TWI790196B - 洗淨液、基板洗淨方法及半導體元件的製造方法 - Google Patents

洗淨液、基板洗淨方法及半導體元件的製造方法 Download PDF

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Publication number
TWI790196B
TWI790196B TW105140737A TW105140737A TWI790196B TW I790196 B TWI790196 B TW I790196B TW 105140737 A TW105140737 A TW 105140737A TW 105140737 A TW105140737 A TW 105140737A TW I790196 B TWI790196 B TW I790196B
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Taiwan
Prior art keywords
cleaning solution
patent application
cleaning
mass
item
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TW105140737A
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English (en)
Chinese (zh)
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TW201732028A (zh
Inventor
高橋智威
高橋智美
清水哲也
吉井朗子
室祐継
Original Assignee
日商富士軟片股份有限公司
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Publication of TW201732028A publication Critical patent/TW201732028A/zh
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    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0047—Other compounding ingredients characterised by their effect pH regulated compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/08—Liquid soap, e.g. for dispensers; capsuled
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0073—Anticorrosion compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/30—Amines; Substituted amines ; Quaternized amines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Detergent Compositions (AREA)
TW105140737A 2015-12-11 2016-12-09 洗淨液、基板洗淨方法及半導體元件的製造方法 TWI790196B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015242708 2015-12-11
JP2015-242708 2015-12-11

Publications (2)

Publication Number Publication Date
TW201732028A TW201732028A (zh) 2017-09-16
TWI790196B true TWI790196B (zh) 2023-01-21

Family

ID=59014274

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105140737A TWI790196B (zh) 2015-12-11 2016-12-09 洗淨液、基板洗淨方法及半導體元件的製造方法

Country Status (4)

Country Link
JP (1) JP6629880B2 (ko)
KR (1) KR102121759B1 (ko)
TW (1) TWI790196B (ko)
WO (1) WO2017099211A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201908616PA (en) * 2017-03-24 2019-10-30 Fujifilm Electronic Materials Usa Inc Cleaning compositions for removing residues on semiconductor substrates
WO2019044463A1 (ja) * 2017-08-31 2019-03-07 富士フイルム株式会社 処理液、キット、基板の洗浄方法
US11175587B2 (en) * 2017-09-29 2021-11-16 Versum Materials Us, Llc Stripper solutions and methods of using stripper solutions
JP7065763B2 (ja) * 2018-12-27 2022-05-12 富士フイルム株式会社 薬液、被処理物の処理方法
WO2021039701A1 (ja) * 2019-08-29 2021-03-04 富士フイルム株式会社 処理液
KR20210032606A (ko) 2019-09-16 2021-03-25 삼성디스플레이 주식회사 금속 마스크, 이의 제조 방법, 및 표시 패널 제조 방법
WO2022176663A1 (ja) * 2021-02-22 2022-08-25 富士フイルム株式会社 洗浄液、半導体基板の洗浄方法
CN114574297A (zh) * 2022-03-09 2022-06-03 张家港安储科技有限公司 一种用于碳化硅半导体制程中的清洗液组合物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010034312A1 (en) * 2000-03-24 2001-10-25 Naoshi Imai Aqueous hydroxylamine solution
JP2006269677A (ja) * 2005-03-23 2006-10-05 Dainippon Screen Mfg Co Ltd 基板処理装置
TW200639594A (en) * 2005-03-11 2006-11-16 Kanto Kagaku Composition for photoresist stripping solution and process of photoresist stripping
TW201239085A (en) * 2011-03-16 2012-10-01 Air Prod & Chem Cleaning formulations and method of using the cleaning formulations
TW201527523A (zh) * 2013-12-06 2015-07-16 Fujifilm Electronic Materials 用來移除表面殘餘物的清洗調配物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001267282A (ja) * 2000-03-21 2001-09-28 Dainippon Screen Mfg Co Ltd 基板処理装置
US7166419B2 (en) * 2002-09-26 2007-01-23 Air Products And Chemicals, Inc. Compositions substrate for removing etching residue and use thereof
US8357646B2 (en) * 2008-03-07 2013-01-22 Air Products And Chemicals, Inc. Stripper for dry film removal
JP5589968B2 (ja) 2011-06-17 2014-09-17 信越半導体株式会社 半導体ウェーハの洗浄方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010034312A1 (en) * 2000-03-24 2001-10-25 Naoshi Imai Aqueous hydroxylamine solution
TW200639594A (en) * 2005-03-11 2006-11-16 Kanto Kagaku Composition for photoresist stripping solution and process of photoresist stripping
JP2006269677A (ja) * 2005-03-23 2006-10-05 Dainippon Screen Mfg Co Ltd 基板処理装置
TW201239085A (en) * 2011-03-16 2012-10-01 Air Prod & Chem Cleaning formulations and method of using the cleaning formulations
TW201527523A (zh) * 2013-12-06 2015-07-16 Fujifilm Electronic Materials 用來移除表面殘餘物的清洗調配物

Also Published As

Publication number Publication date
KR102121759B1 (ko) 2020-06-11
WO2017099211A1 (ja) 2017-06-15
TW201732028A (zh) 2017-09-16
JP6629880B2 (ja) 2020-01-15
KR20180077250A (ko) 2018-07-06
JPWO2017099211A1 (ja) 2018-09-20

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