TWI800501B - 用於將暴露於uv輻射的液體介質塗佈至基板上的裝置 - Google Patents

用於將暴露於uv輻射的液體介質塗佈至基板上的裝置 Download PDF

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Publication number
TWI800501B
TWI800501B TW107106829A TW107106829A TWI800501B TW I800501 B TWI800501 B TW I800501B TW 107106829 A TW107106829 A TW 107106829A TW 107106829 A TW107106829 A TW 107106829A TW I800501 B TWI800501 B TW I800501B
Authority
TW
Taiwan
Prior art keywords
liquid medium
radiation onto
applying liquid
onto substrate
medium exposed
Prior art date
Application number
TW107106829A
Other languages
English (en)
Other versions
TW201841690A (zh
Inventor
彼特 德瑞斯
伍威 戴茲
彼特 格拉比茲
Original Assignee
德商休斯微科光罩儀器股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商休斯微科光罩儀器股份有限公司 filed Critical 德商休斯微科光罩儀器股份有限公司
Publication of TW201841690A publication Critical patent/TW201841690A/zh
Application granted granted Critical
Publication of TWI800501B publication Critical patent/TWI800501B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Physical Water Treatments (AREA)
  • Coating Apparatus (AREA)
TW107106829A 2017-03-01 2018-03-01 用於將暴露於uv輻射的液體介質塗佈至基板上的裝置 TWI800501B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017203351.7A DE102017203351B4 (de) 2017-03-01 2017-03-01 Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat
??102017203351.7 2017-03-01
DE102017203351.7 2017-03-01

Publications (2)

Publication Number Publication Date
TW201841690A TW201841690A (zh) 2018-12-01
TWI800501B true TWI800501B (zh) 2023-05-01

Family

ID=61569258

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107106829A TWI800501B (zh) 2017-03-01 2018-03-01 用於將暴露於uv輻射的液體介質塗佈至基板上的裝置

Country Status (9)

Country Link
US (1) US11410858B2 (zh)
EP (1) EP3589428B1 (zh)
JP (1) JP6980799B2 (zh)
KR (1) KR102553800B1 (zh)
CN (1) CN110402170B (zh)
DE (1) DE102017203351B4 (zh)
RU (1) RU2756470C2 (zh)
TW (1) TWI800501B (zh)
WO (1) WO2018158394A1 (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200941613A (en) * 2007-10-31 2009-10-01 Asml Netherlands Bv Cleaning apparatus and immersion lithographic apparatus
TW201400205A (zh) * 2012-05-18 2014-01-01 Rave N P Inc 汙染物移除設備及方法
TW201525183A (zh) * 2013-12-16 2015-07-01 Applied Materials Inc 介電膜的沉積
TW201630036A (zh) * 2014-10-17 2016-08-16 蘭姆研究公司 用以描繪金屬氧化物還原的方法及設備

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1110101A (ja) * 1997-06-18 1999-01-19 Nikon Corp 光洗浄装置
JP2001300451A (ja) 2000-04-25 2001-10-30 Hoya Schott Kk 紫外光照射装置
RU2195046C2 (ru) * 2000-06-15 2002-12-20 Акционерное общество открытого типа "НИИ молекулярной электроники и завод "Микрон" Способ очистки поверхности
DE10130999A1 (de) * 2000-06-29 2002-04-18 D M S Co Multifunktions-Reinigungsmodul einer Herstellungseinrichtung für Flachbildschirme und Reinigungsgerät mit Verwendung desselben
TWI251506B (en) * 2000-11-01 2006-03-21 Shinetsu Eng Co Ltd Excimer UV photo reactor
JP2003159571A (ja) * 2001-11-27 2003-06-03 Ushio Inc 紫外線照射装置
JP4613167B2 (ja) * 2003-05-22 2011-01-12 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 少なくとも一つの光学要素を洗浄する方法および装置
JP2008068155A (ja) * 2006-09-12 2008-03-27 Ushio Inc エキシマ光照射装置
JP4905049B2 (ja) * 2006-10-17 2012-03-28 株式会社Ｇｓユアサ 紫外線照射装置及びそれの調整方法
JP2009268974A (ja) * 2008-05-08 2009-11-19 Toppan Printing Co Ltd 紫外線照射方法及び紫外線照射装置
DE102009058962B4 (de) * 2009-11-03 2012-12-27 Suss Microtec Photomask Equipment Gmbh & Co. Kg Verfahren und Vorrichtung zum Behandeln von Substraten
JP5348156B2 (ja) 2011-03-01 2013-11-20 ウシオ電機株式会社 光照射装置
DE102015011229B4 (de) * 2015-08-27 2020-07-23 Süss Microtec Photomask Equipment Gmbh & Co. Kg Vorrichtung zum Aufbringen eines mit UV-Strahlung beaufschlagten flüssigen Mediums auf ein Substrat

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200941613A (en) * 2007-10-31 2009-10-01 Asml Netherlands Bv Cleaning apparatus and immersion lithographic apparatus
TW201400205A (zh) * 2012-05-18 2014-01-01 Rave N P Inc 汙染物移除設備及方法
TW201525183A (zh) * 2013-12-16 2015-07-01 Applied Materials Inc 介電膜的沉積
TW201630036A (zh) * 2014-10-17 2016-08-16 蘭姆研究公司 用以描繪金屬氧化物還原的方法及設備

Also Published As

Publication number Publication date
KR102553800B1 (ko) 2023-07-07
JP6980799B2 (ja) 2021-12-15
EP3589428B1 (de) 2024-05-01
WO2018158394A1 (de) 2018-09-07
US11410858B2 (en) 2022-08-09
US20200075354A1 (en) 2020-03-05
EP3589428A1 (de) 2020-01-08
DE102017203351A1 (de) 2018-09-06
CN110402170B (zh) 2022-10-21
CN110402170A (zh) 2019-11-01
RU2019130702A (ru) 2021-04-01
TW201841690A (zh) 2018-12-01
DE102017203351B4 (de) 2021-08-05
JP2020509593A (ja) 2020-03-26
RU2756470C2 (ru) 2021-09-30
KR20190124759A (ko) 2019-11-05
RU2019130702A3 (zh) 2021-04-01

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