JP5686647B2 - Substrate holding device, substrate cleaning device, and substrate processing apparatus - Google Patents

Description

  The present invention relates to a substrate holding apparatus, a substrate cleaning apparatus, and a substrate processing apparatus that hold a substrate.

  In order to perform various processes on various substrates such as a semiconductor substrate, a liquid crystal display substrate, a plasma display substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, and a photomask substrate, It is used.

  In such a substrate processing apparatus, for example, the substrate is cleaned while the substrate is held by a spin chuck. As the spin chuck, there is an end surface holding type spin chuck that holds an outer peripheral end portion of a substrate (see, for example, Patent Document 1).

  The spin chuck described in Patent Document 1 mainly includes a spin motor, a rotating shaft, a spin plate, and a plurality of holding units.

  A rotation shaft is provided so as to extend downward from the inside of the spin motor, and a spin plate is attached to a lower end portion of the rotation shaft. A plurality of holding portions having a substantially cylindrical shape are provided at the peripheral edge portion of the spin plate so as to extend at an equal interval with respect to the rotation axis and below the spin plate. The plurality of holding portions abut on the outer peripheral edge of the substrate, whereby the substrate is held below the spin plate. As the spin plate rotates around the vertical axis, the substrate rotates in a horizontal position. In this state, the back surface of the substrate is cleaned with a brush or the like.

JP 2009-260033 A

  In the end surface holding type spin chuck, the substrate rotates in a state in which a part of the plurality of holding portions is in contact with the outer peripheral edge of the substrate as described above. Therefore, the contact portion of each holding portion with respect to the outer peripheral end portion of the substrate is easily worn. When the contact portion of each holding portion with respect to the substrate is worn, it is necessary to replace the holding portion.

  The exchanging operation of the holding unit is performed in a state where the substrate processing apparatus is stopped. In order to improve the operation rate of the substrate processing apparatus, it is preferable that the stop time of the substrate processing apparatus accompanying the replacement operation of the holding unit is as short as possible. Therefore, the life of the holding part is required to be extended.

  An object of the present invention is to provide a substrate holding device, a substrate cleaning device, and a substrate processing apparatus capable of realizing a long life of a holding member.

[A] The present invention
(1) A substrate holding device according to a first invention is a substrate holding device for holding a substrate, comprising: a supporting member; a holding member having an outer peripheral surface capable of contacting an outer peripheral end of the substrate; and a holding member. A holding state in which the outer peripheral surface of the holding member abuts on the outer peripheral end of the substrate, and a release in which the outer peripheral surface of the holding member is separated from the outer peripheral end of the substrate, while being held rotatably around an axis perpendicular to the main surface of the substrate A movable member provided on the support member so as to be capable of transitioning to a state, a drive mechanism for transitioning the movable member to a holding state and a released state, a fixed state that prevents rotation of the holding member relative to the movable member, and a holding member for the movable member A rotation preventing member that can be switched to a rotatable state that allows rotation is provided, and a plurality of different indicators are provided on the outer peripheral surface of the holding member so as to be aligned in the circumferential direction.
In this substrate holding apparatus, the holding member is rotatably held around an axis perpendicular to the main surface of the substrate. The movable member is shifted between the holding state and the released state by the driving mechanism. In the holding state, the outer peripheral surface of the holding member contacts the outer peripheral end of the substrate, and in the open state, the outer peripheral surface of the holding member is separated from the outer peripheral end of the substrate.
The rotation preventing member can be switched between a fixed state and a rotatable state. When the rotation blocking member is in a fixed state, the rotation of the holding member with respect to the movable member is blocked. In this state, the movable member is shifted to the holding state by the drive mechanism. As a result, a part of the outer peripheral surface of the holding member comes into contact with the outer peripheral end of the substrate, and the substrate is held.
When the rotation preventing member is in a rotatable state, the holding member is allowed to rotate with respect to the movable member. When a part of the outer peripheral surface of the holding member is worn by contact with the outer peripheral end portion of the substrate, the operator contacts the outer peripheral end portion of the substrate by rotating the holding member by a desired angle with respect to the movable member. The part of the outer peripheral surface of the holding member can be changed. Thereafter, the operator can switch the rotation prevention member to the fixed state again.
Therefore, even if a part of the outer peripheral surface of the holding member is worn by coming into contact with the outer peripheral end of the substrate, it is necessary to replace the holding member when other portions of the outer peripheral surface of the holding member are not worn. Disappear. As a result, the life of the holding member can be extended and the replacement cycle of the holding member can be extended.
A plurality of different indexes are provided on the outer peripheral surface of the holding member so as to be aligned in the circumferential direction. In this case, the operator can easily identify the contact portion of the outer peripheral surface of the holding member with respect to the outer peripheral end portion of the substrate by visually recognizing the plurality of indices. Further, the operator can easily recognize the worn portion of the outer peripheral surface of the holding member by visually recognizing the plurality of indexes.
(2) The holding member may be detachably held by the movable member.
In this case, the holding member can be removed from the movable member without removing the movable member from the support member. Therefore, the operator can easily perform the replacement work of the holding member.
(3) The holding member has an end surface orthogonal to the outer peripheral surface, the movable member has a contact surface that contacts the end surface of the holding member, and the rotation prevention member contacts the end surface of the holding member. The holding member may be in a fixed state by pressing against the surface, and the holding member may be in a rotatable state by not pressing the end surface of the holding member against the contact surface of the movable member.
In this case, the holding member is in a fixed state when the end surface of the holding member is pressed against the contact surface of the movable member, and the holding member is in a rotatable state because the end surface of the holding member is not pressed against the contact surface of the movable member. Become. In this way, the fixed state and the rotatable state can be easily switched.
(4) A plurality of locking portions are provided on the end surface of the holding member along a circumference centered on the rotation center of the holding member, and the rotation prevention member is locked to the locking portion in a fixed state. A locked portion may be provided.
In this case, the locked portion of the rotation preventing member is locked to any one of the plurality of locking portions of the holding member in a fixed state. Thereby, in a fixed state, rotation of the holding member with respect to the movable member
Is definitely prevented.
(5) The holding member may be provided with a plurality of restraining surfaces symmetrically with respect to the rotation center of the holding member, and the movable member may be provided with a restrained surface that contacts the restraining surface when the holding member is fixed.
In this case, the restrained surface of the movable member comes into contact with any one of the plurality of restraining surfaces of the holding member in a fixed state. Thereby, in the fixed state, rotation of the holding member with respect to the movable member is reliably prevented.
(6) The substrate holding device may further include a rotation driving unit that rotates the support member around a rotation axis perpendicular to the main surface of the substrate.
In this case, the support member is rotated around the rotation axis by the rotation driving unit in a state where the movable member is in the holding state, whereby the substrate is rotated around the rotation axis while the outer peripheral end is held by the holding member. Is done.
(7) The support member may be disposed such that the rotation shaft extends in the vertical direction, the rotation drive unit may be provided on the upper side of the support member, and the holding member may be held by the movable member on the lower side of the support member. .
In this case, in a state where the movable member is in the holding state, the substrate is held by the holding member below the support member, and the substrate is rotated by the rotation driving unit located above the substrate. Thereby, a sufficient space is formed below the rotating substrate. Therefore, processing can be performed on the lower surface of the substrate.
(8) A substrate cleaning apparatus according to a second invention includes the substrate holding apparatus according to the first invention that holds a substrate, and a cleaning unit that performs a cleaning process on the substrate rotated by the substrate holding apparatus. is there.
In the substrate holding apparatus of the substrate cleaning apparatus, the holding member has a long life and the replacement cycle of the holding member becomes long. Therefore, since the stop time of the substrate cleaning apparatus can be sufficiently shortened, the operating rate of the substrate cleaning apparatus can be improved.
(9) A substrate processing apparatus according to a third invention includes the substrate holding apparatus according to the first invention for holding a substrate, and a processing means for performing a predetermined process on the substrate rotated by the substrate holding apparatus. It is.
In the substrate holding apparatus of this substrate processing apparatus, the holding member has a long life and the replacement cycle of the holding member becomes long. Therefore, since the stop time of the substrate processing apparatus can be sufficiently shortened, the operating rate of the substrate processing apparatus can be improved.
[B] Reference Mode (1) A substrate holding device according to a first reference mode is a substrate holding device that holds a substrate, and has a support member and an outer peripheral surface that can come into contact with the outer peripheral end of the substrate. The member and the holding member are held rotatably around an axis perpendicular to the main surface of the substrate, and the holding state in which the outer peripheral surface of the holding member abuts on the outer peripheral end of the substrate and the outer peripheral surface of the holding member are the outer periphery of the substrate A movable member provided on the support member so as to be able to shift to a released state separated from the end, a drive mechanism for moving the movable member to a holding state and a released state, and a fixed state that prevents rotation of the holding member with respect to the movable member; A rotation preventing member that can be switched to a rotatable state that allows rotation of the holding member relative to the movable member.

  In this substrate holding apparatus, the holding member is rotatably held around an axis perpendicular to the main surface of the substrate. The movable member is shifted between the holding state and the released state by the driving mechanism. In the holding state, the outer peripheral surface of the holding member contacts the outer peripheral end of the substrate, and in the open state, the outer peripheral surface of the holding member is separated from the outer peripheral end of the substrate.

  The rotation preventing member can be switched between a fixed state and a rotatable state. When the rotation blocking member is in a fixed state, the rotation of the holding member with respect to the movable member is blocked. In this state, the movable member is shifted to the holding state by the drive mechanism. As a result, a part of the outer peripheral surface of the holding member comes into contact with the outer peripheral end of the substrate, and the substrate is held.

  When the rotation preventing member is in a rotatable state, the holding member is allowed to rotate with respect to the movable member. When a part of the outer peripheral surface of the holding member is worn by contact with the outer peripheral end portion of the substrate, the operator contacts the outer peripheral end portion of the substrate by rotating the holding member by a desired angle with respect to the movable member. The part of the outer peripheral surface of the holding member can be changed. Thereafter, the operator can switch the rotation prevention member to the fixed state again.

  Therefore, even if a part of the outer peripheral surface of the holding member is worn by coming into contact with the outer peripheral end of the substrate, it is necessary to replace the holding member when other portions of the outer peripheral surface of the holding member are not worn. Disappear. As a result, the life of the holding member can be extended and the replacement cycle of the holding member can be extended.

  (2) A plurality of different indexes may be provided on the outer peripheral surface of the holding member so as to be aligned in the circumferential direction. In this case, the operator can easily identify the contact portion of the outer peripheral surface of the holding member with respect to the outer peripheral end portion of the substrate by visually recognizing the plurality of indices. Further, the operator can easily recognize the worn portion of the outer peripheral surface of the holding member by visually recognizing the plurality of indexes.

  (3) The holding member may be detachably held by the movable member.

  In this case, the holding member can be removed from the movable member without removing the movable member from the support member. Therefore, the operator can easily perform the replacement work of the holding member.

  (4) The holding member has an end surface orthogonal to the outer peripheral surface, the movable member has a contact surface that contacts the end surface of the holding member, and the rotation prevention member contacts the end surface of the holding member with the movable member. The holding member may be in a fixed state by pressing against the surface, and the holding member may be in a rotatable state by not pressing the end surface of the holding member against the contact surface of the movable member.

  In this case, the holding member is in a fixed state when the end surface of the holding member is pressed against the contact surface of the movable member, and the holding member is in a rotatable state because the end surface of the holding member is not pressed against the contact surface of the movable member. Become. In this way, the fixed state and the rotatable state can be easily switched.

  (5) A plurality of locking portions are provided on the end surface of the holding member along a circumference centering on the rotation center of the holding member, and the rotation prevention member is locked to the locking portion in a fixed state. A locked portion may be provided.

  In this case, the locked portion of the rotation preventing member is locked to any one of the plurality of locking portions of the holding member in a fixed state. Thereby, in the fixed state, rotation of the holding member with respect to the movable member is reliably prevented.

  (6) The holding member may be provided with a plurality of restraining surfaces symmetrically with respect to the rotation center of the holding member, and the movable member may be provided with a restrained surface that contacts the restraining surface when the holding member is fixed.

  In this case, the restrained surface of the movable member comes into contact with any one of the plurality of restraining surfaces of the holding member in a fixed state. Thereby, in the fixed state, rotation of the holding member with respect to the movable member is reliably prevented.

  (7) The substrate holding device may further include a rotation driving unit that rotates the support member around a rotation axis perpendicular to the main surface of the substrate.

  In this case, the support member is rotated around the rotation axis by the rotation driving unit in a state where the movable member is in the holding state, whereby the substrate is rotated around the rotation axis while the outer peripheral end is held by the holding member. Is done.

  (8) The support member may be arranged such that the rotation axis extends in the vertical direction, the rotation drive unit may be provided on the upper side of the support member, and the holding member may be held by the movable member on the lower side of the support member. .

  In this case, in a state where the movable member is in the holding state, the substrate is held by the holding member below the support member, and the substrate is rotated by the rotation driving unit located above the substrate. Thereby, a sufficient space is formed below the rotating substrate. Therefore, processing can be performed on the lower surface of the substrate.

(9) The substrate cleaning apparatus according to the second reference embodiment, with a substrate holding apparatus according to a first referential embodiment for holding a substrate, and a cleaning means for performing a cleaning process on the substrate rotated by the substrate holding device Is.

  In the substrate holding apparatus of the substrate cleaning apparatus, the holding member has a long life and the replacement cycle of the holding member becomes long. Therefore, since the stop time of the substrate cleaning apparatus can be sufficiently shortened, the operating rate of the substrate cleaning apparatus can be improved.

(10) A substrate processing apparatus according to the third reference embodiment, includes a substrate holding apparatus according to a first referential embodiment for holding a substrate, and processing means for performing predetermined processing on the substrate rotated by the substrate holding device It is a thing.

  In the substrate holding apparatus of this substrate processing apparatus, the holding member has a long life and the replacement cycle of the holding member becomes long. Therefore, since the stop time of the substrate processing apparatus can be sufficiently shortened, the operating rate of the substrate processing apparatus can be improved.

  According to the present invention, the life of the holding member can be extended.

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. It is one schematic side view of the substrate processing apparatus of FIG. It is the other schematic side view of the substrate processing apparatus of FIG. It is a schematic side view of the interface block seen from the position of the exposure apparatus of FIG. It is a side view which shows the structure of a back surface cleaning process unit. It is a schematic plan view which shows the structure of a back surface cleaning process unit. It is an external appearance perspective view of a substrate holding mechanism. It is a disassembled perspective view of a substrate holding mechanism. It is a disassembled perspective view for demonstrating the connection relation of each member in a support part. It is a figure for demonstrating the detail of the rotation member of FIG. It is a figure for demonstrating the detail of the connection member of FIG. It is a figure for demonstrating the detail of the pin fixing member of FIG. It is a figure for demonstrating the detail of the holding pin of FIG. It is a disassembled perspective view for demonstrating the connection relation of each member in a axial part. It is sectional drawing for demonstrating the connection relation of each member in a axial part. It is an external appearance perspective view which shows the attachment state of the magnet of FIG. It is a bottom view of a substrate holding mechanism. It is a longitudinal cross-sectional view which shows the structure of the fluid supply pipe | tube of FIG. (A) is an enlarged vertical sectional view showing the structure in the vicinity of the tip of the fluid supply pipe in FIG. 5, and (b) is a plan view of the tip of the fluid supply pipe as seen from the arrow of (a). It is a figure for demonstrating holding | maintenance operation | movement of the board | substrate by a spin chuck. It is a figure for demonstrating holding | maintenance operation | movement of the board | substrate by a spin chuck. It is a side view for demonstrating the back surface cleaning process of a board | substrate. It is a side view for demonstrating the back surface cleaning process of a board | substrate. It is a figure for demonstrating the other structural example of a holding pin. FIG. 25 is a partially enlarged cross-sectional view of a substrate holding mechanism using the holding pins of FIG. 24. It is a figure for demonstrating the further another structural example of a holding pin. FIG. 27 is a bottom view of a substrate holding mechanism using the holding pins of FIG. 26.

  Hereinafter, a substrate holding device, a substrate cleaning device, and a substrate processing device concerning an embodiment of the invention are explained using a drawing. In the following description, the substrate refers to a semiconductor substrate, a liquid crystal display substrate, a plasma display substrate, a photomask glass substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, and the like. Say. In this embodiment, as an example of a substrate cleaning apparatus and a substrate processing apparatus, a back surface cleaning processing unit that performs a cleaning process on the back surface of a substrate before exposure processing will be described. The back surface cleaning processing unit includes a spin chuck described later as an example of a substrate holding device.

(1) Configuration of Substrate Processing Apparatus FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. In addition, in FIG. 1 and FIGS. 2 to 4 to be described later, in order to clarify the positional relationship, arrows indicating the X direction, the Y direction, and the Z direction orthogonal to each other are attached. The X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction.

  As shown in FIG. 1, the substrate processing apparatus 500 includes an indexer block 9, an antireflection film processing block 10, a resist film processing block 11, a development processing block 12, and an interface block 15. An exposure device 16 is arranged adjacent to the interface block 15. In the exposure apparatus 16, the substrate W is subjected to an exposure process by a liquid immersion method.

  The indexer block 9 includes a main controller (control unit) 30, a plurality of carrier mounting tables 40, and an indexer robot IR. The main controller 30 controls the operations of the indexer block 9, the antireflection film processing block 10, the resist film processing block 11, the development processing block 12, and the interface block 15. The indexer robot IR is provided with a hand IRH for delivering the substrate W.

  The antireflection film processing block 10 includes antireflection film heat treatment units 100 and 101, an antireflection film application processing unit 50, and a first central robot CR1. The antireflection film coating processing unit 50 is provided opposite to the antireflection film heat treatment units 100 and 101 with the first central robot CR1 interposed therebetween. The first center robot CR1 is provided with hands CRH1 and CRH2 for transferring the substrate W up and down.

  A partition wall 17 is provided between the indexer block 9 and the antireflection film processing block 10 for shielding the atmosphere. In the partition wall 17, substrate platforms PASS 1 and PASS 2 for transferring the substrate W between the indexer block 9 and the anti-reflection film processing block 10 are provided close to each other in the vertical direction. The upper substrate platform PASS1 is used when transporting the substrate W from the indexer block 9 to the antireflection film processing block 10, and the lower substrate platform PASS2 is used to transport the substrate W to the antireflection film processing block. It is used when transporting from 10 to the indexer block 9.

  The substrate platforms PASS1, PASS2 are provided with optical sensors (not shown) that detect the presence or absence of the substrate W. Thereby, it is possible to determine whether or not the substrate W is placed on the substrate platforms PASS1 and PASS2. The substrate platforms PASS1, PASS2 are provided with a plurality of support pins fixedly installed. The optical sensor and the support pin are also provided in the same manner on the substrate platforms PASS3 to PASS9 described later.

  The resist film processing block 11 includes resist film heat treatment units 110 and 111, a resist film coating processing unit 60, and a second central robot CR2. The resist film application processing unit 60 is provided to face the resist film heat treatment units 110 and 111 with the second central robot CR2 interposed therebetween. The second center robot CR2 is provided with hands CRH3 and CRH4 for transferring the substrate W up and down.

  A partition wall 18 is provided between the antireflection film processing block 10 and the resist film processing block 11 for shielding the atmosphere. The partition wall 18 is provided with substrate platforms PASS3 and PASS4 that are close to each other in the vertical direction for transferring the substrate W between the anti-reflection film processing block 10 and the resist film processing block 11. The upper substrate platform PASS3 is used when the substrate W is transported from the antireflection film processing block 10 to the resist film processing block 11, and the lower substrate platform PASS4 is used to transfer the substrate W to the resist film. It is used when transporting from the processing block 11 to the processing block 10 for antireflection film.

  The development processing block 12 includes a development heat treatment section 120, a post-exposure bake heat treatment section 121, a development processing section 70, and a third central robot CR3. The post-exposure bake heat treatment unit 121 is adjacent to the interface block 15 and includes substrate platforms PASS7 and PASS8 as described later. The development processing unit 70 is provided opposite to the development heat treatment unit 120 and the post-exposure bake heat treatment unit 121 with the third central robot CR3 interposed therebetween. The third center robot CR3 is provided with hands CRH5 and CRH6 for transferring the substrate W up and down.

  A partition wall 19 is provided between the resist film processing block 11 and the development processing block 12 for shielding the atmosphere. In the partition wall 19, substrate platforms PASS 5 and PASS 6 for transferring the substrate W between the resist film processing block 11 and the development processing block 12 are provided close to each other in the vertical direction. The upper substrate platform PASS5 is used when the substrate W is transported from the resist film processing block 11 to the development processing block 12, and the lower substrate platform PASS6 is used to transfer the substrate W from the development processing block 12 to the resist processing block 12. Used when transported to the film processing block 11.

The interface block 15 includes a feed buffer unit SBF, a back surface cleaning unit BC, a fourth central robot CR4, an edge exposure unit EEW, a return buffer unit RBF, a placement / cooling unit PASS-CP (hereinafter abbreviated as P-CP). ), A substrate platform PASS9, and an interface transport mechanism IFR. The back surface cleaning unit BC performs a back surface cleaning process (hereinafter referred to as a back surface cleaning process) of the substrate W before the exposure process. Here, the upper surface of the substrate W refers to the surface of the substrate W directed upward, and the lower surface of the substrate W refers to the surface of the substrate W directed downward. Further, the surface of the substrate W refers to the surface (main surface) on which the antireflection film and the resist film are formed in the antireflection film processing block 10 and the resist film processing block 11, and the back surface of the substrate W refers to the surface of the substrate W. The opposite side. The back surface cleaning processing unit BC includes an end surface holding type spin chuck 600 (FIG. 5 to be described later) that holds the outer peripheral edge of the substrate. Spin chuck 600 (FIG. 5 to be described later) is, obtain Bei a plurality of holding pins 710 (FIG. 5 described later). In a state where the substrate W is held by the spin chuck 600, a part of each holding pin 710 comes into contact with the outer peripheral end of the substrate W. The contact portion of the holding pin 710 with the outer peripheral end of the substrate W is easily changed from one part of the holding pin 710 to another part. Details of the back surface cleaning unit BC will be described later.

  The fourth central robot CR4 is provided with hands CRH7 and CRH8 (FIG. 4) for delivering the substrate W up and down, and the interface transport mechanism IFR has hands H1 and H1 for delivering the substrate W. H2 (FIG. 4) is provided above and below. Details of the interface block 15 will be described later.

  In the substrate processing apparatus 500 according to the present embodiment, an indexer block 9, an antireflection film processing block 10, a resist film processing block 11, a development processing block 12, and an interface block 15 are arranged side by side along the Y direction. ing.

  2 is a schematic side view of one side of the substrate processing apparatus 500 of FIG. 1, and FIG. 3 is a schematic side view of the other side of the substrate processing apparatus 500 of FIG. In FIG. 2, what is provided on one side of the substrate processing apparatus 500 is mainly shown, and in FIG. 3, what is provided on the other side of the substrate processing apparatus 500 is mainly shown.

  First, the configuration of the substrate processing apparatus 500 will be described with reference to FIG. As shown in FIG. 2, in the antireflection film coating processing unit 50 (FIG. 1) of the antireflection film processing block 10, three coating units BARC are vertically stacked. Each coating unit BARC includes a spin chuck 51 that rotates while adsorbing and holding the substrate W in a horizontal posture, and a supply nozzle 52 that supplies a coating liquid for an antireflection film to the substrate W held on the spin chuck 51.

  In the resist film coating processing section 60 (FIG. 1) of the resist film processing block 11, three coating units RES are stacked in a vertical direction. Each coating unit RES includes a spin chuck 61 that rotates while adsorbing and holding the substrate W in a horizontal posture, and a supply nozzle 62 that supplies a coating liquid for a resist film to the substrate W held on the spin chuck 61.

  In the development processing unit 70 (FIG. 1) of the development processing block 12, five development processing units DEV are stacked one above the other. Each development processing unit DEV includes a spin chuck 71 that rotates by sucking and holding the substrate W in a horizontal posture, and a supply nozzle 72 that supplies the developer to the substrate W held on the spin chuck 71.

  An edge exposure unit EEW is disposed on one side of the interface block 15. The edge exposure unit EEW includes a spin chuck 98 that rotates by attracting and holding the substrate W in a horizontal posture, and a light irradiator 99 that exposes the periphery of the substrate W held on the spin chuck 98.

  Next, the configuration of the substrate processing apparatus 500 will be described with reference to FIG. As shown in FIG. 3, two heating units (hot plates) HP and two cooling units (cooling plates) CP are provided in the antireflection film heat treatment units 100 and 101 of the antireflection film processing block 10, respectively. Laminated. In addition, in the antireflection film heat treatment units 100 and 101, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are respectively arranged at the top.

  Two heating units HP and two cooling units CP are stacked in the resist film heat treatment sections 110 and 111 of the resist film processing block 11, respectively. In addition, in the resist film heat treatment units 110 and 111, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are respectively arranged at the top.

  The development heat treatment section 120 of the development processing block 12 includes two heating units HP and two cooling units CP stacked, and the post-exposure baking heat treatment section 121 includes two heating units HP, The cooling unit CP and the substrate platforms PASS7 and PASS8 are stacked one above the other. In addition, in the development heat treatment section 120 and the post-exposure bake heat treatment section 121, local controllers LC for controlling the temperatures of the heating unit HP and the cooling unit CP are arranged at the top.

  Next, the interface block 15 will be described in detail with reference to FIG.

  FIG. 4 is a schematic side view of the interface block 15 as viewed from the position of the exposure apparatus 16 in FIG. As shown in FIG. 4, in the interface block 15, the sending buffer unit SBF and the three back surface cleaning processing units BC are stacked on one side. In the interface block 15, an edge exposure unit EEW is disposed on the other side.

  Below the edge exposure unit EEW, a return buffer unit RBF, two placement / cooling units P-CP, and a substrate platform PASS9 are stacked in a vertical direction at a substantially central portion in the interface block 15.

  In the lower part of the interface block 15, a fourth center robot CR4 and an interface transport mechanism IFR are provided. The fourth central robot CR4 moves in the vertical direction among the feed buffer unit SBF, the back surface cleaning unit BC, the edge exposure unit EEW, the return buffer unit RBF, the placement / cooling unit P-CP, and the substrate platform PASS9. It is possible and rotatable. The interface transport mechanism IFR is provided so as to be movable in the vertical direction and rotatable between the return buffer unit RBF, the placement / cooling unit P-CP, and the substrate platform PASS9.

(2) Operation of Substrate Processing Apparatus Next, the operation of the substrate processing apparatus 500 according to the present embodiment will be described with reference to FIGS.

(2-1) Operation from the indexer block to the development processing block First, the operation from the indexer block 9 to the development processing block 12 will be briefly described.

  On the carrier mounting table 40 of the indexer block 9, a carrier C that stores a plurality of substrates W in multiple stages is loaded. The indexer robot IR takes out the unprocessed substrate W stored in the carrier C using the hand IRH. Thereafter, the indexer robot IR moves in the X direction and rotates around an axis parallel to the Z direction, and places the unprocessed substrate W on the substrate platform PASS1.

  The unprocessed substrate W placed on the substrate platform PASS1 is received by the first central robot CR1 of the antireflection film processing block 10. The first center robot CR1 carries the substrate W into the antireflection film heat treatment units 100 and 101.

  Thereafter, the first central robot CR1 takes out the heat-treated substrate W from the antireflection film heat treatment units 100 and 101, and carries the substrate W into the antireflection film application processing unit 50. In the antireflection film coating processing unit 50, an antireflection film is applied and formed on the substrate W by the coating unit BARC in order to reduce standing waves and halation generated during exposure.

  Next, the first central robot CR1 takes out the coated substrate W from the antireflection film coating processing unit 50, and carries the substrate W into the antireflection film heat treatment units 100 and 101. Thereafter, the first central robot CR1 takes out the heat-treated substrate W from the antireflection film heat treatment units 100 and 101, and places the substrate W on the substrate platform PASS3.

  The substrate W placed on the substrate platform PASS3 is received by the second central robot CR2 of the resist film processing block 11. The second central robot CR2 carries the substrate W into the resist film heat treatment units 110 and 111.

  Thereafter, the second central robot CR2 takes out the heat-treated substrate W from the resist film heat treatment units 110 and 111, and carries the substrate W into the resist film coating treatment unit 60. In the resist film application processing unit 60, a resist film is applied and formed on the substrate W on which the antireflection film is applied and formed by the application unit RES.

  Next, the second central robot CR2 takes out the coated substrate W from the resist film coating processing unit 60, and carries the substrate W into the resist film heat treatment units 110 and 111. Thereafter, the second central robot CR2 takes out the heat-treated substrate W from the resist film heat treatment units 110 and 111, and places the substrate W on the substrate platform PASS5.

  The substrate W placed on the substrate platform PASS5 is received by the third central robot CR3 of the development processing block 12. The third central robot CR3 places the substrate W on the substrate platform PASS7.

  The substrate W placed on the substrate platform PASS7 is received by the fourth central robot CR4 of the interface block 15, and predetermined processing is performed in the interface block 15 and the exposure device 16, as will be described later. After predetermined processing is performed on the substrate W in the interface block 15 and the exposure apparatus 16, the substrate W is carried into the post-exposure bake heat treatment part 121 of the development processing block 12 by the fourth central robot CR4.

  In the post-exposure baking heat treatment part 121, post-exposure baking (PEB) is performed on the substrate W. Thereafter, the fourth central robot CR4 takes out the substrate W from the post-exposure bake heat treatment unit 121 and places the substrate W on the substrate platform PASS8.

  The substrate W placed on the substrate platform PASS8 is received by the third central robot CR3 of the development processing block 12. The third central robot CR3 carries the substrate W into the development processing unit 70. In the development processing unit 70, development processing is performed on the exposed substrate W.

  Next, the third central robot CR3 takes out the development-processed substrate W from the development processing unit 70, and carries the substrate W into the development heat treatment unit 120. Thereafter, the third central robot CR3 takes out the substrate W after the heat treatment from the development heat treatment unit 120 and places the substrate W on the substrate platform PASS6.

  The substrate W placed on the substrate platform PASS6 is placed on the substrate platform PASS4 by the second central robot CR2 of the resist film processing block 11. The substrate W placed on the substrate platform PASS4 is placed on the substrate platform PASS2 by the first central robot CR1 of the anti-reflection film processing block 10.

  The substrate W placed on the substrate platform PASS 2 is stored in the carrier C by the indexer robot IR of the indexer block 9. Thereby, each process of the board | substrate W in the substrate processing apparatus 500 is complete | finished.

(2-2) Operation of Interface Block Next, the operation of the interface block 15 will be described in detail.

  As described above, the substrate W carried into the indexer block 9 is subjected to a predetermined process and then placed on the substrate platform PASS7 of the development processing block 12 (FIG. 1).

  The substrate W placed on the substrate platform PASS7 is received by the fourth central robot CR4 of the interface block 15. The fourth central robot CR4 carries the substrate W into the edge exposure unit EEW (FIG. 4). In the edge exposure unit EEW, the peripheral portion of the substrate W is subjected to exposure processing.

  Next, the fourth central robot CR4 takes out the edge-exposed substrate W from the edge exposure unit EEW and carries the substrate W into one of the back surface cleaning processing units BC. In the back surface cleaning processing unit BC, as described above, the back surface cleaning processing is performed on the substrate W before the exposure processing.

  Here, the time of the exposure process by the exposure apparatus 16 is usually longer than the other process steps and the transport step. As a result, the exposure apparatus 16 often cannot accept a subsequent substrate W. In this case, the substrate W is temporarily stored in the sending buffer unit SBF (FIG. 4). In the present embodiment, the fourth central robot CR4 takes out the substrate W that has been subjected to the back surface cleaning processing from the back surface cleaning processing unit BC, and transports the substrate W to the sending buffer unit SBF.

  Next, the fourth central robot CR4 takes out the substrate W stored and stored in the sending buffer unit SBF, and carries the substrate W into the placement / cooling unit P-CP. The substrate W carried into the placement / cooling unit P-CP is maintained at the same temperature (for example, 23 ° C.) as that in the exposure apparatus 16.

  If the exposure apparatus 16 has a sufficient processing speed, the substrate W is transferred from the back surface cleaning processing unit BC to the placement / cooling unit P-CP without storing and storing the substrate W in the sending buffer unit SBF. May be.

  Subsequently, the substrate W maintained at the predetermined temperature by the placement / cooling unit P-CP is received by the upper hand H1 (FIG. 4) of the interface transport mechanism IFR, and the substrate carry-in section 16a in the exposure apparatus 16 is received. (FIG. 1).

  The substrate W that has been subjected to the exposure processing in the exposure device 16 is unloaded from the substrate unloading portion 16b (FIG. 1) by the interface transport mechanism IFR. The interface transport mechanism IFR places the substrate W on the substrate platform PASS9.

  The substrate W placed on the substrate platform PASS9 is received by the fourth central robot CR4. The fourth central robot CR4 transports the substrate W to the post-exposure bake heat treatment part 121 of the development processing block 12 (FIG. 1).

  If the development processing block 12 cannot temporarily accept the substrate W due to a failure of the development processing unit DEV (FIG. 2) or the like, the substrate W after the exposure processing is temporarily stored and stored in the return buffer unit RBF. be able to.

(3) Back surface cleaning unit Next, the back surface cleaning unit BC will be described in detail with reference to the drawings. 5 and 6 are a side view and a schematic plan view showing the configuration of the back surface cleaning processing unit BC. FIG. 6 schematically shows some components of the back surface cleaning unit BC.

  In the present embodiment, the back surface cleaning processing unit BC includes a housing (not shown), and the following components are provided inside the housing.

  As shown in FIGS. 5 and 6, the back surface cleaning processing unit BC includes a spin chuck 600 that holds and rotates the substrate W horizontally. The spin chuck 600 includes a spin motor 200, a rotating shaft 210, a disc-shaped spin plate 520, a plate support member 510, a disc-shaped blocking plate 525, magnet plates 614a and 614b, and a plurality of substrate holding mechanisms 700.

  A spin motor 200 is provided above the back surface cleaning processing unit BC. The spin motor 200 is supported by a motor support member 200s. The motor support member 200 s has a through hole 200 h extending in the vertical direction, and is attached to the motor fixing portion 290. The motor fixing part 290 is attached to the housing of the back surface cleaning processing unit BC (not shown).

  A rotating shaft 210 having a cylindrical shape is provided so as to extend downward from the inside of the spin motor 200. The rotating shaft 210 functions as an output shaft of the spin motor 200.

  A plate support member 510 is attached to the lower end of the rotating shaft 210. As will be described later, the plate support member 510 has a cylindrical shape. The spin plate 520 is supported horizontally by the plate support member 510. A blocking plate 525 is horizontally fixed to the lower surfaces of the plate support member 510 and the spin plate 520 by fixing members 525a and 525b. A through hole 525 h is formed at the center of the blocking plate 525. As the rotation shaft 210 is rotated by the spin motor 200, the plate support member 510, the spin plate 520, and the blocking plate 525 rotate integrally around the vertical axis.

  A fluid supply pipe 400 is inserted through the through hole 200h of the motor support member 200s, the rotation shaft 210 of the spin motor 200, and the plate support member 510. A gas can be supplied through the fluid supply pipe 400 onto the substrate W held by the spin chuck 600. Details of the structure of the fluid supply pipe 400 and its peripheral members will be described later.

  A plurality (five in FIG. 6) of substrate holding mechanisms 700 are provided at equiangular intervals with respect to the rotation shaft 210 at the peripheral edge of the spin plate 520. The number of substrate holding mechanisms 700 is desirably five or more. The reason will be described later.

  Each substrate holding mechanism 700 mainly includes a holding pin 710, a support portion 720, a shaft portion 730, and a magnet 790. A support portion 720 is provided on the spin plate 520. The shaft portion 730 is rotatably supported inside the support portion 720. A holding pin 710 having a substantially cylindrical shape is attached to the lower end portion of the shaft portion 730. A magnet 790 is attached to the upper end portion of the shaft portion 730.

  Each substrate holding mechanism 700 can be switched between a closed state in which the holding pins 710 are in contact with the outer peripheral end portion of the substrate W and an open state in which the holding pins 710 are separated from the outer peripheral end portion of the substrate W. In this example, each substrate holding mechanism 700 is closed when the N pole of the magnet 790 is inside, and each substrate holding mechanism 700 is opened when the S pole of the magnet 790 is inside. Details of the structure of the substrate holding mechanism 700 will be described later. In FIG. 6, the support part 720 and the magnet 790 are not shown in order to clarify the positional relationship between the holding pin 710 and the shaft part 730 in the substrate holding mechanism 700.

  As shown in FIG. 5, magnet plates 614 a and 614 b are arranged above the spin plate 520 along the circumferential direction around the rotation shaft 210. The magnet plates 614a and 614b have an S pole on the outside and an N pole on the inside. The magnet plates 614a and 614b are lifted and lowered independently by the magnet lifting and lowering mechanisms 617a and 617b, respectively. Move between.

  Each substrate holding mechanism 700 is switched between an open state and a closed state by raising and lowering the magnet plates 614a and 614b. Details of operations of the magnet plates 614a and 614b and the substrate holding mechanism 700 will be described later.

  A guard 618 is provided outside the spin chuck 600 to receive the cleaning liquid scattered from the substrate W. The guard 618 has a rotationally symmetric shape with respect to the rotation axis 210 of the spin chuck 600. Further, the guard 618 is moved up and down by a guard lifting mechanism 618a. The cleaning liquid received by the guard 618 is drained or collected by a draining device or a collecting device (not shown).

  Outside the guard 618, three or more (three in this example) substrate transfer mechanisms 620 are arranged at equiangular intervals around the rotation shaft 210 of the spin chuck 600. Each substrate transfer mechanism 620 includes a lifting / lowering rotation drive unit 621, a rotation shaft 622, an arm 623, and a holding pin 624. A rotation shaft 622 is provided so as to extend upward from the ascending / descending rotation driving unit 621, and an arm 623 is connected so as to extend in the horizontal direction from the upper end of the rotation shaft 622. A holding pin 624 for holding the outer peripheral end of the substrate W is provided at the tip of the arm 623.

  The rotating shaft 622 performs a lifting / lowering operation and a rotating operation by the lifting / lowering driving unit 621. Thereby, the holding pin 624 moves in the horizontal direction and the vertical direction.

  A substantially cylindrical cleaning brush 630 is disposed below the back surface cleaning processing unit BC. The cleaning brush 630 is attached to the rotating shaft of the motor 635 and is driven to rotate around the vertical axis. The motor 635 is held by a brush holding member 631. The brush holding member 631 is driven by the brush moving mechanism 632. Accordingly, the cleaning brush 630 moves in the horizontal direction and the vertical direction.

  A cleaning nozzle 633 is attached to a portion of the brush holding member 631 in the vicinity of the cleaning brush 630. A liquid supply pipe (not shown) to which a cleaning liquid is supplied is connected to the cleaning nozzle 633. The discharge port of the cleaning nozzle 633 is directed to the periphery of the cleaning brush 630, and the cleaning liquid is discharged from the discharge port toward the periphery of the cleaning brush 630. In this example, pure water is used as the cleaning water.

(4) Details of Substrate Holding Mechanism Details of the substrate holding mechanism 700 will be described. FIG. 7 is an external perspective view of the substrate holding mechanism 700, and FIG. 8 is an exploded perspective view of the substrate holding mechanism 700. In FIG. 8, the illustration of the magnet 790 is omitted.

  As shown in FIG. 7, the substrate holding mechanism 700 mainly includes a holding pin 710, a support part 720, a shaft part 730, and a magnet 790. As shown in FIG. 8, the support part 720 includes a rotation restricting member 720a, a shaft support member 720b, and two bearings 720c. The shaft portion 730 includes a rotating member 730a, a connecting member 730b, and a pin fixing member 730c.

  A plurality of members constituting the support portion 720 and the shaft portion 730 are connected to each other by a plurality of screws N1 to N5 (FIG. 8 and FIG. 17 described later), and are attached to the peripheral portion of the spin plate 520 as shown in FIG. It is done.

(4-1) Connection Relationship of Each Member in Support Unit FIG. 9 is an exploded perspective view for explaining the connection relationship of each member in the support unit 720. As shown in FIG. 9, the rotation restricting member 720 a includes a screw receiving portion 721 and a flange portion 722. A through hole 721 h extending in the vertical direction so as to pass through the center of the screw receiving portion 721 is formed. The inner diameter of the through hole 721h is slightly larger than the outer diameter of the large-diameter portion 732 (FIG. 10 described later) of the rotating member 730a described later.

  The screw receiving portion 721 has an outer peripheral wall 721a. The upper end portion of the screw receiving portion 721 is open. Two upper surfaces 721b and 721c having a substantially fan shape are formed inside the outer peripheral wall 721a so as to surround the through hole 721h.

  One upper surface 721b is formed in a predetermined angular range with respect to the central axis of the screw receiving portion 721, and the other upper surface 721c is formed in an angular range excluding one upper surface 721b. In the vertical direction, the position of one upper surface 721b is higher than the position of the other upper surface 721c. Therefore, two rotation restricting surfaces 721d parallel to the vertical direction are formed between the two upper surfaces 721b and 721c.

  The flange portion 722 is formed so as to protrude outward by a predetermined length from substantially the entire circumference of the lower end portion of the screw receiving portion 721. Two through holes 722 a extending in the vertical direction are formed in the flange portion 722. In addition, two recesses 722 b are formed in the flange portion 722.

  The shaft support member 720b includes a first tubular portion 724, a flange portion 725, and a second tubular portion 726. The central axes of the first cylindrical portion 724 and the second cylindrical portion 726 are aligned with each other, and the internal spaces of the first cylindrical portion 724 and the second cylindrical portion 726 are in communication with each other.

  Two bearings 720c having a cylindrical shape are inserted into the first cylindrical portion 724 in a state of being aligned in the vertical direction. The inner diameters of the two bearings 720c are slightly smaller than the outer diameter of the large diameter portion 732 (FIG. 10 described later) of the rotating member 730a described later.

  In the 2nd cylindrical part 726, the outer wall 726a and the inner wall 726b which have a cylindrical shape are formed in double. Thereby, an annular space is formed between the outer wall 726a and the inner wall 726b.

  An annular step surface 726s (FIG. 15 described later) is formed inside the shaft support member 720b. The lower end of the lower bearing 720c of the two bearings 720c is supported by an annular step surface 726s (FIG. 15 described later).

  In the peripheral portion of the spin plate 520, one through hole 521 and two screw holes 522 are formed in advance corresponding to one substrate holding mechanism 700. The outer diameter of the outer wall 726a of the second cylindrical portion 726 is slightly smaller than the inner diameter of the through hole 521 of the spin plate 520.

  The second cylindrical portion 726 of the shaft support member 720b is fitted into the through hole 521 of the spin plate 520. The shaft support member 720b is positioned so that the two through holes 725b of the shaft support member 720b are positioned on the two screw holes 522 of the spin plate 520, respectively. The shaft support member 720b is fixed on the spin plate 520 by attaching the two screws N4 to the two screw holes 522 through the two through holes 725b.

  A rotation restricting member 720a is attached on the shaft support member 720b. The rotation restricting member 720a is positioned so that the two through holes 722a of the rotation restricting member 720a are positioned on the two screw holes 725a of the shaft support member 720b, respectively. In this case, the heads of the two screws N4 are respectively located in the two recesses 722b of the rotation restricting member 720a.

  Two screws N3 are respectively attached to the two screw holes 725a through the two through holes 722a. In this way, the rotation restricting member 720a and the shaft support member 720b are connected.

(4-2) Shaft Part FIG. 10 is a view for explaining details of the rotating member 730a of FIG. 10A shows a top view of the rotating member 730a, FIG. 10B shows one side view of the rotating member 730a, and FIG. 10C shows a bottom view of the rotating member 730a. 10 (d) shows the other side view of the rotating member 730a.

  As shown in FIGS. 10A to 10D, the rotating member 730 a includes a disc portion 731, a large diameter portion 732, and a small diameter portion 733. The disc portion 731 has an upper surface and a lower surface, and has a predetermined thickness. A through hole 731 h is formed in the center of the disc portion 731. Further, in the disc portion 731, one screw hole 731 a and two screw holes 731 b are formed so as to surround the through hole 731 h. The inner diameter of one screw hole 731a is larger than the inner diameters of the other two screw holes 731b.

  The large diameter portion 732 and the small diameter portion 733 have a hollow shaft structure. The inner diameter of the small diameter portion 733 is constant, and is smaller than the inner diameter of the through hole 731h of the disc portion 731.

  In the large diameter portion 732, the inner diameter of the portion from the vertical center to the disk portion 731 is equal to the inner diameter of the through hole 731 h of the disk portion 731, and the inner diameter of the portion from the vertical center to the small diameter portion 733 is the diameter. It is equal to the inner diameter of the small portion 733. Thereby, an annular step surface 732c parallel to the horizontal direction is formed at the center in the vertical direction inside the large-diameter portion 732 (FIG. 15 described later).

  The outer peripheral surface in the vicinity of the lower end of the small-diameter portion 733 has two flat portions 733k at symmetrical positions with respect to the central axis of the small-diameter portion 733. The two flat portions 733k are each formed by cutting out part of the outer peripheral surface of the small diameter portion 733. The two flat portions 733k are parallel to each other.

  FIG. 11 is a diagram for explaining the details of the connecting member 730b of FIG. 11A shows a top view of the connecting member 730b, FIG. 11B shows a side view of the connecting member 730b, and FIG. 11C shows a bottom view of the connecting member 730b.

  As shown in FIGS. 11A to 11C, the connecting member 730b includes a connecting main body portion 734 having a substantially disk shape. A through hole 734 h is formed in the central portion of the connection main body portion 734. The connection main body 734 has an upper surface 734a and first, second, and third lower surfaces 734b, 734c, and 734d. The position of the first lower surface 734b is higher than the position of the second lower surface 734c, and the position of the second lower surface 734c is higher than the position of the third lower surface 734d.

  On the upper surface 734a side of the connection main body 734, a cylindrical protrusion 735a and two shaft connection protrusions 735b are provided. The cylindrical projecting portion 735a is formed over the entire outer periphery of the connection main body portion 734 so as to protrude upward from the upper surface 734a of the connection main body portion 734.

  The two shaft connection protrusions 735b are formed so as to protrude upward from the upper surface 734a of the connection main body 734 across the through hole 734h inside the cylindrical protrusion 735a. The two shaft coupling protrusions 735b each have a plane (hereinafter referred to as a facing surface) and an arcuate curved surface that face each other in parallel.

  The distance between the two opposing surfaces of the two shaft coupling protrusions 735b is substantially equal to the distance between the two flat portions 733k of the rotating member 730a in FIG. Thereby, at the time of assembling the substrate holding mechanism 700, the distal end portion of the rotating member 730a is disposed between the two opposing surfaces of the two shaft coupling protrusions 735b.

  A first space 734p is formed below the first lower surface 734b. The outer shape of the first lower surface 734b is substantially equal to the outer shape of the fixing portion 736 of the pin fixing member 730c of FIG. At the time of assembling the substrate holding mechanism 700, a fixing portion 736 shown in FIG. 12, which will be described later, is arranged in the first space 734p.

  A second space 734q is formed below the second lower surface 734c. A part of the outer shape of the second lower surface 734b is substantially equal to a part of the outer shape of the disk portion 711 of the holding pin 710 in FIG. At the time of assembling the substrate holding mechanism 700, a part of a disc portion 711 shown in FIG. 13 to be described later is disposed in the second space 734q.

  FIG. 12 is a diagram for explaining details of the pin fixing member 730c of FIG. 12A shows a top view of the pin fixing member 730c, FIG. 12B shows a side view of the pin fixing member 730c, and FIG. 12C shows a bottom view of the pin fixing member 730c. FIG. 12D shows the other side view of the pin fixing member 730c.

  As shown in FIGS. 12A to 12D, the pin fixing member 730c includes a fixing portion 736, a relay portion 737, and a support portion 738. The fixing portion 736 has a disk shape. A screw hole 736 h is formed in one semicircular portion of the fixing portion 736. A relay portion 737 is provided on the lower surface of the other semicircular portion of the fixing portion 736. The relay part 737 has a semicircular disk shape. A support portion 738 is provided on the lower surface of the relay portion 737.

  The support portion 738 includes a support main body portion 738x and two pin support arms 738a. The support main body portion 738x has a plate shape extending in one direction. Two pin support arms 738a are formed to bend from both ends of the support body 738x. The two pin support arms 738a are curved from both ends of the support portion 738 to the respective tip portions. The tip portions of the two pin support arms 738a are separated from each other. A space 738b for arranging the holding pin 710 of FIG. 8 is formed between the two pin support arms 738a.

(4-3) Holding Pin FIG. 13 is a diagram for explaining the details of the holding pin 710 in FIG. 8. FIG. 13A shows a top view of the holding pin 710. FIGS. 13B to 13E show side views of the holding pin 710 viewed from directions D1 to D4 that are different by 90 degrees. FIG. 13 (f) shows a cross-sectional view taken along line E1-E1 of FIG. 13 (b).

  As shown in FIGS. 13A to 13E, the holding pin 710 includes a disk portion 711 and a pin body portion 712. The pin main body 712 has a substantially cylindrical shape. A disc portion 711 is provided at the upper end portion of the pin main body portion 712. The central axis of the disc part 711 and the central axis of the pin main body part 712 coincide with each other. The outer diameter of the disc part 711 is larger than the outer diameter of the pin body part 712.

  A substrate contact portion 713 is formed in the vicinity of the lower end portion of the pin main body portion 712. The outer diameter of the substrate contact portion 713 is smaller than the outer diameter of other portions of the pin main body portion 712. When the substrate W is held by the plurality of substrate holding mechanisms 700, the substrate contact portions 713 of the plurality of holding pins 710 come into contact with the outer peripheral end portion of the substrate W.

  As shown in FIGS. 13C and 13F, one flat portion 714 is formed on the side surface of the holding pin 710 viewed from the direction D2. As shown in FIGS. 13D and 13F, two flat portions 714 are formed on the side surface of the holding pin 710 viewed from the direction D3. As shown in FIGS. 13E and 13F, three flat portions 714 are formed on the side surface of the holding pin 710 viewed from the direction D4. As shown in FIGS. 13B and 13F, the flat portion 714 is not formed on the side surface of the holding pin 710 viewed from the direction D1. These flat portions 714 are provided to identify the positions of the holding pins 710 in the circumferential direction.

(4-4) Connection Relationship of Each Member in Shaft Part FIG. 14 is an exploded perspective view for explaining the connection relation of each member in the shaft part 730, and FIG. 15 explains the connection relation of each member in the shaft part 730. It is sectional drawing for doing.

  As shown in FIGS. 14 and 15, the screw N1 of FIG. 8 is inserted into the rotating member 730a. The tip of the screw N1 protrudes from the tip of the small diameter portion 733 of the rotating member 730a by a predetermined length. Further, the screw N2 is attached to the screw hole 731a (FIG. 10) of the rotating member 730a. The tip of the screw N2 protrudes from the lower surface of the disc portion 731 by a predetermined length.

  As shown in FIG. 15, the rotating member 730a is fitted into the support portion 720 so that the tip of the screw N2 is positioned on the upper surface 721c (FIG. 9) of the rotation restricting member 720a. Within the support portion 720, the rotating member 730a is held by the two bearings 720c of FIG. In this state, the rotating member 730a can rotate in the circumferential direction within an angle range between the two rotation restricting surfaces 721d (FIGS. 9 and 14) with respect to the central axis of the rotating member 730a. The distal end portion of the rotating member 730a (the distal end portion of the small diameter portion 733) is positioned inside the shaft support member 720b.

  In a state where the rotating member 730a is fitted in the support portion 720, the connecting member 730b is attached from below to the distal end portions of the shaft supporting member 720b and the rotating member 730a. The cylindrical protruding portion 735a of the connecting member 730b is accommodated in an annular space 726c between the outer wall 726a and the inner wall 726b of the second cylindrical portion 726.

  As described above, the distal end portion of the rotating member 730a is disposed between the two shaft coupling protrusions 735b of the coupling member 730b. At this time, the two flat portions 733k of the rotating member 730a abut against the two opposing surfaces of the two shaft coupling protrusions 735b of the coupling member 730b (FIG. 14). Thereby, when the rotating member 730a rotates, the connecting member 730b also rotates together with the rotating member 730a.

  A holding pin 710 is attached to the pin fixing member 730c. Specifically, the pin main body portion 712 of the holding pin 710 is positioned on the pin fixing member 730c so that the disc portion 711 of the holding pin 710 is positioned between the fixing portion 736 of the pin fixing member 730c and the pin support arm 738a. It arrange | positions in the space 738b (FIG. 12).

  The fixing portion 736 of the pin fixing member 730c is disposed in the first space 734p of the connecting member 730b, and the disk portion 711 of the holding pin 710 is disposed in the second space 734q of the connecting member 730b. The tip of the screw N1 protruding into the first space 734p is attached to the screw hole 736h of the fixing portion 736.

  When the screw N1 is tightened, the pin fixing member 730c moves in the vertical direction so as to approach the rotating member 730a and the connecting member 730b, as indicated by a thick arrow in FIG. As a result, the upper surface of the disk portion 711 of the holding pin 710 abuts on the second lower surface 734c of the connecting member 730b and presses the second lower surface 734c upward. Thereby, the holding pin 710 is fixed to the rotating member 730a and the connecting member 730b. In this state, when the rotating member 730a and the connecting member 730b rotate, the holding pin 710 also rotates together with the rotating member 730a and the connecting member 730b.

(4-5) Magnet FIG. 16 is an external perspective view showing a state where the magnet 790 of FIG. 7 is attached. In the present embodiment, magnet 790 has a configuration in which a magnet is accommodated in a casing. The magnet 790 is formed with two through holes 790h extending in the vertical direction and a groove 790g extending in the vertical direction.

  The magnet 790 is positioned such that the groove 790g is positioned on the through hole 731h of the rotating member 730a and the two through holes 790h are respectively positioned on the two screw holes 731b of the rotating member 730a. In this state, the two screws N5 are attached to the two screw holes 731b through the two through holes 790h, respectively. Thereby, the magnet 790 is fixed to the rotating member 730a.

  In this case, since the groove 790g of the magnet 790 is positioned on the screw N1, the operator can easily tighten the screw N1 from above the substrate holding mechanism 700 using a tool such as a wrench or a screwdriver. Alternatively, the operator can easily loosen the screw N1 from above the substrate holding mechanism 700.

(4-6) Change of Contact Portion of Holding Pin with Substrate FIG. 17 is a bottom view of the substrate holding mechanism 700. In FIG. 17, only the holding pin 710, the connecting member 730b, and the pin fixing member 730c are illustrated. As shown in FIG. 17, the holding pin 710 is fixed to the connecting member 730b so that the central axis 710c of the holding pin 710 is displaced from the extension line of the central axis 700c of the rotating member 730a (FIG. 15). As a result, the rotating member 730a (FIG. 15) rotates, whereby the holding pin 710 rotates about the vertical axis along the central axis 700c, as indicated by an arrow 17A in FIG. In this way, the substrate holding mechanism 700 is switched between the closed state and the open state.

  In the substrate holding mechanism 700, as shown by an arrow 17B in FIG. 17, the holding pin 710 can be rotated in the circumferential direction by loosening the screw N1 in FIG.

  When the substrate holding mechanism 700 is repeatedly switched between the closed state and the open state, the contact portion cp of the holding pin 710 with the outer peripheral end portion of the substrate W is worn. In this case, in this case, the operator loosens the screw N1 of FIG. 15 and rotates the holding pin 710 in the circumferential direction, and then tightens the screw N1 of FIG. 15 again. Thereby, the operator can easily change the contact portion cp of the holding pin 710 with the outer peripheral end of the substrate W from one part of the holding pin 710 to another part.

  At this time, the operator can easily recognize the worn portion of the holding pin 710 by visually recognizing the plurality of flat portions 714 shown in FIG. 13 formed on the outer peripheral surface of the holding pin 710, and also hold the holding pin 710. Can be accurately rotated by 90 ° in the circumferential direction.

  Further, when the entire circumference of the substrate contact portion 713 of the holding pin 710 is worn, the operator removes the holding pin 710 from the pin fixing member 730c by sufficiently loosening the screw N1 in FIG. The holding pin 710 can be attached to the pin fixing member 730c. In this way, the holding pin 710 can be easily replaced.

(5) Details of Fluid Supply Pipe Details of the structure of the fluid supply pipe 400 and its peripheral members in FIG. 5 will be described with reference to FIGS. 18 and 19. 18 is a longitudinal sectional view mainly showing the structure of the fluid supply pipe 400 of FIG. FIG. 19A is an enlarged longitudinal sectional view showing the structure near the tip of the fluid supply pipe 400 of FIG. 5, and FIG. 19B is a view of the fluid supply pipe 400 viewed from the arrow YA of FIG. It is a top view of a front-end | tip part.

  As described above, the fluid supply pipe 400 is inserted through the motor support member 200s, the spin motor 200, the rotating shaft 210, and the plate support member 510.

  As shown in FIG. 18, the fluid supply pipe 400 is curved above the motor support member 200s and extends in the horizontal direction. In the following description, the end portion of the straight pipe portion extending in the vertical direction is referred to as a front end portion, and the end portion of the straight pipe portion extending in the horizontal direction is referred to as a rear end portion.

  In the fluid supply pipe 400, a first flange FR1 is integrally formed in the vicinity of the curved portion of the straight pipe portion extending in the vertical direction. A second flange FR2 is integrally formed at the rear end.

  The first flange FR1 is fixed to the motor support member 200s, and the second flange FR2 is fixed to the pipe fixing portion 280. The tube fixing part 280 is attached to the housing of the back surface cleaning unit BC (not shown).

  Thereby, the fluid supply pipe 400 is fixed to the housing of the back surface cleaning processing unit BC by the pipe fixing portion 280, the motor support member 200s, and the motor fixing portion 290.

  As described above, the spin motor 200 is supported by the motor support member 200s. Thus, the fluid supply pipe 400 is attached to the motor support member 200s, so that the positional relationship between the fluid supply pipe 400 and the spin motor 200 is maintained even when the spin motor 200 operates. Therefore, it is possible to prevent the displacement of the fluid supply pipe 400 from occurring.

As shown in FIGS. 19A and 19B, the fluid supply pipe 400 has a structure in which a gas supply pipe 420 is accommodated inside a guide pipe 410. The gas supply pipe 420 is used to supply gas (N ₂ gas in this example) to the substrate W.

  In the present embodiment, guide tube 410 is made of stainless steel. The gas supply pipe 420 is made of a fluororesin such as PTFE (tetrafluoroethylene resin) and PFA (tetrafluoroethylene / perfluoroalkoxyethylene copolymer).

As shown in FIG. 19A, the gas supply pipe 420 is provided so that the tip portion slightly protrudes downward from the through hole 525 h of the blocking plate 525. Thereby, N ₂ gas can be reliably supplied between the blocking plate 525 and the substrate W. Note that the distal end of the gas supply pipe 420 may be fixed to the blocking plate 525.

  The peripheral members at the tip of the fluid supply pipe 400 will be described. In this example, the rotating shaft 210 has an inner diameter of about 20 mm, and the guide tube 410 has an outer diameter of about 18 mm. Accordingly, a gap GA of about 1 mm is formed between the rotating shaft 210 and the guide tube 410 in a state where the fluid supply tube 400 is attached to the motor support member 200s and the tube fixing portion 280 of FIG.

  A plate support member 510 having a substantially cylindrical shape is attached to the rotating shaft 210 in the vicinity of the distal end portion of the fluid supply pipe 400. An inner peripheral surface 510h of the plate support member 510 is formed in a step shape along the central axis.

  When the plate support member 510 is attached to the rotating shaft 210, the cylindrical pad fixing piece 512 is fitted into the gap between the inner peripheral surface 510 h of the plate supporting member 510 and the outer peripheral surface of the rotating shaft 210. Is screwed to the screw receiving portion 511 of the plate support member 510. As a result, the plate support member 510 is securely fixed to the tip of the rotating shaft 210.

  A flange 510F is formed near the lower end of the plate support member 510. The spin plate 520 is fixed to the rotating shaft 210 by screwing the flange 510F and the spin plate 520.

  As shown in FIG. 18, the second flange FR2 is formed at the rear end of the fluid supply pipe 400 as described above. The second flange FR2 is fixed to the tube fixing portion 280. A supply pipe fixing part 490 is provided in the vicinity of the rear end of the fluid supply pipe 400. In the supply pipe fixing part 490, the gas supply pipe 420 is fixed to the guide pipe 410.

The gas supply pipe 420 extends from the rear end of the guide pipe 410 to the outside. The rear end portion of the gas supply pipe 420 extending from the rear end portion of the guide tube 410 is connected to a gas supply device (not shown). By N ₂ gas is supplied to the gas supply pipe 420 from the gas supply apparatus, N ₂ gas is supplied to the substrate W.

(6) Substrate Holding Operation The substrate W holding operation by the spin chuck 600 will be described. 20 and 21 are diagrams for explaining the holding operation of the substrate W by the spin chuck 600. FIG.

  First, as shown in FIG. 20A, the guard 618 moves to a position lower than the substrate holding mechanism 700. Then, the holding pins 624 of the plurality of substrate transfer mechanisms 620 (FIG. 5) move below the spin plate 520 through the guard 618. The substrate W is placed on the plurality of holding pins 624 by the fourth central robot CR4 (FIG. 1).

  At this time, the magnet plates 614a and 614b are in the upper position. In this case, the magnetic force lines B of the magnet plates 614 a and 614 b are directed from the inside to the outside at the height of the magnet 790 of the substrate holding mechanism 700. Thereby, the south pole of the magnet 790 of each substrate holding mechanism 700 is attracted inward. Accordingly, each substrate holding mechanism 700 is opened.

  Subsequently, as shown in FIG. 20B, the plurality of holding pins 624 rise while holding the substrate W. As a result, the substrate W moves between the holding pins 710 of the plurality of substrate holding mechanisms 700.

  Subsequently, as shown in FIG. 21A, the magnet plates 614a and 614b move to the lower position. In this case, the N pole of the magnet 790 of each substrate holding mechanism 700 is attracted inward. Accordingly, each substrate holding mechanism 700 is closed, and the outer peripheral end portion of the substrate W is held by the holding pin 710 of each substrate holding mechanism 700. Each substrate holding mechanism 700 holds the outer peripheral end of the substrate W between adjacent holding pins 624. Therefore, the substrate holding mechanism 700 and the holding pin 624 do not interfere with each other. Thereafter, the plurality of holding pins 624 move outward from the guard 618.

  Subsequently, as shown in FIG. 21B, the guard 618 moves to a height that surrounds the substrate W held by the substrate holding mechanism 700. And the back surface washing process of the board | substrate W is performed.

(7) Backside Cleaning Processing FIGS. 22 and 23 are side views for explaining the backside cleaning processing of the substrate W. FIG.

As shown in FIG. 22, during the back surface cleaning process of the substrate W, the substrate W is rotated by the spin chuck 600 and N ₂ gas is supplied between the shielding plate 525 and the substrate W through the gas supply pipe 420. As a result, an N ₂ gas stream is formed between the blocking plate 525 and the substrate W from the center of the substrate W toward the outside.

  In this state, the cleaning brush 630 contacts the back surface of the substrate W while being rotated by the motor 635. Then, the cleaning brush 630 moves between the lower part of the center of the substrate W and the lower part of the peripheral edge, and contacts the entire back surface of the substrate W. Pure water is supplied from the cleaning nozzle 633 to the contact portion between the substrate W and the cleaning brush 630. As a result, the entire back surface of the substrate W is cleaned by the cleaning brush 630 and contaminants attached to the back surface of the substrate W are removed.

  Subsequently, as shown in FIG. 23A, the magnet plate 614a is disposed at the lower position, and the magnet plate 614b is disposed at the upper position. In this case, as shown in FIGS. 23A and 23B, in the outer region R1 of the magnet plate 614a (FIG. 23B), the respective substrate holding mechanisms 700 are closed, and the outer side of the magnet plate 614b. In the region R2 (FIG. 23B), each substrate holding mechanism 700 is opened. That is, the holding pin 710 of each substrate holding mechanism 700 is maintained in contact with the outer peripheral end of the substrate W when passing through the outer region R1 of the magnet plate 614a, and passes through the outer region R2 of the magnet plate 614b. In this case, the substrate W is separated from the outer peripheral end portion.

  Therefore, in the outer region R2 of the magnet plate 614b, the lower surface side portion of the outer peripheral end portion of the substrate W can be cleaned by the cleaning brush 630.

  In this example, at least four of the five substrate holding mechanisms 700 are located in the outer region R1 of the magnet plate 614a. In this case, even if the holding pin 710 of each substrate holding mechanism 700 passes through the outer region R2 of the magnet plate 614b, the substrate W is held by at least four substrate holding mechanisms 700 even if it is separated from the outer peripheral end of the substrate W. Is done. Thereby, the stability of the substrate W is ensured.

  After completion of the back surface cleaning process, the magnet plates 614a and 615b are arranged at the lower position, and the substrate W is held by all the substrate holding mechanisms 700. In this state, the substrate W is rotated at a high speed by the spin chuck 600. Thereby, the pure water adhering to the substrate W is shaken off, and the substrate W is dried.

(8) Effects of Embodiment As described above, the operator can easily wear the worn portion of the holding pin 710 while visually recognizing the plurality of flat portions 714 formed on the holding pin 710 by loosening the screw N1. Can be recognized. In addition, the operator can rotate the holding pins 710 by 90 ° in the circumferential direction while visually recognizing the plurality of flat portions 714 formed on the holding pins 710. In this way, the contact portion of the holding pin 710 with the outer peripheral end of the substrate W can be easily changed to a plurality of portions of the holding pin 710.

  Thus, in the substrate holding mechanism 700 described above, the outer peripheral end portion of the substrate W can be held by the four portions of the holding pins 710. Therefore, even if a part of the substrate contact portion 713 of the holding pin 710 is worn by contacting the outer peripheral end portion of the substrate W, the other portion of the substrate contact portion 713 is not worn. There is no need to replace 710. As a result, the life of the holding pin 710 is extended and the replacement period of the holding member is increased. As a result, the stop time of the substrate processing apparatus accompanying the replacement work of the holding pins 710 can be sufficiently shortened, so that the operating rate of the substrate processing apparatus can be improved.

(9) Modification (9-1) FIG. 24 is a diagram for explaining another configuration example of the holding pin. FIG. 24A shows a top view of the holding pin 710A. 24B to 24E are side views of the holding pin 710A viewed from directions D1 to D4 that are different from each other by 90 °. FIG. 24F shows a cross-sectional view taken along line E2-E2 of FIG. The holding pin 710A in FIG. 24 is different from the holding pin 710 in FIG. 13 in the following points.

  As shown in FIG. 24 (a), in this holding pin 710A, four depressions h1, h2, h3, h4 are formed on the upper surface of the disk portion 711 at equiangular (90 °) intervals with respect to the central axis of the holding pin 710. Is formed.

  FIG. 25 is a partially enlarged cross-sectional view of the substrate holding mechanism 700 using the holding pins 710A of FIG. As shown in FIG. 25, when the holding pin 710A of FIG. 24 is used, a protrusion N1t is provided at the tip of the screw N1 attached to the screw hole 736h of the pin fixing member 730c.

  The holding pin 710A of FIG. 24 is fixed to the connecting member 730b together with the pin fixing member 730c by the screw N1. In this case, the screw N1 is inserted into any one of the four recesses h1 to h4 (the recess h4 in this example) of the holding pin 710A so that the protrusion N1t of the screw N1 is inserted into the screw hole of the pin fixing member 730c. Tightened to 736h. This prevents the holding pin 710A from rotating in the circumferential direction in a state where the holding pin 710A is fixed to the connecting member 730b. In this way, the holding pin 710A is securely fixed to the connecting member 730b.

  (9-2) FIG. 26 is a diagram for explaining still another configuration example of the holding pin. A top view of the holding pin 710B is shown in FIG. 26B to 26E show side views of the holding pin 710B viewed from directions D1 to D4 that are different by 90 °. FIG. 26 (f) shows a cross-sectional view taken along line E3-E3 of FIG. 26 (b). The holding pin 710B in FIG. 26 is different from the holding pin 710 in FIG. 13 in the following points.

  As shown in FIG. 26A to FIG. 26F, in the holding pin 710 </ b> B, a flange portion 711 </ b> S is formed at the upper end portion of the pin main body portion 712. The flange portion 711S has a square cross section and has four side surfaces 711f. Of the four side surfaces 711f, two side surfaces 711f face each other. Of the four side surfaces 711f, the other two side surfaces 711f face each other.

  FIG. 27 is a bottom view of the substrate holding mechanism 700 using the holding pins 710B of FIG. In FIG. 27, only the holding pin 710B, the connecting member 730b, and the pin fixing member 730c are illustrated.

  As shown in FIG. 27, in the pin fixing member 730c, opposed surfaces 738z facing each other are formed at the tip portions of the two pin support arms 738a. The distance between the two opposing surfaces 738z is substantially equal to the distance between two opposing side surfaces 711f of the four side surfaces 711f of the holding pin 710B in FIG.

  The holding pin 710B of FIG. 26 is disposed between the tip portions of the two pin support arms 738a so that two side surfaces 711f of the four side surfaces 711f that face each other abut against the two opposing surfaces 738z. In this state, the screw N1 in FIG. 15 is tightened.

  This prevents the holding pin 710B from rotating in the circumferential direction in a state where the holding pin 710B is fixed to the connecting member 730b. In this way, the holding pin 710B is securely fixed to the connecting member 730b.

  (9-3) A plurality of flat portions 714 are not necessarily formed on the holding pin 710. As long as the operator can identify the circumferential position of the holding pin 710, a plurality of protrusions may be formed on the holding pin 710, or a plurality of marks may be marked on the holding pin 710.

(9-4) In the back surface cleaning processing unit BC, the back surface and the outer peripheral edge of the substrate W do not necessarily have to be cleaned with the cleaning brush 630. In the back surface cleaning processing unit BC, the cleaning brush 630 without contacting the back surface of the substrate W, the back surface cleaning process by supplying a cleaning liquid such as pure water to the entire region of the back surface from the cleaning nozzle 633 substrate W be performed Good.

  Moreover, you may perform the washing | cleaning of the back surface and outer peripheral edge part of the board | substrate W using the two-fluid nozzle which discharges the mixed fluid of a liquid and gas. Furthermore, the back surface and the outer peripheral edge of the substrate W may be cleaned using an ultrasonic nozzle that incorporates a high-frequency vibrator. When the ultrasonic nozzle is used, the cleaning liquid in an ultrasonic vibration state is supplied to the back surface and the outer peripheral end of the substrate W.

  (9-5) In the back surface cleaning processing unit BC, the spin motor 200 and the rotating shaft 210 are provided above the spin plate 520. The substrate holding mechanism 700 is provided at the peripheral edge of the spin plate 520 so that the holding pins 710 are positioned below the spin plate 520. Thereby, the lower surface of the substrate W is exposed while the substrate W is held by the spin chuck 600.

  However, the substrate holding mechanism 700 may be applied to a spin chuck that holds the substrate W so that the upper surface of the substrate W is exposed.

  For example, there is a spin chuck in which the spin motor 200 and the rotation shaft 210 are provided below the spin plate 520. In this spin chuck, the substrate holding mechanism 700 may be provided on the peripheral edge of the spin plate 520 so that the holding pin 710 is positioned above the spin plate 520. In this case, the upper surface of the substrate W is exposed while the substrate W is held by the spin chuck. Thereby, various processes (cleaning process, coating process, developing process, etc.) can be performed on the upper surface of the substrate W from a position above the substrate W.

  When the above-described spin chuck 600 is applied to the coating units BARC and RES, a coating solution for an antireflection film or a resist film is supplied from the supply nozzles 52 and 62 to the upper surface of the substrate W held on the spin chuck 600.

  When the spin chuck 600 is applied to the development processing unit DEV, the developer is supplied from the supply nozzle 72 to the upper surface of the substrate W held on the spin chuck 600.

  (9-6) In the above embodiment, it has been described that the guide pipe 410 of the fluid supply pipe 400 is formed of stainless steel. However, as a material for forming the guide pipe 410, in addition to stainless steel, iron, copper A tough metal material such as bronze, brass, aluminum, silver, or gold can be used.

  Further, the gas supply pipe 420 has been described as being formed of a fluororesin. However, as a material for forming the gas supply pipe 420, PVC (polyvinyl chloride), PPS (polyphenylene sulfide), PTFE (polyethylene) in addition to fluororesin. A resin material having flexibility such as tetrafluoroethylene) or PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer) can also be used.

(9-7) In the back surface cleaning processing unit BC, the N ₂ gas may be supplied to the space between the spin plate 520 and the substrate W without providing the blocking plate 525.

  (9-8) The number of back surface cleaning processing unit BC, coating unit BARC, RES, development processing unit DEV, heating unit HP, cooling unit CP and mounting / cooling unit P-CP matches the processing speed of each processing block. May be changed as appropriate.

  (9-9) Further, in the above embodiment, the back surface cleaning processing unit BC is disposed in the interface block 15, but the back surface cleaning processing unit BC may be disposed in the development processing block 12 shown in FIG. . Alternatively, a back surface cleaning processing block including the back surface cleaning processing unit BC may be provided between the development processing block 12 and the interface block 15 shown in FIG.

(10) Correspondence between each constituent element of claim and each element of the embodiment Hereinafter, an example of correspondence between each constituent element of the claim and each element of the embodiment will be described. It is not limited to.

  In the above embodiment, the spin chuck 600 is an example of a substrate holding device, the spin plate 520 is an example of a support member, the holding pin 710 is an example of a holding member, and the shaft portion 730 is an example of a movable member. .

  Further, the screw N1 is an example of a rotation preventing member, the plurality of flat portions 714 are examples of a plurality of indicators, the upper surface of the disk portion 711 in FIG. 13 is an example of the end surface of the holding member, The lower surface 734c of No. 2 is an example of the contact surface of the movable member.

  Further, the recesses h1 to h4 in FIG. 24 are examples of a plurality of locking portions, the protrusion N1t in FIG. 25 is an example of a locked portion, and the four side surfaces 711f in FIG. 26 are examples of a plurality of stopping surfaces. 26 is an example of the restrained surface.

  Further, the spin motor 200 is an example of a rotation drive unit, the back surface cleaning processing unit BC is an example of a substrate cleaning device and a substrate processing device, the magnet plates 614a and 614b are examples of a driving mechanism, a cleaning nozzle 633 and a cleaning device. The brush 630 is an example of the cleaning unit, and the cleaning nozzle 633, the cleaning brush 630, and the supply nozzles 52, 62, and 72 are examples of the processing unit.

  As each constituent element in the claims, various other elements having configurations or functions described in the claims can be used.

  The present invention can be effectively used for processing various substrates.

DESCRIPTION OF SYMBOLS 9 Indexer block 10 Processing block for antireflection film 11 Processing block for resist film 12 Development processing block 15 Interface block 16 Exposure apparatus 16a Substrate carry-in part 16b Substrate carry-out part 17, 18, 19 Bulkhead 17A, 17B, YA Arrow 30 Main controller ( Control part)
40 Carrier mounting table 50 Antireflection film coating processing unit 51, 61, 71, 98, 600 Spin chuck 52, 72 Supply nozzle 60 Resist film coating processing unit 70 Development processing unit 99 Light irradiator 100, 101 For antireflection film Heat treatment section 110, 111 Heat treatment section for resist film 120 Heat treatment section for development 121 Heat treatment section for post-exposure baking 200 Spin motor 200s Motor support member 200h, 521, 525h, 721h, 722a, 725b, 731h, 734h, 790h Through hole 210, 622 Rotating shaft 280 Pipe fixing part 290 Motor fixing part 400 Fluid supply pipe 410 Guide pipe 420 Gas supply pipe 490 Supply pipe fixing part 500 Substrate processing apparatus 510 Plate support member 510F, FR1, FR2 Flange 510h Inner peripheral surface 511, 721 Screw receiver 512 Pad fixing piece 520 Spin plate 522, 731a, 731b, 736h Screw hole 525 Blocking plate 525a, 525b Fixing member 614a, 614b Magnet plate 617a, 617b Magnet lifting mechanism 618 Guard 618a Guard lifting mechanism 620 Substrate transfer mechanism 621 623 Arm 624, 710, 710A, 710B Holding pin 630 Cleaning brush 631 Brush holding member 632 Brush moving mechanism 633 Cleaning nozzle 635 Motor 700 Substrate holding mechanism 700c, 710c Central shaft 711, 731 Disc portion 711f Side surface 711S, 722, 725 712 Pin body 713 Substrate contact part 714, 733k Flat part 720 Support part 720a Rotation restricting member 720b Shaft support member 720c Bearer 721a outer peripheral wall 721b, 721c, 734a upper surface 721d rotation restricting surface 722b, h1, h2, h3, h4 hollow 724 first cylindrical portion 726 second cylindrical portion 726a outer wall 726b inner wall 726c, 738b space 726s stepped portion 730 shaft portion 730a Rotating member 730b Connecting member 730c Pin fixing member 732 Large diameter portion 732c Stepped surface 733 Small diameter portion 734 Connection main body portion 734b First lower surface 734c Second lower surface 734d Third lower surface 734p First space 734q Second space 735a Tubular protrusion 735b Shaft coupling protrusion 736 Fixed part 737 Relay part 738 Support part 738a Pin support arm 738x Support body part 738z Opposing surface 790 Magnet 790g Groove BARC, RES Coating unit BC Back surface cleaning unit C Carrier CP cooling unit cp contact part CR1 to CR4 first to fourth central robots CRH1 to CRH8 hand D1 to D4 direction DEV development processing unit EEW edge exposure part H1 hand HP heating unit IFR interface transport mechanism IR indexer robot IRH hand LC Local controller N1 to N5 Screw N1t Protruding part R1, R2 Outer area RBF Return buffer part SBF Feeding buffer part PASS1 to PASS9 Substrate placement part P-CP Placement and cooling unit W Substrate

Claims (9)

A substrate holding device for holding a substrate,
A support member;
A holding member having an outer peripheral surface capable of contacting the outer peripheral end of the substrate;
The holding member is rotatably held around an axis perpendicular to the main surface of the substrate, the holding state in which the outer peripheral surface of the holding member is in contact with the outer peripheral end of the substrate, and the outer peripheral surface of the holding member is the outer periphery of the substrate A movable member provided on the support member so as to be able to shift to a released state separated from the end portion;
A drive mechanism for moving the movable member between the holding state and the released state;
A rotation preventing member that can be switched between a fixed state that prevents rotation of the holding member relative to the movable member and a rotatable state that allows rotation of the holding member relative to the movable member ;
A plurality of different indicators are provided on the outer peripheral surface of the holding member so as to be arranged in the circumferential direction . The holding member, the substrate holding apparatus according to claim 1, characterized in that it is held removably to the movable member. The holding member has an end surface orthogonal to the outer peripheral surface,
The movable member has a contact surface that contacts the end surface of the holding member;
The rotation preventing member presses the end surface of the holding member against the contact surface of the movable member to fix the holding member, and the end surface of the holding member is brought into contact with the contact surface of the movable member. 3. The substrate holding apparatus according to claim 1, wherein the holding member is brought into a rotatable state by not being pressed. A plurality of locking portions are provided on the end surface of the holding member along a circumference centered on the rotation center of the holding member,
The substrate holding device according to claim 3, wherein the rotation preventing member is provided with a locked portion that is locked to the locking portion in the fixed state. The holding member is provided with a plurality of stop surfaces symmetrically with respect to the rotation center of the holding member,
Wherein the movable member, the substrate holding apparatus according to any one of claims 1 to 4, characterized in that the stop surface in contact with the stop surface in a fixed state of the holding member is provided. Substrate holding apparatus according to any one of claims 1 to 5, further comprising a rotation driving unit that rotates about a vertical axis of rotation of the support member to the main surface of the substrate. The support member is disposed such that the rotation shaft extends in a vertical direction,
The rotational drive unit is provided on the upper side of the support member,
The substrate holding apparatus according to claim 6 , wherein the holding member is held by the movable member below the support member. A substrate holding device according to claim 6 or 7, which holds a substrate;
A substrate cleaning apparatus, comprising: a cleaning unit that performs a cleaning process on the substrate rotated by the substrate holding device. A substrate holding device according to claim 6 or 7, which holds a substrate;
A substrate processing apparatus comprising: processing means for performing a predetermined process on the substrate rotated by the substrate holding device.

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