JP6811287B2 - Board processing equipment - Google Patents

Description

The present invention relates to a substrate processing device that processes a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device, a substrate for an optical disk, and the like (hereinafter, simply referred to as a substrate).

Conventionally, as this type of apparatus, there is a substrate processing apparatus including a liquid treatment unit for performing a liquid treatment on a substrate and a heat treatment unit for performing a heat treatment on the substrate. In this substrate processing apparatus, a series of processing including liquid treatment and heat treatment can be performed (see, for example, Patent Document 1). Here, the liquid treatment is, for example, a treatment of applying a resist film material to a substrate or a treatment of supplying a developing solution to the substrate.

Japanese Unexamined Patent Publication No. 2009-010291

However, in the case of the conventional example having such a configuration, there are the following problems.
In the conventional apparatus, the liquid treatment unit and the heat treatment unit are arranged at high density. For example, the liquid treatment unit and the heat treatment unit are arranged in the same block. For example, the liquid treatment unit and the heat treatment unit face each other with a transport space in between. Therefore, the liquid treatment unit may be affected by the heat treatment unit. Specifically, the treatment temperature in the liquid treatment unit may fluctuate due to the influence of the heat treatment unit. In addition, the air in the heat treatment unit is released into the transport space, which may reduce the cleanliness of the atmosphere in the liquid treatment unit.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a substrate processing apparatus capable of reducing the influence of the heat treatment unit on the liquid treatment unit.

The present invention has the following configuration in order to achieve such an object.
That is, the present invention is a substrate processing apparatus, the front heat treatment block which is substantially rectangular in plan view, the front relay block which is substantially rectangular in plan view, and the liquid treatment block which is substantially rectangular in plan view. The front heat treatment block is arranged in the front heat treatment block to perform heat treatment on the substrate, and the front heat treatment block is arranged in the front heat treatment block and in the heat treatment unit of the front heat treatment block. The front relay block is provided with a main transport mechanism for transporting the substrate, the front relay block is arranged in the front relay block, and the mounting portion on which the substrate is mounted and the front relay block are arranged. A transport mechanism for transporting the substrate to the previously described portion of the front relay block is provided, and the liquid treatment block is arranged in the liquid treatment block to perform liquid treatment on the substrate, and the liquid treatment unit. The front heat treatment block and the front relay block are connected and can transfer the substrate to each other, and is provided with a liquid processing transfer mechanism which is arranged in the block and transfers the substrate to the liquid treatment unit. The front relay block and the liquid treatment block are connected so that the substrate can be conveyed to each other, and the front relay block is arranged between the liquid treatment block and the front heat treatment block. It is a substrate processing device.

The present invention is a substrate processing apparatus, comprising a front heat treatment block, a front relay block, and a liquid treatment block. The front heat treatment block includes a heat treatment unit that heats a substrate and the front part. The front relay block is provided with a main transport mechanism for transporting the substrate to the heat treatment unit of the heat treatment block, and the front relay block transports the substrate to a mounting portion on which the substrate is mounted and a front-described mounting portion of the front relay block. The liquid treatment block includes a liquid treatment unit that performs liquid treatment on the substrate, and a liquid treatment transport mechanism that conveys the substrate to the liquid treatment unit, and includes the front heat treatment block. The front relay block is connected and can transfer the substrate to each other, and the front relay block and the liquid treatment block are connected and can transfer the substrate to each other. Is a substrate processing apparatus arranged between the liquid treatment block and the front heat treatment block.

[Action / Effect] According to the substrate processing apparatus according to the present invention, the front relay block is arranged between the liquid treatment block and the front heat treatment block. Here, the front relay block includes a mounting portion and a transport mechanism. Therefore, the mounting portion and the transport mechanism of the front relay block are arranged between the liquid treatment unit and the heat treatment unit of the front heat treatment block. The mounting portion and the transport mechanism of the front relay block preferably prevent the heat and atmosphere released by the heat treatment unit of the front heat treatment block from reaching the liquid treatment unit. Therefore, the influence of the heat treatment unit of the front heat treatment block on the liquid treatment unit can be reduced.

In the above-described invention, it is preferable that the front heat treatment block, the front relay block, and the liquid treatment block are arranged in a row in this order in a plan view. According to such an arrangement, the separation distance between the heat treatment unit and the liquid treatment unit of the front heat treatment block can be effectively increased.

In the above-described invention, the front heat treatment block has a transport space in which the main transport mechanism of the front heat treatment block is installed, and the liquid treatment block has a transport space in which the liquid treatment transport mechanism is installed. It is preferable that the pre-described portion of the front relay block is arranged between the transport space of the front heat treatment block and the transport space of the liquid treatment block. The mounting portion of the front relay block can suitably prevent the atmosphere of the transport space of the front heat treatment block from flowing into the transport space of the liquid treatment block.

In the above-described invention, the main transport mechanism of the front heat treatment block is a first main transport mechanism that transports a substrate to the heat treatment unit of the front heat treatment block, and a substrate is transferred to the heat treatment unit of the front heat treatment block. The transport mechanism of the front relay block includes a second main transport mechanism for transporting, and the transport mechanism of the front relay block includes a first transport mechanism for transporting a substrate to a previously described portion of the front relay block and the front relay block. The liquid treatment transport mechanism of the liquid treatment block includes a first liquid treatment transport mechanism for transporting the substrate to the liquid treatment unit, and the liquid treatment transport mechanism. The first main transport mechanism of the front heat treatment block, the first transport mechanism of the front relay block, and the liquid treatment block are provided with a second liquid treatment transport mechanism for transporting the substrate to the liquid treatment unit. The first liquid treatment transport mechanism transports the first substrate, and the second main transport mechanism of the front heat treatment block, the second transport mechanism of the front relay block, and the first of the liquid treatment block. The two-component processing transfer mechanism preferably conveys a second substrate different from the first substrate. If the transport mechanism for transporting the first substrate is called the "first transport mechanism group", the first main transport mechanism of the front heat treatment block, the first transport mechanism of the front relay block, and the first of the liquid treatment blocks. The liquid treatment transport mechanism belongs to the first transport mechanism group. Further, if the transport machine line for transporting the second substrate is called a "second transport mechanism group", the second main transport mechanism of the front heat treatment block, the second transport mechanism of the front relay block, and the liquid treatment block. The second liquid processing transfer mechanism of the above belongs to the second transfer mechanism group. Here, since there is no common transfer mechanism belonging to both the first and second transfer mechanism groups, the transfer of the substrate by the first transfer mechanism group and the transfer of the substrate by the second transfer mechanism group are independent of each other. ing. Therefore, the transfer of the substrate by the first transfer mechanism group and the transfer of the substrate by the second transfer mechanism group can be executed in parallel. As a result, the operating rate of the substrate processing apparatus can be improved. Further, it is possible to prevent the first transport mechanism group and the second transport mechanism group from affecting each other. For example, even when the transfer of the substrate by the first transfer mechanism group is hindered, the transfer of the substrate by the second transfer mechanism group can be executed without delay.

In the above-described invention, the heat treatment unit of the front heat treatment block heat-treats a first substrate, a plurality of first heat treatment units, and a second substrate different from the first substrate. A plurality of second heat treatment units are provided, and the previously described mounting portion of the front relay block includes one or more first mounting portions on which the first substrate is mounted and the second substrate. The liquid treatment unit comprises one or more second mounting portions to be mounted, and the liquid treatment unit is provided on a plurality of first liquid treatment units and the second substrate for performing liquid treatment on the first substrate. It is preferable to include a plurality of second liquid treatment units for performing liquid treatment. The first heat treatment unit, the first mounting portion, and the first liquid treatment unit accept only the first substrate, and the second heat treatment unit, the second mounting portion, and the second liquid treatment unit accept only the second substrate. The first substrate is conveyed along a first path connecting the first heat treatment unit, the first mounting portion, and the first liquid treatment unit. On the other hand, the second substrate is conveyed along the second path connecting the second heat treatment unit, the second mounting portion, and the second liquid treatment unit. Here, there is no processing unit or mounting unit commonly included in the first path and the second path, and the first path and the second path are completely separated. Therefore, for example, even when the transfer of the substrate along the first route is hindered, the transfer of the substrate along the second feed path can be executed without delay. Further, the front heat treatment block includes a plurality of first heat treatment units, and the liquid treatment block includes a plurality of first liquid treatment units. Therefore, even if a part of the first heat treatment unit or a part of the first liquid treatment unit fails, the substrate can be transferred to the other first heat treatment unit or the other first liquid treatment unit to obtain the first heat treatment unit. The transfer of the substrate along one path can be continued. Similarly, the transfer of the substrate along the second path is not easily affected by the failure of the second heat treatment unit and the second liquid treatment unit.

The present invention is a substrate processing apparatus, which comprises a front heat treatment block which is substantially rectangular in plan view, a front relay block which is substantially rectangular in plan view, a liquid treatment block which is substantially rectangular in plan view, and a flat surface. A heat treatment unit including a rear relay block which is substantially rectangular in view and a rear heat treatment block which is substantially rectangular in plan view, and the front heat treatment block is arranged in the front heat treatment block to heat-treat a substrate. And a main transfer mechanism that is arranged in the front heat treatment block and conveys the substrate to the heat treatment unit of the front heat treatment block, and the front relay block is arranged in the front relay block. The liquid treatment block comprises a mounting portion on which the substrate is placed and a transport mechanism that is arranged in the front relay block and conveys the substrate to the previously described mounting portion of the front relay block. The rear relay is provided with a liquid treatment unit arranged in the liquid treatment block and performing liquid treatment on the substrate, and a liquid treatment transfer mechanism arranged in the liquid treatment block and transporting the substrate to the liquid treatment unit. The block is arranged in the rear relay block and has a mounting portion on which the substrate is mounted, and a transport mechanism arranged in the rear relay block and transporting the substrate to the front-described mounting portion of the rear relay block. The rear heat treatment block is arranged in the rear heat treatment block to perform heat treatment on the substrate, and the main transport is arranged in the rear heat treatment block and conveys the substrate to the heat treatment unit of the rear heat treatment block. The front heat treatment block and the front relay block are connected to each other so that the substrate can be conveyed to each other, and the front relay block and the liquid treatment block are connected to each other. The substrate can be conveyed, the liquid treatment block and the rear relay block can be connected to transfer the substrate to each other, and the rear relay block and the rear heat treatment block can be connected to each other to transfer the substrate to each other. The front relay block is transportable, the front relay block is arranged between the liquid treatment block and the front heat treatment block, and the rear relay block is arranged between the liquid treatment block and the rear heat treatment block. It is a substrate processing device.

The present invention is a substrate processing apparatus, comprising: a front heat treatment block, a front relay block, a liquid treatment block, a rear relay block, and a rear heat treatment block, and the front heat treatment block is attached to a substrate. The front relay block includes a heat treatment unit for performing heat treatment and a main transport mechanism for transporting the substrate to the heat treatment unit of the front heat treatment block, and the front relay block includes a mounting portion on which the substrate is mounted and the front relay. The liquid treatment block includes a transport mechanism for transporting the substrate to the pre-described portion of the block, and the liquid treatment block includes a liquid treatment unit for performing liquid treatment on the substrate and a liquid treatment transport mechanism for transporting the substrate to the liquid treatment unit. The rear relay block comprises a mounting portion on which the substrate is mounted, and a transport mechanism for transporting the substrate to the previously described mounting portion of the rear relay block, and the rear heat treatment block heats the substrate. The front heat treatment block and the front relay block are connected to each other so that the substrate can be conveyed to each other. The front relay block and the liquid treatment block are connected and can transfer the substrate to each other, and the liquid treatment block and the rear relay block are connected and can transfer the substrate to each other. Yes, the rear relay block and the rear heat treatment block are connected and can transfer the substrate to each other, and the front relay block is arranged between the liquid treatment block and the front heat treatment block. The rear relay block is a substrate processing device arranged between the liquid treatment block and the rear heat treatment block.

[Action / Effect] According to the substrate processing apparatus according to the present invention, the front relay block is arranged between the liquid treatment block and the front heat treatment block. Here, the front relay block includes a mounting portion and a transport mechanism. Therefore, the mounting portion and the transport mechanism of the front relay block are arranged between the liquid treatment unit and the heat treatment unit of the front heat treatment block. The mounting portion and the transport mechanism of the front relay block preferably prevent the heat and atmosphere released by the heat treatment unit of the front heat treatment block from reaching the liquid treatment unit. Therefore, the influence of the heat treatment unit of the front heat treatment block on the liquid treatment unit can be reduced.

A rear relay block is arranged between the liquid treatment block and the rear heat treatment block. Here, the rear relay block is a block including a mounting portion and a transport mechanism. Therefore, the mounting portion and the transport mechanism of the rear relay block are arranged between the liquid treatment unit and the heat treatment unit of the rear heat treatment block. The mounting portion and the transport mechanism of the rear relay block preferably prevent the heat and atmosphere released by the heat treatment unit of the rear heat treatment block from reaching the liquid treatment unit. Therefore, the influence of the heat treatment unit of the rear heat treatment block on the liquid treatment unit can be reduced.

In the above-described invention, it is preferable that the front heat treatment block, the front relay block, the liquid treatment block, the rear relay block, and the rear heat treatment block are arranged in a row in this order in a plan view. According to such an arrangement, the separation distance between the heat treatment unit and the liquid treatment unit of the front heat treatment block can be effectively increased. Further, the heat treatment unit of the rear heat treatment block can be effectively separated from the liquid treatment unit.

In the above-described invention, the front heat treatment block has a transport space in which the main transport mechanism of the front heat treatment block is installed, and the liquid treatment block has a transport space in which the liquid treatment transport mechanism is installed. The rear heat treatment block has a transport space in which the main transport mechanism of the rear heat treatment block is installed, and the front-described portion of the front relay block is the transport space of the front heat treatment block. And the transport space of the liquid treatment block, and the pre-described portion of the rear relay block is located between the transport space of the liquid treatment block and the transport space of the rear heat treatment block. It is preferably arranged. The mounting portion of the front relay block can suitably prevent the atmosphere of the transport space of the front heat treatment block from flowing into the transport space of the liquid treatment block. Further, the mounting portion of the rear relay block can preferably prevent the atmosphere of the transport space of the rear heat treatment block from flowing into the transport space of the liquid treatment block.

In the above-described invention, the main transport mechanism of the front heat treatment block is a first main transport mechanism that transports a substrate to the heat treatment unit of the front heat treatment block, and a substrate is transferred to the heat treatment unit of the front heat treatment block. The transport mechanism of the front relay block includes a second main transport mechanism for transporting, and the transport mechanism of the front relay block includes a first transport mechanism for transporting a substrate to a previously described portion of the front relay block and the front relay block. The liquid treatment transport mechanism of the liquid treatment block includes a first liquid treatment transport mechanism for transporting the substrate to the liquid treatment unit, and the liquid treatment transport mechanism. A second liquid processing transport mechanism for transporting the substrate to the liquid treatment unit is provided, and the transport mechanism of the rear relay block includes a first transport mechanism for transporting the substrate to the previously described mounting portion of the rear relay block. A second transport mechanism for transporting the substrate to the previously described portion of the rear relay block is provided, and the main transport mechanism of the rear heat treatment block is a first main transport mechanism for transporting the substrate to the heat treatment unit of the rear heat treatment block. A transport mechanism and a second main transport mechanism for transporting the substrate to the heat treatment unit of the rear heat treatment block are provided, and the first main transport mechanism of the front heat treatment block and the first transport of the front relay block are provided. The mechanism, the first liquid processing transport mechanism of the liquid treatment block, the first transport mechanism of the rear relay block, and the first main transport mechanism of the rear heat treatment block transport the first substrate, and the front The second main transport mechanism of the partial heat treatment block, the second transport mechanism of the front relay block, the second liquid treatment transport mechanism of the liquid treatment block, the second transport mechanism of the rear relay block, and the rear portion. It is preferable that the second main transport mechanism of the heat treatment block transports a second substrate different from the first substrate. Assuming that the transport mechanism for transporting the first substrate is called the "first transport mechanism group", the first transport mechanism group is the first transport mechanism of the front heat treatment block and the first transport of the front relay block. The first transport mechanism for the mechanism and the liquid treatment block, the first transport mechanism for the rear relay block, and the first main transport mechanism for the rear heat treatment block belong to the first transport mechanism group. Further, if the transport machine line for transporting the second substrate is referred to as a "second transport mechanism group", the second main transport mechanism of the front heat treatment block, the second transport mechanism of the front relay block, and the liquid treatment block. The second transport mechanism for liquid treatment, the second transport mechanism of the rear relay block, and the second main transport mechanism of the rear heat treatment block belong to the second transport mechanism group. Here, since there is no common transfer mechanism belonging to both the first and second transfer mechanism groups, the transfer of the substrate by the first transfer mechanism group and the transfer of the substrate by the second transfer mechanism group are independent of each other. ing. Therefore, the transfer of the substrate by the first transfer mechanism group and the transfer of the substrate by the second transfer mechanism group can be executed in parallel. As a result, the operating rate of the substrate processing apparatus can be improved. Further, it is possible to prevent the first transport mechanism group and the second transport mechanism group from affecting each other. For example, even when the transfer of the substrate by the first transfer mechanism group is hindered, the transfer of the substrate by the second transfer mechanism group can be executed without delay.

In the above-described invention, the heat treatment unit of the front heat treatment block includes a plurality of first heat treatment units that heat the first substrate, and a plurality of second heat treatment units that heat the second substrate. The front-described mounting portion of the front relay block comprises one or more first mounting portions on which the first substrate is mounted, and one or more mounting portions on which the second substrate is mounted. The liquid treatment unit includes a second mounting portion, and the liquid treatment unit performs a liquid treatment on a first substrate, a plurality of first liquid treatment units, and a plurality of second liquids on a second substrate. A processing unit is provided, and the front-described mounting portion of the rear relay block mounts one or more first mounting portions on which the first substrate is mounted and the second substrate. The heat treatment unit of the rear heat treatment block, comprising one or more second mounting portions, comprises a plurality of first heat treatment units that heat the first substrate, and a plurality of first heat treatment units that heat the second substrate. It is preferable to include the second heat treatment unit of the above. The first heat treatment unit of the front / rear heat treatment block, the first mounting portion of the front / rear relay block, and the first liquid treatment unit of the liquid treatment block receive only the first substrate. On the other hand, the second heat treatment unit of the front / rear heat treatment block, the second mounting portion of the front / rear relay block, and the second liquid treatment unit of the liquid treatment block accept only the second substrate. The first substrate is conveyed along a first path connecting the first heat treatment unit of the front / rear heat treatment block, the first mounting portion of the front / rear relay block, and the first liquid treatment unit of the liquid treatment block. To. On the other hand, the second substrate is formed along a second path connecting the second heat treatment unit of the front / rear heat treatment block, the second mounting portion of the front / rear relay block, and the second liquid treatment unit of the liquid treatment block. , Will be transported. Here, there is no processing unit or mounting unit commonly included in the first path and the second path, and the first path and the second path are completely separated. Therefore, for example, even when the transfer of the substrate along the first route is hindered, the transfer of the substrate along the second feed path can be executed without delay. Further, each of the front / rear heat treatment blocks includes a plurality of first heat treatment units, and the liquid treatment block includes a plurality of first liquid treatment units. Therefore, even if a part of the first heat treatment unit or a part of the first liquid treatment unit fails, the substrate can be transferred to the other first heat treatment unit or the other first liquid treatment unit to obtain the first heat treatment unit. The transfer of the substrate along one path can be continued. Similarly, the transfer of the substrate along the second path is not easily affected by the failure of the second heat treatment unit and the second liquid treatment unit.

In the above-described invention, the plurality of front-described mounting portions of the front relay block are arranged in the vertical direction with each other, and the plurality of the transport mechanisms of the front relay block are on the side of the front-described placement portion of the front relay block. A plurality of the liquid processing transport mechanisms are arranged in a vertical direction with respect to each other so that each of the liquid treatment transport mechanisms faces at least one or more previously described portions of the front relay block. It is preferable that the previously described portion of the front relay block is arranged. According to such a structure, each of the liquid processing transport mechanisms arranged in the vertical direction can pass the substrate to the transport mechanism of the front relay block via the mounting portion of the front relay block, and also. The substrate can be received from the transport mechanism of the front relay block.

In the above-described invention, the plurality of main transport mechanisms of the front heat treatment block are arranged in either the vertical direction or the lateral direction, and each of the main transport mechanisms of the front heat treatment block is the front relay block. It is preferable that the pre-described portion of the front relay block is arranged so as to face at least one or more pre-described portions of the above. According to such a structure, regardless of whether the plurality of main transport mechanisms of the front heat treatment block are arranged in the vertical direction or in the horizontal direction, each of the main transport mechanisms of the front heat treatment block is arranged. The substrate can be passed to the transport mechanism of the front relay block via the mounting portion of the front relay block, and the substrate can be received from the transport mechanism of the front relay block.

In the invention described above, at least one of the preceding portions of the front relay block is one or more of the main transport mechanisms of the front heat treatment block and one or more of the liquid treatment of the liquid treatment block. It is preferably arranged so as to face both of the transport mechanisms. The main transport mechanism of the front heat treatment block and the liquid treatment transport mechanism of the liquid treatment block can mutually transport the substrate via the mounting portion of the front relay block. That is, the main transport mechanism of the front heat treatment block and the liquid treatment transport mechanism of the liquid treatment block can transport the substrates to each other without using the transport mechanism of the front relay block. Therefore, the substrate can be efficiently transported between the front heat treatment block and the liquid treatment block.

In the above-described invention, the front heat treatment block includes a plurality of mounting portions on which a substrate is mounted, and the plurality of frontal heat treatment blocks of the front heat treatment block are the main transport mechanism of the front heat treatment block. Preliminary description of the front heat treatment block such that each of the transport mechanisms of the front relay block faces each other in the vertical direction and faces at least one or more preambles of the front heat treatment block. It is preferable that the placement portion is arranged. The main transfer mechanism of the front heat treatment block and the transfer mechanism of the front relay block can not only transfer the substrates to each other through the mounting portion of the front relay block, but also the mounting portion of the front heat treatment block. The substrates can be transported to each other via. Therefore, the reliability of substrate transfer between the front heat treatment block and the front relay block can be improved.

In the above-described invention, the pre-described portion of the front heat treatment block is open to the indexer portion connected to the front heat treatment block, and the main transport mechanism and the indexer portion of the front heat treatment block are It is preferable to transfer the substrates to each other through the previously described portion of the front heat treatment block. The substrate can be suitably transferred between the front heat treatment block and the indexer portion.

In the invention described above, at least one of the pre-described portions of the front heat treatment block is an indexer portion that faces one or more of the transport mechanisms of the front relay block and is connected to the front heat treatment block. It is preferable that it is open to the air. The transport mechanism and the indexer portion of the front relay block can transport the substrate to each other via the mounting portion of the front heat treatment block. That is, the transport mechanism of the front relay block and the indexer portion can transport the substrate to each other without using the main transport mechanism of the front heat treatment block. Therefore, the substrate can be efficiently transported between the front relay block and the indexer section.

In the above-described invention, the liquid treatment unit preferably includes a coating unit for applying a coating film material to a substrate and a developing unit for supplying a developing solution to the substrate. A coating film can be formed on the substrate, and the substrate can be developed.

In the above-described invention, the front relay block includes an in-buffer portion that stores a substrate that has not been subjected to any processing in the substrate processing apparatus, and a substrate that has undergone a series of treatments in the substrate processing apparatus. It is preferable to have an out-buffer unit for accumulating. The processing unit can process the unprocessed substrate stored in the in-buffer unit, and the processing unit can store the processed substrate in the out-buffer unit. Therefore, even when the supply of the substrate to the substrate processing apparatus and the collection of the substrate from the substrate processing apparatus are stopped, it is possible to suppress a decrease in the production capacity of the substrate processing apparatus.

In the invention described above, it is preferable that the front heat treatment block and the liquid treatment block are not directly connected.

In the above-described invention, it is preferable that the pre-described portion of the front relay block and the transport mechanism are arranged between the heat treatment unit of the front heat treatment block and the liquid treatment unit of the liquid treatment block.

According to the substrate processing apparatus according to the present invention, the influence of the heat treatment unit on the liquid processing unit can be reduced.

It is a conceptual diagram of the substrate processing apparatus which concerns on Example 1. FIG. It is a top view of the substrate processing apparatus which concerns on Example 1. FIG. It is a side view of the arrow view aa in FIG. It is a side view of the arrow bb in FIG. It is a conceptual diagram which shows typically the relationship between a transport mechanism and a mounting part. It is a front view of the front heat treatment block seen from the indexer part. It is a front view of the front relay block seen from the indexer part. It is a front view of the liquid processing block seen from the indexer part. It is a front view of the rear relay block seen from the indexer part. It is a front view of the rear heat treatment block seen from the indexer part. It is a control block diagram of the substrate processing apparatus which concerns on Example 1. FIG. It is a figure which shows typically the transport path of a substrate. It is a flowchart which shows the procedure of the process performed on a substrate. It is a conceptual diagram which shows typically how the 1st substrate and 2nd substrate move between blocks. It is a figure which shows typically the operation example which each transfer mechanism repeats. It is a conceptual diagram of the substrate processing apparatus which concerns on Example 1. FIG. It is a top view of the substrate processing apparatus which concerns on Example 2. FIG. It is a side view of the arrow view aa in FIG. It is a side view of the arrow bb in FIG. It is a front view of the front heat treatment block seen from the indexer part. It is a front view of the front relay block seen from the indexer part. It is a front view of the liquid processing block seen from the indexer part. It is a front view of the rear relay block seen from the indexer part. It is a front view of the rear heat treatment block seen from the indexer part. It is a front view of the front part of the interface block seen from the indexer part. It is a front view of the rear part of the interface block seen from the indexer part. It is a figure which shows typically the transport path of the outbound route of a substrate. It is a figure which shows typically the transport path of the return path of a substrate. It is a flowchart which shows the procedure of the process performed on a substrate. It is a figure which shows typically the operation example which each transfer mechanism repeats. FIG. 5 is a conceptual diagram schematically showing how a first substrate and a second substrate move between blocks in a modified embodiment. 32 (a), (b), and (c) are side views schematically showing the configuration of the liquid treatment block according to the modified embodiment, respectively.

Hereinafter, Example 1 of the present invention will be described with reference to the drawings.

<Outline of board processing equipment>
FIG. 1 is a conceptual diagram of the substrate processing apparatus according to the first embodiment. The first embodiment is a substrate processing apparatus 1 that performs a series of treatments including liquid treatment and heat treatment on a substrate (for example, a semiconductor wafer) W.

The substrate processing device 1 includes an indexer unit 11 and a processing unit 17. The indexer unit 11 conveys the substrate W to the processing unit 17. The processing unit 17 processes the substrate W. The indexer unit 11 and the processing unit 17 are directly connected to each other, and the substrate W can be conveyed to each other. Note that "transferring to each other" means both transporting the substrate W from one to the other and transporting the substrate W from the other to the other.

Further, the substrate processing device 1 is connected to the exposure machine EXP. More specifically, the processing unit 17 and the exposure machine EXP are directly connected to each other, and the substrate W can be conveyed to each other. The exposure machine EXP is an external device of the substrate processing device 1. The exposure machine EXP performs an exposure process on the substrate W.

The processing unit 17 includes a heat treatment block BA, a relay block BB, a liquid treatment block BC, a relay block BD, and a heat treatment block BE. The heat treatment blocks BA and BE each heat-treat the substrate W. The relay blocks BB and BD each relay the substrate W. The liquid treatment block BC performs liquid treatment on the substrate W.

Blocks BA, BB, BC, BD, and BE are connected in this order. The blocks BA-BB are directly connected and can carry the substrate W to each other. Similarly, the blocks BB-BC, BC-BD, and BD-BE are each directly connected, and the substrate W can be conveyed to each other. However, the block BA is not directly connected to the blocks BC, BD, and BE. The block BB is not directly connected to the blocks BD and BE. The block BC is not directly connected to the blocks BA and BE.

Focusing on the functions of the blocks, the arrangement of the functions from the block BA to the block BE is as follows.
Sequence of functions: heat treatment->relay-> liquid treatment->relay-> heat treatment The sequence of functions is the same as the sequence of functions in the opposite direction (that is, from block BE to block BA).

The front heat treatment block BA is further directly connected to the indexer section 11. The rear heat treatment block BE is further directly connected to the exposure machine EXP.

Hereinafter, the heat treatment block BA is referred to as a “front heat treatment block BA”, and the heat treatment block BE is referred to as a “rear heat treatment block BA”. Similarly, the relay block BB is referred to as a "front relay block BB" and the relay block BD is referred to as a "rear thermal relay block BD".

The front heat treatment block BA includes a heat treatment unit HA and a main transfer mechanism TA. The heat treatment unit HA heat-treats the substrate W. The heat treatment is, for example, a heat treatment or a cooling treatment. The main transport mechanism TA transports the substrate W to the heat treatment unit HA. The main transport mechanism TA does not mean a so-called local transport mechanism (a mechanism installed for each heat treatment unit and exclusively for loading / unloading a substrate to one heat treatment unit).

The front relay block BB includes a mounting portion PB and a transport mechanism TB. The substrate W is mounted on the mounting portion PB. The transport mechanism TB transports the substrate W to the mounting portion PB.

The liquid treatment block BC includes a liquid treatment unit SC and a liquid treatment transfer mechanism TC. The liquid treatment unit SC performs liquid treatment on the substrate W. The liquid treatment is a treatment for supplying a treatment liquid to the substrate W. The treatment liquid is, for example, a coating film material or a developing liquid. That is, the liquid treatment is, for example, a coating treatment or a developing treatment. The liquid processing transport mechanism TC transports the substrate W to the liquid treatment unit SC.

The rear relay block BD includes a mounting portion PD and a transport mechanism TD. The substrate W is mounted on the mounting portion PD. The transport mechanism TD transports the substrate W to the mounting portion PD.

The rear heat treatment block BE includes a heat treatment unit HE and a main transfer mechanism TE. The heat treatment unit HE heat-treats the substrate W. The main transport mechanism TE transports the substrate W to the heat treatment unit HE. The main transport mechanism TE does not mean a so-called local transport mechanism.

For example, when simply described as "heat treatment unit HA", it means the heat treatment unit of the front heat treatment block BA and does not mean the heat treatment unit of the rear heat treatment block BE. Similarly, other members having the same name shall be distinguished by their symbols.

Adjacent transport mechanisms transport the substrate W to each other. Specifically, the transport mechanism TA-TB transports the substrate W to each other. Similarly, the transport mechanisms TB-TC, TC-TD, and TD-TE each transport the substrate W to each other. Further, the main transport mechanism TA and the indexer portion 11 transport the substrate W to each other. The main transport mechanism TE and the exposure machine EXP transport the substrate W to each other.

The substrate processing device 1 operates as follows, for example. The substrate W is conveyed from the indexer unit 11 to the processing unit 17. The processing unit 17 processes the substrate W. Specifically, the liquid treatment unit SC performs liquid treatment (for example, coating treatment) on the substrate W, and the heat treatment unit HE performs heat treatment on the substrate W. As a result, a coating film is formed on the substrate W. The substrate W on which the coating film is formed is conveyed from the processing unit 17 to the exposure machine EXP. The exposure machine EXP exposes the substrate W. The exposed substrate W is conveyed from the exposure machine EXP to the processing unit 17. The processing unit 17 processes the exposed substrate W. Specifically, the liquid treatment unit SC performs liquid treatment (for example, development treatment) on the substrate W, and the heat treatment unit HA performs heat treatment on the substrate W. As a result, the substrate W is developed. The developed substrate W is conveyed from the processing unit 17 to the indexer unit 11.

In the substrate processing apparatus 1 configured in this way, the first relay block BB is arranged between the front heat treatment block BA and the liquid treatment block BC. That is, the front heat treatment block BA and the liquid treatment block BC are not directly connected. The front relay block BB includes a mounting portion PB and a transport mechanism TB. Therefore, the mounting portion PB and the transport mechanism TB are arranged between the liquid treatment unit SC and the heat treatment unit HA. The mounting portion PB and the transport mechanism TB preferably prevent the heat and atmosphere released by the heat treatment unit HA from reaching the liquid treatment unit SC. That is, the influence of the heat treatment unit HA on the liquid treatment unit SC can be reduced. As a result, the liquid treatment unit SC can perform the liquid treatment with good quality.

A rear relay block BD is arranged between the liquid treatment block BC and the rear heat treatment block BE. That is, the liquid treatment block BC and the rear heat treatment block BE are not directly connected. Here, the rear relay block BD includes a mounting portion PD and a transport mechanism TD. Therefore, the mounting portion PD and the transport mechanism TD are arranged between the liquid treatment unit SC and the heat treatment unit HE. The mounting portion PD and the transport mechanism TD preferably prevent the heat and atmosphere released by the heat treatment unit HE from reaching the liquid treatment unit SC. That is, the influence of the heat treatment unit HE on the liquid treatment unit SC can be reduced. As a result, the liquid treatment unit SC can perform the liquid treatment with higher quality.

Hereinafter, the structure of the substrate processing apparatus 1 will be described in more detail.

<Overall structure of substrate processing device 1>
FIG. 2 is a plan view of the substrate processing apparatus 1 according to the first embodiment.
Each block BA, BB, BC, BD, BE is lined up in a row. The directions in which the blocks BA, BB, BC, BD, and BE are lined up are horizontal.

Here, the direction in which the blocks BA, BB, BC, BD, and BE are lined up is referred to as "front-back direction X". In particular, the direction from the block BE to the block BA is called "forward XF", and the direction opposite to the front XF is called "rear XB". Further, the horizontal direction orthogonal to the front-rear direction X is referred to as "horizontal direction Y" or simply "lateral". Further, one direction of the "lateral direction Y" is appropriately called "right YR", and the other direction opposite to the right YR is called "left YL". The vertical direction is called "vertical direction Z".

Each block BA, BB, BC, BD, and BE is substantially rectangular in a plan view. The lengths of the blocks BA, BB, BC, BD, and BE in the lateral direction Y are substantially the same. The entire processing unit 17 is also substantially rectangular in a plan view.

The indexer unit 11, the processing unit 17, and the exposure machine EXP are also arranged in a row in the front-rear direction X in this order. The indexer portion 11 is connected to the front surface of the front heat treatment block BA. The exposure machine EXP is connected to the back surface of the rear heat treatment block BE.

<Indexer section 11>
See FIGS. 2-4. FIG. 3 is a side view of arrow aa in FIG. FIG. 4 is a side view of the arrow bb in FIG.

The indexer unit 11 includes a carrier mounting unit 12, an indexer transfer mechanism 13, and a transfer space 16.

The carrier mounting unit 12 mounts the carrier C. The carrier C accommodates a plurality of substrates W. Carrier C is, for example, FOUP (front opening unified pod). The carrier C is mounted on the carrier mounting portion 12 by, for example, an external transport mechanism (not shown).

The transport space 16 is provided in the rear XB of the carrier mounting portion 12. An indexer transport mechanism 13 is installed in the transport space 16. The indexer transport mechanism 13 transports the substrate W to the carrier C. The indexer transfer mechanism 13 can further transfer the substrate W to the front heat treatment block BA.

For example, the indexer transfer mechanism 13 includes two hands 14 for holding the substrate W and a hand drive mechanism 15 for driving each hand 14. Each hand 14 holds one substrate W. The hand drive mechanism 15 moves the hand 14 in the front-rear direction X, the lateral direction Y, and the vertical direction Z, and rotates the hand 14 around the vertical direction Z. As a result, the indexer transport mechanism 13 transports the substrate W to the carrier C and the front heat treatment block BA.

<Structure of front heat treatment block BA>
See FIGS. 2-6. FIG. 5 is a conceptual diagram schematically showing the relationship between the transport mechanism and the mounting portion. The line with the arrow indicates the mounting part accessed by the transport mechanism. Note that "accessing" means that the transfer mechanism moves to a position where the substrate W is carried into the mounting unit / processing unit or the substrate W is carried out from the mounting unit / processing unit. FIG. 6 is a front view of the front heat treatment block BA seen from the indexer portion 11.

The front heat treatment block BA includes a heat treatment unit HA and a main transport mechanism TA, as well as a transport space AA and a mounting portion PA.

In a plan view, the transport space AA is arranged at the center of the front heat treatment block BA in the lateral direction Y. In other words, in plan view, the transport space AA is arranged on the center line IC passing through the center of the substrate processing apparatus 1 in the lateral direction Y. The center line IC is a virtual line and is parallel to the front-rear direction X. In a plan view, the transport space AA extends in the front-rear direction X.

The front heat treatment block BA further includes an air supply unit SAA that supplies clean gas to the transport space AA, and an exhaust unit EXA that discharges the gas from the transport space AA. The air supply unit SAA is arranged above the transport space AA and blows gas downward. The exhaust unit EXA is arranged below the transport space AA. As a result, a downward gas flow (downflow) is formed in the transport space AA.

The main transport mechanism TA is installed in the transport space AA. The main transport mechanism TA includes a main transport mechanism TAR and a main transport mechanism TAL. The main transport mechanism TAR and the main transport mechanism TAL are arranged so as to be aligned with each other in the lateral direction Y.

The heat treatment unit HA and the mounting portion PA are arranged on both sides of the transport space AA. The heat treatment unit HA includes two heat treatment units HAR arranged on the right YR of the transport space AA and two heat treatment units HAL arranged on the left YL of the transport space AA. The mounting portion PA includes a mounting portion PAR arranged on the right YR of the transport space AA and a mounting portion PAL arranged on the left YL of the transport space AA.

The heat treatment unit HAR and the mounting portion PAR are located on the right YR of the main transport mechanism TAR. The main transport mechanism TAR faces two heat treatment units HAR and one mounting unit PAR. The two heat treatment units HAR and one mounting portion PAR are arranged so as to be aligned with each other in the vertical direction Z. The main transport mechanism TAR is configured to be able to move up and down in the vertical direction Z, and accesses the heat treatment unit HAR and the mounting portion PAR.

The heat treatment unit HAL and the mounting portion PAL are located on the left YL of the main transport mechanism TAL. The main transport mechanism TAL faces two heat treatment units HAL and one mounting unit PAL. The two heat treatment units HAL and one mounting portion PAL are arranged so as to be aligned with each other in the vertical direction Z. The main transport mechanism TAL is configured to be able to move up and down in the vertical direction Z, and accesses the heat treatment unit HAL and the mounting portion PAL.

<Structure of front relay block BB>
See FIGS. 2-5 and 7. FIG. 7 is a front view of the front relay block BB as viewed from the indexer section 11.

The front relay block BB includes a mounting portion PB and a transport mechanism TB.

In a plan view, the mounting portion PB is arranged at the center of the front relay block BB in the lateral direction Y. In other words, in plan view, the mounting portion PB is arranged on the center line IC of the substrate processing device 1.

The plurality of mounting portions PB are arranged so as to be arranged in the vertical direction Z with respect to each other. More specifically, the mounting portion PB includes mounting portions PB1, PB2, PB3, and PB4. The mounting portions PB1, PB1, PB3, and PB4 are arranged in the vertical direction Z with respect to each other. The mounting portions PB1, PB2, PB3, and PB4 are arranged in this order from bottom to top.

The transport mechanism TB is arranged on both sides of the mounting portion PB. Specifically, the transport mechanism TB includes a transport mechanism TBR arranged on the right YR of the mounting portion PB and a transport mechanism TBL arranged on the left YL of the mounting portion PB. The transport mechanisms TBR and TBL each face the mounting portion PB.

In other words, the front relay block BB includes a transport space ABR formed on the right YR of the mounting portion PB and a transport space ABL formed on the left YL of the mounting portion PB. A transport mechanism TBR is installed in the transport space ABR. A transport mechanism TBL is installed in the transport space ABL.

The air supply units SABR and SABL are installed above the transport spaces ABR and ABL, respectively. Exhaust units EXBR and EXBL are installed below the transport spaces ABR and ABL, respectively.

The transport mechanisms TBR and TBL each face the mounting portion PB. The transport mechanism TBR is configured to be able to move up and down in the vertical direction Z, and accesses at least the mounting portions PB1 and PB3. The transport mechanism TBL is configured to be able to move up and down in the vertical direction Z, and accesses at least the mounting portions PB2 and PB4.

<Structure of liquid treatment block BC>
See FIGS. 2-5 and 8. FIG. 8 is a front view of the liquid treatment block BC as viewed from the indexer section 11.

The liquid treatment block BC has a hierarchical structure including a plurality of layers K1, K2, K3, and K4 arranged in the vertical direction. Each of the layers K1, K2, K3, and K4 has one liquid processing transport mechanism TC and one or more liquid treatment units SC to which the liquid treatment transport mechanism TC transports the substrate W. Hierarchies K1, K2, K3, and K4 are arranged in this order from bottom to top. Hereinafter, a specific description will be given.

The liquid treatment block BC includes a liquid treatment unit SC, a liquid treatment transfer mechanism TC, and a transfer space AC. In a plan view, the transport space AC is arranged at the center of the liquid treatment block BC in the lateral direction Y. In other words, in plan view, the transport space AC is arranged on the center line IC of the substrate processing device 1. In plan view, the transport space AC extends in the front-rear direction X.

The transport space AC is divided into a plurality of (for example, four) divided transport spaces AC1, AC2, AC3, and AC4. The divided transport spaces AC1, AC2, AC3, and AC4 are arranged in the vertical direction Z with respect to each other. The divided transport spaces AC1, AC2, AC3, and AC4 are arranged in this order from bottom to top.

An air supply unit (not shown) is installed above each of the divided transport spaces AC1, AC2, AC3, and AC4, and an exhaust unit (not shown) is installed below each of the split transport spaces AC1, AC2, AC3, and AC4. is set up.

The liquid treatment block BC may include a plurality of (for example, three) shielding plates 40. The shielding plate 40 is installed between two divided spaces adjacent to each other in the vertical direction to block the atmosphere of the two divided spaces. For example, the shielding plate 40 is installed between the split transport space AC1 and the split transport space AC2, between the split transport space AC2 and the split transport space AC3, and between the split transport space AC3 and the split transport space AC4. ing.

A liquid processing transfer mechanism TC is installed in each of the divided transfer spaces AC1, AC2, AC3, and AC4. The liquid processing transport mechanisms TC are arranged so as to be arranged in the vertical direction Z with respect to each other.

More specifically, the liquid processing transport mechanism TC includes the liquid treatment transport mechanisms TC1, TC2, TC3, and TC4. The liquid processing transport mechanisms TC1, TC2, TC3, and TC4 are installed in the divided transport spaces AC1, AC2, AC3, and AC4, respectively. The liquid processing transport mechanisms TC1, TC2, TC3, and TC4 are arranged vertically with respect to each other. The liquid processing transport mechanisms TC1, TC2, TC3, and TC4 are arranged in this order from bottom to top. The liquid processing transport mechanism TC1 moves in the split transport space AC1 and does not reach the other split transport spaces AC2, AC3, and AC4. The same applies to the other liquid processing transport mechanisms TC2, TC3, and TC4.

The liquid treatment unit SC is arranged on each side of the divided transport spaces AC1, AC2, AC3, and AC4. More specifically, the liquid treatment unit SC includes liquid treatment units SC1, SC2, SC3, and SC4. The liquid treatment unit SC1 is arranged on both sides of the divided transport space AC1. In the first embodiment, one liquid treatment unit SC1 is arranged on the right YR of the liquid treatment transfer mechanism TC1, and the other liquid treatment unit SC1 is arranged on the left YL of the liquid treatment transfer mechanism TC1. .. Similarly, the liquid treatment unit SC2 is arranged on both sides of the divided transport space AC2. The liquid treatment unit SC3 is arranged on both sides of the divided transport space AC3. The liquid treatment unit SC4 is arranged on both sides of the divided transport space AC4.

The liquid treatment units SC1, SC2, SC3, and SC4 arranged on the right YR of the transport space AC are arranged in the vertical direction Z with each other. The liquid treatment units SC1, SC2, SC3, and SC4 arranged on the left YL of the transport space AC are also arranged in the vertical direction Z.

The liquid treatment transfer mechanism TC1 faces two liquid treatment units SC1 provided on both sides. The liquid treatment transfer mechanism TC1 is configured to be rotatable around the vertical direction Z, and accesses two liquid treatment units SC1. However, the liquid treatment transfer mechanism TC1 does not access the liquid treatment units SC2, SC3, and SC4 provided in other layers. Similarly, the liquid treatment transport mechanisms TC2, TC3, and TC4 access the liquid treatment units SC2, SC3, and SC4, respectively.

The above-mentioned divided transport space ACi, the liquid treatment transport mechanism TCi, and the liquid treatment unit SCi are elements that constitute the hierarchy Ki, respectively (however, i is any one of 1, 2, 3, and 4).

<Structure of rear relay block BD>
See FIGS. 2-5 and 9. FIG. 9 is a front view of the rear relay block BD as viewed from the indexer section 11.

The rear relay block BD has the same structure as the front relay block BB. That is, the rear relay block BD includes a transport space ADR, ADL, an air supply unit SADR, SADL, an exhaust unit EXDR, and EXDL in addition to the mounting portion PD and the transport mechanism TD. The mounting portion PD includes mounting portions PD1, PD2, PD3, and PD4, and the transport mechanism TD includes transport mechanisms TDR and TDL. The relative positional relationship of each element of the rear relay block BD is the same as the relative positional relationship of each element of the front relay block BB.

Specifically, regarding the structure of the rear relay block BD, in the above description of <Structure of front relay block BB>, the front relay block BB is read as the rear relay block BD, and the transport mechanisms TB, TBR, and TBL are referred to. The transfer mechanisms TD, TDR, and TDL are replaced with each other, and the mounting portions PB, PB1, PB2, PB3, and PB4 are replaced with the mounting portions PD, PD1, PD2, PD3, and PD4, respectively, and the transport spaces ABR and ABL are replaced with the transport spaces. It shall be read as ADR and ADL, the air supply units SABR and SABL shall be read as air supply units SADR and SADL, and the exhaust units EXBR and EXBL shall be read as exhaust units EXDR and EXDL.

<Structure of rear heat treatment block BE>
See FIGS. 2-5 and 10. FIG. 10 is a front view of the rear heat treatment block BE as viewed from the indexer section 11.

The rear heat treatment block BE has the same structure as the front heat treatment block BA. That is, the rear heat treatment block BE includes a heat treatment unit HE, a main transport mechanism TE, a transport space AE, a mounting portion PE, an air supply unit SAE, and an exhaust unit EXE. The heat treatment unit HE includes a heat treatment unit HER and a heat treatment unit HEL, a mounting unit PE includes a mounting unit PER and a mounting unit PEL, and a main transport mechanism TE includes a main transport mechanism TER and a main transport mechanism TEL. The relative positional relationship of each element of the rear heat treatment block BE is the same as the relative positional relationship of each element of the front heat treatment block BA.

Specifically, regarding the structure of the rear heat treatment block BE, in the above description of <Structure of front heat treatment block BA>, the front heat treatment block BA is read as the rear heat treatment block BE, and the main transport mechanisms TA, TAR, TAL Are replaced with the main transport mechanisms TE, TER, and TEL, respectively, the heat treatment units HA, HAR, and HAL are replaced with the heat treatment units HE, HER, and HEL, respectively, and the mounting portions PA, PAR, and PAL are replaced with the mounting portions PE, respectively. It shall be read as PER and PEL, the transport space AA shall be read as the transport space AE, the air supply unit SAA shall be read as the air supply unit SAE, and the exhaust unit EXA shall be read as the exhaust unit EXA.

<Relationship between indexer section 11 and block BA>
See Figure 2-5. The mounting portion PA (mounting portion PAR and mounting portion PAL) is open to the indexer portion 11 (transport space 16). The indexer transport mechanism 13 accesses the mounting portion PA. As a result, the indexer transfer mechanism 13 and the main transfer mechanism TAR transfer the substrate W to each other via the mounting portion PAR. The indexer transfer mechanism 13 and the main transfer mechanism TAL transfer the substrate W to each other via the mounting portion PAL.

<Relationship between front heat treatment block BA and front relay block BB>
The main transfer mechanism TA and the transfer mechanism TB transfer the substrate W to each other via the mounting portion PA of the front heat treatment block BA.

Specifically, the transport mechanism TBR and the mounting portion PAR are arranged in the front-rear direction X. The mounting portion PAR is open to the transport space ABR. The transport mechanism TBR and the mounting portion PAR face each other. The transport mechanism TBR is configured to be rotatable about the vertical direction Z, and accesses the mounting portion PAR. As a result, the main transport mechanism TAR and the transport mechanism TBR can transport the substrate W to each other via the mounting portion PAR.

Similarly, the transport mechanism TBL and the mounting portion PAL are aligned in the front-rear direction X. The mounting portion PAL is open to the transport space ABL. The transport mechanism TBL and the mounting portion PAL face each other. The transport mechanism TBL is configured to be rotatable about the vertical direction Z and accesses the mounting portion PAL. As a result, the main transfer mechanism TAL and the transfer mechanism TBL can transfer the substrate W to each other via the mounting portion PAL.

Further, the main transfer mechanism TA and the transfer mechanism TB transfer the substrate W to each other via the mounting portion PBB of the front relay block BB.

Specifically, the mounting portion PB and the transport space AA are arranged in the front-rear direction X. That is, the main transport mechanism TAR and the mounting portion PB are arranged substantially in the front-rear direction, and the main transport mechanism TAL and the mounting portion PB are arranged in the substantially front-rear direction. Each mounting portion PB is open to the transport space AA. The main transport mechanism TAR faces the mounting portion PB. The main transport mechanism TAL also faces the mounting portion PB. The main transport mechanism TAR moves up and down in the vertical direction Z and rotates about the vertical direction Z to access at least the mounting portions PB1 and PB3. As a result, the main transport mechanism TAR and the transport mechanism TBR can transport the substrate W to each other via the mounting portions PB1 and PB3. The main transport mechanism TAL moves up and down in the vertical direction Z and rotates around the vertical direction Z to access at least the mounting portions PB2 and PB4. As a result, the main transfer mechanism TAL and the transfer mechanism TBL can transfer the substrate W to each other via the mounting portions PB2 and PB4.

<Relationship between indexer section 11 and block BA and block BB>
The indexer transfer mechanism 13 and the transfer mechanism TB can transfer the substrate W to each other without using the main transfer mechanism TA.

Specifically, the mounting portion PAR faces both the indexer transport mechanism 13 and the transport mechanism TBR. The indexer transfer mechanism 13 and the transfer mechanism TBR can transfer the substrate W to each other via the mounting portion PAR. That is, the indexer transport mechanism 13 and the transport mechanism TBR can skip the main transport mechanism TA and transport the substrate W to each other.

Similarly, the mounting portion PAL faces both the indexer transport mechanism 13 and the transport mechanism TBL. The indexer transfer mechanism 13 and the transfer mechanism TBL can transfer the substrate W to each other via the mounting portion PAL. That is, the indexer transport mechanism 13 and the transport mechanism TBL can skip the main transport mechanism TA and transport the substrate W to each other.

<Relationship between block BB and block BC>
The transport space AC and the mounting portion PB are arranged in the front-rear direction X.
The mounting portions PB1, PB2, PB3, and PB4 are arranged at positions facing the divided transport spaces AC1, AC2, AC3, and AC4, respectively.
The mounting portions PB1, PB2, PB3, and PB4 are opened to the divided transport spaces AC1, AC2, AC3, and AC4, respectively. The liquid processing transport mechanisms TC1, TC2, TC3, and TC4 face the mounting portions PB1, PB2, PB3, and PB4, respectively.

Each of the liquid processing transport mechanisms TC1, TC2, TC3, and TC4 is configured to be movable in the front-rear direction X, and accesses the mounting portions PB1, PB2, PB3, and PB4, respectively. As a result, the liquid processing transfer mechanism TC1 and the transfer mechanism TBR transfer the substrate W to each other via the mounting portion PB1. The liquid treatment transfer mechanism TC2 and the transfer mechanism TBL transfer the substrate W to each other via the mounting portion PB2. The liquid treatment transfer mechanism TC3 and the transfer mechanism TBR transfer the substrate W to each other via the mounting portion PB3. The liquid processing transfer mechanism TC4 and the transfer mechanism TBL transfer the substrate W to each other via the mounting portion PB4.

<Relationship between block BA, block BB and block BC>

The main transfer mechanism TA and the liquid processing transfer mechanism TC can transfer the substrate W to each other without using the transfer mechanism TB.

Specifically, the mounting portion PB1 faces both the liquid processing transport mechanism TC1 and the main transport mechanism TAR. The liquid processing transfer mechanism TC1 and the main transfer mechanism TAR can transfer the substrate W to each other via the mounting portion PB1. That is, the liquid processing transport mechanism TC1 and the main transport mechanism TAR can skip the transport mechanism TBR and transport the substrate W to each other.

The mounting portion PB2 faces both the liquid processing transport mechanism TC2 and the main transport mechanism TAL. The liquid processing transfer mechanism TC2 and the main transfer mechanism TAL can transfer the substrate W to each other via the mounting portion PB2. That is, the liquid processing transport mechanism TC2 and the main transport mechanism TAL can skip the transport mechanism TBL and transport the substrate W to each other.

The mounting portion PB3 faces both the liquid processing transport mechanism TC3 and the main transport mechanism TAR. The liquid processing transfer mechanism TC3 and the main transfer mechanism TAR can transfer the substrate W to each other via the mounting portion PB3. That is, the liquid processing transport mechanism TC3 and the main transport mechanism TAR can skip the transport mechanism TBR and transport the substrate W to each other.

The mounting portion PB4 faces both the liquid processing transport mechanism TC4 and the main transport mechanism TAL. The liquid processing transfer mechanism TC4 and the main transfer mechanism TAL can transfer the substrate W to each other via the mounting portion PB4. That is, the liquid processing transport mechanism TC4 and the main transport mechanism TAL can skip the transport mechanism TBL and transport the substrate W to each other.

<Relationship between block BC and block BD>
The relationship between the liquid treatment block BC and the rear relay block BD is the same as the relationship between the front relay block BB and the liquid treatment block BC. That is, the liquid processing transport mechanism TC and the transport mechanism TD mutually transport the substrate W via the mounting portion PD. Specifically, the liquid processing transfer mechanism TC1 and the transfer mechanism TDR transfer the substrate W to each other via the mounting portion PD1. The liquid processing transfer mechanism TC2 and the transfer mechanism TDL transfer the substrate W to each other via the mounting portion PD2. The liquid processing transfer mechanism TD3 and the transfer mechanism TDR transfer the substrate W to each other via the mounting portion PD3. The liquid treatment transfer mechanism TC4 and the transfer mechanism TDL transfer the substrate W to each other via the mounting portion PD4.

<Relationship between block BD and block BE>
The relationship between the rear relay block BD and the rear heat treatment block BE is the same as the relationship between the front relay block BB and the front heat treatment block BA.

That is, the transfer mechanism TD and the main transfer mechanism TE transfer the substrate W to each other via the mounting portion PD of the rear relay block BD. Specifically, the transfer mechanism TDR and the main transfer mechanism TER transfer the substrate W to each other via the mounting portions PD1 and PD3. The transfer mechanism TDL and the main transfer mechanism TEL transfer the substrate W to each other via the mounting portions PD2 and PD4.

Further, the transfer mechanism TD and the main transfer mechanism TE transfer the substrate W to each other via the mounting portion PE of the rear heat treatment block BE. Specifically, the transfer mechanism TDR and the main transfer mechanism TER transfer the substrate W to each other via the mounting portion PER. The transfer mechanism TDL and the main transfer mechanism TEL transfer the substrate W to each other via the mounting portion PEL.

<Relationship between block BC, block BD and block BE>
The relationship between the liquid treatment block BC, the rear relay block BD, and the rear heat treatment block BE is the same as the relationship between the liquid treatment block BC, the front relay block BB, and the front heat treatment block BA. That is, the liquid processing transport mechanism TC and the main transport mechanism TE can transport the substrate W to each other without using the transport mechanism TD.

Specifically, the liquid processing transfer mechanism TC1 and the main transfer mechanism TER transfer the substrate W to each other via the mounting portion PD1. The liquid processing transfer mechanism TC2 and the main transfer mechanism TEL transfer the substrate W to each other via the mounting portion PD2. The liquid processing transfer mechanism TC3 and the main transfer mechanism TER transfer the substrate W to each other via the mounting portion PD3. The liquid processing transfer mechanism TC4 and the main transfer mechanism TEL transfer the substrate W to each other via the mounting portion PD4.

<Relationship between rear heat treatment block BE and exposure machine EXP>
Each mounting portion PE is open to the exposure machine EXP. The exposure machine EXP accesses the mounting unit PER and the mounting unit PEL. As a result, the main transfer mechanism TER and the exposure machine EXP transfer the substrate W to each other via the mounting portion PER. The main transport mechanism TEL and the exposure machine EXP transport the substrate W to each other via the mounting portion PEL.

<Structure of each element of front heat treatment block BA>
In this specification, when different elements have the same structure, detailed description thereof will be omitted by assigning a common reference numeral to the structure.

The heat treatment unit HA includes a plate 21, a chamber 23, and a shutter 24. The substrate W is placed on the heat treatment plate 21. A temperature control device (for example, a heat generating device such as a heater or a heat absorbing device such as a heat sink) for adjusting the temperature of the plate 21 is attached to the inside or the outside of the plate 21. The plate 21 applies heat to the substrate W on the plate 21 or removes heat from the substrate W on the plate 21 to adjust the substrate W to a predetermined temperature (that is, heat-treat). The chamber 23 houses the plate 21. The chamber 23 has a substrate transfer port 23a formed on the surface of the chamber 23. The substrate transfer port 23a is arranged at a position facing the main transfer mechanism TA (in other words, in contact with the transfer space AA). The shutter 24 opens and closes the substrate transport port 23a. In FIG. 6, the chamber 23 of the heat treatment unit HAR is closed, and the chamber 23 of the heat treatment unit HAL is open.

The mounting portion PA includes a plate 26 on which the substrate W is mounted. The plate 26 is installed on the shelf 27. The plate 26 is not closed by a chamber or the like, and is basically opened in the horizontal direction (front-back direction X and lateral direction Y). Therefore, not only the main transport mechanism TA but also the indexer transport mechanism 13 and the transport mechanism TB can easily access the mounting portion PA.

The main transport mechanism TA includes a guide shaft portion 31, a drive mechanism 32, and a pair of hands 33. The guide shaft portion 31 extends in the vertical direction Z. The drive mechanism 32 is attached to the guide shaft portion 31. The drive mechanism 32 moves up and down along the guide shaft portion 31 and rotates around the guide shaft portion 31. Further, the drive mechanism 32 moves back and forth (expands and contracts) in the horizontal direction with respect to the guide shaft portion 31. For example, the drive mechanism 32 may include a bendable and stretchable link mechanism (not shown). The pair of hands 33 are attached to the drive mechanism 32. Each hand 33 holds one substrate W in a horizontal posture.

<Structure of each element of front relay block BB>
The mounting portion PB has substantially the same structure as the mounting portion PA. That is, the mounting portion PB includes a plate 26 attached to the shelf 27.

The transport mechanism TB has substantially the same structure as the main transport mechanism TA. That is, the transport mechanism TB includes a guide shaft portion 31, a drive mechanism 32, and a hand 33.

<Structure of each element of liquid treatment block BC>
The liquid treatment units SC1 and SC2 perform a coating treatment on the substrate W. The liquid treatment units SC1 and SC2 have substantially the same structure. Specifically, the liquid treatment units SC1 and SC2 are provided with a rotation holding portion 41, a cup 42, a nozzle 43, a chamber 44, and a shutter 45, respectively. The rotation holding unit 41 rotatably holds the substrate W. The cup 42 is provided around the rotation holding portion 41 and collects the scattered treatment liquid. The nozzle 43 discharges the coating film material as a processing liquid onto the substrate W. The coating film material is, for example, a resist film material. The nozzle 43 is movably provided between a processing position above the rotation holding portion 41 and a retracting position off the top of the cup 42. The chamber 44 houses the rotation holding portion 41, the cup 42, and the nozzle 43. The chamber 44 has a substrate transfer port 44a formed on the surface of the chamber 44. The substrate transfer port 44a is arranged at a position facing the liquid processing transfer mechanism TC1 or TC2 (in other words, in contact with the divided transfer space AC1 or AC2). The shutter 45 opens and closes the substrate transport port 44a. In FIG. 8, the chamber 44 of the liquid treatment unit SC1 is closed, and the chamber 44 of the liquid treatment unit SC2 is open.

The liquid processing units SC3 and SC4 perform development processing on the substrate W. The liquid treatment units SC3 and SC4 have substantially the same structure. The liquid treatment units SC3 and SC4 include a rotation holding portion 51, a cup 52, a nozzle 53, a chamber 54, and a shutter 55, respectively. The rotation holding unit 51 rotatably holds the substrate W. The cup 52 is arranged around the rotation holding portion 51, and collects the scattered treatment liquid. The nozzle 53 discharges the developing solution (processing solution) to the substrate W. The nozzle 53 is provided so as to be movable between a processing position above the rotation holding portion 51 and a retracting position away from above the cup 52. The chamber 54 houses the rotation holding portion 51, the cup 52, and the nozzle 53. The chamber 54 has a substrate transfer port 54a formed on the surface of the chamber 54. The substrate transfer port 54a is arranged at a position facing the liquid processing transfer mechanism TC3 or TC4 (in other words, in contact with the divided transfer space AC3 or AC4). The shutter 55 opens and closes the substrate transport port 54a. In FIG. 8, the chamber 54 of the liquid treatment unit SC3 is closed, and the chamber 54 of the liquid treatment unit SC4 is open.

The liquid processing transfer mechanism TC includes a drive mechanism 61 and a pair of hands 62. The drive mechanism 61 is attached to, for example, a shielding plate 40. The hand 62 is attached to the drive mechanism 61. The drive mechanism 61 moves each hand 62 in various directions X, Y, and Z, and rotates each hand 62 around the vertical direction Z. Each hand 62 holds the substrate W.

<Structure of each element of the rear relay block BD>
The mounting portion PD has substantially the same structure as the mounting portion PA. That is, the mounting portion PD includes a plate 26 attached to the shelf 27.

The transport mechanism TD has substantially the same structure as the main transport mechanism TA. That is, the transport mechanism TD includes a guide shaft portion 31, a drive mechanism 32, and a hand 33.

<Structure of each element of the rear heat treatment block BE>
The heat treatment unit HE has substantially the same structure as the heat treatment unit HA. That is, the heat treatment unit HE includes a plate 21, a chamber 23, and a shutter 24.

The mounting portion PE has substantially the same structure as the mounting portion PA. That is, the mounting portion PE includes a plate 26 attached to the shelf 27.

The main transport mechanism TE has substantially the same structure as the main transport mechanism TA. That is, the main transport mechanism TE includes a guide shaft portion 31, a drive mechanism 32, and a hand 33.

<Block connection structure>
See FIGS. 2-4 and 6-10. The front heat treatment block BA further comprises a frame FA. The frame FA supports the heat treatment unit HA, the main transport mechanism TA, and the mounting portion PA. The frame FA has a substantially box shape and accommodates the heat treatment unit HA, the mounting portion PA, and the main transport mechanism TA. The frame FA has openings (not shown) for opening the mounting portion PA to the indexer portion 11 and the front relay block BB, respectively.

Similarly, the other blocks BB, BC, BD, BE include frames FB, FC, FD, and FE, respectively. Each frame FB-FE supports a processing unit, a mounting portion, a transport mechanism, and the like of the block BB-BE. Each frame FB-FE has a substantially box shape and houses the elements of the block BB-BE. Each frame FB, FC, FD, and FE has an opening (not shown) for opening the mounting portions PB, PD, and PE to adjacent blocks.

The connection of blocks BA-BB is realized by the connection of frames FA-FB. The connection of the blocks BB-BC, BC-BD, and BD-BE is realized by the connection of the frames FB-FC, FC-FD, and FD-FE, respectively.

When manufacturing the substrate processing apparatus 1, first, the blocks BA, BB, BC, BD, and BE are assembled. For example, in the case of the block BA, the heat treatment unit HA, the main transport mechanism TA, and the mounting portion PA are attached to the frame FA. Subsequently, the blocks BA, BB, BC, BD, and BE are connected to each other, and the indexer unit 11 is connected to the block BA.

<Control system configuration>
FIG. 11 is a control block diagram of the substrate processing device 1. The substrate processing device 1 further includes a control unit 67.

The control unit 67 is installed in, for example, the processing unit 17. The control unit 67 comprehensively controls the indexer unit 11 and the processing unit 17. Specifically, it controls the operation of the indexer transport mechanism 13 of the indexer unit 11, and controls the operation of each transport mechanism provided in the block BA-BE and each processing unit provided in the blocks BA, BC, and BE.

The control unit 67 is realized by a central processing unit (CPU) that executes various processes, a RAM (Random-Access Memory) that is a work area for arithmetic processing, a storage medium such as a fixed disk, and the like. Various information such as a processing recipe (processing program) for processing the substrate W and information for identifying each substrate W are stored in the storage medium.

<Transfer path of the substrate in the processing unit 17>
FIG. 12 is a diagram schematically showing a transport path of the substrate W. As shown in FIG. 12, there are two paths for the substrate W to move in the processing unit 17. For convenience, the route in the processing unit 17 is divided into an outward route and a return route. The outward route is the route of the substrate W from entering the processing unit 17 from the indexer unit 11 to exiting the exposure machine EXP from the processing unit 17. The return path is the path of the substrate W from entering the processing unit 17 from the exposure machine EXP to exiting the processing unit 17 to the indexer unit 11.

(Outward)
The first outbound route passes through each of the following elements in this order:
Mounting part PAR → Mounting part PB1 → Liquid treatment unit SC1 → Mounting part PD1 → Heat treatment unit HER → Mounting part PER.
The second outbound route passes through each of the following elements in this order:
Placement part PAL → Placement part PB2 → Liquid treatment unit SC2 → Placement part PD2 → Heat treatment unit HEL → Placement part PEL.

(Return trip)
The first route of the return route passes through each of the following elements in this order:
Placement part PER → Placement part PD3 → Liquid treatment unit SC3 → Placement part PB3 → Heat treatment unit HAR → Placement part PAR.
The second route of the return route passes through each of the following elements in this order:
Mounting part PEL → Mounting part PD4 → Liquid treatment unit SC4 → Mounting part PB4 → Heat treatment unit HAL → Mounting part PAL.

Here, there is no processing unit or mounting unit that is commonly included in the first path and the second path. That is, the first path and the second path are completely different (completely separated).

The mounting portions PAR, PB1, PB3, PD1, PD3, and PER are examples of the first mounting portion of the present invention, and the mounting portions PAL, PB2, PB4, PD2, PD4, and PEL are the second mounting portions of the present invention. This is an example of a mounting part. The liquid treatment units SC1 and SC3 are examples of the first liquid treatment unit of the present invention, and the liquid treatment units SC2 and SC4 are examples of the second liquid treatment unit of the present invention. The heat treatment units HAR and HER are examples of the first heat treatment unit of the present invention, and the heat treatment units HAL and HEL are examples of the ER and the second heat treatment unit of the present invention.

Further, a plurality of processing units SC1 are connected in parallel on the first path. The same applies to the other processing units HER, SC3, and HAR.

The substrate W that moves on the first path and the substrate W that moves on the second path are different. In the following, the substrate W that moves in the first path is appropriately referred to as "first substrate W", and the substrate W that moves in the second path is appropriately referred to as "second substrate W".

Further, the substrate W transported by the transport mechanisms TAR, TBR, TC1, TC3, TDR, and TER is different from the substrate W transported by the transport mechanisms TAL, TBL, TC2, TC4, TDL, and TEL. Assuming that the transport mechanisms TAR, TBR, TC1, TC3, TDR, and TER are referred to as the first transport mechanism group, the first transport mechanism group transports the above-mentioned first substrate W along the first path. Assuming that the transport mechanisms TAL, TBL, TC2, TC4, TDL, and TEL are referred to as the second transport mechanism group, the second transport mechanism group transports the above-mentioned second substrate W along the second path. Here, there is no transport mechanism commonly included in the first transport mechanism group and the second transport mechanism group. That is, the first transport mechanism group and the second transport mechanism group are independent of each other.

The main transport mechanisms TAR and TER are examples of the first main transport mechanism of the present invention, and the main transport mechanisms TAL and TEL are examples of the second main transport mechanism of the present invention. The transport mechanisms TBR and TDR are examples of the first transport mechanism of the present invention, and the transport mechanisms TBL and TDL are examples of the second transport mechanism of the present invention. The liquid treatment transport mechanisms TC1 and TC3 are examples of the first liquid treatment transport mechanism of the present invention, and the liquid treatment transport mechanisms TC2 and TC4 are examples of the second liquid treatment transport mechanism of the present invention.

<Operation example of substrate processing device 1>
An operation example of the substrate processing apparatus 1 will be described with reference to FIGS. 12-15. FIG. 13 is a flowchart showing a procedure of processing performed on the substrate. FIG. 14 is a conceptual diagram schematically showing how the first substrate W and the second substrate W move between the blocks BA-BE. In FIG. 14, for convenience, the liquid treatment units SC1 and SC2 are added with "COAT" meaning coating treatment, and the liquid treatment units SC3 and SC4 are added with "DEV" meaning development processing. FIG. 15 is a diagram schematically showing an operation example repeatedly performed by each transport mechanism.

<Operation in which the indexer unit 11 supplies the substrate W to the processing unit 17>
The indexer transfer mechanism 13 carries out one substrate W from the carrier C, and mounts the substrate W on the mounting portion PAR. Subsequently, the indexer transfer mechanism 13 carries out one substrate W from the carrier C, and mounts the substrate W on the mounting portion PAL. After that, the indexer transport mechanism 13 again transports the substrate W from the carrier C to the mounting portion PAR. In this way, the indexer transport mechanism 13 alternately transports the substrate W one by one to the mounting portion PAR and the mounting portion PAL.

<Operation of processing unit 17 (outward route)>
Since the operation related to the first path and the operation related to the second path are similar, the operation related to the first path will be described for convenience. In the following description, the operation related to the second path is described by replacing the transport mechanism TBR, TC1, and TER with the transport mechanism TBL, TC2, and TEL, respectively, and mounting the mounting portions PAR, PB1, PD1, and PER, respectively. It corresponds to the one in which the placement parts PAL, PB2, PD2, and PEL are read, and the processing units SC1 and HER are read as the processing units SC2 and HEL.

The transport mechanism TBR takes the substrate W on the mounting portion PAR and transports the substrate W to the mounting portion PB1. The liquid processing transport mechanism TC1 takes the substrate W on the mounting portion PB1 and transports the substrate W to the liquid treatment unit SC1. Here, the liquid processing transport mechanism TC1 alternately transports the substrate W to the two liquid treatment units SC2.

When the liquid processing transport mechanism TC1 transports the substrate W to the liquid treatment unit SC1, the shutter 45 temporarily opens the substrate transport port 44a. This allows the hand 62 to enter the chamber 44. After the hand 62 exits the chamber 44, the shutter 45 closes the substrate transfer port 44a again. As a result, the liquid treatment unit SC1 performs liquid treatment in a state where the chamber 44 is closed.

The liquid treatment unit SC1 applies a coating material to the substrate W (step S1). Specifically, the rotation holding unit 41 holds the substrate W. The nozzle 43 moves from the retracted position to the processing position. The rotation holding portion 41 rotates the substrate W, and the nozzle 43 discharges the coating film material. The coating material is applied to the surface of the substrate W. A part of the coating film material is shaken off from the substrate W and collected in the cup 42.

When the coating process is completed, the liquid processing transport mechanism TC1 carries out the substrate W from the liquid processing unit SC1. Also at this time, the chamber 44 is opened to the divided transfer space AC1. Then, the liquid processing transport mechanism TC1 transports the substrate W to the mounting portion PD1.

The liquid processing transfer mechanism TC1 carries out the processed substrate W from the liquid processing unit SC1 while holding the untreated substrate W taken from the mounting portion PB1, and subsequently, the untreated substrate W. May be carried into the liquid treatment unit SC1.

The main transport mechanism TER takes the substrate W from the mounting portion PD1 and transports it to the heat treatment unit HER. Here, the main transfer mechanism TER alternately transfers the substrate W to the two heat treatment units HER. When the main transport mechanism TER transports the substrate W to the heat treatment unit HER, the shutter 24 temporarily opens the substrate transport port 23a. This allows the hand 33 of the main transport mechanism TER to enter the chamber 23. After the hand 33 exits the chamber 23, the shutter 24 closes the substrate transfer port 23a again. As a result, the heat treatment unit HER performs the heat treatment in a state where the chamber 23 is closed.

The heat treatment unit HER heat-treats the substrate W (step S2).

When the heat treatment is completed, the main transfer mechanism TER carries out the substrate W from the heat treatment unit HER. Also at this time, the chamber 23 is opened to the transport space AE. Then, the main transport mechanism TER transports the substrate W to the mounting portion PER.

The above is the operation related to the first route on the outward route. Each operation related to the first route and the second route on the outward route may be performed in parallel.

<Operation of exposure machine EXP>
The substrate W on the mounting portion PER and the mounting portion PEL is conveyed to the exposure machine EXP. The exposure machine EXP performs an exposure process on the substrate W (step S3). When the exposure process is completed, the substrate W is conveyed from the exposure machine EXP to the mounting portion PER and the mounting portion PEL.

<Operation of processing unit 17 (return route)>
Since the operation related to the first path and the operation related to the second path are similar, the operation related to the first path will be described for convenience. In the following description, the operation related to the second path is described by replacing the transport mechanism TAR, TC3, and TDR with the transport mechanism TAL, TC4, and TDL, respectively, and mounting the mounting portions PAR, PB3, PD3, and PER, respectively. It corresponds to the one in which the placement parts PAL, PB4, PD4, and PEL are read, and the processing units SC3 and HAR are read as the processing units SC4 and HAL.

The transport mechanism TDR transports from the mounting portion PER to the mounting portion PD3. The liquid processing transport mechanism TC3 transports the substrate W from the mounting portion PD3 to the liquid treatment unit SC3. Here, the liquid processing transport mechanism TC3 alternately transports the substrate W to the two liquid treatment units SC3.

When the liquid processing transport mechanism TC3 transports the substrate W to the liquid treatment unit SC3, the shutter 55 temporarily opens the substrate transport port 54a.

The liquid processing unit SC3 supplies the developing solution to the substrate W (step S4). Specifically, the rotation holding unit 51 holds the substrate W. The nozzle 53 moves from the retracted position to the processing position. The nozzle 53 discharges the developer. The developer covers the surface of the substrate W. At this time, the rotation holding unit 51 may rotate the substrate W. After a lapse of a predetermined time, the developer is removed from the substrate W. For example, the developer may be shaken off from the substrate W by the rotation holding unit 51 rotating the substrate W. Alternatively, a nozzle (not shown) different from the nozzle 53 may supply the cleaning liquid to the substrate W and replace the developing solution on the substrate W with the cleaning liquid. The developer and the like are collected in the cup 52.

When the development process is completed, the liquid processing transfer mechanism TC3 carries out the substrate W from the liquid treatment unit SC3. Also at this time, the chamber 54 is opened to the divided transfer space AC3. Then, the liquid processing transport mechanism TC3 transports the substrate W to the mounting portion PB3.

The main transport mechanism TAR transports from the mounting portion PB3 to the heat treatment unit HAR. Here, the main transport mechanism TAR alternately transports the substrate W to the two heat treatment units HAR. When the main transport mechanism TAR transports the substrate W to the heat treatment unit HER, the shutter 24 opens and closes the chamber 23 of the heat treatment unit HER.

The heat treatment unit HAR heat-treats the substrate W (step S5).

When the heat treatment is completed, the main transport mechanism TAR carries out the substrate W from the heat treatment unit HAR. Also at this time, the chamber 23 is opened to the transport space AA. Then, the main transport mechanism TAR transports the substrate W to the mounting portion PAR.

The above is the operation related to the first route on the return route. Each operation related to the first path and the second path on the return route may be performed in parallel.

<Operation in which the indexer unit 11 collects the substrate W from the processing unit 17>
The indexer transport mechanism 13 transports the substrate W from the mounting portion PAR to the carrier C. Subsequently, the indexer transport mechanism 13 transports the substrate W from the mounting portion PAL to the carrier C. After that, the indexer transport mechanism 13 again transports the substrate W from the mounting portion PAR to the carrier C. In this way, the indexer transport mechanism 13 alternately carries out the substrate W one by one from the mounting portion PAR and the mounting portion PAL.

The indexer transfer mechanism 13 may mount another substrate W on the mounting portion PAR following the operation of removing the substrate W on the mounting portion PAR. Similarly, the indexer transfer mechanism 13 may mount another substrate W on the mounting portion PAL following the operation of removing the substrate W on the mounting portion PAL.

<Effect of Example 1>
As described above, the influence of the heat treatment unit HA on the liquid treatment unit SC can be reduced. Further, the influence of the heat treatment unit HE on the liquid treatment unit SC can be reduced.

This effect will be illustrated more specifically. When the substrate W is carried into the heat treatment unit HA or when the substrate W is carried out from the heat treatment unit HA, the chamber 23 is opened to the transport space AA. Therefore, it is inevitable that the processing gas in the heat treatment unit HA (chamber 23) (hereinafter referred to as “heat treatment gas”) flows out to the transport space AA. However, a front relay block BB (that is, a mounting portion PB and a transport mechanism TB) is provided between the transport space AA and the liquid treatment unit SC. Therefore, it is possible to preferably prevent the heat treatment gas in the transport space AA from reaching the liquid treatment unit SC. Similarly, even if the heat treatment gas flows out from the heat treatment unit HE to the transport space AE each time the heat treatment unit HE is opened, the liquid treatment unit SC can be suitably protected.

Since the front heat treatment block BA includes the air supply unit SAA and the exhaust unit EXA, the influence of the heat treatment unit HA on the liquid treatment unit SC can be further reduced. Since the front relay block BB includes the air supply units SABR and SABL and the exhaust units EXBR and EXBL, the influence of the heat treatment unit HA on the liquid treatment unit SC can be further reduced. Since the liquid treatment block BC includes an air supply unit (not shown) and an exhaust unit (not shown), the influence of the heat treatment unit HA on the liquid treatment unit SC can be further reduced.

Similarly, since the blocks BD and BE also include the air supply units SADR, SADL and SAE, and the exhaust units EXDR, EXDL, and EXE, the influence of the heat treatment unit HE on the liquid treatment unit SC can be further reduced.

Since the blocks BA, BB, and BC are arranged in a row in this order, the heat treatment unit HA can be effectively separated from the liquid treatment unit SC. Similarly, since the blocks BC, BD, and BE are arranged in a row in this order, the heat treatment unit HE can be effectively separated from the liquid treatment unit SC.

The mounting portion PB is arranged between the transport space AA and the transport space AC. More specifically, the mounting portions PB1, PB2, PB3, and PB4 are arranged between the transport space AA and the split transport spaces AC1, AC2, AC3, and AC4, respectively. Therefore, the mounting portion PB (PB1, PB2, PB3, PB4) can preferably prevent the atmosphere of the transport space AA from flowing into the transport space AC (AC1, AC2, AC3, AC4).

Similarly, the mounting portion PD is arranged between the transport space AE and the transport space AC. More specifically, the mounting portions PD1, PD2, PD3, and PD4 are arranged between the transport space AE and the split transport spaces AC1, AC2, AC3, and AC4, respectively. Therefore, the mounting portions PD (PD1, PD2, PD3, PD4) can preferably prevent the atmosphere of the transport space AE from flowing into the transport space AC (AC1, AC2, AC3, AC4).

In particular, since the transport space AA, the mounting portion PB, and the transport space AC are lined up in a row along the center line IC, it is possible to more preferably prevent the atmosphere of the transport space AA from flowing into the transport space AC. Similarly, since the transport space AE, the mounting portion PD, and the transport space AC are arranged in a row along the center line IC, it is possible to more preferably prevent the atmosphere of the transport space AE from flowing into the transport space AC.

The first transport mechanism group and the second transport mechanism group are independent of each other. Therefore, it is possible to prevent the transfer of the substrate W by the first transfer mechanism group and the transfer of the substrate W by the second transfer mechanism group from affecting each other. For example, even if at least one transport mechanism belonging to the first transport mechanism group fails, the transport of the substrate W by the second transport mechanism group is not delayed or stopped. As a result, it is possible to suppress a decrease in the operating rate of the substrate processing apparatus 1.

The first path and the second path are completely separated. That is, the mounting portion / processing unit through which the first substrate W passes and the mounting portion / processing unit through which the second substrate W passes are completely different. Therefore, it is possible to prevent the substrate transfer along the first path and the substrate transfer along the second path from affecting each other. For example, even if at least one mounting unit / processing unit on the first path fails, it is not necessary to stop the substrate transfer along the second path. As a result, it is possible to further suppress a decrease in the operating rate of the substrate processing apparatus 1.

Two processing units SC1, SC3, HAR, and HER are arranged on the first path. The two processing units SC1 are connected in parallel with each other. The same applies to the other processing units SC3, HAR, and HER. Therefore, liquid treatment and heat treatment can be performed in parallel. As a result, the processing capacity (throughput) of the substrate W in the first path can be increased. Further, for example, even if one of the processing units SC1 fails, the substrate W can be transported to the other processing unit SC1 to continue the substrate transport along the first path. As a result, the reliability of substrate transfer in the first path can be improved.

Similarly, two processing units SC2, SC4, HAL, and HEL are arranged on the second path. Therefore, the processing capacity of the substrate W in the second path can be increased, and the reliability of the substrate transfer along the second path can be increased.

The first substrate W conveyed along the first path and the second substrate W conveyed along the second path are different. Therefore, it is possible to prevent the transfer of the first substrate W and the transfer of the second substrate W from affecting each other. For example, even when the transfer of the first substrate W is stopped, it is not necessary to stop the transfer of the second substrate W. As a result, it is possible to further suppress a decrease in the operating rate of the substrate processing apparatus 1.

The mounting portions PB1, PB2, PB3, and PB4 are arranged vertically with respect to each other, and the liquid processing transport mechanisms TC1, TC2, TC3, and TC4 are also arranged vertically with respect to each other. Further, the mounting portion PB1 is arranged at a position facing the liquid processing transport mechanism TC1. Similarly, the mounting portions PB2, PB3, and PB4 are arranged at positions facing the liquid processing transfer mechanisms TC2, TC3, and TC4, respectively. Therefore, the liquid processing transport mechanism TC1 and the transport mechanism TBR can mutually transport the substrate W via the mounting portion PB1. Similarly, the liquid processing transfer mechanism TC3 and the transfer mechanism TBR can transfer the substrate W to each other via the mounting portion PB3. Further, the liquid processing transport mechanism TC2 / TC4 and the transport mechanism TBL can mutually transport the substrate W via the mounting portions PB2 / PB4.

Similarly, the mounting portion PD and the liquid processing transport mechanism TC are arranged in the same manner as the relative positional relationship between the mounting portion PB and the liquid treatment transport mechanism TC. Therefore, the liquid processing transport mechanisms TC1 and TC3 can mutually transport the transport mechanism TDR and the substrate W, respectively, and the liquid treatment transport mechanisms TC2 and TC4 can mutually favor the transport mechanism TDL and the substrate W, respectively. Can be transported.

The main transport mechanisms TAR and TAL are arranged in the horizontal direction Y. The mounting portion PB1 is arranged at a position facing both the main transport mechanism TAL and the main transport mechanism TAL. Similarly, the mounting portions PB2-PB4 are arranged at positions facing both the main transport mechanism TAR and the main transport mechanism TAL, respectively. Therefore, the main transport mechanism TAR can transport the transport mechanism TBR and the substrate W to each other, and the main transport mechanism TAL can preferably transport the transport mechanism TBL and the substrate W to each other.

The main transport mechanism TAR and the liquid treatment transport mechanisms TC1 and TC3 can transport the substrate W to each other without using the transport mechanism TB. Further, the main transport mechanism TAL and the liquid treatment transport mechanisms TC2 and TC4 can transport the substrate W to each other without using the transport mechanism TB. Therefore, since it is between the front heat treatment block BA and the liquid treatment block BC, the substrate W can be efficiently conveyed.

Similarly, the main transport mechanism TER and the liquid treatment transport mechanisms TC1 and TC3 can transport the substrate W to each other without using the transport mechanism TD. Further, the main transport mechanism TEL and the liquid processing transport mechanisms TC2 and TC4 can transport the substrate W to each other without using the transport mechanism TD. Therefore, since it is between the rear heat treatment block BE and the liquid treatment block BC, the substrate W can be efficiently conveyed.

The mounting portion PAR is arranged on the side of the main transport mechanism TAR and at a position facing the transport mechanism TBR. Therefore, the main transport mechanism TAR and the transport mechanism TBR can not only transport the substrate W via the mounting portion PB, but can also transport the substrate W to each other via the mounting portion PAR. Similarly, the mounting portion PAL is arranged at a position on the side of the main transport mechanism TAL and facing the transport mechanism TBL. Therefore, the main transport mechanism TAL and the transport mechanism TBL can not only transport the substrate W via the mounting portion PB, but can also transport the substrate W to each other via the mounting portion PAL. Therefore, the substrate can be flexibly transferred between the front heat treatment block BA and the front relay block BB.

Similarly, the main transfer mechanism TER and the transfer mechanism TDR can transfer the substrate W to each other by using any of the mounting portions PD1, PD3, and PER. The main transfer mechanism TEL and the transfer mechanism TDL can transfer the substrate W to each other by using any of the mounting portions PD2, PD4, and PEL. Therefore, the substrate can be flexibly transferred between the rear heat treatment block BE and the rear relay block BD.

The mounting portions PAR and PAL are each open to the indexer portion 11. Therefore, the indexer transfer mechanism 13 and the main transfer mechanism TAR can transfer the substrate W to each other, and the indexer transfer mechanism 13 and the main transfer mechanism TAL can transfer the substrate W to each other.

The indexer transfer mechanism 13 and the transfer mechanism TBR can transfer the substrate W to each other without using the main transfer mechanism TA. Further, the indexer transfer mechanism 13 and the transfer mechanism TBL can transfer the substrate W to each other without using the main transfer mechanism TA. Therefore, since it is between the indexer unit 11 and the front relay block BB, the substrate W can be efficiently conveyed.

The liquid treatment unit SC includes liquid treatment units SC1-SC4, the liquid treatment units SC1 and SC2 are coating units for applying a coating film material to the substrate W, and SC3 and SC4 are developing units for supplying a developing solution to the substrate W. It is a unit. Therefore, the coating process and the developing process can be preferably performed on the substrate W.

The number of transfer mechanisms TC for liquid treatment is larger than that of other blocks BA, BB, BD, and BE (specifically, it corresponds to twice that of other blocks BA, BB, BD, and BE). Therefore, the transport capacity of the substrate W in the liquid treatment block BC can be effectively improved.

The array of functions from block BA to block BE is the same as the array of functions from block BE to block BA. Therefore, the indexer unit 11 can be connected to the block BE without being connected to the block BA.

See FIG. FIG. 16 is a conceptual diagram of the substrate processing device 1R obtained by connecting the indexer unit 11 to the block BE. As shown in the figure, the substrate processing apparatus 1R exhibits the same function as the substrate processing apparatus 1 according to the first embodiment.

Further, since the substrate processing device 1 and the substrate processing device 1R have basically the same structure, they can be identified with each other. That is, the front heat treatment block BA and the rear heat treatment block BE have basically the same structure and can be identified with each other, and the front relay block BB and the rear relay block BD have basically the same structure and are identified with each other. The structure of the processing unit 17 seen from the block BA is the same as the structure of the processing unit 17 seen from the block BE. Therefore, even if the indexer unit 11 is connected to either the block BA or the BE, an erroneous connection does not occur, and the assembly work of the substrate processing device 1 can be simplified. Further, the design drawings of the block BA, BE, and the processing unit 17 do not change depending on which of the block BA and BE the indexer unit 11 is connected to. Therefore, the processing unit 17 can be manufactured at a stage where it has not yet been determined whether the indexer unit 11 is connected to the block BA or BE. Once the connection position of the indexer unit 11 is determined, the indexer unit 11 and the processing unit 17 are simply connected as it is, and the substrate processing apparatus 1 can be completed in a short period of time.

Next, a second embodiment of the present invention will be described with reference to the drawings. The same components as those in the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

<Overall structure of substrate processing device 1>
FIG. 17 is a plan view of the substrate processing apparatus 1 according to the second embodiment. The substrate processing apparatus 1 according to the second embodiment is an apparatus that forms an antireflection film, a resist film, and a protective film on the substrate W and develops the substrate W.

The substrate processing device 1 includes an indexer unit 11, a processing unit 17, and an interface block BF. The interface block BF transfers the substrate W to and from the exposure machine EXP. The indexer unit 11, the processing unit 17, the interface block BF, and the exposure machine EXP are arranged in a row in the front-rear direction X in this order. The interface block BF is directly connected to the processing unit 17 (rear heat treatment block BE) and the exposure machine EXP. The exposure machine EXP performs an exposure process on the substrate W by, for example, an immersion method.

<Structure of front heat treatment block BA>
See FIG. 17-20. FIG. 18 is a side view of arrow aa in FIG. FIG. 19 is a side view of arrow bb in FIG. FIG. 20 is a front view of the front heat treatment block BA as viewed from the indexer section 11.

The front heat treatment block BA has a hierarchical structure including two layers arranged in the vertical direction. Specifically, the transport space AA is divided into two divided transport spaces AA1 and AA2. The divided transport spaces AA1 and AA2 are arranged in the vertical direction Z with respect to each other. The divided transport spaces AA1 and AA2 are arranged in this order from bottom to top.

The main transport mechanism TA includes a main transport mechanism TA1 and a main transport mechanism TA2. The main transport mechanism TA1 is installed in the split transport space AA1, and the main transport mechanism TA2 is installed in the split transport space AA2. The main transport mechanisms TA1 and TA2 are arranged so as to be arranged in the vertical direction Z with respect to each other.

The front heat treatment block BA includes heating units HPAA, HPbA, HPcA and a hydrophobizing treatment unit AHP as heat treatment units. The front heat treatment block BA includes a mounting portion SPA and RPA. The elements HPAA, HPbA, HPcA, AHP, SPA, and RPA are arranged on the sides of the divided transport spaces AA1 and AA2, respectively. In the following, symbols indicating the installation location will be appropriately added to the symbols of each element. The symbol indicating the installation location is a combination of a number (for example, 1, 2) indicating the height position (hierarchy) and "R" / "L" indicating either the right YR or the left YL. is there. The numbers "1" / "2" indicating the height position mean the same height as the divided transport spaces AA1 / AA2, respectively. For example, the mounting portion SPA1R is a mounting portion SPA installed on the right YR of the divided transport space AA1, and the heating unit HPAA2L is a heating unit HPaA installed on the left YL of the split transport space AA2.

Each heating unit HPaA, HPbA, and HPcA heats the substrate W, respectively. The hydrophobizing treatment unit AHP performs a hydrophobizing treatment that enhances the adhesion between the substrate W and the coating film. Specifically, the adhesion strengthening treatment unit AHP regulates the temperature of the substrate W while supplying the substrate W with a processing gas containing hexamethyldisilazane (HMDS: Hexamethyldisilazane).

The heating unit HPAA includes a local transfer mechanism 25 in addition to the plate 21, the chamber 23, and the shutter 24 described in the first embodiment (see FIG. 15). The local transport mechanism 25 transports the substrate W in the lateral direction Y and places the substrate W on the plate 21. The other heating units HPbA, HPcA and the hydrophobizing unit AHP also include a local transfer mechanism 25.

The mounting portions SPA and RPA have the same structure as the mounting portion PA of the first embodiment. The mounting section SPA is used, for example, to mount the substrate W exclusively toward the rear XB, and the mounting section RPA is used, for example, to mount the substrate W exclusively facing the front XF.

The main transport mechanisms TA1 and TA2 each include a guide shaft portion 31, a drive mechanism 32, and a hand 33, respectively.

The main transport mechanism TA1 includes each element HPAA1R, HPbA1R, HPcA1R, AHP1R, SPA1R, RPA1R installed on the right YR of the split transport space AA1, and each element HPAA1L, HPbA1L installed on the left YL of the split transport space AA1. , HPcA1LR, AHP1R, SPA1R, RPA1R.

The main transport mechanism TA2 includes each element HPAA2R, HPbA2R, HPcA2R, AHP2R, SPA2R, RPA2R installed on the right YR of the split transport space AA2, and each element HPAA2L, HPbA2L installed on the left YL of the split transport space AA2. , HPcA2LR, AHP2R, SPA2R, RPA2R.

<Structure of front relay block BB>
See FIGS. 17-19 and 21. FIG. 21 is a front view of the front relay block BB as viewed from the indexer section 11.

The front relay block BB includes a mounting portion SPB, an RPB, a cooling mounting portion PCPB, and a cooling unit CPB. The cooling unit CPB is an aspect of the heat treatment unit and cools the substrate W. The cooling mounting unit PCPB mounts the substrate W and cools it. The cooling mounting unit PCPB is an aspect of the mounting unit and also an aspect of the heat treatment unit. The cooling mounting portion PCPB includes a plate 26 and a heat absorbing device (not shown) that absorbs heat from the plate 26. The cooling mounting portion PCPB is open in the horizontal direction in the same manner as the mounting portions SPB and RPB.

The mounting portions SPB, RPB, the cooling mounting portion PCPB, and the cooling unit CPB are stacked vertically on each other at the center of the front relay block BB in the lateral direction Y.

The liquid treatment block BC has divided transport spaces AC1, AC2, ..., AC8 as described later, and the elements SPB, RPB, PCPB, and CPB are the divided transport spaces AC1, AC2, ..., AC8 of the liquid treatment block BC. They are placed at the height facing each other. In the following, numbers (for example, 1, 2, ..., 8) indicating the height position (hierarchy) are added to the codes of the respective elements SPB, RPB, PCPB, and CPB. The number "i" indicating the height position means the same height as the divided transport space ACi of the liquid treatment block BC. For example, the elements RPB8, SPB8, and CPB8 are all arranged at positions facing the divided transport space AC8.

The entire divided transport space AC1-AC4 and the split transport space AA1 have the same height, and the entire split transport space AC5-AC8 and the split transport space AA2 have the same height.

The front relay block BB includes an in-buffer portion Bf-in and an out-buffer portion Bf-out. The in-buffer portion Bf-in accumulates the substrate W which has not been subjected to any treatment such as heat treatment or liquid treatment in the substrate processing apparatus 1. The out-buffer unit Bf-out stores the substrate W for which a series of processing has been completed in the substrate processing apparatus 1. The number of substrates W that can be stored in the in-buffer portion Bf-in and the out-buffer portion Bf-out is, for example, 50.

The in-buffer portion Bf-in is arranged on the right YR of the transport space ABR (convey mechanism TBR). The out-buffer portion Bf-out is arranged in the left YL of the transport space ABL (convey mechanism TBL).

The transport mechanisms TBR and TBL access each element SPB, RPB, PCPB, and CPB, respectively. The transport mechanism TBR further accesses the in-buffer portion Bf-in. The transport mechanism TBL further accesses the in-buffer portion Bf-out.

<Structure of liquid treatment block BC>
See FIGS. 17-19 and 22. FIG. 22 is a front view of the liquid treatment block BC as viewed from the indexer section 11.

The liquid treatment block BC has a hierarchical structure including eight layers arranged in the vertical direction. Specifically, the transport space AC is divided into eight divided transport spaces AC1, AC2, ..., AC8. The divided transport spaces AC1, AC2, ..., AC8 are arranged in the vertical direction Z with each other. The divided transport spaces AC1, AC2, ..., AC8 are arranged in this order from bottom to top.

The liquid treatment transport mechanism TC includes liquid treatment transport mechanisms TC1, TC2, ..., TC8. The liquid processing transport mechanisms TC1, TC2, ..., TC8 are installed in the divided transport spaces AC1, AC2, ..., AC8, respectively.

The liquid treatment unit SC includes liquid treatment units SC1, SC2, ..., SC8. The liquid treatment units SC1, SC2, ..., SC8 are installed on the sides of the divided transport spaces AC1, AC2, ..., AC8, respectively.

The liquid treatment units SC1, SC2, ..., SC6 are coating units. More specifically, the liquid treatment units SC1 and SC2 are antireflection film coating units (BARC), the liquid treatment units SC3 and SC4 are resist film coating units (RESIST), and the liquid treatment units SC5 and SC6 are protective films. Coating unit (TARC). The antireflection film coating units SC1 and SC2 coat the substrate W with an antireflection film material. The resist film coating units SC3 and SC4 coat the resist film material on the substrate W. The protective film coating units SC5 and SC6 coat the protective film material on the substrate W. The liquid treatment units SC7 and SC8 are developing units (DEV).

In the second embodiment, as shown in FIGS. 17 and 18, two liquid treatment units SC are arranged on the right YR of the liquid treatment transport mechanism TC, and the two liquid treatment units SC are the liquid treatment transport mechanism TC. It is located on the left side of YL. The two liquid treatment units SC installed on the right YR of the liquid treatment transfer mechanism TC share the nozzle 43/53 and the chamber 44/54. Similarly, the two liquid treatment units SC installed on the left YL of the liquid treatment transfer mechanism TC also share the nozzle 43/53 and the chamber 44/54.

The liquid processing transport mechanisms TC1, TC2, ..., TC8 access the liquid treatment units SC1, SC2, ..., SC8, respectively.

<Structure of rear relay block BD>
See FIGS. 17-19 and 23. FIG. 23 is a front view of the rear relay block BD as viewed from the indexer section 11.

The rear relay block BD includes a mounting portion SPD, RPD, a cooling mounting portion PCPD, and a cooling unit CPD. The mounting portion SPD, RPD, the cooling mounting portion PCPD, and the cooling unit CPD are stacked vertically on each other at the center of the rear relay block BD in the horizontal direction Y.

The elements SPD, RPD, PCPD, and CPD are arranged at height positions facing each of the divided transport spaces AC1, AC2, ..., AC8 of the liquid processing block BC. In the following, numbers (for example, 1, 2, ..., 8) indicating the height position (hierarchy) are added to the codes of each element SPD, RPD, PCPD, and CPD. The number "i" indicating the height position means that the element faces the divided transport space ACi of the liquid processing block BC.

The transport mechanism TDR and TDL access each element SPD, RPD, PCPD, and CPD, respectively.

The in-buffer portion Bf-in and the out-buffer portion Bf-out are not installed on the right YR of the transport mechanism TDR and the left YL of the transport mechanism TDL. Therefore, for example, a pump for supplying the treatment liquid to the liquid treatment block BC can be installed on the right side portion or the left side portion of the rear relay block BD.

<Structure of rear heat treatment block BE>
See FIGS. 17-19 and 24. FIG. 24 is a front view of the rear heat treatment block BE as viewed from the indexer section 11.

The rear heat treatment block BE has a hierarchical structure including two layers, like the front heat treatment block BA. Specifically, the transport space AE is divided into divided transport spaces AE1 and AE2.

The main transport mechanism TE includes a main transport mechanism TE1 and a main transport mechanism TE2. The main transport mechanism TE1 is installed in the split transport space AE1, and the main transport mechanism TE2 is installed in the split transport space AE2.

The rear heat treatment block BE includes heating units HPaE and HPbE and a cooling unit CPE as heat treatment units. Further, the rear heat treatment block BE includes a mounting portion SPE, RPE and an edge exposure unit EEW. The edge exposure unit EEW exposes the peripheral edge of the resist film on the substrate W.

Each element unit HPaE, HPbE, CPE, SPE, RPE, and EEW are arranged on the sides of the divided transport spaces AE1 and AE2, respectively. In the following, symbols indicating the installation location will be appropriately added to the symbols of each element. The symbol indicating the installation location is a combination of a number (for example, 1, 2) indicating the height position (hierarchy) and "R" / "L" indicating either the right YR or the left YL. is there. The numbers "1" / "2" indicating the height position mean that the elements face the divided transport spaces AE1 / AE2, respectively.

<Structure of interface block BF>
See FIGS. 17-19, 25 and 26. FIG. 25 is a front view of the front portion of the interface block BF as viewed from the indexer portion 11. FIG. 26 is a front view of the rear portion of the interface block BF as viewed from the indexer portion 11.

On the front part (processing unit 17 side) of the interface block BF, mounting parts SPF1, RPF1, SPF2, RPF2 and a transport mechanism TFR, TFL and a pre-exposure cleaning unit BSR, BSL and a post-exposure cleaning processing unit SOR, SOL are installed. Has been done.

The pre-exposure cleaning units BSR and BSL clean and dry the substrate W before the exposure treatment. The pre-exposure cleaning processing units BSR and BSL clean the back surface and the end portion of the substrate W, for example. The post-exposure cleaning treatment units SOR and SOL clean and dry the substrate W after the exposure treatment. For example, the pre-exposure cleaning processing units BSR and BSL and the post-exposure cleaning processing units SOR and SOL are used for cleaning the substrate W, the substrate rotating mechanism for rotating the substrate W, the cleaning liquid supply mechanism for supplying the cleaning liquid to the substrate W, and the substrate W, respectively. It is equipped with cleaning tools such as brushes (not shown).

The mounting portions SPF1, RPF1, SPF2, and RPF2 are arranged at the center of the interface block BF in the lateral direction Y. The mounting portions SPF1, RPF1, SPF2, and RPF2 are arranged in the vertical direction Z with respect to each other. The mounting portions SPF1 and RPF1 are arranged at positions facing the divided transfer space AE1 of the rear heat treatment block BE. The mounting portions SPF2 and RPF2 are arranged at positions facing the divided transfer space AE2 of the rear heat treatment block BE.

The transport mechanism TFR is arranged on the right YR of the mounting portions SPF1, RPF1, SPF2, and RPF2. The pre-exposure cleaning unit BSR and the post-exposure cleaning processing unit SOR are arranged on the right YR of the transport mechanism TFR. The pre-exposure cleaning unit BSR and the post-exposure cleaning processing unit SOR are arranged in the vertical direction Z with each other.

The transport mechanism TFL is arranged on the left YL of the mounting portions SPF1, RPF1, SPF2, and RPF2. The pre-exposure cleaning unit BSL and the post-exposure cleaning processing unit SOL are arranged on the left YL of the transport mechanism TFL. The pre-exposure cleaning unit BSL and the post-exposure cleaning processing unit SOL are arranged in the vertical direction Z with each other.

A cooling mounting unit PCPF, a mounting unit RPFB, a transport mechanism BHU, a post-exposure heat treatment unit PEBR, PEBL, a feed buffer unit SBf, and a return buffer unit RBf are installed at the rear of the interface block BF (exposed machine EXP side). ing.

The post-exposure heat treatment units PEBR and PEBL are one aspect of the heat treatment unit, and perform post-exposure heat treatment (Post Exposure Bake) for heating the substrate W after the exposure treatment. The feed buffer unit SBf accumulates the substrate W before being conveyed to the exposure machine EXP. The return buffer unit RBf stores the substrate W returned from the exposure machine EXP.

The cooling mounting portion PCPF and the mounting portion RPFB are arranged at the center of the interface block BF in the lateral direction Y. The cooling mounting portion PCPF and the mounting portion RPFB are aligned with each other in the vertical direction Z. The transport mechanism BHU is arranged on the right YR of the cooling mounting portion PCPF and the mounting portion RPFB.

The feed buffer unit SBf and the return buffer unit RBf are arranged at the center of the interface block BF in the lateral direction Y and above the cooling mounting unit PCPF and the mounting unit RPFB. The feed buffer unit SBf and the return buffer unit RBf are arranged in the vertical direction Z with respect to each other.

The post-exposure heat treatment unit PEBR is arranged on the right YR of the feed buffer unit SBf and the return buffer unit RBf. The plurality of post-exposure heat treatment units PEBR are arranged in the vertical direction Z with respect to each other. The post-exposure heat treatment unit PEBL is arranged on the left YL of the feed buffer unit SBf and the return buffer unit RBf. The plurality of post-exposure heat treatment units PEBL are arranged in the vertical direction Z with respect to each other.

The transport mechanism TFR includes mounting units SPF1, RPF1, pre-exposure cleaning unit BSR, post-exposure cleaning processing unit SOR, cooling mounting unit PCPF, mounting unit RPFB, post-exposure heat processing unit PEBR, feed buffer unit SBf, and return buffer. Access unit RBf.

The transport mechanism TFL includes mounting units SPF2, RPF2, pre-exposure cleaning unit BSL, post-exposure cleaning processing unit SOL, cooling mounting unit PCPF, mounting unit RPFB, post-exposure heat processing unit PEBL, feed buffer unit SBf, and return buffer. Access part RBf.

The transport mechanism BHU accesses the mounting portions SPF1, RPF1, SPF2, and RPF2. The transport mechanism BHU further transports the substrate W to the exposure machine EXP and receives the substrate W from the exposure machine EXP.

<Relationship between indexer section 11 and block BA>
See FIG. 17-19. The indexer transfer mechanism 13 and the main transfer mechanism TA transfer the substrate W to each other. Specifically, the mounting portions SPA and RPA are open to the indexer portion 11 (conveying space 16), and the indexer transport mechanism 13 can access the mounting portions SPA and RPA. The indexer transfer mechanism 13 and the main transfer mechanism TA1 transfer the substrate W to each other via the mounting portions SPA1R, SPA1L, RPA1R, and RPA1L. The indexer transfer mechanism 13 and the main transfer mechanism TA2 transfer the substrate W to each other via the mounting portions SPA2R, SPA2L, RPA2R, and RPA2L.

<Relationship between front heat treatment block BA and front relay block BB>
The main transfer mechanism TA and the transfer mechanism TB can transfer the substrate W to each other.

Specifically, the transfer mechanism TBR is not only the mounting portions SPA1R, RPA1R, SPA2R, and RPA2R arranged on the right YR of the transfer space AA, but also the heat treatment unit arranged on the right YR of the transfer space AA. HPaA1R, HPbA1R, HPcA1R, AHP1R, HPaA2R, HPbA2R, HPcA2R, and AHP2R are also accessible. Therefore, the main transport mechanism TA1 and the transport mechanism TBR can mutually transport the substrate W via the mounting portions SPA1R and RPA1R. The main transport mechanism TA2 and the transport mechanism TBR can mutually transport the substrate W via the mounting portions SPA2R and RPA2R. Further, the transport mechanism TBR can transport the substrate W to the heat treatment unit HPAA1R or the like arranged on the right YR of the transport space AA.

Similarly, the transfer mechanism TBL includes not only the mounting portions SPA1L, RPA1L, SPA2L, and RPA2L arranged on the left YL of the transfer space AA, but also the units HPaA1L and HPbA1L arranged on the left YL of the transfer space AA. , HPcA1L, AHP1L, HPaA2L, HPbA2L, HPcA2L, AHP2L are also accessible. Therefore, the main transport mechanism TA1 and the transport mechanism TBL can mutually transport the substrate W via the mounting portions SPA1L and RPA1L. The main transport mechanism TA2 and the transport mechanism TBL can transport the substrate W to each other via the mounting portions SPA2L and RPA2L. Further, the transport mechanism TBL can transport the substrate W to the heat treatment unit HPAA1L or the like arranged on the left YL of the transport space AA.

The mounting portions SPB, RPB, the cooling mounting portion PCPB, and the cooling unit CPB facing the divided transport space AC1-AC4 also face the split transport space AA1. The main transport mechanism TA1 is accessible to the mounting portion SPB, the cooling mounting portion PCPB, and the cooling unit CPB in the lower half of the front relay block BB. Therefore, the main transport mechanism TA1 and the transport mechanisms TBR and TBL can mutually transport the substrate W via the mounting portion SPB and the like in the lower half of the front relay block BB.

The mounting portions SPB, RPB, the cooling mounting portion PCPB, and the cooling unit CPB facing the divided transport space AC5-AC8 also face the split transport space AA2. The main transport mechanism TA2 is accessible to the mounting portion SPB, the cooling mounting portion PCPB, and the cooling unit CPB in the upper half of the front relay block BB. Therefore, the main transport mechanism TA2 and the transport mechanisms TBR and TBL can mutually transport the substrate W via the mounting portion SPB or the like in the upper half of the front relay block BB.

<Relationship between indexer section 11 and block BA and block BB>
The indexer transfer mechanism 13 and the transfer mechanism TB can transfer the substrate W to each other without using the main transfer mechanism TA.

Specifically, the indexer transfer mechanism 13 and the transfer mechanism TBR can transfer the substrate W to each other via the mounting portions SPA1R and RPA1R, and the mounting portions SPA2R and RPA2R. Further, the indexer transfer mechanism 13 and the transfer mechanism TBL can mutually transfer the substrate W via the mounting portions SPA1L and RPA1L, and the mounting portions SPA2L and RPA2L.

<Relationship between block BB and block BC>
The transfer mechanism TB and the liquid processing transfer mechanism TC can transfer the substrate W to each other.

Specifically, the liquid processing transfer mechanism TC1 can access the mounting portion RPB1 and the cooling mounting portion PCPB1. The transport mechanism TBR, TBL and the liquid treatment transport mechanism TC1 can mutually transport the substrate W via the mounting portion RPB1 or the cooling mounting portion PCPB1. Similarly, the liquid processing transport mechanisms TC2, TC3, ..., TC8 are between the transport mechanisms TBR and TBL via the mounting portions SPB, RPB or the cooling loading portion PCPB, which are arranged at the same height position, respectively. Therefore, the substrates W can be transported to each other.

<Relationship between block BA, block BB and block BC>
The main transfer mechanism TA and the liquid processing transfer mechanism TC can transfer the substrate W to each other without using the transfer mechanism TB. For example, the main transfer mechanism TA1 and the liquid processing transfer mechanism TC1 can transfer the substrate W to each other via the elements RPB1 and PCPB1.

<Relationship between block BC and block BD>
The relationship between the liquid treatment block BC and the rear relay block BD is the same as the relationship between the front relay block BB and the liquid treatment block BC. That is, the liquid processing transport mechanisms TC1, TC2, ..., TC8 can transport the substrate W to and from the transport mechanisms TDR and TDL, respectively.

<Relationship between block BD and block BE>
The relationship between the rear relay block BD and the rear heat treatment block BE is the same as the relationship between the front relay block BB and the front heat treatment block BA.

Specifically, the transport mechanism TDR and the main transport mechanism TE1 can transport the substrate W to each other via the mounting portions SPE1R and RPE1R. The transfer mechanism TDR and the main transfer mechanism TE2 can transfer the substrate W to each other via the mounting portions SPE2R and RPE2R. Similarly, the transport mechanism TDL and the main transport mechanism TE1 can transport the substrate W to each other via the mounting portions SPE1R and RPE1L. The transfer mechanism TDL and the main transfer mechanism TE2 can transfer the substrate W to each other via the mounting portions SPE2L and RPE2L. Further, the transport mechanism TDR, TDL and the main transport mechanism TE1 can mutually transport the substrate W via the mounting portion SPD or the like in the lower half of the rear relay block BD. The transport mechanism TDR, TDL and the main transport mechanism TE2 can mutually transport the substrate W via the mounting portion SPD or the like on the upper half of the rear relay block BD.

The transport mechanism TDR can transport the substrate W to the heating units HPaE, HPbE, the cooling unit CPE, and the edge exposure unit EEW arranged on the right YR of the transport space AE. The transport mechanism TDL can transport the substrate W to the heating units HPaE, HPbE, the cooling unit CPE, and the edge exposure unit EEW arranged in the left YL of the transport space AE.

<Relationship between block BC, block BD and block BE>
The relationship between the liquid treatment block BC, the rear relay block BD, and the rear heat treatment block BE is the same as the relationship between the liquid treatment block BC, the front relay block BB, and the front heat treatment block BA. That is, the liquid processing transport mechanism TC and the main transport mechanism TE can transport the substrate W to each other without using the transport mechanism TD.

<Relationship between rear heat treatment block BE and exposure machine EXP>
The transport mechanism BHU transports the substrate W to the exposure machine EXP and receives the substrate W from the exposure machine EXP.

<Transfer path of the substrate in the processing unit 17>
FIG. 27 is a diagram schematically showing an outbound transport path of the substrate W. FIG. 28 is a diagram schematically showing a transport path of the return path of the substrate W. As shown in FIGS. 27 and 28, there are two paths (that is, a first path and a second path) for the substrate W to move in the processing unit 17.

There are no processing units or mounting units that are commonly included in the first and second routes. That is, the first path and the second path are completely separated. Each element on the first path is an example of any one of the first mounting portion, the first heat treatment unit and the first liquid treatment unit of the present invention, and each element on the second path is an example of the present invention. This is an example of any one of the second mounting portion, the second heat treatment unit, and the second liquid treatment unit.

A plurality of various processing units such as the processing units AHP and SC1 are arranged on the first path. Similarly, a plurality of various processing units are arranged on the second path.

The transport mechanism group for transporting the substrate W along the first path and the transport mechanism group for transporting the substrate W along the second path are not independent of each other. For example, the main transport mechanism TA1 transports both the first substrate W transported on the first path and the second substrate W transported on the second path.

<Operation example of substrate processing device 1>
An operation example of the substrate processing apparatus 1 according to the second embodiment will be described with reference to FIGS. 27-30. FIG. 29 is a flowchart showing a procedure of processing performed on the substrate. FIG. 30 is a diagram schematically showing an operation example repeatedly performed by each transport mechanism.

<Operation in which the indexer unit 11 supplies the substrate W to the processing unit 17>
The indexer transport mechanism 13 transports the substrate W from the carrier C to the mounting portion SPA. For example, the indexer transport mechanism 13 alternately transports the substrate W to the mounting portions SPA1R, SPA1L, SPA2R, and SPA2L.

<Operation of processing unit 17 (outward route)>
Since the operation related to the first path and the operation related to the second path are similar, the operation related to the first path will be described for convenience, and the description of the operation related to the second path will be omitted.

The transport mechanism TBR transports from the mounting portion SPA1R / SPA2R to the hydrophobizing treatment unit AHP1R / AHP2R. The hydrophobizing unit AHP1R / AHP2R hydrophobicizes the substrate W. The transport mechanism TBR transports the substrate W from the hydrophobizing unit AHP1R / AHP2R to the cooling mounting portion PCPB1. The cooling mounting unit PCPB1 cools the substrate W. These series of heat treatments correspond to step S11 shown in FIG. 27.

The liquid processing transport mechanism TC1 transports the substrate W from the cooling mounting portion PCPB1 to the liquid treatment unit SC1. The liquid treatment unit SC1 applies an antireflection film material to the substrate W (step S12). The liquid processing transfer mechanism TC1 transfers the substrate W from the liquid treatment unit SC1 to the mounting portion RPB1.

The transport mechanism TBR transports the substrate W from the mounting portion RPB1 to the heating unit HPaA1R. The heating unit HPaA1R heats the substrate W. The main transport mechanism TA1 transports the substrate W from the heating unit HPaA1R to the heating unit HPbA1R. The heating unit HPbA1R heats the substrate W. For example, the temperature at which the heating unit HPbA1R heats is higher than that of the heating unit HPaA1R. According to this, the temperature of the substrate W can be rapidly increased. The transport mechanism TBR transports the substrate W from the heating unit HPbA1R to the cooling mounting portion PCPB3. The cooling mounting unit PCPB3 cools the substrate W. These series of heat treatments correspond to step S13 shown in FIG. 27.

The liquid processing transport mechanism TC3 transports the substrate W from the cooling mounting unit PCPB3 to the liquid treatment unit SC3. The liquid treatment unit SC3 applies a resist film material to the substrate W (step S14).

The liquid processing transport mechanism TC3 transports the substrate W from the liquid treatment unit SC3 to the mounting portion SPD3. The transport mechanism TDR transports from the mounting unit SPD3 to the heating unit HPaE1R / HPaE2R. The heating unit HPaE1R / HPaE2R heats the substrate W. The transport mechanism TDR transports the substrate W from the heating units HPaE1R / HPaE2R to the cooling mounting unit PCPD5. The cooling mounting unit PCPD5 cools the substrate W. These series of heat treatments correspond to step S15 shown in FIG. 27.

The liquid treatment transfer mechanism TC5 transfers the substrate W from the cooling mounting unit PCPD5 to the liquid treatment unit SC5. The liquid treatment unit SC5 applies a protective film material to the substrate W (step S16).

The liquid processing transport mechanism TC5 transports the substrate W from the liquid treatment unit SC5 to the mounting portion SPD5. The transport mechanism TDR transports from the mounting portion SPD5 to the heating unit HPbE1R / HPbE2R. The heating unit HPbE1R / HPbE2R heats the substrate W. The main transport mechanism TE1 transports the substrate W from the heating unit HPbE1R to the cooling unit CPE1R. The main transport mechanism TE2 transports the substrate W from the heating unit HPbE2R to the cooling unit CPE2R. The cooling unit CPE1R / CPE2R cools the substrate W. These series of heat treatments correspond to step S17 shown in FIG. 27.

The main transport mechanism TE1 transports the substrate W from the cooling unit CPE1R to the edge exposure unit EEW1R. The main transport mechanism TE2 transports the substrate W from the cooling unit CPE2R to the edge exposure unit EEW2R. The edge exposure unit EEW1R / EEW2R exposes the peripheral edge of the substrate W (step S18).

The transport mechanism TFR transports the substrate W from the edge exposure units EEW1R / EEW2R to the mounting portion SPF1.

<Operation of interface block BF and exposure machine EXP>
The transport mechanism TFR transports the substrate W to the pre-exposure cleaning unit BSR. The pre-exposure cleaning unit BSR cleans the substrate W (step S19).

The transport mechanism TFR transports the substrate W from the pre-exposure cleaning unit BSR to the cooling mounting portion PCPF. The cooling mounting unit PCPF adjusts the substrate W to a predetermined temperature.

The transport mechanism BHU transports the substrate W from the cooling mounting unit PCPF to the exposure machine EXP. The exposure machine EXP performs an exposure process on the substrate W (step S20).

The transport mechanism BHU transports the substrate W from the exposure machine EXP to the mounting portion RPFB. The transport mechanism TFR transports the substrate W from the mounting portion RPFB to the post-exposure cleaning processing unit SOR. The post-exposure cleaning processing unit SOR cleans the substrate W (step S21).

The transport mechanism TFR transports the substrate W from the post-exposure cleaning treatment unit SOR to the post-exposure heat treatment unit PEBR. The post-exposure heat treatment unit PEBR heats the substrate W (step S22).

The transport mechanism TFR transports the substrate W from the heat treatment unit PEBR after exposure to the mounting portion RPE1.

<Operation of processing unit 17 (return route)>
The transport mechanism TDR transports the substrate W from the mounting section RPE1 to the cooling mounting section PCPD7. The cooling mounting unit PCPD7 cools the substrate W (step S23).

The liquid processing transport mechanism TC7 transports the substrate W from the cooling mounting unit PCPD7 to the liquid treatment unit SC7. The liquid treatment unit SC7 develops the substrate W (step S24).

The liquid treatment transfer mechanism TC7 conveys the substrate W from the liquid treatment unit SC7 to the mounting portion RPB7. The transport mechanism TBR transports the substrate W from the mounting portion RPB7 to the heating unit HPcA1R / HPcA2R. The heating unit HPcA1R / HPcA2R heats the substrate W. The main transport mechanism TA1 transports the substrate W from the heating unit HPcA1R to the cooling unit CPB4. The main transport mechanism TA2 transports the substrate W from the heating unit HPcA2R to the cooling unit CPB5. The cooling units CPB4 and CPB5 cool the substrate W. These series of heat treatments correspond to step S25 shown in FIG. 27.

The main transport mechanism TA1 transports the substrate W from the cooling unit CPB4 to the mounting portion RPA1R. The main transport mechanism TA2 transports the substrate W from the cooling unit CPB5 to the mounting portion RPA2R.

<Operation in which the indexer unit 11 collects the substrate W from the processing unit 17>
The indexer transport mechanism 13 transports the substrate W from the mounting portion RPA1R / RPA2R to the carrier C.

<Effect of Example 2>
As described above, the substrate processing apparatus 1 according to the second embodiment also has the same effect as that of the first embodiment.

In particular, the influence of the heating units HPa, HPb, HPc and the hydrophobizing treatment unit on which the released heat and the treatment gas become high temperature can be reduced on the liquid treatment unit SC. Further, the influence of the heating units HPaE and HPbE on the liquid treatment unit SC can be reduced.

Further, according to the substrate processing apparatus 1 according to the second embodiment, various treatments can be performed on the substrate W. For example, a resist film, an antireflection film, and a protective film can be formed on the substrate W.

In the second embodiment, the main transport mechanisms TA1 and TA2 are arranged in the vertical direction Z. The cooling mounting portions PCPB1-PBPB4 and the mounting portions RPB1-RPB4 face the main transport mechanism TA1, respectively, and the mounting portions SPB5-SPB8 and RPB5-RPB8 face the main transport mechanism TA2, respectively. Therefore, the main transport mechanism TA1 and the transport mechanism TBR can transport the substrate W to each other, and the main transport mechanism TAL and the transport mechanism TBL can preferably transport the substrate W to each other.

The front relay block BB includes an in-buffer portion Bf-in. Therefore, even when the supply of the substrate W from the indexer unit 11 to the processing unit 17 is stopped, the processing unit 17 can process the substrate W accumulated in the inbuffer unit Bf-in.
The front relay block BB includes an out-buffer portion Bf-out. Therefore, even when the collection of the substrate W from the processing unit 17 to the indexer unit 11 is stopped, the processing unit 17 can accumulate the substrate W in the out buffer unit Bf-out. Therefore, it is possible to suppress a decrease in the production capacity of the substrate processing apparatus.

Assuming that the apparatus in which the indexer portion 11 is connected to the block BE and the interface block BF is connected to the front heat treatment block BA is the substrate processing apparatus 1R, the substrate processing apparatus 1R is the substrate processing apparatus 1 according to the second embodiment. Demonstrate the same function. Therefore, it is also possible to connect the indexer unit 11 to the block BE. As a result, the assembly work of the substrate processing device 1 can be simplified.

The present invention is not limited to the above embodiment, and can be modified and implemented as follows.

(1) In Example 1 described above, as shown in FIG. 14, whether the substrate W carried out from the liquid treatment unit SC1 or the substrate W carried out from the liquid treatment unit SC2 is used on the rear heat treatment block BE. Transported, but not limited to this. That is, the substrate W carried out from the liquid treatment unit SC1 is conveyed to one of the front heat treatment block BA and the rear heat treatment block BE, and the substrate W carried out from the liquid treatment unit SC2 is transferred to the front heat treatment block BA and the rear heat treatment block BE. It may be transported to the other side of the.

See FIG. 31. FIG. 31 is a conceptual diagram schematically showing how the first substrate W and the second substrate W move between the blocks BA and BE in the modified embodiment. As shown in the figure, the first substrate W is transported from the liquid treatment unit SC1 to the front heat treatment block BA, and the second substrate W is transported from the liquid treatment unit SC2 to the rear heat treatment block BE. Further, the first substrate W is transported from the liquid treatment unit SC3 to the front heat treatment block BA, and the second substrate W is transported from the liquid treatment unit SC4 to the rear heat treatment block BE. Even in such a modified embodiment, the same series of processing can be performed on the first substrate W and the second substrate W.

(2) In Examples 1 and 2 described above, the configuration of the liquid treatment block BC may be appropriately changed. For example, the number of layers K, the number of liquid treatment units SC, the processing contents of the liquid treatment unit SC, and the like may be appropriately changed.

32 (a), (b), and (c) are side views schematically showing the configuration of the liquid treatment block according to the modified embodiment.

As shown in FIG. 32 (a), the liquid treatment units SC1 and SC2 of layers K1 and K2 are used as antireflection film coating units (BARC), and the liquid treatment units SC3 and SC4 of layers K3 and K4 are used as resist film coating units. (RESIST) may be set, and the liquid treatment unit SC5-SC8 of the layer K5-K8 may be changed to a developing unit (DEV).

As shown in FIG. 32 (b), the liquid treatment unit SC1-SC4 of the layer K1-K4 is used as a coating unit (RESIST / BARC) for applying the antireflection film and the resist film, and the liquid treatment unit SC5-S of the layer K5-K8 is used. The SC8 may be changed to a developing unit (DEV).

As shown in FIG. 32 (c), the liquid treatment unit SC1-SC8 of the layer K1-K8 may be a coating unit (RESIST / BARC) for applying the antireflection film and the resist film.

(3) In Examples 1 and 2 described above, the treatment liquid used by the liquid treatment unit SC may be appropriately changed. For example, the treatment solution may be a cleaning solution or a chemical solution. Further, in the above-mentioned Examples 1 and 2, the procedure of the series of processing performed on the substrate W may be appropriately changed.

(4) In Examples 1 and 2 described above, the blocks BD and BE may be omitted. Even in such a modified embodiment, the influence of the heat treatment unit HA provided on the front heat treatment block BA on the liquid treatment unit SC can be reduced.

(5) Each configuration of the above-described embodiment and each modification embodiment may be modified to be appropriately combined.

1 ... Board processing device 1R ... Board processing device 11 ... Indexer section 12 ... Carrier mounting section 13 ... Indexer transfer mechanism BA ... Front heat treatment block BB ... Front relay block BB ... First relay block BC ... Liquid treatment block BE … Rear heat treatment block BF… Interface block TA, TAR, TAL, TA1, TA2… Main transport mechanism of front heat treatment block TB, TBR, TBL… Transport mechanism of front relay block TC, TC1, TC2, TC3, TC4… Liquid Transfer mechanism for processing TD, TDR, TDL ... Transfer mechanism for rear relay block TE, TER, TEL, TE1, TE2 ... Main transfer mechanism for rear heat treatment block TFR, TFL, BHU ... Transfer mechanism for interface block AA ... Front heat treatment block Transport space AA1 ... Split transport space for the front heat treatment block AA2 ... Split transport space for the front heat treatment block ABR, ABL ... Transport space for the front relay block AC ... Transport space for the liquid treatment block AC1-AC8 ... For the liquid treatment block Divided transport space ADR, ADL ... Rear relay block transport space AE ... Rear heat treatment block transport space AE1, AE2 ... Rear heat treatment block split transport space HA, HAR, HAL ... Front heat treatment block heat treatment unit HPA, HPbA, HPcA … Front heat treatment block heating unit AHP… Front heat treatment block adhesion strengthening treatment unit PA, PAR, PAL, SPA, RPA… Front heat treatment block mounting parts PB, PB1-PB4, SPB5-SPB8, RPB1-RPB8 … Front relay block mounting part PCPB1-PCPB8… Front relay block cooling mounting part CPB1-CPB8… Front relay block cooling unit Bf-in… Front relay block in-buffer part Bf-out… Front Out buffer part of the relay block SC, SC1-SC8 ... Liquid treatment unit K1-K8 ... Hierarchical PD, PD1-PD4, SPD1-SPD8, RPD1-RPD4 ... Rear relay block mounting part PCPD5-PCPD8 ... Rear relay block Cooling mounting part CPD1-CPD8 ... Cooling unit of rear relay block HE, HER, HEL ... Rear heat treatment Block heat treatment unit HPaE, HPbE ... Rear heat treatment block heating unit CPE ... Rear heat treatment block cooling unit PE, PER, PEL, SPE, RPE ... Rear heat treatment block mounting part W ... Substrate C ... Carrier EXP ... Exposure machine

Claims (20)

It is a board processing device
The front heat treatment block, which is approximately rectangular in plan view,
The front relay block, which is approximately rectangular in plan view,
A liquid treatment block that is approximately rectangular in plan view,
With
The front heat treatment block is
A heat treatment unit arranged in the front heat treatment block and heat-treating the substrate,
A front main transport mechanism that is arranged in the front heat treatment block and transports the substrate to the heat treatment unit of the front heat treatment block.
With
The front relay block
A mounting portion that is arranged in the front relay block and mounts a substrate,
A front transport mechanism that is arranged in the front relay block and transports the substrate to the previously described mounting portion of the front relay block.
With
The liquid treatment block is
A liquid treatment unit arranged in the liquid treatment block and performing liquid treatment on the substrate,
A liquid treatment transfer mechanism arranged in the liquid treatment block and transporting the substrate to the liquid treatment unit,
With
The front heat treatment block and the front relay block are connected and can transfer the substrate to each other.
The front relay block and the liquid treatment block are connected so that the substrates can be conveyed to each other.
The front relay block is a substrate processing device arranged between the liquid treatment block and the front heat treatment block. In the substrate processing apparatus according to claim 1,
In a plan view, the front heat treatment block, the front relay block, and the liquid treatment block are arranged in a row in this order. In the substrate processing apparatus according to claim 1 or 2.
The front heat treatment block has a transport space in which the front main transport mechanism of the front heat treatment block is installed.
The liquid treatment block has a transport space in which the liquid treatment transport mechanism is installed.
The front-stated portion of the front relay block is a substrate processing apparatus arranged between the transport space of the front heat treatment block and the transport space of the liquid treatment block. In the substrate processing apparatus according to any one of claims 1 to 3,
The front main transport mechanism of the front heat treatment block is
A first front main transport mechanism for transporting a substrate to the heat treatment unit of the front heat treatment block,
A second front main transport mechanism that transports the substrate to the heat treatment unit of the front heat treatment block,
With
The front transport mechanism of the front relay block
A first front transport mechanism that transports the substrate to the previously described mounting portion of the front relay block,
A second front transport mechanism that transports the substrate to the previously described mounting portion of the front relay block, and
With
The liquid treatment transport mechanism of the liquid treatment block is
A first liquid processing transfer mechanism that transfers the substrate to the liquid treatment unit,
A second liquid processing transfer mechanism that transfers the substrate to the liquid treatment unit,
With
Wherein the first liquid treatment transport mechanism of the first front conveyance mechanism and the liquid processing block of the first front main transport mechanism of said front heat treatment block said front relay block, conveying a first substrate And
The second liquid treating transport mechanism of the second front conveyor mechanism and the liquid processing block and the second front main transport mechanism of said front heat treatment block said front relay block, said first substrate Is a substrate processing device that conveys a different second substrate. In the substrate processing apparatus according to any one of claims 1 to 4,
The heat treatment unit of the front heat treatment block
A plurality of first heat treatment units that heat-treat the first substrate,
A plurality of second heat treatment units that heat-treat a second substrate different from the first substrate,
With
The front-mounted portion of the front relay block is
One or more first mounting portions on which the first substrate is mounted, and
One or more second mounting portions on which the second substrate is mounted, and
The liquid treatment unit is equipped with
A plurality of first liquid treatment units that perform liquid treatment on the first substrate,
A plurality of second liquid treatment units that perform liquid treatment on the second substrate,
Substrate processing device. It is a board processing device
The front heat treatment block, which is approximately rectangular in plan view,
The front relay block, which is approximately rectangular in plan view,
A liquid treatment block that is approximately rectangular in plan view,
The rear relay block, which is approximately rectangular in plan view,
The rear heat treatment block, which is approximately rectangular in plan view,
With
The front heat treatment block is
A heat treatment unit arranged in the front heat treatment block and heat-treating the substrate,
A front main transport mechanism that is arranged in the front heat treatment block and transports the substrate to the heat treatment unit of the front heat treatment block.
With
The front relay block
A mounting portion that is arranged in the front relay block and mounts a substrate,
A front transport mechanism that is arranged in the front relay block and transports the substrate to the previously described mounting portion of the front relay block.
With
The liquid treatment block is
A liquid treatment unit arranged in the liquid treatment block and performing liquid treatment on the substrate,
A liquid treatment transfer mechanism arranged in the liquid treatment block and transporting the substrate to the liquid treatment unit,
With
The rear relay block
A mounting portion that is arranged in the rear relay block and mounts a substrate,
A rear transport mechanism that is arranged in the rear relay block and transports the substrate to the previously described mounting portion of the rear relay block.
With
The rear heat treatment block is
A heat treatment unit arranged in the rear heat treatment block and heat-treating the substrate,
A rear main transport mechanism that is arranged in the rear heat treatment block and transports the substrate to the heat treatment unit of the rear heat treatment block.
With
The front heat treatment block and the front relay block are connected and can transfer the substrate to each other.
The front relay block and the liquid treatment block are connected so that the substrates can be conveyed to each other.
The liquid treatment block and the rear relay block are connected so that the substrates can be conveyed to each other.
The rear relay block and the rear heat treatment block are connected and can transfer the substrate to each other.
The front relay block is arranged between the liquid treatment block and the front heat treatment block.
The rear relay block is a substrate processing apparatus arranged between the liquid treatment block and the rear heat treatment block. In the substrate processing apparatus according to claim 6,
In a plan view, the front heat treatment block, the front relay block, the liquid treatment block, the rear relay block, and the rear heat treatment block are arranged in this order in a substrate processing apparatus. In the substrate processing apparatus according to claim 6 or 7.
The front heat treatment block has a transport space in which the front main transport mechanism of the front heat treatment block is installed.
The liquid treatment block has a transport space in which the liquid treatment transport mechanism is installed.
The rear heat treatment block has a transport space in which the rear main transport mechanism of the rear heat treatment block is installed.
The pre-described portion of the front relay block is arranged between the transport space of the front heat treatment block and the transport space of the liquid treatment block.
The front-stated portion of the rear relay block is a substrate processing apparatus arranged between the transport space of the liquid treatment block and the transport space of the rear heat treatment block. In the substrate processing apparatus according to any one of claims 6 to 8.
The front main transport mechanism of the front heat treatment block is
A first front main transport mechanism for transporting a substrate to the heat treatment unit of the front heat treatment block,
A second front main transport mechanism that transports the substrate to the heat treatment unit of the front heat treatment block,
With
The front transport mechanism of the front relay block
A first front transport mechanism that transports the substrate to the previously described mounting portion of the front relay block,
A second front transport mechanism that transports the substrate to the previously described mounting portion of the front relay block, and
With
The liquid treatment transport mechanism of the liquid treatment block is
A first liquid processing transfer mechanism that transfers the substrate to the liquid treatment unit,
A second liquid processing transfer mechanism that transfers the substrate to the liquid treatment unit,
With
The rear transport mechanism of the rear relay block is
A first rear transport mechanism that transports the substrate to the front-mounted portion of the rear relay block,
A second rear transport mechanism that transports the substrate to the previously described mounting portion of the rear relay block, and
With
The rear main transport mechanism of the rear heat treatment block is
A first rear main transport mechanism that transports the substrate to the heat treatment unit of the rear heat treatment block,
A second rear main transport mechanism that transports the substrate to the heat treatment unit of the rear heat treatment block,
With
Wherein the first front main transport mechanism and said first front conveyor mechanism of said front relay block and the first liquid treatment transport mechanism of the liquid processing block and said rear relay block of said front heat treatment blocks the 1 The rear transport mechanism and the first rear main transport mechanism of the rear heat treatment block transport the first substrate.
Wherein said second front main transport mechanism and the second front conveyor mechanism of said front relay block and the second liquid treatment transport mechanism of the liquid processing block and said rear relay block of said front heat treatment blocks the 2. The rear transfer mechanism and the second rear main transfer mechanism of the rear heat treatment block are substrate processing devices that transfer a second substrate different from the first substrate. In the substrate processing apparatus according to any one of claims 6 to 9.
The heat treatment unit of the front heat treatment block
A plurality of first heat treatment units that heat-treat the first substrate,
A plurality of second heat treatment units that heat-treat the second substrate,
With
The front-mounted portion of the front relay block is
One or more first mounting portions on which the first substrate is mounted, and
One or more second mounting portions on which the second substrate is mounted, and
With
The liquid treatment unit
A plurality of first liquid treatment units that perform liquid treatment on the first substrate,
A plurality of second liquid treatment units that perform liquid treatment on the second substrate,
With
The front-mounted portion of the rear relay block is
One or more first mounting portions on which the first substrate is mounted, and
One or more second mounting portions on which the second substrate is mounted, and
With
The heat treatment unit of the rear heat treatment block is
A plurality of first heat treatment units that heat-treat the first substrate,
A plurality of second heat treatment units that heat-treat the second substrate,
Substrate processing device. In the substrate processing apparatus according to any one of claims 1 to 10.
The plurality of pre-described portions of the front relay block are arranged vertically with respect to each other.
The plurality of front transport mechanisms of the front relay block are arranged on the side of the front-described placement portion of the front relay block.
The plurality of liquid processing transport mechanisms are arranged vertically with respect to each other.
A substrate processing device in which the pre-described mounting portions of the front relay block are arranged so that each of the liquid processing transport mechanisms faces at least one or more pre-described mounting portions of the front relay block. In the substrate processing apparatus according to claim 11,
The plurality of front main transport mechanisms of the front heat treatment block are arranged in either the vertical direction or the horizontal direction.
Substrate in which the pre-described mounting of the front relay block is arranged such that each of the front main transport mechanisms of the front heat-treated block faces at least one or more pre-described mounting of the front relay block. Processing device. In the substrate processing apparatus according to claim 12,
At least one of the preceding placements of the front relay block is one or more of the front main transport mechanisms of the front heat treatment block and one or more of the liquid treatment transport mechanisms of the liquid treatment block. A substrate processing device that is placed in a position facing both of them. In the substrate processing apparatus according to claim 12 or 13.
The front heat treatment block includes a plurality of mounting portions on which the substrate is mounted.
The plurality of front-mounted portions of the front heat treatment block are arranged vertically with respect to each other on the side of the front main transport mechanism of the front heat treatment block.
Substrate treatment in which the pre-stated portions of the front heat-treated block are arranged such that each of the front transport mechanisms of the front relay block faces at least one or more pre-described portion of the front heat-treated block. apparatus. In the substrate processing apparatus according to claim 14,
The previously described portion of the front heat treatment block is open to an indexer portion connected to the front heat treatment block.
The front main transport mechanism and the indexer portion of the front heat treatment block are substrate processing devices for transporting substrates to each other via the previously described mounting portions of the front heat treatment block. In the substrate processing apparatus according to claim 14 or 15.
At least one of the pre-described portions of the front heat treatment block is open to an indexer portion that faces one or more of the front transport mechanisms of the front relay block and is connected to the front heat treatment block. Substrate processing equipment. In the substrate processing apparatus according to any one of claims 1 to 16.
The liquid treatment unit
A coating unit that applies the coating material to the substrate,
A developing unit that supplies a developer to the substrate,
Substrate processing device. In the substrate processing apparatus according to any one of claims 1 to 17,
The front relay block
An in-buffer unit that stores a substrate that has not been subjected to any processing in the substrate processing apparatus,
An out-buffer unit that stores a substrate that has undergone a series of processing in the substrate processing apparatus,
Substrate processing equipment equipped with. In the substrate processing apparatus according to any one of claims 1 to 18.
A substrate processing apparatus in which the front heat treatment block and the liquid treatment block are not directly connected. In the substrate processing apparatus according to any one of claims 1 to 19.
The front-stated portion of the front relay block and the front transport mechanism are substrate processing devices arranged between the heat treatment unit of the front heat treatment block and the liquid treatment unit of the liquid treatment block.

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