以下，參照圖式對本發明之基板處理裝置進行說明。
Hereinafter, the substrate processing apparatus of the present invention will be described with reference to the drawings.
[第1實施形態]
[First Embodiment]
<基板處理裝置之概要>
<Overview of substrate processing equipment>
圖1係第1實施形態之基板處理裝置之概念圖。第1實施形態之基板處理裝置1對基板(例如半導體晶圓)W進行一連串之處理。
FIG. 1 is a conceptual diagram of a substrate processing apparatus according to a first embodiment. The substrate processing apparatus 1 of the first embodiment performs a series of processing on a substrate (for example, a semiconductor wafer) W.
基板W例如為半導體晶圓、液晶顯示器用基板、有機EL(Electroluminescence)用基板、FPD(Flat Panel Display)用基板、光顯示器用基板、磁碟用基板、光碟用基板、磁光碟用基板、光罩用基板、太陽電池用基板。基板W具有較薄之平板形狀。基板W於俯視下具有大致圓形狀。
The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for organic EL (Electroluminescence), a substrate for FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, or an optical disk. Cover substrates, solar cell substrates. The substrate W has a thin flat plate shape. The substrate W has a substantially circular shape in plan view.
基板處理裝置1具備主搬送機構17、第1處理部31、第1搬送機構27、第2處理部61及第2搬送機構57。主搬送機構17搬送基板W。第1處理部31對基板W進行處理。第1搬送機構27將基板W搬送至第1處理部31。第2處理部61對基板W進行處理。第2搬送機構57將基板W搬送至第2處理部61。第1搬送機構27配置於主搬送機構17與第2搬送機構57之間。主搬送機構17與第1搬送機構27可相互搬送基板W。第1搬送機構27與第2搬送機構57可相互搬送基板W。
The substrate processing apparatus 1 includes a main transport mechanism 17 , a first processing unit 31 , a first transport mechanism 27 , a second processing unit 61 , and a second transport mechanism 57 . The main transport mechanism 17 transports the substrate W. The first processing unit 31 processes the substrate W. As shown in FIG. The first transport mechanism 27 transports the substrate W to the first processing unit 31 . The second processing unit 61 processes the substrate W. As shown in FIG. The second transport mechanism 57 transports the substrate W to the second processing unit 61 . The first transport mechanism 27 is arranged between the main transport mechanism 17 and the second transport mechanism 57 . The main transport mechanism 17 and the first transport mechanism 27 can transport the substrate W mutually. The first transport mechanism 27 and the second transport mechanism 57 can transport the substrate W mutually.
基板處理裝置1具備迂迴搬送機構41。迂迴搬送機構41搬送基板W。迂迴搬送機構41配置於主搬送機構17與第2搬送機構57之間。迂迴搬送機構41與主搬送機構17可相互搬送基板W。迂迴搬送機構41與第2搬送機構57可相互搬送基板W。
The substrate processing apparatus 1 includes a detour transport mechanism 41 . The detour transport mechanism 41 transports the substrate W. The detour transport mechanism 41 is arranged between the main transport mechanism 17 and the second transport mechanism 57 . The detour transport mechanism 41 and the main transport mechanism 17 can mutually transport the substrate W. The detour transport mechanism 41 and the second transport mechanism 57 can mutually transport the substrate W.
第1搬送機構27及迂迴搬送機構41配置於主搬送機構17與第2搬送機構57之間。因此，於主搬送機構17與第2搬送機構57之間搬送基板W時，基板W必須經由第1搬送機構27及迂迴搬送機構41之任一者。主搬送機構17無法將基板W交遞至第2搬送機構57。主搬送機構17無法自第2搬送機
構57接收基板W。即，主搬送機構17與第2搬送機構無法相互搬送基板W。
The first transport mechanism 27 and the detour transport mechanism 41 are arranged between the main transport mechanism 17 and the second transport mechanism 57 . Therefore, when transferring the substrate W between the main transfer mechanism 17 and the second transfer mechanism 57 , the substrate W must pass through either the first transfer mechanism 27 or the detour transfer mechanism 41 . The main transport mechanism 17 cannot deliver the substrate W to the second transport mechanism 57 . The main conveying mechanism 17 cannot be transferred from the second conveying mechanism
The structure 57 receives the substrate W. That is, the main transport mechanism 17 and the second transport mechanism cannot mutually transport the substrate W.
對基板處理裝置1之3個動作例進行例示。圖2(a)係模式性地表示基板處理裝置1之第1動作例之圖。圖2(b)係模式性地表示基板處理裝置1之第2動作例之圖。圖2(c)係模式性地表示基板處理裝置1之第3動作例之圖。圖2(a)~2(c)模式性地表示基板W所通過之基板處理裝置1之元件(例如搬送機構、處理部)。
Three operation examples of the substrate processing apparatus 1 will be illustrated. FIG. 2( a ) is a diagram schematically showing a first operation example of the substrate processing apparatus 1 . FIG. 2( b ) is a diagram schematically showing a second operation example of the substrate processing apparatus 1 . FIG. 2( c ) is a diagram schematically showing a third operation example of the substrate processing apparatus 1 . 2( a ) to 2( c ) schematically show the components of the substrate processing apparatus 1 through which the substrate W passes (for example, a transport mechanism and a processing unit).
參照圖2(a)。於第1動作例中，將基板W搬送至第2處理部61及第1處理部31。具體而言，主搬送機構17將基板W交遞至迂迴搬送機構41。迂迴搬送機構41將基板W自主搬送機構17搬送至第2搬送機構57。第2搬送機構57將基板W自迂迴搬送機構41搬送至第2處理部61。第2處理部61對基板W進行處理。第2搬送機構57將基板W自第2處理部61搬送至第1搬送機構27。第1搬送機構27將基板W自第2搬送機構57搬送至第1處理部31。第1處理部31對基板W進行處理。第1搬送機構27將基板W自第1處理部31搬送至主搬送機構17。主搬送機構17自第1搬送機構27接收基板W。藉此，基板處理裝置1依序對基板W進行藉由第2處理部61之處理及藉由第1處理部31之處理。
Refer to Figure 2(a). In the first operation example, the substrate W is transferred to the second processing unit 61 and the first processing unit 31 . Specifically, the main transport mechanism 17 delivers the substrate W to the detour transport mechanism 41 . The detour transport mechanism 41 transports the substrate W from the main transport mechanism 17 to the second transport mechanism 57 . The second transport mechanism 57 transports the substrate W from the detour transport mechanism 41 to the second processing unit 61 . The second processing unit 61 processes the substrate W. As shown in FIG. The second transport mechanism 57 transports the substrate W from the second processing unit 61 to the first transport mechanism 27 . The first transport mechanism 27 transports the substrate W from the second transport mechanism 57 to the first processing unit 31 . The first processing unit 31 processes the substrate W. As shown in FIG. The first transport mechanism 27 transports the substrate W from the first processing unit 31 to the main transport mechanism 17 . The main transport mechanism 17 receives the substrate W from the first transport mechanism 27 . Thereby, the substrate processing apparatus 1 sequentially performs processing by the second processing unit 61 and processing by the first processing unit 31 on the substrate W.
參照圖2(b)。於第2動作例中，將基板W搬送至第1處理部31及第2處理部61。具體而言，主搬送機構17將基板W交遞至第1搬送機構27。第1搬送機構27將基板W自主搬送機構17搬送至第1處理部31。第1處理部31
對基板W進行處理。第1搬送機構27將基板W自第1處理部31搬送至第2搬送機構57。第2搬送機構57將基板W自第1搬送機構27搬送至第2處理部61。第2處理部61對基板W進行處理。第2搬送機構57將基板W自第2處理部61搬送至迂迴搬送機構41。迂迴搬送機構41將基板W自第2搬送機構57搬送至主搬送機構17。主搬送機構17自迂迴搬送機構41接收基板W。藉此，基板處理裝置1依序對基板W進行藉由第1處理部31之處理及藉由第2處理部61之處理。
Refer to Figure 2(b). In the second operation example, the substrate W is transferred to the first processing unit 31 and the second processing unit 61 . Specifically, the main transport mechanism 17 delivers the substrate W to the first transport mechanism 27 . The first transport mechanism 27 transports the substrate W to the first processing unit 31 by the main transport mechanism 17 . 1st processing unit 31
The substrate W is processed. The first transport mechanism 27 transports the substrate W from the first processing unit 31 to the second transport mechanism 57 . The second transport mechanism 57 transports the substrate W from the first transport mechanism 27 to the second processing unit 61 . The second processing unit 61 processes the substrate W. As shown in FIG. The second transport mechanism 57 transports the substrate W from the second processing unit 61 to the detour transport mechanism 41 . The detour transport mechanism 41 transports the substrate W from the second transport mechanism 57 to the main transport mechanism 17 . The main transport mechanism 17 receives the substrate W from the detour transport mechanism 41 . Thereby, the substrate processing apparatus 1 sequentially performs processing by the first processing unit 31 and processing by the second processing unit 61 on the substrate W.
參照圖2(c)。於第3動作例中，將一部分基板W搬送至第1處理部31，將其他基板W搬送至第2處理部61。於第3動作例之說明中，將搬送至第1處理部31之基板W稱為第1基板W1，將搬送至第2處理部61之基板W稱為第2基板W2。
Refer to Figure 2(c). In the third operation example, a part of the substrate W is transferred to the first processing unit 31 , and the other substrate W is transferred to the second processing unit 61 . In the description of the third operation example, the substrate W transferred to the first processing unit 31 is referred to as a first substrate W1, and the substrate W transferred to the second processing unit 61 is referred to as a second substrate W2.
主搬送機構17將第1基板交遞至第1搬送機構27，且將第2基板W2交遞至迂迴搬送機構41。第1搬送機構27將第1基板W1自主搬送機構17搬送至第1處理部31。第1處理部31對第1基板W1進行處理。第1搬送機構27將第1基板W1自第1處理部31搬送至主搬送機構17。迂迴搬送機構41將第2基板W2自主搬送機構17搬送至第2搬送機構57。第2搬送機構57將第2基板W2自迂迴搬送機構41搬送至第2處理部61。第2處理部61對第2基板W2進行處理。第2搬送機構57將第2基板W2自第2處理部61搬送至迂迴搬送機構41。迂迴搬送機構41將第2基板W2自第2搬送機構57搬送至主搬送機構17。主搬送機構17自第1搬送機構27接收第1基板W1，且自第2搬送機構57接收第2基板W2。藉此，基板處理裝置1藉由第1處理部31對第1基板
W1進行處理，且藉由第2處理部61對第2基板W2進行處理。
The main transport mechanism 17 delivers the first substrate to the first transport mechanism 27 , and delivers the second substrate W2 to the detour transport mechanism 41 . The first transport mechanism 27 transports the first substrate W1 to the first processing unit 31 by the main transport mechanism 17 . The first processing unit 31 processes the first substrate W1. The first transport mechanism 27 transports the first substrate W1 from the first processing unit 31 to the main transport mechanism 17 . The detour transport mechanism 41 transports the second substrate W2 from the main transport mechanism 17 to the second transport mechanism 57 . The second transport mechanism 57 transports the second substrate W2 from the detour transport mechanism 41 to the second processing unit 61 . The second processing unit 61 processes the second substrate W2. The second transport mechanism 57 transports the second substrate W2 from the second processing unit 61 to the detour transport mechanism 41 . The detour transport mechanism 41 transports the second substrate W2 from the second transport mechanism 57 to the main transport mechanism 17 . The main transport mechanism 17 receives the first substrate W1 from the first transport mechanism 27 and receives the second substrate W2 from the second transport mechanism 57 . Thereby, the substrate processing apparatus 1 processes the first substrate by the first processing unit 31
W1 performs processing, and the second substrate W2 is processed by the second processing unit 61 .
於上述第1動作例、第2動作例及第3動作例中，第1處理部31與第2處理部61可同時運轉。例如，於第1處理部31對基板W進行處理時，第2處理部61可對其他基板W進行處理。
In the above-mentioned first operation example, second operation example, and third operation example, the first processing unit 31 and the second processing unit 61 can operate simultaneously. For example, the second processing unit 61 may process another substrate W while the first processing unit 31 is processing the substrate W.
<第1實施形態之主要效果>
<Main effects of the first embodiment>
基板處理裝置1具備第1處理部31及第2處理部61。因此，可對基板W進行藉由第1處理部31之處理及藉由第2處理部61之處理。
The substrate processing apparatus 1 includes a first processing unit 31 and a second processing unit 61 . Therefore, the substrate W can be processed by the first processing unit 31 and processed by the second processing unit 61 .
基板處理裝置1具備第1搬送機構27及第2搬送機構57。因此，可將基板適當地搬送至第1處理部31及第2處理部61。
The substrate processing apparatus 1 includes a first transport mechanism 27 and a second transport mechanism 57 . Therefore, the substrate can be appropriately transferred to the first processing unit 31 and the second processing unit 61 .
第1搬送機構27配置於主搬送機構17與第2搬送機構57之間。主搬送機構17與第1搬送機構27可相互搬送基板W，第1搬送機構27與第2搬送機構57可相互搬送基板W。因此，第1搬送機構27可於主搬送機構17與第2搬送機構57之間搬送基板W。
The first transport mechanism 27 is arranged between the main transport mechanism 17 and the second transport mechanism 57 . The main transfer mechanism 17 and the first transfer mechanism 27 can transfer the substrate W to each other, and the first transfer mechanism 27 and the second transfer mechanism 57 can transfer the substrate W to each other. Therefore, the first transport mechanism 27 can transport the substrate W between the main transport mechanism 17 and the second transport mechanism 57 .
迂迴搬送機構41配置於主搬送機構17與第2搬送機構57之間。主搬送機構17與迂迴搬送機構41可相互搬送基板W，迂迴搬送機構41與第2搬送機構57可相互搬送基板W。因此，迂迴搬送機構41可繞開第1搬送機構27，而於主搬送機構17與第2搬送機構57之間搬送基板W。
The detour transport mechanism 41 is arranged between the main transport mechanism 17 and the second transport mechanism 57 . The main transport mechanism 17 and the detour transport mechanism 41 can mutually transport the substrate W, and the detour transport mechanism 41 and the second transport mechanism 57 can mutually transport the substrate W. Therefore, the detour transport mechanism 41 can bypass the first transport mechanism 27 and transport the substrate W between the main transport mechanism 17 and the second transport mechanism 57 .
基板處理裝置1由於具備迂迴搬送機構41，故而可減輕第1搬送機構27搬送基板W之負擔。將不通過第1處理部31而於主搬送機構17與第2搬送機構57之間搬送基板W之情況稱為第1直行搬送。如第1~第3動作例般，第1搬送機構27不進行第1直行搬送。第1直行搬送專門由迂迴搬送機構41進行。藉此，可減輕第1搬送機構27搬送基板W之負擔。其結果，可增加第1搬送機構27於每單位時間內所能搬送至第1處理部31之基板W之片數。因此，可增加第1處理部31於每單位時間內所能處理之基板W之片數。因此，可提高基板處理裝置1之產出量(例如基板處理裝置1於每單位時間內所能處理之基板W之數量)。
Since the substrate processing apparatus 1 includes the detour transport mechanism 41 , the burden of transporting the substrate W on the first transport mechanism 27 can be reduced. The case where the substrate W is transported between the main transport mechanism 17 and the second transport mechanism 57 without passing through the first processing unit 31 is referred to as the first straight transport. Like the first to third operation examples, the first conveyance mechanism 27 does not perform the first straight conveyance. The first straight conveyance is exclusively performed by the detour conveyance mechanism 41 . Thereby, the burden of conveying the substrate W on the first conveying mechanism 27 can be reduced. As a result, the number of substrates W that can be transported to the first processing unit 31 by the first transport mechanism 27 per unit time can be increased. Therefore, the number of substrates W that can be processed by the first processing unit 31 per unit time can be increased. Therefore, the throughput of the substrate processing apparatus 1 (for example, the number of substrates W that the substrate processing apparatus 1 can process per unit time) can be increased.
如上所述，迂迴搬送機構41配置於主搬送機構17與第2搬送機構57之間。因此，可抑制迂迴搬送機構41之移動量。具體而言，可將迂迴搬送機構41進行第1直行搬送時之迂迴搬送機構41之移動量抑制於和第1搬送機構27與第2搬送機構57之直線距離相同之程度。或者，可將迂迴搬送機構41進行第1直行搬送時之迂迴搬送機構41之移動量抑制於與第1搬送機構27進行第1直行搬送時之第1搬送機構27之移動量相同之程度。進而，迂迴搬送機構41不將基板W搬送至第1處理部31。因此，迂迴搬送機構41搬送基板W之負擔相對較小。因此，於第1動作例及第3動作例中，迂迴搬送機構41可高效率地將基板W自主搬送機構17搬送至第2搬送機構57。其結果，於第1動作例及第3動作例中，可增加於每單位時間內所能供給至第2搬送機構57之基板W之片數。因此，於第1動作例及第3動作例中，可增加第2處理部61於每單位時間內所能處理之基板W之片數。因此，於第1動作例及第3動作例中，可進一步提高基板處理裝置1之產出量。
As described above, the detour transport mechanism 41 is arranged between the main transport mechanism 17 and the second transport mechanism 57 . Therefore, the amount of movement of the detour transport mechanism 41 can be suppressed. Specifically, the amount of movement of the detour transport mechanism 41 when the detour transport mechanism 41 performs the first straight transport can be suppressed to the same extent as the linear distance between the first transport mechanism 27 and the second transport mechanism 57 . Alternatively, the movement amount of the detour conveyance mechanism 41 when the detour conveyance mechanism 41 performs the first straight conveyance can be suppressed to the same degree as the movement amount of the first conveyance mechanism 27 when the first conveyance mechanism 27 performs the first straight conveyance. Furthermore, the detour transport mechanism 41 does not transport the substrate W to the first processing unit 31 . Therefore, the burden on the detour transport mechanism 41 to transport the substrate W is relatively small. Therefore, in the first operation example and the third operation example, the detour transport mechanism 41 can efficiently transport the substrate W from the main transport mechanism 17 to the second transport mechanism 57 . As a result, in the first operation example and the third operation example, the number of substrates W that can be supplied to the second transport mechanism 57 per unit time can be increased. Therefore, in the first operation example and the third operation example, the number of substrates W that can be processed by the second processing unit 61 per unit time can be increased. Therefore, in the first operation example and the third operation example, the throughput of the substrate processing apparatus 1 can be further improved.
如上所述，可減輕第1搬送機構27搬送基板W之負擔。因此，於第2動作例中，第1搬送機構27可高效率地將基板W經由第1處理部31自主搬送機構17搬送至第2搬送機構57。其結果，於第2動作例中，可增加於每單位時間內所能供給至第2搬送機構57之基板W之片數。因此，於第2動作例中，可增加第2處理部61於每單位時間內所能處理之基板W之片數。因此，於第2動作例中，可進一步提高基板處理裝置1之產出量。
As described above, the load on the first conveyance mechanism 27 to convey the substrate W can be reduced. Therefore, in the second operation example, the first transport mechanism 27 can efficiently transport the substrate W from the main transport mechanism 17 to the second transport mechanism 57 via the first processing unit 31 . As a result, in the second operation example, the number of substrates W that can be supplied to the second transport mechanism 57 per unit time can be increased. Therefore, in the second operation example, the number of substrates W that can be processed by the second processing unit 61 per unit time can be increased. Therefore, in the second operation example, the throughput of the substrate processing apparatus 1 can be further improved.
如上所述，第1動作例、第2動作例及第3動作例之任一者中，均可進一步提高基板處理裝置1之產出量。
As described above, in any one of the first operation example, the second operation example, and the third operation example, the throughput of the substrate processing apparatus 1 can be further improved.
以下，對基板處理裝置1之構造更詳細地進行說明。
Hereinafter, the structure of the substrate processing apparatus 1 will be described in more detail.
<基板處理裝置1之整體構造>
<Overall Structure of Substrate Processing Apparatus 1>
圖3係第1實施形態之基板處理裝置1之俯視圖。圖4係表示基板處理裝置1之右部之構成之右側視圖。圖5係表示寬度方向上之基板處理裝置1之中央部之構成的左側視圖。圖6係表示基板處理裝置1之左部之構成之左側視圖。
Fig. 3 is a plan view of the substrate processing apparatus 1 according to the first embodiment. FIG. 4 is a right side view showing the configuration of the right portion of the substrate processing apparatus 1 . FIG. 5 is a left side view showing the configuration of the central portion of the substrate processing apparatus 1 in the width direction. FIG. 6 is a left side view showing the configuration of the left portion of the substrate processing apparatus 1 .
基板處理裝置1具備傳載機部11、第1區塊21及第2區塊51。傳載機部11收容主搬送機構17。第1區塊21收容第1處理部31、第1搬送機構27及迂迴搬送機構41。第2區塊51收容第2處理部61及第2搬送機構57。
The substrate processing apparatus 1 includes a carrier unit 11 , a first block 21 and a second block 51 . The carrier unit 11 accommodates a main transport mechanism 17 . The first block 21 accommodates the first processing unit 31 , the first transport mechanism 27 , and the detour transport mechanism 41 . The second block 51 accommodates the second processing unit 61 and the second transport mechanism 57 .
第1區塊21於俯視下配置於傳載機部11與第2區塊51之間。第1區塊21連接於傳載機部11。第2區塊51連接於第1區塊21。第2區塊51不連接於傳載機部11。傳載機部11、第1區塊21及第2區塊51以於第1方向上排列之方式配置。傳載機部11、第1區塊21及第2區塊51以依序排列成1行之方式配置。
The first block 21 is disposed between the carrier unit 11 and the second block 51 in plan view. The first block 21 is connected to the carrier unit 11 . The second block 51 is connected to the first block 21 . The second block 51 is not connected to the carrier unit 11 . The carrier unit 11, the first block 21, and the second block 51 are arranged so as to be aligned in the first direction. The carrier unit 11, the first block 21, and the second block 51 are arranged sequentially in one row.
第1區塊21配置於與傳載機部11大致相同之高度位置。第2區塊51配置於與傳載機部11及第1區塊21大致相同之高度位置。第1方向例如為水平。
The first block 21 is arranged at substantially the same height position as the carrier unit 11 . The second block 51 is arranged at substantially the same height position as the carrier unit 11 and the first block 21 . The first direction is, for example, horizontal.
此處，將第1方向稱為「前後方向X」。前後方向X為水平。將前後方向X中之自第2區塊51朝向傳載機部11之方向稱為「前方」。將與前方相反之方向稱為「後方」。將與前後方向X正交之水平之第2方向稱為「寬度方向Y」或「側方」。將「寬度方向Y」之一方向適當地稱為「右方」。將與右方相反之方向稱為「左方」。將與前後方向X正交且與寬度方向Y正交之第3方向稱為「上下方向Z」。上下方向Z為鉛直。於各圖中，適當地表示前、後、右、左、上、下作為參考。
Here, the first direction is referred to as "front-rear direction X". The front-back direction X is horizontal. The direction from the second block 51 toward the carrier unit 11 in the front-rear direction X is referred to as "front". The direction opposite to the front is called "rear". The second horizontal direction perpendicular to the front-back direction X is referred to as "width direction Y" or "side". One direction of the "width direction Y" is appropriately called "right". The direction opposite to the right is called "left". The third direction perpendicular to the front-back direction X and to the width direction Y is referred to as "up-down direction Z". The vertical direction Z is vertical. In each drawing, front, back, right, left, top, and bottom are appropriately indicated for reference.
於本說明書中，將自前後方向X觀察之情況稱為「前視」。將自寬度方向Y觀察之情況稱為「側視」。將自上下方向Z觀察之情況稱為「俯視」。
In this specification, viewing from the front-back direction X is referred to as "front view". When viewed from the width direction Y is called "side view". The situation observed from the up-down direction Z is called "top view".
<傳載機部11>
<Conveyor Unit 11>
參照圖3~6。傳載機部11自載具C搬出基板W。傳載機部11將基板W搬入至載具C。載具C收容複數片基板W。載具C例如為FOUP(front opening unified pod，前開式晶圓傳送盒)。
Refer to Figure 3~6. The carrier unit 11 unloads the substrate W from the carrier C. As shown in FIG. The carrier unit 11 carries the substrate W onto the carrier C. As shown in FIG. The carrier C accommodates a plurality of substrates W. The carrier C is, for example, a FOUP (front opening unified pod, front opening unified pod).
傳載機部11具備載具載置部12a1、12b1。於載具載置部12a1、12b1分別載置1個載具C。載具載置部12a1配置於與載具載置部12b1大致相同之高度位置。載具載置部12a1、12b1以於寬度方向Y上排列之方式配置。載具載置部12b1配置於載具載置部12a1之左方。
The carrier unit 11 includes carrier placement units 12a1 and 12b1. One carrier C is placed on each of the carrier mounting parts 12a1 and 12b1. The carrier mounting part 12a1 is arrange|positioned at the substantially same height position as the carrier mounting part 12b1. The carrier placement parts 12a1 and 12b1 are arranged so as to line up in the width direction Y. The carrier placement part 12b1 is disposed on the left side of the carrier placement part 12a1.
參照圖3~7。圖7係表示傳載機部11之內部之構成之前視圖。傳載機部11具備主搬送空間13。主搬送空間13配置於載具載置部12a1、12b1之後方。主搬送空間13具有大致箱形狀。主搬送空間13於俯視、側視及前視下為大致矩形。
Refer to Figure 3~7. FIG. 7 is a front view showing the internal configuration of the carrier unit 11. As shown in FIG. The conveyor unit 11 includes a main conveyance space 13 . The main conveyance space 13 is arrange|positioned behind the carrier mounting part 12a1, 12b1. The main transfer space 13 has a substantially box shape. The main transfer space 13 is substantially rectangular in plan view, side view and front view.
傳載機部11具備框架14。框架14作為主搬送空間13之構架(骨架)而設置。框架14劃定主搬送空間13之形狀。框架14例如為金屬製。
The carrier unit 11 includes a frame 14 . The frame 14 is provided as a framework (skeleton) of the main transfer space 13 . The frame 14 defines the shape of the main transfer space 13 . The frame 14 is made of metal, for example.
主搬送機構17設置於主搬送空間13。主搬送機構17被支持於框架14。主搬送機構17於載置於載具載置部12a1、12b1之載具C與第1搬送機構27之間搬送基板W。
The main transport mechanism 17 is installed in the main transport space 13 . The main transport mechanism 17 is supported by the frame 14 . The main conveyance mechanism 17 conveys the board|substrate W between the carrier C mounted on the carrier mounting part 12a1, 12b1, and the 1st conveyance mechanism 27. As shown in FIG.
主搬送機構17具備2個搬送機構18a、18b。各搬送機構18a、18b搬送基板W。搬送機構18b配置於與搬送機構18a大致相同之高度位置。搬送
機構18a、18b以於寬度方向Y上排列之方式配置。搬送機構18b配置於搬送機構18a之左方。
The main conveyance mechanism 17 is equipped with two conveyance mechanisms 18a and 18b. Each conveyance mechanism 18a, 18b conveys the board|substrate W. The conveyance mechanism 18b is arrange|positioned at the height position substantially the same as the conveyance mechanism 18a. transport
Mechanisms 18a, 18b are arranged so as to line up in the width direction Y. The transport mechanism 18b is arranged on the left side of the transport mechanism 18a.
搬送機構18a配置於與載具載置部12a1大致相同之高度位置。即，搬送機構18a與載具載置部12a1以於水平方向上排列之方式配置。搬送機構18a可移動至載具載置部12a1之高度位置。搬送機構18a配置於載具載置部12a1之後方。搬送機構18a於載置於載具載置部12a1之載具C與第1搬送機構27之間搬送基板W。搬送機構18b配置於與載具載置部12b1大致相同之高度位置。搬送機構18b配置於載具載置部12b1之後方。搬送機構18b於載置於載具載置部12b1之載具C與第1搬送機構27之間搬送基板W。搬送機構18b可與搬送機構18a獨立地搬送基板W。
The conveyance mechanism 18a is arrange|positioned at the height position substantially the same as the carrier mounting part 12a1. That is, the conveyance mechanism 18a and the carrier mounting part 12a1 are arrange|positioned so that they may line up in a horizontal direction. The conveying mechanism 18a can move to the height position of the carrier placement part 12a1. The conveyance mechanism 18a is arrange|positioned behind the carrier mounting part 12a1. The conveyance mechanism 18a conveys the board|substrate W between the carrier C mounted on the carrier mounting part 12a1, and the 1st conveyance mechanism 27. As shown in FIG. The conveyance mechanism 18b is arrange|positioned at the height position substantially the same as the carrier mounting part 12b1. The conveyance mechanism 18b is arrange|positioned behind the carrier mounting part 12b1. The conveyance mechanism 18b conveys the board|substrate W between the carrier C mounted on the carrier mounting part 12b1, and the 1st conveyance mechanism 27. As shown in FIG. The transport mechanism 18b can transport the substrate W independently of the transport mechanism 18a.
搬送機構18a具備支柱19a、垂直移動部19b、旋轉部19c、及保持部19d、19e。支柱19a被支持於框架14。支柱19a固定於框架14。支柱19a無法相對於框架14移動。支柱19a於大致上下方向Z上延伸。垂直移動部19b被支持於支柱19a。垂直移動部19b可相對於支柱19a於大致上下方向Z上移動。垂直移動部19b無法相對於支柱19a於大致水平方向上移動。旋轉部19c被支持於垂直移動部19b。旋轉部19c可相對於垂直移動部19b繞旋轉軸線A19c旋轉。旋轉軸線A19c係與大致上下方向Z平行之假想線。保持部19d、19e被支持於旋轉部19c。保持部19d、19e可相對於旋轉部19c進退移動。更具體而言，保持部19d、19e可於由旋轉部19c之朝向決定之水平之一方向上往復移動。水平之一方向例如為旋轉軸線A19c之徑向。保持部19d、19e可相互獨立地進退移動。保持部19d、19e分別於俯視下
具有大致U字形狀或大致Y字形狀。保持部19d、19e分別以水平姿勢保持1片基板W。
The conveyance mechanism 18a is equipped with the support|pillar 19a, the vertical movement part 19b, the rotation part 19c, and holding part 19d, 19e. The pillar 19a is supported by the frame 14 . The pillar 19a is fixed to the frame 14 . The strut 19a cannot move relative to the frame 14 . The pillar 19a extends in the substantially up-down direction Z. As shown in FIG. The vertical movement part 19b is supported by the support|pillar 19a. The vertical movement part 19b is movable in the substantially vertical direction Z with respect to the pillar 19a. The vertical movement part 19b cannot move substantially horizontally with respect to the support|pillar 19a. The rotation part 19c is supported by the vertical movement part 19b. The rotation part 19c is rotatable about the rotation axis A19c with respect to the vertical movement part 19b. The rotation axis A19c is an imaginary line substantially parallel to the vertical direction Z. The holding parts 19d and 19e are supported by the rotating part 19c. The holding parts 19d and 19e are movable forward and backward relative to the rotating part 19c. More specifically, the holding parts 19d and 19e can reciprocate in one of the horizontal directions determined by the orientation of the rotating part 19c. One horizontal direction is, for example, the radial direction of the rotation axis A19c. The holding parts 19d and 19e are movable forward and backward independently of each other. Holders 19d, 19e are respectively viewed from above
It has a substantially U-shape or a substantially Y-shape. The holding parts 19d and 19e each hold one substrate W in a horizontal posture.
如此，保持部19d、19e可於上下方向Z上平行移動。保持部19d、19e可繞旋轉軸線A19c旋轉。保持部19d、19e可相對於旋轉部19c進退移動。
In this way, the holding parts 19d and 19e can move in parallel in the up-down direction Z. As shown in FIG. The holding parts 19d, 19e are rotatable about the rotation axis A19c. The holding parts 19d and 19e are movable forward and backward relative to the rotating part 19c.
搬送機構18b與搬送機構18a左右對稱，除該點以外具有大致相同之構造及形狀。即，搬送機構18b具備支柱19a、垂直移動部19b、旋轉部19c及保持部19d、19e。
The conveyance mechanism 18b is bilaterally symmetrical to the conveyance mechanism 18a, and has substantially the same structure and shape except for this point. That is, the conveyance mechanism 18b is equipped with the support|pillar 19a, the vertical movement part 19b, the rotation part 19c, and holding part 19d, 19e.
如此，於本說明書中，於不同元件具有相同構造之情形時，藉由對其構造標註共通之符號而省略詳細之說明。
In this way, in this specification, when different elements have the same structure, the detailed description is omitted by attaching a common symbol to the structure.
<第1區塊21>
<1st block 21>
參照圖3~6、8。圖8係第1區塊21之前視圖。第1區塊21具有大致箱形狀。第1區塊21於俯視、側視及前視下為大致矩形。
Refer to Figures 3~6,8. FIG. 8 is a front view of the first block 21 . The first block 21 has a substantially box shape. The first block 21 is substantially rectangular in plan view, side view and front view.
第1區塊21具有框架22。框架22作為第1區塊21之構架(骨架)而設置。框架22劃定第1區塊21之形狀。框架22例如為金屬製。框架22支持第1處理部31、第1搬送機構27及迂迴搬送機構41。
The first block 21 has a frame 22 . The frame 22 is provided as a framework (skeleton) of the first block 21 . The frame 22 defines the shape of the first block 21 . The frame 22 is made of metal, for example. The frame 22 supports the first processing unit 31 , the first transport mechanism 27 , and the detour transport mechanism 41 .
基板處理裝置具備第1搬送空間23。第1搬送空間23形成於第1區塊
21。第1搬送空間23形成於寬度方向Y上之第1區塊21之中央部。第1搬送空間23於前後方向X上自第1區塊21之前部延伸至第1區塊21之後部。第1搬送空間23配置於與傳載機部11之主搬送空間13大致相同之高度位置。第1搬送空間23與主搬送空間13相接。第1搬送空間23配置於搬送機構18a之左方且後方。第1搬送空間23配置於搬送機構18b之右方且後方。
The substrate processing apparatus includes a first transfer space 23 . The first transfer space 23 is formed in the first block
twenty one. The 1st conveyance space 23 is formed in the center part of the 1st block 21 in the width direction Y. The first transfer space 23 extends from the front of the first block 21 to the rear of the first block 21 in the front-rear direction X. The first conveying space 23 is disposed at substantially the same height as the main conveying space 13 of the carrier unit 11 . The first conveyance space 23 is in contact with the main conveyance space 13 . The 1st conveyance space 23 is arrange|positioned at the left and rear of the conveyance mechanism 18a. The 1st conveyance space 23 is arrange|positioned at the right side and rear of the conveyance mechanism 18b.
基板處理裝置1具備供氣單元24及排氣單元25。供氣單元24配置於第1搬送空間23之上方。供氣單元24於俯視下具有與第1搬送空間23大致相同之寬度。供氣單元24向第1搬送空間23供給氣體。氣體例如為潔淨之空氣。供氣單元24具有供氣口(未圖示)。供氣口形成於供氣單元24之下表面。供氣口向供氣口之下方吹出氣體。藉此，供氣單元24向第1搬送空間23吹出氣體。排氣單元25配置於第1搬送空間23之下方。排氣單元25於俯視下具有與第1搬送空間23大致相同之寬度。排氣單元25排出第1搬送空間23之氣體。排氣單元25具有排氣口(未圖示)。排氣口形成於排氣單元25之上表面。排氣口將排氣口上方之氣體吸入。藉此，排氣單元25將第1搬送空間23之氣體排出至第1搬送空間23之外部。供氣單元24及排氣單元25於第1搬送空間23中形成向下之氣體流動(降流)。藉此，第1搬送空間23之氣體維持潔淨。
The substrate processing apparatus 1 includes an air supply unit 24 and an exhaust unit 25 . The air supply unit 24 is arranged above the first transfer space 23 . The air supply unit 24 has substantially the same width as the first transfer space 23 in plan view. The gas supply unit 24 supplies gas to the first transfer space 23 . The gas is, for example, clean air. The air supply unit 24 has an air supply port (not shown). The air supply port is formed on the lower surface of the air supply unit 24 . The gas supply port blows out gas to the bottom of the gas supply port. Thereby, the gas supply unit 24 blows the gas into the first transfer space 23 . The exhaust unit 25 is arranged below the first transfer space 23 . The exhaust unit 25 has substantially the same width as the first transfer space 23 in plan view. The exhaust unit 25 exhausts the gas in the first transfer space 23 . The exhaust unit 25 has an exhaust port (not shown). The exhaust port is formed on the upper surface of the exhaust unit 25 . The exhaust port sucks the gas above the exhaust port. Thereby, the exhaust unit 25 exhausts the gas in the first conveyance space 23 to the outside of the first conveyance space 23 . The air supply unit 24 and the exhaust unit 25 form a downward gas flow (downflow) in the first transfer space 23 . Thereby, the gas of the 1st transfer space 23 is kept clean.
第1搬送空間23配置於與第1處理部31大致相同之高度位置。第1搬送空間23鄰接於第1處理部31。
The first transfer space 23 is arranged at substantially the same height as the first processing unit 31 . The first transfer space 23 is adjacent to the first processing unit 31 .
第1處理部31具備第1非液體處理部32及第1液體處理部35。第1非液
體處理部32對基板W進行非液體處理。非液體處理係不向基板W供給處理液而對基板W進行之處理或檢查。於本實施形態中，第1非液體處理部32對基板W進行熱處理。第1液體處理部35對基板W進行液體處理。液體處理係將處理液供給至基板W之處理。
The first processing unit 31 includes a first non-liquid processing unit 32 and a first liquid processing unit 35 . 1st non-liquid
The bulk processing unit 32 performs non-liquid processing on the substrate W. The non-liquid processing refers to processing or inspection performed on the substrate W without supplying a processing liquid to the substrate W. In the present embodiment, the first non-liquid processing unit 32 heat-processes the substrate W. As shown in FIG. The first liquid processing unit 35 performs liquid processing on the substrate W. The liquid processing is a process of supplying a processing liquid to the substrate W. As shown in FIG.
第1液體處理部35配置於與第1非液體處理部32大致相同之高度位置。第1非液體處理部32及第1液體處理部35配置於與第1搬送空間23大致相同之高度位置。第1搬送空間23於俯視下配置於第1非液體處理部32與第1液體處理部35之間。第1非液體處理部32、第1搬送空間23及第1液體處理部35以於寬度方向Y上排列之方式配置。更詳細而言，第1非液體處理部32、第1搬送空間23及第1液體處理部35以於寬度方向Y上排列成1行之方式配置。第1非液體處理部32、第1搬送空間23及第1液體處理部35以於俯視下依序排列之方式配置。第1非液體處理部32配置於第1搬送空間23之第1側方(例如右方)。第1液體處理部35配置於第1搬送空間23之第2側方(例如左方)。
The first liquid processing unit 35 is arranged at substantially the same height as the first non-liquid processing unit 32 . The first non-liquid processing unit 32 and the first liquid processing unit 35 are arranged at substantially the same height as the first transfer space 23 . The first transfer space 23 is arranged between the first non-liquid processing unit 32 and the first liquid processing unit 35 in plan view. The first non-liquid processing unit 32 , the first transfer space 23 , and the first liquid processing unit 35 are arranged so as to line up in the width direction Y. More specifically, the first non-liquid processing unit 32 , the first transfer space 23 , and the first liquid processing unit 35 are arranged in a row in the width direction Y. As shown in FIG. The first non-liquid processing unit 32, the first transfer space 23, and the first liquid processing unit 35 are arranged in order in plan view. The first non-liquid processing unit 32 is arranged on the first side (for example, right side) of the first transfer space 23 . The first liquid processing unit 35 is disposed on the second side (for example, left side) of the first transfer space 23 .
第1非液體處理部32鄰接於第1搬送空間23。第1液體處理部35鄰接於第1搬送空間23。
The first non-liquid processing unit 32 is adjacent to the first transfer space 23 . The first liquid processing unit 35 is adjacent to the first transfer space 23 .
參照圖8。第1搬送空間23具有第1側部23a及第2側部23b。第1側部23a例如為第1搬送空間23之右側部。第2側部23b例如為第1搬送空間23之左側部。第1非液體處理部32與第1搬送空間23之第1側部23a相接。第1液體處理部35與第1搬送空間23之第2側部23b相接。
Refer to Figure 8. The 1st conveyance space 23 has the 1st side part 23a and the 2nd side part 23b. The 1st side part 23a is the right side part of the 1st conveyance space 23, for example. The 2nd side part 23b is the left side part of the 1st conveyance space 23, for example. The first non-liquid processing unit 32 is in contact with the first side portion 23 a of the first transfer space 23 . The first liquid processing unit 35 is in contact with the second side portion 23 b of the first transfer space 23 .
圖8示出上下方向Z上之第1搬送空間23之長度L23。圖8示出上下方向Z上之第1非液體處理部32之長度L32。圖8示出上下方向Z上之第1液體處理部35之長度L35。長度L32小於長度L23。長度L32小於長度L35。長度L23與長度L35大致相等。
FIG. 8 shows the length L23 of the first transfer space 23 in the vertical direction Z. As shown in FIG. FIG. 8 shows the length L32 of the first non-liquid processing portion 32 in the vertical direction Z. As shown in FIG. FIG. 8 shows the length L35 of the first liquid processing unit 35 in the vertical direction Z. As shown in FIG. The length L32 is smaller than the length L23. The length L32 is smaller than the length L35. The length L23 is substantially equal to the length L35.
第1搬送空間23具有下端23c。第1搬送空間23之下端23c例如由排氣單元25之上表面規定。第1非液體處理部32具有下端32a。第1液體處理部35具有下端35a。下端32a高於下端23c。即，第1非液體處理部32配置於高於第1搬送空間23之下端23c之高度位置。下端32a高於下端35a。即，第1非液體處理部32配置於高於第1液體處理部35之下端35a之高度位置。下端23c之高度位置與下端35a大致相同。
The first conveyance space 23 has a lower end 23c. The lower end 23c of the first transfer space 23 is defined by, for example, the upper surface of the exhaust unit 25 . The first non-liquid processing part 32 has a lower end 32a. The first liquid processing unit 35 has a lower end 35a. The lower end 32a is higher than the lower end 23c. That is, the first non-liquid processing unit 32 is disposed at a height higher than the lower end 23 c of the first transfer space 23 . The lower end 32a is higher than the lower end 35a. That is, the first non-liquid processing unit 32 is disposed at a height higher than the lower end 35 a of the first liquid processing unit 35 . The height position of the lower end 23c is substantially the same as that of the lower end 35a.
基板處理裝置1具有第1非液體處理部32之下方之空間40。空間40與第1搬送空間23之第1側部23a相接。空間40與第1搬送空間23連續。換言之，空間40與第1搬送空間23連接。
The substrate processing apparatus 1 has a space 40 below the first non-liquid processing unit 32 . The space 40 is in contact with the first side portion 23 a of the first conveyance space 23 . The space 40 is continuous with the first transfer space 23 . In other words, the space 40 is connected to the first transfer space 23 .
第1搬送空間23具有底部23d。底部23d係第1搬送空間23之一部分。底部23d位於與第1非液體處理部32之下端32a同等或低於該下端32a之高度位置。底部23d及空間40以於寬度方向Y上排列之方式配置。底部23d與空間40相接。底部23d與空間40於寬度方向Y上連續。換言之，底部23d與空間40於寬度方向Y上連接。
The first transfer space 23 has a bottom 23d. The bottom 23d is a part of the first transfer space 23 . The bottom portion 23d is located at a height equal to or lower than the lower end 32a of the first non-liquid processing portion 32 . The bottom 23d and the space 40 are arranged so as to line up in the width direction Y. The bottom 23d is in contact with the space 40 . The bottom 23d is continuous with the space 40 in the width direction Y. In other words, the bottom 23d and the space 40 are connected in the width direction Y.
第1搬送機構27設置於第1搬送空間23。第1搬送機構27配置於與第1處理部31大致相同之高度位置。即，第1搬送機構27與第1處理部31以於水平方向上排列之方式配置。第1搬送機構27可移動至第1處理部31之高度位置。第1搬送機構27配置於與第1非液體處理部32大致相同之高度位置。第1搬送機構27配置於與第1液體處理部35大致相同之高度位置。
The first conveyance mechanism 27 is installed in the first conveyance space 23 . The first transport mechanism 27 is arranged at substantially the same height as the first processing unit 31 . That is, the 1st conveyance mechanism 27 and the 1st processing part 31 are arrange|positioned so that they may line up in a horizontal direction. The first transport mechanism 27 can move to the height position of the first processing unit 31 . The first transport mechanism 27 is arranged at substantially the same height as the first non-liquid processing unit 32 . The first transport mechanism 27 is arranged at substantially the same height as the first liquid processing unit 35 .
參照圖3、8。第1搬送機構27具備第1支持部28。第1支持部28固定地設置。第1支持部28配置於第1搬送空間23之第2側部23b。
Refer to Figures 3 and 8. The first transport mechanism 27 includes a first support portion 28 . The first support portion 28 is fixedly provided. The 1st support part 28 is arrange|positioned in the 2nd side part 23b of the 1st conveyance space 23. As shown in FIG.
參照圖3、5。第1支持部28具備支柱28a、28b。支柱28a、28b被支持於框架22。支柱28a、28b固定於框架22。支柱28a、28b無法相對於框架22移動。支柱28b配置於與支柱28a大致相同之高度位置。支柱28a、28b以於大致前後方向X上排列之方式配置。支柱28b配置於支柱28a之後方。支柱28a配置於第1搬送空間23之第2側部23b之前部。支柱28b配置於第1搬送空間23之第2側部23b之後部。支柱28a、28b於上下方向Z上延伸。
Refer to Figures 3 and 5. The 1st support part 28 is provided with support|pillar 28a, 28b. The pillars 28a, 28b are supported by the frame 22 . The pillars 28a, 28b are fixed to the frame 22 . The struts 28a, 28b cannot move relative to the frame 22 . The pillar 28b is arranged at substantially the same height as the pillar 28a. The pillars 28a and 28b are arranged so as to be aligned in the substantially front-back direction X. As shown in FIG. The pillar 28b is disposed behind the pillar 28a. The support column 28a is arranged in the front part of the second side part 23b of the first conveyance space 23 . The pillar 28b is arranged at the rear of the second side portion 23b of the first transfer space 23 . The pillars 28a, 28b extend in the vertical direction Z. As shown in FIG.
參照圖3、5、8。第1搬送機構27具備第1可動部29。第1可動部29設置為可移動。第1可動部29被支持於第1支持部28。第1可動部29可相對於第1支持部28移動。第1可動部29保持基板W。第1可動部29進入第1處理部31。於第1可動部29進入第1處理部31時，第1可動部29不移動至第1搬送空間23之底部23d。即，第1可動部29不移動至第1搬送空間23之底部23d，而第1可動部29進入第1處理部31。
Refer to Figures 3, 5, and 8. The first transport mechanism 27 includes a first movable portion 29 . The first movable part 29 is provided movably. The first movable part 29 is supported by the first support part 28 . The first movable part 29 is movable relative to the first support part 28 . The first movable portion 29 holds the substrate W. The first movable part 29 enters the first processing part 31 . When the first movable part 29 enters the first processing part 31 , the first movable part 29 does not move to the bottom 23 d of the first transfer space 23 . That is, the first movable part 29 enters the first processing part 31 without moving to the bottom part 23 d of the first transfer space 23 .
第1可動部29具備垂直移動部29a、水平移動部29b、旋轉部29c及保持部29d、29e。垂直移動部29a被支持於支柱28a、28b。垂直移動部29a可相對於支柱28a、28b於大致上下方向Z上移動。垂直移動部29a於大致前後方向X上延伸。水平移動部29b被支持於垂直移動部29a。水平移動部29b可相對於垂直移動部29a於大致前後方向X上移動。旋轉部29c被支持於水平移動部29b。旋轉部29c可相對於水平移動部29b繞旋轉軸線A29c旋轉。旋轉軸線A29c係與大致上下方向Z平行之假想線。保持部29d、29e被支持於旋轉部29c。保持部29d、29e可相對於旋轉部29c進退移動。更具體而言，保持部29d、29e可於由旋轉部29c之朝向決定之水平之一方向上往復移動。水平之一方向例如為旋轉軸線A29c之徑向。保持部29d、29e可相互獨立地進退移動。保持部29d、29e分別於俯視下具有大致U字形狀或大致Y字形狀。保持部29d、29e分別以水平姿勢保持1片基板W。
The first movable part 29 includes a vertical movement part 29a, a horizontal movement part 29b, a rotation part 29c, and holding parts 29d and 29e. The vertical movement part 29a is supported by the support|pillar 28a, 28b. The vertical movement part 29a is movable in the substantially vertical direction Z with respect to the support columns 28a and 28b. The vertical movement part 29a extends substantially in the front-back direction X. As shown in FIG. The horizontal movement part 29b is supported by the vertical movement part 29a. The horizontal movement part 29b is movable substantially in the front-back direction X with respect to the vertical movement part 29a. The rotation part 29c is supported by the horizontal movement part 29b. The rotation part 29c is rotatable about the rotation axis A29c with respect to the horizontal movement part 29b. The rotation axis A29c is an imaginary line substantially parallel to the vertical direction Z. The holding parts 29d and 29e are supported by the rotating part 29c. The holding parts 29d and 29e are movable forward and backward relative to the rotating part 29c. More specifically, the holding parts 29d and 29e can reciprocate in one of the horizontal directions determined by the orientation of the rotating part 29c. One horizontal direction is, for example, the radial direction of the rotation axis A29c. The holding parts 29d and 29e are movable forward and backward independently of each other. The holding parts 29d and 29e each have a substantially U-shape or a substantially Y-shape in plan view. The holding parts 29d and 29e each hold one substrate W in a horizontal posture.
如此，保持部29d、29e可於前後方向X及上下方向Z上平行移動。保持部29d、29e可繞旋轉軸線A29c旋轉。保持部29d、29e可相對於旋轉部29c進退移動。
In this way, the holding parts 29d and 29e can move in parallel in the front-back direction X and the up-down direction Z. The holding parts 29d, 29e are rotatable about the rotation axis A29c. The holding parts 29d and 29e are movable forward and backward relative to the rotating part 29c.
參照圖3、4。第1非液體處理部32具備複數個(例如16個)第1熱處理單元33。各第1熱處理單元33對1片基板W進行熱處理。第1熱處理單元33不向基板W供給處理液。由第1熱處理單元33進行之處理為非液體處理。第1熱處理單元33相當於非液體處理單元。第1熱處理單元33之數量相當於第1處理部31所包含之非液體處理單元之數量。
Refer to Figures 3 and 4. The first non-liquid processing unit 32 includes a plurality of (for example, 16) first heat processing units 33 . Each first heat treatment unit 33 heat-processes one substrate W. The first thermal processing unit 33 does not supply the processing liquid to the substrate W. The treatment performed by the first heat treatment unit 33 is non-liquid treatment. The first heat treatment unit 33 corresponds to a non-liquid treatment unit. The number of first heat treatment units 33 is equivalent to the number of non-liquid treatment units included in the first treatment unit 31 .
參照圖4。8個第1熱處理單元33為加熱單元HP。加熱單元HP對1片基板W進行加熱處理。剩餘8個第1熱處理單元33為冷卻單元CP。冷卻單元CP對1片基板W進行冷卻處理。
Referring to FIG. 4 , the eight first heat treatment units 33 are heating units HP. The heating unit HP heat-processes one substrate W. The remaining eight first heat treatment units 33 are cooling units CP. The cooling unit CP cools one substrate W.
各第1熱處理單元33與第1搬送空間23相接。複數個第1熱處理單元33於側視下配置為矩陣狀。例如，複數個第1熱處理單元33於前後方向X上以4行配置，且於上下方向Z上以4段配置。
Each first heat treatment unit 33 is in contact with the first transfer space 23 . The plurality of first heat treatment units 33 are arranged in a matrix form in a side view. For example, the plurality of first thermal processing units 33 are arranged in four rows in the front-back direction X, and are arranged in four stages in the up-down direction Z.
參照圖3、8。對第1熱處理單元之基本構造進行說明。第1熱處理單元33具備第1板34a。第1板34a具有大致圓盤形狀。將1片基板W載置於第1板34a。
Refer to Figures 3 and 8. The basic structure of the first heat treatment unit will be described. The first heat treatment unit 33 includes a first plate 34a. The first plate 34a has a substantially disc shape. One substrate W is placed on the first plate 34a.
第1熱處理單元33具備第2板34b。第2板34b設置於與第1板34a大致相同之高度位置。第1板34a及第2板34b以於大致寬度方向Y上排列之方式配置。第2板34b配置於第1板34a之右方。第2板34b具有大致圓盤形狀。將1片基板W載置於第2板34b。
The first heat treatment unit 33 includes a second plate 34b. The second plate 34b is provided at substantially the same height position as the first plate 34a. The 1st plate 34a and the 2nd plate 34b are arrange|positioned so that they may line up substantially in the width direction Y. The second plate 34b is arranged on the right side of the first plate 34a. The second plate 34b has a substantially disk shape. One substrate W is placed on the second plate 34b.
第1熱處理單元33具備未圖示之局部搬送機構。局部搬送機構於第1板34a與第2板34b之間搬送基板W。
The 1st heat processing unit 33 is equipped with the partial conveyance mechanism which is not shown in figure. The local transport mechanism transports the substrate W between the first plate 34a and the second plate 34b.
第1熱處理單元33具備第1調溫部(未圖示)。第1調溫部安裝於第1板34a及局部搬送機構之至少任一者。第1調溫部將基板W調整為特定溫度。
第1調溫部例如為熱交換器。
The first heat treatment unit 33 includes a first temperature adjustment unit (not shown). The 1st temperature adjustment part is attached to at least any one of the 1st plate 34a and a local conveyance mechanism. The first temperature adjustment unit adjusts the substrate W to a specific temperature.
The first temperature adjustment unit is, for example, a heat exchanger.
第1熱處理單元33具備第2調溫部(未圖示)。第2調溫部安裝於第2板34b。第2調溫部調整第2板34b上之基板W之溫度。第2調溫部將第2板34b上之基板W調整為特定溫度。由第2調溫部調整之基板W之溫度高於由第1調溫部調整之基板W之溫度。第2調溫部例如為加熱器。
The first heat treatment unit 33 includes a second temperature adjustment unit (not shown). The second temperature adjustment unit is attached to the second plate 34b. The second temperature adjustment unit adjusts the temperature of the substrate W on the second plate 34b. The second temperature adjustment unit adjusts the substrate W on the second plate 34b to a specific temperature. The temperature of the substrate W adjusted by the second temperature adjustment unit is higher than the temperature of the substrate W adjusted by the first temperature adjustment unit. The second temperature adjustment unit is, for example, a heater.
第1熱處理單元33之構造亦可於加熱單元HP與冷卻單元CP之間不同。例如，冷卻單元CP亦可不具備第2板34b、局部搬送機構及第2調溫部。
The structure of the 1st heat processing unit 33 may differ between heating unit HP and cooling unit CP. For example, the cooling unit CP does not need to be equipped with the 2nd plate 34b, a local conveyance mechanism, and a 2nd temperature adjustment part.
參照圖3、6。第1液體處理部35具備複數個(例如6個)第1液體處理單元36。各第1液體處理單元36對1片基板W進行液體處理。
Refer to Figures 3 and 6. The first liquid processing unit 35 includes a plurality of (for example, six) first liquid processing units 36 . Each first liquid processing unit 36 performs liquid processing on one substrate W.
第1液體處理單元36例如為塗佈處理單元。由第1液體處理單元36進行之液體處理例如為將塗膜材料塗佈於基板W之塗佈處理。塗膜材料係處理液之一例。第1液體處理單元36塗佈於基板W之塗膜材料根據基板處理裝置1之動作適當地選擇。塗膜例如為下層膜、中間層膜及上層膜之任一者。塗膜例如為抗反射膜、SOG(Spin on Glass，旋塗玻璃)膜、抗蝕膜及保護膜之任一者。各第1液體處理單元36亦可使用相同種類之塗膜材料。
The first liquid processing unit 36 is, for example, a coating processing unit. The liquid processing performed by the first liquid processing unit 36 is, for example, a coating process of coating the substrate W with a coating film material. The coating film material is an example of the treatment liquid. The material of the coating film applied to the substrate W by the first liquid processing unit 36 is appropriately selected according to the operation of the substrate processing apparatus 1 . The coating film is, for example, any one of a lower layer film, an intermediate layer film, and an upper layer film. The coating film is, for example, any of an antireflection film, an SOG (Spin on Glass, spin-on-glass) film, a resist film, and a protective film. Each of the first liquid processing units 36 can also use the same type of coating material.
各第1液體處理單元36與第1搬送空間23相接。複數個第1液體處理單元36於側視下配置為矩陣狀。例如，複數個第1液體處理單元36於前後方
向X上以3行配置，且於上下方向Z上以2段配置。
Each first liquid processing unit 36 is in contact with the first transfer space 23 . The plurality of first liquid processing units 36 are arranged in a matrix form in a side view. For example, a plurality of first liquid processing units 36 are located at the front and rear
Arranged in 3 rows in the X direction, and in 2 stages in the vertical direction Z.
參照圖3、8。第1液體處理單元36具備旋轉保持部37a、噴嘴37b及承杯37c。旋轉保持部37a以水平姿勢保持1片基板W。旋轉保持部37a可使旋轉保持部37a所保持之基板W繞旋轉軸線旋轉。旋轉軸線係通過基板W之中心且與上下方向Z大致平行之假想線。噴嘴37b向被旋轉保持部37a保持之基板W噴出處理液。噴嘴37b設置為可移動至處理位置及退避位置。處理位置係被旋轉保持部37a保持之基板W之上方之位置。於噴嘴37b位於處理位置時，噴嘴37b於俯視下與被旋轉保持部37a保持之基板W重疊。於噴嘴37b位於處理位置時，噴嘴37b向基板W噴出處理液。於噴嘴37b位於退避位置時，噴嘴37b於俯視下不與被旋轉保持部37a保持之基板W重疊。承杯37c配置於旋轉保持部37a之周圍。承杯37c回收處理液。
Refer to Figures 3 and 8. The first liquid processing unit 36 includes a rotation holder 37a, a nozzle 37b, and a cup 37c. The rotation holding unit 37a holds one substrate W in a horizontal posture. The rotation holder 37a can rotate the substrate W held by the rotation holder 37a around the rotation axis. The rotation axis is an imaginary line passing through the center of the substrate W and substantially parallel to the vertical direction Z. The nozzle 37b discharges the processing liquid toward the substrate W held by the rotation holding unit 37a. The nozzle 37b is provided so that it can move to a processing position and a retreat position. The processing position is a position above the substrate W held by the rotation holding unit 37a. When the nozzle 37b is located at the processing position, the nozzle 37b overlaps the substrate W held by the rotation holder 37a in plan view. When the nozzle 37b is located at the processing position, the nozzle 37b discharges the processing liquid toward the substrate W. As shown in FIG. When the nozzle 37b is located at the withdrawn position, the nozzle 37b does not overlap the substrate W held by the rotation holder 37a in plan view. The cup holder 37c is disposed around the rotation holding portion 37a. The receiving cup 37c recovers the treatment liquid.
參照圖8。基板處理裝置1具備複數個殼體38。1個殼體38收容配置於上段之3個第1液體處理單元36。另一個殼體38收容配置於下段之3個第1液體處理單元36。
Refer to Figure 8. The substrate processing apparatus 1 includes a plurality of casings 38. One casing 38 accommodates the three first liquid processing units 36 arranged in the upper stage. The other casing 38 accommodates and arranges the three first liquid processing units 36 in the lower stage.
基板處理裝置1具備可供基板W通過之複數個基板搬送口39。於基板W於第1搬送空間23與第1液體處理部35之間移動時，基板W通過基板搬送口39。基板搬送口39配置於第1搬送空間23與第1液體處理部35之間。基板搬送口39形成於殼體38。基板搬送口39形成於與第1搬送空間23(具體而言為第2側部23b)相接之殼體38之側部。基板搬送口39配置於高於第1非液體處理部32之下端32a之高度位置。
The substrate processing apparatus 1 includes a plurality of substrate transfer ports 39 through which the substrate W can pass. When the substrate W moves between the first transfer space 23 and the first liquid processing unit 35 , the substrate W passes through the substrate transfer port 39 . The substrate transfer port 39 is arranged between the first transfer space 23 and the first liquid processing unit 35 . The substrate transfer port 39 is formed in the casing 38 . The substrate transfer port 39 is formed on the side portion of the casing 38 that is in contact with the first transfer space 23 (specifically, the second side portion 23b). The substrate transfer port 39 is disposed at a height higher than the lower end 32 a of the first non-liquid processing unit 32 .
基板處理裝置1亦可進而具備將基板搬送口39開閉之構件(例如擋板)。將基板搬送口39開閉之構件可將殼體38之內部與第1搬送空間23阻斷。
The substrate processing apparatus 1 may further include a member (for example, a shutter) for opening and closing the substrate transfer port 39 . The member for opening and closing the substrate transfer port 39 can block the inside of the housing 38 from the first transfer space 23 .
第1搬送機構27將基板W搬送至第1熱處理單元33及第1液體處理單元36。具體而言，第1搬送機構27可將基板W載置於各第1熱處理單元33之第1板34a。第1搬送機構27可拿取各第1熱處理單元33之第1板34a上之基板W。第1搬送機構27可將基板W載置於各第1液體處理單元36之旋轉保持部37a。第1搬送機構27可拿取各第1液體處理單元36之旋轉保持部37a上之基板W。
The first transport mechanism 27 transports the substrate W to the first heat treatment unit 33 and the first liquid treatment unit 36 . Specifically, the first transport mechanism 27 can place the substrate W on the first plate 34 a of each first heat treatment unit 33 . The first transfer mechanism 27 can pick up the substrate W on the first plate 34 a of each first heat treatment unit 33 . The first transport mechanism 27 can place the substrate W on the rotation holding portion 37 a of each first liquid processing unit 36 . The first transport mechanism 27 can pick up the substrate W on the rotation holding portion 37 a of each first liquid processing unit 36 .
例如，第1搬送機構27將基板W依序搬送至冷卻單元CP、第1液體處理單元36及加熱單元HP。第1處理部31對基板W依序進行冷卻處理、塗佈處理及加熱處理。藉此，第1處理部31於基板W形成塗膜。將藉由第1處理部31形成於基板W之塗膜適當地稱為第1塗膜。
For example, the first transport mechanism 27 sequentially transports the substrate W to the cooling unit CP, the first liquid processing unit 36 , and the heating unit HP. The first processing unit 31 sequentially performs cooling processing, coating processing, and heating processing on the substrate W. Thereby, the first processing unit 31 forms a coating film on the substrate W. As shown in FIG. The coating film formed on the substrate W by the first processing unit 31 is appropriately referred to as a first coating film.
參照圖8。迂迴搬送機構41配置於與第1搬送空間23大致相同之高度位置。迂迴搬送機構41配置於與第1搬送空間23之下端23c同等或高於該下端23c之高度位置。
Refer to Figure 8. The detour transport mechanism 41 is arranged at substantially the same height position as the first transport space 23 . The detour transport mechanism 41 is disposed at a height equal to or higher than the lower end 23c of the first transport space 23 .
迂迴搬送機構41之至少一部分配置於第1搬送空間23。迂迴搬送機構41之至少一部分配置於第1搬送空間23之底部23d。
At least a part of the detour transport mechanism 41 is arranged in the first transport space 23 . At least a part of the detour conveyance mechanism 41 is arrange|positioned in the bottom part 23d of the 1st conveyance space 23. As shown in FIG.
迂迴搬送機構41於側視下與第1搬送空間23重疊。迂迴搬送機構41於側視下與第1搬送空間23之底部23d重疊。
The detour transport mechanism 41 overlaps the first transport space 23 in side view. The roundabout conveyance mechanism 41 overlaps with the bottom 23d of the 1st conveyance space 23 in side view.
被迂迴搬送機構41保持之基板W之至少一部分位於第1搬送空間23之內部。被迂迴搬送機構41保持之基板W全部位於第1搬送空間23。被迂迴搬送機構41保持之基板W全部位於第1搬送空間23之底部23d。
At least a part of the substrate W held by the detour transport mechanism 41 is located inside the first transport space 23 . All the substrates W held by the detour transport mechanism 41 are located in the first transport space 23 . All the substrates W held by the detour transport mechanism 41 are located at the bottom 23 d of the first transport space 23 .
迂迴搬送機構41及第1搬送機構27以於大致上下方向Z上排列之方式配置。迂迴搬送機構41配置於第1搬送機構27之下方。迂迴搬送機構41配置於第1搬送機構27之第1可動部29之下方。
The detour conveyance mechanism 41 and the first conveyance mechanism 27 are arranged so as to be aligned in the substantially up-down direction Z. The detour transport mechanism 41 is arranged below the first transport mechanism 27 . The detour transport mechanism 41 is disposed below the first movable portion 29 of the first transport mechanism 27 .
迂迴搬送機構41之至少一部分配置於第1非液體處理部32之下方之空間40。迂迴搬送機構41跨及空間40及第1搬送空間23而配置。迂迴搬送機構41跨及空間40及底部23d而配置。
At least a part of the detour transport mechanism 41 is disposed in the space 40 below the first non-liquid processing unit 32 . The detour transport mechanism 41 is arranged across the space 40 and the first transport space 23 . The roundabout conveyance mechanism 41 is arranged across the space 40 and the bottom 23d.
迂迴搬送機構41配置於與第1非液體處理部32之下端32a同等或低於該下端32a之高度位置。迂迴搬送機構41於側視下不與第1非液體處理部32重疊。
The detour transport mechanism 41 is disposed at a height equal to or lower than the lower end 32a of the first non-liquid processing unit 32 . The detour transport mechanism 41 does not overlap the first non-liquid processing unit 32 in side view.
迂迴搬送機構41配置於與第1液體處理部35大致相同之高度位置。迂迴搬送機構41配置於與第1液體處理部35之下端35a同等或高於該下端35a之高度位置。迂迴搬送機構41於側視下與第1液體處理部35重疊。即，迂
迴搬送機構41於側視下與第1處理部31重疊。迂迴搬送機構41配置於低於第1液體處理部35之基板搬送口39之高度位置。迂迴搬送機構41配置於第1液體處理部35之右方。
The detour transport mechanism 41 is arranged at substantially the same height position as the first liquid processing unit 35 . The roundabout transport mechanism 41 is arranged at a height equal to or higher than the lower end 35a of the first liquid processing unit 35 . The detour transport mechanism 41 overlaps the first liquid processing unit 35 in a side view. That is, roundabout
The return transport mechanism 41 overlaps the first processing unit 31 in a side view. The detour transport mechanism 41 is arranged at a height lower than the substrate transport port 39 of the first liquid processing unit 35 . The detour transport mechanism 41 is arranged on the right side of the first liquid processing unit 35 .
圖9係基板處理裝置1之俯視圖。圖9省略第1非液體處理部32之圖示。迂迴搬送機構41之至少一部分於俯視下配置於與第1非液體處理部32重疊之位置。迂迴搬送機構41之至少一部分於俯視下配置於與第1搬送空間23重疊之位置。迂迴搬送機構41於俯視下配置於不與第1液體處理部35重疊之位置。
FIG. 9 is a top view of the substrate processing apparatus 1 . FIG. 9 omits the illustration of the first non-liquid processing unit 32 . At least a part of the detour transport mechanism 41 is arranged at a position overlapping with the first non-liquid processing unit 32 in plan view. At least a part of the roundabout conveyance mechanism 41 is arrange|positioned at the position which overlaps with the 1st conveyance space 23 in planar view. The detour transport mechanism 41 is arranged at a position not overlapping the first liquid processing unit 35 in plan view.
參照圖8、9、圖10(a)、10(b)、10(c)。圖10(a)係迂迴搬送機構41之俯視圖。圖10(b)係迂迴搬送機構41之左側視圖。圖10(b)係迂迴搬送機構41之前視圖。
Referring to Fig. 8, 9, Fig. 10(a), 10(b), 10(c). FIG. 10( a ) is a top view of the roundabout conveying mechanism 41 . FIG. 10( b ) is a left side view of the roundabout conveying mechanism 41 . FIG. 10( b ) is a front view of the detour transport mechanism 41 .
迂迴搬送機構41具備迂迴支持部42。迂迴支持部42固定地設置。迂迴支持部42被支持於框架22。迂迴支持部42固定於框架22。迂迴支持部42無法相對於框架22移動。迂迴支持部42於俯視下配置於與第1非液體處理部32重疊之位置。迂迴支持部42於俯視下配置於不與第1搬送空間23重疊之位置。迂迴支持部42於大致前後方向X上延伸。迂迴支持部42例如為軌道。
The detour transport mechanism 41 includes a detour support unit 42 . The detour support portion 42 is fixedly provided. The detour support portion 42 is supported by the frame 22 . The detour support portion 42 is fixed to the frame 22 . The detour support portion 42 cannot move relative to the frame 22 . The detour supporting part 42 is arranged at a position overlapping with the first non-liquid processing part 32 in plan view. The detour support part 42 is arrange|positioned at the position which does not overlap with the 1st conveyance space 23 in planar view. The detour support portion 42 extends substantially in the front-back direction X. As shown in FIG. The detour support portion 42 is, for example, a rail.
迂迴搬送機構41具備迂迴可動部43。迂迴可動部43被支持於迂迴支持部42。迂迴可動部43可相對於迂迴支持部42移動。迂迴可動部43自迂
迴支持部42於大致水平方向上延伸。具體而言，迂迴可動部43自迂迴支持部42之側部朝向第1搬送空間23延伸。迂迴可動部43之至少一部分配置於第1搬送空間23之內部。迂迴可動部43保持基板W。
The detour transport mechanism 41 includes a detour movable portion 43 . The detour movable part 43 is supported by the detour support part 42 . The detour movable part 43 is movable relative to the detour support part 42 . The detour movable part 43 is self-detour
The back supporting portion 42 extends substantially horizontally. Specifically, the detour movable part 43 extends from the side part of the detour support part 42 toward the first conveyance space 23 . At least a part of the detour movable part 43 is arranged inside the first conveyance space 23 . The detour movable part 43 holds the substrate W. As shown in FIG.
迂迴可動部43具備第1迂迴可動部43a。第1迂迴可動部43a具備水平移動部44a。水平移動部44a被支持於迂迴支持部42。水平移動部44a連接於迂迴支持部42之側部。水平移動部44a可相對於迂迴支持部42於大致水平方向(具體而言為大致前後方向X)上移動。
The detour movable part 43 is provided with the 1st detour movable part 43a. The first detour movable part 43a includes a horizontal movement part 44a. The horizontal movement part 44a is supported by the detour support part 42 . The horizontal movement part 44a is connected to the side part of the detour support part 42 . The horizontal movement part 44a is movable in the substantially horizontal direction (specifically, substantially the front-back direction X) with respect to the detour support part 42 .
參照圖9。前後方向X上之迂迴支持部42之長度與前後方向X上之第1搬送機構27之垂直移動部29a之長度大致相同。供設置迂迴支持部42之前後方向X之範圍與供設置垂直移動部29a之前後方向X之範圍大致相同。
Refer to Figure 9. The length of the detour support portion 42 in the front-rear direction X is approximately the same as the length of the vertical movement portion 29a of the first transport mechanism 27 in the front-rear direction X. The range in the front-back direction X for installing the detour supporting portion 42 is substantially the same as the range in the front-back direction X for installing the vertical moving portion 29a.
水平移動部44a於前後方向X上可移動之距離與第1搬送機構27之水平移動部29b於前後方向X上可移動之距離大致相同。水平移動部44a於前後方向X上可移動之範圍與第1搬送機構27之水平移動部29b於前後方向X上可移動之範圍大致相同。
The distance that the horizontal movement part 44a can move in the front-back direction X is substantially the same as the distance that the horizontal movement part 29b of the first transport mechanism 27 can move in the front-back direction X. The movable range of the horizontal movement part 44a in the front-back direction X is substantially the same as the movable range of the horizontal movement part 29b of the first transport mechanism 27 in the front-back direction X.
參照圖8、9、圖10(a)~10(c)。第1迂迴可動部43a具備臂部44b。臂部44b被支持於水平移動部44a。臂部44b連接於水平移動部44a。臂部44b自水平移動部44a於大致水平方向上延伸。臂部44b可相對於水平移動部44a旋轉。具體而言，臂部44b可相對於水平移動部44a繞旋轉軸線A44b旋轉。旋轉軸線A44b係與上下方向Z大致平行之假想線。
Referring to Fig. 8, 9, Fig. 10(a) ~ 10(c). The first detour movable part 43a includes an arm part 44b. The arm part 44b is supported by the horizontal movement part 44a. The arm part 44b is connected to the horizontal movement part 44a. The arm part 44b extends substantially horizontally from the horizontal movement part 44a. The arm part 44b is rotatable with respect to the horizontal movement part 44a. Specifically, the arm portion 44b is rotatable about the rotation axis A44b relative to the horizontal movement portion 44a. The rotation axis A44b is an imaginary line substantially parallel to the vertical direction Z.
第1迂迴可動部43a具備保持部44c。保持部44c被支持於臂部44b。保持部44c連接於臂部44b。保持部44c固定於臂部44b。保持部44c經由臂部44b被水平移動部44a支持。保持部44c可相對於水平移動部44a旋轉。保持部44c可移動至較水平移動部44a更靠前方之位置及較水平移動部44a更靠後方之位置。保持部44c之至少一部分配置於第1搬送空間23之內部。保持部44c之至少一部分於俯視下配置於與第1搬送空間23重疊之位置。保持部44c於俯視下具有大致I字形狀。保持部44c保持基板W。保持部44c以水平姿勢保持1片基板W。被保持部44c保持之基板W之至少一部分位於第1搬送空間23之內部。
The first detour movable part 43a includes a holding part 44c. The holding part 44c is supported by the arm part 44b. The holding portion 44c is connected to the arm portion 44b. The holding part 44c is fixed to the arm part 44b. The holding part 44c is supported by the horizontal movement part 44a via the arm part 44b. The holding part 44c is rotatable relative to the horizontal moving part 44a. The holding part 44c is movable to a position further forward than the horizontal moving part 44a and to a position rearward than the horizontal moving part 44a. At least a part of the holding part 44c is arrange|positioned in the inside of the 1st conveyance space 23. As shown in FIG. At least a part of the holding part 44c is arrange|positioned at the position which overlaps with the 1st conveyance space 23 in planar view. The holding portion 44c has a substantially I-shape in plan view. The holding portion 44c holds the substrate W. As shown in FIG. The holding portion 44c holds one substrate W in a horizontal posture. At least a part of the substrate W held by the holding portion 44 c is located inside the first transfer space 23 .
參照圖10(a)~10(c)。保持部44c具備保持部本體45a及墊45b。保持部本體45a連接於臂部44b。保持部本體45a自臂部44b於大致水平方向延伸。墊45b連接於保持部本體45a。墊45b自保持部本體45a向上方突出。上下方向Z上之墊45b之長度較佳為大於上下方向Z上之保持部19d之長度。同樣地，上下方向Z上之墊45b之長度較佳為大於上下方向Z上之保持部19e之長度。墊45b與基板W接觸。具體而言，墊45b具有上表面。墊45b之上表面與基板W之背面接觸。
Referring to Figure 10(a)~10(c). The holding part 44c is provided with the holding part main body 45a and the pad 45b. The holding part body 45a is connected to the arm part 44b. The holding part body 45a extends substantially horizontally from the arm part 44b. The pad 45b is connected to the holder body 45a. The pad 45b protrudes upward from the holder main body 45a. The length of the pad 45b in the vertical direction Z is preferably greater than the length of the holding portion 19d in the vertical direction Z. Likewise, the length of the pad 45b in the vertical direction Z is preferably greater than the length of the holding portion 19e in the vertical direction Z. The pad 45b is in contact with the substrate W. As shown in FIG. Specifically, the pad 45b has an upper surface. The upper surface of the pad 45b is in contact with the back surface of the substrate W. As shown in FIG.
第1迂迴可動部43a進而具備臂部44d及保持部44e。臂部44d及保持部44e分別具有與臂部44b及保持部44c大致相同之形狀及構造。臂部44d配置於臂部44b之下方。臂部44d被水平移動部44a支持。臂部44d可相對於水平移動部44a繞旋轉軸線A44d旋轉。旋轉軸線A44d例如與旋轉軸線
A44b位於同軸上。臂部44d可與臂部44b獨立地旋轉。保持部44e固定於臂部44d。
The first detour movable part 43a further includes an arm part 44d and a holding part 44e. The arm part 44d and the holding part 44e have substantially the same shape and structure as the arm part 44b and the holding part 44c, respectively. The arm portion 44d is disposed below the arm portion 44b. The arm part 44d is supported by the horizontal movement part 44a. The arm portion 44d is rotatable about the rotation axis A44d relative to the horizontal movement portion 44a. The axis of rotation A44d is for example related to the axis of rotation
A44b is on the coaxial. The arm portion 44d is rotatable independently of the arm portion 44b. The holding part 44e is fixed to the arm part 44d.
如此，保持部44c、44e可分別於前後方向X平行移動。進而，保持部44c、44e可分別繞旋轉軸線A44b、A44d旋轉。但是，保持部44c、44e無法分別於寬度方向Y及上下方向Z平行移動。
In this way, the holding parts 44c and 44e can move in parallel in the front-back direction X, respectively. Furthermore, the holding parts 44c, 44e are rotatable around the rotation axes A44b, A44d, respectively. However, the holding parts 44c and 44e cannot move in parallel in the width direction Y and the vertical direction Z, respectively.
第1迂迴可動部43a進而具備簷部44f。於圖10(a)中，以虛線表示第1迂迴可動部43a之簷部44f。簷部44f被水平移動部44a支持。簷部44f固定於水平移動部44a。簷部44f配置於臂部44b、44d及保持部44c、44e之上方。簷部44f具有大致水平之板形狀。簷部44f於俯視下較基板W寬。簷部44f覆蓋被保持部44c、44e保持之基板W之上表面。簷部44f於俯視下與被保持部44c、44e保持之基板W重疊。
The first detour movable part 43a further includes a eaves part 44f. In FIG. 10(a), the eaves portion 44f of the first detour movable portion 43a is shown by a dotted line. The eaves portion 44f is supported by the horizontal movement portion 44a. The eaves portion 44f is fixed to the horizontal movement portion 44a. The eaves portion 44f is arranged above the arm portions 44b, 44d and the holding portions 44c, 44e. The eaves portion 44f has a substantially horizontal plate shape. The eaves portion 44f is wider than the base plate W in plan view. The eaves portion 44f covers the upper surface of the substrate W held by the holding portions 44c and 44e. The eaves portion 44f overlaps the substrate W held by the holding portions 44c and 44e in plan view.
迂迴可動部43具備第2迂迴可動部43b。第2迂迴可動部43b配置於低於第1迂迴可動部43a之高度位置。第2迂迴可動部43b具有與第1迂迴可動部43a大致相同之形狀及構造。第2迂迴可動部43b可與第1迂迴可動部43a獨立地移動。具體而言，第2迂迴可動部43b具備水平移動部44a、臂部44b、44d、保持部44c、44e及簷部44f。第2迂迴可動部43b之水平移動部44a不經由第1迂迴可動部43a而被迂迴支持部42支持。第2迂迴可動部43b之水平移動部44a可相對於迂迴支持部42於大致水平方向移動。第2迂迴可動部43b之水平移動部44a可與第1迂迴可動部43a之水平移動部44a獨立地移動。
The detour movable part 43 is provided with the 2nd detour movable part 43b. The 2nd detour movable part 43b is arrange|positioned at the height position lower than the 1st detour movable part 43a. The second detour movable part 43b has substantially the same shape and structure as the first detour movable part 43a. The second detour movable part 43b is movable independently of the first detour movable part 43a. Specifically, the second detour movable part 43b includes a horizontal movement part 44a, arm parts 44b, 44d, holding parts 44c, 44e, and a eaves part 44f. The horizontal movement part 44a of the second detour movable part 43b is supported by the detour support part 42 without passing through the first detour movable part 43a. The horizontal movement part 44a of the second detour movable part 43b can move in the substantially horizontal direction with respect to the detour support part 42 . The horizontal movement part 44a of the second detour movable part 43b can move independently of the horizontal movement part 44a of the first detour movable part 43a.
第1迂迴可動部43a之水平移動部44a係本發明之第1水平移動部之例。第1迂迴可動部43a之臂部44b、44d係本發明之第1臂部之例。第1迂迴可動部43a之保持部44c、44e係本發明之第1保持部之例。第2迂迴可動部43b之水平移動部44a係本發明之第2水平移動部之例。第2迂迴可動部43b之臂部44b、44d係本發明之第2臂部之例。第2迂迴可動部43b之保持部44c、44e係本發明之第2保持部之例。
The horizontal movement part 44a of the 1st detour movable part 43a is an example of the 1st horizontal movement part of this invention. The arm portions 44b and 44d of the first detour movable portion 43a are examples of the first arm portion of the present invention. The holding parts 44c and 44e of the first roundabout movable part 43a are examples of the first holding part of the present invention. The horizontal movement part 44a of the 2nd detour movable part 43b is an example of the 2nd horizontal movement part of this invention. The arm portions 44b, 44d of the second detour movable portion 43b are examples of the second arm portion of the present invention. The holding portions 44c and 44e of the second detour movable portion 43b are examples of the second holding portion of the present invention.
迂迴搬送機構41無法進入第1處理部31。迂迴搬送機構41無法將基板W搬送至第1處理部31。
The detour transport mechanism 41 cannot enter the first processing unit 31 . The detour transport mechanism 41 cannot transport the substrate W to the first processing unit 31 .
<第2區塊51>
<2nd Block 51>
參照圖3~6。第2區塊51不具備迂迴搬送機構41，於此點與第1區塊21不同。然而，第2區塊51具有與第1區塊21之構造類似之較多構造。
Refer to Figure 3~6. The second block 51 is different from the first block 21 in that it does not include the detour transport mechanism 41 . However, the second block 51 has many structures similar to those of the first block 21 .
第2區塊51具有大致箱形狀。第2區塊51於俯視及側視下為大致矩形。第2區塊51於前視下亦為大致矩形，雖然對此省略圖示。
The second block 51 has a substantially box shape. The second block 51 is substantially rectangular in plan view and side view. The second block 51 is also substantially rectangular in a front view, although illustration of this is omitted.
第2區塊51具有框架52。框架52作為第2區塊51之構架(骨架)而設置。框架52劃定第2區塊51之形狀。框架52例如為金屬製。框架52支持第2處理部61及第2搬送機構57。
The second block 51 has a frame 52 . The frame 52 is provided as the frame (skeleton) of the second block 51 . The frame 52 defines the shape of the second block 51 . The frame 52 is made of metal, for example. The frame 52 supports the second processing unit 61 and the second transport mechanism 57 .
基板處理裝置1具備第2搬送空間53。第2搬送空間53形成於第2區塊
51。第2搬送空間53形成於寬度方向Y上之第2區塊51之中央部。第2搬送空間53自第2區塊51之前部於前後方向X上延伸至第2區塊51之後部。第2搬送空間53配置於與第1區塊21之第1搬送空間23大致相同之高度位置。第1搬送空間23與第2搬送空間53以於前後方向X上排列之方式配置。第2搬送空間53配置於第1搬送空間23之後方。第2搬送空間53與第1搬送空間23相接。第2搬送空間53配置於第1搬送機構27及迂迴搬送機構41之後方。
The substrate processing apparatus 1 includes a second transfer space 53 . The second transfer space 53 is formed in the second block
51. The 2nd conveyance space 53 is formed in the center part of the 2nd block 51 in the width direction Y. The second transfer space 53 extends from the front of the second block 51 to the rear of the second block 51 in the front-rear direction X. The second transfer space 53 is arranged at substantially the same height as the first transfer space 23 of the first block 21 . The 1st conveyance space 23 and the 2nd conveyance space 53 are arrange|positioned so that they may line up in the front-back direction X. As shown in FIG. The second conveyance space 53 is disposed behind the first conveyance space 23 . The second conveyance space 53 is in contact with the first conveyance space 23 . The second conveyance space 53 is disposed behind the first conveyance mechanism 27 and the detour conveyance mechanism 41 .
參照圖5。基板處理裝置1具備供氣單元54及排氣單元55。供氣單元54配置於第2搬送空間53之上方。供氣單元54向第2搬送空間53供給氣體。排氣單元55配置於第2搬送空間53之下方。排氣單元55排出第2搬送空間53之氣體。供氣單元54及排氣單元55於第2搬送空間53中形成向下之氣體流動(降流)。藉此，第2搬送空間53之氣體維持潔淨。供氣單元54具有與供氣單元24大致相同之構造。排氣單元55具有與排氣單元25大致相同之構造。
Refer to Figure 5. The substrate processing apparatus 1 includes an air supply unit 54 and an exhaust unit 55 . The air supply unit 54 is arranged above the second transfer space 53 . The gas supply unit 54 supplies gas to the second transfer space 53 . The exhaust unit 55 is arranged below the second transfer space 53 . The exhaust unit 55 exhausts the gas in the second transfer space 53 . The air supply unit 54 and the exhaust unit 55 form a downward gas flow (downflow) in the second transfer space 53 . Thereby, the gas of the 2nd transfer space 53 is kept clean. The air supply unit 54 has substantially the same configuration as the air supply unit 24 . The exhaust unit 55 has substantially the same configuration as the exhaust unit 25 .
第2搬送機構57設置於第2搬送空間53。第2搬送機構57具有與第1搬送機構27大致相同之構造。因此，省略第2搬送機構57之構造之說明。
The second conveyance mechanism 57 is installed in the second conveyance space 53 . The second conveyance mechanism 57 has substantially the same structure as the first conveyance mechanism 27 . Therefore, the description of the structure of the second transport mechanism 57 is omitted.
參照圖3~6。第2處理部61配置於與第2搬送空間53大致相同之高度位置。第2處理部61鄰接於第2搬送空間53。
Refer to Figure 3~6. The second processing unit 61 is arranged at substantially the same height as the second transfer space 53 . The second processing unit 61 is adjacent to the second transfer space 53 .
第2處理部61具備第2非液體處理部62及第2液體處理部65。第2非液
體處理部62對基板W進行非液體處理。第2液體處理部65對基板W進行液體處理。第2非液體處理部62配置於第2搬送空間53之第1側方(例如右方)。第2液體處理部65配置於第2搬送空間53之第2側方(例如左方)。
The second processing unit 61 includes a second non-liquid processing unit 62 and a second liquid processing unit 65 . 2nd non-liquid
The bulk processing unit 62 performs non-liquid processing on the substrate W. The second liquid processing unit 65 performs liquid processing on the substrate W. The second non-liquid processing unit 62 is disposed on the first side (for example, right side) of the second transfer space 53 . The second liquid processing unit 65 is disposed on the second side (for example, left side) of the second transfer space 53 .
第2非液體處理部62配置於與第1非液體處理部32大致相同之高度位置。第1非液體處理部32及第2非液體處理部62以於大致前後方向X上排列之方式配置。第2非液體處理部62配置於第1非液體處理部32之後方。
The second non-liquid processing unit 62 is arranged at substantially the same height as the first non-liquid processing unit 32 . The 1st non-liquid processing part 32 and the 2nd non-liquid processing part 62 are arrange|positioned so that they may line up substantially in the front-back direction X. As shown in FIG. The second non-liquid processing unit 62 is disposed behind the first non-liquid processing unit 32 .
參照圖4。第2非液體處理部62具有下端62a。第2非液體處理部62之下端62a配置於低於第1非液體處理部32之下端32a之高度位置。
Refer to Figure 4. The second non-liquid processing part 62 has a lower end 62a. The lower end 62 a of the second non-liquid processing part 62 is disposed at a height lower than the lower end 32 a of the first non-liquid processing part 32 .
圖4示出上下方向Z上之第1非液體處理部32之長度L32。圖4示出上下方向Z上之第2非液體處理部62之長度L62。長度L32小於長度L62。
FIG. 4 shows the length L32 of the first non-liquid processing portion 32 in the vertical direction Z. As shown in FIG. FIG. 4 shows the length L62 of the second non-liquid processing portion 62 in the vertical direction Z. As shown in FIG. Length L32 is smaller than length L62.
第2非液體處理部62具備複數個(例如20個)第2熱處理單元63。各第2熱處理單元63對1片基板W進行熱處理。第2熱處理單元63不向基板W供給處理液。由第2熱處理單元63進行之處理為非液體處理。第2熱處理單元63相當於非液體處理單元。第2熱處理單元63之數量相當於第2處理部61所包含之非液體處理單元之數量。第2處理部61所包含之非液體處理單元之數量多於第1處理部31所包含之非液體處理單元之數量。
The second non-liquid processing unit 62 includes a plurality of (for example, 20) second heat processing units 63 . Each second heat treatment unit 63 heat-treats one substrate W. The second heat treatment unit 63 does not supply the treatment liquid to the substrate W. The treatment performed by the second heat treatment unit 63 is non-liquid treatment. The second heat treatment unit 63 corresponds to a non-liquid treatment unit. The number of the second heat treatment units 63 corresponds to the number of non-liquid treatment units included in the second treatment unit 61 . The number of non-liquid processing units included in the second processing unit 61 is greater than the number of non-liquid processing units included in the first processing unit 31 .
4個第2熱處理單元63係疏水化處理單元AHP。疏水化處理單元AHP對基板W進行疏水化處理。疏水化處理係一面向基板W供給含有六甲基二
矽氮烷(HMDS：Hexamethyldisilazane)之處理氣體一面將基板W調整為特定溫度之處理。疏水化處理係為了提高基板W與塗膜之密接性而進行。其他8個第2熱處理單元63係中溫加熱單元MHP。中溫加熱單元MHP對基板W進行加熱處理。剩餘8個第2熱處理單元63為高溫加熱單元HHP。高溫加熱單元HHP對基板W進行加熱處理。高溫加熱單元HHP以較中溫加熱單元MHP高之溫度加熱基板W。以下，將藉由中溫加熱單元MHP進行之加熱處理適當地稱為中溫加熱處理。將藉由高溫加熱單元HHP進行之加熱處理稱為高溫加熱處理。
The four second heat treatment units 63 are hydrophobization treatment units AHP. The hydrophobization treatment unit AHP performs hydrophobization treatment on the substrate W. The hydrophobization treatment is to supply the substrate W containing hexamethyl di
Silazane (HMDS: Hexamethyldisilazane) processing gas is used to adjust the substrate W to a specific temperature. The hydrophobization treatment is performed in order to improve the adhesion between the substrate W and the coating film. The other eight second heat treatment units 63 are medium temperature heating units MHP. The medium temperature heating unit MHP heat-processes the substrate W. The remaining eight second heat treatment units 63 are high-temperature heating units HHP. The high-temperature heating unit HHP heat-processes the substrate W. The high-temperature heating unit HHP heats the substrate W at a higher temperature than the medium-temperature heating unit MHP. Hereinafter, the heat treatment by the medium temperature heating unit MHP is appropriately referred to as medium temperature heat treatment. The heat treatment by the high-temperature heating unit HHP is called high-temperature heat treatment.
各第2熱處理單元63與第2搬送空間53相接。複數個第2熱處理單元63於側視下配置為矩陣狀。例如，複數個第2熱處理單元63於前後方向X上以4行配置，且於上下方向Z上以5段配置。
Each second heat treatment unit 63 is in contact with the second transfer space 53 . The plurality of second thermal processing units 63 are arranged in a matrix form in a side view. For example, the some 2nd thermal processing unit 63 is arrange|positioned in 4 rows in the front-back direction X, and is arrange|positioned in 5 stages in the up-down direction Z.
第2熱處理單元63具有與第1熱處理單元33大致相同之構造。因此，省略第2熱處理單元63之構造之說明。再者，第2熱處理單元63之構造亦可於疏水化處理單元AHP、中溫加熱單元MHP及高溫加熱單元HHP之間不同。例如，疏水化處理單元AHP亦可進而具備向第2板34b上之基板W供給處理氣體之氣體供給部。
The second heat treatment unit 63 has substantially the same structure as the first heat treatment unit 33 . Therefore, description of the structure of the second heat treatment unit 63 is omitted. Furthermore, the structure of the second heat treatment unit 63 may also be different among the hydrophobization treatment unit AHP, the medium temperature heating unit MHP, and the high temperature heating unit HHP. For example, the hydrophobization processing unit AHP may further include a gas supply unit that supplies a processing gas to the substrate W on the second plate 34b.
參照圖6。第2液體處理部65配置於與第1液體處理部35大致相同之高度位置。第1液體處理部35及第2液體處理部65以於大致前後方向X上排列之方式配置。第2液體處理部65配置於第1液體處理部35之後方。
Refer to Figure 6. The second liquid processing unit 65 is arranged at substantially the same height as the first liquid processing unit 35 . The first liquid processing unit 35 and the second liquid processing unit 65 are arranged so as to be aligned in the substantially front-back direction X. As shown in FIG. The second liquid processing unit 65 is disposed behind the first liquid processing unit 35 .
第2液體處理部65具備複數個(例如6個)第2液體處理單元66。各第2液體處理單元66對1片基板W進行液體處理。
The second liquid processing unit 65 includes a plurality of (for example, six) second liquid processing units 66 . Each second liquid processing unit 66 performs liquid processing on one substrate W.
第2液體處理單元66例如為塗佈處理單元。由第2液體處理單元66進行之液體處理例如為塗佈處理。第2液體處理單元66對基板W塗佈之塗膜材料根據基板處理裝置1之動作而適當地選擇。各第2液體處理單元66亦可使用相同種類之塗膜材料。
The second liquid processing unit 66 is, for example, a coating processing unit. The liquid processing performed by the second liquid processing unit 66 is, for example, coating processing. The material of the coating film applied to the substrate W by the second liquid processing unit 66 is appropriately selected according to the operation of the substrate processing apparatus 1 . The same type of coating material can also be used for each second liquid processing unit 66 .
各第2液體處理單元66與第2搬送空間53相接。複數個第2液體處理單元66於側視下配置為矩陣狀。例如，複數個第2液體處理單元66於前後方向X上以3行配置，且於上下方向Z上以2段配置。
Each second liquid processing unit 66 is in contact with the second transfer space 53 . The plurality of second liquid processing units 66 are arranged in a matrix form in a side view. For example, the plurality of second liquid processing units 66 are arranged in three rows in the front-back direction X, and are arranged in two stages in the up-down direction Z.
第2液體處理單元66具有與第1液體處理單元36大致相同之構造。因此，省略第2液體處理單元66之構造之說明。再者，第2液體處理單元66亦可根據第2液體處理單元66使用之處理液，而具有與第1液體處理單元36不同之構造。例如，第2液體處理單元66之噴嘴37b亦可具有與第1液體處理單元36之噴嘴37b不同之構造。
The second liquid processing unit 66 has substantially the same structure as the first liquid processing unit 36 . Therefore, description of the structure of the second liquid processing unit 66 is omitted. Furthermore, the second liquid processing unit 66 may have a different structure from that of the first liquid processing unit 36 according to the processing liquid used in the second liquid processing unit 66 . For example, the nozzle 37b of the second liquid processing unit 66 may have a different structure from the nozzle 37b of the first liquid processing unit 36 .
第2搬送機構57將基板W搬送至第2熱處理單元63及第2液體處理單元66。例如，第2搬送機構57將基板W依序搬送至疏水化處理單元AHP、第2液體處理單元66、中溫加熱單元MHP及高溫加熱單元HHP。第2處理部61對基板W依序進行疏水化處理、塗佈處理、中溫加熱處理及高溫加熱處理。藉此，第2處理部61於基板W形成塗膜。將藉由第2處理部61形成於
基板W之塗膜適當地稱為第2塗膜。
The second transport mechanism 57 transports the substrate W to the second thermal processing unit 63 and the second liquid processing unit 66 . For example, the second transport mechanism 57 sequentially transports the substrate W to the hydrophobization treatment unit AHP, the second liquid processing unit 66 , the medium temperature heating unit MHP, and the high temperature heating unit HHP. The second processing unit 61 sequentially performs hydrophobization treatment, coating treatment, medium-temperature heat treatment, and high-temperature heat treatment on the substrate W. Thereby, the second processing unit 61 forms a coating film on the substrate W. As shown in FIG. will be formed by the second processing unit 61 in
The coating film of the substrate W is appropriately referred to as a second coating film.
第2塗膜亦可與藉由第1處理部31形成之第1塗膜相同。第2塗膜亦可與第1塗膜不同。
The 2nd coating film may be the same as the 1st coating film formed by the 1st processing part 31. The second coating film may be different from the first coating film.
<用以於搬送機構彼此之間搬送基板W之構成>
<Structure for transferring substrate W between transfer mechanisms>
參照圖3。第1搬送機構27於俯視下配置於主搬送機構17與第2搬送機構57之間。主搬送機構17、第1搬送機構27及第2搬送機構57以於俯視下依序排列之方式配置。主搬送機構17、第1搬送機構27及第2搬送機構57以於前後方向X上排列之方式配置。第1搬送機構27配置於主搬送機構17之後方。第2搬送機構57配置於第1搬送機構27之後方。
Refer to Figure 3. The 1st conveyance mechanism 27 is arrange|positioned between the main conveyance mechanism 17 and the 2nd conveyance mechanism 57 in planar view. The main transport mechanism 17, the first transport mechanism 27, and the second transport mechanism 57 are arranged in order in plan view. The main conveyance mechanism 17, the 1st conveyance mechanism 27, and the 2nd conveyance mechanism 57 are arrange|positioned so that they may line up in the front-back direction X. As shown in FIG. The first conveying mechanism 27 is disposed behind the main conveying mechanism 17 . The second conveying mechanism 57 is disposed behind the first conveying mechanism 27 .
參照圖4、5、6。第1搬送機構27配置於與主搬送機構17及第2搬送機構57大致相同之高度位置。即，第1搬送機構27、主搬送機構17及第2搬送機構57以於水平方向上排列之方式配置。主搬送機構17可移動至第1搬送機構27之高度位置。第2搬送機構57可移動至第1搬送機構27之高度位置。
Refer to Figures 4, 5, and 6. The first conveying mechanism 27 is arranged at substantially the same height position as the main conveying mechanism 17 and the second conveying mechanism 57 . That is, the 1st conveyance mechanism 27, the main conveyance mechanism 17, and the 2nd conveyance mechanism 57 are arrange|positioned so that they may line up in a horizontal direction. The main transport mechanism 17 can move to the height position of the first transport mechanism 27 . The second conveying mechanism 57 can move to the height position of the first conveying mechanism 27 .
參照圖3、5。對用以於主搬送機構17與第1搬送機構27之間搬送基板W之構成進行說明。基板處理裝置1具備前載置部71。於前載置部71載置基板W。前載置部71配置於主搬送機構17與第1搬送機構27之間。主搬送機構17與第1搬送機構27經由前載置部71相互搬送基板W。搬送機構18a與第1搬送機構27經由前載置部71相互搬送基板W。搬送機構18b與第1搬
送機構27經由前載置部71相互搬送基板W。因此，於主搬送機構17與第1搬送機構27之間搬送基板W時，主搬送機構17與第1搬送機構27不同時接觸相同基板W。
Refer to Figures 3 and 5. A configuration for transferring the substrate W between the main transfer mechanism 17 and the first transfer mechanism 27 will be described. The substrate processing apparatus 1 includes a front loading unit 71 . The substrate W is placed on the front loading unit 71 . The front loading unit 71 is disposed between the main transport mechanism 17 and the first transport mechanism 27 . The main transport mechanism 17 and the first transport mechanism 27 mutually transport the substrate W via the front loading unit 71 . The transport mechanism 18 a and the first transport mechanism 27 mutually transport the substrate W via the front loading unit 71 . The conveying mechanism 18b and the first
The transport mechanism 27 transports the substrates W to each other via the front loading unit 71 . Therefore, when the substrate W is transferred between the main transfer mechanism 17 and the first transfer mechanism 27 , the main transfer mechanism 17 and the first transfer mechanism 27 do not contact the same substrate W at the same time.
前載置部71配置於傳載機部11與第1區塊21之間。例如，前載置部71跨及傳載機部11及第1區塊21而配置。例如，前載置部71跨及傳載機部11之主搬送空間13及第1區塊21之第1搬送空間23而配置。
The front loading unit 71 is disposed between the carrier unit 11 and the first block 21 . For example, the front loading unit 71 is disposed across the carrier unit 11 and the first block 21 . For example, the front loading unit 71 is arranged across the main transport space 13 of the conveyor unit 11 and the first transport space 23 of the first block 21 .
前載置部71配置於與主搬送機構17及第1搬送機構27大致相同之高度位置。前載置部71配置於主搬送機構17之後方。前載置部71配置於搬送機構18a之後方且左方。前載置部71配置於搬送機構18b之後方且右方。前載置部71配置於第1搬送機構27之前方。前載置部71配置於高於迂迴搬送機構41之高度位置。
The front loading unit 71 is arranged at substantially the same height as the main transport mechanism 17 and the first transport mechanism 27 . The front loading unit 71 is disposed behind the main transport mechanism 17 . The front loading part 71 is arrange|positioned behind the conveyance mechanism 18a, and left. The front loading part 71 is arrange|positioned behind the conveyance mechanism 18b, and to the right. The front loading unit 71 is arranged in front of the first transport mechanism 27 . The front loading unit 71 is disposed at a height higher than the roundabout conveyance mechanism 41 .
參照圖5。前載置部71具備複數個(例如4個)板72。將1片基板W載置於1個板72上。複數個板72以於大致上下方向Z上排列之方式配置。因此，前載置部71可載置複數個(例如4片)基板W。
Refer to Figure 5. The front mounting portion 71 includes a plurality (for example, four) of plates 72 . One substrate W is placed on one plate 72 . The plurality of plates 72 are arranged substantially in line in the vertical direction Z. As shown in FIG. Therefore, a plurality of (for example, four) substrates W can be placed on the front loading unit 71 .
主搬送機構17可將基板W載置於前載置部71。搬送機構18a、18b可分別將基板W載置於前載置部71。搬送機構18a、18b可分別將2片基板W同時載置於前載置部71。主搬送機構17可拿取前載置部71上之基板W。搬送機構18a、18b可分別拿取前載置部71上之基板W。搬送機構18a、18b可分別同時拿取前載置部71上之2片基板W。
The main transport mechanism 17 can place the substrate W on the front loading unit 71 . The transport mechanisms 18 a and 18 b can respectively place the substrate W on the front loading portion 71 . The transport mechanisms 18a and 18b can respectively place two substrates W on the front loading portion 71 at the same time. The main transport mechanism 17 can pick up the substrate W on the front loading part 71 . The transport mechanisms 18a, 18b can pick up the substrates W on the front mounting part 71, respectively. The conveying mechanisms 18a and 18b can respectively pick up two substrates W on the front mounting part 71 at the same time.
第1搬送機構27可將基板W載置於前載置部71。第1搬送機構27可拿取前載置部71上之基板W。
The first transport mechanism 27 can place the substrate W on the front loading unit 71 . The first conveying mechanism 27 can pick up the substrate W on the front loading unit 71 .
對主搬送機構17將基板W交遞至第1搬送機構27之動作例進行說明。首先，主搬送機構17將基板W載置於前載置部71。例如，主搬送機構17將2片基板W同時載置於前載置部71。繼而，第1搬送機構27拿取前載置部71上之基板W。例如，第1搬送機構27逐片拿取前載置部71上之基板W。
An operation example in which the main transport mechanism 17 delivers the substrate W to the first transport mechanism 27 will be described. First, the main transport mechanism 17 places the substrate W on the front loading unit 71 . For example, the main transport mechanism 17 simultaneously loads two substrates W on the front loading section 71 . Next, the first transport mechanism 27 picks up the substrate W on the front loading unit 71 . For example, the first conveyance mechanism 27 picks up the substrates W on the front loading unit 71 one by one.
對第1搬送機構27將基板W交遞至主搬送機構17之動作例進行說明。首先，第1搬送機構27將基板W載置於前載置部71。繼而，主搬送機構17拿取前載置部71上之基板W。
An operation example in which the first transport mechanism 27 delivers the substrate W to the main transport mechanism 17 will be described. First, the first transport mechanism 27 places the substrate W on the front loading unit 71 . Then, the main transport mechanism 17 picks up the substrate W on the front loading unit 71 .
對用以於第1搬送機構27與第2搬送機構57之間搬送基板W之構成進行說明。基板處理裝置1具備後載置部77。於後載置部77載置基板W。後載置部77配置於第1搬送機構27與第2搬送機構57之間。第1搬送機構27與第2搬送機構57經由後載置部77相互搬送基板W。因此，於第1搬送機構27與第2搬送機構57之間搬送基板W時，第1搬送機構27與第2搬送機構57不同時接觸相同基板W。
A configuration for transporting the substrate W between the first transport mechanism 27 and the second transport mechanism 57 will be described. The substrate processing apparatus 1 includes a rear loading unit 77 . The substrate W is placed on the rear placement unit 77 . The rear loading unit 77 is arranged between the first conveying mechanism 27 and the second conveying mechanism 57 . The first conveyance mechanism 27 and the second conveyance mechanism 57 convey the substrate W to each other via the rear mounting unit 77 . Therefore, when the substrate W is transferred between the first transfer mechanism 27 and the second transfer mechanism 57 , the first transfer mechanism 27 and the second transfer mechanism 57 do not contact the same substrate W at the same time.
後載置部77配置於第1區塊21與第2區塊51之間。例如，後載置部77跨及第1區塊21及第2區塊51而配置。例如，後載置部77跨及第1區塊21之
第1搬送空間23及第2區塊51之第2搬送空間53而配置。
The rear loading unit 77 is disposed between the first block 21 and the second block 51 . For example, the rear loading unit 77 is arranged across the first block 21 and the second block 51 . For example, the rear loading portion 77 straddles the first block 21
The 1st conveyance space 23 and the 2nd conveyance space 53 of the 2nd block 51 are arrange|positioned.
後載置部77配置於與第1搬送機構27及第2搬送機構57大致相同之高度位置。後載置部77配置於第1搬送機構27之後方。後載置部77配置於第2搬送機構57之前方。後載置部77配置於高於迂迴搬送機構41之高度位置。
The rear loading unit 77 is arranged at substantially the same height position as the first conveying mechanism 27 and the second conveying mechanism 57 . The rear loading unit 77 is disposed behind the first transport mechanism 27 . The rear loading unit 77 is arranged in front of the second transport mechanism 57 . The rear loading unit 77 is disposed at a height higher than the roundabout conveyance mechanism 41 .
參照圖5。後載置部77具有與前載置部71大致相同之構造。即，後載置部77具備複數個(例如4個)板72。後載置部77可載置複數個(例如4片)基板W。
Refer to Figure 5. The rear mounting part 77 has substantially the same structure as the front mounting part 71 . That is, the rear mounting portion 77 includes a plurality of (for example, four) plates 72 . A plurality of (for example, four) substrates W can be placed on the rear loading unit 77 .
第1搬送機構27可將基板W載置於後載置部77。第1搬送機構27可拿取後載置部77上之基板W。第2搬送機構57可將基板W載置於後載置部77。第2搬送機構57可拿取後載置部77上之基板W。
The first transport mechanism 27 can place the substrate W on the rear loading unit 77 . The first conveyance mechanism 27 can pick up the substrate W on the rear placement portion 77 . The second transport mechanism 57 can place the substrate W on the rear loading unit 77 . The second conveyance mechanism 57 can pick up the substrate W on the rear placement unit 77 .
於第1搬送機構27將基板W交遞至第2搬送機構57時，首先，第1搬送機構27將基板W載置於後載置部77，繼而，第2搬送機構57拿取後載置部77上之基板W。於第2搬送機構57將基板W交遞至第1搬送機構27時，首先，第2搬送機構57將基板W載置於後載置部77，繼而，第1搬送機構27拿取後載置部77上之基板W。
When the first conveying mechanism 27 delivers the substrate W to the second conveying mechanism 57, first, the first conveying mechanism 27 places the substrate W on the rear placement portion 77, and then the second conveying mechanism 57 picks up and places the substrate W. The substrate W on the portion 77. When the second conveying mechanism 57 delivers the substrate W to the first conveying mechanism 27, first, the second conveying mechanism 57 places the substrate W on the rear placement portion 77, and then the first conveying mechanism 27 picks up and places the substrate W. The substrate W on the portion 77.
參照圖4、5、8、9。迂迴搬送機構41於俯視下配置於主搬送機構17與第2搬送機構57之間。主搬送機構17、迂迴搬送機構41及第2搬送機構
57以於俯視下依序排列之方式配置。迂迴搬送機構41配置於與主搬送機構17及第2搬送機構57大致相同之高度位置。即，迂迴搬送機構41、主搬送機構17及第2搬送機構57以於水平方向上排列之方式配置。主搬送機構17可移動至迂迴搬送機構41之高度位置。第2搬送機構57可移動至迂迴搬送機構41之高度位置。主搬送機構17、第1搬送機構27及第2搬送機構57以於前後方向X上排列之方式配置。迂迴搬送機構41配置於主搬送機構17之後方。第2搬送機構57配置於迂迴搬送機構41之後方。
Refer to Figures 4, 5, 8, and 9. The detour transport mechanism 41 is arranged between the main transport mechanism 17 and the second transport mechanism 57 in plan view. Main transport mechanism 17, detour transport mechanism 41 and second transport mechanism
57 are arranged sequentially in a top view. The detour transport mechanism 41 is arranged at substantially the same height position as the main transport mechanism 17 and the second transport mechanism 57 . That is, the detour conveyance mechanism 41, the main conveyance mechanism 17, and the 2nd conveyance mechanism 57 are arrange|positioned so that they may line up in a horizontal direction. The main conveying mechanism 17 can move to the height position of the roundabout conveying mechanism 41 . The second conveying mechanism 57 can move to the height position of the detour conveying mechanism 41 . The main conveyance mechanism 17, the 1st conveyance mechanism 27, and the 2nd conveyance mechanism 57 are arrange|positioned so that they may line up in the front-back direction X. As shown in FIG. The detour transport mechanism 41 is disposed behind the main transport mechanism 17 . The second conveying mechanism 57 is disposed behind the detour conveying mechanism 41 .
再者，迂迴搬送機構41配置於第2處理部61之前方。迂迴搬送機構41於俯視下配置於不與第2處理部61重疊之位置。
Furthermore, the detour transport mechanism 41 is arranged in front of the second processing unit 61 . The detour transport mechanism 41 is arranged at a position not overlapping the second processing unit 61 in plan view.
參照圖9。對用以於主搬送機構17與迂迴搬送機構41之間搬送基板W之構成進行說明。主搬送機構17與迂迴搬送機構41直接地交接基板W。具體而言，於主搬送機構17與迂迴搬送機構41之間搬送基板W時，主搬送機構17與迂迴搬送機構41同時接觸相同基板W。換言之，主搬送機構17與迂迴搬送機構41不經由除主搬送機構17及迂迴搬送機構41以外之構件(例如載置部)而相互搬送基板W。
Refer to Figure 9. A configuration for transporting the substrate W between the main transport mechanism 17 and the detour transport mechanism 41 will be described. The main transport mechanism 17 and the detour transport mechanism 41 directly deliver the substrate W. Specifically, when the substrate W is transferred between the main transfer mechanism 17 and the detour transfer mechanism 41 , the main transfer mechanism 17 and the detour transfer mechanism 41 contact the same substrate W at the same time. In other words, the main conveyance mechanism 17 and the detour conveyance mechanism 41 mutually convey the substrate W without passing through a member (for example, a loading unit) other than the main conveyance mechanism 17 and the detour conveyance mechanism 41 .
圖9示出同時接觸相同基板W之主搬送機構17及迂迴搬送機構41。搬送機構18a之保持部19d、19e於俯視下具有大致U字形狀或大致Y字形狀。搬送機構18a之保持部19d、19e與基板W之部分P1接觸。迂迴搬送機構41之保持部44c、44e於俯視下具有大致I字形狀。迂迴搬送機構41之保持部44c、44e(具體而言為墊45b)與基板W之部分Q接觸。基板W之部分
P1與基板W之部分Q不同。基板W之部分P1例如為基板W之背面之除中央部以外之部分。基板W之部分P1例如為基板W之背面之周緣部。基板W之部分Q例如為基板W之背面之中央部。因此，於搬送機構18a與迂迴搬送機構41同時接觸相同基板W時，搬送機構18a與迂迴搬送機構41不相互干涉。
FIG. 9 shows the main transport mechanism 17 and the detour transport mechanism 41 that contact the same substrate W at the same time. The holding parts 19d and 19e of the conveyance mechanism 18a have a substantially U-shape or a substantially Y-shape in plan view. The holding parts 19d and 19e of the transport mechanism 18a are in contact with the part P1 of the substrate W. As shown in FIG. The holding parts 44c and 44e of the roundabout conveyance mechanism 41 have a substantially I-shape in plan view. The holding parts 44c and 44e (specifically, the pads 45b ) of the detour transport mechanism 41 are in contact with the portion Q of the substrate W. As shown in FIG. Part of Substrate W
P1 is different from the portion Q of the substrate W. The portion P1 of the substrate W is, for example, the portion of the back surface of the substrate W other than the central portion. The portion P1 of the substrate W is, for example, the peripheral portion of the back surface of the substrate W. As shown in FIG. The portion Q of the substrate W is, for example, the central portion of the back surface of the substrate W. Therefore, when the conveyance mechanism 18a and the detour conveyance mechanism 41 contact the same substrate W at the same time, the conveyance mechanism 18a and the detour conveyance mechanism 41 do not interfere with each other.
基板W之接觸搬送機構18b之保持部19d、19e之部分與基板W之部分P1大致相同。因此，基板W之接觸搬送機構18b之保持部19d、19e之部分與基板W之部分Q不同。因此，於搬送機構18b與迂迴搬送機構41同時接觸相同基板W時，搬送機構18b與迂迴搬送機構41不相互干涉。
The portion of the substrate W that contacts the holding portions 19d and 19e of the transport mechanism 18b is substantially the same as the portion P1 of the substrate W. Therefore, the part of the board|substrate W which contacts the holding part 19d, 19e of the conveyance mechanism 18b differs from the part Q of the board|substrate W. Therefore, when the conveyance mechanism 18b and the detour conveyance mechanism 41 contact the same substrate W at the same time, the conveyance mechanism 18b and the detour conveyance mechanism 41 do not interfere with each other.
於主搬送機構17與第1搬送機構27交接基板W時，水平移動部44a位於迂迴支持部42之前端。藉由臂部44b、44d之旋轉，保持部44c、44e位於較水平移動部44a更靠前方。
When the main transport mechanism 17 and the first transport mechanism 27 deliver the substrate W, the horizontal movement part 44 a is located at the front end of the detour support part 42 . By the rotation of the arm parts 44b and 44d, the holding parts 44c and 44e are located in front of the horizontal movement part 44a.
將在主搬送機構17與迂迴搬送機構41之間交接基板W之位置稱為第1交接位置。將在主搬送機構17與第1搬送機構27之間交接基板W之位置稱為第2交接位置。第1交接位置於俯視下與第2交接位置大致相同。此處，第2交接位置與前載置部71之位置大致相同。因此，第1交接位置於俯視下與前載置部71之位置大致相同。
The position where the substrate W is delivered between the main transport mechanism 17 and the detour transport mechanism 41 is referred to as a first delivery position. The position where the substrate W is delivered between the main transport mechanism 17 and the first transport mechanism 27 is referred to as a second delivery position. The first transfer position is substantially the same as the second transfer position in plan view. Here, the second delivery position is substantially the same as the position of the front loading portion 71 . Therefore, the first transfer position is substantially the same as the position of the front loading portion 71 in plan view.
第1交接位置係第2交接位置之下方之位置。第1交接位置係前載置部71之下方之位置。
The first transfer position is a position below the second transfer position. The first transfer position is a position below the front loading portion 71 .
圖11(a)~11(e)係表示主搬送機構17與第1搬送機構27交接基板W之動作例之側視圖。對主搬送機構17將基板W交遞至迂迴搬送機構41之動作例進行說明。
FIGS. 11( a ) to 11 ( e ) are side views showing an example of the operation of the main transport mechanism 17 and the first transport mechanism 27 to deliver and transfer the substrate W. FIG. An operation example in which the main transport mechanism 17 delivers the substrate W to the detour transport mechanism 41 will be described.
參照圖11(a)、(b)。保持部19d保持基板W。保持部19d移動至保持部44c之上方之位置。保持部44c未保持基板W。
Referring to Figure 11(a), (b). The holding portion 19d holds the substrate W. As shown in FIG. The holding part 19d moves to a position above the holding part 44c. The holding part 44c does not hold the substrate W. As shown in FIG.
參照圖11(b)~11(d)。保持部19d向下方移動。於保持部19d移動至與墊45b之上表面大致相同之高度位置時，保持部44c與被保持部19d保持之基板W接觸。即，於保持部19d移動至與墊45b之上表面大致相同之高度位置時，主搬送機構17與迂迴搬送機構41同時接觸相同基板W。於保持部19d移動至低於墊45b之上表面之高度位置時，於基板W與保持部44c接觸之狀態下，基板W自保持部19d分離。藉此，基板W自主搬送機構17直接被交遞至迂迴搬送機構41。
Refer to Figure 11(b)~11(d). The holding part 19d moves downward. When the holding part 19d moves to a position substantially at the same height as the upper surface of the pad 45b, the holding part 44c comes into contact with the substrate W held by the holding part 19d. That is, when the holding part 19d moves to substantially the same height position as the upper surface of the pad 45b, the main transport mechanism 17 and the detour transport mechanism 41 contact the same substrate W at the same time. When the holding portion 19d moves to a height position lower than the upper surface of the pad 45b, the substrate W is separated from the holding portion 19d in a state where the substrate W is in contact with the holding portion 44c. Accordingly, the substrate W is directly handed over from the main transport mechanism 17 to the detour transport mechanism 41 .
於保持部19d移動至低於墊45b之上表面且高於保持部本體45a之位置時，保持部19d停止向下方移動。再者，於俯視下保持部19d不與保持部44c重疊之情形時，保持部19d向下方可移動至低於保持部44c之位置。
When the holding portion 19d moves to a position lower than the upper surface of the pad 45b and higher than the holding portion body 45a, the holding portion 19d stops moving downward. Furthermore, when the holding portion 19d does not overlap with the holding portion 44c in plan view, the holding portion 19d can move downward to a position lower than the holding portion 44c.
參照圖11(d)~11(e)。保持部19d於水平方向上移動而與保持部44c遠離。
Refer to Figure 11(d)~11(e). The holding part 19d moves in the horizontal direction away from the holding part 44c.
對迂迴搬送機構41將基板W交遞至主搬送機構17之動作例進行說明。迂迴搬送機構41將基板W交遞至主搬送機構17之動作與主搬送機構17將基板W交遞至迂迴搬送機構41之動作相反。
An operation example in which the detour transport mechanism 41 delivers the substrate W to the main transport mechanism 17 will be described. The operation of the circuitous transport mechanism 41 to deliver the substrate W to the main transport mechanism 17 is opposite to the operation of the main transport mechanism 17 to deliver the substrate W to the circuitous transport mechanism 41 .
參照圖11(e)~11(d)。保持部44c保持基板W。保持部19d未保持基板W。保持部19d於低於被墊45b保持之基板W且高於保持部本體45a之高度位置水平移動。藉此，保持部19d於側視下移動至基板W之下方且保持部本體45a之上方之位置。
Refer to Figure 11(e)~11(d). The holding portion 44c holds the substrate W. As shown in FIG. The holding part 19d does not hold the substrate W. As shown in FIG. The holding part 19d moves horizontally at a height position lower than the substrate W held by the pad 45b and higher than the holding part main body 45a. Thereby, the holding part 19d moves to a position below the substrate W and above the holding part main body 45a in a side view.
參照圖11(d)~11(b)。保持部19d向上方移動。於保持部19d移動至與墊45b之上表面大致相同之高度位置時，保持部19d與被保持部44c保持之基板W接觸。即，於保持部19d移動至與墊45b之上表面大致相同之高度位置時，主搬送機構17與迂迴搬送機構41同時接觸相同基板W。於保持部19d移動至高於墊45b之高度位置時，於基板W與保持部19d接觸之狀態下，基板W自保持部44c分離。藉此，基板W自第1搬送機構27直接被交遞至主搬送機構17。
Referring to Figure 11(d)~11(b). The holding part 19d moves upward. When the holding portion 19d moves to a position substantially at the same height as the upper surface of the pad 45b, the holding portion 19d comes into contact with the substrate W held by the holding portion 44c. That is, when the holding part 19d moves to substantially the same height position as the upper surface of the pad 45b, the main transport mechanism 17 and the detour transport mechanism 41 contact the same substrate W at the same time. When the holding portion 19d moves to a height position higher than the pad 45b, the substrate W is separated from the holding portion 44c in a state where the substrate W is in contact with the holding portion 19d. Accordingly, the substrate W is directly delivered from the first transport mechanism 27 to the main transport mechanism 17 .
參照圖11(b)~11(a)。保持部19d以保持有基板W之狀態於水平方向上移動，而與保持部44c遠離。
Refer to Figure 11(b)~11(a). The holding part 19d moves in the horizontal direction while holding the substrate W, and is separated from the holding part 44c.
主搬送機構17可將2片基板W同時交遞至迂迴搬送機構41。具體而言，搬送機構18a之保持部19d、19e可將2片基板W同時載置於迂迴搬送機構41之保持部44c、44e。同樣地，搬送機構18b之保持部19d、19e可將
2片基板W同時載置於迂迴搬送機構41之保持部44c、44e。
The main transport mechanism 17 can deliver two substrates W to the detour transport mechanism 41 at the same time. Specifically, the holding portions 19d and 19e of the transport mechanism 18a can place two substrates W on the holding portions 44c and 44e of the roundabout transport mechanism 41 at the same time. Similarly, the holding parts 19d, 19e of the conveying mechanism 18b can
The two substrates W are simultaneously placed on the holding portions 44c and 44e of the roundabout transport mechanism 41 .
主搬送機構17可自迂迴搬送機構41同時接收2片基板W。具體而言，搬送機構18a之保持部19d、19e可同時拿取迂迴搬送機構41之保持部44c、44e上之基板W。同樣地，搬送機構18b之保持部19d、19e可同時拿取迂迴搬送機構41之保持部44c、44e上之基板W。
The main transport mechanism 17 can simultaneously receive two substrates W from the detour transport mechanism 41 . Specifically, the holding parts 19d and 19e of the transport mechanism 18a can pick up the substrate W on the holding parts 44c and 44e of the detour transport mechanism 41 at the same time. Similarly, the holding parts 19d and 19e of the transport mechanism 18b can pick up the substrate W on the holding parts 44c and 44e of the detour transport mechanism 41 at the same time.
參照圖9。對用以於迂迴搬送機構41與第2搬送機構57之間搬送基板W之構成進行說明。迂迴搬送機構41與第2搬送機構57直接地交接基板W。具體而言，於迂迴搬送機構41與第2搬送機構57之間搬送基板W時，迂迴搬送機構41與第2搬送機構57同時接觸相同基板W。
Refer to Figure 9. A configuration for transporting the substrate W between the detour transport mechanism 41 and the second transport mechanism 57 will be described. The detour transport mechanism 41 directly delivers the substrate W to the second transport mechanism 57 . Specifically, when the substrate W is transported between the detour transport mechanism 41 and the second transport mechanism 57 , the detour transport mechanism 41 and the second transport mechanism 57 contact the same substrate W at the same time.
圖9係表示同時接觸相同基板W之迂迴搬送機構41與第2搬送機構57之俯視圖。第2搬送機構57之保持部29d、29e於俯視下具有大致U字形狀或大致Y字形狀。第2搬送機構57之保持部29d、29e與基板W之部分P2接觸。迂迴搬送機構41之保持部44c、44e(具體而言為墊45b)與基板W之部分Q接觸。基板W之部分P2與基板W之部分Q不同。基板W之部分P2例如為基板W之背面之除中央部以外之部分。部分P2例如為基板W之背面之周緣部。基板W之部分Q例如為基板W之背面之中央部。因此，於第2搬送機構57與迂迴搬送機構41同時接觸相同基板W時，第2搬送機構57與迂迴搬送機構41不相互干涉。
FIG. 9 is a plan view showing the detour transport mechanism 41 and the second transport mechanism 57 that contact the same substrate W at the same time. The holding parts 29d and 29e of the second transport mechanism 57 have a substantially U-shape or a substantially Y-shape in plan view. The holding parts 29d and 29e of the second transport mechanism 57 are in contact with the portion P2 of the substrate W. As shown in FIG. The holding parts 44c and 44e (specifically, the pads 45b ) of the detour transport mechanism 41 are in contact with the portion Q of the substrate W. As shown in FIG. The portion P2 of the substrate W is different from the portion Q of the substrate W. FIG. The portion P2 of the substrate W is, for example, the portion of the back surface of the substrate W other than the central portion. The portion P2 is, for example, the peripheral portion of the back surface of the substrate W. As shown in FIG. The portion Q of the substrate W is, for example, the central portion of the back surface of the substrate W. Therefore, when the second transport mechanism 57 and the detour transport mechanism 41 contact the same substrate W at the same time, the second transport mechanism 57 and the detour transport mechanism 41 do not interfere with each other.
第2搬送機構57將基板W交遞至迂迴搬送機構41之動作與主搬送機構
17將基板W交遞至迂迴搬送機構41之動作例大致相同。迂迴搬送機構41將基板W交遞至第2搬送機構57之動作與迂迴搬送機構41將基板W交遞至主搬送機構17之動作大致相同。但是，於第2搬送機構57將基板W交遞至迂迴搬送機構41時，及迂迴搬送機構41將基板W交遞至第2搬送機構57時，水平移動部44a位於迂迴支持部42之後端。進而，藉由臂部44b、44d之旋轉，保持部44c、44e位於較水平移動部44a更靠後方。
The operation of the second transport mechanism 57 to hand over the substrate W to the detour transport mechanism 41 is similar to that of the main transport mechanism.
17. The operation example of delivering the substrate W to the roundabout transport mechanism 41 is substantially the same. The operation in which the circuitous transport mechanism 41 delivers the substrate W to the second transport mechanism 57 is substantially the same as the operation in which the circuitous transport mechanism 41 delivers the substrate W to the main transport mechanism 17 . However, when the second transport mechanism 57 delivers the substrate W to the detour transport mechanism 41 , and when the detour transport mechanism 41 delivers the substrate W to the second transport mechanism 57 , the horizontal movement unit 44 a is located at the rear end of the detour support unit 42 . Furthermore, by rotation of the arm parts 44b and 44d, the holding|maintenance parts 44c and 44e are located behind rather than the horizontal movement part 44a.
將在第2搬送機構57與迂迴搬送機構41之間交接基板W之位置稱為第3交接位置。將在第1搬送機構27與第2搬送機構57之間交接基板W之位置稱為第4交接位置。第3交接位置於俯視下與第4交接位置大致相同。此處，第4交接位置與後載置部77之位置大致相同。因此，第3交接位置於俯視下與後載置部77之位置大致相同。
The position where the substrate W is delivered between the second transport mechanism 57 and the detour transport mechanism 41 is referred to as a third delivery position. The position where the substrate W is delivered between the first transport mechanism 27 and the second transport mechanism 57 is referred to as a fourth delivery position. The third transfer position is substantially the same as the fourth transfer position in plan view. Here, the fourth delivery position is substantially the same as the position of the rear loading unit 77 . Therefore, the third delivery position is substantially the same as the position of the rear mounting portion 77 in plan view.
第3交接位置係第4交接位置之下方之位置。第3交接位置係後載置部77之下方之位置。
The 3rd transfer position is the position below the 4th transfer position. The third delivery position is a position below the rear loading portion 77 .
<控制部>
<control department>
參照圖3。基板處理裝置1具備控制部79。控制部79例如設置於傳載機部11。控制部79控制傳載機部11、第1區塊21及第2區塊51。更具體而言，控制部79控制主搬送機構17、第1處理部31、第1搬送機構27、迂迴搬送機構41、第2處理部61及第2搬送機構57。
Refer to Figure 3. The substrate processing apparatus 1 includes a control unit 79 . The control unit 79 is provided, for example, in the carrier unit 11 . The control unit 79 controls the carrier unit 11 , the first block 21 and the second block 51 . More specifically, the control unit 79 controls the main transport mechanism 17 , the first processing unit 31 , the first transport mechanism 27 , the detour transport mechanism 41 , the second processing unit 61 , and the second transport mechanism 57 .
控制部79藉由執行各種處理之中央運算處理裝置(CPU)、成為運算處
理之作業區域之RAM(Random-Access Memory，隨機存取記憶體)、固定磁碟等記憶媒體等實現。於記憶媒體，記憶有用以處理基板W之處理方案(處理程式)、或用以識別各基板W之資訊等各種資訊。
The control unit 79 is a central processing unit (CPU) that executes various processes, and becomes an operation unit.
Realization of RAM (Random-Access Memory, random access memory), fixed disk and other memory media in the working area of the management. Various information such as a processing plan (processing program) for processing the substrate W and information for identifying each substrate W are stored in the storage medium.
<基板處理裝置1之動作例>
<Operation Example of Substrate Processing Apparatus 1>
圖12(a)係模式性地表示圖2(a)所示之第1動作例中之基板W之搬送路徑的圖。圖12(b)係模式性地表示圖2(b)所示之第2動作例中之基板W之搬送路徑的圖。圖12(c)係模式性地表示圖2(c)所示之第3動作例中之基板W之搬送路徑的圖。再者，於圖12(a)~12(c)中，將載具載置部12a1、12b1示於與圖3不同之位置。
FIG. 12( a ) is a diagram schematically showing the conveyance path of the substrate W in the first operation example shown in FIG. 2( a ). FIG. 12( b ) is a diagram schematically showing the conveyance path of the substrate W in the second operation example shown in FIG. 2( b ). FIG. 12( c ) is a diagram schematically showing the conveyance path of the substrate W in the third operation example shown in FIG. 2( c ). Furthermore, in FIGS. 12( a ) to 12 ( c ), the carrier mounting portions 12 a 1 and 12 b 1 are shown in positions different from those in FIG. 3 .
參照圖12(a)，重新對第1動作例進行說明。搬送機構18a將基板W自載具載置部12a1上之載具C搬送至迂迴搬送機構41。迂迴搬送機構41將基板W自搬送機構18a搬送至第2搬送機構57。第2搬送機構57將基板W自迂迴搬送機構41搬送至第2處理部61，且將基板W自第2處理部61搬送至後載置部77。第1搬送機構27將基板W自後載置部77搬送至第1處理部31，且將基板W自第1處理部31搬送至前載置部71。搬送機構18b將基板W自前載置部71搬送至載具載置部12b1上之載具C。
Referring to Fig. 12(a), the first operation example will be described again. The transport mechanism 18 a transports the substrate W from the carrier C on the carrier mounting portion 12 a 1 to the detour transport mechanism 41 . The detour transport mechanism 41 transports the substrate W from the transport mechanism 18 a to the second transport mechanism 57 . The second transport mechanism 57 transports the substrate W from the detour transport mechanism 41 to the second processing unit 61 , and transports the substrate W from the second processing unit 61 to the rear placement unit 77 . The first transport mechanism 27 transports the substrate W from the rear loading unit 77 to the first processing unit 31 , and transports the substrate W from the first processing unit 31 to the front loading unit 71 . The transport mechanism 18b transports the substrate W from the front loading unit 71 to the carrier C on the carrier loading unit 12b1.
於第1動作例中，基板處理裝置1於基板W形成2層塗膜。具體而言，基板處理裝置1於基板W之上表面形成第2塗膜，並於第2塗膜之上表面形成第1塗膜。
In the first operation example, the substrate processing apparatus 1 forms a two-layer coating film on the substrate W. FIG. Specifically, the substrate processing apparatus 1 forms the second coating film on the upper surface of the substrate W, and forms the first coating film on the upper surface of the second coating film.
例如，亦可第2塗膜為下層膜及中間膜之任一者，第1塗膜為中間膜及上層膜之任一者。例如，亦可第2塗膜為抗反射膜，第1塗膜為抗蝕膜。
For example, the second coating film may be any one of the lower film and the intermediate film, and the first coating film may be either the intermediate film or the upper film. For example, the second coating film may be an antireflection film, and the first coating film may be a resist film.
對迂迴搬送機構41之詳細動作例進行說明。第1迂迴可動部43a於第1交接位置自主搬送機構17接收1片或2片基板W。繼而，第1迂迴可動部43a將基板W搬送至第2搬送機構57。具體而言，第1迂迴可動部43a自第1交接位置移動至第2交接位置，將基板W交遞至第2搬送機構T2，然後返回至第1交接位置。於第1迂迴可動部43a將基板W向第2搬送機構57搬送期間，第2迂迴可動部43b於第1交接位置自主搬送機構17接收1片或2片基板W。於第2迂迴可動部43b自主搬送機構17接收基板W之後，第2迂迴可動部43b將基板W向第2搬送機構57搬送。於第2迂迴可動部43b將基板W向第2搬送機構57搬送期間，第1迂迴可動部43a於第1交接位置自主搬送機構17接收基板W。
A detailed operation example of the detour transport mechanism 41 will be described. The first detour movable part 43a receives one or two substrates W from the main transport mechanism 17 at the first delivery position. Then, the first detour movable portion 43 a transports the substrate W to the second transport mechanism 57 . Specifically, the first detour movable part 43a moves from the first delivery position to the second delivery position, delivers the substrate W to the second transport mechanism T2, and then returns to the first delivery position. While the first detour movable unit 43 a is transporting the substrate W to the second transport mechanism 57 , the second detour movable unit 43 b receives one or two substrates W from the main transport mechanism 17 at the first transfer position. After the second detour movable part 43 b receives the substrate W from the main conveyance mechanism 17 , the second detour movable part 43 b conveys the substrate W to the second conveyance mechanism 57 . While the second detour movable part 43 b is transporting the substrate W to the second conveyance mechanism 57 , the first detour movable part 43 a receives the substrate W from the main conveyance mechanism 17 at the first transfer position.
如此，第1迂迴可動部43a交替地反覆進行自主搬送機構17接收基板W之第1收取動作、及將基板W向第2搬送機構57搬送之第1搬送動作。第2迂迴可動部43b亦交替地反覆進行第1收取動作及第1搬送動作。第1迂迴可動部43a與第2迂迴可動部43b可相互獨立地移動。因此，於第1迂迴可動部43a及第2迂迴可動部43b之一者進行第1搬送動作時，第1迂迴可動部43a及第2迂迴可動部43b之另一者可進行第1收取動作。藉此，可縮短迂迴搬送機構41無法自主搬送機構17接收基板W之期間。因此，迂迴搬送機構41可高效率地將基板W自主搬送機構17搬送至第2搬送機構57。
In this manner, the first detour movable portion 43 a alternately repeats the first receiving operation of receiving the substrate W from the main conveying mechanism 17 and the first conveying operation of conveying the substrate W to the second conveying mechanism 57 . The second detour movable part 43b also alternately repeats the first collecting operation and the first conveying operation. The first detour movable part 43a and the second detour movable part 43b are movable independently of each other. Therefore, when one of the first detour movable part 43a and the second detour movable part 43b performs the first conveying operation, the other of the first detour movable part 43a and the second detour movable part 43b can perform the first receiving operation. Thereby, the period during which the detour transport mechanism 41 cannot receive the substrate W from the main transport mechanism 17 can be shortened. Therefore, the detour transport mechanism 41 can efficiently transport the substrate W from the main transport mechanism 17 to the second transport mechanism 57 .
參照圖12(b)，重新對第2動作例進行說明。搬送機構18a將基板W自載具載置部12a1上之載具C搬送至前載置部71。第1搬送機構27將基板W自前載置部71搬送至第1處理部31，且將基板W自第1處理部31搬送至後載置部77。第2搬送機構57將基板W自後載置部77搬送至第2處理部61，且將基板W自第2處理部61搬送至迂迴搬送機構41。迂迴搬送機構41將基板W自第2搬送機構57搬送至搬送機構18b。搬送機構18b將基板W自迂迴搬送機構41搬送至載具載置部12b1上之載具C。
Referring to Fig. 12(b), the second operation example will be described again. The transport mechanism 18 a transports the substrate W from the carrier C on the carrier mounting portion 12 a 1 to the front mounting portion 71 . The first transport mechanism 27 transports the substrate W from the front loading unit 71 to the first processing unit 31 , and transports the substrate W from the first processing unit 31 to the rear loading unit 77 . The second transport mechanism 57 transports the substrate W from the rear loading unit 77 to the second processing unit 61 , and transports the substrate W from the second processing unit 61 to the detour transport mechanism 41 . The detour transport mechanism 41 transports the substrate W from the second transport mechanism 57 to the transport mechanism 18b. The transport mechanism 18b transports the substrate W from the detour transport mechanism 41 to the carrier C on the carrier mounting portion 12b1.
第2動作例中，基板處理裝置1於基板W形成2層塗膜。具體而言，基板處理裝置1於基板W之上表面形成第1塗膜，並於第1塗膜之上表面形成第2塗膜。
In the second operation example, the substrate processing apparatus 1 forms a two-layer coating film on the substrate W. FIG. Specifically, the substrate processing apparatus 1 forms a first coating film on the upper surface of the substrate W, and forms a second coating film on the upper surface of the first coating film.
例如，亦可第1塗膜為下層膜及中間膜之任一者，第2塗膜為中間膜及上層膜之任一者。例如，亦可第1塗膜為抗反射膜，第2塗膜為抗蝕膜。
For example, the first coating film may be any one of the lower film and the intermediate film, and the second coating film may be either the intermediate film or the upper film. For example, the first coating film may be an antireflection film, and the second coating film may be a resist film.
對迂迴搬送機構41之詳細動作例進行說明。第1迂迴可動部43a於第2交接位置自第2搬送機構57接收1片或2片基板W。繼而，第1迂迴可動部43a將基板W搬送至主搬送機構17。具體而言，第1迂迴可動部43a自第2交接位置移動至第1交接位置，將基板W交遞至搬送機構18b，然後返回至第2交接位置。於第1迂迴可動部43a將基板W向主搬送機構17搬送期間，第2迂迴可動部43b於第2交接位置自第2搬送機構57接收1片或2片基板W。於第2迂迴可動部43b自第2搬送機構57接收基板W之後，第2迂迴可動部43b將基板W向主搬送機構17搬送。於第2迂迴可動部43b將基板W向
主搬送機構17搬送期間，第1迂迴可動部43a於第2交接位置自第2搬送機構57接收基板W。
A detailed operation example of the detour transport mechanism 41 will be described. The first detour movable part 43a receives one or two substrates W from the second transfer mechanism 57 at the second delivery position. Then, the first detour movable portion 43 a transports the substrate W to the main transport mechanism 17 . Specifically, the first detour movable part 43a moves from the second delivery position to the first delivery position, delivers the substrate W to the transport mechanism 18b, and then returns to the second delivery position. While the first detour movable unit 43 a is transporting the substrate W to the main transport mechanism 17 , the second detour movable unit 43 b receives one or two substrates W from the second transfer mechanism 57 at the second delivery position. After the second detour movable part 43 b receives the substrate W from the second conveyance mechanism 57 , the second detour movable part 43 b conveys the substrate W to the main conveyance mechanism 17 . At the second detour movable part 43b, the substrate W is directed toward
During the conveyance by the main conveyance mechanism 17 , the first detour movable portion 43 a receives the substrate W from the second conveyance mechanism 57 at the second delivery position.
如此，第1迂迴可動部43a交替地反覆進行自第2搬送機構57接收基板W之第2收取動作、及將基板W向主搬送機構17搬送之第2搬送動作。第2迂迴可動部43b亦交替地反覆進行第2收取動作及第2搬送動作。第1迂迴可動部43a與第2迂迴可動部43b可相互獨立地移動。因此，於第1迂迴可動部43a及第2迂迴可動部43b之一者進行第2搬送動作時，第1迂迴可動部43a及第2迂迴可動部43b之另一者可進行第2收取動作。藉此，可縮短迂迴搬送機構41無法自第2搬送機構57接收基板W之期間。因此，迂迴搬送機構41可高效率地將基板W自第2搬送機構57搬送至主搬送機構17。
In this manner, the first detour movable portion 43 a alternately repeats the second receiving operation of receiving the substrate W from the second conveying mechanism 57 and the second conveying operation of conveying the substrate W to the main conveying mechanism 17 . The second detour movable part 43b also alternately repeats the second collecting operation and the second conveying operation. The first detour movable part 43a and the second detour movable part 43b are movable independently of each other. Therefore, when one of the first detour movable part 43a and the second detour movable part 43b performs the second conveying operation, the other of the first detour movable part 43a and the second detour movable part 43b can perform the second receiving operation. Thereby, the period during which the detour transport mechanism 41 cannot receive the substrate W from the second transport mechanism 57 can be shortened. Therefore, the detour transport mechanism 41 can efficiently transport the substrate W from the second transport mechanism 57 to the main transport mechanism 17 .
參照圖12(c)，重新對第3動作例進行說明。搬送機構18a將第1基板W1自載具載置部12a1上之載具C搬送至前載置部71，並將第2基板W2自載具載置部12a1上之載具C搬送至迂迴搬送機構41。第1搬送機構27將第1基板W1自前載置部71搬送至第1處理部31，並將第1基板W1自第1處理部31搬送至前載置部71。迂迴搬送機構41將第2基板W2自搬送機構18a搬送至第2搬送機構57。第2搬送機構57將第2基板W2自迂迴搬送機構41搬送至第2處理部61，且將第2基板W2自第2處理部61搬送至迂迴搬送機構41。迂迴搬送機構41將第2基板W2自第2搬送機構57搬送至搬送機構18b。搬送機構18b將第1基板W1自前載置部71搬送至載具載置部12b1上之載具C，並將第2基板W2自迂迴搬送機構41搬送至載具載置部12b1上之載具C。
Referring to Fig. 12(c), the third operation example will be described again. The transfer mechanism 18a transfers the first substrate W1 from the carrier C on the carrier placement portion 12a1 to the front placement portion 71, and transfers the second substrate W2 from the carrier C on the carrier placement portion 12a1 to the roundabout transfer. agency41. The first transport mechanism 27 transports the first substrate W1 from the front loading unit 71 to the first processing unit 31 , and transports the first substrate W1 from the first processing unit 31 to the front loading unit 71 . The detour transport mechanism 41 transports the second substrate W2 from the transport mechanism 18 a to the second transport mechanism 57 . The second transport mechanism 57 transports the second substrate W2 from the detour transport mechanism 41 to the second processing unit 61 , and transports the second substrate W2 from the second processing unit 61 to the detour transport mechanism 41 . The detour transport mechanism 41 transports the second substrate W2 from the second transport mechanism 57 to the transport mechanism 18b. The transport mechanism 18b transports the first substrate W1 from the front loading section 71 to the carrier C on the carrier loading section 12b1, and transports the second substrate W2 from the roundabout transport mechanism 41 to the carrier on the carrier loading section 12b1. c.
於第3動作例中，基板處理裝置1於第1基板W1形成1層塗膜，並於第2基板W2形成1層塗膜。具體而言，基板處理裝置1於第1基板W1之上表面形成第1塗膜，並於第2基板W2之上表面形成第2塗膜。
In the third operation example, the substrate processing apparatus 1 forms a single-layer coating film on the first substrate W1, and forms a single-layer coating film on the second substrate W2. Specifically, the substrate processing apparatus 1 forms a first coating film on the upper surface of the first substrate W1, and forms a second coating film on the upper surface of the second substrate W2.
對迂迴搬送機構41之詳細動作例進行說明。第1迂迴可動部43a反覆進行自主搬送機構17接收第2基板W2之第1收取動作、將第2基板W2向第2搬送機構57搬送之第1搬送動作、自第2搬送機構57接收第2基板W2之第2收取動作、及將第2基板W2向主搬送機構17搬送之第2搬送動作。第2迂迴可動部43b亦反覆進行第1收取動作、第1搬送動作、第2收取動作及第1搬送動作。第1迂迴可動部43a與第2迂迴可動部43b可相互獨立地移動。因此，可縮短迂迴搬送機構41無法自主搬送機構17接收基板W之期間。可縮短迂迴搬送機構41無法自第2搬送機構57接收基板W之期間。因此，迂迴搬送機構41可於主搬送機構17與第2搬送機構57之間高效率地搬送基板W。
A detailed operation example of the detour transport mechanism 41 will be described. The first detour movable part 43a repeatedly performs the first collecting operation of receiving the second substrate W2 from the main conveying mechanism 17, the first conveying operation of conveying the second substrate W2 to the second conveying mechanism 57, and receiving the second substrate W2 from the second conveying mechanism 57. The second pick-up operation of the substrate W2 and the second transfer operation of transferring the second substrate W2 to the main transfer mechanism 17 . The second detour movable part 43b also repeatedly performs the first collecting operation, the first conveying operation, the second collecting operation, and the first conveying operation. The first detour movable part 43a and the second detour movable part 43b are movable independently of each other. Therefore, the period during which the detour transport mechanism 41 cannot receive the substrate W from the main transport mechanism 17 can be shortened. The period during which the detour transport mechanism 41 cannot receive the substrate W from the second transport mechanism 57 can be shortened. Therefore, the detour transport mechanism 41 can efficiently transport the substrate W between the main transport mechanism 17 and the second transport mechanism 57 .
<第1實施形態之其他效果>
<Other effects of the first embodiment>
第1實施形態之主要效果如上所述。以下，對第1實施形態之其他效果進行說明。
The main effects of the first embodiment are as described above. Next, other effects of the first embodiment will be described.
主搬送機構17與迂迴搬送機構41直接地交接基板W。更具體而言，於主搬送機構17與迂迴搬送機構41之間搬送基板W時，主搬送機構17與迂迴搬送機構41同時接觸相同基板W。藉此，主搬送機構17及迂迴搬送機
構41不將基板W暫時載置於與主搬送機構17及迂迴搬送機構41分開之構件(例如載置部)，而主搬送機構17與迂迴搬送機構41可相互搬送基板W。因此，可於主搬送機構17與迂迴搬送機構41之間高效率地搬送基板W。
The main transport mechanism 17 and the detour transport mechanism 41 directly deliver the substrate W. More specifically, when the substrate W is transferred between the main transfer mechanism 17 and the detour transfer mechanism 41 , the main transfer mechanism 17 and the detour transfer mechanism 41 contact the same substrate W at the same time. Thereby, the main conveying mechanism 17 and the winding conveyer
The mechanism 41 does not temporarily place the substrate W on a member (for example, a loading unit) separate from the main conveyance mechanism 17 and the detour conveyance mechanism 41 , but the main conveyance mechanism 17 and the detour conveyance mechanism 41 can mutually convey the substrate W. Therefore, the substrate W can be efficiently transferred between the main transfer mechanism 17 and the detour transfer mechanism 41 .
基板W之接觸主搬送機構17之部分P1與基板W之接觸迂迴搬送機構41之部分Q不同。因此，可適當地防止於主搬送機構17與迂迴搬送機構41同時接觸相同基板W時主搬送機構17與迂迴搬送機構41發生干涉。
The portion P1 of the substrate W that contacts the main transport mechanism 17 is different from the portion Q of the substrate W that contacts the detour transport mechanism 41 . Therefore, interference between the main transport mechanism 17 and the detour transport mechanism 41 can be suitably prevented when the main transport mechanism 17 and the detour transport mechanism 41 contact the same substrate W at the same time.
主搬送機構17之保持部19d、19e分別於俯視下具有大致U字形狀或大致Y字形狀。迂迴搬送機構41之保持部44c、44e分別於俯視下具有大致I字形狀。因此，可適當地防止於主搬送機構17與迂迴搬送機構41同時接觸相同基板W時主搬送機構17與迂迴搬送機構41發生干涉。
The holding parts 19d and 19e of the main transport mechanism 17 each have a substantially U-shape or a substantially Y-shape in plan view. The holding parts 44c and 44e of the roundabout conveyance mechanism 41 each have a substantially I-shape in plan view. Therefore, interference between the main transport mechanism 17 and the detour transport mechanism 41 can be suitably prevented when the main transport mechanism 17 and the detour transport mechanism 41 contact the same substrate W at the same time.
第1交接位置於俯視下與第2交接位置大致相同。因此，可抑制主搬送機構17移動至第1交接位置之量。具體而言，可將主搬送機構17移動至第1交接位置時之主搬送機構17之水平方向之移動量抑制於與主搬送機構17移動至第2交接位置時之主搬送機構17之水平方向之移動量相同之程度。因此，主搬送機構17與迂迴搬送機構41可容易地相互搬送基板W。
The first transfer position is substantially the same as the second transfer position in plan view. Therefore, the amount by which the main transport mechanism 17 moves to the first delivery position can be suppressed. Specifically, the amount of movement in the horizontal direction of the main transport mechanism 17 when the main transport mechanism 17 moves to the first delivery position can be suppressed to be the same as the horizontal direction of the main transport mechanism 17 when the main transport mechanism 17 moves to the second delivery position. the same amount of movement. Therefore, the main transport mechanism 17 and the detour transport mechanism 41 can easily transport the substrate W to each other.
第1交接位置於俯視下與前載置部71之位置大致相同。因此，可抑制主搬送機構17移動至第1交接位置之量。因此，主搬送機構17與迂迴搬送機構41可容易地相互搬送基板W。
The first transfer position is substantially the same as the position of the front loading portion 71 in plan view. Therefore, the amount by which the main transport mechanism 17 moves to the first delivery position can be suppressed. Therefore, the main transport mechanism 17 and the detour transport mechanism 41 can easily transport the substrate W to each other.
第2搬送機構57與迂迴搬送機構41直接地交接基板。更具體而言，於第2搬送機構57與迂迴搬送機構41之間搬送基板W時，第2搬送機構57與迂迴搬送機構41同時接觸相同基板W。因此，可於第2搬送機構57與迂迴搬送機構41之間高效率地搬送基板W。
The second transport mechanism 57 directly transfers the substrate to the detour transport mechanism 41 . More specifically, when the substrate W is transferred between the second transfer mechanism 57 and the detour transfer mechanism 41 , the second transfer mechanism 57 and the detour transfer mechanism 41 contact the same substrate W at the same time. Therefore, the substrate W can be efficiently transferred between the second transfer mechanism 57 and the detour transfer mechanism 41 .
基板W之接觸第2搬送機構57之部分P2與基板W之接觸迂迴搬送機構41之部分Q不同。因此，可適當地防止於第2搬送機構57與迂迴搬送機構41同時接觸相同基板W時第2搬送機構57與迂迴搬送機構41發生干涉。
The portion P2 of the substrate W that contacts the second transport mechanism 57 is different from the portion Q of the substrate W that contacts the detour transport mechanism 41 . Therefore, it is possible to appropriately prevent the second transport mechanism 57 from interfering with the detour transport mechanism 41 when the second transport mechanism 57 and the detour transport mechanism 41 contact the same substrate W at the same time.
第2搬送機構57之保持部29d、29e分別於俯視下具有大致U字形狀或大致Y字形狀。迂迴搬送機構41之保持部44c、44e分別於俯視下具有大致I字形狀。因此，可適當地防止於第2搬送機構57與迂迴搬送機構41同時接觸相同基板W時第2搬送機構57與迂迴搬送機構41發生干涉。
The holding parts 29d and 29e of the second transport mechanism 57 each have a substantially U-shape or a substantially Y-shape in plan view. The holding parts 44c and 44e of the roundabout conveyance mechanism 41 each have a substantially I-shape in plan view. Therefore, it is possible to appropriately prevent the second transport mechanism 57 from interfering with the detour transport mechanism 41 when the second transport mechanism 57 and the detour transport mechanism 41 contact the same substrate W at the same time.
第3交接位置於俯視下與第4交接位置大致相同。因此，可抑制第2搬送機構57移動至第3交接位置之量。具體而言，可將第2搬送機構57移動至第3交接位置時之第2搬送機構57之水平方向之移動量抑制於與第2搬送機構57移動至第4交接位置時之第2搬送機構57之水平方向之移動量相同之程度。因此，第2搬送機構57與迂迴搬送機構41可容易地相互搬送基板W。
The third transfer position is substantially the same as the fourth transfer position in plan view. Therefore, the amount by which the second transport mechanism 57 moves to the third delivery position can be suppressed. Specifically, the amount of movement in the horizontal direction of the second conveying mechanism 57 when the second conveying mechanism 57 moves to the third delivery position can be suppressed from that of the second conveying mechanism 57 when it moves to the fourth delivery position. The amount of movement in the horizontal direction of 57 is the same level. Therefore, the second transport mechanism 57 and the detour transport mechanism 41 can easily transport the substrate W to each other.
第3交接位置於俯視下與後載置部77之位置大致相同。因此，可抑制第2搬送機構57移動至第3交接位置之量。因此，第2搬送機構57與迂迴搬
送機構41可容易地相互搬送基板W。
The third delivery position is substantially the same as the position of the rear loading portion 77 in plan view. Therefore, the amount by which the second transport mechanism 57 moves to the third delivery position can be suppressed. Therefore, the second transport mechanism 57 and the detour transport
The transport mechanism 41 can easily transport the substrates W to each other.
被迂迴搬送機構41保持之基板W之至少一部分位於第1搬送空間23。因此，被迂迴搬送機構41保持之基板W周圍之環境與被第1搬送機構27保持之基板W周圍之環境相等。因此，可容易地將被迂迴搬送機構41保持之基板W周圍之環境維持潔淨。
At least a part of the substrate W held by the detour transport mechanism 41 is located in the first transport space 23 . Therefore, the environment around the substrate W held by the detour transport mechanism 41 is equal to the environment around the substrate W held by the first transport mechanism 27 . Therefore, the environment around the substrate W held by the detour transport mechanism 41 can be easily kept clean.
供氣單元24設置於第1搬送空間23之上方，向第1搬送空間23供給氣體。排氣單元25設置於第1搬送空間23之下方，排出第1搬送空間23之氣體。藉此，第1搬送空間23維持潔淨。因此，不僅可適當地保護由第1搬送機構27保持之基板W亦可適當地保護由迂迴搬送機構41保持之基板W免受微粒或塵埃等影響。
The gas supply unit 24 is installed above the first conveyance space 23 and supplies gas to the first conveyance space 23 . The exhaust unit 25 is provided below the first conveying space 23 and exhausts the gas in the first conveying space 23 . Thereby, the 1st conveyance space 23 is kept clean. Therefore, not only the substrate W held by the first conveying mechanism 27 but also the substrate W held by the detour conveying mechanism 41 can be appropriately protected from particles, dust, and the like.
迂迴搬送機構41之至少一部分配置於第1搬送空間23。換言之，迂迴搬送機構41之至少一部分配置於與第1搬送機構27相同之空間(即第1搬送空間23)。因此，可容易地將迂迴搬送機構41周圍之環境維持潔淨。因此，可適當地保護迂迴搬送機構41搬送之基板W免受微粒或塵埃等影響。
At least a part of the detour transport mechanism 41 is arranged in the first transport space 23 . In other words, at least a part of the detour transport mechanism 41 is arranged in the same space as the first transport mechanism 27 (that is, the first transport space 23 ). Therefore, the environment around the roundabout conveyance mechanism 41 can be easily maintained clean. Therefore, the substrate W transported by the detour transport mechanism 41 can be appropriately protected from particles, dust, and the like.
將第1搬送空間23之一部分活用為迂迴搬送機構41之設置空間。因此，可適當地抑制基板處理裝置1之大型化。
A part of the first conveyance space 23 is utilized as an installation space for the detour conveyance mechanism 41 . Therefore, the enlargement of the substrate processing apparatus 1 can be suppressed suitably.
迂迴搬送機構41之至少一部分於俯視下配置於與第1非液體處理部32重疊之位置。因此，可抑制基板處理裝置1之佔據面積(俯視下之基板處理
裝置1之設置面積)增大。
At least a part of the detour transport mechanism 41 is arranged at a position overlapping with the first non-liquid processing unit 32 in plan view. Therefore, the occupied area of the substrate processing apparatus 1 (substrate processing in plan view) can be suppressed.
The installation area of the device 1) increases.
上下方向Z上之第1非液體處理部32之長度L32小於上下方向Z上之第1搬送空間23之長度L23。因此，藉由將迂迴搬送機構41之至少一部分於俯視下配置於與第1非液體處理部32重疊之位置，可抑制上下方向Z上之基板處理裝置1之長度增大。
The length L32 of the first non-liquid processing section 32 in the vertical direction Z is smaller than the length L23 of the first transfer space 23 in the vertical direction Z. Therefore, by arranging at least a part of the detour transport mechanism 41 at a position overlapping with the first non-liquid processing unit 32 in plan view, it is possible to suppress an increase in the length of the substrate processing apparatus 1 in the vertical direction Z.
上下方向Z上之第1非液體處理部32之長度L32小於上下方向Z上之第1液體處理部35之長度L35。因此，藉由將迂迴搬送機構41之至少一部分於俯視下配置於與第1非液體處理部32重疊之位置，可抑制上下方向Z上之基板處理裝置1之長度增大。藉由將迂迴搬送機構41於俯視下配置於不與第1液體處理部35重疊之位置，可抑制上下方向Z上之基板處理裝置1之長度增大。
The length L32 of the first non-liquid processing part 32 in the vertical direction Z is smaller than the length L35 of the first liquid processing part 35 in the vertical direction Z. Therefore, by arranging at least a part of the detour transport mechanism 41 at a position overlapping with the first non-liquid processing unit 32 in plan view, it is possible to suppress an increase in the length of the substrate processing apparatus 1 in the vertical direction Z. By arranging the detour transport mechanism 41 at a position not overlapping with the first liquid processing unit 35 in plan view, it is possible to suppress an increase in the length of the substrate processing apparatus 1 in the vertical direction Z.
上下方向Z上之第1非液體處理部32之長度L32小於上下方向Z上之第2非液體處理部62之長度L62。因此，藉由將迂迴搬送機構41之至少一部分於俯視下配置於與第1非液體處理部32重疊之位置，可抑制上下方向Z上之基板處理裝置1之長度增大。藉由將迂迴搬送機構41於俯視下配置於不與第2非液體處理部62重疊之位置，可抑制上下方向Z上之基板處理裝置1之長度增大。
The length L32 of the first non-liquid processing part 32 in the vertical direction Z is smaller than the length L62 of the second non-liquid processing part 62 in the vertical direction Z. Therefore, by arranging at least a part of the detour transport mechanism 41 at a position overlapping with the first non-liquid processing unit 32 in plan view, it is possible to suppress an increase in the length of the substrate processing apparatus 1 in the vertical direction Z. By arranging the detour transport mechanism 41 at a position not overlapping the second non-liquid processing unit 62 in a plan view, the increase in length of the substrate processing apparatus 1 in the vertical direction Z can be suppressed.
第1處理部31所包含之非液體處理單元之數量少於第2處理部61所包含之非液體處理單元之數量。因此，第1非液體處理部32之設置空間小於
第2非液體處理部62之設置空間。因此，藉由將迂迴搬送機構41之至少一部分於俯視下配置於與第1非液體處理部32重疊之位置，可抑制上下方向Z上之基板處理裝置1之長度增大。藉由將迂迴搬送機構41於俯視下配置於不與第2非液體處理部62重疊之位置，可抑制上下方向Z上之基板處理裝置1之長度增大。
The number of non-liquid processing units included in the first processing unit 31 is smaller than the number of non-liquid processing units included in the second processing unit 61 . Therefore, the installation space of the first non-liquid processing part 32 is smaller than
The installation space of the second non-liquid processing unit 62 . Therefore, by arranging at least a part of the detour transport mechanism 41 at a position overlapping with the first non-liquid processing unit 32 in plan view, it is possible to suppress an increase in the length of the substrate processing apparatus 1 in the vertical direction Z. By arranging the detour transport mechanism 41 at a position not overlapping the second non-liquid processing unit 62 in a plan view, the increase in length of the substrate processing apparatus 1 in the vertical direction Z can be suppressed.
迂迴搬送機構41跨及第1非液體處理部32下方之空間40及第1搬送空間23而配置。因此，可抑制基板處理裝置1之佔據面積增大。
The detour transport mechanism 41 is arranged across the space 40 below the first non-liquid processing unit 32 and the first transport space 23 . Therefore, an increase in the occupied area of the substrate processing apparatus 1 can be suppressed.
第1非液體處理部32鄰接於第1搬送空間23，且第1非液體處理部32配置於高於第1搬送空間23之下端23c之高度位置。因此，第1非液體處理部32下方之空間40與第1搬送空間23連續。因此，可容易地確保迂迴搬送機構41之設置空間。
The first non-liquid processing unit 32 is adjacent to the first transfer space 23 , and the first non-liquid processing unit 32 is disposed at a height higher than the lower end 23 c of the first transfer space 23 . Therefore, the space 40 below the first non-liquid processing unit 32 is continuous with the first transfer space 23 . Therefore, the installation space of the roundabout conveyance mechanism 41 can be ensured easily.
第1非液體處理部32下方之空間40與第1搬送空間23之第1側部23a相接。第1搬送機構27之第1支持部28配置於第1搬送空間23之第2側部23b。即，第1支持部28不配置於空間40與第1搬送空間23之間。因此，第1搬送空間23與空間40無障礙地連續。即，藉由空間40及第1搬送空間23，可形成1個相對較大之空間。因此，可容易地確保迂迴搬送機構41之設置空間。
The space 40 below the first non-liquid processing unit 32 is in contact with the first side portion 23 a of the first transfer space 23 . The 1st support part 28 of the 1st conveyance mechanism 27 is arrange|positioned in the 2nd side part 23b of the 1st conveyance space 23. As shown in FIG. That is, the first support portion 28 is not disposed between the space 40 and the first transfer space 23 . Therefore, the 1st conveyance space 23 and the space 40 continue without hindrance. That is, a relatively large space can be formed by the space 40 and the first conveyance space 23 . Therefore, the installation space of the roundabout conveyance mechanism 41 can be ensured easily.
迂迴搬送機構41配置於與第1非液體處理部32之下端32a同等或低於該下端32a之位置。因此，可適當地防止迂迴搬送機構41與第1非液體處
理部32發生干涉。
The detour transport mechanism 41 is disposed at a position equal to or lower than the lower end 32a of the first non-liquid processing unit 32 . Therefore, it is possible to appropriately prevent the detour transport mechanism 41 from contacting the first non-liquid place.
Processing unit 32 interferes.
迂迴搬送機構41配置於與第1液體處理部35之下端35a同等或高於該下端35a之位置。因此，可抑制上下方向Z上之基板處理裝置1之長度增大。
The roundabout transport mechanism 41 is arranged at a position equal to or higher than the lower end 35a of the first liquid processing unit 35 . Therefore, an increase in the length of the substrate processing apparatus 1 in the vertical direction Z can be suppressed.
第1可動部29不移動至第1搬送空間23之底部23d，而第1可動部29進入第1非液體處理部32及第1液體處理部35。即，第1可動部29不移動至低於第1非液體處理部32之下端32a之高度位置，而第1可動部29進入第1非液體處理部32及第1液體處理部35。迂迴搬送機構41配置於與第1非液體處理部32之下端32a同等或低於該下端32a之位置。因此，可適當地防止迂迴搬送機構41與第1可動部29發生干涉。
The first movable part 29 does not move to the bottom 23 d of the first transfer space 23 , but the first movable part 29 enters the first non-liquid processing part 32 and the first liquid processing part 35 . That is, the first movable part 29 does not move to a height position lower than the lower end 32 a of the first non-liquid processing part 32 , but the first movable part 29 enters the first non-liquid processing part 32 and the first liquid processing part 35 . The detour transport mechanism 41 is disposed at a position equal to or lower than the lower end 32a of the first non-liquid processing unit 32 . Therefore, it is possible to appropriately prevent the detour conveyance mechanism 41 from interfering with the first movable portion 29 .
迂迴可動部43之至少一部分配置於第1搬送空間23之內部。因此，可容易地使被迂迴可動部43保持之基板W位於第1搬送空間23之內部。藉此，可容易地將被迂迴搬送機構41之基板W周圍之環境維持潔淨。
At least a part of the detour movable part 43 is arranged inside the first conveyance space 23 . Therefore, the substrate W held by the detour movable portion 43 can be easily positioned inside the first transfer space 23 . Thereby, the environment around the substrate W that is subjected to the detour transport mechanism 41 can be easily maintained clean.
迂迴支持部42於俯視下配置於與第1非液體處理部32重疊之位置。因此，可容易地將迂迴可動部43之至少一部分設置於第1搬送空間23之內部。
The detour supporting part 42 is arranged at a position overlapping with the first non-liquid processing part 32 in plan view. Therefore, at least a part of the detour movable part 43 can be easily installed inside the first conveyance space 23 .
迂迴支持部42不設置於第1搬送空間23。因此，可於第1搬送空間23中容易地確保迂迴可動部43之至少一部分設置空間。
The detour support unit 42 is not provided in the first conveyance space 23 . Therefore, at least a part of installation space of the detour movable part 43 can be easily ensured in the first conveyance space 23 .
迂迴可動部43具備水平移動部44a、及保持部44c、44e。因此，迂迴可動部43可於主搬送機構17與第2搬送機構57之間適當地搬送基板W。
The detour movable part 43 is provided with the horizontal movement part 44a, and holding part 44c, 44e. Therefore, the detour movable part 43 can appropriately transport the substrate W between the main transport mechanism 17 and the second transport mechanism 57 .
迂迴可動部43具備臂部44b、44d。因此，保持部44c、44e可相對於水平移動部44a旋轉。因此，保持部44c、44e可移動至較水平移動部44a更靠前方。因此，迂迴搬送機構41可將基板W適當地交遞至主搬送機構17，且可自主搬送機構17適當地接收基板W。進而，保持部44c、44e可移動至較水平移動部44a更靠後方。因此，迂迴搬送機構41可將基板W適當地交遞至第2搬送機構57，且可自第2搬送機構57適當地接收基板W。
The detour movable part 43 includes arm parts 44b and 44d. Therefore, the holding parts 44c, 44e are rotatable relative to the horizontal moving part 44a. Therefore, the holding parts 44c and 44e can move forward rather than the horizontal moving part 44a. Therefore, the detour transport mechanism 41 can properly deliver the substrate W to the main transport mechanism 17 and can properly receive the substrate W from the main transport mechanism 17 . Furthermore, the holding parts 44c and 44e can move to the back with respect to the horizontal movement part 44a. Therefore, the detour transport mechanism 41 can properly deliver the substrate W to the second transport mechanism 57 and can properly receive the substrate W from the second transport mechanism 57 .
迂迴可動部43除具備第1迂迴可動部43a以外還具備第2迂迴可動部43b。因此，可容易地增加迂迴搬送機構41於每單位時間內所能搬送之基板W之片數。
The detour movable part 43 is provided with the 2nd detour movable part 43b in addition to the 1st detour movable part 43a. Therefore, the number of substrates W that can be transported per unit time by the detour transport mechanism 41 can be easily increased.
第2迂迴可動部43b可與第1迂迴可動部43a獨立地移動。具體而言，第2迂迴可動部43b之水平移動部44a可與第1迂迴可動部43a之水平移動部44a獨立地移動。因此，迂迴搬送機構41可於主搬送機構17與第2搬送機構57之間高效率地搬送基板W。
The second detour movable part 43b is movable independently of the first detour movable part 43a. Specifically, the horizontal movement part 44a of the second detour movable part 43b can move independently of the horizontal movement part 44a of the first detour movable part 43a. Therefore, the detour transport mechanism 41 can efficiently transport the substrate W between the main transport mechanism 17 and the second transport mechanism 57 .
迂迴搬送機構41之構造相對較簡單。具體而言，迂迴搬送機構41不具備用以使保持部44c、44e於寬度方向Y上平行移動之構成。迂迴搬送機構41不具備用以使保持部44c、44e於上下方向Z上平行移動之構成。因
此，可容易地使迂迴搬送機構41小型化。例如，可容易地使上下方向Z上之迂迴搬送機構41之長度小於上下方向Z上之第1搬送機構27之長度。因此，可適當地抑制基板處理裝置1之大型化。
The structure of the roundabout conveying mechanism 41 is relatively simple. Specifically, the detour conveyance mechanism 41 does not have a structure for parallelly moving the holding parts 44c and 44e in the width direction Y. As shown in FIG. The detour conveyance mechanism 41 does not have the structure for parallel-moving the holding part 44c, 44e in the up-down direction Z. As shown in FIG. because
Therefore, the roundabout conveyance mechanism 41 can be easily miniaturized. For example, the length of the detour transport mechanism 41 in the vertical direction Z can be easily made smaller than the length of the first transport mechanism 27 in the vertical direction Z. Therefore, the enlargement of the substrate processing apparatus 1 can be suppressed suitably.
[第2實施形態]
[Second Embodiment]
參照圖式，對第2實施形態之基板處理裝置1進行說明。再者，對於與第1實施形態相同之構成標註同符號，藉此省略詳細之說明。
A substrate processing apparatus 1 according to a second embodiment will be described with reference to the drawings. In addition, the same code|symbol is attached|subjected to the same structure as 1st Embodiment, and detailed description is abbreviate|omitted.
<基板處理裝置之概要>
<Overview of substrate processing equipment>
圖13係第2實施形態之基板處理裝置1之概念圖。基板處理裝置1除具備第1處理部31及第2處理部61以外還具備第3處理部91及第4處理部131。基板處理裝置1除具備主搬送機構17、第1搬送機構27、迂迴搬送機構41及第2搬送機構57以外還具備第3搬送機構87及第4搬送機構127。第3處理部91配置於第1處理部31之下方。第3處理部91對基板W進行處理。第3搬送機構87配置於第1搬送機構27及迂迴搬送機構41之下方。第3搬送機構87將基板W搬送至第3處理部91。第4處理部131配置於第2處理部61之下方。第4處理部131對基板W進行處理。第4搬送機構127配置於第2搬送機構57之下方。第4搬送機構127將基板W搬送至第4處理部131。
FIG. 13 is a conceptual diagram of a substrate processing apparatus 1 according to the second embodiment. The substrate processing apparatus 1 includes a third processing unit 91 and a fourth processing unit 131 in addition to the first processing unit 31 and the second processing unit 61 . The substrate processing apparatus 1 includes a third transport mechanism 87 and a fourth transport mechanism 127 in addition to the main transport mechanism 17 , the first transport mechanism 27 , the detour transport mechanism 41 , and the second transport mechanism 57 . The third processing unit 91 is arranged below the first processing unit 31 . The third processing unit 91 processes the substrate W. As shown in FIG. The third conveying mechanism 87 is disposed below the first conveying mechanism 27 and the detour conveying mechanism 41 . The third transport mechanism 87 transports the substrate W to the third processing unit 91 . The fourth processing unit 131 is arranged below the second processing unit 61 . The fourth processing unit 131 processes the substrate W. The 4th conveyance mechanism 127 is arrange|positioned below the 2nd conveyance mechanism 57. As shown in FIG. The fourth transport mechanism 127 transports the substrate W to the fourth processing unit 131 .
基板處理裝置1具備第5處理部111、第5搬送機構107、第6處理部151及第6搬送機構147。第5處理部111配置於第1處理部31之上方。第5處理部111對基板W進行處理。第5搬送機構107配置於第1搬送機構27及迂迴搬送機構41之上方。第5搬送機構107將基板W搬送至第5處理部111。
第6處理部151配置於第2處理部61之上方。第6處理部151對基板W進行處理。第6搬送機構147配置於第2搬送機構57之上方。第6搬送機構147將基板W搬送至第6處理部151。
The substrate processing apparatus 1 includes a fifth processing unit 111 , a fifth transport mechanism 107 , a sixth processing unit 151 , and a sixth transport mechanism 147 . The fifth processing unit 111 is arranged above the first processing unit 31 . The fifth processing unit 111 processes the substrate W. The fifth conveying mechanism 107 is disposed above the first conveying mechanism 27 and the detour conveying mechanism 41 . The fifth transport mechanism 107 transports the substrate W to the fifth processing unit 111 .
The sixth processing unit 151 is arranged above the second processing unit 61 . The sixth processing unit 151 processes the substrate W. The sixth conveyance mechanism 147 is disposed above the second conveyance mechanism 57 . The sixth transport mechanism 147 transports the substrate W to the sixth processing unit 151 .
主搬送機構17可移動至第1搬送機構27之高度位置、迂迴搬送機構41之高度位置、第3搬送機構87之高度位置及第5搬送機構107之高度位置。即，主搬送機構17及第1搬送機構27以於水平方向上排列之方式配置。主搬送機構17以與迂迴搬送機構41於水平方向上排列之方式配置。主搬送機構17及第3搬送機構87以於水平方向上排列之方式配置。主搬送機構17及第5搬送機構107以於水平方向上排列之方式配置。總之，第1搬送機構27、迂迴搬送機構41、第3搬送機構87、第5搬送機構107分別配置於與主搬送機構17大致相同之高度位置。主搬送機構17與第1搬送機構27可相互搬送基板W。主搬送機構17與迂迴搬送機構41可相互搬送基板W。主搬送機構17與第3搬送機構87可相互搬送基板W。主搬送機構17與第5搬送機構107可相互搬送基板W。
The main transport mechanism 17 can move to the height position of the first transport mechanism 27 , the height position of the detour transport mechanism 41 , the height position of the third transport mechanism 87 and the height position of the fifth transport mechanism 107 . That is, the main conveyance mechanism 17 and the 1st conveyance mechanism 27 are arrange|positioned so that they may line up in a horizontal direction. The main conveyance mechanism 17 is arranged so as to be aligned with the detour conveyance mechanism 41 in the horizontal direction. The main conveyance mechanism 17 and the 3rd conveyance mechanism 87 are arrange|positioned so that they may line up in a horizontal direction. The main conveyance mechanism 17 and the 5th conveyance mechanism 107 are arrange|positioned so that they may line up in a horizontal direction. In short, the first conveying mechanism 27 , the detour conveying mechanism 41 , the third conveying mechanism 87 , and the fifth conveying mechanism 107 are arranged at approximately the same height positions as the main conveying mechanism 17 . The main transport mechanism 17 and the first transport mechanism 27 can transport the substrate W mutually. The main transport mechanism 17 and the detour transport mechanism 41 can mutually transport the substrate W. The main transport mechanism 17 and the third transport mechanism 87 can transport the substrate W mutually. The main transport mechanism 17 and the fifth transport mechanism 107 can transport the substrate W mutually.
主搬送機構17與第2搬送機構57無法相互搬送基板W。主搬送機構17與第4搬送機構127無法相互搬送基板W。主搬送機構17與第6搬送機構147無法相互搬送基板W。具體而言，主搬送機構17無法將基板W交遞至第2搬送機構57、第4搬送機構127及第6搬送機構147。主搬送機構17無法自第2搬送機構57、第4搬送機構127及第6搬送機構147接收基板W。
The main transport mechanism 17 and the second transport mechanism 57 cannot mutually transport the substrate W. The main transport mechanism 17 and the fourth transport mechanism 127 cannot mutually transport the substrate W. The main transport mechanism 17 and the sixth transport mechanism 147 cannot mutually transport the substrate W. Specifically, the main transport mechanism 17 cannot deliver the substrate W to the second transport mechanism 57 , the fourth transport mechanism 127 , and the sixth transport mechanism 147 . The main transport mechanism 17 cannot receive the substrate W from the second transport mechanism 57 , the fourth transport mechanism 127 , and the sixth transport mechanism 147 .
基板處理裝置1具備中繼搬送機構167。中繼搬送機構167搬送基板
W。中繼搬送機構167可移動至第1搬送機構27與第2搬送機構57之間之位置。中繼搬送機構167可移動至迂迴搬送機構41與第2搬送機構57之間之位置。中繼搬送機構167可移動至第3搬送機構87與第4搬送機構127之間之位置。中繼搬送機構167可移動至第5搬送機構107與第6搬送機構147之間之位置。中繼搬送機構167可於第1搬送機構27、第2搬送機構57、第3搬送機構87、第4搬送機構127、第5搬送機構107、第6搬送機構147及迂迴搬送機構41之間搬送基板W。
The substrate processing apparatus 1 includes a relay transport mechanism 167 . Relay conveying mechanism 167 conveys the substrate
W. The relay transport mechanism 167 can move to a position between the first transport mechanism 27 and the second transport mechanism 57 . The relay transport mechanism 167 can move to a position between the detour transport mechanism 41 and the second transport mechanism 57 . The relay transport mechanism 167 can move to a position between the third transport mechanism 87 and the fourth transport mechanism 127 . The relay transport mechanism 167 can move to a position between the fifth transport mechanism 107 and the sixth transport mechanism 147 . The relay conveying mechanism 167 can convey between the first conveying mechanism 27, the second conveying mechanism 57, the third conveying mechanism 87, the fourth conveying mechanism 127, the fifth conveying mechanism 107, the sixth conveying mechanism 147, and the detour conveying mechanism 41. Substrate W.
第2搬送機構57可移動至第1搬送機構27之高度位置及迂迴搬送機構41之高度位置。即，第1搬送機構27及第2搬送機構57以於水平方向上排列之方式配置。迂迴搬送機構41及第2搬送機構57以於水平方向上排列之方式配置。總之，第1搬送機構27及迂迴搬送機構41分別配置於與第2搬送機構57大致相同之高度位置。第4搬送機構127可移動至第3搬送機構87之高度位置。即，第3搬送機構87及第4搬送機構127以於水平方向上排列之方式配置。第3搬送機構87配置於與第4搬送機構127大致相同之高度位置。第6搬送機構147可移動至第5搬送機構107之高度位置。即，第5搬送機構107及第6搬送機構147以於水平方向上排列之方式配置。第5搬送機構107配置於與第6搬送機構147大致相同之高度位置。
The second conveying mechanism 57 can move to the height position of the first conveying mechanism 27 and the height position of the detour conveying mechanism 41 . That is, the 1st conveyance mechanism 27 and the 2nd conveyance mechanism 57 are arrange|positioned so that they may line up in a horizontal direction. The roundabout conveyance mechanism 41 and the second conveyance mechanism 57 are arranged so as to be aligned in the horizontal direction. In short, the first conveying mechanism 27 and the detour conveying mechanism 41 are arranged at substantially the same height positions as the second conveying mechanism 57 . The fourth conveying mechanism 127 can move to the height position of the third conveying mechanism 87 . That is, the 3rd conveyance mechanism 87 and the 4th conveyance mechanism 127 are arrange|positioned so that they may line up in a horizontal direction. The third conveyance mechanism 87 is arranged at substantially the same height position as the fourth conveyance mechanism 127 . The sixth conveying mechanism 147 can move to the height position of the fifth conveying mechanism 107 . That is, the 5th conveyance mechanism 107 and the 6th conveyance mechanism 147 are arrange|positioned so that they may line up in a horizontal direction. The fifth conveyance mechanism 107 is arranged at substantially the same height position as the sixth conveyance mechanism 147 .
對基板處理裝置1之2個動作例進行例示。圖14(a)係模式性地表示基板處理裝置1之第4動作例之圖。圖14(b)係模式性地表示基板處理裝置1之第5動作例之圖。圖14(a)、14(b)模式性地表示基板W通過之基板處理裝置1之元件。
Two operation examples of the substrate processing apparatus 1 will be illustrated. FIG. 14( a ) is a diagram schematically showing a fourth operation example of the substrate processing apparatus 1 . FIG. 14( b ) is a diagram schematically showing a fifth operation example of the substrate processing apparatus 1 . 14(a) and 14(b) schematically show components of the substrate processing apparatus 1 through which the substrate W passes.
參照圖14(a)。於第4動作例中，將第1基板W1依序搬送至第4處理部131、第1處理部31及第3處理部91。於第4動作例中，將第2基板W2依序搬送至第6處理部151、第2處理部61及第5處理部111。
Refer to Figure 14(a). In the fourth operation example, the first substrate W1 is sequentially transferred to the fourth processing unit 131 , the first processing unit 31 , and the third processing unit 91 . In the fourth operation example, the second substrate W2 is sequentially transferred to the sixth processing unit 151 , the second processing unit 61 , and the fifth processing unit 111 .
主搬送機構17將第1基板W1及第2基板W2搬送至迂迴搬送機構41。迂迴搬送機構41將第1基板W1及第2基板W2自主搬送機構17搬送至中繼搬送機構167。中繼搬送機構167將第1基板W1自迂迴搬送機構41搬送至第4搬送機構127，將第2基板W2自迂迴搬送機構41搬送至第6搬送機構147。第4搬送機構127將第1基板W1自中繼搬送機構167搬送至第4處理部131，並將第1基板W1自第4處理部131搬送至中繼搬送機構167。第6搬送機構147將第2基板W2自中繼搬送機構167搬送至第6處理部151，並將第2基板W2自第6處理部151搬送至中繼搬送機構167。中繼搬送機構167將第1基板W1自第4搬送機構127搬送至第1搬送機構27，將第2基板W2自第6搬送機構147搬送至第2搬送機構57。第1搬送機構27將第1基板W1自中繼搬送機構167搬送至第1處理部31，且將第1基板W1自第1處理部31搬送至中繼搬送機構167。第2搬送機構57將第2基板W2自中繼搬送機構167搬送至第2處理部61，且將第2基板W2自第2處理部61搬送至中繼搬送機構167。中繼搬送機構167將第1基板W1自第1搬送機構27搬送至第3搬送機構87，且將第2基板W2自第2搬送機構57搬送至第5搬送機構107。第3搬送機構87將第1基板W1自中繼搬送機構167搬送至第3處理部91，且將第1基板W1自第3處理部91搬送至主搬送機構17。第5搬送機構107將第2基板W2自中繼搬送機構167搬送至第5處理部111，且將第2基板W2自第5處理
部111搬送至主搬送機構17。主搬送機構17自第3搬送機構87接收第1基板W1，且自第5搬送機構107接收第2基板W2。
The main transport mechanism 17 transports the first substrate W1 and the second substrate W2 to the detour transport mechanism 41 . The detour transport mechanism 41 transports the first substrate W1 and the second substrate W2 from the main transport mechanism 17 to the relay transport mechanism 167 . The relay transport mechanism 167 transports the first substrate W1 from the detour transport mechanism 41 to the fourth transport mechanism 127 , and transports the second substrate W2 from the detour transport mechanism 41 to the sixth transport mechanism 147 . The fourth transport mechanism 127 transports the first substrate W1 from the relay transport mechanism 167 to the fourth processing unit 131 , and transports the first substrate W1 from the fourth processing unit 131 to the relay transport mechanism 167 . The sixth transport mechanism 147 transports the second substrate W2 from the relay transport mechanism 167 to the sixth processing unit 151 , and transports the second substrate W2 from the sixth processing unit 151 to the relay transport mechanism 167 . The relay transport mechanism 167 transports the first substrate W1 from the fourth transport mechanism 127 to the first transport mechanism 27 , and transports the second substrate W2 from the sixth transport mechanism 147 to the second transport mechanism 57 . The first transport mechanism 27 transports the first substrate W1 from the relay transport mechanism 167 to the first processing unit 31 , and transports the first substrate W1 from the first processing unit 31 to the relay transport mechanism 167 . The second transport mechanism 57 transports the second substrate W2 from the relay transport mechanism 167 to the second processing unit 61 , and transports the second substrate W2 from the second processing unit 61 to the relay transport mechanism 167 . The relay transport mechanism 167 transports the first substrate W1 from the first transport mechanism 27 to the third transport mechanism 87 , and transports the second substrate W2 from the second transport mechanism 57 to the fifth transport mechanism 107 . The third transport mechanism 87 transports the first substrate W1 from the relay transport mechanism 167 to the third processing unit 91 , and transports the first substrate W1 from the third processing unit 91 to the main transport mechanism 17 . The fifth transport mechanism 107 transports the second substrate W2 from the relay transport mechanism 167 to the fifth processing unit 111, and transfers the second substrate W2 from the fifth processing
The part 111 is conveyed to the main conveyance mechanism 17 . The main transport mechanism 17 receives the first substrate W1 from the third transport mechanism 87 and receives the second substrate W2 from the fifth transport mechanism 107 .
藉此，對第1基板W1依序進行藉由第4處理部131之處理、藉由第1處理部31之處理、及藉由第3處理部91之處理。對第2基板W2依序進行藉由第6處理部151之處理、藉由第2處理部61之處理、及藉由第5處理部111之處理。
Thereby, the processing by the 4th processing part 131, the processing by the 1st processing part 31, and the processing by the 3rd processing part 91 are performed sequentially with respect to the 1st board|substrate W1. The processing by the sixth processing unit 151 , the processing by the second processing unit 61 , and the processing by the fifth processing unit 111 are sequentially performed on the second substrate W2 .
再者，於第4動作例中，主搬送機構17不自第1搬送機構27及中繼搬送機構167接收基板W。
In addition, in the fourth operation example, the main transport mechanism 17 does not receive the substrate W from the first transport mechanism 27 and the relay transport mechanism 167 .
參照圖14(b)。於第5動作例中，將第1基板W1依序搬送至第3處理部91、第1處理部31及第4處理部131。於第5動作例中，將第2基板W2依序搬送至第5處理部111、第2處理部61及第6處理部151。
Refer to Figure 14(b). In the fifth operation example, the first substrate W1 is sequentially transferred to the third processing unit 91 , the first processing unit 31 , and the fourth processing unit 131 . In the fifth operation example, the second substrate W2 is sequentially transferred to the fifth processing unit 111 , the second processing unit 61 , and the sixth processing unit 151 .
主搬送機構17將第1基板W1搬送至第3搬送機構87，且將第2基板W2搬送至第5搬送機構107。第3搬送機構87將第1基板W1自主搬送機構17搬送至第3處理部91，且將第1基板W1自第3處理部91搬送至中繼搬送機構167。第5搬送機構107將第2基板W2自主搬送機構17搬送至第5處理部111，且將第2基板W2自第5處理部111搬送至中繼搬送機構167。中繼搬送機構167將第1基板W1自第3搬送機構87搬送至第1搬送機構27，且將第2基板W2自第5搬送機構107搬送至第2搬送機構57。第1搬送機構27將第1基板W1自中繼搬送機構167搬送至第1處理部31，且將第1基板W1自第1
處理部31搬送至中繼搬送機構167。第2搬送機構57將第2基板W2自中繼搬送機構167搬送至第2處理部61，且將第2基板W2自第2處理部61搬送至中繼搬送機構167。中繼搬送機構167將第1基板W1自第1搬送機構27搬送至第4搬送機構127，且將第2基板W2自第2搬送機構57搬送至第6搬送機構147。第4搬送機構127將第1基板W1自中繼搬送機構167搬送至第4處理部131，且將第1基板W1自第4處理部131搬送至中繼搬送機構167。第6搬送機構147將第2基板W2自中繼搬送機構167搬送至第6處理部151，且將第2基板W2自第6處理部151搬送至中繼搬送機構167。中繼搬送機構167將第1基板W1自第4搬送機構127搬送至迂迴搬送機構41，且將第2基板W2自第6搬送機構147搬送至迂迴搬送機構41。迂迴搬送機構41將第1基板W1及第2基板W2自中繼搬送機構167搬送至主搬送機構17。主搬送機構17自迂迴搬送機構41接收第1基板W1及第2基板W2。
The main transport mechanism 17 transports the first substrate W1 to the third transport mechanism 87 and transports the second substrate W2 to the fifth transport mechanism 107 . The third transport mechanism 87 transports the first substrate W1 from the main transport mechanism 17 to the third processing unit 91 , and transports the first substrate W1 from the third processing unit 91 to the relay transport mechanism 167 . The fifth transport mechanism 107 transports the second substrate W2 from the main transport mechanism 17 to the fifth processing unit 111 , and transports the second substrate W2 from the fifth processing unit 111 to the relay transport mechanism 167 . The relay transport mechanism 167 transports the first substrate W1 from the third transport mechanism 87 to the first transport mechanism 27 , and transports the second substrate W2 from the fifth transport mechanism 107 to the second transport mechanism 57 . The first transport mechanism 27 transports the first substrate W1 from the relay transport mechanism 167 to the first processing section 31, and transports the first substrate W1 from the first substrate W1 to the first processing unit 31.
The processing unit 31 is transported to the relay transport mechanism 167 . The second transport mechanism 57 transports the second substrate W2 from the relay transport mechanism 167 to the second processing unit 61 , and transports the second substrate W2 from the second processing unit 61 to the relay transport mechanism 167 . The relay transport mechanism 167 transports the first substrate W1 from the first transport mechanism 27 to the fourth transport mechanism 127 , and transports the second substrate W2 from the second transport mechanism 57 to the sixth transport mechanism 147 . The fourth transport mechanism 127 transports the first substrate W1 from the relay transport mechanism 167 to the fourth processing unit 131 , and transports the first substrate W1 from the fourth processing unit 131 to the relay transport mechanism 167 . The sixth transport mechanism 147 transports the second substrate W2 from the relay transport mechanism 167 to the sixth processing unit 151 , and transports the second substrate W2 from the sixth processing unit 151 to the relay transport mechanism 167 . The relay transport mechanism 167 transports the first substrate W1 from the fourth transport mechanism 127 to the roundabout transport mechanism 41 , and transports the second substrate W2 from the sixth transport mechanism 147 to the roundabout transport mechanism 41 . The detour transport mechanism 41 transports the first substrate W1 and the second substrate W2 from the relay transport mechanism 167 to the main transport mechanism 17 . The main transport mechanism 17 receives the first substrate W1 and the second substrate W2 from the detour transport mechanism 41 .
藉此，對第1基板W1依序進行藉由第3處理部91之處理、藉由第1處理部31之處理、及藉由第4處理部131之處理。對第2基板W2依序進行藉由第5處理部111之處理、藉由第2處理部61之處理、及藉由第6處理部151之處理。
Thereby, the processing by the 3rd processing part 91, the processing by the 1st processing part 31, and the processing by the 4th processing part 131 are performed sequentially with respect to the 1st board|substrate W1. The processing by the fifth processing unit 111 , the processing by the second processing unit 61 , and the processing by the sixth processing unit 151 are sequentially performed on the second substrate W2 .
再者，於第5動作例中，主搬送機構17不將基板W交遞至第1搬送機構27及中繼搬送機構167。
In addition, in the fifth operation example, the main transport mechanism 17 does not deliver the substrate W to the first transport mechanism 27 and the relay transport mechanism 167 .
<第2實施形態之主要效果>
<Main effects of the second embodiment>
藉由第2實施形態，亦發揮與第1實施形態同樣之效果。例如，可減
輕第1搬送機構27搬送基板W之負擔。進而，迂迴搬送機構41搬送基板W之負擔相對較小。因此，可增加第1處理部31於每單位時間內所能處理之基板W之片數。因此，可提高基板處理裝置1之產出量。進而，可增加第2處理部61於每單位時間內所能處理之基板W之片數。因此，可進一步提高基板處理裝置1之產出量。
Also by the second embodiment, the same effects as those of the first embodiment are exhibited. For example, you can reduce
The burden of conveying the substrate W on the first conveying mechanism 27 is lightened. Furthermore, the burden on the detour transport mechanism 41 to transport the substrate W is relatively small. Therefore, the number of substrates W that can be processed by the first processing unit 31 per unit time can be increased. Therefore, the throughput of the substrate processing apparatus 1 can be improved. Furthermore, the number of substrates W that can be processed by the second processing unit 61 per unit time can be increased. Therefore, the throughput of the substrate processing apparatus 1 can be further improved.
進而，根據第2實施形態，發揮以下主要效果。
Furthermore, according to the second embodiment, the following main effects are exhibited.
基板處理裝置1具備第3處理部91、第4處理部131、第5處理部111及第6處理部151。因此，可對基板W進行藉由第3處理部91之處理、藉由第4處理部131之處理、藉由第5處理部111之處理及藉由第6處理部151之處理。
The substrate processing apparatus 1 includes a third processing unit 91 , a fourth processing unit 131 , a fifth processing unit 111 , and a sixth processing unit 151 . Therefore, the substrate W can be processed by the third processing unit 91 , processed by the fourth processing unit 131 , processed by the fifth processing unit 111 , and processed by the sixth processing unit 151 .
基板處理裝置1具備第3搬送機構87、第4搬送機構127、第5搬送機構107及第6搬送機構147。因此，可將基板適當地搬送至第3處理部91、第4處理部131、第5處理部111及第6處理部151。
The substrate processing apparatus 1 includes a third transport mechanism 87 , a fourth transport mechanism 127 , a fifth transport mechanism 107 , and a sixth transport mechanism 147 . Therefore, the substrate can be appropriately transferred to the third processing unit 91 , the fourth processing unit 131 , the fifth processing unit 111 , and the sixth processing unit 151 .
第3處理部91配置於第1處理部31之下方。第4處理部131配置於第2處理部61之下方。第5處理部111配置於第1處理部31之上方。第6處理部151配置於第2處理部61之上方。因此，可抑制基板處理裝置1之佔據面積增大。
The third processing unit 91 is arranged below the first processing unit 31 . The fourth processing unit 131 is arranged below the second processing unit 61 . The fifth processing unit 111 is arranged above the first processing unit 31 . The sixth processing unit 151 is arranged above the second processing unit 61 . Therefore, an increase in the occupied area of the substrate processing apparatus 1 can be suppressed.
第3搬送機構87配置於第1搬送機構27及迂迴搬送機構41之下方。第4
搬送機構127配置於第2搬送機構57之下方。第5搬送機構107配置於第1搬送機構27及迂迴搬送機構41之上方。第6搬送機構147配置於第2搬送機構57之上方。因此，可抑制基板處理裝置1之佔據面積增大。
The third conveying mechanism 87 is disposed below the first conveying mechanism 27 and the detour conveying mechanism 41 . No. 4
The transport mechanism 127 is arranged below the second transport mechanism 57 . The fifth conveying mechanism 107 is disposed above the first conveying mechanism 27 and the detour conveying mechanism 41 . The sixth conveyance mechanism 147 is disposed above the second conveyance mechanism 57 . Therefore, an increase in the occupied area of the substrate processing apparatus 1 can be suppressed.
中繼搬送機構167可於第1搬送機構27、第2搬送機構57、第3搬送機構87、第4搬送機構127、第5搬送機構107、第6搬送機構147及迂迴搬送機構41之間搬送基板W。因此，可靈活地選擇基板W之搬送路徑。此處，於不對第1處理部31、第2處理部61、第3處理部91、第4處理部131、第5處理部111及第6處理部151進行區別之情形時，將該等稱為處理部K。例如，可自第1處理部31、第2處理部61、第3處理部91、第4處理部131、第5處理部111及第6處理部151中靈活地選擇搬送基板W之處理部K。例如，可靈活地選擇搬送基板W之處理部K之數量。例如，於將基板W搬送至複數個處理部K之情形時，可靈活地選擇搬送基板W之處理部K之順序。其結果，可靈活地選擇對基板W進行之處理。
The relay conveying mechanism 167 can convey between the first conveying mechanism 27, the second conveying mechanism 57, the third conveying mechanism 87, the fourth conveying mechanism 127, the fifth conveying mechanism 107, the sixth conveying mechanism 147, and the detour conveying mechanism 41. Substrate W. Therefore, the conveyance path of the substrate W can be flexibly selected. Here, when the first processing unit 31, the second processing unit 61, the third processing unit 91, the fourth processing unit 131, the fifth processing unit 111, and the sixth processing unit 151 are not distinguished, they are referred to as For the processing department K. For example, the processing unit K for transferring the substrate W can be flexibly selected from the first processing unit 31, the second processing unit 61, the third processing unit 91, the fourth processing unit 131, the fifth processing unit 111, and the sixth processing unit 151. . For example, the number of processing units K for transferring the substrate W can be flexibly selected. For example, when transferring the substrate W to a plurality of processing units K, the order of the processing units K to transfer the substrate W can be flexibly selected. As a result, the processing to be performed on the substrate W can be flexibly selected.
中繼搬送機構167設置為可移動至第1搬送機構27與第2搬送機構57之間之位置、迂迴搬送機構41與第2搬送機構57之間之位置、及第3搬送機構87與第4搬送機構127之間之位置、及第5搬送機構107與第6搬送機構147之間之位置。因此，中繼搬送機構167可於第1搬送機構27、第2搬送機構57、第3搬送機構87、第4搬送機構127、第5搬送機構107、第6搬送機構147及迂迴搬送機構41之間適當地搬送基板W。
The intermediary transport mechanism 167 is arranged to be movable to the position between the first transport mechanism 27 and the second transport mechanism 57, the position between the detour transport mechanism 41 and the second transport mechanism 57, and the position between the third transport mechanism 87 and the fourth transport mechanism. The position between the conveying mechanisms 127 and the position between the fifth conveying mechanism 107 and the sixth conveying mechanism 147 . Therefore, the relay transport mechanism 167 can be used between the first transport mechanism 27, the second transport mechanism 57, the third transport mechanism 87, the fourth transport mechanism 127, the fifth transport mechanism 107, the sixth transport mechanism 147, and the detour transport mechanism 41. The substrate W is properly transported between them.
將不通過第1處理部31而於主搬送機構17與中繼搬送機構167之間搬
送基板W之情況稱為第1直行搬送。迂迴搬送機構41進行第1直行搬送，第1搬送機構27不進行第1直行搬送。因此，可減輕第1搬送機構27搬送基板W之負擔。其結果，可增加第1搬送機構27於每單位時間內所能搬送至第1處理部31之基板W之片數。因此，可增加第1處理部31於每單位時間內所能處理之基板W之片數。因此，可進一步提高基板處理裝置1之產出量。
will not pass through the first processing unit 31 and be transported between the main transport mechanism 17 and the relay transport mechanism 167
The case where the substrate W is conveyed is called the first straight conveyance. The detour conveyance mechanism 41 performs the first straight conveyance, and the first conveyance mechanism 27 does not perform the first straight conveyance. Therefore, the burden of conveying the substrate W on the first conveying mechanism 27 can be reduced. As a result, the number of substrates W that can be transported to the first processing unit 31 by the first transport mechanism 27 per unit time can be increased. Therefore, the number of substrates W that can be processed by the first processing unit 31 per unit time can be increased. Therefore, the throughput of the substrate processing apparatus 1 can be further improved.
將不通過第3處理部91而於主搬送機構17與中繼搬送機構167之間搬送基板W之情況稱為第3直行搬送。迂迴搬送機構41進行第3直行搬送，第3搬送機構87不進行第3直行搬送。因此，可減輕第3搬送機構87搬送基板W之負擔。其結果，可增加第3搬送機構87於每單位時間內所能搬送至第3處理部91之基板W之片數。因此，可增加第3處理部91於每單位時間內所能處理之基板W之片數。因此，可進一步提高基板處理裝置1之產出量。
The case where the substrate W is transported between the main transport mechanism 17 and the relay transport mechanism 167 without passing through the third processing unit 91 is referred to as a third straight transport. The detour conveyance mechanism 41 performs the third straight conveyance, and the third conveyance mechanism 87 does not perform the third straight conveyance. Therefore, the load on the third conveyance mechanism 87 to convey the substrate W can be reduced. As a result, the number of substrates W that can be transported to the third processing unit 91 by the third transport mechanism 87 per unit time can be increased. Therefore, the number of substrates W that can be processed by the third processing unit 91 per unit time can be increased. Therefore, the throughput of the substrate processing apparatus 1 can be further improved.
將不通過第5處理部111而於主搬送機構17與中繼搬送機構167之間搬送基板W之情況稱為第5直行搬送。由於迂迴搬送機構41進行第5直行搬送，故而第5搬送機構107不進行第5直行搬送。因此，可減輕第5搬送機構107搬送基板W之負擔。其結果，可增加第5搬送機構107於每單位時間內所能搬送至第5處理部111之基板W之片數。因此，可增加第5處理部111於每單位時間內所能處理之基板W之片數。因此，可進一步提高基板處理裝置1之產出量。
The case where the substrate W is transported between the main transport mechanism 17 and the relay transport mechanism 167 without passing through the fifth processing unit 111 is referred to as fifth straight transport. Since the detour transport mechanism 41 performs the fifth straight transport, the fifth transport mechanism 107 does not perform the fifth straight transport. Therefore, the burden of conveying the substrate W on the fifth conveying mechanism 107 can be reduced. As a result, the number of substrates W that can be transported to the fifth processing section 111 by the fifth transport mechanism 107 per unit time can be increased. Therefore, the number of substrates W that can be processed by the fifth processing unit 111 per unit time can be increased. Therefore, the throughput of the substrate processing apparatus 1 can be further improved.
迂迴搬送機構41配置於第3搬送機構87之上方且第5搬送機構107之下方。即，迂迴搬送機構41並非第1搬送機構27、第3搬送機構87、第5搬送
機構107及迂迴搬送機構41之中配置於最低之高度位置之搬送機構。迂迴搬送機構41並非第1搬送機構27、第3搬送機構87、第5搬送機構107及迂迴搬送機構41之中配置於最高之高度位置之搬送機構。因此，可抑制在主搬送機構17與迂迴搬送機構41之間搬送基板W時之主搬送機構17之移動量。具體而言，可抑制主搬送機構17於上下方向Z上之移動量。同樣地，可抑制在中繼搬送機構167與迂迴搬送機構41之間搬送基板W時之中繼搬送機構167之移動量。具體而言，可抑制中繼搬送機構167於上下方向Z上之移動量。
The detour transport mechanism 41 is disposed above the third transport mechanism 87 and below the fifth transport mechanism 107 . That is, the detour conveying mechanism 41 is not the first conveying mechanism 27, the third conveying mechanism 87, the fifth conveying mechanism
Among the mechanism 107 and the roundabout conveying mechanism 41, the conveying mechanism arranged at the lowest height position. The detour conveying mechanism 41 is not the conveying mechanism arranged at the highest height position among the first conveying mechanism 27 , the third conveying mechanism 87 , the fifth conveying mechanism 107 , and the detour conveying mechanism 41 . Therefore, the amount of movement of the main transport mechanism 17 when the substrate W is transported between the main transport mechanism 17 and the detour transport mechanism 41 can be suppressed. Specifically, the amount of movement of the main transport mechanism 17 in the vertical direction Z can be suppressed. Likewise, the amount of movement of the relay transfer mechanism 167 when transferring the substrate W between the relay transfer mechanism 167 and the detour transfer mechanism 41 can be suppressed. Specifically, the amount of movement of the intermediary transport mechanism 167 in the vertical direction Z can be suppressed.
將基板W自除主搬送機構17以外之搬送機構被搬送至主搬送機構17之前最後對基板W進行之處理稱為「最後之處理」。於第4動作例中，第3搬送機構87將基板W交遞至主搬送機構17。具體而言，第3搬送機構87將第1基板W1自第3處理部91交遞至主搬送機構17。因此，於第4動作例中，第3處理部91對第1基板W1進行最後之處理。於第4動作例中，第5搬送機構107將基板W交遞至主搬送機構17。具體而言，第5搬送機構107將第2基板W2自第5處理部111搬送至主搬送機構17。因此，於第4動作例中，第5處理部111對第2基板W2進行最後之處理。此處，第3處理部91及第5處理部111配置於與主搬送機構17相對較近之位置。具體而言，第3處理部91及第5處理部111配置於較第2處理部61、第4處理部131及第6處理部151更靠近主搬送機構17之位置。如此，進行最後之處理之第3處理部91及第5處理部111配置於靠近主搬送機構17之位置。因此，於第4動作例中，可於對基板W進行最後之處理之後將基板W迅速地搬送至主搬送機構17。
The last process performed on the substrate W before the substrate W is transported to the main transport mechanism 17 from a transport mechanism other than the main transport mechanism 17 is referred to as "final process". In the fourth operation example, the third transport mechanism 87 delivers the substrate W to the main transport mechanism 17 . Specifically, the third transport mechanism 87 delivers the first substrate W1 from the third processing unit 91 to the main transport mechanism 17 . Therefore, in the fourth operation example, the third processing unit 91 performs the final processing on the first substrate W1. In the fourth operation example, the fifth transport mechanism 107 delivers the substrate W to the main transport mechanism 17 . Specifically, the fifth transport mechanism 107 transports the second substrate W2 from the fifth processing unit 111 to the main transport mechanism 17 . Therefore, in the fourth operation example, the fifth processing unit 111 performs the final processing on the second substrate W2. Here, the third processing unit 91 and the fifth processing unit 111 are arranged relatively close to the main transport mechanism 17 . Specifically, the third processing unit 91 and the fifth processing unit 111 are disposed closer to the main transport mechanism 17 than the second processing unit 61 , the fourth processing unit 131 and the sixth processing unit 151 . In this way, the third processing unit 91 and the fifth processing unit 111 that perform the final processing are arranged near the main transport mechanism 17 . Therefore, in the fourth operation example, the substrate W can be quickly transferred to the main transfer mechanism 17 after the substrate W is subjected to final processing.
再者，於第4動作例中，第1搬送機構27、第2搬送機構57、第4搬送機構127、第6搬送機構147及迂迴搬送機構41不將基板W交遞至主搬送機構17。因此，第1處理部31、第2處理部61、第4處理部131及第6處理部151不進行最後之處理。
In addition, in the fourth operation example, the first transport mechanism 27 , the second transport mechanism 57 , the fourth transport mechanism 127 , the sixth transport mechanism 147 , and the detour transport mechanism 41 do not deliver the substrate W to the main transport mechanism 17 . Therefore, the first processing unit 31 , the second processing unit 61 , the fourth processing unit 131 , and the sixth processing unit 151 do not perform final processing.
將基板W自主搬送機構17被搬送至除主搬送機構17以外之搬送機構之後最初對基板進行之處理稱為「最初之處理」。於第5動作例中，主搬送機構17將基板W交遞至第3搬送機構87。第3搬送機構87將第1基板W1自主搬送機構17搬送至第3處理部91。因此，於第5動作例中，第3處理部91對第1基板W1進行最初之處理。於第5動作例中，主搬送機構17將基板W交遞至第5搬送機構107。第5搬送機構107將第2基板W2自主搬送機構17搬送至第5處理部111。因此，於第5動作例中，第5處理部111對第2基板W2進行最初之處理。此處，第3處理部91及第5處理部111配置於與主搬送機構17相對較近之位置。具體而言，第3處理部91及第5處理部111配置於較第2處理部61、第4處理部131及第6處理部151更靠近主搬送機構17之位置。如此，進行最初之處理之第3處理部91及第5處理部111配置於靠近主搬送機構17之位置。因此，於第5動作例中，可於自主搬送機構17搬送至主搬送機構17以外之搬送機構之後，對基板W迅速地進行最初之處理。
The first processing performed on the substrate after the substrate W is transferred from the main transfer mechanism 17 to a transfer mechanism other than the main transfer mechanism 17 is referred to as "first processing". In the fifth operation example, the main transport mechanism 17 delivers the substrate W to the third transport mechanism 87 . The third transport mechanism 87 transports the first substrate W1 to the third processing unit 91 by the main transport mechanism 17 . Therefore, in the fifth operation example, the third processing unit 91 performs the first processing on the first substrate W1. In the fifth operation example, the main transport mechanism 17 delivers the substrate W to the fifth transport mechanism 107 . The fifth transport mechanism 107 transports the second substrate W2 to the fifth processing unit 111 by the main transport mechanism 17 . Therefore, in the fifth operation example, the fifth processing unit 111 performs the first processing on the second substrate W2. Here, the third processing unit 91 and the fifth processing unit 111 are arranged relatively close to the main transport mechanism 17 . Specifically, the third processing unit 91 and the fifth processing unit 111 are disposed closer to the main transport mechanism 17 than the second processing unit 61 , the fourth processing unit 131 and the sixth processing unit 151 . Thus, the 3rd processing part 91 and the 5th processing part 111 which perform the initial processing are arrange|positioned in the position close to the main conveyance mechanism 17. Therefore, in the fifth operation example, after the main transport mechanism 17 is transported to a transport mechanism other than the main transport mechanism 17, the first processing can be performed on the substrate W promptly.
再者，於第5動作例中，主搬送機構17不將基板W交遞至第1搬送機構27、第2搬送機構57、第4搬送機構127、第6搬送機構147及迂迴搬送機構41。因此，第1處理部31、第2處理部61、第4處理部131及第6處理部
151不進行最初之處理。
In addition, in the fifth operation example, the main transport mechanism 17 does not deliver the substrate W to the first transport mechanism 27 , the second transport mechanism 57 , the fourth transport mechanism 127 , the sixth transport mechanism 147 , and the detour transport mechanism 41 . Therefore, the first processing unit 31, the second processing unit 61, the fourth processing unit 131, and the sixth processing unit
151 No initial processing.
以下，對基板處理裝置1之構造更詳細地進行說明。
Hereinafter, the structure of the substrate processing apparatus 1 will be described in more detail.
<基板處理裝置1之整體構造>
<Overall Structure of Substrate Processing Apparatus 1>
圖15係第2實施形態之基板處理裝置1之俯視圖。圖16係表示基板處理裝置1之右部之構成之右側視圖。圖17係表示寬度方向上之基板處理裝置1之中央部之構成的左側視圖。圖18係表示基板處理裝置1之左部之構成之左側視圖。
Fig. 15 is a plan view of the substrate processing apparatus 1 according to the second embodiment. FIG. 16 is a right side view showing the configuration of the right portion of the substrate processing apparatus 1 . FIG. 17 is a left side view showing the configuration of the central portion of the substrate processing apparatus 1 in the width direction. FIG. 18 is a left side view showing the configuration of the left portion of the substrate processing apparatus 1 .
基板處理裝置1除具備傳載機部11、第1區塊21及第2區塊51以外，還具備中繼區塊161。傳載機部11收容主搬送機構17。第1區塊21收容第1處理部31、第3處理部91及第5處理部111。第1區塊21收容第1搬送機構27、第3搬送機構87、第5搬送機構107及迂迴搬送機構41。第2區塊51收容第2處理部61、第4處理部131及第6處理部151。第2區塊51收容第2搬送機構57、第4搬送機構127及第6搬送機構147。中繼區塊161收容中繼搬送機構167。
The substrate processing apparatus 1 includes a relay block 161 in addition to the carrier unit 11 , the first block 21 , and the second block 51 . The carrier unit 11 accommodates a main transport mechanism 17 . The first block 21 accommodates the first processing unit 31 , the third processing unit 91 , and the fifth processing unit 111 . The first block 21 accommodates the first conveying mechanism 27 , the third conveying mechanism 87 , the fifth conveying mechanism 107 , and the detour conveying mechanism 41 . The second block 51 accommodates the second processing unit 61 , the fourth processing unit 131 , and the sixth processing unit 151 . The second block 51 accommodates the second conveying mechanism 57 , the fourth conveying mechanism 127 , and the sixth conveying mechanism 147 . The relay block 161 accommodates the relay transport mechanism 167 .
中繼區塊161於俯視下配置於第1區塊21與第2區塊51之間。中繼區塊161配置於與傳載機部11、第1區塊21及第2區塊51大致相同之高度位置。傳載機部11、第1區塊21、中繼區塊161及第2區塊51以於前後方向X排列之方式配置。傳載機部11、第1區塊21、中繼區塊161及第2區塊51以此順序排列而配置。
The relay block 161 is disposed between the first block 21 and the second block 51 in plan view. The relay block 161 is arranged at substantially the same height position as the carrier unit 11 , the first block 21 and the second block 51 . The carrier unit 11 , the first block 21 , the relay block 161 , and the second block 51 are arranged in a row in the front-rear direction X. The carrier unit 11, the first block 21, the relay block 161, and the second block 51 are arranged in this order.
中繼區塊161與第1區塊21連接。中繼區塊161與第2區塊51連接。中繼區塊161不與傳載機部11連接。第1區塊21不與第2區塊51連接。
The relay block 161 is connected to the first block 21 . The relay block 161 is connected to the second block 51 . The relay block 161 is not connected to the carrier unit 11 . The first block 21 is not connected to the second block 51 .
<傳載機部11>
<Conveyor Unit 11>
圖19係傳載機部11之前視圖。傳載機部11除具備載具載置部12a1、121b1以外，還具備載具載置部12a2、12b2。於載具載置部12a1、12a2、12b1、12b2分別載置1個載具C。
FIG. 19 is a front view of the carrier unit 11. FIG. The carrier unit 11 is provided with carrier placement parts 12a2 and 12b2 in addition to carrier placement parts 12a1 and 121b1. One carrier C is placed on each of the carrier mounting parts 12a1, 12a2, 12b1, and 12b2.
載具載置部12a1、12a2以於上下方向Z上排列之方式配置。載具載置部12a2配置於載具載置部12a1之上方。載具載置部12b1、12b2以於上下方向Z上排列之方式配置。載具載置部12b2配置於載具載置部12b1之上方。
The carrier placement parts 12a1, 12a2 are arranged so as to line up in the up-down direction Z. The carrier loading portion 12a2 is disposed above the carrier loading portion 12a1. The carrier placement parts 12b1 and 12b2 are arranged so as to line up in the up-down direction Z. As shown in FIG. The carrier mounting part 12b2 is disposed above the carrier mounting part 12b1.
載具載置部12a2配置於與載具載置部12b2大致相同之高度位置。載具載置部12a2、12b2以於寬度方向Y上排列之方式配置。載具載置部12b2配置於載具載置部12a2之左方。
The carrier mounting part 12a2 is arrange|positioned at the substantially same height position as the carrier mounting part 12b2. The carrier placement parts 12a2 and 12b2 are arranged so as to line up in the width direction Y. The carrier mounting part 12b2 is arranged on the left side of the carrier mounting part 12a2.
於不對載具載置部12a1、12a2進行區別之情形時，記載為「載具載置部12a」。於不對載具載置部12b1、12b2進行區別之情形時，記載為「載具載置部12b」。
When not distinguishing the carrier mounting part 12a1, 12a2, it describes as "the carrier mounting part 12a." When not distinguishing the carrier mounting part 12b1, 12b2, it describes as "the carrier mounting part 12b."
參照圖15~18。搬送機構18a配置於與載具載置部12a大致相同之高
度位置。搬送機構18a配置於載具載置部12a之後方。搬送機構18a於載置於載具載置部12a之載具C與第1搬送機構27之間搬送基板W。搬送機構18b配置於與載具載置部12b大致相同之高度位置。搬送機構18b配置於載具載置部12b之後方。搬送機構18b於載置於載具載置部12b之載具C與第1搬送機構27之間搬送基板W。
Refer to Figures 15-18. The conveying mechanism 18a is arranged at approximately the same height as the carrier mounting portion 12a
degree position. The conveyance mechanism 18a is arrange|positioned behind the carrier mounting part 12a. The conveyance mechanism 18a conveys the board|substrate W between the carrier C mounted on the carrier mounting part 12a, and the 1st conveyance mechanism 27. As shown in FIG. The conveyance mechanism 18b is arrange|positioned in the height position substantially the same as the carrier mounting part 12b. The conveyance mechanism 18b is arrange|positioned behind the carrier mounting part 12b. The conveyance mechanism 18b conveys the board|substrate W between the carrier C mounted on the carrier mounting part 12b, and the 1st conveyance mechanism 27. As shown in FIG.
<第1區塊21>
<1st block 21>
參照圖15~18、20。圖20係第1區塊21之前視圖。框架22支持第1處理部31、第3處理部91及第5處理部111。框架22支持第1搬送機構27、第3搬送機構87、第5搬送機構107及迂迴搬送機構41。
Refer to Figures 15~18, 20. FIG. 20 is a front view of the first block 21 . The frame 22 supports the first processing unit 31 , the third processing unit 91 , and the fifth processing unit 111 . The frame 22 supports the first conveying mechanism 27 , the third conveying mechanism 87 , the fifth conveying mechanism 107 , and the detour conveying mechanism 41 .
基板處理裝置1除具備第1搬送空間23以外，還具備第3搬送空間83及第5搬送空間103。第3搬送空間83及第5搬送空間103形成於第1區塊21。第3搬送空間83配置於第1搬送空間23之下方。第3搬送空間83於俯視下配置於與第1搬送空間23大致相同之位置。第5搬送空間103配置於第1搬送空間23之上方。第5搬送空間103於俯視下配置於與第1搬送空間23大致相同之位置。
The substrate processing apparatus 1 includes a third transfer space 83 and a fifth transfer space 103 in addition to the first transfer space 23 . The third transfer space 83 and the fifth transfer space 103 are formed in the first block 21 . The third conveyance space 83 is arranged below the first conveyance space 23 . The 3rd conveyance space 83 is arrange|positioned at the substantially same position as the 1st conveyance space 23 in planar view. The fifth conveyance space 103 is disposed above the first conveyance space 23 . The 5th conveyance space 103 is arrange|positioned at the substantially same position as the 1st conveyance space 23 in planar view.
第1搬送空間23、第3搬送空間83及第5搬送空間103配置於與主搬送空間13大致相同之高度位置。第1搬送空間23、第3搬送空間83及第5搬送空間103分別與主搬送空間13相接。
The first conveyance space 23 , the third conveyance space 83 , and the fifth conveyance space 103 are arranged at substantially the same height as the main conveyance space 13 . The first conveyance space 23 , the third conveyance space 83 , and the fifth conveyance space 103 are in contact with the main conveyance space 13 , respectively.
參照圖17、20。基板處理裝置1除具備供氣單元24以外還具備供氣單
元84、104。基板處理裝置1除具備排氣單元25以外還具備排氣單元85、105。供氣單元84與排氣單元85於第3搬送空間83中形成向下之氣體流動。供氣單元104與排氣單元105於第5搬送空間103中形成向下之氣體流動。
Referring to Figures 17 and 20. The substrate processing apparatus 1 includes an air supply unit in addition to the air supply unit 24.
Yuan 84, 104. The substrate processing apparatus 1 includes exhaust units 85 and 105 in addition to the exhaust unit 25 . The gas supply unit 84 and the exhaust unit 85 form a downward gas flow in the third transfer space 83 . The gas supply unit 104 and the exhaust unit 105 form a downward gas flow in the fifth transfer space 103 .
供氣單元24配置於第1搬送空間23之上方且第5搬送空間103之下方。排氣單元25配置於第1搬送空間23之下方且第3搬送空間83之上方。供氣單元84配置於排氣單元25之下方且第3搬送空間83之上方。排氣單元85配置於第3搬送空間83之下方。供氣單元104配置於第5搬送空間103之上方。排氣單元105配置於第5搬送空間103之下方且供氣單元24之上方。供氣單元84、104具有與供氣單元24大致相同之形狀及構造。排氣單元85、105具有與排氣單元25大致相同之形狀及構造。
The air supply unit 24 is disposed above the first conveyance space 23 and below the fifth conveyance space 103 . The exhaust unit 25 is disposed below the first conveyance space 23 and above the third conveyance space 83 . The air supply unit 84 is disposed below the exhaust unit 25 and above the third transfer space 83 . The exhaust unit 85 is arranged below the third transfer space 83 . The air supply unit 104 is arranged above the fifth transfer space 103 . The exhaust unit 105 is disposed below the fifth transfer space 103 and above the air supply unit 24 . The air supply unit 84 , 104 has substantially the same shape and structure as the air supply unit 24 . The exhaust units 85 , 105 have substantially the same shape and structure as the exhaust unit 25 .
第3搬送機構87設置於第3搬送空間83。第5搬送機構107設置於第5搬送空間103。第3搬送機構87及第5搬送機構107具有與第1搬送機構27大致相同之構造。
The third conveyance mechanism 87 is installed in the third conveyance space 83 . The fifth conveyance mechanism 107 is installed in the fifth conveyance space 103 . The third conveying mechanism 87 and the fifth conveying mechanism 107 have substantially the same structure as the first conveying mechanism 27 .
參照圖17。基板處理裝置1除具備前載置部71以外還具備前載置部73、75。於前載置部73、75載置基板W。前載置部73配置於主搬送機構17與第3搬送機構87之間。主搬送機構17與第3搬送機構87經由前載置部73相互搬送基板W。前載置部75配置於主搬送機構17與第5搬送機構107之間。主搬送機構17與第5搬送機構107經由前載置部75相互搬送基板W。
Refer to Figure 17. The substrate processing apparatus 1 includes front loading sections 73 and 75 in addition to the front loading section 71 . The substrate W is placed on the front loading parts 73 and 75 . The front loading unit 73 is disposed between the main transport mechanism 17 and the third transport mechanism 87 . The main transport mechanism 17 and the third transport mechanism 87 mutually transport the substrate W via the front loading unit 73 . The front loading unit 75 is disposed between the main transport mechanism 17 and the fifth transport mechanism 107 . The main transport mechanism 17 and the fifth transport mechanism 107 mutually transport the substrate W via the front loading unit 75 .
前載置部73、75配置於傳載機部11與第1區塊21之間。前載置部73、75跨及傳載機部11及第1區塊21而配置。前載置部73跨及主搬送空間13及第3搬送空間83而配置。前載置部75跨及主搬送空間13及第5搬送空間103而配置。
The front loading parts 73 and 75 are arranged between the carrier part 11 and the first block 21 . The front loading parts 73 and 75 are arranged straddling the carrier part 11 and the first block 21 . The front loading unit 73 is arranged across the main conveyance space 13 and the third conveyance space 83 . The front loading unit 75 is arranged straddling the main conveyance space 13 and the fifth conveyance space 103 .
前載置部73、75配置於與主搬送機構17大致相同之高度位置。前載置部73、75配置於主搬送機構17之後方。前載置部73、75配置於搬送機構18a之後方且左方。前載置部73、75配置於搬送機構18b之後方且右方。
The front loading parts 73 and 75 are arranged at substantially the same height position as the main conveyance mechanism 17 . The front loading units 73 and 75 are arranged behind the main transport mechanism 17 . The front loading parts 73 and 75 are arrange|positioned behind the conveyance mechanism 18a, and left. The front loading parts 73 and 75 are arrange|positioned behind the conveyance mechanism 18b, and to the right.
前載置部73配置於與第3搬送機構87大致相同之高度位置。前載置部73配置於第3搬送機構87之前方。前載置部75配置於與第5搬送機構107大致相同之高度位置。前載置部75配置於第5搬送機構107之前方。
The front loading unit 73 is arranged at substantially the same height position as the third conveying mechanism 87 . The front loading unit 73 is arranged in front of the third transport mechanism 87 . The front loading unit 75 is arranged at substantially the same height as the fifth transport mechanism 107 . The front loading unit 75 is arranged in front of the fifth transport mechanism 107 .
前載置部71、73、75以於上下方向Z上排列之方式配置。前載置部73於俯視下與前載置部71重疊。前載置部75於俯視下與前載置部71重疊。
The front mounting parts 71, 73, 75 are arranged so as to line up in the vertical direction Z. As shown in FIG. The front loading portion 73 overlaps the front loading portion 71 in plan view. The front loading portion 75 overlaps the front loading portion 71 in plan view.
前載置部73、75具有與前載置部71大致相同之構造。即，前載置部73、75具備複數個(例如4個)板72。前載置部73、75可載置複數個基板W。
The front mounting parts 73 and 75 have substantially the same structure as the front mounting part 71 . That is, the front mounting parts 73 and 75 include a plurality of (for example, four) plates 72 . A plurality of substrates W can be placed on the front loading parts 73 and 75 .
參照圖20。第3處理部91配置於與第3搬送空間83大致相同之高度位
置。第3處理部91鄰接於第3搬送空間83。第5處理部111配置於與第5搬送空間103大致相同之高度位置。第5處理部111鄰接於第5搬送空間103。
Refer to Figure 20. The third processing unit 91 is arranged at substantially the same height as the third transfer space 83
place. The third processing unit 91 is adjacent to the third transfer space 83 . The fifth processing unit 111 is arranged at substantially the same height as the fifth transfer space 103 . The fifth processing unit 111 is adjacent to the fifth transfer space 103 .
第3處理部91具備第3非液體處理部92。第5處理部111具備第5非液體處理部112。第3非液體處理部92及第5非液體處理部112對基板W進行非液體處理。
The third processing unit 91 includes a third non-liquid processing unit 92 . The fifth processing unit 111 includes a fifth non-liquid processing unit 112 . The third non-liquid processing unit 92 and the fifth non-liquid processing unit 112 perform non-liquid processing on the substrate W.
第3非液體處理部92配置於第3搬送空間83之第1側方(例如右方)。第3非液體處理部92配置於第1非液體處理部32之下方。第5非液體處理部112配置於第5搬送空間103之第1側方(例如右方)。第5非液體處理部112配置於第1非液體處理部32之上方。
The third non-liquid processing unit 92 is disposed on the first side (for example, right side) of the third transfer space 83 . The third non-liquid processing unit 92 is disposed below the first non-liquid processing unit 32 . The fifth non-liquid processing unit 112 is arranged on the first side (for example, right side) of the fifth transfer space 103 . The fifth non-liquid processing unit 112 is disposed above the first non-liquid processing unit 32 .
圖20示出上下方向Z上之第1非液體處理部32之長度L32。圖20示出上下方向Z上之第3非液體處理部92之長度L92。圖20示出上下方向Z上之第5非液體處理部112之長度L112。長度L32小於長度L92。長度L32小於長度L112。
FIG. 20 shows the length L32 of the first non-liquid processing portion 32 in the vertical direction Z. As shown in FIG. FIG. 20 shows the length L92 of the third non-liquid processing portion 92 in the vertical direction Z. As shown in FIG. FIG. 20 shows the length L112 of the fifth non-liquid processing part 112 in the vertical direction Z. As shown in FIG. Length L32 is smaller than length L92. The length L32 is smaller than the length L112.
參照圖16。第1非液體處理部32具備複數個(例如16個)第1熱處理單元33。第3非液體處理部92具備複數個(例如16個)第3熱處理單元93及複數個(例如4個)第3檢查單元94。第5非液體處理部112具備複數個(例如16個)第5熱處理單元113及複數個(例如4個)第5檢查單元114。各第1熱處理單元33、各第3熱處理單元93及各第5熱處理單元113對1片基板W進行熱處理。各第3檢查單元94及各第5檢查單元114對1片基板W進行檢查。第1熱
處理單元33、第3熱處理單元93、第3檢查單元94、第5熱處理單元113及第5檢查單元114不向基板W供給處理液。由第1熱處理單元33、第3熱處理單元93及第5熱處理單元113進行之處理為非液體處理。由第3檢查單元94及第5檢查單元114進行之檢查為非液體處理。第1熱處理單元33、第3熱處理單元93、第3檢查單元94、第5熱處理單元113及第5檢查單元114相當於非液體處理單元。第1熱處理單元33之數量(即16個)相當於第1處理部31所包含之非液體處理單元之數量。第3熱處理單元93之數量與第3檢查單元94之數量之和(即20個)相當於第3處理部91所包含之非液體處理單元之數量。第1處理部31所包含之非液體處理單元之數量少於第3處理部91所包含之非液體處理單元之數量。第5熱處理單元113之數量與第5檢查單元114之數量之和(即20個)相當於第5處理部111所包含之非液體處理單元之數量。第1處理部31所包含之非液體處理單元之數量少於第5處理部111所包含之非液體處理單元之數量。
Refer to Figure 16. The first non-liquid processing unit 32 includes a plurality of (for example, 16) first heat processing units 33 . The third non-liquid processing unit 92 includes a plurality of (for example, 16) third heat treatment units 93 and a plurality of (for example, four) third inspection units 94 . The fifth non-liquid processing unit 112 includes a plurality of (for example, 16) fifth heat treatment units 113 and a plurality of (for example, four) fifth inspection units 114 . Each first heat treatment unit 33 , each third heat treatment unit 93 , and each fifth heat treatment unit 113 heat-treat one substrate W. Each of the third inspection units 94 and each of the fifth inspection units 114 inspects one substrate W. As shown in FIG. 1st hottest
The processing unit 33 , the third thermal processing unit 93 , the third inspection unit 94 , the fifth thermal processing unit 113 , and the fifth inspection unit 114 do not supply the substrate W with processing liquid. The treatment performed by the first heat treatment unit 33 , the third heat treatment unit 93 and the fifth heat treatment unit 113 is non-liquid treatment. The inspection performed by the third inspection unit 94 and the fifth inspection unit 114 is non-liquid processing. The first heat treatment unit 33 , the third heat treatment unit 93 , the third inspection unit 94 , the fifth heat treatment unit 113 , and the fifth inspection unit 114 correspond to non-liquid treatment units. The number of first heat treatment units 33 (ie, 16) is equivalent to the number of non-liquid treatment units included in the first treatment unit 31 . The sum of the number of the third thermal processing units 93 and the number of the third inspection units 94 (that is, 20) is equivalent to the number of non-liquid processing units included in the third processing unit 91 . The number of non-liquid processing units included in the first processing unit 31 is smaller than the number of non-liquid processing units included in the third processing unit 91 . The sum of the number of the fifth thermal processing units 113 and the number of the fifth inspection units 114 (ie 20) is equivalent to the number of non-liquid processing units included in the fifth processing unit 111 . The number of non-liquid processing units included in the first processing unit 31 is less than the number of non-liquid processing units included in the fifth processing unit 111 .
8個第3熱處理單元93為加熱單元HP。剩餘8個第3熱處理單元93為冷卻單元CP。8個第5熱處理單元113為加熱單元HP。剩餘8個第5熱處理單元113為冷卻單元CP。
Eight third heat treatment units 93 are heating units HP. The remaining eight third heat treatment units 93 are cooling units CP. Eight fifth heat treatment units 113 are heating units HP. The remaining eight fifth heat treatment units 113 are cooling units CP.
複數個第3熱處理單元93及複數個第3檢查單元94於側視下配置為矩陣狀。例如，複數個第3熱處理單元93及複數個第3檢查單元94於前後方向X上以4行配置，且於上下方向Z上以5段配置。複數個第5熱處理單元113及複數個第5檢查單元114於側視下配置為矩陣狀。例如，複數個第5熱處理單元113及複數個第5檢查單元114於前後方向X上以4行配置，且於
上下方向Z上以5段配置。
The plurality of third heat treatment units 93 and the plurality of third inspection units 94 are arranged in a matrix form in side view. For example, the plurality of third heat treatment units 93 and the plurality of third inspection units 94 are arranged in four rows in the front-back direction X, and in five stages in the up-down direction Z. The plurality of fifth heat treatment units 113 and the plurality of fifth inspection units 114 are arranged in a matrix form in side view. For example, a plurality of fifth heat treatment units 113 and a plurality of fifth inspection units 114 are arranged in four rows in the front-rear direction X, and
Arranged in 5 stages in the vertical direction Z.
第3熱處理單元93及第5熱處理單元113具有與第1熱處理單元33大致相同之構造。
The third heat treatment unit 93 and the fifth heat treatment unit 113 have substantially the same structure as the first heat treatment unit 33 .
參照圖20，對第3檢查單元94之構造進行說明。第3檢查單元94具備板94a。板94a具有大致圓盤形狀。第3搬送機構97將1片基板W載置於板94a。
Referring to Fig. 20, the structure of the third inspection unit 94 will be described. The third inspection unit 94 includes a plate 94a. Plate 94a has a substantially disc shape. The third transport mechanism 97 places one substrate W on the plate 94a.
第3檢查單元94具備攝像部94b。攝像部94b例如配置於板94a之上方。攝像部94b拍攝板94a上之基板W之上表面。
The third inspection unit 94 includes an imaging unit 94b. The imaging unit 94b is arranged above the board 94a, for example. The imaging unit 94b images the upper surface of the substrate W on the board 94a.
第3檢查單元94亦可具備未圖示之驅動部。驅動部使板94a及攝像部94b之至少任一者移動，從而改變板94a與攝像部94b之相對位置。藉由驅動部改變板94a與攝像部94b之相對位置，可改變由攝像部94b拍攝之基板W之上表面之範圍。
The 3rd inspection unit 94 may also be equipped with the drive part which is not shown in figure. The drive part moves at least one of the board 94a and the imaging part 94b, and changes the relative position of the board 94a and the imaging part 94b. By changing the relative position of the plate 94a and the imaging unit 94b by the driving unit, the range of the upper surface of the substrate W photographed by the imaging unit 94b can be changed.
第3檢查單元94基於由攝像部94b拍攝之圖像，檢查基板W之上表面。於以下例示藉由第3檢查單元94進行之檢查之內容。
The third inspection unit 94 inspects the upper surface of the substrate W based on the image captured by the imaging unit 94b. The contents of the inspection by the third inspection unit 94 are exemplified below.
‧基板W之上表面之形狀之測定
‧Measurement of the shape of the upper surface of the substrate W
‧基板W之上表面之狀態之特定
‧Specification of the state of the upper surface of the substrate W
‧基板W之上表面中之缺陷之檢測
‧Inspection of defects in the upper surface of the substrate W
此處，基板W之上表面係包括基板W之上表面本身、形成於基板W之
上表面之塗膜、及形成於基板W之上表面之圖案之至少任一者之含義。上述「基板W之上表面之形狀之測定」例如包括測定、檢查形成於基板W之上表面之塗膜之膜厚、或者測定、檢查基板W之切邊寬度。
Here, the upper surface of the substrate W includes the upper surface of the substrate W itself,
Meaning of at least any one of the coating film on the upper surface and the pattern formed on the upper surface of the substrate W. The aforementioned "measurement of the shape of the upper surface of the substrate W" includes, for example, measurement and inspection of the film thickness of the coating film formed on the upper surface of the substrate W, or measurement and inspection of the trimming width of the substrate W.
第5檢查單元114具有與第3檢查單元94大致相同之構造。
The fifth inspection unit 114 has substantially the same structure as the third inspection unit 94 .
參照圖18。第3處理部91具備第3液體處理部95。第5處理部111具備第5液體處理部115。第3液體處理部95及第5液體處理部115對基板W進行液體處理。
Refer to Figure 18. The third processing unit 91 includes a third liquid processing unit 95 . The fifth processing unit 111 includes a fifth liquid processing unit 115 . The third liquid processing unit 95 and the fifth liquid processing unit 115 perform liquid processing on the substrate W.
第3液體處理部95配置於第3搬送空間83之第2側方(例如左方)。第3液體處理部95配置於第1液體處理部35之下方。第5液體處理部115配置於第5搬送空間103之第2側方(例如左方)。第5液體處理部115配置於第1液體處理部35之上方。
The third liquid processing unit 95 is disposed on the second side (for example, left side) of the third transfer space 83 . The third liquid processing unit 95 is disposed below the first liquid processing unit 35 . The fifth liquid processing unit 115 is disposed on the second side (for example, left side) of the fifth transfer space 103 . The fifth liquid processing unit 115 is disposed above the first liquid processing unit 35 .
第3液體處理部95具備複數個(例如6個)第3液體處理單元96。第5液體處理部115具備複數個(例如6個)第5液體處理單元116。各第3液體處理單元96及各第5液體處理單元116對1片基板W進行液體處理。
The third liquid processing unit 95 includes a plurality of (for example, six) third liquid processing units 96 . The fifth liquid processing unit 115 includes a plurality of (for example, six) fifth liquid processing units 116 . Each of the third liquid processing units 96 and each of the fifth liquid processing units 116 performs liquid processing on one substrate W.
第3液體處理單元96及第5液體處理單元116例如為塗佈處理單元。由第3液體處理單元96及第5液體處理單元116進行之液體處理例如為將塗膜材料塗佈於基板W之塗佈處理。第3液體處理單元96及第5液體處理單元116塗佈於基板W之塗膜材料根據基板處理裝置1之動作適當地選擇。各第
3液體處理單元96亦可使用相同種類之塗膜材料。各第5液體處理單元116亦可使用相同種類之塗膜材料。
The third liquid processing unit 96 and the fifth liquid processing unit 116 are, for example, coating processing units. The liquid processing performed by the third liquid processing unit 96 and the fifth liquid processing unit 116 is, for example, a coating process of coating the substrate W with a coating film material. The coating film material applied to the substrate W by the third liquid processing unit 96 and the fifth liquid processing unit 116 is appropriately selected according to the operation of the substrate processing apparatus 1 . Each section
3 The liquid processing unit 96 can also use the same type of coating material. Each fifth liquid processing unit 116 can also use the same kind of coating film material.
複數個第3液體處理單元96於側視下配置為矩陣狀。複數個第5液體處理單元116於側視下配置為矩陣狀。第3液體處理單元96及第5液體處理單元116具有與第1液體處理單元36大致相同之構造。
The plurality of third liquid processing units 96 are arranged in a matrix form in a side view. The plurality of fifth liquid processing units 116 are arranged in a matrix form in a side view. The third liquid processing unit 96 and the fifth liquid processing unit 116 have substantially the same structure as the first liquid processing unit 36 .
第3搬送機構87將基板W搬送至第3熱處理單元93、第3檢查單元94及第3液體處理單元96。例如，第3搬送機構87將基板W依序搬送至第3液體處理單元96、加熱單元HP、冷卻單元CP及第3檢查單元94。第3處理部91對基板W依序進行塗佈處理、加熱處理及冷卻處理。藉此，第3處理部91於基板W形成塗膜。將藉由第3處理部91形成於基板W之塗膜適當地稱為第3塗膜。
The third transport mechanism 87 transports the substrate W to the third thermal processing unit 93 , the third inspection unit 94 , and the third liquid processing unit 96 . For example, the third transport mechanism 87 transports the substrate W to the third liquid processing unit 96 , the heating unit HP, the cooling unit CP, and the third inspection unit 94 in order. The third processing unit 91 sequentially performs coating processing, heating processing, and cooling processing on the substrate W. Thereby, the 3rd processing part 91 forms a coating film on the board|substrate W. As shown in FIG. The coating film formed on the board|substrate W by the 3rd processing part 91 is suitably called a 3rd coating film.
第5搬送機構107將基板W搬送至第5熱處理單元113、第5檢查單元114及第5液體處理單元116。例如，第5搬送機構107將基板W依序搬送至第5液體處理單元116、加熱單元HP、冷卻單元CP及第5檢查單元94。第5處理部111對基板W依序進行塗佈處理、加熱處理、冷卻處理及檢查。藉此，第5處理部111於基板W形成塗膜。將藉由第5處理部111形成於基板W之塗膜適當地稱為第5塗膜。
The fifth transport mechanism 107 transports the substrate W to the fifth thermal processing unit 113 , the fifth inspection unit 114 , and the fifth liquid processing unit 116 . For example, the fifth transport mechanism 107 sequentially transports the substrate W to the fifth liquid processing unit 116 , the heating unit HP, the cooling unit CP, and the fifth inspection unit 94 . The fifth processing unit 111 sequentially performs coating processing, heating processing, cooling processing, and inspection on the substrate W. Thereby, the fifth processing unit 111 forms a coating film on the substrate W. As shown in FIG. The coating film formed on the substrate W by the fifth processing unit 111 is appropriately referred to as a fifth coating film.
參照圖16、17、20。迂迴搬送機構41於側視下配置於與第1處理部31及第1搬送空間23重疊之位置。迂迴搬送機構41於側視下配置於不與第
1非液體處理部32重疊之位置。迂迴搬送機構41於側視下配置於不與第1液體處理部35重疊之位置。
Refer to Figures 16, 17, and 20. The detour transport mechanism 41 is arranged at a position overlapping the first processing unit 31 and the first transport space 23 in a side view. The circuitous conveying mechanism 41 is configured in a side view that is not connected with the first
1 The position where the non-liquid processing part 32 overlaps. The detour transport mechanism 41 is arranged at a position not overlapping with the first liquid processing unit 35 in a side view.
迂迴搬送機構41配置於第3搬送機構87之上方。迂迴搬送機構41配置於第3搬送空間83之上方。迂迴搬送機構41配置於第5搬送機構107之下方。迂迴搬送機構41配置於第5搬送空間103之下方。
The detour transport mechanism 41 is arranged above the third transport mechanism 87 . The detour transport mechanism 41 is arranged above the third transport space 83 . The detour transport mechanism 41 is arranged below the fifth transport mechanism 107 . The detour transport mechanism 41 is arranged below the fifth transport space 103 .
迂迴搬送機構41於前視及側視下配置於第3處理部91之上方。迂迴搬送機構41於前視及側視下配置於不與第3處理部91重疊之位置。迂迴搬送機構41於前視及側視下配置於第5處理部111之下方。迂迴搬送機構41於前視及側視下配置於不與第5處理部111重疊之位置。
The detour transport mechanism 41 is arranged above the third processing unit 91 in front view and side view. The detour transport mechanism 41 is arranged at a position not overlapping with the third processing unit 91 in front view and side view. The detour transport mechanism 41 is arranged below the fifth processing unit 111 in front view and side view. The detour transport mechanism 41 is arranged at a position not overlapping with the fifth processing unit 111 in a front view and a side view.
<第2區塊51>
<2nd block 51>
參照圖15~18。框架52支持第2處理部61、第4處理部131及第6處理部151。框架52支持第2搬送機構57、第4搬送機構127及第6搬送機構147。
Refer to Figures 15-18. The frame 52 supports the second processing unit 61 , the fourth processing unit 131 and the sixth processing unit 151 . The frame 52 supports the second conveying mechanism 57 , the fourth conveying mechanism 127 and the sixth conveying mechanism 147 .
基板處理裝置1除具備第2搬送空間53以外還具備第4搬送空間123及第6搬送空間143。第4搬送空間123及第6搬送空間143形成於第2區塊51。第4搬送空間123配置於第2搬送空間53之下方。第4搬送空間123於俯視下配置於與第2搬送空間53大致相同之位置。第6搬送空間143配置於第2搬送空間53之上方。第6搬送空間143於俯視下配置於與第2搬送空間53大致相同之位置。
The substrate processing apparatus 1 includes a fourth transfer space 123 and a sixth transfer space 143 in addition to the second transfer space 53 . The fourth transfer space 123 and the sixth transfer space 143 are formed in the second block 51 . The 4th conveyance space 123 is arrange|positioned below the 2nd conveyance space 53. As shown in FIG. The 4th conveyance space 123 is arrange|positioned at the substantially same position as the 2nd conveyance space 53 in planar view. The sixth conveyance space 143 is disposed above the second conveyance space 53 . The sixth conveyance space 143 is arranged at substantially the same position as the second conveyance space 53 in plan view.
參照圖17。基板處理裝置1除具備供氣單元54以外還具備供氣單元124、144。基板處理裝置1除具備排氣單元55以外還具備排氣單元125、145。供氣單元124與排氣單元125於第4搬送空間123中形成向下之氣體流動。供氣單元144與排氣單元145於第6搬送空間143中形成向下之氣體流動。
Refer to Figure 17. The substrate processing apparatus 1 includes air supply units 124 and 144 in addition to the air supply unit 54 . The substrate processing apparatus 1 includes exhaust units 125 and 145 in addition to the exhaust unit 55 . The gas supply unit 124 and the exhaust unit 125 form a downward gas flow in the fourth transfer space 123 . The gas supply unit 144 and the exhaust unit 145 form a downward gas flow in the sixth transfer space 143 .
供氣單元54配置於第2搬送空間53之上方且第6搬送空間143之下方。排氣單元55配置於第2搬送空間53之下方且第4搬送空間123之上方。供氣單元124配置於排氣單元55之下方且第4搬送空間123之上方。排氣單元125配置於第4搬送空間123之下方。供氣單元144配置於第6搬送空間143之上方。排氣單元145配置於第6搬送空間143之下方且供氣單元54之上方。供氣單元54、124、144具有與供氣單元24大致相同之形狀及構造。排氣單元55、125、145具有與排氣單元25大致相同之形狀及構造。
The air supply unit 54 is disposed above the second conveyance space 53 and below the sixth conveyance space 143 . The exhaust unit 55 is arranged below the second conveyance space 53 and above the fourth conveyance space 123 . The air supply unit 124 is disposed below the exhaust unit 55 and above the fourth transfer space 123 . The exhaust unit 125 is arranged below the fourth transfer space 123 . The air supply unit 144 is disposed above the sixth transfer space 143 . The exhaust unit 145 is disposed below the sixth transfer space 143 and above the air supply unit 54 . The air supply unit 54 , 124 , 144 has substantially the same shape and structure as the air supply unit 24 . The exhaust units 55 , 125 , 145 have substantially the same shape and structure as the exhaust unit 25 .
第4搬送機構127設置於第4搬送空間123。第6搬送機構147設置於第6搬送空間143。第4搬送機構127及第6搬送機構147具有與第1搬送機構27大致相同之構造。
The fourth conveyance mechanism 127 is installed in the fourth conveyance space 123 . The sixth conveyance mechanism 147 is installed in the sixth conveyance space 143 . The fourth conveying mechanism 127 and the sixth conveying mechanism 147 have substantially the same structure as the first conveying mechanism 27 .
第4處理部131配置於與第4搬送空間123大致相同之高度位置。第4處理部131鄰接於第4搬送空間123。第6處理部151配置於與第6搬送空間143大致相同之高度位置。第6處理部151鄰接於第6搬送空間143。
The fourth processing unit 131 is arranged at substantially the same height as the fourth transfer space 123 . The fourth processing unit 131 is adjacent to the fourth transfer space 123 . The sixth processing unit 151 is arranged at substantially the same height as the sixth transfer space 143 . The sixth processing unit 151 is adjacent to the sixth transfer space 143 .
參照圖16。第4處理部131具備第4非液體處理部132。第6處理部151具備第6非液體處理部152。第4非液體處理部132及第6非液體處理部152對基板W進行非液體處理。
Refer to Figure 16. The fourth processing unit 131 includes a fourth non-liquid processing unit 132 . The sixth processing unit 151 includes a sixth non-liquid processing unit 152 . The fourth non-liquid processing unit 132 and the sixth non-liquid processing unit 152 perform non-liquid processing on the substrate W.
第4非液體處理部132配置於第4搬送空間123之第1側方(例如右方)。第4非液體處理部132配置於第2非液體處理部62之下方。第6非液體處理部152配置於第6搬送空間143之第1側方(例如右方)。第6非液體處理部152配置於第2非液體處理部62之上方。
The fourth non-liquid processing unit 132 is disposed on the first side (for example, right side) of the fourth transfer space 123 . The fourth non-liquid processing unit 132 is disposed below the second non-liquid processing unit 62 . The sixth non-liquid processing unit 152 is disposed on the first side (for example, right side) of the sixth transfer space 143 . The sixth non-liquid processing unit 152 is disposed above the second non-liquid processing unit 62 .
第2非液體處理部62具備複數個(例如16個)第2熱處理單元63。第4非液體處理部132具備複數個(例如20個)第4熱處理單元133。第6非液體處理部152具備複數個(例如20個)第6熱處理單元153。各第2熱處理單元63、各第4熱處理單元133及各第6熱處理單元153對1片基板W進行熱處理。第2熱處理單元63、第4熱處理單元133及第6熱處理單元153相當於非液體處理單元。第2處理部61所包含之非液體處理單元之數量與第1處理部31所包含之非液體處理單元之數量相等。第4處理部131所包含之非液體處理單元之數量多於第1處理部31所包含之非液體處理單元之數量。第6處理部151所包含之非液體處理單元之數量多於第1處理部31所包含之非液體處理單元之數量。
The second non-liquid processing unit 62 includes a plurality of (for example, 16) second heat processing units 63 . The fourth non-liquid processing unit 132 includes a plurality of (for example, 20) fourth heat processing units 133 . The sixth non-liquid processing unit 152 includes a plurality of (for example, 20) sixth thermal processing units 153 . Each second heat treatment unit 63 , each fourth heat treatment unit 133 , and each sixth heat treatment unit 153 heat-process one substrate W. The second heat treatment unit 63 , the fourth heat treatment unit 133 , and the sixth heat treatment unit 153 correspond to non-liquid treatment units. The number of non-liquid processing units included in the second processing unit 61 is equal to the number of non-liquid processing units included in the first processing unit 31 . The number of non-liquid processing units included in the fourth processing unit 131 is greater than the number of non-liquid processing units included in the first processing unit 31 . The number of non-liquid processing units included in the sixth processing unit 151 is greater than the number of non-liquid processing units included in the first processing unit 31 .
8個第2熱處理單元63為加熱單元HP。剩餘8個第2熱處理單元63為冷卻單元CP。4個第4熱處理單元133為疏水化處理單元AHP。其他8個第4熱處理單元133為中溫加熱單元MHP。剩餘8個第4熱處理單元133為高溫加
熱單元HHP。4個第6熱處理單元153為疏水化處理單元AHP。其他8個第6熱處理單元153為中溫加熱單元MHP。剩餘8個第6熱處理單元153為高溫加熱單元HHP。
Eight second heat treatment units 63 are heating units HP. The remaining eight second heat treatment units 63 are cooling units CP. The four fourth heat treatment units 133 are hydrophobization treatment units AHP. The other eight fourth heat treatment units 133 are medium temperature heating units MHP. The remaining 8 fourth heat treatment units 133 are high temperature heating
Heat unit HHP. The four sixth heat treatment units 153 are hydrophobization treatment units AHP. The other eight sixth heat treatment units 153 are medium temperature heating units MHP. The remaining eight sixth heat treatment units 153 are high-temperature heating units HHP.
複數個第2熱處理單元63、複數個第4熱處理單元133及複數個第6熱處理單元153於側視下配置為矩陣狀。例如，複數個第2熱處理單元63於前後方向X上以4行配置，且於上下方向Z上以4段配置。例如，複數個第4熱處理單元133於前後方向X上以4行配置，且於上下方向Z上以5段配置。例如，複數個第6熱處理單元153於前後方向X上以4行配置，且於上下方向Z上以5段配置。
The plurality of second heat treatment units 63 , the plurality of fourth heat treatment units 133 , and the plurality of sixth heat treatment units 153 are arranged in a matrix form in side view. For example, the some 2nd thermal processing unit 63 is arrange|positioned in 4 rows in the front-back direction X, and is arrange|positioned in 4 stages in the up-down direction Z. For example, the plurality of fourth thermal processing units 133 are arranged in four rows in the front-back direction X, and are arranged in five stages in the up-down direction Z. For example, the plurality of sixth thermal processing units 153 are arranged in four rows in the front-back direction X, and are arranged in five stages in the up-down direction Z.
第2熱處理單元63、第4熱處理單元133及第6熱處理單元153具有與第1熱處理單元33大致相同之構造。
The second heat treatment unit 63 , the fourth heat treatment unit 133 , and the sixth heat treatment unit 153 have substantially the same structure as the first heat treatment unit 33 .
參照圖18。第4處理部131具備第4液體處理部135。第6處理部151具備第6液體處理部155。第4液體處理部135及第6液體處理部155對基板W進行液體處理。
Refer to Figure 18. The fourth processing unit 131 includes a fourth liquid processing unit 135 . The sixth processing unit 151 includes a sixth liquid processing unit 155 . The fourth liquid processing unit 135 and the sixth liquid processing unit 155 perform liquid processing on the substrate W.
第4液體處理部135配置於第4搬送空間123之第2側方(例如左方)。第4液體處理部135配置於第2液體處理部65之下方。第6液體處理部155配置於第6搬送空間143之第2側方(例如左方)。第6液體處理部155配置於第2液體處理部65之上方。
The fourth liquid processing unit 135 is disposed on the second side (for example, left side) of the fourth transfer space 123 . The fourth liquid processing unit 135 is disposed below the second liquid processing unit 65 . The sixth liquid processing unit 155 is disposed on the second side (for example, left side) of the sixth transfer space 143 . The sixth liquid processing unit 155 is arranged above the second liquid processing unit 65 .
第4液體處理部135具備複數個(例如6個)第4液體處理單元136。第6液體處理部155具備複數個(例如6個)第6液體處理單元156。各第4液體處理單元136及各第6液體處理單元156對1片基板W進行液體處理。
The fourth liquid processing unit 135 includes a plurality of (for example, six) fourth liquid processing units 136 . The sixth liquid processing unit 155 includes a plurality of (for example, six) sixth liquid processing units 156 . Each of the fourth liquid processing units 136 and each of the sixth liquid processing units 156 performs liquid processing on one substrate W.
第4液體處理單元136及第6液體處理單元156例如為塗佈處理單元。由第4液體處理單元136及第6液體處理單元156進行之液體處理例如為將塗膜材料塗佈於基板W之塗佈處理。第4液體處理單元136及第6液體處理單元156塗佈於基板W之塗膜材料根據基板處理裝置1之動作適當地選擇。各第4液體處理單元136亦可使用相同種類之塗膜材料。各第6液體處理單元156亦可使用相同種類之塗膜材料。
The fourth liquid processing unit 136 and the sixth liquid processing unit 156 are, for example, coating processing units. The liquid processing performed by the fourth liquid processing unit 136 and the sixth liquid processing unit 156 is, for example, a coating process of coating the substrate W with a coating film material. The coating film material applied to the substrate W by the fourth liquid processing unit 136 and the sixth liquid processing unit 156 is appropriately selected according to the operation of the substrate processing apparatus 1 . Each fourth liquid processing unit 136 can also use the same kind of coating film material. Each sixth liquid processing unit 156 can also use the same kind of coating film material.
複數個第4液體處理單元136於側視下配置為矩陣狀。複數個第6液體處理單元156於側視下配置為矩陣狀。第4液體處理單元136及第6液體處理單元156具有與第1液體處理單元36大致相同之構造。
The plurality of fourth liquid processing units 136 are arranged in a matrix form in a side view. A plurality of sixth liquid processing units 156 are arranged in a matrix form in a side view. The fourth liquid processing unit 136 and the sixth liquid processing unit 156 have substantially the same structure as the first liquid processing unit 36 .
第2搬送機構57將基板W搬送至第2熱處理單元63及第2液體處理單元65。例如，第2搬送機構57將基板W依序搬送至冷卻單元CP、第2液體處理單元65及加熱單元HP。第2處理部61對基板W依序進行冷卻處理、塗佈處理及加熱處理。藉此，第2處理部61於基板W形成塗膜。將藉由第2處理部61形成於基板W之塗膜適當地稱為第2塗膜。
The second transport mechanism 57 transports the substrate W to the second thermal processing unit 63 and the second liquid processing unit 65 . For example, the second transport mechanism 57 sequentially transports the substrate W to the cooling unit CP, the second liquid processing unit 65 , and the heating unit HP. The second processing unit 61 sequentially performs cooling processing, coating processing, and heating processing on the substrate W. Thereby, the second processing unit 61 forms a coating film on the substrate W. As shown in FIG. The coating film formed on the board|substrate W by the 2nd processing part 61 is suitably called a 2nd coating film.
第4搬送機構127將基板W搬送至第4熱處理單元133及第4液體處理單元136。例如，第4搬送機構127將基板W依序搬送至疏水化處理單元
AHP、第4液體處理單元136、中溫加熱單元MHP及高溫加熱單元HHP。第4處理部131對基板W依序進行疏水化處理、塗佈處理、中溫加熱處理及高溫加熱處理。藉此，第4處理部131於基板W形成塗膜。將藉由第4處理部131形成於基板W之塗膜適當地稱為第4塗膜。
The fourth transport mechanism 127 transports the substrate W to the fourth thermal processing unit 133 and the fourth liquid processing unit 136 . For example, the fourth transport mechanism 127 sequentially transports the substrate W to the hydrophobization treatment unit.
AHP, fourth liquid processing unit 136 , medium temperature heating unit MHP and high temperature heating unit HHP. The fourth processing unit 131 sequentially performs hydrophobization treatment, coating treatment, medium-temperature heat treatment, and high-temperature heat treatment on the substrate W. Thereby, the fourth processing unit 131 forms a coating film on the substrate W. As shown in FIG. The coating film formed on the substrate W by the fourth processing unit 131 is appropriately referred to as a fourth coating film.
第6搬送機構147將基板W搬送至第6熱處理單元153及第6液體處理單元156。例如，第6搬送機構147將基板W依序搬送至疏水化處理單元AHP、第6液體處理單元156、中溫加熱單元MHP及高溫加熱單元HHP。第6處理部151對基板W依序進行疏水化處理、塗佈處理、中溫加熱處理及高溫加熱處理。藉此，第6處理部151於基板W形成塗膜。將藉由第6處理部151形成於基板W之塗膜適當地稱為第6塗膜。
The sixth transport mechanism 147 transports the substrate W to the sixth thermal processing unit 153 and the sixth liquid processing unit 156 . For example, the sixth transport mechanism 147 sequentially transports the substrate W to the hydrophobization treatment unit AHP, the sixth liquid processing unit 156 , the medium temperature heating unit MHP, and the high temperature heating unit HHP. The sixth processing unit 151 sequentially performs hydrophobization treatment, coating treatment, medium-temperature heat treatment, and high-temperature heat treatment on the substrate W. Thereby, the sixth processing unit 151 forms a coating film on the substrate W. As shown in FIG. The coating film formed on the substrate W by the sixth processing unit 151 is appropriately referred to as a sixth coating film.
亦可第1~第6塗膜之至少2個以上相同。亦可第1~第6塗膜互不相同。
At least two or more of the first to sixth coating films may be the same. The first to sixth coating films may be different from each other.
<中繼區塊161>
<relay block 161>
參照圖15~18、圖21。圖21係中繼區塊161之後視圖。於圖21中，示出第1區塊21所包含之元件(例如第1處理部31、第3處理部91、第5處理部111及迂迴搬送機構41)作為參考。
Refer to Figures 15-18 and Figure 21. FIG. 21 is a rear view of the relay block 161. In FIG. 21 , elements included in the first block 21 (for example, the first processing unit 31 , the third processing unit 91 , the fifth processing unit 111 , and the detour transport mechanism 41 ) are shown for reference.
中繼區塊161具有大致箱形狀。中繼區塊161於俯視、側視及前視下為大致矩形。
The relay block 161 has a substantially box shape. The relay block 161 is substantially rectangular in plan view, side view and front view.
中繼區塊161具有框架162。框架162作為中繼區塊161之構架(骨架)而設置。框架162劃定中繼區塊161之形狀。框架162例如為金屬製。框架162支持中繼搬送機構167。
The relay block 161 has a frame 162 . The frame 162 is provided as a frame (skeleton) of the relay block 161 . The frame 162 defines the shape of the relay block 161 . The frame 162 is made of metal, for example. The frame 162 supports the relay transport mechanism 167 .
基板處理裝置1具備中繼搬送空間163。中繼搬送空間163形成於中繼區塊161。中繼搬送空間163配置於與第1搬送空間23、第3搬送空間83及第5搬送空間103大致相同之高度位置。中繼搬送空間163配置於第1搬送空間23、第3搬送空間83及第5搬送空間103之後方。中繼搬送空間163與第1搬送空間23、第3搬送空間83及第5搬送空間103相接。中繼搬送空間163配置於與第2搬送空間53、第4搬送空間123及第6搬送空間143大致相同之高度位置。中繼搬送空間163配置於第2搬送空間53、第4搬送空間123及第6搬送空間143之前方。中繼搬送空間163與第2搬送空間53、第4搬送空間123及第6搬送空間143相接。
The substrate processing apparatus 1 includes a relay transfer space 163 . The relay transport space 163 is formed in the relay block 161 . The relay conveyance space 163 is arranged at substantially the same height position as the first conveyance space 23 , the third conveyance space 83 , and the fifth conveyance space 103 . The relay conveyance space 163 is arranged behind the first conveyance space 23 , the third conveyance space 83 , and the fifth conveyance space 103 . The relay conveyance space 163 is in contact with the first conveyance space 23 , the third conveyance space 83 , and the fifth conveyance space 103 . The relay conveyance space 163 is arranged at substantially the same height position as the second conveyance space 53 , the fourth conveyance space 123 , and the sixth conveyance space 143 . The relay conveyance space 163 is arranged in front of the second conveyance space 53 , the fourth conveyance space 123 , and the sixth conveyance space 143 . The relay conveyance space 163 is in contact with the second conveyance space 53 , the fourth conveyance space 123 , and the sixth conveyance space 143 .
中繼搬送機構167設置於中繼搬送空間163。中繼搬送機構167具備2個搬送機構168a、168b。各搬送機構168a、168b搬送基板W。搬送機構168a配置於與搬送機構168b大致相同之高度位置。搬送機構168a、168b以於寬度方向Y上排列之方式配置。搬送機構168b配置於搬送機構168a之左方。
The relay conveyance mechanism 167 is installed in the relay conveyance space 163 . The relay conveyance mechanism 167 is provided with two conveyance mechanisms 168a and 168b. Each conveyance mechanism 168a, 168b conveys the board|substrate W. The conveyance mechanism 168a is arrange|positioned at the substantially same height position as the conveyance mechanism 168b. The conveyance mechanisms 168a, 168b are arranged so as to line up in the width direction Y. The transport mechanism 168b is arranged on the left side of the transport mechanism 168a.
搬送機構168a具有與搬送機構18a大致相同之構造及形狀。搬送機構168b與搬送機構18a左右對稱，除該點以外具有大致相同之構造及形狀。
The transport mechanism 168a has substantially the same structure and shape as the transport mechanism 18a. The conveyance mechanism 168b is bilaterally symmetrical to the conveyance mechanism 18a, and has substantially the same structure and shape except for this point.
參照圖17。基板處理裝置1具備第1載置部171、第2載置部172、第3載置部173、第4載置部174、第5載置部175及第6載置部176。於第1~第6載置部171~176載置基板W。第1載置部171配置於中繼搬送機構167與第1搬送機構27之間。中繼搬送機構167與第1搬送機構27可經由第1載置部171相互搬送基板W。第2載置部172配置於中繼搬送機構167與第2搬送機構57之間。中繼搬送機構167與第2搬送機構57可經由第2載置部172相互搬送基板W。第3載置部173配置於中繼搬送機構167與第3搬送機構87之間。中繼搬送機構167與第3搬送機構87可經由第3載置部173相互搬送基板W。第4載置部174配置於中繼搬送機構167與第4搬送機構127之間。中繼搬送機構167與第4搬送機構127可經由第4載置部174相互搬送基板W。第5載置部175配置於中繼搬送機構167與第5搬送機構107之間。中繼搬送機構167與第5搬送機構107可經由第5載置部175相互搬送基板W。第6載置部176配置於中繼搬送機構167與第6搬送機構147之間。中繼搬送機構167與第6搬送機構147可經由第6載置部176相互搬送基板W。
Refer to Figure 17. The substrate processing apparatus 1 includes a first loading unit 171 , a second loading unit 172 , a third loading unit 173 , a fourth loading unit 174 , a fifth loading unit 175 , and a sixth loading unit 176 . The substrate W is placed on the first to sixth placement parts 171 to 176 . The first loading unit 171 is disposed between the relay transport mechanism 167 and the first transport mechanism 27 . The relay transport mechanism 167 and the first transport mechanism 27 can transport the substrate W to each other via the first loading unit 171 . The second loading unit 172 is arranged between the relay transport mechanism 167 and the second transport mechanism 57 . The relay transport mechanism 167 and the second transport mechanism 57 can transport the substrate W to each other via the second loading unit 172 . The third loading unit 173 is arranged between the relay transport mechanism 167 and the third transport mechanism 87 . The relay transport mechanism 167 and the third transport mechanism 87 can transport the substrate W to each other via the third loading unit 173 . The fourth loading unit 174 is arranged between the relay transport mechanism 167 and the fourth transport mechanism 127 . The relay transport mechanism 167 and the fourth transport mechanism 127 can transport the substrate W to each other via the fourth loading unit 174 . The fifth loading unit 175 is arranged between the relay transport mechanism 167 and the fifth transport mechanism 107 . The relay transport mechanism 167 and the fifth transport mechanism 107 can transport the substrate W to each other via the fifth loading unit 175 . The sixth loading unit 176 is disposed between the relay transport mechanism 167 and the sixth transport mechanism 147 . The relay transport mechanism 167 and the sixth transport mechanism 147 can transport the substrate W to each other via the sixth loading unit 176 .
第1載置部171、第3載置部173及第5載置部175配置於第1區塊21與中繼區塊161之間。第1載置部171、第3載置部173及第5載置部175跨及第1區塊21及中繼區塊161而配置。第1載置部171跨及第1搬送空間23及中繼搬送空間163而配置。第3載置部173跨及第3搬送空間83及中繼搬送空間163而配置。第5載置部175跨及第5搬送空間103及中繼搬送空間163而配置。
The first loading unit 171 , the third loading unit 173 and the fifth loading unit 175 are arranged between the first block 21 and the relay block 161 . The first loading unit 171 , the third loading unit 173 , and the fifth loading unit 175 are arranged across the first block 21 and the relay block 161 . The first loading unit 171 is disposed across the first conveyance space 23 and the relay conveyance space 163 . The third loading unit 173 is arranged across the third conveyance space 83 and the relay conveyance space 163 . The fifth loading unit 175 is arranged straddling the fifth conveyance space 103 and the relay conveyance space 163 .
第1載置部171配置於與第1搬送機構27大致相同之高度位置。第1載
置部171配置於第1搬送機構27之後方。第3載置部173配置於與第3搬送機構87大致相同之高度位置。第3載置部173配置於第3搬送機構87之後方。第5載置部175配置於與第5搬送機構107大致相同之高度位置。第5載置部175配置於第5搬送機構107之後方。
The first loading unit 171 is arranged at substantially the same height as the first transport mechanism 27 . 1st load
The placement unit 171 is disposed behind the first transport mechanism 27 . The 3rd loading part 173 is arrange|positioned in the height position substantially the same as the 3rd conveyance mechanism 87. As shown in FIG. The third loading unit 173 is disposed behind the third transport mechanism 87 . The 5th loading part 175 is arrange|positioned in the height position substantially the same as the 5th conveyance mechanism 107. As shown in FIG. The fifth loading unit 175 is disposed behind the fifth transport mechanism 107 .
第1載置部171、第3載置部173及第5載置部175配置於與中繼搬送機構167大致相同之高度位置。第1載置部171、第3載置部173及第5載置部175配置於中繼搬送機構167之前方。第1載置部171、第3載置部173及第5載置部175配置於搬送機構168a之前方且左方。第1載置部171、第3載置部173及第5載置部175配置於搬送機構168b之前方且右方。
The 1st loading part 171, the 3rd loading part 173, and the 5th loading part 175 are arrange|positioned in the height position substantially the same as the relay conveyance mechanism 167. As shown in FIG. The first loading unit 171 , the third loading unit 173 , and the fifth loading unit 175 are arranged in front of the relay transport mechanism 167 . The 1st loading part 171, the 3rd loading part 173, and the 5th loading part 175 are arrange|positioned at the front and left side of the conveyance mechanism 168a. The 1st loading part 171, the 3rd loading part 173, and the 5th loading part 175 are arrange|positioned in front of the conveyance mechanism 168b, and right.
第1載置部171、第3載置部173及第5載置部175以於上下方向Z上排列之方式配置。第3載置部173於俯視下與第1載置部171重疊。第5載置部175於俯視下與第1載置部171重疊。
The 1st mounting part 171, the 3rd mounting part 173, and the 5th mounting part 175 are arrange|positioned so that they may line up in the up-down direction Z. As shown in FIG. The third mounting portion 173 overlaps the first mounting portion 171 in plan view. The fifth mounting portion 175 overlaps the first mounting portion 171 in plan view.
第2載置部172、第4載置部174及第6載置部176配置於第2區塊51與中繼區塊161之間。第2載置部172、第4載置部174及第6載置部176跨及第2區塊51及中繼區塊161而配置。第2載置部172跨及第2搬送空間53及中繼搬送空間163而配置。第4載置部174跨及第4搬送空間123及中繼搬送空間163而配置。第6載置部176跨及第6搬送空間143及中繼搬送空間163而配置。
The second loading unit 172 , the fourth loading unit 174 and the sixth loading unit 176 are arranged between the second block 51 and the relay block 161 . The second loading unit 172 , the fourth loading unit 174 , and the sixth loading unit 176 are arranged across the second block 51 and the relay block 161 . The second loading unit 172 is arranged across the second conveyance space 53 and the relay conveyance space 163 . The fourth loading unit 174 is disposed across the fourth transfer space 123 and the relay transfer space 163 . The sixth loading unit 176 is arranged across the sixth conveyance space 143 and the relay conveyance space 163 .
第2載置部172、第4載置部174及第6載置部176配置於與中繼搬送機
構167大致相同之高度位置。第2載置部172、第4載置部174及第6載置部176配置於中繼搬送機構167之後方。第2載置部172、第4載置部174及第6載置部176配置於搬送機構168a之後方且左方。第2載置部172、第4載置部174及第6載置部176配置於搬送機構168b之後方且右方。
The second loader 172, the fourth loader 174, and the sixth loader 176 are arranged on the intermediary conveyor
The height position of structure 167 is roughly the same. The second loading unit 172 , the fourth loading unit 174 , and the sixth loading unit 176 are disposed behind the relay transport mechanism 167 . The 2nd loading part 172, the 4th loading part 174, and the 6th loading part 176 are arrange|positioned behind the conveyance mechanism 168a, and left. The 2nd loading part 172, the 4th loading part 174, and the 6th loading part 176 are arrange|positioned behind the conveyance mechanism 168b, and right.
第2載置部172配置於與第2搬送機構57大致相同之高度位置。第2載置部172配置於第2搬送機構57之前方。第4載置部174配置於與第4搬送機構127大致相同之高度位置。第4載置部174配置於第4搬送機構127之前方。第6載置部176配置於與第6搬送機構147大致相同之高度位置。第6載置部176配置於第6搬送機構147之前方。
The second loading unit 172 is arranged at substantially the same height position as the second conveying mechanism 57 . The second loading unit 172 is arranged in front of the second transport mechanism 57 . The 4th loading part 174 is arrange|positioned at substantially the same height position as the 4th conveyance mechanism 127. As shown in FIG. The fourth loading unit 174 is arranged in front of the fourth transport mechanism 127 . The sixth loading unit 176 is arranged at substantially the same height as the sixth transport mechanism 147 . The sixth loading unit 176 is arranged in front of the sixth transport mechanism 147 .
第2載置部172、第4載置部174及第6載置部176以於上下方向Z上排列之方式配置。第4載置部174於俯視下與第2載置部172重疊。第6載置部176於俯視下與第4載置部174重疊。
The 2nd loading part 172, the 4th loading part 174, and the 6th loading part 176 are arrange|positioned so that they may line up in the up-down direction Z. As shown in FIG. The 4th loading part 174 overlaps with the 2nd loading part 172 in planar view. The sixth mounting portion 176 overlaps the fourth mounting portion 174 in plan view.
第1~第6載置部171~176具有與前載置部71大致相同之構造。即，第1~第6載置部171~176具備複數個(例如4個)板72。第1~第6載置部171~176可載置複數個基板W。
The first to sixth placement parts 171 to 176 have substantially the same structure as that of the front placement part 71 . That is, the first to sixth placement parts 171 to 176 include a plurality of (for example, four) plates 72 . A plurality of substrates W can be placed on the first to sixth placement parts 171 to 176 .
第1搬送機構27可將基板W載置於第1載置部171。第1搬送機構27可拿取第1載置部171上之基板W。第3搬送機構87可將基板W載置於第3載置部173。第3搬送機構87可拿取第3載置部173上之基板W。第5搬送機構107可將基板W載置於第5載置部175。第5搬送機構107可拿取第5載置部
175上之基板W。
The first transport mechanism 27 can place the substrate W on the first loading unit 171 . The first transport mechanism 27 can pick up the substrate W on the first loading unit 171 . The third transport mechanism 87 can place the substrate W on the third loading unit 173 . The third conveying mechanism 87 can pick up the substrate W on the third loading unit 173 . The fifth transport mechanism 107 can place the substrate W on the fifth loading unit 175 . The 5th conveying mechanism 107 can take the 5th loading part
175 on the substrate W.
中繼搬送機構167可將基板W載置於第1~第6載置部171~176。搬送機構168a、168b分別可將基板W載置於第1~第6載置部171~176。中繼搬送機構167可拿取第1~第6載置部171~176上之基板W。搬送機構168a、168b分別可拿取第1~第6載置部171~176上之基板W。
The relay transport mechanism 167 can place the substrate W on the first to sixth loading parts 171 to 176 . The transport mechanisms 168a and 168b can place the substrate W on the first to sixth loading parts 171 to 176, respectively. The relay transport mechanism 167 can pick up the substrates W on the first to sixth placement parts 171 to 176 . The transport mechanisms 168a and 168b can pick up the substrates W on the first to sixth placement parts 171 to 176, respectively.
第2搬送機構57可將基板W載置於第2載置部172。第2搬送機構57可拿取第2載置部172上之基板W。第4搬送機構127可將基板W載置於第4載置部174。第4搬送機構127可拿取第4載置部174上之基板W。第6搬送機構147可將基板W載置於第6載置部176。第6搬送機構147可拿取第6載置部176上之基板W。
The second transport mechanism 57 can place the substrate W on the second loading unit 172 . The second transport mechanism 57 can pick up the substrate W on the second loading unit 172 . The fourth transport mechanism 127 can place the substrate W on the fourth loading unit 174 . The fourth conveying mechanism 127 can pick up the substrate W on the fourth loading unit 174 . The sixth transport mechanism 147 can place the substrate W on the sixth loading unit 176 . The sixth conveying mechanism 147 can pick up the substrate W on the sixth loading unit 176 .
圖15示出將俯視下之第1載置部171與第2載置部172相連之假想之線段E。線段E於俯視下與前後方向X大致平行。圖15示出線段E之中垂線F。中垂線F為假想之線。中繼搬送機構167於俯視下配置於與中垂線F交叉之位置。搬送機構168a、168b分別於俯視下配置於與中垂線F交叉之位置。搬送機構168a於俯視下配置於線段E之第1側方(具體而言為右方)。搬送機構168b於俯視下配置於線段E之第2側方(具體而言為左方)。
FIG. 15 shows an imaginary line segment E connecting the first mounting portion 171 and the second mounting portion 172 in plan view. The line segment E is substantially parallel to the front-back direction X in plan view. FIG. 15 shows a perpendicular line F to the line segment E. FIG. The vertical line F is an imaginary line. The relay transport mechanism 167 is arranged at a position intersecting the vertical line F in plan view. The conveying mechanisms 168a and 168b are arranged at positions intersecting the vertical line F in plan view, respectively. The conveyance mechanism 168a is arrange|positioned at the 1st side of the line segment E (specifically, the right side) in planar view. The conveyance mechanism 168b is arrange|positioned at the 2nd side of the line segment E (specifically, the left side) in planar view.
搬送機構168a、168b之一者為本發明中之第1中繼搬送機構之例。搬送機構168a、168b之另一者為本發明中之第2中繼搬送機構之例。
One of the transport mechanisms 168a, 168b is an example of the first intermediate transport mechanism in the present invention. The other of the transport mechanisms 168a and 168b is an example of the second intermediary transport mechanism in the present invention.
圖22係基板處理裝置1之俯視圖。圖22省略第1非液體處理部32之圖示。迂迴搬送機構41與中繼搬送機構167直接地交接基板W。具體而言，於迂迴搬送機構41與中繼搬送機構167之間搬送基板W時，迂迴搬送機構41與中繼搬送機構167同時接觸相同基板W。
FIG. 22 is a top view of the substrate processing apparatus 1 . FIG. 22 omits the illustration of the first non-liquid processing unit 32 . The detour transport mechanism 41 directly delivers the substrate W to the relay transport mechanism 167 . Specifically, when the substrate W is transferred between the detour transfer mechanism 41 and the relay transfer mechanism 167 , the detour transfer mechanism 41 and the relay transfer mechanism 167 contact the same substrate W at the same time.
搬送機構168b之保持部19d、19e於俯視下具有大致U字形狀或大致Y字形狀。搬送機構168b之保持部19d、19e與基板W之部分P3接觸。迂迴搬送機構41之保持部44c、44e於俯視下具有大致I字形狀。迂迴搬送機構41之保持部44c、44e(具體而言為墊45b)與基板W之部分Q接觸。基板W之部分P3與基板W之部分Q不同。基板W之部分P3例如為基板W之背面之除中央部以外之部分。基板W之部分P3例如為基板W之背面之周緣部。基板W之部分Q例如為基板W之背面之中央部。因此，於搬送機構168b與迂迴搬送機構41同時接觸相同基板W時，搬送機構168b與迂迴搬送機構41不相互干涉。
The holding parts 19d and 19e of the transport mechanism 168b have a substantially U-shape or a substantially Y-shape in plan view. The holding parts 19d and 19e of the transport mechanism 168b are in contact with the portion P3 of the substrate W. As shown in FIG. The holding parts 44c and 44e of the roundabout conveyance mechanism 41 have a substantially I-shape in plan view. The holding parts 44c and 44e (specifically, the pads 45b ) of the detour transport mechanism 41 are in contact with the portion Q of the substrate W. As shown in FIG. The portion P3 of the substrate W is different from the portion Q of the substrate W. FIG. The portion P3 of the substrate W is, for example, the portion of the back surface of the substrate W other than the central portion. The portion P3 of the substrate W is, for example, the peripheral portion of the back surface of the substrate W. The portion Q of the substrate W is, for example, the central portion of the back surface of the substrate W. Therefore, when the transport mechanism 168b and the detour transport mechanism 41 contact the same substrate W at the same time, the transport mechanism 168b and the detour transport mechanism 41 do not interfere with each other.
基板W之接觸搬送機構168a之保持部19d、19e之部分與基板W之部分P3大致相同。因此，基板W之接觸搬送機構168a之保持部19d、19e之部分與基板W之部分Q不同。因此，於搬送機構168a與迂迴搬送機構41同時接觸相同基板W時，搬送機構168a與迂迴搬送機構41不相互干涉。
The portion of the substrate W that contacts the holding portions 19d and 19e of the transport mechanism 168a is substantially the same as the portion P3 of the substrate W. Therefore, the portion of the substrate W that contacts the holding portions 19d and 19e of the transport mechanism 168a is different from the portion Q of the substrate W. Therefore, when the transport mechanism 168a and the detour transport mechanism 41 contact the same substrate W at the same time, the transport mechanism 168a and the detour transport mechanism 41 do not interfere with each other.
中繼搬送機構167將基板W交遞至迂迴搬送機構41之動作與主搬送機構17將基板W交遞至迂迴搬送機構41之動作例大致相同。迂迴搬送機構41將基板W交遞至中繼搬送機構167之動作與迂迴搬送機構41將基板W交
遞至主搬送機構17之動作例大致相同。但是，於中繼搬送機構167將基板W交遞至迂迴搬送機構41時，及迂迴搬送機構41將基板W交遞至中繼搬送機構167時，水平移動部44a位於迂迴支持部42之後端。進而，藉由臂部44b、44d之旋轉，保持部44c、44e位於較水平移動部44a更靠後方。
The operation example in which the relay transport mechanism 167 delivers the substrate W to the roundabout transport mechanism 41 is substantially the same as the operation example in which the main transport mechanism 17 delivers the substrate W to the roundabout transport mechanism 41 . The operation of the circuitous transport mechanism 41 delivering the substrate W to the relay transport mechanism 167 is the same as that of the circuitous transport mechanism 41 delivering the substrate W.
The action example of handing over to the main conveying mechanism 17 is roughly the same. However, when the relay transport mechanism 167 delivers the substrate W to the detour transport mechanism 41 , and when the detour transport mechanism 41 delivers the substrate W to the relay transport mechanism 167 , the horizontal movement unit 44 a is located at the rear end of the detour support unit 42 . Furthermore, by rotation of the arm parts 44b and 44d, the holding|maintenance parts 44c and 44e are located behind rather than the horizontal movement part 44a.
將在中繼搬送機構167與迂迴搬送機構41之間交接基板W之位置稱為第5交接位置。將在中繼搬送機構167與第1搬送機構27之間交接基板W之位置稱為第6交接位置。第5交接位置於俯視下與第6交接位置大致相同。此處，第6交接位置與第1載置部171之位置大致相同。因此，第5交接位置於俯視下與第1載置部171之位置大致相同。
The position where the substrate W is delivered between the relay transport mechanism 167 and the detour transport mechanism 41 is referred to as a fifth delivery position. The position where the substrate W is delivered between the relay transport mechanism 167 and the first transport mechanism 27 is referred to as a sixth delivery position. The fifth transfer position is substantially the same as the sixth transfer position in plan view. Here, the sixth delivery position is substantially the same as the position of the first placement portion 171 . Therefore, the fifth delivery position is substantially the same as the position of the first placement part 171 in plan view.
第5交接位置係第6交接位置之下方之位置。第5交接位置係第1載置部171之下方之位置。
The 5th transfer position is the position below the 6th transfer position. The fifth transfer position is a position below the first loading unit 171 .
<控制部>
<control department>
控制部79控制傳載機部11、第1區塊21、第2區塊51及中繼區塊161。更具體而言，控制部79控制第1處理部31、第2處理部61、第3處理部91、第4處理部131、第5處理部111及第6處理部151。控制部79控制主搬送機構17、第1搬送機構27、第2搬送機構57、第3搬送機構87、第4搬送機構127、第5搬送機構107、第6搬送機構147、迂迴搬送機構41及中繼搬送機構167。
The control unit 79 controls the carrier unit 11 , the first block 21 , the second block 51 , and the relay block 161 . More specifically, the control unit 79 controls the first processing unit 31 , the second processing unit 61 , the third processing unit 91 , the fourth processing unit 131 , the fifth processing unit 111 , and the sixth processing unit 151 . The control unit 79 controls the main transport mechanism 17, the first transport mechanism 27, the second transport mechanism 57, the third transport mechanism 87, the fourth transport mechanism 127, the fifth transport mechanism 107, the sixth transport mechanism 147, the detour transport mechanism 41 and Relay transfer mechanism 167.
<基板處理裝置1之動作例>
<Operation Example of Substrate Processing Apparatus 1>
圖23(a)係模式性地表示圖14(a)所示之第4動作例中之基板W之搬送路徑的圖。圖23(b)係模式性地表示圖14(b)所示之第5動作例中之基板W之搬送路徑的圖。再者，於圖23(a)、23(b)中，將載具載置部12a、12b示於與圖15不同之位置。
FIG. 23( a ) is a diagram schematically showing the conveyance path of the substrate W in the fourth operation example shown in FIG. 14( a ). FIG. 23( b ) is a diagram schematically showing the conveyance path of the substrate W in the fifth operation example shown in FIG. 14( b ). In addition, in FIG. 23(a), 23(b), the carrier mounting part 12a, 12b is shown in the position different from FIG. 15. FIG.
參照圖23(a)，重新對第4動作例進行說明。搬送機構18a將第1基板W1及第2基板W2自載具載置部12a上之載具C搬送至迂迴搬送機構41。迂迴搬送機構41將第1基板W1及第2基板W2自搬送機構18a搬送至中繼搬送機構167。中繼搬送機構167將第1基板W1自迂迴搬送機構41搬送至第4載置部174，且將第2基板W2自迂迴搬送機構41搬送至第6載置部176。第4搬送機構127將第1基板W1自第4載置部174搬送至第4處理部131，且將第1基板W1自第4處理部131搬送至第4載置部174。第6搬送機構147將第2基板W2自第6載置部176搬送至第6處理部151，且將第2基板W2自第6處理部151搬送至第6載置部176。中繼搬送機構167將第1基板W1自第4載置部174搬送至第1載置部171，且將第2基板W2自第6載置部176搬送至第2載置部172。第1搬送機構27將第1基板W1自第1載置部171搬送至第1處理部31，且將第1基板W1自第1處理部31搬送至第1載置部171。第2搬送機構57將第2基板W2自第2載置部172搬送至第2處理部61，且將基板W自第2處理部61搬送至第2載置部172。中繼搬送機構167將第1基板W1自第1載置部171搬送至第3載置部173，且將第2基板W2自第2載置部172搬送至第5載置部175。第3搬送機構87將第1基板W1自第3載置部173搬送至第3處理部91，並將第1基板W1自第3處理部91搬送至前載置部73。第5搬送機構107將第2基板W2自第5載置部175搬送至第5處理部111，並將第2基板
W2自第5處理部111搬送至前載置部75。搬送機構18b將第1基板W1自前載置部73搬送至載具載置部12b上之載具C，且將第2基板W2自前載置部75搬送至載具載置部12b上之載具C。
Referring to Fig. 23(a), the fourth operation example will be described again. The transport mechanism 18 a transports the first substrate W1 and the second substrate W2 from the carrier C on the carrier mounting portion 12 a to the detour transport mechanism 41 . The detour transport mechanism 41 transports the first substrate W1 and the second substrate W2 from the transport mechanism 18 a to the relay transport mechanism 167 . The relay transport mechanism 167 transports the first substrate W1 from the detour transport mechanism 41 to the fourth placement unit 174 , and transports the second substrate W2 from the detour transport mechanism 41 to the sixth placement unit 176 . The fourth transport mechanism 127 transports the first substrate W1 from the fourth loading unit 174 to the fourth processing unit 131 , and transports the first substrate W1 from the fourth processing unit 131 to the fourth loading unit 174 . The sixth transport mechanism 147 transports the second substrate W2 from the sixth loading unit 176 to the sixth processing unit 151 , and transports the second substrate W2 from the sixth processing unit 151 to the sixth loading unit 176 . The relay transport mechanism 167 transports the first substrate W1 from the fourth loading unit 174 to the first loading unit 171 , and transports the second substrate W2 from the sixth loading unit 176 to the second loading unit 172 . The first transport mechanism 27 transports the first substrate W1 from the first loading unit 171 to the first processing unit 31 , and transports the first substrate W1 from the first processing unit 31 to the first loading unit 171 . The second transport mechanism 57 transports the second substrate W2 from the second loading unit 172 to the second processing unit 61 , and transports the substrate W from the second processing unit 61 to the second loading unit 172 . The relay transport mechanism 167 transports the first substrate W1 from the first loading unit 171 to the third loading unit 173 , and transports the second substrate W2 from the second loading unit 172 to the fifth loading unit 175 . The third transport mechanism 87 transports the first substrate W1 from the third loading unit 173 to the third processing unit 91 , and transports the first substrate W1 from the third processing unit 91 to the front loading unit 73 . The fifth transport mechanism 107 transports the second substrate W2 from the fifth loading unit 175 to the fifth processing unit 111, and transfers the second substrate W2 to the fifth processing unit 111.
W2 is conveyed from the fifth processing unit 111 to the front loading unit 75 . The transport mechanism 18b transports the first substrate W1 from the front loading section 73 to the carrier C on the carrier loading section 12b, and transports the second substrate W2 from the front loading section 75 to the carrier on the carrier loading section 12b. c.
於第4動作例中，基板處理裝置1於第1基板W1形成3層塗膜。具體而言，基板處理裝置1於第1基板W1之上表面形成第4塗膜，於第4塗膜之上表面形成第1塗膜，並於第1塗膜之上表面形成第3塗膜。於第4動作例中，基板處理裝置1於第2基板W2形成3層塗膜。具體而言，基板處理裝置1於第2基板W2之上表面形成第6塗膜，於第6塗膜之上表面形成第2塗膜，並於第2塗膜之上表面形成第5塗膜。
In the fourth operation example, the substrate processing apparatus 1 forms a three-layer coating film on the first substrate W1. Specifically, the substrate processing apparatus 1 forms a fourth coating film on the upper surface of the first substrate W1, forms a first coating film on the upper surface of the fourth coating film, and forms a third coating film on the upper surface of the first coating film. . In the fourth operation example, the substrate processing apparatus 1 forms a three-layer coating film on the second substrate W2. Specifically, the substrate processing apparatus 1 forms a sixth coating film on the upper surface of the second substrate W2, forms a second coating film on the upper surface of the sixth coating film, and forms a fifth coating film on the upper surface of the second coating film. .
例如，亦可第4塗膜及第6塗膜為下層膜，第1塗膜及第2塗膜為中間膜，且第3塗膜及第5塗膜為上層膜。例如，亦可第4塗膜及第6塗膜為抗反射膜，第1塗膜及第2塗膜為抗蝕膜，且第3塗膜及第5塗膜為保護膜。
For example, the fourth coating film and the sixth coating film may be the lower layer film, the first coating film and the second coating film may be the intermediate film, and the third coating film and the fifth coating film may be the upper layer film. For example, the fourth and sixth coating films may be antireflection films, the first and second coating films may be resist films, and the third and fifth coating films may be protective films.
參照圖23(b)，重新對第5動作例進行說明。搬送機構18a將第1基板W1自載具載置部12a上之載具C搬送至前載置部73，且將第2基板W2自載具載置部12a上之載具C搬送至前載置部75。第3搬送機構87將第1基板W1自前載置部73搬送至第3處理部91，並將第1基板W1自第3處理部91搬送至第3載置部173。第5搬送機構107將第2基板W2自前載置部75搬送至第5處理部111，並將第2基板W2自第5處理部111搬送至第5載置部175。中繼搬送機構167將第1基板W1自第3載置部173搬送至第1載置部171，且將第2基板W2自第5載置部175搬送至第2載置部172。第1搬送機構27將第1基
板W1自第1載置部171搬送至第1處理部31，且將第1基板W1自第1處理部31搬送至第1載置部171。第2搬送機構57將第2基板W2自第2載置部172搬送至第2處理部61，且將基板W自第2處理部61搬送至第2載置部172。中繼搬送機構167將第1基板W1自第1載置部171搬送至第4載置部174，且將第2基板W2自第2載置部172搬送至第6載置部176。第4搬送機構127將第1基板W1自第4載置部174搬送至第4處理部131，且將第1基板W1自第4處理部131搬送至第4載置部174。第6搬送機構147將第2基板W2自第6載置部176搬送至第6處理部151，且將第2基板W2自第6處理部151搬送至第6載置部176。中繼搬送機構167將第1基板W1自第4載置部174搬送至迂迴搬送機構41，且將第2基板W2自第6載置部176搬送至迂迴搬送機構41。迂迴搬送機構41將第1基板W1及第2基板W2自中繼搬送機構167搬送至搬送機構18b。搬送機構18b將第1基板W1及第2基板W2自迂迴搬送機構41搬送至載具載置部12b上之載具C。
Referring to Fig. 23(b), the fifth operation example will be described again. The transfer mechanism 18a transfers the first substrate W1 from the carrier C on the carrier placement section 12a to the front placement section 73, and transfers the second substrate W2 from the carrier C on the carrier placement section 12a to the front placement section. Setting part 75. The third transport mechanism 87 transports the first substrate W1 from the front loading unit 73 to the third processing unit 91 , and transports the first substrate W1 from the third processing unit 91 to the third loading unit 173 . The fifth transport mechanism 107 transports the second substrate W2 from the front loading unit 75 to the fifth processing unit 111 , and transports the second substrate W2 from the fifth processing unit 111 to the fifth loading unit 175 . The relay transport mechanism 167 transports the first substrate W1 from the third loading unit 173 to the first loading unit 171 , and transports the second substrate W2 from the fifth loading unit 175 to the second loading unit 172 . The first conveying mechanism 27 moves the first base
The board W1 is conveyed from the first loading unit 171 to the first processing unit 31 , and the first substrate W1 is transported from the first processing unit 31 to the first loading unit 171 . The second transport mechanism 57 transports the second substrate W2 from the second loading unit 172 to the second processing unit 61 , and transports the substrate W from the second processing unit 61 to the second loading unit 172 . The relay transport mechanism 167 transports the first substrate W1 from the first loading unit 171 to the fourth loading unit 174 , and transports the second substrate W2 from the second loading unit 172 to the sixth loading unit 176 . The fourth transport mechanism 127 transports the first substrate W1 from the fourth loading unit 174 to the fourth processing unit 131 , and transports the first substrate W1 from the fourth processing unit 131 to the fourth loading unit 174 . The sixth transport mechanism 147 transports the second substrate W2 from the sixth loading unit 176 to the sixth processing unit 151 , and transports the second substrate W2 from the sixth processing unit 151 to the sixth loading unit 176 . The relay transport mechanism 167 transports the first substrate W1 from the fourth placement unit 174 to the roundabout transport mechanism 41 , and transports the second substrate W2 from the sixth placement unit 176 to the roundabout transport mechanism 41 . The detour transport mechanism 41 transports the first substrate W1 and the second substrate W2 from the relay transport mechanism 167 to the transport mechanism 18b. The transport mechanism 18b transports the first substrate W1 and the second substrate W2 from the detour transport mechanism 41 to the carrier C on the carrier placement portion 12b.
於第5動作例中，基板處理裝置1於第1基板W1形成3層塗膜。具體而言，基板處理裝置1於第1基板W1之上表面形成第3塗膜，於第3塗膜之上表面形成第1塗膜，並於第1塗膜之上表面形成第4塗膜。於第5動作例中，基板處理裝置1於第2基板W2形成3層塗膜。具體而言，基板處理裝置1於第2基板W2之上表面形成第5塗膜，於第5塗膜之上表面形成第2塗膜，並於第2塗膜之上表面形成第6塗膜。
In the fifth operation example, the substrate processing apparatus 1 forms a three-layer coating film on the first substrate W1. Specifically, the substrate processing apparatus 1 forms a third coating film on the upper surface of the first substrate W1, forms a first coating film on the upper surface of the third coating film, and forms a fourth coating film on the upper surface of the first coating film. . In the fifth operation example, the substrate processing apparatus 1 forms a three-layer coating film on the second substrate W2. Specifically, the substrate processing apparatus 1 forms a fifth coating film on the upper surface of the second substrate W2, forms a second coating film on the upper surface of the fifth coating film, and forms a sixth coating film on the upper surface of the second coating film. .
例如，亦可第3塗膜及第5塗膜為下層膜，第1塗膜及第2塗膜為中間膜，且第4塗膜及第6塗膜為上層膜。例如，亦可第3塗膜及第5塗膜為抗
反射膜，第1塗膜及第2塗膜為抗蝕膜，且第4塗膜及第6塗膜為保護膜。
For example, the third coating film and the fifth coating film may be the lower layer film, the first coating film and the second coating film may be the intermediate film, and the fourth coating film and the sixth coating film may be the upper layer film. For example, the 3rd coating film and the 5th coating film can also be anti-
In the reflective film, the first coating film and the second coating film are resist films, and the fourth coating film and sixth coating film are protective films.
<第2實施形態之其他效果>
<Other effects of the second embodiment>
第2實施形態之主要效果如上所述。以下，對第2實施形態之其他效果進行說明。
The main effects of the second embodiment are as described above. Next, other effects of the second embodiment will be described.
迂迴搬送機構41於側視下配置於與第1處理部31及第1搬送空間23重疊之位置。迂迴搬送機構41於側視下配置於不與第3處理部91重疊之位置。此處，上下方向Z上之第1非液體處理部32之長度L32小於上下方向Z上之第3非液體處理部92之長度L92。因此，可相對較容易地確保迂迴搬送機構41之設置空間。
The detour transport mechanism 41 is arranged at a position overlapping the first processing unit 31 and the first transport space 23 in a side view. The detour transport mechanism 41 is arranged at a position not overlapping with the third processing unit 91 in a side view. Here, the length L32 of the first non-liquid processing part 32 in the vertical direction Z is smaller than the length L92 of the third non-liquid processing part 92 in the vertical direction Z. Therefore, it is relatively easy to ensure the installation space of the detour transport mechanism 41 .
第1處理部31所包含之非液體處理單元之數量少於第3處理部91所包含之非液體處理單元之數量。因此，第1非液體處理部32之設置空間小於第3非液體處理部92之設置空間。因此，可容易地確保迂迴搬送機構41之設置空間。
The number of non-liquid processing units included in the first processing unit 31 is smaller than the number of non-liquid processing units included in the third processing unit 91 . Therefore, the installation space of the first non-liquid processing unit 32 is smaller than the installation space of the third non-liquid processing unit 92 . Therefore, the installation space of the roundabout conveyance mechanism 41 can be ensured easily.
迂迴搬送機構41於側視下配置於與第1處理部31及第1搬送空間23重疊之位置。迂迴搬送機構41於側視下配置於不與第5處理部111重疊之位置。此處，上下方向Z上之第1非液體處理部32之長度L32小於上下方向Z上之第5非液體處理部112之長度L112。因此，可相對較容易地確保迂迴搬送機構41之設置空間。
The detour transport mechanism 41 is arranged at a position overlapping the first processing unit 31 and the first transport space 23 in a side view. The detour transport mechanism 41 is arranged at a position not overlapping with the fifth processing unit 111 in a side view. Here, the length L32 of the first non-liquid processing part 32 in the vertical direction Z is smaller than the length L112 of the fifth non-liquid processing part 112 in the vertical direction Z. Therefore, it is relatively easy to ensure the installation space of the detour transport mechanism 41 .
第1處理部31所包含之非液體處理單元之數量少於第5處理部111所包含之非液體處理單元之數量。因此，第1非液體處理部32之設置空間小於第5非液體處理部112之設置空間。因此，可容易地確保迂迴搬送機構41之設置空間。
The number of non-liquid processing units included in the first processing unit 31 is less than the number of non-liquid processing units included in the fifth processing unit 111 . Therefore, the installation space of the first non-liquid processing unit 32 is smaller than the installation space of the fifth non-liquid processing unit 112 . Therefore, the installation space of the roundabout conveyance mechanism 41 can be ensured easily.
中繼搬送機構167於俯視下配置於與中垂線F交叉之位置。因此，於俯視下，自中繼搬送機構167至第1載置部171之距離與自中繼搬送機構167至第2載置部172之距離大致相等。因此，中繼搬送機構167可容易地進入第1載置部171，且可容易地進入第2載置部172。
The relay transport mechanism 167 is arranged at a position intersecting the vertical line F in plan view. Therefore, in plan view, the distance from the relay transport mechanism 167 to the first loading unit 171 is substantially equal to the distance from the relay transport mechanism 167 to the second loading unit 172 . Therefore, the intermediary conveyance mechanism 167 can easily enter into the 1st loading part 171, and can enter into the 2nd loading part 172 easily.
第3載置部173及第5載置部175於俯視下配置於與第1載置部171重疊之位置。因此，中繼搬送機構167可容易地進入第3載置部173及第5載置部175。
The 3rd loading part 173 and the 5th loading part 175 are arrange|positioned at the position which overlaps with the 1st loading part 171 in planar view. Therefore, the intermediary transport mechanism 167 can easily enter the third loading section 173 and the fifth loading section 175 .
第4載置部174及第6載置部176於俯視下配置於與第2載置部172重疊之位置。因此，中繼搬送機構167可容易地進入第4載置部174及第6載置部176。
The 4th mounting part 174 and the 6th mounting part 176 are arrange|positioned at the position which overlaps with the 2nd mounting part 172 in planar view. Therefore, the intermediary conveyance mechanism 167 can easily enter into the 4th loading part 174 and the 6th loading part 176. As shown in FIG.
中繼搬送機構167具備搬送機構168a、168b。因此，可容易地增加中繼搬送機構167於每單位時間內所能搬送之基板W之片數。因此，可進一步提高基板處理裝置1之產出量。
The relay conveyance mechanism 167 is provided with conveyance mechanisms 168a and 168b. Therefore, the number of substrates W that can be transported by the relay transport mechanism 167 per unit time can be easily increased. Therefore, the throughput of the substrate processing apparatus 1 can be further improved.
搬送機構168a於俯視下配置於線段E之第1側方(具體而言為右方)。
搬送機構168b於俯視下配置於線段E之第2側方(具體而言為左方)。因此，可適當地防止搬送機構168a、168b相互干涉。
The conveyance mechanism 168a is arrange|positioned at the 1st side of the line segment E (specifically, the right side) in planar view.
The conveyance mechanism 168b is arrange|positioned at the 2nd side of the line segment E (specifically, the left side) in planar view. Therefore, it is possible to appropriately prevent the conveying mechanisms 168a, 168b from interfering with each other.
中繼搬送機構167與迂迴搬送機構41直接地交接基板。更具體而言，於中繼搬送機構167與迂迴搬送機構41之間搬送基板W時，中繼搬送機構167與迂迴搬送機構41同時接觸相同基板W。因此，可於中繼搬送機構167與迂迴搬送機構41之間高效率地搬送基板W。
The relay transport mechanism 167 directly delivers the substrate to the detour transport mechanism 41 . More specifically, when the substrate W is transferred between the relay transfer mechanism 167 and the detour transfer mechanism 41 , the relay transfer mechanism 167 and the detour transfer mechanism 41 contact the same substrate W at the same time. Therefore, the substrate W can be efficiently transferred between the relay transfer mechanism 167 and the detour transfer mechanism 41 .
基板W之接觸中繼搬送機構167之部分P3與基板W之接觸迂迴搬送機構41之部分Q不同。因此，可適當地防止於中繼搬送機構167與迂迴搬送機構41同時接觸相同基板W時中繼搬送機構167與迂迴搬送機構41發生干涉。
The portion P3 of the substrate W in contact with the relay transport mechanism 167 is different from the portion Q of the substrate W in contact with the detour transport mechanism 41 . Therefore, it is possible to suitably prevent interference between the relay transport mechanism 167 and the detour transport mechanism 41 when the relay transport mechanism 167 and the detour transport mechanism 41 contact the same substrate W at the same time.
中繼搬送機構167之保持部19d、19e分別於俯視下具有大致U字形狀或大致Y字形狀。迂迴搬送機構41之保持部44c、44e分別於俯視下具有大致I字形狀。因此，可適當地防止於中繼搬送機構167與迂迴搬送機構41同時接觸相同基板W時中繼搬送機構167與迂迴搬送機構41發生干涉。
The holding parts 19d and 19e of the relay transport mechanism 167 each have a substantially U-shape or a substantially Y-shape in plan view. The holding parts 44c and 44e of the roundabout conveyance mechanism 41 each have a substantially I-shape in plan view. Therefore, it is possible to suitably prevent interference between the relay transport mechanism 167 and the detour transport mechanism 41 when the relay transport mechanism 167 and the detour transport mechanism 41 contact the same substrate W at the same time.
第5交接位置於俯視下與第6交接位置大致相同。因此，可抑制中繼搬送機構167移動至第5交接位置之量。具體而言，可將中繼搬送機構167移動至第5交接位置時之中繼搬送機構167之水平方向之量抑制於與中繼搬送機構167移動至第6交接位置時之中繼搬送機構167之水平方向之移動量相同之程度。因此，中繼搬送機構167與迂迴搬送機構41可容易地相互
搬送基板W。
The fifth transfer position is substantially the same as the sixth transfer position in plan view. Therefore, the amount by which the relay transport mechanism 167 moves to the fifth delivery position can be suppressed. Specifically, the amount in the horizontal direction of the relay conveying mechanism 167 when the relay conveying mechanism 167 moves to the fifth delivery position can be restrained from that of the relay conveying mechanism 167 when the relay conveying mechanism 167 moves to the sixth delivery position. The amount of movement in the horizontal direction is the same. Therefore, the relay transport mechanism 167 and the detour transport mechanism 41 can easily interact with each other.
The substrate W is transported.
第5交接位置於俯視下與第1載置部171之位置大致相同。因此，可抑制中繼搬送機構167移動至第5交接位置之量。因此，中繼搬送機構167與迂迴搬送機構41可容易地相互搬送基板W。
The fifth transfer position is substantially the same as the position of the first loading portion 171 in plan view. Therefore, the amount by which the relay transport mechanism 167 moves to the fifth delivery position can be suppressed. Therefore, the relay transport mechanism 167 and the detour transport mechanism 41 can easily transport the substrate W to each other.
本發明並不限於上述第1、第2實施形態，能以下述方式進行變化而實施。
The present invention is not limited to the first and second embodiments described above, and can be implemented in the following manner.
於第1、第2實施形態中，迂迴搬送機構41之保持部44c經由臂部44b被支持於水平移動部44a。但是，並不限於此。例如，保持部44c亦可固定於水平移動部44a。例如，保持部44c亦可無法相對於水平移動部44a移動。例如，臂部44b亦可固定於水平移動部44a。例如，亦可省略臂部44b而將保持部44c連接於水平移動部44a。同樣地，亦可變更迂迴搬送機構41之保持部44e之支持構造。根據本變化實施形態，迂迴搬送機構41之構造更簡單。因此，可使迂迴搬送機構41更小型化。
In the first and second embodiments, the holding portion 44c of the detour transport mechanism 41 is supported by the horizontal movement portion 44a via the arm portion 44b. However, it is not limited to this. For example, the holding part 44c may also be fixed to the horizontal movement part 44a. For example, the holding part 44c may not be able to move relative to the horizontal movement part 44a. For example, the arm part 44b may also be fixed to the horizontal movement part 44a. For example, the arm part 44b may be omitted, and the holding part 44c may be connected to the horizontal movement part 44a. Similarly, the support structure of the holding part 44e of the roundabout conveyance mechanism 41 can also be changed. According to this variant embodiment, the structure of the detour transport mechanism 41 is simpler. Therefore, the roundabout conveyance mechanism 41 can be further downsized.
於第1、第2實施形態中，迂迴搬送機構41於側視下配置於與第1處理部31及第1搬送空間23兩者重疊之位置。但是，並不限於此。例如，迂迴搬送機構41亦可於側視下配置於與第1處理部31及第1搬送空間23之至少任一者重疊之位置。例如，迂迴搬送機構41亦可於側視下配置於與第1處理部31及第1搬送空間23之任一者均不重疊之位置。根據本變化實施形態，亦可容易地確保迂迴搬送機構41之設置空間。
In the first and second embodiments, the detour transport mechanism 41 is arranged at a position overlapping with both the first processing unit 31 and the first transport space 23 in a side view. However, it is not limited to this. For example, the detour transport mechanism 41 may be arranged at a position overlapping with at least any one of the first processing unit 31 and the first transport space 23 in a side view. For example, the detour transport mechanism 41 may be arranged at a position that does not overlap any of the first processing unit 31 and the first transport space 23 in a side view. Also according to this modified embodiment, it is possible to easily secure the installation space of the detour transport mechanism 41 .
於第1、第2實施形態中，迂迴搬送機構41於俯視下配置於與第1非液體處理部32重疊之位置。但是，並不限於此。例如，迂迴搬送機構41亦可於俯視下配置於不與第1非液體處理部32重疊之位置。例如，亦可迂迴搬送機構41全部配置於第1搬送空間23。根據本變化實施形態，亦可容易地確保迂迴搬送機構41之設置空間。
In the first and second embodiments, the detour transport mechanism 41 is arranged at a position overlapping with the first non-liquid processing unit 32 in plan view. However, it is not limited to this. For example, the detour transport mechanism 41 may be arranged at a position not overlapping with the first non-liquid processing unit 32 in plan view. For example, all the detour transport mechanisms 41 may be arranged in the first transport space 23 . Also according to this modified embodiment, it is possible to easily secure the installation space of the detour transport mechanism 41 .
於第1、第2實施形態中，迂迴搬送機構41之保持部44c於俯視下具有大致I字形狀。但是，並不限於此。例如，保持部44c亦可具有大致水平之平板形狀。例如，保持部44c亦可於俯視下為圓形或矩形。保持部44c例如亦可具有與前載置部71之板72大致相同之形狀。同樣地，亦可變更迂迴搬送機構41之保持部44e之構造。例如，亦可保持部44c、44e之整體具有與前載置部71大致相同之構造。
In the first and second embodiments, the holding portion 44c of the detour transport mechanism 41 has a substantially I-shape in plan view. However, it is not limited to this. For example, the holding portion 44c may have a substantially horizontal flat plate shape. For example, the holding portion 44c may also be circular or rectangular in plan view. The holding part 44c may have substantially the same shape as the plate 72 of the front mounting part 71, for example. Similarly, the structure of the holding part 44e of the roundabout conveyance mechanism 41 can also be changed. For example, the entirety of the holding parts 44c and 44e may have substantially the same structure as that of the front mounting part 71 .
於第1、第2實施形態中，迂迴搬送機構41跨及空間40及第1搬送空間23而配置。但是，並不限於此。例如，迂迴搬送機構41亦可配置於空間40及第1搬送空間23之一者。即，迂迴搬送機構41亦可不配置於空間40及第1搬送空間23之另一者。
In the first and second embodiments, the detour transport mechanism 41 is arranged across the space 40 and the first transport space 23 . However, it is not limited to this. For example, the detour transport mechanism 41 may be arranged in one of the space 40 and the first transport space 23 . That is, the detour conveyance mechanism 41 may not be arranged in the other of the space 40 and the first conveyance space 23 .
於第1、第2實施形態中，迂迴搬送機構41配置於第1非液體處理部32之下方之空間40。但是，並不限於此。於基板處理裝置1具備第1非液體處理部32之上方之空間之情形時，亦可將迂迴搬送機構41之至少一部分配置於第1非液體處理部32之上方之空間。
In the first and second embodiments, the detour transport mechanism 41 is arranged in the space 40 below the first non-liquid processing unit 32 . However, it is not limited to this. When the substrate processing apparatus 1 has a space above the first non-liquid processing unit 32 , at least a part of the detour transport mechanism 41 may be arranged in the space above the first non-liquid processing unit 32 .
於第1、第2實施形態中，迂迴搬送機構41之至少一部分配置於第1搬送空間23之底部23d。但是，並不限於此。亦可將迂迴搬送機構41之至少一部分配置於第1搬送空間23之上部。
In the first and second embodiments, at least a part of the detour transport mechanism 41 is disposed on the bottom portion 23d of the first transport space 23 . However, it is not limited to this. At least a part of the detour transport mechanism 41 may be disposed above the first transport space 23 .
於第2實施形態中，上下方向Z上之第1搬送空間23之長度可與上下方向Z上之第3搬送空間83之長度大致相同。上下方向Z上之第1搬送空間23之長度亦可較上下方向Z上之第3搬送空間83之長度略長。上下方向Z上之第1搬送空間23之長度可與上下方向Z上之第5搬送空間103之長度大致相同。上下方向Z上之第1搬送空間23之長度亦可較上下方向Z上之第5搬送空間103之長度略長。
In the second embodiment, the length of the first conveyance space 23 in the vertical direction Z may be substantially the same as the length of the third conveyance space 83 in the vertical direction Z. The length of the first transfer space 23 in the vertical direction Z may also be slightly longer than the length of the third transfer space 83 in the vertical direction Z. The length of the first conveyance space 23 in the vertical direction Z may be substantially the same as the length of the fifth conveyance space 103 in the vertical direction Z. The length of the first transfer space 23 in the vertical direction Z may also be slightly longer than the length of the fifth transfer space 103 in the vertical direction Z.
於第1、第2實施形態中，排氣單元25配置於第1搬送空間23之下方。但是，並不限於此。排氣單元25亦可延伸至空間40之下方。例如，排氣單元25亦可除配置於第1搬送空間23之下方以外還配置於空間40之下方。排氣單元25亦可於俯視下與空間40之至少一部分重疊。藉此，可容易地將空間40維持潔淨。因此，可容易地將迂迴搬送機構41周圍之環境維持潔淨。
In the first and second embodiments, the exhaust unit 25 is arranged below the first transfer space 23 . However, it is not limited to this. The exhaust unit 25 can also extend below the space 40 . For example, the exhaust unit 25 may be arranged under the space 40 in addition to being arranged under the first transfer space 23 . The exhaust unit 25 may also overlap with at least a part of the space 40 in plan view. Thereby, the space 40 can be easily maintained clean. Therefore, the environment around the roundabout conveyance mechanism 41 can be easily maintained clean.
於第1、第2實施形態中，中繼搬送機構167具備搬送機構168a、168b。但是，並不限於此。亦可省略搬送機構168a、168b之任一者。
In 1st, 2nd embodiment, the relay conveyance mechanism 167 is equipped with conveyance mechanism 168a, 168b. However, it is not limited to this. Either one of the transport mechanisms 168a, 168b may be omitted.
於第1實施形態中，基板處理裝置1不具備中繼搬送機構167。但是，
並不限於此。第1實施形態之基板處理裝置1亦可具備中繼搬送機構167。中繼搬送機構167亦可於第1搬送機構27、迂迴搬送機構41及第2搬送機構57之間搬送基板W。亦可將圖15、22視為本變化實施形態之基板處理裝置1之俯視圖。
In the first embodiment, the substrate processing apparatus 1 does not include the relay transport mechanism 167 . but,
It is not limited to this. The substrate processing apparatus 1 of the first embodiment may also include a relay transport mechanism 167 . The relay transport mechanism 167 can also transport the substrate W between the first transport mechanism 27 , the detour transport mechanism 41 , and the second transport mechanism 57 . Figures 15 and 22 can also be regarded as top views of the substrate processing apparatus 1 of this variation embodiment.
於第1實施形態中，主搬送機構17進入載具載置部12a1、12b1上之載具C。但是，並不限於此。主搬送機構17亦可不進入載具載置部12a1、12b1上之載具C。例如，基板處理裝置1亦可具備進入載具載置部12a1、12b1上之載具C之其他搬送機構。同樣地，亦可變更第2實施形態中之主搬送機構17。
In the first embodiment, the main transport mechanism 17 enters the carrier C on the carrier mounting parts 12a1, 12b1. However, it is not limited to this. The main conveying mechanism 17 may not enter the carrier C on the carrier placement parts 12a1, 12b1. For example, the substrate processing apparatus 1 may be provided with another transport mechanism for entering the carrier C on the carrier mounting parts 12a1, 12b1. Similarly, the main conveying mechanism 17 in the second embodiment can also be changed.
於第1、第2實施形態中，主搬送機構17具備搬送機構18a、18b。但是，並不限於此。亦可省略搬送機構18a、18b之一者。
In the first and second embodiments, the main transport mechanism 17 is provided with transport mechanisms 18a and 18b. However, it is not limited to this. One of the transport mechanisms 18a, 18b may be omitted.
於第1、第2實施形態中，例示出第1~第5動作例。但是，並不限於此。例如，基板處理裝置1亦可進行與第1~第5動作例不同之動作。例如，亦可變更搬送基板W之處理部K之數量。例如，搬送第1基板W1之處理部K之數量亦可與搬送第2基板W2之處理部K之數量不同。亦可變更搬送基板W之處理部K之順序。以下，對變化實施形態之第6~第9動作例進行說明。
In the first and second embodiments, the first to fifth operation examples are illustrated. However, it is not limited to this. For example, the substrate processing apparatus 1 may perform operations different from the first to fifth operation examples. For example, the number of processing units K for transferring the substrate W may be changed. For example, the number of processing units K for transferring the first substrate W1 may be different from the number of processing units K for transferring the second substrate W2. It is also possible to change the order of the processing part K which transfers the board|substrate W. Hereinafter, the sixth to ninth operation examples of the modified embodiment will be described.
於第6動作例中，將基板W搬送至1個處理部K。例如，將第1基板W1搬送至第1處理部31，將第2基板W2搬送至第2處理部61，將第3基板W3
搬送至第3處理部91，將第4基板W4搬送至第4處理部131，將第5基板W5搬送至第5處理部111，並將第6基板W6搬送至第6處理部151。
In the sixth operation example, the substrate W is transferred to one processing unit K. For example, the first substrate W1 is transferred to the first processing unit 31, the second substrate W2 is transferred to the second processing unit 61, and the third substrate W3
The substrate is transferred to the third processing unit 91 , the fourth substrate W4 is transferred to the fourth processing unit 131 , the fifth substrate W5 is transferred to the fifth processing unit 111 , and the sixth substrate W6 is transferred to the sixth processing unit 151 .
於第7動作例中，將基板W搬送至2個處理部K。例如，將第1基板W1搬送至第1處理部31及第2處理部61，將第2基板W2搬送至第3處理部91及第4處理部131，並將第3基板W3搬送至第5處理部111及第6處理部151。
In the seventh operation example, the substrate W is conveyed to two processing units K. For example, the first substrate W1 is transferred to the first processing unit 31 and the second processing unit 61, the second substrate W2 is transferred to the third processing unit 91 and the fourth processing unit 131, and the third substrate W3 is transferred to the fifth processing unit. The processing unit 111 and the sixth processing unit 151 .
與第8動作例中，將基板W搬送至6個處理部K。具體而言，將基板W搬送至第1處理部31、第2處理部61、第3處理部91、第4處理部131、第5處理部111及第6處理部151。
In the eighth operation example, the substrate W is transferred to the six processing units K. Specifically, the substrate W is transferred to the first processing unit 31 , the second processing unit 61 , the third processing unit 91 , the fourth processing unit 131 , the fifth processing unit 111 , and the sixth processing unit 151 .
於第9動作例中，將第1基板W1搬送至4個處理部K，並將第2基板W2搬送至2個處理部K。例如，將第1基板W1搬送至第1處理部31、第2處理部61、第3處理部91及第4處理部131，並將第2基板W2搬送至第5處理部111及第6處理部151。
In the ninth operation example, the first substrate W1 is transferred to four processing units K, and the second substrate W2 is transferred to two processing units K. For example, the first substrate W1 is transferred to the first processing unit 31, the second processing unit 61, the third processing unit 91, and the fourth processing unit 131, and the second substrate W2 is transferred to the fifth processing unit 111 and the sixth processing unit. Section 151.
於上述第6~第9動作例中，較佳亦為迂迴搬送機構41進行第1直行搬送、第3直行搬送及第5直行搬送。進而，較佳為第1搬送機構27不進行第1直行搬送，第3搬送機構87不進行第3直行搬送，且第5搬送機構107不進行第5直行搬送。
In the sixth to ninth operation examples described above, it is also preferable that the detour transport mechanism 41 performs the first straight transport, the third straight transport, and the fifth straight transport. Furthermore, it is preferable that the first conveyance mechanism 27 does not perform the first straight conveyance, the third conveyance mechanism 87 does not perform the third straight conveyance, and the fifth conveyance mechanism 107 does not perform the fifth straight conveyance.
於第1、第2實施形態中，例示出塗佈處理作為液體處理，但並不限於此。液體處理例如亦可為對基板W進行顯影之顯影處理或將基板W洗淨
之洗淨處理。顯影處理係將顯影液作為處理液供給至基板W。洗淨處理係將洗淨液作為處理液供給至基板W。
In the first and second embodiments, the coating treatment was exemplified as the liquid treatment, but it is not limited thereto. The liquid treatment may be, for example, developing treatment for developing the substrate W or cleaning the substrate W.
The cleaning treatment. In the development treatment, a developing solution is supplied to the substrate W as a treatment solution. In the cleaning treatment, a cleaning liquid is supplied to the substrate W as a processing liquid.
對於第1、第2實施形態及各變化實施形態，亦可進而將各構成與其他變化實施形態之構成置換或組合等而適當地變更。
With respect to the first and second embodiments and each modified embodiment, further changes may be made by substituting or combining each configuration with the configuration of other modified embodiments.
