KR102870073B1 - 화학적-기계적-연마 후 세척용 조성물 - Google Patents

화학적-기계적-연마 후 세척용 조성물

Info

Publication number
KR102870073B1
KR102870073B1 KR1020187021141A KR20187021141A KR102870073B1 KR 102870073 B1 KR102870073 B1 KR 102870073B1 KR 1020187021141 A KR1020187021141 A KR 1020187021141A KR 20187021141 A KR20187021141 A KR 20187021141A KR 102870073 B1 KR102870073 B1 KR 102870073B1
Authority
KR
South Korea
Prior art keywords
acid
composition
range
cleaning composition
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020187021141A
Other languages
English (en)
Korean (ko)
Other versions
KR20180091928A (ko
Inventor
크리슈티안 데슐라인
막스 지베르트
미하엘 라우터
페터 프시빌스키
율리안 프뢸쓰
안드레아스 클리프
하지 오스만 귀벤즈
레오나르뒤스 뢰니선
뢸프-페터 바우만
터 위 웨이
Original Assignee
바스프 에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 바스프 에스이 filed Critical 바스프 에스이
Publication of KR20180091928A publication Critical patent/KR20180091928A/ko
Application granted granted Critical
Publication of KR102870073B1 publication Critical patent/KR102870073B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3707—Polyethers, e.g. polyalkyleneoxides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0026—Low foaming or foam regulating compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3719—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
    • C11D3/3765—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions in liquid compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/378—(Co)polymerised monomers containing sulfur, e.g. sulfonate
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/37—Polymers
    • C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3784—(Co)polymerised monomers containing phosphorus
    • H01L21/02052—
    • H01L21/304—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/10—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H10P70/15—Cleaning before device manufacture, i.e. Begin-Of-Line process by wet cleaning only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/18—Glass; Plastics
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Detergent Compositions (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020187021141A 2015-12-22 2016-12-20 화학적-기계적-연마 후 세척용 조성물 Active KR102870073B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15201910 2015-12-22
EP15201910.5 2015-12-22
PCT/EP2016/081847 WO2017108743A1 (en) 2015-12-22 2016-12-20 Composition for post chemical-mechanical-polishing cleaning

Publications (2)

Publication Number Publication Date
KR20180091928A KR20180091928A (ko) 2018-08-16
KR102870073B1 true KR102870073B1 (ko) 2025-10-13

Family

ID=55023982

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187021141A Active KR102870073B1 (ko) 2015-12-22 2016-12-20 화학적-기계적-연마 후 세척용 조성물

Country Status (8)

Country Link
US (1) US10844325B2 (OSRAM)
EP (1) EP3394234B1 (OSRAM)
JP (1) JP6949846B2 (OSRAM)
KR (1) KR102870073B1 (OSRAM)
CN (1) CN108473918B (OSRAM)
SG (1) SG11201804637UA (OSRAM)
TW (1) TWI794152B (OSRAM)
WO (1) WO2017108743A1 (OSRAM)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201804636YA (en) * 2015-12-22 2018-07-30 Basf Se Composition for post chemical-mechanical-polishing cleaning
WO2019105777A1 (en) * 2017-11-29 2019-06-06 Basf Se A process for styling human hair
CN109576090A (zh) * 2018-12-13 2019-04-05 中国科学院上海光学精密机械研究所 氧化物光学元件化学机械抛光后残留物清洗剂及其制备方法
CN119776089A (zh) * 2020-03-19 2025-04-08 富士胶片电子材料美国有限公司 清洁组合物及其使用方法
JP2022144640A (ja) * 2021-03-19 2022-10-03 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング 基板処理液、これを用いる基板の製造方法およびデバイスの製造方法
CA3213769A1 (en) 2021-04-01 2022-10-06 Sterilex, Llc Quat-free powdered disinfectant/sanitizer
CN119325501A (zh) 2022-05-31 2025-01-17 巴斯夫欧洲公司 用于清洁包含钴和铜的衬底的组合物、其用途及方法
CN121399239A (zh) 2023-06-20 2026-01-23 巴斯夫欧洲公司 用于清洁包含钴和铜的衬底的碱性组合物、其用途及方法
CN121548628A (zh) 2023-06-20 2026-02-17 巴斯夫欧洲公司 用于清洁包含钴和铜的衬底的碱性组合物、其用途及方法
WO2026057376A1 (en) 2024-09-11 2026-03-19 Basf Se Alkaline composition, its use and a process for cleaning substrates comprising cobalt and copper

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090239777A1 (en) * 2006-09-21 2009-09-24 Advanced Technology Materials, Inc. Antioxidants for post-cmp cleaning formulations

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3907985A (en) * 1973-07-27 1975-09-23 Burton Parsons And Company Inc Polystyrene sulfonate containing opthalmic solutions
WO1995016767A1 (en) * 1993-12-14 1995-06-22 The Procter & Gamble Company Liquid laundry detergents containing polyamino acid and polyalkylene glycol
KR20020027571A (ko) 1999-08-24 2002-04-13 갤반 마틴 절연체와 금속의 ｃｍｐ용 조성물 및 이에 관련된 방법
WO2008023215A1 (en) * 2006-08-23 2008-02-28 Freescale Semiconductor, Inc. Post chemical mechanical polishing rinse formulation
JP4777197B2 (ja) 2006-09-11 2011-09-21 富士フイルム株式会社 洗浄液及びそれを用いた洗浄方法
KR101622862B1 (ko) * 2007-05-17 2016-05-19 엔테그리스, 아이엔씨. Ｃｍｐ후 세정 제제용 신규한 항산화제
US8114827B2 (en) 2007-08-28 2012-02-14 Ecolab Usa Inc. Paste-like detergent formulation comprising branched alkoxylated fatty alcohols as non-ionic surfactants
US20090056744A1 (en) 2007-08-29 2009-03-05 Micron Technology, Inc. Wafer cleaning compositions and methods
JP2009069505A (ja) 2007-09-13 2009-04-02 Tosoh Corp レジスト除去用洗浄液及び洗浄方法
WO2012043767A1 (ja) * 2010-10-01 2012-04-05 三菱化学株式会社 半導体デバイス用基板の洗浄液及び洗浄方法
SG11201404930SA (en) 2012-02-15 2014-09-26 Advanced Tech Materials Post-cmp removal using compositions and method of use
TWI573864B (zh) * 2012-03-14 2017-03-11 卡博特微電子公司 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之ｃｍｐ組成物
PL3022280T3 (pl) * 2013-07-19 2019-06-28 Ecolab Usa Inc. Łagodny, alkaliczny, stały środek do czyszczenia narzędzi
KR102040050B1 (ko) * 2013-08-02 2019-11-05 동우 화인켐 주식회사 웨이퍼 다이싱용 세정제 조성물
JP2015181079A (ja) * 2014-03-05 2015-10-15 三洋化成工業株式会社 磁気ディスク基板用洗浄剤組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090239777A1 (en) * 2006-09-21 2009-09-24 Advanced Technology Materials, Inc. Antioxidants for post-cmp cleaning formulations

Also Published As

Publication number Publication date
JP6949846B2 (ja) 2021-10-13
US10844325B2 (en) 2020-11-24
JP2019502803A (ja) 2019-01-31
KR20180091928A (ko) 2018-08-16
EP3394234B1 (en) 2019-10-09
CN108473918B (zh) 2021-11-30
WO2017108743A1 (en) 2017-06-29
US20180371371A1 (en) 2018-12-27
CN108473918A (zh) 2018-08-31
TW201732026A (zh) 2017-09-16
SG11201804637UA (en) 2018-07-30
EP3394234A1 (en) 2018-10-31
TWI794152B (zh) 2023-03-01

Similar Documents

Publication Publication Date Title
KR102773140B1 (ko) 포스트 화학적-기계적-폴리싱 세정을 위한 조성물
US10844325B2 (en) Composition for post chemical-mechanical-polishing cleaning
EP2596091B1 (en) Aqueous alkaline cleaning compositions and methods of their use
CN1670147A (zh) 碱性后化学机械平面化清洗组合物
KR102377573B1 (ko) 포스트 화학적-기계적-폴리싱 세정용 조성물
KR101751553B1 (ko) 수성 알칼리 세정 조성물 및 그 사용 방법
EP1466963A1 (en) Cleaning liquid composition for semiconductor substrate
KR20250020516A (ko) 코발트 및 구리를 포함하는 기판의 세정을 위한 조성물, 이의 용도 및 방법
KR102399811B1 (ko) 금속막 연마 후 세정액 조성물

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000