TWI800084B - 用於確認探針是否與接觸墊相接觸的半導體檢測方法 - Google Patents
用於確認探針是否與接觸墊相接觸的半導體檢測方法 Download PDFInfo
- Publication number
- TWI800084B TWI800084B TW110141685A TW110141685A TWI800084B TW I800084 B TWI800084 B TW I800084B TW 110141685 A TW110141685 A TW 110141685A TW 110141685 A TW110141685 A TW 110141685A TW I800084 B TWI800084 B TW I800084B
- Authority
- TW
- Taiwan
- Prior art keywords
- contact
- confirming whether
- inspecting method
- semiconductor inspecting
- contact pads
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202063113199P | 2020-11-13 | 2020-11-13 | |
US63/113,199 | 2020-11-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202223420A TW202223420A (zh) | 2022-06-16 |
TWI800084B true TWI800084B (zh) | 2023-04-21 |
Family
ID=81345316
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110141683A TWI800083B (zh) | 2020-11-13 | 2021-11-09 | 於接觸墊上確保刮除長度的半導體檢測方法 |
TW110141685A TWI800084B (zh) | 2020-11-13 | 2021-11-09 | 用於確認探針是否與接觸墊相接觸的半導體檢測方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW110141683A TWI800083B (zh) | 2020-11-13 | 2021-11-09 | 於接觸墊上確保刮除長度的半導體檢測方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US11703541B2 (zh) |
DE (2) | DE102021129067A1 (zh) |
TW (2) | TWI800083B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07297241A (ja) * | 1994-04-19 | 1995-11-10 | Tokyo Electron Ltd | プローブ方法 |
TW201636618A (zh) * | 2014-12-24 | 2016-10-16 | 克禮陶股份有限公司 | 半自動探測器 |
TW201643451A (zh) * | 2014-12-05 | 2016-12-16 | Tokyo Electron Ltd | 探針裝置及探針方法 |
US20210116496A1 (en) * | 2019-10-21 | 2021-04-22 | Star Technologies, Inc. | Method of operating a probing apparatus |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5657394A (en) * | 1993-06-04 | 1997-08-12 | Integrated Technology Corporation | Integrated circuit probe card inspection system |
US5644245A (en) * | 1993-11-24 | 1997-07-01 | Tokyo Electron Limited | Probe apparatus for inspecting electrical characteristics of a microelectronic element |
US6414477B1 (en) * | 1999-06-07 | 2002-07-02 | Applied Precision, Inc. | Method for optimizing probe card analysis and scrub mark analysis data |
DE102004030881B4 (de) | 2003-07-01 | 2015-05-13 | Cascade Microtech, Inc. | Verfahren und Prober zur Kontaktierung einer Kontakfläche mit einer Kontaktspitze |
US7688085B2 (en) * | 2006-06-13 | 2010-03-30 | Formfactor, Inc. | Contactor having a global spring structure and methods of making and using the contactor |
DE102007054879B4 (de) | 2007-07-17 | 2018-08-02 | Cascade Microtech, Inc. | Verfahren und Anordnung zur Positionierung einer Probecard |
US7629805B2 (en) * | 2008-03-19 | 2009-12-08 | Texas Instruments Incorporated | Method and system to dynamically compensate for probe tip misalignement when testing integrated circuits |
KR102189285B1 (ko) * | 2014-11-04 | 2020-12-09 | 세메스 주식회사 | 다이들의 위치 정보를 획득하는 방법 |
CN106935524B (zh) * | 2015-12-24 | 2020-04-21 | 台湾积体电路制造股份有限公司 | 探针卡和晶圆测试系统及晶圆测试方法 |
-
2021
- 2021-11-09 DE DE102021129067.8A patent/DE102021129067A1/de active Pending
- 2021-11-09 TW TW110141683A patent/TWI800083B/zh active
- 2021-11-09 TW TW110141685A patent/TWI800084B/zh active
- 2021-11-10 DE DE102021129203.4A patent/DE102021129203A1/de active Pending
- 2021-11-12 US US17/524,788 patent/US11703541B2/en active Active
- 2021-11-12 US US17/524,833 patent/US11693050B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07297241A (ja) * | 1994-04-19 | 1995-11-10 | Tokyo Electron Ltd | プローブ方法 |
TW201643451A (zh) * | 2014-12-05 | 2016-12-16 | Tokyo Electron Ltd | 探針裝置及探針方法 |
TW201636618A (zh) * | 2014-12-24 | 2016-10-16 | 克禮陶股份有限公司 | 半自動探測器 |
US20210116496A1 (en) * | 2019-10-21 | 2021-04-22 | Star Technologies, Inc. | Method of operating a probing apparatus |
Also Published As
Publication number | Publication date |
---|---|
US20220155366A1 (en) | 2022-05-19 |
TW202229913A (zh) | 2022-08-01 |
TWI800083B (zh) | 2023-04-21 |
US11693050B2 (en) | 2023-07-04 |
DE102021129067A1 (de) | 2022-05-19 |
TW202223420A (zh) | 2022-06-16 |
DE102021129203A1 (de) | 2022-05-19 |
US20220155365A1 (en) | 2022-05-19 |
US11703541B2 (en) | 2023-07-18 |
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