JP7133451B2 - Substrate processing equipment - Google Patents

Description

The present invention relates to a substrate processing apparatus for processing substrates. Substrates include, for example, semiconductor wafers, liquid crystal display substrates, organic EL (Electroluminescence) substrates, FPD (Flat Panel Display) substrates, optical display substrates, magnetic disk substrates, magneto-optical disk substrates, and photomask substrates. , is a substrate for solar cells.

Patent Literature 1 discloses a substrate processing apparatus. Below, the code|symbol described in patent document 1 is described in parenthesis. A substrate processing apparatus (100) comprises an indexer block (11), a processing block (12) and a processing block (13). The indexer block (11) comprises a main transport mechanism (15). The processing block (12) comprises a first processing section (121), a thermal processing section (123) and a main transfer mechanism (127). The processing block (13) comprises a second processing section (131), a thermal processing section (133) and a main transfer mechanism (137). The main transport mechanism (127) transports the substrate (W) between the main transport mechanism (15), the first processing section (121) and the thermal processing section (123). The main transport mechanism (137) transports the substrate (W) between the main transport mechanism (127), the second processing section (131) and the thermal processing section (133).

A substrate processing apparatus (100) includes a sub-transport mechanism (117). The heat treatment section (123) includes an upper heat treatment section (301) and a lower heat treatment section (302). The heat treatment section (133) includes an upper heat treatment section (303) and a lower heat treatment section (304). The sub-transport mechanism (117) is arranged between the upper heat treatment section (301) and the lower heat treatment section (302) and between the upper heat treatment section (303) and the lower heat treatment section (304). The sub-transport mechanism (117) transports the substrate (W) between the main transport mechanism (15) and the main transport mechanism (137).

JP 2014-116508 A

There is a need to further improve the throughput of substrate processing apparatuses. However, with the configuration of the substrate processing apparatus (100) disclosed in Patent Document 1, it is difficult to further improve the throughput.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a substrate processing apparatus capable of further improving the throughput of the substrate processing apparatus.

In order to achieve these objects, the present invention has the following configuration. That is, the present invention is a substrate processing apparatus comprising: a main transport mechanism for transporting a substrate; a first processing section for processing the substrate; a first transport mechanism for transporting the substrate to the first processing section; A first transport space provided with a first transport mechanism, a second processing section for processing a substrate, a second transport mechanism for transporting the substrate to the second processing section, and a detour transport mechanism for transporting the substrate. wherein the first transport mechanism is arranged between the main transport mechanism and the second transport mechanism; the detour transport mechanism is arranged between the main transport mechanism and the second transport mechanism; mechanism and the first transport mechanism are capable of mutually transporting substrates, the first transport mechanism and the second transport mechanism are capable of mutually transporting substrates, and the main transport mechanism and the detour transport mechanism are , in which the substrates can be transported mutually, and the bypass transport mechanism and the second transport mechanism are substrate processing apparatuses capable of transporting the substrates mutually.

The substrate processing apparatus includes a first processing section and a second processing section. Therefore, the substrate can be subjected to the processing by the first processing unit and the processing by the second processing unit. The substrate processing apparatus includes a first transport mechanism and a second transport mechanism. Therefore, the substrate can be suitably transported to the first processing section and the second processing section.

The first transport mechanism is arranged between the main transport mechanism and the second transport mechanism. The main transport mechanism and the first transport mechanism can mutually transport substrates, and the first transport mechanism and the second transport mechanism can mutually transport substrates. Therefore, the first transport mechanism can transport substrates between the main transport mechanism and the second transport mechanism.

The bypass transport mechanism is arranged between the main transport mechanism and the second transport mechanism. The main transport mechanism and the detour transport mechanism can mutually transport substrates, and the detour transport mechanism and the second transport mechanism can transport substrates mutually. Therefore, the detour transport mechanism can bypass the first transport mechanism and transport the substrate between the main transport mechanism and the second transport mechanism. Therefore, the burden of transporting the substrate by the first transport mechanism can be reduced. As a result, the number of substrates that the first transport mechanism can transport to the first processing section per unit time can be increased. That is, it is possible to increase the number of substrates that can be processed by the first processing section per unit time. Therefore, the throughput of the substrate processing apparatus can be improved.

Furthermore, the first transport mechanism can efficiently transport substrates between the main transport mechanism and the second transport mechanism. Therefore, it is possible to increase the number of substrates that the first transport mechanism can supply to the second transport mechanism per unit time. Therefore, when the first transport mechanism supplies substrates to the second transport mechanism, the number of substrates that can be processed per unit time by the second processing section can be increased. That is, the throughput of the substrate processing apparatus can be further improved.

As noted above, the bypass transport mechanism is positioned between the primary transport mechanism and the secondary transport mechanism. Therefore, the amount of movement of the bypass transport mechanism can be suppressed. Therefore, the bypass transport mechanism can efficiently transport substrates between the main transport mechanism and the second transport mechanism. Therefore, it is possible to increase the number of substrates that the bypass transport mechanism can supply to the second transport mechanism per unit time. As a result, when the bypass transport mechanism supplies substrates to the second transport mechanism, the number of substrates that can be processed by the second processing section per unit time can be increased.

Thus, even when the first transport mechanism supplies substrates to the second transport mechanism and when the detour transport mechanism supplies substrates to the second transport mechanism, the throughput of the substrate processing apparatus can be further improved. can improve.

As described above, according to the substrate processing apparatus, the throughput of the substrate processing apparatus can be further improved.

In the above-described substrate processing apparatus, when the substrate is transported between the main transport mechanism and the detour transport mechanism, it is preferable that the main transport mechanism and the detour transport mechanism contact the same substrate at the same time. That is, it is preferable that the main transport mechanism and the detour transport mechanism directly transfer the substrate. According to this, the substrate can be efficiently transported between the main transport mechanism and the detour transport mechanism.

In the substrate processing apparatus described above, the position at which the substrate is transferred between the main transport mechanism and the detour transport mechanism is the position at which the substrate is transferred between the main transport mechanism and the first transport mechanism in plan view. is preferably the same as According to this, the main transport mechanism and the detour transport mechanism can easily transport substrates to each other.

In the substrate processing apparatus described above, it is preferable that at least part of the substrate held by the bypass transport mechanism is positioned inside the first transport space. At least part of the substrate held by the bypass transport mechanism is positioned inside the first transport space. Therefore, the environment around the substrate held by the bypass transport mechanism can be easily kept clean.

In the substrate processing apparatus described above, it is preferable that at least part of the bypass transport mechanism is arranged in the first transport space. According to this, at least part of the detour transport mechanism is arranged in the same space as the first transport mechanism (that is, the first transport space). Therefore, the environment around the bypass transport mechanism can be easily kept clean.

In the above-described substrate processing apparatus, the first processing section includes a first non-liquid processing section that performs non-liquid processing on the substrate, and at least a portion of the bypass transport mechanism has the first non-liquid processing section in plan view. It is preferably arranged at a position overlapping with the liquid processing section. Non-liquid processing is processing or inspection performed on a substrate without applying a processing liquid to the substrate. According to this, it is possible to suppress an increase in the footprint of the substrate processing apparatus.

In the substrate processing apparatus described above, the first transport mechanism is arranged at the same height position as the main transport mechanism and the second transport mechanism, and the detour transport mechanism is located at the same height as the main transport mechanism and the second transport mechanism. The first non-liquid processing section is arranged at the same height position and is adjacent to the first transfer space, the first transfer space has a lower end, and the first non-liquid processing section It is preferable that the detour transport mechanism is arranged at a height position higher than the lower end of the first transport space, and arranged over the space below the first non-liquid processing section and the first transport space. The detour transport mechanism is arranged across the space below the first non-liquid processing section and the first transport space. Therefore, it is possible to suppress an increase in the footprint of the substrate processing apparatus. Here, the first non-liquid processing section is adjacent to the first transport space, and the first non-liquid processing section is arranged at a height position higher than the lower end of the first transport space. Therefore, the space below the first non-liquid processing section is continuous with the first transfer space. Therefore, it is possible to easily secure an installation space for the detour transport mechanism.

In the substrate processing apparatus described above, the first non-liquid processing section has a lower end, and the bypass transport mechanism is arranged at a height equal to or lower than the lower end of the first non-liquid processing section. and a first liquid processing section for performing liquid processing on the substrate, the first liquid processing section having a lower end, the lower end of the first liquid processing section It is preferable that the detour transport mechanism is arranged at a height position lower than the lower end of the first non-liquid processing section, and that the bypass transport mechanism is arranged at a height position equal to or higher than the lower end of the first liquid processing section. . The bypass transport mechanism is arranged at a height position equal to or lower than the lower end of the first non-liquid processing section. Therefore, it is possible to preferably prevent the bypass transport mechanism from interfering with the first non-liquid processing section. The detour transport mechanism is arranged at a position equal to or higher than the lower end of the first liquid processing section. Therefore, it is possible to suppress an increase in the length of the substrate processing apparatus in the vertical direction.

In the substrate processing apparatus described above, the detour transport mechanism includes a detour support portion that is fixedly provided, and a detour transport mechanism that is supported by the detour support portion, is movable with respect to the detour support portion, and holds the substrate. and a movable portion, wherein the detour support portion is arranged at a position overlapping with the first non-liquid processing portion in plan view, and at least part of the detour movable portion is arranged inside the first transport space. preferably. At least part of the detour movable part is arranged inside the first transport space. Therefore, the substrate held by the detour movable portion can be easily positioned inside the first transfer space. As a result, the environment around the substrates held by the bypass transport mechanism can be easily kept clean. The detour support section is arranged at a position overlapping the first non-liquid processing section in plan view. That is, the first transport space is not used as the installation space for the detour support section. Therefore, an installation space for at least a part of the detour movable part can be easily secured inside the first transport space.

In the substrate processing apparatus described above, the detour movable section is supported by the detour support section and is supported by a first horizontal movement section that moves horizontally with respect to the detour support section; and a first holder that holds the substrate. The entirety of the first horizontal movement part and the first holding part can suitably transport the substrate between the main transport mechanism and the second transport mechanism.

In the substrate processing apparatus described above, the detour movable section includes a first arm section supported by the first horizontal movement section and rotatable with respect to the first horizontal movement section, and the first holding section includes , and is preferably supported by the first horizontal movement section via the first arm section. Since the bypass movable section includes the first arm section, the first holding section is rotatable with respect to the first horizontal movement section. Therefore, the bypass transport mechanism and the main transport mechanism can mutually transport substrates favorably.

In the substrate processing apparatus described above, it is preferable that the first holding section is fixed to the first horizontal movement section and is immovable with respect to the first horizontal movement section. The structure in which the first horizontal movement part supports the first holding part is simple. Therefore, the structure of the bypass transport mechanism is simple. Therefore, the detour transport mechanism can be easily miniaturized.

In the substrate processing apparatus described above, the detour movable section is supported by the detour support section and is supported by a second horizontal movement section that moves horizontally with respect to the detour support section, and a second holding part for holding the substrate, wherein the second horizontal movement part is preferably movable independently of the first horizontal movement part. The entirety of the second horizontal movement section and the second holding section can suitably transport the substrate between the main transport mechanism and the second transport mechanism. In addition to the first horizontal movement section and the first holding section, the bypass conveyance mechanism includes the second horizontal movement section and the second holding section. can be increased. The second horizontal movement section is movable independently of the first horizontal movement section. Therefore, the bypass transport mechanism can efficiently transport substrates between the main transport mechanism and the second transport mechanism.

In the substrate processing apparatus described above, the main transport mechanism is movable to a height position of the first transport mechanism and a height position of the detour transport mechanism, and the second transport mechanism is positioned at the height of the first transport mechanism. The substrate processing apparatus is movable between a height position and a height position of the bypass transport mechanism, and includes a third processing unit disposed below the first processing unit for processing the substrate, and the first transport mechanism. and a third transport mechanism disposed below the detour transport mechanism for transporting the substrate to the third processing section; a fourth processing section disposed below the second processing section for processing the substrate; a fourth transport mechanism arranged below the second transport mechanism for transporting the substrate to the fourth processing section; a position between the first transport mechanism and the second transport mechanism; a relay transport mechanism that is movably provided between a position between the transport mechanisms and a position between the third transport mechanism and the fourth transport mechanism for transporting the substrate, wherein the main transport mechanism and the fourth transport mechanism; The three transport mechanisms are capable of mutually transporting substrates, and the relay transport mechanism is positioned between the first transport mechanism, the second transport mechanism, the third transport mechanism, the fourth transport mechanism, and the detour transport mechanism. It is preferable that the substrate can be transported. The substrate processing apparatus includes a third processing section and a fourth processing section. Therefore, the processing by the third processing section and the processing by the fourth processing section can be performed on the substrate. The substrate processing apparatus includes a third transport mechanism and a fourth transport mechanism. Therefore, the substrate can be suitably transported to the third processing section and the fourth processing section. The third processing section is arranged below the first processing section. The fourth processing section is arranged below the second processing section. The third transport mechanism is arranged below the first transport mechanism and the bypass transport mechanism. The fourth transport mechanism is arranged below the second transport mechanism. For these reasons, it is possible to suppress an increase in the footprint of the substrate processing apparatus. The substrate processing apparatus has a relay transport mechanism. Therefore, the first transport mechanism, the second transport mechanism, the third transport mechanism, the fourth transport mechanism, and the detour transport mechanism can mutually transport substrates via the relay transport mechanism. Therefore, the transport route of the substrate can be flexibly selected. Therefore, the processing to be performed on the substrate can be flexibly selected.

In the above-described substrate processing apparatus, the bypass transport mechanism is arranged at a position overlapping at least one of the first processing section and the first transport space in a side view, and the bypass transport mechanism overlaps the first transport space in a side view. a first non-liquid processing unit arranged at a position not overlapping with the third processing unit, the first processing unit performing non-liquid processing on the substrate, and the third processing unit performing non-liquid processing on the substrate . and a third non-liquid processing section, wherein the length of the first non-liquid processing section in the vertical direction is preferably smaller than the length of the third non-liquid processing section in the vertical direction. According to this, it is possible to relatively easily secure an installation space for the bypass transport mechanism.

In the substrate processing apparatus described above, the substrate processing apparatus is arranged between the relay transport mechanism and the first transport mechanism, and includes a first platform on which a substrate is placed, the relay transport mechanism and the second transport mechanism. a second receiver disposed between the mechanisms and on which the substrate is placed, wherein the relay transport mechanism is a line segment connecting the first receiver and the second receiver in a plan view; is preferably arranged at a position intersecting the perpendicular bisector of According to this, in plan view, the distance from the relay transport mechanism to the first receiver is substantially equal to the distance from the relay transport mechanism to the second receiver. Therefore, the relay transport mechanism can easily access the first receiver and can easily access the second receiver.

In the substrate processing apparatus described above, the relay transport mechanism includes a first relay transport mechanism that transports the substrate and a second relay transport mechanism that transports the substrate, and the first relay transport mechanism has the above-described The second relay transport mechanism is arranged on the first side of a segment connecting the first receiver and the second receiver, and the second relay transport mechanism is positioned between the first receiver and the second receiver in a plan view. is preferably arranged on a second side of the line segment connecting The relay transport mechanism includes a first relay transport mechanism and a second relay transport mechanism. Therefore, the number of substrates that can be transported per unit time by the relay transport mechanism can be easily increased. The first relay transport mechanism is arranged on the first side of the line connecting the first receiver and the second receiver in plan view. The second relay transport mechanism is arranged on the second side of the line connecting the first receiver and the second receiver in plan view. Therefore, it is possible to suitably prevent the first relay transport mechanism and the second relay transport mechanism from interfering with each other.

In the substrate processing apparatus described above, the substrate processing apparatus is arranged above the first processing section, and is arranged above the fifth processing section that processes the substrate, and the first transport mechanism and the bypass transport mechanism. , a fifth transport mechanism that transports the substrate to the fifth processing unit; a sixth processing unit that is disposed above the second processing unit and processes the substrate; and a sixth processing unit that is disposed above the second transport mechanism, a sixth transport mechanism for transporting the substrate to the sixth processing unit, wherein the relay transport mechanism is movable to a position between the fifth transport mechanism and the sixth transport mechanism; and the main transport mechanism. and the fifth transport mechanism are capable of mutually transporting substrates, and the relay transport mechanism comprises the first transport mechanism, the second transport mechanism, the third transport mechanism, the fourth transport mechanism, and the fifth transport mechanism. It is preferable that the substrate can be transported between the transport mechanism, the sixth transport mechanism, and the detour transport mechanism. The substrate processing apparatus includes a fifth processing section and a sixth processing section. Therefore, the processing by the fifth processing section and the processing by the sixth processing section can be performed on the substrate. The substrate processing apparatus includes a fifth transport mechanism and a sixth transport mechanism. Therefore, the substrate can be suitably transferred to the fifth processing section and the sixth processing section. The fifth processing section is arranged above the first processing section. The sixth processing section is arranged above the second processing section. The fifth transport mechanism is arranged above the first transport mechanism and the bypass transport mechanism. The sixth transport mechanism is arranged above the second transport mechanism. For these reasons, it is possible to suppress an increase in the footprint of the substrate processing apparatus. The first transport mechanism, the second transport mechanism, the third transport mechanism, the fourth transport mechanism, the fifth transport mechanism, the sixth transport mechanism, and the detour transport mechanism are capable of mutually transporting substrates via the relay transport mechanism. . Therefore, the transport route of the substrate can be flexibly selected. Therefore, the processing to be performed on the substrate can be flexibly selected. The bypass transport mechanism is arranged above the third transport mechanism and below the fifth transport mechanism. Therefore, it is possible to suppress the amount of movement of the main transport mechanism when transporting the substrate between the main transport mechanism and the detour transport mechanism. Similarly, it is possible to reduce the amount of movement of the relay transport mechanism when the substrate is transported between the relay transport mechanism and the detour transport mechanism.

In the substrate processing apparatus described above, the main transport mechanism transfers the substrate to at least one of the first transport mechanism, the third transport mechanism, and the fifth transport mechanism, and does not pass the substrate to the detour transport mechanism. and when the main transport mechanism delivers the substrate to the first transport mechanism, the first transport mechanism transports the substrate from the main transport mechanism to the first processing unit, and the main transport mechanism transfers the substrate to the third transport mechanism. , the third transport mechanism transports the substrate from the main transport mechanism to the third processing unit, and when the main transport mechanism delivers the substrate to the fifth transport mechanism, the fifth transport mechanism Preferably, the mechanism transports the substrate from the main transport mechanism to the fifth processing section. After the substrate is transported from the main transport mechanism to a transport mechanism other than the main transport mechanism, the first process performed on the substrate is called "first process". When the main transport mechanism hands over the substrate to the first transport mechanism, the first processing unit performs the first processing on the substrate. When the main transport mechanism passes the substrate to the third transport mechanism, the third processing section performs the first processing on the substrate. When the main transport mechanism passes the substrate to the fifth transport mechanism, the fifth processing unit performs the first processing on the substrate. The main transport mechanism does not pass the substrate to the bypass transport mechanism. Since the first transport mechanism is arranged between the second transport mechanism and the main transport mechanism, the main transport mechanism cannot transfer the substrate to the second transport mechanism. For the same reason, the main transport mechanism cannot pass substrates to the fourth transport mechanism and the sixth transport mechanism. Therefore, the first processing is performed by one of the first processing section, the third processing section and the fifth processing section. In other words, the first processing is not performed by the second, fourth and sixth processing units. Here, the first processing section, the third processing section and the fifth processing section are arranged at positions relatively close to the main transport mechanism. Specifically, the first processing section, the third processing section and the fifth processing section are arranged closer to the main transport mechanism than the second processing section, the fourth processing section and the sixth processing section. In this way, the processing section that performs the first processing on the substrate is arranged at a position close to the main transport mechanism. Therefore, the substrate can be efficiently transported from the main transport mechanism to the processing section that performs the first processing.

In the substrate processing apparatus described above, at least one of the first transport mechanism, the third transport mechanism, and the fifth transport mechanism transfers the substrate to the main transport mechanism, and the bypass transport mechanism transfers the substrate to the main transport mechanism. When the first transfer mechanism transfers the substrate to the main transfer mechanism without transferring the substrate, the first transfer mechanism transfers the substrate from the first processing section to the main transfer mechanism, and the third transfer mechanism transfers the substrate to the main transfer mechanism. When the substrate is transferred to the main transport mechanism, the third transport mechanism transports the substrate from the third processing section to the main transport mechanism, and when the fifth transport mechanism transfers the substrate to the main transport mechanism, the fifth Preferably, the transport mechanism transports the substrate from the fifth processing section to the main transport mechanism. Before the substrate is transported from a transport mechanism other than the main transport mechanism to the main transport mechanism, the last process performed on the substrate is called "final process." When the first transport mechanism passes the substrate to the main transport mechanism, the first processing section performs the final processing on the substrate. When the third transport mechanism passes the substrate to the main transport mechanism, the third processing section performs the final processing on the substrate. When the fifth transport mechanism passes the substrate to the main transport mechanism, the fifth processing section performs the final processing on the substrate. The bypass transport mechanism does not pass substrates to the main transport mechanism. Since the first transport mechanism is arranged between the second transport mechanism and the main transport mechanism, the second transport mechanism cannot transfer the substrate to the main transport mechanism. For the same reason, the fourth transport mechanism and the sixth transport mechanism cannot pass substrates to the main transport mechanism. Therefore, the final processing is performed by one of the first, third and fifth processing units. In other words, the last processing is not performed by the second, fourth and sixth processing units. Here, the first processing section, the third processing section and the fifth processing section are arranged at positions relatively close to the main transport mechanism. Specifically, the first processing section, the third processing section and the fifth processing section are arranged closer to the main transport mechanism than the second processing section, the fourth processing section and the sixth processing section. In this way, the processing section that performs the final processing on the substrate is arranged at a position close to the main transport mechanism. Therefore, the substrate can be efficiently transported from the processing section that performs the final processing to the main transport mechanism.

According to the substrate processing apparatus described above, it is possible to further improve the throughput of the substrate processing apparatus.

1 is a conceptual diagram of a substrate processing apparatus according to a first embodiment; FIG. FIG. 2(a) is a diagram schematically showing a first operation example of the substrate processing apparatus, FIG. 2(b) is a diagram schematically showing a second operation example of the substrate processing apparatus, and FIG. ) schematically shows a third operation example of the substrate processing apparatus. 1 is a plan view of a substrate processing apparatus according to a first embodiment; FIG. It is a right view which shows the structure of the right part of a substrate processing apparatus. It is a left view which shows the structure of the center part of a substrate processing apparatus in the width direction. It is a left view which shows the structure of the left part of a substrate processing apparatus. It is a front view which shows the structure inside an indexer part. It is a front view of a 1st block. It is a top view of a substrate processing apparatus. 10A is a plan view of the bypass transport mechanism, FIG. 10B is a left side view of the bypass transport mechanism, and FIG. 10C is a front view of the bypass transport mechanism. 11(a) to 11(e) are side views showing an example of the substrate transfer operation between the main transport mechanism and the first transport mechanism. FIG. 12(a) is a diagram schematically showing the transport path of the substrate in the first operation example, and FIG. 12(b) is a diagram schematically showing the transport path of the substrate in the second operation example. (c) is a diagram schematically showing a transport path of the substrate in the third operation example. It is a conceptual diagram of the substrate processing apparatus of 2nd Embodiment. FIG. 14(a) is a diagram schematically showing a fourth operation example of the substrate processing apparatus, and FIG. 14(b) is a diagram schematically showing a fifth operation example of the substrate processing apparatus. It is a top view of the substrate processing apparatus of 2nd Embodiment. It is a right view which shows the structure of the right part of a substrate processing apparatus. It is a left view which shows the structure of the center part of a substrate processing apparatus in the width direction. It is a left view which shows the structure of the left part of a substrate processing apparatus. It is a front view of an indexer part. It is a front view of a 1st block. It is a rear view of a relay block . It is a top view of a substrate processing apparatus . FIG. 23(a) is a diagram schematically showing the transport path of the substrate in the fourth operation example, and FIG. 23(b) is a diagram schematically showing the transport path of the substrate in the fifth operation example.

A substrate processing apparatus of the present invention will be described below with reference to the drawings.

[First embodiment]
<Overview of substrate processing equipment>
FIG. 1 is a conceptual diagram of the substrate processing apparatus of the first embodiment. The substrate processing apparatus 1 of the first embodiment performs a series of processes on a substrate (eg, semiconductor wafer) W. FIG.

The substrate W is, for example, a semiconductor wafer, a liquid crystal display substrate, an organic EL (Electroluminescence) substrate, an FPD (Flat Panel Display) substrate, an optical display substrate, a magnetic disk substrate, a magneto-optical disk substrate, or a photomask. It is a substrate, a substrate for solar cells. The substrate W has a thin flat plate shape. The substrate W has a substantially circular shape in plan view.

The substrate processing apparatus 1 includes a main transport mechanism 17 , a first processing section 31 , a first transport mechanism 27 , a second processing section 61 and a second transport mechanism 57 . The main transport mechanism 17 transports the substrate W. As shown in FIG. The first processing unit 31 processes the substrate W. As shown in FIG. The first transport mechanism 27 transports the substrate W to the first processing section 31 . The second processing unit 61 processes the substrate W. FIG. The second transport mechanism 57 transports the substrate W to the second processing section 61 . The first transport mechanism 27 is arranged between the main transport mechanism 17 and the second transport mechanism 57 . The main transport mechanism 17 and the first transport mechanism 27 are capable of transporting substrates W to each other. The first transport mechanism 27 and the second transport mechanism 57 are capable of transporting substrates W to each other.

The substrate processing apparatus 1 includes a bypass transport mechanism 41 . The bypass transport mechanism 41 transports the substrate W. As shown in FIG. The bypass transport mechanism 41 is arranged between the main transport mechanism 17 and the second transport mechanism 57 . The detour transport mechanism 41 and the main transport mechanism 17 are capable of transporting substrates W to each other. The bypass transport mechanism 41 and the second transport mechanism 57 can transport substrates W mutually.

The first transport mechanism 27 and the bypass transport mechanism 41 are arranged between the main transport mechanism 17 and the second transport mechanism 57 . Therefore, when the wafer W is transported between the main transport mechanism 17 and the second transport mechanism 57 , the wafer W always passes through either the first transport mechanism 27 or the detour transport mechanism 41 . The main transport mechanism 17 cannot transfer the substrate W to the second transport mechanism 57 . The main transport mechanism 17 cannot receive substrates W from the second transport mechanism 57 . That is, the main transport mechanism 17 and the second transport mechanism cannot transport substrates W to each other.

Three operation examples of the substrate processing apparatus 1 are illustrated. FIG. 2A is a diagram schematically showing a first operation example of the substrate processing apparatus 1. FIG. FIG. 2B is a diagram schematically showing a second operation example of the substrate processing apparatus 1. As shown in FIG. FIG. 2(c) is a diagram schematically showing a third operation example of the substrate processing apparatus 1. As shown in FIG. 2(a)-2(c) schematically show elements of the substrate processing apparatus 1 through which the substrate W passes (eg, transport mechanism, processing section).

Please refer to FIG. In the first operation example, the substrate W is transported to the second processing section 61 and the first processing section 31 . Specifically, the main transport mechanism 17 transfers the substrate W to the bypass transport mechanism 41 . The bypass transport mechanism 41 transports the substrate W from the main transport mechanism 17 to the second transport mechanism 57 . The second transport mechanism 57 transports the substrate W from the bypass transport mechanism 41 to the second processing section 61 . The second processing unit 61 processes the substrate W. FIG. The second transport mechanism 57 transports the substrate W from the second processing section 61 to the first transport mechanism 27 . The first transport mechanism 27 transports the substrate W from the second transport mechanism 57 to the first processing section 31 . The first processing unit 31 processes the substrate W. As shown in FIG. The first transport mechanism 27 transports the substrate W from the first processing section 31 to the main transport mechanism 17 . The main transport mechanism 17 receives substrates W from the first transport mechanism 27 . Thereby, the substrate processing apparatus 1 performs the processing by the second processing unit 61 and the processing by the first processing unit 31 on the substrate W in this order.

Please refer to FIG. In the second operation example, the substrate W is transported to the first processing section 31 and the second processing section 61 . Specifically, the main transport mechanism 17 transfers the substrate W to the first transport mechanism 27 . The first transport mechanism 27 transports the substrate W from the main transport mechanism 17 to the first processing section 31 . The first processing unit 31 processes the substrate W. As shown in FIG. The first transport mechanism 27 transports the substrate W from the first processing section 31 to the second transport mechanism 57 . The second transport mechanism 57 transports the substrate W from the first transport mechanism 27 to the second processing section 61 . The second processing unit 61 processes the substrate W. FIG. The second transport mechanism 57 transports the substrate W from the second processing section 61 to the bypass transport mechanism 41 . The bypass transport mechanism 41 transports the substrate W from the second transport mechanism 57 to the main transport mechanism 17 . The main transport mechanism 17 receives the substrate W from the bypass transport mechanism 41 . Thereby, the substrate processing apparatus 1 performs the processing by the first processing unit 31 and the processing by the second processing unit 61 on the substrate W in this order.

Refer to FIG. 2(c). In the third operation example, some substrates W are transported to the first processing section 31 and other substrates W are transported to the second processing section 61 . In the description of the third operation example, the substrate W transported to the first processing section 31 is referred to as the first substrate W1, and the substrate W transported to the second processing section 61 is referred to as the second substrate W2.

The main transport mechanism 17 delivers the first substrate W<b>1 to the first transport mechanism 27 and delivers the second substrate W<b>2 to the bypass transport mechanism 41 . The first transport mechanism 27 transports the first substrate W<b>1 from the main transport mechanism 17 to the first processing section 31 . The first processing unit 31 processes the first substrate W1. The first transport mechanism 27 transports the first substrate W<b>1 from the first processing section 31 to the main transport mechanism 17 . The bypass transport mechanism 41 transports the second substrate W<b>2 from the main transport mechanism 17 to the second transport mechanism 57 . The second transport mechanism 57 transports the second substrate W<b>2 from the bypass transport mechanism 41 to the second processing section 61 . The second processing unit 61 processes the second substrate W2. The second transport mechanism 57 transports the second substrate W<b>2 from the second processing section 61 to the bypass transport mechanism 41 . The bypass transport mechanism 41 transports the second substrate W<b>2 from the second transport mechanism 57 to the main transport mechanism 17 . The main transport mechanism 17 receives the first substrate W<b>1 from the first transport mechanism 27 and the second substrate W<b>2 from the second transport mechanism 57 . Thereby, the substrate processing apparatus 1 performs the processing by the first processing unit 31 on the first substrate W1 and the processing by the second processing unit 61 on the second substrate W2.

In the first operation example, the second operation example, and the third operation example described above, the first processing unit 31 and the second processing unit 61 can operate simultaneously. For example, while the first processing section 31 is processing the substrate W, the second processing section 61 can process another substrate W. FIG.

<Main effects of the first embodiment>
The substrate processing apparatus 1 includes a first processing section 31 and a second processing section 61 . Therefore, the substrate W can be subjected to the processing by the first processing unit 31 and the processing by the second processing unit 61 .

The substrate processing apparatus 1 has a first transport mechanism 27 and a second transport mechanism 57 . Therefore, the substrate can be suitably transferred to the first processing section 31 and the second processing section 61 .

The first transport mechanism 27 is arranged between the main transport mechanism 17 and the second transport mechanism 57 . The main transport mechanism 17 and the first transport mechanism 27 can transport the substrates W mutually, and the first transport mechanism 27 and the second transport mechanism 57 can transport the substrates W mutually. Therefore, the first transport mechanism 27 can transport the substrate W between the main transport mechanism 17 and the second transport mechanism 57 .

The bypass transport mechanism 41 is arranged between the main transport mechanism 17 and the second transport mechanism 57 . The main transport mechanism 17 and the detour transport mechanism 41 can mutually transport the substrates W, and the detour transport mechanism 41 and the second transport mechanism 57 can transport the substrates W mutually. Therefore, the detour transport mechanism 41 can bypass the first transport mechanism 27 and transport the substrate W between the main transport mechanism 17 and the second transport mechanism 57 .

Since the substrate processing apparatus 1 includes the bypass transport mechanism 41, the burden of transporting the substrate W by the first transport mechanism 27 can be reduced. Transporting the substrate W between the main transport mechanism 17 and the second transport mechanism 57 without passing through the first processing section 31 is called first direct transport. As in the first to third operation examples, the first transport mechanism 27 does not perform the first direct transport. The first direct transport is performed exclusively by the detour transport mechanism 41 . Thereby, the burden of transporting the substrate W by the first transport mechanism 27 can be reduced. As a result, the number of wafers W that can be transported to the first processing section 31 by the first transport mechanism 27 per unit time can be increased. Therefore, the number of substrates W that can be processed per unit time by the first processing section 31 can be increased. Therefore, the throughput of the substrate processing apparatus 1 (for example, the number of substrates W that can be processed by the substrate processing apparatus 1 per unit time) can be improved.

As described above , the bypass transport mechanism 41 is arranged between the main transport mechanism 17 and the second transport mechanism 57 . Therefore, the amount of movement of the bypass transport mechanism 41 can be suppressed. Specifically, the amount of movement of the detour transport mechanism 41 when the detour transport mechanism 41 performs the first direct transport can be suppressed to the same extent as the linear distance between the first transport mechanism 27 and the second transport mechanism 57 . . Alternatively, the amount of movement of the detour transport mechanism 41 when the detour transport mechanism 41 performs the first direct transport is set to be approximately the same as the amount of movement of the first transport mechanism 27 when the first transport mechanism 27 performs the first direct transport. can be suppressed. Further, the bypass transport mechanism 41 does not transport the substrate W to the first processing section 31 . Therefore, the burden of transporting the wafer W on the bypass transport mechanism 41 is relatively small. Therefore, in the first operation example and the third operation example, the bypass transport mechanism 41 can efficiently transport the substrate W from the main transport mechanism 17 to the second transport mechanism 57 . As a result, in the first operation example and the third operation example, the number of substrates W that can be supplied to the second transport mechanism 57 per unit time can be increased. Therefore, in the first operation example and the third operation example, the number of substrates W that can be processed per unit time by the second processing section 61 can be increased. Therefore, in the first operation example and the third operation example, the throughput of the substrate processing apparatus 1 can be further improved.

As described above, the burden of transporting the substrate W by the first transport mechanism 27 can be reduced. Therefore, in the second operation example, the first transport mechanism 27 can efficiently transport the substrate W from the main transport mechanism 17 to the second transport mechanism 57 via the first processing section 31 . As a result, in the second operation example, the number of substrates W that can be supplied to the second transport mechanism 57 per unit time can be increased. Therefore, in the second operation example, the number of wafers W that can be processed per unit time by the second processing section 61 can be increased. Therefore, in the second operation example, the throughput of the substrate processing apparatus 1 can be further improved.

As described above, the throughput of the substrate processing apparatus 1 can be further improved in any of the first operation example, the second operation example, and the third operation example.

The structure of the substrate processing apparatus 1 will be described in more detail below.

<Overall Structure of Substrate Processing Apparatus 1>
FIG. 3 is a plan view of the substrate processing apparatus 1 of the first embodiment. FIG. 4 is a right side view showing the configuration of the right portion of the substrate processing apparatus 1. As shown in FIG. FIG. 5 is a left side view showing the configuration of the central portion of the substrate processing apparatus 1 in the width direction. FIG. 6 is a left side view showing the configuration of the left portion of the substrate processing apparatus 1. As shown in FIG.

The substrate processing apparatus 1 includes an indexer section 11 , a first block 21 and a second block 51 . The indexer section 11 accommodates the main transport mechanism 17 . The first block 21 accommodates the first processing section 31 , the first transport mechanism 27 and the bypass transport mechanism 41 . The second block 51 accommodates the second processing section 61 and the second transport mechanism 57 .

The first block 21 is arranged between the indexer section 11 and the second block 51 in plan view. The first block 21 is connected to the indexer section 11 . A second block 51 is connected to the first block 21 . The second block 51 is not connected to the indexer section 11 . The indexer section 11, the first block 21, and the second block 51 are arranged side by side in the first direction. The indexer section 11, the first block 21, and the second block 51 are arranged in this order in a row.

The first block 21 is arranged at substantially the same height position as the indexer section 11 . The second block 51 is arranged at substantially the same height position as the indexer section 11 and the first block 21 . The first direction is, for example, horizontal.

Here, the first direction is called "front-back direction X". The front-rear direction X is horizontal. Of the front-rear direction X, the direction from the second block 51 toward the indexer section 11 is called "forward". The direction opposite to forward is called "backward". A second horizontal direction orthogonal to the front-rear direction X is called a "width direction Y" or a "side". One direction of the "width direction Y" is appropriately called "right side". The direction opposite to right is called "left". A third direction orthogonal to the front-rear direction X and orthogonal to the width direction Y is called a “vertical direction Z”. The vertical direction Z is vertical. In each figure, front, rear, right, left, top, and bottom are indicated as appropriate for reference.

In this specification, viewing from the front-rear direction X is referred to as "front viewing". Viewing from the width direction Y is called "side view". Viewing from the up-down direction Z is called "plan view".

<Indexer unit 11>
See Figures 3-6. The indexer section 11 unloads the substrates W from the carriers C. As shown in FIG. The indexer section 11 loads the substrate W onto the carrier C. As shown in FIG. A carrier C accommodates a plurality of substrates W. As shown in FIG. Carrier C is, for example, a FOUP (front opening unified pod).

The indexer section 11 includes carrier placement sections 12a1 and 12b1. One carrier C is mounted on each of the carrier mounting portions 12a1 and 12b1. The carrier mounting portion 12a1 is arranged at substantially the same height position as the carrier mounting portion 12b1. The carrier mounting portions 12a1 and 12b1 are arranged side by side in the width direction Y. As shown in FIG. Carrier placement portion 12b1 is arranged to the left of carrier placement portion 12a1.

See Figures 3-7. FIG. 7 is a front view showing the internal configuration of the indexer section 11. As shown in FIG. The indexer section 11 comprises a main transport space 13 . The main transport space 13 is arranged behind the carrier placement sections 12a1 and 12b1. The main transport space 13 has a substantially box shape. The main transport space 13 is substantially rectangular in plan view, side view and front view.

The indexer unit 11 has a frame 14 . A frame 14 is provided as a framework (skeleton) of the main transport space 13 . The frame 14 defines the shape of the main conveying space 13 . The frame 14 is made of metal, for example.

A main transport mechanism 17 is provided in the main transport space 13 . The main transport mechanism 17 is supported by the frame 14 . The main transport mechanism 17 transports the substrates W between the first transport mechanism 27 and the carriers C placed on the carrier platforms 12a1 and 12b1.

The main transport mechanism 17 comprises two transport mechanisms 18a, 18b. Each transport mechanism 18a, 18b transports the substrate W. As shown in FIG. The transport mechanism 18b is arranged at substantially the same height position as the transport mechanism 18a. The transport mechanisms 18a and 18b are arranged side by side in the width direction Y. As shown in FIG. The transport mechanism 18b is arranged to the left of the transport mechanism 18a.

The transport mechanism 18a is arranged at substantially the same height position as the carrier mounting portion 12a1. That is, the transport mechanism 18a and the carrier placement section 12a1 are arranged horizontally. The transport mechanism 18a is movable to the height position of the carrier mounting portion 12a1. The transport mechanism 18a is arranged behind the carrier placement section 12a1. The transport mechanism 18 a transports the substrate W between the carrier C placed on the carrier platform 12 a 1 and the first transport mechanism 27 . The transport mechanism 18b is arranged at substantially the same height position as the carrier mounting portion 12b1. The transport mechanism 18b is arranged behind the carrier mounting portion 12b1. The transport mechanism 18b transports the substrate W between the carrier C placed on the carrier platform 12b1 and the first transport mechanism 27. As shown in FIG. The transport mechanism 18b can transport the substrate W independently of the transport mechanism 18a.

The conveying mechanism 18a includes a column 19a, a vertical moving portion 19b, a rotating portion 19c, and holding portions 19d and 19e. The strut 19a is supported by the frame 14. As shown in FIG. The strut 19a is fixed to the frame 14. As shown in FIG. The strut 19a is immovable with respect to the frame 14. As shown in FIG. The strut 19a extends substantially in the up-down direction Z. As shown in FIG. The vertical moving part 19b is supported by the strut 19a. The vertical moving part 19b is movable in the substantially vertical direction Z with respect to the column 19a. The vertical moving part 19b cannot move in a substantially horizontal direction with respect to the column 19a. The rotating portion 19c is supported by the vertical moving portion 19b. The rotating portion 19c is rotatable about the rotation axis A19c with respect to the vertical moving portion 19b. The rotation axis A19c is a virtual line substantially parallel to the up-down direction Z. As shown in FIG. The holding portions 19d and 19e are supported by the rotating portion 19c. The holding portions 19d and 19e are movable forward and backward with respect to the rotating portion 19c. More specifically, the holding portions 19d and 19e can reciprocate in one horizontal direction determined by the orientation of the rotating portion 19c. One horizontal direction is, for example, the radial direction of the rotation axis A19c. The holding portions 19d and 19e can move forward and backward independently of each other . Each of the holding portions 19d and 19e has a substantially U shape or a substantially Y shape in plan view. Each of the holding portions 19d and 19e holds one substrate W in a horizontal posture.

In this manner, the holding portions 19d and 19e can move in the vertical direction Z in parallel. The holding portions 19d and 19e are rotatable around the rotation axis A19c. The holding portions 19d and 19e are movable forward and backward with respect to the rotating portion 19c.

The transport mechanism 18b has substantially the same structure and shape as the transport mechanism 18a, except that it is bilaterally symmetrical. That is, the conveying mechanism 18b includes a post 19a, a vertical moving portion 19b, a rotating portion 19c, and holding portions 19d and 19e.

Thus, in this specification, when different elements have the same structure, the same reference numerals are given to the structures, and detailed description thereof is omitted.

<First block 21>
See Figures 3-6 and 8. FIG. 8 is a front view of the first block 21. FIG. The first block 21 has a substantially box shape. The first block 21 is substantially rectangular in plan view, side view and front view.

A first block 21 has a frame 22 . The frame 22 is provided as a skeleton (skeleton) of the first block 21 . Frame 22 defines the shape of first block 21 . The frame 22 is made of metal, for example. The frame 22 supports the first processing section 31 , the first transport mechanism 27 and the bypass transport mechanism 41 .

The substrate processing apparatus 1 has a first transport space 23 . A first transport space 23 is formed in the first block 21 . The first transport space 23 is formed in the central portion of the first block 21 in the width direction Y. As shown in FIG. The first transport space 23 extends in the front-rear direction X from the front portion of the first block 21 to the rear portion of the first block 21 . The first transport space 23 is arranged at substantially the same height position as the main transport space 13 of the indexer section 11 . The first conveying space 23 borders the main conveying space 13 . The first transport space 23 is arranged to the left and rear of the transport mechanism 18a. The first transport space 23 is arranged to the right and rear of the transport mechanism 18b.

The substrate processing apparatus 1 includes an air supply unit 24 and an exhaust unit 25 . The air supply unit 24 is arranged above the first transport space 23 . The air supply unit 24 has substantially the same size as the first transport space 23 in plan view. The air supply unit 24 supplies gas to the first transfer space 23 . The gas is, for example, clean air. The air supply unit 24 has an air supply port (not shown). The air supply port is formed on the bottom surface of the air supply unit 24 . The air supply port blows gas downward from the air supply port. Thereby, the air supply unit 24 blows out the gas to the first transfer space 23 . The exhaust unit 25 is arranged below the first transport space 23 . The exhaust unit 25 has substantially the same size as the first transfer space 23 in plan view. The exhaust unit 25 exhausts gas in the first transfer space 23 . The exhaust unit 25 has an exhaust port (not shown). An exhaust port is formed on the upper surface of the exhaust unit 25 . The exhaust port sucks the gas above the exhaust port. Thereby, the exhaust unit 25 exhausts the gas in the first transfer space 23 to the outside of the first transfer space 23 . The air supply unit 24 and the exhaust unit 25 form a downward gas flow (downflow) in the first transfer space 23 . Thereby, the gas in the first transfer space 23 is kept clean.

The first transport space 23 is arranged at substantially the same height position as the first processing section 31 . The first transport space 23 is adjacent to the first processing section 31 .

The first processing section 31 includes a first non-liquid processing section 32 and a first liquid processing section 35 . The first non-liquid processing unit 32 performs non-liquid processing on the substrate W. FIG. Non-liquid processing is processing or inspection performed on the substrate W without supplying the substrate W with a processing liquid. In this embodiment, the first non-liquid processing unit 32 heats the substrate W. As shown in FIG. The first liquid processing section 35 performs liquid processing on the substrate W. FIG. The liquid process is a process of supplying the substrate W with a processing liquid.

The first liquid processing section 35 is arranged at substantially the same height position as the first non-liquid processing section 32 . The first non-liquid processing section 32 and the first liquid processing section 35 are arranged at substantially the same height position as the first transfer space 23 . The first transfer space 23 is arranged between the first non-liquid processing section 32 and the first liquid processing section 35 in plan view. The first non-liquid processing section 32, the first transport space 23, and the first liquid processing section 35 are arranged side by side in the width direction Y. As shown in FIG. More specifically, the first non-liquid processing section 32, the first transport space 23, and the first liquid processing section 35 are arranged in a row in the width direction Y. As shown in FIG. The first non-liquid processing section 32, the first transfer space 23, and the first liquid processing section 35 are arranged in this order in plan view. The first non-liquid processing section 32 is arranged on the first side (for example, the right side) of the first transport space 23 . The first liquid processing section 35 is arranged on the second side (for example, the left side) of the first transfer space 23 .

The first non-liquid processing section 32 is adjacent to the first transfer space 23 . The first liquid processing section 35 is adjacent to the first transfer space 23 .

Please refer to FIG. The first transport space 23 has a first side portion 23a and a second side portion 23b. The first side portion 23 a is, for example, the right side portion of the first transport space 23 . The second side portion 23b is, for example, the left side portion of the first transport space 23. As shown in FIG. The first non-liquid processing section 32 is in contact with the first side portion 23 a of the first transfer space 23 . The first liquid processing section 35 is in contact with the second side portion 23 b of the first transfer space 23 .

FIG. 8 shows the length L23 of the first transfer space 23 in the vertical direction Z. As shown in FIG. FIG. 8 shows the length L32 of the first non-liquid processing portion 32 in the vertical direction Z. As shown in FIG. FIG. 8 shows the length L35 of the first liquid processing portion 35 in the vertical direction Z. As shown in FIG. Length L32 is smaller than length L23. Length L32 is smaller than length L35. Length L23 is approximately equal to length L35.

The first transport space 23 has a lower end 23c. The lower end 23c of the first transfer space 23 is defined by the upper surface of the exhaust unit 25, for example. The first non-liquid processing portion 32 has a lower end 32a. The first liquid processing portion 35 has a lower end 35a. Lower end 32a is higher than lower end 23c. That is, the first non-liquid processing section 32 is arranged at a height position higher than the lower end 23 c of the first transfer space 23 . Lower end 32a is higher than lower end 35a. That is, the first non-liquid processing section 32 is arranged at a height position higher than the lower end 35 a of the first liquid processing section 35 . The lower end 23c is at substantially the same height position as the lower end 35a.

The substrate processing apparatus 1 has a space 40 below the first non-liquid processing section 32 . The space 40 contacts the first side 23 a of the first transport space 23 . Space 40 is continuous with first transport space 23 . In other words, the space 40 is connected with the first transport space 23 .

The first transport space 23 has a bottom portion 23d. The bottom 23 d is part of the first transport space 23 . The bottom portion 23 d is located at a height position equal to or lower than the lower end 32 a of the first non-liquid processing portion 32 . The bottom portion 23d and the space 40 are arranged side by side in the width direction Y. As shown in FIG. Bottom portion 23 d contacts space 40 . The bottom portion 23d and the space 40 are continuous in the width direction Y. As shown in FIG. In other words, the bottom portion 23d and the space 40 are connected in the width direction Y.

The first transport mechanism 27 is provided in the first transport space 23 . The first transport mechanism 27 is arranged at substantially the same height position as the first processing section 31 . That is, the first transport mechanism 27 and the first processing section 31 are arranged horizontally. The first transport mechanism 27 is movable to the height position of the first processing section 31 . The first transport mechanism 27 is arranged at substantially the same height position as the first non-liquid processing section 32 . The first transport mechanism 27 is arranged at substantially the same height position as the first liquid processing section 35 .

See FIGS. The first transport mechanism 27 has a first support portion 28 . The first support portion 28 is fixedly provided. The first support portion 28 is arranged on the second side portion 23 b of the first transport space 23 .

Please refer to FIGS. The first support portion 28 includes struts 28a and 28b. Supports 28 a and 28 b are supported by frame 22 . The struts 28a, 28b are fixed to the frame 22. As shown in FIG. The struts 28 a , 28 b are immovable with respect to the frame 22 . The support 28b is arranged at substantially the same height position as the support 28a. The struts 28a and 28b are arranged so as to be aligned substantially in the front-rear direction X. As shown in FIG. The strut 28b is arranged behind the strut 28a. The post 28a is arranged in front of the second side 23b of the first transport space 23 . The post 28b is arranged at the rear of the second side 23b of the first transport space 23 . The struts 28a and 28b extend in the up-down direction Z. As shown in FIG.

See FIGS. The first transport mechanism 27 has a first movable portion 29 . The first movable portion 29 is movably provided. The first movable portion 29 is supported by the first support portion 28 . The first movable portion 29 is movable with respect to the first support portion 28 . The first movable part 29 holds the substrate W. As shown in FIG. The first movable section 29 accesses the first processing section 31 . When the first movable portion 29 accesses the first processing portion 31 , the first movable portion 29 does not move to the bottom portion 23 d of the first transfer space 23 . That is, the first movable part 29 accesses the first processing part 31 without moving the first movable part 29 to the bottom part 23 d of the first transfer space 23 .

The first movable portion 29 includes a vertical moving portion 29a, a horizontal moving portion 29b, a rotating portion 29c, and holding portions 29d and 29e. The vertical moving part 29a is supported by the struts 28a, 28b. The vertical moving part 29a is movable in the substantially vertical direction Z with respect to the columns 28a and 28b. The vertical moving portion 29a extends substantially in the front-rear direction X. As shown in FIG. The horizontal moving portion 29b is supported by the vertical moving portion 29a. The horizontal moving portion 29b can move substantially in the front-rear direction X with respect to the vertical moving portion 29a. The rotating portion 29c is supported by the horizontally moving portion 29b. The rotating portion 29c is rotatable about the rotation axis A29c with respect to the horizontal moving portion 29b. The rotation axis A29c is a virtual line substantially parallel to the up-down direction Z. As shown in FIG. The holding portions 29d and 29e are supported by the rotating portion 29c. The holding portions 29d and 29e are movable forward and backward with respect to the rotating portion 29c. More specifically, the holding portions 29d and 29e can reciprocate in one horizontal direction determined by the orientation of the rotating portion 29c. One horizontal direction is, for example, the radial direction of the rotation axis A29c. The holding portions 29d and 29e can move forward and backward independently of each other. Each of the holding portions 29d and 29e has a substantially U-shape or a substantially Y-shape in plan view. Each of the holding portions 29d and 29e holds one substrate W in a horizontal posture.

In this manner, the holding portions 29d and 29e can move in parallel in the front-back direction X and the up-down direction Z. As shown in FIG. The holding portions 29d and 29e are rotatable around the rotation axis A29c. The holding portions 29d and 29e are movable forward and backward with respect to the rotating portion 29c.

Please refer to FIGS. The first non-liquid processing section 32 includes a plurality of (for example, 16) first heat treatment units 33 . Each first heat treatment unit 33 heats one substrate W. As shown in FIG. The first thermal processing unit 33 does not supply the substrate W with the processing liquid. The processing performed by the first thermal processing unit 33 is non-liquid processing. The first heat treatment unit 33 corresponds to a non-liquid treatment unit. The number of first heat treatment units 33 corresponds to the number of non-liquid treatment units included in the first treatment section 31 .

Please refer to FIG. The eight first heat treatment units 33 are heating units HP. The heating unit HP heats a single substrate W. As shown in FIG. The remaining eight first heat treatment units 33 are cooling units CP. The cooling unit CP performs a cooling process on one substrate W. FIG.

Each first heat treatment unit 33 contacts the first transport space 23 . The plurality of first heat treatment units 33 are arranged in a matrix when viewed from the side. For example, the plurality of first heat treatment units 33 are arranged in four rows in the front-back direction X and four stages in the up-down direction Z. As shown in FIG.

See FIGS. A basic structure of the first heat treatment unit will be described. The first heat treatment unit 33 includes a first plate 34a. The first plate 34a has a substantially disk shape. One substrate W is placed on the first plate 34a.

The first thermal processing unit 33 comprises a second plate 34b. The second plate 34b is provided at substantially the same height position as the first plate 34a. The first plate 34a and the second plate 34b are arranged so as to be aligned substantially in the width direction Y. As shown in FIG. The second plate 34b is arranged to the right of the first plate 34a. The second plate 34b has a substantially disk shape. One substrate W is placed on the second plate 34b.

The first heat treatment unit 33 has a local transport mechanism (not shown). The local transport mechanism transports the substrate W between the first plate 34a and the second plate 34b.

The first heat treatment unit 33 includes a first temperature control section (not shown). The first temperature control section is attached to at least one of the first plate 34a and the local transport mechanism. The first temperature control section adjusts the substrate W to a predetermined temperature. The first temperature control section is, for example, a heat exchanger.

The first heat treatment unit 33 includes a second temperature control section (not shown). The second temperature control section is attached to the second plate 34b. The second temperature control section adjusts the temperature of the substrate W on the second plate 34b. The second temperature control section adjusts the temperature of the substrate W on the second plate 34b to a predetermined temperature. The temperature of the substrate W adjusted by the second temperature control section is higher than the temperature of the substrate W adjusted by the first temperature control section. The second temperature control section is, for example, a heater.

The structure of the first heat treatment unit 33 may differ between the heating unit HP and the cooling unit CP. For example, the cooling unit CP does not have to include the second plate 34b, the local transport mechanism, and the second temperature control section.

Please refer to FIGS. The first liquid processing section 35 includes a plurality of (for example, six) first liquid processing units 36 . Each first liquid processing unit 36 performs liquid processing on one substrate W. FIG.

The first liquid processing unit 36 is, for example, a coating processing unit. The liquid processing performed by the first liquid processing unit 36 is, for example, coating processing of coating the substrate W with a coating film material. A coating material is an example of a treatment liquid. The coating film material applied to the substrate W by the first liquid processing unit 36 is appropriately selected according to the operation of the substrate processing apparatus 1 . The coating film is, for example, any one of an underlayer film, an intermediate layer film and an overlayer film. The coating film is, for example, an antireflection film, an SOG (Spin on Glass) film, a resist film, or a protective film. Each first liquid processing unit 36 may use the same type of coating material.

Each first liquid processing unit 36 is in contact with the first transfer space 23 . The plurality of first liquid processing units 36 are arranged in a matrix when viewed from the side. For example, the plurality of first liquid processing units 36 are arranged in three rows in the front-back direction X and two stages in the up-down direction Z. As shown in FIG.

See FIGS. The first liquid processing unit 36 includes a rotary holder 37a, a nozzle 37b and a cup 37c. The rotation holding part 37a holds one substrate W in a horizontal posture. The rotation holding part 37a can rotate the substrate W held by the rotation holding part 37a around the rotation axis. The rotation axis is an imaginary line that passes through the center of the substrate W and is substantially parallel to the vertical direction Z. As shown in FIG. The nozzle 37b ejects the processing liquid onto the substrate W held by the spin holder 37a. The nozzle 37b is movably provided between a processing position and a retracted position. The processing position is a position above the substrate W held by the spin holder 37a. When the nozzle 37b is at the processing position, the nozzle 37b overlaps the substrate W held by the rotation holding part 37a in plan view. The nozzle 37b ejects the processing liquid onto the substrate W when the nozzle 37b is at the processing position. When the nozzle 37b is at the retracted position, the nozzle 37b does not overlap the substrate W held by the rotation holding part 37a in plan view. The cup 37c is arranged around the rotation holding portion 37a. The cup 37c collects the processing liquid.

Please refer to FIG. The substrate processing apparatus 1 includes multiple housings 38 . One housing 38 accommodates three first liquid processing units 36 arranged in the upper stage. Another housing 38 accommodates three first liquid processing units 36 arranged in the lower stage.

The substrate processing apparatus 1 includes a plurality of substrate transfer ports 39 through which substrates W can pass. When the substrate W moves between the first transfer space 23 and the first liquid processing section 35 , the substrate W passes through the substrate transfer port 39 . The substrate transfer port 39 is arranged between the first transfer space 23 and the first liquid processing section 35 . A board transfer port 39 is formed in the housing 38 . The board transfer port 39 is formed in a side portion of the housing 38 that contacts the first transfer space 23 (specifically, the second side portion 23b). The substrate transfer port 39 is arranged at a height position higher than the lower end 32 a of the first non-liquid processing section 32 .

The substrate processing apparatus 1 may further include a member (such as a shutter) that opens and closes the substrate transfer port 39 . A member that opens and closes the substrate transfer port 39 can isolate the inside of the housing 38 from the first transfer space 23 .

The first transport mechanism 27 transports the substrate W to the first thermal processing unit 33 and the first liquid processing unit 36 . Specifically, the first transport mechanism 27 can place the substrate W on the first plate 34 a of each first heat treatment unit 33 . The first transport mechanism 27 can pick up the substrate W on the first plate 34 a of each first thermal processing unit 33 . The first transport mechanism 27 can place the substrate W on the spin holder 37 a of each first liquid processing unit 36 . The first transport mechanism 27 can pick up the substrate W on the spin holder 37 a of each first liquid processing unit 36 .

For example, the first transport mechanism 27 transports the substrate W to the cooling unit CP, the first liquid processing unit 36, and the heating unit HP in this order. The first processing unit 31 performs cooling processing, coating processing, and heating processing on the substrate W in this order. Thereby, the first processing section 31 forms a coating film on the substrate W. As shown in FIG. The coating film formed on the substrate W by the first processing section 31 is appropriately called a first coating film.

Please refer to FIG. The detour transport mechanism 41 is arranged at substantially the same height position as the first transport space 23 . The detour transport mechanism 41 is arranged at a height position equal to or higher than the lower end 23 c of the first transport space 23 .

At least part of the bypass transport mechanism 41 is arranged in the first transport space 23 . At least part of the bypass transport mechanism 41 is arranged on the bottom portion 23 d of the first transport space 23 .

The bypass transport mechanism 41 overlaps the first transport space 23 in a side view. The bypass transport mechanism 41 overlaps the bottom portion 23d of the first transport space 23 in a side view.

At least part of the substrate W held by the bypass transport mechanism 41 is positioned inside the first transport space 23 . All of the substrates W held by the bypass transport mechanism 41 are positioned in the first transport space 23 . All of the substrates W held by the bypass transport mechanism 41 are positioned on the bottom portion 23 d of the first transport space 23 .

The detour transport mechanism 41 and the first transport mechanism 27 are arranged so as to be aligned substantially in the vertical direction Z. As shown in FIG. The bypass transport mechanism 41 is arranged below the first transport mechanism 27 . The bypass transport mechanism 41 is arranged below the first movable portion 29 of the first transport mechanism 27 .

At least part of the bypass transport mechanism 41 is arranged in the space 40 below the first non-liquid processing section 32 . A detour transport mechanism 41 is arranged across the space 40 and the first transport space 23 . A detour transport mechanism 41 is arranged across the space 40 and the bottom portion 23d.

The detour transport mechanism 41 is arranged at a height position equal to or lower than the lower end 32 a of the first non-liquid processing section 32 . The bypass transport mechanism 41 does not overlap the first non-liquid processing section 32 in a side view.

The detour transport mechanism 41 is arranged at substantially the same height position as the first liquid processing section 35 . The detour transport mechanism 41 is arranged at a height position equal to or higher than the lower end 35 a of the first liquid processing section 35 . The bypass transport mechanism 41 overlaps the first liquid processing section 35 in a side view. That is, the bypass transport mechanism 41 overlaps the first processing section 31 in a side view. The detour transport mechanism 41 is arranged at a height position lower than the substrate transport port 39 of the first liquid processing section 35 . The bypass transport mechanism 41 is arranged on the right side of the first liquid processing section 35 .

FIG. 9 is a plan view of the substrate processing apparatus 1. FIG. FIG. 9 omits illustration of the first non-liquid processing unit 32 . At least part of the bypass transport mechanism 41 is arranged at a position overlapping the first non-liquid processing section 32 in a plan view. At least part of the bypass transport mechanism 41 is arranged at a position overlapping the first transport space 23 in plan view. The detour transport mechanism 41 is arranged at a position not overlapping the first liquid processing section 35 in plan view.

Please refer to FIGS. 8, 9, 10(a), 10(b) and 10(c). 10A is a plan view of the bypass transport mechanism 41. FIG. FIG. 10B is a left side view of the bypass transport mechanism 41. FIG. FIG. 10B is a front view of the bypass transport mechanism 41. FIG.

The detour transport mechanism 41 includes a detour support section 42 . The detour support portion 42 is fixedly provided. The detour support portion 42 is supported by the frame 22 . The detour support portion 42 is fixed to the frame 22 . The detour support portion 42 is immovable with respect to the frame 22 . The detour support portion 42 is arranged at a position overlapping the first non-liquid processing portion 32 in plan view. The detour support part 42 is arranged at a position not overlapping the first transport space 23 in plan view. The detour support portion 42 extends substantially in the front-rear direction X. As shown in FIG. The detour support portion 42 is, for example, a rail.

The detour transport mechanism 41 includes a detour movable section 43 . The detour movable portion 43 is supported by the detour support portion 42 . The detour movable portion 43 is movable with respect to the detour support portion 42 . The detour movable portion 43 extends substantially horizontally from the detour support portion 42 . Specifically, the detour movable portion 43 extends from the side portion of the detour support portion 42 toward the first transport space 23 . At least part of the detour movable part 43 is arranged inside the first transport space 23 . The detour movable part 43 holds the substrate W. As shown in FIG.

The bypass movable portion 43 includes a first bypass movable portion 43a. The first bypass movable section 43a includes a horizontal movement section 44a. The horizontal movement portion 44 a is supported by the detour support portion 42 . The horizontal movement portion 44 a is connected to the side portion of the detour support portion 42 . The horizontal moving portion 44 a is movable in a substantially horizontal direction (specifically, substantially in the front-rear direction X) with respect to the detour support portion 42 .

See FIG. The length of the detour support portion 42 in the front-rear direction X is substantially the same as the length of the vertical movement portion 29a of the first transport mechanism 27 in the front-rear direction X. As shown in FIG. The range in the front-rear direction X in which the detour support portion 42 is installed is substantially the same as the range in the front-rear direction X in which the vertical moving portion 29a is installed.

The distance in which the horizontal moving part 44a can move in the front-rear direction X is substantially the same as the distance in which the horizontal moving part 29b of the first transport mechanism 27 can move in the front-rear direction X. As shown in FIG. The range in which the horizontal moving part 44a can move in the front-rear direction X is substantially the same as the range in which the horizontal moving part 29b of the first transport mechanism 27 can move in the front-rear direction X. As shown in FIG.

See FIGS. 8, 9 and 10(a)-10(c). The first bypass movable portion 43a includes an arm portion 44b. The arm portion 44b is supported by the horizontal movement portion 44a. The arm portion 44b is connected to the horizontal movement portion 44a. The arm portion 44b extends substantially horizontally from the horizontal movement portion 44a. The arm portion 44b is rotatable with respect to the horizontal moving portion 44a. Specifically, the arm portion 44b is rotatable about the rotation axis A44b with respect to the horizontal moving portion 44a. The rotation axis A44b is a virtual line substantially parallel to the up-down direction Z. As shown in FIG.

The first bypass movable portion 43a includes a holding portion 44c. The holding portion 44c is supported by the arm portion 44b. The holding portion 44c is connected to the arm portion 44b. The holding portion 44c is fixed to the arm portion 44b. The holding portion 44c is supported by the horizontal moving portion 44a via the arm portion 44b. The holding portion 44c is rotatable with respect to the horizontal moving portion 44a. The holding portion 44c is movable to a position forward of the horizontal movement portion 44a and a position rearward of the horizontal movement portion 44a. At least part of the holding portion 44 c is arranged inside the first transport space 23 . At least part of the holding portion 44c is arranged at a position overlapping the first transport space 23 in plan view. The holding portion 44c has a substantially I shape in plan view. The holding part 44c holds the substrate W. As shown in FIG. The holding part 44c holds one substrate W in a horizontal posture. At least part of the substrate W held by the holding portion 44 c is positioned inside the first transport space 23 .

See FIGS. 10(a)-10(c). The holding portion 44c includes a holding portion main body 45a and a pad 45b. The holding portion main body 45a is connected to the arm portion 44b. The holding portion main body 45a extends substantially horizontally from the arm portion 44b. The pad 45b is connected to the holding portion main body 45a. The pad 45b protrudes upward from the holding portion main body 45a. The length of the pad 45b in the vertical direction Z is preferably longer than the length of the holding portion 19d in the vertical direction Z. Similarly, the length of the pad 45b in the vertical direction Z is preferably longer than the length of the holding portion 19e in the vertical direction Z. The pads 45b are in contact with the substrate W. FIG. Specifically, the pad 45b has an upper surface. The upper surface of the pad 45b contacts the back surface of the substrate W. As shown in FIG.

The first roundabout movable portion 43a further includes an arm portion 44d and a holding portion 44e. The arm portion 44d and the holding portion 44e have substantially the same shape and structure as the arm portion 44b and the holding portion 44c, respectively. The arm portion 44d is arranged below the arm portion 44b. The arm portion 44d is supported by the horizontal movement portion 44a. The arm portion 44d is rotatable about the rotation axis A44d with respect to the horizontal moving portion 44a. The rotation axis A44d is, for example, coaxial with the rotation axis A44b. The arm portion 44d is rotatable independently of the arm portion 44b. The holding portion 44e is fixed to the arm portion 44d.

In this manner, the holding portions 44c and 44e can move in parallel in the front-rear direction X, respectively. Furthermore, the holding portions 44c and 44e are rotatable around rotation axes A44b and A44d, respectively. However, the holding portions 44c and 44e cannot be translated in the width direction Y and the vertical direction Z, respectively.

The first roundabout movable portion 43a further includes a canopy portion 44f. In FIG. 10A, the eaves portion 44f of the first detour movable portion 43a is indicated by a dashed line. The canopy portion 44f is supported by the horizontally moving portion 44a. The canopy portion 44f is fixed to the horizontally moving portion 44a. The eaves portion 44f is arranged above the arm portions 44b, 44d and the holding portions 44c, 44e. The eaves portion 44f has a substantially horizontal plate shape. The eaves portion 44f is wider than the substrate W in plan view. The eaves portion 44f covers the upper surface of the substrate W held by the holding portions 44c and 44e. The eaves portion 44f overlaps the substrate W held by the holding portions 44c and 44e in plan view.

The bypass movable portion 43 includes a second bypass movable portion 43b. The second detouring movable portion 43b is arranged at a height position lower than that of the first detouring movable portion 43a. The second detouring movable portion 43b has substantially the same shape and structure as the first detouring movable portion 43a. The second detour movable portion 43b is movable independently of the first detour movable portion 43a. Specifically, the second detouring movable portion 43b includes a horizontal moving portion 44a, arm portions 44b and 44d, holding portions 44c and 44e, and a canopy portion 44f. The horizontal movement portion 44a of the second detour movable portion 43b is supported by the detour support portion 42 without interposing the first detour movable portion 43a. The horizontal movement portion 44 a of the second detour movable portion 43 b can move in a substantially horizontal direction with respect to the detour support portion 42 . The horizontal movement portion 44a of the second detour movable portion 43b can move independently of the horizontal movement portion 44a of the first detour movable portion 43a.

The horizontal movement portion 44a of the first detour movable portion 43a is an example of the first horizontal movement portion of the present invention. The arm portions 44b and 44d of the first detour movable portion 43a are examples of the first arm portion of the present invention. The holding portions 44c and 44e of the first detour movable portion 43a are examples of the first holding portion of the present invention. The horizontal movement portion 44a of the second detour movable portion 43b is an example of the second horizontal movement portion of the present invention. The arm portions 44b and 44d of the second detour movable portion 43b are examples of the second arm portion of the present invention. The holding portions 44c and 44e of the second detouring movable portion 43b are examples of the second holding portion of the present invention.

The bypass transport mechanism 41 cannot access the first processing section 31 . The bypass transport mechanism 41 cannot transport the substrate W to the first processing section 31 .

<Second Block 51>
See Figures 3-6. The second block 51 differs from the first block 21 in that it does not include the bypass transport mechanism 41 . However, the second block 51 has many structural similarities to that of the first block 21 .

The second block 51 has a substantially box shape. The second block 51 is substantially rectangular in plan view and side view. Although not shown, the second block 51 has a substantially rectangular shape even when viewed from the front.

A second block 51 has a frame 52 . The frame 52 is provided as a skeleton (skeleton) of the second block 51 . Frame 52 defines the shape of second block 51 . The frame 52 is made of metal, for example. The frame 52 supports the second processing section 61 and the second transport mechanism 57 .

The substrate processing apparatus 1 has a second transfer space 53 . A second transport space 53 is formed in the second block 51 . The second transport space 53 is formed in the central portion of the second block 51 in the width direction Y. As shown in FIG. The second transport space 53 extends in the front-rear direction X from the front portion of the second block 51 to the rear portion of the second block 51 . The second transport space 53 is arranged at substantially the same height position as the first transport space 23 of the first block 21 . The first transport space 23 and the second transport space 53 are arranged side by side in the front-rear direction X. As shown in FIG. The second transport space 53 is arranged behind the first transport space 23 . The second transport space 53 contacts the first transport space 23 . The second transport space 53 is arranged behind the first transport mechanism 27 and the bypass transport mechanism 41 .

Please refer to FIG. The substrate processing apparatus 1 includes an air supply unit 54 and an exhaust unit 55 . The air supply unit 54 is arranged above the second transport space 53 . The air supply unit 54 supplies gas to the second transfer space 53 . The exhaust unit 55 is arranged below the second transport space 53 . The exhaust unit 55 exhausts the gas in the second transfer space 53 . The air supply unit 54 and the exhaust unit 55 form a downward gas flow (downflow) in the second transfer space 53 . Thereby, the gas in the second transfer space 53 is kept clean. The air supply unit 54 has substantially the same structure as the air supply unit 24 . The exhaust unit 55 has substantially the same structure as the exhaust unit 25 .

A second transport mechanism 57 is provided in the second transport space 53 . The second transport mechanism 57 has substantially the same structure as the first transport mechanism 27 . Therefore, description of the structure of the second transport mechanism 57 is omitted.

See Figures 3-6. The second processing section 61 is arranged at substantially the same height position as the second transfer space 53 . The second processing section 61 is adjacent to the second transfer space 53 .

The second processing section 61 includes a second non-liquid processing section 62 and a second liquid processing section 65 . The second non-liquid processing unit 62 performs non-liquid processing on the substrate W. FIG. The second liquid processing section 65 performs liquid processing on the substrate W. FIG. The second non-liquid processing section 62 is arranged on the first side (eg, right side) of the second transfer space 53 . The second liquid processing section 65 is arranged on the second side (for example, the left side) of the second transfer space 53 .

The second non-liquid processing section 62 is arranged at substantially the same height position as the first non-liquid processing section 32 . The first non-liquid processing section 32 and the second non-liquid processing section 62 are arranged substantially side by side in the front-rear direction X. As shown in FIG. The second non-liquid processing section 62 is arranged behind the first non-liquid processing section 32 .

Please refer to FIG. The second non-liquid processing portion 62 has a lower end 62a. A lower end 62 a of the second non-liquid processing portion 62 is arranged at a height position lower than the lower end 32 a of the first non-liquid processing portion 32 .

FIG. 4 shows the length L32 of the first non-liquid processing portion 32 in the vertical direction Z. As shown in FIG. 4 shows the length L62 of the second non-liquid processing portion 62 in the vertical direction Z. FIG. Length L32 is smaller than length L62.

The second non-liquid processing section 62 includes a plurality of (for example, 20) second heat processing units 63 . Each second heat treatment unit 63 heats one substrate W. As shown in FIG. The second thermal processing unit 63 does not supply the substrate W with the processing liquid. The processing performed by the second thermal processing unit 63 is non-liquid processing. The second heat treatment unit 63 corresponds to a non-liquid treatment unit. The number of second heat treatment units 63 corresponds to the number of non-liquid treatment units included in the second treatment section 61 . The number of non-liquid processing units included in the second processing section 61 is greater than the number of non-liquid processing units included in the first processing section 31 .

The four second heat treatment units 63 are hydrophobic treatment units AHP. The hydrophobizing unit AHP performs a hydrophobizing process on the substrate W. FIG. Hydrophobic treatment is a process of adjusting the temperature of the substrate W to a predetermined temperature while supplying the substrate W with a processing gas containing hexamethyldisilazane (HMDS). Hydrophobic treatment is performed to improve the adhesion between the substrate W and the coating film. The other eight second heat treatment units 63 are medium temperature heating units MHP. The medium-temperature heating unit MHP heats the substrate W. As shown in FIG. The remaining eight second heat treatment units 63 are high temperature heating units HHP. The high-temperature heating unit HHP heats the substrate W. As shown in FIG. The high temperature heating unit HHP heats the substrate W at a higher temperature than the medium temperature heating unit MHP. Hereinafter, the heat treatment by the medium-temperature heating unit MHP will be appropriately referred to as medium-temperature heat treatment. The heat treatment by the high temperature heating unit HHP is appropriately called high temperature heat treatment.

Each second heat treatment unit 63 contacts the second transport space 53 . The plurality of second heat treatment units 63 are arranged in a matrix when viewed from the side. For example, the plurality of second heat treatment units 63 are arranged in four rows in the front-back direction X and five stages in the up-down direction Z. As shown in FIG.

The second heat treatment unit 63 has substantially the same structure as the first heat treatment unit 33 . Therefore, description of the structure of the second heat treatment unit 63 is omitted. The structure of the second heat treatment unit 63 may differ between the hydrophobic treatment unit AHP, the medium temperature heating unit MHP, and the high temperature heating unit HHP. For example, the hydrophobic processing unit AHP may further include a gas supply unit that supplies a processing gas to the substrate W on the second plate 34b .

Please refer to FIG. The second liquid processing section 65 is arranged at substantially the same height position as the first liquid processing section 35 . The first liquid processing section 35 and the second liquid processing section 65 are arranged substantially side by side in the front-rear direction X. As shown in FIG. The second liquid processing section 65 is arranged behind the first liquid processing section 35 .

The second liquid processing section 65 includes a plurality of (for example, six) second liquid processing units 66 . Each second liquid processing unit 66 performs liquid processing on one substrate W. FIG.

The second liquid processing unit 66 is, for example, a coating processing unit. The liquid processing performed by the second liquid processing unit 66 is, for example, coating processing. The coating film material applied to the substrate W by the second liquid processing unit 66 is appropriately selected according to the operation of the substrate processing apparatus 1 . Each second liquid processing unit 66 may use the same type of coating material.

Each second liquid processing unit 66 is in contact with the second transfer space 53 . The plurality of second liquid processing units 66 are arranged in a matrix when viewed from the side. For example, the plurality of second liquid processing units 66 are arranged in three rows in the front-rear direction X and two stages in the vertical direction Z. As shown in FIG.

The second liquid processing unit 66 has substantially the same structure as the first liquid processing unit 36 . Therefore, description of the structure of the second liquid processing unit 66 is omitted. The second liquid processing unit 66 may have a structure different from that of the first liquid processing unit 36 depending on the processing liquid used by the second liquid processing unit 66 . For example, the nozzle 37b of the second liquid processing unit 66 may have a structure different from that of the nozzle 37b of the first liquid processing unit 36. FIG.

The second transport mechanism 57 transports the substrate W to the second thermal processing unit 63 and the second liquid processing unit 66 . For example, the second transport mechanism 57 transports the substrate W to the hydrophobizing unit AHP, the second liquid processing unit 66, the medium temperature heating unit MHP, and the high temperature heating unit HHP in this order. The second processing unit 61 subjects the substrate W to a hydrophobization process, a coating process, a medium-temperature heat process, and a high-temperature heat process in this order. Thereby, the second processing section 61 forms a coating film on the substrate W. As shown in FIG. The coating film formed on the substrate W by the second processing section 61 is appropriately called a second coating film.

The second coating may be the same as the first coating formed by the first processing section 31 . The second coating may be different than the first coating.

<Structure for transporting wafers W between transport mechanisms>
Please refer to FIG. The first transport mechanism 27 is arranged between the main transport mechanism 17 and the second transport mechanism 57 in plan view. The main transport mechanism 17, the first transport mechanism 27, and the second transport mechanism 57 are arranged in this order in plan view. The main transport mechanism 17, the first transport mechanism 27, and the second transport mechanism 57 are arranged side by side in the front-rear direction X. As shown in FIG. The first transport mechanism 27 is arranged behind the main transport mechanism 17 . The second transport mechanism 57 is arranged behind the first transport mechanism 27 .

See FIGS. The first transport mechanism 27 is arranged at substantially the same height position as the main transport mechanism 17 and the second transport mechanism 57 . That is, the first transport mechanism 27, the main transport mechanism 17, and the second transport mechanism 57 are arranged horizontally. The main transport mechanism 17 is movable to the height position of the first transport mechanism 27 . The second transport mechanism 57 is movable to the height position of the first transport mechanism 27 .

Please refer to FIGS. A configuration for transporting the substrate W between the main transport mechanism 17 and the first transport mechanism 27 will be described. The substrate processing apparatus 1 includes a front mounting section 71 . A substrate W is placed on the front placement portion 71 . The front loading section 71 is arranged between the main transport mechanism 17 and the first transport mechanism 27 . The main transport mechanism 17 and the first transport mechanism 27 transport the substrates W to each other via the pre-mounting section 71 . The transport mechanism 18 a and the first transport mechanism 27 transport the substrates W to each other via the front placement section 71 . The transport mechanism 18 b and the first transport mechanism 27 transport the substrates W to each other via the front mounting section 71 . Therefore, when the substrate W is transported between the main transport mechanism 17 and the first transport mechanism 27, the main transport mechanism 17 and the first transport mechanism 27 do not contact the same substrate W at the same time.

The front mounting section 71 is arranged between the indexer section 11 and the first block 21 . For example, the front placement section 71 is arranged over the indexer section 11 and the first block 21 . For example, the front loading section 71 is arranged across the main transport space 13 of the indexer section 11 and the first transport space 23 of the first block 21 .

The front loading section 71 is arranged at substantially the same height position as the main transport mechanism 17 and the first transport mechanism 27 . The front loading section 71 is arranged behind the main transport mechanism 17 . The front loading section 71 is arranged behind and to the left of the transport mechanism 18a. The front placement section 71 is arranged behind and to the right of the transport mechanism 18b. The front placement section 71 is arranged in front of the first transport mechanism 27 . The front mounting portion 71 is arranged at a height position higher than that of the detour transport mechanism 41 .

Please refer to FIG. The front mounting portion 71 includes a plurality of (for example, four) plates 72 . One substrate W is placed on one plate 72 . The plurality of plates 72 are arranged so as to be aligned substantially in the vertical direction Z. As shown in FIG. Therefore, the front mounting part 71 can mount a plurality of (for example, four) substrates W thereon.

The main transport mechanism 17 can place the substrate W on the front placement section 71 . Each of the transport mechanisms 18 a and 18 b can place the substrate W on the front placement section 71 . Each of the transport mechanisms 18 a and 18 b can simultaneously place two substrates W on the front placement section 71 . The main transport mechanism 17 can pick up the substrate W on the front loading section 71 . Each of the transport mechanisms 18 a and 18 b can pick up the substrate W on the front mounting section 71 . Each of the transport mechanisms 18a and 18b can take two substrates W on the pre-mounting section 71 at the same time.

The first transport mechanism 27 can place the substrate W on the front placement portion 71 . The first transport mechanism 27 can pick up the substrate W on the front mounting section 71 .

An operation example in which the main transport mechanism 17 transfers the substrate W to the first transport mechanism 27 will be described. First, the main transport mechanism 17 places the substrate W on the front placement section 71 . For example, the main transport mechanism 17 places two substrates W on the pre-placing section 71 at the same time. Next, the first transport mechanism 27 picks up the substrate W on the front mounting section 71 . For example, the first transport mechanism 27 picks up the substrates W on the front mounting portion 71 one by one.

An operation example in which the first transport mechanism 27 transfers the substrate W to the main transport mechanism 17 will be described. First, the first transport mechanism 27 places the substrate W on the front placement section 71 . Next, the main transport mechanism 17 picks up the substrate W on the front loading section 71 .

A configuration for transporting the substrate W between the first transport mechanism 27 and the second transport mechanism 57 will be described. The substrate processing apparatus 1 includes a rear placement section 77 . A substrate W is placed on the rear placement part 77 . The rear placement section 77 is arranged between the first transport mechanism 27 and the second transport mechanism 57 . The first transport mechanism 27 and the second transport mechanism 57 transport wafers W to each other via the rear placement section 77 . Therefore, when the substrate W is transported between the first transport mechanism 27 and the second transport mechanism 57, the first transport mechanism 27 and the second transport mechanism 57 do not contact the same substrate W at the same time.

The rear placement section 77 is arranged between the first block 21 and the second block 51 . For example, the rear placement section 77 is arranged across the first block 21 and the second block 51 . For example, the rear placement section 77 is arranged across the first transport space 23 of the first block 21 and the second transport space 53 of the second block 51 .

The rear placement section 77 is arranged at substantially the same height position as the first transport mechanism 27 and the second transport mechanism 57 . The rear placement section 77 is arranged behind the first transport mechanism 27 . The rear placement section 77 is arranged in front of the second transport mechanism 57 . The rear stacking section 77 is arranged at a height position higher than the bypass transport mechanism 41 .

Please refer to FIG. The rear mounting portion 77 has substantially the same structure as the front mounting portion 71 . That is, the rear placement section 77 includes a plurality of (for example, four) plates 72 . The rear mounting part 77 can mount a plurality of (for example, four) substrates W thereon.

The first transport mechanism 27 can place the substrate W on the rear placement section 77 . The first transport mechanism 27 can pick up the substrate W on the rear placement section 77 . The second transport mechanism 57 can place the substrate W on the rear placement section 77 . The second transport mechanism 57 can pick up the substrate W on the rear placement section 77 .

When the first transport mechanism 27 transfers the substrate W to the second transport mechanism 57, the first transport mechanism 27 first places the substrate W on the rear placement part 77, and then the second transport mechanism 57 places the substrate W on the rear placement part 77. The substrate W on the placement portion 77 is taken. When the second transport mechanism 57 transfers the substrate W to the first transport mechanism 27, the second transport mechanism 57 first places the substrate W on the rear placement section 77, and then the first transport mechanism 27 places the substrate W on the latter. The substrate W on the placement portion 77 is taken.

See FIGS . The detour transport mechanism 41 is arranged between the main transport mechanism 17 and the second transport mechanism 57 in plan view. The main transport mechanism 17, the detour transport mechanism 41, and the second transport mechanism 57 are arranged in this order in plan view. The detour transport mechanism 41 is arranged at substantially the same height position as the main transport mechanism 17 and the second transport mechanism 57 . That is, the detour transport mechanism 41, the main transport mechanism 17, and the second transport mechanism 57 are arranged horizontally. The main transport mechanism 17 is movable to the height position of the detour transport mechanism 41 . The second transport mechanism 57 is movable to the height position of the detour transport mechanism 41 . The main transport mechanism 17, the first transport mechanism 27, and the second transport mechanism 57 are arranged side by side in the front-rear direction X. As shown in FIG. The detour transport mechanism 41 is arranged behind the main transport mechanism 17 . The second transport mechanism 57 is arranged behind the bypass transport mechanism 41 .

The bypass transport mechanism 41 is arranged in front of the second processing section 61 . The bypass transport mechanism 41 is arranged at a position not overlapping the second processing section 61 in plan view.

See FIG. A configuration for transporting wafers W between the main transport mechanism 17 and the detour transport mechanism 41 will be described. The main transport mechanism 17 and the detour transport mechanism 41 transfer the substrate W directly. Specifically, when the substrate W is transported between the main transport mechanism 17 and the bypass transport mechanism 41, the main transport mechanism 17 and the bypass transport mechanism 41 contact the same substrate W at the same time. In other words, the main transport mechanism 17 and the bypass transport mechanism 41 transport the substrates W to each other without any member (for example, a receiver) other than the main transport mechanism 17 and the bypass transport mechanism 41 intervening.

FIG. 9 shows the main transport mechanism 17 and the bypass transport mechanism 41 contacting the same substrate W at the same time. The holding portions 19d and 19e of the transport mechanism 18a have a substantially U shape or a substantially Y shape in plan view. The holding portions 19d and 19e of the transport mechanism 18a come into contact with the portion P1 of the substrate W. As shown in FIG. The holding portions 44c and 44e of the bypass transport mechanism 41 have a substantially I shape in plan view. The holding portions 44c and 44e of the bypass transport mechanism 41 come into contact with the portion Q of the substrate W. As shown in FIG. The portion P1 of the substrate W is different from the portion Q of the substrate W. FIG. The portion P1 of the substrate W is, for example, a portion of the rear surface of the substrate W other than the central portion. The portion P1 of the substrate W is, for example, the periphery of the back surface of the substrate W. As shown in FIG. The portion Q of the substrate W is the central portion of the back surface of the substrate W, for example. Therefore, when the transport mechanism 18a and the bypass transport mechanism 41 contact the same substrate W at the same time, the transport mechanism 18a and the bypass transport mechanism 41 do not interfere with each other.

The portion of the substrate W that contacts the holding portions 19d and 19e of the transport mechanism 18b is substantially the same as the portion P1 of the substrate W. As shown in FIG. Therefore, the portion of the substrate W that contacts the holding portions 19d and 19e of the transport mechanism 18b is different from the portion Q of the substrate W. FIG. Therefore, when the transport mechanism 18b and the bypass transport mechanism 41 contact the same substrate W at the same time, the transport mechanism 18b and the bypass transport mechanism 41 do not interfere with each other.

When the main transport mechanism 17 and the first transport mechanism 27 transfer the substrates W, the horizontal moving part 44 a is positioned at the front end of the detour support part 42 . By rotating the arm portions 44b and 44d, the holding portions 44c and 44e are positioned forward of the horizontal moving portion 44a.

A position at which the wafer W is transferred between the main transport mechanism 17 and the detour transport mechanism 41 is called a first transfer position. A position at which the substrate W is transferred between the main transport mechanism 17 and the first transport mechanism 27 is called a second transfer position. The first delivery position is substantially the same as the second delivery position in plan view. Here, the second delivery position is substantially the same as the position of the front placement section 71 . Therefore, the first delivery position is substantially the same as the position of the front placement portion 71 in plan view.

The first delivery position is a position below the second delivery position. The first delivery position is a position below the front placement portion 71 .

11(a) to 11(e) are side views showing an operation example of transferring the substrate W between the main transport mechanism 17 and the first transport mechanism 27. FIG. An operation example in which the main transport mechanism 17 transfers the wafer W to the bypass transport mechanism 41 will be described.

See FIGS. 11(a) and 11(b). The holding part 19d holds the substrate W. As shown in FIG. The holding portion 19d moves to a position above the holding portion 44c. The holding part 44c does not hold the substrate W. As shown in FIG.

See FIGS. 11(b)-11(d). The holding portion 19d moves downward. When the holding portion 19d moves to a height position substantially equal to the upper surface of the pad 45b, the holding portion 44c contacts the substrate W held by the holding portion 19d. That is, the main transport mechanism 17 and the detour transport mechanism 41 come into contact with the same substrate W at the same time when the holding portion 19d moves to a height position substantially equal to the upper surface of the pad 45b. When the holding portion 19d moves to a height position lower than the upper surface of the pad 45b, the substrate W is separated from the holding portion 19d while the substrate W is in contact with the holding portion 44c. Thereby, the substrate W is directly transferred from the main transport mechanism 17 to the detour transport mechanism 41 .

When the holding portion 19d moves to a position lower than the upper surface of the pad 45b and higher than the holding portion main body 45a, the holding portion 19d stops moving downward. When the holding portion 19d does not overlap the holding portion 44c in plan view, the holding portion 19d can move downward to a position lower than the holding portion 44c.

See FIGS. 11(d)-11(e). The holding portion 19d moves horizontally and moves away from the holding portion 44c.

An operation example in which the bypass transport mechanism 41 transfers the substrate W to the main transport mechanism 17 will be described. The operation of the bypass transport mechanism 41 transferring the substrate W to the main transport mechanism 17 is the reverse of the operation of the main transport mechanism 17 transferring the substrate W to the bypass transport mechanism 41 .

See FIGS. 11(e)-11(d). The holding part 44c holds the substrate W. As shown in FIG. The holding part 19d does not hold the substrate W. As shown in FIG. The holding portion 19d horizontally moves at a height position lower than the substrate W held by the pad 45b and higher than the holding portion main body 45a. As a result, the holding portion 19d moves to a position below the substrate W and above the holding portion main body 45a in a side view.

See FIGS. 11(d)-11(b). The holding portion 19d moves upward. When the holding portion 19d moves to a height position substantially equal to the upper surface of the pad 45b, the holding portion 19d comes into contact with the substrate W held by the holding portion 44c. That is, the main transport mechanism 17 and the detour transport mechanism 41 come into contact with the same substrate W at the same time when the holding portion 19d moves to a height position substantially equal to the upper surface of the pad 45b. When the holding portion 19d moves to a height position higher than the pad 45b, the substrate W is separated from the holding portion 44c while the substrate W is in contact with the holding portion 19d. Thereby, the substrate W is directly transferred from the first transport mechanism 27 to the main transport mechanism 17 .

See FIGS. 11(b)-11(a). The holding part 19d moves horizontally while holding the substrate W, and moves away from the holding part 44c.

The main transport mechanism 17 can transfer two substrates W to the bypass transport mechanism 41 at the same time. Specifically, the holders 19 d and 19 e of the transport mechanism 18 a can simultaneously place two substrates W on the holders 44 c and 44 e of the bypass transport mechanism 41 . Similarly, the holders 19d and 19e of the transport mechanism 18b can place two substrates W on the holders 44c and 44e of the bypass transport mechanism 41 at the same time.

The main transport mechanism 17 can receive two substrates W from the bypass transport mechanism 41 at the same time. Specifically, the holders 19d and 19e of the transport mechanism 18a can take the substrates W on the holders 44c and 44e of the bypass transport mechanism 41 at the same time. Similarly, the holders 19d and 19e of the transport mechanism 18b can take the substrates W on the holders 44c and 44e of the bypass transport mechanism 41 at the same time.

See FIG. A configuration for transporting the substrate W between the bypass transport mechanism 41 and the second transport mechanism 57 will be described. The bypass transport mechanism 41 and the second transport mechanism 57 transfer the substrate W directly. Specifically, when the substrate W is transported between the bypass transport mechanism 41 and the second transport mechanism 57, the bypass transport mechanism 41 and the second transport mechanism 57 contact the same substrate W at the same time.

FIG. 9 is a plan view showing the detour transport mechanism 41 and the second transport mechanism 57 that contact the same substrate W at the same time. The holding portions 29d and 29e of the second transport mechanism 57 have a substantially U-shape or a substantially Y-shape in plan view. The holding portions 29d and 29e of the second transport mechanism 57 come into contact with the portion P2 of the substrate W. As shown in FIG. The holding portions 44c and 44e of the bypass transport mechanism 41 come into contact with the portion Q of the substrate W. As shown in FIG. The portion P2 of the substrate W is different from the portion Q of the substrate W. As shown in FIG. The portion P2 of the substrate W is, for example, a portion of the rear surface of the substrate W other than the central portion. The portion P2 is, for example, the periphery of the back surface of the substrate W. As shown in FIG. The portion Q of the substrate W is the central portion of the back surface of the substrate W, for example. Therefore, when the second transport mechanism 57 and the bypass transport mechanism 41 contact the same substrate W at the same time, the second transport mechanism 57 and the bypass transport mechanism 41 do not interfere with each other.

The operation of the second transport mechanism 57 transferring the substrate W to the bypass transport mechanism 41 is substantially the same as the operation example of the main transport mechanism 17 transferring the substrate W to the bypass transport mechanism 41 . The operation of the bypass transport mechanism 41 transferring the substrate W to the second transport mechanism 57 is substantially the same as the operation of the bypass transport mechanism 41 transferring the substrate W to the main transport mechanism 17 . However, when the second transport mechanism 57 delivers the substrate W to the bypass transport mechanism 41 and when the bypass transport mechanism 41 delivers the substrate W to the second transport mechanism 57, the horizontal moving part 44a moves behind the bypass support part 42. located at the edge. Furthermore, the holding portions 44c and 44e are positioned behind the horizontal moving portion 44a by the rotation of the arm portions 44b and 44d.

A position at which the wafer W is transferred between the second transport mechanism 57 and the bypass transport mechanism 41 is called a third transfer position. A position where the substrate W is transferred between the first transport mechanism 27 and the second transport mechanism 57 is called a fourth transfer position. The third delivery position is substantially the same as the fourth delivery position in plan view. Here, the fourth delivery position is substantially the same as the position of the rear placement section 77 . Therefore, the third delivery position is substantially the same as the position of the rear placement portion 77 in plan view.

The third delivery position is a position below the fourth delivery position. The third delivery position is a position below the rear placement section 77 .

<Control part>
Please refer to FIG. The substrate processing apparatus 1 includes a controller 79 . The control unit 79 is installed in the indexer unit 11, for example. The control section 79 controls the indexer section 11 , the first block 21 and the second block 51 . More specifically, the control section 79 controls the main transport mechanism 17 , the first processing section 31 , the first transport mechanism 27 , the detour transport mechanism 41 , the second processing section 61 , and the second transport mechanism 57 .

The control unit 79 is implemented by a central processing unit (CPU) that executes various processes, a RAM (Random-Access Memory) that serves as a work area for arithmetic processing, a storage medium such as a fixed disk, and the like. Various types of information such as a processing recipe (processing program) for processing the substrate W and information for identifying each substrate W are stored in the storage medium.

<Operation Example of Substrate Processing Apparatus 1>
FIG. 12(a) is a diagram schematically showing the transport path of the substrate W in the first operation example shown in FIG. 2(a). FIG. 12(b) is a diagram schematically showing the transport path of the substrate W in the second operation example shown in FIG. 2(b). FIG. 12(c) is a diagram schematically showing the transport path of the substrate W in the third operation example shown in FIG. 2(c). 12(a) to 12(c), the carrier mounting portions 12a1 and 12b1 are shown in positions different from those in FIG .

The first operation example will be explained again with reference to FIG. The transport mechanism 18 a transports the substrate W from the carrier C on the carrier platform 12 a 1 to the bypass transport mechanism 41 . The bypass transport mechanism 41 transports the substrate W from the transport mechanism 18 a to the second transport mechanism 57 . The second transport mechanism 57 transports the wafer W from the bypass transport mechanism 41 to the second processing section 61 and also transports the wafer W from the second processing section 61 to the post-mounting section 77 . The first transport mechanism 27 transports the wafers W from the rear loading section 77 to the first processing section 31 and transports the wafers W from the first processing section 31 to the front loading section 71 . The transport mechanism 18b transports the substrate W from the front mounting portion 71 to the carrier C on the carrier mounting portion 12b1.

In the first operation example, the substrate processing apparatus 1 forms a two-layer coating film on the substrate W. FIG. Specifically, the substrate processing apparatus 1 forms a second coating film on the upper surface of the substrate W, and forms a first coating film on the upper surface of the second coating film.

For example, the second coating film may be either the lower layer film or the intermediate film, and the first coating film may be either the intermediate film or the upper layer film. For example, the second coating may be an antireflection coating and the first coating may be a resist film.

A detailed operation example of the bypass transport mechanism 41 will be described. The first detour movable part 43a receives one or two substrates W from the main transport mechanism 17 at the first transfer position. Subsequently, the first detour movable part 43 a transports the substrate W to the second transport mechanism 57 . Specifically, the first detour movable part 43a moves from the first transfer position to the second transfer position, transfers the substrate W to the second transport mechanism T2, and returns to the first transfer position. While the first detour movable part 43a is transporting the wafers W to the second transport mechanism 57, the second detour movable part 43b transports one or two wafers W from the main transport mechanism 17 at the first transfer position. receive. After the second detour movable part 43 b receives the substrate W from the main transport mechanism 17 , the second detour movable part 43 b transports the substrate W to the second transport mechanism 57 . While the second detour movable part 43b is transporting the wafer W to the second transport mechanism 57, the first detour movable part 43a receives the wafer W from the main transport mechanism 17 at the first transfer position.

In this way, the first detour movable part 43 a alternately repeats the first receiving operation of receiving the substrate W from the main transport mechanism 17 and the first transport operation of transporting the substrate W to the second transport mechanism 57 . The second roundabout movable portion 43b also alternately repeats the first receiving operation and the first conveying operation. The first detour movable portion 43a and the second detour movable portion 43b can move independently of each other. Therefore, when one of the first detouring movable portion 43a and the second detouring movable portion 43b is performing the first conveying operation, the other of the first detouring movable portion 43a and the second detouring movable portion 43b is performing the first receiving operation. It can be carried out. As a result, the period during which the bypass transport mechanism 41 cannot receive the wafers W from the main transport mechanism 17 can be shortened. Therefore, the bypass transport mechanism 41 can efficiently transport the substrate W from the main transport mechanism 17 to the second transport mechanism 57 .

The second operation example will be explained again with reference to FIG. The transport mechanism 18 a transports the substrate W from the carrier C on the carrier platform 12 a 1 to the front platform 71 . The first transport mechanism 27 transports the wafer W from the front loading section 71 to the first processing section 31 and transports the wafer W from the first processing section 31 to the rear loading section 77 . The second transport mechanism 57 transports the wafers W from the rear placement part 77 to the second processing part 61 and transports the wafers W from the second processing part 61 to the bypass transport mechanism 41 . The bypass transport mechanism 41 transports the substrate W from the second transport mechanism 57 to the transport mechanism 18b. The transport mechanism 18b transports the substrate W from the bypass transport mechanism 41 to the carrier C on the carrier platform 12b1.

In the second operation example, the substrate processing apparatus 1 forms a two-layer coating film on the substrate W. FIG. Specifically, the substrate processing apparatus 1 forms a first coating film on the upper surface of the substrate W, and forms a second coating film on the upper surface of the first coating film.

For example, the first coating film may be either the lower layer film or the intermediate film, and the second coating film may be either the intermediate film or the upper layer film. For example, the first coating may be an antireflection film and the second coating may be a resist film.

A detailed operation example of the bypass transport mechanism 41 will be described. The first detour movable part 43a receives one or two substrates W from the second transport mechanism 57 at the second transfer position. Subsequently, the first detour movable part 43 a transports the substrate W to the main transport mechanism 17 . Specifically, the first detour movable part 43a moves from the second transfer position to the first transfer position, transfers the substrate W to the transport mechanism 18b, and returns to the second transfer position. While the first detour movable part 43a is transporting the wafers W to the main transport mechanism 17, the second detour movable part 43b transports one or two wafers W from the second transport mechanism 57 at the second transfer position. receive. After the second detour movable part 43 b receives the two substrates W from the second transport mechanism 57 , the second detour movable part 43 b transports the wafers W to the main transport mechanism 17 . While the second detour movable part 43b is transporting the substrate W to the main transport mechanism 17, the first detour movable part 43a receives the substrate W from the second transport mechanism 57 at the second transfer position.

In this manner, the first detour movable part 43 a alternately repeats the second receiving operation of receiving the substrate W from the second transport mechanism 57 and the second transport operation of transporting the substrate W to the main transport mechanism 17 . The second detour movable portion 43b also alternately repeats the second receiving operation and the second conveying operation. The first detour movable portion 43a and the second detour movable portion 43b can move independently of each other. Therefore, when one of the first detouring movable portion 43a and the second detouring movable portion 43b is performing the second conveying operation, the other of the first detouring movable portion 43a and the second detouring movable portion 43b is performing the second receiving operation. It can be carried out. As a result, the period during which the bypass transport mechanism 41 cannot receive the wafers W from the second transport mechanism 57 can be shortened. Therefore, the bypass transport mechanism 41 can efficiently transport the substrate W from the second transport mechanism 57 to the main transport mechanism 17 .

The third operation example will be described again with reference to FIG. 12(c). The transport mechanism 18a transports the first substrate W1 from the carrier C on the carrier platform 12a1 to the front platform 71, and transports the second substrate W2 from the carrier C on the carrier platform 12a1 to the bypass transport mechanism 41. do. The first transport mechanism 27 transports the first wafer W<b>1 from the front mounting part 71 to the first processing part 31 and transports the first wafer W<b>1 from the first processing part 31 to the front mounting part 71 . The bypass transport mechanism 41 transports the second substrate W<b>2 from the transport mechanism 18 a to the second transport mechanism 57 . The second transport mechanism 57 transports the second substrate W<b>2 from the bypass transport mechanism 41 to the second processing section 61 and transports the second substrate W<b>2 from the second processing section 61 to the bypass transport mechanism 41 . The bypass transport mechanism 41 transports the second substrate W2 from the second transport mechanism 57 to the transport mechanism 18b. The transport mechanism 18b transports the first wafer W1 from the front loading part 71 to the carrier C on the carrier loading part 12b1, and transports the second wafer W2 from the bypass transport mechanism 41 to the carrier C on the carrier loading part 12b1. do.

In the third operation example, the substrate processing apparatus 1 forms one layer of coating film on the first substrate W1 and forms one layer of coating film on the second substrate W2. Specifically, the substrate processing apparatus 1 forms a first coating film on the upper surface of the first substrate W1 and forms a second coating film on the upper surface of the second substrate W2.

A detailed operation example of the bypass transport mechanism 41 will be described. The first detour movable part 43 a performs a first receiving operation for receiving the second substrate W<b>2 from the main transport mechanism 17 , a first transport operation for transporting the second substrate W<b>2 to the second transport mechanism 57 , and a The second receiving operation for receiving the second substrate W2 and the second transport operation for transporting the second substrate W2 to the main transport mechanism 17 are repeated. The second bypass movable portion 43b also repeats the first receiving operation, the first transporting operation, the second receiving operation, and the first transporting operation. The first detour movable portion 43a and the second detour movable portion 43b can move independently of each other. Therefore, the period during which the bypass transport mechanism 41 cannot receive the wafers W from the main transport mechanism 17 can be shortened. The period during which the bypass transport mechanism 41 cannot receive the substrates W from the second transport mechanism 57 can be shortened. Therefore, the bypass transport mechanism 41 can efficiently transport the substrates W between the main transport mechanism 17 and the second transport mechanism 57 .

<Other effects of the first embodiment>
The main effects of the first embodiment are as described above. Other effects of the first embodiment will be described below.

The main transport mechanism 17 and the detour transport mechanism 41 transfer the substrate W directly. More specifically, when the substrate W is transported between the main transport mechanism 17 and the bypass transport mechanism 41, the main transport mechanism 17 and the bypass transport mechanism 41 contact the same substrate W at the same time. According to this, the main transport mechanism 17 and the bypass transport mechanism 41 do not temporarily place the substrate W on a separate member (for example, a mounting section) from the main transport mechanism 17 and the bypass transport mechanism 41. , the main transport mechanism 17 and the detour transport mechanism 41 can transport substrates W to each other. Therefore, the wafers W can be efficiently transported between the main transport mechanism 17 and the detour transport mechanism 41 .

The portion P1 of the substrate W that contacts the main transport mechanism 17 is different from the portion Q of the substrate W that contacts the bypass transport mechanism 41 . Therefore, when the main transport mechanism 17 and the bypass transport mechanism 41 contact the same substrate W at the same time, interference between the main transport mechanism 17 and the bypass transport mechanism 41 can be preferably prevented.

Each of the holding portions 19d and 19e of the main transport mechanism 17 has a substantially U-shape or a substantially Y-shape in plan view. Each of the holding portions 44c and 44e of the bypass transport mechanism 41 has a substantially I shape in plan view. Therefore, when the main transport mechanism 17 and the bypass transport mechanism 41 contact the same substrate W at the same time, interference between the main transport mechanism 17 and the bypass transport mechanism 41 can be preferably prevented.

The first delivery position is substantially the same as the second delivery position in plan view. Therefore, the amount of movement of the main transport mechanism 17 to the first delivery position can be suppressed. Specifically, the amount of horizontal movement of the main transport mechanism 17 when the main transport mechanism 17 moves to the first transfer position is the horizontal movement amount of the main transport mechanism 17 when the main transport mechanism 17 moves to the second transfer position. It can be suppressed to the same degree as the amount of horizontal movement. Therefore, the main transport mechanism 17 and the detour transport mechanism 41 can easily transport the substrates W to each other.

The first delivery position is substantially the same as the position of the front placement portion 71 in plan view. Therefore, the amount of movement of the main transport mechanism 17 to the first delivery position can be suppressed. Therefore, the main transport mechanism 17 and the detour transport mechanism 41 can easily transport the substrates W to each other.

The second transport mechanism 57 and the bypass transport mechanism 41 directly transfer substrates. More specifically, when the substrate W is transported between the second transport mechanism 57 and the bypass transport mechanism 41, the second transport mechanism 57 and the bypass transport mechanism 41 contact the same substrate W at the same time. Therefore, the substrate W can be efficiently transported between the second transport mechanism 57 and the bypass transport mechanism 41 .

The portion P2 of the substrate W that contacts the second transport mechanism 57 is different from the portion Q of the substrate W that contacts the bypass transport mechanism 41 . Therefore, when the second transport mechanism 57 and the bypass transport mechanism 41 contact the same substrate W at the same time, interference between the second transport mechanism 57 and the bypass transport mechanism 41 can be preferably prevented.

Each of the holding portions 29d and 29e of the second transport mechanism 57 has a substantially U-shape or a substantially Y-shape in plan view. Each of the holding portions 44c and 44e of the bypass transport mechanism 41 has a substantially I shape in plan view. Therefore, when the second transport mechanism 57 and the bypass transport mechanism 41 contact the same substrate W at the same time, interference between the second transport mechanism 57 and the bypass transport mechanism 41 can be preferably prevented.

The third delivery position is substantially the same as the fourth delivery position in plan view. Therefore, the amount by which the second transport mechanism 57 moves to the third transfer position can be suppressed. Specifically, the amount of horizontal movement of the second transport mechanism 57 when the second transport mechanism 57 moves to the third transfer position is the second distance when the second transport mechanism 57 moves to the fourth transfer position. The amount of movement of the transport mechanism 57 in the horizontal direction can be suppressed to the same extent. Therefore, the second transport mechanism 57 and the bypass transport mechanism 41 can easily transport the substrates W to each other.

The third delivery position is substantially the same as the position of the rear placement portion 77 in plan view. Therefore, the amount by which the second transport mechanism 57 moves to the third transfer position can be suppressed. Therefore, the second transport mechanism 57 and the bypass transport mechanism 41 can easily transport the substrates W to each other.

At least part of the substrate W held by the bypass transport mechanism 41 is positioned in the first transport space 23 . Therefore, the environment around the substrate W held by the bypass transport mechanism 41 is the same as the environment around the substrate W held by the first transport mechanism 27 . Therefore, the environment around the substrate W held by the bypass transport mechanism 41 can be easily kept clean.

The air supply unit 24 is provided above the first transport space 23 and supplies gas to the first transport space 23 . The exhaust unit 25 is provided below the first transport space 23 and exhausts the gas in the first transport space 23 . This keeps the first transport space 23 clean. Therefore, not only the substrates W held by the first transport mechanism 27 but also the substrates W held by the bypass transport mechanism 41 can be suitably protected from particles, dust, and the like.

At least part of the bypass transport mechanism 41 is arranged in the first transport space 23 . In other words, at least part of the bypass transport mechanism 41 is arranged in the same space as the first transport mechanism 27 (that is, the first transport space 23). Therefore, the environment around the bypass transport mechanism 41 can be easily kept clean. Therefore, the substrate W transported by the bypass transport mechanism 41 can be suitably protected from particles, dust, and the like.

A part of the first transport space 23 is used as an installation space for the detour transport mechanism 41 . Therefore, it is possible to suitably suppress the increase in size of the substrate processing apparatus 1 .

At least part of the bypass transport mechanism 41 is arranged at a position overlapping the first non-liquid processing section 32 in a plan view. Therefore, it is possible to suppress an increase in the footprint of the substrate processing apparatus 1 (installation area of the substrate processing apparatus 1 in plan view).

A length L32 of the first non-liquid processing portion 32 in the vertical direction Z is smaller than a length L23 of the first transfer space 23 in the vertical direction Z. As shown in FIG. Therefore, by arranging at least part of the bypass transport mechanism 41 at a position overlapping the first non-liquid processing section 32 in plan view, an increase in the length of the substrate processing apparatus 1 in the vertical direction Z is suppressed. can.

The length L32 of the first non-liquid processing portion 32 in the vertical direction Z is smaller than the length L35 of the first liquid processing portion 35 in the vertical direction Z. As shown in FIG. Therefore, by arranging at least part of the bypass transport mechanism 41 at a position overlapping the first non-liquid processing section 32 in plan view, an increase in the length of the substrate processing apparatus 1 in the vertical direction Z is suppressed. can. By arranging the detour transport mechanism 41 at a position not overlapping the first liquid processing section 35 in plan view, it is possible to suppress an increase in the length of the substrate processing apparatus 1 in the vertical direction Z. FIG.

A length L32 of the first non-liquid processing portion 32 in the vertical direction Z is smaller than a length L62 of the second non-liquid processing portion 62 in the vertical direction Z. Therefore, by arranging at least part of the bypass transport mechanism 41 at a position overlapping the first non-liquid processing section 32 in plan view, an increase in the length of the substrate processing apparatus 1 in the vertical direction Z is suppressed. can. By arranging the bypass transport mechanism 41 at a position not overlapping the second non-liquid processing section 62 in plan view, it is possible to suppress an increase in the length of the substrate processing apparatus 1 in the vertical direction Z. FIG.

The number of non-liquid processing units included in the first processing section 31 is smaller than the number of non-liquid processing units included in the second processing section 61 . Therefore, the installation space of the first non-liquid processing section 32 is smaller than the installation space of the second non-liquid processing section 62 . Therefore, by arranging at least part of the bypass transport mechanism 41 at a position overlapping the first non-liquid processing section 32 in plan view, an increase in the length of the substrate processing apparatus 1 in the vertical direction Z is suppressed. can. By arranging the bypass transport mechanism 41 at a position not overlapping the second non-liquid processing section 62 in plan view, it is possible to suppress an increase in the length of the substrate processing apparatus 1 in the vertical direction Z. FIG.

The bypass transport mechanism 41 is arranged across the space 40 below the first non-liquid processing section 32 and the first transport space 23 . Therefore, an increase in the footprint of the substrate processing apparatus 1 can be suppressed.

The first non-liquid processing section 32 is adjacent to the first transport space 23 and is arranged at a height position higher than the lower end 23 c of the first transport space 23 . Therefore, the space 40 below the first non-liquid processing section 32 is continuous with the first transfer space 23 . Therefore, an installation space for the detour transport mechanism 41 can be easily secured.

A space 40 below the first non-liquid processing section 32 is in contact with the first side portion 23 a of the first transfer space 23 . The first support portion 28 of the first transport mechanism 27 is arranged on the second side portion 23 b of the first transport space 23 . That is, the first support part 28 is not arranged between the space 40 and the first transport space 23 . Therefore, the first transport space 23 is continuous with the space 40 without any trouble. That is, the space 40 and the first transfer space 23 can form one relatively large space. Therefore, an installation space for the detour transport mechanism 41 can be easily secured.

The detour transport mechanism 41 is arranged at a position equal to or lower than the lower end 32 a of the first non-liquid processing section 32 . Therefore, it is possible to preferably prevent the bypass transport mechanism 41 from interfering with the first non-liquid processing section 32 .

The detour transport mechanism 41 is arranged at a position equal to or higher than the lower end 35 a of the first liquid processing section 35 . Therefore, an increase in the length of the substrate processing apparatus 1 in the vertical direction Z can be suppressed.

The first movable portion 29 accesses the first non-liquid processing portion 32 and the first liquid processing portion 35 without moving the first movable portion 29 to the bottom portion 23 d of the first transfer space 23 . That is, the first movable portion 29 does not move to a height position lower than the lower end 32 a of the first non-liquid processing portion 32 , and the first non-liquid processing portion 32 and the first liquid processing portion 35 do not move. to access. The bypass transport mechanism 41 is arranged at a lower position equal to or better than the lower end 32 a of the first non-liquid processing section 32 . Therefore, it is possible to preferably prevent the bypass transport mechanism 41 from interfering with the first movable portion 29 .

At least part of the detour movable part 43 is arranged inside the first transport space 23 . Therefore, the substrate W held by the detour movable part 43 can be easily positioned inside the first transfer space 23 . As a result, the environment around the substrate W held by the bypass transport mechanism 41 can be easily kept clean.

The detour support portion 42 is arranged at a position overlapping the first non-liquid processing portion 32 in plan view. Therefore, at least part of the detour movable part 43 can be easily installed inside the first transport space 23 .

The detour support part 42 is not installed in the first transport space 23 . Therefore, an installation space for at least a part of the detour movable part 43 can be easily secured in the first transport space 23 .

The bypass movable portion 43 includes a horizontal moving portion 44a and holding portions 44c and 44e. Therefore, the substrate W can be suitably transported between the main transport mechanism 17 and the second transport mechanism 57 .

The bypass movable portion 43 includes arm portions 44b and 44d. Therefore, the holding portions 44c and 44e are rotatable with respect to the horizontal moving portion 44a. Therefore, the holding portions 44c and 44e can move forward relative to the horizontal moving portion 44a. Therefore, the bypass transport mechanism 41 can suitably transfer the substrate W to the main transport mechanism 17 and receive the substrate W from the main transport mechanism 17 . Furthermore, the holding portions 44c and 44e can move rearward relative to the horizontal moving portion 44a. Therefore, the bypass transport mechanism 41 can suitably transfer the substrate W to the second transport mechanism 57 and receive the substrate W from the second transport mechanism 57 .

The detour movable portion 43 includes a second detour movable portion 43b in addition to the first detour movable portion 43a. Therefore, the number of wafers W that can be transported per unit time by the bypass transport mechanism 41 can be easily increased.

The second detour movable portion 43b is movable independently of the first detour movable portion 43a. Specifically, the horizontal movement portion 44a of the second detour movable portion 43b can move independently of the horizontal movement portion 44a of the first detour movable portion 43a. Therefore, the bypass transport mechanism 41 can efficiently transport the substrates W between the main transport mechanism 17 and the second transport mechanism 57 .

The structure of the bypass transport mechanism 41 is relatively simple. Specifically, the bypass transport mechanism 41 does not have a configuration for moving the holding portions 44c and 44e in the width direction Y in parallel. The detour transport mechanism 41 does not have a configuration for moving the holding portions 44c and 44e in the vertical direction Z in parallel. Therefore, the detour transport mechanism 41 can be easily miniaturized. For example, the length of the bypass transport mechanism 41 in the vertical direction Z can be easily made smaller than the length of the first transport mechanism 27 in the vertical direction Z. Therefore, the enlargement of the substrate processing apparatus 1 can be suitably suppressed.

[Second embodiment]
A substrate processing apparatus 1 according to a second embodiment will be described with reference to the drawings. In addition, detailed description is abbreviate|omitted by attaching|subjecting the same code|symbol about the same structure as 1st Embodiment.

<Overview of substrate processing equipment>
FIG. 13 is a conceptual diagram of the substrate processing apparatus 1 of the second embodiment. The substrate processing apparatus 1 includes a third processing section 91 and a fourth processing section 131 in addition to the first processing section 31 and the second processing section 61 . The substrate processing apparatus 1 includes a third transport mechanism 87 and a fourth transport mechanism 127 in addition to the main transport mechanism 17 , first transport mechanism 27 and detour transport mechanism 41 . The third processing section 91 is arranged below the first processing section 31 . The third processing unit 91 processes the substrate W. FIG. The third transport mechanism 87 is arranged below the first transport mechanism 27 and the bypass transport mechanism 41 . The third transport mechanism 87 transports the substrate W to the third processing section 91 . The fourth processing section 131 is arranged below the second processing section 61 . The fourth processing unit 131 processes the substrate W. FIG. The fourth transport mechanism 127 is arranged below the second transport mechanism 57 . The fourth transport mechanism 127 transports the substrate W to the fourth processing section 131 .

The substrate processing apparatus 1 includes a fifth processing section 111 , a fifth transport mechanism 107 , a sixth processing section 151 and a sixth transport mechanism 147 . The fifth processing section 111 is arranged above the first processing section 31 . The fifth processing unit 111 processes the substrate W. FIG. The fifth transport mechanism 107 is arranged above the first transport mechanism 27 and the bypass transport mechanism 41 . The fifth transport mechanism 107 transports the substrate W to the fifth processing section 111 . The sixth processing section 151 is arranged above the second processing section 61 . The sixth processing unit 151 processes the substrate W. FIG. The sixth transport mechanism 147 is arranged above the second transport mechanism 57 . The sixth transport mechanism 147 transports the substrate W to the sixth processing section 151 .

The main transport mechanism 17 can move to the height position of the first transport mechanism 27 , the height position of the detour transport mechanism 41 , the height position of the third transport mechanism 87 , and the height position of the fifth transport mechanism 107 . That is, the main transport mechanism 17 and the first transport mechanism 27 are arranged horizontally. The main transport mechanism 17 is arranged so as to be horizontally aligned with the detour transport mechanism 41 . The main transport mechanism 17 and the third transport mechanism 87 are arranged horizontally. The main transport mechanism 17 and the fifth transport mechanism 107 are arranged horizontally. In summary, the first transport mechanism 27 , the detour transport mechanism 41 , the third transport mechanism 87 , and the fifth transport mechanism 107 are arranged at substantially the same height position as the main transport mechanism 17 . The main transport mechanism 17 and the first transport mechanism 27 are capable of transporting substrates W to each other. The main transport mechanism 17 and the detour transport mechanism 41 are capable of transporting substrates W to each other. The main transport mechanism 17 and the third transport mechanism 87 are capable of transporting substrates W to each other. The main transport mechanism 17 and the fifth transport mechanism 107 are capable of transporting substrates W to each other.

The main transport mechanism 17 and the second transport mechanism 57 cannot transport substrates W to each other. The main transport mechanism 17 and the fourth transport mechanism 127 cannot transport substrates W to each other. The main transport mechanism 17 and the sixth transport mechanism 147 cannot transport substrates W to each other. Specifically, the main transport mechanism 17 cannot transfer the substrate W to the second transport mechanism 57 , the fourth transport mechanism 127 and the sixth transport mechanism 147 . The main transport mechanism 17 cannot receive substrates W from the second transport mechanism 57 , the fourth transport mechanism 127 and the sixth transport mechanism 147 .

The substrate processing apparatus 1 has a relay transport mechanism 167 . The relay transport mechanism 167 transports the substrate W. As shown in FIG. The relay transport mechanism 167 can move to a position between the first transport mechanism 27 and the second transport mechanism 57 . The relay transport mechanism 167 is movable to a position between the detour transport mechanism 41 and the second transport mechanism 57 . The relay transport mechanism 167 can move to a position between the third transport mechanism 87 and the fourth transport mechanism 127 . The relay transport mechanism 167 can move to a position between the fifth transport mechanism 107 and the sixth transport mechanism 147 . Between the first transport mechanism 27, the second transport mechanism 57, the third transport mechanism 87, the fourth transport mechanism 127, the fifth transport mechanism 107, the sixth transport mechanism 147, and the detour transport mechanism 41, the relay transport mechanism 167 A substrate W can be transported.

The second transport mechanism 57 is movable to the height position of the first transport mechanism 27 and the height position of the detour transport mechanism 41 . That is, the first transport mechanism 27 and the second transport mechanism 57 are arranged horizontally. The bypass transport mechanism 41 and the second transport mechanism 57 are arranged horizontally. In summary, the first transport mechanism 27 and the detour transport mechanism 41 are arranged at substantially the same height position as the second transport mechanism 57, respectively. The fourth transport mechanism 127 can move to the height position of the third transport mechanism 87 . That is, the third transport mechanism 87 and the fourth transport mechanism 127 are arranged horizontally. The third transport mechanism 87 is arranged at substantially the same height position as the fourth transport mechanism 127 . The sixth transport mechanism 147 can move to the height position of the fifth transport mechanism 107 . That is, the fifth transport mechanism 107 and the sixth transport mechanism 147 are arranged horizontally. The fifth transport mechanism 107 is arranged at substantially the same height position as the sixth transport mechanism 147 .

Two operation examples of the substrate processing apparatus 1 are illustrated. FIG. 14A is a diagram schematically showing a fourth operation example of the substrate processing apparatus 1. FIG. FIG. 14B is a diagram schematically showing a fifth operation example of the substrate processing apparatus 1. FIG. 14(a) and 14(b) schematically show elements of the substrate processing apparatus 1 through which the substrate W passes.

Please refer to FIG. In the fourth operation example, the first substrate W1 is transferred to the fourth processing section 131, the first processing section 31 and the third processing section 91 in this order. In the fourth operation example, the second substrate W2 is transported to the sixth processing section 151, the second processing section 61 and the fifth processing section 111 in this order.

The main transport mechanism 17 transports the first substrate W<b>1 and the second substrate W<b>2 to the bypass transport mechanism 41 . The bypass transport mechanism 41 transports the first substrate W<b>1 and the second substrate W<b>2 from the main transport mechanism 17 to the relay transport mechanism 167 . The relay transport mechanism 167 transports the first substrate W1 from the bypass transport mechanism 41 to the fourth transport mechanism 127, and transports the second substrate W2 from the bypass transport mechanism 41 to the sixth transport mechanism 147. The fourth transport mechanism 127 transports the first substrate W1 from the intermediate transport mechanism 167 to the fourth processing section 131 and transports the first substrate W1 from the fourth processing section 131 to the intermediate transport mechanism 167 . The sixth transport mechanism 147 transports the second substrate W2 from the intermediate transport mechanism 167 to the sixth processing section 151, and transports the second substrate W2 from the sixth processing section 151 to the intermediate transport mechanism 167. The relay transport mechanism 167 transports the first substrate W<b>1 from the fourth transport mechanism 127 to the first transport mechanism 27 and transports the second substrate W<b>2 from the sixth transport mechanism 147 to the second transport mechanism 57 . The first transport mechanism 27 transports the first substrate W<b>1 from the relay transport mechanism 167 to the first processing section 31 and transports the first substrate W<b>1 from the first processing section 31 to the relay transport mechanism 167 . The second transport mechanism 57 transports the second substrate W2 from the relay transport mechanism 167 to the second processing section 61 and also transports the second substrate W2 from the second processing section 61 to the relay transport mechanism 167 . The relay transport mechanism 167 transports the first substrate W<b>1 from the first transport mechanism 27 to the third transport mechanism 87 and transports the second substrate W<b>2 from the second transport mechanism 57 to the fifth transport mechanism 107 . The third transport mechanism 87 transports the first substrate W1 from the intermediate transport mechanism 167 to the third processing section 91 and also transports the first substrate W1 from the third processing section 91 to the main transport mechanism 17 . The fifth transport mechanism 107 transports the second substrate W2 from the relay transport mechanism 167 to the fifth processing section 111 and also transports the second substrate W2 from the fifth processing section 111 to the main transport mechanism 17 . The main transport mechanism 17 receives the first substrate W<b>1 from the third transport mechanism 87 and the second substrate W<b>2 from the fifth transport mechanism 107 .

Thus, the processing by the fourth processing unit 131, the processing by the first processing unit 31, and the processing by the third processing unit 91 are performed on the first substrate W1 in this order. The processing by the sixth processing unit 151, the processing by the second processing unit 61, and the processing by the fifth processing unit 111 are performed on the second substrate W2 in this order.

In addition, in the fourth operation example, the main transport mechanism 17 does not receive the substrates W from the first transport mechanism 27 and the relay transport mechanism 167 .

See FIG. 14(b). In the fifth operation example, the first substrate W1 is transferred to the third processing section 91, the first processing section 31 and the fourth processing section 131 in this order. In the fifth operation example, the second substrate W2 is transported to the fifth processing section 111, the second processing section 61 and the sixth processing section 151 in this order.

The main transport mechanism 17 transports the first substrate W<b>1 to the third transport mechanism 87 and transports the second substrate W<b>2 to the fifth transport mechanism 107 . The third transport mechanism 87 transports the first substrate W1 from the main transport mechanism 17 to the third processing section 91 and also transports the first substrate W1 from the third processing section 91 to the intermediate transport mechanism 167 . The fifth transport mechanism 107 transports the second substrate W2 from the main transport mechanism 17 to the fifth processing section 111 and also transports the second substrate W2 from the fifth processing section 111 to the intermediate transport mechanism 167 . The relay transport mechanism 167 transports the first substrate W<b>1 from the third transport mechanism 87 to the first transport mechanism 27 and transports the second substrate W<b>2 from the fifth transport mechanism 107 to the second transport mechanism 57 . The first transport mechanism 27 transports the first substrate W<b>1 from the relay transport mechanism 167 to the first processing section 31 and transports the first substrate W<b>1 from the first processing section 31 to the relay transport mechanism 167 . The second transport mechanism 57 transports the second substrate W2 from the relay transport mechanism 167 to the second processing section 61 and also transports the second substrate W2 from the second processing section 61 to the relay transport mechanism 167 . The relay transport mechanism 167 transports the first substrate W<b>1 from the first transport mechanism 27 to the fourth transport mechanism 127 and transports the second substrate W<b>2 from the second transport mechanism 57 to the sixth transport mechanism 147 . The fourth transport mechanism 127 transports the first substrate W1 from the intermediate transport mechanism 167 to the fourth processing section 131 and also transports the first substrate W1 from the fourth processing section 131 to the intermediate transport mechanism 167 . The sixth transport mechanism 147 transports the second substrate W2 from the intermediate transport mechanism 167 to the sixth processing section 151, and transports the second substrate W2 from the sixth processing section 151 to the intermediate transport mechanism 167. The relay transport mechanism 167 transports the first substrate W<b>1 from the fourth transport mechanism 127 to the bypass transport mechanism 41 and transports the second substrate W<b>2 from the sixth transport mechanism 147 to the bypass transport mechanism 41 . The bypass transport mechanism 41 transports the first substrate W<b>1 and the second substrate W<b>2 from the relay transport mechanism 167 to the main transport mechanism 17 . The main transport mechanism 17 receives the first substrate W<b>1 and the second substrate W<b>2 from the bypass transport mechanism 41 .

Accordingly, the processing by the third processing unit 91, the processing by the first processing unit 31, and the processing by the fourth processing unit 131 are performed on the first substrate W1 in this order. The processing by the fifth processing unit 111, the processing by the second processing unit 61, and the processing by the sixth processing unit 151 are performed on the second substrate W2 in this order.

In addition, in the fifth operation example, the main transport mechanism 17 does not transfer the substrate W to the first transport mechanism 27 and the relay transport mechanism 167 .

<Main effects of the second embodiment>
The second embodiment also has the same effect as the first embodiment. For example, the burden of transporting the substrate W by the first transport mechanism 27 can be reduced. Furthermore, the burden of transporting the substrate W by the bypass transport mechanism 41 is relatively small. Therefore, the number of substrates W that can be processed per unit time by the first processing section 31 can be increased. Therefore, the throughput of the substrate processing apparatus 1 can be improved. Furthermore, the number of substrates W that can be processed per unit time by the second processing section 61 can be increased. Therefore, the throughput of the substrate processing apparatus 1 can be further improved.

Furthermore, according to the second embodiment, the following main effects are obtained.

The substrate processing apparatus 1 includes a third processing section 91 , a fourth processing section 131 , a fifth processing section 111 and a sixth processing section 151 . Therefore, the substrate W can be subjected to the processing by the third processing unit 91 , the processing by the fourth processing unit 131 , the processing by the fifth processing unit 111 , and the processing by the sixth processing unit 151 .

The substrate processing apparatus 1 includes a third transport mechanism 87 , a fourth transport mechanism 127 , a fifth transport mechanism 107 and a sixth transport mechanism 147 . Therefore, the substrates can be suitably transferred to the third processing section 91 , the fourth processing section 131 , the fifth processing section 111 and the sixth processing section 151 .

The third processing section 91 is arranged below the first processing section 31 . The fourth processing section 131 is arranged below the second processing section 61 . The fifth processing section 111 is arranged above the first processing section 31 . The sixth processing section 151 is arranged above the second processing section 61 . For these reasons, an increase in the footprint of the substrate processing apparatus 1 can be suppressed.

The third transport mechanism 87 is arranged below the first transport mechanism 27 and the bypass transport mechanism 41 . The fourth transport mechanism 127 is arranged below the second transport mechanism 57 . The fifth transport mechanism 107 is arranged above the first transport mechanism 27 and the bypass transport mechanism 41 . The sixth transport mechanism 147 is arranged above the second transport mechanism 57 . For these reasons, an increase in the footprint of the substrate processing apparatus 1 can be suppressed.

Between the first transport mechanism 27, the second transport mechanism 57, the third transport mechanism 87, the fourth transport mechanism 127, the fifth transport mechanism 107, the sixth transport mechanism 147, and the detour transport mechanism 41, the relay transport mechanism 167 A substrate W is transported. Therefore, the transfer route of the substrate W can be flexibly selected. Here, when the first processing unit 31, the second processing unit 61, the third processing unit 91, the fourth processing unit 131, the fifth processing unit 111, and the sixth processing unit 151 are not distinguished, these are called processing units K. . For example, the processing unit K for transporting the substrate W is selected from the first processing unit 31, the second processing unit 61, the third processing unit 91, the fourth processing unit 131, the fifth processing unit 111, and the sixth processing unit 151. , can be chosen flexibly. For example, the number of processing units K that transport substrates W can be flexibly selected. For example, when the substrate W is transported to a plurality of processing units K, the order of the processing units K for transporting the substrate W can be flexibly selected. As a result, the processing to be performed on the substrate W can be flexibly selected.

The relay transport mechanism 167 is positioned between the first transport mechanism 27 and the second transport mechanism 57, between the detour transport mechanism 41 and the second transport mechanism 57, and between the third transport mechanism 87 and the fourth transport mechanism 127. and between the fifth transport mechanism 107 and the sixth transport mechanism 147 . For this reason, the relay transport mechanism 167 includes the first transport mechanism 27 , the second transport mechanism 57 , the third transport mechanism 87 , the fourth transport mechanism 127 , the fifth transport mechanism 107 , the sixth transport mechanism 147 , and the detour transport mechanism 41 . The substrate W can be suitably transported between them.

Transporting the substrate W between the main transport mechanism 17 and the relay transport mechanism 167 without passing through the first processing section 31 is called first direct transport. The bypass transport mechanism 41 performs the first direct transport, and the first transport mechanism 27 does not perform the first direct transport. Therefore, the burden of transporting the substrate W by the first transport mechanism 27 can be reduced. As a result, the number of wafers W that can be transported to the first processing section 31 by the first transport mechanism 27 per unit time can be increased. Therefore, the number of substrates W that can be processed per unit time by the first processing section 31 can be increased. Therefore, the throughput of the substrate processing apparatus 1 can be further improved.

Transporting the substrate W between the main transport mechanism 17 and the relay transport mechanism 167 without passing through the third processing section 91 is called third direct transport. The detour transport mechanism 41 performs the third direct transport, and the third transport mechanism 87 does not perform the third direct transport. Therefore, the burden of transporting the substrate W by the third transport mechanism 87 can be reduced. As a result, the number of wafers W that can be transported to the third processing section 91 by the third transport mechanism 87 per unit time can be increased. Therefore, the number of substrates W that can be processed per unit time by the third processing section 91 can be increased. Therefore, the throughput of the substrate processing apparatus 1 can be further improved.

Transporting the substrate W between the main transport mechanism 17 and the relay transport mechanism 167 without passing through the fifth processing section 111 is called fifth direct transport. Since the bypass transport mechanism 41 performs the fifth direct transport, the fifth transport mechanism 107 does not perform the fifth direct transport. Therefore, the burden of transporting the substrate W by the fifth transport mechanism 107 can be reduced. As a result, the number of wafers W that can be transported to the fifth processing section 111 by the fifth transport mechanism 107 per unit time can be increased. Therefore, the number of substrates W that can be processed per unit time by the fifth processing section 111 can be increased. Therefore, the throughput of the substrate processing apparatus 1 can be further improved.

The bypass transport mechanism 41 is arranged above the third transport mechanism 87 and below the fifth transport mechanism 107 . That is, the bypass transport mechanism 41 is not the transport mechanism arranged at the lowest height position among the first transport mechanism 27 , the third transport mechanism 87 , the fifth transport mechanism 107 and the bypass transport mechanism 41 . The bypass transport mechanism 41 is not the transport mechanism arranged at the highest height position among the first transport mechanism 27 , the third transport mechanism 87 , the fifth transport mechanism 107 and the bypass transport mechanism 41 . Therefore, the amount of movement of the main transport mechanism 17 when transporting the substrate W between the main transport mechanism 17 and the bypass transport mechanism 41 can be suppressed. Specifically, the amount of movement of the main transport mechanism 17 in the vertical direction Z can be suppressed. Similarly, the amount of movement of the relay transport mechanism 167 when transporting the substrate W between the relay transport mechanism 167 and the bypass transport mechanism 41 can be suppressed. Specifically, the amount of movement of the relay transport mechanism 167 in the vertical direction Z can be suppressed.

Before the wafer W is transported from a transport mechanism other than the main transport mechanism 17 to the main transport mechanism 17, the last process performed on the wafer W is called "final process". In the fourth operation example, the third transport mechanism 87 transfers the substrate W to the main transport mechanism 17 . Specifically, the third transport mechanism 87 transports the first substrate W<b> 1 from the third processing section 91 to the main transport mechanism 17 . Therefore , in the fourth operation example, the third processing section 91 performs the final processing on the first substrate W1. In the fourth operation example, the fifth transport mechanism 107 transfers the substrate W to the main transport mechanism 17 . Specifically, the fifth transport mechanism 107 transports the second substrate W<b>2 from the fifth processing section 111 to the main transport mechanism 17 . Therefore, in the fourth operation example, the fifth processing section 111 performs the final processing on the second substrate W2. Here, the third processing section 91 and the fifth processing section 111 are arranged at positions relatively close to the main transport mechanism 17 . Specifically, the third processing section 91 and the fifth processing section 111 are arranged closer to the main transport mechanism 17 than the second processing section 61 , the fourth processing section 131 and the sixth processing section 151 . In this manner, the third processing section 91 and the fifth processing section 111 that perform the final processing are arranged at positions close to the main transport mechanism 17 . Therefore, in the fourth operation example, the wafer W can be rapidly transported to the main transport mechanism 17 after the last process is performed on the wafer W. FIG.

In addition, in the fourth operation example, the first transport mechanism 27 , the second transport mechanism 57 , the fourth transport mechanism 127 , the sixth transport mechanism 147 and the bypass transport mechanism 41 do not pass the substrate W to the main transport mechanism 17 . Therefore, the first processing section 31, the second processing section 61, the fourth processing section 131 and the sixth processing section 151 do not perform the final processing.

After the substrate W is transported from the main transport mechanism 17 to a transport mechanism other than the main transport mechanism 17, the first process performed on the substrate is called "first process". In the fifth operation example, the main transport mechanism 17 transfers the substrate W to the third transport mechanism 87 . The third transport mechanism 87 transports the first substrate W<b>1 from the main transport mechanism 17 to the third processing section 91 . Therefore, in the fifth operation example, the third processing section 91 performs the first processing on the first substrate W1. In the fifth operation example, the main transport mechanism 17 transfers the substrate W to the fifth transport mechanism 107 . The fifth transport mechanism 107 transports the second substrate W<b>2 from the main transport mechanism 17 to the fifth processing section 111 . Therefore, in the fifth operation example, the fifth processing section 111 performs the first processing on the second substrate W2. Here, the third processing section 91 and the fifth processing section 111 are arranged at positions relatively close to the main transport mechanism 17 . Specifically, the third processing section 91 and the fifth processing section 111 are arranged closer to the main transport mechanism 17 than the second processing section 61 , the fourth processing section 131 and the sixth processing section 151 . In this way, the third processing section 91 and the fifth processing section 111 that perform the initial processing are arranged at positions close to the main transport mechanism 17 . Therefore, in the fifth operation example, after being transported from the main transport mechanism 17 to a transport mechanism other than the main transport mechanism 17, the wafer W can be quickly processed for the first time.

In addition, in the fifth operation example, the main transport mechanism 17 does not transfer the substrate W to the first transport mechanism 27 , the second transport mechanism 57 , the fourth transport mechanism 127 , the sixth transport mechanism 147 and the bypass transport mechanism 41 . Therefore, the first processing section 31, the second processing section 61, the fourth processing section 131 and the sixth processing section 151 do not perform the first processing.

The structure of the substrate processing apparatus 1 will be described in more detail below.

<Overall Structure of Substrate Processing Apparatus 1>
FIG. 15 is a plan view of the substrate processing apparatus 1 of the second embodiment. 16 is a right side view showing the configuration of the right portion of the substrate processing apparatus 1. FIG. FIG. 17 is a left side view showing the configuration of the central portion of the substrate processing apparatus 1 in the width direction. FIG. 18 is a left side view showing the configuration of the left portion of the substrate processing apparatus 1. As shown in FIG.

The substrate processing apparatus 1 includes a relay block 161 in addition to the indexer section 11 , the first block 21 and the second block 51 . The indexer section 11 accommodates the main transport mechanism 17 . The first block 21 accommodates the first processing section 31 , the third processing section 91 and the fifth processing section 111 . The first block 21 accommodates the first transport mechanism 27 , the third transport mechanism 87 , the fifth transport mechanism 107 and the bypass transport mechanism 41 . The second block 51 accommodates the second processing section 61 , the fourth processing section 131 and the sixth processing section 151 . The second block 51 accommodates the second transport mechanism 57 , the fourth transport mechanism 127 and the sixth transport mechanism 147 . The relay block 161 accommodates the relay transport mechanism 167 .

The relay block 161 is arranged between the first block 21 and the second block 51 in plan view. The relay block 161 is arranged at substantially the same height position as the indexer section 11 , the first block 21 and the second block 51 . The indexer unit 11, the first block 21, the relay block 161, and the second block 51 are arranged side by side in the front-rear direction X. As shown in FIG. The indexer unit 11, the first block 21, the relay block 161, and the second block 51 are arranged in this order.

Relay block 161 is connected to first block 21 . Relay block 161 is connected to second block 51 . The relay block 161 is not connected to the indexer section 11 . The first block 21 is not connected with the second block 51 .

<Indexer unit 11>
19 is a front view of the indexer section 11. FIG. The indexer section 11 includes carrier placement sections 12a2 and 12b2 in addition to carrier placement sections 12a1 and 121b1. One carrier C is mounted on each of the carrier mounting portions 12a1, 12a2, 12b1, and 12b2.

The carrier mounting portions 12a1 and 12a2 are arranged so as to be aligned in the vertical direction Z. As shown in FIG. The carrier mounting portion 12a2 is arranged above the carrier mounting portion 12a1. The carrier mounting portions 12b1 and 12b2 are arranged so as to line up in the vertical direction Z. As shown in FIG. Carrier mounting portion 12b2 is arranged above carrier mounting portion 12b1.

The carrier mounting portion 12a2 is arranged at substantially the same height position as the carrier mounting portion 12b2. The carrier mounting portions 12a2 and 12b2 are arranged side by side in the width direction Y. As shown in FIG. The carrier mounting portion 12b2 is arranged to the left of the carrier mounting portion 12a2.

When the carrier mounting portions 12a1 and 12a2 are not distinguished from each other, they are referred to as "carrier mounting portions 12a". When the carrier mounting portions 12b1 and 12b2 are not distinguished from each other, they are described as "carrier mounting portion 12b".

See Figures 15-18. The transport mechanism 18a is arranged at substantially the same height position as the carrier mounting portion 12a. The transport mechanism 18a is arranged behind the carrier placement section 12a. The transport mechanism 18 a transports the substrate W between the carrier C placed on the carrier platform 12 a and the first transport mechanism 27 . The transport mechanism 18b is arranged at substantially the same height position as the carrier mounting portion 12b. The transport mechanism 18b is arranged behind the carrier placement section 12b. The transport mechanism 18 b transports the substrate W between the carrier C placed on the carrier platform 12 b and the first transport mechanism 27 .

<First block 21>
See FIGS. 15-18, 20. 20 is a front view of the first block 21. FIG. The frame 22 supports the first processing section 31 , the third processing section 91 and the fifth processing section 111 . The frame 22 supports the first transport mechanism 27 , the third transport mechanism 87 , the fifth transport mechanism 107 and the bypass transport mechanism 41 .

The substrate processing apparatus 1 includes a third transport space 83 and a fifth transport space 103 in addition to the first transport space 23 . A third transport space 83 and a fifth transport space 103 are formed in the first block 21 . The third transport space 83 is arranged below the first transport space 23 . The third transport space 83 is arranged at substantially the same position as the first transport space 23 in plan view. The fifth transport space 103 is arranged above the first transport space 23 . The fifth transport space 103 is arranged at substantially the same position as the first transport space 23 in plan view.

The first transport space 23 , the third transport space 83 and the fifth transport space 103 are arranged at substantially the same height position as the main transport space 13 . The first conveying space 23 , the third conveying space 83 and the fifth conveying space 103 each adjoin the main conveying space 13 .

Please refer to FIGS. The substrate processing apparatus 1 includes air supply units 84 and 104 in addition to the air supply unit 24 . The substrate processing apparatus 1 includes exhaust units 85 and 105 in addition to the exhaust unit 25 . The air supply unit 84 and the exhaust unit 85 form a downward gas flow in the third transfer space 83 . The air supply unit 104 and the exhaust unit 105 form a downward gas flow in the fifth transfer space 103 .

The air supply unit 24 is arranged above the first transport space 23 and below the fifth transport space 103 . The exhaust unit 25 is arranged below the first transfer space 23 and above the third transfer space 83 . The air supply unit 84 is arranged below the exhaust unit 25 and above the third transfer space 83 . The exhaust unit 85 is arranged below the third transfer space 83 . The air supply unit 104 is arranged above the fifth transport space 103 . The exhaust unit 105 is arranged below the fifth transfer space 103 and above the air supply unit 24 . Air supply units 84 , 104 have substantially the same shape and structure as air supply unit 24 . The exhaust units 85 , 105 have substantially the same shape and structure as the exhaust unit 25 .

A third transport mechanism 87 is provided in the third transport space 83 . A fifth transport mechanism 107 is provided in the fifth transport space 103 . The third transport mechanism 87 and the fifth transport mechanism 107 have substantially the same structure as the first transport mechanism 27 .

See FIG. The substrate processing apparatus 1 includes front mounting parts 73 and 75 in addition to the front mounting part 71 . A substrate W is placed on the front placement parts 73 and 75 . The front loading section 73 is arranged between the main transport mechanism 17 and the third transport mechanism 87 . The main transport mechanism 17 and the third transport mechanism 87 transport wafers W to each other via the front loading section 73 . The front loading section 75 is arranged between the main transport mechanism 17 and the fifth transport mechanism 107 . The main transport mechanism 17 and the fifth transport mechanism 107 transport the substrates W to each other via the pre-mounting section 75 .

The front mounting portions 73 and 75 are arranged between the indexer portion 11 and the first block 21 . The front mounting portions 73 and 75 are arranged over the indexer portion 11 and the first block 21 . The front loading section 73 is arranged across the main transport space 13 and the third transport space 83 . The front loading section 75 is arranged across the main transport space 13 and the fifth transport space 103 .

The front stackers 73 and 75 are arranged at substantially the same height position as the main transport mechanism 17 . The front stackers 73 and 75 are arranged behind the main transport mechanism 17 . The front mounting portions 73 and 75 are arranged behind and to the left of the transport mechanism 18a. The front mounting portions 73 and 75 are arranged behind and to the right of the transport mechanism 18b.

The front mounting section 73 is arranged at substantially the same height position as the third transport mechanism 87 . The front placement section 73 is arranged in front of the third transport mechanism 87 . The front loading section 75 is arranged at substantially the same height position as the fifth transport mechanism 107 . The front loading section 75 is arranged in front of the fifth transport mechanism 107 .

The front mounting portions 71, 73, and 75 are arranged so as to be aligned in the vertical direction Z. As shown in FIG. The front mounting portion 73 overlaps the front mounting portion 71 in plan view. The front mounting portion 75 overlaps the front mounting portion 71 in plan view.

The front mounting portions 73 and 75 have substantially the same structure as the front mounting portion 71 . That is, the front mounting portions 73 and 75 are provided with a plurality of (for example, four) plates 72 . A plurality of substrates W can be placed on the front mounting parts 73 and 75 .

See FIG. The third processing section 91 is arranged at substantially the same height position as the third transfer space 83 . The third processing section 91 is adjacent to the third transfer space 83 . The fifth processing section 111 is arranged at substantially the same height position as the fifth transport space 103 . The fifth processing section 111 is adjacent to the fifth transfer space 103 .

The third processing section 91 includes a third non-liquid processing section 92 . The fifth processing section 111 includes a fifth non-liquid processing section 112 . The third non-liquid processing section 92 and the fifth non-liquid processing section 112 perform non-liquid processing on the substrate W. FIG.

The third non-liquid processing section 92 is arranged on the first side (eg, right side) of the third transfer space 83 . The third non-liquid processing section 92 is arranged below the first non-liquid processing section 32 . The fifth non-liquid processing section 112 is arranged on the first side (eg, right side) of the fifth transport space 103 . The fifth non-liquid processing section 112 is arranged above the first non-liquid processing section 32 .

20 shows the length L32 of the first non-liquid processing portion 32 in the vertical direction Z. FIG. FIG. 20 shows the length L92 of the third non-liquid processing portion 92 in the vertical direction Z. As shown in FIG. 20 shows the length L112 of the fifth non-liquid processing portion 112 in the vertical direction Z. FIG. Length L32 is smaller than length L92. Length L32 is smaller than length L112.

Please refer to FIG. The third non-liquid processing section 92 includes a plurality (eg, 16) of third heat treatment units 93 and a plurality (eg, 4) of third inspection units 94 . The fifth non-liquid processing section 112 includes a plurality (eg, 16) of fifth heat treatment units 113 and a plurality (eg, 4) of fifth inspection units 114 . Each third heat-treating unit 93 and each fifth heat-treating unit 113 heat-processes one substrate W. As shown in FIG. Each third inspection unit 94 and each fifth inspection unit 114 inspects one substrate W. FIG. The third thermal processing unit 93, the third inspection unit 94, the fifth thermal processing unit 113, and the fifth inspection unit 114 do not supply the substrate W with the processing liquid. The treatments performed by the third heat treatment unit 93 and the fifth heat treatment unit 113 are non-liquid treatments. The inspections performed by the third inspection unit 94 and the fifth inspection unit 114 are non-liquid processes. The third heat treatment unit 93, the third inspection unit 94, the fifth heat treatment unit 113, and the fifth inspection unit 114 correspond to non-liquid treatment units. The sum of the number of third heat treatment units 93 and the number of third inspection units 94 corresponds to the number of non-liquid treatment units included in the third processing section 91 . The number of non-liquid processing units included in the first processing section 31 is smaller than the number of non-liquid processing units included in the third processing section 91 . The sum of the number of fifth heat treatment units 113 and the number of fifth inspection units 114 corresponds to the number of non-liquid treatment units included in the fifth processing section 111 . The number of non-liquid processing units included in the first processing section 31 is smaller than the number of non-liquid processing units included in the fifth processing section 111 .

The eight third heat treatment units 93 are heating units HP. The remaining eight third heat treatment units 93 are cooling units CP. The eight fifth heat treatment units 113 are heating units HP. The remaining eight fifth thermal processing units 113 are cooling units CP.

The plurality of third heat treatment units 93 and the plurality of third inspection units 94 are arranged in a matrix when viewed from the side. For example, the plurality of third heat treatment units 93 and the plurality of third inspection units 94 are arranged in four rows in the front-back direction X and five stages in the up-down direction Z. As shown in FIG. The plurality of fifth heat treatment units 113 and the plurality of fifth inspection units 114 are arranged in a matrix when viewed from the side. For example, the plurality of fifth heat treatment units 113 and the plurality of fifth inspection units 114 are arranged in four rows in the front-back direction X and five stages in the up-down direction Z.

The third heat treatment unit 93 and the fifth heat treatment unit 113 have substantially the same structure as the first heat treatment unit 33 .

The structure of the third inspection unit 94 will be described with reference to FIG. The third inspection unit 94 has a plate 94a. The plate 94a has a substantially disk shape. The third transport mechanism 97 places one substrate W on the plate 94a.

The third inspection unit 94 has an imaging section 94b. The imaging unit 94b is arranged, for example, above the plate 94a. The imaging unit 94b photographs the upper surface of the substrate W on the plate 94a.

The third inspection unit 94 may include a driving section (not shown). The driving section moves at least one of the plate 94a and the imaging section 94b to change the relative positions of the plate 94a and the imaging section 94b. By changing the relative positions of the plate 94a and the imaging section 94b by the driving section, the range of the upper surface of the substrate W photographed by the imaging section 94b can be changed.

The third inspection unit 94 inspects the upper surface of the substrate W based on the image captured by the imaging section 94b. The contents of inspection by the third inspection unit 94 are exemplified below.
・Measurement of the shape of the top surface of the substrate W ・Identification of the state of the top surface of the substrate W ・Detection of defects on the top surface of the substrate W Here, the top surface of the substrate W is the top surface of the substrate W itself, or the top surface of the substrate W is formed on the top surface of the substrate W. It is meant to include at least one of a coating film and a pattern formed on the upper surface of the substrate W. The above-mentioned "measurement of the shape of the upper surface of the substrate W" means, for example, measuring/inspecting the thickness of the coating film formed on the upper surface of the substrate W, or measuring /inspecting the edge cut width of the substrate W. include.

The fifth inspection unit 114 has substantially the same structure as the third inspection unit 94 .

See FIG. The third processing section 91 includes a third liquid processing section 95 . The fifth processing section 111 includes a fifth liquid processing section 115 . The third liquid processing section 95 and the fifth liquid processing section 115 perform liquid processing on the substrate W. FIG.

The third liquid processing section 95 is arranged on the second side (for example, the left side) of the third transfer space 83 . The third liquid processing section 95 is arranged below the first liquid processing section 35 . The fifth liquid processing section 115 is arranged on the second side (for example, the left side) of the fifth transfer space 103 . The fifth liquid processing section 115 is arranged above the first liquid processing section 35 .

The third liquid processing section 95 includes a plurality of (for example, six) third liquid processing units 96 . The fifth liquid processing section 115 includes a plurality of (for example, six) fifth liquid processing units 116 . Each third liquid processing unit 96 and each fifth liquid processing unit 116 performs liquid processing on one substrate W. FIG.

The third liquid processing unit 96 and the fifth liquid processing unit 116 are, for example, coating processing units. The liquid processing performed by the third liquid processing unit 96 and the fifth liquid processing unit 116 is, for example, coating processing of coating the substrate W with a coating film material. The coating material applied to the substrate W by the third liquid processing unit 96 and the fifth liquid processing unit 116 is appropriately selected according to the operation of the substrate processing apparatus 1 . Each third liquid processing unit 96 may use the same type of coating material. Each fifth liquid processing unit 116 may use the same type of coating material.

The plurality of third liquid processing units 96 are arranged in a matrix when viewed from the side. The plurality of fifth liquid processing units 116 are arranged in a matrix when viewed from the side. The third liquid processing unit 96 and the fifth liquid processing unit 116 have substantially the same structure as the first liquid processing unit 36 .

The third transport mechanism 87 transports the substrate W to the third thermal processing unit 93 , the third inspection unit 94 and the third liquid processing unit 96 . For example, the third transport mechanism 87 transports the substrate W to the third liquid processing unit 96, the heating unit HP, the cooling unit CP, and the third inspection unit 94 in this order. The third processing unit 91 performs coating processing, heating processing, cooling processing, and inspection on the substrate W in this order. Thereby, the third processing section 91 forms a coating film on the substrate W. As shown in FIG. The coating film formed on the substrate W by the third processing section 91 is appropriately called a third coating film.

The fifth transport mechanism 107 transports the substrate W to the fifth thermal processing unit 113 , the fifth inspection unit 114 and the fifth liquid processing unit 116 . For example, the fifth transport mechanism 107 transports the substrate W to the fifth liquid processing unit 116, the heating unit HP, the cooling unit CP, and the fifth inspection unit 94 in this order. The fifth processing unit 111 performs coating processing, heating processing, cooling processing, and inspection on the substrate W in this order. Thereby, the fifth processing section 111 forms a coating film on the substrate W. FIG. The coating film formed on the substrate W by the fifth processing section 111 is appropriately called a fifth coating film.

See FIGS. 16 , 17 and 20. FIG. The bypass transport mechanism 41 is arranged at a position overlapping the first processing section 31 and the first transport space 23 in a side view. The detour transport mechanism 41 is arranged at a position not overlapping the first non-liquid processing section 32 in a side view. The bypass transport mechanism 41 is arranged at a position overlapping the first liquid processing section 35 in a side view.

The bypass transport mechanism 41 is arranged above the third transport mechanism 87 . The bypass transport mechanism 41 is arranged above the third transport space 83 . The bypass transport mechanism 41 is arranged below the fifth transport mechanism 107 . The bypass transport mechanism 41 is arranged below the fifth transport space 103 .

The bypass transport mechanism 41 is arranged above the third processing section 91 in front view and side view. The detour transport mechanism 41 is arranged at a position not overlapping with the third processing section 91 in front view and side view. The bypass transport mechanism 41 is arranged below the fifth processing section 111 in front view and side view. The detour transport mechanism 41 is arranged at a position not overlapping the fifth processing section 111 in front view and side view.

<Second Block 51>
See Figures 15-18. The frame 52 supports the second processing section 61 , the fourth processing section 131 and the sixth processing section 151 . Frame 52 supports second transport mechanism 57 , fourth transport mechanism 127 and sixth transport mechanism 147 .

The substrate processing apparatus 1 includes a fourth transport space 123 and a sixth transport space 143 in addition to the second transport space 53 . A fourth transport space 123 and a sixth transport space 143 are formed in the second block 51 . The fourth transport space 123 is arranged below the second transport space 53 . The fourth transport space 123 is arranged at substantially the same position as the second transport space 53 in plan view. The sixth transport space 143 is arranged above the second transport space 53 . The sixth transport space 143 is arranged at substantially the same position as the second transport space 53 in plan view.

See FIG. The substrate processing apparatus 1 includes air supply units 124 and 144 in addition to the air supply unit 54 . The substrate processing apparatus 1 includes exhaust units 125 and 145 in addition to the exhaust unit 55 . The air supply unit 124 and the exhaust unit 125 form a downward gas flow in the fourth transfer space 123 . The air supply unit 144 and the exhaust unit 145 form a downward gas flow in the sixth transfer space 143 .

The air supply unit 54 is arranged above the second transport space 53 and below the sixth transport space 143 . The exhaust unit 55 is arranged below the second transfer space 53 and above the fourth transfer space 123 . The air supply unit 124 is arranged below the exhaust unit 55 and above the fourth transfer space 123 . The exhaust unit 125 is arranged below the fourth transfer space 123 . The air supply unit 144 is arranged above the sixth transport space 143 . The exhaust unit 145 is arranged below the sixth transfer space 143 and above the air supply unit 54 . Air supply units 54 , 124 , 144 have substantially the same shape and structure as air supply unit 24 . The exhaust units 55 , 125 , 145 have substantially the same shape and structure as the exhaust unit 25 .

A fourth transport mechanism 127 is provided in the fourth transport space 123 . A sixth transport mechanism 147 is provided in the sixth transport space 143 . The fourth transport mechanism 127 and the sixth transport mechanism 147 have substantially the same structure as the first transport mechanism 27 .

The fourth processing section 131 is arranged at substantially the same height position as the fourth transfer space 123 . The fourth processing section 131 is adjacent to the fourth transfer space 123 . The sixth processing section 151 is arranged at substantially the same height position as the sixth transport space 143 . The sixth processing section 151 is adjacent to the sixth transport space 143 .

Please refer to FIG. The fourth processing section 131 includes a fourth non-liquid processing section 132 . The sixth processing section 151 includes a sixth non-liquid processing section 152 . The fourth non-liquid processing section 132 and the sixth non-liquid processing section 152 perform non-liquid processing on the substrate W. FIG.

The fourth non-liquid processing section 132 is arranged on the first side (eg, right side) of the fourth transfer space 123 . The fourth non-liquid processing section 132 is arranged below the second non-liquid processing section 62 . The sixth non-liquid processing section 152 is arranged on the first side (eg, right side) of the sixth transport space 143 . The sixth non-liquid processing section 152 is arranged above the second non-liquid processing section 62 .

The second non-liquid processing section 62 includes a plurality of (for example, 16) second heat processing units 63 . The fourth non-liquid processing section 132 includes a plurality of (for example, 20) fourth heat processing units 133 . The sixth non-liquid processing section 152 includes a plurality of (for example, 20) sixth heat processing units 153 . Each second heat treatment unit 63, each fourth heat treatment unit 133, and each sixth heat treatment unit 153 perform heat treatment on one substrate W. FIG. The second heat treatment unit 63, the fourth heat treatment unit 133 and the sixth heat treatment unit 153 correspond to non-liquid treatment units. The number of non-liquid processing units included in the second processing section 61 is equal to the number of non-liquid processing units included in the first processing section 31 . The number of non-liquid processing units included in the fourth processing section 131 is greater than the number of non-liquid processing units included in the first processing section 31 . The number of non-liquid processing units included in the sixth processing section 151 is greater than the number of non-liquid processing units included in the first processing section 31 .

The eight second heat treatment units 63 are heating units HP. The remaining eight second heat treatment units 63 are cooling units CP. The four fourth heat treatment units 133 are hydrophobic treatment units AHP. The other eight fourth heat treatment units 133 are medium temperature heating units MHP. The remaining eight fourth heat treatment units 133 are high temperature heating units HHP. The four sixth heat treatment units 153 are hydrophobic treatment units AHP. The other eight sixth heat treatment units 153 are medium temperature heating units MHP. The remaining eight sixth heat treatment units 153 are high temperature heating units HHP.

The plurality of second heat treatment units 63, the plurality of fourth heat treatment units 133, and the plurality of sixth heat treatment units 153 are arranged in a matrix when viewed from the side. For example, the plurality of second heat treatment units 63 are arranged in four rows in the front-back direction X and four stages in the up-down direction Z. As shown in FIG. For example, the plurality of fourth heat treatment units 133 are arranged in four rows in the front-back direction X and five stages in the up-down direction Z. As shown in FIG. For example, the plurality of sixth heat treatment units 153 are arranged in four rows in the front-back direction X and five stages in the up-down direction Z. As shown in FIG.

The second heat treatment unit 63 , the fourth heat treatment unit 133 and the sixth heat treatment unit 153 have substantially the same structure as the first heat treatment unit 33 .

See FIG. The fourth processing section 131 includes a fourth liquid processing section 135 . The sixth processing section 151 includes a sixth liquid processing section 155 . The fourth liquid processing section 135 and the sixth liquid processing section 155 perform liquid processing on the substrate W. FIG.

The fourth liquid processing section 135 is arranged on the second side (for example, the left side) of the fourth transfer space 123 . The fourth liquid processing section 135 is arranged below the second liquid processing section 65 . The sixth liquid processing section 155 is arranged on the second side (for example, the left side) of the sixth transport space 143 . The sixth liquid processing section 155 is arranged above the second liquid processing section 65 .

The fourth liquid processing section 135 includes a plurality of (for example, six) fourth liquid processing units 136 . The sixth liquid processing section 155 includes a plurality of (for example, six) sixth liquid processing units 156 . Each fourth liquid processing unit 136 and each sixth liquid processing unit 156 performs liquid processing on one substrate W. FIG.

The fourth liquid processing unit 136 and the sixth liquid processing unit 156 are, for example, coating processing units. The liquid processing performed by the fourth liquid processing unit 136 and the sixth liquid processing unit 156 is, for example, coating processing of coating the substrate W with a coating film material. The coating material applied to the substrate W by the fourth liquid processing unit 136 and the sixth liquid processing unit 156 is appropriately selected according to the operation of the substrate processing apparatus 1 . Each fourth liquid processing unit 136 may use the same type of coating material. Each sixth liquid processing unit 156 may use the same type of coating material.

The plurality of fourth liquid processing units 136 are arranged in a matrix when viewed from the side. The multiple sixth liquid processing units 156 are arranged in a matrix when viewed from the side. The fourth liquid processing unit 136 and the sixth liquid processing unit 156 have substantially the same structure as the first liquid processing unit 36 .

The second transport mechanism 57 transports the substrate W to the second thermal processing unit 63 and the second liquid processing unit 65 . For example, the second transport mechanism 57 transports the substrate W to the cooling unit CP, the second liquid processing unit 65 and the heating unit HP in this order. The second processing unit 61 performs cooling processing, coating processing, and heating processing on the substrate W in this order. Thereby, the second processing section 61 forms a coating film on the substrate W. As shown in FIG. The coating film formed on the substrate W by the second processing section 61 is appropriately called a second coating film.

The fourth transport mechanism 127 transports the substrate W to the fourth thermal processing unit 133 and the fourth liquid processing unit 136 . For example, the fourth transport mechanism 127 transports the substrate W to the hydrophobizing unit AHP, the fourth liquid processing unit 136, the medium temperature heating unit MHP, and the high temperature heating unit HHP in this order. The fourth processing unit 131 subjects the substrate W to a hydrophobizing process, a coating process, a medium-temperature heat process, and a high-temperature heat process in this order. Thereby, the fourth processing section 131 forms a coating film on the substrate W. FIG. The coating film formed on the substrate W by the fourth processing section 131 is appropriately called a fourth coating film.

The sixth transport mechanism 147 transports the substrate W to the sixth thermal processing unit 153 and sixth liquid processing unit 156 . For example, the sixth transport mechanism 147 transports the substrate W to the hydrophobizing unit AHP, the sixth liquid processing unit 156, the medium temperature heating unit MHP, and the high temperature heating unit HHP in this order. The sixth processing unit 151 subjects the substrate W to the hydrophobizing process, the coating process, the medium-temperature heating process, and the high-temperature heating process in this order. Thereby, the sixth processing section 151 forms a coating film on the substrate W. FIG. The coating film formed on the substrate W by the sixth processing section 151 is appropriately called a sixth coating film.

At least two or more of the first to sixth coatings may be the same. The first to sixth coatings may be different from each other.

<Relay block 161>
Please refer to FIGS. 15-18 and 21. 21 is a rear view of the relay block 161. FIG. For reference, FIG. 21 shows the elements included in the first block 21 (for example, the first processing section 31, the third processing section 91, the fifth processing section 111, and the bypass transport mechanism 41).

The relay block 161 has a substantially box shape. The relay block 161 is substantially rectangular in plan view, side view, and front view.

Relay block 161 has frame 162 . The frame 162 is provided as a framework (skeleton) of the relay block 161 . Frame 162 defines the shape of relay block 161 . The frame 162 is made of metal, for example. Frame 162 supports relay transport mechanism 167 .

The substrate processing apparatus 1 has a relay transfer space 163 . A relay transport space 163 is formed in the relay block 161 . The intermediate transport space 163 is arranged at substantially the same height position as the first transport space 23 , the third transport space 83 and the fifth transport space 103 . The intermediate transport space 163 is arranged behind the first transport space 23 , the third transport space 83 and the fifth transport space 103 . The intermediate transport space 163 contacts the first transport space 23 , the third transport space 83 and the fifth transport space 103 . The intermediate transport space 163 is arranged at substantially the same height position as the second transport space 53 , the fourth transport space 123 and the sixth transport space 143 . The intermediate transport space 163 is arranged in front of the second transport space 53 , the fourth transport space 123 and the sixth transport space 143 . The intermediate transport space 163 contacts the second transport space 53 , the fourth transport space 123 and the sixth transport space 143 .

The relay transport mechanism 167 is provided in the relay transport space 163 . The relay transport mechanism 167 has two transport mechanisms 168a and 168b. Each transport mechanism 168a, 168b transports the substrate W. As shown in FIG. The transport mechanism 168a is arranged at substantially the same height position as the transport mechanism 168b. The transport mechanisms 168a and 168b are arranged side by side in the width direction Y. As shown in FIG. The transport mechanism 168b is arranged to the left of the transport mechanism 168a.

The transport mechanism 168a has substantially the same structure and shape as the transport mechanism 18a. The transport mechanism 168b has substantially the same structure and shape as the transport mechanism 18a, except that it is bilaterally symmetrical.

See FIG. The substrate processing apparatus 1 includes a first receiver 171 , a second receiver 172 , a third receiver 173 , a fourth receiver 174 , a fifth receiver 175 and a sixth receiver 176 . A substrate W is placed on the first to sixth placement parts 171 to 176 . The first receiver 171 is arranged between the relay transport mechanism 167 and the first transport mechanism 27 . The relay transport mechanism 167 and the first transport mechanism 27 can transport the substrate W to each other via the first receiver 171 . The second receiver 172 is arranged between the relay transport mechanism 167 and the second transport mechanism 57 . The relay transport mechanism 167 and the second transport mechanism 57 can transport substrates W to each other via the second receiver 172 . The third receiver 173 is arranged between the relay transport mechanism 167 and the third transport mechanism 87 . The relay transport mechanism 167 and the third transport mechanism 87 can transport substrates W to each other via the third receiver 173 . The fourth receiver 174 is arranged between the relay transport mechanism 167 and the fourth transport mechanism 127 . The relay transport mechanism 167 and the fourth transport mechanism 127 can transport substrates W to each other via the fourth receiver 174 . The fifth receiver 175 is arranged between the relay transport mechanism 167 and the fifth transport mechanism 107 . The relay transport mechanism 167 and the fifth transport mechanism 107 can transport the substrate W to each other via the fifth receiver 175 . The sixth receiver 176 is arranged between the relay transport mechanism 167 and the sixth transport mechanism 147 . The relay transport mechanism 167 and the sixth transport mechanism 147 can mutually transport the substrate W via the sixth receiver 176 .

The first mounting section 171 , the third mounting section 173 and the fifth mounting section 175 are arranged between the first block 21 and the relay block 161 . The first mounting portion 171 , the third mounting portion 173 and the fifth mounting portion 175 are arranged over the first block 21 and the relay block 161 . The first receiver 171 is arranged across the first transport space 23 and the intermediate transport space 163 . The third receiver 173 is arranged across the third transport space 83 and the intermediate transport space 163 . The fifth receiver 175 is arranged across the fifth transport space 103 and the relay transport space 163 .

The first mounting section 171 is arranged at substantially the same height position as the first transport mechanism 27 . The first placement section 171 is arranged behind the first transport mechanism 27 . The third placement section 173 is arranged at substantially the same height position as the third transport mechanism 87 . The third placement section 173 is arranged behind the third transport mechanism 87 . The fifth mounting section 175 is arranged at substantially the same height position as the fifth transport mechanism 107 . The fifth receiver 175 is arranged behind the fifth transport mechanism 107 .

The first receiver 171 , the third receiver 173 , and the fifth receiver 175 are arranged at substantially the same height as the relay transport mechanism 167 . The first receiver 171 , the third receiver 173 and the fifth receiver 175 are arranged in front of the relay transport mechanism 167 . The first receiver 171, the third receiver 173 and the fifth receiver 175 are arranged in front and left of the transport mechanism 168a. The first receiver 171, the third receiver 173, and the fifth receiver 175 are arranged in front and right of the transport mechanism 168b.

The first mounting portion 171, the third mounting portion 173, and the fifth mounting portion 175 are arranged so as to be aligned in the vertical direction Z. As shown in FIG. The third mounting portion 173 overlaps the first mounting portion 171 in plan view. The fifth mounting portion 175 overlaps the first mounting portion 171 in plan view.

The second mounting section 172 , the fourth mounting section 174 and the sixth mounting section 176 are arranged between the second block 51 and the relay block 161 . The second mounting portion 172 , the fourth mounting portion 174 and the sixth mounting portion 176 are arranged over the second block 51 and the relay block 161 . The second receiver 172 is arranged across the second transport space 53 and the intermediate transport space 163 . The fourth receiver 174 is arranged across the fourth transport space 123 and the intermediate transport space 163 . The sixth receiver 176 is arranged across the sixth transport space 143 and the relay transport space 163 .

The second receiver 172 , the fourth receiver 174 , and the sixth receiver 176 are arranged at substantially the same height as the relay transport mechanism 167 . The second receiver 172 , the fourth receiver 174 and the sixth receiver 176 are arranged behind the relay transport mechanism 167 . The second receiver 172, fourth receiver 174 and sixth receiver 176 are arranged behind and to the left of the transport mechanism 168a. The second receiver 172, fourth receiver 174 and sixth receiver 176 are arranged behind and to the right of the transport mechanism 168b.

The second mounting section 172 is arranged at substantially the same height position as the second transport mechanism 57 . The second placement section 172 is arranged in front of the second transport mechanism 57 . The fourth mounting section 174 is arranged at substantially the same height position as the fourth transport mechanism 127 . The fourth loading section 174 is arranged in front of the fourth transport mechanism 127 . The sixth mounting section 176 is arranged at substantially the same height position as the sixth transport mechanism 147 . The sixth loading section 176 is arranged in front of the sixth transport mechanism 147 .

The second mounting portion 172, the fourth mounting portion 174, and the sixth mounting portion 176 are arranged so as to be aligned in the vertical direction Z. As shown in FIG. The fourth mounting portion 174 overlaps the second mounting portion 172 in plan view. The sixth mounting portion 176 overlaps the fourth mounting portion 174 in plan view.

The first to sixth receivers 171 to 176 have substantially the same structure as the front receiver 71 . That is, the first to sixth receivers 171 to 176 are provided with a plurality of (for example, four) plates 72 . A plurality of substrates W can be placed on the first to sixth receivers 171 to 176 .

The first transport mechanism 27 can place the substrate W on the first platform 171 . The first transport mechanism 27 can pick up the substrate W on the first receiver 171 . The third transport mechanism 87 can place the substrate W on the third platform 173 . The third transport mechanism 87 can pick up the substrate W on the third receiver 173 . The fifth transport mechanism 107 can place the substrate W on the fifth platform 175 . The fifth transport mechanism 107 can pick up the substrate W on the fifth receiver 175 .

The relay transport mechanism 167 can place the substrate W on the first to sixth placement parts 171-176. The transport mechanisms 168a and 168b can place the substrates W on the first to sixth receivers 171 to 176, respectively. The relay transport mechanism 167 can pick up the substrates W on the first to sixth receivers 171-176. The transport mechanisms 168a and 168b can take the substrates W on the first to sixth receivers 171-176, respectively.

The second transport mechanism 57 can place the substrate W on the second platform 172 . The second transport mechanism 57 can pick up the substrate W on the second receiver 172 . The fourth transport mechanism 127 can place the substrate W on the fourth platform 174 . The fourth transport mechanism 127 can pick up the substrate W on the fourth receiver 174 . The sixth transport mechanism 147 can place the substrate W on the sixth platform 176 . The sixth transport mechanism 147 can pick up the substrate W on the sixth receiver 176 .

FIG. 15 shows a virtual line segment E connecting the first placement portion 171 and the second placement portion 172 in a plan view. The line segment E is substantially parallel to the front-rear direction X in plan view. FIG. 15 shows the perpendicular bisector F of line segment E. FIG. The perpendicular bisector F is a virtual line. The relay transport mechanism 167 is arranged at a position that intersects the perpendicular bisector F in plan view. The transport mechanisms 168a and 168b are arranged at positions intersecting the perpendicular bisector F in plan view. The transport mechanism 168a is arranged on the first side (specifically, the right side) of the line segment E in plan view. The transport mechanism 168b is arranged on the second side (more specifically, left) of the line segment E in plan view.

One of the transport mechanisms 168a and 168b is an example of a first relay transport mechanism in the present invention. The other of the transport mechanisms 168a and 168b is an example of a second relay transport mechanism in the present invention.

FIG. 22 is a plan view of the substrate processing apparatus 1. FIG. FIG. 22 omits illustration of the first non-liquid processing unit 32 . The detour transport mechanism 41 and the relay transport mechanism 167 directly transfer the substrate W. Specifically, when the substrate W is transported between the detour transport mechanism 41 and the relay transport mechanism 167, the detour transport mechanism 41 and the relay transport mechanism 167 contact the same substrate W at the same time.

The holding portions 19d and 19e of the transport mechanism 168b have a substantially U-shape or a substantially Y-shape in plan view. The holding portions 19d and 19e of the transport mechanism 168b come into contact with the portion P3 of the substrate W. As shown in FIG. The holding portions 44c and 44e of the bypass transport mechanism 41 have a substantially I shape in plan view. The holding portions 44c and 44e of the bypass transport mechanism 41 come into contact with the portion Q of the substrate W. As shown in FIG. The portion P3 of the substrate W is different from the portion Q of the substrate W. FIG. The portion P3 of the substrate W is, for example, a portion of the rear surface of the substrate W other than the central portion. The portion P3 of the substrate W is, for example, the periphery of the back surface of the substrate W. As shown in FIG. The portion Q of the substrate W is the central portion of the back surface of the substrate W, for example. Therefore, when the transport mechanism 168b and the bypass transport mechanism 41 contact the same substrate W at the same time, the transport mechanism 168b and the bypass transport mechanism 41 do not interfere with each other.

The portion of the substrate W that contacts the holding portions 19d and 19e of the transport mechanism 168a is substantially the same as the portion P3 of the substrate W. As shown in FIG. Therefore, the portion of the substrate W that contacts the holding portions 19d and 19e of the transport mechanism 168a is different from the portion Q of the substrate W. FIG. Therefore, when the transport mechanism 168a and the bypass transport mechanism 41 contact the same substrate W at the same time, the transport mechanism 168a and the bypass transport mechanism 41 do not interfere with each other.

The operation of the relay transport mechanism 167 transferring the substrate W to the bypass transport mechanism 41 is substantially the same as the operation example of the main transport mechanism 17 transferring the substrate W to the bypass transport mechanism 41 . The operation of the detour transport mechanism 41 to transfer the substrate W to the relay transport mechanism 167 is substantially the same as the operation example of the detour transport mechanism 41 to transfer the substrate W to the main transport mechanism 17 . However, when the relay transport mechanism 167 passes the substrate W to the bypass transport mechanism 41 and when the bypass transport mechanism 41 passes the substrate W to the relay transport mechanism 167, the horizontal moving part 44a moves to the rear end of the bypass support part 42. To position. Furthermore, the holding portions 44c and 44e are positioned behind the horizontal moving portion 44a by the rotation of the arm portions 44b and 44d.

A position at which the substrate W is transferred between the relay transport mechanism 167 and the detour transport mechanism 41 is called a fifth transfer position. A position at which the substrate W is transferred between the relay transport mechanism 167 and the first transport mechanism 27 is called a sixth transfer position. The fifth delivery position is substantially the same as the sixth delivery position in plan view. Here, the sixth transfer position is substantially the same as the position of the first placement section 171 . Therefore, the fifth delivery position is substantially the same as the position of the first placement section 171 in plan view.

The fifth delivery position is a position below the sixth delivery position. The fifth delivery position is a position below the first placement section 171 .

<Control part>
The control unit 79 controls the indexer unit 11 , the first block 21 , the second block 51 and the relay block 161 . More specifically, control unit 79 controls first processing unit 31 , second processing unit 61 , third processing unit 91 , fourth processing unit 131 , fifth processing unit 111 and sixth processing unit 151 . The control unit 79 controls the main transport mechanism 17 , the first transport mechanism 27 , the second transport mechanism 57 , the third transport mechanism 87 , the fourth transport mechanism 127 , the fifth transport mechanism 107 , the sixth transport mechanism 147 , the detour transport mechanism 41 . and control the relay transport mechanism 167 .

<Operation Example of Substrate Processing Apparatus 1>
FIG. 23(a) is a diagram schematically showing the transport path of the substrate W in the fourth operation example shown in FIG. 14(a). FIG. 23(b) is a diagram schematically showing the transport path of the substrate W in the fifth operation example shown in FIG. 14(b). 23(a) and 23(b), the carrier mounting portions 12a and 12b are shown at positions different from those in FIG.

The fourth operation example will be explained again with reference to FIG. The transport mechanism 18 a transports the first substrate W<b>1 and the second substrate W<b>2 from the carrier C on the carrier platform 12 a to the bypass transport mechanism 41 . The bypass transport mechanism 41 transports the first substrate W<b>1 and the second substrate W<b>2 from the transport mechanism 18 a to the relay transport mechanism 167 . The relay transport mechanism 167 transports the first substrate W<b>1 from the bypass transport mechanism 41 to the fourth receiver 174 , and transports the second substrate W<b>2 from the bypass transport mechanism 41 to the sixth receiver 176 . The fourth transport mechanism 127 transports the first substrate W1 from the fourth receiver 174 to the fourth processing unit 131, and transports the first wafer W1 from the fourth processing unit 131 to the fourth receiver 174. . The sixth transport mechanism 147 transports the second substrate W2 from the sixth receiver 176 to the sixth processing unit 151, and transports the second wafer W2 from the sixth processing unit 151 to the sixth receiver 176. . The relay transport mechanism 167 transports the first substrate W1 from the fourth platform 174 to the first platform 171, and transports the second substrate W2 from the sixth platform 176 to the second platform 172. do. The first transport mechanism 27 transports the first wafer W1 from the first receiver 171 to the first processing part 31 and transports the first wafer W1 from the first processor 31 to the first receiver 171. . The second transport mechanism 57 transports the second wafer W<b>2 from the second receiver 172 to the second processing part 61 and transports the wafer W from the second processor 61 to the second receiver 172 . The relay transport mechanism 167 transports the first substrate W1 from the first platform 171 to the third platform 173 and the second substrate W2 from the second platform 172 to the fifth platform 175. do. The third transport mechanism 87 transports the first wafer W<b>1 from the third receiver 173 to the third processing part 91 and transports the first wafer W<b>1 from the third processor 91 to the front receiver 73 . The fifth transport mechanism 107 transports the second substrate W2 from the fifth receiver 175 to the fifth processing section 111 and transports the second wafer W2 from the fifth processing section 111 to the front receiver 75 . The transport mechanism 18b transports the first substrate W1 from the front mounting portion 73 to the carrier C on the carrier mounting portion 12b, and transfers the second substrate W1 from the front mounting portion 75 to the carrier C on the carrier mounting portion 12b. Transport W2.

In the fourth operation example, the substrate processing apparatus 1 forms three layers of coating films on the first substrate W1. Specifically, the substrate processing apparatus 1 forms a fourth coating film on the top surface of the first substrate W1, forms a first coating film on the top surface of the fourth coating film, and forms a third coating film on the top surface of the first coating film. Forms a coating. In the fourth operation example, the substrate processing apparatus 1 forms three layers of coating films on the second substrate W2. Specifically, the substrate processing apparatus 1 forms a sixth coating film on the upper surface of the second substrate W2, forms a second coating film on the upper surface of the sixth coating film, and forms a fifth coating film on the upper surface of the second coating film. Forms a coating.

For example, the fourth coating film and the sixth coating film are the lower layer films, the first coating film and the second coating film are the intermediate films, and the third coating film and the fifth coating film are the upper layer films. good too. For example, the fourth coating film and the sixth coating film are antireflection films, the first coating film and the second coating film are resist films, and the third coating film and the fifth coating film are protective films. may

The fifth operation example will be described again with reference to FIG. The transport mechanism 18a transports the first substrate W1 from the carrier C on the carrier platform 12a to the front platform 73, and transfers the second substrate W1 from the carrier C on the carrier platform 12a to the front platform 75. Transport W2. The third transport mechanism 87 transports the first wafer W<b>1 from the pre-mounting section 73 to the third processing section 91 and transports the first wafer W<b>1 from the third processing section 91 to the third mounting section 173 . The fifth transport mechanism 107 transports the second wafer W2 from the pre-mounting section 75 to the fifth processing section 111 and transports the second wafer W2 from the fifth processing section 111 to the fifth mounting section 175 . The relay transport mechanism 167 transports the first substrate W1 from the third platform 173 to the first platform 171, and transports the second substrate W2 from the fifth platform 175 to the second platform 172. do. The first transport mechanism 27 transports the first wafer W1 from the first receiver 171 to the first processing part 31 and transports the first wafer W1 from the first processor 31 to the first receiver 171. . The second transport mechanism 57 transports the second wafer W<b>2 from the second receiver 172 to the second processing part 61 and transports the wafer W from the second processor 61 to the second receiver 172 . The relay transport mechanism 167 transports the first substrate W1 from the first platform 171 to the fourth platform 174, and transports the second substrate W2 from the second platform 172 to the sixth platform 176. do. The fourth transport mechanism 127 transports the first substrate W1 from the fourth receiver 174 to the fourth processing unit 131, and transports the first wafer W1 from the fourth processing unit 131 to the fourth receiver 174. . The sixth transport mechanism 147 transports the second substrate W2 from the sixth receiver 176 to the sixth processing unit 151, and transports the second wafer W2 from the sixth processing unit 151 to the sixth receiver 176. . The relay transport mechanism 167 transports the first substrate W<b>1 from the fourth receiver 174 to the bypass transport mechanism 41 and transports the second wafer W<b>2 from the sixth receiver 176 to the bypass transport mechanism 41 . The bypass transport mechanism 41 transports the first substrate W1 and the second substrate W2 from the relay transport mechanism 167 to the transport mechanism 18b. The transport mechanism 18b transports the first substrate W1 and the second substrate W2 from the bypass transport mechanism 41 to the carrier C on the carrier platform 12b.

In the fifth operation example, the substrate processing apparatus 1 forms three layers of coating films on the first substrate W1. Specifically, the substrate processing apparatus 1 forms a third coating film on the top surface of the first substrate W1, forms a first coating film on the top surface of the third coating film, and forms a fourth coating film on the top surface of the first coating film. Forms a coating. In the fifth operation example, the substrate processing apparatus 1 forms three layers of coating films on the second substrate W2. Specifically, the substrate processing apparatus 1 forms a fifth coating film on the upper surface of the second substrate W2, forms a second coating film on the upper surface of the fifth coating film, and forms a sixth coating film on the upper surface of the second coating film. Forms a coating.

For example, the third coating film and the fifth coating film are the lower layer films, the first coating film and the second coating film are the intermediate films, and the fourth coating film and the sixth coating film are the upper layer films. good too. For example, the third coating film and the fifth coating film are antireflection films, the first coating film and the second coating film are resist films, and the fourth coating film and the sixth coating film are protective films. may

<Other effects of the second embodiment>
The main effects of the second embodiment are as described above. Other effects of the second embodiment will be described below.

The bypass transport mechanism 41 is arranged at a position overlapping the first processing section 31 and the first transport space 23 in a side view. The detour transport mechanism 41 is arranged at a position not overlapping the third processing section 91 in a side view. Here, the length L32 of the first non-liquid processing portion 32 in the vertical direction Z is smaller than the length L92 of the third non-liquid processing portion 92 in the vertical direction Z. Therefore, it is possible to relatively easily secure an installation space for the detour transport mechanism 41 .

The number of non-liquid processing units included in the first processing section 31 is smaller than the number of non-liquid processing units included in the third processing section 91 . Therefore, the installation space of the first non-liquid processing section 32 is smaller than the installation space of the third non-liquid processing section 92 . Therefore, an installation space for the detour transport mechanism 41 can be easily secured.

The bypass transport mechanism 41 is arranged at a position overlapping the first processing section 31 and the first transport space 23 in a side view. The detour transport mechanism 41 is arranged at a position not overlapping the fifth processing section 111 in a side view. Here, the length L32 of the first non-liquid processing portion 32 in the vertical direction Z is smaller than the length L112 of the fifth non-liquid processing portion 112 in the vertical direction Z. Therefore, it is possible to relatively easily secure an installation space for the detour transport mechanism 41 .

The number of non-liquid processing units included in the first processing section 31 is smaller than the number of non-liquid processing units included in the fifth processing section 111 . Therefore, the installation space of the first non-liquid processing section 32 is smaller than the installation space of the fifth non-liquid processing section 112 . Therefore, an installation space for the detour transport mechanism 41 can be easily secured.

The relay transport mechanism 167 is arranged at a position that intersects the perpendicular bisector F in plan view. Therefore, in plan view, the distance from the relay transport mechanism 167 to the first receiver 171 is substantially equal to the distance from the relay transport mechanism 167 to the second receiver 172 . Therefore, the relay transport mechanism 167 can easily access the first receiver 171 and the second receiver 172 .

The third mounting portion 173 and the fifth mounting portion 175 are arranged at positions overlapping the first mounting portion 171 in plan view. Therefore, the relay transport mechanism 167 can easily access the third receiver 173 and the fifth receiver 175 .

The fourth mounting portion 174 and the sixth mounting portion 176 are arranged at positions overlapping the second mounting portion 172 in plan view. Therefore, the relay transport mechanism 167 can easily access the fourth receiver 174 and the sixth receiver 176 .

The relay transport mechanism 167 includes transport mechanisms 168a and 168b. Therefore, the number of substrates W that can be transported per unit time by the relay transport mechanism 167 can be easily increased. Therefore, the throughput of the substrate processing apparatus 1 can be further improved.

The transport mechanism 168a is arranged on the first side (specifically, the right side) of the line segment E in plan view. The transport mechanism 168b is arranged on the second side (more specifically, left) of the line segment E in plan view. Therefore, it is possible to preferably prevent the transport mechanisms 168a and 168b from interfering with each other.

The relay transport mechanism 167 and the detour transport mechanism 41 directly transfer the substrate. More specifically, when the substrate W is transported between the relay transport mechanism 167 and the bypass transport mechanism 41, the relay transport mechanism 167 and the bypass transport mechanism 41 contact the same substrate W at the same time. Therefore, the substrate W can be efficiently transported between the relay transport mechanism 167 and the detour transport mechanism 41 .

The portion P3 of the substrate W that contacts the relay transport mechanism 167 is different from the portion Q of the substrate W that contacts the bypass transport mechanism 41 . Therefore, when the relay transport mechanism 167 and the bypass transport mechanism 41 contact the same substrate W at the same time, interference between the relay transport mechanism 167 and the bypass transport mechanism 41 can be preferably prevented.

Each of the holding portions 19d and 19e of the relay transport mechanism 167 has a substantially U-shape or a substantially Y-shape in plan view. Each of the holding portions 44c and 44e of the bypass transport mechanism 41 has a substantially I shape in plan view. Therefore, when the relay transport mechanism 167 and the bypass transport mechanism 41 contact the same substrate W at the same time, interference between the relay transport mechanism 167 and the bypass transport mechanism 41 can be preferably prevented.

The fifth delivery position is substantially the same as the sixth delivery position in plan view. Therefore, the amount of movement of the relay transport mechanism 167 to the fifth transfer position can be suppressed. Specifically, the horizontal amount of the relay transport mechanism 167 when the relay transport mechanism 167 moves to the fifth transfer position is the horizontal distance of the relay transport mechanism 167 when the relay transport mechanism 167 moves to the sixth transfer position. It can be suppressed to the same extent as the amount of movement in the direction. Therefore, the relay transport mechanism 167 and the detour transport mechanism 41 can easily transport the substrates W to each other.

The fifth transfer position is substantially the same as the position of the first placement portion 171 in plan view. Therefore, the amount of movement of the relay transport mechanism 167 to the fifth transfer position can be suppressed. Therefore, the relay transport mechanism 167 and the detour transport mechanism 41 can easily transport the substrates W to each other.

The present invention is not limited to the above-described first and second embodiments, and can be modified as follows.

In the first and second embodiments, the holding portion 44c of the bypass transport mechanism 41 is supported by the horizontal moving portion 44a via the arm portion 44b. However, it is not limited to this. For example, the holding portion 44c may be fixed to the horizontal moving portion 44a. For example, the holding portion 44c may be immovable with respect to the horizontal moving portion 44a. For example, arm portion 44b may be fixed to horizontal moving portion 44a. For example, the arm portion 44b may be omitted and the holding portion 44c may be connected to the horizontal movement portion 44a. Similarly, the support structure of the holding portion 44e of the bypass transport mechanism 41 may be changed. According to this modified embodiment, the structure of the bypass transport mechanism 41 is even simpler. Therefore, the detour transport mechanism 41 can be further miniaturized.

In the first and second embodiments, the bypass transport mechanism 41 is arranged at a position overlapping both the first processing section 31 and the first transport space 23 in a side view. However, it is not limited to this. For example, the detour transport mechanism 41 may be arranged at a position overlapping at least one of the first processing section 31 and the first transport space 23 in a side view. For example, the detour transport mechanism 41 may be arranged at a position that does not overlap with either the first processing section 31 or the first transport space 23 in a side view. Also according to this modified embodiment, the installation space for the detour transport mechanism 41 can be easily secured.

In the first and second embodiments, the bypass transport mechanism 41 is arranged at a position overlapping the first non-liquid processing section 32 in plan view. However, it is not limited to this. For example, the bypass transport mechanism 41 may be arranged at a position not overlapping the first non-liquid processing section 32 in plan view. For example, all of the bypass transport mechanism 41 may be arranged in the first transport space 23 . Also according to this modified embodiment, the installation space for the detour transport mechanism 41 can be easily secured.

In the first and second embodiments, the holding portion 44c of the bypass transport mechanism 41 has a substantially I shape in plan view. However, it is not limited to this. For example, the holding portion 44c may have a substantially horizontal flat plate shape. For example, the holding portion 44c may be circular or rectangular in plan view. The holding portion 44c may have substantially the same shape as the plate 72 of the front mounting portion 71, for example. Similarly, the structure of the holding portion 44e of the bypass transport mechanism 41 may be changed. For example, the entire holding portions 44 c and 44 e may have substantially the same structure as the front mounting portion 71 .

In the first and second embodiments, the bypass transport mechanism 41 is arranged across the space 40 and the first transport space 23 . However, it is not limited to this. For example, the bypass transport mechanism 41 may be arranged in one of the space 40 and the first transport space 23 . That is, the bypass transport mechanism 41 does not have to be arranged in the other of the space 40 and the first transport space 23 .

In the first and second embodiments, the bypass transport mechanism 41 is arranged in the space 40 below the first non-liquid processing section 32 . However, it is not limited to this. When the substrate processing apparatus 1 has a space above the first non-liquid processing section 32 , at least part of the bypass transport mechanism 41 may be arranged in the space above the first non-liquid processing section 32 .

In the first and second embodiments, at least part of the bypass transport mechanism 41 is arranged on the bottom portion 23 d of the first transport space 23 . However, it is not limited to this. At least part of the bypass transport mechanism 41 may be arranged above the first transport space 23 .

In the second embodiment, the length of the first transport space 23 in the vertical direction Z may be substantially the same as the length of the third transport space 83 in the vertical direction Z. The length of the first transport space 23 in the vertical direction Z may be slightly longer than the length of the third transport space 83 in the vertical direction Z. The length of the first transport space 23 in the vertical direction Z may be substantially the same as the length of the fifth transport space 103 in the vertical direction Z. The length of the first transport space 23 in the vertical direction Z may be slightly longer than the length of the fifth transport space 103 in the vertical direction Z.

In the first and second embodiments, the exhaust unit 25 is arranged below the first transfer space 23 . However, it is not limited to this. The exhaust unit 25 may extend below the space 40 . For example, the exhaust unit 25 may be arranged below the space 40 in addition to below the first transfer space 23 . The exhaust unit 25 may overlap at least part of the space 40 in plan view. According to this, the space 40 can be easily kept clean. Therefore, the environment around the bypass transport mechanism 41 can be easily kept clean.

In the first and second embodiments, the relay transport mechanism 167 includes transport mechanisms 168a and 168b. However, it is not limited to this. Either of the transport mechanisms 168a and 168b may be omitted.

In the first embodiment, the substrate processing apparatus 1 does not have the relay transport mechanism 167 . However, it is not limited to this. The substrate processing apparatus 1 of the first embodiment may have the relay transport mechanism 167 . The relay transport mechanism 167 may transport the substrate W between the first transport mechanism 27 , the detour transport mechanism 41 and the second transport mechanism 57 . 15 and 22 may be regarded as plan views of the substrate processing apparatus 1 of this modified embodiment.

In the first embodiment, the main transport mechanism 17 accesses the carriers C on the carrier platforms 12a1 and 12b1. However, it is not limited to this. The main transport mechanism 17 does not have to access the carriers C on the carrier placement sections 12a1 and 12b1. For example, the substrate processing apparatus 1 may include other transport mechanisms that access the carriers C on the carrier platforms 12a1 and 12b1. Similarly, the main transport mechanism 17 in the second embodiment may be modified.

In the first and second embodiments, the main transport mechanism 17 includes transport mechanisms 18a and 18b. However, it is not limited to this. Either of the transport mechanisms 18a and 18b may be omitted.

In the first and second embodiments, the first to fifth operation examples are illustrated. However, it is not limited to this. For example, the substrate processing apparatus 1 may perform operations different from those in the first to fifth operation examples. For example, the number of processing units K that transport substrates W may be changed. For example, the number of processing units K that transport the first substrate W1 may be different from the number of processing units K that transport the second substrate W2. The order of the processing units K that transport the substrates W may be changed. Sixth to ninth operation examples of the modified embodiment will be described below.

In the sixth operation example, the substrate W is transported to one processing section K. FIG. For example, the first substrate W1 is transferred to the first processing unit 31, the second substrate W2 is transferred to the second processing unit 61, the third substrate W3 is transferred to the third processing unit 91, and the fourth substrate W4 is transferred to the third processing unit 91. 4 processing unit 131 , the fifth substrate W 5 is transported to the fifth processing unit 111 , and the sixth substrate W 6 is transported to the sixth processing unit 151 .

In the seventh operation example, the substrate W is transported to two processing units K. As shown in FIG. For example, the first wafer W1 is transferred to the first processing section 31 and the second processing section 61, the second wafer W2 is transferred to the third processing section 91 and the fourth processing section 131, and the third wafer W3 is transferred to the fifth processing section. It is transported to the section 111 and the sixth processing section 151 .

In the eighth operation example, the substrate W is transported to six processing units K. As shown in FIG. Specifically, the substrate W is transferred to the first processing section 31 , the second processing section 61 , the third processing section 91 , the fourth processing section 131 , the fifth processing section 111 and the sixth processing section 151 .

In the ninth operation example, the first substrate W1 is transported to four processing units K, and the second substrate W2 is transported to two processing units K. FIG. For example, the first substrate W1 is transferred to the first processing section 31, the second processing section 61, the third processing section 91 and the fourth processing section 131, and the second substrate W2 is transferred to the fifth processing section 111 and the sixth processing section 151. transport to

Also in the sixth to ninth operation examples described above, it is preferable that the bypass transport mechanism 41 performs the first direct transport, the third direct transport and the fifth direct transport. Furthermore, it is preferable that the first transport mechanism 27 does not perform the first direct transport, the third transport mechanism 87 does not perform the third direct transport, and the fifth transport mechanism 107 does not perform the fifth direct transport.

In the first and second embodiments, coating processing was exemplified as liquid processing, but it is not limited to this. The liquid treatment may be, for example, a development treatment for developing the substrate W or a cleaning treatment for washing the substrate W. FIG. In the development process, the substrate W is supplied with a developer as a processing liquid. In the cleaning process, a cleaning liquid is supplied to the substrate W as a processing liquid.

The first and second embodiments and each of the modified embodiments may be appropriately modified by replacing or combining each configuration with the configuration of another modified embodiment.

Reference Signs List 1 Substrate processing apparatus 11 Indexer 17 Main transfer mechanism 21 First block 23 First transfer space 23a First side 23b Second side 23c Lower end of first transfer space 23d Bottom 24 Air supply unit 25 Exhaust unit 27 First transport mechanism 28 First support part 29 First movable part 31 First processing part 32 First non-liquid processing part
32a ...lower end of first non-liquid processing section 33...first heat treatment unit 35...first liquid processing section 35a...lower end of first liquid processing section 36...first liquid processing unit 39...substrate transfer port 40...space 41...bypass Conveying mechanism 42... detour support part 43... detour movable part 43a... first detour movable part 43b... second detour movable part 44a... horizontal movement part (first horizontal movement part, second horizontal movement part)
44b, 44d... arm portions (first arm portion, second arm portion)
44c, 44e... holding portion (first holding portion, second holding portion)
51 ... second block 57 ... second transport mechanism 61 ... second processing section 62 ... second non-liquid processing section 63 ... second heat treatment unit 65 ... second liquid processing section 66 ... second liquid processing unit 71, 73, 75 ... front placement section 77 ... rear placement section 79 ... control section 87 ... third transfer mechanism 91 ... third processing section 107 ... fifth transfer mechanism 111 ... fifth processing section 127 ... fourth transfer mechanism 131 ... fourth processing Part 147... Sixth transport mechanism 151... Sixth processing part 161... Relay block 167... Relay transport mechanism 168a, 168b... Transport mechanism (first relay transport mechanism, second relay transport mechanism)
Reference numerals 171: first receiver 172: second receiver E: line segment connecting the first receiver and second receiver in plan view F: perpendicular bisector of line segment E L23: vertical direction Length of the first transport space L32 ... Length of the first non-liquid processing section in the vertical direction L35 ... Length of the first liquid processing section in the vertical direction L62 ... Length of the second non-liquid processing section in the vertical direction L92 ... Length of the third non-liquid processing portion in the vertical direction L112 ... Length of the fifth non-liquid processing portion in the vertical direction P1 ... Portion of the substrate in contact with the main transport mechanism P2 ... Portion of the substrate in contact with the second transport mechanism P3 ... Portion of substrate in contact with relay transport mechanism Q ... Portion of substrate in contact with detour transport mechanism W ... Substrate X ... Back-and-forth direction (first direction)
Y … Width direction (second direction)
Z … vertical direction Z (third direction)

Claims (20)

A substrate processing apparatus,
a main transport mechanism for transporting the substrate;
a first processing unit that processes the substrate;
a first transport mechanism for transporting the substrate to the first processing unit;
a first transport space in which the first transport mechanism is provided;
a second processing unit that processes the substrate;
a second transport mechanism for transporting the substrate to the second processing unit;
a bypass transport mechanism for transporting the substrate;
with
The first transport mechanism is arranged between the main transport mechanism and the second transport mechanism,
The detour transport mechanism is arranged between the main transport mechanism and the second transport mechanism,
the main transport mechanism and the first transport mechanism are capable of mutually transporting substrates;
The first transport mechanism and the second transport mechanism are capable of mutually transporting substrates,
the main transport mechanism and the detour transport mechanism are capable of mutually transporting substrates;
The detour transport mechanism and the second transport mechanism are capable of mutually transporting substrates ,
The first processing unit is
a first non-liquid processing unit that performs non-liquid processing on the substrate;
with
The first non-liquid processing section is adjacent to the first transport space,
the first transport space has a lower end,
The first non-liquid processing unit is arranged at a height position higher than the lower end of the first transport space,
The detour transport mechanism is arranged across the space below the first non-liquid processing section and the first transport space.
Substrate processing equipment. In the substrate processing apparatus according to claim 1,
when transferring substrates between the main transport mechanism and the first transport mechanism, the main transport mechanism and the first transport mechanism do not contact the same substrate at the same time;
The substrate processing apparatus, wherein when the substrate is transported between the main transport mechanism and the detour transport mechanism, the main transport mechanism and the detour transport mechanism contact the same substrate at the same time. In the substrate processing apparatus according to any one of claims 1 and 2,
A position at which the substrate is transferred between the main transport mechanism and the detour transport mechanism is the same as a position at which the substrate is transferred between the main transport mechanism and the first transport mechanism in a plan view. . In the substrate processing apparatus according to any one of claims 1 to 3,
At least part of the substrate held by the bypass transport mechanism is positioned inside the first transport space. Substrate processing apparatus. In the substrate processing apparatus according to any one of claims 1 to 4,
At least part of the bypass transport mechanism is arranged in the first transport space. Substrate processing apparatus. In the substrate processing apparatus according to any one of claims 1 to 5 ,
At least part of the bypass transport mechanism is arranged at a position overlapping the first non-liquid processing section in plan view. Substrate processing apparatus. In the substrate processing apparatus according to any one of claims 1 to 6 ,
The first transport mechanism is arranged at the same height position as the main transport mechanism and the second transport mechanism,
The detour transport mechanism is arranged at the same height position as the main transport mechanism and the second transport mechanism.
Substrate processing equipment. In the substrate processing apparatus according to any one of claims 1 to 7 ,
The first non-liquid processing section has a lower end,
The detour transport mechanism is arranged at a height position equal to or lower than the lower end of the first non-liquid processing section,
The first processing unit is
a first liquid processing unit that performs liquid processing on the substrate;
with
The first liquid processing section has a lower end,
the lower end of the first liquid processing section is arranged at a height position lower than the lower end of the first non-liquid processing section;
The substrate processing apparatus, wherein the detour transport mechanism is arranged at a height position equal to or higher than the lower end of the first liquid processing section. In the substrate processing apparatus according to any one of claims 1 to 8 ,
The detour transport mechanism is
a fixedly provided detour support;
a detour movable part supported by the detour support part, movable with respect to the detour support part, and holding a substrate;
with
The detour support portion is arranged at a position overlapping with the first non-liquid processing portion in a plan view,
At least part of the detour movable part is disposed inside the first transfer space. Substrate processing apparatus. In the substrate processing apparatus according to claim 9,
The detour movable part is
a first horizontal moving part supported by the detour support and moving horizontally with respect to the detour support;
a first holding part that is supported by the first horizontal movement part and holds the substrate;
A substrate processing apparatus. In the substrate processing apparatus according to claim 10,
The detour movable part is
a first arm portion supported by the first horizontal movement portion and rotatable with respect to the first horizontal movement portion;
with
A said 1st holding|maintenance part is supported by a said 1st horizontal movement part via a said 1st arm part. Substrate processing apparatus. In the substrate processing apparatus according to claim 10,
Said 1st holding part is fixed to said 1st horizontal movement part, and is immovable with respect to said 1st horizontal movement part. Substrate processing apparatus. In the substrate processing apparatus according to any one of claims 10 to 12 ,
The detour movable part is
a second horizontal moving part supported by the detour support and moving horizontally with respect to the detour support;
a second holding part that is supported by the second horizontal movement part and holds the substrate;
with
The substrate processing apparatus, wherein the second horizontal movement section is movable independently of the first horizontal movement section. In the substrate processing apparatus according to any one of claims 1 to 13,
the main transport mechanism is movable to a height position of the first transport mechanism and a height position of the detour transport mechanism;
The second transport mechanism is movable to a height position of the first transport mechanism and a height position of the bypass transport mechanism,
The substrate processing equipment
a third processing unit arranged below the first processing unit and performing processing on the substrate;
a third transport mechanism disposed below the first transport mechanism and the detour transport mechanism for transporting the substrate to the third processing section;
a fourth processing unit arranged below the second processing unit and performing processing on the substrate;
a fourth transport mechanism arranged below the second transport mechanism for transporting the substrate to the fourth processing section;
Move to a position between the first transport mechanism and the second transport mechanism, a position between the bypass transport mechanism and the second transport mechanism, and a position between the third transport mechanism and the fourth transport mechanism. a relay transport mechanism that can be provided and transports the substrate;
with
The main transport mechanism and the third transport mechanism are capable of mutually transporting substrates,
The substrate processing apparatus, wherein the relay transport mechanism can transport a substrate between the first transport mechanism, the second transport mechanism, the third transport mechanism, the fourth transport mechanism, and the detour transport mechanism. In the substrate processing apparatus according to claim 14,
The detour transport mechanism is arranged at a position overlapping at least one of the first processing section and the first transport space in a side view,
The detour transport mechanism is arranged at a position not overlapping the third processing section in a side view,
The first processing unit is
a first non-liquid processing unit that performs non-liquid processing on the substrate;
with
The third processing unit is
a third non-liquid processing unit that performs non-liquid processing on the substrate ;
with
The length of the first non-liquid processing section in the vertical direction is smaller than the length of the third non-liquid processing section in the vertical direction. In the substrate processing apparatus according to claim 14 or 15,
The substrate processing equipment
a first mounting unit disposed between the intermediate transport mechanism and the first transport mechanism and on which a substrate is placed;
a second mounting unit disposed between the intermediate transport mechanism and the second transport mechanism, on which a substrate is placed;
with
The relay transport mechanism is arranged at a position that intersects a perpendicular bisector of a line connecting the first receiver and the second receiver in a plan view. In the substrate processing apparatus according to claim 16,
The relay transport mechanism is
a first relay transport mechanism for transporting the substrate;
a second relay transport mechanism for transporting the substrate;
with
The first relay transport mechanism is arranged on a first side of a line segment connecting the first receiver and the second receiver in a plan view,
The second relay transport mechanism is arranged on a second side of the line connecting the first receiver and the second receiver in plan view. Substrate processing apparatus. In the substrate processing apparatus according to any one of claims 14 to 17,
The substrate processing apparatus is
a fifth processing unit disposed above the first processing unit and performing processing on the substrate;
a fifth transport mechanism arranged above the first transport mechanism and the detour transport mechanism for transporting the substrate to the fifth processing section;
a sixth processing unit disposed above the second processing unit and performing processing on the substrate;
a sixth transport mechanism arranged above the second transport mechanism for transporting the substrate to the sixth processing section;
with
The relay transport mechanism is movable to a position between the fifth transport mechanism and the sixth transport mechanism,
The main transport mechanism and the fifth transport mechanism are capable of mutually transporting substrates,
The relay transport mechanism, between the first transport mechanism, the second transport mechanism, the third transport mechanism, the fourth transport mechanism, the fifth transport mechanism, the sixth transport mechanism and the detour transport mechanism, A substrate processing apparatus capable of transporting a substrate. In the substrate processing apparatus according to claim 18,
the main transport mechanism delivers the substrate to at least one of the first transport mechanism, the third transport mechanism, and the fifth transport mechanism and does not deliver the substrate to the bypass transport mechanism;
when the main transport mechanism delivers the substrate to the first transport mechanism, the first transport mechanism transports the substrate from the main transport mechanism to the first processing section;
when the main transport mechanism delivers the substrate to the third transport mechanism, the third transport mechanism transports the substrate from the main transport mechanism to the third processing section;
The substrate processing apparatus, wherein the fifth transport mechanism transports the substrate from the main transport mechanism to the fifth processing section when the main transport mechanism delivers the substrate to the fifth transport mechanism. In the substrate processing apparatus according to claim 18,
at least one of the first transport mechanism, the third transport mechanism, and the fifth transport mechanism delivers the substrate to the main transport mechanism, and the bypass transport mechanism does not deliver the substrate to the main transport mechanism;
when the first transport mechanism transfers the substrate to the main transport mechanism, the first transport mechanism transports the substrate from the first processing unit to the main transport mechanism;
when the third transport mechanism transfers the substrate to the main transport mechanism, the third transport mechanism transports the substrate from the third processing section to the main transport mechanism;
The substrate processing apparatus, wherein when the fifth transport mechanism transfers the substrate to the main transport mechanism, the fifth transport mechanism transports the substrate from the fifth processing section to the main transport mechanism.

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