TWI794152B - 用於化學機械研磨後清潔之組成物 - Google Patents

用於化學機械研磨後清潔之組成物 Download PDF

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Publication number
TWI794152B
TWI794152B TW105142442A TW105142442A TWI794152B TW I794152 B TWI794152 B TW I794152B TW 105142442 A TW105142442 A TW 105142442A TW 105142442 A TW105142442 A TW 105142442A TW I794152 B TWI794152 B TW I794152B
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TW
Taiwan
Prior art keywords
composition
weight
range
acid
cleaning
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Application number
TW105142442A
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English (en)
Chinese (zh)
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TW201732026A (zh
Inventor
可里斯汀 戴許藍
馬克斯 席伯特
米夏埃爾 勞特
彼得 普茲比斯基
胡利安 普洛斯
安卓亞斯 克里普
哈奇 歐斯曼 古芬克
李歐納度斯 里尼森
羅爾夫 彼得 包曼
魏得育
Original Assignee
德商巴斯夫歐洲公司
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Publication of TW201732026A publication Critical patent/TW201732026A/zh
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Publication of TWI794152B publication Critical patent/TWI794152B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3707—Polyethers, e.g. polyalkyleneoxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0026—Low foaming or foam regulating compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3719—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
    • C11D3/3765—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions in liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/378—(Co)polymerised monomers containing sulfur, e.g. sulfonate
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3784—(Co)polymerised monomers containing phosphorus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/18—Glass; Plastics
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW105142442A 2015-12-22 2016-12-21 用於化學機械研磨後清潔之組成物 TWI794152B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP15201910 2015-12-22
EP15201910.5 2015-12-22

Publications (2)

Publication Number Publication Date
TW201732026A TW201732026A (zh) 2017-09-16
TWI794152B true TWI794152B (zh) 2023-03-01

Family

ID=55023982

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105142442A TWI794152B (zh) 2015-12-22 2016-12-21 用於化學機械研磨後清潔之組成物

Country Status (8)

Country Link
US (1) US10844325B2 (OSRAM)
EP (1) EP3394234B1 (OSRAM)
JP (1) JP6949846B2 (OSRAM)
KR (1) KR102870073B1 (OSRAM)
CN (1) CN108473918B (OSRAM)
SG (1) SG11201804637UA (OSRAM)
TW (1) TWI794152B (OSRAM)
WO (1) WO2017108743A1 (OSRAM)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201804636YA (en) * 2015-12-22 2018-07-30 Basf Se Composition for post chemical-mechanical-polishing cleaning
WO2019105777A1 (en) * 2017-11-29 2019-06-06 Basf Se A process for styling human hair
CN109576090A (zh) * 2018-12-13 2019-04-05 中国科学院上海光学精密机械研究所 氧化物光学元件化学机械抛光后残留物清洗剂及其制备方法
CN119776089A (zh) * 2020-03-19 2025-04-08 富士胶片电子材料美国有限公司 清洁组合物及其使用方法
JP2022144640A (ja) * 2021-03-19 2022-10-03 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング 基板処理液、これを用いる基板の製造方法およびデバイスの製造方法
CA3213769A1 (en) 2021-04-01 2022-10-06 Sterilex, Llc Quat-free powdered disinfectant/sanitizer
CN119325501A (zh) 2022-05-31 2025-01-17 巴斯夫欧洲公司 用于清洁包含钴和铜的衬底的组合物、其用途及方法
CN121399239A (zh) 2023-06-20 2026-01-23 巴斯夫欧洲公司 用于清洁包含钴和铜的衬底的碱性组合物、其用途及方法
CN121548628A (zh) 2023-06-20 2026-02-17 巴斯夫欧洲公司 用于清洁包含钴和铜的衬底的碱性组合物、其用途及方法
WO2026057376A1 (en) 2024-09-11 2026-03-19 Basf Se Alkaline composition, its use and a process for cleaning substrates comprising cobalt and copper

Citations (2)

* Cited by examiner, † Cited by third party
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CN1137287A (zh) * 1993-12-14 1996-12-04 普罗格特-甘布尔公司 含有聚氨基酸和聚亚烷基二醇的液体洗衣剂
WO2015007347A1 (en) * 2013-07-19 2015-01-22 Ecolab Inc. Mild alkaline solid instrument cleaner

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US3907985A (en) * 1973-07-27 1975-09-23 Burton Parsons And Company Inc Polystyrene sulfonate containing opthalmic solutions
KR20020027571A (ko) 1999-08-24 2002-04-13 갤반 마틴 절연체와 금속의 ｃｍｐ용 조성물 및 이에 관련된 방법
WO2008023215A1 (en) * 2006-08-23 2008-02-28 Freescale Semiconductor, Inc. Post chemical mechanical polishing rinse formulation
JP4777197B2 (ja) 2006-09-11 2011-09-21 富士フイルム株式会社 洗浄液及びそれを用いた洗浄方法
US8685909B2 (en) * 2006-09-21 2014-04-01 Advanced Technology Materials, Inc. Antioxidants for post-CMP cleaning formulations
KR101622862B1 (ko) * 2007-05-17 2016-05-19 엔테그리스, 아이엔씨. Ｃｍｐ후 세정 제제용 신규한 항산화제
US8114827B2 (en) 2007-08-28 2012-02-14 Ecolab Usa Inc. Paste-like detergent formulation comprising branched alkoxylated fatty alcohols as non-ionic surfactants
US20090056744A1 (en) 2007-08-29 2009-03-05 Micron Technology, Inc. Wafer cleaning compositions and methods
JP2009069505A (ja) 2007-09-13 2009-04-02 Tosoh Corp レジスト除去用洗浄液及び洗浄方法
WO2012043767A1 (ja) * 2010-10-01 2012-04-05 三菱化学株式会社 半導体デバイス用基板の洗浄液及び洗浄方法
SG11201404930SA (en) 2012-02-15 2014-09-26 Advanced Tech Materials Post-cmp removal using compositions and method of use
TWI573864B (zh) * 2012-03-14 2017-03-11 卡博特微電子公司 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之ｃｍｐ組成物
KR102040050B1 (ko) * 2013-08-02 2019-11-05 동우 화인켐 주식회사 웨이퍼 다이싱용 세정제 조성물
JP2015181079A (ja) * 2014-03-05 2015-10-15 三洋化成工業株式会社 磁気ディスク基板用洗浄剤組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1137287A (zh) * 1993-12-14 1996-12-04 普罗格特-甘布尔公司 含有聚氨基酸和聚亚烷基二醇的液体洗衣剂
WO2015007347A1 (en) * 2013-07-19 2015-01-22 Ecolab Inc. Mild alkaline solid instrument cleaner

Also Published As

Publication number Publication date
JP6949846B2 (ja) 2021-10-13
US10844325B2 (en) 2020-11-24
JP2019502803A (ja) 2019-01-31
KR20180091928A (ko) 2018-08-16
EP3394234B1 (en) 2019-10-09
CN108473918B (zh) 2021-11-30
WO2017108743A1 (en) 2017-06-29
US20180371371A1 (en) 2018-12-27
KR102870073B1 (ko) 2025-10-13
CN108473918A (zh) 2018-08-31
TW201732026A (zh) 2017-09-16
SG11201804637UA (en) 2018-07-30
EP3394234A1 (en) 2018-10-31

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