-10-01 日產化學工業有限公司 多官能環氧化合物及含有其之硬化性組合物
WO2018106090A1 (ko) * 2016-12-09 2018-06-14 주식회사 엘지화학 밀봉재 조성물
TW201834547A (zh) * 2016-12-09 2018-09-16 南韓商Ｌｇ化學股份有限公司 有機電子裝置之製法

Also Published As

Publication number Publication date
CN113166374A (zh) 2021-07-23
TW202042316A (zh) 2020-11-16
WO2020067827A1 (ko) 2020-04-02
KR102253501B1 (ko) 2021-05-18
US20220017693A1 (en) 2022-01-20
JP2022501461A (ja) 2022-01-06
JP7180837B2 (ja) 2022-11-30
CN113166374B (zh) 2024-02-27
KR20200036383A (ko) 2020-04-07

Similar Documents

Publication Publication Date Title
EP3697376B8 (en) Composition
EP3897522A4 (en) MICROCAPSULE COMPOSITION
EP3890761A4 (en) NEW COMPOSITION
EP3722358A4 (en) COMPOSITION
EP3626751A4 (en) RESIN COMPOSITION
EP3626770A4 (en) RESIN COMPOSITION
EP3866752A4 (en) ENCAPSULATION
EP3584364A4 (en) COMPOSITION
EP3705501A4 (en) RESIN COMPOSITION
EP3646858A4 (en) ENCLOSED FORMULATIONS
EP3705127A4 (en) COMPOSITION CONTAINING AN EXTRACT OF DESALVIA MILTIORRHIZA
EP3882323A4 (en) COMPOSITION
EP3715422A4 (en) RESIN COMPOSITION
EP3895682A4 (en) DENTAL COMPOSITION
EP3683264A4 (en) ENCLOSURE COMPOSITION
EP3701930A4 (en) DENTAL COMPOSITION
EP3722092A4 (en) ENCAPSULATION FILM
EP3725795A4 (en) JOINT MARKED WITH STABLE ISOTOPES
EP3629747A4 (en) COMPOSITION WITH ANTI-OVERFLOW FUNCTION
TWI800688B (zh) 封裝組成物
EP3897732A4 (en) COMPOSITION CONTAINING CANNABINOIDS
EP3808785A4 (en) COMPOSITION
EP3725860A4 (en) COMPOSITION FOR ENCAPSULATION
EP3769784A4 (en) ANTI-INFLAMMATORY COMPOSITION
EP3760602A4 (en) COMPOSITION OF PARTICLES